200849641 ID-9603006 24067twf.doc/p 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種光源模組與調整亮度的方法，且 特別是有關於-縣用發光單元的光源模組與調整亮度的 方法。 【先前技術】 近年來，利用含氮化鎵的化合物半導體，如氮化嫁 (GaN)、氮化銘鎵（AlGaN)、氮化銦鎵（InGaN)等的 發光二極體（light emitting diode, LED)元件備受矚目。三 族氮化物為-寬頻帶能隙之材料，其發光波長可以從紫外 光一直涵蓋至紅光，因此可說是幾乎涵蓋整個可見光的波 段。此外，相較於傳統燈泡，發光二極體具有絕對的優勢， 例如體積小、壽命長、低電壓/電流驅動、不易破裂、不含 水銀（/又有污染問題）以及發光效率佳（省電）等特性， 因此發光二極體在產業上的應用非常廣泛。 由於發光二極體的發光現象不屬於熱發光或放電發 光’而疋屬1冷性發光，所以發光二極體裝置在散熱良好 的情況下，壽命可長達十萬小相上，且無須暖燈時間 Udling time)。此外，發光二極體裳置具有反應速度快（約 為1〇9秒）、體積小、用電省、污染低（不含水銀）、高 可靠度、適合量產等優點，因此其應㈣領域十分廣泛。 因此，發光二極體被視為21世紀最重要的光源。 由發光二極體所構成的光源模組中，由於各發光二極 5 200849641 ID-9603006 24067twf.doc/p 體的亮度不太相同，因此局部的亮度的差異性會較大。此 外，用於習知的光源模組中的發光二極體通常具有封膠， 而封膠的散熱效率較差。另外，由於習知的發光二極體運 作時會產生大量的熱能，且發光二極體的亮度及壽命都會 受到溫度的影響，因此當發光二極體的功率增加時，散熱 的需求也就逐漸增加。習知技術是使用複雜的散熱系統， 〇 o 然而複雜的散熱系統也會造成體積過大以及成本增加 題。 ] 【發明内容】 均勺ί鑑於此，本發明提供一種光源模組，以提高光源的 模組=度树_整光源 光單源模組，其包括—承載器、多個發 發光單元'第-導線與第二導 ^2。 此外，各發群元相紐 =^载為上。 第一導、線並中夕一、采 按主弟一蛉線其中之一以及 述發光單Ϊ。。日Μ板配置於承载H上，並覆蓋上 在本發明之一實施例中， 材質、陶竞材料或者是類金屬弟一¥線的材質可以是金屬 在本發明之一實施 墊與多個第二接墊，其 t，、且更包括多個第-接 各弟一¥線分別電性連接至第— 6 200849641 ID-9603006 24067twf.doc/p 接墊其 接墊其中之一，且各第一導線分別 中之一。 兔性連接至第二 在本發明之一實施例中， 裝體。 x枣凡可以是發光晶片封 在本發明之一實施例中，發一 在本發明之-實施例中，發，兀可以是發光晶片。 晶片或有機發光二極體晶片。x早π可以是發光二極體 〇 在本發明之一實施例中， 其配置於承载器與這些發光單元更包括多個凸塊， 由凸绳其中之—電性連接至第，，其中各發光單元經 凸塊其中之另一電性連接至第―導:。’且各發光單元經由 在本發明之一實施例中，、:。 ”之—電性連接至第二導線， x先早凡經由導線 中之另1性連接至第—導線。°*光單元經由導線其 〇或壓發明之—實施例中，透明蓋板的材質可以是玻璃 導線在實關巾’光賴組更包括—散熱虛擬 〜配置於承載器表面。 立配ίΐΓ明之—實施例中，光源模組更包括—散熱板， /、罝於承载器下。 2本發明之—實施例中，承載器具有多個導熱貫孔。 本發明之一實施例中，承載裔可以是捲帶或電路 板。 7 用於上述的光源模 區域的 區域的 〇 〇 200849641 ID-9603006 24067twf.doc/p 本發明提出一種調整亮度的方法， 之部分區域 在本發明之一實施例中，移除第二導線之部 方法可以是使用雷射。 在本發明之-實施例中，移除第二導線之部分 方法可以是使用打孔。 上述，本發制用第二導線與發光單元電性連200849641 ID-9603006 24067twf.doc/p IX. Description of the Invention: [Technical Field] The present invention relates to a light source module and a method for adjusting brightness, and more particularly to a light source module for a county light emitting unit With the method of adjusting the brightness. [Prior Art] In recent years, a compound semiconductor containing gallium nitride, such as a light emitting diode (GaN), an indium gallium nitride (AlGaN), an indium gallium nitride (InGaN) or the like, has been used. LED) components are attracting attention. The triad nitride is a material with a wide band gap, and its illuminating wavelength can be covered from ultraviolet light to red light, so it can be said to cover almost the entire visible light band. In addition, compared to conventional light bulbs, light-emitting diodes have absolute advantages, such as small size, long life, low voltage/current drive, not easy to crack, no mercury (and pollution problems), and good luminous efficiency (power saving) And other characteristics, so the application of the light-emitting diode in the industry is very extensive. Since the luminescence phenomenon of the illuminating diode does not belong to thermal luminescence or discharge luminescence, and the luminescence is a cold luminescence, the illuminating diode device can have a lifetime of up to 100,000 small phases in the case of good heat dissipation, and does not require heating. Light time Udling time). In addition, the light-emitting diode skirt has the advantages of fast reaction speed (about 1 〇 9 seconds), small volume, low power consumption, low pollution (no mercury), high reliability, and suitable for mass production, so it should be (4) The field is very extensive. Therefore, the light-emitting diode is regarded as the most important light source in the 21st century. In the light source module composed of the light-emitting