CN112366201A - High-power light source packaging structure and manufacturing method thereof - Google Patents
High-power light source packaging structure and manufacturing method thereof Download PDFInfo
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- CN112366201A CN112366201A CN202011231566.7A CN202011231566A CN112366201A CN 112366201 A CN112366201 A CN 112366201A CN 202011231566 A CN202011231566 A CN 202011231566A CN 112366201 A CN112366201 A CN 112366201A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The application relates to the technical field of semiconductor light sources, and provides a high-power light source packaging structure and a manufacturing method thereof, wherein the high-power light source packaging structure comprises a substrate, a metal block device, a light-emitting chip and a packaging cover; the metal block device is provided with a main body block and a mounting block, a plurality of mounting surfaces are arranged on the periphery of the mounting block, each light-emitting chip is fixed on each mounting surface, and the light-emitting directions of the light-emitting chips are the same; the packaging cover is arranged on the substrate and covers the metal block device and the plurality of light-emitting chips, the packaging cover is provided with a light-transmitting piece, the light-transmitting piece is positioned on a light-emitting path of each light-emitting chip, the lower surface of the substrate is provided with a first conducting strip and a second conducting strip at intervals, and the first conducting strip and the second conducting strip are electrically connected with the metal block device. Through the metal block device with a plurality of installation faces arranged on the substrate, a plurality of light-emitting chips can be arranged simultaneously to improve power, and the metal block device can also improve the heat dissipation effect, so that the high-power light source packaging structure has the advantages of high power and good heat dissipation effect.
Description
Technical Field
The application belongs to the technical field of semiconductor light sources, and particularly relates to a high-power light source packaging structure and a manufacturing method thereof.
Background
A Light Emitting Diode (LED) is a solid semiconductor device capable of converting electric energy into visible light, and an LED light source is widely used because it has advantages of using a low voltage power supply, consuming less energy, having a long service life and high stability. For example, in miniature products such as miniature projectors or miniature car lights, high power LED light sources or high power laser light sources have been used, wherein, high power LED light sources need TO adopt the luminous chip of jumbo size, and radiant power CAN only reach 5-8W, and in miniature products, the space is little, TO the inconvenient and with high costs or the not good life that influences miniature products of heat dissipation processing of high power LED light source heat dissipation processing, wherein laser light sources adopts the TO-CAN encapsulation device that power is 3-5W, on the one hand power is less, on the other hand TO-CAN encapsulation device is plug-in components, its radiating mode CAN only add the tin heat dissipation after positive negative pole leg pegs graft on the circuit board, heat radiating area is little, simultaneously the leg is when pegging graft and is easily caused phenomenons such as crooked and influence packaging efficiency if the butt joint is inaccurate.
Disclosure of Invention
An object of the embodiment of the present application is to provide a high power light source package structure, so as to solve the technical problems in the prior art that a light source package body has poor heat dissipation effect and low power.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: provided is a high power light source package structure, including:
a substrate;
the metal block device is arranged on the upper surface of the substrate and provided with a main body block and an installation block, the installation block is fixed on one side of the main body block, and a plurality of installation surfaces are arranged on the peripheral side of the installation block;
the light-emitting chips are fixed on the mounting surfaces and electrically connected with the metal block device, and the light-emitting directions of the light-emitting chips are the same; and the number of the first and second groups,
the packaging cover is arranged on the substrate and covers the metal block device and the plurality of light-emitting chips, the packaging cover is provided with a light-transmitting piece, the light-transmitting piece is positioned on a light-emitting path of each light-emitting chip, a first conducting strip and a second conducting strip are arranged on the lower surface of the substrate at intervals, and the first conducting strip and the second conducting strip are electrically connected with the metal block device.
In one embodiment, the metal block device is a copper block device.
In one embodiment, the main body block is disposed on the substrate, and the substrate is a ceramic substrate.
In one embodiment, the mounting block is a regular prism.
In one embodiment, the package cover is a metal cover or a glass cover.
In one embodiment, the packaging cover is a rectangular cover, the packaging cover comprises four side plates and a top plate which are connected with each other and enclose a cavity, and the light-transmitting piece is one of the four side plates.
In one embodiment, the light-transmitting member includes a convex lens, and the convex lens is located on a light exit path of each of the light-emitting chips.
In one embodiment, the metal block device has a metal pole piece thereon, the plurality of light emitting chips are electrically connected to the metal pole piece, the metal pole piece extends to the bottom surface of the main body block, the upper surface of the substrate is provided with a third conductive sheet and a fourth conductive sheet which are electrically connected to the metal pole piece, the third conductive sheet is electrically connected to the first conductive sheet, and the fourth conductive sheet is electrically connected to the second conductive sheet.
In one embodiment, the upper surface of the substrate is provided with a circle of mounting grooves for mounting the encapsulation cover.
Another object of the present application is to provide a method for manufacturing a high power light source package structure, including the following steps:
s1, manufacturing a packaging cover, a substrate and a metal block device; the packaging cover is provided with a light-transmitting piece, the substrate is provided with a first conducting strip and a second conducting strip, and the metal block device is provided with a plurality of mounting surfaces;
s2, fixing a plurality of light-emitting chips on the mounting surfaces respectively, electrically connecting the light-emitting chips with the metal block device, and enabling the light-emitting directions of the light-emitting chips to be the same;
s3, fixing the metal block devices on the substrate, and enabling the metal block devices to be electrically connected with the first conducting strips and the second conducting strips;
and S4, fixing the packaging cover on the substrate, covering the metal block device and the plurality of light-emitting chips, and enabling the light-transmitting piece to be located on the light-emitting path of each light-emitting chip.
The application provides a high power light source packaging structure and manufacturing method's beneficial effect lies in: through set up the metal block device on the base plate, be equipped with a plurality of installation faces on the installation piece of metal block device to can set up a plurality of luminescence chips that the light-emitting direction is the same simultaneously in order to raise the power, the metal block device can also improve the radiating effect simultaneously, and the automatic laminating welding that high power light source packaging structure can be realized through surface mounting technology to first conducting strip and the second conducting strip that the base plate lower surface set up is on the circuit board, has improved equipment quality and production efficiency.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic diagram of an oblique top explosion structure of a high power light source package structure according to an embodiment of the present disclosure;
fig. 2 is a schematic diagram of an oblique bottom view explosion structure of a high power light source package structure according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a metal block device, a light emitting chip and a substrate in a high power light source package structure according to an embodiment of the present disclosure;
fig. 4 is a schematic side view illustrating a side view structure of a high power light source package structure provided in the present application, wherein the mounting block is a regular triangle;
fig. 5 is a schematic side view illustrating a square mounting block in the high power light source package structure according to the embodiment of the present disclosure;
fig. 6 is a schematic side view of a high power light source package structure provided in this embodiment of the present application, in which a mounting block is a regular pentagon;
fig. 7 is a schematic flowchart of a manufacturing method of a high-power light source package structure according to an embodiment of the present disclosure.
Wherein, in the figures, the respective reference numerals:
1. a substrate; 11. a first conductive sheet; 12. a second conductive sheet; 13. a third conductive sheet; 14. a fourth conductive sheet; 15. mounting grooves; 2. a metal block device; 21. a main body block; 22. mounting blocks; 221. a mounting surface; 23. a metal pole piece; 3. a light emitting chip; 31. a light-emitting surface; 4. a package cover; 41. a light transmissive member; 42. a side plate; 43. a top plate.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
As shown in fig. 1 to fig. 3, a description will now be made of a high power light source package structure provided in an embodiment of the present application. The high-power light source packaging structure comprises a substrate 1, a metal block device 2, a plurality of light-emitting chips 3 and a packaging cover 4. The metal block device 2 is disposed on the upper surface of the substrate 1, and specifically, the metal block device 2 includes a main body block 21 and a mounting block 22, the main body block 21 is disposed on the substrate 1, the mounting block 22 is disposed on one side of the main body block 21, and a plurality of mounting surfaces 221 are disposed on the peripheral side of the mounting block 22. The main body block 21 and the mounting block 22 are integrally formed or welded, and the main body block 21 is welded to the substrate 1.
The lower surface of the substrate 1 is provided with a first conducting strip 11 and a second conducting strip 12 at intervals, which are electrically connected with the metal block device 2, the first conducting strip 11 and the second conducting strip 12 are respectively used for welding with an anode pad and a cathode pad on a circuit board, the number of the plurality of mounting surfaces 221 on the mounting block 22 is the same as that of the plurality of light-emitting chips 3, each mounting surface 221 is fixedly provided with one light-emitting chip 3 in an electrical connection manner, each light-emitting chip 3 is electrically connected with the metal block device 2, the light-emitting surface 31 of each light-emitting chip 3 is positioned on the same side of the metal block device 2 so that the light-emitting direction of each light-emitting chip 3 is the same, and the light-emitting chips.
Wherein, encapsulation cover 4 is fixed at the upper surface of base plate 1 and is used for covering metal block device 2 and a plurality of luminescence chip 3 to play the guard action to metal block device 2 and luminescence chip 3, encapsulation cover 4 has light-permeable piece 41, and light-permeable piece 41 is located each luminescence chip 3's light-emitting path, and light-permeable piece 41 is used for supplying luminescence chip 3's light to jet out encapsulation cover 4 in order to play the illumination effect.
The high power light source packaging structure that this application embodiment provided, through set up metal block device 2 on base plate 1, the installation piece 22 of metal block device 2 possesses a plurality of installation faces 221 to can set up the same luminescent chip 3 of a plurality of light-emitting directions simultaneously in order to improve light source packaging structure's power, metal block device 2 can also improve the radiating effect simultaneously, makes this high power light source packaging structure have power big, advantage that the radiating effect is good. The first conducting strip 11 and the second conducting strip 12 arranged on the lower Surface of the substrate 1 can realize the automatic bonding and welding of the high-power light source packaging structure on a circuit board through a Surface Mount Technology (SMT) process, so that the automatic assembly of the high-power packaging structure is realized, and the production efficiency and the assembly quality are improved.
In this embodiment, the metal block device 2 is a copper block device, which has the advantages of good electrical conductivity and good heat dissipation. In other embodiments, the metal block arrangement 2 is an aluminum block arrangement. As shown in fig. 1-3, a metal pole piece 23 is disposed on the metal block device 2, each light emitting chip 3 is electrically connected and fixed on the metal pole piece 23, the metal pole piece 23 extends from the mounting surface 221 to the bottom surface of the main body block 21, the metal pole piece 23 located on the bottom surface of the main body block 21 is used for electrically connecting with the first conductive sheet 11 and the second conductive sheet 12, therefore, the metal pole piece 23 is used for electrically connecting each light emitting chip 3 with the first conductive sheet 11 and the second conductive sheet 12, and the metal pole piece 23 is a copper sheet to ensure electrical conductivity.
As shown in fig. 4 to 6, in the present embodiment, the mounting block 22 is a regular prism, and the side surface of the regular prism is the mounting surface 221. As shown in fig. 4, the mounting block 22 is a regular triangular prism having three side surfaces, which are the three mounting surfaces 221, and the plurality of light emitting chips 3 have three. As shown in fig. 5, the mounting block 22 is a regular quadrangular prism having four mounting surfaces 221, in which case the plurality of light emitting chips 3 has four. As shown in fig. 6, the mounting block 22 is a regular pentagonal prism having five mounting surfaces 221, and the plurality of light emitting chips 3 are five in number. Of course, the regular prism may also be a regular hexagonal prism, a regular octagonal prism, or the like, and the structure may be selected according to the usage amount of the light emitting chip 3. In this embodiment, the light emitting chip 3 may be one or more of an edge-emitting laser light emitting chip, a red light emitting chip, a green light emitting chip, a blue light emitting chip, or an infrared light emitting chip, so that the high-power light source package structure can emit light of various colors or functions. The side of the light-emitting chip 3 attached to the mounting surface 221 is provided with a positive electrode, the side of the light-emitting chip 3 away from the positive electrode is provided with a negative electrode, the end face of the light-emitting chip 3 close to the light-transmitting member 41 is the light-emitting surface 31, the negative electrode is electrically connected with the metal pole piece 23 through a gold thread, and the positive electrode is electrically connected with the metal pole piece 23 through a conductive adhesive bonding, tin bonding or eutectic mode.
As shown in fig. 1 to fig. 3, in the present embodiment, the package cover 4 is a metal cover, which has the advantages of good heat dissipation effect and high structural strength, and can protect and dissipate heat from the metal block device 2 and the light emitting chip 3. Wherein, the metal cover is made of aluminum material or steel material. In other embodiments, the package cover 4 is a glass cover made of K7 glass material or K9 glass material.
Specifically, the package cover 4 is a rectangular cover, which has the advantage of simple manufacture, and the package cover 4 includes four side plates 42 and a top plate 43 that are connected to each other and enclose a cavity, and the four side plates 42 and the top plate 43 are fixedly connected by stamping, welding or bonding.
