JP4492486B2 - Lighting equipment using LED - Google Patents

Lighting equipment using LED Download PDF

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Publication number
JP4492486B2
JP4492486B2 JP2005243091A JP2005243091A JP4492486B2 JP 4492486 B2 JP4492486 B2 JP 4492486B2 JP 2005243091 A JP2005243091 A JP 2005243091A JP 2005243091 A JP2005243091 A JP 2005243091A JP 4492486 B2 JP4492486 B2 JP 4492486B2
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Prior art keywords
led
mounting
main
mounting substrate
center
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Expired - Fee Related
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JP2007059207A (en
Inventor
洋二 浦野
健一郎 田中
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パナソニック電工株式会社
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Description

  The present invention relates to a lighting fixture using LEDs.
  In recent years, with the increase in output of white LEDs, development of luminaires using white LEDs as light sources has been promoted (see, for example, Patent Document 1).
In this type of lighting fixture, a plurality of LEDs are used to obtain a desired light output, and in order to make the brightness of the irradiated surface uniform as shown in FIG. On the surface of 30, a plurality of LEDs 31 are arranged at the same pitch angle on a plurality of concentric circles centered on the center position of the printed wiring board 30.
Japanese Utility Model Publication No. 3-112818
  In the lighting fixture having the above-described configuration, since the high-power LED 31 is used, the input power to the LED 31 is large, and thus the heat generation of the LED 31 is increased. Here, in order to make the brightness uniform, when a plurality of LEDs 31 are arranged on the printed wiring board 30 at substantially constant intervals as shown in FIG. The part is easily affected by the temperature of the other LEDs 31 arranged around it, and as a result, the luminous efficiency of the LED 31 arranged in the central part is lowered, resulting in uneven brightness. .
  In order to solve such a problem, in the lighting apparatus shown in Patent Document 1, the printed wiring board on which the LED is mounted is divided into a plurality of sheets, and a gap is formed between the plurality of printed wiring boards. A plurality of printed wiring boards are arranged at different positions in the thickness direction, and air is convected through the gaps between the printed wiring boards to suppress the temperature rise of the LED placed in the center. Since the number of wiring boards increases, there is a problem that workability of assembly work is deteriorated.
  The present invention has been made in view of the above problems, and an object of the present invention is to provide an illuminating device using an LED that is easy to assemble and obtains illumination light with uniform brightness. .
To achieve the above object, the invention of claim 1 is attached to a plurality of LEDs , a mounting board in which a plurality of LEDs are uniformly arranged on one main surface, and the other main surface of the mounting board. and a radiator, with one main surface of the mounting substrate is formed into a flat plate shape, the other major surface of the mounting substrate, so that the thickness as goes from the central portion in the attachment area of the LED to the peripheral portion becomes thick The surface on the mounting board side of the radiator is formed in a convex curved surface that is in surface contact with the other main surface of the mounting board, and the other surface of the radiator has a protruding amount toward the center. It is characterized by being formed in a convex curved surface that becomes larger .
According to a second aspect of the present invention, in the first aspect of the present invention, the mounting substrate is higher in at least one of heat dissipation and radiation than the material of the central portion in the LED mounting range than the material of the peripheral portion. It is characterized by the material.
According to the invention of claim 1, since the heat capacity of the central part in the attachment range of the LED is smaller than the heat capacity of the peripheral part, the heat generation of the LED arranged in the central part of the attachment range is attached to the attachment substrate. It becomes easy to conduct to the other main surface of the substrate, and as a result, it is easy to dissipate the heat generated by the LED in the center, so the temperature difference between the center and the periphery in the mounting range is reduced, and the LED arranged in the center In this way, illumination light with uniform brightness can be obtained. Moreover, since the mounting substrate itself is formed so that the heat dissipation of the central portion in the LED mounting range is higher than the heat dissipation of the peripheral portion, compared to the case where the mounting substrate is divided into a plurality of substrates, The number of parts is reduced and the assembly work can be simplified .
According to the invention of claim 2 , since it becomes easy to dissipate the heat generated by the LED arranged in the central part of the attachment range, the temperature difference between the LED arranged in the central part and the LED arranged in the peripheral part in the attachment range. Is reduced, and it is possible to obtain illumination light with uniform brightness by suppressing a decrease in light emission efficiency of the LED disposed in the central portion.
  Embodiments of the present invention will be described below with reference to the drawings.
(Basic configuration)
The basic configuration of the present invention will be described with reference to FIGS. This luminaire includes a plurality of LED modules 1 and a mounting substrate 2 on which the plurality of LED modules 1 are arranged, and direct current power is supplied to each LED module 1 from a power supply device (not shown). It emits light.
  As shown in FIG. 3, each LED module 1 includes a rectangular plate-shaped LED chip 10, a chip mounting member 11 that is formed in a substantially T shape with a conductive material, and the LED chip 10 is mounted on the wide portion 11 a, and a conductive material. It is formed in a substantially T shape with a material, and the wide portion 12a is disposed so as to surround the LED chip 10 and the terminal plate 12 disposed so as to be separated from the wide portion 11a of the chip mounting member 11, and is emitted from the side surface of the LED chip 10. A reflector 13 that radiates the emitted light to the front of the LED chip 10 (left side in FIG. 1) and a dome-shaped reflector made of light-transmitting synthetic resin is disposed in front of the reflector 13 so as to cover the LED chip 10. And a protective cover 14. Here, the reflector 13 is attached to the chip mounting member 11 and the terminal plate 12 via a fixing material 17 made of an insulating sheet-like adhesive film, and the LED chip 10 is placed at the center of the fixing material 17. A round hole 17a to be exposed is provided.
  The chip mounting member 11 and the terminal plate 12 are formed by using a lead frame made of a metal plate (for example, a copper plate), and are simultaneously and integrally formed on a holding frame 15 formed into a rectangular frame shape by an insulating synthetic resin. Yes. The wide portions 11a and 12a of the chip mounting member 11 and the terminal plate 12 are arranged inside the holding frame 15, and the portions of the chip mounting member 11 and the terminal plate 12 that protrude outside the holding frame 15 are external connection terminals 11b and 12b, respectively. It becomes. Further, an insulating sheet 16 made of a green sheet is interposed between the chip mounting member 11 and the terminal plate 12 and the mounting substrate 2, and the chip mounting member 11 and the terminal plate 12 and the mounting substrate 2 are electrically connected. Insulated and thermally coupled. The insulating sheet 16 is not limited to a ceramic unsintered body formed into a sheet shape such as a green sheet. For example, a thermosetting fixing material (such as an epoxy resin) may be used.
  The LED chip 10 has an anode electrode formed on one surface side and a cathode electrode formed on the other surface side, and one of the anode electrode and the cathode electrode is connected via a conductive submount member 18. It is electrically connected to the wide portion 11a of the chip mounting member 11, and the other electrode is electrically connected to the wide portion 12a of the terminal plate 12 via a bonding wire 19 made of a fine metal wire (for example, a gold fine wire, an aluminum fine wire, etc.). Has been.
The mounting substrate 2 is formed in a substantially disk shape with a metal having high thermal conductivity such as aluminum or copper. A plurality of LED modules 1 are attached to one main surface 2a of the mounting substrate 2 at the same pitch angle on a plurality of concentric circles centered on the center point of the mounting substrate 2. They are connected in series via a lead wire (not shown), and are lit when power is supplied from the power supply circuit. In the lighting fixture described above, a plurality of LED modules 1 are connected in series. However, the connection relationship of the plurality of LED modules 1 is not limited to the series connection, and the plurality of LED modules 1 are connected in parallel. Alternatively, a series connection and a parallel connection may be combined. Further, the arrangement of the plurality of LED modules 1 is not limited to the arrangement shown in FIG. 2, and the arrangement may be appropriately set in accordance with the usage application of the lighting fixture.
  On the other hand, the other main surface 2b of the mounting substrate 2 is formed in a concave curved surface such that the thickness dimension increases from the center position of the mounting substrate 2 to the outer periphery as shown in FIG. The heat capacity decreases from the center to the periphery. Here, a plurality of LED modules 1 are uniformly disposed on one main surface 2a of the mounting substrate 2, and the LED module 1 disposed at the center in the mounting range of the LED module 1 is another LED module. 1 is surrounded by 1 and the heat dissipation is poor, and the temperature rise of the LED module 1 at the center is larger than the temperature rise of the LED module 1 at the periphery, but the heat capacity of the mounting substrate 2 is increased from the center. Since it is made small so that it goes to a peripheral part, the heat_generation | fever of the LED module 1 arrange | positioned in the center part of the main surface 2a is efficiently conducted to the main surface 2b on the opposite side compared with the LED module 1 arrange | positioned in a peripheral part. The heat is dissipated and the temperature rise of the LED module 1 near the center can be suppressed. Therefore, the variation in temperature rise between the LED module 1 disposed near the center on the main surface 2a of the mounting substrate 2 and the LED module 1 disposed in the peripheral portion can be reduced, and the variation in luminous efficiency is suppressed. Unevenness can be reduced.
