JP7050610B2 - Lighting equipment and lighting modules - Google Patents

Description

The present invention relates to a lighting device and a lighting module including a substrate on which a light emitting element is mounted.

Lighting devices equipped with a light emitting device using a semiconductor light emitting device (hereinafter, simply referred to as a light emitting device) such as an LED (Light Emitting Diode) as a light source have been widely used. In such a lighting device, in order to maintain the luminous efficiency of the light emitting element, it is necessary to dissipate the heat generated from the light emitting element to the outside at the time of light emission.

Japanese Unexamined Patent Publication No. 2016-130755 Japanese Unexamined Patent Publication No. 2017-182948

In recent years, in the above-mentioned lighting device, in order to improve the illuminance, the variety of lighting such as color tone and color temperature, and the increase in the lighting range, the number and arrangement density of the mounted light emitting devices have been improved, and one light emitting device emits light. There is a demand for increased light intensity. Therefore, the amount of heat generated from these light emitting devices tends to increase, and improvement of heat dissipation in the lighting device is required.

The lighting device of one aspect of the present invention has a first surface including a mounting portion of a light emitting element and a second surface opposite to the first surface, and the portion other than the mounting portion is described from the first surface to the above. Second
A substrate having a through hole penetrating the surface, a light emitting element located in the mounting portion, and a light emitting element.
A portion including a portion located along the inner side surface of the through hole, at least a part of which projects outward from the first surface of the substrate and a heat dissipation portion including heat radiation fins located on the outer periphery of the through hole. I have.

The lighting module of one aspect of the present invention includes a lighting device having the above configuration and a housing in which the lighting device is mounted.

According to the light emitting device of one aspect of the present invention, the heat generated at the time of light emission of the light emitting element is effectively dissipated from the substrate to the outside through the through hole and the heat radiating portion by conduction and convection. Therefore, it is possible to provide a lighting device that is advantageous in improving heat dissipation.

Further, according to the lighting device of one aspect of the present invention, since the light emitting device having the above configuration is provided, it is possible to provide a lighting device which is advantageous for improving heat dissipation.

It is a perspective view which looked at the lighting apparatus of embodiment of this invention from the 1st surface side of a substrate. FIG. 3 is a plan view of the lighting device shown in FIG. 1 as viewed from the first surface side of the substrate. FIG. 3 is a plan view of the lighting device shown in FIG. 1 as viewed from the second surface side of the substrate. (A) is a perspective view showing a part of the illuminating device of another embodiment of the present invention, and (b) is a case where the illuminating device shown in (a) is cut by a plane D surrounded by a virtual line. It is a sectional view. It is a perspective view which looked at the lighting apparatus of another embodiment of this invention from the 1st surface side of a substrate. It is a perspective view which shows by disassembling the lighting apparatus shown in FIG. It is a perspective view which shows the lighting module of embodiment of this invention.

The lighting device and the lighting module of the embodiment of the present invention will be described with reference to the accompanying drawings. The distinction between top and bottom in the following description is for convenience and does not specify the top and bottom when the luminaire and lighting module are actually used. In the following description, the first surface side of the substrate, which will be described later, is the upper side, and the second surface side is the lower side.

FIG. 1 is a perspective view of the lighting device according to the embodiment of the present invention as viewed from the first surface side (upper side) of the substrate. FIG. 2 is a plan view of the lighting device shown in FIG. 1 as viewed from above. FIG. 3 is a plan view (bottom view) of the light emitting device shown in FIG. 1 as viewed from below. In the following description, the first surface may be referred to as an upper surface, and the second surface may be referred to as a lower surface.

