CN211295130U - LED lamp bead packaging structure - Google Patents
LED lamp bead packaging structure Download PDFInfo
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- CN211295130U CN211295130U CN201921667288.2U CN201921667288U CN211295130U CN 211295130 U CN211295130 U CN 211295130U CN 201921667288 U CN201921667288 U CN 201921667288U CN 211295130 U CN211295130 U CN 211295130U
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Abstract
The utility model discloses a LED lamp pearl packaging structure. The LED lamp bead packaging structure comprises an LED radiating support; the light-emitting chip is arranged on the LED heat dissipation bracket and is electrically connected with the LED heat dissipation bracket; the fluorescent glue is encapsulated in the LED radiating bracket, and the light-emitting chip is encapsulated; LED heat dissipation support includes: the high-heat-conductivity ceramic base is provided with a plurality of radiating fins on at least one side edge; the positive and negative pins are arranged on the high-heat-conductivity ceramic base and matched with the high-heat-conductivity ceramic base; and the reflecting cup is integrally formed on the high-heat-conductivity ceramic base and the positive and negative pins, and the high-heat-conductivity ceramic base is fixedly connected with the positive and negative pins through the reflecting cup. The utility model discloses not only dispel the heat through whole high heat conduction ceramic base, simultaneously, design heat radiation fins on it, further improved whole heat dissipation, increase luminescent chip's life.
Description
Technical Field
The utility model relates to a LED field especially relates to a LED lamp pearl packaging structure.
Background
The English language of the LED is (light emitting diode), and the LED lamp bead is the English abbreviation of the LED which is called LED for short, which is a popular name.
The working principle is as follows: the terminal voltage of the PN junction forms a certain potential barrier, when a forward bias voltage is applied, the potential barrier is lowered, and most carriers in the P region and the N region diffuse to each other. Since electron mobility is much greater than hole mobility, a large number of electrons will diffuse into the P region, constituting an injection of minority carriers into the P region. These electrons recombine with holes in the valence band and the energy obtained upon recombination is released as light energy. This is the principle of PN junction luminescence.
LED lamp pearl on the present market, its LED support heat-sinking capability is weak, and it is generally all to adopt non-benign heat conduction material to make, simultaneously, even there is corresponding heat conduction post, but its area of contact with the external world is little, and the heat dissipation is unsatisfactory.
Therefore, there is a need in the market for an LED lamp bead packaging structure capable of solving one or more of the above problems.
SUMMERY OF THE UTILITY MODEL
For solving one or more problems that exist among the prior art, the utility model provides a LED lamp pearl packaging structure.
The utility model discloses a reach the technical scheme that above-mentioned purpose adopted and be: the utility model provides a LED lamp pearl packaging structure, packaging structure includes:
an LED heat dissipation bracket;
the light-emitting chip is arranged on the LED heat dissipation bracket and is electrically connected with the LED heat dissipation bracket; and
the fluorescent glue is encapsulated in the LED heat dissipation bracket, and the light-emitting chip is encapsulated;
the LED heat dissipation support includes:
the high-thermal-conductivity ceramic base is provided with a plurality of radiating fins on at least one side edge;
the positive and negative pins are arranged on the high-heat-conductivity ceramic base and matched with the high-heat-conductivity ceramic base; and
the reflecting cup is integrally formed on the high-heat-conductivity ceramic base and the positive and negative pins, and the high-heat-conductivity ceramic base is fixedly connected with the positive and negative pins through the reflecting cup.
In some embodiments, a light emitting chip mounting seat protruding from the upper surface of the high thermal conductivity ceramic base is disposed on the high thermal conductivity ceramic base, and a laterally conducted convection channel is disposed in the light emitting chip mounting seat.
In some embodiments, the cross-sectional thickness of the positive and negative leads is equal to the thickness of the light emitting chip mounting seat.
In some embodiments, the positive and negative leads are respectively attached to two side edges of the light emitting chip mounting seat.
In some embodiments, mounting grooves for mounting the positive and negative pins are formed on two side edges of the high thermal conductivity ceramic base.
In some embodiments, the inner surface of the reflector cup is provided with a high reflectivity coating.