  By the way, instead of forming the main surface 2b of the mounting substrate 2 into a concave curved surface that increases in thickness as it goes from the center position of the mounting substrate 2 to the outer peripheral portion, as shown in FIG. A heat radiating portion 3 for radiating heat generated by the mounting substrate 2 may be integrally provided on the back side (the side opposite to the main surface 2a). The heat dissipating part 3 includes a plurality of plate-like heat dissipating fins 3 a protruding from the back side of the mounting substrate 2. Here, in the radial cross section of the mounting substrate 2, the projecting amount of the central radiating fin 3 a is increased so that the curve formed by connecting the tips of the plurality of radiating fins 3 a becomes an envelope. The heat dissipating property of the heat dissipating part 3 increases as the distance from the center increases. Since the heat radiating part 3 is provided integrally with the mounting board 2, the heat of the central part of the mounting board 2 (that is, the central part of the mounting range of the LED module 1) can be efficiently radiated by the heat radiating part 3. An increase in temperature of the LED module 1 disposed in the central portion can be suppressed, and uneven brightness can be reduced.
  In the form shown in FIG. 4A, a plurality of plate-like heat radiating fins are provided on the back surface of the mounting substrate 2, but the heat radiating portion 3 is provided on the back surface of the mounting substrate 2 as shown in FIG. A plurality of rod-shaped heat radiation fins 3b projecting from each other, and the heat radiation fins 3b closer to the center position of the mounting substrate 2 may be made longer to increase the heat radiation performance at the center.
(Embodiment 1)
FIG. 4B shows an embodiment of the present invention, and a radiator 3 ′ for radiating heat generated by the mounting board 2 is attached to the other main surface 2 b of the mounting board 2 shown in FIG . The radiator 3 ′ is formed of a metal material having a good thermal conductivity such as aluminum, and has one surface formed in a convex curved surface in surface contact with the main surface 2b of the mounting substrate 2 and the other main surface being It is formed in a convex curved surface with a protruding amount that increases toward the center, and the heat dissipation performance of the radiator 3 increases from the periphery to the center. It is possible to dissipate heat efficiently.
(Reference Example 1)
Reference Example 1 of the present invention will be described with reference to FIGS. In the lighting fixture described in the basic configuration, the other main surface 2b of the mounting substrate 2 is formed in a concave curved surface such that the thickness dimension increases from the center position of the mounting substrate 2 to the outer peripheral portion. In this lighting fixture , the other main surface 2b is formed in an inclined surface that is inclined at a predetermined angle with respect to the one main surface 2a. A plurality of protruding walls 21 extending along the inclined direction are provided on the main surface 2b with a substantially constant interval, and a plurality of grooves 22 extending along the inclined direction are provided between the adjacent protruding walls 21. It is formed. In addition, since it is the same as that of the lighting fixture demonstrated with the basic composition except the shape of the main surface 2b, the same code | symbol is attached | subjected to the same component and the description is abbreviate | omitted.
  Here, as shown in FIG. 5 (a), the mounting substrate 2 is mounted so that the normal direction of one main surface 2a of the mounting substrate 2 is perpendicular to the vertical direction, and the thickness of the mounting substrate 2 increases toward the upper vertical side. When the substrate 2 is arranged, the temperature rises as the upper LED module 1 increases due to the heat generated by the lower LED module 1, but the thickness of the mounting substrate 2 increases as the upper LED module 1 increases. Therefore, the increase in temperature is reduced and the decrease in luminous efficiency due to the temperature increase is suppressed, and the luminance of the lighting fixture can be made uniform. Further, the main surface 2b is provided with a plurality of protruding walls 21 extending along the inclined direction, and a groove 22 extending along the inclined direction is formed between the adjacent protruding walls 21. By passing, the air flow is rectified, air convection is likely to occur, and heat dissipation can be improved. In addition, the arrow in FIG. 5 has shown the flow of air.
(Reference Example 2)
Reference Example 2 of the present invention will be described. In the lighting fixture described in the basic configuration, the main surface 2b of the mounting substrate 2 is formed in a concave curved surface, so that the heat dissipation property of the central portion in the mounting range of the LED module 1 is higher than the heat dissipation property of the peripheral portion. However, in this reference example , as shown in FIG. 6, the main surface 2 b of the mounting substrate 2 is formed in a planar shape, and an annular portion 24 having a circular hole 23 penetrating in the center, and the annular portion 24. The mounting substrate 2 is configured by integrally connecting a small-diameter core portion 25 fitted into the round hole 23. In addition, since it is the same as that of the lighting fixture demonstrated with the basic composition except the shape of the attachment board | substrate 2, the same code | symbol is attached | subjected to the same component and the description is abbreviate | omitted.
