CN113126108A - Distance sensor and method for manufacturing same - Google Patents
Distance sensor and method for manufacturing same Download PDFInfo
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- CN113126108A CN113126108A CN202110377451.7A CN202110377451A CN113126108A CN 113126108 A CN113126108 A CN 113126108A CN 202110377451 A CN202110377451 A CN 202110377451A CN 113126108 A CN113126108 A CN 113126108A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Remote Sensing (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Radar, Positioning & Navigation (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
The invention relates to the technical field of distance sensors, and provides a distance sensor and a manufacturing method thereof. The distance sensor comprises a substrate, a light-emitting chip, a sensing chip, a separating rubber wall and a light-blocking rubber shell, wherein the light-emitting chip and the sensing chip are installed on the substrate, the separating rubber wall is convexly arranged on the sensing chip, the light-blocking rubber shell is installed on the substrate, and the separating rubber wall separates an inner cavity of the light-blocking rubber shell into a first cavity and a second cavity. According to the distance sensor and the manufacturing method thereof, the separating rubber wall is arranged between the transmitting end photosensitive area and the receiving end photosensitive area in a protruding mode, the separating rubber wall can completely separate light interference between the first cavity and the second cavity, the technical problem that the existing distance sensor is low in detection accuracy is solved, the detection accuracy of the distance sensor is improved, and the light-emitting chip and the sensing chip cannot be damaged by pressure when the light blocking rubber shell is installed.
Description
Technical Field
The invention relates to the technical field of distance sensors, in particular to a distance sensor and a manufacturing method thereof.
Background
The distance sensor is a sensor that detects the approach of an object in a non-contact manner. Since the detection can be performed in a non-contact manner without abrasion or damage to the detection object, the distance sensor is widely used in various industries. For example, an automatic teller machine uses a distance sensor to detect whether a teller approaches, a production line uses the distance sensor to count products, a smart phone uses the distance sensor to detect whether a user leaves, a smart phone uses the distance sensor to detect the distance to the ear, and the like.
Referring to fig. 1 and 2, the distance sensor includes a substrate 11, an emitting chip 12, a sensing chip 13 and a plastic casing 14, the emitting chip 12 and the sensing chip 13 are mounted on the substrate 11 at intervals, the sensing chip 13 includes an emitting end photosensitive area 15 and a receiving end photosensitive area 16, the plastic casing 14 is covered on the substrate 11 and is separated into two chambers, wherein the emitting chip 12 and the emitting end photosensitive area 15 are located in one chamber, and the receiving end photosensitive area 16 is located in the other chamber. The working principle of the distance sensor is that a part of light emitted by the emitting chip 12 directly reaches the emitting end photosensitive area 15, the other part of light emitted by the emitting chip 12 is emitted out of the plastic shell 14 and then meets the detection object 17 and then is reflected back to the receiving end photosensitive area 16, and the distance of the detection object 17 is calculated according to the time difference of the light received by the emitting end photosensitive area 15 and the receiving end photosensitive area 16.
According to the related art known to the inventor, referring to fig. 2 and 3, the plastic housing 14 in the distance sensor has two chambers, but the two chambers are not completely separated. Since the partition wall 18 is prevented from crushing the sensing chip 13, a gap 19 is formed between the partition wall 18 and the sensing chip 13, so that the light of the two chambers affect each other, and the detection accuracy of the distance sensor is reduced.
Disclosure of Invention
The invention aims to provide a distance sensor and a manufacturing method thereof, and aims to solve the technical problem that the existing distance sensor is low in detection accuracy.
In order to achieve the purpose, the invention adopts the technical scheme that: a distance sensor comprises a substrate, a sensing chip, a separation rubber wall and a light blocking rubber shell, wherein a light emitting chip is mounted on the substrate; the sensing chip is arranged on the substrate and is spaced from the light-emitting chip, and the sensing chip comprises an emitting end photosensitive area close to the light-emitting chip and a receiving end photosensitive area far away from the light-emitting chip; the separation rubber wall is convexly arranged on the sensing chip and is positioned between the transmitting end photosensitive area and the receiving end photosensitive area; the light blocking rubber shell is arranged on the base plate, the top of the separating rubber wall is connected with the light blocking rubber shell, an inner cavity of the light blocking rubber shell is divided into a first cavity and a second cavity, the receiving end photosensitive area is located in the first cavity, the light emitting chip and the transmitting end photosensitive area are located in the second cavity, and the light blocking rubber shell is further provided with a first light hole communicated with the first cavity and a second light hole communicated with the second cavity.