diodes, since the brightness of each of the light-emitting diodes is not the same, the difference in local brightness is large. In addition, the light-emitting diodes used in the conventional light source module generally have a sealant, and the heat-dissipating efficiency of the sealant is poor. In addition, since the conventional light-emitting diode generates a large amount of heat energy during operation, and the brightness and life of the light-emitting diode are affected by temperature, when the power of the light-emitting diode increases, the heat-dissipation demand gradually increases. increase. Conventional technology uses complex heat dissipation systems, 然而 o However, complex heat dissipation systems can also cause excessive volume and cost increases. In view of the above, the present invention provides a light source module for improving a module of a light source, a degree tree, and a light source single source module, which includes a carrier and a plurality of light emitting units. - Wire and second guide ^2. In addition, each group of elements is loaded with ^^. The first guide, the line and the middle of the evening, one by one of the line of the brother-in-law and the light-emitting single. . The corrugated board is disposed on the bearing H and covered in an embodiment of the present invention. The material of the material, the ceramic material or the metal-like material may be metal in one embodiment of the present invention and the plurality of The second pad, the t, and the plurality of first-connected brothers are respectively electrically connected to the first - 6 200849641 ID-9603006 24067twf.doc/p one of the pads, and each of the pads One of the wires. Rabbit sex is coupled to the second. In one embodiment of the invention, the body is mounted. x Jujube may be a light-emitting wafer package. In one embodiment of the invention, in one embodiment of the invention, the hair may be a light-emitting wafer. Wafer or organic light emitting diode wafer. x early π may be a light-emitting diode 〇 in an embodiment of the present invention, which is disposed on the carrier and the light-emitting unit further includes a plurality of bumps, wherein the convex rope is electrically connected to the first, wherein each The light-emitting unit is electrically connected to the first guide through the bump. And each of the light-emitting units is via an embodiment of the present invention. "Electrically connected to the second wire, x is first connected to the first wire via another wire. ° * Light unit is invented by wire or pressed - in the embodiment, the material of the transparent cover It can be a glass wire in the actual closing towel's light-receiving group, including the heat-dissipating virtual-distributed to the surface of the carrier. In the embodiment, the light source module further includes a heat-dissipating plate, and is disposed under the carrier. In the embodiment of the invention, the carrier has a plurality of thermally conductive through holes. In one embodiment of the invention, the carrier may be a tape or a circuit board. 7 用于200849641 for the area of the light source mode region described above ID-9603006 24067twf.doc/p The present invention proposes a method of adjusting the brightness, in which a portion of the method of removing the second wire may be a laser using an embodiment of the present invention. In the method of removing the second wire, the punching may be performed. The second wire of the present invention is electrically connected to the light emitting unit.
以改時’移除第：導'軸分區域， A止^的冗度。因此，相較於習知技術，本發明 的光源模組簡提供具有較均勻的光源。此外，相較P 具有封膠的發光二極體，本發明採用裸晶並： 配透明^板’以提高散熱效率與制壽命。 為2本發明之上述和其他目的、特徵和優點能更明顯 明=下。文特舉數個實施例，並配合賴圖式，作詳細說 【實施方式】 第一實 郝囝圖往，：知本發明之第-實施例之-種光源模組的俯 π回明苓考圖1，本實施例之光源模組100包括一承· iUrT個發光單^ 12Q、多條第—導線13G與多條第二 M0均配120、弟-導線130與第二導線 直於承载态110,而發光單元120可以經由表面黏 200849641 ID-9603006 24067twf.doc/p 著技術（SMT)或插拔方式配置於承載器n〇上 元120可以是排列成一線或面陣列。承载器ιι〇可 帶、電路板、軟性電路板或其他類型的承載器。在= 例中，發光單元120為發光二極體晶片封裝體、有機ς: 二極體晶片封裝體或其他型態的發光晶片封铁: 在另-實施例中’發光單元12Q也可以是發光二極體晶 片、有機發光二極體晶片或其他型態的發光晶片。此 〇 纟發光單元12Q均連接至—條第-導線130與—條第二導 線140。更詳細而言，第二導線的材質可以是金屬材^ 陶瓷材料或者是類金屬。 ' 在本實施例中，此光源模組1〇〇更包括多個第一接墊 150與多個第二接墊跡其中各第二導線14〇分別電性連 接至第-接墊150，且各第—導線13〇分別電性連接至第 二接墊160。因此，外界電源能夠經由第一接墊15〇與第 二接墊160而施加於發光單元12〇上。此外，承載器/n〇 表面亦可配置散熱虛擬導線135，此散熱虛擬導線可 '接合於發光單元120 ’以增進散熱功效。以下將用於此光 源模組100的調整亮度的方法進行說明。 、 請繼續參考圖1的放大區域，此調整亮度的方法包括 下列步驟。首先，偵測各個發光單元12〇的亮度。當部分 發光單元120的運作異常時（例如是亮度太高），移除部 分發光單兀120所對應之第二導線14〇之部分區域i4〇a。 因此，此異常發光單元120的發光亮度便可改變，以配合 周的赉光單元120的發光壳度。更詳細而言，移除第二 200849641 ID-9603006 24067twf.doc/p 導線140之部分區域i4〇a的方法可以是使用雷射。或者， 牙夕除弟一導線140之部分區域i40a的方法可以是使用打 孔。此外，本實施例並不限定區域14〇a的形狀與位置。 由於異常的發光單元120可以經由上述的方法來調整 儿度’因此此種光源板組1 具有較高的良率。此外，此 種光源模組100能夠提供較為均勻的光源 ΟIn order to change the time to remove the "guide:" axis sub-area, A stop ^ redundancy. Therefore, the light source module of the present invention provides a relatively uniform light source as compared with the prior art. In addition, the present invention employs a bare crystal and a transparent plate to improve heat dissipation efficiency and lifetime compared to a light-emitting diode having a sealant. The above and other objects, features and advantages of the present invention will become more apparent. The following is a detailed description of the embodiment of the present invention, and the first embodiment of the present invention 1. The light source module 100 of the present embodiment includes a bearing, an iUrT light emitting unit 12Q, a plurality of first conductors 13G and a plurality of second M0s, 120, and a second conductor and a second conductor directly connected to the carrier 110. The light emitting unit 120 may be disposed on the carrier via the surface bonding technology, or may be arranged in a line or area array. Carrier ιι〇 can be used as a tape, circuit board, flexible circuit board or other type of carrier. In the example, the light emitting unit 120 is a light emitting diode chip package, an organic germanium: a diode chip package or other types of light emitting chip seal iron: in another embodiment, the light emitting unit 12Q may also be illuminated. Diode wafers, organic light emitting diode wafers or other types of light emitting wafers. The illuminating unit 12Q is connected to the strip-wire 130 and the strip second wire 140. In more detail, the material of the second wire may be a metal material, a ceramic material or a metalloid. In this embodiment, the light source module 1 further includes a plurality of first pads 150 and a plurality of second pads, wherein each of the second wires 14 is electrically connected to the first pads 150, respectively, and Each of the first wires 13 is electrically connected to the second pads 160, respectively. Therefore, the external power source can be applied to the light emitting unit 12A via the first pads 15 and