CN101329043B - Light source component and lightness adjusting method for the same - Google Patents
Light source component and lightness adjusting method for the same Download PDFInfo
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- CN101329043B CN101329043B CN2007101119732A CN200710111973A CN101329043B CN 101329043 B CN101329043 B CN 101329043B CN 2007101119732 A CN2007101119732 A CN 2007101119732A CN 200710111973 A CN200710111973 A CN 200710111973A CN 101329043 B CN101329043 B CN 101329043B
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- source assembly
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- 238000000034 method Methods 0.000 title claims description 21
- 238000004020 luminiscence type Methods 0.000 claims description 63
- 230000005855 radiation Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229910052752 metalloid Inorganic materials 0.000 claims description 3
- 150000002738 metalloids Chemical class 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- -1 acryl Chemical group 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000000904 thermoluminescence Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a light source component which comprises a loader, a plurality of light emitting units, a plurality of first leads and a plurality of second leads, wherein, the light emitting units, the first leads and the second leads are configured on the loader respectively. In addition, all light emitting units are respectively and electrically connected with one of the second leads or one of the first leads. Therefore, the light source can provide a relatively even light source.
Description
Technical field
The invention relates to a kind of light source assembly and the method for adjusting brightness, and particularly relevant for a kind of light source assembly and the method for adjusting brightness that adopts luminescence unit.
Background technology
In recent years, utilize the compound semiconductor of nitrogen gallium, (light emitting diode, LED) element gets most of the attention as the light emitting diode of gallium nitride (GaN), aluminium gallium nitride alloy (AlGaN), nitrated steel gallium (InGaN) etc.III-nitride is the material of a broadband energy gap, and its emission wavelength can be contained to ruddiness from ultraviolet light always, therefore can say so and almost contain the wave band of whole visible light.In addition, compared to conventional bulb, light emitting diode has absolute advantage, for example volume is little, life-span length, low-voltage/current drives, be difficult for breaking, do not contain mercury (not having pollution problem) and the good characteristics such as (power savings) of luminous efficiency, so the application of light emitting diode on industry is very extensive.
Because the luminescence phenomenon of light emitting diode does not belong to thermoluminescence or Discharge illuminating, but it is luminous to belong to cold property, thus light-emitting diode assembly under the good situation of heat radiation, the life-span was more than 100,000 hours, and need not warm up the lamp time (idling time).In addition, light-emitting diode assembly have reaction speed fast (be about 10-9 second), volume little, power-saving, pollute low (not containing mercury), high-reliability, be fit to advantages such as volume production, so the field of its application is very extensive.Therefore, light emitting diode is regarded as most important light source of 21 century.
In the light source assembly that light emitting diode constituted, because the brightness of each light emitting diode is not too identical, therefore the otherness of local brightness can be bigger.In addition, the light emitting diode that is used for the conventional lighting sources assembly has sealing usually, and the radiating efficiency of sealing is relatively poor.In addition owing to can produce a large amount of heat energy during the running of existing light emitting diode, and the brightness of light emitting diode and life-span all can be subjected to Temperature Influence, therefore when the power of light emitting diode increased, the demand of heat radiation is just increase gradually also.Prior art is to use complicated cooling system, yet complicated cooling system also can cause problems such as the excessive and cost increase of volume.
Summary of the invention
In view of this, the invention provides a kind of light source assembly, to improve the uniformity of light source.
In addition, the invention provides a kind of method of adjusting brightness, to adjust the brightness of light source assembly.
The present invention proposes a kind of light source assembly, and it comprises a carrier, a plurality of luminescence unit, many first leads, many second leads and a transparent cover plate.Wherein, luminescence unit, first lead and second lead all are disposed on the carrier.In addition, each luminescence unit be electrically connected to respectively second lead one of them and first lead one of them.Luminescence unit first lead that connects respectively be electrically insulated each other, luminescence unit institute second lead of connection respectively is electrically insulated each other.Second lead one of them has one and removes the district at least, and second lead in the size that removes the district less than other regional sizes of this second lead.Transparent cover plate is disposed on the carrier, and covers above-mentioned luminescence unit.
In an embodiment of the present invention, the material of second lead can be metal material, ceramic material or metalloid.