In one embodiment, the substrate comprises a bottom plate and a flange arranged around the circumference of the bottom plate, the flange is provided with a notch, and the light blocking rubber shell is provided with a lug matched with the notch.
In one embodiment, the partition rubber wall spans across the sensing chip, two ends of the partition rubber wall respectively abut against the inner wall of the flange, and the top of the partition rubber wall is flush with the top end of the flange.
In one embodiment, the distance sensor further includes two transparent rubber blocks, and the two transparent rubber blocks are respectively filled in the first cavity and the second cavity.
In one embodiment, the distance sensor further includes a lens integrally formed with the transparent adhesive block in the first chamber, and the lens is configured to guide the incident light passing through the first light hole to converge on the receiving-end photosensitive area.
In one embodiment, the transparent adhesive block located in the second cavity has a third light hole corresponding to the light emitting chip.
In one embodiment, the transparent glue block is flush with the partition glue wall.
In one embodiment, the transparent rubber blocks are higher than the separation rubber wall, a clamping groove is formed between the two transparent rubber blocks, and the light blocking rubber shell is provided with a separation wall which extends into the clamping groove and is attached to the separation rubber wall.
In one embodiment, the light blocking plastic shell is a plastic shell or a molded plastic shell.
The invention also provides a distance sensor, which comprises a substrate, a light-emitting chip, a sensing chip, a light-blocking rubber shell and a separating rubber wall, the light-emitting chip and the sensing chip are arranged on the substrate at intervals, the sensing chip comprises an emitting end photosensitive area close to the light-emitting chip and a receiving end photosensitive area far away from the light-emitting chip, the light blocking rubber shell is arranged on the substrate, the top of the light blocking rubber shell is provided with a hole, one end of the separating rubber wall is connected with the inner side wall of the hole, the other end of the separating rubber wall is connected with the sensing chip and is positioned between the transmitting end photosensitive area and the receiving end photosensitive area, the separating rubber wall separates the inner cavity of the light blocking rubber shell into a first cavity and a second cavity, and the light blocking rubber shell is further provided with a first light hole communicated with the first cavity and a second light hole communicated with the second cavity.
The invention also provides a manufacturing method of the distance sensor, which comprises the following steps:
providing a substrate, and mounting a light-emitting chip and a sensing chip on the substrate at intervals;
forming a separation rubber wall between the transmitting end photosensitive area and the receiving end photosensitive area on the sensing chip;
forming a light blocking rubber shell covering the light emitting chip and the sensing chip on the substrate by using a mould pressing injection molding process; the top of the separating glue wall is connected with the light blocking glue shell, the inner cavity of the light blocking glue shell is divided into a second light blocking wall of a first cavity and a second cavity, the receiving end photosensitive area is located in the first cavity, the light emitting chip and the emitting end photosensitive area are located in the second cavity, and the light blocking glue shell is further provided with a first light hole communicated with the first cavity and a second light hole communicated with the second cavity.
The distance sensor and the manufacturing method thereof provided by the invention have the beneficial effects that: adopt protruding the establishing between transmitting terminal photosensitive area and receiving terminal photosensitive area to separate gluey wall, separate gluey wall and can separate the light interference between first cavity and the second cavity completely, solved current distance sensor's the low technical problem of detection precision to improve distance sensor's detection precision, and can not weigh luminous chip and sensing chip when being in the light and glue the shell installation.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic diagram of the operation of a distance sensor;
fig. 2 is an exploded view of a related art distance sensor;
fig. 3 is an internal view of a related art distance sensor;
FIG. 4 is an exploded view of the distance sensor in the third embodiment;
fig. 5(a) to (f) are manufacturing flowcharts of a method of manufacturing a distance sensor in the third embodiment;
FIG. 6 is an exploded view of the distance sensor in the fourth embodiment;
fig. 7(a) to (e) are manufacturing flowcharts of a method of manufacturing a distance sensor in the fourth embodiment;
FIG. 8 is an exploded view of another distance sensor according to the fourth embodiment;
FIG. 9 is a cross-sectional view of the light blocking gel cover of the distance sensor of FIG. 8;
fig. 10(a) to (h) are manufacturing flowcharts of a manufacturing method of another distance sensor according to the fourth embodiment;
FIG. 11 is an exploded view of the distance sensor in the fifth embodiment;
fig. 12(a) to (g) are manufacturing flowcharts of a method of manufacturing a distance sensor in the fifth embodiment.
