JP2013101951A - Light source unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source unit that can enhance heat radiation effect.SOLUTION: The light source unit includes a heat radiation body including a substrate 2 having a base plate 2a of a heat conductive layer on a rear face side opposite to a front face side where a plurality of LED chips 6 are mounted, a heat radiation member 4 arranged on a rear face side of the substrate 2, which is connected thermally to the base plate 2a, and a decorative cover 3 which covers the side face of the substrate 2 and is arranged to be connected thermally to the heat radiation member 4 to be projected to the outside.

Description

  The present invention relates to a light source unit and a lighting device using light emitting elements such as LEDs.

  A light emitting element such as an LED affects the life as well as a decrease in light output and fluctuation of characteristics as its temperature rises. For this reason, in a light source unit using a solid light emitting element such as an LED or an EL element as a light source, it is necessary to suppress an increase in temperature of the light emitting element in order to improve various characteristics of life and efficiency. Conventionally, in this kind of lighting device, a plurality of LEDs are gathered and arranged on a base, and a large number of through holes are formed in the base so that each LED can sufficiently dissipate heat to suppress a temperature rise. The thing is proposed (refer patent document 1).

JP 2004-95655 A

  However, although Patent Document 1 discloses a configuration that dissipates heat of an LED and suppresses temperature rise, in order to actually commercialize this form as a light source unit or a lighting device, its heat dissipation structure, appearance In addition, it is not satisfactory in function and the like.

  The present invention has been made in view of the above circumstances, improves the heat dissipation effect, can be independently configured as a light source unit, and can be diversified by arranging a plurality of light source units in a desired manner. An object is to provide a light source unit and an illumination device.

  In the present invention and the following inventions, definitions and technical meanings of terms are as follows unless otherwise specified. The light emitting element is an LED, an organic EL, an inorganic EL, or the like. The light emitting element is preferably disposed by a chip-on-board method or a surface mounting method. However, due to the nature of the present invention, the disposition method is not particularly limited. For example, a bullet-type LED is used. May be disposed on the substrate. Further, there is no particular limitation on the number of light emitting elements. The circuit pattern region means an electrically conductive region in which light emitting elements are disposed and wiring is provided.

  As the substrate, a metal substrate or ceramic substrate having so-called thermal conductivity, or a substrate in which a copper foil or the like is sandwiched between glass epoxy substrates can be applied. Surrounding the board includes, for example, covering the side of the board so that it is difficult to see from the outside without exposing the surrounding area of the light source unit in use. The aim is to improve the appearance design. Being in surface contact with the substrate and thermally coupled allows not only direct contact of the decorative cover to the substrate but also indirect contact. For example, a member having good thermal conductivity or an adhesive may be interposed between the substrate and the decorative cover.

  According to the first aspect of the present invention, since the heat conduction layer on the back surface side of the substrate and the radiator are thermally connected, heat dissipation as a light source unit is improved, and a single light source unit is heated. It is possible to suppress the occurrence of defects.

It is a perspective view which shows the light source unit which concerns on the 1st Embodiment of this invention. It is the same top view. FIG. It is a perspective view which shows the illuminating device which concerns on embodiment of this invention. It is a perspective view similarly. It is sectional drawing which shows the light source unit which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows the light source unit which concerns on the 3rd Embodiment. It is sectional drawing which shows the light source unit which concerns on the 4th Embodiment. It is a side view which shows the light source unit which concerns on the 5th Embodiment. It is a side view which similarly shows the light source unit which concerns on 5th Embodiment. It is a side view which shows the light source unit which concerns on the 6th Embodiment. It is a side view which similarly shows the light source unit which concerns on 6th Embodiment. It is sectional drawing which shows the light source unit which concerns on the 7th Embodiment. It is sectional drawing which similarly enlarges and shows a part of light source unit which concerns on 7th Embodiment (Example 1). It is sectional drawing which similarly enlarges and shows a part of light source unit which concerns on 7th Embodiment (Example 2). It is sectional drawing which expands and shows a part of light source unit which concerns on the 8th Embodiment.

