JP5614794B2 - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
JP5614794B2
JP5614794B2 JP2009019855A JP2009019855A JP5614794B2 JP 5614794 B2 JP5614794 B2 JP 5614794B2 JP 2009019855 A JP2009019855 A JP 2009019855A JP 2009019855 A JP2009019855 A JP 2009019855A JP 5614794 B2 JP5614794 B2 JP 5614794B2
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light emitting
substrate
light
emitting elements
mounting surface
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JP2009218204A (en
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田中 敏也
敏也 田中
斉藤 明子
明子 斉藤
河野 仁志
仁志 河野
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東芝ライテック株式会社
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Description

The present invention relates to a lighting device using a light emitting module provided with a light emitting element such as an LED .

  2. Description of the Related Art Conventionally, there has been proposed a lighting fixture including an LED module having a power feeding terminal portion and mounting an LED chip, and a fixture main body provided with a holding member that detachably holds the LED module (see Patent Document 1). Moreover, what provided the terminal part for connecting an electric power feeding wire directly to an LED module is proposed in order to replace | exchange LED module easily or to divert it to various instruments (refer patent document 2).

JP 2003-68129 A JP 2003-59330 A

  However, what is shown in Patent Document 1 is not clearly shown, but is a mixture of at least LED chips and circuit components on the LED module surface. Therefore, there is no disclosure of the technical idea of improving the light distribution of the light emitted from the LED chip. Further, the back surface of the LED module is not actively used as a heat dissipation surface. Furthermore, this LED module has a specific mounting / connecting structure due to the configuration of the power supply terminal portion and the holding member, and does not have versatility because it requires a dedicated adapter.

  Similarly, the one disclosed in Patent Document 2 is a mixture of LED chips and circuit components on the LED module surface. Therefore, there is no disclosure of a specific technical idea for improving the light distribution of the light emitted from the LED chip.

The present invention has been made in view of the above situation, and an object of the present invention is to provide an illumination device using a light-emitting module with good light emission efficiency and light distribution characteristics.

The lighting device according to claim 1 is assembled into a device main body; a disk-shaped substrate that is incorporated in the device main body, the front surface side is a component mounting surface, and the rear surface side is a flat heat dissipation surface; and the component mounting surface of the substrate A plurality of protrusions are provided only in the central portion, and are electrically connected to the light emitting elements by a light emitting element that emits light in at least the upper surface direction and the direction along the component mounting surface, and a wiring pattern provided on the substrate. together, a component mounting surface of the substrate, a light emitting module that includes a lighting circuit component which is arranged on the peripheral edge of the substrate than all of the light emitting element; and upper and lower edges are open, toward the irradiation direction A reflector that is formed in an expanding bowl shape and is interposed between all of the plurality of light emitting elements and the lighting circuit component disposed in the light emitting module so as to partition them. A lighting device characterized by the above.

The illumination device according to claim 2 is the illumination device according to claim 1 , wherein a plurality of light emitting elements in the light emitting module are arranged at equal intervals so as to be rotationally symmetric except for a central point of a central portion of a component mounting surface of the substrate. It is characterized by being arranged individually.

According to the first aspect of the present invention, it is possible to satisfactorily optimize the light distribution of the light emitted from the light emitting element. In addition, it is possible to provide a lighting device that can promote the heat dissipation effect and can efficiently distribute the emitted light from the light emitting element.

  According to the second aspect of the present invention, since a plurality of light emitting elements are arranged, heat can be radiated from the vicinity of the center point of the substrate to the back side of the substrate in a concentrated manner, and a substantially uniform light distribution characteristic is obtained in the horizontal direction. It becomes possible.

According to the third aspect of the present invention, it is possible to provide a lighting device that suppresses uneven luminance and has good efficiency.