Wherein, in the figures, the respective reference numerals:
11-substrate, 12-emission chip, 13-sensing chip, 14-plastic shell, 15-emission end photosensitive area, 16-receiving end photosensitive area, 17-detection object, 18-partition wall, 19-gap;
100-substrate, 110-base plate, 120-flange, 121-notch;
200-a light emitting chip;
300-sensing chip, 310-transmitting terminal photosensitive area, 320-receiving terminal photosensitive area;
410-a separation rubber wall, 430-a transparent rubber block, 431-a third light hole, 432-a clamping groove, 440-a lens, 450-a first optical filter and 460-a second optical filter;
500-light blocking rubber shell, 501-partition wall, 510-first chamber, 520-second chamber, 530-first light hole, 540-second light hole, 550-lug, 560-hole;
610-mould pressing jig, 611-hole cover, 630-dispensing head.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Example one
Referring to fig. 4, 8 and 9, a distance sensor includes a substrate 100, a light emitting chip 200, a sensing chip 300, a partition wall 410 and a light blocking rubber case 500. The light emitting chip 200 is mounted on the substrate 100. The sensing chip 300 is mounted on the substrate 100 and spaced apart from the light emitting chip 200. The sensing chip 300 includes an emitting end photosensitive region 310 close to the light emitting chip 200 and a receiving end photosensitive region 320 far from the light emitting chip 200. The partition glue wall 410 protrudes from the sensing chip 300 and is located between the transmitting end photosensitive region 310 and the receiving end photosensitive region 320. The light blocking plastic shell 500 is mounted on the substrate 100, the top of the partition plastic wall 410 is connected to the light blocking plastic shell 500, and partitions the internal cavity of the light blocking plastic shell 500 into a first cavity 510 and a second cavity 520 (please refer to fig. 7 and 9), the receiving end photosensitive area 320 is located in the first cavity 510, the light emitting chip 200 and the emitting end photosensitive area 310 are located in the second cavity 520, and the light blocking plastic shell 500 further has a first light hole 530 communicated with the first cavity 510 and a second light hole 540 communicated with the second cavity 520.
The distance sensor provided by the invention adopts the separation rubber wall 410 which is convexly arranged between the transmitting end photosensitive area 310 and the receiving end photosensitive area 320, when the light blocking rubber shell 500 is arranged on the substrate 100, the separation rubber wall 410 can completely separate light interference between the first cavity 510 and the second cavity 520, the technical problem of low detection precision caused by light leakage of the cavity of the existing distance sensor is solved, the detection precision of the distance sensor is improved, and the light blocking rubber shell 500 cannot damage the light emitting chip 200 and the sensing chip 300 when being arranged.
In this embodiment, the term "abutting" includes a case where the two are connected to each other, and also includes a case where the two are in contact with each other but are not physically connected to each other.
The substrate 100 includes, but is not limited to, one of a printed circuit board, a bismaleimide triazine substrate, a glass fiber substrate, or a direct copper clad substrate. The light emitting chip 200 is electrically connected to the substrate 100 through a wire bonding process. The light emitting chip 200 may be, for example, a laser chip. The sensing chip 300 is electrically connected to the substrate 100 through a wire bonding process.
The light blocking rubber case 500 and the separating rubber wall 410 may be made of opaque epoxy resin, acrylate resin, or polyvinyl chloride, which are independent of each other. Optionally, the light blocking rubber case 500 and the separating rubber wall 410 are made of black rubber.
The light blocking rubber case 500 may be a plastic case, which is manufactured in advance through an injection molding process and then mounted on the substrate 100; the light blocking gel case 500 may also be selected as a mold-pressed gel case, and a mold is pressed on the substrate 100 mounted with the light emitting chip 200 and the sensing chip 300 using a mold-pressing process and the gel is injected, thereby forming the light blocking gel case 500 on the substrate 100.
