CN108023985A - Electronic device - Google Patents

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Publication number
CN108023985A
CN108023985A CN201711437458.3A CN201711437458A CN108023985A CN 108023985 A CN108023985 A CN 108023985A CN 201711437458 A CN201711437458 A CN 201711437458A CN 108023985 A CN108023985 A CN 108023985A
Authority
CN
China
Prior art keywords
infrared
lamp
casing
close
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201711437458.3A
Other languages
Chinese (zh)
Other versions
CN108023985B (en
Inventor
吴安平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201711437458.3A priority Critical patent/CN108023985B/en
Publication of CN108023985A publication Critical patent/CN108023985A/en
Priority to PCT/CN2018/118716 priority patent/WO2019128628A1/en
Application granted granted Critical
Publication of CN108023985B publication Critical patent/CN108023985B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly

Abstract

The invention discloses a kind of electronic device.Electronic device includes casing, output module, mainboard, imaging modules and receiving module.Export module to be installed in casing, including encapsulating housing, infrared light compensating lamp and include package substrate close to infrared lamp, encapsulating housing.For infrared light compensating lamp with being encapsulated in encapsulating housing and being carried on package substrate close to infrared lamp, both can launch infrared light to outside encapsulating housing with different power.Mainboard is installed in casing, and mainboard is formed with installation gap.Imaging modules are installed in casing and corresponding with installation gap.Receiving module is incorporated on mainboard, and stretches into installation gap from the edge of installation gap, and along the depth direction of installation gap, receiving module partly overlaps with imaging modules, and receiving module includes proximity sensor and/or optical flame detector.Since output module integrated level is higher, small volume, and imaging modules and receiving module partly overlap on the depth direction of installation gap, have saved the space inside electronic device.

Description

Electronic device
Technical field
The present invention relates to consumer electronics technical field, more specifically, is related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of the function element set It is more and more, in order to realize distance detection, ambient light detection with the function such as the facial 3D feature recognitions of user, it is necessary to be set in electronics The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth Numerous function elements is put, the excessive space of mobile phone can be taken.
The content of the invention
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Output module in the casing, the output module include encapsulating housing, infrared light compensating lamp and approach Infrared lamp, the encapsulating housing include package substrate, and the infrared light compensating lamp is encapsulated in the encapsulation with described close to infrared lamp In housing and carry on the package substrate, the infrared light compensating lamp from it is described close to infrared lamp can with different power to Launch infrared light outside the encapsulating housing；
Mainboard in the casing, the mainboard is formed with installation gap；
Imaging modules, the imaging modules are installed in the casing and corresponding with the installation gap；With
Receiving module, the receiving module are incorporated on the mainboard, and are stretched into from the edge of the installation gap described Installation gap, along the depth direction of the installation gap, the receiving module partly overlaps with the imaging modules, described to connect Receiving module includes proximity sensor and/or optical flame detector.
In some embodiments, the output module further includes chip, and the infrared light compensating lamp is with described close to infrared Lamp is formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly The package substrate extends and is connected at the top of the encapsulation between the package substrate, formed with light filling at the top of the encapsulation Window and close to window, the light filling window is corresponding with the infrared light compensating lamp, it is described close to window with it is described close to infrared lamp It is corresponding.
In some embodiments, the output module further includes light-supplementing lamp lens, and the light-supplementing lamp lens are arranged on institute State in encapsulating housing and corresponding with the infrared light compensating lamp；And/or
The output module is further included close to lamp lens, it is described be arranged on close to lamp lens in the encapsulating housing and with institute State and corresponded to close to infrared lamp.
In some embodiments, the output module further include the light-supplementing lamp lens that are arranged in the encapsulating housing and Close to lamp lens, the light-supplementing lamp lens are corresponding with the infrared light compensating lamp, described close to lamp lens and described close to infrared lamp Corresponding, the light-supplementing lamp lens are located on same transparent base with described close to lamp lens.
In some embodiments, the output module further includes metal shutter, and the metal shutter is positioned at described In encapsulating housing and positioned at the infrared light compensating lamp and described close between infrared lamp.
In some embodiments, the output module further includes the optics sealing cover made of light transmissive material, the optics Sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps the infrared light compensating lamp It is and described close to infrared lamp.
In some embodiments, the output module further includes out light clapboard, it is described go out light clapboard be formed in the light Learn in sealing cover and positioned at the infrared light compensating lamp and described close between infrared lamp.
In some embodiments, formed with grounding pin, light compensating lamp pin and close to lamp pin on the output module, When the grounding pin and the light compensating lamp pin are enabled, the infrared light compensating lamp launches infrared light；The grounding pin With it is described close to lamp pin be enabled when, it is described close to infrared lamp launch infrared light.
In some embodiments, the electronic device further includes the cover board of printing opacity, and the casing offers casing and approaches Through hole and casing light filling through hole, it is described corresponding close to through hole with the casing close to infrared lamp, the infrared light compensating lamp with it is described Casing light filling through hole corresponds to, and the cover board is set on the housing.
In some embodiments, the electronic device further includes the cover board of printing opacity, and the casing offers casing and approaches Through hole and casing light filling through hole, it is described corresponding close to through hole with the casing close to infrared lamp, the infrared light compensating lamp with it is described Casing light filling through hole corresponds to, and the cover board is set on the housing, the cover board and the surface that the casing is combined formed with Only transmit the infrared of infrared light and pass through ink, the infrared ink that passes through blocks the casing close to through hole and the casing light filling It is at least one in through hole.
In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head Kind.
In some embodiments, the imaging modules include infrared pick-up head and visible image capturing head, the electronics Device further includes receiver and structured light projector, the output module, the infrared pick-up head, the visible image capturing The center of head, the receiver and the structured light projector is located on same line segment, from one end of the line segment to the other end It is followed successively by：
The output module, the structured light projector, the receiver, the infrared pick-up head, the visible ray Camera；Or
The output module, the infrared pick-up head, the receiver, the visible image capturing head, the structure light The projector；Or
The infrared pick-up head, the output module, the receiver, the visible image capturing head, the structure light The projector；Or
The infrared pick-up head, the visible image capturing head, the receiver, the output module, the structure light The projector.
