CN214379231U - Laser SMD packaging support plate structure - Google Patents
Laser SMD packaging support plate structure Download PDFInfo
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- CN214379231U CN214379231U CN202120581981.9U CN202120581981U CN214379231U CN 214379231 U CN214379231 U CN 214379231U CN 202120581981 U CN202120581981 U CN 202120581981U CN 214379231 U CN214379231 U CN 214379231U
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- heat conduction
- metal heat
- conduction module
- laser
- light
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Abstract
The utility model discloses a laser SMD encapsulates support plate structure, it includes that metal heat conduction module and an organic whole are fixed in metal heat conduction module outlying high temperature plastify frame, be formed with the installation cavity between high temperature plastify frame and the metal heat conduction module, terminal surface salient is terminal surface under the high temperature plastify frame under the metal heat conduction module, and terminal surface still is equipped with the conducting electrode under the high temperature plastify frame, the laser wafer passes through the base plate and installs in metal heat conduction module upper end, and place in the installation cavity, and the installation cavity still is equipped with the light reflection structure, the light emitting area of laser wafer is towards the light reflection structure. The utility model adopts the combination of the metal heat conduction module and the high-temperature plasticizing outer frame as the laser SMD packaging support plate, which can realize rapid heat conduction and has ideal heat conduction effect, thereby improving the working quality and the service life of the product; the lower end face of the metal heat conduction module and the conductive electrode are used as a positive electrode and a negative electrode, and the surface mounting can be realized; the light emitting surface of the laser chip faces the light reflecting structure, so that the light emitting surface can be enlarged, and the illumination effect is improved.
Description
The technical field is as follows:
the utility model relates to a laser wafer encapsulation technical field refers in particular to a laser SMD encapsulates carrier plate structure.
Background art:
laser wafers in the prior art are packaged by adopting TO TO form a laser light source, and the laser light source is inserted into a PCB (printed circuit board) through a positive pin and a negative pin and is fixed by soldering tin; the laser light source in the prior art has the advantages of quick heat conduction and unsatisfactory effect.
In view of the above, the present inventors propose the following.
The utility model has the following contents:
an object of the utility model is to overcome prior art not enough, provide a laser SMD encapsulates support plate structure.
In order to solve the technical problem, the utility model discloses a following technical scheme: the laser SMD packaging carrier plate structure comprises a metal heat conduction module and a high-temperature plasticizing outer frame integrally fixed on the periphery of the metal heat conduction module, an installation cavity is formed between the high-temperature plasticizing outer frame and the metal heat conduction module, the lower end face of the metal heat conduction module is convexly displayed on the lower end face of the high-temperature plasticizing outer frame, the lower end face of the high-temperature plasticizing outer frame is also provided with a conductive electrode, a laser wafer is installed at the upper end of the metal heat conduction module through a substrate and is placed in the installation cavity, the installation cavity is also provided with a light reflection structure, and the light emitting face of the laser wafer faces the light reflection structure.
Further, in the above technical solution, the metal heat conducting module is integrally formed by any one of copper, iron, and aluminum.
Further, in the above technical solution, the metal heat conduction module is a ceramic and metal combined structure, and the metal includes copper, iron, and aluminum.
Further, in the above technical solution, the high-temperature plasticizing outer frame is integrally molded by any one of a PCT material, an EMC material, and an SMC material.
Further, in the above technical solution, the upper end of the metal heat conduction module is stepped, and has a boss and a groove, the laser chip and the substrate are mounted on the boss, and the light reflection structure is disposed in the groove.
Further, in the above technical solution, the light reflection structure is a reflecting mirror or a prism, and has a 45 ° reflecting surface, and a light emitting surface of the laser chip faces the 45 ° reflecting surface.
Further, in the above technical solution, the substrate is a ceramic plate or a silica gel plate.
Further, in the above technical solution, a light-transmitting plate is disposed at an upper end of the high-temperature plasticizing outer frame, and the light-transmitting plate covers the installation chamber.
Further, in the above technical solution, the light-transmitting plate is any one of a glass plate, a sapphire plate, and a transparent ceramic plate.
Further, in the above technical solution, the upper end surface of the light-transmitting plate is provided with a fluorescent layer.
After the technical scheme is adopted, compared with the prior art, the utility model has following beneficial effect: the utility model adopts the metal heat conducting module and the high-temperature plasticizing outer frame integrally fixed at the periphery of the metal heat conducting module as the laser SMD packaging support plate, which can realize rapid heat conduction and has ideal heat conducting effect, thereby improving the working quality and the service life of the product; the lower end face of the metal heat conduction module and the conductive electrodes are used as positive and negative electrodes, patch mounting can be achieved, assembly is more convenient, and the electric conduction effect is excellent; the installation cavity is also provided with a light reflection structure, and the light emitting surface of the laser wafer faces the light reflection structure, so that the light emitting surface can be enlarged, and the illumination effect is improved.
Description of the drawings:
fig. 1 is a structural view of the present invention.
The specific implementation mode is as follows:
the present invention will be further described with reference to the following specific embodiments and accompanying drawings.
See fig. 1 for a laser SMD package carrier plate structure, which includes a metal heat conduction module 1 and a high temperature plasticized outer frame 2 integrally fixed to the periphery of the metal heat conduction module 1, an installation cavity is formed between the high temperature plasticized outer frame 2 and the metal heat conduction module 1, the lower end surface of the metal heat conduction module 1 is protruded from the lower end surface of the high temperature plasticized outer frame 2, and the lower end surface of the high temperature plasticized outer frame 2 is further provided with a conductive electrode 21, a laser wafer 3 is installed on the upper end of the metal heat conduction module 1 through a substrate 4 and is placed in the installation cavity, and the installation cavity is further provided with a light reflection structure 6, and the light emitting surface of the laser wafer 3 faces the light reflection structure 6. The utility model adopts the metal heat conducting module 1 and the high temperature plasticizing outer frame 2 integrally fixed at the periphery of the metal heat conducting module 1 as the laser SMD packaging support plate, which can realize rapid heat conduction and has ideal heat conducting effect, thereby improving the working quality and the service life of the product; the lower end face of the metal heat conduction module 1 and the conductive electrode 21 are used as a positive electrode and a negative electrode, so that patch mounting can be realized, assembly is more convenient, and the electric conduction effect is excellent; the installation cavity is also provided with a light reflection structure, and the light emitting surface of the laser wafer 3 faces the light reflection structure, so that the light emitting surface can be enlarged, and the illumination effect is improved.
The metal heat conducting module 1 is integrally formed by any one of copper, iron and aluminum. Alternatively, the metal heat conduction module 1 is a combined structure of ceramic and metal, and the metal includes copper, iron, and aluminum.
The high-temperature plasticizing outer frame 2 is integrally formed by any one of PCT material, EMC material and SMC material, and the heat removal effect is excellent.
The upper end of the metal heat conduction module 1 is in a step shape and is provided with a boss 11 and a groove 12, the laser wafer 3 and the substrate 4 are installed on the boss 11, and the light reflection structure is arranged in the groove 12, so that the laser wafer 3, the substrate 4 and the light reflection structure are convenient to assemble, and the light emitting surface can be well adjusted.
The light reflection structure 6 is a reflector or a prism, and has a 45-degree reflection surface, the light emitting surface of the laser wafer 3 faces the 45-degree reflection surface, the reflection effect is excellent, and the light emitting surface can be effectively enlarged.
The substrate 4 is a ceramic plate or a silica gel plate.
And a light-transmitting plate 5 is arranged at the upper end of the high-temperature plasticizing outer frame 2, and the light-transmitting plate 5 covers the mounting cavity to protect the product. The light-transmitting plate 5 is any one of a glass plate, a sapphire plate or a transparent ceramic plate.
The upper end face of the light-transmitting plate 5 is provided with a fluorescent layer, so that the light reflecting effect can be improved.
In summary, the metal heat conduction module 1 and the high-temperature plasticizing outer frame 2 integrally fixed on the periphery of the metal heat conduction module 1 are adopted as the laser SMD packaging support plate, so that the rapid heat conduction can be realized, the heat conduction effect is ideal, and the working quality and the service life of a product can be improved; the lower end face of the metal heat conduction module 1 and the conductive electrode 21 are used as a positive electrode and a negative electrode, so that patch mounting can be realized, assembly is more convenient, and the electric conduction effect is excellent; the installation cavity is also provided with a light reflection structure, and the light emitting surface of the laser wafer 3 faces the light reflection structure, so that the light emitting surface can be enlarged, and the illumination effect is improved.
Of course, the above description is only an exemplary embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes and modifications made by the constructions, features, and principles of the present invention in accordance with the claims of the present invention are intended to be included in the scope of the present invention.
Claims (10)
1. The utility model provides a laser SMD encapsulates carrier plate structure which characterized in that: it includes that metal heat conduction module (1) and an organic whole are fixed in this metal heat conduction module (1) outlying high temperature plastify frame (2), be formed with the installation cavity between this high temperature plastify frame (2) and metal heat conduction module (1), terminal surface salient is terminal surface under this high temperature plastify frame (2) under this metal heat conduction module (1), and terminal surface still is provided with conducting electrode (21) under this high temperature plastify frame (2), install in metal heat conduction module (1) upper end through a base plate (4) laser wafer (3), and place in the installation cavity, and this installation cavity still is provided with light-reflecting structure (6), the light emitting area of this laser wafer (3) is towards light-reflecting structure.
2. The structure of claim 1, wherein the SMD package carrier further comprises: the metal heat conduction module (1) is integrally formed by any one of copper, iron and aluminum.
3. The structure of claim 1, wherein the SMD package carrier further comprises: the metal heat conduction module (1) is of a ceramic and metal combined structure, and metal comprises copper, iron and aluminum.
4. The laser SMD package carrier structure according to any one of claims 1-3, characterized in that: the high-temperature plasticizing outer frame (2) is integrally formed by any one of PCT materials, EMC materials and SMC materials.
5. The laser SMD package carrier structure according to any one of claims 1-3, characterized in that: the upper end of the metal heat conduction module (1) is in a step shape and is provided with a boss (11) and a groove (12), the laser wafer (3) and the substrate (4) are installed on the boss (11), and the light reflection structure is arranged in the groove (12).
6. The structure of claim 5, wherein the SMD package carrier further comprises: the light reflection structure (6) is a reflector or a prism, and is provided with a 45-degree reflection surface, and the light emitting surface of the laser wafer (3) faces the 45-degree reflection surface.
7. The structure of claim 6, wherein the SMD package carrier further comprises: the substrate (4) is a ceramic plate or a silica gel plate.
8. The structure of claim 6, wherein the SMD package carrier further comprises: and a light-transmitting plate (5) is arranged at the upper end of the high-temperature plasticizing outer frame (2), and the light-transmitting plate (5) covers the mounting chamber.
9. The structure of claim 8, wherein the SMD package carrier further comprises: the light-transmitting plate (5) is any one of a glass plate, a sapphire plate or a transparent ceramic plate.
10. The structure of claim 8, wherein the SMD package carrier further comprises: and the upper end surface of the light-transmitting plate (5) is provided with a fluorescent layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120581981.9U CN214379231U (en) | 2021-03-22 | 2021-03-22 | Laser SMD packaging support plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120581981.9U CN214379231U (en) | 2021-03-22 | 2021-03-22 | Laser SMD packaging support plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214379231U true CN214379231U (en) | 2021-10-08 |
Family
ID=77972327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120581981.9U Active CN214379231U (en) | 2021-03-22 | 2021-03-22 | Laser SMD packaging support plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214379231U (en) |
-
2021
- 2021-03-22 CN CN202120581981.9U patent/CN214379231U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.25, Jinfu Road, Jinxia community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee after: Dongguan Aika Intelligent Technology Co.,Ltd. Address before: No.25, Jinfu Road, Jinxia community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee before: DONGGUAN TRUSTING SMART CARD CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230116 Address after: No.6, Xinchun Road, No.5 Industrial Zone, Shangsha community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee after: DONGGUAN SANCHUANG SMART CARD TECHNOLOGY CO.,LTD. Address before: No.25, Jinfu Road, Jinxia community, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee before: Dongguan Aika Intelligent Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |