CN214379248U - SMD white laser packaging structure - Google Patents
SMD white laser packaging structure Download PDFInfo
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- CN214379248U CN214379248U CN202120314383.5U CN202120314383U CN214379248U CN 214379248 U CN214379248 U CN 214379248U CN 202120314383 U CN202120314383 U CN 202120314383U CN 214379248 U CN214379248 U CN 214379248U
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Abstract
The utility model discloses a white laser packaging structure of SMD, it includes the metal substrate, locate the ceramic plate on the metal substrate, locate ceramic plate upper end and with metal substrate electric connection's sheetmetal, be fixed in sheetmetal upper end outlying ceramic seat, install in two inboard first in ceramic seat upper end, second laser wafer and be located first, between the second laser wafer and with first laser wafer and the mirror that blurs of second laser wafer adaptation, be fixed in the light-passing board of this ceramic seat upper end, be formed with sealed chamber between sheetmetal and the ceramic seat, it is first, second laser wafer and blurs the mirror and arrange sealed chamber in, and first, second laser wafer all inclines to set up, it is first, the light emitting area of second laser wafer all faces the mirror. The utility model can effectively dissipate the heat generated by the first and the second laser wafers during working, so as to prolong the service life; the light of the first and second laser chips is reflected to the transparent plate by the prism to enlarge the light-emitting surface and enhance the illumination intensity.
Description
The technical field is as follows:
the utility model relates to a laser wafer encapsulation technical field refers in particular to a SMD white laser packaging structure.
Background art:
laser wafers in the prior art are packaged by adopting TO TO form a laser light source, and the laser light source is inserted into a PCB (printed circuit board) through a positive pin and a negative pin and is fixed by soldering tin; in the prior art, the laser light source can only utilize the tin added at the pin ends of the positive and negative electrodes for heat dissipation, so that the heat dissipation area is small, and the service life cannot be guaranteed; moreover, the light-emitting surface of the laser light source in the prior art is small, and the use is inconvenient.
In view of the above, the present inventors propose the following.
The utility model has the following contents:
an object of the utility model is to overcome prior art's not enough, provide a SMD white laser packaging structure.
In order to solve the technical problem, the utility model discloses a following technical scheme: this white laser packaging structure of SMD includes the metal baseplate, set up the ceramic plate on this metal baseplate, set up in the ceramic plate upper end and with metal baseplate electric connection's sheetmetal, be fixed in this sheetmetal upper end outlying ceramic seat, install in first laser wafer and the second laser wafer of this ceramic seat upper end both insides and be located between this first laser wafer and the second laser wafer and with the rabdosis mirror of this first laser wafer and second laser wafer adaptation, be fixed in the light-passing board of this ceramic seat upper end, be formed with sealed chamber between this sheetmetal and the ceramic seat, first laser wafer and second laser wafer and rabdosis mirror are arranged in this sealed chamber, and this first laser wafer and second laser wafer all incline to set up, and the light emitting area of this first laser wafer and the light emitting area of second laser wafer all face this rabdosis mirror.
Further, in the above technical solution, a first mounting portion and a second mounting portion are respectively formed on two sides of the upper end of the metal sheet, a first inclined surface is provided on the first mounting portion, a second inclined surface is provided on the second mounting portion, and the first laser wafer and the second laser wafer are respectively mounted on the first inclined surface and the second inclined surface.
Further, in the above technical solution, the first laser chip and the second laser chip are respectively mounted on a first substrate and a second substrate, and the first substrate and the second substrate are respectively mounted on the first inclined surface and the second inclined surface; the first laser wafer and the second laser wafer are respectively welded and conducted with the metal sheet through a plurality of first gold wires and second gold wires.
Further, in the above technical solution, the first laser wafer and the second laser wafer are symmetrically distributed in an inverted-splayed shape.
Further, in the above technical solution, the metal base plate and the metal sheet are both made of copper.
Further, in the above technical solution, the light-transmitting plate is any one of a transparent glass plate, a transparent sapphire plate, a transparent ceramic plate, and an acrylic plate.
Further, in the above technical scheme, the ceramic base upper end inboard is provided with the ladder groove, the light-passing board is installed in this ladder groove, and this light-passing board up end flushes with ceramic base up end.
Furthermore, in the above technical solution, two sides of the ceramic plate extend out of two side surfaces of the metal base plate and the metal sheet, and two side surfaces of the metal base plate are flush with two side surfaces of the metal sheet.
Further, in the above technical solution, a vacuum is formed inside the sealed cavity.
Further, in the above technical solution, the ceramic base is in a square frame shape.
After the technical scheme is adopted, compared with the prior art, the utility model has following beneficial effect: the utility model adopts the metal bottom plate, the ceramic plate, the metal sheet and the ceramic seat as the frame, the first laser wafer and the second laser wafer are arranged at the two inner sides of the upper end of the ceramic seat and are distributed at the two sides of the prism, the structure is convenient for effectively dissipating the heat generated by the first laser wafer and the second laser wafer during the work, the heat dissipation area is large, the heat dissipation effect is excellent, and the service life of the utility model is convenient to be prolonged; moreover, this first laser wafer and second laser wafer all incline to set up, and this first laser wafer's light emitting area and second laser wafer's light emitting area all face this rabdosia glass to this reflects laser to the light-passing board through the rabdosia glass, with this expansion light emitting area, and can greatly increased laser light intensity, reinforcing illumination intensity, it is more convenient to use.
