CN105098046B - LED light source substrate and preparation method thereof and LED light source - Google Patents
LED light source substrate and preparation method thereof and LED light source Download PDFInfo
- Publication number
- CN105098046B CN105098046B CN201410212223.4A CN201410212223A CN105098046B CN 105098046 B CN105098046 B CN 105098046B CN 201410212223 A CN201410212223 A CN 201410212223A CN 105098046 B CN105098046 B CN 105098046B
- Authority
- CN
- China
- Prior art keywords
- radiator structure
- substrate
- radiator
- light source
- led light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The present invention provides a kind of LED light source substrates, comprising: has the substrate of at least three radiator structures, the thermally conductive intensity that the corresponding radiator structure of LED core panel region is preset in the substrate is greater than other radiator structures；Reflecting layer and insulating layer positioned at the copper foil layer of the substrate surface and positioned at the copper foil layer surface.Thermally conductive intensity due to presetting the corresponding radiator structure of LED core panel region is greater than other radiator structures, so that the heat that LED chip generates can distribute to the greatest extent, improve the heat-sinking capability of LED light source substrate, the performance parameter for stabilizing LED light source increases the service life of LED light source.It is very good insulating materials also, since the base material of LED light source substrate of the invention is heat-conducting plastic PA, therefore, eliminates insulating layer compared to traditional substrate, saved cost, simplified manufacture craft.
Description
Technical field
The present invention relates to technical field of semiconductor illumination, more specifically to a kind of LED light source substrate and its production side
Method and LED light source.
Background technique
The PN junction temperature of LED (Light Emitting Diode, light emitting diode) chip, can not only determine the longevity of LED
Life, it is also possible to LED can be made to generate color drift, go out phenomena such as light is uneven, influence the light-out effect of LED.Based on this, it is desirable to improve
The service life of LED improves its light-out effect, it is important to the PN junction temperature of LED chip is reduced, and the key for reducing PN junction temperature is
Using the good substrate of heat dissipation performance as radiator, so that the heat of generation is distributed in time.
Currently, high-power LED mainly uses COB (Chip On Board, integrated optical source) integration packaging mode, it is this
Requirement of the packaged type than conventional packaged type to heat dissipation is higher, and therefore, the requirement to substrate heat dissipation performance is also higher.Usually
The structure for the LED light source substrate that COB integration packaging uses is as shown in Figure 1, include aluminium substrate 1, insulating layer 2, copper foil layer 3 and reflection
Layer 4, wherein LED chip 5 is normally at the surface in reflecting layer 4.But the LED light source substrate of this structure can not be by LED
The heat that chip generates effectively is conducted to outside, and heat dissipation performance is poor, will affect performance and the service life of LED light source.
Summary of the invention
In view of this, the present invention provides a kind of LED light source substrate and preparation method thereof and LED light source, it is existing to solve
The problem of LED light source substrate heat dissipation performance is poor in technology, influences LED light source performance and service life.
To achieve the above object, the invention provides the following technical scheme:
A kind of LED light source substrate, comprising:
Substrate at least three radiator structures presets the corresponding radiator structure of LED core panel region in the substrate
Thermally conductive intensity is greater than other radiator structures；
Reflecting layer and insulating layer positioned at the copper foil layer of the substrate surface and positioned at the copper foil layer surface.
Preferably, at least three radiator structure are as follows: in concentric ring-shaped and successively arrange outward along the center of circle first
Radiator structure, the second radiator structure and third radiator structure.
Preferably, first radiator structure corresponds to the default LED core panel region, and first radiator structure is led
Calorific intensity is greater than second radiator structure, and the thermally conductive intensity of second radiator structure is greater than the third radiator structure.
Preferably, the semidiameter of first radiator structure and second radiator structure is equal to second radiator structure
With the semidiameter of the third radiator structure.
Preferably, the ratio between radius of first radiator structure, the second radiator structure and third radiator structure is 1:2:3.
Preferably, the material of the substrate is heat-conducting plastic PA, and thermal coefficient is 5W/mK~20W/mK.
Preferably, it is doped with respectively in the first radiator structure, the second radiator structure and third radiator structure of the substrate
The fibrous carbon dust of different content, so that different radiator structures has different thermally conductive intensity.
Preferably, in first radiator structure, the second radiator structure and third radiator structure fibrous carbon dust content
The ratio between be 4:2:1.
