CN211083705U

CN211083705U - Prevent L ED lamp strip of short circuit

Info

Publication number: CN211083705U
Application number: CN201921666651.9U
Authority: CN
Inventors: 唐勇
Original assignee: YLin Electronics Co ltd
Current assignee: YLin Electronics Co ltd; Yonglin Electronics Co Ltd
Priority date: 2019-10-08
Filing date: 2019-10-08
Publication date: 2020-07-24
Anticipated expiration: 2029-10-08

Abstract

The utility model discloses a prevent short circuit's L ED lamp strip this prevent short circuit's L ED lamp strip includes the PCB board to and L ED lamp pearl, L ED lamp pearl sets up on the PCB board, with PCB board electricity connection, L ED lamp pearl includes the support, be equipped with a bowl form mounting groove on the support up end, the relative both sides punishment that sets up of support lower extreme face do not is equipped with a tin cream overflow launder, positive pole/negative pole pin one end sets up in bowl form mounting groove, the other end sets up on tin cream overflow launder lateral wall, luminescent chip sets up in bowl form mounting groove, luminescent chip's input and output are connected with positive pole pin and negative pole pin electricity respectively through the wire rod, and fluorescent glue, fluorescent glue sets up in bowl form mounting groove, with luminescent chip encapsulation.

Description

Prevent L ED lamp strip of short circuit

Technical Field

The utility model relates to an L ED field especially relates to a prevent L ED lamp strip of short circuit.

Background

L ED is English (light emitting diode), L ED lamp bead is the abbreviation L ED for light emitting diode, which is a popular name.

The working principle is as follows: the terminal voltage of the PN junction forms a certain potential barrier, when a forward bias voltage is applied, the potential barrier is lowered, and most carriers in the P region and the N region diffuse to each other. Since electron mobility is much greater than hole mobility, a large number of electrons will diffuse into the P region, constituting an injection of minority carriers into the P region. These electrons recombine with holes in the valence band and the energy obtained upon recombination is released as light energy. This is the principle of PN junction luminescence.

L ED lamp pearl on the market now, its L ED support heat-sinking capability is weak, and it all adopts non-benign heat conduction material to make generally, simultaneously, even there is corresponding heat conduction post, its area of contact with the external world is little, and the heat dissipation is unsatisfactory.

Moreover, when L ED lamp beads are installed on a PCB board, since L ED lamp beads are small, solder paste at two tin points is easy to contact in the process of glue overflow, and therefore the problem of short circuit is caused.

Therefore, there is a need in the market for an L ED light bar that is short-proof and that solves one or more of the above problems.

SUMMERY OF THE UTILITY MODEL

For solving one or more problems that exist among the prior art, the utility model provides a prevent L ED lamp strip of short circuit.

The utility model discloses a prevent L ED lamp strip of short circuit, its characterized in that, L ED lamp strip includes:

a PCB board; and

l ED lamp beads, wherein the L ED lamp beads are arranged on the PCB and are electrically connected with the PCB;

l ED lamp pearl includes:

the tin paste overflow groove is formed in the two opposite side edges of the lower end face of the bracket;

one end of the positive electrode/negative electrode pin is arranged in the bowl-shaped mounting groove, and the other end of the positive electrode/negative electrode pin is arranged on the side wall of the solder paste overflow groove;

the light-emitting chip is arranged in the bowl-shaped mounting groove, and the input end and the output end of the light-emitting chip are electrically connected with the anode pin and the cathode pin through wires respectively; and

fluorescent glue, the fluorescent glue sets up in the bowl form mounting groove, with luminous chip package.

In some embodiments, at least one limiting groove for avoiding short circuit of solder paste at the pin of the positive electrode/negative electrode is further disposed on the side wall of the solder paste overflow groove.