In some embodiments, the imaging modules include infrared pick-up head and visible image capturing head, the electronics Device further includes the cover board of receiver, structured light projector and printing opacity, and the cover board is set on the housing, and the casing is opened Equipped with casing sound outlet hole, the cover board offers cover board sound outlet hole, the receiver and the cover board sound outlet hole and the casing The position correspondence of sound outlet hole, output module, the infrared pick-up head, the visible image capturing head and the structure light are thrown The center of emitter is located on same line segment, and the receiver is between the line segment and the top of the casing.
In the electronic device of embodiment of the present invention, output module is by infrared light compensating lamp with being integrated into one close to infrared lamp Single package body structure, has gathered transmitting infrared light with the function of infrared distance measurement and infrared light filling, therefore, has exported the integrated level of module Height, small volume, output module have saved the space for the function of realizing infrared light filling and infrared distance measurement.Further, since infrared benefit Light lamp and be carried on close to infrared lamp on same package substrate, compared to traditional handicraft infrared light compensating lamp with close to infrared lamp Need to be respectively adopted different wafers and manufacture recombinants and encapsulated to PCB substrate, improve packaging efficiency.Furthermore due to being imaged mould Group and receiving module partly overlap on the depth direction of installation gap, and receiving module sets compacter with imaging modules, and two The horizontal space that person takes jointly is smaller, has saved the space inside electronic device.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become obvious, or recognized by the practice of embodiments of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the schematic perspective view of the output module of the electronic device of embodiment of the present invention；
Fig. 3 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Fig. 4 is the schematic perspective view of the output module of the electronic device of embodiment of the present invention；
Fig. 5 is the partial sectional schematic view of the electronic device of embodiment of the present invention；
Fig. 6 is the receiving module of the electronic device of embodiment of the present invention and the schematic perspective view of imaging modules；
Fig. 7 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Fig. 8 is the schematic cross-section of the output module of another embodiment of the present invention；
Fig. 9 is the proximity sensor of embodiment of the present invention and the schematic perspective view of imaging modules；
Figure 10 is the structure diagram of the electronic device of another embodiment of the present invention；
Figure 11 is the partial sectional schematic view of the electronic device of another embodiment of the present invention；
Figure 12 is the partial sectional schematic view of the electronic device of a further embodiment of this invention；
Figure 13 is the receiving module of another embodiment of the present invention and the schematic perspective view of imaging modules；
Figure 14 to Figure 21 is the receiving module of the electronic device of embodiment of the present invention and the schematic perspective view of imaging modules；
Figure 22 is the schematic perspective view of the receiving module of the electronic device of embodiment of the present invention, imaging modules and mainboard； With
Figure 23 is the partial sectional schematic view of the electronic device of embodiment of the present invention.
Embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing To the same or similar element of expression eventually or there is same or like element.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's Embodiment, and be not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity Sub- component includes output module 10, receiving module 50 (such as Fig. 6), imaging modules 60 (such as Fig. 6), receiver 70 and structure light and throws Emitter 80.Electronic device 100 can be mobile phone, tablet computer, laptop, intelligent watch, Intelligent bracelet, automatic teller machine etc., The embodiment of the present invention is illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the concrete form of electronic device 100 can To be other, this is not restricted.
Fig. 2 and Fig. 3 are referred to, exports module 10 as single package body structure, including encapsulating housing 11,12 and of infrared light compensating lamp Close to infrared lamp 13.
Encapsulating housing 11 is used to encapsulate infrared light compensating lamp 12 at the same time and close to infrared lamp 13, in other words, infrared light compensating lamp 12 It is encapsulated at the same time in encapsulating housing 11 with close to infrared lamp 13.Encapsulating housing 11 includes package substrate 111,112 and of package wall Encapsulation top 113.Encapsulating housing 11 can be shielded by electromagnetic interference (Electromagnetic Interference, EMI) Material is made, and output module 10 is had an impact to avoid extraneous electromagnetic interference.
Package substrate 111 is used to carry infrared light compensating lamp 12 and close to infrared lamp 13.It is infrared when manufacture exports module 10 Light compensating lamp 12 and can be formed on a piece of chip 14 close to infrared lamp 13, then by infrared light compensating lamp 12, close to 13 and of infrared lamp Chip 14 is set along on package substrate 111, and specifically, chip 14 can be bonded on package substrate 111.Meanwhile seal Dress substrate 111 can be used for and other parts of electronic device 100 (such as the casing 20 of electronic device 100, mainboard 110 (as shown in figure 22) etc.) connection, output module 10 is fixed in electronic device 100.
Package wall 112 can surround infrared light compensating lamp 12 and be set close to infrared lamp 13, and package wall 112 encapsulates base certainly Plate 111 extends, and package wall 112 can be combined with package substrate 111, it is preferred that package wall 112 is can with package substrate 111 Releasably connect, in order to remove to infrared light compensating lamp 12 after package wall 112 and overhauled close to infrared lamp 13.Package-side The making material of wall 112 can be the material of impermeable infrared light, be sent to avoid infrared light compensating lamp 12 or close to infrared lamp 13 Infrared light passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113 Formed with light filling window 1131 and close to window 1132, light filling window 1131 is corresponding with infrared light compensating lamp 12, infrared light compensating lamp 12 The infrared light of transmitting is pierced by from light filling window 1131；It is corresponding with close to infrared lamp 13 close to window 1132, sent out close to infrared lamp 13 The infrared light penetrated is pierced by from close to window 1132.Encapsulation top 113 integrally formed can be obtained with package wall 112, can also Split shapes to obtain.In one example, light filling window 1131 and close to window 1132 be through hole, encapsulation top 113 making Material is the material of impermeable infrared light.In another example, 113 material by impermeable infrared light of encapsulation top and saturating infrared light Material co-manufactured forms, and specifically, light filling window 1131 and is made close to window 1132 of the material of saturating infrared light, its remaining part Position is made of the material of impermeable infrared light, further, light filling window 1131 and could be formed with lens knot close to window 1132 Structure, to improve the infrared light emission angle projected from light filling window 1131 and close to window 1132, such as 1131 shape of light filling window Into there is concavees lens structure, so that the divergence of beam through light filling window 1131 outwards projects；Close to window 1132 formed with convex lens Mirror structure, so as to gather outside injection through the light close to window 1132.
Infrared light compensating lamp 12 further reduces infrared light compensating lamp with that can be formed on a piece of chip 14 close to infrared lamp 13 12 with the volume close to infrared lamp 13 after integrated, and preparation process is simpler.Infrared light compensating lamp 12 can launch infrared light, infrared light Through light filling window 1131 to project body surface, the infrared pick-up first 62 of electronic device 100 is (as shown in Figure 1) to receive quilt The infrared light of object reflection is to obtain the image information of object (at this time, infrared light compensating lamp 12 is used for infrared light filling).Close to infrared Lamp 13 can launch infrared light, and infrared light passes through close to window 1132 and reaches body surface, the proximity sensor of electronic device 100 The infrared light that 51 receptions (as shown in Figure 6) are reflected by the object is with the distance of detection object to electronic device 100 (at this time, close to red Outer lamp 13 is used for infrared distance measurement).
Infrared light compensating lamp 12 can launch infrared light with different power from close to infrared lamp 13 to outside encapsulating housing 11, Specifically, infrared light compensating lamp 12 close to infrared lamp 13 with that can launch infrared light at the same time, and output module 10 is at the same time for infrared Light filling and infrared distance measurement；Can also infrared light compensating lamp 12 launch light and do not launch light close to infrared lamp 13, export module 10 It is only used for infrared light filling；Can also infrared light compensating lamp 12 do not launch light and close to infrared lamp 13 launch light, export module 10 It is only used for infrared distance measurement.Incorporated by reference to Fig. 4, in embodiments of the present invention, export on module 10 formed with grounding pin 15, light compensating lamp Pin 16 and close to lamp pin 17.Grounding pin 15, light compensating lamp pin 16 and it can be formed in package substrate close to lamp pin 17 On 111, when grounding pin 15 and light compensating lamp pin 16 are enabled, (that is, grounding pin 15 and light compensating lamp pin 16 access circuit During conducting), infrared light compensating lamp 12 launches infrared light；When grounding pin 15 and (that is, grounding lead when being enabled close to lamp pin 17 Foot 15 and close to lamp pin 17 access circuit turn-on when), close to infrared lamp 13 launch infrared light.
Please refer to Fig.1 and Fig. 5, casing 20 can be as the installation carriers of output module 10, in other words, output module 10 can To be arranged in casing 20.Casing 20 can be the shell of electronic device 100, in embodiments of the present invention, may be used also in casing 20 For setting the display screen 90 of electronic device 100, since the output module 10 of embodiment of the present invention can take less body Product, therefore, in casing 20 is used to set the volume of display screen 90 to correspond to increase, is accounted for improving the screen of electronic device 100 Than.Specifically, casing 20 includes top 21 and bottom 22, display screen 90 and output module 10 be arranged on top 21 and bottom 22 it Between, in the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, as shown in Figure 1, output mould Group 10 can be arranged between display screen 90 and top 21.In other embodiments, display screen 90 can be that screen opens up comprehensively Jagged, display screen 90 surrounds output module 10, and the notch for exporting module 10 from display screen 90 exposes.
Casing 20 is further opened with casing close to through hole 23 and casing light filling through hole 24.Output module 10 is arranged in casing 20 When, corresponding close to through hole 23 with casing close to infrared lamp 13, infrared light compensating lamp 12 is corresponding with casing light filling through hole 24.It is wherein close Infrared lamp 13 and casing can be passed through close to the corresponding light sent close to infrared lamp 13 that refers to of through hole 23 from casing close to through hole 23, be had Body, can be passed through close to infrared lamp 13 and casing close to 23 face of through hole or close to the light of the transmitting of infrared lamp 13 Casing is passed through after light-guide device effect close to through hole 23.Infrared light compensating lamp 12 is corresponding with casing light filling through hole 24 similarly, herein not Repeat.In the embodiment as shown in fig.5, casing close to through hole 23 and casing light filling through hole 24 can be apart from one another by, Certainly, in other embodiments, casing can also be interconnected close to through hole 23 and casing light filling through hole 24.
Cover board 30 can be printing opacity, and the material of cover board 30 can be glass, resin, plastics of printing opacity etc..Cover board 30 is set Put on casing 20, cover board 30 includes the inner surface 32 combined with casing 20, and the outer surface 31 opposite with inner surface 32, defeated Go out after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 5 In, cover board 30 covers casing light filling through hole 24 and casing close to through hole 23, and infrared transmission is coated with the inner surface 32 of cover board 30 Ink 40, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and have to visible ray Higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device 100 On by the infrared region covered through ink 40.Specifically, it is infrared through ink 40 can cover on inner surface 32 not with display Shield 90 corresponding regions.
It is infrared to block casing close at least one in through hole 23 and casing light filling through hole 24 through ink 40, That is, it is infrared to cover casing at the same time close to through hole 23 and casing light filling through hole 24 (as shown in Figure 5), Yong Hunan through ink 40 To see the internal structure of electronic device 100 close to through hole 23 and casing light filling through hole 24 by casing, electronic device 100 it is outer Shape is more beautiful；It is infrared to cover casing close to through hole 23 through ink 40, and casing light filling through hole 24 is not covered；It is or red It is outer to cover casing light filling through hole 24 through ink 40, and casing is not covered close to through hole 23.
Referring to Fig. 6, receiving module 50 is integrated with proximity sensor 51 and optical flame detector 52, proximity sensor 51 and optical flame detector 52 are collectively forming single packaging body.The infrared light sent out close to infrared lamp 13, after being reflected by external object, by proximity sensor 51 receive, and proximity sensor 51 is judged between external object and electronic device 100 according to the infrared light reflected received Distance.Optical flame detector 52 receives the visible ray in ambient light, and detects the intensity of visible ray, using the display as control display screen 90 The foundation of brightness.Proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, between reducing when the two is individually assembled Gap, saves the installation space in electronic device 100.
Please refer to Fig.1 and Fig. 6, imaging modules 60 can be visible image capturing first 61 and one in infrared pick-up first 62 Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is installed on microscope base 63, and image passes Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it Between.In the embodiment illustrated in fig. 6, receiving module 50 is arranged on mounting surface 631, and specifically, receiving module 50 is being installed Plane orthographic projection where face 631 is at least partly dropped on mounting surface 631, in this way, receiving module 50 is set with imaging modules 60 Put compacter, the horizontal space that the two takes jointly is smaller.
Referring to Fig. 1, receiver 70 is used to send out acoustic signals when being encouraged be subject to power supply, user can by by Words device 70 is conversed.Structured light projector 80 is used for outside emitting structural light, on project structured light to testee after it is anti- Penetrate, the structure light reflected can be received by infrared pick-up first 62, and the processor of electronic device 100 is further analyzed by infrared light The structure light that camera 62 receives, to obtain the depth information of testee.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, defeated Go out that module 10, infrared pick-up are first 62, visible image capturing is first 61, the center of receiver 70 and structured light projector 80 is positioned at same On line segment.Specifically, output module 10, structured light projector 80, receiver 70, red is followed successively by from one end of line segment to the other end Outer light video camera head 62, visible image capturing first 61 (as shown in Figure 7)；Or output module is followed successively by from one end of line segment to the other end 10th, infrared pick-up is first 62, receiver 70, visible image capturing are first 61, structured light projector 80 (as shown in Figure 1)；Or from line One end of section is followed successively by that infrared pick-up is first 62, the first 61, structure that exports module 10, receiver 70, visible image capturing to the other end Light projector 80；Or it is followed successively by that infrared pick-up is first 62, visible image capturing is first 61, receiver from one end of line segment to the other end 70th, module 10, structured light projector 80 are exported.Certainly, module 10, infrared pick-up first 62 are exported, receiver 70, visible ray are taken the photograph As the arrangement mode of first 61, structured light projector 80 is not limited to above-mentioned citing, there can also be other, such as each electronic component The shape such as center arrangement in the arc-shaped, center arrangement is rectangular.
Further, incorporated by reference to Fig. 6, receiving module 50 can be arranged on the mounting surface 631 of infrared pick-up first 62, It can be arranged on the mounting surface 631 of visible image capturing first 61, certainly, receiving module 50 can not also be arranged on mounting surface 631 On, receiving module 50 can be disposed adjacent with output module 10, and proximity sensor 51 is readily received by being sent out close to infrared lamp 13 Penetrate, and the infrared light being reflected back by external object；Receiving module 50 can also be disposed adjacent with receiver 70, when user answers electricity During words, proximity sensor 51 is readily detected the ear of user close to receiver 70.
To sum up, in the electronic device 100 of embodiment of the present invention, output module 10 by infrared light compensating lamp 12 with close to infrared Lamp 13 is integrated into a single package body structure, has gathered transmitting infrared light with the function of infrared distance measurement and infrared light filling, therefore, defeated It is higher to go out the integrated level of module 10, small volume, output module 10 has saved the function of realizing infrared light filling and infrared distance measurement Space.Further, since infrared light compensating lamp 12 and it is carried on close to infrared lamp 13 on same package substrate 111, compared to tradition The infrared light compensating lamp 12 of technique manufactures recombinants from needing to be respectively adopted different wafers close to infrared lamp 13 and is sealed to PCB substrate Dress, improves packaging efficiency.
Referring to Fig. 3, in some embodiments, output module 10 further includes light-supplementing lamp lens 18 and close to lamp lens 19.Light-supplementing lamp lens 18 are arranged in encapsulating housing 11 and corresponding with infrared light compensating lamp 12.Encapsulation is arranged on close to lamp lens 19 It is in housing 11 and corresponding with close to infrared lamp 13.The infrared light that infrared light compensating lamp 12 is launched converges under the action of light-supplementing lamp lens 18 Gather and projected in light filling window 1131, reduce the light quantity in other regions for being transmitted to package wall 112 and encapsulation top 113.Together Reason, the infrared light launched close to infrared lamp 13 are projected being converged to close under the action of lamp lens 19 close in window 1132, subtracted The light quantity in other regions at package wall 112 and encapsulation top 113 is transmitted to less.Specifically, light-supplementing lamp lens 18 with close to lamp Lens 19 can be located at same transparent base on, more specifically, light-supplementing lamp lens 18 with can be transparent with this close to lamp lens 19 Matrix is integrally formed obtained.Certainly, output module 10 can also be provided only with light-supplementing lamp lens 18 and close in lamp lens 19 One, light-supplementing lamp lens 18 can not also be set and close to lamp lens 19.
Referring to Fig. 3, in some embodiments, output module 10 further includes metal shutter 1a, metal shutter 1a In encapsulating housing 11, and metal shutter 1a is located at infrared light compensating lamp 12 and close between infrared lamp 13.Metal shutter 1a is located at infrared light compensating lamp 12 and close between infrared lamp 13, metal shutter 1a on the one hand can shield infrared light compensating lamp 12 with The electromagnetic interference mutual close to infrared lamp 13, infrared light compensating lamp 12 will not with the luminous intensity and sequential close to infrared lamp 13 Interact, another aspect metal shutter 1a can be used for completely cutting off 12 place cavity of infrared light compensating lamp with close to the institute of infrared lamp 13 Cavity, light will not enter another cavity from a cavity.
Referring to Fig. 8, in some embodiments, output module 10 further includes optics sealing cover 1b.Optics sealing cover 1b is by saturating Luminescent material is made, and optics sealing cover 1b is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1b wraps red Outer light compensating lamp 12 and close to infrared lamp 13.Specifically, optics sealing cover 1b can be formed by encapsulating injection molding and forming technology, optics envelope Cover 1b can be made of transparent thermosetting epoxy resin, and to be not easy to soften in use, optics sealing cover 1b can fix red Outer light compensating lamp 12 and close to the relative position between infrared lamp 13, and cause infrared light compensating lamp 12 with being encapsulated close to infrared lamp 13 It is not easy to rock in housing 11.
In addition, referring to Fig. 8, output module 10 further include out light clapboard 1c, go out light clapboard 1c and be formed in optics sealing cover 1b It is interior and positioned at infrared light compensating lamp 12 and close between infrared lamp 13.Go out light clapboard 1c to can be used for interval infrared light compensating lamp 12 and approach Infrared lamp 13, the light that infrared light compensating lamp 12 is sent will not be pierced by from close to window 1132, the light sent close to infrared lamp 13 Line will not be pierced by from light filling window 1131.
Referring to Fig. 9, in some embodiments, proximity sensor 51 can be not integrated in receiving module with optical flame detector 52 In 50, in other words, proximity sensor 51 is separately set with optical flame detector 52.At this time, proximity sensor 51 can be arranged on microscope base 63 Mounting surface 631 on；Optical flame detector 52 can also be arranged on the mounting surface 631 of microscope base 63；Or proximity sensor 51 and light sensation Device 52 is arranged on the mounting surface 631 of microscope base 63 at the same time.Microscope base 63 can be the microscope base 63 of infrared pick-up first 62 or The microscope base 63 of visible image capturing first 61.
Referring to Fig. 10, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also Offer cover board sound outlet hole 35, the position correspondence of receiver 70 and cover board sound outlet hole 35 and casing sound outlet hole.Export module 10, red The center of outer light video camera head 62, visible image capturing first 61 and structured light projector 80 is located on same line segment, and receiver 70 is located at Between the line segment and the top 21 of casing 20.
It is (output module 10, red each electronic component on cover board 30 is saved not on the line segment in the center of receiver 70 Outer light video camera head 62, visible image capturing are first 61, structured light projector 80 etc.) horizontal space that takes.In reality as shown in Figure 10 Apply in example, cover board sound outlet hole 35 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
Referring again to Figure 11, cover board light filling through hole 34, cover board can also be offered in some embodiments, on cover board 30 Light filling through hole 34 is corresponding with casing light filling through hole 24, and the infrared light that infrared light compensating lamp 12 is launched can after passing through casing light filling through hole 24 To be pierced by electronic device 100 from cover board light filling through hole 34.At this time, can close to 23 corresponding position of through hole with casing on cover board 30 To set infrared transmission ink 40, user is difficult to the close red of the inside for seeing electronic device 100 close to through hole 23 by casing Outer lamp 13, the shape of electronic device 100 are more beautiful.
2 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to through hole 33, cover board approaches Through hole 33 is corresponding close to through hole 23 with casing, can be from close to after through hole 23 through casing close to the infrared light that infrared lamp 13 is launched Cover board is pierced by electronic device 100 close in through hole 33.At this time, can be set with 24 corresponding position of casing light filling through hole on cover board 30 Infrared transmission ink 40 is put, user is difficult to the infrared light compensating lamp that the inside of electronic device 100 is seen by casing light filling through hole 24 12, the shape of electronic device 100 is more beautiful.
3 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on On substrate 66, receiving module 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, one of substrate 66 Divide in microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and is used to carry image sensing Device 65, the other end can be connected with the mainboard 110 of electronic device 100.When receiving module 50 is arranged on substrate 66, receiving module 50 are arranged on outside microscope base 63, and receiving module 50 can also be connected with FPC.
Further, being arranged on the receiving module 50 of substrate 66 includes proximity sensor 51 and optical flame detector 52, close to sensing Device 51 is collectively forming single package body structure with optical flame detector 52, reduces gap when the two is individually assembled, saves in electronic device 100 Installation space.In other embodiments, being arranged on the receiving module 50 of substrate 66 includes proximity sensor 51 or/and light sensation Device 52, proximity sensor 51 and optical flame detector 52 are respectively single package body structure.That is, the receiving module 50 for being arranged on substrate 66 is single The proximity sensor 51 of package body structure；Alternatively, the receiving module 50 for being arranged on substrate 66 is the optical flame detector of single package body structure 52；Alternatively, the receiving module 50 for being arranged on substrate 66 is the proximity sensor 51 of single package body structure and single package body structure Optical flame detector 52.
Imaging modules 60 can be visible image capturing first 61 and one or two in infrared pick-up first 62.Specifically, Receiving module 50 can be fixed on the substrate 66 of visible image capturing first 61；Receiving module 50 can be fixed on infrared pick-up head On 62 substrate 66.When proximity sensor 51 and optical flame detector 52 encapsulate for split, proximity sensor 51 can be fixed on visible On the substrate 66 of light video camera head 61, optical flame detector 52 can be fixed on the substrate 66 of infrared pick-up first 62；Alternatively, optical flame detector 52 It can be fixed on the substrate 66 of visible image capturing first 61, proximity sensor 51 can be fixed on the substrate of infrared pick-up first 62 On 66；Alternatively, proximity sensor 51 is each attached on the substrate 66 of visible image capturing first 61 with optical flame detector 52；Alternatively, close pass Sensor 51 is each attached on the substrate 66 of infrared pick-up first 62 with optical flame detector 52.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with receiving module 50, with increase The integral strength of substrate 66 so that FPC is not susceptible to around folding, while receiving module 50 (or proximity sensor 51 or optical flame detector 52) It is not susceptible to rock when being arranged on substrate 66.In one example, receiving module 50 (or proximity sensor 51 or optical flame detector 52) it may be also secured on the lateral wall of microscope base 63, such as be fixed on by cohesive mode on the lateral wall of microscope base 63.
4 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67 Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- 672 and the 3rd sub- top surface 673 of top surface, the second son top 672 and first sub- top surface 671 of face tilts connection and forms notch 675, the 3rd sub- top surface 673 and second with the first sub- top surface 671 Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- 671 and the 3rd sub- top surface 673 of top surface to connect first Sub- 671 and the 3rd sub- top surface 673 of top surface.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight Angle, the angle between the second sub- 672 and the 3rd sub- top surface 673 of top surface can be obtuse angle or right angle.Notch 675 is opened in camera shell On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.3rd sub- top surface 673 offers out Light through hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through hole 674.Imaging sensor 65 is housed in In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through hole 674 and camera lens mould Group 68 is simultaneously delivered on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Receiving module 50 is arranged on At first sub- top surface 671, receiving module 50 includes proximity sensor 51 and optical flame detector 52.In present embodiment, imaging modules 60 Can be visible image capturing first 61, receiving module 50 is single packaging body that proximity sensor 51 is collectively forming with optical flame detector 52.Connect Nearly sensor 51 can be consistent with the extending direction of notch 675 (as shown in figure 14) with the center line connecting direction of optical flame detector 52；Or Person, proximity sensor 51 can be vertical with the extending direction of notch 675 or in the two shape with the center line connecting direction of optical flame detector 52 Into angle be acute angle or obtuse angle.In other embodiments, imaging modules 60 can be infrared pick-up first 62.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the first sub- top surface On 671, receiving module 50 is set to set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, saves Installation space in electronic device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce Gap when the two is individually assembled, saves the installation space in electronic device 100.
Please continue to refer to Figure 14, in some embodiments, the receiving module 50 of the above embodiment is arranged on the first son On top surface 671 and positioned at the outside of camera case 67, specifically, whole receiving module 50 is along perpendicular to the first sub- top surface 671 Projection can be located in the first sub- top surface 671 (as shown in figure 14)；Alternatively, part receiving module 50 is pushed up along perpendicular to the first son The projection in face 671 is located in the first sub- top surface 671.That is, receiving module 50 is at least part of to be located at the first sub- top surface 671 surface, in this way, receiving module 50 sets compacter with imaging modules 60, the two horizontal space taken jointly compared with It is small, further save the installation space in electronic device 100.In other embodiments, receiving module 50 is included close to biography Sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two single single packaging bodies, at this time, are respectively single envelope The proximity sensor 51 and optical flame detector 52 for filling body can also be all disposed within the first sub- top surface 671.
5 are please referred to Fig.1, in some embodiments, the receiving module 50 of the above embodiment only includes proximity sensor 51, not comprising optical flame detector 52, at this time, proximity sensor 51 (or receiving module 50) is respectively monomer encapsulation with optical flame detector 52 and ties Structure, proximity sensor 51 are arranged on the first sub- top surface 671, and optical flame detector 52 is arranged on any other except the first sub- top surface 671 Position.
Please continue to refer to Figure 15, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, and do not include proximity sensor 51, at this time, optical flame detector 52 (or receiving module 50) is respectively monomer envelope with proximity sensor 51 Assembling structure, optical flame detector 52 are arranged on the first sub- top surface 671, proximity sensor 51 be arranged on except the first sub- top surface 671 other Optional position.
6 are please referred to Fig.1, the first sub- top surface 671 of the above embodiment offers loophole 676, and receiving module 50 is located at It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without light sensation Device 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 The light in portion can pass through loophole 676 and be delivered on proximity sensor 51.The receiving module 50 of present embodiment is arranged on In camera case 67, receiving module 50 and the structure of camera case 67 is set more to stablize and be easy to receiving module 50 and imaging mould Group 60 is installed on casing 20.
Please continue to refer to 16, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics Light outside device 100 can pass through loophole 676 and be delivered on optical flame detector 52.The receiving module 50 of present embodiment is set Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and easy to by receiving module 50 with into As module 60 is installed on casing 20.
7 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 be integrated with it is close When sensor 51 is with optical flame detector 52, loophole 676 can be one and proximity sensor 51 and the corresponding printing opacity of optical flame detector 52 Hole or two it is spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that light can pass through loophole 676 and be delivered in receiving module 50.In other realities Apply in mode, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two Individually list packaging body, at this time, the proximity sensor 51 and optical flame detector 52 for being respectively single packaging body can also be all disposed within camera It is in housing 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, makes receiving module 50 more stablize with the structure of camera case 67 and easy to which receiving module 50 and imaging modules 60 are installed on casing 20.
7 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground, FPC is provided with substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connected with the mainboard 110 with electronic device 100.In other embodiments, receiving module 50 can also be connected with FPC.This reality Apply in mode, being arranged on receiving module 50 on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 with Optical flame detector 52 is collectively forming single package body structure, reduces gap when the two is individually assembled, saves the installation in electronic device 100 Space.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 also encapsulates for monomer Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at Outside camera case 67.
In yet another embodiment, optical flame detector 52 is only included in receiving module 50, proximity sensor 51, which is not integrated into, to be connect Receive in module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 also seals for monomer Assembling structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when one of substrate 66 Divide in camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate On 66 and outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67 Structure is more stablized and easy to which receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, receiving module 50 is firmly mounted in camera case 67.
8 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 take the photograph module, including two imaging sensors 65, camera case 67 and two camera lens moulds to be double Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677 678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a positioned at the first tread 677 with With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677 Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle. Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two A light extraction through hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through holes 674 Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions Through hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68, Light outside electronic device 100 can pass through light extraction through hole 674 and camera lens module 68 and be delivered on imaging sensor 65.This reality Apply in mode, imaging modules 60 can be visible image capturing first 61, and two camera lens modules 68 are visible image capturing first 61 at this time Corresponding camera lens module.Receiving module 50 is arranged on the second tread 678 and outside camera case 67.Receiving module 50 is to connect Single packaging body that nearly sensor 51 is collectively forming with optical flame detector 52.The center line connecting direction of proximity sensor 51 and optical flame detector 52 can With consistent with the extending direction of notch 675；Alternatively, the center line connecting direction of proximity sensor 51 and optical flame detector 52 can be with notch 675 extending direction vertical (as shown in figure 18) or the two angle formed are acute angle or obtuse angle.In other embodiments, into As module 60 can be infrared pick-up first 62, two camera lens modules 68 are first 62 corresponding camera lens mould of infrared pick-up at this time Group.In yet another embodiment, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, at this time one of them Camera lens module 68 is first 62 corresponding camera lens module of infrared pick-up, another camera lens module 68 corresponds to for visible image capturing first 61 Camera lens module.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the second tread 678 On, receiving module 50 is set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, has saved electronics Installation space in device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce the two Individually gap during assembling, saves the installation space in electronic device 100.
9 are please referred to Fig.1, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670 On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through holes 674 are opened in the first son respectively On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675 Both sides.At this time, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face 679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678, Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating receiving module 50 is arranged on the second tread On 678.
8 and Figure 19 is please referred to Fig.1, in some embodiments, the receiving module 50 of the above embodiment is arranged on second On tread 678 and positioned at the outside of camera case 67.Specifically, it is whole when notch 675 is opened in the marginal position of top surface 670 A receiving module 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, part receives mould Group 50 is located in the second tread 678 (as shown in figure 18) along the projection perpendicular to the second tread 678.That is, receiving module The 50 at least part of surfaces for being located at the second tread 678.It is whole when notch 675 is opened on the centre position of top surface 670 A receiving module 50 can be located in the second tread 678 (as shown in figure 19) along perpendicular to the projection of the second tread 678.Such as This, receiving module 50 sets compacter with imaging modules 60, and the horizontal space that the two takes jointly is smaller, further saves Installation space in electronic device 100.In other embodiments, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two single single packaging bodies, at this time, be respectively single packaging body close to sensing Device 51 and optical flame detector 52 can also be all disposed within the second tread 678.
9 are please referred to Fig.1, in some embodiments, the receiving module 50 of the above embodiment only includes close to sensing Device 51, receiving module 50 do not include optical flame detector 52, and at this time, proximity sensor 51 (or receiving module 50) is respectively with optical flame detector 52 Cell packaging configuration, proximity sensor 51 are arranged on the second tread 678, and optical flame detector 52 is arranged on the casing outside imaging modules 60 On 20.
9 are please referred to Fig.1, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, Receiving module 50 does not include proximity sensor 51, and at this time, optical flame detector 52 (or receiving module 50) is respectively with proximity sensor 51 Cell packaging configuration, optical flame detector 52 are arranged on the second tread 678, and proximity sensor 51 is arranged on the casing outside imaging modules 60 On 20.
Figure 20 is referred to, the second tread 678 of the above embodiment offers loophole 676, and receiving module 50 is located at phase It is in casing body 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without optical flame detector 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 Light can pass through and loophole 676 and be delivered on proximity sensor 51.The receiving module 50 of present embodiment is arranged on phase In casing body 67, the structure of receiving module 50 and camera case 67 is set more to stablize and be easy to receiving module 50 and imaging modules 60 are installed on casing 20.
Please continue to refer to Figure 20, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics Light outside device 100 can pass through loophole 676 and be delivered on optical flame detector 52.The receiving module 50 of present embodiment is set Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and easy to by receiving module 50 with into As module 60 is installed on casing 20.
Figure 21 is referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, Receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 is integrated with close to sensing When device 51 and optical flame detector 52, loophole 676 can be one with proximity sensor 51 and the corresponding loophole of optical flame detector 52 or Two spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, the light outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that loophole 676 can be passed through and be delivered in receiving module 50.In other embodiment party In formula, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are independent for two Single packaging body, at this time, the proximity sensor 51 and optical flame detector 52 for being respectively single packaging body can also be all disposed within camera case It is in 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, make receiving module 50 with The structure of camera case 67 is more stablized and easy to which receiving module 50 and imaging modules 60 is installed on casing 20.
Please continue to refer to Figure 21, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground, FPC is provided with substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connected with the mainboard 110 with electronic device 100.In other embodiments, receiving module 50 can also be connected with FPC.This reality Apply in mode, being arranged on receiving module 50 on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 with Optical flame detector 52 is collectively forming single package body structure, reduces gap when the two is individually assembled, saves the installation in electronic device 100 Space.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 also encapsulates for monomer Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at Outside camera case 67.
In yet another embodiment, receiving module 50 only includes optical flame detector 52, and proximity sensor 51 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 also encapsulates for monomer Structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 In camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate 66 Go up and be located at outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67 Structure is more stablized and easy to which receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, receiving module 50 is firmly mounted in camera case 67.
Also referring to Fig. 1, Figure 22 and Figure 23, in some embodiments, the electronic device 100 of the above embodiment is also Including the mainboard 110 in casing 20.Mainboard 110 is formed with installation gap 110a.Imaging modules 60 are installed on casing 20 It is interior and corresponding with installation gap 110a.Receiving module 50 is incorporated on mainboard 110, and stretches into peace from the edge of installation gap 110a Fill notch 110a.Along along the depth direction (Z-direction in such as Figure 22) of installation gap 110a, receiving module 50 and imaging modules 60 Partly overlap.
Specifically, mainboard 110 can be printed wiring board, and printed wiring board can be hardboard, soft board or Rigid Flex, Electronic component, such as output module 10, receiving module 50, imaging modules 60, receiver 70, structured light projector 80 etc. To be connected with mainboard 110, electronic component can be directly installed on mainboard 110 or be installed on electronic device 100 Other structures on, then be connected with mainboard 110 by circuit.Installation gap 110a is formed on mainboard 110, installation gap 110a Mainboard 110 can be run through.Imaging modules 60 are in casing 20 and corresponding with installation gap 110a, can be imaging modules 60 Wear installation gap 110a；Can also be incidence hole (in certain embodiments, incidence hole and the above-mentioned light extraction of imaging modules 60 Through hole 674 corresponds to) it is aligned with installation gap 110a, but installation gap 110a is not penetrated.
Receiving module 50 is incorporated on mainboard 110, and specifically, the pin of receiving module 50 can be welded on mainboard 110 On pad, so that receiving module 50 is fixedly connected with mainboard 110.Receiving module 50 stretches into installation from the edge of installation gap 110a Notch 110a, has saved the installation site on mainboard 110.Along the depth direction (Z-direction in such as Figure 23) of installation gap 110a On, receiving module 50 partly overlaps with imaging modules 60, and receiving module 50 can be contacted with each other with imaging modules 60, receiving module 50 with imaging modules 60 can also be interval.Receiving module 50 sets compacter with imaging modules 60, the two common occupancy Horizontal space it is smaller (perpendicular to the direction of Z-direction), saved the space inside electronic device 100.
Certainly, receiving module 50 can be integrated with proximity sensor 51 and optical flame detector 52；Receiving module 50 can also be Individually include proximity sensor 51；Receiving module 50, which can also be, individually includes optical flame detector 52.On imaging modules 60 can also be Imaging modules 60 and its deformation of any embodiment are stated, details are not described herein.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention. In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side Formula combines.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.

Claims (14)

  1. A kind of 1. electronic device, it is characterised in that including：
    Casing；
    Output module in the casing, the output module include encapsulating housing, infrared light compensating lamp and close to infrared Lamp, the encapsulating housing include package substrate, and the infrared light compensating lamp is encapsulated in the encapsulating housing with described close to infrared lamp It is interior and carry on the package substrate, the infrared light compensating lamp from it is described can be with different power to described close to infrared lamp Launch infrared light outside encapsulating housing；
    Mainboard in the casing, the mainboard is formed with installation gap；
    Imaging modules, the imaging modules are installed in the casing and corresponding with the installation gap；With
    Receiving module, the receiving module are incorporated on the mainboard, and stretch into the installation from the edge of the installation gap Notch, along the depth direction of the installation gap, the receiving module partly overlaps with the imaging modules, the reception mould Group includes proximity sensor and/or optical flame detector.
  2. 2. electronic device according to claim 1, it is characterised in that the output module further includes chip, described infrared Light compensating lamp is formed on a piece of chip with described close to infrared lamp.
  3. 3. electronic device according to claim 2, it is characterised in that the encapsulating housing further includes package wall and encapsulation Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute Encapsulation top is stated formed with light filling window and close to window, the light filling window is corresponding with the infrared light compensating lamp, described close Window with it is described corresponding close to infrared lamp.
  4. 4. electronic device according to claim 2, it is characterised in that the output module further includes light-supplementing lamp lens, institute Light-supplementing lamp lens are stated to be arranged in the encapsulating housing and corresponding with the infrared light compensating lamp；And/or
    The output module is further included close to lamp lens, described to be arranged in the encapsulating housing close to lamp lens and connect with described Near-infrared lamp corresponds to.
  5. 5. electronic device according to claim 2, it is characterised in that the output module, which further includes, is arranged on the encapsulation Light-supplementing lamp lens in housing and close to lamp lens, the light-supplementing lamp lens are corresponding with the infrared light compensating lamp, described close to lamp With described corresponding close to infrared lamp, the light-supplementing lamp lens are located on same transparent base lens with described close to lamp lens.
  6. 6. electronic device according to claim 2, it is characterised in that the output module further includes metal shutter, institute Metal shutter is stated to be located in the encapsulating housing and positioned at the infrared light compensating lamp and described close between infrared lamp.
  7. 7. electronic device according to claim 1, it is characterised in that the output module is further included to be made of light transmissive material Optics sealing cover, the optics sealing cover formed on the package substrate and in the encapsulating housing, the optics sealing cover Wrap the infrared light compensating lamp and described close to infrared lamp.
  8. 8. electronic device according to claim 7, it is characterised in that the output module further includes out light clapboard, described Go out light clapboard to be formed in the optics sealing cover and positioned at the infrared light compensating lamp and described close between infrared lamp.
  9. 9. according to the electronic device described in claim 1-8 any one, it is characterised in that formed with connecing on the output module Ground pin, light compensating lamp pin and close to lamp pin, the grounding pin and the light compensating lamp pin be enabled when, the infrared benefit Light lamp launches infrared light；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared lamp launch it is infrared Light.
  10. 10. electronic device according to claim 1, it is characterised in that the electronic device further includes the cover board of printing opacity, institute State casing and offer casing close to through hole and casing light filling through hole, it is described corresponding close to through hole with the casing close to infrared lamp, The infrared light compensating lamp is corresponding with the casing light filling through hole, and the cover board is set on the housing.
  11. 11. electronic device according to claim 1, it is characterised in that the electronic device further includes the cover board of printing opacity, institute State casing and offer casing close to through hole and casing light filling through hole, it is described corresponding close to through hole with the casing close to infrared lamp, The infrared light compensating lamp is corresponding with the casing light filling through hole, and the cover board is set on the housing, the cover board with it is described The surface that casing combines passes through ink formed with the infrared of infrared light is only transmitted, and the infrared transmission ink blocks the casing and connects It is at least one in nearly through hole and the casing light filling through hole.
  12. 12. electronic device according to claim 1, it is characterised in that the imaging modules include visible image capturing head and At least one of infrared pick-up head.
  13. 13. electronic device according to claim 1, it is characterised in that the imaging modules include infrared pick-up head and Visible image capturing head, the electronic device further include receiver and structured light projector, and the output module, the infrared light are taken the photograph As the center of head, the visible image capturing head, the receiver and the structured light projector is located on same line segment, from described One end of line segment is followed successively by the other end：
    The output module, the structured light projector, the receiver, the infrared pick-up head, the visible image capturing Head；Or
    The output module, the infrared pick-up head, the receiver, the visible image capturing head, the project structured light Device；Or the infrared pick-up head, the output module, the receiver, the visible image capturing head, the project structured light Device；Or the infrared pick-up head, the visible image capturing head, the receiver, the output module, the project structured light Device.
  14. 14. electronic device according to claim 1, it is characterised in that the imaging modules include infrared pick-up head and Visible image capturing head, the electronic device further include the cover board of receiver, structured light projector and printing opacity, and the cover board is arranged on On the casing, the casing offers casing sound outlet hole, and the cover board offers cover board sound outlet hole, the receiver with it is described The position correspondence of cover board sound outlet hole and the casing sound outlet hole, the output module, the infrared pick-up head, the visible ray The center of camera and the structured light projector is located on same line segment, and the receiver is located at the line segment and the casing Top between.
CN201711437458.3A 2017-12-26 2017-12-26 Electronic device Active CN108023985B (en)

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