In the present embodiment, the lighting device 10 includes a substrate 1 having a first surface (upper surface) 1a including a mounting portion 2 for a light emitting element and a second surface (lower surface) 1b opposite to the upper surface 1a. The substrate 1 has a through hole 3 penetrating (in the vertical direction) from the first surface 1a to the second surface 1b in a portion other than the mounting portion 2. Further, the lighting device 10 includes a light emitting element 4 located in the mounting unit 2 and a heat radiating unit 5. The heat radiating portion 5 includes a portion located along the inner side surface of the through hole 3, and includes a radiating fin 6 having at least a part protruding outward (that is, from the upper surface to the upper side) from the first surface 1a of the substrate 1. I'm out.

For example, electric power is supplied to the light emitting element 4 via a wiring conductor (not shown) arranged on the substrate 1, and light is radiated from the light emitting element 4 to the outside by photoelectric conversion. The heat generated by the operation of the light emitting element 4 such as photoelectric conversion is dissipated to the outside from the heat radiating unit 5. In this case, heat is also dissipated from the substrate 1 to the outside.

The substrate 1 functions as a substrate for mounting and fixing the light emitting element 4. Further, the substrate 1 functions as a part of a heat transfer path when the heat generated from the light emitting element 4 is dissipated to the outside. In the examples shown in FIGS. 1 to 3, the substrate 1 has a rectangular shape in a plan view, and has a rectangular upper surface 1a and a lower surface 1b, respectively. The mounting portion 2 of the light emitting element is located at the central portion or the like in the plan view of the rectangular upper surface 1a. The dimensions of the substrate 1 in a plan view are, for example, about 10 × 100 to 50 × 300 mm. The thickness of the substrate 1 (distance between the first surface 1a and the second surface 1b) is, for example, about 3 to 15 mm. As described above, the substrate 1 has a through hole 3, and the through hole 3 is located in an intermediate portion between the two mounting portions 2.

The substrate 1 is formed of, for example, a metal material such as stainless steel, an alloy material containing copper as a main component, or an alloy material containing aluminum as a main component. Further, the substrate 1 may be made of a ceramic material such as an aluminum oxide sintered body, a silicon nitride material sintered body, an aluminum nitride material sintered body, a mulite material sintered body, or a glass ceramic sintered body. Further, the substrate 1 may be made of a resin material such as an epoxy resin, a polyimide resin or a polyamide-imide resin, or may be a resin material containing glass cloth or inorganic filler particles.

If the substrate 1 is made of a metal material such as stainless steel, various metal processing such as cutting, cutting, rolling, polishing and etching may be appropriately selected and applied to the raw material of the metal material such as ingots. , Can be manufactured. Further, the substrate 1 can also be manufactured by a method such as casting in which the above-mentioned metal material is heated and melted and then the melt is processed by a mold having a predetermined shape.

Further, if the substrate 1 is made of an aluminum oxide sintered body, it can be manufactured in the following steps. First, a slurry obtained by adding an organic solvent and a binder to raw material powders such as aluminum oxide and silicon oxide and kneading the slurry is formed into a sheet by a method such as a doctor blade method to prepare a ceramic green sheet. Next, the ceramic green sheet is cut into a predetermined shape and size to produce a plurality of sheets. Then, if necessary, a plurality of layers of these sheets are laminated and integrally fired at a temperature of about 1300 to 1600 ° C. The substrate 1 can be manufactured by the above steps.

If the substrate 1 is made of a resin material, the uncured material of the resin material such as epoxy resin is molded into a predetermined shape and size of the substrate 1 by a molding method such as injection molding or transfer molding. Can be manufactured.

A conductor (not shown) such as a wiring conductor may be located on the upper surface 1a or the inside of the substrate 1. For example, the wiring conductor is positioned so as to be electrically led out from the mounting portion 2 to the side surface, the lower surface, or the like. The light emitting element 4 mounted on the mounting unit 2 and the external electric circuit can be electrically connected via the wiring conductor. When the substrate 1 is made of a metal material, an insulating material such as a resin material, a ceramic material, or a glass material may be interposed between the wiring conductor and the substrate 1 to suppress an electrical short circuit.