In some embodiments, referring to fig. 4 and 5, the substrate 100 includes a bottom plate 110 and a flange 120 disposed around the circumference of the bottom plate 110, the flange 120 has a notch 121, and the light blocking rubber shell 500 has a protrusion 550 matching with the notch 121. When the light blocking plastic shell 500 is a mold pressing plastic shell, the arrangement of the notch 121 facilitates mold pressing for glue feeding. When the glue shell 500 that is in the light is the plastic shell, the setting of breach 121 is convenient for fix a position to improve the butt joint precision between plastic shell and the base plate 100, avoid the two skew to appear, the gap appears even, prevent the light leak, the protection is located the inside luminescent chip 200 of glue shell 500 that is in the light and the steam corrosion that sensing chip 300 does not receive external environment, the degree of difficulty of aiming at between glue shell 500 and the base plate 100 that is in the light has been reduced, and then manufacturing cost has been reduced, distance sensor's air tightness performance has been improved.
Specifically, referring to fig. 4, the separating rubber wall 410 spans across the sensing chip 300, two ends of the separating rubber wall 410 respectively abut against the inner wall of the flange 120, and the top of the separating rubber wall 410 is flush with the top end of the flange 120. Thus, the partition glue wall 410 partitions the substrate 100 into two independent portions, thereby preventing light interference.
In some embodiments, referring to fig. 4 and 6, the distance sensor further includes two transparent adhesive blocks 430, and the two transparent adhesive blocks 430 are respectively filled in the first chamber 510 and the second chamber 520. Wherein, the transparent glue block 430 is manufactured by a mould pressing process.
Referring to fig. 4, when the substrate 100 has the gap 121, the glue can enter the first chamber 510 and the second chamber 520 from the gap 121, and after the transparent glue 430 is formed, the transparent glue 430 at the gap 121 is removed, so that the light blocking glue shell 500 can be conveniently manufactured during the secondary molding.
Specifically, referring to fig. 4, the distance sensor further includes a lens 440, the lens 440 is integrally formed with the transparent glue block 430 located in the first chamber 510, and the lens 440 is used for guiding the incident light passing through the first light hole 530 to be converged to the receiving-end photosensitive area 320. The lens 440 is located between the first aperture 530 and the receiver photosensitive region 320.
The inventor has appreciated that some distance sensors in the related art need to have mounting structures at two ends of the first light hole 530, so as to facilitate mounting the optical filter at the top end of the first light hole 530, and the lens 440 is adhered to the bottom end of the first light hole 530. However, since the lens 440 has a small size and a rim thickness of only 0.1mm, if a mounting structure for mounting the lens 440 is required to be disposed on the end wall of the first light hole 530, the production and manufacturing are difficult, and the product defect rate is high. Moreover, the lens 440 is connected by glue, and the glue is easily liquefied or even loses viscosity when passing through an SMT (Surface mount Technology) high temperature furnace, so that the lens 440 is easily dropped. In the embodiment, the lens 440 and the transparent rubber block 430 are molded integrally without arranging an installation structure on the end wall of the first light hole 530, so that the manufacturing process is simplified, the investment of automation equipment is reduced, the production efficiency is improved, and the manufacturing cost is reduced.
Specifically, referring to fig. 11 and 12(e), the transparent adhesive block 430 located in the second cavity 520 has a third light hole 431 corresponding to the light emitting chip 200. Light that emitting chip 200 sent directly jets out through third unthreaded hole 431, does not pass through transparent gluey piece 430, and no refraction loss influences, is favorable to improving distance sensor's detection precision.
The mold pressing jig 610 with the hole cover 620 can be used for processing the third unthreaded hole 431, the mold pressing jig 610 covers the light-emitting chip 200, the colloid cannot enter the inside of the hole cover 620 during mold pressing, the side wall of the hole cover 620 is vertically arranged upwards and is parallel to the moving direction of the mold pressing jig 610, and no obstruction exists during demolding.
Wherein the transparent glue block 430 is flush or not flush with the partition glue wall 410.
In one embodiment, referring to fig. 4, the transparent glue block 430 is flush with the partition glue wall 410.
In another embodiment, referring to fig. 6 and 7(c), the transparent plastic blocks 430 are higher than the separating plastic walls 410, a clamping groove 432 is formed between the two transparent plastic blocks 430, and the light blocking plastic shell 500 has the separating walls 501 extending into the clamping groove 432 and attached to the separating plastic walls.
