JP2008034315A - Led illumination fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED illumination fixture capable of improving accuracies of light color and color temperature of mixed color light obtained as the whole fixture without necessity to provide a light guide member separately from a light-emitting device. <P>SOLUTION: This is provided with a fixture main body 110, a plurality of light-emitting devices A in which light detecting elements 4 to detect light emitted from LED chips 1 in a package B are installed at the package B where the LED chips 1 are housed and which are retained at the fixture main body 110, and a control part 160 to control light output of the LED chips 1 in the package B where the light detecting elements 4 are installed based on the output of the light detecting elements 4. As for the light-emitting device A, the plurality of kinds of the LED chips 1 having different light-emitting colors are housed in the package B, and the plurality of the light detecting elements 4 to respectively and separately detecting the light emitted from the LED chips 1 having respective light-emitting colors are installed at the package B. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an LED lighting apparatus that uses a plurality of types of LED chips having different emission colors to obtain desired mixed color light.

  Conventionally, a circuit board on which a plurality of types of LEDs having different emission colors (for example, red LED, green LED, blue LED) are mounted, an instrument body in which the circuit board is stored, and a mounting surface side of each LED on the circuit board There has been proposed an LED lighting apparatus including an optical member disposed on the surface (for example, see Patent Document 1).

Here, the LED lighting apparatus disclosed in the above-mentioned Patent Document 1 is a mixed color light (for example, a desired light color or color temperature) regardless of a temporal change of LED light output for each light emission color or a difference in temperature dependency. In order to maintain white light), a photodetection device composed of a photodiode that detects the light output of all LEDs, an optical fiber for guiding light emitted from each LED to the photodetection device, The amount of forward current applied to the LED for each luminescent color via the drive circuit unit is maintained so that the light output of the LED for each luminescent color detected by the light detection device is maintained at a preset target value. And a control unit that performs feedback control. In addition, in the LED lighting apparatus disclosed in Patent Document 1, in order to measure the light output of the red LED group, the light output of the green LED group, and the light output of the blue LED group separately by one light detection device, The control section controls the drive circuit section so that a period in which only the red LED group is lit, a period in which only the green LED group is lit, and a period in which only the blue LED group is lit appear in time series. .
JP 2002-533870 A

  However, the LED lighting apparatus disclosed in Patent Document 1 is configured to propagate the light emitted from each LED through one optical fiber, so that the light of all LEDs is detected by the light detection device. Therefore, it is difficult to detect stably, and the accuracy of the light color and color temperature of the mixed color light obtained as the whole instrument is lowered. In addition, in the LED lighting apparatus disclosed in Patent Document 1, a part of light emitted from the light emitting device is detected separately from the light emitting device including the LED chip and a shell type package containing the LED chip. It is necessary to separately provide a light guide member such as an optical fiber for guiding light to the apparatus, and it is necessary to secure a space for housing the light guide member in the instrument main body, making it difficult to reduce the thickness of the instrument main body.

  The present invention has been made in view of the above reasons, and its purpose is not to provide a light guide member separately from the light emitting device, and to improve the accuracy of the light color and color temperature of the mixed color light obtained as a whole instrument. It is in providing the LED lighting fixture which can be improved.

  The invention of claim 1 is a lighting fixture that obtains a desired mixed color light by using a plurality of types of LED chips having different emission colors, and the LEDs in the package are stored in the fixture main body and the package containing the LED chips. A plurality of light-emitting devices provided with a light detection element for detecting light emitted from the chip and held in the instrument body, and an LED chip in a package in which the light detection element is provided based on the output of the light detection element And a control unit for controlling the light output.

  According to this invention, since each light emitting device includes the light detection element that detects light emitted from the LED chip in the package in the package in which the LED chip is accommodated, the light guide member is provided separately from the light emitting device. The light emitted from the LED chip can be stably and accurately detected by the light detecting element provided in the package in which the LED chip is housed, regardless of the layout design of the light emitting device. The accuracy of the light color and color temperature of the mixed color light obtained as a whole can be improved.

  According to a second aspect of the present invention, in the light emitting device according to the first aspect of the invention, a plurality of types of LED chips having different emission colors are accommodated in the package, and light emitted from the LED chips of the respective emission colors is separately provided. A plurality of light detection elements to be detected are provided in a package.

  According to the present invention, light emitted from a plurality of types of LED chips having different emission colors can be individually detected in each light emitting device, and the light color and color temperature of mixed light can be controlled for each light emitting device. Therefore, the degree of freedom in the layout design of the light emitting device is increased.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the control unit is provided in a package of each light emitting device.

  According to the present invention, since it is not necessary to provide a control unit separately from each light emitting device, the layout design of each light emitting device on a circuit board or the like is facilitated.

  According to the first aspect of the present invention, there is no need to provide a light guide member separately from the light emitting device, and there is an effect that it is possible to improve the accuracy of the light color and color temperature of the mixed color light obtained as the whole instrument.

(Embodiment 1)
Hereinafter, the LED lighting fixture of this embodiment is demonstrated, referring FIGS.

  The LED lighting apparatus of the present embodiment is a ceiling light and includes a disk-shaped apparatus main body 110 (see FIGS. 1A, 2 and 6) attached to a construction material 200 such as a ceiling material. The instrument body 110 is formed with a recess 111 having a circular opening on one surface (the lower surface in FIG. 1A) opposite to the construction material 200 side, and a plurality of (main) on the inner bottom surface of the recess 111. In the embodiment, an accommodation recess 112 for accommodating a circuit board 130 made of a disk-shaped printed wiring board on which eight light-emitting devices A are mounted is formed.