A conductor such as a wiring conductor is made of a conductive material appropriately selected from materials such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, nickel, cobalt, tin and carbon.

When the substrate 1 is made of a ceramic material, the wiring conductor can be formed, for example, as follows. First, a metal paste obtained by adding an organic solvent to a powder such as tungsten is printed on a plurality of sheets serving as a substrate 1 in a predetermined pattern. After that, the wiring conductor can be formed on the substrate 1 by simultaneously firing the laminated sheet and the metal paste. A plating layer made of, for example, nickel or gold is formed on the surface of the wiring conductor in order to prevent oxidation or improve the wettability of the brazing material, which will be described later.

The light emitting element 4 mounted on the mounting portion 2 of the substrate 1 is a semiconductor light emitting element such as an LED (Light Emitting Diode). The light emitting element 4 is electrically and mechanically connected to the wiring conductor via, for example, brazing material or solder. The light emitting element 4 emits light by the electric power supplied from the outside through the wiring conductor or the like, and the light is radiated from the lighting device 10 to the outside. The emitted light may be visible light, infrared light or ultraviolet light, or may have a spectrum including a plurality of these types.

The light emitting element 4 has, for example, a translucent substrate and a light emitting unit which is an optical semiconductor layer located on the translucent substrate. The translucent substrate may be any as long as it can grow an optical semiconductor layer by using a chemical vapor phase growth method such as an organic metal vapor phase growth method or a molecular beam epitaxial growth method. As the material used for the translucent substrate, for example, sapphire, gallium nitride, aluminum nitride, zinc oxide, zinc selenide, silicon carbide, silicon, zirconium dibodium or the like can be used. The thickness of the translucent substrate is, for example, 50 μm or more and 1000 μm or less.

The optical semiconductor layer is composed of a first semiconductor layer located on a translucent substrate, a light emitting layer located on the first semiconductor layer, and a second semiconductor layer located on the light emitting layer. The first semiconductor layer, the light emitting layer and the second semiconductor layer are, for example, a group III nitride semiconductor, a III-V semiconductor such as gallium phosphorus or gallium arsenide, or a group III nitride such as gallium nitride, aluminum nitride or indium nitride. Material semiconductors and the like can be used. The thickness of the first semiconductor layer is, for example, 1 μm or more and 5 μm or less, the thickness of the light emitting layer is, for example, 25 nm or more and 150 nm or less, and the thickness of the second semiconductor layer is, for example, 50 nm or more and 600 nm or less.

The light emitting element 4 may have a light emitting portion covered with a wavelength conversion member containing, for example, a phosphor material. Further, the light emitting element 4 may be housed in a concave accommodating portion of a package (unsigned) accommodating such a light emitting element 4 and a wavelength conversion member. Further, a translucent sealing material may be arranged between the light emitting portion and the wavelength conversion member in the accommodating portion. In the example shown in FIG. 1 and the like, the light emitting element 4 is housed in the package as described above. The light emitting element 4 can also be regarded as a light emitting device including the above-mentioned members.

The package consists of, for example, a ceramic material such as aluminum oxide, titanium oxide, zirconium oxide or yttrium oxide. The inner side surface surrounding the light emitting element 4 of the accommodating portion may be an inclined surface inclined so as to spread outward from the lower part to the upper part. The light emitted by the light emitting element 4 can be reflected on the inclined surface and effectively radiated to the outside.

As the sealing material, for example, a translucent insulating resin such as a silicone resin, an acrylic resin or an epoxy resin, or a translucent glass material is used. The refractive index of the encapsulant is set to, for example, 1.4 or more and 1.6 or less.