The partition wall 501 and the partition rubber wall 410 are attached to form a sealed light-blocking wall.
In some embodiments, referring to fig. 8 and 9, the light blocking plastic shell 500 has an aperture 560 at the top, one end of the separating plastic wall 410 is connected to the inner sidewall of the aperture 560, the other end of the separating plastic wall 410 is connected to the sensing chip 310, and the separating plastic wall 410 is located between the transmitting end photosensitive region 310 and the receiving end photosensitive region 320, the separating plastic wall 410 separates the internal cavity of the light blocking plastic shell 500 into a first cavity 510 and a second cavity 520, and the light blocking plastic shell 500 further has a first light hole 530 communicated with the first cavity 510 and a second light hole 540 communicated with the second cavity 520.
Likewise, the partition rubber wall 410 can completely separate the light interference between the first chamber 510 and the second chamber 520, thereby improving the detection accuracy of the distance sensor, and the light-blocking rubber case 500 is installed without damaging the light-emitting chip 200 and the sensing chip 300.
In some embodiments, referring to fig. 4, the distance sensor further includes a first filter 450 installed in the first light hole 530. The first filter 450 is used to filter stray light and light noise.
In some embodiments, referring to fig. 4, the distance sensor further includes a second filter 460 installed at the second light hole 540. The second filter 460 is used to filter stray light and light noise.
Example two
The invention also provides a manufacturing method of the distance sensor, which comprises the following steps:
s100, referring to fig. 5(b) and 12(a), the substrate 100 is provided, and the light emitting chip 200 and the sensing chip 300 are mounted on the substrate 100 at intervals. Optionally, the light emitting chip 200 is electrically connected to the substrate 100 through a wire bonding process. The sensing chip 300 is electrically connected to the substrate 100 through a wire bonding process.
S200, referring to fig. 5(c), fig. 7(a) and fig. 12(b), a partition glue wall 410 between the transmitting end photosensitive region 310 and the receiving end photosensitive region 320 is formed on the sensor chip 300.
S300, please refer to fig. 5(f), fig. 7(d) and fig. 12(f), a light blocking plastic case 500 covering the light emitting chip 200 and the sensing chip 300 is formed on the substrate 100 by a mold injection molding process.
The top of the partition glue wall 410 is connected to the light-blocking glue shell 500, and partitions the internal cavity of the light-blocking glue shell 500 into a first cavity 510 and a second cavity 520, the receiving-end photosensitive area 320 is located in the first cavity 510, the light-emitting chip 200 and the emitting-end photosensitive area 310 are located in the second cavity 520, and the light-blocking glue shell 500 further has a first light hole 530 communicated with the first cavity 510 and a second light hole 540 communicated with the second cavity 520.
The method for manufacturing a distance sensor in the second embodiment can obtain the distance sensor in the first embodiment, and accordingly, has the corresponding technical effects of the distance sensor in the first embodiment, which will not be described in detail herein.
In some embodiments, after step S300, the method for manufacturing the distance sensor further includes step S400, please refer to fig. 7(e) and fig. 12(g), in which the first filter 450 and the second filter 460 are respectively installed in the first light hole 530 and the second light hole 540.
In some embodiments, in step S100, please refer to fig. 5(a), a sunken groove is formed in the middle of the plate to obtain a bottom plate 110 and a flange 120 circumferentially disposed around the bottom plate 110, and a notch 121 is opened on the flange 120.
Before step S300, referring to fig. 5(d), two transparent adhesive blocks 430 filling the sunken groove are formed through the gap 121 by using a mold-pressing injection molding process, the two transparent adhesive blocks 430 are respectively located at two sides of the separating adhesive wall 410, and the transparent adhesive block 430 located in the gap 121 is removed, so as to enter the adhesive during the mold-pressing of the light-blocking adhesive case 500, thereby forming a closed structure and preventing light leakage.
The arrangement of the gap 121 facilitates the glue feeding during the molding of the transparent glue block 430 and the accurate positioning during the installation of the light blocking glue shell 500 and the glue feeding during the molding of the light blocking glue shell 500.
Specifically, in the step "forming two transparent plastic blocks 430 filling the sunken groove body through the notch 121 by using a die-pressing injection molding process", specifically, the shapes of the transparent plastic blocks 430 and the lens 440 are die-pressed in the first cavity. Therefore, the transparent rubber block 430 and the lens 440 in the first cavity are integrally formed, the installation process of the lens 440 is omitted, and the manufacturing cost is reduced.