Preferably, the thermal coefficient of the fibrous carbon dust is 400W/mK~700W/mK.
Preferably, the thickness range of the substrate is 0.5mm~1.5mm.
A kind of production method of LED light source substrate, comprising:
At least three radiator structures are sequentially formed using Shooting Technique, to constitute the corresponding heat dissipation of default LED core panel region
The thermally conductive intensity of structure is greater than the substrate of other radiator structures；
Copper foil layer is formed on the surface of the substrate, and forms reflecting layer and insulating layer on the surface of the copper foil layer.
Preferably, described that at least three radiator structures are sequentially formed using Shooting Technique, to constitute default LED core panel region
The thermally conductive intensity of corresponding radiator structure is greater than the substrate of other radiator structures are as follows:
Using Shooting Technique by the successively injection molding of the different heat-conducting plastic of fibrous carbon powder content, composition is led with difference
The substrate of the different radiator structures of calorific intensity, wherein the thermally conductive of the corresponding radiator structure of LED core panel region is preset in the substrate
Intensity is greater than other radiator structures.
Preferably, when at least three radiator structure be in concentric ring-shaped and successively arrange outward along the center of circle first
It is described that at least three heat dissipation knots are sequentially formed using Shooting Technique when radiator structure, the second radiator structure and third radiator structure
Structure are as follows:
Circular first radiator structure is formed using Shooting Technique；
The second circular radiator structure is formed in the surrounding of first radiator structure；
Circular third radiator structure is formed in the surrounding of second radiator structure；
Wherein, the content of the fibrous carbon dust of first radiator structure be greater than second radiator structure, described second
The content of the fibrous carbon dust of radiator structure is greater than the third radiator structure, so that the thermally conductive intensity of first radiator structure
Greater than second radiator structure, the thermally conductive intensity of second radiator structure is greater than the third radiator structure.
Preferably, the surface in the substrate forms copper foil layer are as follows:
It is performed etching in the copper-depositing on surface layers of foil of the substrate, and to the copper foil layer, forms preset circuit structure.
Preferably, the surface in the copper foil layer forms reflecting layer and insulating layer are as follows:
The copper foil layer surface default LED core panel region formed reflecting layer, and the copper foil layer surface other
Region forms insulating layer.
A kind of LED light source, including above-mentioned LED light source substrate, wherein LED chip is pre- in the LED light source substrate
If LED core panel region, and the thermally conductive intensity of the corresponding radiator structure of default LED core panel region of the LED light source substrate is greater than
Other radiator structures.
Compared with prior art, the technical scheme provided by the invention has the following advantages:
LED light source substrate provided by the present invention and preparation method thereof and LED light source, substrate have at least three heat dissipation knots
Structure, and the thermally conductive intensity of the default corresponding radiator structure of LED core panel region is greater than other radiator structures, so that LED chip
The heat of generation can distribute to the greatest extent, improve the heat-sinking capability of LED light source substrate, stabilize LED light source
Performance parameter increases the service life of LED light source.Also, since the base material of LED light source substrate of the invention is thermally conductive
Plastics PA is very good insulating materials, therefore, eliminates insulating layer compared to traditional substrate, has saved cost, is simplified
Manufacture craft.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of LED light source substrate in the prior art；
Fig. 2 is the structural schematic diagram for the LED light source substrate that the embodiment of the present invention one provides；
Fig. 3 is the structural schematic diagram of the pedestal for the LED light source substrate that the embodiment of the present invention one provides；
Fig. 4 is the production method flow chart of LED light source substrate provided by Embodiment 2 of the present invention；
Fig. 5 is the flow chart of the production method of pedestal provided by Embodiment 2 of the present invention.
Specific embodiment
As described in background, the heat that LED light source substrate in the prior art can not generate LED chip is effective
Conduction to outside, heat dissipation performance is poor, will affect performance and the service life of LED light source.Inventor is the study found that cause this ask
The reason of topic is mainly that the heat distribution of LED light source substrate surface is not uniform in the prior art, wherein LED core section
The heat in domain be it is highest, still, due to the heat-sinking capability of LED light source substrate all areas be it is the same, it is existing
The heat that LED chip generates can not be effectively dissipated away for LED light source substrate, cause heat dissipation performance poor, influence LED light
The performance in source and service life.