The substrate 1 has a through hole 3 penetrating from the first surface 1a to the second surface 1b in a portion other than the mounting portion 2. As described above, the through hole 3 is located between the two mounting portions 2. That is, the heat transfer distance from the mounting portion 2 to the through hole 3 is about the same for the two mounting portions 2. The through hole 3 is a portion where the heat radiating portion 5 described later is located, and is a portion where the radiating portion 5 effectively dissipates heat to the outside. The heat generated by the light emitting element 4 is conducted from the mounting portion 2 to the heat radiating portion 5 located around the through hole 3.

The heat radiating portion 5 includes a portion located along the inner surface of the through hole 3. Further, the heat radiating unit 5 includes a heat radiating fin 6 having at least a part thereof protruding outward from the first surface (upper surface) 1a of the substrate 1. In the following, in order to distinguish the heat radiation fin 6 located on the upper surface 1a side of the substrate 1 from other heat radiation fins and the like described later, the heat radiation fin 6A may be referred to as a first heat radiation fin 6A. In addition to the first heat radiation fin 6A, the heat radiation unit 5 may include a heat radiation fin 6 (6B) protruding outward from the second surface (lower surface) of the substrate 1. The details of the second heat radiation fin 6B located on the lower surface 1b side of the substrate 1 will be described later.

Since at least a part of the heat radiating portion 5 is located in the through hole 3, heat can be radiated into the through hole 3 from the portion located in the through hole 3. Further, heat is radiated to the outside from the first heat radiating fin 6A above the through hole 3. Due to the dissipated heat, an air flow is generated from the inside of the through hole 3 toward the upper side of the upper surface 1a of the substrate 1. In other words, due to the presence of the through hole 3, upward heat is effectively dissipated from the heat radiating portion 5 by the natural air flow. As a result, effective heat dissipation from the lighting device 10 to the outside is performed. Therefore, the lighting device 10 can be used, which is advantageous for improving heat dissipation.

Regarding the improvement of heat dissipation, for example, there is a means to generate an air flow by a fan or the like to move (heat dissipate) heat, but there is a possibility that power is consumed for the operation of the fan or the like or it becomes a new heat source. be. Therefore, there is a possibility that so-called decrease in energy saving or increase in calorific value may be induced. On the other hand, since the lighting device 10 of the embodiment does not require a fan or the like, the above-mentioned induction can be effectively suppressed.

In such a lighting device 10, since the decrease in the luminous efficiency of the light emitting element 4 due to heat is suppressed, the luminous efficiency can be maintained for a long period of time, and the light emitting element 4 can stably emit light to the outside. can.

In the example of this embodiment, the first heat radiating fin 6A is the first heat radiating fin 6A of the heat radiating unit 5.
It is integrally formed with other parts. The portion of the heat radiating portion 5 other than the first radiating fin 6A is, for example, a portion located along the inner side surface of the through hole 3, and in the example of this embodiment, the radiating portion 5 is integrally formed with the substrate 1. Has been done. The portion of the heat radiating portion 5 located inside the through hole 3 constitutes a part of the inner surface of the through hole 3.

The heat radiating portion 5 including the first heat radiating fin 6A is formed of, for example, a metal material similar to the metal material forming the substrate 1 described above. The heat radiating unit 5 can be manufactured by subjecting such a raw material of a metal material to the same metal processing as when the substrate 1 is manufactured. When the substrate 1 and the heat radiating portion 5 are integrally formed, the substrate 1 and the radiating portion can be manufactured by the above-mentioned metal processing at the same time. Therefore, the lighting device 10 can be used, which is advantageous for heat conduction from the substrate 1 to the heat radiating unit 5 and also for improving productivity.

The heat radiation fins 6 (first heat radiation fins 6A and second heat radiation fins 6B) are formed by arranging a large number of fins (fin-shaped portions) on a flat plate base material. Considering the effect of heat dissipation by the above-mentioned air flow, the flat portions of the fins are arranged so as to be parallel in the vertical direction. Further, these fins are arranged not only on the through hole 3 side but also on the side opposite to the through hole 3 in a plan view, so that the effect of heat dissipation to the outside is enhanced.