In an embodiment of the present invention, light source assembly also comprises a plurality of first connection pads and a plurality of second connection pad, wherein each second lead be electrically connected to respectively first connection pad one of them, and each first lead be electrically connected to respectively second connection pad one of them.
In an embodiment of the present invention, luminescence unit can be a luminous chip encapsulation body.
In an embodiment of the present invention, luminescence unit can be a luminescence chip.
In an embodiment of the present invention, luminescence unit can be light-emitting diode chip for backlight unit or Organic Light Emitting Diode chip.
In an embodiment of the present invention, light source assembly also comprises a plurality of projections, it is disposed between carrier and these luminescence units, and wherein one of them is electrically connected to second lead to each luminescence unit via projection, and each luminescence unit is electrically connected to first lead via wherein another of projection.
In an embodiment of the present invention, light source assembly also comprises many leads, it connects between carrier and the luminescence unit, and wherein one of them is electrically connected to second lead to each luminescence unit via lead, and each luminescence unit is electrically connected to first lead via wherein another of lead.
In an embodiment of the present invention, the material of transparent cover plate can be glass or acryl.
In an embodiment of the present invention, light source assembly also comprises a heat radiation virtual wires, and it is disposed at loader surface.
In an embodiment of the present invention, light source assembly also comprises a heat sink, and it is disposed under the carrier.
In an embodiment of the present invention, carrier has a plurality of heat conduction perforations.
In an embodiment of the present invention, carrier can be winding or circuit board.
The present invention proposes a kind of method of adjusting brightness, is used for above-mentioned light source assembly, and this method of adjusting brightness comprises the following steps.At first, detect the brightness of luminescence unit.Then, remove the subregion of pairing second lead of part luminescence unit.
In an embodiment of the present invention, the method that removes the subregion of second lead can be to use laser.
In an embodiment of the present invention, the method that removes the subregion of second lead can be to use punching.
Based on above-mentioned, the present invention utilizes second lead and luminescence unit to electrically connect.When the brightness of luminescence unit is unusual, remove the subregion of second lead, to change the brightness of luminescence unit.Therefore, compared to prior art, light source assembly of the present invention can provide has light source uniformly.In addition, adopt the light emitting diode with sealing compared to prior art, the present invention adopts the naked crystalline substance and the transparent cover plate of arranging in pairs or groups, to improve radiating efficiency and service life.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, several embodiment cited below particularly, and conjunction with figs. is described in detail below.
Description of drawings
Fig. 1 is the vertical view according to a kind of light source assembly of first embodiment of the invention.
Fig. 2 A and Fig. 2 B are the profiles according to a kind of light source assembly of second embodiment of the invention.
The specific embodiment
First embodiment
Fig. 1 is the vertical view according to a kind of light source assembly of first embodiment of the invention.Please refer to Fig. 1, the light source assembly 100 of present embodiment comprises a carrier 110, a plurality of luminescence unit 120, many first leads 130 and many second leads 140, wherein luminescence unit 120, first lead 130 and second lead 140 all are disposed at carrier 110, and luminescence unit 120 can be disposed on the carrier 110 via surface mount technology (SMT) or pluggable mode.Luminescence unit 120 can be to arrange being aligned or face array.Carrier 110 can be the carrier of winding, circuit board, flexible circuit board or other types.In the present embodiment, luminescence unit 120 is the luminous chip encapsulation body of light-emitting diode chip for backlight unit packaging body, Organic Light Emitting Diode chip packing-body or other kenels.Yet in another embodiment, luminescence unit 120 also can be the luminescence chip of light-emitting diode chip for backlight unit, Organic Light Emitting Diode chip or other kenels.In addition, each luminescence unit 120 all is connected to one first lead 130 and one second lead 140.More specifically, the material of second lead can be metal material, ceramic material or metalloid.
In the present embodiment, this light source assembly 100 also comprises a plurality of first connection pads 150 and a plurality of second connection pads 160, and wherein each second lead 140 is electrically connected to first connection pad 150 respectively, and each first lead 130 is electrically connected to second connection pad 160 respectively.Therefore, extraneous power supply can be via first connection pad 150 and second connection pad 160 and is put on the luminescence unit 120.In addition, the also configurable heat radiation virtual wires 135 in carrier 110 surfaces, this heat radiation virtual wires 135 can be engaged in luminescence unit 120, to promote heat radiation function.The method that below will be used for the adjustment brightness of this light source assembly 100 describes.
