CN108023985B - Electronic device - Google Patents

Electronic device Download PDF

Info

Publication number
CN108023985B
CN108023985B CN201711437458.3A CN201711437458A CN108023985B CN 108023985 B CN108023985 B CN 108023985B CN 201711437458 A CN201711437458 A CN 201711437458A CN 108023985 B CN108023985 B CN 108023985B
Authority
CN
China
Prior art keywords
light
infrared
lamp
housing
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201711437458.3A
Other languages
Chinese (zh)
Other versions
CN108023985A (en
Inventor
吴安平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201711437458.3A priority Critical patent/CN108023985B/en
Publication of CN108023985A publication Critical patent/CN108023985A/en
Priority to PCT/CN2018/118716 priority patent/WO2019128628A1/en
Application granted granted Critical
Publication of CN108023985B publication Critical patent/CN108023985B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Studio Devices (AREA)

Abstract

The invention discloses an electronic device. The electronic device comprises a shell, an output module, a mainboard, an imaging module and a receiving module. The output module is installed in the casing, including encapsulation casing, infrared light filling lamp and near infrared lamp, the encapsulation casing includes the encapsulation base plate. The infrared light supplement lamp and the near infrared lamp are packaged in the packaging shell and are borne on the packaging substrate, and the infrared light supplement lamp and the near infrared lamp can emit infrared light to the outside of the packaging shell with different powers. The mainboard is installed in the casing, and the mainboard is formed with the installation breach. The imaging module is installed in the casing and corresponds to the installation notch. The receiving module is combined on the mainboard, and stretches into the installation breach from the edge of installation breach, and along the direction of depth of installation breach, the receiving module overlaps with the imaging module part, and the receiving module includes proximity sensor and/or light sense ware. Because output module integrated level is higher, and the volume is less, and imaging module and receiving module partially overlap on the degree of depth direction of installation breach, has practiced thrift the inside space of electron device.

