CN107968865A - Export module and electronic device - Google Patents

Export module and electronic device Download PDF

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Publication number
CN107968865A
CN107968865A CN201711437492.0A CN201711437492A CN107968865A CN 107968865 A CN107968865 A CN 107968865A CN 201711437492 A CN201711437492 A CN 201711437492A CN 107968865 A CN107968865 A CN 107968865A
Authority
CN
China
Prior art keywords
light
infrared
infrared lamp
casing
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711437492.0A
Other languages
Chinese (zh)
Inventor
吴安平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201711437492.0A priority Critical patent/CN107968865A/en
Publication of CN107968865A publication Critical patent/CN107968865A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/33—Transforming infrared radiation

Abstract

The invention discloses one kind output module and electronic device.Output module includes encapsulating housing, infrared lamp, light-guide device and structured light projector.Encapsulating housing includes package substrate.Infrared lamp, light-guide device and structured light projector are encapsulated in encapsulating housing.Infrared lamp and structured light projector are carried on package substrate.Light-guide device can be movably arranged in the luminous light path of infrared lamp.When light-guide device is located in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted using as infrared light compensating lamp or close to infrared lamp with the first field angle from encapsulating housing；When light-guide device is left in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted using as close to infrared lamp or infrared light compensating lamp with the second field angle from encapsulating housing.It is higher to export the integrated level of module and electronic device, small volume, while the packaging efficiency for exporting module is higher.

Description

Export module and electronic device
Technical field
The present invention relates to consumer electronics technical field, more specifically, is related to a kind of output module and electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of the function element set It is more and more, in order to realize distance detection, ambient light detection with the function such as the facial 3D feature recognitions of user, it is necessary to be set in electronics The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth Numerous function elements is put, the excessive space of mobile phone can be taken.
The content of the invention
Embodiment of the present invention provides a kind of output module and electronic device.
The output module of embodiment of the present invention includes encapsulating housing, infrared lamp, light-guide device and structured light projector, institute Stating encapsulating housing includes package substrate, and the infrared lamp, the light-guide device and the structured light projector are encapsulated in the envelope Fill in housing, on the package substrate, the light-guide device can move for the infrared lamp and structured light projector carrying It is arranged on dynamicly in the luminous light path of the infrared lamp, when the light-guide device is located in the luminous light path of the infrared lamp, The infrared light of the infrared lamp transmitting is emitted to be used as infrared light compensating lamp or close with the first field angle from the encapsulating housing Infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting with Second field angle is emitted using as close to infrared lamp or infrared light compensating lamp from the encapsulating housing.
In some embodiments, the light-guide device includes convex lens or the lens group with positive light coke, when described When light-guide device is located in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting is with the first field angle from institute Encapsulating housing outgoing is stated using as close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, institute The infrared light for stating infrared lamp transmitting is emitted to be used as infrared light compensating lamp with the second field angle from the encapsulating housing；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is positioned at described red When in the luminous light path of outer lamp, the infrared light of the infrared lamp transmitting is emitted to make with the first field angle from the encapsulating housing For infrared light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared lamp is launched infrared Light is emitted using as close to infrared lamp with the second field angle from the encapsulating housing.
In some embodiments, the output module further includes chip, the infrared lamp and the structured light projector Formed on the chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly The package substrate extends and is connected at the top of the encapsulation between the package substrate, formed with first at the top of the encapsulation Light-emitting window and the second light-emitting window, first light-emitting window is corresponding with the infrared lamp, second light-emitting window and institute State structured light projector correspondence.
In some embodiments, the output module further includes metal shutter, and the metal shutter is positioned at described In encapsulating housing, and between the infrared lamp and the structured light projector.
The electronic device of embodiment of the present invention includes：
Casing；With
Output module described in any of the above-described embodiment, the output module are arranged in the casing.
In some embodiments, the electronic device further includes the cover board of printing opacity, and it is infrared that the casing offers casing Through hole and casing structure light through hole, the infrared lamp is corresponding with the infrared through hole of the casing, the structured light projector with it is described Casing structure light through hole corresponds to, and the cover board is set on the housing.
In some embodiments, the cover board and the surface that the casing is combined are formed with only transmitting the infrared of infrared light Through ink, it is described it is infrared blocked through ink in the infrared through hole of the casing and the casing structure light through hole at least one It is a.
In some embodiments, the electronic device further includes receiving module and imaging modules, the receiving module collection Into having proximity sensor and optical flame detector, the imaging modules include microscope base, the lens barrel on the microscope base and are housed in institute The imaging sensor in microscope base is stated, the microscope base includes the mounting surface between the lens barrel and described image sensor, institute State receiving module and be arranged on the mounting surface.
In some embodiments, the electronic device further includes proximity sensor, optical flame detector and imaging modules, described Imaging modules include microscope base, the lens barrel on the microscope base and the imaging sensor being housed in the microscope base, the mirror Seat includes mounting surface positioned at the lens barrel and described image sensor between, in the proximity sensor and the optical flame detector It is at least one to be arranged on the mounting surface.
In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head Kind.
In some embodiments, the electronic device further include receiver, infrared pick-up head, visible image capturing head and The cover board of printing opacity, the casing offer casing sound outlet hole, and the cover board offers cover board sound outlet hole, the receiver with it is described The position correspondence of cover board sound outlet hole and the casing sound outlet hole, the output module, the infrared pick-up head and described visible The center of light video camera head is located on same line segment, and the receiver is between the line segment and the top of the casing.
In some embodiments, the electronic device further includes receiving module and imaging modules, the imaging modules peace In the casing, the imaging modules include microscope base, the lens barrel on the microscope base and part and are arranged on the mirror Substrate in seat；The receiving module is set on the substrate, and the receiving module includes proximity sensor and/or light sensation Device.
In the output module and electronic device of embodiment of the present invention, pass through the position of mobile light-guide device so that infrared Lamp can be used as close to infrared lamp or infrared light compensating lamp, integrated structure light projector, export module group transmitting infrared light with red The function of outer ranging, infrared light filling and three-dimensional imaging, therefore, it is higher to export the integrated level of module, small volume, exports module section About realize the space of the function of infrared distance measurement, infrared light filling and three-dimensional imaging.Further, since structured light projector and infrared lamp It is carried on same package substrate, structured light projector compared to traditional handicraft, need close to infrared lamp, infrared light compensating lamp The encapsulation in different wafer manufacture recombinants to PCB substrate is respectively adopted, improves packaging efficiency.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become obvious, or recognized by the practice of embodiments of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the schematic perspective view of the output module of the electronic device of embodiment of the present invention；
Fig. 3 is the view of the output module of the electronic device of embodiment of the present invention；
Fig. 4 is the view of the output module of the electronic device of embodiment of the present invention；
Fig. 5 and Fig. 6 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Fig. 7 is the partial sectional schematic view of the electronic device of embodiment of the present invention；
Fig. 8 is the receiving module of the electronic device of embodiment of the present invention and the schematic perspective view of imaging modules；
Fig. 9 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 10 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Figure 11 is the proximity sensor of embodiment of the present invention and the schematic perspective view of imaging modules；
Figure 12 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 13 is the partial sectional schematic view of the electronic device of embodiment of the present invention；
Figure 14 is the partial sectional schematic view of the electronic device of embodiment of the present invention；
Figure 15 to Figure 23 is the receiving module of the electronic device of embodiment of the present invention and the schematic perspective view of imaging modules.
Embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing To the same or similar element of expression eventually or there is same or like element.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's Embodiment, and be not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity Sub- component includes output module 10, receiving module 50 (such as Fig. 8), imaging modules 60 (such as Fig. 8) and receiver 70.Electronic device 100 can be mobile phone, tablet computer, laptop, intelligent watch, Intelligent bracelet, automatic teller machine etc., and the embodiment of the present invention is with electricity Sub-device 100 is illustrated exemplified by mobile phone, it will be understood that the concrete form of electronic device 100 can be other, not make herein Limitation.
Fig. 2 and Fig. 5 are referred to, exports module 10 as single package body structure, including encapsulating housing 11, infrared lamp 12, leaded light Element 13 and structured light projector 14.