In other embodiments, the substrate 100 is a flat plate without a sink-type trough.
Before the step S300, please refer to fig. 7(b), a transparent adhesive block 430 higher than the partition adhesive wall 410 is formed by a molding process, please refer to fig. 7(c), and the transparent adhesive block 430 above the partition adhesive wall 410 is removed, so as to form two transparent adhesive blocks 430 respectively located at two sides of the partition adhesive wall 410.
In step S300, referring to fig. 7(d), an opaque adhesive is injected above the substrate 100 by a molding process, so as to form a light blocking plastic shell 500 covering the light emitting chip 200 and the sensing chip 300, wherein the light blocking plastic shell 500 is connected to the top of the partition plastic wall 410.
In other embodiments, the substrate 100 is a flat plate without a sink-type tank, and the step S300 includes:
in step S310, referring to fig. 10(b), a light blocking plastic shell 500 having pores 560 is formed by an injection molding process. Wherein, the position of the aperture 560 corresponds to the position of the partition rubber wall 410.
In step S320, referring to fig. 10(f), the light blocking rubber case 500 is mounted on the substrate 100 and covers the light emitting chip 200 and the sensing chip 300.
In step S330, please refer to fig. 10(g) and 10(h), a light-tight adhesive is injected into the aperture 560 to form the partition wall 410.
Specifically, before step S320, the method further includes the following steps:
in step S340, please refer to fig. 10(c), the lens 440 is mounted at the bottom of the first light hole 530 of the light blocking plastic shell 500.
In step S350, referring to fig. 10(d), the light blocking rubber case 500 is turned over by 180 degrees, and the first optical filter 450 and the second optical filter 460 are respectively installed on the tops of the first optical hole 530 and the second optical hole 540.
Wherein, the sequence of step S340 and step S350 is not sequential.
EXAMPLE III
Referring to fig. 4, the present embodiment provides a distance sensor, which includes a substrate 100, a light emitting chip 200, a sensing chip 300, a partition wall 410 and a light blocking plastic case 500. Wherein the substrate 100 includes a base plate 110 and a flange 120. The flange 120 has a notch 121.
Specifically, the number of the notches 121 is plural, and the plurality of notches 121 are distributed at intervals.
Specifically, the distance sensor further includes a transparent paste block 430 between the light blocking paste case 500 and the substrate 100. The first cavity 510 is further provided with a lens 440, and the lens 440 and the transparent rubber block 430 are molded integrally.
Referring to fig. 5, the present embodiment further provides a method for manufacturing a distance sensor, including the following steps:
s31, referring to fig. 5(a), a substrate 100 is formed, the substrate 100 includes a bottom plate 110 and a flange 120 disposed around the circumference of the bottom plate 110, the flange 120 has a notch 121.
S32, referring to fig. 5(b), the light emitting chip 200 and the sensing chip 300 are mounted on the bottom plate 110 at intervals.
S33, please refer to fig. 5(c), a partition wall 410 is drawn on the sensing chip 300. The partition glue wall 410 is located between the emitting end photosensitive area 310 and the receiving end photosensitive area 320 and spans the sensing chip 300, two ends of the partition glue wall 410 are respectively abutted against the inner wall of the flange 120, and the top of the partition glue wall 410 is flush with the top end of the flange 120.
S34, referring to fig. 5(d), two transparent adhesive blocks 430 are formed above the bottom plate 110 through the gap 121 by a molding process, and the two transparent adhesive blocks 430 are respectively located at two sides of the partition adhesive wall 410. Meanwhile, a lens 440 is formed on the transparent glue block 430 of the receiving-end photosensitive region 320.
S35, please refer to fig. 5(e), the transparent glue block 430 in the gap 121 is removed.
S36, referring to fig. 5(f), a light blocking plastic shell 500 is formed on the transparent plastic block 430 through the gap 121 by a molding process to cover the light emitting chip 200 and the sensing chip 300. The top of the partition glue wall 410 is connected to the light-blocking glue shell 500, and partitions the internal cavity of the light-blocking glue shell 500 into a first cavity 510 and a second cavity 520, the receiving-end photosensitive area 320 is located in the first cavity 510, the light-emitting chip 200 and the emitting-end photosensitive area 310 are located in the second cavity 520, and the light-blocking glue shell 500 further has a first light hole 530 communicated with the first cavity 510 and a second light hole 540 communicated with the second cavity 520.