The dimensions of the individual fins in the first heat radiation fin 6A in a plan view, the number (number of fins) of the fins, the adjacent distance between the fins, and the like are the amount of heat generated from the light emitting element 4 mounted on the mounting portion 2 and the first heat radiation fin 6A. It can be appropriately set according to the conditions such as the thermal conductivity of the formed metal material. The above amount of heat can be calculated according to conditions such as the number of light emitting elements 4, the amount of heat generated when each light emitting element 4 is operated, and the operating time (actual lighting time) of the lighting device 10.

For example, in the example shown in FIG. 1, the first heat dissipation fin 6A is made of an aluminum alloy, and the dimensions of each fin in a plan view are a square shape of about 2 × 10 to 6 × 30 mm, and the adjacent distance between the fins is 2 to 2. It is about 6 mm. The amount of heat generated by the light emitting element 4 mounted on the mounting unit 2 is, for example, about 1 to 2 W.

In this embodiment, the through hole 3 has a rectangular shape in a plan view, and the corner portion is formed into an arc shape. The shape of the through hole 3 in a plan view is not limited to a rectangular shape, but may be another rectangular shape such as a square shape, a trapezoidal shape, or a parallel quadrilateral shape, or another polygonal shape such as a hexagonal shape or an octagonal shape. Further, a plurality of these figures may be connected by one side of each. Further, the number of through holes 3 is not limited to one, and may be two or three or more as shown in FIGS. 1 to 3, for example.

In this case, considering that the first heat radiation fins 6A are arranged on both sides of the through hole 3 in a plan view, the opening shape is preferably a shape having side portions parallel to each other on both sides of the through hole 3. ing. The inner surface of the through hole 3 may be inclined inward or outward from the upper end to the lower end thereof. That is, the through hole 3 may have different opening dimensions on the upper surface side 1a side and the lower surface side 1b of the substrate 1. When the inner surface of the through hole 3 is tilted as described above, for example, the opening may be increased on the lower surface 1b side (intake side) of the substrate 1 to facilitate the intake of outside air. Further, it is possible to reduce the opening on the upper surface 1a side to increase the air flow and promote the heat dissipation in the upward direction.

When the lighting device 10 shown in FIG. 1 is used for actual lighting, the light emitting element 4 may be directed toward the object to be illuminated. The illuminated object is, for example, a person in a room or various articles visually observed by a person. The lighting device 10 for indoor lighting is set, for example, on the ceiling portion so that the light emitting element 4 faces downward. That is, for example, the lighting device 10 having the form shown in FIG. 1 is used upside down. In this case, a diffuser plate for diffusing light may be arranged under the light emitting element 4. This makes it possible to reduce glare in the room. As the diffuser plate, a material having a function of diffusing light, such as a translucent resin material or a glass material, can be used. As an example, a diffusion plate made of a white polycarbonate resin, frosted glass, or the like can be used.

4 (a) is a perspective view showing a part of the lighting device 10 of another embodiment of the present invention, and FIG. 4 (b) shows the lighting device 10 shown in FIG. 4 (a) surrounded by virtual lines. It is sectional drawing at the time of cutting in the plane D. FIG. 5 is a perspective view of the lighting device 10 of another embodiment of the present invention as viewed from the first surface 1a side of the substrate 1. FIG. 6 is a perspective view showing the lighting device 10 shown in FIG. 5 in an exploded manner. A part of the lighting device 10 shown in FIG. 4 is a reflecting member (reflector) that reflects the light emitted by the light emitting element 4 to change the direction of the light and radiate it to the outside. Hereinafter, this is referred to as a reflector 7.

