CN212934648U - SMD double-colored support with metal reflection cavity - Google Patents
SMD double-colored support with metal reflection cavity Download PDFInfo
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- CN212934648U CN212934648U CN202020987843.6U CN202020987843U CN212934648U CN 212934648 U CN212934648 U CN 212934648U CN 202020987843 U CN202020987843 U CN 202020987843U CN 212934648 U CN212934648 U CN 212934648U
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Abstract
The utility model discloses a SMD double-colored support with metal reflection chamber, including the base plate, be provided with anode plate and negative plate above the base plate, anode plate and negative plate are located same horizontal plane, be provided with the metal sheet below the base plate, the base plate left side is provided with positive pole paster layer, the right side of base plate is provided with negative pole paster layer, the metal sheet, the base plate, the anode plate passes through the positive pole paster layer and connects, the metal sheet, the base plate, the negative plate passes through the negative pole paster layer and connects; the metal reflection cavity is characterized in that a first small hole is formed in the substrate, a second small hole is formed in the anode plate, and the first small hole and the second small hole form a metal reflection cavity.
Description
Technical Field
The utility model relates to the technical field of supports, particularly, relate to a SMD double-colored support with metal reflection chamber.
Background
With the continuous development of electronic products, power consumption is higher and higher, the requirement on the heat dissipation performance of the PCB substrate is more and more urgent, the poor heat dissipation performance can reduce the service life of the product and even damage the product, however, the high heat conduction substrate is relatively expensive. On the one hand, the temperature of other most substrates is increased by using electronic products, so that the substrates are damaged, and on the other hand, the heat transfer path is long and the heat dissipation effect is poor.
In view of the above technical problems, no effective solution has been proposed at present.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned technical problem among the correlation technique, the utility model provides a SMD double-colored support with metal reflection chamber can overcome the above-mentioned not enough of prior art.
In order to achieve the technical purpose, the technical scheme of the utility model is realized as follows:
a chip type double-color support with a metal reflection cavity comprises a substrate, wherein an anode plate and a cathode plate are arranged above the substrate, the anode plate and the cathode plate are positioned on the same horizontal plane, a metal plate is arranged below the substrate, an anode chip layer is arranged on the left side of the substrate, a cathode chip layer is arranged on the right side of the substrate, the metal plate, the substrate and the anode plate are connected through the anode chip layer, and the metal plate, the substrate and the cathode plate are connected through the cathode chip layer; the metal reflection cavity is characterized in that a first small hole is formed in the substrate, a second small hole is formed in the anode plate, and the first small hole and the second small hole form a metal reflection cavity.
Furthermore, the substrate is made of a solid transparent double-color plastic material.
Furthermore, the anode plate, the cathode plate and the metal plate are all made of copper.
Further, the shape of the metal reflecting cavity is horn-shaped.
Furthermore, the anode patch layer and the cathode patch layer are both made of conductive metal.
The utility model has the advantages that: the utility model discloses a design a SMD double-colored support with metal reflection chamber, when having strengthened the thermal diffusivity of base plate, also the cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is an exploded schematic view of a patch type two-color bracket with a metal reflective cavity according to an embodiment of the present invention;
fig. 2 is a schematic view of an assembly structure of a patch type bicolor bracket with a metal reflective cavity according to an embodiment of the present invention.
In the figure:
1. a substrate; 2. an anode plate; 3. a cathode plate; 4. a metal plate; 5. an anode patch layer; 6. a cathode patch layer; 7. a metal reflective cavity; 11. a first aperture; 21. a second aperture.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art all belong to the protection scope of the present invention.
As shown in fig. 1-2, according to the embodiment of the present invention, a chip type two-color bracket with a metal reflection cavity comprises a substrate 1, an anode plate 2 and a cathode plate 3 are arranged above the substrate 1, the anode plate 2 and the cathode plate 3 are located on the same horizontal plane, a metal plate 4 is arranged below the substrate 1, an anode chip layer 5 is arranged on the left of the substrate 1, a cathode chip layer 6 is arranged on the right of the substrate 1, the metal plate 4, the substrate 1 and the anode plate 2 are connected through the anode chip layer 5, and the metal plate 4, the substrate 1 and the cathode plate 3 are connected through the cathode chip layer 6; the substrate 1 is provided with a first small hole 11, the anode plate 2 is provided with a second small hole 21, and the first small hole 11 and the second small hole 21 form a metal reflection cavity 7.
