CN108040147A - Input and output module and electronic device - Google Patents
Input and output module and electronic device Download PDFInfo
- Publication number
- CN108040147A CN108040147A CN201711433355.XA CN201711433355A CN108040147A CN 108040147 A CN108040147 A CN 108040147A CN 201711433355 A CN201711433355 A CN 201711433355A CN 108040147 A CN108040147 A CN 108040147A
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- China
- Prior art keywords
- light
- infrared
- infrared lamp
- input
- output module
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
Abstract
Electronic device disclosed by the invention and input and output module include encapsulating housing, infrared lamp, light-guide device and proximity sensor, encapsulating housing includes package substrate, infrared lamp, light-guide device and proximity sensor are encapsulated in encapsulating housing, infrared lamp and proximity sensor are carried on package substrate, light-guide device can be movably arranged in the luminous light path of infrared lamp, when light-guide device is located in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted using as infrared light compensating lamp or close to infrared lamp with the first field angle from encapsulating housing；When light-guide device is left in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted using as close to infrared lamp or infrared light compensating lamp with the second field angle from encapsulating housing；Proximity sensor is used to receive the infrared light that is reflected by the object to detect the distance of object.The integrated level of input and output module is higher, small volume, so as to save the space for the function of realizing infrared distance measurement and infrared light filling.
Description
Technical field
The present invention relates to consumer electronics technical field, more specifically, is related to a kind of input and output module and electronics dress
Put.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of the function element set
It is more and more, in order to realize distance detection, ambient light detection with the function such as the facial 3D feature recognitions of user, it is necessary to be set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be taken.
The content of the invention
Embodiment of the present invention provides a kind of input and output module and electronic device.
The input and output module of embodiment of the present invention includes encapsulating housing, infrared lamp, light-guide device and close sensing
Device, the encapsulating housing include package substrate, and the infrared lamp, the light-guide device and the proximity sensor are encapsulated in institute
State in encapsulating housing, the infrared lamp and the proximity sensor carry on the package substrate, the light-guide device energy
Enough it is movably arranged in the luminous light path of the infrared lamp, when the light-guide device is located in the luminous light path of the infrared lamp
When, the infrared light of infrared lamp transmitting is emitted as infrared light compensating lamp or to connect with the first field angle from the encapsulating housing
Near-infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing using as close to infrared lamp or infrared light compensating lamp；The proximity sensor is used for
The infrared light that is reflected by the object is received to detect the distance of object.
In some embodiments, the light-guide device includes convex lens or the lens group with positive light coke, when described
When light-guide device is located in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting is with the first field angle from institute
Encapsulating housing outgoing is stated using as close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, institute
The infrared light for stating infrared lamp transmitting is emitted to be used as infrared light compensating lamp with the second field angle from the encapsulating housing；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is positioned at described red
When in the luminous light path of outer lamp, the infrared light of the infrared lamp transmitting is emitted to make with the first field angle from the encapsulating housing
For infrared light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared lamp is launched infrared
Light is emitted using as close to infrared lamp with the second field angle from the encapsulating housing.
In some embodiments, the input and output module further includes chip, the infrared lamp and the close sensing
Device is respectively formed on the chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected between the encapsulation top and the package substrate, formed with luminous at the top of the encapsulation
Window and close to sensing window, the luminescence window is correspondings with the infrared lamp, described close to sensing window and the close biography
Sensor corresponds to.
In some embodiments, the input and output module is further included close to sensing lens, described close to sensing lens
It is arranged in the encapsulating housing and corresponding with the proximity sensor.
In some embodiments, the input and output module further includes metal shutter, and the metal shutter is located at
In the encapsulating housing and between the infrared lamp and the proximity sensor.
In some embodiments, the input and output module further includes the optics sealing cover made of light transmissive material, described
Optics sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps the infrared lamp
With the proximity sensor.
In some embodiments, the input and output module further includes out light clapboard, it is described go out light clapboard be formed in institute
State in optics sealing cover and between the infrared lamp and the proximity sensor.
In some embodiments, formed with grounding pin, infrared lamp pin and close biography on the input and output module
Feel pin, when the grounding pin and the infrared lamp pin are enabled, the infrared lamp launches infrared light；The grounding lead
Foot and it is described close to sensing pin be enabled when, the proximity sensor receives the infrared light that is reflected by the object to detect object
Distance.
The electronic device of embodiment of the present invention includes：
Casing；With
Input and output module described in above-mentioned any one embodiment, the input and output module are arranged on the casing
It is interior.
In some embodiments, the electronic device further includes the cover board of printing opacity, and the casing offers casing light source
Close to sensing through hole, the infrared lamp is corresponding with the casing light source through holes for through hole and casing, the proximity sensor with it is described
Casing is corresponded to close to sensing through hole, and the cover board is set on the housing.
In some embodiments, the electronic device further includes the cover board of printing opacity, and the casing offers casing light source
Close to sensing through hole, the infrared lamp is corresponding with the casing light source through holes for through hole and casing, the proximity sensor with it is described
Casing is corresponded to close to sensing through hole, and the cover board is set on the housing, the surface shape that the cover board is combined with the casing
Only transmit the infrared of infrared light into having and pass through ink, it is described infrared to block the casing light source through holes and the casing through ink
It is at least one in through hole close to sensing.
In some embodiments, the electronic device further includes optical flame detector and imaging modules, and the imaging modules include
Microscope base, the lens barrel on the microscope base and the imaging sensor being housed in the microscope base, the microscope base include being located at institute
The mounting surface between lens barrel and described image sensor is stated, the optical flame detector is arranged on the mounting surface.
In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head
Kind.