That is, the lighting device 10 of this embodiment further includes a reflector 7 in addition to each portion such as the substrate 1 described in the above embodiment. The reflector 7 has a container portion 8 having a recess 8a on the lower surface side, and a reflecting portion 9 located on the inner surface of the recess 8a of the container portion 8 and having a higher surface reflectance than the container portion 8. In this case, the surface of the container portion 8 is an outer surface located outside the recess 8a of the container portion and an inner surface of the recess 8a covered with the reflection portion 9. In the lighting device 10 of this embodiment, the substrate 1 is arranged in the recess 8a. Further, the substrate 1 is arranged so that the first surface 1a faces upward. That is, the light emitting element 4 (light emitting portion on the upper surface) mounted on the first surface 1a and the reflecting portion 9 covering the inner surface of the recess 8a face each other.

In the lighting device 10 shown in FIGS. 5 and 6, the light emitting element 4 is directed upward. The light emitted from the light emitting element 4 is reflected downward by the reflecting unit 9 and radiated to the outside. As a result, it is possible to illuminate an object to be illuminated such as a room by so-called indirect lighting. Indirect lighting can provide an effective lighting environment, for example, to reduce glare.

For the container portion 8, for example, a resin such as polycarbonate can be used, or a metal material similar to the metal material constituting the substrate 1 described above can also be used. Further, the reflective portion 9 is formed of a metal material such as aluminum, silver or stainless steel. Further, the reflective portion 9 may have a plating layer such as aluminum vapor deposition or silver plating adhered to the outer surface of a base material such as resin. The outer surface of these metal materials and the plating layer may be mirror-polished or mirror-plated. The reflectance of light in the reflecting unit 9 is set to, for example, 80% or more.

The container portion 8 and the reflective portion 9 may both be made of the same type of metal material such as aluminum and may be integrally processed with each other. In this case, breakage such as peeling of the reflective portion 9 from the container portion 8 is suppressed, and the durability and reliability of the lighting device 10 are improved.

In the example shown in FIGS. 4 to 6, the container portion 8 has an opening portion 8b in which the container portion 8 penetrates in the vertical direction in the recess 8a. The substrate 1 is positioned so that the through hole 3 and the opening 8b overlap each other in a plan view. The first heat radiation fin 6A passes through the opening 8b and projects upward from the upper surface of the container portion 8.

In this case, since the opening 8b functions as a space for passing the first heat radiation fin 6A from the inside to the outside of the reflector 7, it is easy to project a part of the first heat radiation fin 6A to the outside. Further, in this case, an air flow path is formed in a straight line from the through hole 3 to the opening 8b. Therefore, it is possible to effectively enhance the heat dissipation to the outside via the first heat dissipation fin 6A.

Further, as an example of the method of fixing the reflector 7 and the substrate 1, the reflector 7 is provided with a screw mounting portion protruding from the opening 8b, and the screw is screwed to the heat radiating portion 5 (first heat radiation fin 6A) protruding upward from the opening 8b. May be used to attach the reflector 7.

In the lighting device 10 of this embodiment, at least a part of the heat radiating unit 5 may be arranged so as to project outward from the reflector 7. It is also possible to promote heat dissipation to the outside from this outwardly protruding portion. For example, in the example shown in FIG. 5, the upper portion of the first heat radiation fin 6A extends so as to project upward from the upper surface of the reflector 7 (container portion 8). The heat is radiated upward from the upper portion of the first heat radiating fin 6A.

The effect of improving heat dissipation due to the presence of the opening 8b can also be obtained when the entire first heat dissipation fin 6A is located in the opening 8b. Even if the entire first heat radiation fin 6A is located in the opening 8b, the air heated by the first heat radiation fin 6A heat-conducted from the light emitting element 4 flows upward. Therefore, heat is radiated by dissipating the heated air from the upper end of the opening 8b where the first heat radiating fin 6A is located to the outside.

However, when at least a part of the first heat radiating fin 6A extends so as to project upward from the opening 8b, as described above, from the protruding portion of the first heat radiating fin 6A. It is also possible to dissipate heat directly to the outside. Therefore, it is advantageous in enhancing the heat dissipation effect.