  Here, in the LED lighting fixture of this embodiment, each light-emitting device A is held by the fixture main body 110 by attaching the circuit board 130 to the fixture main body 110. In this embodiment, when the circuit board 130 is attached to the instrument main body 110, a resin sheet containing a filler made of a filler such as silica or alumina and having a low viscosity when heated (for example, an epoxy resin sheet highly filled with fused silica) A sheet-like joining member (not shown) made of an organic green sheet) is interposed between the circuit board 130 and the inner bottom surface of the housing recess 112 of the instrument body 110 to join them together. Alternatively, the circuit board 130 may be attached to the instrument main body 110 using a fixing tool such as a screw. The instrument body 110 is made of a metal material having high thermal conductivity such as Al or Cu.

  At the center of the other surface of the instrument main body 110 (the upper surface in FIG. 1A), a cylindrical embedding portion 113 to be inserted into a circular mounting hole 201 formed in the construction material 200 is projected. The instrument main body 110 has a wire insertion hole 114 for introducing two electric wires 196 for supplying power to the circuit board 130 into the storage recess 112, and the inner end of the embedded portion 113 and the storage recess 112. It penetrates in the site | part between the center part of a bottom face. In short, the instrument main body 110 has a wire insertion hole 114 formed through the bottom of the storage recess 112. In addition, the other end side opposite to the one end side connected to the circuit board 130 in each electric wire 196 is attached to and detached from a first connector (not shown) for output of a separate power supply unit (not shown). A second connector 197 that is freely connected is provided.

  In addition, a plurality of (in this embodiment, two) mounting screws 118 for attaching the tool body 110 to the construction material 200 are inserted into the above-described tool body 110 from the one surface side (in this embodiment). Two) screw insertion holes 115 are provided in a portion between the inner bottom surface of the recess 111 and the other surface of the instrument body 110. Therefore, the instrument main body 110 can be attached to the construction material 200 such as a ceiling material using the attachment screw 118.

  In addition, the LED lighting apparatus of the present embodiment includes a translucent cover 140 disposed on one surface side of the circuit board 130 (the lower surface side in FIG. 1A), and a storage recess on the one surface side of the apparatus body 110. A frame-shaped decorative cover 150 is provided to be attached to the instrument main body 110 so as to cover the peripheral portion 112 and the mounting screws 118.

  The translucent cover 140 (see FIG. 1A, FIG. 2 and FIG. 7) includes a front plate portion 140a disposed on the one surface side of the circuit board 130 and spaced apart from the circuit board 130, and a front plate portion 140a. And an annular side plate portion 140b protruding continuously and integrally from the peripheral edge of the housing main body 110 toward the inner bottom surface of the housing recess 111. Here, the instrument main body 110 is formed with two screw insertion holes 117 through which a fixing screw 119 for fixing the translucent cover 140 is inserted. Two boss portions 140c having screw holes 140d into which the tip ends of the fixing screws 119 inserted through the screw insertion holes 117 of the instrument main body 110 are screwed from the other surface side are integrally formed. Note that a cutout portion is formed in a portion corresponding to each boss portion 140 c in the peripheral portion of the circuit board 130.

  Further, the decorative cover 150 (see FIGS. 1A, 2, 8, and 9) is formed using an elastic synthetic resin (for example, PBT, ABS, etc.) and formed on the instrument body 110. A plurality of locking projections 152 that respectively engage with the plurality of engagement holes 116 (see FIG. 6) are provided so as to protrude from the surface facing the instrument main body 110. That is, the decorative cover 150 is attached to the instrument main body 110 by inserting the respective locking projections 152 into the respective engagement holes 116 of the instrument main body 110 and engaging with the peripheral portions of the respective engagement holes 116. . Here, the above-described translucent cover 140 is exposed through the circular opening window 151 of the decorative cover 150. Therefore, if the decorative cover 150 is attached to the instrument main body 110 after the instrument main body 110 is attached to the construction material 200 using the attachment screws 118, the attachment screw 118 cannot be seen from the one surface side of the instrument main body 110. Can be better. The above-described decorative cover 150 is made of a synthetic resin molded product. However, if the decorative cover 150 is made of metal, each light emitting device A can be compared with the case where the decorative cover 150 is made of synthetic resin. The heat generated in can be dissipated more effectively. Here, when the decorative cover 150 is formed of metal, for example, a structure that is attached to the instrument main body 110 using a leaf spring may be employed, and the decorative cover 150 may be detachable from the instrument main body 110. A structure in which the main body 110 is screwed onto the main body 110 may be adopted to be detachable from the instrument main body 110.

  In addition, each light emitting device A individually detects a plurality of types of LED chips 1 having different emission colors stored in the package B and light emitted from the LED chips 1 of each emission color in the package B as will be described later. A light detection element 4 made of a photodiode is provided, and on the circuit board 130 described above, in addition to each light emitting device A, a driving circuit unit (not shown) for driving each LED chip 1 of each light emitting device A. ) And a control unit 160 composed of a microcomputer or the like that controls the light output of the LED chip 1 in the package B in which the light detection element 4 is provided based on the output of the light detection element 4. Here, the control unit 160 supplies each LED chip 1 of each light emitting device A via the drive circuit unit so that the output of each light detection element 4 becomes a target value set in advance according to the desired mixed color light. The amount of forward current flowing through is feedback controlled.