Encapsulating housing 11 is used to encapsulate infrared lamp 12, light-guide device 13 and structured light projector 14 at the same time, in other words, infrared Lamp 12, light-guide device 13 and structured light projector 14 are encapsulated in encapsulating housing 11 at the same time.Encapsulating housing 11 includes package substrate 111st, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference (Electromagnetic Interference, EMI) shielding material is made, output module 10 had an impact to avoid extraneous electromagnetic interference.
Package substrate 111 is used to carry infrared lamp 12 and structured light projector 14.When manufacture exports module 10, infrared lamp 12 and structured light projector 14 can be formed on chip 15, then by infrared lamp 12, structured light projector 14 and chip 15 together It is arranged on package substrate 111, specifically, chip 15 can be bonded on package substrate 111.Meanwhile package substrate 111 It can be used for being connected with other parts (such as the casing 20 of electronic device 100, mainboard etc.) of electronic device 100, will be defeated Go out module 10 to be fixed in electronic device 100.
Package wall 112 can be set around infrared lamp 12, light-guide device 13 and structured light projector 14, package wall 112 extend from package substrate 111, and package wall 112 can be combined with package substrate 111, it is preferred that package wall 112 and encapsulation Substrate 111 is detachably connected, in order to throw infrared lamp 12, light-guide device 13 and structure light after removing package wall 112 Emitter 14 is overhauled.The making material of package wall 112 can be the material of impermeable infrared light, to avoid infrared lamp 12 or knot The infrared light that structure light projector 14 is sent passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113 Formed with the first light-emitting window 1131 and the second light-emitting window 1132, the first light-emitting window 1131 is corresponding with infrared lamp 12, infrared The infrared light that lamp 12 is launched is pierced by from the first light-emitting window 1131；Second light-emitting window 1132 is corresponding with structured light projector 14, The structure light (infrared light) that structured light projector 14 is launched is pierced by from the second light-emitting window 1132.Encapsulation top 113 and package-side Wall 112 integrally formed can obtain, can also split shape to obtain.In one example, the first light-emitting window 1131 and second Light-emitting window 1132 is through hole, and the making material at encapsulation top 113 is the material of impermeable infrared light.In another example, encapsulate Top 113 is formed by the material of impermeable infrared light and the material co-manufactured of saturating infrared light, specifically, the first light-emitting window 1131 It is made with the second light-emitting window 1132 of the material of saturating infrared light, remaining position is made of the material of impermeable infrared light, further Ground, the first light-emitting window 1131 and the second light-emitting window 1132 could be formed with lens arrangement, to improve from the first light-emitting window 1131 and the second infrared light emission angle that projects of light-emitting window 1132, such as the second light-emitting window 1132 is formed with concavees lens knot Structure, so that the divergence of beam through the second light-emitting window 1132 outwards projects；First light-emitting window 1131 is formed with convex lens knot Structure, so that the light through the first light-emitting window 1131 gathers outside injection.
Light-guide device 13 can be movably arranged in the luminous light path of infrared lamp 12.Fig. 5 and Fig. 6 are referred to, exports mould Group 10 further includes actuator 17, and actuator 17 is used to drive light-guide device 13 to move so as to being movably arranged at infrared lamp 12 In the light path that shines.Wherein, actuator 17 drives light-guide device 13 to move so as to being movably arranged at the luminous light of infrared lamp 12 Include on road：Under normal conditions, light-guide device 13 is arranged in the luminous light path of infrared lamp 12, and infrared lamp 12 is used as infrared light compensating lamp (or close to infrared lamp), when infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), actuator 17 drives light-guide device 13 move to leave the luminous light path of infrared lamp 12；Or under normal conditions, light-guide device 13 is not arranged in shining for infrared lamp 12 In light path, infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), when infrared lamp 12 is used as infrared light compensating lamp (or close to red Outer lamp) when, actuator 17 drives light-guide device 13 to move in the luminous light path of infrared lamp 12.
