TWI782715B - Distance sensor package structure - Google Patents
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- 238000009434 installation Methods 0.000 claims description 14
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- 238000010586 diagram Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 8
- 238000004026 adhesive bonding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
- G01S17/10—Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
- G01S7/4813—Housing arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
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Abstract
本發明適用於距離感測器的技術領域,提供了一種距離感測器封裝結構,包括基板、晶片組件、透光組件和罩設於基板上的殼體;晶片組件包括間隔排布於基板上的發光晶片和感測晶片;透光組件包括間隔設置的透光件和透鏡模組;透光件與發光晶片對應設置,以供發光晶片發出的光穿過;透鏡模組與接收端感光區對應設置,以供所述發光晶片發出的光經檢測物體反射後的光線穿過並彙聚至感測晶片的接收端感光區;透鏡模組模壓成型於基板上且覆蓋所述感測晶片的接收端感光區。本發明提供的距離感測器封裝結構,簡化了距離感測器封裝製程,提高了生產效率、裝配精度及防水性能,進而降低了距離感測器的製造成本和產品不良率。 The present invention is applicable to the technical field of distance sensors, and provides a distance sensor packaging structure, including a substrate, a chip assembly, a light-transmitting assembly, and a housing covered on the substrate; The light-emitting chip and the sensing chip; the light-transmitting assembly includes a light-transmitting member and a lens module arranged at intervals; the light-transmitting member and the light-emitting chip are correspondingly arranged for the light emitted by the light-emitting chip to pass through; the lens module and the photosensitive area of the receiving end Corresponding settings are used for the light emitted by the light-emitting chip to pass through and converge to the receiving end photosensitive area of the sensing chip after being reflected by the detection object; the lens module is molded on the substrate and covers the receiving end of the sensing chip. photosensitive area. The packaging structure of the distance sensor provided by the present invention simplifies the packaging process of the distance sensor, improves production efficiency, assembly accuracy and waterproof performance, and further reduces the manufacturing cost and product defective rate of the distance sensor.
Description
本發明屬於距離感測器的技術領域,尤其涉及一種距離感測器封裝結構。 The invention belongs to the technical field of distance sensors, in particular to a package structure of distance sensors.
距離感測器是一種借助光束在發射面和接收面之間的往返飛行時間來測量物體距離的測距裝置,廣泛應用於手機攝像頭自動對焦、無人機駕駛、3D(three dimensions)建模等領域。未來將會在3D人臉識別、人臉支付等安全領域的應用越來越成熟。距離感測器一般包括基板、安裝於基板上的晶片組件、安裝於晶片組件上方的透光組件和殼體。其中,透光組件包括透鏡、濾光片等多個部件,一般通過膠接方式與殼體固定連接。其中,透鏡裝配必須精準,導致距離感測器的整個封裝製程複雜,製造成本高。同時,又由於距離感測器中各透光件分別通過膠接方式與殼體連接,使得其防水性能差,只能在室內使用。 The distance sensor is a distance measuring device that measures the distance of an object by means of the round-trip flight time of the light beam between the transmitting surface and the receiving surface. It is widely used in mobile phone camera autofocus, drone driving, 3D (three dimensions) modeling and other fields . In the future, the application in security fields such as 3D face recognition and face payment will become more and more mature. A distance sensor generally includes a substrate, a chip component mounted on the substrate, a light-transmitting component mounted above the chip component, and a housing. Wherein, the light-transmitting component includes a plurality of components such as a lens and a filter, and is generally fixedly connected to the casing by glue bonding. Among them, the assembly of the lens must be precise, which leads to the complexity of the entire packaging process of the distance sensor and the high manufacturing cost. At the same time, since the light-transmitting parts in the distance sensor are respectively connected to the casing by glue bonding, the waterproof performance thereof is poor, and it can only be used indoors.
本發明的目的在於提供一種距離感測器封裝結構,旨在解決習知技術中距離感測器的整個封裝製程複雜,製造成本高,且不防水的技術問題。 The object of the present invention is to provide a distance sensor packaging structure, aiming to solve the technical problems of the prior art that the entire packaging process of the distance sensor is complicated, the manufacturing cost is high, and it is not waterproof.
本發明是這樣實現的,一種距離感測器封裝結構,包括基板、晶片組件、透光組件和安裝於所述基板上的殼體;所述晶片組件包括間隔排布於所述基板上的發光晶片和感測晶片;所述透光組件包括間隔設置的透光件和透鏡模組;所述透光件與所述發光晶片對應設置,以供所述發光晶片發出的光穿過,所述透鏡模組與所述感測晶片的接收端感光區對應設置,以供所述發光晶片發出的光經檢測物體反射後的光線穿過並 彙聚至所述感測晶片的接收端感光區;所述透鏡模組模壓成型於所述基板上且覆蓋所述感測晶片的接收端感光區。 The present invention is achieved in this way, a distance sensor packaging structure, including a substrate, a chip assembly, a light-transmitting assembly, and a housing mounted on the substrate; chip and sensing chip; the light-transmitting assembly includes a light-transmitting member and a lens module arranged at intervals; the light-transmitting member is arranged correspondingly to the light-emitting chip for the light emitted by the light-emitting chip to pass through, the The lens module is set corresponding to the photosensitive area of the receiving end of the sensing chip, so that the light emitted by the light emitting chip and reflected by the detection object can pass through and converging to the photosensitive area of the receiving end of the sensing chip; the lens module is molded on the substrate and covers the photosensitive area of the receiving end of the sensing chip.
在其中一個實施例中,所述透鏡模組包括聚光部和環繞所述聚光部設置的支撐部,所述支撐部與所述聚光部為相同材料且一體成型的固接;所述距離感測器封裝結構還包括安裝於所述透鏡模組上的濾光組件,所述濾光組件可拆卸地連接於所述支撐部。 In one of the embodiments, the lens module includes a light concentrating part and a support part arranged around the light concentrating part, and the support part and the light concentrating part are made of the same material and fixed integrally; the The package structure of the distance sensor further includes a filter assembly installed on the lens module, and the filter assembly is detachably connected to the supporting part.
在其中一個實施例中,所述濾光組件包括具有貫穿孔的支架以及嵌裝於所述貫穿孔內的濾光片,所述濾光片位於所述聚光部的正上方,所述支架形成有第一插接部,所述支撐部形成有第二插接部,所述濾光組件通過所述第一插接部和所述第二插接部與所述透鏡模組插接配合。 In one of the embodiments, the filter assembly includes a bracket with a through hole and a filter embedded in the through hole, the filter is located directly above the light collecting part, and the bracket A first plug-in part is formed, and a second plug-in part is formed on the support part, and the filter assembly is plug-fitted with the lens module through the first plug-in part and the second plug-in part .
在其中一個實施例中,所述貫穿孔包括相互連通的第一孔體和第二孔體,其中,所述第二孔體位於所述第一孔體的下方,且所述第二孔體的孔徑小於所述第一孔體的孔徑,所述濾光片嵌裝於所述第一孔體內;或者,所述第二孔體位於所述第一孔體的下方,所述第二孔體的孔徑大於所述第一孔體的孔徑,所述濾光片嵌裝於所述第二孔體內;或者,所述第二孔體位於所述第一孔體的中部,且所述第二孔體的孔徑大於所述第一孔體的孔徑,所述濾光片嵌裝於所述第二孔體內。 In one of the embodiments, the through hole includes a first hole body and a second hole body connected to each other, wherein the second hole body is located below the first hole body, and the second hole body The aperture is smaller than the aperture of the first hole, and the filter is embedded in the first hole; or, the second hole is located below the first hole, and the second hole The aperture of the body is larger than the aperture of the first hole, and the filter is embedded in the second hole; or, the second hole is located in the middle of the first hole, and the first hole is The aperture of the two-hole body is larger than that of the first hole body, and the optical filter is embedded in the second hole body.
在其中一個實施例中,所述支架為塑膠架,所述濾光片注塑成型於所述貫穿孔內,所述濾光片的尺寸適配所述聚光部的尺寸。 In one embodiment, the bracket is a plastic frame, the filter is injection-molded in the through hole, and the size of the filter is adapted to the size of the light-collecting portion.