Example four
Referring to fig. 7, the present embodiment provides a method for manufacturing a distance sensor, including the following steps:
s41, the substrate 100 is provided, and the light emitting chip 200 and the sensing chip 300 are mounted on the substrate 100 with a space therebetween.
S42, please refer to fig. 7(a), a partition wall 410 is drawn on the sensing chip 300. The partition glue wall 410 is located between the transmitting end photosensitive area 310 and the receiving end photosensitive area 320, and spans across the sensing chip 300.
S43, please refer to fig. 7(b), the transparent plastic block 430 higher than the separating plastic wall 410 is formed by a molding process, please refer to fig. 7(c), and the transparent plastic block 430 above the separating plastic wall 410 is removed.
S44, referring to fig. 7(d), an opaque adhesive is injected above the substrate 100 by a molding process, so as to form a light blocking plastic shell 500 covering the light emitting chip 200 and the sensing chip 300.
Optionally, after step S44, the method further includes:
s45, please refer to fig. 7(e), the first filter 450 and the second filter 460 are respectively installed in the first light hole 530 and the second light hole 540 of the light blocking plastic shell 500.
Referring to fig. 10, the fourth embodiment further provides another method for manufacturing a distance sensor, including:
s51, referring to fig. 10(a), a substrate 100 is provided, and the light emitting chips 200 and the sensing chips 300 are mounted on the substrate 100 at intervals.
S52, please refer to fig. 10(b), a light blocking rubber case 500 with an aperture 560 is provided. The light blocking glue shell 500 further has a first chamber 510, a second chamber 520, a first light hole 530 communicated with the first chamber 510, and a second light hole 540 communicated with the second chamber 520. The aperture 560 is located between the first chamber 510 and the second chamber 520.
S53, please refer to fig. 10(c), the lens 440 is mounted at the bottom of the first light hole 530.
S54, please refer to fig. 10(d) and 10(e), the light blocking rubber case 500 is turned over, and the first optical filter 450 and the second optical filter 460 are respectively installed on the top of the first light hole 530 and the second light hole 540.
S55, please refer to fig. 10(f), the light blocking rubber case 500 is mounted on the substrate 100 and covers the light emitting chip 200 and the sensing chip 300. The receiving-end photosensitive region 320 is located in the first chamber 510, and the emitting-end photosensitive region 310 and the light emitting chip 200 are located in the second chamber 520.
S56, please refer to fig. 10(g), light blocking glue is injected into the aperture 560 to form the partition glue wall 410. Optionally, a light blocking glue is injected into the aperture 560 using a dispensing head 630.
Finally, a distance sensor shown in fig. 10(h) was produced by the above-described production method.
EXAMPLE five
Referring to fig. 12, the present embodiment provides a method for manufacturing a distance sensor, including:
s61, referring to fig. 12(a), a substrate 100 is provided, and the light emitting chips 200 and the sensing chips 300 are mounted on the substrate 100 at intervals.
S62, please refer to fig. 12(b), a partition wall 410 is drawn on the sensing chip 300. The partition glue wall 410 is located between the transmitting end photosensitive area 310 and the receiving end photosensitive area 320, and spans across the sensing chip 300.
S63, referring to fig. 12(c) - (e), a mold tool 610 with a hole cover 620 is used to mold two transparent plastic blocks 430 on the substrate 100, wherein the two transparent plastic blocks 430 are respectively located at two sides of the partition plastic wall 410. The transparent adhesive block 430 positioned above the light emitting chip 200 has a third light hole 431, and the transparent adhesive block 430 positioned at the receiving end photosensitive area 320 has an integrally formed lens 440.
S64, referring to fig. 12(f), an opaque adhesive is injected over the substrate 100 by a molding process to form a light blocking plastic shell 500 covering the light emitting chip 200 and the sensing chip 300.