Referring to Fig. 5, actuator 17 includes linear motor, linear motor includes stator 172 and mover 174, and stator 172 is pacified In package wall 112, mover 174 is connected with light-guide device 13, and actuator 17 drives mover 174 to move to drive guide-lighting member Part 13 moves.Referring to Fig. 6, the structure of above-mentioned actuator 17 could alternatively be：Actuator 17 includes linear motor, linear motor Including stator 172 and mover 174, stator 172 is installed in package wall 112, and output module 10 further includes shaft 18 and connection Arm 19, the first end connection light-guide device 13 of linking arm 19, the second end of mover 174 and the remote light-guide device 13 of linking arm 19 Connection, linking arm 19 are set in shaft 18, and shaft 18 is between light-guide device 13 and mover 174, the mover of linear motor 174 are drivingly connected the second end motion of arm 19, and linking arm 19 is rotated around shaft 18, and thus, the first end of linking arm 19 drives Light-guide device 13 is rotated around shaft 18, to realize that light-guide device 13 is in the luminous light path of infrared lamp 12 or away from infrared lamp 12 luminous light path.In an embodiment of the present invention, output module 10 can also include loading plate (not shown), be opened on loading plate Equipped with bearing holes, light-guide device 13 is installed in bearing holes, and actuator 17 is used to drive loading plate movement to drive light-guide device 13 movements.
Referring to Fig. 3, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12 Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 using as close to red Outer lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 is launched is with the second visual field Angle is emitted so that as infrared light compensating lamp, at this time, the first field angle is less than the second field angle from encapsulating housing 11, wherein, first regards The scope of rink corner is 10 degree of -30 degree, for example, the first field angle is 10 degree, 15 degree, 20 degree, 25 degree or 30 degree etc., the second visual field The scope at angle for 60 degree -90 degree, for example, the second field angle be 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 degree, Or 90 degree etc..Light-guide device 13 is used to converge light, and light-guide device 13 includes convex lens or the lens group with positive light coke, thoroughly Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light goes out optical window through first Scopes of the mouth 1131 from the outgoing covering of encapsulating housing 11.
Referring to Fig. 4, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12 Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 to be used as infrared benefit Light lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 is launched is with the second visual field Angle is emitted so that as close to infrared lamp, at this time, the first field angle is more than the second field angle from encapsulating housing 11, wherein, first regards The scope of rink corner for 60 degree -90 degree, for example, the first field angle be 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 Degree or 90 degree etc., the scope of the second field angle is spent for 10 degree -30, for example, the second field angle is 10 degree, 15 degree, 20 degree, 25 degree, Or 30 degree etc..Light-guide device 13 is used for divergent rays, and light-guide device 13 includes concavees lens or the lens group with negative power, thoroughly Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light goes out optical window through first Scopes of the mouth 1131 from the outgoing covering of encapsulating housing 11.
When infrared lamp 12 is opened and launches infrared light to outside encapsulating housing 11 as infrared light compensating lamp, infrared light passes through For first light-emitting window 1131 to project body surface, the infrared pick-up first 62 of electronic device 100 is (as shown in Figure 1) to receive quilt The infrared light of object reflection is to obtain the image information of object (at this time, infrared lamp 12 is used for infrared light filling).When infrared lamp 12 is opened Open and be used as close to infrared lamp launch infrared light to outside encapsulating housing 11 when, infrared light is through the first light-emitting window 1131 and arriving Up to body surface, the proximity sensor 51 of electronic device 100 the infrared light (as shown in Figure 8) that be reflected by the object that receives is with detectable substance Distance of the body to electronic device 100 (at this time, infrared lamp 12 is used for infrared distance measurement).
When infrared lamp 12 is used as infrared light compensating lamp and as close to can be with different power to encapsulating housing during infrared lamp Transmitting infrared light outside 11.Specifically, infrared lamp 12 is used as with the first power to outside encapsulating housing 11 launching close to during infrared lamp Infrared light, launches infrared light with the second power when infrared lamp 12 is used as infrared light compensating lamp to outside encapsulating housing 11, wherein, the One power can be less than the second power.
Fig. 5 and Fig. 6 are referred to, structured light projector 14 can be formed on a piece of chip 15 with infrared lamp 12, further Reduce volume of the structured light projector 14 with infrared lamp 12 after integrated, and preparation process is simpler.Structured light projector 14 can be to Outer transmitting structure light, structure light can form infrared laser speckle pattern, and project structured light to target object surface, is taken the photograph by infrared light As first 62 it is (as shown in Figure 1) gathers by the modulated structured light patterns of target object, by the structured light patterns to being modulated into Row analysis calculates the depth image for obtaining target object (at this time, structured light projector 14 is used for three-dimensional imaging).Of the invention real Apply in example, structured light projector 14 includes light source 141, mirror holder 142, lens 143 and diffraction optical element (diffractive optical elements,DOE)144.The light beam that light source 141 is sent is after lens 143 are collimated or converged by diffraction optical element 144 are expanded and are outwards launched with certain beam pattern.Specifically, light source 141 can be formed on chip 15,143 He of lens Diffraction optical element 144 can be fixed on mirror holder 1422, such as is fixed on by gluing mode on mirror holder 142.