Please continue the magnification region with reference to figure 1, this method of adjusting brightness comprises the following steps.At first, detect the brightness of each luminescence unit 120.When the running of part luminescence unit 120 is unusual (for example being that brightness is too high), remove the subregion 140a of part luminescence unit 120 pairing second leads 140.Therefore, the luminosity of this abnormal luminous unit 120 just can change, with the luminosity of the luminescence unit 120 arround cooperating.More specifically, the method that removes the subregion 140a of second lead 140 can be to use laser.Perhaps, the method that removes the subregion 140a of second lead 140 can be to use punching.In addition, not shape and the position of localized area 140a of present embodiment.
Because unusual luminescence unit 120 can be adjusted brightness via above-mentioned method, so this kind light source assembly 100 has higher yield.In addition, this kind light source assembly 100 can provide light source comparatively uniformly
Second embodiment
Fig. 2 A and Fig. 2 B are the profiles according to a kind of light source assembly of second embodiment of the invention.Please refer to Fig. 2 A, the light source assembly 200 of present embodiment is similar to the aforementioned embodiment, and its difference is: luminescence unit 220 is light-emitting diode chip for backlight unit, Organic Light Emitting Diode chip or other luminescence chips.In addition, light source assembly 200 also comprises a plurality of projections 230, and it is disposed between carrier 110 and these luminescence units 220, and wherein each luminescence unit 220 is electrically connected to second lead 140 and first lead 130 respectively via projection 230.Yet light source assembly 200 also can comprise many routings 270, and each luminescence unit 220 is electrically connected to second lead 140 and first lead 130 (shown in Fig. 2 B) via routing 270.
In addition, the light source assembly 200 of present embodiment also comprises a transparent cover plate 210, and it is disposed on the carrier 110, and covers luminescence unit 220, with the electric connection between protection luminescence unit 220 and the carrier 110.The material of transparent cover plate 210 can be glass, acryl or other transparent materials.In addition, transparent cover plate 210 also can be applied among first embodiment.Moreover in order to protect the electric connection between luminescence unit 220 and the carrier 110, the light source assembly 200 of present embodiment also can comprise a primer 240, and it is disposed between luminescence unit 220 and the carrier 110, to coat projection 230.
In order to increase radiating efficiency, this carrier 110 can have a plurality of heat conduction perforations 250, and it runs through whole carrier 110, and the position of heat conduction perforation 250 can be the below that is positioned at luminescence unit 220.In addition, light source assembly 200 also can comprise a heat sink 260, and it is disposed at carrier 110 times.In the present embodiment, heat conduction perforation 250 can contact with heat sink 260.It should be noted that heat conduction perforation 250 and heat sink 260 also can use separately, and the heat conduction perforation 250 of present embodiment can be applied among first embodiment also with heat sink 260.
Light emitting diode compared to prior art has sealing, and the luminescence unit 220 of present embodiment is naked crystalline substance, so the luminescence unit 220 of present embodiment has higher radiating efficiency.In other words, compared to prior art, the light source assembly 200 of present embodiment has preferable radiating efficiency and long service life.In addition, the method for above-mentioned adjustment brightness also can be applied to the light source assembly 200 of present embodiment.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when with being as the criterion that claim was defined.
Claims (11)
1. light source assembly comprises:
One carrier;
A plurality of luminescence units are disposed on this carrier;
Many first leads are disposed on this carrier;
Many second leads, be disposed on this carrier, wherein respectively this luminescence unit be electrically connected to respectively those second leads one of them and those first leads one of them, those luminescence units those first leads of connecting respectively be electrically insulated each other, those luminescence units those second leads of connecting respectively be electrically insulated each other, wherein those second leads one of them has one and removes the district at least, and this second lead in this size that removes the district less than other regional sizes of this second lead; And
One transparent cover plate is disposed on this carrier, and covers those luminescence units.
2. light source assembly as claimed in claim 1 is characterized in that the material of those second leads comprises metal material, ceramic material or metalloid.
3. light source assembly as claimed in claim 1, it is characterized in that, also comprise a plurality of first connection pads and a plurality of second connection pad, wherein respectively this second lead be electrically connected to respectively those first connection pads one of them, and respectively this first lead be electrically connected to respectively those second connection pads one of them.