In each of the above embodiments, the heat radiating unit 5 may further have a heat radiating fin 6 (the above-mentioned second radiating fin 6B) protruding outward (lower side) from the second surface 1b (lower surface) of the substrate 1. ..
The second heat radiation fin 6B is also heated by the heat conducted from the light emitting element 4 via the substrate 1. The heated second radiating fin 6B heats the surrounding air to generate an air flow upward (that is, upward from the inside of the through hole 3). As a result, an air flow is likely to be generated in the upward direction in the through hole 3, and heat dissipation to the outside is promoted.

The height of the second heat radiating fin 6B is set to a height (dimension in the vertical direction) smaller than that of the first heat radiating fin 6A in consideration of miniaturization, weight reduction, economy, and the like as the lighting device 10. Further, the second heat radiation fin 6B can be manufactured by the same method using, for example, the same metal material as the first heat radiation fin 6A or the substrate 1. The heat radiating portion 5 may be integrally formed including the second radiating fin 6B.

In this case, the thickness of the substrate 1 may be thinner around the through hole 3 than the other portions, depending on the height of the second heat radiation fin 6B. As a result, the moving distance of the airflow in the through hole 3 can be reduced, and the effect of heat dissipation can be enhanced.

In the lighting device 10 of the embodiment, the through holes 3 may have two or more inner surfaces facing each other in a plan view. In this case, the heat radiation fins 6 (at least one of the first heat radiation fins 6A and the second heat radiation fins 6B) may be located on two or more inner surfaces facing each other. That is, in a plan view, two or more heat radiation fins 6 may be located with the through hole 3 sandwiched between them. In this case, an air flow of air heated by the radiating fins 6 can be generated over the entire area of the through hole 3 in a plan view. Therefore, the heat dissipation effect from the lighting device 10 to the outside can be enhanced.

Further, in this case, as shown in FIGS. 1 and 5, the substrate 1 has mounting portions 2 on both sides of the through hole 3, and the light emitting element 4 is mounted on each mounting portion 2. Even in this case, it is possible to effectively dissipate heat from the light emitting element 4 to the outside.

As shown in FIG. 2, for example, the substrate 1 may have the second heat radiation fins 6B extending over a relatively wide range of the second surface 1b. By extending the second heat radiating fin 6B in this way, the lighting device 10 can be made effective for improving the heat radiating effect to the outside.

In the example shown in FIG. 2 and the like, the second heat radiation fins 6B are a plurality of linear (strip-shaped) in a plan view from the end portion of the through hole 3 on the second surface 1b side to the outer periphery of the lower surface of the substrate 1. Fins are arranged parallel to each other.

FIG. 7 is a perspective view showing the lighting module 20 according to the embodiment of the present invention. In FIG. 7, the same parts as those in FIGS. 1 to 6 are designated by the same reference numerals. The positive module 20 includes a lighting device 10 of any of the above forms and a housing 11 on which the lighting device 10 is mounted. In the example shown in FIG. 7, the housing 11 and the lighting device 10 are shown separately. In this example, three lighting devices 10 are mounted on one housing 11.

The housing 11 is made of, for example, a metal material such as stainless steel, aluminum or steel, or a resin material such as a polycarbonate resin, an acrylic resin or a polyetheretherketone (PEEK) resin. The outer surface of the housing 11 may be painted with various resin paints such as white. The housing 11 is not limited to a simple rectangular box shape (a rectangular parallelepiped shape having a concave accommodating portion) as shown in FIG. 7, and is a circular shape, an elliptical shape, or a combination of a plurality of these shapes in a plan view. It may have an elliptical shape. A mounting portion (unsigned) for positioning and fixing each lighting device 10 is provided in the accommodating portion of the housing 11. The mounting portion may be in the shape of a socket.