  Hereinafter, the above-described light-emitting device A will be described with reference to FIGS.

  In the light emitting device A, a plurality of (four in this embodiment) LED chips 1 having different emission colors and a storage recess 2a for storing each LED chip 1 are formed on one surface, and the inner bottom surface of the storage recess 2a. A mounting substrate 2 on which each LED chip 1 is mounted; a translucent member 3 fixed to the mounting substrate 2 so as to close the housing recess 2a on the one surface side of the mounting substrate 2; A plurality of (four in the present embodiment) light detection elements 4 that are provided and detect light emitted from the LED chips 1 of the respective emission colors, and a light transmission filled in the housing recess 2a of the mounting substrate 2 Each of the LED chips 1 and the bonding wire 14 connected to each LED chip 1 and a sealing portion 5 made of a conductive sealing resin (for example, silicone resin, acrylic resin). Further, the mounting substrate 2 has a hook-like protruding portion 2c protruding inward from the peripheral portion of the storage recess 2a on the one surface side, and each light detection element 4 is provided in the protruding portion 2c. Is provided. In the present embodiment, the package B is configured by the mounting substrate 2 and the translucent member 3, but the translucent member 3 is not necessarily provided, and may be appropriately provided as necessary. .

  In the light emitting device A according to the present embodiment, as the four LED chips 1, the LED chip 1a having a red emission color, the LED chip 1b having a green emission color, the LED chip 1c having a blue emission color, and a yellow emission color. The LED chip 1d is used, and white light can be obtained as mixed light of red light, green light, blue light, and yellow light. However, the emission color of each LED chip 1 is not particularly limited, and may be appropriately selected according to the desired mixed color light.

  The mounting substrate 2 includes a rectangular plate-shaped LED mounting substrate 20 on which each LED chip 1a to 1d is mounted on one surface side, and a circular light extraction window disposed to face the one surface side of the LED mounting substrate 20 41 is formed, and a light detection element forming substrate 40 on which each light detection element 4 is formed, and a rectangular shape that is interposed between the LED mounting substrate 20 and the light detection element formation substrate 40 and communicates with the light extraction window 41. A space surrounded by the LED mounting substrate 20, the intermediate layer substrate 30, and the light detection element forming substrate 40 constitutes the housing recess 2a. is doing. Here, the outer peripheral shapes of the LED mounting substrate 20, the intermediate layer substrate 30, and the light detection element formation substrate 40 are rectangular, and the intermediate layer substrate 30 and the light detection element formation substrate 40 have the same outer dimensions as the LED mounting substrate 20. Is formed. Further, the thickness dimension of the light detection element forming substrate 40 is set smaller than the thickness dimension of the LED mounting substrate 20 and the intermediate layer substrate 30. In the present embodiment, the LED mounting substrate 20 constitutes a base substrate portion on which the LED chips 1a to 1d are mounted, and the intermediate layer substrate 30 and the light detection element formation substrate 40 constitute the LED chips 1a to 1d. A wall portion 2b that protrudes from the base substrate portion so as to surround 1d is formed, and a portion of the light detection element forming substrate 40 that protrudes above the opening window 31 of the intermediate layer substrate 30 constitutes the above-described protruding portion 2c. is doing. In short, the overhanging portion 2c protrudes inward from the tip end portion of the wall portion 2b.

  The LED mounting substrate 20, the intermediate layer substrate 30, and the light detection element formation substrate 40 described above are formed using silicon substrates 20 a, 30 a, and 40 a each having an n-type conductivity and a (100) plane main surface. In addition, the inner side surface of the intermediate layer substrate 30 is configured by a (111) plane formed by anisotropic etching using an alkaline solution (for example, TMAH solution, KOH solution, etc.) (that is, the intermediate layer substrate) 30, the opening area of the opening window 31 gradually increases as the distance from the LED mounting substrate 20 increases.) Light emitted from the LED chips 1 a to 1 d to the side (wall portion 2 b side) is forward (projected). This constitutes a mirror 2d that reflects to the part 2c side). In short, in the present embodiment, the intermediate layer substrate 30 also serves as a frame-like reflector that reflects light emitted from the LED chips 1a to 1d to the side.

  The LED mounting substrate 20 is a set of two conductor patterns 25a electrically connected to each of the electrodes of the LED chips 1a to 1d on one surface side (the lower surface side in FIG. 1B) of the silicon substrate 20a. , 25a are formed, and a pair of conductor patterns 25b, 25b that are electrically connected to the photodetecting element 4 through two through-hole wirings 34, 34 formed in the intermediate layer substrate 30. Are formed, and each external connection electrode 27a, 27a, 27b formed on each conductor pattern 25a, 25a, 25b, 25b and the other surface side of the silicon substrate 20a (upper surface side in FIG. 1B). 27b are electrically connected to each other through the through-hole wiring 24. The LED mounting substrate 20 is also formed with a bonding metal layer 29 for bonding to the intermediate layer substrate 30 on the one surface side of the silicon substrate 20a.