  As described above, the mounting substrate 2 is formed by using different materials for the central portion (core portion 25) and the peripheral portion (ring portion 24) in the mounting range of the LED module 1, and the core portion 25 is an annular ring. Since it is made of a material having high heat dissipation or thermal conductivity compared to the portion 24 or a material having high radiation compared to the annular portion 24, the heat dissipation of the central portion compared to the peripheral portion of the mounting substrate 2. Alternatively, radiation can be improved. For example, the materials shown in Table 1 can be used as the material of the annular portion 24 and the core portion 25. Among these materials, a material having a relatively high thermal conductivity is used for the core portion 25, and the thermal conductivity is high. A relatively low material may be used for the annular portion 24. Further, blackened Cu or anodized Al may be used as the core portion 25, or a black paint may be applied to the core portion 25, and the color of the central portion of the mounting substrate 2 is made blacker. Thus, the heat radiation property of the central portion can be enhanced. Further, each of the annular portion 24 and the core portion 25 may be formed of a single material, or a combination of materials made of a plurality of materials allows heat dissipation and thermal radiation to be the central portion of the mounting substrate 2. You may give it an inclination so that it may become so high. The materials and dimensions of the annular portion 24 and the core portion 25 may be appropriately set in consideration of the temperature distribution of the mounting substrate 2 in the lighting state of the LED module 1.
  Here, a plurality of LED modules 1 are uniformly disposed on one main surface 2a of the mounting substrate 2, and the LED module 1 disposed at the center in the mounting range of the LED module 1 is another LED module. 1 is surrounded by 1, the heat dissipation is poor, and the temperature rise of the LED module 1 in the central part is larger than the temperature rise of the LED module 1 in the peripheral part. Since the material is formed of a material having higher heat dissipation and radiation than the material of the annular portion 24, the heat generated by the LED module 1 disposed in the central portion of the main surface 2a is disposed in the peripheral portion. Compared to the LED module 1, it is efficiently conducted to the opposite main surface 2 b and dissipated, so that the temperature rise of the LED module 1 in the center can be suppressed. Therefore, the variation in temperature rise between the LED module 1 disposed near the center on the main surface 2a of the mounting substrate 2 and the LED module 1 disposed in the peripheral portion can be reduced, the variation in luminous efficiency can be reduced, and the luminance can be reduced. Uniform illumination light can be obtained.
In addition, in the luminaire described in the basic configuration, the first embodiment, and the reference example 1, the annular portion 24 and the core portion 25 are combined to form the mounting substrate 2 as in this reference example, and the material of the core portion 25 is formed. A material having at least one of heat dissipation and radiation properties higher than that of the annular portion 24 may be used, and the temperature rise of the LED module 1 in the center portion is suppressed, and the heat distribution on the mounting substrate 2 is made uniform. it can.
  It should be noted that a wide variety of different embodiments can be configured without departing from the spirit and scope of the present invention, and the present invention is not limited to a specific embodiment.
It is principal part sectional drawing which shows the basic composition of the lighting fixture which concerns on this invention . It is an external appearance perspective view of the principal part same as the above. It is a disassembled perspective view of the LED module used for the same as the above. (A)-(c) is principal part sectional drawing which shows the other structure same as the above. The lighting fixture of the reference example 1 is shown, (a) is principal part sectional drawing, (b) is a rear view of an attachment board | substrate. It is principal part sectional drawing which shows the lighting fixture of the reference example 2. FIG. The printed wiring board used for the conventional lighting fixture is shown, (a) is a front view, (b) is the side view seen from the lower side.
1 LED module 2 Mounting board 2a Main surface

Claims (2)

  1. A plurality of LEDs, a mounting board on which the plurality of LEDs are uniformly arranged on one main surface, and a radiator attached to the other main surface of the mounting board, the one main board on the mounting board The surface is formed in a flat plate shape, and the other main surface of the mounting substrate is formed in a concave curved surface that increases in thickness as it goes from the center to the periphery in the LED mounting range. The surface on the mounting board side of the mounting board is formed in a convex curved surface that comes into surface contact with the other main surface of the mounting board, and the other surface of the radiator has a convexity that protrudes toward the center. A lighting apparatus using LEDs, characterized by being formed into a curved surface .
  2. 2. The mounting board according to claim 1, wherein a material of a central part in the LED mounting range is made of a material having at least one of heat dissipation and radiation that is higher than that of a peripheral part. Lighting equipment using LED .
JP2005243091A 2005-08-24 2005-08-24 Lighting equipment using LED Expired - Fee Related JP4492486B2 (en)

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