4. light source assembly as claimed in claim 1, it is characterized in that, also comprise a plurality of projections, be disposed between this carrier and those luminescence units, wherein respectively this luminescence unit one of them is electrically connected to this second lead via those projections, and respectively this luminescence unit is electrically connected to this first lead via wherein another of those projections.
5. light source assembly as claimed in claim 1, it is characterized in that, also comprise many routings, connect between this carrier and those luminescence units, wherein respectively this luminescence unit one of them is electrically connected to this second lead via those routings, and respectively this luminescence unit is electrically connected to this first lead via wherein another of those leads.
6. light source assembly as claimed in claim 1 is characterized in that, also comprises a heat radiation virtual wires, is disposed at the surface of this carrier.
7. light source assembly as claimed in claim 1 is characterized in that, also comprises a heat sink, is disposed under this carrier.
8. light source assembly as claimed in claim 1 is characterized in that, this carrier has a plurality of heat conduction perforations.
9. a method of adjusting brightness is used for light source assembly as claimed in claim 1, and the method for this adjustment brightness comprises:
Detect the brightness of those luminescence units; And
Remove the subregion of pairing those second leads of those luminescence units of part.
10. the method for adjustment brightness as claimed in claim 9 is characterized in that, the method that removes the subregion of those second leads comprises use laser.
11. the method for adjustment brightness as claimed in claim 9 is characterized in that, the method that removes the subregion of those second leads comprises uses punching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101119732A CN101329043B (en) | 2007-06-18 | 2007-06-18 | Light source component and lightness adjusting method for the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101119732A CN101329043B (en) | 2007-06-18 | 2007-06-18 | Light source component and lightness adjusting method for the same |
Publications (2)
| Publication Number | Publication Date |
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| CN101329043A CN101329043A (en) | 2008-12-24 |
| CN101329043B true CN101329043B (en) | 2010-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2007101119732A Expired - Fee Related CN101329043B (en) | 2007-06-18 | 2007-06-18 | Light source component and lightness adjusting method for the same |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101034054B1 (en) * | 2009-10-22 | 2011-05-12 | 엘지이노텍 주식회사 | Light emitting device package and method for fabricating the same |
| CN102854724B (en) * | 2012-08-30 | 2014-11-05 | 深圳市绎立锐光科技开发有限公司 | Adjustment method and device of projection light source |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1216742A (en) * | 1997-09-24 | 1999-05-19 | Valeo电子公司 | Circuit with luminescent diode, and indicating light for motor vehicle contg. same |
| CN2671036Y (en) * | 2003-10-14 | 2005-01-12 | 胜开科技股份有限公司 | Small memory card |
| CN1584956A (en) * | 2004-06-07 | 2005-02-23 | 友达光电股份有限公司 | Organic LED displaying panels with uniform height |
| CN1601772A (en) * | 2004-09-22 | 2005-03-30 | 邹庆福 | Modular structure of array LED and its packing method |
| CN1885514A (en) * | 2005-06-20 | 2006-12-27 | 南茂科技股份有限公司 | Packaging arrangement of flip chip on thin film |
-
2007
- 2007-06-18 CN CN2007101119732A patent/CN101329043B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1216742A (en) * | 1997-09-24 | 1999-05-19 | Valeo电子公司 | Circuit with luminescent diode, and indicating light for motor vehicle contg. same |
| CN2671036Y (en) * | 2003-10-14 | 2005-01-12 | 胜开科技股份有限公司 | Small memory card |
| CN1584956A (en) * | 2004-06-07 | 2005-02-23 | 友达光电股份有限公司 | Organic LED displaying panels with uniform height |
| CN1601772A (en) * | 2004-09-22 | 2005-03-30 | 邹庆福 | Modular structure of array LED and its packing method |
| CN1885514A (en) * | 2005-06-20 | 2006-12-27 | 南茂科技股份有限公司 | Packaging arrangement of flip chip on thin film |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2004-200537A 2004.07.15 |
| JP特开平10-83148A 1998.03.31 |
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| CN101329043A (en) | 2008-12-24 |
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Granted publication date: 20100901 Termination date: 20200618 |