  The LED chips 1a to 1d in the present embodiment are visible light LED chips in which electrodes (not shown) are formed on both surfaces in the thickness direction using a conductive substrate as a crystal growth substrate. One of the two conductor patterns 25a, 25a to which the LED chips 1a to 1d are electrically connected is connected to a rectangular die pad portion 25aa to which the LED chips 1a to 1d are die-bonded, and a die pad portion. The lead wiring portion 25ab is formed integrally with 25aa and serves as a connection portion with the through-hole wiring 24. In short, the LED chips 1a to 1d are die-bonded to the die pad portion 25aa of the one conductor pattern 25a, and the electrodes on the die pad portion 25aa side are joined and electrically connected to the die pad portion 25aa, and the light extraction surface side The electrode is electrically connected to the other conductor pattern 25a through the bonding wire. Here, in the present embodiment, the outer peripheral shape of the LED chips 1a to 1d and the die pad portion 25aa in a plan view is a rectangular shape (in the illustrated example, a square shape), and the planar size of the die pad portion 25aa is the same as that of the LED chips 1a to 1d. It is set slightly larger than the plane size.

  Further, the LED mounting substrate 20 has a rectangular heat dissipation pad portion 28 made of a metal material having a higher thermal conductivity than the silicon substrate 20a in the projection region of each die pad portion 25aa on the other surface side of the silicon substrate 20a. In this embodiment, a plurality of die pad portions 25aa and heat radiation pad portions 28 that overlap in the thickness direction of the silicon substrate 20a are made of a metal material (for example, Cu) having a higher thermal conductivity than the silicon substrate 20a. In this case, the thermal coupling is performed through the nine (9) cylindrical thermal vias 26, and the heat generated in the LED chip 1 is radiated through the thermal vias 26 and the heat radiation pad 28. ing.

  By the way, the LED mounting substrate 20 has a plurality of through holes 22a in which each of the above-described through-hole wirings 24 is formed inside and a plurality of each of the above-described thermal vias 26 are formed in the silicon substrate 20a. A through hole 22b is provided in the thickness direction, and an insulating film 23 made of a thermal oxide film (silicon oxide film) is formed across the one surface and the other surface of the silicon substrate 20a and the inner surfaces of the through holes 22a and 22b. The conductor patterns 25a, 25a, 25b, and 25b, the bonding metal layer 29, the external connection electrodes 27a, 27a, 27b, and 27b, the heat dissipation pad portions 28, the through-hole wirings 24, and the thermal elements are formed. The via 26 is electrically insulated from the silicon substrate 20a. In the present embodiment, the opening shape of the through hole 22b for each thermal via 26 and the opening shape of the through hole 22a for each through hole wiring 24 are circular, but the inner diameter of the through hole 22b for the thermal via 26 The dimension is set larger than the inner diameter of the through hole 22 a for the through hole wiring 24, and the cross sectional area of the thermal via 26 in the cross section perpendicular to the thickness direction of the silicon substrate 20 a is larger than the cross sectional area of the through hole wiring 24. ing.

  In addition, in the LED mounting substrate 20, the conductor patterns 25 a, 25 a, 25 b, 25 b, the bonding metal layer 29, the external connection electrodes 27 a, 27 a, 27 b, 27 b, and the heat dissipation pad portions 28 are formed of the insulating film 23. Each of the conductor patterns 25a, 25a, 25b, and 25b and the bonding metal layer 29 is formed at the same time, and is composed of a laminated film of a Ti film formed thereon and an Au film formed on the Ti film. Each external connection electrode 27a, 27a, 27b, 27b and each heat dissipating pad portion 28 are formed simultaneously. In this embodiment, the thickness of the Ti film on the insulating film 23 is set to 15 to 50 nm, and the thickness of the Au film on the Ti film is set to 500 nm. However, these numerical values are only examples and are particularly limited. Not what you want. Further, the material of each Au film is not limited to pure gold, and may be one added with impurities. Further, a Ti film is interposed as an adhesion layer for improving adhesion between each Au film and the insulating film 23, but the material of the adhesion layer is not limited to Ti, for example, Cr, Nb, Zr, TiN, TaN or the like may be used. Moreover, although Cu is adopted as the material of the through-hole wiring 24 and the thermal via 26, it is not limited to Cu, and for example, Ni may be adopted.

  The intermediate layer substrate 30 is joined and electrically connected to one set of conductor patterns 27b and 27b of the LED mounting substrate 20 on one surface side (the upper surface side in FIG. 1B) of the silicon substrate 30a. Four sets of conductor patterns (not shown) are formed, and a bonding metal layer 36 to be bonded to the bonding metal layer 29 of the LED mounting substrate 20 is formed. Further, the intermediate layer substrate 30 is electrically connected to the other surface side of the silicon substrate 30a (the lower surface side in FIG. 1 (b)) via the through-hole wirings 34, 34, and a pair of conductor patterns on the one surface side. Four sets of two conductor patterns 37, 37 that are connected to each other are formed, and a bonding metal layer 38 for bonding to the light detection element forming substrate 40 is formed.

