CN204216071U - A kind of LED-COB base plate for packaging of high heat conduction - Google Patents
A kind of LED-COB base plate for packaging of high heat conduction Download PDFInfo
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- CN204216071U CN204216071U CN201320884393.8U CN201320884393U CN204216071U CN 204216071 U CN204216071 U CN 204216071U CN 201320884393 U CN201320884393 U CN 201320884393U CN 204216071 U CN204216071 U CN 204216071U
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Abstract
The utility model relates to a kind of LED-COB base plate for packaging of high heat conduction, it comprises: substrate, thermal insulation layer and copper foil layer, thermal insulation layer is arranged between substrate and copper foil layer, it is characterized in that, thermal insulation layer is at least divided into the high thermal conductive zone being mixed with diamond dust, the middle thermal conductive zone being mixed with high heat-conducting ceramic powder or a small amount of diamond dust and region, three, low thermal conductive zone, wherein, middle thermal conductive zone is arranged on outside high thermal conductive zone, and low thermal conductive zone is arranged on outside middle thermal conductive zone.The utility model is different for LED-baseplate zones of different caloric value, substrate insulating layer is divided into several region, and mate the corresponding insulating material of employing by this region caloric value, make substrate on the basis of equal or lower cost, the capacity of heat transmission of substrate can be adjusted, make the heat of substrate farthest conduct to outside, improve substrate heat dispersion, keep substrate surface temperature substantially identical, stablize the performance parameter of LED, increase the useful life of LED component, reduce use cost.
Description
Technical field
The utility model relates to a kind of LED-COB base plate for packaging, particularly relates to a kind of LED-COB base plate for packaging of high heat conduction.
Background technology
In recent years, white light LEDs development rapidly, with advantages such as its energy-saving and environmental protection, life-span length, will occupy whole illumination market gradually, be called as 21 century a new generation's light source.The life-span of LED is determined by the PN junction temperature of chip, and if LED junction temperature is too high, also may produce look drift, the phenomenons such as bright dipping is uneven, affect its bright dipping.The key improving this problem to reduce LED junction temperature, and the radiator that the key reducing junction temperature will have exactly, can in time the heat that LED produces be distributed.So the heat dissipation problem of LED limits the principal element that can it commercially obtain more ten-strike.
Current great power LED mainly adopts COB integration packaging mode, and this packaged type wants technique simple than SMD, and cost is lower, and light efficiency also wants better.But because multi-chip is all integrated on one piece of substrate, the SMD encapsulation just more conventional to the requirement of heat radiation wants high a lot.
The COB aluminium base of usual employing mainly contains the several part in base material, insulating barrier, copper foil layer and reflector and forms, in above-mentioned several part, the conductive coefficient of base material aluminium and copper foil layer copper is all very high, and the conductive coefficient of insulating material epoxy (or organic siliconresin) is compared to this poor several times of two classes material, the heat conduction causing LED chip to send to insulating barrier can not very fast spreading out, make heat all concentrate on insulating barrier, form a hot bottleneck.Cause the junction temperature of LED chip to reduce, the light decay of LED is speeded, useful life and reliability reduce.
In order to address this problem, on market, usual way mixes resistant to elevated temperatures special ceramics powder in epoxy (or organic siliconresin), this method can improve the coefficient of heat conduction of insulating barrier, improves its capacity of heat transmission, and temperature can be conducted in base material and air.In order to improve the heat conductivility of substrate further again, the higher diamond dust of conductive coefficient can be mixed in epoxy (or organic siliconresin), if publication number is the Chinese patent of CN101545587A.But no matter be special cermacis powder or diamond dust, its price is all very expensive, incorporation too much can increase the cost of COB aluminium base greatly.
In addition, the heat of COB mainly concentrates on the region that LED chip placed by substrate, generally is substrate central areas.And the material of the present each layer of COB substrate is all uniform, the capacity of heat transmission in each region is also identical.Will there is fringe region caloric value low, heat can conduct rapidly, and central area heat is too high, and conductive coefficient is inadequate, and heat can not conduct to substrate outside completely, thus forms the performance of temperatures involved COB.