the second pads 160. In addition, the carrier/n〇 surface may also be provided with a heat dissipating dummy wire 135, which may be 'bonded to the light emitting unit 120' to enhance heat dissipation. A method for adjusting the brightness of the light source module 100 will be described below. Please continue to refer to the enlarged area of Figure 1. This method of adjusting the brightness includes the following steps. First, the brightness of each of the light-emitting units 12A is detected. When the operation of the partial light-emitting unit 120 is abnormal (for example, the brightness is too high), a portion i4〇a of the second wire 14A corresponding to the portion of the light-emitting unit 120 is removed. Therefore, the brightness of the light emitted from the abnormal light emitting unit 120 can be changed to match the light-emitting shell of the peripheral light-emitting unit 120. In more detail, the method of removing the partial region i4〇a of the second 200849641 ID-9603006 24067twf.doc/p wire 140 may be to use a laser. Alternatively, the method of removing a portion of the wire i40a of the wire 140 may be to use a punch. Further, the present embodiment does not limit the shape and position of the region 14A. Since the abnormal light-emitting unit 120 can be adjusted by the above-described method, the light source panel group 1 has a high yield. In addition, the light source module 100 can provide a relatively uniform light source.
(J _第二 圖2A與圖2B是依照本發明之第二實施例之一種光源 模組的剖面圖。请先參考圖2A，本實施例之光源模組2〇( 與上述實施例相似，其不同之處在於··發光單元220為發 光一極體晶片、有機發光二極體晶片或其他發光晶片。此 外，光源模組200更包括多個凸塊23〇 ,其配置於承载器 no與這些發光單元220之間，其中各發光單元22〇經: 凸塊230分別電性連接至第二導線14〇盥第一導嗖 2而’光源模組200也可以包括多條打線27〇， ，兀220經由打線27〇 |性連接至第 〆= 線130 (如圖2B所示）。 ，、弟一導 另外’本實施例之光源模組2〇〇 21〇，其配置於承載器110上，並包括_一透明蓋极(J _ second FIG. 2A and FIG. 2B are cross-sectional views of a light source module according to a second embodiment of the present invention. Referring first to FIG. 2A, the light source module 2A of the present embodiment is similar to the above embodiment. The difference is that the light-emitting unit 220 is a light-emitting one-pole wafer, an organic light-emitting diode wafer or other light-emitting chip. In addition, the light source module 200 further includes a plurality of bumps 23, which are disposed on the carrier no and Between the light-emitting units 220, wherein the light-emitting units 22 are: the bumps 230 are electrically connected to the second wires 14 and the first guides 2, respectively. The light source module 200 may also include a plurality of wires 27, The 兀220 is connected to the 〆= line 130 (shown in FIG. 2B) via the wire 27〇, and the other light source module 2〇〇21〇 of the present embodiment is disposed on the carrier 110. And include _ a transparent cover
護發光單元⑽與承載哭先早兀220，以保 91Π ΛΑα1 之間的電性連接。透日θ I 210的材質可以是玻璃、壓克力或其 透月盖板 透明蓋板210也可以應用於第—實施 1。此外， 護發光單元220與承載器11〇之間者，為了保 連接，本實施例 10 200849641 ID-9603006 24067twf.doc/pThe light-emitting unit (10) and the load-carrying device are placed early to ensure an electrical connection between 91Π ΛΑα1. The material of the θ I 210 may be glass, acryl or a moon permeable cover. The transparent cover 210 may also be applied to the first embodiment. In addition, in order to ensure connection between the light-emitting unit 220 and the carrier 11〇, this embodiment 10 200849641 ID-9603006 24067twf.doc/p