In one embodiment, the substrate 1 is made of a solid transparent bi-color plastic material.
In one embodiment, the anode plate 2, the cathode plate 3, and the metal plate 4 are made of copper.
In one embodiment, the metal reflective cavity 7 is flared in shape.
In a specific embodiment, the anode patch layer 5 and the cathode patch layer 6 are both made of conductive metal.
For the convenience of understanding the above technical solutions of the present invention, the above technical solutions of the present invention are explained in detail through specific use modes below.
According to a SMD double-colored support with metal reflection chamber, positive pole SMD layer 5 is established on the left end portion of anode plate 2, base plate 1 and metal sheet 4, and negative pole SMD layer 6 is established at the right-hand member portion of negative plate 3, base plate 1 and metal sheet 4. When a circuit is required to be connected, the circuit can be directly welded on the anode surface mount layer 5 and the cathode surface mount layer 6, and the electric connection is convenient to realize. When specifically using, settle the LED chip in metal reflection chamber 7, the bottom surface of LED chip directly pastes on metal sheet 4, make the produced heat direct transfer of LED chip to metal sheet 4 on, because thermal transfer path is short, can be timely with the heat effluvium, and, the radiating effect of copper metal sheet 4 is good, consequently, the thermal diffusivity of overall structure has been strengthened, simultaneously because the heat is not through base plate 1 transmission, make base plate 1 not fragile, thereby the life of support has been improved.
To sum up, the utility model discloses a design a SMD double-colored support with metal reflection chamber, when having strengthened the thermal diffusivity of base plate, also the cost is reduced.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A patch type double-color support with a metal reflection cavity comprises a substrate (1) and is characterized in that an anode plate (2) and a cathode plate (3) are arranged above the substrate (1), the anode plate (2) and the cathode plate (3) are located on the same horizontal plane, a metal plate (4) is arranged below the substrate (1), an anode patch layer (5) is arranged on the left side of the substrate (1), a cathode patch layer (6) is arranged on the right side of the substrate (1), the metal plate (4), the substrate (1) and the anode plate (2) are connected through the anode patch layer (5), and the metal plate (4), the substrate (1) and the cathode plate (3) are connected through the cathode patch layer (6); the metal reflection cavity is characterized in that a first small hole (11) is formed in the substrate (1), a second small hole (21) is formed in the anode plate (2), and the first small hole (11) and the second small hole (21) form a metal reflection cavity (7).
2. The patch type bicolor bracket with the metal reflection cavity as claimed in claim 1, wherein the substrate (1) is made of a solid transparent bicolor plastic material.
3. The patch type bicolor bracket with the metal reflecting cavity according to claim 1, wherein the anode plate (2), the cathode plate (3) and the metal plate (4) are all made of copper.
4. The patch type bicolor bracket with the metal reflecting cavity as claimed in claim 1, wherein the shape of the metal reflecting cavity (7) is trumpet-shaped.
5. The SMD bicolor bracket according to claim 1, wherein said anode SMD layer (5) and said cathode SMD layer (6) are made of conductive metal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202020987843.6U CN212934648U (en) | 2020-06-03 | 2020-06-03 | SMD double-colored support with metal reflection cavity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202020987843.6U CN212934648U (en) | 2020-06-03 | 2020-06-03 | SMD double-colored support with metal reflection cavity |
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CN212934648U true CN212934648U (en) | 2021-04-09 |
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CN202020987843.6U Active CN212934648U (en) | 2020-06-03 | 2020-06-03 | SMD double-colored support with metal reflection cavity |
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2020
- 2020-06-03 CN CN202020987843.6U patent/CN212934648U/en active Active
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