It is a top view which shows 1st Embodiment of the light emitting module used for the illuminating device of this invention. It is a partial side view which expands and shows the light emitting element. It is a circuit diagram of the light emitting module. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic block diagram which shows 1st Embodiment of the illuminating device of this invention. It is a schematic block diagram which shows 2nd Embodiment as reference embodiment of the same illuminating device. It is a schematic block diagram which shows 3rd Embodiment as reference embodiment of the illuminating device. It is a top view which shows the modification of the light emitting module of 1st Embodiment. It is the top view and side view which show the light emitting element (LED package) in 1st Embodiment of a light emitting module. It is a graph which shows the directivity characteristic of the emitted light of a light emitting element. It is a top view which shows the arrangement | positioning state of a light emitting element. It is a schematic diagram which shows the illumination intensity distribution in the floor surface at the time of lighting a light emitting module. It is a graph which shows the brightness nonuniformity and efficiency based on the space | interval of a light emitting element. It is explanatory drawing which shows the other example of application of a light emitting element.

Hereinafter, a first embodiment of a light emitting module used in the illumination device of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is a plan view showing a light emitting module, FIG. 2 is a partial side view showing an enlarged light emitting element, and FIG. 3 is a circuit diagram of the light emitting module. In FIG. 1, the light emitting module 1 includes a disk-shaped substrate 2, light emitting elements 3... Mounted on the substrate 2, a lighting circuit component 4, and a power supply connector 5.

  The substrate 2 is made of aluminum and is formed in a disc shape, and has a plate thickness of about 1.5 mm and a diameter of about 70 mm. The substrate 2 is configured such that the front surface side 2a is a component mounting surface and the back surface side 2b is a flat heat dissipation surface. On the component mounting surface, eight light emitting elements 3... Are mounted at a predetermined interval so as to be concentrated on the central portion. In addition, when making the board | substrate 2 metal, it is preferable to apply the material which has favorable heat conductivity, such as aluminum and copper, and was excellent in heat dissipation. When the insulating material is used, a ceramic material or a synthetic resin material containing a heat conductive filler having relatively good heat dissipation characteristics and excellent durability can be applied. When a synthetic resin material is used, it can be formed of, for example, a glass epoxy resin. The shape of the substrate 2 is not limited to a circular shape. It may be square or polygonal.

  The light emitting elements 3... Are surface-mounted LED packages, which are roughly a main body 3a formed of ceramics, an LED chip mounted on the main body, and an epoxy-based resin that seals the LED chip. And a translucent resin 3b for molding such as silicone resin (see FIG. 2). A pair of lead terminals (not shown) connected to the LED chip protrude from the main body 3a in the horizontal direction. Four LED chips are mounted on the LED package, and each LED chip is connected in series between the electrodes of the package. Accordingly, since eight LED packages each having four LED chips are arranged, 32 LED chips are arranged. Of course, a type in which one LED chip is mounted on the LED package is also applicable.

  The LED chip is a blue LED chip that emits blue light. The translucent resin 3b for molding contains a phosphor that absorbs light emitted from the LED chip and generates yellow light, and is molded with a predetermined thickness so as to form a flat plate from the upper surface of the main body 3a. Has been. Therefore, the light from the LED chip is radiated to the outside with a wide range of light distribution characteristics as a result of a white light-emitting color such as white or light bulb color from the top and side surfaces of the translucent resin 3b of the LED package. It is like that. That is, light is emitted from the light emitting elements 3... In the upper surface direction and the direction along the component mounting surface. Incidentally, the outer dimensions of the LED package are about 3.5 mm in length, 3.5 mm in width, and about 1.5 mm in height, and have a substantially rectangular parallelepiped shape.

  An insulating layer is formed on the surface of the substrate 2, and a connection land to which a wiring pattern (not shown) and lead terminals of surface mount components are connected is formed on the insulating layer. In the central portion excluding the central point of the substrate 2, the light emitting elements 3... Are rotationally symmetric along the surface direction of the substrate 2 with the central point as a rotation axis (in the present embodiment, the light emitting elements 3. Are arranged at a predetermined interval (3 mm to 15 mm, preferably 5 mm to 10 mm) so as to be symmetrical. A lighting circuit component 4 is mounted on the outer peripheral edge side of the substrate 2. Note that the lighting circuit component 4 is not mounted between the light emitting elements 3 and 3. The lighting circuit component 4 controls lighting of the LED chip, and includes a fuse F, a capacitor C, a rectifier REC, a constant voltage diode ZD, resistance elements R1 and R2, and a transistor Q. Similarly, a power supply connector 5 is disposed around the light emitting elements 3. The connector 5 is disposed so that the connection port 5a faces the outer peripheral edge of the substrate 2 and is located in the vicinity of the outer peripheral edge. This is to facilitate the connection with the power line of the commercial power supply. Note that the lighting circuit component 4 and the connector 5 are located on the peripheral side of the substrate 2 with respect to the light emitting elements 3... The outer periphery of the substrate 2 is approximately 1/3 of the outer periphery. Note that a white resist having a high reflectance is printed on the mounting surface of the substrate 3, and screw through holes 6 for attachment to an apparatus or the like are formed at three locations.

  The light emitting elements 3... Protrude in the height direction from the mounting surface of the substrate 2 and emit light radially as indicated by the arrows shown in FIG. 2 from the protruding portion of the translucent resin 3b. It has become. Therefore, not only the light LV emitted in the direction perpendicular to the mounting surface (upper surface direction) but also the light LH emitted along the component mounting surface from the side surface of the translucent resin 3b of the LED package can be used. It has become.

  In the circuit diagram of FIG. 3, a capacitor C is connected to both ends of the commercial power supply AC via a fuse F. A full-wave rectifier REC is connected to both ends of the capacitor C, and a series circuit of a resistor element R1 and a constant voltage diode ZD, a plurality of LED chips LED, an NPN transistor Q, and a resistor are connected to the output terminal of the full-wave rectifier REC. The series circuit of the element R2 is connected in parallel. The base of the transistor Q is connected to the connection point between the resistance element R1 and the constant voltage diode ZD. As described above, since the LED package has four LED chips connected in series, a series circuit of a transistor Q and a resistance element R2 is configured for each LED package and connected in parallel to each other. Also good.

A constant current circuit is configured by the circuit as described above, and the current supplied from the commercial power supply AC is converted to a direct current, and this direct current is applied to the series circuit of the LED chip LED, the transistor Q, and the resistance element R2 as a constant current I. It flows as F. Specifically, the current I C flowing into the collector of the transistor Q leave the base voltage V B of the transistor Q constant by the constant voltage diode ZD is kept constant, and consequently the constant current I F flowing through the LED chip.

  As described above, according to the present embodiment, the light emitting elements 3... Are disposed at the center of the component mounting surface of the substrate 2, and the lighting circuit components 4 and the power supply connector 5 are disposed around the light emitting elements 3. Therefore, the light LH emitted from the side surfaces of the light emitting elements 3..., That is, the LED package can be used effectively, and light distribution can be optimized and optimized. That is, when the light emitting elements 3..., The lighting circuit component 4 and the power supply connector 5 are arranged in a mixed manner, particularly the light LH emitted from the side surface of the LED package is the lighting circuit component 4. As a result, the light extraction rate of the emitted light is increased, the emitted light cannot be used effectively, the illumination efficiency is lowered, and the optimization of the light distribution is hindered. In this embodiment, since the decrease in the light extraction rate of the emitted light by the lighting circuit component 4 or the like is reduced, the light LH emitted from the side surface can be effectively used. For example, the reflected light LH can be obtained using a reflector. Can be irradiated in the direction of the irradiated surface. In addition, since the light emitting elements 3..., The lighting circuit component 4 and the connector 5 for connecting the power source are respectively integrated, the wiring pattern of the substrate 2 can be shortened and simplified. Further, since the light-emitting elements 3... That are heat sources are not arranged at the center point of the substrate 2 and the back side is a flat heat radiating surface, the heat radiating surface is brought into contact with another heat radiating body so The structure which can transfer heat efficiently to the side and accelerates the heat dissipation effect can be easily achieved. Further, since the power supply connector 5 is modularized, the board module 1 can be configured as a lighting device simply by incorporating the board module 1 into the apparatus body and the like, and then connecting the commercial power supply to the connector 5. The light emitting module 1 that can be handled as a part and has a wide application range can be provided. Further, since the connector 5 is arranged so that the connection port 5a is located in the vicinity of the outer peripheral edge of the substrate 2, it is easy to connect with the power line of the commercial power source, Since the white resist is printed, the reflection efficiency is good.

  Next, the 1st Embodiment of the illuminating device of this invention is described with reference to FIG. FIG. 4 is a schematic configuration diagram of the illumination device. The illuminating device 10 is, for example, a downlight, and has an instrument main body 11, a metal radiator 12 having a radiation fin in the instrument main body 11, a light emitting module 1 attached to the radiator 12, and The reflector 13 is accommodated. The light emitting module 1 is attached by screwing so that the heat radiating surface of the back side 2b of the substrate 2 is in close contact with the heat radiating body 12 via the silicone rubber sheet. Of course, this attachment may be performed by means such as adhesion, not by screwing. The reflector 13 is formed in a bowl shape having a gently curved surface, with upper and lower edges opened, an upper edge serving as an attachment opening 13a, and a lower edge serving as an irradiation opening 13b.

  Here, the mounting opening 13a of the reflector 13 is in the positional relationship with the light emitting module 1, that is, in the positional relationship with the component mounting surface of the substrate 2, and the light emitting element 3 disposed in the central portion of the substrate 2. ... and the lighting circuit component 4 and the connector 5 for connecting the power source disposed around the. That is, since the light emitting elements 3... And the lighting circuit components 4 etc. are partitioned by the reflector 13, the light emitted from the light emitting elements 3. Reflected by the reflector 13 and irradiated downward. Further, since the lighting circuit component 4 cannot be seen from the surface side of the reflector 13, the appearance of the lighting device 10 is also improved.

  According to the present embodiment, in addition to the effects produced by the light emitting module 1 described above, it is possible to provide the lighting device 10 that can more efficiently distribute the emitted light from the light emitting elements 3.

  In addition, the illuminating device is not limited to the above-described embodiment, and may be configured by incorporating the light emitting module 1 into a light source having a base, or may be configured by incorporating in an indoor or outdoor lighting fixture.

Then, 2nd Embodiment is described with reference to FIG. 5 as reference embodiment of the illuminating device of this invention. In the present embodiment, a downlight type illumination device using a light bulb shaped LED lamp as a light source is shown.

  In FIG. 5, the lighting device installed on the ceiling surface includes a device main body 10 and a light bulb-shaped light source 20 attached to the device main body 10. The light source 20 includes a light emitting module 1 according to the first embodiment in which the light emitting elements 3... Are mounted, a main body 21 as a heat radiating member thermally coupled to the light emitting module 1, and an insulating member on the main body 21. For example, a globe 22 attached to the main body 21 so as to cover the E26 type base and the light emitting module 1 is provided.

  The apparatus main body 10 includes a case 15 having a metal box shape having an opening on the lower surface, and a metal reflector 16 fitted into the opening of the case 15. The reflector 16 is formed of, for example, a metal plate such as aluminum, and a decorative frame 16a is formed around the lower surface. A socket 17 into which a base of the light source 20 is screwed is disposed at the center of the upper surface plate of the reflector 16. The socket 17 is attached to the case 15 via a support plate 18 fixed inside the case 15.

  According to this embodiment, the illuminating device provided with the lightbulb-shaped LED lamp which has the effect of the above-mentioned light emitting module 1 can be provided.

Furthermore, a third embodiment will be described with reference to FIG. 6 as a reference embodiment of the illumination device of the present invention. In addition, the same code | symbol is attached | subjected to the same or same or an equivalent part as 2nd Embodiment, and the overlapping description is abbreviate | omitted. The present embodiment shows a downlight type illumination device that uses an LED lamp formed in a thin shape with a small dimension in the height direction as the light source 20. Similarly, the light source 20 incorporates the light emitting module 1 of the first embodiment, and the light emitting module 1 is thermally coupled with a main body 21 as a heat radiating member. Further, the base is provided with a connection pin 25 and is formed in the shape of GX53. On the other hand, on the case 15 side, a socket 17 to which a base connection pin 25 is electrically and mechanically connected is disposed.

  As described above, according to the present embodiment, it is possible to provide an illumination device including a thin LED lamp that exhibits the effect of the light emitting module 1.

  Next, a modification of the light emitting module of the first embodiment will be described with reference to FIG. FIG. 7 is a plan view showing the light emitting module. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 1st Embodiment, or an equivalent part, and the overlapping description is abbreviate | omitted.

  The lighting circuit component 4 is mounted on the component mounting surface of the substrate 2 in a concentrated manner at the center thereof. The lighting circuit component 4 includes a fuse F, a capacitor C, a rectifier REC, a constant voltage diode ZD, resistance elements R1 and R2, and a transistor Q. On the other hand, the light emitting elements 3... Are mounted around the lighting circuit component 4 with a predetermined interval. The power supply connector 5 is disposed so that the connection port 5a is positioned in the vicinity of the outer peripheral edge of the substrate 2. The power supply connector 5 is preferably in the vicinity of the outer peripheral edge of the substrate 2 in consideration of the connection with the power supply line, but may be disposed together with the lighting circuit component 4 in the center of the substrate 2. In this modification, the arrangement relationship between the light emitting elements 3... And the lighting circuit components 4 of the first embodiment is opposite, and the mounting interval of the light emitting elements 3... Is larger than that of the first embodiment. It is common with the first embodiment in that the light LH emitted from the side surface of the LED package can be used effectively. By increasing the interval between the light emitting elements 3. Can be transferred to the back side of the substrate 2 by using the entire substrate 2 to dissipate heat.

  Next, in the light emitting module 1 in the above-described first embodiment, the interval between the light emitting elements 3 mounted on the substrate 2, the degree of luminance unevenness based on the interval, and the change in the light emission efficiency are examined. The embodiment described above will be described with reference to FIGS.

  In FIG. 8, the light emitting elements 3... Are surface-mounted LED packages, and include a main body 3a, an LED chip mounted on the main body 3a, and a translucent resin 3b that seals the LED chip. The portion of the translucent resin 3b is configured to function as the light emitting portion L. As shown in FIG. 8A, the light emitting portion L is formed in a substantially square shape having a side W of 2.8 mm, and the diagonal dimension a is about 4 mm. Further, as shown in FIG. 8B, the light emitting elements 3... Mounted on the substrate 2 have a height dimension b from the mounting surface of the substrate 2 to the upper surface of the light emitting portion L of 1.5 mm. In addition, the height dimension h of the light emitting portion L is 0.7 mm.

  FIG. 9 is a graph showing the directivity characteristics of the light emitting elements 3. The light emitting element 3 has the maximum illuminance at the right upper surface direction, that is, the radiation angle of 0 °, and is 40% or more of the maximum illuminance at the side surface direction, for example, the radiation angle of 80 °, and 50% or more of the maximum illuminance at the radiation angle of 70 °. The predetermined light is radiated in the direction along the component mounting surface.

  The light emitting elements 3... Having such a form and characteristics are arranged at a predetermined interval as shown in FIG. And this space | interval was changed and luminance unevenness and luminous efficiency were evaluated and measured.

  Here, as illustrated, the minimum dimension between the light emitting portions L1 and L2 of the adjacent light emitting elements 3... Is c, and the width dimension of the light emitting portions L1 and L2 on the line of the minimum dimension c is a. Further, the method for evaluating the luminance unevenness is performed based on visual evaluation by lighting the light emitting module 1 at a height of 2.5 m from the floor and observing the illumination state of the floor when the floor is illuminated. It was. This visual evaluation is an observation of the illuminance distribution on the floor as shown in FIG. Incidentally, the figure schematically represents the boundary where the difference in illuminance occurs, specifically, the appearance of the light emission patterns of the light emitting elements 3... (Mounting pattern image of the light emitting elements 3. It is what. Therefore, A is ranked with no brightness unevenness, B with little concern for brightness unevenness, C with brightness unevenness, and D with clearly visible brightness unevenness. . In general, if the interval between the light emitting portions L of the light emitting elements 3... Is narrow, the luminance unevenness is eliminated, but the adjacent light emitting elements 3. If the interval between the light emitting portions L is wide, the efficiency is increased, but uneven luminance tends to occur.