Based on this, the present invention provides a kind of LED light source substrates, to overcome the above problem of the existing technology, comprising:
Substrate at least three radiator structures presets the corresponding radiator structure of LED core panel region in the substrate
Thermally conductive intensity is greater than other radiator structures；Copper foil layer positioned at the substrate surface and the reflection positioned at the copper foil layer surface
Layer and insulating layer.
The present invention also provides a kind of production methods of LED light source substrate, comprising:
At least three radiator structures are sequentially formed using Shooting Technique, to constitute the corresponding heat dissipation of default LED core panel region
The thermally conductive intensity of structure is greater than the substrate of other radiator structures；Copper foil layer is formed on the surface of the substrate, and in the copper foil
The surface of layer forms reflecting layer and insulating layer.
The present invention also provides a kind of LED light sources, including above-mentioned LED light source substrate, wherein LED chip is in described
The default LED core panel region of LED light source substrate, and the corresponding radiator structure of default LED core panel region of the LED light source substrate
Thermally conductive intensity be greater than other radiator structures.
LED light source substrate provided by the present invention and preparation method thereof and LED light source, substrate have at least three heat dissipation knots
Structure, and the thermally conductive intensity of the default corresponding radiator structure of LED core panel region is greater than other radiator structures, so that LED chip
The heat of generation can distribute to the greatest extent, improve the heat-sinking capability of LED light source substrate, stabilize LED light source
Performance parameter increases the service life of LED light source.Also, since the base material of LED light source substrate of the invention is thermally conductive
Plastics PA is very good insulating materials, therefore, eliminates insulating layer compared to traditional substrate, has saved cost, is simplified
Manufacture craft.
It is core of the invention thought above, to keep the above objects, features and advantages of the present invention more obvious easily
Understand, specific embodiments of the present invention will be described in detail with reference to the accompanying drawing.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, but the present invention can be with
Implemented using other than the one described here other way, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar popularization, therefore the present invention is not limited by the specific embodiments disclosed below.
Secondly, combination schematic diagram of the present invention is described in detail, when describing the embodiments of the present invention, for purposes of illustration only, table
Show that the sectional view of device architecture can disobey general proportion and make partial enlargement, and the schematic diagram is example, is not answered herein
Limit the scope of protection of the invention.In addition, the three-dimensional space of length, width and depth should be included in actual fabrication.
It is described in detail below by several embodiments.
Embodiment one
A kind of LED light source substrate is present embodiments provided, as shown in Fig. 2, including the base at least three radiator structures
Bottom 10, wherein the thermally conductive intensity of LED core panel region (dashed region in Fig. 2) corresponding radiator structure is preset in the substrate 10
Greater than other radiator structures；Copper foil layer 20 positioned at the substrate surface and 30 He of reflecting layer positioned at the copper foil layer surface
Insulating layer 40.
As shown in figure 3, at least three radiator structures that substrate 10 has are as follows: the first radiator structure 101, the second radiator structure
102 and third radiator structure 103, these three radiator structures are distributed in concentric ring-shaped, and are successively arranged outward along the center of circle, i.e., and the
One radiator structure 101 is centrally located border circular areas, and the second radiator structure 102 is positioned at 101 surrounding of the first radiator structure
Annulus, third radiator structure 103 are the annulus positioned at 102 surrounding of the second radiator structure.
Also, the space D 1 of the first radiator structure 101 and the second radiator structure 102 is equal to the second radiator structure 102 and the
The space D 2 of three radiator structures 103, certainly, in other embodiments of the invention, if the central area of LED light source substrate is
LED core panel region overheat, can also be by the first radiator structure 101, the circle of the second radiator structure 102 and third radiator structure 103
The ratio between ring radius is set as 1:2:3, i.e. R1:R2:R3=1:2:3, or is set as other ratios.
Wherein, the corresponding default LED core panel region of the first radiator structure 101, i.e., positioned at LED chip region just under
Side, and the thermally conductive intensity of the first radiator structure 101 is greater than the second radiator structure 102, the thermally conductive intensity of the second radiator structure 102 is big
In third radiator structure 103.Since the heat-sinking capability of the first radiator structure 101 immediately below LED chip is stronger, it can
The heat that LED chip generates is distributed to the greatest extent, the heat-sinking capability of LED light source substrate is improved, so that LED light source
The temperature of substrate surface reaches unanimity substantially, very good solution LED light source substrate center temperature excessively high problem.