在其中一個實施例中,所述支撐部包括多個間隔設置的第一凸起部,多個所述第一凸起部圍繞所述聚光部設置,多個所述第一凸起部的上表面齊平且高於所述聚光部的頂面,所述第一凸起部的上表面接合所述濾光組件的支架。 In one of the embodiments, the support part includes a plurality of first protrusions arranged at intervals, and the plurality of first protrusions are arranged around the light collecting part, and the plurality of first protrusions are The upper surface is flush with and higher than the top surface of the light collecting part, and the upper surface of the first protrusion engages the bracket of the filter assembly.
在其中一個實施例中,所述支撐部的外沿(外緣)形成有多個第二凸起部,多個所述第二凸起部的上表面齊平且高於所述第一凸起部的上表面,多個所述第二凸起部圍成用於嵌裝所述濾光組件的安裝腔,所述第一凸起部位於所述安裝腔內。 In one of the embodiments, the outer edge (outer edge) of the support part is formed with a plurality of second protrusions, and the upper surfaces of the plurality of second protrusions are flush and higher than the first protrusions. On the upper surface of the raised portion, a plurality of the second raised portions enclose an installation cavity for inserting the filter assembly, and the first raised portion is located in the installed cavity.
在其中一個實施例中,所述支撐部包括封閉結構,所述封閉結構圍繞所述聚光部,所述第一插接部為凸出於所述支架的下表面的凸起結構,所述第二插接部為凹槽且位於所述封閉結構與多個所述第一凸起部之間。 In one of the embodiments, the support part includes a closed structure, the closed structure surrounds the light-collecting part, the first insertion part is a protruding structure protruding from the lower surface of the bracket, and the The second insertion part is a groove and is located between the closing structure and the plurality of first protrusions.
在其中一個實施例中,所述第一插接部為凸出於所述支架的下表面的凸起結構,所述第二插接部為凹槽且位於多個所述第一凸起部與所述聚光部之間。 In one of the embodiments, the first insertion part is a protruding structure protruding from the lower surface of the bracket, and the second insertion part is a groove and is located on a plurality of the first protrusions. and the concentrator.
在其中一個實施例中,所述殼體模壓成型於所述基板上且包覆所述支架、所述透光件和所述透鏡模組,所述殼體的底部與所述基板密封連接。 In one embodiment, the casing is molded on the substrate and covers the bracket, the light-transmitting member and the lens module, and the bottom of the casing is sealed and connected to the substrate.
本發明相對於習知技術的技術效果是:本發明實施例提供的距離感測器封裝結構,將透鏡模組的安裝方式,由膠接於殼體上改為了模壓成型於基板上,從而有效減少了部分或全部透光組件的滴膠(點膠)固定裝配工序,使得距離感測器封裝結構的製程變的簡單、易操作,提高了生產效率及透光組件的裝配精度,進而降低了距離感測器的製造成本和產品不良率。又由於透鏡模組模壓成型,可與基板緊密接觸或連接,從而將相應晶片包覆其中,進而大大提高了相應部件及距離感測器整體的防水性能,使得距離感測器即可在室內使用又可在戶外使用,有效提高了產品效益。 The technical effect of the present invention relative to the prior art is: the distance sensor packaging structure provided by the embodiment of the present invention changes the installation method of the lens module from glued on the housing to molded on the substrate, thereby effectively Reduce the glue dropping (dispensing) fixed assembly process of part or all of the light-transmitting components, making the process of the distance sensor packaging structure simple and easy to operate, improving production efficiency and assembly accuracy of the light-transmitting components, and reducing the cost of The manufacturing cost and product defect rate of the distance sensor. And because the lens module is molded, it can be in close contact with or connected to the substrate, thereby covering the corresponding chip, which greatly improves the waterproof performance of the corresponding components and the distance sensor as a whole, so that the distance sensor can be used indoors It can also be used outdoors, which effectively improves product benefits.
100:基板 100: Substrate
200:晶片組件 200: chip assembly
210:發光晶片 210: Light emitting chip
220:感測晶片 220: sensing chip
300:透光組件 300: Light-transmitting components
310:透光件 310: Light-transmitting parts
321:透鏡模組 321: Lens module
3211:聚光部 3211: Concentrating Department
3212:封閉結構 3212: closed structure
3213:第二插接部 3213: The second socket
3214:第一凸起部 3214: the first raised part
3215:第二凸起部 3215: second raised part
322:濾光組件 322: Filter component
3221:第一插接部 3221: The first socket
3222:支架 3222: Bracket
3223:濾光片 3223: filter
3224:貫穿孔 3224: through hole
330:密封膠 330: sealant
400:殼體 400: Shell
為了更清楚地說明本發明實施例的技術方案,下面將對本發明實施例或習知技術描述中所需要使用的附圖作簡單地介紹,顯而易見地, 下面所描述的附圖僅僅是本發明的一些實施例,對於本領域中具有通常知識者來講,在不付出進步性的改變的前提下,還可以根據這些附圖獲得其他的附圖。 In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings that need to be used in the embodiments of the present invention or the description of conventional technologies. Obviously, The drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained according to these drawings without making progressive changes.
圖1是本發明一實施例提供的距離感測器封裝結構的爆炸結構示意圖;圖2是圖1中透鏡模組的結構示意圖;圖3是本發明另一實施例提供的距離感測器封裝結構的爆炸結構示意圖;圖4是圖3所示距離感測器封裝結構的剖面結構示意圖;圖5是圖4中透光組件的安裝結構示意圖;圖6是圖4中透鏡模組和濾光組件的連接結構示意圖;圖7是圖3中透鏡模組的結構示意圖;圖8是本發明另一實施例提供的距離感測器封裝結構的爆炸結構示意圖;圖9是圖8中透鏡模組的結構示意圖;圖10是圖8中濾光組件的結構示意圖;圖11是本發明另一實施例提供的距離感測器封裝結構的爆炸結構示意圖;圖12是圖11所示距離感測器封裝結構的剖面結構示意圖;圖13是圖12中透光組件的安裝結構示意圖;圖14是圖11中透鏡模組和濾光組件的連接結構示意圖;圖15是圖11中透鏡模組的結構示意圖;圖16是本發明一實施例所採用的濾光組件的剖面結構示意圖;圖17是本發明另一實施例所採用的濾光組件的剖面結構示意圖;以及圖18是本發明另一實施例所採用的濾光組件的剖面結構示意圖。 Fig. 1 is a schematic diagram of an exploded structure of a distance sensor package structure provided by an embodiment of the present invention; Fig. 2 is a schematic structural diagram of a lens module in Fig. 1; Fig. 3 is a schematic diagram of a distance sensor package provided by another embodiment of the present invention Figure 4 is a schematic diagram of the cross-sectional structure of the distance sensor package structure shown in Figure 3; Figure 5 is a schematic diagram of the installation structure of the light-transmitting component in Figure 4; Figure 6 is a lens module and filter in Figure 4 A schematic diagram of the connection structure of the components; FIG. 7 is a schematic structural diagram of the lens module in FIG. 3; FIG. 8 is a schematic diagram of the exploded structure of the distance sensor package structure provided by another embodiment of the present invention; FIG. 9 is a schematic diagram of the lens module in FIG. 8 Fig. 10 is a schematic structural diagram of the filter assembly in Fig. 8; Fig. 11 is a schematic diagram of an exploded structure of a distance sensor packaging structure provided by another embodiment of the present invention; Fig. 12 is a schematic diagram of the distance sensor shown in Fig. 11 13 is a schematic diagram of the installation structure of the light-transmitting component in FIG. 12; FIG. 14 is a schematic diagram of the connection structure of the lens module and the filter component in FIG. 11; FIG. 15 is the structure of the lens module in FIG. 11 Schematic diagram; FIG. 16 is a schematic cross-sectional structure diagram of an optical filter assembly used in one embodiment of the present invention; FIG. 17 is a schematic cross-sectional structural diagram of an optical filter assembly used in another embodiment of the present invention; and FIG. 18 is another implementation of the present invention Schematic diagram of the cross-sectional structure of the filter assembly used in the example.
下面詳細描述本發明的實施例,所述實施例的示例在附圖中示出,其中自始至終相同或類似的標號表示相同或類似的元件或具有相同 或類似功能的元件。下面通過參考附圖描述的實施例是示例性的,旨在用於解釋本發明,而不能理解為對本發明的限制。 Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or have the same or similar functional components. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
在本發明的描述中,需要理解的是,術語“長度”、“寬度”、“上”、“下”、“前”、“後”、“左”、“右”、“垂直”、“水平”、“頂”、“底”“內”、“外”等指示的方位或位置關係為基於附圖所示的方位或位置關係,僅是為了便於描述本發明和簡化描述,而不是指示或暗示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作,因此不能理解為對本發明的限制。 In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", " The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating Or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the invention.
此外,術語“第一”、“第二”僅用於描述目的,而不能理解為指示或暗示相對重要性或者隱含指明所指示的技術特徵的數量。由此,限定有“第一”、“第二”的特徵可以明示或者隱含地包括一個或者更多個該特徵。在本發明的描述中,“多個”的含義是兩個或兩個以上,除非另有明確具體的限定。 In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.
在本發明中,除非另有明確的規定和限定,術語“安裝”、“相連”、“連接”、“固定”等術語應做廣義理解,例如,可以是固定連接,也可以是可拆卸連接,或成一體;可以是機械連接,也可以是電連接;可以是直接相連,也可以通過中間媒介間接相連,可以是兩個元件內部的連通或兩個元件的相互作用關係。對於本領域的具有通常知識者而言,可以根據具體情況理解上述術語在本發明中的具體含義。 In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those with ordinary knowledge in the art can understand the specific meanings of the above terms in the present invention according to specific situations.
為了使本發明的目的、技術方案及優點更加清楚明白,以下結合附圖及實施例,對本發明進行進一步詳細說明。 In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
本發明實施例提供了一種距離感測器封裝結構。為便於理解圖1、圖3、圖8及圖11給出了四種較佳的實施例以說明本發明提供的距離感測器封裝結構。距離感測器封裝結構包括基板100、晶片組件200、透光組件300和安裝於基板100上的殼體400,晶片組件200包括間隔排布於基板100上的發光晶片210和感測晶片220。具體的,發光晶片210和感測
晶片220一般沿基板100的長度方向間隔排布於基板100上。發光晶片210一般為鐳射晶片。感測晶片220具有靠近發光晶片210的發射端感光區和遠離發光晶片210的接收端感光區。
An embodiment of the present invention provides a package structure of a distance sensor. To facilitate understanding, FIG. 1 , FIG. 3 , FIG. 8 and FIG. 11 give four preferred embodiments to illustrate the package structure of the distance sensor provided by the present invention. The package structure of the distance sensor includes a
透光組件300包括間隔設置的透光件310和透鏡模組321。透光件310與發光晶片210對應設置,以供發光晶片210發出的光穿過。透鏡模組321與感測晶片220的接收端感光區對應設置,以供發光晶片210發出的光經檢測物體反射後的光線穿過並彙聚至感測晶片220的接收端感光區。
The light-transmitting
透鏡模組321模壓成型於基板100上且覆蓋感測晶片220的接收端感光區,以增強感測晶片220的接收端感光區的防水性能。在一些實施例中,透鏡模組321模壓成型於基板100上時,可與基板100熔接或膠接於一體,從而將感測晶片220的接收端感光區密封包覆其中。
The
本發明實施例提供的距離感測器封裝結構,將透鏡模組321的安裝方式,由傳統膠接於殼體400上改為了模壓成型於基板100上,從而有效減少了部分或全部透光組件300的滴膠(點膠)固定裝配工序,使得距離感測器封裝結構的製程變的簡單、易操作,提高了生產效率及透光組件300的裝配精度,進而降低了距離感測器封裝結構的製造成本和產品不良率。又由於透鏡模組321模壓成型,可與基板100緊密接觸或連接,從而將相應晶片包覆其中,進而大大提高了相應部件及距離感測器整體的防水性能,使得距離感測器即可在室內使用又可在戶外使用,有效提高了產品效益。如圖1至圖15所示,在一個具體的實施例中,透鏡模組321包括聚光部3211和環繞於聚光部3211設置的支撐部。支撐部與聚光部3211為相同材料且一體成型的固接。距離感測器封裝結構還包括安裝於透鏡模組321上的濾光組件322,濾光組件322可拆卸地連接於支撐部。具體的,濾光組件322可以搭放在支撐部上,也可通過膠接、插接、卡接、套接等方式中的一種或多種方式可拆卸地連接於支撐部上,如圖1所示,
濾光組件322放置到支撐部上後,通過密封膠330與透鏡模組321密封連接。
In the distance sensor packaging structure provided by the embodiment of the present invention, the installation method of the
本實施例提供了一種新的透鏡模組結構,同時改變了濾光組件322的安裝方式。採用本實施例提供的距離感測器封裝結構,組裝距離感測器時,可先將透鏡模組321和濾光組件322組合成一個組合件,再將該組合件安裝於殼體400上,並將殼體400罩設於基板100上,進一步簡化了距離感測器的生產工序,提高了組裝效率,降低了製造成本,便於推廣。
This embodiment provides a new lens module structure, while changing the installation method of the
目前市場上現有的距離感測器,一般採用一個濾光片作為濾光組件322,採用這一結構接收端的濾光片面積比所需的有效接收面積大很多,除了經檢測物體反射回來的光線外還有其他的雜光投射進來,對產品的精確度造成影響。為改善這一現象,如圖3、圖6、圖10、圖11及圖14所示,在一個具體的實施例中,濾光組件322包括具有貫穿孔3224的支架3222以及嵌裝於貫穿孔3224內的濾光片3223。其中,濾光片3223位於聚光部3211的正上方。濾光組件322採用本實施例提供的結構可有效減少距離感測器接收端的濾光片3223的面積,進而降低檢測物體反射回來的光以外的其他雜光進入接收端的概率,以提高距離感測器的測量精確度。
At present, the existing distance sensors on the market generally use a filter as the
如圖4至圖6、圖12至圖14所示,支架3222形成有第一插接部3221,支撐部形成有第二插接部3213,濾光組件322通過第一插接部3221和第二插接部3213與透鏡模組321插接配合。
As shown in Figures 4 to 6 and Figures 12 to 14, the
具體的,第一插接部3221可以為沿支架3222的長度方向、寬度方向或者厚度方向而向外延伸的凸起部,還可為沿上述任一或多個方向向內凹陷的凹陷部。第二插接部3213則可為與第一插接部3221插接配合的相應結構,如當第一插接部3221為沿長度方向或寬度方向而向外延伸的凸起部時,第二插接部3213則為開設於支撐部的相應方位上的開口朝
上的凹槽或盲孔,以供凸起部插入;當第一插接部3221為沿厚度方向而向下延伸的凸起部時,第二插接部3213則為開設於支撐部頂部的開口朝上的凹槽或盲孔,以供凸起部插入;當第一插接部3221為沿長度方向或寬度方向而向內凹陷的凹陷時,第二插接部3213則為形成於支撐部的相應側壁上的凸起結構。具體實現方式眾多,這裡不再一一列舉。濾光組件322和透鏡模組321借助第一插接部3221和第二插接部3213插接配合,操作簡便,且連接後兩者關係不易發生變動,確保了兩者連接後相對位置的穩定性,保證了距離感測器的使用性能的穩定性。
Specifically, the first inserting
為確保距離感測器封裝結構的穩定性,上述第一插接部3221可一體成型於濾光組件322上,第二插接部3213可一體成型於透鏡模組321上。
In order to ensure the stability of the package structure of the distance sensor, the above-mentioned
為確保濾光片3223與支架3222連接關係的穩定性,請參照圖16至圖18,在一個具體的實施例中,貫穿孔3224包括相互連通的第一孔體和第二孔體。上述第一孔體和第二孔體主要有三種連接關係:第一種,如圖16所示,第二孔體位於第一孔體的下方,且第二孔體的孔徑小於第一孔體的孔徑,濾光片3223嵌裝於第一孔體內;第二種,如圖17所示,第二孔體位於第一孔體的下方,第二孔體的孔徑大於第一孔體的孔徑,濾光片3223嵌裝於第二孔體內;第三種,如圖18所示,第二孔體位於第一孔體的中部,且第二孔體的孔徑大於第一孔體的孔徑,濾光片3223嵌裝於第二孔體內。
In order to ensure the stability of the connection relationship between the
如此,第一孔體和第二孔體無論採用上述哪種連接關係,均可保證貫穿孔3224內具有至少一個平行於濾光片3223的板面的連接面,相較濾光片3223的側壁與貫穿孔3224的孔壁連接,兩者的接觸面積大大增加,進而保證了兩者連接關係的穩定性。
In this way, no matter which connection relationship the first hole body and the second hole body adopt, it can ensure that there is at least one connection surface parallel to the plate surface of the
為進一步提高濾光片3223與支架3222連接關係的穩定性,同時進一步減少距離感測器封裝結構的生產工序,在一個可選的實施例中,
支架3222為塑膠架,濾光片3223注塑成型於貫穿孔3224內。濾光片3223的尺寸適配聚光部3211的尺寸。其中,支架3222由塑膠製成,製造成本低廉,且加工方便。濾光片3223注塑成型於貫穿孔3224,加工方式簡單,且防水效果好。將濾光片3223作為塑膠支架的鑲件進行注塑成型,採用這種製造製程能在最大限度減小濾光片3223面積的情況下又能密封防水。
In order to further improve the stability of the connection relationship between the
上述支撐部可以採用一體成型結構,也可採用分體結構。現舉例說明,如圖15所示,在一個可選的實施例中,支撐部包括多個間隔設置的第一凸起部3214。多個第一凸起部3214圍繞聚光部3211設置,多個第一凸起部3214的上表面齊平且高於聚光部3211的頂面,第一凸起部3214的上表面接合濾光組件322的支架3222。支撐部採用這一結構,可減少所需材料數量,降低成本。
The above-mentioned supporting part may adopt an integrally formed structure, or may adopt a split structure. For example, as shown in FIG. 15 , in an optional embodiment, the support portion includes a plurality of
如圖2、圖7及圖9所示,在一個可選的實施例中,支撐部包括封閉結構3212。該封閉結構3212圍繞聚光部3211,第一插接部3221為凸出於支架3222的下表面的凸起結構,第二插接部3213為凹槽且位於封閉結構3212與多個第一凸起部3214之間。具體的,上述封閉結構3212可以為凸出於聚光部3211的頂面的環形結構,也可以為凸出於聚光部3211的頂面的其他形狀的封閉結構3212,具體根據濾光組件322的形狀進行設定,這裡不做唯一限定。凸起結構可為凸出於支架3222的下表面的凸塊、環形結構、矩形結構等,第二插接部3213則為與第一插接部3221相適配的相應結構。第一插接部3221和第二插接部3213採用本實施例提供的結構,拆裝方便。支撐部採用上述封閉結構3212,加工方式簡單,且結構穩定。
As shown in FIG. 2 , FIG. 7 and FIG. 9 , in an optional embodiment, the support part includes a
如圖7及圖9所示,在另一個可選的實施例中,支撐部既包括封閉結構3212,也包括第一凸起部3214,以實現濾光組件322的穩定支撐。
As shown in FIG. 7 and FIG. 9 , in another optional embodiment, the supporting part includes both the
如圖2、圖7、圖9及圖15所示,支撐部的外沿(外緣)形成有多個第二凸起部3215,多個第二凸起部3215的上表面齊平且高於第一凸起部3214的上表面,多個第二凸起部3215圍成用於嵌裝濾光組件322的安裝腔,進而使得濾光組件322安裝於透鏡模組321上時可嵌裝於安裝腔內,以避免濾光組件322安裝後與透鏡模組321發生相對移動。其中,第一凸起部3214位於上述安裝腔內。具體的,第二凸起部3215與支撐部一體成形地連接,也可為分開設置,具體可根據使用需要設定,這裡不做唯一限定。當第二凸起部3215與支撐部的第一凸起部3214連接時,由於第一凸起部3214低於第二凸起部3215,兩者連接可形成臺階結構,該臺階結構圍成的凹槽可為第二插接部3213,也可單獨設置第二插接部3213。
As shown in Fig. 2, Fig. 7, Fig. 9 and Fig. 15, a plurality of
更為具體的,第二凸起部3215的結構、支撐部的結構,以及第二凸起部3215與支撐部的連接方式有多種形式。如圖2所示,多個第二凸起部3215和支撐部的多個第一凸起部3214均構成封閉式結構且形狀與濾光組件322相適配,且支撐部的第一凸起部3214位於第二凸起部3215的內側且與第二凸起部3215連接形成臺階結構,濾光組件322嵌裝於第二凸起部3215所圍空腔內,並被支撐部的第一凸起部3214支撐。如圖7及圖9所示,多個第二凸起部3215為多個間隔設置且一體成型於透鏡模組321的主體上的凸塊,支撐部既包括封閉結構3212,又包括多個第一凸起部3214,封閉結構3212位於多個第一凸起部3214圍成的空腔內,多個第二凸起部3215圍成具有一個缺口的安裝腔,以供濾光組件322的一端伸入。如圖15所示,多個第二凸起部3215為多個間隔設置且一體成型於透鏡模組321主體上的凸塊,支撐部僅包括多個第一凸起部3214,且多個第一凸起部3214的數量大於多個第二凸起部3215的數量,第二凸起部3215圍成具有一個缺口的安裝腔,以供濾光組件322的一端伸入。當
然,在其他實施例中,第二凸起部3215的結構、支撐部的結構,以及第二凸起部3215與支撐部的連接方式還可以採用其他形狀。
More specifically, the structure of the second protruding
在一個具體的實施例中,第一插接部3221為凸出於支架3222的下表面的凸起結構,第二插接部3213為凹槽且位於多個第一凸起部3214與聚光部3211之間。具體的,凸起結構可為凸出於支架3222的下表面的凸塊、環形結構、矩形結構等,第二插接部3213則為與第一插接部3221相適配的相應結構。第一插接部3221和第二插接部3213採用本實施例提供的結構,拆裝方便。
In a specific embodiment, the
普通的距離感測器中的殼體400,其一般通過膠接方式連接於基板100上,防水效果差。為改善這一現象,在一個可選的實施例中,殼體400模壓成型於基板100上且包覆支架3222、透光件310和透鏡模組321,同時殼體400的底部與基板100密封連接。如此,殼體400成型後不僅可以與基板100緊密連接,還可對透鏡模組321和支架3222之間的縫隙進行填補,以進一步提高距離感測器的防水性能。
The
經測試,距離感測器封裝結構若採用透光件310、透鏡模組321和殼體400分別模壓成型製程,其防水等級可達IP66。之所以會產生如此優越的防水效果,是因為該距離感測器封裝結構形成了兩重防水結構。第一重防水結構為:透光組件300模壓成型,將晶片組件200等電子元件包裹於其中,鑄成第一道防水結構;第二重防水結構為:殼體400模壓成型,包覆支架3222、透光件310和透鏡模組321,鑄成第二道防水結構。兩重防水結構相互配合,保證了產品的品質。
After testing, if the packaging structure of the distance sensor adopts the molding process of the light-transmitting
以上所述僅為本發明的較佳實施例而已,僅具體描述了本發明的技術原理,這些描述只是為了解釋本發明的原理,不能以任何方式解釋為對本發明保護範圍的限制。基於此處解釋,凡在本發明的精神和原則之內所作的任何修改、等同替換和改進,及本領域的具有通常知識者不 需要付出具進步性的改變即可聯想到本發明的其他具體實施方式,均應包含在本發明的保護範圍之內。 The above descriptions are only preferred embodiments of the present invention, and only specifically describe the technical principle of the present invention. These descriptions are only for explaining the principle of the present invention, and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations herein, any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention, and those with ordinary knowledge in the art will not Other specific implementations of the present invention can be conceived if progressive changes are required, and should be included within the protection scope of the present invention.
100:基板 100: Substrate
200:晶片組件 200: chip assembly
210:發光晶片 210: Light emitting chip
220:感測晶片 220: sensing chip
300:透光組件 300: Light-transmitting components
310:透光件 310: Light-transmitting parts
321:透鏡模組 321: Lens module
322:濾光組件 322: Filter component
330:密封膠 330: sealant
400:殼體 400: shell
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