In one embodiment, the light-transmitting member is one of four side plates 42, and the light-transmitting member as a whole side plate 42 is made of, for example, a light-transmitting glass material, and is connected to the adjacent side plate 42 and the top plate 43, and further, the light-transmitting member as a side plate includes a lens integrally formed on the light-transmitting member, and the lens is located on the light-emitting path of each light-emitting chip 3 for adjusting the light shape of the light emitted by the light-emitting chip 3.
In one embodiment, as shown in fig. 2, the light-transmitting member 41 is mounted on the side plate 42, and the light-transmitting member 41 is a lens, which may be a convex lens, a concave lens or a fresnel lens. The lens is positioned on the light-emitting path of each light-emitting chip 3, and the lens is used for adjusting the light shape of the light emitted by the light-emitting chip 3, so that the light emitted by the high-power light source packaging structure can achieve different using effects. In the present embodiment, the light-transmitting member 41 is made of a glass material, specifically, a quartz glass material. In this embodiment, a copper layer or a tin layer is disposed on a surface of the light-transmitting member 41 for connecting with the side plate 42, so that the light-transmitting member 41 and the side plate 42 can be eutectic-fixed, or the light-transmitting member 41 is fixed on the side plate 42 by gluing, and the side plate 42 is provided with a mounting hole for mounting the light-transmitting member 41.
As shown in fig. 1 to fig. 3, in the present embodiment, the upper surface of the substrate 1 is provided with a third conductive sheet 13 and a fourth conductive sheet 14, which are electrically connected to the metal block device 2, the third conductive sheet 13 is electrically connected to the first conductive sheet 11, and the fourth conductive sheet 14 is electrically connected to the second conductive sheet 12. Specifically, the third conductive sheet 13 and the fourth conductive sheet 14 are electrically connected to the metal pole piece 23, respectively, wherein the first conductive sheet 11, the second conductive sheet 12, the third conductive sheet 13, and the fourth conductive sheet 14 are all embedded in the substrate 1 when the substrate 1 is formed.
As shown in fig. 1 and 3, a circle of mounting groove 15 for mounting the package cover 4 is formed on the upper surface of the substrate 1, and one end of the package cover 4 is inserted into the mounting groove 15 and then fixedly connected to the substrate 1 by metal welding or adhesive dispensing.
In the present embodiment, the substrate 1 is any one of a ceramic substrate, a silicon carbide substrate, or a graphene substrate.
As shown in fig. 7, the present embodiment further provides a manufacturing method of a high power light source package structure, the manufacturing method is used for manufacturing the high power light source package structure stated above, and the manufacturing method specifically includes the following steps:
s1, manufacturing a packaging cover 4, a substrate 1 and a metal block device 2; the packaging cover 4 is provided with a light-transmitting piece 41, the substrate 1 is provided with a first conducting strip 11 and a second conducting strip 12, and the metal block device 2 is provided with a plurality of mounting surfaces 221;
s2, fixing the light emitting chips 3 on the mounting surfaces 221 of the metal block device 2, electrically connecting the metal block device 2, and making the light emitting directions of the light emitting chips 3 the same;
s3, fixing the metal block device 2 on the substrate 1, and electrically connecting the metal block device 2 with the first conducting strip 11 and the second conducting strip 12;
s4, fixing the package cover 4 on the substrate 1, covering the metal block device 2 and the plurality of light emitting chips 3, and positioning the light-transmitting member 41 on the light emitting path of each light emitting chip 3.
In the step S1, the package cover 4 and the light-transmitting member 41 are fixed by eutectic or adhesive, the light-transmitting member 41 is a lens structure, the first conductive sheet 11 and the second conductive sheet are located on the lower surface of the substrate 1, the third conductive sheet 13 and the fourth conductive sheet 14 are disposed on the upper surface of the substrate 1, and the metal pole piece 23 is disposed on the metal block device 2. The metal block device 2 includes a main body block 21 and a mounting block 22 integrally formed on one side of the main body block 21, and each mounting surface 221 is a circumferential side surface of the mounting block 22.
In step S2, the positive electrode of the light-emitting chip 3 is electrically connected to the metal block device 2 by means of conductive paste adhesion, solder bonding, or eutectic bonding, and the negative electrode of the light-emitting chip 3 is electrically connected to the metal block device 2 by means of a gold wire bonding. The light emitting side of the light emitting chip 3 is located on the same side of the metal block device 2, so that the light emitting directions are the same.
In step S3, the metal block device 2 is fixed on the substrate 1 by soldering, so that the third conductive sheet 13 and the fourth conductive sheet 14 are electrically connected to the metal pole pieces 23 on the metal block device 2, respectively, and the soldering process includes an eutectic process, a solder paste, and a co-solvent eutectic process.