Description of the drawings:
fig. 1 is a front view of the present invention.
The specific implementation mode is as follows:
the present invention will be further described with reference to the following specific embodiments and accompanying drawings.
As shown in fig. 1, an SMD white laser package structure includes a metal base plate 1, a ceramic plate 2 disposed on the metal base plate 1, a metal plate 3 disposed on the upper end of the ceramic plate 2 and electrically connected to the metal base plate 1, a ceramic holder 4 fixed on the periphery of the upper end of the metal plate 3, a first laser chip 5 and a second laser chip 6 mounted on the inner sides of the two upper ends of the ceramic holder 4, a prism 7 located between the first laser chip 5 and the second laser chip 6 and adapted to the first laser chip 5 and the second laser chip 6, and a transparent plate 8 fixed on the upper end of the ceramic holder 4, a sealed cavity 10 is formed between the metal sheet 3 and the ceramic seat 4, the first laser wafer 5, the second laser wafer 6 and the prism 7 are arranged in the sealed cavity 10, the first laser wafer 5 and the second laser wafer 6 are both obliquely arranged, the light emitting surface of the first laser chip 5 and the light emitting surface of the second laser chip 6 both face the prism 7. The utility model adopts the metal bottom plate 1, the ceramic plate 2, the metal sheet 3 and the ceramic base 4 as the frame, the first laser wafer 5 and the second laser wafer 6 are arranged at the two inner sides of the upper end of the ceramic base 4 and distributed at the two sides of the rabdosia mirror 7, the structure is convenient for effectively dissipating the heat generated by the first laser wafer 5 and the second laser wafer 6 during the work, the heat dissipation area is large, the heat dissipation effect is excellent, and the service life of the utility model is convenient to be prolonged; moreover, this first laser wafer 5 and the equal slope setting of second laser wafer 6, the light emitting area of this first laser wafer 5 and the light emitting area of second laser wafer 6 all face this rabdosia mirror 7 to this reflects laser to light-passing board 8 through rabdosia mirror 7, with this expansion light emitting area, and can greatly increased laser light intensity, reinforcing illumination intensity, it is more convenient to use.
The light emitting surface of the first laser chip 5 and the light emitting surface of the second laser chip 6 both face the prism 7, so that the laser is reflected to the light-transmitting plate 8 through the prism 7 to form white laser.
3 upper end both sides of sheetmetal are shaped respectively and are had first installation department 31 and second installation department 32, are provided with first inclined plane 311 on this first installation department 31, are provided with second inclined plane 321 on this second installation department 32, first laser wafer 5 and second laser wafer 6 are installed respectively on this first inclined plane 311 and second inclined plane 321, make first laser wafer 5 and second laser wafer 6 are the splayed symmetric distribution that falls, guarantee that the light emitting area of first laser wafer 5 and the light emitting area of second laser wafer 6 all face this blurry-glass 7.
The first laser wafer 5 and the second laser wafer 6 are respectively arranged on a first substrate 51 and a second substrate 61, and the first substrate 51 and the second substrate 61 are respectively arranged on the first inclined surface 311 and the second inclined surface 321; the first laser wafer 5 and the second laser wafer 6 are respectively welded and conducted with the metal sheet 3 through a plurality of first gold wires and second gold wires.
The metal base plate 1 and the metal sheet 3 are both made of copper, have strong electric conductivity and have strong heat conduction and heat dissipation functions.
The light-transmitting plate 8 is any one of a transparent glass plate, a transparent sapphire plate, a transparent ceramic plate and an acrylic plate.
The inboard ladder groove 41 that is provided with of ceramic seat 4 upper end, light-passing board 8 is installed in this ladder groove 41, and this light-passing board 8 up end flushes with ceramic seat 4 up end.
Two sides of the ceramic plate 2 extend out of two side surfaces of the metal base plate 1 and the metal sheet 3, and two side surfaces of the metal base plate 1 are flush with two side surfaces of the metal sheet 3.
The inside of the sealed cavity 10 forms a vacuum, which ensures the quality of the emitted light.
The ceramic seat 4 is in a square frame shape.
To sum up, the utility model adopts the metal base plate 1, the ceramic plate 2, the metal sheet 3 and the ceramic base 4 as the frame, the first laser wafer 5 and the second laser wafer 6 are installed at the inner sides of the two upper ends of the ceramic base 4 and distributed at the two sides of the rabdosian mirror 7, the structure is convenient for effectively dissipating the heat generated by the first laser wafer 5 and the second laser wafer 6 during the operation, the heat dissipation area is large, the heat dissipation effect is excellent, and the service life of the utility model is convenient to be prolonged; moreover, this first laser wafer 5 and the equal slope setting of second laser wafer 6, the light emitting area of this first laser wafer 5 and the light emitting area of second laser wafer 6 all face this rabdosia mirror 7 to this reflects laser to light-passing board 8 through rabdosia mirror 7, with this expansion light emitting area, and can greatly increased laser light intensity, reinforcing illumination intensity, it is more convenient to use.