In some embodiments, the high reflectivity coating is an ABS aluminum plated film or a specular aluminum plate.
In some embodiments, the reflector cup comprises:
the bowl-shaped reflector is arranged above the positive and negative electrode pins and matched with the positive and negative electrode pins; and
and the connecting plate and the bowl-shaped reflector are integrally formed, and the connecting plate is respectively connected with the positive and negative electrode pins and the high-heat-conductivity ceramic base.
In some embodiments, the sum of the thickness of the connecting plate and the thickness of the cross section of the positive and negative pins is equal to the depth of the mounting groove.
In some embodiments, a second convection channel is formed between the positive and negative pins and the bottom surface of the ceramic base and the PCB.
The utility model has the advantages that: the utility model comprises a LED radiating bracket; the light-emitting chip is arranged on the LED heat dissipation bracket and is electrically connected with the LED heat dissipation bracket; the fluorescent glue is encapsulated in the LED heat dissipation bracket, and the light-emitting chip is encapsulated; the LED heat dissipation support includes: the high-thermal-conductivity ceramic base is provided with a plurality of radiating fins on at least one side edge; the positive and negative pins are arranged on the high-heat-conductivity ceramic base and matched with the high-heat-conductivity ceramic base; and the reflecting cup is integrally formed on the high-heat-conductivity ceramic base and the positive and negative pins, and the high-heat-conductivity ceramic base is fixedly connected with the positive and negative pins through the reflecting cup. The utility model discloses not only dispel the heat through whole high heat conduction ceramic base, simultaneously, design heat radiation fins on it, further improved whole heat dissipation, increase luminescent chip's life.
Drawings
Fig. 1 is a schematic structural diagram of an LED lamp bead packaging structure according to a preferred embodiment of the present invention;
fig. 2 is a schematic structural view of an LED heat dissipation bracket in an LED lamp bead packaging structure according to a preferred embodiment of the present invention;
fig. 3 is a sectional view along the direction a-a in the structure diagram 1 of the LED lamp bead package according to the preferred embodiment of the present invention;
fig. 4 is a schematic structural view of an LED heat dissipation bracket in an LED lamp bead packaging structure according to a preferred embodiment of the present invention;
fig. 5 is the utility model discloses preferred embodiment a LED lamp pearl packaging structure and PCB board's equipment state schematic diagram.
Detailed Description
In order to make the above objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
Referring to fig. 1-5, the utility model discloses a LED lamp pearl packaging structure, packaging structure includes:
an LED heat dissipation bracket 10;
the light emitting chip (not shown) is arranged on the LED heat dissipation bracket 10 and electrically connected with the LED heat dissipation bracket 10; and
the fluorescent glue 30 is encapsulated in the LED heat dissipation bracket 10, and encapsulates the light emitting chip (not shown in the figure);
the LED heat dissipation bracket 10 includes:
the high-thermal-conductivity ceramic base 11 is provided with a plurality of radiating fins 111 on at least one side edge of the high-thermal-conductivity ceramic base 11;
the positive and negative pins 12 are arranged on the high-thermal-conductivity ceramic base 11, and the positive and negative pins 12 are matched with the high-thermal-conductivity ceramic base 11; and
and the reflecting cup 13 is integrally formed on the high-thermal-conductivity ceramic base 11 and the positive and negative pins 12, and the high-thermal-conductivity ceramic base 11 is fixedly connected with the positive and negative pins 12 through the reflecting cup 13.
Specifically, the embodiment adopts a high heat dissipation LED support, and the LED support is designed into three parts, namely, a high thermal conductivity ceramic base 11, positive and negative electrode pins 12, and a reflective cup 13.
In the installation process, the light emitting chip (not shown) is attached to the high thermal conductivity ceramic base 11 by using the thermal conductive silicone grease, and meanwhile, the positive and negative electrodes of the light emitting chip (not shown) are connected to the positive and negative electrode pins 12 by gold wires, when the light emitting chip (not shown) generates heat, the heat is directly transferred to the high thermal conductivity ceramic base 11 by the thermal conductive silicone grease, and the heat is dissipated by the heat dissipating fins 111 on the high thermal conductivity ceramic base 11.