S65, please refer to fig. 12(g), the first filter 450 and the second filter 460 are installed.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A distance sensor, comprising:
a substrate;
a light emitting chip mounted on the substrate;
the sensing chip is arranged on the substrate and has a gap with the light-emitting chip, and comprises an emitting end photosensitive area close to the light-emitting chip and a receiving end photosensitive area far away from the light-emitting chip;
the separation rubber wall is convexly arranged on the sensing chip and is positioned between the transmitting end photosensitive area and the receiving end photosensitive area; and
the light blocking rubber shell is mounted on the base plate, the top of the separating rubber wall is connected with the light blocking rubber shell, an inner cavity of the light blocking rubber shell is divided into a first cavity and a second cavity, the receiving end photosensitive area is located in the first cavity, the light emitting chip and the transmitting end photosensitive area are located in the second cavity, and the light blocking rubber shell is further provided with a first light hole communicated with the first cavity and a second light hole communicated with the second cavity.
2. The distance sensor of claim 1, wherein: the base plate comprises a bottom plate and a flange arranged around the circumference of the bottom plate, the flange is provided with a notch, and the light blocking rubber shell is provided with a convex block matched with the notch.
3. The distance sensor of claim 2, wherein: the partition rubber wall stretches across the sensing chip, two ends of the partition rubber wall are respectively abutted to the inner wall of the flange, and the top of the partition rubber wall is flush with the top end of the flange.
4. The distance sensor of claim 1, wherein: the distance sensor further comprises two transparent rubber blocks, and the two transparent rubber blocks are respectively filled in the first cavity and the second cavity.
5. The distance sensor of claim 4, wherein: the distance sensor further comprises a lens, the lens and the transparent rubber block positioned in the first cavity are integrally formed, and the lens is used for guiding incident light rays passing through the first light hole to be collected to the receiving end photosensitive area.
6. The distance sensor of claim 4, wherein: the transparent rubber block positioned in the second cavity is provided with a third light hole corresponding to the light-emitting chip in position.
7. The distance sensor of claim 4, wherein: the transparent rubber block is flush with the separating rubber wall;
or the transparent rubber blocks are higher than the separating rubber wall, a clamping groove is formed between the two transparent rubber blocks, and the light blocking rubber shell is provided with a separating wall which extends into the clamping groove and is attached to the separating rubber wall.
8. The distance sensor according to any one of claims 1 to 7, wherein: the light blocking rubber shell is a plastic shell or a mould pressing rubber shell.
9. A distance sensor is characterized by comprising a substrate, a light emitting chip, a sensing chip, a light blocking rubber shell and a separating rubber wall, the light-emitting chip and the sensing chip are arranged on the substrate at intervals, the sensing chip comprises an emitting end photosensitive area close to the light-emitting chip and a receiving end photosensitive area far away from the light-emitting chip, the light blocking rubber shell is arranged on the substrate, the top of the light blocking rubber shell is provided with a hole, one end of the separating rubber wall is connected with the inner side wall of the hole, the other end of the separating rubber wall is connected with the sensing chip and is positioned between the transmitting end photosensitive area and the receiving end photosensitive area, the separating rubber wall separates the inner cavity of the light blocking rubber shell into a first cavity and a second cavity, and the light blocking rubber shell is further provided with a first light hole communicated with the first cavity and a second light hole communicated with the second cavity.
10. A method of manufacturing a distance sensor, comprising:
providing a substrate, and mounting a light-emitting chip and a sensing chip on the substrate at intervals, wherein the sensing chip is provided with an emitting end photosensitive area and a receiving end photosensitive area;
forming a separation rubber wall between the transmitting end photosensitive area and the receiving end photosensitive area on the sensing chip;
forming a light blocking rubber shell covering the light emitting chip and the sensing chip on the substrate by using a mould pressing injection molding process; the top of the separating glue wall is connected with the light blocking glue shell, the inner cavity of the light blocking glue shell is divided into a first cavity and a second cavity, the receiving end photosensitive area is located in the first cavity, the light emitting chip and the emitting end photosensitive area are located in the second cavity, and the light blocking glue shell is further provided with a first light hole communicated with the first cavity and a second light hole communicated with the second cavity.
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| CN202110377451.7A CN113126108A (en) | 2021-04-08 | 2021-04-08 | Distance sensor and method for manufacturing same |
| TW110119422A TWI768934B (en) | 2021-04-08 | 2021-05-28 | Distance sensor and method of making the same |
| TW110206234U TWM617422U (en) | 2021-04-08 | 2021-05-28 | Distance sensor |
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