In some embodiments, the stent comprises:

the solder paste overflow groove is arranged at two opposite side edges of the lower end surface of the high-heat-conductivity ceramic base, and the limiting groove is arranged at the side edge of the solder paste overflow groove; and

the reflection cup, the reflection cup sets up on the high heat conduction ceramic base, with high heat conduction ceramic base is connected, bowl form mounting groove sets up on the reflection cup up end.

In some embodiments, the ceramic base with high thermal conductivity is provided with a convection groove along the length or width direction of the ceramic base with high thermal conductivity.

In some embodiments, after the L ED lamp bead is mounted on the PCB, the distance between the highest point of the solder paste overflow groove and the PCB is less than the height of the solder paste on the PCB after being brushed.

The utility model has the advantages of the utility model discloses a PCB board, and L ED lamp pearl, L ED lamp pearl sets up on the PCB board, with PCB board electricity is connected, L ED lamp pearl includes the support, be equipped with a bowl form mounting groove on the support up end, the relative both sides punishment that sets up of terminal surface do not is equipped with a tin cream overflow launder under the support, positive pole/negative pole pin one end sets up in bowl form mounting groove, and the other end sets up on the tin cream overflow launder lateral wall, luminescent chip sets up in bowl form mounting groove, luminescent chip's input and output are connected with positive pole pin and negative pole pin electricity through the wire rod respectively, and fluorescent glue, fluorescent glue sets up in bowl form mounting groove, with luminescent chip encapsulation.

Drawings

Fig. 1 is a schematic structural view of an L ED light bar for short circuit prevention according to a preferred embodiment of the present invention;

fig. 2 is a top view of L ED lamp beads in an L ED light bar for short circuit prevention according to a preferred embodiment of the present invention;

fig. 3 is a left side view of L ED lamp beads in an L ED light bar for short circuit prevention according to a preferred embodiment of the present invention;

fig. 4 is a front view of L ED lamp beads in an L ED light bar for short circuit prevention according to a preferred embodiment of the present invention;

fig. 5 is a sectional view of the short-circuit-proof L ED lamp beads in the L ED lamp strip in the direction of a-a in fig. 2 according to the preferred embodiment of the present invention.

Detailed Description

In order to make the above objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

Referring to fig. 1-5, the utility model discloses a prevent L ED lamp strip of short circuit, a serial communication port, L ED lamp strip includes:

a PCB board 10; and

l ED lamp beads 20, wherein the L ED lamp beads 20 are arranged on the PCB 10 and are electrically connected with the PCB 10;

l ED lamp pearl 20 includes:

the solder paste overflow groove structure comprises a bracket 21, wherein a bowl-shaped mounting groove 211 is formed in the upper end surface of the bracket 21, and solder paste overflow grooves 212 are respectively formed in two opposite side edges of the lower end surface of the bracket 21;

the positive electrode/negative electrode pin 22, one end of the positive electrode/negative electrode pin 22 is arranged in the bowl-shaped mounting groove 211, and the other end is arranged on the side wall of the solder paste overflow groove 212;

the light-emitting chip 23 is arranged in the bowl-shaped mounting groove 211, and the input end and the output end of the light-emitting chip 23 are electrically connected with the anode pin and the cathode pin through wires respectively; and

and the fluorescent glue 24 is arranged in the bowl-shaped mounting groove 211, and encapsulates the light-emitting chip 23.

Specifically, in this embodiment, design tin cream overflow launder 212 on support 21 lower extreme face, when placing L ED lamp pearl 20 on the PCB board 10 of brushing the tin cream, L ED lamp pearl 20 presses the tin cream, and at this in-process, the tin cream will overflow the cream to the periphery, because the design of tin cream overflow launder 212 for the tin cream is most will overflow to this tin cream overflow launder 212, and this just can not cause the inside excessive cream of tin cream, causes the problem of short circuit.

This scheme has significantly reduced L ED lamp pearl 20 at the in-process of installation, the problem of short circuit appears.