After the light-emitting chip (not shown) is mounted, the positive and negative pins 12 are mounted on the high thermal conductivity ceramic base 11, then the reflection cup 13 is integrally formed on the high thermal conductivity ceramic base 11 and the positive and negative pins 12, the three pins are adhered together, and finally the fluorescent glue 30 is encapsulated in the reflection cup 13, so that the whole lamp bead is mounted.
The structure not only dissipates heat through the whole high heat-conducting ceramic base 11, but also designs the heat dissipating fins 111 on the ceramic base, thereby further improving the overall heat dissipation and prolonging the service life of the light emitting chip (not shown in the figure).
In some embodiments, the high thermal conductivity ceramic base 11 is provided with a light emitting chip mounting base 112 protruding from the upper surface of the high thermal conductivity ceramic base 11, and a laterally conducted convection channel 113 is provided in the light emitting chip mounting base 112.
Specifically, in order to further increase the heat dissipation, the light emitting chip mounting base 112 is further designed on the upper surface of the high thermal conductivity ceramic base 11 according to the present scheme, the convection channel 113 is designed in the mounting base, and when the heat generated by the light emitting chip (not marked in the figure) is transferred to the high thermal conductivity ceramic base 11, the heat on the high thermal conductivity ceramic base 11 can be quickly taken away through the convection channel 113, so that the whole heat dissipation is facilitated.
In some embodiments, the cross-sectional thickness of the positive and negative leads 12 is equal to the thickness of the light emitting chip mounting base 112.
In some embodiments, the positive and negative leads 12 are respectively attached to two sides of the light emitting chip mounting base 112.
In some embodiments, the high thermal conductivity ceramic base 11 has mounting grooves 114 on two sides for mounting the positive and negative leads 12.
In some embodiments, the inner surface of the reflector cup 13 is provided with a high reflectivity coating.
In some embodiments, the high reflectivity coating is an ABS aluminum plated film or a specular aluminum plate.
In particular, the high-emissivity coating is designed on the inner surface of the emitting quilt, and the coating greatly improves the light efficiency.
In some embodiments, the reflector cup 13 comprises:
the bowl-shaped reflector 131 is arranged above the positive and negative pins 12, and the bowl-shaped reflector 131 is matched with the positive and negative pins 12; and
and a connecting plate 132, wherein the connecting plate 132 and the bowl-shaped reflector 131 are integrally formed, and the connecting plate 132 is respectively connected with the positive and negative electrode pins 12 and the high thermal conductivity ceramic base 11.
Specifically, one side of the connecting plate 132 in this embodiment is connected to the positive and negative pins 12, and the two sides are connected to the sides of the mounting groove 114, so that the high thermal conductivity ceramic base 11, the positive and negative pins 12, and the reflector cup 13 are firmly connected together, thereby achieving the mounting and fixing of the three.
In some embodiments, the sum of the thickness of the connecting plate 132 and the cross-sectional thickness of the positive and negative leads 12 is equal to the depth of the mounting groove 114.
In some embodiments, a second convection channel 115 is formed between the positive and negative leads 12 and the bottom surface of the ceramic base 11 and the PCB.
Specifically, after the lamp is welded to the PCB 20, the positive and negative pins 12 have a certain thickness, so that a gap is formed between the installed lamp bead and the PCB 20, the gap is the second convection channel 115, and heat on the ceramic base 11 with high thermal conductivity can be quickly taken away through the channel, thereby facilitating heat dissipation.
To sum up, the utility model comprises an LED radiating bracket 10; the light emitting chip (not shown) is arranged on the LED heat dissipation bracket 10 and electrically connected with the LED heat dissipation bracket 10; the fluorescent glue 30 is encapsulated in the LED heat dissipation bracket 10, and encapsulates the light emitting chip (not shown in the figure); the LED heat dissipation bracket 10 includes: the high-thermal-conductivity ceramic base 11 is provided with a plurality of radiating fins 111 on at least one side edge of the high-thermal-conductivity ceramic base 11; the positive and negative pins 12 are arranged on the high-thermal-conductivity ceramic base 11, and the positive and negative pins 12 are matched with the high-thermal-conductivity ceramic base 11; and the reflecting cup 13 is integrally formed on the high-thermal-conductivity ceramic base 11 and the positive and negative pins 12, and the high-thermal-conductivity ceramic base 11 is fixedly connected with the positive and negative pins 12 through the reflecting cup 13. The utility model discloses not only dispel the heat through whole high heat conduction ceramic base 11, simultaneously, design heat radiation fins 111 on it, further improved whole heat dissipation, increase the life of luminous chip (not marked in the picture).
The above-mentioned embodiments only express two embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides a LED lamp pearl packaging structure which characterized in that, packaging structure includes:
an LED heat dissipation bracket;
the light-emitting chip is arranged on the LED heat dissipation bracket and is electrically connected with the LED heat dissipation bracket; and
the fluorescent glue is encapsulated in the LED heat dissipation bracket, and the light-emitting chip is encapsulated;
the LED heat dissipation support includes:
the high-thermal-conductivity ceramic base is provided with a plurality of radiating fins on at least one side edge;
the positive and negative pins are arranged on the high-heat-conductivity ceramic base and matched with the high-heat-conductivity ceramic base; and
the reflecting cup is integrally formed on the high-heat-conductivity ceramic base and the positive and negative pins, and the high-heat-conductivity ceramic base is fixedly connected with the positive and negative pins through the reflecting cup.
2. The LED lamp bead packaging structure of claim 1, wherein the high thermal conductivity ceramic base is provided with a light emitting chip mounting base protruding from the upper surface of the high thermal conductivity ceramic base, and a transversely conducting convection channel is provided in the light emitting chip mounting base.
3. The LED lamp bead packaging structure of claim 2, wherein the cross-sectional thickness of the positive and negative electrode pins is equal to the thickness of the light emitting chip mounting seat.
4. The LED lamp bead packaging structure of claim 2 or 3, wherein the positive and negative leads are respectively attached to two side edges of the light emitting chip mounting seat.
5. The LED lamp bead packaging structure of claim 1, wherein two side edges of the high thermal conductivity ceramic base are provided with mounting grooves for mounting the positive and negative pins.
6. The LED lamp bead packaging structure of claim 1, wherein the inner surface of the reflecting cup is provided with a high reflectivity coating.
7. The LED lamp bead packaging structure of claim 6, wherein the high-reflectivity coating is an ABS (acrylonitrile-butadiene-styrene) aluminum-plated film or a mirror aluminum plate.
8. The LED lamp bead packaging structure of claim 5, wherein the reflection cup comprises:
the bowl-shaped reflector is arranged above the positive and negative electrode pins and matched with the positive and negative electrode pins; and
and the connecting plate and the bowl-shaped reflector are integrally formed, and the connecting plate is respectively connected with the positive and negative electrode pins and the high-heat-conductivity ceramic base.
9. The LED lamp bead packaging structure of claim 8, wherein the sum of the thickness of the connecting plate and the thickness of the cross sections of the positive and negative electrode pins is equal to the depth of the mounting groove.
10. The LED lamp bead packaging structure of claim 1, wherein a second convection channel is formed between the positive and negative electrode pins, the bottom surface of the high thermal conductivity ceramic base and the PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921667288.2U CN211295130U (en) | 2019-10-08 | 2019-10-08 | LED lamp bead packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921667288.2U CN211295130U (en) | 2019-10-08 | 2019-10-08 | LED lamp bead packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211295130U true CN211295130U (en) | 2020-08-18 |
Family
ID=72018342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921667288.2U Active CN211295130U (en) | 2019-10-08 | 2019-10-08 | LED lamp bead packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211295130U (en) |
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2019
- 2019-10-08 CN CN201921667288.2U patent/CN211295130U/en active Active
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Address after: No.6, Jinhe Xinguang Road, Zhangmutou town, Dongguan City, Guangdong Province 523000 Patentee after: Yonglin Electronics Co., Ltd Address before: 523000 No. three Xinguang Road, Jinhe Industrial Zone, Zhangmutou town, Guangdong, Dongguan, 3 Patentee before: Y.LIN ELECTRONICS Co.,Ltd. |