In the step S4, during the manufacturing process of the substrate 1, a circle of mounting groove 15 is formed on the upper surface of the substrate 1, and one end of the package cover 4 is inserted into the mounting groove 15 and then fixed on the substrate 1 by metal welding or adhesive dispensing.
The high-power light source packaging structure of the embodiment of the application has the advantages of good heat dissipation effect and high power, and meanwhile, the high-power light source packaging structure can be automatically attached and welded on a circuit board through an SMT (surface mount technology), so that automation is realized, and the assembly quality and the production efficiency are improved.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A high power light source package structure, comprising:
a substrate;
the metal block device is arranged on the upper surface of the substrate and provided with a main body block and an installation block, the installation block is fixed on one side of the main body block, and a plurality of installation surfaces are arranged on the peripheral side of the installation block;
the light-emitting chips are fixed on the mounting surfaces and electrically connected with the metal block device, and the light-emitting directions of the light-emitting chips are the same; and the number of the first and second groups,
the packaging cover is arranged on the substrate and covers the metal block device and the plurality of light-emitting chips, the packaging cover is provided with a light-transmitting piece, the light-transmitting piece is positioned on a light-emitting path of each light-emitting chip, a first conducting strip and a second conducting strip are arranged on the lower surface of the substrate at intervals, and the first conducting strip and the second conducting strip are electrically connected with the metal block device.
2. The high power light source package structure of claim 1, wherein the metal block device is a copper block device.
3. The high power light source package structure of claim 1, wherein the body block is disposed on the substrate, and the substrate is a ceramic substrate.
4. The high power light source package of claim 1, wherein the mounting block is a regular prism.
5. The high power light source package structure of claim 1, wherein the package cover is a metal cover or a glass cover.
6. The high power light source package structure of claim 5, wherein the package cover is a rectangular cover, the package cover comprises four side plates and a top plate connected to each other and enclosing a cavity, and the light-transmitting member is one of the four side plates.
7. The high power light source package structure of claim 1, wherein the light-transmitting member comprises a convex lens, and the convex lens is located on a light exit path of each of the light-emitting chips.
8. The high power light source package structure of claim 1, wherein the metal block device has a metal pole piece thereon, the plurality of light emitting chips are electrically connected to the metal pole piece, the metal pole piece extends to the bottom surface of the main body block, the upper surface of the substrate is provided with a third conductive sheet and a fourth conductive sheet, which are electrically connected to the metal pole piece, the third conductive sheet is electrically connected to the first conductive sheet, and the fourth conductive sheet is electrically connected to the second conductive sheet.
9. The high power light source package structure of claim 1, wherein the upper surface of the substrate is provided with a ring of mounting grooves for mounting the package cover.
10. A manufacturing method of a high-power light source packaging structure is characterized by comprising the following steps:
s1, manufacturing a packaging cover, a substrate and a metal block device; the packaging cover is provided with a light-transmitting piece, the substrate is provided with a first conducting strip and a second conducting strip, and the metal block device is provided with a plurality of mounting surfaces;
s2, fixing a plurality of light-emitting chips on the mounting surfaces respectively, electrically connecting the light-emitting chips with the metal block device, and enabling the light-emitting directions of the light-emitting chips to be the same;
s3, fixing the metal block devices on the substrate, and enabling the metal block devices to be electrically connected with the first conducting strips and the second conducting strips;
and S4, fixing the packaging cover on the substrate, covering the metal block device and the plurality of light-emitting chips, and enabling the light-transmitting piece to be located on the light-emitting path of each light-emitting chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011231566.7A CN112366201A (en) | 2020-11-06 | 2020-11-06 | High-power light source packaging structure and manufacturing method thereof |
| TW109141412A TWI753673B (en) | 2020-11-06 | 2020-11-25 | High-power light source package structure and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011231566.7A CN112366201A (en) | 2020-11-06 | 2020-11-06 | High-power light source packaging structure and manufacturing method thereof |
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| CN112366201A true CN112366201A (en) | 2021-02-12 |
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| CN113126108A (en) * | 2021-04-08 | 2021-07-16 | 弘凯光电(江苏)有限公司 | Distance sensor and method for manufacturing same |
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| Publication number | Publication date |
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| TWI753673B (en) | 2022-01-21 |
| TW202220235A (en) | 2022-05-16 |
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