CN211083706U - SMD L ED lamp strip of astigmatic type - Google Patents
SMD L ED lamp strip of astigmatic type Download PDFInfo
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- CN211083706U CN211083706U CN201921666695.1U CN201921666695U CN211083706U CN 211083706 U CN211083706 U CN 211083706U CN 201921666695 U CN201921666695 U CN 201921666695U CN 211083706 U CN211083706 U CN 211083706U
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Abstract
The utility model discloses a SMD L ED lamp strip of astigmatism type this L ED lamp pearl includes the PCB board, be equipped with at least one joint groove on the PCB board, L ED lamp pearl body to and insulating baffle that separates, insulating baffle setting that separates is in on the terminal surface under the L ED lamp pearl body, cooperate with PCB integrated circuit board connect groove for separate shelves tin cream, avoid L ED lamp pearl body short circuit adopt above-mentioned scheme, not only simple to operate, and the heat dissipation is fast, has improved the life of lamp pearl greatly, simultaneously, adopts insulating baffle that separates, has avoided the tin cream to climb the problem that causes the short circuit greatly.
Description
Technical Field
The utility model relates to an L ED field especially relates to a SMD L ED lamp strip of astigmatism type.
Background
L ED is English (light emitting diode), L ED lamp bead is the abbreviation L ED for light emitting diode, which is a popular name.
The working principle is as follows: the terminal voltage of the PN junction forms a certain potential barrier, when a forward bias voltage is applied, the potential barrier is lowered, and most carriers in the P region and the N region diffuse to each other. Since electron mobility is much greater than hole mobility, a large number of electrons will diffuse into the P region, constituting an injection of minority carriers into the P region. These electrons recombine with holes in the valence band and the energy obtained upon recombination is released as light energy. This is the principle of PN junction luminescence.
SMD L ED lamp strip of scattered light type on the present market, general radiating effect is relatively poor, and seventy percent above electric energy has changed into heat energy, if these heat energy can not be quick the effluvium, can seriously influence L ED lamp pearl life-span.
Meanwhile, L ED lamp pearl is when with PCB board welded fastening, because L ED lamp pearl is less, and some tin volume is great, the tin cream is climbing very easily, causes the problem of short circuit at last.
Therefore, there is a need in the market for a light diffusing patch L ED light bar that can solve one or more of the above problems.
SUMMERY OF THE UTILITY MODEL
For solving one or more problems that exist among the prior art, the utility model provides a SMD L ED lamp strip of astigmatism type.
The utility model discloses a SMD L ED lamp strip of astigmatism type, SMD L ED lamp strip of astigmatism type includes:
the PCB board is provided with at least one clamping groove;
l ED lamp bead body, and
the insulating baffle that separates, it sets up to insulate to separate the baffle on L ED lamp pearl body lower extreme face, cooperate with PCB integrated circuit board connecting groove for separate shelves tin cream, avoid L ED lamp pearl body short circuit.
In some embodiments, the L ED lamp bead body includes:
the high-heat-conductivity ceramic base is provided with at least one clamping groove;
the reflecting cup is provided with a bowl-shaped reflecting cavity and two guide plates matched with the high-heat-conductivity ceramic base;
the positive and negative pins are integrally formed on the reflection cup, one end of each positive and negative pin extends into the reflection cavity, and the other end of each positive and negative pin extends to the position below the high-thermal-conductivity ceramic base along the guide plate;
the light-emitting chip is arranged on the high-heat-conductivity ceramic base and is electrically connected with the positive and negative pins; and
the fluorescent glue is encapsulated in the reflection cavity and encapsulates the light-emitting chip;
when the reflection cup is matched with the high-heat-conductivity ceramic base, the positive and negative pins are matched with the clamping grooves and used for limiting the relative motion between the high-heat-conductivity ceramic base and the reflection cup.
In some embodiments, at least one side of the ceramic base with high thermal conductivity is provided with heat dissipation fins for dissipating heat.
In some embodiments, the positive and negative electrode pins comprise:
the first pin is matched with the upper surface of the high-heat-conductivity ceramic base;
the second pin is matched with the side surface of the high-heat-conductivity ceramic base;
the third pin is matched with the bottom surface of the high-heat-conductivity ceramic base; and
and the fourth pin is connected with the third pin, the upper end surface of the fourth pin is matched with the bottom surface of the high-heat-conductivity ceramic base, and the bottom surface of the fourth pin is flush with the bottom surface of the guide plate.