Certainly, in other embodiments, not necessarily centrally located first radiator structure in region of LED chip is preset
101, or no matter other radiator structures still correspond to that radiator structure, the thermally conductive intensity of corresponding radiator structure
I.e. heat-sinking capability is all stronger.
In the present embodiment, the material of substrate 10 is the heat-conducting plastic PA that thermal coefficient is 5W/mK~20W/mK
The reason of (Polyamide, polyamide), the thermally conductive intensity of the first radiator structure 101 is greater than other radiator structures, is, is making
During standby different radiator structures, the high thermal conductivity threadiness carbon dust of different content is mixed in heat-conducting plastic PA raw material, with
Make different radiator structures that there is different thermally conductive intensity, wherein the first radiator structure 101, the second radiator structure 102 and third
The ratio between the content of fibrous carbon dust is 4:2:1 in radiator structure 103.
Since the thermal coefficient of high thermal conductivity threadiness carbon dust is 400W/mK~700W/mK, in heat-conducting plastic
After mixing high thermal conductivity threadiness carbon dust in PA, the heat-sinking capability of radiator structure can be greatlyd improve, and the content mixed is higher, dissipated
The heat-sinking capability of heat structure is stronger.
The substrate of the LED light source substrate of the present embodiment is formed by the way of injection molding, is filled first in grinding tool high
The higher heat-conducting plastic PA of heat conducting fiber shape carbon powder content, forms circular first radiator structure 101, then with this after cooling and shaping
Mode successively forms the second radiator structure 102 in the surrounding of the first radiator structure 101, in the surrounding shape of the second radiator structure 102
At third radiator structure 103, to finally obtain the substrate 10 that thickness range is about 0.5mm~1.5mm.
LED light source substrate provided in this embodiment, substrate have at least three radiator structures, and default LED core panel region
The thermally conductive intensity of corresponding radiator structure is greater than other radiator structures, so that the heat that LED chip generates being capable of maximum journey
Distributing for degree, improves the heat-sinking capability of LED light source substrate, stabilizes the performance parameter of LED light source, increase LED light
The service life in source.It also, is very since the base material of LED light source substrate provided in this embodiment is heat-conducting plastic PA
Therefore good insulating materials eliminates insulating layer compared to traditional substrate, has saved cost, simplified manufacture craft.
Embodiment two
The production method for present embodiments providing a kind of LED light source substrate, as shown in Figure 4, comprising:
S41: sequentially forming at least three radiator structures using Shooting Technique, corresponding to constitute default LED core panel region
The thermally conductive intensity of radiator structure is greater than the substrate of other radiator structures；
In the present embodiment, at least three radiator structures include: in concentric ring-shaped and successively arrange outward along the center of circle
The material of one radiator structure, the second radiator structure and third radiator structure, these three radiator structures and substrate is heat-conducting plastic
PA, and in the material of different radiator structures high thermal conductivity threadiness carbon dust content it is different so that different radiator structures has
Different thermally conductive intensity, therefore, different radiator structure needs are respectively formed.
Since base material is heat-conducting plastic PA, the present embodiment mainly uses Shooting Technique to sequentially form at least three
A radiator structure, and then constitute required substrate.Wherein, the process of at least three radiator structures is sequentially formed using Shooting Technique
Are as follows: using Shooting Technique by the successively injection molding of the different heat-conducting plastic of fibrous carbon powder content, being formed has difference thermally conductive strong
The substrate of the radiator structure of degree, wherein the thermally conductive intensity that the corresponding radiator structure of LED core panel region is preset in the substrate is greater than
Other radiator structures.
When three radiator structures are in concentric ring-shaped and the first radiator structure successively arranged outward along the center of circle, second to dissipate
When heat structure and third radiator structure, as shown in figure 5, sequentially forming the process of at least three radiator structures using Shooting Technique
Are as follows:
S411: circular first radiator structure is formed；
The higher heat-conducting plastic of high thermal conductivity fibrous carbon powder content is filled in grinding tool by the way of injection molding, is cooled and shaped
After form circular first radiator structure.
S412: the second circular radiator structure is formed in the surrounding of first radiator structure；
The surrounding filling high thermal conductivity fibrous carbon powder content of the first radiator structure is placed in the middle in grinding tool by the way of injection molding
Heat-conducting plastic, the second circular radiator structure is formed after cooling and shaping.