Description

Electronic device
Technical Field
The present invention relates to the field of consumer electronics, and more particularly, to an electronic device.
Background
Along with the functions supported by the mobile phone are more and more abundant and various, the types and the number of functional devices required to be set by the mobile phone are more and more, in order to realize the functions of distance detection, ambient light detection, facial 3D feature recognition of a user and the like, functional devices such as a proximity sensor, an ambient light sensor, an infrared camera, a structured light projector and the like need to be configured in the electronic equipment, and in order to arrange numerous functional devices, the mobile phone occupies too much space.
Disclosure of Invention
The embodiment of the invention provides an electronic device.
An electronic device according to an embodiment of the present invention includes:
a housing;
the output module is arranged in the shell and comprises a packaging shell, an infrared light supplementing lamp and a near infrared lamp, the packaging shell comprises a packaging substrate, the infrared light supplementing lamp and the near infrared lamp are packaged in the packaging shell and are borne on the packaging substrate, and the infrared light supplementing lamp and the near infrared lamp can emit infrared light rays to the outside of the packaging shell at different powers;
the main board is arranged in the shell and is provided with an installation notch;
the imaging module is arranged in the shell and corresponds to the installation notch; and
the receiving module is combined on the mainboard, extends into the installation notch from the edge of the installation notch, and partially overlaps with the imaging module along the depth direction of the installation notch, and comprises a proximity sensor and/or a light sensor.
In some embodiments, the output module further includes a chip, and the infrared fill-in light and the near infrared light are formed on one chip.
In some embodiments, the package housing further includes a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, a light supplement window and an access window are formed at the package top, the light supplement window corresponds to the infrared light supplement lamp, and the access window corresponds to the infrared light approaching lamp.
In some embodiments, the output module further includes a light supplement lamp lens, and the light supplement lamp lens is disposed in the package housing and corresponds to the infrared light supplement lamp; and/or
The output module is characterized by further comprising a proximity lamp lens, wherein the proximity lamp lens is arranged in the packaging shell and corresponds to the proximity infrared lamp.
In some embodiments, the output module further comprises a light supplement lamp lens and a proximity lamp lens, the light supplement lamp lens and the proximity lamp lens are arranged in the packaging shell, the light supplement lamp lens corresponds to the infrared light supplement lamp, the proximity lamp lens corresponds to the proximity infrared lamp, and the light supplement lamp lens and the proximity lamp lens are located on the same transparent base body.
In some embodiments, the output module further includes a metal shielding plate, and the metal shielding plate is located in the package housing and located between the infrared fill light and the near infrared light.
In some embodiments, the output module further includes an optical enclosure made of a light-transmissive material, the optical enclosure is formed on the package substrate and located in the package housing, and the optical enclosure encloses the infrared fill light and the proximity infrared light.
In some embodiments, the output module further comprises a light-emitting partition plate, wherein the light-emitting partition plate is formed in the optical enclosure and is located between the infrared light supplement lamp and the near infrared lamp.
In some embodiments, a ground pin, a fill-in light pin, and a proximity light pin are formed on the output module, and when the ground pin and the fill-in light pin are enabled, the infrared fill-in light emits infrared light; the proximity infrared lamp emits infrared light when the ground pin and the proximity lamp pin are enabled.
In some embodiments, the electronic device further includes a light-transmitting cover plate, the housing is provided with a housing approaching through hole and a housing light-supplementing through hole, the approaching infrared lamp corresponds to the housing approaching through hole, the infrared light-supplementing lamp corresponds to the housing light-supplementing through hole, and the cover plate is disposed on the housing.
In some embodiments, the electronic device further includes a light-transmitting cover plate, the casing is provided with a casing approach through hole and a casing light supplement through hole, the approach infrared lamp corresponds to the casing approach through hole, the infrared light supplement lamp corresponds to the casing light supplement through hole, the cover plate is arranged on the casing, infrared transmission ink only transmitting infrared light is formed on the surface of the cover plate combined with the casing, and the infrared transmission ink shields the casing approach through hole and at least one of the casing light supplement through holes.
In some embodiments, the imaging module comprises at least one of a visible light camera and an infrared light camera.
In some embodiments, the imaging module includes an infrared camera and a visible light camera, the electronic device further includes a receiver and a structured light projector, centers of the output module, the infrared camera, the visible light camera, the receiver and the structured light projector are located on a same line segment, and the following are sequentially performed from one end to the other end of the line segment:
the output module, the structured light projector, the receiver, the infrared camera and the visible light camera; or
The output module, the infrared camera, the telephone receiver, the visible light camera and the structured light projector; or
The infrared camera, the output module, the telephone receiver, the visible light camera and the structured light projector; or
The infrared camera, the visible light camera, the telephone receiver, the output module and the structured light projector.
In some embodiments, the imaging module includes an infrared camera and a visible light camera, the electronic device further includes a receiver, a structured light projector and a transparent cover plate, the cover plate is disposed on the housing, the housing has a housing sound outlet, the cover plate has a cover plate sound outlet, the receiver corresponds to the cover plate sound outlet and the housing sound outlet, the output module, the infrared camera, the visible light camera and the structured light projector are located on the same line segment, and the receiver is located between the line segment and the top of the housing.
In the electronic device of the embodiment of the invention, the output module integrates the infrared light supplement lamp and the near infrared lamp into a single packaging body structure, and integrates the functions of transmitting infrared light for infrared distance measurement and infrared light supplement, so that the output module has high integration level and small volume, and saves the space for realizing the functions of infrared light supplement and infrared distance measurement. In addition, because the infrared light supplement lamp and the near infrared lamp are borne on the same packaging substrate, compared with the infrared light supplement lamp and the near infrared lamp in the traditional process, the infrared light supplement lamp and the near infrared lamp need to be manufactured by different wafers respectively and then are combined on a PCB substrate for packaging, and the packaging efficiency is improved. Moreover, because imaging module and receiving module partially overlap on the depth direction of installation breach, receiving module and imaging module set up compacter, and the horizontal space that the two occupy jointly is less, has practiced thrift the inside space of electron device.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the invention;
fig. 2 is a schematic perspective view of an output module of an electronic device according to an embodiment of the invention;
FIG. 3 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the invention;
FIG. 4 is a schematic perspective view of an output module of an electronic device according to an embodiment of the invention;
FIG. 5 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the invention;
fig. 6 is a schematic perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the invention;
FIG. 7 is a schematic diagram of an arrangement of electronic components of an electronic device according to an embodiment of the invention;
FIG. 8 is a schematic cross-sectional view of an output module according to another embodiment of the present invention;
FIG. 9 is a perspective view of a proximity sensor and an imaging module according to an embodiment of the present invention;
FIG. 10 is a schematic structural diagram of an electronic device according to another embodiment of the invention;
FIG. 11 is a schematic partial cross-sectional view of an electronic device in accordance with another embodiment of the invention;
FIG. 12 is a schematic partial cross-sectional view of an electronic device in accordance with yet another embodiment of the invention;
fig. 13 is a schematic perspective view of a receiving module and an imaging module according to another embodiment of the invention;
fig. 14 to 21 are schematic perspective views of a receiving module and an imaging module of an electronic device according to an embodiment of the invention;
fig. 22 is a schematic perspective view of a receiving module, an imaging module and a main board of an electronic device according to an embodiment of the invention; and
fig. 23 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the invention.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.
In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1, an electronic device 100 according to an embodiment of the invention includes a housing 20, a cover 30, and electronic components. The electronic components include an output module 10, a receiving module 50 (see fig. 6), an imaging module 60 (see fig. 6), a receiver 70, and a structured light projector 80. The electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, an intelligent watch, an intelligent bracelet, a teller machine, and the like, and the embodiment of the invention is described by taking the electronic device 100 as a mobile phone, it is understood that the specific form of the electronic device 100 may be other, and is not limited herein.
Referring to fig. 2 and 3, the output module 10 is a single package structure, and includes a package housing 11, an infrared fill-in lamp 12, and a proximity infrared lamp 13.
The packaging shell 11 is used for packaging the infrared light supplement lamp 12 and the proximity infrared lamp 13 at the same time, or the infrared light supplement lamp 12 and the proximity infrared lamp 13 are packaged in the packaging shell 11 at the same time. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an Electromagnetic Interference (EMI) shielding material to prevent external EMI from affecting the output module 10.
The package substrate 111 is used for carrying the infrared fill light 12 and the proximity infrared light 13. When the output module 10 is manufactured, the infrared fill-in light 12 and the proximity infrared light 13 may be formed on one chip 14, and then the infrared fill-in light 12, the proximity infrared light 13, and the chip 14 are disposed on the package substrate 111 together, specifically, the chip 14 may be bonded on the package substrate 111. Meanwhile, the package substrate 111 may also be used to connect with other components of the electronic device 100 (e.g., the housing 20 of the electronic device 100, the main board 110 (as shown in fig. 22), etc.) so as to fix the output module 10 in the electronic device 100.