In some embodiments, the number of the clamping grooves is two, and the two clamping grooves are respectively matched with the positive and negative pins.
In some embodiments, after the positive and negative pins are matched with the clamping grooves, the upper end surfaces of the first pins are flush with the upper surface of the high-thermal-conductivity ceramic base.
In some embodiments, the sides of the positive and negative pins are provided with an oblique opening for facilitating the fitting of the reflection cup on the high thermal conductivity ceramic base.
In some embodiments, the reflective chamber interior surface is provided with a high reflectivity coating.
The utility model has the advantages that: the utility model comprises a high heat-conducting ceramic base, wherein at least one clamping groove is arranged on the high heat-conducting ceramic base; the reflecting cup is provided with a bowl-shaped reflecting cavity and two guide plates matched with the high-heat-conductivity ceramic base; the positive and negative pins are integrally formed on the reflection cup, one end of each positive and negative pin extends into the reflection cavity, and the other end of each positive and negative pin extends to the position below the high-thermal-conductivity ceramic base along the guide plate; the light-emitting chip is arranged on the high-heat-conductivity ceramic base and is electrically connected with the positive and negative pins; by adopting the scheme, the lamp bead has the advantages of being convenient to install, fast in heat dissipation, and capable of greatly prolonging the service life of the lamp bead, and meanwhile, the insulating baffle is adopted, so that the problem of short circuit caused by climbing of solder paste is greatly avoided.
Drawings
Fig. 1 is a schematic structural view of a light-scattering type patch L ED lamp bead with a light-emitting chip and fluorescent glue omitted in the preferred embodiment of the present invention;
fig. 2 is a cross-sectional view taken along the direction a-a in fig. 1 of a light-scattering type patch L ED lamp bead according to a preferred embodiment of the present invention;
fig. 3 is an exploded view of a light-emitting chip and fluorescent glue omitted from a light-scattering type patch L ED lamp bead according to a preferred embodiment of the present invention;
fig. 4 is a schematic view of an assembly structure of a reflection cup and positive and negative electrode pins in a light-scattering type patch L ED lamp bead according to a preferred embodiment of the present invention;
fig. 5 is a schematic structural view of a patch type L ED light bar according to a preferred embodiment of the present invention;
fig. 6 is a cross-sectional view of a portion a-B of the patch L ED light bar of fig. 5 according to a preferred embodiment of the present invention.
Detailed Description
In order to make the above objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
Referring to fig. 1-6, the utility model discloses a SMD L ED lamp strip of astigmatic type, SMD L ED lamp strip of astigmatic type includes:
the PCB 40 is provided with at least one clamping groove 41;
l ED lamp bead body, and
insulating baffle 13 that separates, insulating baffle 13 that separates sets up on L ED lamp pearl body lower extreme face, cooperate with 40 joint grooves 41 of PCB board for separate shelves tin cream, avoid L ED lamp pearl body short circuit.
L ED lamp pearl body includes:
the high-heat-conductivity ceramic base 10 is provided with at least one clamping groove 11;
the reflecting cup 20 is provided with a bowl-shaped reflecting chamber 21, and the reflecting cup 20 is provided with two guide plates 22 matched with the high-thermal-conductivity ceramic base 10;
the positive and negative pins 30 are integrally formed on the reflection cup 20, one end of each positive and negative pin 30 extends into the reflection chamber 21, and the other end of each positive and negative pin 30 extends to the lower part of the high-thermal-conductivity ceramic base 10 along the guide plate 22;
a light emitting chip (not shown) disposed on the high thermal conductivity ceramic base 10 and electrically connected to the positive and negative leads 30; and
fluorescent glue (not shown) which is encapsulated in the reflection chamber 21 to encapsulate the light emitting chip;
when the reflection cup 20 is matched with the high thermal conductivity ceramic base 10, the positive and negative electrode pins 30 are matched with the clamping grooves 11 to limit the relative movement between the high thermal conductivity ceramic base 10 and the reflection cup 20.
Specifically, in the installation of this embodiment, after the guide block is matched with the high thermal conductivity ceramic base 10, a thrust is applied to the guide block, the whole reflection cup 20 is matched with the high thermal conductivity ceramic base 10, and finally, the positive and negative electrode pins 30 are clamped and fixed with the clamping groove 11, so as to complete the installation of the two.
After the mounting is completed, die bonding is performed on the light emitting chip (not shown in the figure) on the high thermal conductivity ceramic base 10, it should be noted that the light emitting chip (not shown in the figure) and the high thermal conductivity ceramic base 10 are connected by using thermal conductive silicone grease, which is convenient for heat transfer, and after the fixing is completed, the positive and negative electrodes of the light emitting chip (not shown in the figure) are connected with the positive and negative electrode pins 30 by using gold wires, so as to implement circuit connection of the whole diode.
Finally, fluorescent glue is filled and sealed in the reflection chamber 21 of the reflection cup 20, and a light emitting chip (not shown in the figure) is packaged by the fluorescent glue, so that the whole diode is packaged.
This structure, simple to operate not only, simultaneously, the high heat conduction ceramic substrate 10 that is connected with light-emitting chip (not marked in the figure) can take away the heat fast for the heat dissipation of whole lamp pearl has improved L ED lamp pearl's heat dissipation level greatly, improves its life.
In this embodiment, high heat conduction ceramic substrate 10 bottom still is equipped with an insulation and separates baffle 13, be equipped with on the PCB board 40 with insulation and separate baffle 13 matched with joint groove 41, during the assembly, solder joint point tin cream on the PCB board earlier, then place L ED lamp pearl on PCB board 40, separate baffle 13 with insulation and insert joint groove 41 in, at this moment, even the phenomenon that climbs appears in the tin cream, also hardly cross the insulation and separate the problem that baffle 13 appears breaking, this mode, the problem of short circuit appears in L ED lamp pearl rewelding in-process has been avoided greatly.
In some embodiments, at least one side of the ceramic base 10 is provided with heat dissipation fins 12 for dissipating heat.
Specifically, the design of the heat dissipation fins 12 increases the contact surface between the ceramic base 10 with high thermal conductivity and the air, thereby further accelerating the heat dissipation.
In some embodiments, the positive and negative electrode pins 30 include:
the first pins 31 are matched with the upper surface of the high-thermal-conductivity ceramic base 10;
the second pins 32 are matched with the side surfaces of the high-thermal-conductivity ceramic base 10;
the third pin 33 is matched with the bottom surface of the high-thermal-conductivity ceramic base 10; and
and the fourth pin 34, the fourth pin 34 is connected with the third pin 33, the upper end surface of the fourth pin 34 is matched with the bottom surface of the high thermal conductivity ceramic base 10, and the bottom surface of the fourth pin 34 is flush with the bottom surface of the guide plate 22.
Specifically, the fourth pin 34 is designed such that the entire positive and negative electrode pins 30 are flush with the bottom surface of the guide plate 22 after the installation, which is convenient for installation and welding.
In some embodiments, two of the clamping grooves 11 are respectively matched with the positive and negative pins 30.
In some embodiments, after the positive and negative pins 30 are fitted in the clamping grooves 11, the upper end surfaces of the first pins 31 are flush with the upper surface of the high thermal conductivity ceramic base 10.
In some embodiments, the sides of the positive and negative leads 30 are provided with a bevel 35 for facilitating the assembly of the reflector cup 20 to the ceramic submount 10.
Specifically, in the present embodiment, the bevel 35 is further designed on the side edges of the positive and negative pins 30, and the bevel 35 is designed such that when the reflective cup 20 is mounted on the high thermal conductivity ceramic base 10, since the gap between the guide plates 22 is equal to the thickness of the high thermal conductivity ceramic base 10, after the positive and negative pins 30 are designed, the gap between the two positive and negative pins 30 is smaller than the high thermal conductivity ceramic base 10, which results in that the reflective cup 20 is difficult to be mounted on the high thermal conductivity ceramic base 10, but the reflective cup can be smoothly mounted on the high thermal conductivity ceramic base 10 through the bevel 35, and finally is matched with the clamping groove 11 to be fixed.
In some embodiments, the inner surface of the reflective chamber 21 is provided with a high reflectivity coating.