S413: circular third radiator structure is formed in the surrounding of second radiator structure；
The surrounding filling high thermal conductivity fibrous carbon powder content of the second radiator structure is lower in grinding tool by the way of injection molding
Heat-conducting plastic, circular third radiator structure is formed after cooling and shaping.
Wherein, the content of the fibrous carbon dust of the first radiator structure is greater than the second radiator structure, the fibre of the second radiator structure
The content for tieing up shape carbon dust is greater than third radiator structure, so that the thermally conductive intensity of the first radiator structure is greater than the second radiator structure, the
The thermally conductive intensity of two radiator structures is greater than third radiator structure.
It is formed after the substrate at least three radiator structures, enters step S42.
S42: copper foil layer is formed on the surface of the substrate, and forms reflecting layer and insulation on the surface of the copper foil layer
Layer.
Specifically: it is performed etching in the copper-depositing on surface layers of foil of the substrate, and to the copper foil layer, forms preset electricity
Line structure passes through the techniques such as sputtering in the copper-depositing on surface layers of foil conductive film of the substrate, and according to pre-designed
Circuit diagram performs etching the copper foil layer, forms the circuit structure of needs；Then it cleaned, dried, in the copper
The default LED core panel region on layers of foil surface forms reflecting layer, that is, uses the techniques such as sputtering, vacuum coating or chemical vapor deposition,
In the default LED chip area deposition reflective film of copper foil layer, one layer of reflecting layer with high reflectivity is formed；And in the copper
Other regions on layers of foil surface form insulating layer, i.e., using the technique of silk-screen printing or sputtering, in other non-chips of copper foil layer
One layer of white oil insulating layer, i.e. insulating layer are formed in placement region, and insulation protection is provided, prevents from getting an electric shock.
LED light source method for preparing substrate provided in this embodiment sequentially forms at least three of substrate using Shooting Technique
Radiator structure, the thermally conductive intensity due to presetting the corresponding radiator structure of LED core panel region are greater than other radiator structures, energy
Enough heats that LED chip is generated distribute to the greatest extent, improve the heat-sinking capability of LED light source substrate, surely
The performance parameter for having determined LED light source increases the service life of LED light source.Also, by LED light source base in this present embodiment
The base material of plate is heat-conducting plastic PA, is very good insulating materials, therefore, eliminates insulation compared to traditional substrate
Layer, has saved cost, has simplified manufacture craft.
Embodiment three
A kind of LED light source is present embodiments provided, the LED light source substrate provided including any of the above-described embodiment, wherein
LED chip is in the default LED core panel region of the LED light source substrate, and the default LED core section of the LED light source substrate
The thermally conductive intensity of the corresponding radiator structure in domain is greater than other radiator structures.
LED light source provided in this embodiment, substrate has at least three radiator structures, and default LED core panel region is corresponding
Radiator structure thermally conductive intensity be greater than other radiator structures so that LED chip generate heat can be maximum
It distributes, improves the heat-sinking capability of LED light source substrate, stabilize the performance parameter of LED light source, increase LED light source
Service life.It is very good exhausted also, since the base material of the LED light source substrate of the present embodiment is heat-conducting plastic PA
Therefore edge material eliminates insulating layer compared to traditional substrate, has saved cost, simplified manufacture craft.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment
For, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (13)
1. a kind of LED light source substrate characterized by comprising
Substrate at least three radiator structures presets the thermally conductive of the corresponding radiator structure of LED core panel region in the substrate
Intensity is greater than other radiator structures；
Reflecting layer and insulating layer positioned at the copper foil layer of the substrate surface and positioned at the copper foil layer surface；
Wherein, the material of the substrate is heat-conducting plastic PA；
Wherein, at least three radiator structure are as follows: tied in concentric ring-shaped and along the first heat dissipation that the center of circle is successively arranged outward
Structure, the second radiator structure and third radiator structure；First radiator structure corresponds to the default LED core panel region, and described
The thermally conductive intensity of first radiator structure is greater than second radiator structure, and the thermally conductive intensity of second radiator structure is greater than described
Third radiator structure；
The ratio between radius of first radiator structure, the second radiator structure and third radiator structure is 1:2:3.
2. substrate according to claim 1, which is characterized in that first radiator structure and second radiator structure
Semidiameter is equal to the semidiameter of second radiator structure and the third radiator structure.
3. substrate according to claim 2, which is characterized in that the substrate thermal coefficient is 5W/m 〃 K~20W/m 〃 K.