The light source unit according to the first embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a perspective view showing a light source unit, FIG. 2 is a plan view thereof, FIG. 3A is a sectional view thereof, and FIG. 1B is a sectional view showing a substrate taken out. 1 and 2, the light source unit 1 has a substantially rectangular parallelepiped shape having a length and width of about 70 mm and a height of about 25 mm, and a decorative cover 3 and a substrate 2 on which light emitting elements serving as light sources are disposed. The heat radiating member 4 and the reflector 5 are provided.

  On the substrate 2, LED chips 6... Are mounted as light emitting elements by a chip-on-board method. That is, the LED chips 6... Are arranged on the surface of the substrate 2 in a matrix at predetermined intervals, and the coating material is applied to the surface. In addition, what is necessary is just to determine suitably the arrangement | positioning number of LED chip 6 ... according to product specification and design.

  As shown in FIG. 3, the substrate 2 includes a base plate 2a, an electrical insulating layer 2b, and a circuit pattern layer. The base plate 2a which is a heat conductive layer is made of a metal, for example, a substantially square flat plate made of aluminum having good heat conductivity and excellent heat dissipation. On one surface of the base plate 2a, an electrically insulating layer 2b made of a synthetic resin made of an epoxy resin or the like is formed. A circuit pattern layer is formed on the electrical insulating layer 2b. The circuit pattern layer is formed of a conductive material such as copper foil in order to supply power from the power source to the LED chips 6. The base plate 2a of the substrate 2 can be made of a metal or an insulating material. When an insulating material is used, a ceramic material or a synthetic resin material having relatively good heat dissipation characteristics and excellent durability can be applied. When a synthetic resin material is used, it can be formed of, for example, a glass epoxy resin.

  Further, a lighting circuit is disposed on the front surface side of the substrate 2 where the LED chips 6... Are mounted, and on the peripheral side of the substrate 2, and the lighting circuit component 7 is mounted. The lighting circuit component 7 is a component such as a capacitor, a resistance element, or a switching element, and controls the lighting of the LED chips 6.

  The decorative cover 3 forming the side metal part constitutes the appearance of the light source unit 1, is made of aluminum, is a substantially rectangular parallelepiped, and has a short cylindrical shape. Radiation fins 3a are integrally formed on the entire outer peripheral surface of the decorative cover 3 in order to increase the heat radiation area. The heat radiating fins 3a are formed in the horizontal direction, that is, in the horizontal direction, and accordingly, grooves are formed in the direction. Further, the outer peripheral surface of the decorative cover 3 is baked and painted with a white melamine resin-based paint. Further, on the inner peripheral surface of the decorative cover 3, there is a contact portion 3b that is in surface contact with at least the surface side of the substrate 2, that is, the surface side of the base plate 2a of the substrate 2 and is in surface contact with the peripheral edge portion. Is formed. Further, a flange 3c is formed on the opening end side of the decorative cover 3 toward the inner circumferential direction.

  The heat dissipating member 4 forming the flat metal portion is made of aluminum and is formed in a substantially square flat plate shape. The heat radiating member 4 is configured to be in surface contact with the back surface side of the substrate 2, that is, the back surface side of the base plate 2 a of the substrate 2. The surface contact may be partial contact instead of full contact.

  The reflector 5 is made of aluminum, has a substantially rectangular parallelepiped shape, has a cylindrical shape, and the heat dissipating fins 5a... It is formed in a horizontal direction so as to be continuous, and a groove is formed in the direction. On the other hand, the inner peripheral surface of the reflector 5 forms an inclined reflecting surface 5c that expands in the direction of the irradiation opening 5b, and the inclination angle is adjusted to obtain desired light distribution characteristics and prevent glare. Has been. Further, the inner and outer peripheral surfaces of the reflector 5 are baked and painted with a white melamine resin-based paint. In addition, the material of the said decorative cover 3, the heat radiating member 4, and the reflector 5 is not restricted to aluminum, A metal material or a resin material etc. with favorable heat conductivity can be used.

  Next, an assembled state of the substrate 2, the decorative cover 3, the heat radiating member 4, and the reflector 5 will be described with reference to FIG. On the upper surface of the heat radiating member 4, the back surface side of the base plate 2 a of the substrate 2 is in surface contact and is thermally coupled. Note that an adhesive may be interposed between the upper surface of the heat radiating member 4 and the back surface side of the base plate 2a so as to be coupled. In this case, it is preferable to use a material having good thermal conductivity obtained by mixing a metal oxide or the like with a silicone resin adhesive.

  The decorative cover 3 is arranged in such a manner that the contact portion 3b is in thermal contact with the surface side of the base plate 2a of the substrate 2 and is thermally coupled, and the stepped portion 3d is a side surface portion of the base plate 2a, the heat radiating member 4. It arrange | positions so that the peripheral part of may contact. Moreover, the lighting circuit component 7 mounted on the peripheral side of the substrate 2 is covered so as to be covered by the flange 3c. The reflector 5 is disposed in surface contact with the upper surface of the decorative cover 3, and the heat radiating member 4, the decorative cover 3, and the reflector 5 are screwed into the screw through holes formed therein from the back side of the heat radiating member 4. Are fastened and joined together by screws 8. In this state, the substrate 2 is sandwiched and fixed between the heat dissipation member 4 and the decorative cover 3. The decorative cover 3 covers the substrate 2 so as to make it difficult to see the periphery of the substrate 2 from the outside and to improve the appearance design of the light source unit 1.

  The operation of the light source unit 1 configured as described above will be described. When the light source unit 1 is energized, power is supplied to the substrate 2 and the lighting circuit operates to emit the LED chips 6. Most of the light emitted from the LED chips 6... Passes through the opening end side of the decorative cover 3 and is directly irradiated forward from the irradiation opening 5 b of the reflector 5, and a part of the light is reflected by the reflection plate 5. Reflected by the surface 5c and irradiated forward. Here, since the lighting circuit component 7 is covered by the flange 3c, when viewed from the front, the light emitting portion where the LED chips 6 ... are disposed and the light emission where the lighting circuit component 7 is disposed. There is no difference in brightness from the part that does not, and the visual design is good.

  On the other hand, the heat generated from the LED chips 6... Is mainly transmitted from the substantially entire back surface of the base plate 2 a of the substrate 2 to the heat radiating member 4. Further, the heat is conducted from the surface side of the base plate 2 a to the decorative cover 3 via the contact portion 3 b of the decorative cover 3 and is radiated. As described above, heat conduction is performed by surface contact from both the front and back surfaces of the substrate 2 to dissipate heat, so that a heat radiation effect can be improved and an increase in temperature of the substrate 2 can be suppressed. In other words, heat is radiated from both the front and back surfaces of the substrate 2, so that the heat radiating function can be satisfied and the heat radiation as the light source unit 1 can be completed. In addition, since the decorative cover 3 is in contact with the side surface portion of the base plate 2a and the peripheral edge portion of the heat dissipation member 4, heat conduction is also performed in this portion, and further, heat conduction from the decorative cover 3 to the reflector 5 is performed. Heat dissipation is promoted. Moreover, since the heat sink 3a, 5a ... which enlarges the surface area of the outer peripheral surface is formed in the decorative cover 3 and the reflector 5, heat dissipation is also efficiently performed here. Thus, each member is thermally coupled, and the temperature rise of the substrate 2 can be suppressed by the heat conduction path and heat dissipation. At the same time, heat generated from the lighting circuit is dissipated.

  As described above, according to the present embodiment, since heat is radiated from both the front and back surfaces of the substrate 2, the heat radiating function can be satisfied, and the light source unit 1 alone has high heat radiating properties. It is possible to suppress the occurrence of defects. Moreover, it becomes possible to complete the heat radiation as the light source unit 1 alone, and the light source unit 1 can be configured independently. Since the decorative cover 3 is in contact with the side surface portion of the substrate 2 and the peripheral edge portion of the heat dissipation member 4, heat dissipation is also promoted in this portion. Further, heat can be transferred from the decorative cover 3 to the reflector 5, and heat can be efficiently radiated by the heat radiating fins 3a, 5a,. Furthermore, since the lighting circuit component 7 is covered with the flange 3c of the decorative cover 3, the visual design is good.

  The reflector 5 may be formed of ABS resin or the like. In the present embodiment, the reflector 5 is described. However, the reflector 5 is essential for the light source unit 1 of the present invention. Instead, the reflector 5 may be provided as necessary. Furthermore, it is not essential to cover the lighting circuit component 7 mounted on the peripheral side of the substrate 2 with the flange 3c. In addition, the lighting circuit can be sealed in the electrical insulating layer 2 b of the substrate 2 or provided outside the light source unit 1. Furthermore, in the present embodiment, the configuration in which the contact portion 3b of the decorative cover 3 is in surface contact with the surface side of the base plate 2a of the substrate 2 has been described, but the contact portion 3b faces the electrical insulating layer 2b of the substrate 2. A configuration in which heat conduction is performed by contact and heat dissipation is allowed. In short, it is sufficient that the surface side of the substrate 2 is in surface contact and heat conduction and heat dissipation are performed.

  Next, an embodiment of the illumination device of the present invention will be described with reference to the perspective views of FIGS.

  (Example 1) In FIG. 4, this illuminating device shows what is called a base illuminating device 10 used by being attached to a ceiling surface. The base lighting device 10 includes a base 11 and a plurality of light source units 1 arranged on the base 11. The base 11 is made of aluminum and is formed in a substantially square flat plate shape having a side of about 250 mm. The light source unit 1 is arranged in a matrix on the surface of the base 11 in a total of 9 pieces of 3 × 3 in a predetermined distance (about 10 mm) from each other.

  (Embodiment 2) The illuminating device 10 shown in FIG. 5 is obtained by changing the number of light source units 1 and the arrangement method with respect to the embodiment 1. Five light source units 1 are arranged on the surface of the base 11 bent at a right angle with a predetermined interval (about 10 mm).

  The material of the base 11 is not limited to aluminum, and a metal material or a resin material having good thermal conductivity can be used. Further, when the lighting device 10 is configured, the light source units 1 may be arranged directly on the ceiling surface without using the base 11. In this case, an assembly of a plurality of light source units 1.

  According to the configuration of the lighting device as described above, each light source unit 1 is dissipated. On the other hand, since each light source unit 1 is arranged at a predetermined interval, this interval is communicated. A heat dissipating flow passage 12 is formed. Specifically, the intervals between the light source units 1 are in communication with each other to form the heat radiation flow passage 12. Therefore, not only the heat radiation of the individual light source units 1 but also the heat radiation flow passage 12 promotes the flow of the heat radiation air flow along the flow passage 12, and the heat radiation effect is further enhanced. Further, since the heat radiating fins 3a, 5a,... Are formed in the horizontal direction with respect to the surface of the base 11, the flow of the heat radiating airflow is also promoted by this configuration.

  As described above, according to the present embodiment, since the light source unit 1 alone has high heat dissipation, it is possible to suppress the failure of the single light source unit 1 due to heat, and complete the heat dissipation as the light source unit 1 alone. Since the light source unit 1 can be configured independently, the plurality of light source units 1 can be arbitrarily arranged on the base 11 or the ceiling surface as shown in the first and second embodiments. The light source unit 1 can be shared. Therefore, simplification of heat radiation design when designing different types of lighting devices can be expected. Furthermore, several types of bases 11 of different sizes can be prepared, and the number of light source units 1 can be changed corresponding to these bases 11 to have a configuration according to the application, so that various types and diversification can be achieved. Yes, the degree of freedom of combination is widened, and improvement in merchantability can be expected. Further, by both the configuration of the light source unit 1 and the configuration of the light source unit 1 on the base 11, the temperature rise of the substrate 2 on which the light emitting elements are disposed can be effectively suppressed. As a result, a large number of light source units 1 can be disposed on the base 11, which makes it easy to realize a high-power illumination device.

  Next, a light source unit according to a second embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view showing the light source unit. In the following embodiments, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and redundant description thereof is omitted. In the present embodiment, the reflector 5 is formed of a synthetic resin such as ABS resin, and no heat radiating fins are provided. The reflective surface 5c is chrome plated to increase the reflection efficiency. Accordingly, the heat of the substrate 2 is mainly transmitted from substantially the entire back surface of the base plate 2a of the substrate 2 to the heat radiating member 4, and further radiated from the surface side of the base plate 2a via the contact portion 3b of the decorative cover 3. Is done.

  As described above, according to the present embodiment, since heat can be radiated from both the front and back surfaces of the substrate 2, it is possible to complete the heat radiation as the light source unit 1 alone, and the same effects as in the first embodiment can be achieved. .

  Next, a light source unit according to a third embodiment of the present invention will be described with reference to FIG. FIG. 3A is a sectional view showing the light source unit, and FIG. 3B is a sectional view showing the substrate taken out. In the present embodiment, the reflector 5 is formed of a synthetic resin such as ABS resin, and the configuration of the substrate 2 is different from that of the first embodiment. The substrate 2 is composed of a base plate 2a, an electrical insulating layer 2b, and a circuit pattern layer, and a standing wall 2a-1 is formed on the periphery of the base plate 2a. Accordingly, the standing wall 2a-1 forms a recess 2a-2 in the base plate 2a, and an electrical insulating layer 2b is formed in the recess 2a-2. Such a substrate 2 can also be applied to the light source unit 1. In this case, the contact portion 3b of the decorative cover 3 comes into contact with the upper surface of the upright wall 2a-1, and heat conduction is performed.

As described above, according to the present embodiment, the same effects as those of the first embodiment can be obtained.

  Next, a light source unit according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a cross-sectional view showing the light source unit. In the present embodiment, FIG. 8A shows a light source unit 1 of a type that does not include the reflector 5. Even when the reflector 5 is not provided, the light source unit 1 can be established. Of course, this does not prevent the addition of the reflector 5 as appropriate. FIG. 8B shows a light source unit 1 of a type that does not include the flange 3 c of the decorative cover 3.

  Also according to the present embodiment, heat can be radiated from both the front and back surfaces of the substrate 2, so that the heat radiation as the light source unit 1 alone can be completed, and the same effects as those of the first embodiment can be achieved.

  A light source unit according to a fifth embodiment of the present invention will be described with reference to FIGS. 9 and 10 are side views showing the right half of the light source unit in section. In the present embodiment, as shown in FIG. 9, the decorative cover 3 and the reflector 5 are integrally formed of heat conductive aluminum or the like. In other words, the decorative cover 3-1 also serves as a reflector. Moreover, the outer peripheral part of the heat radiating member 4 is extended and the extension part 4e is comprised. This extending portion 4e can be used for mounting the light source unit 1 to the base 11 or the like. In the structure shown in FIG. 10, a reflector 5-1 along the inclined shape is attached to the reflector 5. The reflecting plate 5-1 is made of ABS resin, and the surface reflecting surface is chrome plated in order to increase the reflection efficiency.

As described above, according to the present embodiment, the same effects as those of the first embodiment can be obtained.

  Next, a light source unit according to a sixth embodiment of the present invention will be described with reference to FIGS. 11 and 12 are side views showing the right half of the light source unit in section. In this embodiment, the decorative cover 3 made of heat conductive aluminum or the like and the reflector 5 are configured separately, and the reflector 5 is attached to the reflector 5 along the inclined shape. It is. 11 is provided with the flange 3c on the decorative cover 3, whereas the one shown in FIG. 12 is not provided with the flange 3c on the decorative cover 3, and serves as a flange and the irradiation opening of the reflector 5. It is carried by the edge 5d opposite to the portion 5b.

  Also according to this embodiment, since heat can be radiated from both the front and back surfaces of the substrate 2, the same effects as those of the first embodiment can be obtained.

  Next, a light source unit according to a seventh embodiment of the present invention will be described with reference to FIGS. 13 to 15 while showing a detailed structure of the substrate. FIG. 13 is a cross-sectional view showing the light source unit, FIG. 14 is an enlarged cross-sectional view showing a part of the light source unit of Example 1, and FIG. 15 is an enlarged view of a part of the light source unit of Example 2. It is sectional drawing.

  This embodiment is basically the same configuration as the light source unit in the first embodiment. As shown in FIG. 13, a plurality of LED chips 6... Are mounted on the substrate 2 in a matrix form in a chip-on-board manner. The substrate 2 includes a base plate 2a serving as a heat conductive layer, an electrical insulating layer, and a circuit pattern layer. On the surface of the substrate 2, a resin frame 2d is fixed along the periphery thereof. Yes.

  A sealing member 2e, which is a coating material, is formed in a resin frame 2d in which a plurality of LED chips 6. The sealing member 2e is shielded from the outside air to protect the LED chip 6... And the like, and a thermosetting epoxy-based or silicone-based transparent or translucent translucent resin is used. It is done. And what knead | mixed fluorescent substance in these resin as needed is used. In the present embodiment, a phosphor that is excited by the blue light emission of the LED chips 6... And emits yellow light is used. In this case, the yellow light emission and the blue light emission are combined to emit white light. ing.

  A contact portion 3 b that is in surface contact with at least the surface side of the substrate 2 is formed on the inner peripheral surface of the decorative cover 3. The abutting portion 3b is electrically insulated and is in surface contact with the periphery of the circuit pattern region, in other words, the region where the LED chips 6. It has become.

  (Embodiment 1) As shown in FIG. 14, the base plate 2a as a heat conductive layer is made of an aluminum flat plate having good heat conductivity and excellent heat dissipation. The plate thickness dimension is about 1 mm. On one surface of the base plate 2a, an electric insulating layer 2b made of a synthetic resin made of epoxy resin or the like is formed with a thickness of about 80 μm. Further, a circuit pattern layer 2c constituting a circuit pattern region for wiring of the LED chips 6... Is formed on the electrical insulating layer 2b leaving the peripheral edge, that is, the periphery. The reason why the circuit pattern layer 2c is formed leaving the periphery is to make the contact portion 3b of the decorative cover 3 contact the substrate 2 while ensuring insulation with the circuit pattern region. The circuit pattern layer 2c is formed by plating Ni and Ag on a conductive material such as copper foil in order to supply power from the power source to the LED chips 6. Specifically, the thickness dimension of the copper foil or the like is about 35 μm, and Ni plating treatment with a thickness dimension of 3.0 to 5.0 μm is performed thereon. An Ag plating treatment of 3 to 0.7 μm is performed.

  The LED chips 6 are bonded on the circuit pattern layer 2c of the substrate 2 using a silicone resin adhesive. The LED chips 6 are, for example, InGaN-based elements, in which a light-emitting layer is stacked on a light-transmitting sapphire element substrate, and the light-emitting layer includes an n-type nitride semiconductor layer, an InGaN light-emitting layer, A p-type nitride semiconductor layer is sequentially stacked. And the electrode for sending an electric current through a light emitting layer was formed with the p-type electrode pad on the p-type nitride semiconductor layer, and the n-type electrode pad on the n-type nitride semiconductor layer. It consists of a negative electrode. These electrodes are electrically connected to the circuit pattern layer 2c by bonding wires 6a. The bonding wire 6a is made of a gold wire, and is connected via bumps mainly composed of Au in order to improve mounting strength and reduce damage to the LED chips 6.

  According to such a configuration, the contact portion 3 b of the decorative cover 3 is in contact with the periphery of the circuit pattern region on the surface side of the substrate 2. Specifically, it is thermally coupled to the periphery of the base plate 2a via the electric insulating layer 2b. Therefore, as in the above embodiments, the heat generated from the plurality of LED chips 6... Is mainly transmitted from the substantially entire back surface of the base plate 2a of the substrate 2 to the heat radiating member 4, and further, the heat is The LED chip 6... Is diffused from the central circuit pattern area where the LED chips 6... Are arranged to the outer peripheral area and conducted to the surroundings, and is conducted to the decorative cover 3 via the contact part 3 b of the decorative cover 3. Heat is dissipated. Thus, since heat is radiated from both the front and back surfaces of the substrate 2, the heat radiation effect as the light source unit 1 can be improved. In this case, the contact portion 3b of the decorative cover 3 is in contact with the periphery of the substrate 2, so that it is easy to ensure electrical insulation from the circuit pattern region.