Please refer to Fig.1 and Fig. 7, casing 20 can be as the installation carriers of output module 10, in other words, output module 10 can To be arranged in casing 20.Casing 20 can be the shell of electronic device 100, in embodiments of the present invention, may be used also in casing 20 For setting the display screen 90 of electronic device 100, due to embodiment of the present invention output module 10 take small volume, because This, is used to set the volume of display screen 90 to correspond to increase, to improve the screen accounting of electronic device 100 in casing 20.Tool Body, casing 20 includes top 21 and bottom 22, and display screen 90 and output module 10 are arranged between top 21 and bottom 22, In the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, as shown in Figure 1, output module 10 can To be arranged between display screen 90 and top 21.In other embodiments, display screen 90 can open up jagged for screen comprehensively, Display screen 90 surrounds output module 10, and the notch for exporting module 10 from display screen 90 exposes.
Casing 20 is further opened with the infrared through hole 23 of casing and casing structure light through hole 24.Output module 10 is arranged on casing 20 When interior, the through hole 23 infrared with casing of infrared lamp 12 is corresponding, and structured light projector 14 is corresponding with casing structure light through hole 24.It is wherein red The outer through hole 23 infrared with casing of lamp 12 is corresponding, which to refer to the light that infrared lamp 12 is sent, to be passed through from the infrared through hole 23 of casing, specifically, It can be infrared lamp 12 with infrared 23 face of through hole of casing or the light of the transmitting of infrared lamp 12 is after leaded light device acts on Through the infrared through hole 23 of casing.Structured light projector 14 is corresponding with casing structure light through hole 24 similarly, and therefore not to repeat here.Such as In embodiment shown in Fig. 7, the infrared through hole 23 of casing and casing structure light through hole 24 can be apart from one another by certainly, at it In his embodiment, the infrared through hole 23 of casing and casing structure light through hole 24 can also interconnect.
Cover board 30 can be printing opacity, and the material of cover board 30 can be glass, resin, plastics of printing opacity etc..Cover board 30 is set Put on casing 20, cover board 30 includes the inner surface 32 combined with casing 20, and the outer surface 31 opposite with inner surface 32, defeated Go out after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 7 In, cover board 30 covers the infrared through hole 23 of casing and casing structure light through hole 24, is coated with the inner surface 32 of cover board 30 infrared Ink 40 is crossed, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and to visible ray There is higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device By the infrared region covered through ink 40 on 100.Specifically, it is infrared to be covered on inner surface 32 not with showing through ink 40 90 corresponding region of display screen.
It is infrared can also be blocked through ink 40 it is at least one in the infrared through hole 23 of casing and casing structure light through hole 24, That is, it is infrared to block the infrared through hole 23 of casing and casing structure light through hole 24 (as shown in Figure 7), user at the same time through ink 40 It is difficult to the internal structure that electronic device 100 is seen by the infrared through hole 23 of casing and casing structure light through hole 24, electronic device 100 Shape it is more beautiful；It is infrared to cover the infrared through hole 23 of casing through ink 40, and casing structure light through hole 24 is not covered； Or the infrared ink 40 that passes through can also cover casing structure light through hole 24, and the infrared through hole 23 of casing is not covered.
Referring to Fig. 8, receiving module 50 is integrated with proximity sensor 51 and optical flame detector 52, proximity sensor 51 and optical flame detector 52 are collectively forming single packaging body.The infrared light that infrared lamp 12 is sent out when being used as close to infrared lamp, after being reflected by external object, Received by proximity sensor 51, proximity sensor 51 judges that external object is filled with electronics according to the infrared light reflected received Put the distance between 100.Optical flame detector 52 receives the visible ray in ambient light, and detects the intensity of visible ray, to be shown as control The foundation of the display brightness of display screen 90.Proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, and it is single to reduce the two Solely gap during assembling, saves the installation space in electronic device 100.
Please refer to Fig.1 and Fig. 8, imaging modules 60 can be visible image capturing first 61 and one in infrared pick-up first 62 Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is installed on microscope base 63, and image passes Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it Between.In the embodiment shown in fig. 8, receiving module 50 is arranged on mounting surface 631, and specifically, receiving module 50 is being installed Plane orthographic projection where face 631 is at least partly dropped on mounting surface 631, in this way, receiving module 50 is set with imaging modules 60 Put compacter, the horizontal space that the two takes jointly is smaller.
Referring to Fig. 1, receiver 70 is used to send out acoustic signals when being encouraged be subject to power supply, user can by by Words device 70 is conversed.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, defeated The center for going out module 10, infrared pick-up first 62, visible image capturing first 61 and receiver 70 is located on same line segment.Specifically, Output module 10, visible image capturing first 61, receiver 70, infrared pick-up first 62 are followed successively by from one end of line segment to the other end (as shown in Figure 9)；Or be followed successively by from one end of line segment to the other end output module 10, receiver 70, visible image capturing it is first 61, Infrared pick-up first 62 (as shown in Figure 1)；Or it is followed successively by that infrared pick-up is first 62, output mould from one end of line segment to the other end Group 10, receiver 70, visible image capturing first 61.Certainly, module 10, infrared pick-up first 62, receiver 70 and visible ray are exported The arrangement mode of camera 61 is not limited to above-mentioned citing, can also there is other, such as the center of each electronic component is arranged in Arc-shaped, center arranges the shape such as rectangular.
Further, incorporated by reference to Fig. 8, receiving module 50 can be arranged on the mounting surface 631 of infrared pick-up first 62, It can be arranged on the mounting surface 631 of visible image capturing first 61, certainly, receiving module 50 can not also be arranged on mounting surface 631 On, receiving module 50 can be disposed adjacent with output module 10, and proximity sensor 51 is readily received to be used as connecing by infrared lamp 12 Launch during near-infrared lamp, and the infrared light being reflected back by external object；Receiving module 50 can also be disposed adjacent with receiver 70, When user receives calls, proximity sensor 51 is readily detected the ear of user close to receiver 70.
To sum up, in the electronic device 100 of embodiment of the present invention, the position of mobile light-guide device 13 is passed through so that infrared Lamp 12 can be used as close to infrared lamp or infrared light compensating lamp, integrated structure light projector 14, and it is infrared that output module 10 has gathered transmitting Light is with the function of infrared distance measurement, infrared light filling and three-dimensional imaging, and therefore, the integrated level of output module 10 is higher, and small volume is defeated Go out the space that module 10 has saved the function of realizing infrared distance measurement, infrared light filling and three-dimensional imaging.Further, since project structured light Device 14 and infrared lamp 12 are carried on a package substrate 111, structured light projector compared to traditional handicraft, close to infrared Lamp, infrared light compensating lamp need the encapsulation being respectively adopted in different wafer manufacture recombinants to PCB substrate, improve packaging efficiency.
Referring to Fig. 5, in some embodiments, output module 10 further includes metal shutter 16, metal shutter 18 In encapsulating housing 11, and metal shutter 16 is between structured light projector 14 and infrared lamp 12.Metal shutter 16 Between structured light projector 14 and infrared lamp 12, metal shutter 16 on the one hand can with shielding construction light projector 14 with it is red The luminous intensity and sequential of the mutual electromagnetic interference of outer lamp 12, structured light projector 14 and infrared lamp 12 will not mutual shadows Ring, another aspect metal shutter 16 can be used for chamber of the 14 place cavity of isolation structures light projector where with infrared lamp 12 Body, light will not enter another cavity from a cavity.
Referring to Fig. 10, in some embodiments, output module 10 further includes optics sealing cover 1a.Optics sealing cover 1a is by saturating Luminescent material is made, and optics sealing cover 1a is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1a wraps red Outer lamp 12.Specifically, optics sealing cover 1a can be formed by encapsulating injection molding and forming technology, and optics sealing cover 1a can use transparent Thermosetting epoxy resin is made, and to be not easy to soften in use, optics sealing cover 1a can fix the position of infrared lamp 12, and cause Infrared lamp 12 is not easy to rock in encapsulating housing 11.At this time, light-guide device 13 is arranged on beyond optics sealing cover 1a and movably It is housed in encapsulating housing 11.