4. substrate according to claim 3, which is characterized in that the first radiator structure, the second radiator structure of the substrate
With the fibrous carbon dust for being doped with different content in third radiator structure respectively, different led so that different radiator structures has
Calorific intensity.
5. substrate according to claim 4, which is characterized in that first radiator structure, the second radiator structure and third
The ratio between the content of fibrous carbon dust is 4:2:1 in radiator structure.
6. substrate according to claim 5, which is characterized in that it is described threadiness carbon dust thermal coefficient be 400W/m 〃 K~
700W/m〃K。
7. substrate according to claim 6, which is characterized in that the thickness range of the substrate is 0.5mm~1.5mm.
8. a kind of production method of LED light source substrate characterized by comprising
At least three radiator structures are sequentially formed using Shooting Technique, to constitute the corresponding radiator structure of default LED core panel region
Thermally conductive intensity be greater than other radiator structures substrate；
Copper foil layer is formed on the surface of the substrate, and forms reflecting layer and insulating layer on the surface of the copper foil layer；
Wherein, the material of the substrate is heat-conducting plastic PA；
At least three radiator structure are as follows: in concentric ring-shaped and the first radiator structure successively arranged outward along the center of circle,
Two radiator structures and third radiator structure；First radiator structure corresponds to the default LED core panel region, and described first dissipates
The thermally conductive intensity of heat structure is greater than second radiator structure, and the thermally conductive intensity of second radiator structure is dissipated greater than the third
Heat structure；
The ratio between radius of first radiator structure, the second radiator structure and third radiator structure is 1:2:3.
9. according to the method described in claim 8, it is characterized in that, described sequentially form at least three heat dissipations using Shooting Technique
Structure, to constitute the substrate that the thermally conductive intensity of the corresponding radiator structure of default LED core panel region is greater than other radiator structures are as follows:
Using Shooting Technique by the successively injection molding of the different heat-conducting plastic of fibrous carbon powder content, constituting has difference thermally conductive strong
The substrate of the different radiator structures of degree, wherein the thermally conductive intensity of the corresponding radiator structure of LED core panel region is preset in the substrate
Greater than other radiator structures.
10. according to the method described in claim 9, it is characterized in that, when at least three radiator structure is in concentric loop
It is described using note when shape and the first radiator structure successively arranged outward along the center of circle, the second radiator structure and third radiator structure
Modeling technique sequentially forms at least three radiator structures are as follows:
Circular first radiator structure is formed using Shooting Technique；
The second circular radiator structure is formed in the surrounding of first radiator structure；
Circular third radiator structure is formed in the surrounding of second radiator structure；
Wherein, the content of the fibrous carbon dust of first radiator structure is greater than second radiator structure, second heat dissipation
The content of the fibrous carbon dust of structure is greater than the third radiator structure, so that the thermally conductive intensity of first radiator structure is greater than
The thermally conductive intensity of second radiator structure, second radiator structure is greater than the third radiator structure.
11. according to the method described in claim 10, it is characterized in that, the surface in the substrate forms copper foil layer are as follows:
It is performed etching in the copper-depositing on surface layers of foil of the substrate, and to the copper foil layer, forms preset circuit structure.
12. according to the method for claim 11, which is characterized in that the surface in the copper foil layer formed reflecting layer and
Insulating layer are as follows:
Reflecting layer is formed in the default LED core panel region of the copper foil layer surface, and in other regions of the copper foil layer surface
Form insulating layer.