To sum up, the utility model comprises a high thermal conductivity ceramic base 10, wherein at least one clamping groove 11 is arranged on the high thermal conductivity ceramic base 10; the reflecting cup 20 is provided with a bowl-shaped reflecting chamber 21, and the reflecting cup 20 is provided with two guide plates 22 matched with the high-thermal-conductivity ceramic base 10; the positive and negative pins 30 are integrally formed on the reflection cup 20, one end of each positive and negative pin 30 extends into the reflection chamber 21, and the other end of each positive and negative pin 30 extends to the lower part of the high-thermal-conductivity ceramic base 10 along the guide plate 22; the light-emitting chip (not shown) is arranged on the high-thermal-conductivity ceramic base 10 and is electrically connected with the positive and negative electrode pins 30; by adopting the scheme, the lamp bead is convenient to install, fast in heat dissipation and greatly prolonged in service life.
The above-mentioned embodiments only express two embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (8)
1. The utility model provides a SMD L ED lamp strip of astigmatic type, its characterized in that, the SMD L ED lamp strip of astigmatic type includes:
the PCB board is provided with at least one clamping groove;
l ED lamp bead body, and
the insulating baffle that separates, it sets up to insulate to separate the baffle on L ED lamp pearl body lower extreme face, cooperate with PCB integrated circuit board connecting groove for separate shelves tin cream, avoid L ED lamp pearl body short circuit.
2. The light-diffusing patch L ED light bar of claim 1, wherein the L ED light bead body comprises:
the high-heat-conductivity ceramic base is provided with at least one clamping groove;
the reflecting cup is provided with a bowl-shaped reflecting cavity and two guide plates matched with the high-heat-conductivity ceramic base;
the positive and negative pins are integrally formed on the reflection cup, one end of each positive and negative pin extends into the reflection cavity, and the other end of each positive and negative pin extends to the position below the high-thermal-conductivity ceramic base along the guide plate;
the light-emitting chip is arranged on the high-heat-conductivity ceramic base and is electrically connected with the positive and negative pins; and
the fluorescent glue is encapsulated in the reflection cavity and encapsulates the light-emitting chip;
when the reflection cup is matched with the high-heat-conductivity ceramic base, the positive and negative pins are matched with the clamping grooves and used for limiting the relative motion between the high-heat-conductivity ceramic base and the reflection cup.
3. The light diffusing patch L ED light bar of claim 2, wherein at least one side of the ceramic base has heat dissipating fins for dissipating heat.
4. The light diffusing patch L ED light bar of claim 2, wherein the positive and negative leads comprise:
the first pin is matched with the upper surface of the high-heat-conductivity ceramic base;
the second pin is matched with the side surface of the high-heat-conductivity ceramic base;
the third pin is matched with the bottom surface of the high-heat-conductivity ceramic base; and
and the fourth pin is connected with the third pin, the upper end surface of the fourth pin is matched with the bottom surface of the high-heat-conductivity ceramic base, and the bottom surface of the fourth pin is flush with the bottom surface of the guide plate.
5. The light-diffusing patch L ED light bar of claim 4, wherein the number of the snap grooves is two, and the two snap grooves are respectively matched with the positive and negative pins.
6. The light-diffusing patch L ED light bar according to claim 5, wherein after the positive and negative leads are fitted in the clip grooves, the upper end surfaces of the first leads are flush with the upper surface of the high thermal conductivity ceramic base.
7. The light-diffusing patch-type L ED light bar of claim 2, wherein the side edges of the positive and negative leads have a bevel for fitting the reflector cup onto the ceramic base.
8. The light diffusing patch L ED light bar of claim 2, wherein the reflective chamber has a high reflectivity coating on its inner surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921666695.1U CN211083706U (en) | 2019-10-08 | 2019-10-08 | SMD L ED lamp strip of astigmatic type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921666695.1U CN211083706U (en) | 2019-10-08 | 2019-10-08 | SMD L ED lamp strip of astigmatic type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211083706U true CN211083706U (en) | 2020-07-24 |
Family
ID=71627658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921666695.1U Active CN211083706U (en) | 2019-10-08 | 2019-10-08 | SMD L ED lamp strip of astigmatic type |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211083706U (en) |
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2019
- 2019-10-08 CN CN201921666695.1U patent/CN211083706U/en active Active
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | "change of name, title or address" | ||
| CP03 | "change of name, title or address" |
Address after: No.6, Jinhe Xinguang Road, Zhangmutou town, Dongguan City, Guangdong Province 523000 Patentee after: Yonglin Electronics Co., Ltd Address before: 523000 No. three Xinguang Road, Jinhe Industrial Zone, Zhangmutou town, Guangdong, Dongguan, 3 Patentee before: Y.LIN ELECTRONICS Co.,Ltd. |