  Further, the intermediate layer substrate 30 has a plurality of through holes 32 penetrating in the thickness direction of the silicon substrate 30 a, and heats across the one surface and the other surface of the silicon substrate 30 a and the inner surface of each through hole 32. An insulating film 33 made of an oxide film (silicon oxide film) is formed, and each conductor pattern on the one surface side, each conductor pattern 37, 37 on the other surface side, and each bonding metal layer 36, 38 are formed on a silicon substrate. It is electrically insulated from 30a. Here, the conductor patterns on the one surface side, the conductor patterns 37 and 37 on the other surface side, and the bonding metal layers 36 and 38 are formed on the Ti film formed on the insulating film 33 and the Ti film, respectively. Each of the conductor patterns on one surface side and the bonding metal layer 36 are formed at the same time, and each of the conductor patterns 37, 37 on the surface side and the bonding metal layer are formed. 38 are formed simultaneously. In this embodiment, the thickness of the Ti film on the insulating film 33 is set to 15 to 50 nm, and the thickness of the Au film on the Ti film is set to 500 nm. However, these numerical values are only examples and are particularly limited. Not what you want. Here, the material of each Au film is not limited to pure gold, and may be added with impurities. Further, although a Ti film is interposed as an adhesion improving layer for adhesion between each Au film and the insulating film 33, the material of the adhesion layer is not limited to Ti, for example, Cr, Nb, Zr, TiN, TaN or the like may be used. Moreover, although Cu is adopted as the material of the through-hole wiring 34, it is not limited to Cu, and for example, Ni may be adopted.

  The photodetecting element forming substrate 40 is joined and electrically connected to one set of conductor patterns 37 and 37 of the intermediate layer substrate 30 on one surface side (the upper surface side in FIG. 1B) of the silicon substrate 40a. Four pairs of conductor patterns 47a and 47b (see FIG. 5) are formed, and a bonding metal layer 48 bonded to the bonding metal layer 38 of the intermediate layer substrate 30 is formed. Here, each light detection element 4 is configured by a photodiode, and one conductor pattern 47a of the pair of conductor patterns 47a and 47b formed on the light detection element formation substrate 40 is the light detection element 4. Is electrically connected to the p-type region 4a of the photodiode, and the other conductor pattern 47b is electrically connected to the silicon substrate 40a constituting the n-type region 4b of the photodiode.

  Further, in the photodetecting element forming substrate 40, an insulating film 43 made of a silicon oxide film is formed on the one surface side of the silicon substrate 40a, and the insulating film 43 also serves as an antireflection film of the photodiode. In the photodetecting element forming substrate 40, the one conductor pattern 47a is electrically connected to the p-type region 43a through a first contact hole (not shown) formed in the insulating film 43, and the other conductor is formed. The pattern 47b is electrically connected to the n-type region 4b through a second contact hole (not shown) formed in the insulating film 43. Here, each of the conductor patterns 47a and 47b and the bonding metal layer 48 is composed of a laminated film of a Ti film formed on the insulating film 43 and an Au film formed on the Ti film, and is formed at the same time. It is. In this embodiment, the thickness of the Ti film on the insulating film 43 is set to 15 to 50 nm, and the thickness of the Au film on the Ti film is set to 500 nm. However, these numerical values are only examples and are particularly limited. Not what you want. Here, the material of each Au film is not limited to pure gold, and may be added with impurities. Further, a Ti film is interposed as an adhesion layer for improving adhesion between each Au film and the insulating film 43, but the material of the adhesion layer is not limited to Ti, for example, Cr, Nb, Zr, TiN, TaN or the like may be used.

  In forming the mounting substrate 2 described above, the silicon substrate 40a and the intermediate layer substrate 30 on which the respective light detection elements 4, the insulating film 43, the respective conductor patterns 47a and 47b, and the bonding metal layer 48 are formed are formed at a low temperature. After performing a first bonding step for bonding by a room temperature bonding method or the like capable of direct bonding, a polishing step for polishing the silicon substrate 40a to a desired thickness is performed, and then an inductively coupled plasma (ICP) type dry etching apparatus The light detection element forming substrate 40 is completed by performing the light extraction window forming step of forming the light extraction window 41 on the silicon substrate 40a using the above, and then the LED chips 1a to 1d are mounted and the bonding wires 14 are connected. What is necessary is just to perform the 2nd joining process which joins the board | substrate 20 for LED mounting and the intermediate | middle layer board | substrate 30 which were connected by normal temperature joining method etc. FIG. In the normal temperature bonding method, the bonding surfaces are contacted with each other after the bonding surfaces are cleaned and activated by irradiating the bonding surfaces with argon plasma, ion beam or atomic beam in vacuum before bonding. And bond directly at room temperature.

  In the first bonding step, the bonding metal layer 48 of the silicon substrate 40a and the bonding metal layer 38 of the intermediate layer substrate 30 are bonded, and the conductor patterns 47a and 47b of the silicon substrate 40a and the intermediate layer substrate 30 are bonded. The conductor patterns 37 and 37 are joined and electrically connected. Here, since the joint portions of the conductor patterns 47a and 47b and the conductor patterns 37 and 37 are shifted from the region overlapping the through-hole wiring 34, the joint surfaces of the conductor patterns 47a and 47b and the conductor patterns 37 and 37 are mutually connected. The flatness of the substrate can be increased, the junction yield can be increased, and the junction reliability can be increased. In the second bonding step, the bonding metal layer 29 of the LED mounting substrate 20 and the bonding metal layer 36 of the intermediate layer substrate 30 are bonded, and the conductor patterns 25b and 25b of the LED mounting substrate 20 The conductor patterns 35 and 35 of the intermediate layer substrate 30 are joined and electrically connected. Here, since the joint portions of the conductor patterns 25b and 25b and the conductor patterns 35 and 35 are shifted from the region overlapping the through-hole wiring 24 and the region overlapping the through-hole wiring 34, the conductor patterns 25b and 25b and the conductor pattern 35 are arranged. , 35, the flatness of the mutual joint surfaces can be increased, the joint yield can be increased, and the joint reliability can be enhanced.

  Moreover, the above-mentioned translucent member 3 is formed using the translucent board | substrate which consists of translucent materials (for example, silicone, an acrylic resin, glass, etc.). Here, the translucent member 3 is formed in a rectangular plate shape having the same outer peripheral shape as the mounting substrate 2, and light emitted from the LED chips 1 a to 1 d on the light extraction surface opposite to the mounting substrate 2 side. A fine concavo-convex structure that suppresses total reflection is formed. Here, the fine concavo-convex structure formed on the light extraction surface of the translucent member 3 is formed such that many fine concave portions have a two-dimensional periodic structure. The fine concavo-convex structure described above may be formed using, for example, a laser processing technique, an etching technique, an imprint lithography technique, or the like.

  In manufacturing the light emitting device A described above, a silicon wafer capable of forming a large number of the LED mounting substrate 20, the intermediate layer substrate 30, and the light detection element forming substrate 40 is used as each of the silicon substrates 20a, 30a, and 40a. A wafer-like member (translucent wafer) on which a large number of translucent members 3 can be formed as the above-described translucent substrate, the above-described first bonding step, polishing step, second bonding step, light extraction The mounting substrate 2 after the window forming step, the second bonding step, the sealing portion forming step of forming the sealing portion 5 by filling the housing recess 2a of the mounting substrate 2 with the sealing resin, and the sealing portion forming step. The wafer level package structure is formed by performing each process such as a third bonding process for bonding the light transmitting member 3 and the translucent member 3 at the wafer level, and then divided into the size of the mounting substrate 2 by the dicing process. . Therefore, the LED mounting substrate 20, the intermediate layer substrate 30, the light detection element formation substrate 40, and the translucent member 3 have the same outer size, so that a small package B can be realized and manufacture is facilitated. In addition, the relative positional accuracy between the mirror 2d in the intermediate layer substrate 30 and the light detecting element 4 in the light detecting element forming substrate 40 can be improved, and the light emitted from the LED chips 1a to 1d to the side is mirror 2d. And is guided to the light detection elements 4 corresponding to the LED chips 1a to 1d.

  By the way, as described above, the light emitting device A is provided with the four light detecting elements 4 that individually detect the light emitted from the LED chips 1a to 1d of the respective emission colors on the light detecting element forming substrate 40. The interior surrounded by the LED mounting substrate 20 that is the base substrate portion and the wall portion 2b in order to correspond one-to-one with the four light detection elements 4 and the four LED chips 1a to 1d having different emission colors. A space (that is, an internal space of the housing recess 2a in the mounting substrate 2) is partitioned into housing spaces for the LED chips 1a to 1d of the respective emission colors, and two or more lights emitted from the LED chips 1a to 1d are emitted. A cross-shaped light-shielding portion 39 that prevents entry to the light-receiving surface of the light-detecting element 4 is formed continuously and integrally on the intermediate layer substrate 30. That is, in the light emitting device A according to the present embodiment, the opening window 31 of the intermediate layer substrate 30 is partitioned into four small spaces 31a by the light shielding portion 39, and the emission range of light emitted from each of the LED chips 1a to 1d. Is limited by the light shielding unit 39. Here, in this embodiment, the light shielding part 39 in the intermediate layer substrate 30 is formed simultaneously with the opening window 31 by anisotropic etching using an alkaline solution, and each side surface of the light shielding part 39 is within the opening window 31. Since it is a (111) surface like the side surface, each side surface of the light shielding portion 39 functions as a mirror that reflects light emitted from the LED chips 1a to 1d forward. In the light emitting device A of the present embodiment, the protruding height of the light shielding portion 39 from the LED mounting substrate 20 is lower than the protruding height of the wall portion 2b, and the front end surface of the light shielding portion 39 and the translucent member As a result, the dark portion due to the light shielding portion 39 can be prevented.

  In the LED lighting apparatus of the present embodiment described above, the light detection element 4 that detects light emitted from the LED chip 1 in the package B is provided in the package B in which the LED chip 1 is stored, and is held by the apparatus main body 110. A plurality of light emitting devices A and a control unit 160 that controls the light output of the LED chip 1 in the package B in which the light detection element 4 is provided based on the output of the light detection element 4. There is no need to provide a light guide member such as an optical fiber in the instrument main body 110 separately from the light emitting device A, and the LED chip 1 stores light emitted from the LED chip 1 regardless of the layout design of the light emitting device A. Can be detected stably and accurately by the light detecting element 4 provided in the package B, and the accuracy of the light color and color temperature of the mixed color light obtained as a whole instrument can be improved. Kill.

  Here, in the LED lighting apparatus of this embodiment, for each light emitting device A, a plurality of types of LED chips 1a to 1d having different emission colors are housed in one package B, and the LED chips 1a to 1d for each emission color are stored. Since a plurality of light detecting elements 4 for detecting light emitted from each of the light emitting devices A are provided in the package B, light emitted from a plurality of types of LED chips 1a to 1d having different emission colors in each light emitting device A is provided. Since it can be detected separately and the light color and color temperature of the mixed color light can be controlled for each light emitting device A, the degree of freedom in the layout design of the light emitting device A is increased.

