JP4096927B2 - LED lighting source - Google Patents

Description

  The present invention relates to an LED illumination light source, and more particularly to a high-intensity LED illumination light source having high heat dissipation.

  Conventionally, incandescent lamps, fluorescent lamps, and the like have been used as light sources for lighting fixtures, but their lifetimes are short, and there is annoyance that the light source must be replaced every time the lifetime is reached. On the other hand, the LED light source has a longer life than conventional light sources, and is particularly suitable for applications such as built-in lighting in outdoor buildings where it is difficult to replace the lamp, and lighting in high places. In addition, since the LED light source is small and consumes little power, the lighting fixture can be reduced in size and thickness, and can be expected to be used in places and applications that cannot be mounted with conventional lighting fixtures.

  On the other hand, since a single LED light source has lower luminance than other light sources, the light source is configured as an aggregate of LEDs in which a large number of LEDs are arranged in an array in order to obtain sufficient luminance.

  However, the use of a large number of LEDs results in an increase in the size of the light source, thereby losing the characteristic small size inherent to LEDs. In addition, a large number of LEDs are required, leading to an increase in cost.

  Therefore, efforts have been made to increase the output of the LED chip, and by increasing the current flowing to the LED, a high-luminance LED illumination light source comparable to conventional light sources can be obtained even with a small number of LED assemblies. It was.

  However, when the current is increased, heat is generated from the LED chip, thereby causing a problem that the balance with the heat dissipation is lost and the temperature of the lighting fixture is increased. Since the lifetime of the LED has a property of rapidly decreasing as the temperature rises, it is necessary to arrange the LED chips apart in order to maintain the long lifetime of the LED light source. In this case, even if the brightness of the LED chip itself is increased, the LED light source as an aggregate cannot be reduced in size.

  Therefore, in order not to cause a temperature rise even if the LED chips are arranged at high density, it is necessary to enhance the heat radiation effect of the LED light source. FIG. 15 shows an example in which a heat radiating plate is provided in the illumination light source 100 in order to enhance the heat radiation effect. As shown in FIG. 15, the plurality of LED chips 101 are flip-chip mounted on the surface of the substrate 102 to form a light source as an LED aggregate. A plurality of heat dissipation plates 103 are formed on the surface of the substrate 102 where the LED chip 101 is not mounted. The substrate 102 functions as a heat sink, and the heat radiating plate 103 exhibits an effect as a heat radiating fin. The heat generated in the LED chip 101 is transmitted to the substrate 102 and is emitted to the outside by radiation from the heat radiation fin 103. This prevents the temperature of the substrate 102 from rising. Further, as the heat radiating plate, a heat radiating fin having a shape as shown in FIG.

In addition, about the technique for improving the thermal radiation effect of a LED illumination light source, it is disclosed by patent document 1, 2, 3, etc.
JP 2000-031546 A JP 2002-299700 A JP 2002-304902 A

  The heat radiating action using the heat radiating plates 103 and 103 ′ shown in FIG. 15 or 16 is performed by transferring heat generated by the LED 101 to the heat radiating plate and releasing it to the outside by radiation from the surface of the heat radiating plate. . Therefore, in order to enhance the heat dissipation effect, the surface area of the heat dissipation plate must be increased, but this makes it impossible to reduce the size of the LED light source.

  Further, in order to increase the brightness of the LED illumination light source, the plurality of LEDs are mounted on the substrate surface with high density, which causes more heat generation sources to be concentrated on the substrate. Therefore, if heat transfer from the substrate to the heat sink is not performed efficiently, the heat dissipation effect by the heat dissipation fins cannot be achieved no matter how much the surface area of the heat sink is increased.

  This invention is made | formed in view of this point, and it aims at providing the small LED illumination light source with high heat dissipation efficiency, aiming at high density of LED.

  The LED illumination light source of the present invention includes an insulating substrate, a transparent substrate disposed to face the insulating substrate, a plurality of first LEDs mounted on a first main surface of the insulating substrate, and the transparent A plurality of second LEDs mounted on a first main surface of the substrate, wherein the first main surface of the insulating substrate and the first main surface of the transparent substrate are opposed to each other across a space portion. The first LED and the second LED are arranged without overlapping each other in the space portion.

  With the above configuration, the heat generated from the first and second LEDs arranged and mounted on two different substrates (insulating substrate and transparent substrate) without overlapping each other is dissipated from the substrate on which each is mounted. Therefore, the heat radiation effect is about twice as high as that of the LED illumination light source mounted on the same substrate at the same density. Moreover, since the mounting density of the LEDs mounted on one substrate is halved, the heat source from the LEDs is dispersed on the two substrates, and heat can be radiated more effectively. Furthermore, since an airflow path is generated between the two substrates, the heat dissipation effect is further enhanced. With these effects, it is possible to realize a small LED illumination light source that does not cause a temperature rise while maintaining the LED mounting density.

  In a preferred embodiment, the first LED and the second LED are alternately arranged in the space portion without overlapping each other. Accordingly, the first and second LEDs mounted on the two substrates are uniformly dispersed and arranged, so that heat generation from the LEDs is made uniform in the substrate, so that heat is radiated more effectively. be able to.

  In a preferred embodiment, the first LED is flip-chip mounted on the first main surface of the insulating substrate, and the second LED is flip-chip mounted on the first main surface of the transparent substrate. Has been implemented.

  In a preferred embodiment, a plurality of reflectors are installed between the first LEDs mounted on the first main surface of the insulating substrate.

  Moreover, it is preferable that the plurality of reflectors are installed at positions facing the second LED mounted on the first main surface of the transparent substrate.

  In a preferred embodiment, the light emitted from the first LED passes through the transparent substrate, is emitted to the outside from the second main surface of the transparent substrate, and is emitted from the second LED. The light is reflected by a reflecting plate installed on the first main surface of the insulating substrate, and the reflected light passes through the transparent substrate and is emitted to the outside from the second main surface of the transparent substrate.

  The transparent substrate is preferably made of a ceramic substrate.

  Moreover, it is preferable that the plurality of second LEDs are electrically connected to each other through a transparent electrode formed on the first main surface of the transparent substrate.

  An LED illumination light source according to the present invention includes an insulating substrate, a plurality of LEDs disposed on a main surface of the insulating substrate, and a transparent substrate disposed to face the main surface of the insulating substrate. The first electrode terminal formed on the surface opposite to the emission surface is connected to the first electrode formed on the main surface of the insulating substrate, and the second electrode terminal formed on the emission surface of the LED is , Connected to a second electrode formed on the first main surface of the transparent substrate.

  In a preferred embodiment, the light emitted from the plurality of LEDs passes through the transparent substrate and is emitted from a second main surface of the transparent substrate.

  In the LED illumination light source according to the present invention, heat generated from LEDs mounted on two different substrates without being overlapped with each other is dissipated from the substrates on which they are mounted. Compared to the mounted LED illumination light source, a heat dissipation effect of about twice is obtained. Moreover, since the mounting density of the LEDs mounted on one substrate is halved, the heat source from the LEDs is dispersed on the two substrates, and heat can be radiated more effectively. Furthermore, since an airflow path is generated between the two substrates, the heat dissipation effect is further enhanced. With these effects, it is possible to realize a small LED illumination light source that does not cause a temperature rise while maintaining the LED mounting density.

  Improvement of heat radiation efficiency by a conventional heat radiation plate (heat radiation fin) has been performed mainly by reducing the thermal resistance from the substrate on which the LED is mounted to the heat radiation fin and increasing the surface area of the heat radiation fin.

  However, in order to increase the brightness of the LED illumination light source, it is necessary to increase the mounting density of the substrate surface of the plurality of LEDs, and heat generation on the substrate will be concentrated more than before, and the heat dissipation effect of the radiation fins will be increased. It has become difficult to achieve effectiveness.

  The inventor of the present application has been studying the heat radiation action by the heat radiating fins, and no matter how much the surface area of the heat radiating fins is increased to promote heat radiation to the outside, if the gap between the heat radiating fins is small, the heat radiation is radiated into the gap. Focusing on the point that the heat that is radiated from the radiating fins cannot be released to the outside and is stored in the space, in order to efficiently radiate the heat radiated from the radiating fins to the outside, the gap between the radiating fins Noticed that it was important to ensure a certain amount of space.

  In other words, if it is possible to arrange small LEDs in the gaps between the radiation fins that require a certain amount of space, a plurality of LEDs can be separated from each other by combining the radiation fins with the substrate on which the LEDs are mounted ( I came up with the idea that it could be dispersed and mounted on the heat dissipating fins.

  If such a configuration is taken, LED lighting having substantially the same plane mounting density as that of LEDs mounted on only one board is achieved by dispersing and mounting a plurality of LEDs on boards arranged in parallel. A light source is obtained.

  Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of simplicity. In addition, this invention is not limited to the following embodiment.

(Embodiment 1)
FIG. 1 is a diagram schematically showing the configuration of an LED illumination light source 10 according to an embodiment of the present invention. As shown in FIG. 1, the LED illumination light source 10 includes an insulating substrate 13, a transparent substrate 14 disposed to face the insulating substrate 13, and a plurality of first substrates mounted on the first main surface of the insulating substrate 13. 1 LED 11 a and a plurality of second LEDs 11 b mounted on the first main surface of the transparent substrate 14. The first main surface of the insulating substrate 13 and the first main surface of the transparent substrate 14 are arranged to face each other with the space 16 interposed therebetween, and the first LED 11a and the second LED 11b are arranged in the space 16. Are arranged without overlapping each other.

  The first LED 11a is flip-chip mounted on the first main surface of the insulating substrate 13 via the bump electrode 12a. Similarly, the second LED 11b is bump electrode on the first main surface of the transparent substrate 14. It is flip-chip mounted via 12b.

  Further, as shown in FIG. 1, a plurality of reflecting plates 15 are installed between the first LEDs 11 a mounted on the first main surface of the insulating substrate 13. The plurality of reflectors 15 are installed at positions facing the second LEDs 11b mounted on the first main surface of the transparent substrate 14.

  In the LED illumination light source 10 configured in this way, light (arrow A) emitted from the first LED 11a passes through the transparent substrate 14 and is emitted to the outside from the second main surface of the transparent substrate (arrow). A ′). The light (arrow B) emitted from the second LED 11b is reflected by the reflecting plate 15 installed on the first main surface of the insulating substrate 13, and the reflected light (arrow C) passes through the transparent substrate 14. It passes through and is emitted to the outside from the second main surface of the transparent substrate (arrow C ′).

  Therefore, since the light emitted from the first and second LEDs 11a and 11b passes through the transparent substrate 14 and is emitted to the outside, the emission surface of the LED illumination light source (the vertical direction of the two substrates arranged in parallel) ) From the plurality of LEDs arranged in a lattice pattern on one substrate. That is, an LED illumination light source having substantially the same plane mounting density as the LEDs mounted on one substrate.

  In the LED illumination light source 10 configured as described above, the heat generated from the LEDs mounted on two different substrates is dissipated from the substrates on which they are mounted, so that the LED illumination mounted on the same substrate with the same density. Compared to a light source, a heat dissipation effect that is approximately twice as large is obtained. Moreover, since the mounting density of the LEDs mounted on one substrate is halved, the heat source from the LEDs is dispersed on the two substrates, and heat can be radiated more effectively. In addition, since an air flow path is generated between the two substrates, the heat dissipation effect is further enhanced. This means that an LED illumination light source having double heat dissipation efficiency can be realized while maintaining the LED mounting density.

  The LED used here is a surface-mount type surface-emitting LED. As shown in FIG. 1, the first LED 11a is flip-chip on the first main surface of the insulating substrate 13 via the bump electrode 12a. Similarly, the second LED 11b is flip-chip mounted on the first main surface of the transparent substrate 14 via the bump electrode 12b.

  Further, as shown in FIG. 1, the first LED 11a and the second LED 11b are not overlapped with each other in the horizontal direction of the space portion 16 (direction parallel to both the boards 13 and 14 arranged in parallel). By alternately arranging, the heat generated from each LED can be uniformly dispersed in each substrate, and thereby, the heat generated from the LED can be efficiently dissipated. Further, the light emitted from the second LED 11b mounted on the transparent substrate 14 has a lower emission efficiency because the light reflected from the reflecting plate 15 is shielded by the second LED 11b when passing through the transparent substrate 14. . However, such a drawback can also reduce luminance unevenness of illumination light by alternately arranging the first LED 11a and the second LED 11b. Of course, it is also possible to reduce the luminance unevenness of the illumination light by setting the decrease in the emission efficiency of the second LED 11b in advance to increase the emission luminance of the second LED 11b.

  Here, the insulating substrate 13 is a composite substrate using alumina powder and a thermosetting resin, and the transparent substrate 14 is a transparent ceramic substrate having good thermal conductivity.

  Next, a method of arranging the first LEDs 11a on the insulating substrate 13 will be described with reference to FIG.

  As shown in FIG. 2, the plurality of first LEDs 11 a are mounted at every other lattice point on the first main surface of the insulating substrate 13. At the position of the lattice point where the first LED 11a is not disposed, the second LED 11b mounted on the transparent substrate 14 disposed to face the insulating substrate 13 is disposed.

  Each first LED 11a is connected in series to the adjacent LED 11a by a connection wiring 20 formed on the surface of the insulating substrate 13 to form one circuit, and the LEDs 11a located at both ends of the circuit are connected from the outside. Power supply and negative power supply are supplied respectively. The arrangement of the second LEDs 11b on the surface of the transparent substrate 14 is the same as that shown in FIG. 2, but the connection wiring formed on the surface of the transparent substrate 14 is made of ITO (indium-tin oxide). A transparent electrode is used.

  Next, a method of installing the reflecting plate 15 on the insulating substrate 13 will be described with reference to FIGS. 3 (a) and 3 (b).

  3A is a plan view of the reflecting plate 15, and FIG. 3B is a cross-sectional view of the reflecting plate 15 installed on the insulating substrate 13 (dotted line X− shown in FIG. 3A). (Cross section along Y). The reflector 15 is integrally molded, and is opened where the first LED 11a is disposed, and is processed into a concave shape as shown in FIG. 3B at a position facing the second LED 11b. Yes. Thus, if the reflecting plate 15 is formed by integral molding, installation on the insulating substrate 13 can be easily performed collectively.

  Next, a method for manufacturing the LED illumination light source 10 will be described with reference to FIGS.

  First, as shown in FIG. 4A, the first LED 11 a is flip-chip mounted on the insulating substrate 13 via the bump electrode 12. The LED 11a is a surface-emitting LED, and light is emitted from the side opposite to the insulating substrate 13. Thereafter, as shown in FIG. 4B, the reflecting plate 15 is installed on the insulating substrate 13. As the reflecting plate 15, the integrally molded one shown in FIG.

  Next, as shown in FIG. 2C, after mounting the second LED 11b on the transparent substrate 14, the surface on which the first and second LEDs 11a and 11b are mounted is formed on the insulating substrate 13 and the transparent substrate 14. It arrange | positions on both sides of a space part so that it may mutually oppose. Finally, as shown in FIG. 4D, the insulating substrate 13 and the transparent substrate 14 are fixed by the casing 31 in a state where the space portion is interposed therebetween, and the LED illumination light source 10 is completed.

  5 and 6 are diagrams showing an example in which the LED illumination light source 10 of the present invention is incorporated in the LED illumination device 30. FIG.

  As shown in FIG. 5, the LED illumination device 30 includes an LED illumination light source 10 fixed to the housing 31, a lighting circuit 33 mounted in the internal space of the housing 31 (the back surface of the insulating substrate 13), and LED illumination. It is composed of a transparent plastic cover 42 that covers the light source 10 on the transparent substrate 14 side. The lighting circuit 33 controls lighting of the LEDs 11 a and 11 b of the LED illumination light source 10. Further, if the opening 32 is provided in a part of the casing 31 that holds the insulating substrate 13 and the transparent substrate 14, an air flow path is generated between the insulating substrate 13 and the transparent substrate 14. Can be released to the outside, whereby the heat radiation efficiency can be further enhanced.

  FIG. 6 is a diagram schematically showing a state in which the LED lighting device 30 shown in FIG. 5 is installed on the ceiling in the room, which is much thinner than a conventional LED lighting device using a heat sink. It can also be used as a lighting device, and is highly valuable as an interior.