Utility model content
For the problems referred to above, the utility model provides a kind of LED-COB base plate for packaging of high heat conduction.
The utility model discloses a kind of LED-COB base plate for packaging of high heat conduction, it comprises: substrate, thermal insulation layer and copper foil layer, described thermal insulation layer is arranged between described substrate and described copper foil layer, it is characterized in that, described thermal insulation layer is at least divided into the high thermal conductive zone being mixed with diamond dust, the middle thermal conductive zone being mixed with high heat-conducting ceramic powder or a small amount of diamond dust and region, three, low thermal conductive zone, wherein, described middle thermal conductive zone is arranged on outside described high thermal conductive zone, and described low thermal conductive zone is arranged on outside described middle thermal conductive zone.
According to one preferred embodiment, the diamond dust in described high thermal conductive zone comprises bulky diamond powder and granule diamond dust.
According to one preferred embodiment, the particle diameter of described granule diamond dust is 10 ~ 90nm, and the particle diameter of described bulky diamond powder is 1 ~ 5 μm.
According to one preferred embodiment, described granule diamond dust and described bulky diamond size of powder particles respectively, be evenly distributed in disperse shape in the high thermal conductive zone of the described thermal insulation layer be made up of epoxy resin, organic siliconresin or epoxy modified silicone resin.
According to one preferred embodiment, described high heat-conducting ceramic powder is the mixing of one or more in aluminum nitride ceramic powder, beryllium oxide ceramics powder, high heat conduction alumina ceramic powder.
According to one preferred embodiment, described high heat-conducting ceramic powder or a small amount of diamond dust are that disperse shape to be evenly distributed in the described thermal insulation layer be made up of epoxy resin, organic siliconresin or epoxy modified silicone resin in thermal conductive zone.
According to one preferred embodiment, do not mix any Heat Conduction Material powder in the low thermal conductive zone of the described thermal insulation layer be made up of epoxy resin, organic siliconresin or epoxy modified silicone resin, or in described low thermal conductive zone, mix but the powder of negligible amounts identical with described high thermal conductive zone or described middle thermal conductive zone.
According to one preferred embodiment, described substrate is high heat-conducting ceramic substrate or high thermal conductivity aluminum matrix plate.
According to one preferred embodiment, described thermal insulation layer is provided with the circuit be made up of described copper foil layer.
According to one preferred embodiment, position corresponding with described high thermal conductive zone on described copper foil layer is reserved with the region of installing LED chip, the region of the non-chip on described copper foil layer is provided with reflector, and region and the non-reflective layer region of the non-chip on described copper foil layer are provided with white oil insulating barrier.
The beneficial effects of the utility model are:
Heat due to COB encapsulation mainly concentrates on the region that LED chip placed by substrate, generally is substrate central areas.And the material of the present each layer of COB substrate is all uniform, the capacity of heat transmission in each region is also identical.Will there is fringe region caloric value low, heat can conduct rapidly, and central area heat is too high, and conductive coefficient is inadequate, and heat can not conduct to substrate outside completely, thus forms the performance of temperatures involved COB.
The utility model provides a kind of LED-COB base plate for packaging of high heat conduction, different for LED-baseplate zones of different caloric value, substrate insulating layer is divided into several region, and mate the corresponding insulating material of employing by this region caloric value, make substrate on the basis of equal or lower cost, the capacity of heat transmission of substrate can be adjusted, the heat of substrate is made farthest to conduct to outside, improve substrate heat dispersion, keep substrate surface temperature substantially identical, stablize the performance parameter of LED, increase the useful life of LED component, reduce use cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED-COB base plate for packaging of high heat conduction of the present utility model;
Fig. 2 is the structural representation of thermal insulation layer of the present utility model.
Reference numerals list
100: the LED-COB base plate for packaging of high heat conduction
101: substrate 102: thermal insulation layer 103: copper foil layer
104: white oil insulating barrier 105: reflector
201: high thermal conductive zone 202: middle thermal conductive zone 203: low thermal conductive zone
Embodiment
The utility model is illustrated below in conjunction with accompanying drawing.
Fig. 1 is the structural representation of the LED-COB base plate for packaging of high heat conduction of the present utility model.Fig. 1 shows the LED-COB base plate for packaging 100 of a kind of high heat conduction of the present utility model, and it comprises: substrate 101, thermal insulation layer 102 and copper foil layer 103.Thermal insulation layer 102 at least can be divided into the high thermal conductive zone 201 being mixed with diamond dust, the middle thermal conductive zone 202 being mixed with high heat-conducting ceramic powder or a small amount of diamond dust and region, 203 3, low thermal conductive zone.Wherein, middle thermal conductive zone 202 is arranged on outside high thermal conductive zone 201, and low thermal conductive zone 203 is arranged on outside middle thermal conductive zone 202.Thermal insulation layer 102 is arranged between substrate 101 and copper foil layer 103.Thermal insulation layer 102 is provided with the circuit be made up of copper foil layer 103.Position corresponding with high thermal conductive zone 201 on copper foil layer 103 is reserved with the region of installing LED chip, the region of the non-chip on copper foil layer 103 is provided with reflector 105, and region and the non-reflective layer region of the non-chip on copper foil layer 103 are provided with white oil insulating barrier 104.Different for LED-baseplate zones of different caloric value, substrate insulating layer is divided into several region, and mate the corresponding insulating material of employing by this region caloric value, make substrate on the basis of equal or lower cost, the capacity of heat transmission of substrate can be adjusted, make the heat of substrate farthest conduct to outside, improve substrate heat dispersion, keep substrate surface temperature substantially identical, stablize the performance parameter of LED, increase the useful life of LED component, reduce use cost.
Fig. 2 is the structural representation of thermal insulation layer of the present utility model.The material of thermal insulation layer 102 is epoxy resin, organic siliconresin or epoxy modified silicone resin.Thermal insulation layer 102 at least can be divided into three regions, is respectively high thermal conductive zone 201, middle thermal conductive zone 202, low thermal conductive zone 203.Middle thermal conductive zone 202 is arranged on outside high thermal conductive zone 201, and low thermal conductive zone 203 is arranged on outside middle thermal conductive zone 202.
Diamond dust is mixed with in high thermal conductive zone 201.Diamond dust in high thermal conductive zone 201 comprises bulky diamond powder and granule diamond dust.The particle diameter of granule diamond dust is 10 ~ 90nm, and the particle diameter of bulky diamond powder is 1 ~ 5 μm.Granule diamond dust and bulky diamond size of powder particles respectively, in disperse shape are evenly distributed in the high thermal conductive zone 201 of thermal insulation layer 102.
Middle heat district 202, can select the high heat-conducting ceramic powder mixing special high temperature-resistant, or mix a small amount of diamond dust.High heat-conducting ceramic powder can be the mixing of one or more in aluminum nitride ceramic powder, beryllium oxide ceramics powder, high heat conduction alumina ceramic powder.High heat-conducting ceramic powder or a small amount of diamond dust are that disperse shape is evenly distributed in the middle thermal conductive zone 202 of thermal insulation layer 102.
Any Heat Conduction Material powder can not be mixed in the low thermal conductive zone 203 of thermal insulation layer 102, also can mix but the diamond dust of negligible amounts or high heat-conducting ceramic powder identical with high thermal conductive zone 201 or middle thermal conductive zone 202 in low thermal conductive zone 203.
Such as, if LED component power is comparatively large, caloric value is more.Also all can mix the material of identical conductive coefficient in high thermal conductive zone 201, middle thermal conductive zone 202 and low thermal conductive zone 203, difference mixes concentration.Or mix the material of different conductive coefficient, but the conductive coefficient in each region need be directly proportional to its caloric value.
Substrate 101 can be high heat-conducting ceramic substrate or high thermal conductivity aluminum matrix plate.
When preparing thermal insulation layer 102, can adopt the position of the high thermal conductive zone of the mode of curtain coating or sputtering first in substrate 101 formed complete evenly and one deck of densification mixes the high thermal conductive zone 201 of diamond dust.Thermal conductive zone 202 in the outside formation of the high thermal conductive zone 201 more in this way in substrate 101.In more in this way in substrate 101, the outside of thermal conductive zone 202 forms low thermal conductive zone 203.
Pass through the techniques such as sputtering more directly at thermal insulation layer 102 copper-depositing on surface conductive film.
Design circuit diagram, adopt etch process to produce required circuit diagram, then carry out cleaning, dry.
Then adopt sputtering, vacuum coating, chemical deposition mode in the reserved region of placing LED chip of copper foil layer 103, and plate one deck reflectance coating, form the reflector 105 that one deck has high reflectance.
On other non-chip rest areas of copper foil layer 103, adopt the mode of silk screen printing or sputtering, be covered with one deck white oil insulating barrier 104, insulation protection is provided, prevent from getting an electric shock.
The beneficial effects of the utility model are:
Heat due to COB encapsulation mainly concentrates on the region that LED chip placed by substrate, generally is substrate central areas.And the material of the present each layer of COB substrate is all uniform, the capacity of heat transmission in each region is also identical.Will there is fringe region caloric value low, heat can conduct rapidly, and central area heat is too high, and conductive coefficient is inadequate, and heat can not conduct to substrate outside completely, thus forms the performance of temperatures involved COB.
The utility model provides a kind of LED-COB base plate for packaging of high heat conduction, different for LED-baseplate zones of different caloric value, substrate insulating layer is divided into several region, and mate the corresponding insulating material of employing by this region caloric value, make substrate on the basis of equal or lower cost, the capacity of heat transmission of substrate can be adjusted, the heat of substrate is made farthest to conduct to outside, improve substrate heat dispersion, keep substrate surface temperature substantially identical, stablize the performance parameter of LED, increase the useful life of LED component, reduce use cost.
It should be noted that; above-mentioned specific embodiment is exemplary; under above-mentioned instruction of the present utility model, those skilled in the art can carry out various improvement and distortion on the basis of above-described embodiment, and these improve or distortion drops in protection range of the present utility model.It will be understood by those skilled in the art that specific descriptions are above to explain the purpose of this utility model, not for limiting the utility model.Protection range of the present utility model is by claim and equivalents thereof.
Claims (10)
1. the LED-COB base plate for packaging (100) of a high heat conduction, it comprises: substrate (101), thermal insulation layer (102) and copper foil layer (103),
Described thermal insulation layer (102) is arranged between described substrate (101) and described copper foil layer (103),
It is characterized in that,
Described thermal insulation layer (102) is at least divided into the high thermal conductive zone (201) being mixed with diamond dust, the middle thermal conductive zone (202) being mixed with high heat-conducting ceramic powder or a small amount of diamond dust and region, (203) three, low thermal conductive zone
Wherein, described middle thermal conductive zone (202) is arranged on described high thermal conductive zone (201) outside, and described low thermal conductive zone (203) is arranged on described middle thermal conductive zone (202) outside.
2. the LED-COB base plate for packaging (100) of high heat conduction according to claim 1, is characterized in that, the diamond dust in described high thermal conductive zone (201) comprises bulky diamond powder and granule diamond dust.
3. the LED-COB base plate for packaging (100) of high heat conduction according to claim 2, is characterized in that, the particle diameter of described granule diamond dust is 10 ~ 90nm, and the particle diameter of described bulky diamond powder is 1 ~ 5 μm.
4. the LED-COB base plate for packaging (100) of high heat conduction according to claim 3, it is characterized in that, described granule diamond dust and described bulky diamond size of powder particles respectively, be evenly distributed in disperse shape in the high thermal conductive zone (201) of the described thermal insulation layer (102) be made up of epoxy resin, organic siliconresin or epoxy modified silicone resin.
5. the LED-COB base plate for packaging (100) of high heat conduction according to claim 1, is characterized in that, described high heat-conducting ceramic powder is aluminum nitride ceramic powder, beryllium oxide ceramics powder or high heat conduction alumina ceramic powder.
6. the LED-COB base plate for packaging (100) of high heat conduction according to claim 5, it is characterized in that, described high heat-conducting ceramic powder or a small amount of diamond dust are that disperse shape is evenly distributed in the middle thermal conductive zone (202) of the described thermal insulation layer (102) be made up of epoxy resin, organic siliconresin or epoxy modified silicone resin.
7. the LED-COB base plate for packaging (100) of high heat conduction according to claim 1, it is characterized in that, any Heat Conduction Material powder is not mixed in the low thermal conductive zone (203) of the described thermal insulation layer (102) be made up of epoxy resin, organic siliconresin or epoxy modified silicone resin
Or in described low thermal conductive zone (203), mix but the powder of negligible amounts identical with described high thermal conductive zone (201) or described middle thermal conductive zone (202).
8. according to the LED-COB base plate for packaging (100) of the high heat conduction one of claim 1 to 7 Suo Shu, it is characterized in that, described substrate (101) is high heat-conducting ceramic substrate or high thermal conductivity aluminum matrix plate.
9. according to the LED-COB base plate for packaging (100) of the high heat conduction one of claim 1 to 7 Suo Shu, it is characterized in that, described thermal insulation layer (102) is provided with the circuit be made up of described copper foil layer (103).
10. the LED-COB base plate for packaging (100) of high heat conduction according to claim 9, it is characterized in that, the region of installing LED chip is reserved with in the upper position corresponding with described high thermal conductive zone (201) of described copper foil layer (103)
The region of the non-chip on described copper foil layer (103) is provided with reflector (105),
The region of the non-chip on described copper foil layer (103) and non-reflective layer region are provided with white oil insulating barrier (104).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320884393.8U CN204216071U (en) | 2013-12-30 | 2013-12-30 | A kind of LED-COB base plate for packaging of high heat conduction |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201320884393.8U CN204216071U (en) | 2013-12-30 | 2013-12-30 | A kind of LED-COB base plate for packaging of high heat conduction |
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| CN204216071U true CN204216071U (en) | 2015-03-18 |
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| CN201320884393.8U Expired - Fee Related CN204216071U (en) | 2013-12-30 | 2013-12-30 | A kind of LED-COB base plate for packaging of high heat conduction |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105098046A (en) * | 2014-05-19 | 2015-11-25 | 四川新力光源股份有限公司 | LED light source substrate, method for manufacturing LED light source substrate and LED light source |
| CN108087728A (en) * | 2017-12-13 | 2018-05-29 | 苏州吉赛电子科技有限公司 | LED chip and preparation method thereof |
| CN113619229A (en) * | 2021-08-13 | 2021-11-09 | 宁波卓翔科技有限公司 | Integrated composite mica sheet and preparation method and application thereof |
-
2013
- 2013-12-30 CN CN201320884393.8U patent/CN204216071U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105098046A (en) * | 2014-05-19 | 2015-11-25 | 四川新力光源股份有限公司 | LED light source substrate, method for manufacturing LED light source substrate and LED light source |
| CN108087728A (en) * | 2017-12-13 | 2018-05-29 | 苏州吉赛电子科技有限公司 | LED chip and preparation method thereof |
| CN113619229A (en) * | 2021-08-13 | 2021-11-09 | 宁波卓翔科技有限公司 | Integrated composite mica sheet and preparation method and application thereof |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150318 Termination date: 20181230 |