(Embodiment 2)
The basic configuration of the LED lighting apparatus of the present embodiment is the same as that of the first embodiment. In the first embodiment, the light emitting device A includes a plurality of types of LED chips 1a to 1d having different emission colors, whereas FIG. As shown in FIG. 4, the light emitting device A includes only one LED chip 1, the light emitting device A (Aa) adopting a red LED chip as the LED chip 1, and the light emitting device adopting a green LED chip as the LED chip 1. A predetermined number of sets of A (Ab) and a light emitting device A (Ac) adopting a blue LED chip as the LED chip 1 are mounted on the circuit board 130, and the LED of each light emitting device A is mounted on the circuit board 130. A drive circuit unit (not shown) for driving the chip 1 and feedback control of the current flowing from the drive circuit unit to the LED chip 1 of each emission color based on the output of each light detection element 4 Such that the controller 160 is provided that is different. In addition, in the LED lighting fixture of this embodiment, the light-emitting devices Aa, Ab, and Ac are covered for each set of the light-emitting devices Aa, Ab, and Ac on one surface side of the circuit board 130 where the light-emitting devices A are mounted. A lens portion (not shown) made of a light material (eg, silicone, acrylic resin, etc.) is provided, and the lens portion is made of a material (eg, glass) having a refractive index different from that of the light transmissive material. By adding a large number of small spherical light diffusing materials, it is possible to obtain a desired mixed color light while reducing the thickness of the instrument body 110, but without adding each light scattering material to the lens portion. However, a desired color mixture light may be obtained by appropriately designing the shape of the lens portion. Since other configurations are the same as those of the first embodiment, illustration and description thereof are omitted. Further, the combination of the light emission colors of each of the plurality of light emitting devices Aa, Ab, and Ac may be appropriately selected according to the desired mixed color light, and the number of light emitting devices A forming the group is also limited to three. Instead, it may be a plurality.

  Hereinafter, the light emitting device A according to the present embodiment will be described with reference to FIGS. 10 to 18. However, the same components as those of the light emitting device A according to the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  The basic configuration of the light emitting device A in the present embodiment is substantially the same as that of the first embodiment, and the LED chip 1 that emits visible light (for example, red light, green light, blue light, etc.) and the LED chip 1 are accommodated. A mounting substrate 2 in which a housing recess 2a is formed on one surface and the LED chip 1 is mounted on the inner bottom surface of the housing recess 2a, and the mounting substrate 2 is closed on the one surface side of the mounting substrate 2 2, a translucent member 3 fixed to 2, a light detection element 4 provided on the mounting substrate 2 for detecting light emitted from the LED chip 1, and a translucency filled in the housing recess 2 a of the mounting substrate 2. And a sealing portion 5 that seals the LED chip 1 and the bonding wire 14 (see FIG. 11) connected to the LED chip 1.

  As shown in FIGS. 10 to 12, the mounting substrate 2 is disposed so as to be opposed to the rectangular plate-shaped LED mounting substrate 20 on which the LED chip 1 is mounted on one surface side and the one surface side of the LED mounting substrate 20. The circular light extraction window 41 and the light detection element forming substrate 40 on which the light detection element 4 is formed, and the light extraction window interposed between the LED mounting substrate 20 and the light detection element formation substrate 40. The space surrounded by the LED mounting substrate 20, the intermediate layer substrate 30, and the photodetecting element forming substrate 40 is configured by the intermediate layer substrate 30 in which the rectangular opening window 31 communicating with the terminal 41 is formed. The storage recess 2a is configured.

  As shown in FIGS. 13 and 14, the LED mounting substrate 20 is electrically connected to each of both electrodes of the LED chip 1 on one surface side (left surface side in FIG. 13C) of the silicon substrate 20 a. Two conductor patterns 25a and 25b are formed, and two conductor patterns 25b and 25b are electrically connected to the light detection element 4 through two through-hole wirings 34 and 34 formed in the intermediate layer substrate 30. The four external connection electrodes 27a, 27a, 27b, formed on the other surface side of the conductor patterns 25a, 25a, 25b, 25b and the silicon substrate 20a (the right side in FIG. 13C), 27b are electrically connected to each other through the through-hole wiring 24. The LED mounting substrate 20 is also formed with a bonding metal layer 29 for bonding to the intermediate layer substrate 30 on the one surface side of the silicon substrate 20a.

  As shown in FIGS. 15 and 16, the intermediate layer substrate 30 is bonded to the two conductor patterns 27b and 27b of the LED mounting substrate 20 on one surface side of the silicon substrate 30a (the right side in FIG. 15C). Thus, two conductive patterns 35 and 35 that are electrically connected are formed, and a bonding metal layer 36 that is bonded to the bonding metal layer 29 of the LED mounting substrate 20 is formed. In addition, the intermediate layer substrate 30 is a conductor pattern electrically connected to the conductor patterns 35 and 35 via the through-hole wirings 34 and 34 on the other surface side of the silicon substrate 30a (the left side in FIG. 15C). 37 and 37 are formed, and a bonding metal layer 38 for bonding to the light detection element forming substrate 40 is formed.