In some embodiments, at least one limiting groove 2121 is disposed on a sidewall of the solder paste overflow groove 212 for avoiding a short circuit of solder paste at the positive/negative lead 22.

Specifically, in this embodiment, a limiting groove 2121 is further formed in the sidewall of the solder paste overflow groove 212, so that even if solder paste overflows inward during the mounting process, most of the solder paste enters the limiting groove 2121 due to the effect of the limiting groove 2121, and the short circuit problem is further avoided.

In some embodiments, the bracket 21 includes:

the solder paste overflow groove 212 is arranged at two opposite side edges of the lower end surface of the high thermal conductivity ceramic base 213, and the limiting groove 2121 is arranged at the side edge of the solder paste overflow groove 212; and

and the reflecting cup 214 is arranged on the high heat conduction ceramic base 213 and connected with the high heat conduction ceramic base 213, and the bowl-shaped mounting groove 211 is arranged on the upper end surface of the reflecting cup 214.

Specifically, the bracket 21 is designed to be the high thermal conductivity ceramic base 213 and the reflective cup 214, so that heat can be dissipated through the high thermal conductivity ceramic base 213, and meanwhile, the limiting groove 2121 can increase the contact area between the high thermal conductivity ceramic base 213 and the air, thereby accelerating heat dissipation.

The reflector cup 214 is generally made of PC material, and is molded on the high thermal conductivity ceramic base 213 and the anode/cathode pin 22 in an integrated molding mode, and the three are connected together, so that the structure is ingenious.

In some embodiments, the ceramic base 213 has a convection groove 215 along the length or width of the ceramic base 213.

Specifically, this scheme has still designed convection current groove 215, should be to the chute design in luminescent chip 23 below, can be comparatively quick take away the heat that luminescent chip 23 sent, has improved the life-span of whole lamp pearl greatly.

In some embodiments, after the L ED lamp bead 20 is mounted on the PCB 10, the distance between the highest point of the solder paste overflow trough 212 and the PCB 10 is less than the height of the solder paste on the PCB 10 after being brushed.

Specifically, the distance between the highest point of the solder paste overflow groove 212 and the PCB 10 is set, so that the problem of insufficient solder is avoided, and the qualification rate of the light bar is improved.

To sum up, the utility model discloses a PCB board 10, and L ED lamp pearl 20, L ED lamp pearl 20 sets up on PCB board 10, be connected with PCB board 10 electricity, L ED lamp pearl 20 includes support 21, be equipped with a bowl form mounting groove 211 on the support 21 up end, the relative both sides punishment that sets up of support 21 lower extreme face do not is equipped with a tin cream overflow launder 212, anodal/negative pole pin 22 one end sets up in bowl form mounting groove 211, the other end sets up on tin cream overflow launder 212 lateral wall, luminescent chip 23 sets up in bowl form mounting groove 211, the input and the output of luminescent chip 23 are connected with anodal pin and negative pole pin electricity respectively through the wire rod, and fluorescent glue 24, fluorescent glue 24 sets up in bowl form mounting groove 211, encapsulate luminescent chip 23.

The above-mentioned embodiments only express two embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. An L ED light bar that is short-circuited, wherein the L ED light bar comprises:

a PCB board; and

l ED lamp pearl includes:

2. The short-circuit-proof L ED light bar of claim 1, wherein the solder paste overflow trough has at least one limiting groove on its side wall for avoiding solder paste short circuit at the positive/negative pin.

3. The short circuit resistant L ED light bar of claim 2, wherein the bracket comprises:

4. The short-circuit proof L ED light bar of claim 3, wherein the ceramic base with high thermal conductivity is provided with a convection groove along the length or width of the ceramic base with high thermal conductivity.

5. The short-circuit-proof L ED light bar of claim 1, wherein the distance between the highest point of the solder paste overflow trough and the PCB is less than the height of the solder paste on the PCB after the solder paste overflow trough is brushed after the L ED light bulb is mounted on the PCB.