(Embodiment 2)
In the LED illumination light source 10 according to the first embodiment of the present invention shown in FIG. 1, the first and second LEDs 11a and 11b are surface mounted on the insulating substrate 13 and the transparent substrate 14 by the flip chip method. Similar effects can be obtained for non-type LEDs.

  7-9 is a figure explaining the mounting method to the insulated substrate 13 and the transparent substrate 14 in LED which is not a surface mounting type.

  In the mounting method shown in FIG. 7, the first electrode terminal 40a of the first LED 11a is wire-bonded to the first electrode 42a formed on the surface of the insulating substrate 13, and the second electrode terminal of the first LED 11a. 41a is directly flip-chip bonded to the second electrode 43a formed on the surface of the insulating substrate 13a. Similarly, the first electrode terminal 40b of the second LED 11b is wire-bonded to the first electrode 42b formed on the surface of the transparent substrate 14, and the second electrode terminal 41b of the second LED 11b is transparent substrate 14 is directly flip-chip bonded to the second electrode 43b formed on the surface.

  In the first and second LEDs 11a and 11b, the LED chip surface on which the first electrode terminals 40a and 40b are formed forms an emission surface, so that the light emitted from the first LED 11a passes through the transparent substrate 14. The light that passes through and is emitted to the outside and is emitted from the second LED 11 b is reflected by the reflecting plate 15 formed on the insulating substrate 13, and then passes through the transparent substrate 14 and is emitted to the outside.

  In the mounting method shown in FIG. 8, the mounting direction of the second LED 11b shown in FIG. 7 on the transparent substrate 14 is reversed. That is, the first electrode terminal 40b of the second LED 11b is directly flip-chip bonded to the first electrode 42b formed on the surface of the transparent substrate 14, and the second electrode terminal 41b is formed on the surface of the transparent substrate 14. The second electrode 43b is wire-bonded. In this case, since the light emitted from the second LED 11b passes through the transparent substrate 14 and is emitted to the outside, it is not necessary to provide the reflecting plate 15 on the insulating substrate.

  In the mounting method shown in FIG. 9, the LED 11 is disposed between the insulating substrate 13 and the transparent substrate 14, and the first electrode terminal 41 formed on the surface opposite to the emission surface of the LED 11 is on the main surface of the insulating substrate 13. The second electrode terminal 40 connected to the first electrode 43 formed by the flip chip mounting and formed on the emission surface of the LED 11 is a second electrode formed on the first main surface of the transparent substrate 14. The electrode 42 is connected to the flip chip mounting.

  7 and 8, the heat generated in the first LED 11a is radiated from the insulating substrate 13 and the heat generated in the second LED 11b is radiated from the transparent substrate. In the mounting method shown in FIG. 4, the heat generated in the LED 11 is different from the insulating substrate 13 and the transparent substrate 14 in that it is dissipated, but both have the same LED mounting density, so that the heat dissipation efficiency is high. Are the same.

(Embodiment 3)
As described above, the inventor of the present application needs to secure a certain amount of space between the substrates in order to efficiently release the heat radiated from the substrates acting as the radiation fins to the outside. Focusing on a certain point, the present invention was conceived.

  That is, in the present invention, the plurality of LEDs are distributed and mounted on different substrates by arranging the plurality of LEDs without overlapping each other between the different substrates while having the effect as the heat radiation fins on different substrates. Its essential features.

  From this point of view, the present invention is not limited to the case where a plurality of LEDs are distributed and mounted on two different substrates as described in the first and second embodiments, but also on three or more substrates. The LEDs can be sorted in a similar manner.

  10 and 11 are diagrams illustrating an example in which a plurality of LEDs are distributed to three substrates.

  As shown in FIG. 10, the insulating substrate 13, the first transparent substrate 14, and the second transparent substrate 17 are arranged in parallel with each other at a predetermined interval. The first LED 11 a is flip-chip mounted on the insulating substrate 13, the second LED 11 b is flip-chip mounted on the first transparent substrate 14, and the third LED 11 c is flip-chip mounted on the second transparent substrate 17. Has been implemented. The first and second LEDs 11a and 11b are arranged so as not to overlap in the space between the insulating substrate 13 and the transparent substrate 14, and the third LED 11c is arranged on the first and second transparent substrates 14 and 16. It is arranged in the space part between. Note that the third LED 11c is disposed at a position that does not overlap the first and second LEDs 11a and 11b when viewed from the direction perpendicular to the substrate (from the bottom to the top of the page).

  The light emitted from the first LED 11a passes through the transparent substrates 14 and 16 and is emitted to the outside. The light emitted from the second LED 11b is reflected by the reflecting plate 15 formed on the insulating substrate 13, passes through the transparent substrates 14 and 16, is emitted to the outside, and is emitted from the third LED 11c. The light is reflected by the reflecting plate 15 formed on the transparent substrate 14, then passes through the transparent substrate 17 and is emitted to the outside. Thus, the light emitted from the first, second, and third LEDs 11a, 11b, and 11c passes through the transparent substrate 17 and is emitted in the same direction.

  In the third embodiment, the heat generated from the LEDs 11a, 11b, and 11c that are mounted on the three different substrates 13, 14, and 16 without being superimposed on each other is dissipated from the substrate on which each is mounted. Therefore, the heat radiation effect is about three times that of the LED illumination light source mounted on the same substrate at the same density. Moreover, since the mounting density of the LEDs mounted on one substrate is one third, the heat source from the LEDs is dispersed on the three substrates, and heat can be radiated more effectively. Furthermore, since an airflow path is generated between the substrates, the heat dissipation effect is further enhanced.

  In the example shown in FIG. 11, as shown in FIG. 10, instead of arranging the second LED 11 b in the space between the insulating substrate 13 and the first transparent substrate 14 without overlapping the first LED 11 a, The third LED 11c is arranged in the space between the first transparent substrate 14 and the second transparent substrate 17 without overlapping. In this case, since the light emitted from the second LED 11b passes through the transparent substrate 14 and is emitted to the outside, it is not necessary to provide the reflecting plate 15 on the insulating substrate.

  As mentioned above, although this invention was demonstrated by suitable embodiment, such description is not a limitation matter and of course various modifications are possible.

  For example, in the embodiment of the present invention, a surface-emitting LED is used as an LED mounted on a substrate, but an edge-emitting LED (a light quantity more than ½ of the total luminous flux is emitted from the end surface (side surface). Can be used). In that case, when an edge-emitting LED is mounted on a substrate, in order to obtain emitted light in the same direction as the surface-emitting LED, a configuration as shown in FIG. In other words, the edge-emitting LED 11 is flip-chip mounted on the substrate 13, the reflecting portion 50 having a reflecting surface is installed on the side surface side of the LED 11, and the light emitted from the end surface of the LED 11 is reflected by the reflecting surface, It is emitted in the direction of 52. In this case, if the space between the LED 11 and the reflecting portion 50 is filled with a fluorescent agent, white light can be obtained by using a blue LED as the LED 11.

  In the embodiment of the present invention, the LED to be mounted is not particularly limited. For example, in FIG. 10 or FIG. 11, red, green, and blue LEDs are used as the first to third LEDs 11a, 11b, and 11c. It is also possible to obtain a white LED lighting source in which red, green and blue are mixed. In this case, since the green LED has low light emission efficiency, it is preferable to mount the green LED on the transparent substrate 17 as the third LED 11c. Based on the same idea, since the red LED has high luminous efficiency, it is preferable to mount it on the insulating substrate 13 as the first LED 11a. In order to reduce color unevenness, the type of LED mounted on each substrate is not limited. For example, red, green, and blue LEDs may be mounted on the transparent substrate 17 at appropriate positions. It is also possible to use not only chromatic (red, green, blue) LEDs but also white LEDs or LEDs coated with phosphors.

  Furthermore, in the embodiment of the present invention, the example in which the LED is mounted on the substrate via the bump has been described. However, as shown in FIG. 13, the LED 11 is bump-mounted on the electrode 42 formed on the substrate 13. Alternatively, as shown in FIG. 14, the LED 11 previously mounted on the submount 60 may be mounted on the substrate 13.

  According to the present invention, it is possible to provide a small LED illumination light source with high heat dissipation efficiency while increasing the density of LEDs.

Sectional drawing which shows the structure of the LED illumination light source 10 which concerns on Embodiment 1 of this invention. The top view which shows arrangement | positioning of 1st LED11a in Embodiment 1 of this invention. (A) is a top view of the reflecting plate 15 in Embodiment 1 of this invention, (b) is sectional drawing of the state which installed the reflecting plate 15 in the insulated substrate 13 (A)-(d) is process drawing which shows the manufacturing method of the LED illumination light source which concerns on Embodiment 1 of this invention. Sectional drawing which shows the structure of the LED lighting apparatus 30 in Embodiment 1 of this invention. The figure which shows the state which installed the LED lighting apparatus 30 in Embodiment 1 of this invention in the ceiling Sectional drawing which shows the mounting method of LED in Embodiment 2 of this invention Sectional drawing which shows the mounting method of the other LED in Embodiment 2 of this invention. Sectional drawing which shows the implementation method of the other LED in Embodiment 2 of this invention Sectional drawing which shows the mounting method of LED in Embodiment 3 of this invention Sectional drawing which shows the mounting method of the other LED in Embodiment 3 of this invention. Sectional drawing which shows the mounting method of edge-emitting LED of this invention Sectional drawing which shows the other mounting method of LED in this invention Sectional drawing which shows the other mounting method of LED in this invention Sectional drawing which shows the structure of the conventional LED illumination light source 100 Sectional drawing which shows the structure of the conventional LED illumination light source 100 '

Explanation of symbols

10 LED illumination light source 11a 1st LED
11b Second LED
11c 3rd LED
12a, 12b Bump electrode 13 Insulating substrate 14, 17 Transparent substrate 15 Reflector 16 Spacer 20 Connection wiring 30 LED lighting device 31 Housing 32 Opening 33 Lighting circuit 40a, 40b, 41a, 41b Electrode terminal 42a, 42b, 43a, 43b Electrode 50 Reflector 51 Fluorescent agent 60 Submount 100 LED illumination light source 101 LED chip 102 Substrate 103 Heat sink

Claims (10)

An insulating substrate;
A transparent substrate disposed opposite the insulating substrate;
A plurality of first LEDs mounted on a first main surface of the insulating substrate;
An LED illumination light source comprising a plurality of second LEDs mounted on the first main surface of the transparent substrate,
The first main surface of the insulating substrate and the first main surface of the transparent substrate are arranged to face each other with a space portion interposed therebetween,
The LED illumination light source, wherein the first LED and the second LED are arranged without overlapping each other in the space portion. 2. The LED illumination light source according to claim 1, wherein the first LED and the second LED are alternately arranged in the space portion without overlapping each other. The first LED is flip-chip mounted on the first main surface of the insulating substrate,
The LED illumination light source according to claim 1, wherein the second LED is flip-chip mounted on the first main surface of the transparent substrate. 2. The LED illumination light source according to claim 1, wherein a plurality of reflecting plates are installed between the first LEDs mounted on the first main surface of the insulating substrate. 5. The LED illumination light source according to claim 4, wherein the plurality of reflection plates are installed at positions facing the second LEDs mounted on the first main surface of the transparent substrate. The light emitted from the first LED passes through the transparent substrate and is emitted to the outside from the second main surface of the transparent substrate,
The light emitted from the second LED is reflected by a reflecting plate installed on the first main surface of the insulating substrate, and the reflected light passes through the transparent substrate and the second light of the transparent substrate. 6. The LED illumination light source according to claim 4, wherein the LED illumination light source is emitted from the main surface to the outside. The LED illumination light source according to claim 1, wherein the transparent substrate is made of a ceramic substrate. 2. The LED illumination light source according to claim 1, wherein the plurality of second LEDs are electrically connected to each other through a transparent electrode formed on the first main surface of the transparent substrate. An insulating substrate;
A plurality of LEDs disposed on the main surface of the insulating substrate;
A transparent substrate disposed to face the main surface of the insulating substrate;
An LED illumination light source comprising:
The first electrode terminal formed on the surface opposite to the LED emission surface is connected to the first electrode formed on the main surface of the insulating substrate,
The LED illumination light source, wherein the second electrode terminal formed on the emission surface of the LED is connected to the second electrode formed on the first main surface of the transparent substrate. 10. The LED illumination light source according to claim 9, wherein the light emitted from the plurality of LEDs passes through the transparent substrate and is emitted from a second main surface of the transparent substrate.

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