Wiring consisting of a printed circuit, a conducting wire, or the like is arranged from the mounting portion to the outer surface of the housing 11. The mounted lighting device and an external power source or the like are electrically connected to each other via wiring, and electric power for causing the light emitting element 4 of the lighting device 10 to emit light is supplied.

In the example shown in FIG. 7, a controller 12 for controlling the light emission of the plurality of lighting devices 10 is arranged. A plurality of lighting devices 10 and a controller are electrically connected to each other via a connecting conductor 13 electrically connected to the above wiring. By adjusting the on / off and emission intensity of each light emitting element of the plurality of lighting devices 10 by the controller 12, the spectrum of the light emitted from the outside from the lighting module 20 can be adjusted and the lighting position can be adjusted. It can be adjusted.

For example, when the lighting module 20 is used for lighting an animal breeding cage or the like, it can be combined with a sensor such as an infrared sensor to change the lighting position according to the movement of the animal. Further, in an aquarium or the like, it is possible to provide a lighting environment having spectra corresponding to different water depths.

1 ... Substrate 1a ... First surface (upper surface)
1b ... 2nd surface (lower surface)
2 ・ ・ Mounting part 3 ・ ・ Through hole 4 ・ ・ Light emitting element 5 ・ ・ Heat dissipation part 6 ・ ・ Radiation fin 6A ・ ・ First heat radiation fin 6B ・ ・ Second heat radiation fin 7 ・ ・ Reflector 8 ・ ・ Container part 8a ・・ Recess 8b ・ ・ Opening 9 ・ ・ Reflector
10 ... Lighting equipment
11 ... Housing
12 ... Controller
13 ... Connecting conductor
20 ... Lighting module

Claims (9)

It has a first surface including a mounting portion of a light emitting element and a second surface opposite to the first surface, and has a through hole penetrating from the first surface to the second surface in a portion other than the mounting portion. With the board
The light emitting element located in the mounting portion and
A portion including a portion located along the inner side surface of the through hole, and at least a part thereof protrudes outward from the first surface of the substrate and includes a heat dissipation portion including heat radiation fins located on the outer periphery of the through hole. Lighting equipment to be equipped. The lighting device according to claim 1, wherein the heat radiation fin is located so as to face the light emitting element in a cross-sectional view intersecting the first surface and the second surface. A reflector having a container portion having a recess on the lower surface side and a reflecting portion located on the inner surface of the recess of the container portion and having a higher reflectance on the surface than the container portion is further provided.
The lighting device according to claim 1 or 2 , wherein the substrate is arranged in the recess so that the first surface faces upward. It has a first surface including a mounting portion of a light emitting element and a second surface opposite to the first surface, and has a through hole penetrating from the first surface to the second surface in a portion other than the mounting portion. With the board
The light emitting element located in the mounting portion and
A heat radiating portion including a portion located along the inner side surface of the through hole, and at least a part of which includes heat radiating fins protruding outward from the first surface of the substrate.
It is provided with a container portion having a recess on the lower surface side and a reflector having a reflecting portion located on the inner surface of the recess of the container portion and having a higher reflectance on the surface than the container portion.
A lighting device in which the substrate is arranged in the recess so that the first surface faces upward. The container portion has an opening that penetrates in the vertical direction in the recess.
The lighting device according to claim 3 or 4 , wherein the substrate is located so that the through hole and the opening are overlapped with each other in a plan view. The lighting device according to claim 5 , wherein at least a part of the heat radiation fins extends so as to project upward from the opening. The lighting device according to claim 5 or 6 , wherein the heat radiating portion further has heat radiating fins protruding outward from the second surface of the substrate. Claims 1 to claim that the through holes have two or more inner surfaces facing each other in a plan view, and the heat radiation fins are located on the two or more inner surfaces facing each other. 7. The lighting device according to any one of 7. The lighting device according to any one of claims 1 to 8 .
A lighting module including a housing in which the lighting device is mounted.

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