Of course, the above description is only an exemplary embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes and modifications made by the constructions, features, and principles of the present invention in accordance with the claims of the present invention are intended to be included in the scope of the present invention.
Claims (10)
1. The utility model provides a SMD white laser packaging structure which characterized in that: which comprises a metal base plate (1), a ceramic plate (2) arranged on the metal base plate (1), a metal sheet (3) arranged at the upper end of the ceramic plate (2) and electrically connected with the metal base plate (1), a ceramic base (4) fixed at the periphery of the upper end of the metal sheet (3), a first laser wafer (5) and a second laser wafer (6) arranged at the two inner sides of the upper end of the ceramic base (4), a prism (7) arranged between the first laser wafer (5) and the second laser wafer (6) and matched with the first laser wafer (5) and the second laser wafer (6), and a light-transmitting plate (8) fixed at the upper end of the ceramic base (4), wherein a sealing cavity (10) is formed between the metal sheet (3) and the ceramic base (4), the first laser wafer (5), the second laser wafer (6) and the prism (7) are arranged in the sealing cavity (10), and the first laser chip (5) and the second laser chip (6) are both obliquely arranged, and the light-emitting surface of the first laser chip (5) and the light-emitting surface of the second laser chip (6) both face the rabdosia mirror (7).
2. The SMD white laser package structure as claimed in claim 1, wherein: the laser chip comprises a metal sheet (3), wherein a first installation part (31) and a second installation part (32) are formed on two sides of the upper end of the metal sheet (3) respectively, a first inclined surface (311) is arranged on the first installation part (31), a second inclined surface (321) is arranged on the second installation part (32), and a first laser chip (5) and a second laser chip (6) are installed on the first inclined surface (311) and the second inclined surface (321) respectively.
3. The SMD white laser package as claimed in claim 2, wherein: the first laser wafer (5) and the second laser wafer (6) are respectively arranged on a first substrate (51) and a second substrate (61), and the first substrate (51) and the second substrate (61) are respectively arranged on the first inclined surface (311) and the second inclined surface (321); the first laser wafer (5) and the second laser wafer (6) are respectively welded and conducted with the metal sheet (3) through a plurality of first gold wires and second gold wires.
4. The SMD white laser package as claimed in claim 2, wherein: the first laser wafer (5) and the second laser wafer (6) are symmetrically distributed in an inverted splayed shape.
5. The SMD white laser package structure according to any one of claims 1-4, wherein: the metal bottom plate (1) and the metal sheet (3) are both made of copper.
6. The SMD white laser package structure according to any one of claims 1-4, wherein: the light-transmitting plate (8) is any one of a transparent glass plate, a transparent sapphire plate, a transparent ceramic plate and an acrylic plate.
7. The SMD white laser package structure of claim 5, wherein: ceramic seat (4) upper end inboard is provided with ladder groove (41), light-passing board (8) are installed in this ladder groove (41), and this light-passing board (8) up end flushes with ceramic seat (4) up end.
8. The SMD white laser package structure of claim 5, wherein: two sides of the ceramic plate (2) extend out of two side surfaces of the metal base plate (1) and the metal sheet (3), and two side surfaces of the metal base plate (1) are flush with two side surfaces of the metal sheet (3).
9. The SMD white laser package structure of claim 5, wherein: the inside of the sealed cavity (10) forms vacuum.
10. The SMD white laser package structure of claim 5, wherein: the ceramic seat (4) is in a square frame shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120314383.5U CN214379248U (en) | 2021-02-03 | 2021-02-03 | SMD white laser packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120314383.5U CN214379248U (en) | 2021-02-03 | 2021-02-03 | SMD white laser packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214379248U true CN214379248U (en) | 2021-10-08 |
Family
ID=77962837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120314383.5U Active CN214379248U (en) | 2021-02-03 | 2021-02-03 | SMD white laser packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214379248U (en) |
-
2021
- 2021-02-03 CN CN202120314383.5U patent/CN214379248U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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| CP01 | Change in the name or title of a patent holder |
Address after: No.25, Jinfu Road, Jinxia community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee after: Dongguan Aika Intelligent Technology Co.,Ltd. Address before: No.25, Jinfu Road, Jinxia community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee before: DONGGUAN TRUSTING SMART CARD CO.,LTD. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230117 Address after: No.6, Xinchun Road, No.5 Industrial Zone, Shangsha community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee after: DONGGUAN SANCHUANG SMART CARD TECHNOLOGY CO.,LTD. Address before: No.25, Jinfu Road, Jinxia community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee before: Dongguan Aika Intelligent Technology Co.,Ltd. |