之光源模組200也可以包括一底膠240，其配置於發光單 元220與承載器！ 1〇之間，以包覆凸塊23〇。 X 為了增加散熱效率，此承載器Π0可以具有多個導熱 貫孔250,其貫穿整個承载器11〇，而導熱貫孔25〇的位置 可以是位於發光單元220的下方。此外，光源模組2〇〇也 可以包括一散熱板260，其配置於承載器11〇下。在本實 施例中，導熱貫孔250可以與散熱板26〇接觸。值得注咅 〇 的疋，$熱貝孔與散熱板260也可以單獨使用，且本 實施例之導熱貫孔250與散熱板260也可以應用於第一每 施例中。 貝 义一，較於習知技術的發光二極體具有封膠，本實施例的 發光單兀220為裸晶，因此本實施例的發光單元22〇呈有 較高㈣熱效率。換言之，相較於習知技術，本實施例之 光源模組2〇0具有較佳的散熱效率與較長的使用壽命。此 外，上述的調整亮度的方法也可以應用於本實施例之 ^ 模組200。 雖然本發明已以較佳實施例揭露如上，铁豆 限定本發明，任何所屬技術領域中具有通常:識者= =本發明之精神和範_，t可作些許之更動與潤飾， =本發明之紐_當視後社巾請專· _界定者 【圖式簡單說明】 圖1是依照本發明之第一實施例之一種光源模組的俯 200849641 ID-9603006 24067twf.doc/p 視圖。 圖2A與圖2B是依照本發明之第二實施例之一種光源 模組的剖面圖。 【主要元件符號說明】 100、200 :光源模組 110 :承載器 120、220 :發光單元 、 130 :第一導線 135 :散熱虛擬導線 140 :第二導線 140a :區域 150 :第一接墊 160 ·•第二接墊 210 :透明蓋板 230 :凸塊 CJ 240 :底膠 250 :導熱貫孔 260 :散熱板 270 :導線 12The light source module 200 can also include a primer 240 disposed on the light emitting unit 220 and the carrier! Between 1 ,, to cover the bumps 23 〇. In order to increase the heat dissipation efficiency, the carrier Π0 may have a plurality of thermally conductive through holes 250 extending through the entire carrier 11〇, and the position of the thermally conductive through holes 25〇 may be located below the light emitting unit 220. In addition, the light source module 2A may also include a heat dissipation plate 260 disposed under the carrier 11. In the present embodiment, the thermally conductive through holes 250 may be in contact with the heat sink 26 . It is worthwhile to note that the hot hole and the heat sink 260 can also be used alone, and the heat conducting through hole 250 and the heat sink 260 of this embodiment can also be applied to the first embodiment. In the first embodiment, the light-emitting diode of the present embodiment has a seal, and the light-emitting unit 220 of the present embodiment is a bare crystal. Therefore, the light-emitting unit 22 of the present embodiment has a high (four) thermal efficiency. In other words, the light source module 2〇0 of the embodiment has better heat dissipation efficiency and longer service life than the prior art. Further, the above method of adjusting the brightness can also be applied to the module 200 of the present embodiment. Although the present invention has been disclosed in the preferred embodiments as above, the iron beans define the present invention, and any one of the technical fields in the art has the following general knowledge: = the spirit and the scope of the present invention, t can be modified and retouched, = the new invention BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view of a light source module according to a first embodiment of the present invention in the form of 200849641 ID-9603006 24067twf.doc/p. 2A and 2B are cross-sectional views showing a light source module in accordance with a second embodiment of the present invention. [Main component symbol description] 100, 200: light source module 110: carrier 120, 220: light-emitting unit, 130: first wire 135: heat-dissipating virtual wire 140: second wire 140a: region 150: first pad 160 • Second pad 210: transparent cover 230: bump CJ 240: primer 250: thermally conductive through hole 260: heat sink 270: wire 12