  As described above, according to this example, the same effects as those of the first embodiment can be obtained, and the heat dissipation effect can be enhanced while ensuring electrical insulation with the circuit pattern region.

  (Embodiment 2) As shown in FIG. 15, in this embodiment, an electrical insulating layer 2b and a circuit pattern layer 2c constituting a circuit pattern region are formed on one surface of a base plate 2a of a substrate 2 so as to leave the periphery. It is. Therefore, the periphery of the base plate 2a is exposed on the surface side, and the contact portion 3b of the decorative cover 3 is directly thermally coupled to the periphery of the base plate 2a.

  As described above, this embodiment can achieve the same effects as those of the first embodiment. Moreover, since the contact part 3 of the decorative cover 3 is directly thermally coupled to the base plate 2a, heat conduction is performed efficiently. In addition, it does not prevent that an adhesive agent intervenes between the contact part 3 and the base board 2a.

  Next, a light source unit according to an eighth embodiment of the present invention will be described with reference to FIG. FIG. 16 is an enlarged cross-sectional view of a part of the light source unit, as in the seventh embodiment. This embodiment is different from the seventh embodiment in the configuration of the substrate 2. Schematically, a glass epoxy substrate is sandwiched between a copper foil or the like having good thermal conductivity to ensure thermal conductivity. As shown in the figure, an electrical insulating layer 2b made of glass epoxy resin is formed on the front surface side and the back surface side of the substrate 2, and a circuit pattern layer 2c is formed on the electrical insulating layer 2b on the front surface side. LED chips 6 are arranged on the top. A heat conductive layer 2f such as a copper foil is interposed between the electrical insulating layers 2b.

  As described above, according to the present embodiment, the heat generated from the plurality of LED chips 6... Mainly passes through the heat conductive layer 2 f from the central circuit pattern region where the LED chips 6. Conducted, diffused to the outer peripheral region and conducted to the surroundings, conducted to the decorative cover 3 via the contact portion 3b of the decorative cover 3, and radiated. Therefore, the same effects as those of the first embodiment can be obtained, and the heat dissipation effect can be enhanced while ensuring electrical insulation from the circuit pattern region.

  As in Example 2 of the seventh embodiment, the periphery of the heat conductive layer 2f such as copper foil is exposed to the surface side, and the contact portion 3b of the decorative cover 3 and the periphery of the heat conductive layer 2f are formed. Direct thermal coupling may be used.

  The present invention is not limited to the configuration of the embodiment described above, and various modifications can be made without departing from the spirit of the invention. In the present invention, a thermally conductive decorative cover is thermally coupled to the surface side of a substrate having thermal conductivity, and it is preferable to provide a heat dissipation member on the back side of the substrate, but the heat dissipation member is necessarily required. is not. Further, a ceramic substrate or the like may be applied as the substrate in order to ensure thermal conductivity. Furthermore, you may make it provide a translucent cover, such as milky white, in the irradiation opening part of a light source unit. Furthermore, the heat radiating fins may be formed horizontally, vertically or obliquely with respect to the base surface, may be formed stepwise, and are not limited to the forming direction and shape.

DESCRIPTION OF SYMBOLS 1 ... Light source unit, 2 ... Board | substrate, 3 ... Cosmetic cover, 4 ... Heat dissipation member, 6 ... Light emitting element (LED chip), 10 ... Illuminating device, 12 ... Heat dissipation Flow passage

Claims (2)

A substrate having a plurality of light emitting elements mounted on the front side and a heat conductive layer on the back side opposite to the front side;
A flat metal part provided on the back side of the substrate that is thermally connected to the thermal conductive layer, and is thermally coupled to the flat metal part so as to cover the side surface of the substrate and to be exposed to the outside. A heat dissipating body having a side metal part provided;
A light source unit comprising:   The light source unit according to claim 1, wherein a groove is formed in a horizontal direction parallel to a front surface of the substrate on an outer surface of the side metal portion.

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