JP4492486B2 - Lighting equipment using LED - Google Patents

Lighting equipment using LED Download PDF

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JP4492486B2
JP4492486B2 JP2005243091A JP2005243091A JP4492486B2 JP 4492486 B2 JP4492486 B2 JP 4492486B2 JP 2005243091 A JP2005243091 A JP 2005243091A JP 2005243091 A JP2005243091 A JP 2005243091A JP 4492486 B2 JP4492486 B2 JP 4492486B2
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led
mounting
mounting substrate
main surface
center
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JP2007059207A (en
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健一郎 田中
洋二 浦野
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Panasonic Corp
Panasonic Electric Works Co Ltd
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Panasonic Corp
Matsushita Electric Works Ltd
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
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Description

本発明は、ＬＥＤを用いた照明器具に関するものである。   The present invention relates to a lighting fixture using LEDs.

近年、白色ＬＥＤの高出力化に伴って、光源として白色ＬＥＤを用いた照明器具の開発が進められている（例えば特許文献１参照）。   In recent years, with the increase in output of white LEDs, development of luminaires using white LEDs as light sources has been promoted (see, for example, Patent Document 1).

この種の照明器具では、所望の光出力を得るために複数個のＬＥＤを用いており、図７に示すように被照射面の明るさを均一にするために、円板状のプリント配線板３０の表面に、プリント配線板３０の中心位置を中心とする複数の同心円周上に同一ピッチ角で複数個のＬＥＤ３１を配置している。
実開平３−１１２８１８号公報 In this type of lighting fixture, a plurality of LEDs are used to obtain a desired light output, and in order to make the brightness of the irradiated surface uniform as shown in FIG. On the surface of 30, a plurality of LEDs 31 are arranged at the same pitch angle on a plurality of concentric circles centered on the center position of the printed wiring board 30.
Japanese Utility Model Publication No. 3-112818

上記構成の照明器具では、高出力のＬＥＤ３１を用いているため、ＬＥＤ３１への投入電力が大きく、そのためＬＥＤ３１の発熱が増大していた。ここで、明るさを均一にするために、図７に示すように複数のＬＥＤ３１を略一定の間隔でプリント配線板３０に配置した場合、空気層に熱が逃げやすい周辺部に比べて、中央部は周りに配置された他のＬＥＤ３１の温度の影響を受けて温度が上昇しやすく、その結果中央部に配置されたＬＥＤ３１の発光効率が低下して、輝度むらが発生するという問題があった。   In the lighting fixture having the above-described configuration, since the high-power LED 31 is used, the input power to the LED 31 is large, and thus the heat generation of the LED 31 is increased. Here, in order to make the brightness uniform, when a plurality of LEDs 31 are arranged on the printed wiring board 30 at substantially constant intervals as shown in FIG. The part is easily affected by the temperature of the other LEDs 31 arranged around it, and as a result, the luminous efficiency of the LED 31 arranged in the central part is lowered, resulting in uneven brightness. .

このような問題を解決するために、特許文献１に示される照明器具では、ＬＥＤが実装されるプリント配線板を複数枚に分割し、複数枚のプリント配線板の間に隙間が形成されるように、複数枚のプリント配線板を厚み方向において位置をずらして配置しており、プリント配線板の間の隙間を通して空気を対流させることで、中央部に配置されたＬＥＤの温度上昇を抑制しているが、プリント配線板の枚数が増えるために、組立作業の作業性が悪化するという問題があった。   In order to solve such a problem, in the lighting apparatus shown in Patent Document 1, the printed wiring board on which the LED is mounted is divided into a plurality of sheets, and a gap is formed between the plurality of printed wiring boards. A plurality of printed wiring boards are arranged at different positions in the thickness direction, and air is convected through the gaps between the printed wiring boards to suppress the temperature rise of the LED placed in the center. Since the number of wiring boards increases, there is a problem that workability of assembly work is deteriorated.

本発明は上記問題点に鑑みて為されたものであり、その目的とするところは、組立作業が簡単で、輝度の均一な照明光が得られるＬＥＤを用いた照明器具を提供することにある。   The present invention has been made in view of the above problems, and an object of the present invention is to provide an illuminating device using an LED that is easy to assemble and obtains illumination light with uniform brightness. .

上記目的を達成するために、請求項１の発明は、複数のＬＥＤと、一方の主表面に複数のＬＥＤが均一に配置される取付基板と、取付基板における他方の主表面に取着された放熱器とを備え、取付基板における一方の主表面は平板形状に形成されるとともに、取付基板における他方の主表面は、ＬＥＤの取付範囲における中央部から周辺部へ行くほど厚み寸法が厚くなるような凹曲面に形成され、放熱器における取付基板側の表面は、取付基板の他方の主表面に面接触する凸曲面に形成され、放熱器における他方の表面は、中央部に行くほど突出量が大きくなるような凸曲面に形成されたことを特徴とする。 To achieve the above object, the invention of claim 1 is attached to a plurality of LEDs , a mounting board in which a plurality of LEDs are uniformly arranged on one main surface, and the other main surface of the mounting board. and a radiator, with one main surface of the mounting substrate is formed into a flat plate shape, the other major surface of the mounting substrate, so that the thickness as goes from the central portion in the attachment area of the LED to the peripheral portion becomes thick The surface on the mounting board side of the radiator is formed in a convex curved surface that is in surface contact with the other main surface of the mounting board, and the other surface of the radiator has a protruding amount toward the center. It is characterized by being formed in a convex curved surface that becomes larger .

請求項２の発明は、請求項１の発明において、取付基板は、ＬＥＤの取付範囲における中央部の材料を、周辺部の材料に比べて、放熱性又は輻射性の内少なくとも何れか一方が高い材料としたことを特徴とする。 According to a second aspect of the present invention, in the first aspect of the present invention, the mounting substrate is higher in at least one of heat dissipation and radiation than the material of the central portion in the LED mounting range than the material of the peripheral portion. It is characterized by the material.

請求項１の発明によれば、取付基板は、ＬＥＤの取付範囲における中央部の熱容量が、周辺部の熱容量に比べて小さくなるので、取付範囲の中央部に配置されたＬＥＤの発熱が、取付基板の他方の主表面に伝導しやすくなり、その結果中央部のＬＥＤの発熱を放熱しやすくなるから、取付範囲における中央部と周辺部との温度差が小さくなり、中央部に配置されたＬＥＤの発光効率の低下を抑制して、輝度が均一な照明光が得られる。しかも、取付基板自体が、ＬＥＤの取付範囲における中央部の放熱性を周辺部の放熱性よりも高くなるように形成されているので、取付基板を複数枚の基板に分割した場合に比べて、部品点数が少なくなり、組立の手間を簡単にできる。 According to the invention of claim 1, since the heat capacity of the central part in the attachment range of the LED is smaller than the heat capacity of the peripheral part, the heat generation of the LED arranged in the central part of the attachment range is attached to the attachment substrate. It becomes easy to conduct to the other main surface of the substrate, and as a result, it is easy to dissipate the heat generated by the LED in the center, so the temperature difference between the center and the periphery in the mounting range is reduced, and the LED arranged in the center In this way, illumination light with uniform brightness can be obtained. Moreover, since the mounting substrate itself is formed so that the heat dissipation of the central portion in the LED mounting range is higher than the heat dissipation of the peripheral portion, compared to the case where the mounting substrate is divided into a plurality of substrates, The number of parts is reduced and the assembly work can be simplified .

請求項２の発明によれば、取付範囲の中央部に配置されたＬＥＤの発熱を放熱しやすくなるから、取付範囲における中央部に配置されたＬＥＤと周辺部に配置されたＬＥＤとの温度差が小さくなり、中央部に配置されたＬＥＤの発光効率の低下を抑制して、輝度が均一な照明光を得ることができる。 According to the invention of claim 2 , since it becomes easy to dissipate the heat generated by the LED arranged in the central part of the attachment range, the temperature difference between the LED arranged in the central part and the LED arranged in the peripheral part in the attachment range. Is reduced, and it is possible to obtain illumination light with uniform brightness by suppressing a decrease in light emission efficiency of the LED disposed in the central portion.

以下に本発明の実施の形態を図面に基づいて説明する。   Embodiments of the present invention will be described below with reference to the drawings.

（基本構成）
本発明の基本構成を図１〜図４に基づいて説明する。この照明器具は、複数のＬＥＤモジュール１と、複数のＬＥＤモジュール１が配置される取付基板２とを備え、図示しない電源装置から各ＬＥＤモジュール１に直流電源が供給されて、各ＬＥＤモジュール１が発光するようになっている。 (Basic configuration)
The basic configuration of the present invention will be described with reference to FIGS. This luminaire includes a plurality of LED modules 1 and a mounting substrate 2 on which the plurality of LED modules 1 are arranged, and direct current power is supplied to each LED module 1 from a power supply device (not shown). It emits light.

各ＬＥＤモジュール１は、図３に示すように、矩形板状のＬＥＤチップ１０と、導電材料により略Ｔ形に形成され、幅広部１１ａにＬＥＤチップ１０が搭載されたチップ搭載部材１１と、導電材料により略Ｔ形に形成され、幅広部１２ａがチップ搭載部材１１の幅広部１１ａに離間して配置された端子板１２と、ＬＥＤチップ１０を囲むように配置されＬＥＤチップ１０の側面から放射された光をＬＥＤチップ１０の前方（図１中の左側）に放射させるリフレクタ１３と、透光性を有する合成樹脂によりドーム形に形成されＬＥＤチップ１０を覆うようにしてリフレクタ１３の前方に配置される保護カバー１４とを備えている。ここで、リフレクタ１３は、絶縁性を有するシート状の接着フィルムからなる固着材１７を介してチップ搭載部材１１および端子板１２に取着されており、固着材１７の中央にはＬＥＤチップ１０を露出させる丸孔１７ａが貫設されている。   As shown in FIG. 3, each LED module 1 includes a rectangular plate-shaped LED chip 10, a chip mounting member 11 that is formed in a substantially T shape with a conductive material, and the LED chip 10 is mounted on the wide portion 11 a, and a conductive material. It is formed in a substantially T shape with a material, and the wide portion 12a is disposed so as to surround the LED chip 10 and the terminal plate 12 disposed so as to be separated from the wide portion 11a of the chip mounting member 11, and is emitted from the side surface of the LED chip 10. A reflector 13 that radiates the emitted light to the front of the LED chip 10 (left side in FIG. 1) and a dome-shaped reflector made of light-transmitting synthetic resin is disposed in front of the reflector 13 so as to cover the LED chip 10. And a protective cover 14. Here, the reflector 13 is attached to the chip mounting member 11 and the terminal plate 12 via a fixing material 17 made of an insulating sheet-like adhesive film, and the LED chip 10 is placed at the center of the fixing material 17. A round hole 17a to be exposed is provided.

チップ搭載部材１１および端子板１２は金属板（例えば銅板など）からなるリードフレームを用いて形成され、絶縁性を有する合成樹脂により矩形枠状に成形された保持枠１５に同時一体に成形されている。チップ搭載部材１１および端子板１２の幅広部１１ａ，１２ａは保持枠１５の内側に配置され、保持枠１５の外側に突出するチップ搭載部材１１および端子板１２の部位がそれぞれ外部接続端子１１ｂ，１２ｂとなる。また、チップ搭載部材１１および端子板１２と取付基板２との間にはグリーンシートからなる絶縁シート１６が介在しており、チップ搭載部材１１および端子板１２と取付基板２との間を電気的に絶縁するとともに、熱的に結合している。尚、絶縁シート１６はグリーンシートのようなシート状に成形したセラミックの未燒結体に限らず、例えば熱硬化性の固着材（例えばエポキシ樹脂など）を用いても良い。   The chip mounting member 11 and the terminal plate 12 are formed by using a lead frame made of a metal plate (for example, a copper plate), and are simultaneously and integrally formed on a holding frame 15 formed into a rectangular frame shape by an insulating synthetic resin. Yes. The wide portions 11a and 12a of the chip mounting member 11 and the terminal plate 12 are arranged inside the holding frame 15, and the portions of the chip mounting member 11 and the terminal plate 12 that protrude outside the holding frame 15 are external connection terminals 11b and 12b, respectively. It becomes. Further, an insulating sheet 16 made of a green sheet is interposed between the chip mounting member 11 and the terminal plate 12 and the mounting substrate 2, and the chip mounting member 11 and the terminal plate 12 and the mounting substrate 2 are electrically connected. Insulated and thermally coupled. The insulating sheet 16 is not limited to a ceramic unsintered body formed into a sheet shape such as a green sheet. For example, a thermosetting fixing material (such as an epoxy resin) may be used.

ＬＥＤチップ１０は一表面側にアノード電極が形成されるとともに、他表面側にカソード電極が形成されており、アノード電極又はカソード電極の内の一方の電極が導電性のサブマウント部材１８を介してチップ搭載部材１１の幅広部１１ａに電気的に接続され、他方の電極が金属細線（例えば金細線、アルミニウム細線など）からなるボンディングワイヤ１９を介して端子板１２の幅広部１２ａに電気的に接続されている。   The LED chip 10 has an anode electrode formed on one surface side and a cathode electrode formed on the other surface side, and one of the anode electrode and the cathode electrode is connected via a conductive submount member 18. It is electrically connected to the wide portion 11a of the chip mounting member 11, and the other electrode is electrically connected to the wide portion 12a of the terminal plate 12 via a bonding wire 19 made of a fine metal wire (for example, a gold fine wire, an aluminum fine wire, etc.). Has been.

取付基板２は、例えばアルミニウムや銅などの熱伝導率が高い金属により略円板形に形成されている。取付基板２の一方の主表面２ａには、取付基板２の中心点を中心とする複数の同心円周上に同一ピッチ角で複数個のＬＥＤモジュール１が取着され、各ＬＥＤモジュール１の間は図示しないリード線を介して直列に接続され、電源回路から電力が供給されて点灯するようになっている。尚、上述の照明器具では複数個のＬＥＤモジュール１を直列接続しているが、複数個のＬＥＤモジュール１の接続関係は直列接続に限定されるものではなく、複数個のＬＥＤモジュール１を並列接続しても良いし、直列接続と並列接続とを組み合わせても良い。また複数個のＬＥＤモジュール１の配置は図２の配置に限定されるものではなく、照明器具の使用用途などに合わせて適宜配置を設定すれば良い。 The mounting substrate 2 is formed in a substantially disk shape with a metal having high thermal conductivity such as aluminum or copper. A plurality of LED modules 1 are attached to one main surface 2a of the mounting substrate 2 at the same pitch angle on a plurality of concentric circles centered on the center point of the mounting substrate 2. They are connected in series via a lead wire (not shown), and are lit when power is supplied from the power supply circuit. In the lighting fixture described above, a plurality of LED modules 1 are connected in series. However, the connection relationship of the plurality of LED modules 1 is not limited to the series connection, and the plurality of LED modules 1 are connected in parallel. Alternatively, a series connection and a parallel connection may be combined. Further, the arrangement of the plurality of LED modules 1 is not limited to the arrangement shown in FIG. 2, and the arrangement may be appropriately set in accordance with the usage application of the lighting fixture.

一方、取付基板２の他方の主表面２ｂは、図１に示すように取付基板２の中心位置から外周部へ行くほど厚み寸法が厚くなるような凹曲面に形成されており、取付基板２の熱容量は中央部から周辺部に行くほど小さくなっている。ここで、取付基板２の一方の主表面２ａには複数個のＬＥＤモジュール１を均一に配置しており、ＬＥＤモジュール１の取付範囲において中央部に配置されたＬＥＤモジュール１は、他のＬＥＤモジュール１によって周りを囲まれているため放熱性が悪く、中央部のＬＥＤモジュール１の温度上昇が、周辺部のＬＥＤモジュール１の温度上昇に比べて大きくなるが、取付基板２の熱容量を中央部から周辺部へ行くほど小さくしているので、主表面２ａの中央部に配置されたＬＥＤモジュール１の発熱は、周辺部に配置されたＬＥＤモジュール１に比べて効率良く反対側の主表面２ｂに伝導して放熱され、中心付近のＬＥＤモジュール１の温度上昇を抑制することができる。したがって、取付基板２の主表面２ａにおいて中心付近に配置されたＬＥＤモジュール１と、周辺部に配置されたＬＥＤモジュール１の温度上昇のばらつきを低減でき、発光効率のばらつきが抑制されるから、輝度むらを低減することができる。   On the other hand, the other main surface 2b of the mounting substrate 2 is formed in a concave curved surface such that the thickness dimension increases from the center position of the mounting substrate 2 to the outer periphery as shown in FIG. The heat capacity decreases from the center to the periphery. Here, a plurality of LED modules 1 are uniformly disposed on one main surface 2a of the mounting substrate 2, and the LED module 1 disposed at the center in the mounting range of the LED module 1 is another LED module. 1 is surrounded by 1 and the heat dissipation is poor, and the temperature rise of the LED module 1 at the center is larger than the temperature rise of the LED module 1 at the periphery, but the heat capacity of the mounting substrate 2 is increased from the center. Since it is made small so that it goes to a peripheral part, the heat_generation | fever of the LED module 1 arrange | positioned in the center part of the main surface 2a is efficiently conducted to the main surface 2b on the opposite side compared with the LED module 1 arrange | positioned in a peripheral part. The heat is dissipated and the temperature rise of the LED module 1 near the center can be suppressed. Therefore, the variation in temperature rise between the LED module 1 disposed near the center on the main surface 2a of the mounting substrate 2 and the LED module 1 disposed in the peripheral portion can be reduced, and the variation in luminous efficiency is suppressed. Unevenness can be reduced.

ところで、取付基板２の主表面２ｂを、取付基板２の中心位置から外周部へ行くほど厚み寸法が厚くなるような凹曲面に形成する代わりに、図４（ａ）に示すように取付基板２の背面側（主表面２ａと反対側）に取付基板２の発熱を放熱する放熱部３を一体に設けても良い。放熱部３は取付基板２の背面側に突設された複数の板状の放熱フィン３ａを備えている。ここで、取付基板２の径方向の断面において、複数の放熱フィン３ａの先端を結んでできる曲線が包絡線となるように、中央の放熱フィン３ａほど突出量が大きく形成されており、周辺部から中央部にいくほど放熱部３の放熱性が高くなっている。この放熱部３は取付基板２と一体に設けられているので、取付基板２の中央部（すなわちＬＥＤモジュール１の取付範囲の中央部）の熱を放熱部３により効率良く放熱させることができ、中央部に配置されたＬＥＤモジュール１の温度上昇を抑制して、輝度むらを低減することができる。   By the way, instead of forming the main surface 2b of the mounting substrate 2 into a concave curved surface that increases in thickness as it goes from the center position of the mounting substrate 2 to the outer peripheral portion, as shown in FIG. A heat radiating portion 3 for radiating heat generated by the mounting substrate 2 may be integrally provided on the back side (the side opposite to the main surface 2a). The heat dissipating part 3 includes a plurality of plate-like heat dissipating fins 3 a protruding from the back side of the mounting substrate 2. Here, in the radial cross section of the mounting substrate 2, the projecting amount of the central radiating fin 3 a is increased so that the curve formed by connecting the tips of the plurality of radiating fins 3 a becomes an envelope. The heat dissipating property of the heat dissipating part 3 increases as the distance from the center increases. Since the heat radiating part 3 is provided integrally with the mounting board 2, the heat of the central part of the mounting board 2 (that is, the central part of the mounting range of the LED module 1) can be efficiently radiated by the heat radiating part 3. An increase in temperature of the LED module 1 disposed in the central portion can be suppressed, and uneven brightness can be reduced.

なお、図４（ａ）に示す形態では取付基板２の背面に板状の放熱フィンを複数突設しているが、図４（ｃ）に示すように放熱部３を取付基板２の背面に突設された複数本のロッド状の放熱フィン３ｂで構成し、取付基板２の中心位置に近い放熱フィン３ｂほど長さを長くすることで、中央部の放熱性を高めても良い。   In the form shown in FIG. 4A, a plurality of plate-like heat radiating fins are provided on the back surface of the mounting substrate 2, but the heat radiating portion 3 is provided on the back surface of the mounting substrate 2 as shown in FIG. A plurality of rod-shaped heat radiation fins 3b projecting from each other, and the heat radiation fins 3b closer to the center position of the mounting substrate 2 may be made longer to increase the heat radiation performance at the center.

（実施形態１）
図４（ｂ）は本発明の実施形態を示し、図１に示す取付基板２の他方の主表面２ｂに、取付基板２の発熱を放熱する放熱器３’を取着してある。この放熱器３’は例えばアルミニウム等の熱伝導率の良好な金属材料により形成され、一方の表面が取付基板２の主表面２ｂに面接触する凸曲面に形成されるとともに、他方の主表面が中央部に行くほど突出量が大きくなるような凸曲面に形成されており、放熱器３の放熱性が周辺部から中央部にいくほど高くなっているから、取付基板２の中央部の発熱を効率良く、放熱させることができる。 (Embodiment 1)
FIG. 4B shows an embodiment of the present invention, and a radiator 3 ′ for radiating heat generated by the mounting board 2 is attached to the other main surface 2 b of the mounting board 2 shown in FIG . The radiator 3 ′ is formed of a metal material having a good thermal conductivity such as aluminum, and has one surface formed in a convex curved surface in surface contact with the main surface 2b of the mounting substrate 2 and the other main surface being It is formed in a convex curved surface with a protruding amount that increases toward the center, and the heat dissipation performance of the radiator 3 increases from the periphery to the center. It is possible to dissipate heat efficiently.

（参考例１）
本発明の参考例１を図５（ａ）（ｂ）に基づいて説明する。基本構成で説明した照明器具では、取付基板２の他方の主表面２ｂを、取付基板２の中心位置から外周部へ行くほど厚み寸法が厚くなるような凹曲面に形成しているのに対して、本照明器具では他方の主表面２ｂを、一方の主表面２ａに対して所定角度傾斜するような傾斜面に形成してある。この主表面２ｂには、傾斜方向に沿って延びる複数の突壁２１が略一定の間隔を開けて突設してあり、隣接する突壁２１の間に傾斜方向に沿って延びる溝２２が複数形成される。尚、主表面２ｂの形状以外は基本構成で説明した照明器具と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 (Reference Example 1)
Reference Example 1 of the present invention will be described with reference to FIGS. In the lighting fixture described in the basic configuration, the other main surface 2b of the mounting substrate 2 is formed in a concave curved surface such that the thickness dimension increases from the center position of the mounting substrate 2 to the outer peripheral portion. In this lighting fixture , the other main surface 2b is formed in an inclined surface that is inclined at a predetermined angle with respect to the one main surface 2a. A plurality of protruding walls 21 extending along the inclined direction are provided on the main surface 2b with a substantially constant interval, and a plurality of grooves 22 extending along the inclined direction are provided between the adjacent protruding walls 21. It is formed. In addition, since it is the same as that of the lighting fixture demonstrated with the basic composition except the shape of the main surface 2b, the same code | symbol is attached | subjected to the same component and the description is abbreviate | omitted.

ここで、図５（ａ）に示すように、取付基板２における一方の主表面２ａの法線方向が鉛直方向と直交し、且つ、鉛直上側ほど取付基板２の厚みが厚くなるように、取付基板２を配置した場合、下側のＬＥＤモジュール１の発熱によって上側のＬＥＤモジュール１ほど温度上昇が大きくなるが、取付基板２の厚みは上側ほど厚くなっているので、上側のＬＥＤモジュール１ほど放熱性が高くなって温度上昇が低減されるから、温度上昇による発光効率の低下が抑制されて、照明器具の輝度を均一にすることができる。また、主表面２ｂには傾斜方向に沿って延びる突壁２１が複数突設され、隣接する突壁２１の間に傾斜方向に沿って延びる溝２２が形成されるので、溝２２内部を空気が通過することによって空気の流れが整流され、空気の対流が起きやすくなり、放熱性を向上させることができる。尚、図５中の矢印は空気の流れを示している。   Here, as shown in FIG. 5 (a), the mounting substrate 2 is mounted so that the normal direction of one main surface 2a of the mounting substrate 2 is perpendicular to the vertical direction, and the thickness of the mounting substrate 2 increases toward the upper vertical side. When the substrate 2 is arranged, the temperature rises as the upper LED module 1 increases due to the heat generated by the lower LED module 1, but the thickness of the mounting substrate 2 increases as the upper LED module 1 increases. Therefore, the increase in temperature is reduced and the decrease in luminous efficiency due to the temperature increase is suppressed, and the luminance of the lighting fixture can be made uniform. Further, the main surface 2b is provided with a plurality of protruding walls 21 extending along the inclined direction, and a groove 22 extending along the inclined direction is formed between the adjacent protruding walls 21. By passing, the air flow is rectified, air convection is likely to occur, and heat dissipation can be improved. In addition, the arrow in FIG. 5 has shown the flow of air.

（参考例２）
本発明の参考例２について説明する。基本構成で説明した照明器具では、取付基板２の主表面２ｂを凹曲面に形成することによって、ＬＥＤモジュール１の取付範囲における中央部の放熱性が周辺部の放熱性よりも高くなるように形成しているが、本参考例では、図６に示すように取付基板２の主表面２ｂを平面形状に形成し、中央に丸孔２３が貫設された円環部２４と、円環部２４の丸孔２３内に嵌合される小径の芯部２５とを一体に結合して取付基板２を構成している。尚、取付基板２の形状以外は基本構成で説明した照明器具と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 (Reference Example 2)
Reference Example 2 of the present invention will be described. In the lighting fixture described in the basic configuration, the main surface 2b of the mounting substrate 2 is formed in a concave curved surface, so that the heat dissipation property of the central portion in the mounting range of the LED module 1 is higher than the heat dissipation property of the peripheral portion. However, in this reference example , as shown in FIG. 6, the main surface 2 b of the mounting substrate 2 is formed in a planar shape, and an annular portion 24 having a circular hole 23 penetrating in the center, and the annular portion 24. The mounting substrate 2 is configured by integrally connecting a small-diameter core portion 25 fitted into the round hole 23. In addition, since it is the same as that of the lighting fixture demonstrated with the basic composition except the shape of the attachment board | substrate 2, the same code | symbol is attached | subjected to the same component and the description is abbreviate | omitted.

上述のように取付基板２は、ＬＥＤモジュール１の取付範囲における中心部（芯部２５）と周辺部（円環部２４）とが別々の材料により形成されており、芯部２５は、円環部２４に比べて放熱性又は熱伝導率が高い材料、或いは、円環部２４に比べて輻射性が高い材料で形成しているので、取付基板２の周辺部に比べて中央部の放熱性又は輻射性を高めることができる。円環部２４および芯部２５の材料として例えば表１に示すような材料を用いることができ、これらの材料の中から熱伝導率が相対的に高い材料を芯部２５に、熱伝導率が相対的に低い材料を円環部２４に用いれば良い。また、黒化処理を施したＣｕや陽極酸化処理を施したＡｌを芯部２５として用いたり、芯部２５に黒色塗料を塗布しても良く、取付基板２の中心部ほど色を黒くすることで、中心部の熱輻射性を高めることができる。また、円環部２４および芯部２５は、それぞれ、単一の材料で形成しても良いし、複数の材料からなるものを組み合わせることで、放熱性や熱輻射性が取付基板２の中心部ほど高くなるように傾斜を持たせても良い。なお、円環部２４および芯部２５の材料や寸法は、ＬＥＤモジュール１の点灯状態における取付基板２の温度分布等を考慮して、適宜設定すれば良い。   As described above, the mounting substrate 2 is formed by using different materials for the central portion (core portion 25) and the peripheral portion (ring portion 24) in the mounting range of the LED module 1, and the core portion 25 is an annular ring. Since it is made of a material having high heat dissipation or thermal conductivity compared to the portion 24 or a material having high radiation compared to the annular portion 24, the heat dissipation of the central portion compared to the peripheral portion of the mounting substrate 2. Alternatively, radiation can be improved. For example, the materials shown in Table 1 can be used as the material of the annular portion 24 and the core portion 25. Among these materials, a material having a relatively high thermal conductivity is used for the core portion 25, and the thermal conductivity is high. A relatively low material may be used for the annular portion 24. Further, blackened Cu or anodized Al may be used as the core portion 25, or a black paint may be applied to the core portion 25, and the color of the central portion of the mounting substrate 2 is made blacker. Thus, the heat radiation property of the central portion can be enhanced. Further, each of the annular portion 24 and the core portion 25 may be formed of a single material, or a combination of materials made of a plurality of materials allows heat dissipation and thermal radiation to be the central portion of the mounting substrate 2. You may give it an inclination so that it may become so high. The materials and dimensions of the annular portion 24 and the core portion 25 may be appropriately set in consideration of the temperature distribution of the mounting substrate 2 in the lighting state of the LED module 1.

Figure 0004492486
Figure 0004492486

ここで、取付基板２の一方の主表面２ａには複数個のＬＥＤモジュール１を均一に配置しており、ＬＥＤモジュール１の取付範囲において中央部に配置されたＬＥＤモジュール１は、他のＬＥＤモジュール１によって周りを囲まれているため放熱性が悪く、中央部のＬＥＤモジュール１の温度上昇が、周辺部のＬＥＤモジュール１の温度上昇に比べて大きくなるが、取付基板２は、芯部２５の材料が、円環部２４の材料に比べて放熱性および輻射性が高い材料で形成されているので、主表面２ａの中央部に配置されたＬＥＤモジュール１の発熱は、周辺部に配置されたＬＥＤモジュール１に比べて効率良く反対側の主表面２ｂに伝導されて、放熱されるから、中央部のＬＥＤモジュール１の温度上昇を抑制することができる。したがって、取付基板２の主表面２ａにおいて中心付近に配置されたＬＥＤモジュール１と、周辺部に配置されたＬＥＤモジュール１の温度上昇のばらつきを低減でき、発光効率のばらつきを低減して、輝度が均一な照明光を得ることができる。   Here, a plurality of LED modules 1 are uniformly disposed on one main surface 2a of the mounting substrate 2, and the LED module 1 disposed at the center in the mounting range of the LED module 1 is another LED module. 1 is surrounded by 1, the heat dissipation is poor, and the temperature rise of the LED module 1 in the central part is larger than the temperature rise of the LED module 1 in the peripheral part. Since the material is formed of a material having higher heat dissipation and radiation than the material of the annular portion 24, the heat generated by the LED module 1 disposed in the central portion of the main surface 2a is disposed in the peripheral portion. Compared to the LED module 1, it is efficiently conducted to the opposite main surface 2 b and dissipated, so that the temperature rise of the LED module 1 in the center can be suppressed. Therefore, the variation in temperature rise between the LED module 1 disposed near the center on the main surface 2a of the mounting substrate 2 and the LED module 1 disposed in the peripheral portion can be reduced, the variation in luminous efficiency can be reduced, and the luminance can be reduced. Uniform illumination light can be obtained.

なお、基本構成、実施形態１及び参考例１で説明した照明器具において、本参考例と同様に円環部２４と芯部２５とを結合して取付基板２を形成し、芯部２５の材料を円環部２４に比べて放熱性又は輻射性の内少なくとも何れか一方が高い材料を用いても良く、中央部のＬＥＤモジュール１の温度上昇を抑制し、取付基板２における熱分布を均一にできる。 In addition, in the luminaire described in the basic configuration, the first embodiment, and the reference example 1, the annular portion 24 and the core portion 25 are combined to form the mounting substrate 2 as in this reference example, and the material of the core portion 25 is formed. A material having at least one of heat dissipation and radiation properties higher than that of the annular portion 24 may be used, and the temperature rise of the LED module 1 in the center portion is suppressed, and the heat distribution on the mounting substrate 2 is made uniform. it can.

なお、本発明の精神と範囲に反することなしに、広範に異なる実施形態を構成することができることは明白なので、この発明は、特定の実施形態に制約されるものではない。   It should be noted that a wide variety of different embodiments can be configured without departing from the spirit and scope of the present invention, and the present invention is not limited to a specific embodiment.

本発明に係る照明器具の基本構成を示す要部断面図である。It is principal part sectional drawing which shows the basic composition of the lighting fixture which concerns on this invention . 同上の要部の外観斜視図である。It is an external appearance perspective view of the principal part same as the above. 同上に用いるＬＥＤモジュールの分解斜視図である。It is a disassembled perspective view of the LED module used for the same as the above. （ａ）〜（ｃ）は同上の他の構成を示す要部断面図である。(A)-(c) is principal part sectional drawing which shows the other structure same as the above. 参考例１の照明器具を示し、（ａ）は要部断面図、（ｂ）は取付基板の背面図である。 The lighting fixture of the reference example 1 is shown, (a) is principal part sectional drawing, (b) is a rear view of an attachment board | substrate. 参考例２の照明器具を示す要部断面図である。It is principal part sectional drawing which shows the lighting fixture of the reference example 2. FIG. 従来の照明器具に用いるプリント配線板を示し、（ａ）は正面図、（ｂ）は下側から見た側面図である。The printed wiring board used for the conventional lighting fixture is shown, (a) is a front view, (b) is the side view seen from the lower side.

１ ＬＥＤモジュール
２ 取付基板
２ａ 主表面 1 LED module 2 Mounting board 2a Main surface

Claims (2)

複数のＬＥＤと、一方の主表面に前記複数のＬＥＤが均一に配置される取付基板と、取付基板における他方の主表面に取着された放熱器とを備え、前記取付基板における前記一方の主表面は平板形状に形成されるとともに、前記取付基板における他方の主表面は、前記ＬＥＤの取付範囲における中央部から周辺部へ行くほど厚み寸法が厚くなるような凹曲面に形成され、前記放熱器における前記取付基板側の表面は、前記取付基板の前記他方の主表面に面接触する凸曲面に形成され、前記放熱器における他方の表面は、中央部に行くほど突出量が大きくなるような凸曲面に形成されたことを特徴とするＬＥＤを用いた照明器具。 A plurality of LEDs, a mounting board on which the plurality of LEDs are uniformly arranged on one main surface, and a radiator attached to the other main surface of the mounting board, the one main board on the mounting board The surface is formed in a flat plate shape, and the other main surface of the mounting substrate is formed in a concave curved surface that increases in thickness as it goes from the center to the periphery in the LED mounting range. The surface on the mounting board side of the mounting board is formed in a convex curved surface that comes into surface contact with the other main surface of the mounting board, and the other surface of the radiator has a convexity that protrudes toward the center. A lighting apparatus using LEDs, characterized by being formed into a curved surface . 前記取付基板は、前記ＬＥＤの取付範囲における中央部の材料を、周辺部の材料に比べて、放熱性又は輻射性の内少なくとも何れか一方が高い材料としたことを特徴とする請求項１記載のＬＥＤを用いた照明器具。 2. The mounting board according to claim 1, wherein a material of a central part in the LED mounting range is made of a material having at least one of heat dissipation and radiation that is higher than that of a peripheral part. Lighting equipment using LED .
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Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US8044428B2 (en) 2007-08-10 2011-10-25 Panasonic Electric Works SUNX Co., Ltd. Package and semiconductor device for preventing occurrence of false connection
JP4479839B2 (en) * 2007-08-10 2010-06-09 パナソニック電工株式会社 Package and semiconductor device
JP4941207B2 (en) * 2007-09-28 2012-05-30 日亜化学工業株式会社 Illumination unit and illumination lamp using the same
JP2009289772A (en) * 2008-05-27 2009-12-10 Rohm Co Ltd Led lamp
TWI381134B (en) * 2008-06-02 2013-01-01 榮創能源科技股份有限公司 Led lighting module
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
DE102008054233A1 (en) 2008-10-31 2010-05-06 Osram Opto Semiconductors Gmbh light module
JP2011165529A (en) * 2010-02-11 2011-08-25 Denso Corp Liquid crystal display device
US8235540B2 (en) * 2011-01-14 2012-08-07 Lg Innotek Co., Ltd. Backlight unit and display apparatus using the same
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
JP6022183B2 (en) * 2011-03-31 2016-11-09 株式会社神戸製鋼所 LED lighting heat sink
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
CN102261596A (en) * 2011-09-09 2011-11-30 霸士电器(上海)有限公司 Light-emitting diode (LED) lamp
CN103311233B (en) * 2012-03-12 2016-08-03 光宝电子(广州)有限公司 Package structure for LED
JP6026315B2 (en) * 2013-02-20 2016-11-16 スタンレー電気株式会社 Light emitting element module
JP2015122250A (en) * 2013-12-25 2015-07-02 株式会社オートネットワーク技術研究所 Conductive member
CN105098046B (en) * 2014-05-19 2019-06-07 四川新力光源股份有限公司 LED light source substrate and preparation method thereof and LED light source
WO2016079900A1 (en) * 2014-11-19 2016-05-26 アイリスオーヤマ株式会社 Lighting device
JP7232239B2 (en) * 2018-02-26 2023-03-02 パナソニックホールディングス株式会社 semiconductor light emitting device
US11962122B2 (en) * 2018-07-30 2024-04-16 Panasonic Holdings Corporation Semiconductor light emitting device and external resonance type laser device
JP7297121B2 (en) * 2019-01-10 2023-06-23 三菱電機株式会社 Semiconductor laser device
JP7291675B2 (en) * 2020-07-30 2023-06-15 日本特殊陶業株式会社 Semiconductor package array
CN113764972B (en) * 2021-09-06 2023-08-18 青岛海信激光显示股份有限公司 Laser device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002102164A (en) * 2000-10-04 2002-04-09 Asahi Optical Co Ltd Processor for electronic endoscope and light source for endoscope
JP2003115204A (en) * 2001-10-04 2003-04-18 Toyoda Gosei Co Ltd Shading reflection type device and light source
JP2003303511A (en) * 2002-10-03 2003-10-24 Ccs Inc Lighting system
JP2004528698A (en) * 2001-05-26 2004-09-16 ゲルコアー リミテッド ライアビリティ カンパニー High power LED module for spot lighting
JP2005093097A (en) * 2003-09-12 2005-04-07 Sanyo Electric Co Ltd Lighting system
JP2005149943A (en) * 2003-11-17 2005-06-09 Seiko Epson Corp Light source device and projector using this
JP2005229095A (en) * 2004-01-13 2005-08-25 Seiko Epson Corp Light source device and projection-type display device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002102164A (en) * 2000-10-04 2002-04-09 Asahi Optical Co Ltd Processor for electronic endoscope and light source for endoscope
JP2004528698A (en) * 2001-05-26 2004-09-16 ゲルコアー リミテッド ライアビリティ カンパニー High power LED module for spot lighting
JP2003115204A (en) * 2001-10-04 2003-04-18 Toyoda Gosei Co Ltd Shading reflection type device and light source
JP2003303511A (en) * 2002-10-03 2003-10-24 Ccs Inc Lighting system
JP2005093097A (en) * 2003-09-12 2005-04-07 Sanyo Electric Co Ltd Lighting system
JP2005149943A (en) * 2003-11-17 2005-06-09 Seiko Epson Corp Light source device and projector using this
JP2005229095A (en) * 2004-01-13 2005-08-25 Seiko Epson Corp Light source device and projection-type display device

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