  As shown in FIGS. 17 and 18, the photodetecting element forming substrate 40 has two conductor patterns 37 and 37 on the intermediate layer substrate 30 on one surface side (right side in FIG. 17C) of the silicon substrate 40a. Two conductor patterns 47 a and 47 b that are bonded and electrically connected are formed, and a bonding metal layer 48 that is bonded to the bonding metal layer 38 of the intermediate layer substrate 30 is formed. In the photodetecting element forming substrate 40, the one conductor pattern 47a is electrically connected to the p-type region 43a of the photodiode constituting the photodetecting element 4 through the contact hole 43a formed in the insulating film 43. The other conductor pattern 47 b is electrically connected to the n-type region 4 b of the photodiode through a contact hole 43 b formed in the insulating film 43.

  As described in the first embodiment, the LED lighting fixture of the present embodiment described above is provided with the light detection element 4 that detects light emitted from the LED chip 1 in the package B in the package B that houses the LED chip 1. A plurality of light emitting devices A held by the instrument body 110, and a control unit 160 for controlling the light output of the LED chip 1 in the package B in which the light detection element 4 is provided based on the output of the light detection element 4. Therefore, it is not necessary to provide a light guide member such as an optical fiber in the instrument main body 110 separately from the light emitting device A, and the light emitted from the LED chip 1 can be emitted regardless of the layout design of the light emitting device A. The light detection element 4 provided in the package B in which the LED chip 1 is housed can be stably and accurately detected, and the accuracy of the light color and color temperature of the mixed color light obtained as the entire instrument. It can be improved.

  In the present embodiment, one LED chip 1 is mounted on the inner bottom surface of the housing recess 2a of the mounting substrate 2. However, the number of LED chips 1 is not particularly limited, and a plurality of light emission colors are the same. The LED chip 1 may be mounted on the inner bottom surface of the storage recess 2a. In the present embodiment, the lens portion is provided on the one surface side of the circuit board 130. However, the lens portion may be provided integrally with the light-transmitting cover 140 instead of the circuit board 130, or a set. The lens portion may be eliminated by arranging a plurality of light emitting devices A closer to each other, or the lens portion may be eliminated by forming the translucent member 30 of the light emitting device A into a lens shape. Good.

  By the way, in each said embodiment, although the control part 160 is provided separately from the light-emitting device A, if the control part 160 is integrated and provided in the package B of each light-emitting device A, each light-emitting device A and In addition, since it is not necessary to provide the controller 160 separately, the layout design of each light emitting device A on the circuit board 130 or the like is facilitated.

Embodiment 1 is shown, (a) is a schematic front view partly broken, and (b) is a schematic sectional view of a light emitting device. It is a schematic bottom view which shows the same as the above. It is a general | schematic disassembled perspective view of the light-emitting device same as the above. It is a principal part schematic plan view of the light-emitting device same as the above. It is a schematic bottom view of the optical detection element formation board | substrate in the same as the above. It is a schematic perspective view of the instrument main body in the same as the above. The translucent cover in the same as above is shown, (a) is a plan view and (b) is a sectional view. The decorative cover in the above is shown, (a) is a plan view, (b) is a cross-sectional view taken along line X-X 'of (a). It is a perspective view of the decorative cover in the same as the above. Embodiment 2 is shown, (a) is a principal part schematic perspective view, (b) is a schematic sectional drawing of a light-emitting device. It is a general | schematic disassembled perspective view of the light-emitting device same as the above. The mounting board of the light-emitting device in the same as above is shown, (a) is a schematic plan view, (b) is an XX ′ schematic cross-sectional view of (a), and (c) is a YY ′ schematic cross-sectional view of (a). is there. The LED mounting board | substrate of the light-emitting device in the same as the above is shown, (a) is a schematic plan view, (b) is an XX 'schematic cross-sectional view of (a), and (c) is a YY' schematic cross-sectional view of (a). FIG. It is a schematic bottom view of the board | substrate for LED mounting of the light-emitting device in the same as the above. The intermediate | middle layer board | substrate of the light-emitting device in the same as the above is shown, (a) is a schematic plan view, (b) is an XX 'schematic cross-sectional view of (a), (c) is a YY' schematic cross-sectional view of (a). It is. It is a schematic bottom view of the intermediate | middle layer board | substrate of the light-emitting device in the same as the above. The light detection element formation board | substrate of the light-emitting device same as the above is shown, (a) is a schematic plan view, (b) is XX 'schematic sectional drawing of (a), (c) is YY' schematic of (a). It is sectional drawing. It is a schematic bottom view of the light detection element formation board | substrate of the light-emitting device same as the above.

Explanation of symbols

A Light-emitting device B Package 1 LED chip 4 Photodetecting element 110 Instrument body 130 Circuit board 160 Control unit

Claims (3)

  An LED lighting apparatus that uses a plurality of types of LED chips having different emission colors to obtain desired mixed color light, and the light emitted from the LED chips in the apparatus main body and a package containing the LED chips. A plurality of light emitting devices that are provided with a light detection element for detecting light and are held by the instrument body, and a control for controlling the light output of the LED chip in the package in which the light detection element is provided based on the output of the light detection element The LED lighting fixture characterized by comprising a part.   In the light emitting device, a plurality of types of LED chips having different emission colors are housed in a package, and a plurality of light detection elements for detecting light emitted from the LED chips of each emission color are provided in the package. The LED lighting apparatus according to claim 1. The LED lighting apparatus according to claim 1, wherein the control unit is provided in a package of each light emitting device.

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