The packaging sidewall 112 can surround the infrared fill light 12 and the proximity infrared light 13, the packaging sidewall 112 extends from the packaging substrate 111, the packaging sidewall 112 can be combined with the packaging substrate 111, and preferably, the packaging sidewall 112 and the packaging substrate 111 are detachably connected, so that the infrared fill light 12 and the proximity infrared light 13 can be conveniently overhauled after the packaging sidewall 112 is taken down. The package sidewall 112 may be made of a material opaque to infrared light to prevent infrared light emitted from the infrared fill light 12 or the near infrared light 13 from passing through the package sidewall 112.
The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. A light supplement window 1131 and a proximity window 1132 are formed in the top 113 of the package, the light supplement window 1131 corresponds to the infrared light supplement lamp 12, and infrared light emitted by the infrared light supplement lamp 12 passes through the light supplement window 1131; the proximity window 1132 corresponds to the proximity infrared lamp 13, and infrared light emitted from the proximity infrared lamp 13 passes out of the proximity window 1132. The package top 113 and the package side wall 112 may be formed integrally or separately. In one example, the fill window 1131 and the proximity window 1132 are through holes, and the package top 113 is made of an infrared opaque material. In another example, the package top 113 is made of an infrared opaque material and an infrared opaque material, specifically, the fill light window 1131 and the proximity window 1132 are made of an infrared opaque material, and the rest of the package top is made of an infrared opaque material, further, the fill light window 1131 and the proximity window 1132 may be formed with a lens structure to improve the emission angle of infrared light emitted from the fill light window 1131 and the proximity window 1132, for example, the fill light window 1131 is formed with a concave lens structure to diffuse light passing through the fill light window 1131 to be emitted outward; the proximity window 1132 is formed with a convex lens structure to focus light passing through the proximity window 1132 to be emitted outward.
The infrared light supplement lamp 12 and the proximity infrared lamp 13 can be formed on one chip 14, so that the size of the infrared light supplement lamp 12 and the proximity infrared lamp 13 after integration is further reduced, and the preparation process is simple. The infrared fill-in light 12 can emit infrared light, the infrared light passes through the fill-in light window 1131 to project onto the surface of the object, and the infrared camera 62 (as shown in fig. 1) of the electronic device 100 receives the infrared light reflected by the object to obtain image information of the object (at this time, the infrared fill-in light 12 is used for infrared fill-in light). The proximity infrared lamp 13 may emit infrared light, which passes through the proximity window 1132 and reaches the surface of the object, and the proximity sensor 51 (shown in fig. 6) of the electronic device 100 receives the infrared light reflected by the object to detect the distance of the object to the electronic device 100 (at this time, the proximity infrared lamp 13 is used for infrared ranging).
The infrared light supplementing lamp 12 and the near infrared lamp 13 can emit infrared light to the outside of the packaging shell 11 at different powers, specifically, the infrared light supplementing lamp 12 and the near infrared lamp 13 can emit infrared light simultaneously, and the output module 10 is used for infrared light supplementing and infrared distance measurement simultaneously; or the infrared light supplement lamp 12 can emit light and does not emit light close to the infrared lamp 13, and the output module 10 is only used for infrared light supplement; also can infrared light filling lamp 12 not launch light and be close infrared lamp 13 launch light, output module 10 is only used for infrared range finding. Referring to fig. 4, in the embodiment of the invention, a ground pin 15, a fill light pin 16 and a proximity light pin 17 are formed on the output module 10. The ground pin 15, the fill-in lamp pin 16, and the proximity lamp pin 17 may be formed on the package substrate 111, and when the ground pin 15 and the fill-in lamp pin 16 are enabled (i.e., when the ground pin 15 and the fill-in lamp pin 16 are connected to the circuit, the infrared fill-in lamp 12 emits infrared light; when the ground pin 15 and the proximity lamp pin 17 are enabled (i.e., when the ground pin 15 and the proximity lamp pin 17 access circuit are on), the proximity infrared lamp 13 emits infrared light.
Referring to fig. 1 and 5, the housing 20 may serve as a mounting carrier for the output module 10, or the output module 10 may be disposed in the housing 20. The housing 20 may be a housing of the electronic device 100, in the embodiment of the present invention, the housing 20 may further be used to dispose the display screen 90 of the electronic device 100, and since the output module 10 according to the embodiment of the present invention may occupy a smaller volume, the volume for disposing the display screen 90 in the housing 20 may be correspondingly increased, so as to increase the screen occupation ratio of the electronic device 100. Specifically, the housing 20 includes a top 21 and a bottom 22, the display screen 90 and the output module 10 are disposed between the top 21 and the bottom 22, and the top 21 is located above the bottom 22 in a state that the user normally uses the electronic device 100, as shown in fig. 1, and the output module 10 may be disposed between the display screen 90 and the top 21. In other embodiments, the display screen 90 may be a full screen with a gap, the display screen 90 surrounds the output module 10, and the output module 10 is exposed from the gap of the display screen 90.
The casing 20 is further provided with a casing approach through hole 23 and a casing supplementary lighting through hole 24. When the output module 10 is disposed in the housing 20, the proximity infrared lamp 13 corresponds to the housing proximity through hole 23, and the infrared light supplement lamp 12 corresponds to the housing light supplement through hole 24. The light emitted by the near infrared lamp 13 corresponding to the case near through hole 23 can pass through the case near through hole 23, specifically, the near infrared lamp 13 is opposite to the case near through hole 23, or the light emitted by the near infrared lamp 13 passes through the case near through hole 23 after being acted by the light guide element. The infrared light supplement lamp 12 corresponds to the chassis light supplement through hole 24, and the description thereof is omitted. In the embodiment shown in fig. 5, the chassis approach through hole 23 and the chassis fill light through hole 24 may be spaced apart from each other, and in other embodiments, the chassis approach through hole 23 and the chassis fill light through hole 24 may also be communicated with each other.
The cover plate 30 may be light-transmissive, and the material of the cover plate 30 may be light-transmissive glass, resin, plastic, or the like. The cover plate 30 is disposed on the chassis 20, the cover plate 30 includes an inner surface 32 combined with the chassis 20, and an outer surface 31 opposite to the inner surface 32, and the light emitted from the output module 10 sequentially passes through the inner surface 32 and the outer surface 31 and then passes through the cover plate 30. In the embodiment shown in fig. 5, the cover plate 30 covers the chassis fill-in through hole 24 and the chassis approach through hole 23, the inner surface 32 of the cover plate 30 is coated with the infrared transmissive ink 40, and the infrared transmissive ink 40 has a high transmittance to infrared light, for example, 85% or more, and a high attenuation to visible light, for example, 70% or more, so that a user can hardly see an area of the electronic device 100 covered by the infrared transmissive ink 40 with naked eyes in normal use. Specifically, infrared-transmissive ink 40 may cover areas of inner surface 32 that do not correspond to display 90.
The infrared transmissive ink 40 may further shield at least one of the chassis approach through hole 23 and the chassis light supplement through hole 24, that is, the infrared transmissive ink 40 may simultaneously shield the chassis approach through hole 23 and the chassis light supplement through hole 24 (as shown in fig. 5), so that a user is difficult to see the internal structure of the electronic device 100 through the chassis approach through hole 23 and the chassis light supplement through hole 24, and the electronic device 100 has a more beautiful appearance; the infrared transmission ink 40 can also cover the case access through hole 23 and does not cover the case light supplement through hole 24; or the infrared transparent ink 40 can cover the chassis light supplement through hole 24 and uncover the chassis approach through hole 23.
Referring to fig. 6, the receiving module 50 is integrated with a proximity sensor 51 and a light sensor 52, and the proximity sensor 51 and the light sensor 52 together form a single package. The infrared light emitted from the proximity infrared lamp 13 is reflected by the external object and then received by the proximity sensor 51, and the proximity sensor 51 determines the distance between the external object and the electronic device 100 according to the received reflected infrared light. The light sensor 52 receives the visible light in the ambient light and detects the intensity of the visible light as a basis for controlling the display brightness of the display 90. The proximity sensor 51 and the optical sensor 52 are packaged together to form the receiving module 50, so that the gap between the two modules during independent assembly is reduced, and the installation space in the electronic device 100 is saved.
Referring to fig. 1 and 6, the imaging module 60 may be one or both of a visible light camera 61 and an infrared camera 62. The imaging module 60 includes a lens mount 63, a lens barrel 64, and an image sensor 65. The lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63. The mirror base 63 includes a mounting surface 631, and the mounting surface 631 is located between the lens barrel 64 and the image sensor 65. In the embodiment shown in fig. 6, the receiving module 50 is disposed on the mounting surface 631, and specifically, the receiving module 50 at least partially falls onto the mounting surface 631 in the orthogonal projection of the plane where the mounting surface 631 is located, so that the receiving module 50 and the imaging module 60 are disposed compactly, and the lateral space occupied by the two modules is small.
Referring to fig. 1, the receiver 70 is used for sending out an acoustic signal when being excited by a power supply, and a user can talk through the receiver 70. The structured light projector 80 is configured to emit structured light outwards, the structured light is reflected after being projected onto the object to be measured, the reflected structured light can be received by the infrared camera 62, and the processor of the electronic device 100 further analyzes the structured light received by the infrared camera 62 to obtain depth information of the object to be measured.
In the embodiment shown in fig. 1, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, and the centers of the output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70 and the structured light projector 80 are located on the same line segment. Specifically, the output module 10, the structured light projector 80, the receiver 70, the infrared camera 62 and the visible light camera 61 (as shown in fig. 7) are sequentially arranged from one end to the other end of the line segment; or the output module 10, the infrared camera 62, the receiver 70, the visible light camera 61 and the structured light projector 80 (as shown in fig. 1) are sequentially arranged from one end of the line segment to the other end; or the infrared camera 62, the output module 10, the receiver 70, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the visible light camera 61, the receiver 70, the output module 10 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment. Of course, the arrangement of the output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above example, and may be other shapes such as a shape in which the centers of the respective electronic components are arranged in a circular arc shape and a shape in which the centers are arranged in a rectangular shape.
Further, referring to fig. 6, the receiving module 50 may be disposed on the mounting surface 631 of the infrared camera 62, or may be disposed on the mounting surface 631 of the visible light camera 61, of course, the receiving module 50 may not be disposed on the mounting surface 631, the receiving module 50 may be disposed adjacent to the output module 10, and the proximity sensor 51 is easy to receive the infrared light emitted by the proximity infrared lamp 13 and reflected by the external object; the receiving module 50 can also be disposed adjacent to the receiver 70, and when the user answers the phone, the proximity sensor 51 can easily detect that the user's ear is close to the receiver 70.
In summary, in the electronic device 100 according to the embodiment of the invention, the output module 10 integrates the infrared light supplement lamp 12 and the proximity infrared lamp 13 into a single package structure, and integrates the functions of emitting infrared light for infrared distance measurement and infrared light supplement, so that the output module 10 has a higher integration level and a smaller volume, and the output module 10 saves space for realizing the functions of infrared light supplement and infrared distance measurement. In addition, because the infrared light supplement lamp 12 and the proximity infrared lamp 13 are supported on the same packaging substrate 111, compared with the infrared light supplement lamp 12 and the proximity infrared lamp 13 in the conventional process, which need to be manufactured by different wafers and then packaged on a PCB substrate, the packaging efficiency is improved.
Referring to fig. 3, in some embodiments, the output module 10 further includes a fill-in lamp lens 18 and a proximity lamp lens 19. The fill light lens 18 is disposed in the package housing 11 and corresponds to the infrared fill light 12. The proximity lamp lens 19 is provided inside the package case 11 and corresponds to the proximity infrared lamp 13. The infrared light emitted by the infrared fill light 12 is focused into the fill light window 1131 under the action of the fill light lens 18 to be emitted, so as to reduce the amount of light emitted to other areas of the package sidewall 112 and the package top 113. Similarly, the infrared light emitted from the proximity infrared lamp 13 is focused by the proximity lamp lens 19 into the proximity window 1132 and emitted, reducing the amount of light emitted to other areas of the package sidewall 112 and package top 113. Specifically, the fill-in lamp lens 18 and the proximity lamp lens 19 may be located on the same transparent substrate, and more specifically, the fill-in lamp lens 18 and the proximity lamp lens 19 may be integrally formed with the transparent substrate. Of course, the output module 10 may be provided with only one of the light supplement lamp lens 18 and the proximity lamp lens 19, or may not be provided with the light supplement lamp lens 18 and the proximity lamp lens 19.
Referring to fig. 3, in some embodiments, the output module 10 further includes a metal shielding plate 1a, the metal shielding plate 1a is located in the package housing 11, and the metal shielding plate 1a is located between the infrared fill-in light 12 and the near infrared light 13. Metal shielding plate 1a is located infrared light filling lamp 12 and is close between infrared lamp 13, metal shielding plate 1a can shield infrared light filling lamp 12 and is close infrared lamp 13 electromagnetic interference each other on the one hand, infrared light filling lamp 12 can not influence each other with the luminous intensity and the chronogenesis that are close infrared lamp 13, on the other hand metal shielding plate 1a can be used for isolated infrared light filling lamp 12 place cavity and the cavity that is close infrared lamp 13 place, light can not get into another cavity from a cavity.
Referring to fig. 8, in some embodiments, the output module 10 further includes an optical enclosure 1 b. The optical enclosure 1b is made of a light-transmissive material, and the optical enclosure 1b is formed on the package substrate 111 and located inside the package case 11. The optical enclosure 1b encloses the infrared fill light 12 and the proximity infrared light 13. Specifically, optics sealing cover 1b can form through encapsulating injection molding process, and optics sealing cover 1b can adopt transparent thermosetting epoxy to make to in use is difficult for softening, and optics sealing cover 1b can fix infrared light filling lamp 12 and be close the relative position between infrared lamp 13, and makes infrared light filling lamp 12 and be close infrared lamp 13 and be difficult for rocking in encapsulation casing 11.
In addition, referring to fig. 8, the output module 10 further includes a light-emitting partition plate 1c, and the light-emitting partition plate 1c is formed in the optical enclosure 1b and located between the infrared fill light 12 and the near infrared light 13. The light-emitting partition board 1c can be used for separating the infrared light supplement lamp 12 from the near infrared lamp 13, light emitted by the infrared light supplement lamp 12 cannot penetrate out of the near window 1132, and light emitted by the near infrared lamp 13 cannot penetrate out of the light supplement window 1131.
Referring to fig. 9, in some embodiments, the proximity sensor 51 and the optical sensor 52 may not be integrated in the receiving module 50, or the proximity sensor 51 and the optical sensor 52 are separately disposed. At this time, the proximity sensor 51 may be provided on the mounting surface 631 of the mirror base 63; the light sensor 52 may also be disposed on the mounting surface 631 of the mirror base 63; or the proximity sensor 51 is provided on the mounting surface 631 of the mirror base 63 together with the optical sensor 52. The lens mount 63 can be the lens mount 63 of the infrared camera 62, and can also be the lens mount 63 of the visible camera 61.
Referring to fig. 10, in some embodiments, the housing 20 further has a housing sound outlet (not shown), the cover 30 further has a cover sound outlet 35, and the receiver 70 corresponds to the positions of the cover sound outlet 35 and the housing sound outlet. The centers of the output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the housing 20.
The center of the receiver 70 is not located on the line segment, so that the lateral space occupied by each electronic component (the output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, and the like) on the cover plate 30 is saved. In the embodiment shown in fig. 10, the cover sound outlet 35 is opened at the edge of the cover 30, and the case sound outlet is opened near the top 21.
Referring to fig. 11, in some embodiments, the cover plate 30 may further have a cover plate light supplement through hole 34, the cover plate light supplement through hole 34 corresponds to the chassis light supplement through hole 24, and the infrared light emitted by the infrared light supplement lamp 12 passes through the chassis light supplement through hole 24 and then passes through the electronic device 100 from the cover plate light supplement through hole 34. In this case, the infrared transmitting ink 40 may be provided on the cover 30 at a position corresponding to the chassis approach through hole 23, so that the user cannot easily see the approach infrared lamp 13 inside the electronic device 100 through the chassis approach through hole 23, and the electronic device 100 has a good appearance.
Referring to fig. 12, in some embodiments, the cover 30 may further include a cover approaching through hole 33, the cover approaching through hole 33 corresponds to the chassis approaching through hole 23, and the infrared light emitted by the approaching infrared lamp 13 passes through the chassis approaching through hole 23 and then passes through the cover approaching through hole 33 to the electronic device 100. At this time, the infrared transmissive ink 40 may be disposed at a position on the cover plate 30 corresponding to the chassis light supplement through hole 24, so that the user is difficult to see the infrared light supplement lamp 12 inside the electronic device 100 through the chassis light supplement through hole 24, and the electronic device 100 has a beautiful appearance.
Referring to fig. 13, in some embodiments, the imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the receiving module 50 can be further fixed on the substrate 66. Specifically, the substrate 66 is provided with an FPC, a portion of the substrate 66 is located in the mirror base 63, another portion of the substrate extends out of the mirror base 63, one end of the FPC is located in the mirror base 63 and is used for bearing the image sensor 65, and the other end of the FPC can be connected with the main board 110 of the electronic device 100. When the receiving module 50 is disposed on the substrate 66, the receiving module 50 is disposed outside the lens holder 63, and the receiving module 50 may be connected to an FPC.
Further, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52, and the proximity sensor 51 and the light sensor 52 together form a single package structure, so that a gap between the two when they are separately assembled is reduced, and an installation space in the electronic device 100 is saved. In other embodiments, the receiving module 50 disposed on the substrate 66 includes the proximity sensor 51 and/or the light sensor 52, and each of the proximity sensor 51 and the light sensor 52 is a single package structure. That is, the proximity sensor 51 in which the receiving module 50 provided on the substrate 66 has a single package structure; alternatively, the photo sensor 52 with a single package structure is disposed on the receiving module 50 of the substrate 66; alternatively, the receiving module 50 disposed on the substrate 66 is a proximity sensor 51 of a single package structure and a photosensor 52 of a single package structure.
The imaging module 60 may be one or two of a visible light camera 61 and an infrared light camera 62. Specifically, the receiving module 50 may be fixed on the substrate 66 of the visible light camera 61; the receiving module 50 may be fixed on the substrate 66 of the infrared camera 62. When the proximity sensor 51 and the optical sensor 52 are separately packaged, the proximity sensor 51 may be fixed on the substrate 66 of the visible light camera 61, and the optical sensor 52 may be fixed on the substrate 66 of the infrared light camera 62; alternatively, the photosensor 52 may be fixed on the substrate 66 of the visible light camera 61, and the proximity sensor 51 may be fixed on the substrate 66 of the infrared light camera 62; alternatively, the proximity sensor 51 and the optical sensor 52 are both fixed on the substrate 66 of the visible light camera 61; alternatively, the proximity sensor 51 and the optical sensor 52 are both fixed to the substrate 66 of the infrared camera 62.
Further, the substrate 66 further includes a reinforcing plate disposed on a side opposite to the receiving module 50 to increase the overall strength of the substrate 66, so that the FPC is not prone to being folded, and the receiving module 50 (or the proximity sensor 51 or the light sensor 52) is not prone to shaking when disposed on the substrate 66. In one example, the receiving module 50 (or the proximity sensor 51 or the optical sensor 52) may also be fixed on the outer sidewall of the mirror base 63, for example, by bonding.
Referring to fig. 14, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 includes an image sensor 65, a camera housing 67 and a lens module 68. The top surface 670 of the camera housing 67 is a stepped surface, the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672 and a third sub-top surface 673, the second sub-top surface 672 is connected to the first sub-top surface 671 in an inclined manner and forms a notch 675 with the first sub-top surface 671, the third sub-top surface 673 is connected to the second sub-top surface 672 in an inclined manner, and the second sub-top surface 672 is located between the first sub-top surface 671 and the third sub-top surface 673 to connect the first sub-top surface 671 and the third sub-top surface 673. The angle between the second sub top surface 672 and the first sub top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub top surface 672 and the third sub top surface 673 may be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The third sub-top surface 673 is provided with a light-emitting through hole 674, and the lens module 68 is accommodated in the camera housing 67 and corresponds to the light-emitting through hole 674. The image sensor 65 is accommodated in the camera housing 67 and corresponds to the lens module 68, light outside the electronic device 100 can pass through the light-out hole 674 and the lens module 68 and be transmitted to the image sensor 65, and the image sensor 65 converts an optical signal into an electrical signal. The receiving module 50 is disposed at the first sub-top surface 671, and the receiving module 50 includes a proximity sensor 51 and a photosensor 52. In the present embodiment, the imaging module 60 may be a visible light camera 61, and the receiving module 50 is a single package formed by the proximity sensor 51 and the optical sensor 52. The direction of the center line connecting the proximity sensor 51 and the light sensor 52 may coincide with the extending direction of the slit 675 (as shown in fig. 14); alternatively, the direction of the central line connecting the proximity sensor 51 and the optical sensor 52 may be perpendicular to the extending direction of the slit 675 or an included angle formed by the two may be an acute angle or an obtuse angle. In other embodiments, the imaging module 60 may be an infrared camera 62.
The imaging module 60 of the present embodiment has a notch 675, and the receiving module 50 is disposed on the first sub-top surface 671, so that the receiving module 50 and the imaging module 60 are disposed compactly, and the two occupy a smaller lateral space, thereby saving the installation space in the electronic device 100; meanwhile, the proximity sensor 51 and the optical sensor 52 are packaged together to form the receiving module 50, so that the gap between the proximity sensor 51 and the optical sensor when the proximity sensor and the optical sensor are independently assembled is reduced, and the installation space in the electronic device 100 is saved.
With reference to fig. 14, in some embodiments, the receiving module 50 of the above embodiments is disposed on the first sub-top surface 671 and located outside the camera housing 67, and specifically, a projection of the entire receiving module 50 along a direction perpendicular to the first sub-top surface 671 may be located inside the first sub-top surface 671 (as shown in fig. 14); alternatively, a part of the receiving module 50 is located in the first sub-top surface 671 along a projection perpendicular to the first sub-top surface 671. That is, at least a portion of the receiving module 50 is located directly above the first sub-top surface 671, so that the receiving module 50 and the imaging module 60 are disposed compactly, and the occupied lateral space is small, thereby further saving the installation space in the electronic device 100. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the optical sensor 52, but the proximity sensor 51 and the optical sensor 52 are two separate single packages, and in this case, the proximity sensor 51 and the optical sensor 52, which are each a single package, may also be both disposed on the first sub-top surface 671.
Referring to fig. 15, in some embodiments, the receiving module 50 of the above embodiments only includes the proximity sensor 51 and does not include the optical sensor 52, in this case, the proximity sensor 51 (or the receiving module 50) and the optical sensor 52 are respectively of a single package structure, the proximity sensor 51 is disposed on the first sub-top surface 671, and the optical sensor 52 is disposed at any other position except the first sub-top surface 671.
Referring to fig. 15, in some embodiments, the receiving module 50 of the above embodiments only includes the optical sensor 52 and does not include the proximity sensor 51, in which case, the optical sensor 52 (or the receiving module 50) and the proximity sensor 51 are each a single package structure, the optical sensor 52 is disposed on the first sub-top surface 671, and the proximity sensor 51 is disposed at any other position except for the first sub-top surface 671.
Referring to fig. 16, the first sub-top surface 671 of the above embodiment is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 includes only the proximity sensor 51 without the photosensor 52, and the photosensor 52 is disposed outside the camera housing 67, the number of the light-transmitting holes 676 may be one, and light outside the electronic device 100 can pass through the light-transmitting holes 676 and be transmitted to the proximity sensor 51. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.
Referring to fig. 16, the first sub-top surface 671 of the above embodiment is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 includes only the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of the light holes 676 may be one, and light outside the electronic device 100 can pass through the light holes 676 and be transmitted to the light sensor 52. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.
Referring to fig. 17, in some embodiments, the first sub-top surface 671 of the above embodiments is formed with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 integrates the proximity sensor 51 and the light sensor 52, the light hole 676 can be one light hole corresponding to both the proximity sensor 51 and the light sensor 52 or two light holes spaced apart from each other and corresponding to the proximity sensor 51 and the light sensor 52, respectively, and light outside the electronic device 100 can pass through the light hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single packages, and in this case, the proximity sensor 51 and the light sensor 52, which are each a single package, may be both disposed in the camera housing 67 and correspond to the light transmission hole 676. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.
Referring to fig. 17, in some embodiments, the first sub-top surface 671 of the above embodiments is formed with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the receiving module 50 can be fixed on the substrate 66 and accommodated in the camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to the main board 110 of the electronic device 100. In other embodiments, the receiving module 50 may be connected to an FPC. In this embodiment, the receiving module 50 disposed on the substrate 66 includes the proximity sensor 51 and the light sensor 52, and the proximity sensor 51 and the light sensor 52 together form a single package structure, so as to reduce a gap between the two when they are separately assembled, and save an installation space in the electronic device 100.
In other embodiments, the receiving module 50 only includes the proximity sensor 51, and the optical sensor 52 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the proximity sensor 51, the optical sensor 52 is also a single package structure, and the optical sensor 52 can be fixed on the substrate 66 and accommodated in the camera housing 67; alternatively, when a part of the substrate 66 is located inside the camera housing 67 and another part thereof protrudes from the camera housing 67, the light sensor 52 may be fixed to the substrate 66 and located outside the camera housing 67.
In another embodiment, the receiving module 50 only includes the optical sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the optical sensor 52, the proximity sensor 51 is also a single package structure, and the proximity sensor 51 can be fixed on the substrate 66 and accommodated in the camera housing 67; alternatively, when a part of the base plate 66 is located inside the camera housing 67 and another part thereof protrudes from the camera housing 67, the proximity sensor 51 may be fixed to the base plate 66 and located outside the camera housing 67.
The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20; meanwhile, the imaging module 60 sets the substrate 66 and sets the receiving module 50 on the substrate 66, so that the receiving module 50 can be stably installed in the camera housing 67.
Referring to fig. 18, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 is a dual-camera module, and includes two image sensors 65, a camera housing 67, and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 lower than the first step surface 677, and a first connection surface 679 a. The first connecting surface 679a is obliquely connected with the second tread 678 and forms a notch 675 with the second tread 678, the first connecting surface 679a is obliquely connected with the first tread 677, and the first connecting surface 679a is positioned between the first tread 677 and the second tread 678 to connect the first tread 677 with the second tread 678. The included angle between the first connecting surface 679a and the first tread 677 can be an obtuse angle or a right angle, and the included angle between the first connecting surface 679a and the second tread 678 can be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The two light-emitting through holes 674 are arranged on the first ladder surface 677 and are located on the same side of the cut 675, and a central connecting line of the two light-emitting through holes 674 is perpendicular to the extending direction of the cut 675. The two lens modules 68 are accommodated in the camera housing 67 and respectively correspond to the two light-emitting through holes 674, the two image sensors 65 are accommodated in the camera housing 67 and respectively correspond to the two lens modules 68, and light outside the electronic device 100 can pass through the light-emitting through holes 674 and the lens modules 68 and is transmitted to the image sensors 65. In the present embodiment, the imaging module 60 can be a visible light camera 61, and at this time, both the two lens modules 68 are lens modules corresponding to the visible light camera 61. The receiving module 50 is disposed on the second step face 678 and is located outside the camera housing 67. The receiving module 50 is a single package formed by the proximity sensor 51 and the optical sensor 52. The direction of the central line connecting the proximity sensor 51 and the light sensor 52 may coincide with the extending direction of the slit 675; alternatively, the direction of the center line connecting the proximity sensor 51 and the optical sensor 52 may be perpendicular to the extending direction of the slit 675 (as shown in fig. 18) or an acute angle or an obtuse angle. In other embodiments, the imaging module 60 may be an infrared camera 62, and both of the lens modules 68 correspond to the infrared camera 62. In another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared camera 62, and in this case, one of the lens modules 68 is a lens module corresponding to the infrared camera 62, and the other lens module 68 is a lens module corresponding to the visible light camera 61.
The imaging module 60 of the present embodiment has a notch 675, and the receiving module 50 is disposed on the second step surface 678, so that the receiving module 50 and the imaging module 60 are disposed compactly, and the two occupy a smaller lateral space, thereby saving the installation space in the electronic device 100; meanwhile, the proximity sensor 51 and the optical sensor 52 are packaged together to form the receiving module 50, so that the gap between the proximity sensor 51 and the optical sensor when the proximity sensor and the optical sensor are independently assembled is reduced, and the installation space in the electronic device 100 is saved.
Referring to fig. 19, in some embodiments, the cut 675 of the above embodiments is formed in the middle of the top surface 670, the first tread 677 is divided into a first sub-tread 677a and a second sub-tread 677b by the cut 675, the first sub-tread 677a and the second sub-tread 677b are respectively located on two opposite sides of the cut 675, two light-exiting through holes 674 are respectively formed in the first sub-tread 677a and the second sub-tread 677b, and the lens modules 68 mounted in the camera housing 67 are also located on two opposite sides of the cut 675. At this time, the cutout 675 is defined by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b, the first connecting surface 679a connects the first sub top surface 677a and the second step surface 678 obliquely and is located between the first sub top surface 677a and the second step surface 678, and the second connecting surface 679b connects the second sub top surface 677b and the second step surface 678 obliquely and is located between the second sub top surface 677b and the second step surface 678. In this embodiment, the first terraced surface 677 is parallel to the second terraced surface 678, an included angle between the first connection surface 679a and the first sub terraced surface 677a is an obtuse angle, and an included angle between the second connection surface 679b and the second sub terraced surface 677b is an obtuse angle. In other embodiments, the first connection surface 679a and the first sub-step surface 677a form a right angle, and the second connection surface 679b and the second sub-step surface 677b form a right angle. The cutout 675 of the present embodiment is opened at the middle position of the top surface 670, relative to the cutout 675 opened at the edge position of the top surface 670, so that the width of the cutout 675 is wider, thereby facilitating the positioning of the receiving module 50 on the second tread 678.
Referring to fig. 18 and 19, in some embodiments, the receiving module 50 of the above embodiments is disposed on the second step 678 and is located outside the camera housing 67. Specifically, when the cut 675 is opened at the edge of the top surface 670, the projection of the whole receiving module 50 along the direction perpendicular to the second step surface 678 can be located in the second step surface 678; alternatively, a projection of a portion of the receiving module 50 along a direction perpendicular to the second tread 678 is located within the second tread 678 (as shown in fig. 18). That is, at least a portion of the receiving module 50 is located directly above the second step surface 678. When the cutout 675 is opened at the middle position of the top surface 670, the whole receiving module 50 can be located in the second step surface 678 along the projection perpendicular to the second step surface 678 (as shown in fig. 19). Thus, the receiving module 50 and the imaging module 60 are arranged compactly, and the horizontal space occupied by the receiving module and the imaging module is small, so that the installation space in the electronic device 100 is further saved. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single packages, and in this case, the proximity sensor 51 and the light sensor 52, which are each a single package, may also be both disposed on the second step surface 678.
Referring to fig. 19, in some embodiments, the receiving module 50 of the above embodiments only includes the proximity sensor 51, and the receiving module 50 does not include the optical sensor 52, in this case, the proximity sensor 51 (or the receiving module 50) and the optical sensor 52 are respectively a single package structure, the proximity sensor 51 is disposed on the second step surface 678, and the optical sensor 52 is disposed on the housing 20 outside the imaging module 60.
Referring to fig. 19, in some embodiments, the receiving module 50 of the above embodiments only includes the optical sensor 52, and the receiving module 50 does not include the proximity sensor 51, in this case, the optical sensor 52 (or the receiving module 50) and the proximity sensor 51 are respectively a single package structure, the optical sensor 52 is disposed on the second step surface 678, and the proximity sensor 51 is disposed on the housing 20 outside the imaging module 60.
Referring to fig. 20, the second step surface 678 of the above embodiment is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 includes only the proximity sensor 51 without the photosensor 52, and the photosensor 52 is disposed outside the camera housing 67, the number of the light-transmitting holes 676 may be one, and light outside the electronic device 100 can pass through the light-transmitting holes 676 and be transmitted to the proximity sensor 51. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.
Referring to fig. 20, the second step surface 678 of the above embodiment is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 includes only the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of the light holes 676 may be one, and light outside the electronic device 100 can pass through the light holes 676 and be transmitted to the light sensor 52. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.
Referring to fig. 21, in some embodiments, the second step surface 678 of the above embodiments is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 integrates the proximity sensor 51 and the light sensor 52, the light hole 676 can be one light hole corresponding to both the proximity sensor 51 and the light sensor 52 or two light holes spaced apart from each other and corresponding to the proximity sensor 51 and the light sensor 52, respectively, and light outside the electronic device 100 can pass through the light hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single packages, and in this case, the proximity sensor 51 and the light sensor 52, which are each a single package, may be both disposed in the camera housing 67 and correspond to the light transmission hole 676. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.
Referring to fig. 21, in some embodiments, the second step surface 678 of the above embodiments is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the receiving module 50 can be fixed on the substrate 66 and accommodated in the camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to the main board 110 of the electronic device 100. In other embodiments, the receiving module 50 may be connected to an FPC. In this embodiment, the receiving module 50 disposed on the substrate 66 includes the proximity sensor 51 and the light sensor 52, and the proximity sensor 51 and the light sensor 52 together form a single package structure, so as to reduce a gap between the two when they are separately assembled, and save an installation space in the electronic device 100.
In other embodiments, the receiving module 50 only includes the proximity sensor 51, and the optical sensor 52 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the proximity sensor 51, the optical sensor 52 is also a single package structure, and the optical sensor 52 can be fixed on the substrate 66 and accommodated in the camera housing 67; alternatively, when a part of the substrate 66 is located inside the camera housing 67 and another part thereof protrudes from the camera housing 67, the light sensor 52 may be fixed to the substrate 66 and located outside the camera housing 67.
In another embodiment, the receiving module 50 only includes the optical sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the optical sensor 52, the proximity sensor 51 is also a single package structure, and the proximity sensor 51 can be fixed on the substrate 66 and housed in the camera housing 67; alternatively, when a part of the base plate 66 is located inside the camera housing 67 and another part thereof protrudes from the camera housing 67, the proximity sensor 51 may be fixed to the base plate 66 and located outside the camera housing 67.
The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20; meanwhile, the imaging module 60 sets the substrate 66 and sets the receiving module 50 on the substrate 66, so that the receiving module 50 can be stably installed in the camera housing 67.
Referring to fig. 1, 22 and 23, in some embodiments, the electronic device 100 of the above embodiment further includes a main board 110 installed in the housing 20. The main board 110 is formed with a mounting notch 110 a. The imaging module 60 is installed in the housing 20 and corresponds to the installation notch 110 a. The receiving module 50 is coupled to the main board 110 and extends into the mounting notch 110a from an edge of the mounting notch 110 a. The receiving module 50 partially overlaps the imaging module 60 in the depth direction (Z direction in fig. 22) of the mounting notch 110 a.
Specifically, the main board 110 may be a printed circuit board, the printed circuit board may be a hard board, a soft board, or a hard and soft board, and electronic components, such as the output module 10, the receiving module 50, the imaging module 60, the receiver 70, the structured light projector 80, and the like, may be connected to the main board 110, and the electronic components may be directly mounted on the main board 110, or may be mounted on other structures of the electronic device 100, and then connected to the main board 110 through a line. The mounting notch 110a is formed on the main board 110, and the mounting notch 110a may penetrate the main board 110. The imaging module 60 is installed in the housing 20 and corresponds to the installation notch 110a, and the imaging module 60 may penetrate through the installation notch 110 a; it is also possible that the light inlet hole of the imaging module 60 (in some embodiments, the light inlet hole corresponds to the light outlet through hole 674 described above) is aligned with the mounting notch 110a, but does not penetrate into the mounting notch 110 a.
The receiving module 50 is bonded to the main board 110, and specifically, the pins of the receiving module 50 may be soldered to the pads of the main board 110, so that the receiving module 50 is fixedly connected to the main board 110. The receiving module 50 extends into the mounting notch 110a from the edge of the mounting notch 110a, saving the mounting position on the main board 110. In the depth direction (e.g., Z direction in fig. 23) of the mounting notch 110a, the receiving module 50 partially overlaps the imaging module 60, the receiving module 50 can contact the imaging module 60, and the receiving module 50 can be spaced apart from the imaging module 60. The receiving module 50 and the imaging module 60 are arranged compactly, and the horizontal space (the direction perpendicular to the Z direction) occupied by the receiving module and the imaging module is small, so that the space inside the electronic device 100 is saved.
Of course, the receiving module 50 may be integrated with the proximity sensor 51 and the light sensor 52; the receiving module 50 may also include the proximity sensor 51 alone; the receiving module 50 may also include the optical sensor 52 alone. The imaging module 60 may also be the imaging module 60 of any of the above embodiments and its variants, which are not described herein again.
In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.

Claims (11)

1. An electronic device, comprising:
a housing;
the output module is of a single packaging body structure and comprises a packaging shell, an infrared light supplement lamp, a near infrared lamp, a chip, a metal shielding plate, a light supplement lamp lens and a near lamp lens, wherein the packaging shell comprises a packaging substrate, the infrared light supplement lamp and the near infrared lamp are packaged in the packaging shell and are borne on the packaging substrate, the light supplement lamp lens corresponds to the infrared light supplement lamp, the near lamp lens corresponds to the near infrared lamp, and the light supplement lamp lens and the near lamp lens are positioned on the same transparent substrate, wherein the infrared light supplement lamp and the near infrared lamp are formed on one chip, and the infrared light supplement lamp, the near infrared lamp and the chip are arranged on the packaging substrate together; the metal shielding plate is positioned in the packaging shell and between the infrared light supplementing lamp and the near infrared lamp, and the infrared light supplementing lamp and the near infrared lamp can emit infrared light rays to the outside of the packaging shell at different powers;
the main board is arranged in the shell and is provided with an installation notch;
the imaging module is arranged in the shell and corresponds to the installation notch, the imaging module is a double-camera module, the double-camera module comprises two image sensors, a camera shell and two lens modules, the top surface of the camera shell is a step surface, the two image sensors are accommodated in the camera shell and respectively correspond to the two lens modules, and the top surface comprises a first step surface, a second step surface lower than the first step surface and a first connecting surface; the first connecting surface is obliquely connected with the second ladder surface and forms a notch with the second ladder surface, the first connecting surface is obliquely connected with the first ladder surface, the first connecting surface is positioned between the first ladder surface and the second ladder surface to connect the first ladder surface with the second ladder surface, the notch is arranged in the middle of the top surface, the first ladder surface is divided into a first sub-ladder surface and a second sub-ladder surface by the notch, the first sub-ladder surface and the second sub-ladder surface are respectively positioned on two opposite sides of the notch, and the second ladder surface is arranged between the first sub-ladder surface and the second sub-ladder surface; and
the receiving module, the receiving module is single packaging body structure, the receiving module combines on the mainboard, and follows the edge of installation breach stretches into installation breach follows in the direction of depth of installation breach, the receiving module with the imaging module part overlaps, the receiving module includes proximity sensor and/or light sense ware, proximity sensor with the light sense ware all sets up in the camera housing, the light trap can be one with proximity sensor reaches the light trap or two mutual intervals that the light sense ware all corresponds and respectively with proximity sensor reaches the light trap that the light sense ware corresponds, the light trap all sets up on the second terraced surface.
2. The electronic device according to claim 1, wherein the package housing further comprises a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, the package top is formed with a fill light window and an access window, the fill light window corresponds to the infrared fill light, and the access window corresponds to the access infrared light.
3. The electronic device according to claim 1, wherein the output module further comprises a fill-in light lens disposed in the package housing and corresponding to the infrared fill-in light; and/or
The output module is characterized by further comprising a proximity lamp lens, wherein the proximity lamp lens is arranged in the packaging shell and corresponds to the proximity infrared lamp.
4. The electronic device of claim 1, wherein the output module further comprises an optical enclosure made of a light transmissive material, the optical enclosure being formed on the package substrate and located within the package housing, the optical enclosure enclosing the infrared fill light and the proximity infrared light.
5. The electronic device of claim 4, wherein the output module further comprises a light-emitting partition formed in the optical enclosure and located between the infrared fill light and the near infrared light.
6. The electronic device according to any one of claims 1 to 4, wherein a ground pin, a fill light pin, and a proximity light pin are formed on the output module, and when the ground pin and the fill light pin are enabled, the infrared fill light emits infrared light; the proximity infrared lamp emits infrared light when the ground pin and the proximity lamp pin are enabled.
7. The electronic device according to claim 1, further comprising a transparent cover plate, wherein the housing has a housing access through hole and a housing light supplement through hole, the access infrared lamp corresponds to the housing access through hole, the infrared light supplement lamp corresponds to the housing light supplement through hole, and the cover plate is disposed on the housing.
8. The electronic device according to claim 1, further comprising a transparent cover plate, wherein the housing has a housing access through hole and a housing light supplement through hole, the access infrared lamp corresponds to the housing access through hole, the infrared light supplement lamp corresponds to the housing light supplement through hole, the cover plate is disposed on the housing, an infrared transmissive ink that only transmits infrared light is formed on a surface of the cover plate combined with the housing, and the infrared transmissive ink shields at least one of the housing access through hole and the housing light supplement through hole.
9. The electronic device of claim 1, wherein the imaging module comprises at least one of a visible light camera and an infrared camera.
10. The electronic device of claim 1, wherein the imaging module comprises an infrared camera and a visible light camera, the electronic device further comprises a receiver and a structured light projector, centers of the output module, the infrared camera, the visible light camera, the receiver and the structured light projector are located on a same line segment, and the following are sequentially from one end to the other end of the line segment:
the output module, the structured light projector, the receiver, the infrared camera and the visible light camera; or
The output module, the infrared camera, the telephone receiver, the visible light camera and the structured light projector; or
The infrared camera, the output module, the telephone receiver, the visible light camera and the structured light projector; or
The infrared camera, the visible light camera, the telephone receiver, the output module and the structured light projector.
11. The electronic device of claim 1, wherein the imaging module comprises an infrared camera and a visible light camera, the electronic device further comprises a receiver, a structured light projector and a transparent cover plate, the cover plate is disposed on the housing, the housing has a housing sound outlet, the cover plate has a cover sound outlet, the receiver corresponds to the cover sound outlet and the housing sound outlet, the centers of the output module, the infrared camera, the visible light camera and the structured light projector are located on the same line, and the receiver is located between the line and the top of the housing.
CN201711437458.3A 2017-12-26 2017-12-26 Electronic device Active CN108023985B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201711437458.3A CN108023985B (en) 2017-12-26 2017-12-26 Electronic device
PCT/CN2018/118716 WO2019128628A1 (en) 2017-12-26 2018-11-30 Output module, input and output module and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711437458.3A CN108023985B (en) 2017-12-26 2017-12-26 Electronic device

Publications (2)

Publication Number Publication Date
CN108023985A CN108023985A (en) 2018-05-11
CN108023985B true CN108023985B (en) 2020-09-01

Family

ID=62070994

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711437458.3A Active CN108023985B (en) 2017-12-26 2017-12-26 Electronic device

Country Status (1)

Country Link
CN (1) CN108023985B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019128628A1 (en) * 2017-12-26 2019-07-04 Oppo广东移动通信有限公司 Output module, input and output module and electronic device
CN108665815A (en) * 2018-05-15 2018-10-16 珠海格力电器股份有限公司 Display device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103050089A (en) * 2011-10-12 2013-04-17 富泰华工业（深圳）有限公司 Electronic device and method for adjusting brightness of display screen thereof
CN103515371A (en) * 2012-06-27 2014-01-15 格科微电子（上海）有限公司 Integrated optical sensor package
CN204145746U (en) * 2014-07-29 2015-02-04 东莞劲胜精密组件股份有限公司 A kind of electroacoustic sensing device and there is the mobile phone of this device
CN106550228A (en) * 2015-09-16 2017-03-29 上海图檬信息科技有限公司 Obtain the equipment of the depth map of three-dimensional scenic
CN107451542A (en) * 2017-07-14 2017-12-08 广东欧珀移动通信有限公司 Iris recognition modular arrangements structure and mobile terminal
CN107480589A (en) * 2017-07-07 2017-12-15 广东欧珀移动通信有限公司 Infrared light supply component and electronic installation
CN107508938A (en) * 2017-09-06 2017-12-22 广东欧珀移动通信有限公司 Camera module and electronic installation

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103050089A (en) * 2011-10-12 2013-04-17 富泰华工业（深圳）有限公司 Electronic device and method for adjusting brightness of display screen thereof
CN103515371A (en) * 2012-06-27 2014-01-15 格科微电子（上海）有限公司 Integrated optical sensor package
CN204145746U (en) * 2014-07-29 2015-02-04 东莞劲胜精密组件股份有限公司 A kind of electroacoustic sensing device and there is the mobile phone of this device
CN106550228A (en) * 2015-09-16 2017-03-29 上海图檬信息科技有限公司 Obtain the equipment of the depth map of three-dimensional scenic
CN107480589A (en) * 2017-07-07 2017-12-15 广东欧珀移动通信有限公司 Infrared light supply component and electronic installation
CN107451542A (en) * 2017-07-14 2017-12-08 广东欧珀移动通信有限公司 Iris recognition modular arrangements structure and mobile terminal
CN107508938A (en) * 2017-09-06 2017-12-22 广东欧珀移动通信有限公司 Camera module and electronic installation

Also Published As

Publication number Publication date
CN108023985A (en) 2018-05-11

Similar Documents

Publication Publication Date Title
CN107918459B (en) Electronic device
CN108040148B (en) Input/output module and electronic device
CN108012004B (en) Electronic device
CN107968910B (en) Electronic device
US11449102B2 (en) Electronic device
CN108023984B (en) Input/output module and electronic device
CN107968863B (en) Input/output module and electronic device
CN108124032B (en) Electronic device
CN108074941B (en) Input/output module and electronic device
CN108183984B (en) Input/output module and electronic device
CN108183990B (en) Electronic device
CN108173992B (en) Electronic device
CN108023985B (en) Electronic device
KR101361844B1 (en) Proximity ambient light sensor package and mobile apparatus with it
CN108156286B (en) Electronic device
CN108200235B (en) Output module and electronic device
CN108200237B (en) Electronic device
CN108183987B (en) Electronic device
CN108063150B (en) Electronic device
CN108040147B (en) Input/output module and electronic device
CN107995339B (en) Output module and electronic device
CN108200239B (en) Electronic device
CN108074947B (en) Input/output module and electronic device
CN108093102B (en) Electronic device
CN108183991B (en) Electronic device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information
CB02 Change of applicant information

Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong

Applicant after: OPPO Guangdong Mobile Communications Co., Ltd.

Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong

Applicant before: Guangdong OPPO Mobile Communications Co., Ltd.

GR01 Patent grant
GR01 Patent grant