CN107995339A - Export module and electronic device - Google Patents
Export module and electronic device Download PDFInfo
- Publication number
- CN107995339A CN107995339A CN201711433098.XA CN201711433098A CN107995339A CN 107995339 A CN107995339 A CN 107995339A CN 201711433098 A CN201711433098 A CN 201711433098A CN 107995339 A CN107995339 A CN 107995339A
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- China
- Prior art keywords
- light
- infrared
- infrared lamp
- electronic device
- lamp
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
Abstract
The invention discloses one kind to export module.Output module includes encapsulating housing, infrared lamp and light-guide device.Encapsulating housing includes package substrate.Infrared lamp and light-guide device are encapsulated in encapsulating housing.Infrared lamp is carried on package substrate.Light-guide device can be movably arranged in the luminous light path of infrared lamp.When light-guide device is located in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted using as infrared light compensating lamp or close to infrared lamp with the first field angle from encapsulating housing；When light-guide device is left in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted using as close to infrared lamp or infrared light compensating lamp with the second field angle from encapsulating housing.The position that the output module of embodiment of the present invention passes through mobile light-guide device so that output module can be used as, close to infrared lamp or infrared light compensating lamp, having gathered transmitting infrared light with the function of infrared distance measurement and infrared light filling, take small.In addition, the invention also discloses a kind of electronic device.
Description
Technical field
The present invention relates to consumer electronics technical field, more specifically, is related to a kind of output module and electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of the function element set
It is more and more, in order to realize distance detection, ambient light detection with the function such as the facial 3D feature recognitions of user, it is necessary to be set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be taken.
The content of the invention
Embodiment of the present invention provides a kind of output module and electronic device.
The output module of embodiment of the present invention includes encapsulating housing, infrared lamp and light-guide device, the encapsulating housing bag
Package substrate is included, the infrared lamp and the light-guide device are encapsulated in the encapsulating housing, and the infrared lamp is carried on described
On package substrate, the light-guide device can be movably arranged in the luminous light path of the infrared lamp, when the light-guide device
When in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting is with the first field angle from the encapsulating shell
Body outgoing is using as infrared light compensating lamp or close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp
When, the infrared light of infrared lamp transmitting is emitted using as close to infrared lamp or red with the second field angle from the encapsulating housing
Outer light compensating lamp.
The electronic device of embodiment of the present invention includes：
Casing；With
The output module of embodiment of the present invention, the output module are arranged in the casing.
In the output module and electronic device of embodiment of the present invention, pass through the position of mobile light-guide device so that output
Module can be used as, close to infrared lamp or infrared light compensating lamp, having gathered transmitting infrared light with the function of infrared distance measurement and infrared light filling.
Secondly, needed compared to current electronic device for being positioned proximate to infrared lamp and infrared light compensating lamp at the same time, embodiment party of the present invention
The output module of formula only needs to set an infrared lamp, and small volume, has saved and realized infrared light filling and infrared distance measurement function
Space.Furthermore it is packaged due to only needing an infrared lamp being arranged on package substrate, it is infrared compared to traditional handicraft
Light compensating lamp manufactures recombinants from needing to be respectively adopted different wafers close to infrared lamp and is encapsulated to PCB substrate, improves encapsulation effect
Rate.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become obvious, or recognized by the practice of embodiments of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the schematic perspective view of the output module of the electronic device of embodiment of the present invention；
Fig. 3 to Fig. 4 is the view of the output module of the electronic device of embodiment of the present invention；
Fig. 5 to Fig. 7 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Fig. 8 is the receiving module of the electronic device of embodiment of the present invention and the schematic perspective view of imaging modules；
Fig. 9 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 10 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Figure 11 is the proximity sensor of embodiment of the present invention and the schematic perspective view of imaging modules；
Figure 12 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 13 is the partial sectional schematic view of the electronic device of embodiment of the present invention；
Figure 14 is the receiving module of embodiment of the present invention and the schematic perspective view of imaging modules；
Figure 15 to Figure 22 is the receiving module of the electronic device of embodiment of the present invention and the schematic perspective view of imaging modules.
Embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the same or similar element of expression eventually or there is same or like element.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity
Sub- component includes output module 10, receiving module 50 (such as Fig. 8), imaging modules 60 (such as Fig. 8), receiver 70 and structure light and throws
Emitter 80.Electronic device 100 can be mobile phone, tablet computer, laptop, intelligent watch, Intelligent bracelet, automatic teller machine etc.,
The embodiment of the present invention is illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the concrete form of electronic device 100 can
To be other, this is not restricted.
Fig. 2 to Fig. 4 is referred to, exports module 10 as single package body structure, including encapsulating housing 11, infrared lamp 12 and leaded light
Element 13.
Encapsulating housing 11 is used to encapsulate infrared lamp 12 and light-guide device 13 at the same time, in other words, infrared lamp 12 and light-guide device
13 are encapsulated in encapsulating housing 11 at the same time.Encapsulating housing 11 includes package substrate 111, package wall 112 and encapsulation top 113.
Encapsulating housing 11 can be made of electromagnetic interference (Electromagnetic Interference, EMI) shielding material, to keep away
The electromagnetic interference for exempting from the external world has an impact output module 10.
Incorporated by reference to Fig. 5, package substrate 111 is used to carry infrared lamp 12.When manufacture exports module 10, infrared lamp 12 can be with
It is formed on chip 14, then infrared lamp 12 and chip 14 is set along on package substrate 111, specifically, can be by chip
14 are bonded on package substrate 111.Meanwhile package substrate 111 can be used for other parts (examples with electronic device 100
Casing 20, the mainboard of such as electronic device 100) connection, output module 10 is fixed in electronic device 100.
Package wall 112 can surround infrared lamp 12 and light-guide device 13 and set, and package wall 112 is from package substrate 111
Extension, package wall 112 can be combined with package substrate 111, it is preferred that package wall 112 is removably with package substrate 111
Connection, in order to be overhauled to infrared lamp 12 after removing package wall 112.The making material of package wall 112 can be not
The material of saturating infrared light, package wall 112 is passed through to avoid the infrared light that infrared lamp 12 is sent.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113
Formed with luminescence window 1131, luminescence window 1131 is corresponding with infrared lamp 12, and the infrared light that infrared lamp 12 is launched is from luminescence window
1131 are pierced by.Encapsulation top 113 integrally formed can be obtained with package wall 112, can also split shape to obtain.In an example
In son, luminescence window 1131 is through hole, and the making material at encapsulation top 113 is the material of impermeable infrared light.In another example,
Encapsulation top 113 is formed by the material of impermeable infrared light and the material co-manufactured of saturating infrared light, specifically, luminescence window 1131
It is made of the material of saturating infrared light, remaining position is made of the material of impermeable infrared light, and further, luminescence window 1131 can be with
Formed with lens arrangement, to improve the infrared light emission angle projected from luminescence window 1131, such as luminescence window 1131 is formed
There is concavees lens structure, so that the divergence of beam through luminescence window 1131 outwards projects；Luminescence window 1131 is formed with convex lens
Structure, so that the light through luminescence window 1131 gathers outside injection.
Light-guide device 13 can be movably arranged in the luminous light path of infrared lamp 12.Fig. 5 and Fig. 6 are referred to, exports mould
Group 10 further includes actuator 17, and actuator 17 is used to drive light-guide device 13 to move so as to being movably arranged at infrared lamp 12
In the light path that shines.Wherein, actuator 17 drives light-guide device 13 to move so as to being movably arranged at the luminous light of infrared lamp 12
Include on road：Under normal conditions, light-guide device 13 is arranged in the luminous light path of infrared lamp 12, and infrared lamp 12 is used as infrared light compensating lamp
(or close to infrared lamp), when infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), actuator 17 drives light-guide device
13 move to leave the luminous light path of infrared lamp 12；Or under normal conditions, light-guide device 13 is not arranged in shining for infrared lamp 12
In light path, infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), when infrared lamp 12 is used as infrared light compensating lamp (or close to red
Outer lamp) when, actuator 17 drives light-guide device 13 to move in the luminous light path of infrared lamp 12.
Referring to Fig. 5, actuator 17 includes linear motor, linear motor includes stator 172 and mover 174, and stator 172 is pacified
In package wall 112, mover 174 is connected with light-guide device 13, and actuator 17 drives mover 174 to move to drive guide-lighting member
Part 13 moves.Referring to Fig. 6, the structure of above-mentioned actuator 17 could alternatively be：Actuator 17 includes linear motor, linear motor
Including stator 172 and mover 174, stator 172 is installed in package wall 112, and output module 10 further includes shaft 18 and connection
Arm 19, the first end connection light-guide device 13 of linking arm 19, the second end of mover 174 and the remote light-guide device 13 of linking arm 19
Connection, linking arm 19 are set in shaft 18, and shaft 18 is between light-guide device 13 and mover 174, the mover of linear motor
174 are drivingly connected the second end motion of arm 19, and linking arm 19 is rotated around shaft 18, and thus, the first end of linking arm 19 drives
Light-guide device 13 is rotated around shaft 18, to realize that light-guide device 13 is in the luminous light path of infrared lamp 12 or away from infrared lamp
12 luminous light path.In an embodiment of the present invention, output module 10 can also include loading plate (not shown), be opened on loading plate
Equipped with bearing holes, light-guide device 13 is installed in bearing holes, and actuator 17 is used to drive loading plate movement to drive light-guide device
13 movements.
Referring to Fig. 3, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 using as close to red
Outer lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 is launched is with the second visual field
Angle is emitted so that as infrared light compensating lamp, at this time, the first field angle is less than the second field angle from encapsulating housing 11, wherein, first regards
The scope of rink corner is 10 degree of -30 degree, for example, the first field angle is 10 degree, 15 degree, 20 degree, 25 degree or 30 degree etc., the second visual field
The scope at angle for 60 degree -90 degree, for example, the second field angle be 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 degree,
Or 90 degree etc..Light-guide device 13 is used to converge light, and light-guide device 13 includes convex lens or the lens group with positive light coke, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light passes through luminescence window
1131 scopes covered from the outgoing of encapsulating housing 11.
Referring to Fig. 4, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 to be used as infrared benefit
Light lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 is launched is with the second visual field
Angle is emitted so that as close to infrared lamp, at this time, the first field angle is more than the second field angle from encapsulating housing 11, wherein, first regards
The scope of rink corner for 60 degree -90 degree, for example, the first field angle be 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87
Degree or 90 degree etc., the scope of the second field angle is spent for 10 degree -30, for example, the second field angle is 10 degree, 15 degree, 20 degree, 25 degree,
Or 30 degree etc..Light-guide device 13 is used for divergent rays, and light-guide device 13 includes concavees lens or the lens group with negative power, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light passes through luminescence window
1131 scopes covered from the outgoing of encapsulating housing 11.
When infrared lamp 12 is opened and launches infrared light to outside encapsulating housing 11 as infrared light compensating lamp, infrared light passes through
Luminescence window 1131 is to project body surface, and the reception (as shown in Figure 1) of infrared pick-up first 62 of electronic device 100 is by object
The infrared light of reflection is to obtain the image information of object (at this time, infrared lamp 12 is used for infrared light filling).When infrared lamp 12 is opened simultaneously
During as launching infrared light to outside encapsulating housing 11 close to infrared lamp, infrared light is through luminescence window 1131 and reaches object table
Face, the proximity sensor 51 of electronic device 100 the infrared light (as shown in Figure 8) that be reflected by the object that receives is with detection object to electronics
The distance of device 100 (at this time, infrared lamp 12 is used for infrared distance measurement).
When infrared lamp 12 is used as infrared light compensating lamp and as close to can be with different power to encapsulating housing during infrared lamp
Transmitting infrared light outside 11.Specifically, infrared lamp 12 is used as with the first power to outside encapsulating housing 11 launching close to during infrared lamp
Infrared light, launches infrared light with the second power when infrared lamp 12 is used as infrared light compensating lamp to outside encapsulating housing 11, wherein, the
One power can be less than the second power.
Please refer to Fig.1 and Fig. 7, casing 20 can be as the installation carriers of output module 10, in other words, output module 10 can
To be arranged in casing 20.Casing 20 can be the shell of electronic device 100, in embodiments of the present invention, may be used also in casing 20
For setting the display screen 90 of electronic device 100, due to embodiment of the present invention output module 10 take small volume, because
This, is used to set the volume of display screen 90 to correspond to increase, to improve the screen accounting of electronic device 100 in casing 20.Tool
Body, casing 20 includes top 21 and bottom 22, and display screen 90 and output module 10 are arranged between top 21 and bottom 22,
In the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, as shown in Figure 1, output module 10 can
To be arranged between display screen 90 and top 21.In other embodiments, display screen 90 can open up jagged for screen comprehensively,
Display screen 90 surrounds output module 10, and the notch for exporting module 10 from display screen 90 exposes.
Casing 20 is further opened with casing through hole 23.When output module 10 is arranged in casing 20, infrared lamp 12 leads to casing
Hole 23 corresponds to.Wherein infrared lamp 12 is corresponding with casing through hole 23 refers to the light that infrared lamp 12 is sent and can be passed through from casing through hole 23,
Specifically, it can be infrared lamp 12 with 23 face of casing through hole or the light of the transmitting of infrared lamp 12 is through light-guide device 13
Casing through hole 23 is passed through after effect.
Cover board 30 can be printing opacity, and the material of cover board 30 can be glass, resin, plastics of printing opacity etc..Cover board 30 is set
Put on casing 20, cover board 30 includes the inner surface 32 combined with casing 20, and the outer surface 31 opposite with inner surface 32, defeated
Go out after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 7
In, cover board 30 covers casing through hole 23, and infrared transmission ink 40 is coated with the inner surface 32 of cover board 30, infrared to pass through ink 40
There is higher transmitance to infrared light, such as can reach 85% or more, and have higher attenuation rate to visible ray, for example, it is reachable
To more than 70% so that user during normal use, is visually difficult to see that on electronic device 100 and is covered by infrared through ink 40
Region.Specifically, it is infrared through ink 40 can cover on inner surface 32 not with 90 corresponding region of display screen.
Infrared to block casing through hole 23 (as shown in Figure 7) through ink 40, user is difficult to by casing through hole 23
See the internal structure of electronic device 100, the shape of electronic device 100 is more beautiful.
Referring to Fig. 8, receiving module 50 is integrated with proximity sensor 51 and optical flame detector 52, proximity sensor 51 and optical flame detector
52 are collectively forming single package body structure.The infrared light that infrared lamp 12 is sent out when being used as close to infrared lamp, it is anti-by external object
After penetrating, received by proximity sensor 51, proximity sensor 51 according to the infrared light reflected received judge external object with
The distance between electronic device 100.Optical flame detector 52 receives the visible ray in ambient light, and detects the intensity of visible ray, using as
The foundation of the display brightness of control display screen 90.Proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce
Gap when the two is individually assembled, saves the installation space in electronic device 100.
Please refer to Fig.1 and Fig. 8, imaging modules 60 can be visible image capturing first 61 and one in infrared pick-up first 62
Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is installed on microscope base 63, and image passes
Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it
Between.In the embodiment shown in fig. 8, receiving module 50 is arranged on mounting surface 631, and specifically, receiving module 50 is being installed
Plane orthographic projection where face 631 is at least partly dropped on mounting surface 631, in this way, receiving module 50 is set with imaging modules 60
Put compacter, the horizontal space that the two takes jointly is smaller.
Referring to Fig. 1, receiver 70 is used to send out acoustic signals when being encouraged be subject to power supply, user can by by
Words device 70 is conversed.Structured light projector 80 is used for outside emitting structural light, on project structured light to testee after it is anti-
Penetrate, the structure light reflected can be received by infrared pick-up first 62, and the processor of electronic device 100 is further analyzed by infrared light
The structure light that camera 62 receives, to obtain the depth information of testee.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, defeated
Go out that module 10, infrared pick-up are first 62, visible image capturing is first 61, the center of receiver 70 and structured light projector 80 is positioned at same
On line segment.Specifically, output module 10, structured light projector 80, receiver 70, red is followed successively by from one end of line segment to the other end
Outer light video camera head 62, visible image capturing first 61 (as shown in Figure 9)；Or output module is followed successively by from one end of line segment to the other end
10th, infrared pick-up is first 62, receiver 70, visible image capturing are first 61, structured light projector 80 (as shown in Figure 1)；Or from line
One end of section is followed successively by that infrared pick-up is first 62, the first 61, structure that exports module 10, receiver 70, visible image capturing to the other end
Light projector 80；Or it is followed successively by that infrared pick-up is first 62, visible image capturing is first 61, receiver from one end of line segment to the other end
70th, module 10, structured light projector 80 are exported.Certainly, module 10, infrared pick-up first 62 are exported, receiver 70, visible ray are taken the photograph
As the arrangement mode of first 61, structured light projector 80 is not limited to above-mentioned citing, there can also be other, such as each electronic component
The shape such as center arrangement in the arc-shaped, center arrangement is rectangular.
Further, incorporated by reference to Fig. 8, receiving module 50 can be arranged on the mounting surface 631 of infrared pick-up first 62,
It can be arranged on the mounting surface 631 of visible image capturing first 61, certainly, receiving module 50 can not also be arranged on mounting surface 631
On, receiving module 50 can be disposed adjacent with output module 10, and proximity sensor 51 is readily received to be used as connecing by infrared lamp 12
Launch during near-infrared lamp, and the infrared light being reflected back by external object；Receiving module 50 can also be disposed adjacent with receiver 70,
When user receives calls, proximity sensor 51 is readily detected the ear of user close to receiver 70.
To sum up, in the electronic device 100 of embodiment of the present invention, the position of mobile light-guide device 13 is passed through so that output
Module 10 can be used as, close to infrared lamp or infrared light compensating lamp, having gathered transmitting infrared light with infrared distance measurement and the work(of infrared light filling
Energy.Secondly, needed compared to current electronic device for being positioned proximate to infrared lamp and infrared light compensating lamp at the same time, the present invention is implemented
The output module 10 of mode only needs to set an infrared lamp 12, and small volume, has saved and realized infrared light filling and infrared distance measurement
The space of function.Furthermore it is packaged due to only needing an infrared lamp 12 being arranged on package substrate 111, compared to biography
The infrared light compensating lamp for technique of uniting is encapsulated with needing to be respectively adopted different wafers manufacture recombinants close to infrared lamp to PCB substrate,
Improve packaging efficiency.
Referring to Fig. 10, in some embodiments, output module 10 further includes optics sealing cover 16.Optics sealing cover 16 is by saturating
Luminescent material is made, and optics sealing cover 16 is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 16 wraps red
Outer lamp 12.Specifically, optics sealing cover 16 can be formed by encapsulating injection molding and forming technology, and optics sealing cover 16 can use transparent
Thermosetting epoxy resin is made, and to be not easy to soften in use, optics sealing cover 16 can fix the position of infrared lamp 12, and cause
Infrared lamp 12 is not easy to rock in encapsulating housing 11.At this time, light-guide device 13 is arranged on beyond optics sealing cover 16 and movably
It is housed in encapsulating housing 11.
1 is please referred to Fig.1, in some embodiments, proximity sensor 51 can be not integrated in reception mould with optical flame detector 52
In group 50, in other words, proximity sensor 51 is separately set with optical flame detector 52.At this time, proximity sensor 51 can be arranged on microscope base
On 63 mounting surface 631；Optical flame detector 52 can also be arranged on the mounting surface 631 of microscope base 63；Or proximity sensor 51 and light
Sensor 52 is arranged on the mounting surface 631 of microscope base 63 at the same time.Microscope base 63 can be the microscope base 63 of infrared pick-up first 62, can also
It is the microscope base 63 of visible image capturing first 61.
2 are please referred to Fig.1, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Offer cover board sound outlet hole 34, the position correspondence of receiver 70 and cover board sound outlet hole 34 and casing sound outlet hole.Export module 10, red
The center of outer light video camera head 62, visible image capturing first 61 and structured light projector 80 is located on same line segment, and receiver 70 is located at
Between the line segment and the top 21 of casing 20.
It is (output module 10, red each electronic component on cover board 30 is saved not on the line segment in the center of receiver 70
Outer light video camera head 62, visible image capturing are first 61, structured light projector 80 etc.) horizontal space that takes.In reality as shown in figure 12
Apply in example, cover board sound outlet hole 34 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
Referring again to Figure 13, in some embodiments, cover plate through hole 33, cover plate through hole can also be offered on cover board 30
33 is corresponding with casing through hole 23, and the infrared light that infrared lamp 12 is launched can be pierced by after passing through casing through hole 23 from cover plate through hole 33
Electronic device 100.
4 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on
On substrate 66, receiving module 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, one of substrate 66
Divide in microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and is used to carry image sensing
Device 65, the other end can be connected with the mainboard of electronic device 100.When receiving module 50 is arranged on substrate 66, receiving module 50
It is arranged on outside microscope base 63, receiving module 50 can also be connected with FPC.
Further, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, close to biography
Sensor 51 is collectively forming single package body structure with optical flame detector 52, reduces gap when the two is individually assembled, saves electronic device 100
Interior installation space.In other embodiments, being arranged on the receiving module 50 of substrate 66 includes proximity sensor 51 or/and light
Sensor 52, proximity sensor 51 and optical flame detector 52 are respectively single package body structure.That is, the receiving module 50 for being arranged on substrate 66 is
The proximity sensor 51 of single package body structure；Alternatively, the receiving module 50 for being arranged on substrate 66 is the light sensation of single package body structure
Device 52；Alternatively, the receiving module 50 for being arranged on substrate 66 is the proximity sensor 51 of single package body structure and single package body structure
Optical flame detector 52.
Imaging modules 60 can be visible image capturing first 61 and one or two in infrared pick-up first 62.Specifically,
Receiving module 50 can be fixed on the substrate 66 of visible image capturing first 61；Receiving module 50 can be fixed on infrared pick-up head
On 62 substrate 66.When proximity sensor 51 and optical flame detector 52 encapsulate for split, proximity sensor 51 can be fixed on visible
On the substrate 66 of light video camera head 61, optical flame detector 52 can be fixed on the substrate 66 of infrared pick-up first 62；Alternatively, optical flame detector 52
It can be fixed on the substrate 66 of visible image capturing first 61, proximity sensor 51 can be fixed on the substrate of infrared pick-up first 62
On 66；Alternatively, proximity sensor 51 is each attached on the substrate 66 of visible image capturing first 61 with optical flame detector 52；Alternatively, close pass
Sensor 51 is each attached on the substrate 66 of infrared pick-up first 62 with optical flame detector 52.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with receiving module 50, with increase
The integral strength of substrate 66 so that FPC is not susceptible to around folding, while receiving module 50 (or proximity sensor 51 or optical flame detector 52)
It is not susceptible to rock when being arranged on substrate 66.In one example, receiving module 50 (or proximity sensor 51 or optical flame detector
52) it may be also secured on the lateral wall of microscope base 63, such as be fixed on by cohesive mode on the lateral wall of microscope base 63.
5 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67
Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- 672 and the 3rd sub- top surface 673 of top surface, the second son top
672 and first sub- top surface 671 of face tilts connection and forms notch 675, the 3rd sub- top surface 673 and second with the first sub- top surface 671
Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- 671 and the 3rd sub- top surface 673 of top surface to connect first
Sub- 671 and the 3rd sub- top surface 673 of top surface.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight
Angle, the angle between the second sub- 672 and the 3rd sub- top surface 673 of top surface can be obtuse angle or right angle.Notch 675 is opened in camera shell
On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.3rd sub- top surface 673 offers out
Light through hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through hole 674.Imaging sensor 65 is housed in
In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through hole 674 and camera lens mould
Group 68 is simultaneously delivered on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Receiving module 50 is arranged on
At first sub- top surface 671, receiving module 50 includes proximity sensor 51 and optical flame detector 52.In present embodiment, imaging modules 60
Can be visible image capturing first 61, receiving module 50 is single packaging body knot that proximity sensor 51 is collectively forming with optical flame detector 52
Structure.Proximity sensor 51 can be consistent with the extending direction of notch 675 (such as Figure 15 institutes with the center line connecting direction of optical flame detector 52
Show)；Alternatively, proximity sensor 51 can be vertical with the extending direction of notch 675 with the center line connecting direction of optical flame detector 52 or be in
The two angle formed is acute angle or obtuse angle.In other embodiments, imaging modules 60 can be infrared pick-up first 62.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the first sub- top surface
On 671, receiving module 50 is set to set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, saves
Installation space in electronic device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce
Gap when the two is individually assembled, saves the installation space in electronic device 100.
Please continue to refer to Figure 15, in some embodiments, the receiving module 50 of the above embodiment is arranged on the first son
On top surface 671 and positioned at the outside of camera case 67, specifically, whole receiving module 50 is along perpendicular to the first sub- top surface 671
Projection can be located in the first sub- top surface 671 (as shown in figure 15)；Alternatively, part receiving module 50 is pushed up along perpendicular to the first son
The projection in face 671 is located in the first sub- top surface 671.That is, receiving module 50 is at least part of to be located at the first sub- top surface
671 surface, in this way, receiving module 50 sets compacter with imaging modules 60, the two horizontal space taken jointly compared with
It is small, further save the installation space in electronic device 100.In other embodiments, receiving module 50 is included close to biography
Sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two single single package body structures, at this time, are respectively
The proximity sensor 51 and optical flame detector 52 of single package body structure can also be all disposed within the first sub- top surface 671.
6 are please referred to Fig.1, in some embodiments, the receiving module 50 of the above embodiment only includes proximity sensor
51, not comprising optical flame detector 52, at this time, proximity sensor 51 (or receiving module 50) is respectively monomer encapsulation with optical flame detector 52 and ties
Structure, proximity sensor 51 are arranged on the first sub- top surface 671, and optical flame detector 52 is arranged on any other except the first sub- top surface 671
Position.
Please continue to refer to Figure 16, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector
52, and do not include proximity sensor 51, at this time, optical flame detector 52 (or receiving module 50) is respectively monomer envelope with proximity sensor 51
Assembling structure, optical flame detector 52 are arranged on the first sub- top surface 671, proximity sensor 51 be arranged on except the first sub- top surface 671 other
Optional position.
7 are please referred to Fig.1, the first sub- top surface 671 of the above embodiment offers loophole 676, and receiving module 50 is located at
It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without light sensation
Device 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100
The light in portion can pass through loophole 676 and be delivered on proximity sensor 51.The receiving module 50 of present embodiment is arranged on
In camera case 67, receiving module 50 and the structure of camera case 67 is set more to stablize and be easy to receiving module 50 and imaging mould
Group 60 is installed on casing 20.
Please continue to refer to 17, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50
It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close
Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics
Light outside device 100 can pass through loophole 676 and be delivered on optical flame detector 52.The receiving module 50 of present embodiment is set
Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and easy to by receiving module 50 with into
As module 60 is installed on casing 20.
8 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 be integrated with it is close
When sensor 51 is with optical flame detector 52, loophole 676 can be one and proximity sensor 51 and the corresponding printing opacity of optical flame detector 52
Hole or two it is spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, outside electronic device 100
On the proximity sensor 51 and optical flame detector 52 that light can pass through loophole 676 and be delivered in receiving module 50.In other realities
Apply in mode, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two
Individually list package body structure, at this time, the proximity sensor 51 and optical flame detector 52 for being respectively single package body structure can also all be set
Put in camera case 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, is made
Receiving module 50 and the structure of camera case 67 are more stablized and easy to which receiving module 50 and imaging modules 60 are installed to casing
On 20.
8 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes
Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground, FPC is provided with substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connected with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connected with FPC.This embodiment party
In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation
Device 52 is collectively forming single package body structure, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty
Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception
In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 also encapsulates for monomer
Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at
In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at
Outside camera case 67.
In yet another embodiment, optical flame detector 52 is only included in receiving module 50, proximity sensor 51, which is not integrated into, to be connect
Receive in module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 also seals for monomer
Assembling structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when one of substrate 66
Divide in camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate
On 66 and outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67
Structure is more stablized and easy to which receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base
Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, receiving module 50 is firmly mounted in camera case 67.
9 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 take the photograph module, including two imaging sensors 65, camera case 67 and two camera lens moulds to be double
Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677
678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread
Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a positioned at the first tread 677 with
With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677
Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle.
Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two
A light extraction through hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through holes 674
Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions
Through hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68,
Light outside electronic device 100 can pass through light extraction through hole 674 and camera lens module 68 and be delivered on imaging sensor 65.This reality
Apply in mode, imaging modules 60 can be visible image capturing first 61, and two camera lens modules 68 are visible image capturing first 61 at this time
Corresponding camera lens module.Receiving module 50 is arranged on the second tread 678 and outside camera case 67.Receiving module 50 is to connect
Single package body structure that nearly sensor 51 is collectively forming with optical flame detector 52.The line of centres side of proximity sensor 51 and optical flame detector 52
To can be consistent with the extending direction of notch 675；Alternatively, the center line connecting direction of proximity sensor 51 and optical flame detector 52 can be with
The extending direction of notch 675 vertical (as shown in figure 19) or the two angle formed are acute angle or obtuse angle.In other embodiment
In, imaging modules 60 can be infrared pick-up first 62, and two camera lens modules 68 are that infrared pick-up first 62 is corresponding at this time
Camera lens module.In yet another embodiment, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, at this time its
In a camera lens module 68 be first 62 corresponding camera lens module of infrared pick-up, another camera lens module 68 is visible image capturing head
61 corresponding camera lens modules.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the second tread 678
On, receiving module 50 is set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, has saved electronics
Installation space in device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce the two
Individually gap during assembling, saves the installation space in electronic device 100.
Figure 20 is referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670
On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread
The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through holes 674 are opened in the first son respectively
On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675
Both sides.At this time, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face
679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678,
Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second
Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first
The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment
In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second
Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in
The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating receiving module 50 is arranged on the second tread
On 678.
9 and Figure 20 is please referred to Fig.1, in some embodiments, the receiving module 50 of the above embodiment is arranged on second
On tread 678 and positioned at the outside of camera case 67.Specifically, it is whole when notch 675 is opened in the marginal position of top surface 670
A receiving module 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, part receives mould
Group 50 is located in the second tread 678 (as shown in figure 19) along the projection perpendicular to the second tread 678.That is, receiving module
The 50 at least part of surfaces for being located at the second tread 678.It is whole when notch 675 is opened on the centre position of top surface 670
A receiving module 50 can be located in the second tread 678 (as shown in figure 20) along perpendicular to the projection of the second tread 678.Such as
This, receiving module 50 sets compacter with imaging modules 60, and the horizontal space that the two takes jointly is smaller, further saves
Installation space in electronic device 100.In other embodiments, receiving module 50 includes proximity sensor 51 and optical flame detector
52, but proximity sensor 51 and optical flame detector 52 are two single single package body structures, at this time, are respectively single package body structure
Proximity sensor 51 and optical flame detector 52 can also be all disposed within the second tread 678.
Figure 20 is referred to, in some embodiments, the receiving module 50 of the above embodiment only includes close to sensing
Device 51, receiving module 50 do not include optical flame detector 52, and at this time, proximity sensor 51 (or receiving module 50) is respectively with optical flame detector 52
Cell packaging configuration, proximity sensor 51 are arranged on the second tread 678, and optical flame detector 52 is arranged on the casing outside imaging modules 60
On 20.
Figure 20 is referred to, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52,
Receiving module 50 does not include proximity sensor 51, and at this time, optical flame detector 52 (or receiving module 50) is respectively with proximity sensor 51
Cell packaging configuration, optical flame detector 52 are arranged on the second tread 678, and proximity sensor 51 is arranged on the casing outside imaging modules 60
On 20.
Figure 21 is referred to, the second tread 678 of the above embodiment offers loophole 676, and receiving module 50 is located at phase
It is in casing body 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without optical flame detector
52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100
Light can pass through and loophole 676 and be delivered on proximity sensor 51.The receiving module 50 of present embodiment is arranged on phase
In casing body 67, the structure of receiving module 50 and camera case 67 is set more to stablize and be easy to receiving module 50 and imaging modules
60 are installed on casing 20.
Please continue to refer to Figure 21, the second tread 678 of the above embodiment offers loophole 676, receiving module 50
It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close
Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics
Light outside device 100 can pass through loophole 676 and be delivered on optical flame detector 52.The receiving module 50 of present embodiment is set
Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and easy to by receiving module 50 with into
As module 60 is installed on casing 20.
Figure 22 is referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676,
Receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 is integrated with close to sensing
When device 51 and optical flame detector 52, loophole 676 can be one with proximity sensor 51 and the corresponding loophole of optical flame detector 52 or
Two spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, the light outside electronic device 100
On the proximity sensor 51 and optical flame detector 52 that loophole 676 can be passed through and be delivered in receiving module 50.In other embodiment party
In formula, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are independent for two
Single package body structure, at this time, the proximity sensor 51 and optical flame detector 52 for being respectively single package body structure can also be all disposed within
It is in camera case 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, makes reception
The structure of module 50 and camera case 67 is more stablized and easy to which receiving module 50 and imaging modules 60 are installed on casing 20.
Please continue to refer to Figure 22, in some embodiments, the second tread 678 of the above embodiment offers loophole
676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes
Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground, FPC is provided with substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connected with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connected with FPC.This embodiment party
In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation
Device 52 is collectively forming single package body structure, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty
Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception
In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 also encapsulates for monomer
Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at
In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at
Outside camera case 67.
In yet another embodiment, receiving module 50 only includes optical flame detector 52, and proximity sensor 51 is not integrated into reception
In module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 also encapsulates for monomer
Structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66
In camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate 66
Go up and be located at outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67
Structure is more stablized and easy to which receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base
Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, receiving module 50 is firmly mounted in camera case 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (14)
1. one kind output module, it is characterised in that the output module includes encapsulating housing, infrared lamp and light-guide device, described
Encapsulating housing includes package substrate, and the infrared lamp and the light-guide device are encapsulated in the encapsulating housing, the infrared lamp
On the package substrate, the light-guide device can be movably arranged in the luminous light path of the infrared lamp, work as institute for carrying
When stating light-guide device and being located in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting with the first field angle from
Encapsulating housing outgoing is using as infrared light compensating lamp or close to infrared lamp；When the light-guide device leaves the hair of the infrared lamp
When in light light path, the infrared light of infrared lamp transmitting is emitted using as close to red with the second field angle from the encapsulating housing
Outer lamp or infrared light compensating lamp.
2. output module according to claim 1, it is characterised in that
The light-guide device includes convex lens or the lens group with positive light coke, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted using as connecing with the first field angle from the encapsulating housing
Near-infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing to be used as infrared light compensating lamp；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted using as red with the first field angle from the encapsulating housing
Outer light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing using as close to infrared lamp.
3. output module according to claim 1, it is characterised in that the output module further includes chip, described infrared
Lamp is formed on the chip.
4. output module according to claim 3, it is characterised in that the encapsulating housing further includes package wall and encapsulation
Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute
It is corresponding with the infrared lamp formed with luminescence window, the luminescence window to state encapsulation top.
5. output module according to claim 1, it is characterised in that the output module is further included to be made of light transmissive material
Optics sealing cover, the optics sealing cover formed on the package substrate and in the encapsulating housing, the optics sealing cover
Wrap the infrared lamp.
6. a kind of electronic device, it is characterised in that the electronic device includes：
Casing；With
Output module described in claim 1-5 any one, the output module are arranged in the casing.
7. electronic device according to claim 6, it is characterised in that the electronic device further includes the cover board of printing opacity, institute
State casing and offer casing through hole, the infrared lamp is corresponding with the casing through hole, and the cover board is set on the housing.
8. electronic device according to claim 6, it is characterised in that the electronic device further includes the cover board of printing opacity, institute
State casing and offer casing through hole, the infrared lamp is corresponding with the casing through hole, and the cover board is set on the housing, institute
State cover board and pass through ink formed with the infrared of infrared light is only transmitted with the surface that the casing is combined, the infrared ink that passes through hides
Keep off the casing through hole.
9. electronic device according to claim 6, it is characterised in that the electronic device further includes receiving module and imaging
Module, the receiving module are integrated with proximity sensor and optical flame detector, and the imaging modules include microscope base, installed in the microscope base
On lens barrel and the imaging sensor that is housed in the microscope base, the microscope base include passing positioned at the lens barrel and described image
Mounting surface between sensor, the receiving module are arranged on the mounting surface.
10. electronic device according to claim 6, it is characterised in that the electronic device further includes proximity sensor, light
Sensor and imaging modules, the imaging modules include microscope base, the lens barrel on the microscope base and are housed in the microscope base
Interior imaging sensor, the microscope base includes the mounting surface between the lens barrel and described image sensor, described close
At least one in sensor and the optical flame detector is arranged on the mounting surface.
11. the electronic device according to claim 9 or 10, it is characterised in that the imaging modules include visible image capturing
At least one of head and infrared pick-up head.
12. electronic device according to claim 6, it is characterised in that the electronic device further include infrared pick-up head,
Visible image capturing head, receiver and structured light projector, the output module, the infrared pick-up head, the visible ray are taken the photograph
As the center of head, the receiver and the structured light projector is located on same line segment, from one end of the line segment to another
End is followed successively by：
The output module, the structured light projector, the receiver, the infrared pick-up head, the visible image capturing
Head；Or
The output module, the infrared pick-up head, the receiver, the visible image capturing head, the project structured light
Device；Or
The infrared pick-up head, the output module, the receiver, the visible image capturing head, the project structured light
Device；Or
The infrared pick-up head, the visible image capturing head, the receiver, the output module, the project structured light
Device.
13. electronic device according to claim 6, it is characterised in that the electronic device further includes receiver, infrared light
Camera, visible image capturing head, the cover board of structured light projector and printing opacity, the casing offer casing sound outlet hole, the lid
Plate offers cover board sound outlet hole, and the position correspondence of the receiver and the cover board sound outlet hole and the casing sound outlet hole is described
The center for exporting module, the infrared pick-up head, the visible image capturing head and the structured light projector is located at same line
Duan Shang, the receiver is between the line segment and the top of the casing.
14. electronic device according to claim 6, it is characterised in that the electronic device further include receiving module and into
As module, on the housing, the imaging modules include microscope base, the mirror on the microscope base for the imaging modules installation
Cylinder and part are arranged on the substrate in the microscope base；The receiving module is set on the substrate, and the receiving module includes
Proximity sensor and/or optical flame detector.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711433098.XA CN107995339B (en) | 2017-12-26 | 2017-12-26 | Output module and electronic device |
| PCT/CN2018/118683 WO2019128625A1 (en) | 2017-12-26 | 2018-11-30 | Output module, input and output module and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711433098.XA CN107995339B (en) | 2017-12-26 | 2017-12-26 | Output module and electronic device |
Publications (2)
| Publication Number | Publication Date |
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| CN107995339A true CN107995339A (en) | 2018-05-04 |
| CN107995339B CN107995339B (en) | 2020-08-28 |
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| WO2019128625A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic apparatus |
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|---|---|---|---|---|
| WO2019128625A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic apparatus |
| CN109639897A (en) * | 2018-12-20 | 2019-04-16 | 维沃移动通信有限公司 | A kind of light transmission method and device |
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| CN107995339B (en) | 2020-08-28 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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