In some embodiments, the electronic device further include infrared pick-up head, visible image capturing head, receiver,
And structured light projector, the input and output module, the infrared pick-up head, the visible image capturing head, the receiver
It is located at the center of the structured light projector on same line segment, is followed successively by from one end of the line segment to the other end：
The input and output module, the structured light projector, the receiver, the infrared pick-up head, it is described can
See light video camera head；Or
The input and output module, the infrared pick-up head, the receiver, the visible image capturing head, the knot
Structure light projector；Or
The infrared pick-up head, the input and output module, the receiver, the visible image capturing head, the knot
Structure light projector；Or
The infrared pick-up head, the visible image capturing head, the receiver, the input and output module, the knot
Structure light projector.
In some embodiments, the electronic device further include receiver, infrared pick-up head, visible image capturing head,
The cover board of structured light projector and printing opacity, the casing offer casing sound outlet hole, and the cover board offers cover board sound outlet hole, institute
State the position correspondence of receiver and the cover board sound outlet hole and the casing sound outlet hole, it is the input and output module, described infrared
The center of light video camera head, the visible image capturing head and the structured light projector is located on same line segment, the receiver position
Between the top of the line segment and the casing.
In some embodiments, the electronic device further includes optical flame detector and imaging modules, the imaging modules installation
On the housing, the imaging modules include microscope base, the lens barrel on the microscope base and are partly arranged on the microscope base
Interior substrate；The optical flame detector is set on the substrate.
In some embodiments, the electronic device further includes imaging modules and optical flame detector, the imaging modules installation
On the housing, the imaging modules include camera case and camera lens module, the top surface of the camera case for cascaded surface simultaneously
Including connected the first sub- top surface and the second sub- top surface, the relatively described first sub- top surface inclination of the second sub- top surface and with it is described
First sub- top surface forms notch, and the top surface offers light extraction through hole, and the camera lens module is housed in the camera case simultaneously
Corresponding with the light extraction through hole, the optical flame detector is arranged at the described first sub- top surface.
In some embodiments, the electronic device further includes imaging modules and optical flame detector, and the imaging modules include
Camera case and two camera lens modules, offer notch to form step-like top surface on the top surface of the camera case, described
Top surface includes the first tread and the second tread less than first tread, and offering two light extractions on first tread leads to
Hole, each light extraction through hole is corresponding with the camera lens module, and the optical flame detector is arranged at second tread.
The position that the electronic device and input and output module of embodiment of the present invention pass through mobile light-guide device so that input
Output module can be used as close to infrared lamp or infrared light compensating lamp, and infrared lamp, light-guide device and proximity sensor are integrated into a list
Package body structure, makes input and output module group launch and receive infrared light with the function of infrared distance measurement and infrared light filling
Function.Secondly, needed compared to current electronic device for being positioned proximate to infrared lamp and infrared light compensating lamp at the same time, the present invention is real
Applying the input and output module of mode only needs to set an infrared lamp, small volume.Further, infrared lamp and proximity sensor
A single package body structure is integrated into, the integrated level of input and output module is higher, small volume, and input and output module has saved reality
The space of the function of existing infrared distance measurement and infrared light filling.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become obvious, or recognized by the practice of embodiments of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of certain embodiments of the present invention；
Fig. 2 is the schematic perspective view of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 3 is the view of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 4 is the view of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 5 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 6 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 7 is the part isometric schematic diagram of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 8 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 9 is the optical flame detector of the electronic device of certain embodiments of the present invention and the schematic perspective view of imaging modules；
Figure 10 is the arrangement schematic diagram of the electronic component of the electronic device of certain embodiments of the present invention；
Figure 11 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention；
Figure 12 is the structure diagram of the electronic device of certain embodiments of the present invention；
Figure 13 is the partial sectional schematic view of the electronic device of certain embodiments of the present invention；
Figure 14 is the partial sectional schematic view of the electronic device of certain embodiments of the present invention；
Figure 15 to Figure 22 is optical flame detector and the three-dimensional signal of imaging modules of the electronic device of certain embodiments of the present invention
Figure.
Embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the same or similar element of expression eventually or there is same or like element.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity
Sub- component includes input and output module 10, optical flame detector 50 (such as Fig. 9), imaging modules 60 (such as Fig. 9), receiver 70 and structure light
The projector 80.Electronic device 100 can be mobile phone, tablet computer, laptop, intelligent watch, Intelligent bracelet, automatic teller machine
Deng the embodiment of the present invention is illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the concrete form of electronic device 100
Can be other, this is not restricted.
Refer to Fig. 2 to Fig. 4, input and output module 10 is single package body structure, including encapsulating housing 11, infrared lamp 12,
Light-guide device 13 and proximity sensor 1a.
Encapsulating housing 11 be used at the same time encapsulate infrared lamp 12, light-guide device 13 and with proximity sensor 1a, it is in other words, infrared
Lamp 12, light-guide device 13 and proximity sensor 1a are encapsulated in encapsulating housing 11 at the same time.Encapsulating housing 11 includes package substrate
111st, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference (Electromagnetic
Interference, EMI) shielding material is made, input and output module 10 had an impact to avoid extraneous electromagnetic interference.
Incorporated by reference to Fig. 5, package substrate 111 is used to carry infrared lamp 12 and proximity sensor 1a at the same time.It is defeated in manufacture input
When going out module 10, infrared lamp 12 and proximity sensor 1a can be formed on a piece of chip 14, then by infrared lamp 12, close to pass
Sensor 1a and chip 14 are set along on package substrate 111, and specifically, chip 14 can be bonded on package substrate 111.