13. a kind of LED light source, which is characterized in that including the described in any item LED light source substrates of claim 1-7, wherein
LED chip is in the default LED core panel region of the LED light source substrate, and the default LED core section of the LED light source substrate
The thermally conductive intensity of the corresponding radiator structure in domain is greater than other radiator structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410212223.4A CN105098046B (en) | 2014-05-19 | 2014-05-19 | LED light source substrate and preparation method thereof and LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410212223.4A CN105098046B (en) | 2014-05-19 | 2014-05-19 | LED light source substrate and preparation method thereof and LED light source |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105098046A CN105098046A (en) | 2015-11-25 |
| CN105098046B true CN105098046B (en) | 2019-06-07 |
Family
ID=54578050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410212223.4A Active CN105098046B (en) | 2014-05-19 | 2014-05-19 | LED light source substrate and preparation method thereof and LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105098046B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106129235B (en) * | 2016-08-11 | 2018-10-16 | 珠海市一芯半导体科技有限公司 | A kind of the high heat conduction chip light source substrate and its manufacturing method of thermoelectricity separation |
| CN107706286B (en) * | 2017-09-27 | 2019-10-11 | 开发晶照明（厦门）有限公司 | LED light emission device and LED support |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101568599A (en) * | 2006-12-27 | 2009-10-28 | 第一毛织株式会社 | Heat-conductive resin composition and plastic article |
| CN203192844U (en) * | 2012-11-30 | 2013-09-11 | 联京光电股份有限公司 | Light emitting diode packaging structure |
| CN103311233A (en) * | 2012-03-12 | 2013-09-18 | 光宝电子(广州)有限公司 | Light emitting diode packaging structure |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4492486B2 (en) * | 2005-08-24 | 2010-06-30 | パナソニック電工株式会社 | Lighting equipment using LED |
| KR100828891B1 (en) * | 2006-02-23 | 2008-05-09 | 엘지이노텍 주식회사 | LED Package |
| JP2011044612A (en) * | 2009-08-21 | 2011-03-03 | Panasonic Electric Works Co Ltd | Light emitting device |
| JP5423547B2 (en) * | 2010-04-05 | 2014-02-19 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
| CN102903838A (en) * | 2012-07-10 | 2013-01-30 | 贵州大学 | Packaged LED light source with radiating structure and production method thereof |
| CN102796369B (en) * | 2012-07-25 | 2014-12-31 | 上海耐特复合材料制品有限公司 | Heat conduction polyimide composite material, preparation method and application thereof |
| CN203218332U (en) * | 2013-04-27 | 2013-09-25 | 新美化精机工厂股份有限公司 | High illuminance LED light source module with high reflectivity |
| CN204216071U (en) * | 2013-12-30 | 2015-03-18 | 四川新力光源股份有限公司 | A kind of LED-COB base plate for packaging of high heat conduction |
-
2014
- 2014-05-19 CN CN201410212223.4A patent/CN105098046B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101568599A (en) * | 2006-12-27 | 2009-10-28 | 第一毛织株式会社 | Heat-conductive resin composition and plastic article |
| CN103311233A (en) * | 2012-03-12 | 2013-09-18 | 光宝电子(广州)有限公司 | Light emitting diode packaging structure |
| CN203192844U (en) * | 2012-11-30 | 2013-09-11 | 联京光电股份有限公司 | Light emitting diode packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105098046A (en) | 2015-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9406851B2 (en) | Surface-textured encapsulations for use with light emitting diodes | |
| CN101542752B (en) | Thin-film semiconductor component and component assembly | |
| US8814381B2 (en) | Omnidirectional light emitting device lamp | |
| TWI603033B (en) | A light emitting module comprising a thermal conductor, a lamp and a luminaire | |
| KR20120059059A (en) | LED lamp | |
| KR20120067309A (en) | Optical semiconductor device | |
| CN101711434A (en) | Led lighting device | |
| TW200941758A (en) | LED-based surface light-source device | |
| CN105098046B (en) | LED light source substrate and preparation method thereof and LED light source | |
| US10533729B2 (en) | Light source with LED chip and luminophore layer | |
| JP2009277843A (en) | Light-emitting device, illuminating apparatus with the same, and back light for liquid crystal display | |
| Huang et al. | High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes | |
| TW201034266A (en) | Heat dissipation module for a light emitting device and light emitting diode device having the same | |
| TWI550232B (en) | An illumination apparatus and a method of assembling the illumination apparatus | |
| TWM345944U (en) | Light emitting diode bulb | |
| CN103104841B (en) | Light-emitting diode (LED) lamp unit with high heat-radiating performance and modular high-power LED lamp thereof | |
| CN203521463U (en) | High-thermal conductivity LED-COB packaging substrate | |
| CN102263185A (en) | Thermal radiation light emitting diode structure and manufacturing method thereof | |
| CN105720178B (en) | A kind of method for packing of light emitting diode | |
| WO2014086078A1 (en) | Led light-emitting component | |
| TWI325640B (en) | Led device module with high heat dissipation | |
| KR101267849B1 (en) | Heat-pipe integrated one body type pcb using thin film vapor deposition method for led light | |
| CN202629724U (en) | Light emitting diode (LED) lamp and lamp cup | |
| CN206093593U (en) | Cavity formula does not have base plate pottery lamp | |
| CN208352293U (en) | Wiring board and lighting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |