CN108183992B

CN108183992B - Electronic device

Info

Publication number: CN108183992B
Application number: CN201711435462.6A
Authority: CN
Inventors: 吴安平
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-12-26
Filing date: 2017-12-26
Publication date: 2021-04-09
Anticipated expiration: 2037-12-26
Also published as: CN108183992A

Abstract

The electronic device comprises a shell, an output module, a vibration module, a piezoelectric element, an imaging module and a receiving module. The output module comprises a packaging shell, an infrared light supplement lamp and a proximity infrared lamp. The packaging shell comprises a packaging substrate, and the infrared light supplement lamp and the near infrared lamp are packaged in the packaging shell and are borne on the packaging substrate. The piezoelectric element is coupled to the vibration module and spaced apart from the output module. The piezoelectric element is used for generating deformation when an electric signal is applied to enable the vibration module to vibrate. The imaging module comprises a lens base, a lens cone and a substrate. The receiving module is arranged on the substrate and comprises a proximity sensor and/or a light sensor. The output module has higher integration level and smaller volume; the receiving module is arranged on the substrate, and a fixing structure is not required to be additionally arranged to fix the receiving module, so that the installation space in the electronic device is saved; the electronic device adopts the piezoelectric element and the vibration module to realize bone conduction and sound transmission, and effectively ensures the privacy of conversation contents.

Description

Electronic device

Technical Field

The present invention relates to the field of consumer electronics, and more particularly, to an electronic device.

Background

Along with the functions supported by the mobile phone are more and more abundant and various, the types and the number of functional devices required to be set by the mobile phone are more and more, in order to realize the functions of distance detection, ambient light detection, facial 3D feature recognition of a user and the like, functional devices such as a proximity sensor, an ambient light sensor, an infrared camera, a structured light projector and the like need to be configured in the electronic equipment, and in order to arrange numerous functional devices, the mobile phone occupies too much space.

Disclosure of Invention

The embodiment of the invention provides an electronic device.

An electronic device according to an embodiment of the present invention includes:

a housing;

the output module is arranged in the shell and comprises a packaging shell, an infrared light supplementing lamp and a near infrared lamp, the packaging shell comprises a packaging substrate, the infrared light supplementing lamp and the near infrared lamp are packaged in the packaging shell and are borne on the packaging substrate, and the infrared light supplementing lamp and the near infrared lamp can emit infrared light rays to the outside of the packaging shell at different powers;

the vibration module is arranged on the shell;

a piezoelectric element coupled to the vibration module and spaced apart from the output module, the piezoelectric element being configured to deform when an electrical signal is applied thereto to vibrate the vibration module;

the imaging module is arranged in the shell and comprises a lens base, a lens barrel arranged on the lens base and a substrate partially arranged in the lens base; and

the receiving module is arranged on the substrate and comprises a proximity sensor and/or a light sensor.

In some embodiments, the vibration module includes a display screen and a transparent cover plate, the display screen is disposed on the housing and forms an accommodating cavity together with the housing, the cover plate is disposed on the housing and located on a side of the display screen away from the accommodating cavity, the display screen is combined with the cover plate, the housing is provided with a housing approaching through hole, a housing light supplement through hole and a housing vibration through hole which are spaced from each other, the approaching infrared lamp corresponds to the housing approaching through hole, the infrared light supplement lamp corresponds to the housing light supplement through hole, and the piezoelectric element is accommodated in the housing vibration through hole and combined with the cover plate.

In some embodiments, the piezoelectric element and the display screen are attached to the cover plate by a joint.

In some embodiments, the output module further includes a chip, and the infrared fill-in light and the near infrared light are formed on one chip.

In some embodiments, the package housing further includes a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, a light supplement window and an access window are formed at the package top, the light supplement window corresponds to the infrared light supplement lamp, and the access window corresponds to the infrared light approaching lamp.

In some embodiments, the output module further includes a light supplement lamp lens, and the light supplement lamp lens is disposed in the package housing and corresponds to the infrared light supplement lamp; and/or the output module further comprises a proximity lamp lens, and the proximity lamp lens is arranged in the packaging shell and corresponds to the proximity infrared lamp.

In some embodiments, the output module further comprises a light supplement lamp lens and a proximity lamp lens, the light supplement lamp lens and the proximity lamp lens are arranged in the packaging shell, the light supplement lamp lens corresponds to the infrared light supplement lamp, the proximity lamp lens corresponds to the proximity infrared lamp, and the light supplement lamp lens and the proximity lamp lens are located on the same transparent base body.

In some embodiments, the output module further includes a metal shielding plate, and the metal shielding plate is located in the package housing and located between the infrared fill light and the near infrared light.

In some embodiments, the output module further includes an optical enclosure made of a light-transmissive material, the optical enclosure is formed on the package substrate and located in the package housing, and the optical enclosure encloses the infrared fill light and the proximity infrared light.

In some embodiments, the output module further comprises a light-emitting partition plate, wherein the light-emitting partition plate is formed in the optical enclosure and is located between the infrared light supplement lamp and the near infrared lamp.

In some embodiments, a ground pin, a fill-in light pin, and a proximity light pin are formed on the output module, and when the ground pin and the fill-in light pin are enabled, the infrared fill-in light emits infrared light; the proximity infrared lamp emits infrared light when the ground pin and the proximity lamp pin are enabled.

In some embodiments, an infrared transparent ink which only transmits infrared light is formed on a surface of the cover plate, which is combined with the casing, and the infrared transparent ink blocks at least one of the casing access through hole, the casing light supplement through hole and the casing vibration through hole.

In some embodiments, the imaging module comprises at least one of a visible light camera and an infrared light camera.

In some embodiments, the imaging module includes an infrared camera and a visible light camera, the electronic device further includes a structured light projector, centers of the output module, the infrared camera, the visible light camera, the piezoelectric element, and the structured light projector are located on a same line segment, and the following are sequentially performed from one end to the other end of the line segment:

the output module, the structured light projector, the piezoelectric element, the infrared camera and the visible light camera; or

The output module, the infrared camera, the piezoelectric element, the visible light camera and the structured light projector; or

The infrared camera, the output module, the piezoelectric element, the visible light camera and the structured light projector; or

The infrared camera, the visible light camera, the piezoelectric element, the output module and the structured light projector.

In some embodiments, the imaging module includes an infrared camera and a visible light camera, the electronic device further includes a structured light projector, centers of the output module, the infrared camera, the visible light camera, and the structured light projector are located on a same line segment, and the piezoelectric element is located between the line segment and the top of the housing.

In some embodiments, the imaging module includes an infrared camera and a visible light camera, the electronic device further includes a structured light projector, the number of the piezoelectric elements is multiple, the number of the casing vibration through holes is multiple, the multiple piezoelectric elements correspond to the multiple casing vibration through holes, each piezoelectric element is accommodated in the corresponding casing vibration through hole, centers of the output module, the infrared camera, the visible light camera, the multiple piezoelectric elements and the structured light projector are located on the same line segment, and at least one of the output module, the infrared camera, the visible light camera and the structured light projector is disposed between two adjacent piezoelectric elements.

In some embodiments, the imaging module includes an infrared camera and a visible light camera, the electronic device further includes a structured light projector, the piezoelectric element includes a piezoelectric body and a plurality of piezoelectric bumps extending from the piezoelectric body, the number of the casing vibration through holes is multiple, the plurality of piezoelectric bumps correspond to the plurality of casing vibration through holes, each of the piezoelectric bumps is partially received in the corresponding casing vibration through hole and is combined with the cover plate, the output module, the infrared camera, the visible light camera, and the structured light projector are located between the cover plate and the piezoelectric body, the centers of the output module, the infrared camera, the visible light camera, the plurality of piezoelectric bumps, and the structured light projector are located on the same line segment, and the output module, the visible light camera, the plurality of piezoelectric bumps, and the structured light projector are located between two adjacent piezoelectric bumps, At least one of the infrared camera, the visible light camera, and the structured light projector.

In the electronic device of the embodiment of the invention, the output module integrates the infrared light supplement lamp and the near infrared lamp into a single packaging body structure, and integrates the functions of transmitting infrared light for infrared distance measurement and infrared light supplement, so that the output module has higher integration level and smaller volume, and saves the space for realizing the functions of infrared light supplement and infrared distance measurement. In addition, because the infrared light supplement lamp and the near infrared lamp are borne on the same packaging substrate, compared with the infrared light supplement lamp and the near infrared lamp in the traditional process, the infrared light supplement lamp and the near infrared lamp need to be manufactured by different wafers respectively and then are combined on a PCB substrate for packaging, and the packaging efficiency is improved. Furthermore, the electronic device adopts the piezoelectric element and the vibration module to realize bone conduction sound transmission, replaces the traditional telephone receiver structure which is used for transmitting sound through air, effectively ensures the privacy of conversation content on the one hand, and on the other hand, because the original telephone receiver is cancelled, the through hole which corresponds to the telephone receiver is avoided being arranged on the cover plate, the process is simpler, and the appearance is more attractive. Finally, the receiving module is arranged on the substrate, so that an additional fixing structure is not needed to fix the receiving module, and the installation space in the electronic device is saved.

Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

fig. 2 is a schematic perspective view of an output module of an electronic device according to an embodiment of the invention;

FIG. 3 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the invention;

FIG. 4 is a schematic perspective view of an output module of an electronic device according to an embodiment of the invention;

FIG. 5 is a schematic cross-sectional view of the electronic device of FIG. 1 taken along line V-V;

FIG. 6 is a schematic partial cross-sectional view of the electronic device of FIG. 1 taken along line VI-VI;

fig. 7 is a schematic perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the invention;

fig. 8 is a schematic arrangement of electronic components of an electronic device according to an embodiment of the invention;

FIG. 9 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

fig. 10 to 11 are schematic arrangement diagrams of electronic components of the electronic device according to the embodiment of the present invention;

FIG. 12 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

FIG. 13 is a schematic partial cross-sectional view of the electronic device of FIG. 12 taken along line XIII-XIII;

FIG. 14 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the invention;

fig. 15 is a schematic perspective view of a receiving module and an imaging module according to an embodiment of the invention;

fig. 16 to 17 are schematic partial cross-sectional views of the electronic device according to the embodiment of the present invention taken along positions corresponding to XVI-XVI in fig. 1;

fig. 18 to 26 are schematic perspective views of a receiving module and an imaging module of an electronic device according to an embodiment of the invention.

Detailed Description

The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout. In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, an electronic device 100 according to an embodiment of the invention includes a housing 20, a cover 30, and electronic components. The electronic component includes an output module 10, a vibration module 30a (see fig. 5), a piezoelectric element 70, a receiving module 50 (see fig. 7), an imaging module 60 (see fig. 7), and a structured light projector 80. The electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, an intelligent watch, an intelligent bracelet, a teller machine, and the like, and the embodiment of the invention is described by taking the electronic device 100 as a mobile phone, it is understood that the specific form of the electronic device 100 may be other, and is not limited herein.

Referring to fig. 2 and 3, the output module 10 is a single package structure, and includes a package housing 11, an infrared fill-in lamp 12, and a proximity infrared lamp 13.

The packaging shell 11 is used for packaging the infrared light supplement lamp 12 and the proximity infrared lamp 13 at the same time, or the infrared light supplement lamp 12 and the proximity infrared lamp 13 are packaged in the packaging shell 11 at the same time. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an Electromagnetic Interference (EMI) shielding material to prevent external EMI from affecting the output module 10.

The package substrate 111 is used for carrying the infrared fill light 12 and the proximity infrared light 13. When the output module 10 is manufactured, the infrared fill-in light 12 and the proximity infrared light 13 may be formed on one chip 14, and then the infrared fill-in light 12, the proximity infrared light 13, and the chip 14 are disposed on the package substrate 111 together, specifically, the chip 14 may be bonded on the package substrate 111. Meanwhile, the package substrate 111 may also be used to connect with other components of the electronic device 100 (e.g., the housing 20 and the motherboard of the electronic device 100), so as to fix the output module 10 in the electronic device 100.

The packaging sidewall 112 can surround the infrared fill light 12 and the proximity infrared light 13, the packaging sidewall 112 extends from the packaging substrate 111, the packaging sidewall 112 can be combined with the packaging substrate 111, and preferably, the packaging sidewall 112 and the packaging substrate 111 are detachably connected, so that the infrared fill light 12 and the proximity infrared light 13 can be conveniently overhauled after the packaging sidewall 112 is taken down. The package sidewall 112 may be made of a material opaque to infrared light to prevent infrared light emitted from the infrared fill light 12 or the near infrared light 13 from passing through the package sidewall 112.

The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. A light supplement window 1131 and a proximity window 1132 are formed in the top 113 of the package, the light supplement window 1131 corresponds to the infrared light supplement lamp 12, and infrared light emitted by the infrared light supplement lamp 12 passes through the light supplement window 1131; the proximity window 1132 corresponds to the proximity infrared lamp 13, and infrared light emitted from the proximity infrared lamp 13 passes out of the proximity window 1132. The package top 113 and the package side wall 112 may be formed integrally or separately. In one example, the fill window 1131 and the proximity window 1132 are through holes, and the package top 113 is made of an infrared opaque material. In another example, the package top 113 is made of an infrared opaque material and an infrared opaque material, specifically, the fill light window 1131 and the proximity window 1132 are made of an infrared opaque material, and the rest of the package top is made of an infrared opaque material, further, the fill light window 1131 and the proximity window 1132 may be formed with a lens structure to improve the emission angle of infrared light emitted from the fill light window 1131 and the proximity window 1132, for example, the fill light window 1131 is formed with a concave lens structure to diffuse light passing through the fill light window 1131 to be emitted outward; the proximity window 1132 is formed with a convex lens structure to focus light passing through the proximity window 1132 to be emitted outward.

The infrared light supplement lamp 12 and the proximity infrared lamp 13 can be formed on one chip 14, so that the size of the infrared light supplement lamp 12 and the proximity infrared lamp 13 after integration is further reduced, and the preparation process is simple. The infrared fill-in light 12 can emit infrared light, the infrared light passes through the fill-in light window 1131 to project onto the surface of the object, and the infrared camera 62 (as shown in fig. 1) of the electronic device 100 receives the infrared light reflected by the object to obtain image information of the object (at this time, the infrared fill-in light 12 is used for infrared fill-in light). The proximity infrared lamp 13 may emit infrared light, which passes through the proximity window 1132 and reaches the surface of the object, and the proximity sensor 51 (shown in fig. 7) of the electronic device 100 receives the infrared light reflected by the object to detect the distance of the object to the electronic device 100 (at this time, the proximity infrared lamp 13 is used for infrared ranging).

The infrared light supplementing lamp 12 and the near infrared lamp 13 can emit infrared light to the outside of the packaging shell 11 at different powers, specifically, the infrared light supplementing lamp 12 and the near infrared lamp 13 can emit infrared light simultaneously, and the output module 10 is used for infrared light supplementing and infrared distance measurement simultaneously; or the infrared light supplement lamp 12 can emit light and does not emit light close to the infrared lamp 13, and the output module 10 is only used for infrared light supplement; also can infrared light filling lamp 12 not launch light and be close infrared lamp 13 launch light, output module 10 is only used for infrared range finding.

Referring to fig. 4, in the embodiment of the invention, a ground pin 15, a fill light pin 16 and a proximity light pin 17 are formed on the output module 10. The ground pin 15, the fill-in lamp pin 16, and the proximity lamp pin 17 may be formed on the package substrate 111, and when the ground pin 15 and the fill-in lamp pin 16 are enabled (i.e., when the ground pin 15 and the fill-in lamp pin 16 are connected to the circuit, the infrared fill-in lamp 12 emits infrared light; when the ground pin 15 and the proximity lamp pin 17 are enabled (i.e., when the ground pin 15 and the proximity lamp pin 17 access circuit are on), the proximity infrared lamp 13 emits infrared light.

Referring to fig. 1 and 5, the housing 20 may serve as a mounting carrier for the output module 10, or the output module 10 may be disposed in the housing 20. The chassis 20 may be a housing of the electronic device 100.

Referring to fig. 1, 5 and 6, the casing 20 includes a top portion 21 and a bottom portion 22, and at a position corresponding to the electronic component, the casing 20 is provided with a casing approach through hole 23, a casing supplementary light through hole 24 and a casing vibration through hole 2a which are spaced from each other. When the output module 10 is disposed in the housing 20, the proximity infrared lamp 13 corresponds to the housing proximity through hole 23, and the infrared light supplement lamp 12 corresponds to the housing light supplement through hole 24. The light emitted by the near infrared lamp 13 corresponding to the case near through hole 23 can pass through the case near through hole 23, specifically, the near infrared lamp 13 is opposite to the case near through hole 23, or the light emitted by the near infrared lamp 13 passes through the case near through hole 23 after being acted by the light guide element. The infrared light supplement lamp 12 corresponds to the chassis light supplement through hole 24, and the description thereof is omitted. In the embodiment shown in fig. 6, the chassis approach through hole 23 and the chassis fill light through hole 24 may be spaced apart from each other, and in other embodiments, the chassis approach through hole 23 and the chassis fill light through hole 24 may also be communicated with each other.

The vibration module 30a is mounted on the cabinet 20. The vibration module 30a may include a display screen 90 and a cover plate 30, or the display screen 90 and the cover plate 30 are combined to form the vibration module 30a, so as to improve the rigidity of the vibration module 30 a. The display screen 90 is disposed on the housing 20 and forms a receiving cavity 91 with the housing 20, and the cover plate 30 is disposed on the housing 20 and located on a side of the display screen 90 away from the receiving cavity 91 to protect the display screen 90. Since the output module 10 according to the embodiment of the invention can occupy a smaller volume, the volume for disposing the display screen 90 in the housing 20 can be correspondingly increased, so as to increase the screen occupation ratio of the electronic device 100. Specifically, the display screen 90, the output module 10 and the piezoelectric element 70 are disposed between the top portion 21 and the bottom portion 22, and the top portion 21 is located above the bottom portion 22 in a state that the user normally uses the electronic device 100, as shown in fig. 1, the output module 10 may be disposed between the display screen 90 and the top portion 21. In other embodiments, the display screen 90 may be a full screen with a gap, the display screen 90 surrounds the output module 10, and the output module 10 is exposed from the gap of the display screen 90.

The piezoelectric element 70 is made of a ceramic or quartz crystal material, and the piezoelectric element 70 may be a single wafer, a twin wafer, or a laminated piezoelectric element 70. The piezoelectric element 70 is coupled to the vibration module 30a and spaced apart from the output module 10. Specifically, the piezoelectric element 70 is accommodated in the casing vibration through hole 2a, is coupled to the cover plate 30, and is spaced apart from the casing 20, and may be: the piezoelectric element 70 is partially accommodated in the chassis vibration through hole 2a, or the piezoelectric element 70 is entirely accommodated in the chassis vibration through hole 2 a. When an electric signal (voltage) is applied to both ends of the piezoelectric element 70, the piezoelectric element 70 is mechanically deformed, for example, expanded or contracted, due to the inverse piezoelectric effect, thereby causing the vibration module 30a coupled to the piezoelectric element 70 to vibrate according to the frequency of the electric signal. When the user's body is in contact with the vibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with the vibration module 30a (e.g., cartilage of the outer ear, teeth). In this way, the user can realize the functions of voice call, listening to music, etc. through the piezoelectric element 70 and the vibration module 30 a. In an embodiment of the present invention, the processor of the electronic device 100 is configured to acquire a sound signal and apply an electrical signal corresponding to the sound signal to the two ends of the piezoelectric element 70.

It can be understood that the traditional receiver structure adopts air conduction sound, the local sound pressure of the receiver is usually about 90 dB-100 dB when the receiver works, and the sound is still about 50 dB-60 dB even if the sound is transmitted to the range of 1 meter around in the quiet surrounding environment (such as in the general office environment of about 50 dB), which causes the conversation content among the callers to be perceived around, resulting in privacy leakage. The electronic device 100 according to the embodiment of the invention adopts the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, and the sound of the call is mainly sensed by the bone conduction of the vibration and can effectively ensure the privacy of the call content.

Referring again to fig. 5 and 6, the piezoelectric element 70 and the display screen 90 are attached to the cover plate 30 by the joint 30 b. The bonding member 30b is an adhesive, a double-sided tape, an adhesive tape, or the like having a thermosetting property and an ultraviolet curing property. For example, the joining member 30b may be an optically elastic resin (a colorless and transparent ultraviolet-curing acrylic adhesive). The area of the cover 30 bonded to the piezoelectric element 70 is spaced apart from the area of the cover 30 bonded to the display screen 90 to prevent the display of the display screen 90 from being interfered with by the piezoelectric element 70. Of course, the cover 30 can also be coupled to the housing 20 by the coupling member 30b, so that compared with the case where the cover 30 is directly disposed on the housing 20, the vibration of the vibration module 30a can be prevented from being directly transmitted to the housing 20, thereby reducing the possibility that the user may drop the electronic device 100 due to the excessive vibration amplitude of the housing 20.

The cover plate 30 may be light-transmissive, and the material of the cover plate 30 may be light-transmissive glass, resin, plastic, or the like. The cover plate 30 is disposed on the chassis 20, the cover plate 30 includes an inner surface 32 combined with the chassis 20, and an outer surface 31 opposite to the inner surface 32, and the light emitted from the output module 10 sequentially passes through the inner surface 32 and the outer surface 31 and then passes through the cover plate 30. In the embodiment shown in fig. 6, the cover plate 30 covers the chassis fill-in through hole 24 and the chassis approach through hole 23, the inner surface 32 of the cover plate 30 is coated with the infrared transmissive ink 40, and the infrared transmissive ink 40 has a high transmittance to infrared light, for example, 85% or more, and a high attenuation to visible light, for example, 70% or more, so that a user can hardly see an area of the electronic device 100 covered by the infrared transmissive ink 40 with naked eyes in normal use. Specifically, infrared-transmissive ink 40 may cover areas of inner surface 32 that do not correspond to display 90.

The infrared transmission ink 40 can further shield at least one of the case access through hole 23, the case light supplement through hole 24 and the case vibration through hole 2a, that is, the infrared transmission ink 40 can simultaneously shield the case access through hole 23, the case light supplement through hole 24 and the case vibration through hole 2a (as shown in fig. 6), so that a user cannot easily see the internal structure of the electronic device 100 through the case access through hole 23, the case light supplement through hole 24 and the case vibration through hole 2a, and the electronic device 100 is attractive in appearance; the infrared transmission ink 40 can also cover the case approach through hole 23, and does not cover the case light supplement through hole 24 and the case vibration through hole 2 a; the infrared transmission ink 40 can also cover the shell light supplement through hole 24, and does not cover the shell approach through hole 23 and the shell vibration through hole 2 a; the infrared transmission ink 40 can also cover the shell vibration through hole 2a, and does not cover the shell approach through hole 23 and the shell light supplement through hole 24; the infrared transmission ink 40 can also cover the case approaching through hole 23 and the case light supplement through hole 24, and does not cover the case vibration through hole 2 a; the infrared transmission ink 40 can also cover the shell light supplement through hole 24 and the shell vibration through hole 2a, and does not cover the shell approach through hole 23; the infrared transparent ink 40 can also cover the chassis approach through hole 23 and the chassis vibration through hole 2a, and does not cover the chassis light supplement through hole 24.

Referring to fig. 7, the receiving module 50 is integrated with a proximity sensor 51 and a light sensor 52, and the proximity sensor 51 and the light sensor 52 form a single package structure. The infrared light emitted from the proximity infrared lamp 13 is reflected by the external object and then received by the proximity sensor 51, and the proximity sensor 51 determines the distance between the external object and the electronic device 100 according to the received reflected infrared light. The light sensor 52 receives the visible light in the ambient light and detects the intensity of the visible light as a basis for controlling the display brightness of the display 90. The proximity sensor 51 and the optical sensor 52 are packaged together to form the receiving module 50, so that the gap between the two modules during independent assembly is reduced, and the installation space in the electronic device 100 is saved.

Referring to fig. 1 and 7, the imaging module 60 may be one or both of a visible light camera 61 and an infrared camera 62. The imaging module 60 includes a lens mount 63, a lens barrel 64, and an image sensor 65. The lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63. The mirror base 63 includes a mounting surface 631, and the mounting surface 631 is located between the lens barrel 64 and the image sensor 65. In the embodiment shown in fig. 7, the receiving module 50 is disposed on the mounting surface 631, and specifically, the receiving module 50 at least partially falls onto the mounting surface 631 in the orthogonal projection of the plane where the mounting surface 631 is located, so that the receiving module 50 and the imaging module 60 are disposed compactly, and the lateral space occupied by the two modules is small.

Referring to fig. 1, the structured light projector 80 is configured to emit structured light to the outside, the structured light is reflected after being projected onto the object to be measured, the reflected structured light can be received by the infrared camera 62, and the processor of the electronic device 100 further analyzes the structured light received by the infrared camera 62 to obtain the depth information of the object to be measured.

In the embodiment shown in fig. 1, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, and the centers of the output module 10, the infrared light camera 62, the visible light camera 61, the piezoelectric element 70 and the structured light projector 80 are located on the same line segment. Specifically, the output module 10, the structured light projector 80, the piezoelectric element 70, the infrared camera 62, and the visible light camera 61 (as shown in fig. 8) are arranged in sequence from one end to the other end of the line segment; or an output module 10, an infrared camera 62, a piezoelectric element 70, a visible light camera 61 and a structured light projector 80 (as shown in fig. 1) are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the output module 10, the piezoelectric element 70, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the visible light camera 61, the piezoelectric element 70, the output module 10 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment. Of course, the arrangement of the output module 10, the infrared camera 62, the piezoelectric element 70, the visible light camera 61, and the structured light projector 80 is not limited to the above example, and may be other shapes such as a shape in which the centers of the respective electronic components are arranged in a circular arc shape and a shape in which the centers are arranged in a rectangular shape.

Referring to fig. 9, the imaging module 60 includes a visible light camera 61 and an infrared camera 62. The centers of the output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 are located on the same line segment, and the piezoelectric element 70 is located between the line segment and the top 21 of the housing 20. Specifically, the output module 10, the structured light projector 80, the infrared camera 62 and the visible light camera 61 are sequentially arranged from one end to the other end of the line segment; or the output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 are sequentially arranged from one end to the other end of the line segment (as shown in fig. 9); or the infrared camera 62, the output module 10, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the visible light camera 61, the output module 10 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment. Of course, the arrangement of the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 is not limited to the above example. In the embodiment of the present invention, the center of the piezoelectric element 70 is not located on the line segment, so that the lateral space occupied by the electronic components (the output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover plate 30 is saved.

Further, referring to fig. 7, the receiving module 50 may be disposed on the mounting surface 631 of the infrared camera 62, or may be disposed on the mounting surface 631 of the visible light camera 61, of course, the receiving module 50 may not be disposed on the mounting surface 631, the receiving module 50 may be disposed adjacent to the output module 10, and the proximity sensor 51 is easy to receive the infrared light emitted by the proximity infrared lamp 13 and reflected by the external object; the receiving module 50 may also be disposed adjacent to the piezoelectric element 70, which is not limited herein.

In summary, in the electronic device 100 according to the embodiment of the invention, the output module 10 integrates the infrared light supplement lamp 12 and the proximity infrared lamp 13 into a single package structure, and integrates the functions of emitting infrared light for infrared distance measurement and infrared light supplement, so that the output module 10 has a higher integration level and a smaller volume, and the output module 10 saves space for realizing the functions of infrared light supplement and infrared distance measurement. In addition, because the infrared light supplement lamp 12 and the proximity infrared lamp 13 are supported on the same packaging substrate 111, compared with the infrared light supplement lamp 12 and the proximity infrared lamp 13 in the conventional process, which need to be manufactured by different wafers and then packaged on a PCB substrate, the packaging efficiency is improved. Moreover, the electronic device 100 adopts the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, and replaces the traditional receiver structure which conducts sound through air, so that on one hand, the privacy of the conversation content can be effectively ensured; on the other hand, the original telephone receiver is eliminated, so that a through hole corresponding to the telephone receiver is not formed in the cover plate 30, the process is simpler, the appearance is more attractive, and dust or moisture can be prevented from entering the electronic device 100.

Referring to fig. 6 and 10, in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared camera 62. The casing 20 is provided with a casing approach through hole 23, a casing supplementary light through hole 24, and a casing vibration through hole 2a, which are spaced apart from each other. The proximity infrared lamp 13 corresponds to the enclosure proximity through hole 23, and the infrared light supplement lamp 12 corresponds to the enclosure light supplement through hole 24. The number of the piezoelectric elements 70 is plural, the number of the chassis vibration through holes 2a is plural, the plural piezoelectric elements 70 correspond to the plural chassis vibration through holes 2a, and each piezoelectric element 70 is accommodated in the corresponding chassis vibration through hole 2 a. The centers of the output module 10, the infrared camera 62, the visible light camera 61, the plurality of piezoelectric elements 70 and the structured light projector 80 are located on the same line segment, and at least one of the output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 is arranged between two adjacent piezoelectric elements 70. For example, the number of the piezoelectric elements 70 is two, and the piezoelectric elements 70, the output module 10, the structured light projector 80, the infrared camera 62, the visible light camera 61, and the piezoelectric elements 70 are arranged in sequence from one end to the other end of the line segment (as shown in fig. 10); or the piezoelectric element 70, the output module 10, the infrared camera 62, the visible light camera 61, the piezoelectric element 70, the structured light projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of the piezoelectric elements 70 is three, and the piezoelectric elements 70, the output module 10, the structured light projector 80, the piezoelectric elements 70, the infrared camera 62, the visible light camera 61, and the piezoelectric elements 70 (shown in fig. 11) are arranged in sequence from one end to the other end of the line segment; or the piezoelectric element 70, the output module 10, the piezoelectric element 70, the infrared camera 62, the visible light camera 61, the piezoelectric element 70, the structured light projector 80 and the like are arranged in sequence from one end to the other end of the line segment. Of course, the number of the piezoelectric elements 70 and the arrangement of the piezoelectric elements 70, the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are not limited to the above examples. In the embodiment of the present invention, the plurality of piezoelectric elements 70 are combined with the cover plate 30, and specifically, the plurality of piezoelectric elements 70 are respectively attached to the cover plate 30 by the joining members 30 b. The processor of the electronic device 100 is configured to obtain a sound signal, and apply an electrical signal corresponding to the sound signal to two ends of the piezoelectric elements 70, and the piezoelectric elements 70 are mechanically deformed, so that the piezoelectric elements 70 drive the vibration module 30a to vibrate according to the frequency of the electrical signal from different positions combined with the cover plate 30. When the user's body is in contact with the vibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with the vibration module 30a (e.g., cartilage of the outer ear, teeth).

In the embodiment of the present invention, the plurality of piezoelectric elements 70 simultaneously drive the vibration module 30a to vibrate from a plurality of different positions combined with the cover plate 30, and the vibration of the vibration module 30a is uniform and has higher intensity, which is beneficial to stably transmitting the bone conduction sound to the auditory nerve of the user.

Referring to fig. 6, 12 and 13, in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared camera 62. The casing 20 is provided with a casing approach through hole 23, a casing supplementary light through hole 24, and a casing vibration through hole 2a, which are spaced apart from each other. The proximity infrared lamp 13 corresponds to the enclosure proximity through hole 23, and the infrared light supplement lamp 12 corresponds to the enclosure light supplement through hole 24. The piezoelectric element 70 includes a piezoelectric body 71 and a plurality of piezoelectric bumps 72 extending from the piezoelectric body 71, the number of the piezoelectric bumps 72 is plural, the number of the chassis vibration through holes 2a is plural, the plurality of piezoelectric bumps 72 correspond to the plurality of chassis vibration through holes 2a, and each piezoelectric bump 72 is partially received in the corresponding chassis vibration through hole 2a and is coupled to the cover plate 30. The output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located between the cover plate 30 and the piezoelectric body 71. The centers of the output module 10, the infrared camera 62, the visible light camera 61, the plurality of piezoelectric bumps 72 and the structured light projector 80 are located on the same line segment, and at least one of the output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 is arranged between two adjacent piezoelectric bumps 72. For example, the number of the piezoelectric bumps 72 is two, and the piezoelectric bumps 72, the output module 10, the structured light projector 80, the infrared camera 62, the visible light camera 61, and the piezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment; or the piezoelectric bump 72, the output module 10, the infrared camera 62, the visible light camera 61, the piezoelectric bump 72, the structured light projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of the piezoelectric bumps 72 is three, and the piezoelectric bumps 72, the output module 10, the structured light projector 80, the piezoelectric bumps 72, the infrared camera 62, the visible light camera 61, and the piezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment; or the piezoelectric bump 72, the output module 10, the piezoelectric bump 72, the infrared camera 62, the visible light camera 61, the piezoelectric bump 72, the structured light projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of the piezoelectric bumps 72 is five, and the piezoelectric bumps 72, the output module 10, the piezoelectric bumps 72, the structured light projector 80, the piezoelectric bumps 72, the infrared camera 62, the piezoelectric bumps 72, the visible light camera 61, and the piezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment (as shown in fig. 13). Of course, the number of the piezoelectric bumps 72 and the arrangement of the piezoelectric bumps 72, the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are not limited to the above examples. In the embodiment of the present invention, the plurality of piezoelectric bumps 72 are combined with the cap plate 30, and more specifically, the plurality of piezoelectric bumps 72 are respectively attached to the cap plate 30 by the bonding members 30 b. The processor of the electronic device 100 is configured to obtain a sound signal, and apply an electrical signal corresponding to the sound signal to the piezoelectric element 70, and the piezoelectric element 70 including the piezoelectric body 71 and the piezoelectric bumps 72 is mechanically deformed, so that the piezoelectric bumps 72 drive the vibration module 30a to vibrate according to the frequency of the electrical signal from a plurality of different positions combined with the cover plate 30. When the user's body is in contact with the vibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with the vibration module 30a (e.g., cartilage of the outer ear, teeth).

In the embodiment shown in fig. 13, the housing 20 is provided with a housing vibration through hole 2a, an output through hole 25, a structured light through hole 26, an infrared light through hole 27, and a visible light through hole 28 which are spaced from each other. The case vibration through hole 2a corresponds to the piezoelectric bump 72, the output through hole 25 corresponds to the output module 10, the structured light through hole 26 corresponds to the structured light projector 80, the infrared light through hole 27 corresponds to the infrared light camera 62, and the visible light through hole 28 corresponds to the visible light camera 61. The output through hole 25 may be replaced with the above-mentioned enclosure approaching through hole 23 and the enclosure light supplementing through hole 24 which are spaced from each other, or the output through hole 25 is formed by communicating the above-mentioned enclosure approaching through hole 23 and the enclosure light supplementing through hole 24. In addition, the structured light through hole 26 corresponds to the structured light projector 80, that is, the structured light emitted by the structured light projector 80 can pass through the structured light through hole 26, the infrared light through hole 27 corresponds to the infrared camera 62, that is, the infrared camera 62 can receive the infrared light reflected by the object from the infrared light through hole 27, and the visible light through hole 28 corresponds to the visible light camera 61, that is, the visible light camera 61 can receive the visible light reflected by the object from the visible light through hole 28.

In the embodiment of the present invention, the plurality of piezoelectric bumps 72 drive the vibration module 30a to vibrate from a plurality of different positions combined with the cover plate 30, and the vibration of the vibration module 30a is more uniform and stronger, which is beneficial to stably transmitting bone conduction sound to the auditory nerve of the user; in addition, the plurality of piezoelectric bumps 72 extend from the same piezoelectric body 71, so that an electrical signal can be simultaneously applied to the plurality of piezoelectric bumps 72, and the vibration module 30a can be driven to vibrate synchronously from a plurality of different positions; furthermore, the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located between the cover plate 30 and the piezoelectric body 71, and the piezoelectric bumps 72 are inserted, so that the electronic device 100 has a small overall size and saves space.

Referring to fig. 3, in some embodiments, the output module 10 further includes a fill-in lamp lens 18 and a proximity lamp lens 19. The fill light lens 18 is disposed in the package housing 11 and corresponds to the infrared fill light 12. The proximity lamp lens 19 is provided inside the package case 11 and corresponds to the proximity infrared lamp 13. The infrared light emitted by the infrared fill light 12 is focused into the fill light window 1131 under the action of the fill light lens 18 to be emitted, so as to reduce the amount of light emitted to other areas of the package sidewall 112 and the package top 113. Similarly, the infrared light emitted from the proximity infrared lamp 13 is focused by the proximity lamp lens 19 into the proximity window 1132 and emitted, reducing the amount of light emitted to other areas of the package sidewall 112 and package top 113. Specifically, the fill-in lamp lens 18 and the proximity lamp lens 19 may be located on the same transparent substrate, and more specifically, the fill-in lamp lens 18 and the proximity lamp lens 19 may be integrally formed with the transparent substrate. Of course, the output module 10 may be provided with only one of the light supplement lamp lens 18 and the proximity lamp lens 19, or may not be provided with the light supplement lamp lens 18 and the proximity lamp lens 19.

Referring to fig. 3, in some embodiments, the output module 10 further includes a metal shielding plate 1a, the metal shielding plate 1a is located in the package housing 11, and the metal shielding plate 1a is located between the infrared fill-in light 12 and the near infrared light 13. Metal shielding plate 1a is located infrared light filling lamp 12 and is close between infrared lamp 13, metal shielding plate 1a can shield infrared light filling lamp 12 and is close infrared lamp 13 electromagnetic interference each other on the one hand, infrared light filling lamp 12 can not influence each other with the luminous intensity and the chronogenesis that are close infrared lamp 13, on the other hand metal shielding plate 1a can be used for isolated infrared light filling lamp 12 place cavity and the cavity that is close infrared lamp 13 place, light can not get into another cavity from a cavity.

Referring to fig. 14, in some embodiments, the output module 10 further includes an optical enclosure 1 b. The optical enclosure 1b is made of a light-transmissive material, and the optical enclosure 1b is formed on the package substrate 111 and located inside the package case 11. The optical enclosure 1b encloses the infrared fill light 12 and the proximity infrared light 13. Specifically, optics sealing cover 1b can form through encapsulating injection molding process, and optics sealing cover 1b can adopt transparent thermosetting epoxy to make to in use is difficult for softening, and optics sealing cover 1b can fix infrared light filling lamp 12 and be close the relative position between infrared lamp 13, and makes infrared light filling lamp 12 and be close infrared lamp 13 and be difficult for rocking in encapsulation casing 11.

In addition, referring to fig. 14, the output module 10 further includes a light-emitting partition plate 1c, and the light-emitting partition plate 1c is formed in the optical enclosure 1b and located between the infrared fill light 12 and the near infrared light 13. The light-emitting partition board 1c can be used for separating the infrared light supplement lamp 12 from the near infrared lamp 13, light emitted by the infrared light supplement lamp 12 cannot penetrate out of the near window 1132, and light emitted by the near infrared lamp 13 cannot penetrate out of the light supplement window 1131.

Referring to fig. 15, in some embodiments, the proximity sensor 51 and the optical sensor 52 may not be integrated in the receiving module 50, or the proximity sensor 51 and the optical sensor 52 are separately disposed. At this time, the proximity sensor 51 may be provided on the mounting surface 631 of the mirror base 63; the light sensor 52 may also be disposed on the mounting surface 631 of the mirror base 63; or the proximity sensor 51 is provided on the mounting surface 631 of the mirror base 63 together with the optical sensor 52. The lens mount 63 can be the lens mount 63 of the infrared camera 62, and can also be the lens mount 63 of the visible camera 61.

Referring to fig. 16, in some embodiments, a cover plate light supplement through hole 34 may be further formed in the cover plate 30, the cover plate light supplement through hole 34 corresponds to the chassis light supplement through hole 24, and infrared light emitted by the infrared light supplement lamp 12 passes through the chassis light supplement through hole 24 and then passes through the electronic device 100 from the cover plate light supplement through hole 34. In this case, the infrared transmitting ink 40 may be provided on the cover 30 at a position corresponding to the chassis approach through hole 23, so that the user cannot easily see the approach infrared lamp 13 inside the electronic device 100 through the chassis approach through hole 23, and the electronic device 100 has a good appearance.

Referring to fig. 17, in some embodiments, the cover 30 may further include a cover approaching through hole 33, the cover approaching through hole 33 corresponds to the chassis approaching through hole 23, and the infrared light emitted by the approaching infrared lamp 13 passes through the chassis approaching through hole 23 and then passes through the cover approaching through hole 33 to the electronic device 100. At this time, the infrared transmissive ink 40 may be disposed at a position on the cover plate 30 corresponding to the chassis light supplement through hole 24, so that the user is difficult to see the infrared light supplement lamp 12 inside the electronic device 100 through the chassis light supplement through hole 24, and the electronic device 100 has a beautiful appearance.

Referring to fig. 18, in some embodiments, the imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the receiving module 50 can be further fixed on the substrate 66. Specifically, the substrate 66 is provided with an FPC, a part of the substrate 66 is located in the mirror base 63, another part of the substrate extends out of the mirror base 63, one end of the FPC is located in the mirror base 63 and is used for bearing the image sensor 65, and the other end of the FPC can be connected with a main board of the electronic device 100. When the receiving module 50 is disposed on the substrate 66, the receiving module 50 is disposed outside the lens holder 63, and the receiving module 50 may be connected to an FPC.

Further, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52, and the proximity sensor 51 and the light sensor 52 together form a single package structure, so that a gap between the two when they are separately assembled is reduced, and an installation space in the electronic device 100 is saved. In other embodiments, the receiving module 50 disposed on the substrate 66 includes the proximity sensor 51 and/or the light sensor 52, and each of the proximity sensor 51 and the light sensor 52 is a single package structure. That is, the proximity sensor 51 in which the receiving module 50 provided on the substrate 66 has a single package structure; alternatively, the photo sensor 52 with a single package structure is disposed on the receiving module 50 of the substrate 66; alternatively, the receiving module 50 disposed on the substrate 66 is a proximity sensor 51 of a single package structure and a photosensor 52 of a single package structure.

The imaging module 60 may be one or two of a visible light camera 61 and an infrared light camera 62. Specifically, the receiving module 50 may be fixed on the substrate 66 of the visible light camera 61; the receiving module 50 may be fixed on the substrate 66 of the infrared camera 62. When the proximity sensor 51 and the optical sensor 52 are separately packaged, the proximity sensor 51 may be fixed on the substrate 66 of the visible light camera 61, and the optical sensor 52 may be fixed on the substrate 66 of the infrared light camera 62; alternatively, the photosensor 52 may be fixed on the substrate 66 of the visible light camera 61, and the proximity sensor 51 may be fixed on the substrate 66 of the infrared light camera 62; alternatively, the proximity sensor 51 and the optical sensor 52 are both fixed on the substrate 66 of the visible light camera 61; alternatively, the proximity sensor 51 and the optical sensor 52 are both fixed to the substrate 66 of the infrared camera 62.

Further, the substrate 66 further includes a reinforcing plate disposed on a side opposite to the receiving module 50 to increase the overall strength of the substrate 66, so that the FPC is not prone to being folded, and the receiving module 50 (or the proximity sensor 51 or the light sensor 52) is not prone to shaking when disposed on the substrate 66. In one example, the receiving module 50 (or the proximity sensor 51 or the optical sensor 52) may also be fixed on the outer sidewall of the mirror base 63, for example, by bonding.

Referring to fig. 19, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 includes an image sensor 65, a camera housing 67 and a lens module 68. The top surface 670 of the camera housing 67 is a stepped surface, the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672 and a third sub-top surface 673, the second sub-top surface 672 is connected to the first sub-top surface 671 in an inclined manner and forms a notch 675 with the first sub-top surface 671, the third sub-top surface 673 is connected to the second sub-top surface 672 in an inclined manner, and the second sub-top surface 672 is located between the first sub-top surface 671 and the third sub-top surface 673 to connect the first sub-top surface 671 and the third sub-top surface 673. The angle between the second sub top surface 672 and the first sub top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub top surface 672 and the third sub top surface 673 may be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The third sub-top surface 673 is provided with a light-emitting through hole 674, and the lens module 68 is accommodated in the camera housing 67 and corresponds to the light-emitting through hole 674. The image sensor 65 is accommodated in the camera housing 67 and corresponds to the lens module 68, light outside the electronic device 100 can pass through the light-out hole 674 and the lens module 68 and be transmitted to the image sensor 65, and the image sensor 65 converts an optical signal into an electrical signal. The receiving module 50 is disposed at the first sub-top surface 671, and the receiving module 50 includes a proximity sensor 51 and a photosensor 52. In the present embodiment, the imaging module 60 may be a visible light camera 61, and the receiving module 50 is a single package structure formed by the proximity sensor 51 and the optical sensor 52. The direction of the center line connecting the proximity sensor 51 and the light sensor 52 may coincide with the extending direction of the slit 675 (as shown in fig. 19); alternatively, the direction of the central line connecting the proximity sensor 51 and the optical sensor 52 may be perpendicular to the extending direction of the slit 675 or an included angle formed by the two may be an acute angle or an obtuse angle. In other embodiments, the imaging module 60 may be an infrared camera 62.

The imaging module 60 of the present embodiment has a notch 675, and the receiving module 50 is disposed on the first sub-top surface 671, so that the receiving module 50 and the imaging module 60 are disposed compactly, and the two occupy a smaller lateral space, thereby saving the installation space in the electronic device 100; meanwhile, the proximity sensor 51 and the optical sensor 52 are packaged together to form the receiving module 50, so that the gap between the proximity sensor 51 and the optical sensor when the proximity sensor and the optical sensor are independently assembled is reduced, and the installation space in the electronic device 100 is saved.

With reference to fig. 19, in some embodiments, the receiving module 50 of the above embodiments is disposed on the first sub-top surface 671 and located outside the camera housing 67, and specifically, a projection of the entire receiving module 50 along a direction perpendicular to the first sub-top surface 671 may be located inside the first sub-top surface 671 (as shown in fig. 19); alternatively, a part of the receiving module 50 is located in the first sub-top surface 671 along a projection perpendicular to the first sub-top surface 671. That is, at least a portion of the receiving module 50 is located directly above the first sub-top surface 671, so that the receiving module 50 and the imaging module 60 are disposed compactly, and the occupied lateral space is small, thereby further saving the installation space in the electronic device 100. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the optical sensor 52, but the proximity sensor 51 and the optical sensor 52 are two separate single package structures, and in this case, the proximity sensor 51 and the optical sensor 52, which are each a single package structure, may also be both disposed on the first sub-top surface 671.

Referring to fig. 20, in some embodiments, the receiving module 50 of the above embodiments only includes the proximity sensor 51 and does not include the optical sensor 52, in this case, the proximity sensor 51 (or the receiving module 50) and the optical sensor 52 are respectively of a single package structure, the proximity sensor 51 is disposed on the first sub-top surface 671, and the optical sensor 52 is disposed at any other position except the first sub-top surface 671.

Referring to fig. 20, in some embodiments, the receiving module 50 of the above embodiments only includes the optical sensor 52 and does not include the proximity sensor 51, in which case, the optical sensor 52 (or the receiving module 50) and the proximity sensor 51 are each a single package structure, the optical sensor 52 is disposed on the first sub-top surface 671, and the proximity sensor 51 is disposed at any other position except the first sub-top surface 671.

Referring to fig. 21, the first sub-top surface 671 of the above embodiment is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 includes only the proximity sensor 51 without the photosensor 52, and the photosensor 52 is disposed outside the camera housing 67, the number of the light-transmitting holes 676 may be one, and light outside the electronic device 100 can pass through the light-transmitting holes 676 and be transmitted to the proximity sensor 51. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 21, the first sub-top surface 671 of the above embodiment is formed with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 includes only the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of the light holes 676 may be one, and light outside the electronic device 100 can pass through the light holes 676 and be transmitted to the light sensor 52. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 22, in some embodiments, the first sub-top surface 671 of the above embodiments is formed with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 integrates the proximity sensor 51 and the light sensor 52, the light hole 676 can be one light hole corresponding to both the proximity sensor 51 and the light sensor 52 or two light holes spaced apart from each other and corresponding to the proximity sensor 51 and the light sensor 52, respectively, and light outside the electronic device 100 can pass through the light hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the light sensor 52, but the proximity sensor 51 and the light sensor 52 are of two separate single-package structures, and in this case, the proximity sensor 51 and the light sensor 52, which are of the single-package structure, may be both disposed in the camera housing 67 and correspond to the light-transmitting hole 676. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 22, in some embodiments, the first sub-top surface 671 of the above embodiments is formed with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the receiving module 50 can be fixed on the substrate 66 and accommodated in the camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to a main board of the electronic device 100. In other embodiments, the receiving module 50 may be connected to an FPC. In this embodiment, the receiving module 50 disposed on the substrate 66 includes the proximity sensor 51 and the light sensor 52, and the proximity sensor 51 and the light sensor 52 together form a single package structure, so as to reduce a gap between the two when they are separately assembled, and save an installation space in the electronic device 100.

In other embodiments, the receiving module 50 only includes the proximity sensor 51, and the optical sensor 52 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the proximity sensor 51, the optical sensor 52 is also a single package structure, and the optical sensor 52 can be fixed on the substrate 66 and accommodated in the camera housing 67; alternatively, when a part of the substrate 66 is located inside the camera housing 67 and another part thereof protrudes from the camera housing 67, the light sensor 52 may be fixed to the substrate 66 and located outside the camera housing 67.

In another embodiment, the receiving module 50 only includes the optical sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the optical sensor 52, the proximity sensor 51 is also a single package structure, and the proximity sensor 51 can be fixed on the substrate 66 and accommodated in the camera housing 67; alternatively, when a part of the base plate 66 is located inside the camera housing 67 and another part thereof protrudes from the camera housing 67, the proximity sensor 51 may be fixed to the base plate 66 and located outside the camera housing 67.

The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20; meanwhile, the imaging module 60 sets the substrate 66 and sets the receiving module 50 on the substrate 66, so that the receiving module 50 can be stably installed in the camera housing 67.

Referring to fig. 23, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 is a dual-camera module, and includes two image sensors 65, a camera housing 67, and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 lower than the first step surface 677, and a first connection surface 679 a. The first connecting surface 679a is obliquely connected with the second tread 678 and forms a notch 675 with the second tread 678, the first connecting surface 679a is obliquely connected with the first tread 677, and the first connecting surface 679a is positioned between the first tread 677 and the second tread 678 to connect the first tread 677 with the second tread 678. The included angle between the first connecting surface 679a and the first tread 677 can be an obtuse angle or a right angle, and the included angle between the first connecting surface 679a and the second tread 678 can be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The two light-emitting through holes 674 are arranged on the first ladder surface 677 and are located on the same side of the cut 675, and a central connecting line of the two light-emitting through holes 674 is perpendicular to the extending direction of the cut 675. The two lens modules 68 are accommodated in the camera housing 67 and respectively correspond to the two light-emitting through holes 674, the two image sensors 65 are accommodated in the camera housing 67 and respectively correspond to the two lens modules 68, and light outside the electronic device 100 can pass through the light-emitting through holes 674 and the lens modules 68 and is transmitted to the image sensors 65. In the present embodiment, the imaging module 60 can be a visible light camera 61, and at this time, both the two lens modules 68 are lens modules corresponding to the visible light camera 61. The receiving module 50 is disposed on the second step face 678 and is located outside the camera housing 67. The receiving module 50 is a single package structure formed by the proximity sensor 51 and the optical sensor 52. The direction of the central line connecting the proximity sensor 51 and the light sensor 52 may coincide with the extending direction of the slit 675; alternatively, the direction of the center line connecting the proximity sensor 51 and the optical sensor 52 may be perpendicular to the extending direction of the slit 675 (as shown in fig. 23) or an acute angle or an obtuse angle. In other embodiments, the imaging module 60 may be an infrared camera 62, and both of the lens modules 68 correspond to the infrared camera 62. In another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared camera 62, and in this case, one of the lens modules 68 is a lens module corresponding to the infrared camera 62, and the other lens module 68 is a lens module corresponding to the visible light camera 61.

The imaging module 60 of the present embodiment has a notch 675, and the receiving module 50 is disposed on the second step surface 678, so that the receiving module 50 and the imaging module 60 are disposed compactly, and the two occupy a smaller lateral space, thereby saving the installation space in the electronic device 100; meanwhile, the proximity sensor 51 and the optical sensor 52 are packaged together to form the receiving module 50, so that the gap between the proximity sensor 51 and the optical sensor when the proximity sensor and the optical sensor are independently assembled is reduced, and the installation space in the electronic device 100 is saved.

Referring to fig. 24, in some embodiments, the cut 675 of the above embodiments is formed in the middle of the top surface 670, the first tread 677 is divided into a first sub-tread 677a and a second sub-tread 677b by the cut 675, the first sub-tread 677a and the second sub-tread 677b are respectively located on two opposite sides of the cut 675, two light-exiting through holes 674 are respectively formed in the first sub-tread 677a and the second sub-tread 677b, and the lens modules 68 mounted in the camera housing 67 are also located on two opposite sides of the cut 675. At this time, the cutout 675 is defined by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b, the first connecting surface 679a connects the first sub top surface 677a and the second step surface 678 obliquely and is located between the first sub top surface 677a and the second step surface 678, and the second connecting surface 679b connects the second sub top surface 677b and the second step surface 678 obliquely and is located between the second sub top surface 677b and the second step surface 678. In this embodiment, the first terraced surface 677 is parallel to the second terraced surface 678, an included angle between the first connection surface 679a and the first sub terraced surface 677a is an obtuse angle, and an included angle between the second connection surface 679b and the second sub terraced surface 677b is an obtuse angle. In other embodiments, the first connection surface 679a and the first sub-step surface 677a form a right angle, and the second connection surface 679b and the second sub-step surface 677b form a right angle. The cutout 675 of the present embodiment is opened at the middle position of the top surface 670, relative to the cutout 675 opened at the edge position of the top surface 670, so that the width of the cutout 675 is wider, thereby facilitating the positioning of the receiving module 50 on the second tread 678.

Referring to fig. 23 and 24, in some embodiments, the receiving module 50 of the above embodiments is disposed on the second step surface 678 and is located outside the camera housing 67. Specifically, when the cut 675 is opened at the edge of the top surface 670, the projection of the whole receiving module 50 along the direction perpendicular to the second step surface 678 can be located in the second step surface 678; alternatively, a projection of a portion of the receiving module 50 along a direction perpendicular to the second tread 678 is located within the second tread 678 (as shown in fig. 23). That is, at least a portion of the receiving module 50 is located directly above the second step surface 678. When the cutout 675 is opened at the middle position of the top surface 670, the entire receiving module 50 can be located in the second step surface 678 along the projection perpendicular to the second step surface 678 (as shown in fig. 24). Thus, the receiving module 50 and the imaging module 60 are arranged compactly, and the horizontal space occupied by the receiving module and the imaging module is small, so that the installation space in the electronic device 100 is further saved. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the light sensor 52, but the proximity sensor 51 and the light sensor 52 are of two separate single-package structures, and in this case, the proximity sensor 51 and the light sensor 52, which are of the single-package structure, may also be both disposed on the second step surface 678.

Referring to fig. 24, in some embodiments, the receiving module 50 of the above embodiments only includes the proximity sensor 51, and the receiving module 50 does not include the optical sensor 52, in this case, the proximity sensor 51 (or the receiving module 50) and the optical sensor 52 are respectively a single package structure, the proximity sensor 51 is disposed on the second step surface 678, and the optical sensor 52 is disposed on the housing 20 outside the imaging module 60.

Referring to fig. 24, in some embodiments, the receiving module 50 of the above embodiments only includes the optical sensor 52, and the receiving module 50 does not include the proximity sensor 51, in this case, the optical sensor 52 (or the receiving module 50) and the proximity sensor 51 are respectively a single package structure, the optical sensor 52 is disposed on the second step surface 678, and the proximity sensor 51 is disposed on the housing 20 outside the imaging module 60.

Referring to fig. 25, the second step surface 678 of the above embodiment is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 includes only the proximity sensor 51 without the photosensor 52, and the photosensor 52 is disposed outside the camera housing 67, the number of the light-transmitting holes 676 may be one, and light outside the electronic device 100 can pass through the light-transmitting holes 676 and be transmitted to the proximity sensor 51. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 25, the second step surface 678 of the above embodiment is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 includes only the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of the light holes 676 may be one, and light outside the electronic device 100 can pass through the light holes 676 and be transmitted to the light sensor 52. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 26, in some embodiments, the second step surface 678 of the above embodiments is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 integrates the proximity sensor 51 and the light sensor 52, the light hole 676 can be one light hole corresponding to both the proximity sensor 51 and the light sensor 52 or two light holes spaced apart from each other and corresponding to the proximity sensor 51 and the light sensor 52, respectively, and light outside the electronic device 100 can pass through the light hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the light sensor 52, but the proximity sensor 51 and the light sensor 52 are of two separate single-package structures, and in this case, the proximity sensor 51 and the light sensor 52, which are of the single-package structure, may be both disposed in the camera housing 67 and correspond to the light-transmitting hole 676. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 26, in some embodiments, the second step surface 678 of the above embodiments is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the receiving module 50 can be fixed on the substrate 66 and accommodated in the camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to a main board of the electronic device 100. In other embodiments, the receiving module 50 may be connected to an FPC. In this embodiment, the receiving module 50 disposed on the substrate 66 includes the proximity sensor 51 and the light sensor 52, and the proximity sensor 51 and the light sensor 52 together form a single package structure, so as to reduce a gap between the two when they are separately assembled, and save an installation space in the electronic device 100.

In another embodiment, the receiving module 50 only includes the optical sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the optical sensor 52, the proximity sensor 51 is also a single package structure, and the proximity sensor 51 can be fixed on the substrate 66 and housed in the camera housing 67; alternatively, when a part of the base plate 66 is located inside the camera housing 67 and another part thereof protrudes from the camera housing 67, the proximity sensor 51 may be fixed to the base plate 66 and located outside the camera housing 67.

In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising:

a housing;

the output module is of a single-packaging body structure and is arranged in the shell, the output module comprises a packaging shell, an infrared light supplementing lamp and a near infrared lamp, the packaging shell comprises a packaging substrate, the infrared light supplementing lamp and the near infrared lamp are packaged in the packaging shell and are borne on the packaging substrate, and the infrared light supplementing lamp and the near infrared lamp can emit infrared light rays to the outside of the packaging shell at different powers;

a grounding pin, a light supplement lamp pin and an approach lamp pin are formed on the output module; when the grounding pin and the light supplement lamp pin are enabled, the infrared light supplement lamp emits infrared light; when the grounding pin and the proximity lamp pin are enabled, the proximity infrared lamp emits infrared light; the shell is provided with a shell approaching through hole, a shell light supplementing through hole and a shell vibration through hole which are mutually spaced, the approaching infrared lamp corresponds to the shell approaching through hole, and the infrared light supplementing lamp corresponds to the shell light supplementing through hole;

the vibration module is arranged on the shell; the vibration module comprises a display screen and a light-transmitting cover plate, the display screen is arranged on the shell and forms an accommodating cavity together with the shell, the cover plate is arranged on the shell and is positioned on one side of the display screen, which is far away from the accommodating cavity, the display screen is combined with the cover plate, and a piezoelectric element is accommodated in the shell vibration through hole and is combined with the cover plate; the piezoelectric element and the display screen are attached to the cover plate by a joint;

the imaging module is arranged in the shell and comprises a lens base, a lens barrel arranged on the lens base and a substrate partially arranged in the lens base; the imaging module comprises an infrared camera and a visible light camera, and the electronic device further comprises a structured light projector; and

the receiving module is arranged on the substrate and comprises a proximity sensor and/or a light sensor, the proximity sensor and the light sensor form a single packaging body structure together, or the proximity sensor and the light sensor are of single packaging body structures respectively;

the piezoelectric element comprises a piezoelectric body and a plurality of piezoelectric lugs extending out of the piezoelectric body, the number of the shell vibration through holes is multiple, the plurality of piezoelectric lugs correspond to the plurality of shell vibration through holes, each piezoelectric lug is partially accommodated in the corresponding shell vibration through hole and is combined with the cover plate, the output module, the infrared camera, the visible light camera and the structured light projector are positioned between the cover plate and the piezoelectric body, the output module infrared camera, visible light camera, a plurality of piezoelectricity lug with the center of structured light projector is located same line segment, adjacent two be provided with between the piezoelectricity lug the output module infrared camera, visible light camera, reach at least one in the structured light projector.

2. The electronic device of claim 1, wherein the output module further comprises a chip, and the infrared fill-in light and the proximity infrared light are formed on one chip.

3. The electronic device according to claim 1, wherein the package housing further comprises a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, the package top is formed with a fill light window and an access window, the fill light window corresponds to the infrared fill light, and the access window corresponds to the access infrared light.

4. The electronic device according to claim 1, wherein the output module further comprises a fill-in light lens disposed in the package housing and corresponding to the infrared fill-in light; and/or

The output module is characterized by further comprising a proximity lamp lens, wherein the proximity lamp lens is arranged in the packaging shell and corresponds to the proximity infrared lamp.

5. The electronic device according to claim 1, wherein the output module further comprises a fill-in light lens and a proximity light lens disposed in the package housing, the fill-in light lens corresponds to the infrared fill-in light, the proximity light lens corresponds to the proximity infrared light, and the fill-in light lens and the proximity light lens are located on a same transparent substrate.

6. The electronic device of claim 1, wherein the output module further comprises a metal shielding plate located in the package housing and between the infrared fill light and the near infrared light.

7. The electronic device of claim 1, wherein the output module further comprises an optical enclosure made of a light transmissive material, the optical enclosure being formed on the package substrate and located within the package housing, the optical enclosure enclosing the infrared fill light and the proximity infrared light.

8. The electronic device of claim 7, wherein the output module further comprises a light-emitting partition formed in the optical enclosure and located between the infrared fill light and the near infrared light.

9. The electronic device of claim 1, wherein a surface of the cover plate combined with the housing is formed with an infrared transparent ink that only transmits infrared light, and the infrared transparent ink blocks at least one of the housing access through hole, the housing fill light through hole, and the housing vibration through hole.