  As a result of the evaluation and measurement, the evaluation and measurement values shown in FIG. 12 were obtained. In the figure, the horizontal axis is the interval c between the light emitting parts L of the light emitting elements 3..., And the vertical axis is the evaluation value of luminance unevenness and the measured value of efficiency. The luminance unevenness gradually decreases and gets worse as the interval c exceeds 4 mm. Further, the efficiency increases as the distance c increases, but it has been found that when the distance c exceeds 8 mm, the efficiency becomes saturated.

  Considering the above results, the allowable range of luminance unevenness is around the C rank, and considering the efficiency, the interval c between the light emitting elements 3... Is in the range of b <c <4a. It was confirmed that it was preferable. Moreover, in the said range, it came to the view that the optimal range which raises evaluation of efficiency and brightness nonuniformity further, and improves a lighting effect further is the range of 2b <= c <= 3a. Furthermore, in order to suppress the influence of heat generation between the light emitting elements 3..., A <c is optimal as an arrangement pattern. By setting a <c, an increase in temperature during light emission of the light emitting elements 3... can be suppressed. Note that the lower limit value of the interval c can also be expressed by using the height dimension h of the light emitting portion L. When this height dimension h is used, the relationship is approximately 2h <c, preferably 4h ≦ c.

  In the present embodiment, the relationship between the light emitting portions L1 and L2 of the light emitting elements 3 ... shown in FIG. 10 has been described, but for example, the dimensional relationship of the interval c is the same for the light emitting portions L2 and L3. is there. Moreover, each dimension, directivity, etc. of the light emitting elements 3... Are not limited to the specific dimensions and characteristics of the embodiment. The mounting pattern of the light emitting elements 3... Is not limited to that mounted along the circumference as shown in FIG. The minimum dimension c between the respective light emitting elements 3... Only needs to be within the predetermined range, and may be mounted in a matrix, for example.

  Further, as the light emitting element, a light emitting element 30 as shown in FIG. 13 can be applied. The light emitting element 30 is a surface mount type LED package, and the LED package is formed of a main body 30a formed of ceramics, a reflector 30d provided on the main body 30a, a main body 30a, and a reflector 30d. The LED chip 30c is mounted in the recess, and a silicone resin 30e that seals the LED chip 30c. The silicone resin 30e portion functions as the light emitting portion L, and light is emitted from the light emitting portion L in a radial pattern similar to the directivity shown in FIG. 9 as a whole including the upper surface direction and the direction along the component mounting surface. It has become.

1 ... light emitting module, 2 ... substrate, 2a ... substrate surface side,
2b ... back side of substrate, 3 ... light emitting element (LED package),
4 ... lighting circuit components, 5 ... connector for power supply connection, 10 ... lighting device

Claims (2)

  1. The device body;
    Incorporated in the apparatus main body, the front surface and the component mounting surface, a disk-shaped substrate for the back side and flat radiating surfaces, while being more disposed to project only the central portion of the mounting surface of the substrate, A light emitting element that emits light in at least the upper surface direction and a direction along the component mounting surface, and a light emitting element that is electrically connected by a wiring pattern provided on the substrate, A light emitting module comprising a lighting circuit component disposed on the peripheral side of the substrate with respect to the light emitting element;
    Upper and lower edges are opened and formed in a bowl shape that expands in the irradiation direction, and these light emitting modules are arranged between all the light emitting elements and the lighting circuit components. A reflector interposed between;
    An illumination device comprising:
  2.   2. The lighting device according to claim 1, wherein a plurality of light emitting elements in the light emitting module are arranged at equal intervals so as to be rotationally symmetric except for a central point of a central portion of a component mounting surface of a substrate. .
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