Meanwhile package substrate 111 can be used for other parts of electronic device 100 (such as the casing 20 of electronic device 100,
Mainboard etc.) connection, input and output module 10 is fixed in electronic device 100.Infrared lamp 12 and proximity sensor 1a
To be formed on a piece of chip 14, the volume after further reduction infrared lamp 12 and proximity sensor 1a are integrated, and preparation process
It is simpler.
Package wall 112 can surround infrared lamp 12, light-guide device 13 and proximity sensor 1a and set, package wall 112
Extend from package substrate 111, package wall 112 can be combined with package substrate 111, it is preferred that package wall 112 and package substrate
111 is detachably connected, in order to be overhauled to infrared lamp 12 and proximity sensor 1a after removing package wall 112.Envelope
The making material of dress side wall 112 can be the material of impermeable infrared light, and encapsulation is passed through to avoid the infrared light that infrared lamp 12 is sent
Side wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113
Formed with luminescence window 1131 and close to sensing window 1132, luminescence window 1131 is corresponding with infrared lamp 12, and infrared lamp 12 is launched
Infrared light be pierced by from luminescence window 1131；Corresponding with proximity sensor 1a close to sensing window 1132, what is be reflected by the object is red
Outer light can be passed through close to sensing window 1132 and incided on proximity sensor 1a.Encapsulation top 113 can with package wall 112
Obtained with integrally formed, can also split shape to obtain.In one example, luminescence window 1131 and close sensing window 1132
It is through hole, the making material at encapsulation top 113 is impermeable infrared light and the material being opaque to visible light but.In another example, seal
Dress top 113 is formed by the material of impermeable infrared light, saturating infrared light and the material co-manufactured that is opaque to visible light but, specifically, hair
Light window 1131 and it is made close to sensing window 1132 by the material of saturating infrared light, remaining position is by impermeable infrared light and impermeable
The material of visible ray is made, and further, luminescence window 1131 could be formed with lens arrangement, to improve from luminescence window 1131
The infrared light emission angle of injection, such as luminescence window 1131 is formed with concavees lens structure, so that through luminescence window 1131
Divergence of beam outwards projects；Luminescence window 1131 is formed with convex lens structures, so that the light through luminescence window 1131 is gathered
Outwards project；Close sensing window 1132 can also be formed with lens arrangement, to improve from close 1132 incidence of sensing window
Infrared light emission angle, such as have convex lens structures so that by the light close to 1132 incidence of sensing window close to sensing window 1132
Line is gathered and is projected on proximity sensor 1a.
Light-guide device 13 can be movably arranged in the luminous light path of infrared lamp 12.Fig. 5 and Fig. 6 are referred to, input is defeated
Go out module 10 and further include actuator 17, actuator 17 is used to drive light-guide device 13 to move so as to being movably arranged at infrared lamp
In 12 luminous light path.Wherein, actuator 17 drives light-guide device 13 to move so as to being movably arranged at the hair of infrared lamp 12
Include in light light path：Under normal conditions, light-guide device 13 is arranged in the luminous light path of infrared lamp 12, and infrared lamp 12 is used as infrared benefit
Light lamp (or close to infrared lamp), when infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), actuator 17 drives leaded light
Element 13 is moved to leave the luminous light path of infrared lamp 12；Or under normal conditions, light-guide device 13 is not arranged in infrared lamp 12
In the light path that shines, infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), (or is connect when infrared lamp 12 is used as infrared light compensating lamp
Near-infrared lamp) when, actuator 17 drives light-guide device 13 to move in the luminous light path of infrared lamp 12.
Referring to Fig. 5, actuator 17 includes linear motor, linear motor includes stator 172 and mover 174, and stator 172 is pacified
In package wall 112, mover 174 is connected with light-guide device 13, and actuator 17 drives mover 174 to move to drive guide-lighting member
Part 13 moves.Referring to Fig. 6, the structure of above-mentioned actuator 17 could alternatively be：Actuator 17 includes linear motor, linear motor
Including stator 172 and mover 174, stator 172 is installed in package wall 112, input and output module 10 further include shaft 18 and
Linking arm 19, the first end connection light-guide device 13 of linking arm 19, the of the remote light-guide device 13 of mover 174 and linking arm 19
Two ends connect, and linking arm 19 is set in shaft 18, shaft 18 between light-guide device 13 and mover 174, linear motor
Mover 174 is drivingly connected the second end motion of arm 19, and linking arm 19 is rotated around shaft 18, thus, the first end of linking arm 19
Light-guide device 13 is driven to be rotated around shaft 18, to realize that light-guide device 13 is in the luminous light path of infrared lamp 12 or away from red
The luminous light path of outer lamp 12.In an embodiment of the present invention, input and output module 10 can also include loading plate (not shown), hold
Bearing holes are offered on support plate, light-guide device 13 is installed in bearing holes, and actuator 17 is used to drive loading plate movement to drive
Light-guide device 13 moves.
Referring to Fig. 3, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 using as close to red
Outer lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 is launched is with the second visual field
Angle is emitted so that as infrared light compensating lamp, at this time, the first field angle is less than the second field angle from encapsulating housing 11, wherein, first regards
The scope of rink corner is 10 degree of -30 degree, for example, the first field angle is 10 degree, 15 degree, 20 degree, 25 degree or 30 degree etc., the second visual field
The scope at angle for 60 degree -90 degree, for example, the second field angle be 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 degree,
Or 90 degree etc..Light-guide device 13 is used to converge light, and light-guide device 13 includes convex lens or the lens group with positive light coke, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light passes through luminescence window
1131 scopes covered from the outgoing of encapsulating housing 11.
Referring to Fig. 4, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 to be used as infrared benefit
Light lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 is launched is with the second visual field
Angle is emitted so that as close to infrared lamp, at this time, the first field angle is more than the second field angle from encapsulating housing 11, wherein, first regards
The scope of rink corner for 60 degree -90 degree, for example, the first field angle be 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87
Degree or 90 degree etc., the scope of the second field angle is spent for 10 degree -30, for example, the second field angle is 10 degree, 15 degree, 20 degree, 25 degree,
Or 30 degree etc..Light-guide device 13 is used for divergent rays, and light-guide device 13 includes concavees lens or the lens group with negative power, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light passes through luminescence window
1131 scopes covered from the outgoing of encapsulating housing 11.
When infrared lamp 12 is opened and launches infrared light to outside encapsulating housing 11 as infrared light compensating lamp, infrared light passes through
Luminescence window 1131 is to project body surface, and the reception (as shown in Figure 1) of infrared pick-up first 62 of electronic device 100 is by object
The infrared light of reflection is to obtain the image information of object (at this time, infrared lamp 12 is used for infrared light filling).When infrared lamp 12 is opened simultaneously
During as launching infrared light to outside encapsulating housing 11 close to infrared lamp, infrared light is through luminescence window 1131 and reaches object table
Face, the proximity sensor 1a of electronic device 100 receive the infrared light that is reflected by the object with detection object to electronic device 100 away from
From (at this time, infrared lamp 12 is used for infrared distance measurement).
When infrared lamp 12 is used as infrared light compensating lamp and as close to can be with different power to encapsulating housing during infrared lamp
Transmitting infrared light outside 11.Specifically, infrared lamp 12 is used as with the first power to outside encapsulating housing 11 launching close to during infrared lamp
Infrared light, launches infrared light with the second power when infrared lamp 12 is used as infrared light compensating lamp to outside encapsulating housing 11, wherein, the
One power can be less than the second power.
The visible ray (as shown in Figure 9) received in ambient light of optical flame detector 50, and detect the intensity of visible ray.
Incorporated by reference to Fig. 7, in embodiments of the present invention, draw on input and output module 10 formed with grounding pin 1e, infrared lamp
Foot 1f and close sensing pin 1g.Grounding pin 1e, infrared lamp pin 1f and close sensing pin 1g can be formed in encapsulation
On substrate 111, (that is, grounding pin 1e and infrared lamp pin 1f accesses when grounding pin 1e and infrared lamp pin 1f is enabled
During circuit turn-on), infrared lamp 12 launches infrared light；When grounding pin 1e, close sensing pin 1g and infrared lamp pin 1f quilts
When enabled (that is, when grounding pin 1e, close sensing pin 1g, infrared lamp pin 1f access circuit turn-ons), and control infrared lamp
During infrared light of 12 transmittings for infrared distance measurement, proximity sensor 1a receives the infrared light that is reflected by the object to detect thing
The distance of body.
Please refer to Fig.1 and Fig. 8, casing 20 can be as the installation carriers of input and output module 10, in other words, input and output
Module 10 can be arranged in casing 20.Casing 20 can be the shell of electronic device 100, in embodiments of the present invention, casing
It can be additionally used in the display screen 90 that electronic device 100 is set in 20, since the input and output module 10 of embodiment of the present invention takes
Small volume, therefore, in casing 20 be used to set the volume of display screen 90 to correspond to increase, to improve electronic device
100 screen accounting.Specifically, casing 20 includes top 21 and bottom 22, and display screen 90 and input and output module 10 are arranged on top
Between portion 21 and bottom 22, in the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, such as
Shown in Fig. 1, input and output module 10 can be arranged between display screen 90 and top 21.In other embodiments, display screen
90 can be that screen open up jagged comprehensively, and display screen 90 surrounds input and output module 10, and input and output module 10 is from display
The notch of screen 90 exposes.
Casing 20 is further opened with casing light source through holes 23 and casing close to sensing through hole 24.Input and output module 10 is arranged on
When in casing 20, infrared lamp 12 is corresponding with casing light source through holes 23, and proximity sensor 1a is corresponding close to sensing through hole 24 with casing.
Wherein infrared lamp 12 is corresponding with casing light source through holes 23 refers to the light that infrared lamp 12 is sent and can be passed through from casing light source through holes 23, has
Body, it can be infrared lamp 12 with 23 face of casing light source through holes or the light of the transmitting of infrared lamp 12 is through light-guide device
Casing light source through holes 23 are passed through after 13 effects.Close to sensing, through hole 24 is corresponding to refer to what is be reflected by the object to proximity sensor 1a with casing
Infrared light can be passed through from casing close to sensing through hole 24 and incided on proximity sensor 1a, can approach biography specifically
Sensor 1a passes through casing close to sensing through hole 24 with casing close to sensing 24 face of through hole or the light of infrared light incidence
And incided after light-guide device acts on proximity sensor 1a.Casing light source through holes 23 and casing can be with close to sensing through hole 24
Be apart from one another by, certainly, in other embodiments, casing light source through holes 23 and casing close to sensing through hole 24 can also be mutual
It is connected.
Cover board 30 can be printing opacity, and the material of cover board 30 can be glass, resin, plastics of printing opacity etc..Cover board 30 is set
Put on casing 20, cover board 30 includes the inner surface 32 combined with casing 20, and the outer surface 31 opposite with inner surface 32, defeated
Enter to export after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In reality as shown in Figure 8
Apply in example, cover board 30 covers casing light source through holes 23 and casing close to through hole 24 is sensed, and is coated with the inner surface 32 of cover board 30
Infrared transmission ink 40, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and it is right
Visible ray has higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronics
By the infrared region covered through ink 40 on device 100.Specifically, it is infrared to be covered on inner surface 32 not through ink 40
With 90 corresponding region of display screen.
It is infrared to block casing light source through holes 23 and casing close at least one in sensing through hole 24 through ink 40
It is a, i.e. infrared to block casing light source through holes 23 and casing at the same time close to sensing through hole 24 (such as Fig. 8 institutes through ink 40
Show), user is difficult to the internal structure for seeing electronic device 100 close to sensing through hole 24 by casing light source through holes 23 and casing,
The shape of electronic device 100 is more beautiful；It is infrared to block casing light source through holes 23 through ink 40, and do not block casing and connect
Nearly sensing through hole 24；Or the infrared ink 40 that passes through can also block casing close to sensing through hole 24, and casing light source is not blocked
Through hole 23.
Referring to Fig. 9, optical flame detector 50 is single package body structure.Optical flame detector 50 receives the visible ray in ambient light, and detects
The intensity of visible ray, using the foundation of the display brightness as control display screen 90.
Please refer to Fig.1 and Fig. 9, imaging modules 60 can be visible image capturing first 61 and one in infrared pick-up first 62
Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is installed on microscope base 63, and image passes
Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it
Between.In embodiment as shown in Figure 9, optical flame detector 50 is arranged on mounting surface 631, and specifically, optical flame detector 50 is in mounting surface 631
The plane orthographic projection at place is at least partly dropped on mounting surface 631, in this way, optical flame detector 50 sets tighter with imaging modules 60
Gather, the horizontal space that the two takes jointly is smaller.
Referring to Fig. 1, receiver 70 is used to send out acoustic signals when being encouraged be subject to power supply, user can by by
Words device 70 is conversed.Structured light projector 80 is used for outside emitting structural light, on project structured light to testee after it is anti-
Penetrate, the structure light reflected can be received by infrared pick-up first 62, and the processor of electronic device 100 is further analyzed by infrared light
The structure light that camera 62 receives, to obtain the depth information of testee.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, defeated
Enter to export that module 10, infrared pick-up are first 62, visible image capturing is first 61, the center of receiver 70 and structured light projector 80 is located at
On same line segment.Specifically, be followed successively by from one end of line segment to the other end input and output module 10, structured light projector 80, by
Talk about that device 70, infrared pick-up be first 62, visible image capturing first 61 (as shown in Figure 10), at this time, it is seen that light video camera head 61 and infrared light
Camera 62 can form double photography/videography heads (as shown in figure 19)；Or input and output are followed successively by the other end from one end of line segment
Module 10, infrared pick-up are first 62, receiver 70, visible image capturing are first 61, structured light projector 80 (as shown in Figure 1)；Or
Infrared pick-up first 62, input and output module 10, receiver 70, visible image capturing head are followed successively by from one end of line segment to the other end
61st, structured light projector 80；Or it is followed successively by that infrared pick-up is first 62, visible image capturing head from one end of line segment to the other end
61st, receiver 70, input and output module 10, structured light projector 80, at this time, it is seen that light video camera head 61 and infrared pick-up first 62
Double photography/videography heads (as shown in figure 19) can be formed.Certainly, input and output module 10, infrared pick-up be first 62, receiver 70, can
See that light video camera head 61, the arrangement mode of structured light projector 80 are not limited to above-mentioned citing, there can also be other, such as each electronics
The center of component arranges the shapes such as in the arc-shaped, center arrangement is rectangular.
Further, incorporated by reference to Fig. 9, optical flame detector 50 can be arranged on the mounting surface 631 of infrared pick-up first 62, also may be used
To be arranged on the mounting surface 631 of visible image capturing first 61, certainly, optical flame detector 50 can not also be arranged on mounting surface 631, example
Such as, optical flame detector 50 can be disposed adjacent with input and output module 10, or be disposed adjacent with receiver 70, and this is not restricted.
To sum up, in the electronic device 100 of embodiment of the present invention, the position of mobile light-guide device 13 is passed through so that input
Output module 10 can be used as integrating close to infrared lamp or infrared light compensating lamp, infrared lamp 12, light-guide device 13 and proximity sensor 1a
For a single package body structure, make input and output module 10 gathered transmitting and receive infrared light with the function of infrared distance measurement and
The function of infrared light filling.Secondly, need to be positioned proximate to infrared lamp and infrared light compensating lamp at the same time compared to current electronic device and
Speech, the input and output module 10 of embodiment of the present invention only need to set an infrared lamp 12, small volume.Further, it is red
Outer lamp 12 and proximity sensor 1a are integrated into a single package body structure, and the integrated level of input and output module 10 is higher, volume compared with
It is small, so as to save the space for the function of realizing infrared distance measurement and infrared light filling.Furthermore due to only needing an infrared lamp 12
It is arranged on same package substrate 111 and is packaged with proximity sensor 1a, infrared light compensating lamp compared to traditional handicraft,
Need to be respectively adopted different wafers close to infrared lamp and proximity sensor 1a and manufacture recombinants and encapsulated to PCB substrate, improved
Packaging efficiency.
Referring again to Fig. 5, in some embodiments, input and output module 10 is further included close to sensing lens 1b.It is close
Sensing lens 1b is arranged in encapsulating housing 11 and corresponding with proximity sensor 1a.Infrared light is converged to close to sensing lens 1b
On proximity sensor 1a, reduce infrared light and be transferred to proximity sensor 1a with the light quantity of exterior domain.
Referring to Fig. 5, in some embodiments, input and output module 10 further includes metal shutter 1c, metal blocks
Plate 1c is located in encapsulating housing 11 and between infrared lamp 12 and proximity sensor 1a.Metal shutter 1c is located at infrared lamp 12
Between proximity sensor 1a, the infrared light that infrared lamp 12 is sent can be avoided to incide on proximity sensor 1a, moreover it is possible to from shielding
Cover infrared lamp 12 and electromagnetic interference mutual proximity sensor 1a.
1 is please referred to Fig.1, in some embodiments, input and output module 10 further includes optics sealing cover 16.Optics sealing cover 16
It is made of light transmissive material, optics sealing cover 16 is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 16 wraps up
Firmly infrared lamp 12 and proximity sensor 1a.Specifically, optics sealing cover 16 can be formed by encapsulating injection molding and forming technology, optics envelope
Cover 16 can be made of transparent thermosetting epoxy resin, and to be not easy to soften in use, optics sealing cover 16 can be fixed red
Relative position between outer lamp 12 and proximity sensor 1a, and cause infrared lamp 12 and proximity sensor 1a in encapsulating housing 11
It is not easy to rock.At this time, light-guide device 13 is arranged on beyond optics sealing cover 16 and is movably housed in encapsulating housing 11.
1 is please referred to Fig.1, in some embodiments, input and output module 10 further includes out light clapboard 1d, goes out light clapboard 1d
It is formed in optics sealing cover 16 and between infrared lamp 12 and proximity sensor 1a.Infrared lamp 12 can be stopped by going out light clapboard 1d
Incided in the infrared light of initial transmissions on proximity sensor 1a, while stop from close to sensing window 1132 and enter simultaneously directive
The infrared light of proximity sensor 1a influences shining for infrared lamp 12.
Referring to Fig. 9, in some embodiments, the optical flame detector 50 of the above embodiment can be arranged on the peace of microscope base 63
On dress face 631.Microscope base 63 can be the microscope base 63 of infrared pick-up first 62 or the microscope base 63 of visible image capturing first 61.
2 are please referred to Fig.1, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Offer cover board sound outlet hole 34, the position correspondence of receiver 70 and cover board sound outlet hole 34 and casing sound outlet hole.Input and output module
10th, infrared pick-up is first 62, the center of visible image capturing first 61 and structured light projector 80 is located on same line segment, receiver 70
Between the line segment and the top 21 of casing 20.
On the line segment, each electronic component (input and output module on cover board 30 has not been saved in the center of receiver 70
10th, infrared pick-up is first 62, visible image capturing is first 61, structured light projector 80 etc.) horizontal space that takes.As shown in figure 12
Embodiment in, cover board sound outlet hole 34 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
Referring again to Figure 13, in some embodiments, cover board light source through holes 33, cover board can also be offered on cover board 30
Light source through holes 33 are corresponding with casing light source through holes 23, and the infrared light that infrared lamp 12 is launched can be from after passing through casing light source through holes 23
Electronic device 100 is pierced by cover board light source through holes 33.
4 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to sensing through hole 35, cover board
Corresponding close to sensing through hole 24 and proximity sensor 1a with casing close to sensing through hole 35, electronic device 100 is outer anti-by object
The infrared light penetrated can incide proximity sensor 1a through cover board close to sensing through hole 35 and casing close to after sensing through hole 24
On.
5 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on
On substrate 66, optical flame detector 50 may be also secured on substrate 66.Specifically, FPC, a part for substrate 66 are provided with substrate 66
In microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and for carrying imaging sensor
65, the other end can be connected with the mainboard of electronic device 100.When optical flame detector 50 is arranged on substrate 66, optical flame detector 50 is arranged on
Outside microscope base 63, optical flame detector 50 can also be connected with FPC.
Imaging modules 60 can be visible image capturing first 61 and one or two in infrared pick-up first 62.Specifically,
Optical flame detector 50 can be fixed on the substrate 66 of visible image capturing first 61；Optical flame detector 50 can be fixed on infrared pick-up first 62
On substrate 66.Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with optical flame detector 50, with increase
The integral strength of substrate 66 so that FPC is not susceptible to around folding, while when optical flame detector 50 is arranged on substrate 66 is not susceptible to shake
It is dynamic.In one example, optical flame detector 50 may be also secured on the lateral wall of microscope base 63, such as is fixed on by cohesive mode
On the lateral wall of microscope base 63.
6 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67
Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- 672 and the 3rd sub- top surface 673 of top surface, the second son top
672 and first sub- top surface 671 of face tilts connection and forms notch 675, the 3rd sub- top surface 673 and second with the first sub- top surface 671
Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- 671 and the 3rd sub- top surface 673 of top surface to connect first
Sub- 671 and the 3rd sub- top surface 673 of top surface.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight
Angle, the angle between the second sub- 672 and the 3rd sub- top surface 673 of top surface can be obtuse angle or right angle.Notch 675 is opened in camera shell
On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.3rd sub- top surface 673 offers out
Light through hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through hole 674.Imaging sensor 65 is housed in
In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through hole 674 and camera lens mould
Group 68 is simultaneously delivered on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Optical flame detector 50 is arranged on
At one sub- top surface 671.In present embodiment, imaging modules 60 can be visible image capturing first 61, and optical flame detector 50 is single packaging body
Structure.
The imaging modules 60 of present embodiment offer notch 675, and optical flame detector 50 is arranged on the first sub- top surface 671
On, optical flame detector 50 is set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, has saved electronics dress
Put the installation space in 100.
Please continue to refer to Figure 16, in some embodiments, the optical flame detector 50 of the above embodiment is arranged on the first son top
On face 671 and positioned at the outside of camera case 67, specifically, whole optical flame detector 50 is along the projection perpendicular to the first sub- top surface 671
It can be located in the first sub- top surface 671 (as shown in figure 15)；Alternatively, part optical flame detector 50 is along perpendicular to the first sub- top surface 671
Projection be located in the first sub- top surface 671.That is, optical flame detector 50 is at least part of to be located at the first sub- top surface 671 just
Top, in this way, optical flame detector 50 sets compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, further
The installation space in electronic device 100 is saved.
7 are please referred to Fig.1, the first sub- top surface 671 of the above embodiment offers loophole 676, and optical flame detector 50 is located at phase
It is in casing body 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be delivered to light
On sensor 50.The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67
More stablize and easy to which optical flame detector 50 and imaging modules 60 are installed on casing 20.
8 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, optical flame detector 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image sensing
Device 65 is arranged on substrate 66, and optical flame detector 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically, base
It is provided with FPC on plate 66, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can be with
The mainboard connection of electronic device 100.In other embodiments, optical flame detector 50 can also be connected with FPC.
The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67 more
Add and stablize and easy to which optical flame detector 50 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60 set substrate 66 simultaneously
Optical flame detector 50 is arranged on substrate 66, optical flame detector 50 is firmly mounted in camera case 67.
9 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 take the photograph module, including two imaging sensors 65, camera case 67 and two camera lens moulds to be double
Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677
678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread
Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a positioned at the first tread 677 with
With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677
Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle.
Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two
A light extraction through hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through holes 674
Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions
Through hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68,
Light outside electronic device 100 can pass through light extraction through hole 674 and camera lens module 68 and be delivered on imaging sensor 65.This reality
Apply in mode, imaging modules 60 can be visible image capturing first 61, and two camera lens modules 68 are visible image capturing first 61 at this time
Corresponding camera lens module.Optical flame detector 50 is arranged on the second tread 678 and outside camera case 67.Optical flame detector 50 encapsulates to be single
Body structure.In other embodiments, imaging modules 60 can be infrared pick-up first 62, and two camera lens modules 68 are at this time
First 62 corresponding camera lens module of infrared pick-up.In yet another embodiment, imaging modules 60 include visible image capturing first 61 and
Infrared pick-up first 62, wherein camera lens module 68 is first 62 corresponding camera lens module of infrared pick-up at this time, another camera lens mould
Group 68 is first 61 corresponding camera lens module of visible image capturing.
The imaging modules 60 of present embodiment offer notch 675, and optical flame detector 50 is arranged on the second tread 678
On, optical flame detector 50 is set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, has saved electronics dress
Put the installation space in 100.
Figure 20 is referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670
On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread
The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through holes 674 are opened in the first son respectively
On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675
Both sides.At this time, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face
679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678,
Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second
Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first
The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment
In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second
Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in
The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating optical flame detector 50 is arranged on the second tread 678
On.
9 and Figure 20 is please referred to Fig.1, in some embodiments, the optical flame detector 50 of the above embodiment is arranged on the second ladder
On face 678 and positioned at the outside of camera case 67.Specifically, when notch 675 is opened in the marginal position of top surface 670, entirely
Optical flame detector 50 can be located in the second tread 678 (as shown in figure 19) along perpendicular to the projection of the second tread 678；Alternatively, portion
Light splitting sensor 50 is located in the second tread 678 along perpendicular to the projection of the second tread 678.That is, optical flame detector 50 is at least
A part is located at the surface of the second tread 678.When notch 675 is opened on the centre position of top surface 670, whole optical flame detector
50 can be located in the second tread 678 (as shown in figure 20) along perpendicular to the projection of the second tread 678.In this way, optical flame detector 50
Set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, further saves in electronic device 100
Installation space.
Figure 21 is referred to, the second tread 678 of the above embodiment offers loophole 676, and optical flame detector 50 is located at camera
It is in housing 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be delivered to light sensation
On device 50.The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67 more
Add and stablize and easy to which optical flame detector 50 and imaging modules 60 are installed on casing 20.
Figure 22 is referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676,
Optical flame detector 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, imaging sensor 65
It is arranged on substrate 66, optical flame detector 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically, substrate 66
On be provided with FPC, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can be with electronics
The mainboard connection of device 100.In other embodiments, optical flame detector 50 can also be connected with FPC.
The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67 more
Add and stablize and easy to which optical flame detector 50 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60 set substrate 66 simultaneously
Optical flame detector 50 is arranged on substrate 66, optical flame detector 50 is firmly mounted in camera case 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (16)
1. a kind of input and output module, it is characterised in that the input and output module includes encapsulating housing, infrared lamp, guide-lighting member
Part and proximity sensor, the encapsulating housing include package substrate, the infrared lamp, the light-guide device and the close biography
Sensor is encapsulated in the encapsulating housing, and the infrared lamp and the proximity sensor carry on the package substrate,
The light-guide device can be movably arranged in the luminous light path of the infrared lamp, when the light-guide device is positioned at described infrared
When in the luminous light path of lamp, the infrared light of infrared lamp transmitting with the first field angle from the encapsulating housing be emitted using as
Infrared light compensating lamp or close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared lamp
The infrared light of transmitting is emitted using as close to infrared lamp or infrared light compensating lamp with the second field angle from the encapsulating housing；It is described
Proximity sensor is used to receive the infrared light that is reflected by the object to detect the distance of object.
2. input and output module according to claim 1, it is characterised in that
The light-guide device includes convex lens or the lens group with positive light coke, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted using as connecing with the first field angle from the encapsulating housing
Near-infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing to be used as infrared light compensating lamp；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted using as red with the first field angle from the encapsulating housing
Outer light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing using as close to infrared lamp.
3. input and output module according to claim 1, it is characterised in that the input and output module further includes chip,
The infrared lamp and the proximity sensor are respectively formed on the chip.
4. input and output module according to claim 3, it is characterised in that the encapsulating housing further include package wall and
Encapsulation top, the package wall extend from the package substrate and be connected at the top of the encapsulation and the package substrate it
Between, formed with luminescence window and close to sensing window at the top of the encapsulation, the luminescence window is corresponding with the infrared lamp, described
It is corresponding with the proximity sensor close to sensing window.
5. input and output module according to claim 3, it is characterised in that the input and output module is further included close to biography
Feel lens, the close sensing lens are arranged in the encapsulating housing and corresponding with the proximity sensor.
6. input and output module according to claim 1, it is characterised in that the input and output module further includes metal screening
Baffle, the metal shutter are located in the encapsulating housing and between the infrared lamp and the proximity sensor.
7. input and output module according to claim 1, it is characterised in that the input and output module is further included by printing opacity
Optics sealing cover made of material, the optics sealing cover is formed on the package substrate and in the encapsulating housing, described
Optics sealing cover wraps the infrared lamp and the proximity sensor.
8. input and output module according to claim 7, it is characterised in that the input and output module further include light extraction every
Plate, it is described go out light clapboard be formed in the optics sealing cover and between the infrared lamp and the proximity sensor.
9. according to the input and output module described in claim 1-8 any one, it is characterised in that on the input and output module
Formed with grounding pin, infrared lamp pin and sensing pin is approached, when the grounding pin and the infrared lamp pin are enabled,
The infrared lamp launches infrared light；When the grounding pin and the close sensing pin are enabled, the proximity sensor
The infrared light that is reflected by the object is received to detect the distance of object.
10. a kind of electronic device, it is characterised in that the electronic device includes：
Casing；With
Input and output module described in claim 1-9 any one, the input and output module are arranged in the casing.
11. electronic device according to claim 10, it is characterised in that the electronic device further includes the cover board of printing opacity,
The casing offers casing light source through holes and casing close to sensing through hole, the infrared lamp and the casing light source through holes pair
Should, the proximity sensor is corresponding close to sensing through hole with the casing, and the cover board is set on the housing.
12. electronic device according to claim 10, it is characterised in that the electronic device further includes the cover board of printing opacity,
The casing offers casing light source through holes and casing close to sensing through hole, the infrared lamp and the casing light source through holes pair
Should, the proximity sensor is corresponding close to sensing through hole with the casing, and the cover board is set on the housing, the cover board
Ink is passed through formed with the infrared of infrared light is only transmitted with the surface that the casing is combined, the infrared transmission ink blocks described
Casing light source through holes and the casing are at least one in through hole close to sensing.
13. electronic device according to claim 10, it is characterised in that the electronic device further includes optical flame detector and imaging
Module, the imaging modules include microscope base, the lens barrel on the microscope base and the image sensing being housed in the microscope base
Device, the microscope base include the mounting surface between the lens barrel and described image sensor, and the optical flame detector is arranged on described
On mounting surface.
14. electronic device according to claim 10, it is characterised in that the electronic device further includes optical flame detector and imaging
Module, on the housing, the imaging modules include microscope base, the lens barrel on the microscope base for the imaging modules installation
The substrate being partly arranged in the microscope base；The optical flame detector is set on the substrate.
15. electronic device according to claim 10, it is characterised in that the electronic device further includes imaging modules and light
Sensor, on the housing, the imaging modules include camera case and camera lens module, the camera for the imaging modules installation
The top surface of housing is for cascaded surface and the first sub- top surface and the second sub- top surface including being connected, the second sub- top surface relatively described the
One sub- top surface inclination simultaneously forms notch with the described first sub- top surface, and the top surface offers light extraction through hole, and the camera lens module is received
Appearance is in the camera case and corresponding with the light extraction through hole, and the optical flame detector is arranged at the described first sub- top surface.
16. electronic device according to claim 10, it is characterised in that the electronic device further includes imaging modules and light
Sensor, the imaging modules include camera case and two camera lens modules, offered on the top surface of the camera case notch with
Step-like top surface is formed, the top surface includes the first tread and the second tread less than first tread, first ladder
Two light extraction through holes are offered on face, each light extraction through hole is corresponding with the camera lens module, and the optical flame detector is arranged on institute
State at the second tread.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711433355.XA CN108040147B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
| PCT/CN2018/118683 WO2019128625A1 (en) | 2017-12-26 | 2018-11-30 | Output module, input and output module and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711433355.XA CN108040147B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN108040147A true CN108040147A (en) | 2018-05-15 |
| CN108040147B CN108040147B (en) | 2020-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711433355.XA Active CN108040147B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019128625A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic apparatus |
| CN111337995A (en) * | 2018-12-18 | 2020-06-26 | 夏普株式会社 | Optical proximity sensor and portable terminal device |
Citations (2)
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| US20130038535A1 (en) * | 2011-08-12 | 2013-02-14 | Pixart Imaging Inc. | Optical pointing device |
| CN107480589A (en) * | 2017-07-07 | 2017-12-15 | 广东欧珀移动通信有限公司 | Infrared light supply component and electronic installation |
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| US20130038535A1 (en) * | 2011-08-12 | 2013-02-14 | Pixart Imaging Inc. | Optical pointing device |
| CN107480589A (en) * | 2017-07-07 | 2017-12-15 | 广东欧珀移动通信有限公司 | Infrared light supply component and electronic installation |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2019128625A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic apparatus |
| CN111337995A (en) * | 2018-12-18 | 2020-06-26 | 夏普株式会社 | Optical proximity sensor and portable terminal device |
| CN111337995B (en) * | 2018-12-18 | 2023-05-23 | 夏普株式会社 | Optical proximity sensor and portable terminal device |
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| CN108040147B (en) | 2020-08-28 |
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