1 is please referred to Fig.1, in some embodiments, proximity sensor 51 can be not integrated in reception mould with optical flame detector 52 In group 50, in other words, proximity sensor 51 is separately set with optical flame detector 52.At this time, proximity sensor 51 can be arranged on microscope base On 63 mounting surface 631；Optical flame detector 52 can also be arranged on the mounting surface 631 of microscope base 63；Or proximity sensor 51 and light Sensor 52 is arranged on the mounting surface 631 of microscope base 63 at the same time.Microscope base 63 can be the microscope base 63 of infrared pick-up first 62, can also It is the microscope base 63 of visible image capturing first 61.
2 are please referred to Fig.1, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also Offer cover board sound outlet hole 35, the position correspondence of receiver 70 and cover board sound outlet hole 35 and casing sound outlet hole.Export module 10, red The center of outer light video camera head 62 and visible image capturing first 61 is located on same line segment, and receiver 70 is located at the line segment and casing 20 Between top 21.
It is (output module 10, red each electronic component on cover board 30 is saved not on the line segment in the center of receiver 70 Outer light video camera head 62, visible image capturing first 61 etc.) take horizontal space.In embodiment as shown in figure 12, cover board goes out sound Hole 35 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
Referring again to Figure 13, the infrared through hole 33 of cover board, cover board can also be offered in some embodiments, on cover board 30 The infrared through hole 23 infrared with casing of through hole 33 is corresponding, and the infrared light that infrared lamp 12 is launched can be from after passing through the infrared through hole 23 of casing Electronic device 100 is pierced by the infrared through hole 33 of cover board.At this time, can be with 24 corresponding position of casing structure light through hole on cover board 30 Infrared transmission ink 40 is set, and user is difficult to the structure light that the inside of electronic device 100 is seen by casing structure light through hole 24 The projector 14, the shape of electronic device 100 are more beautiful.
4 are please referred to Fig.1, covering plate structure light through hole 34, cover board knot can also be opened up in some embodiments, on cover board 30 Structure light through hole 34 is corresponding with casing structure light through hole 24, and the infrared light that structured light projector 14 is launched passes through casing structure light through hole Electronic device 100 can be pierced by after 24 from covering plate structure light through hole 34.At this time, through hole 23 infrared with casing is corresponding on cover board 30 Position can set it is infrared pass through ink 40, user is difficult to the inside that electronic device 100 is seen by the infrared through hole 23 of casing Light-guide device 13 and infrared lamp 12, the shape of electronic device 100 is more beautiful.
5 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on On substrate 66, receiving module 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, one of substrate 66 Divide in microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and is used to carry image sensing Device 65, the other end can be connected with the mainboard of electronic device 100.When receiving module 50 is arranged on substrate 66, receiving module 50 It is arranged on outside microscope base 63, receiving module 50 can also be connected with FPC.
Further, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, close to biography Sensor 51 is collectively forming single package body structure with optical flame detector 52, reduces gap when the two is individually assembled, saves electronic device 100 Interior installation space.In other embodiments, being arranged on the receiving module 50 of substrate 66 includes proximity sensor 51 or/and light Sensor 52, proximity sensor 51 and optical flame detector 52 are respectively single package body structure.That is, the receiving module 50 for being arranged on substrate 66 is The proximity sensor 51 of single package body structure；Alternatively, the receiving module 50 for being arranged on substrate 66 is the light sensation of single package body structure Device 52；Alternatively, the receiving module 50 for being arranged on substrate 66 is the proximity sensor 51 of single package body structure and single package body structure Optical flame detector 52.
Imaging modules 60 can be visible image capturing first 61 and one or two in infrared pick-up first 62.Specifically, Receiving module 50 can be fixed on the substrate 66 of visible image capturing first 61；Receiving module 50 can be fixed on infrared pick-up head On 62 substrate 66.When proximity sensor 51 and optical flame detector 52 encapsulate for split, proximity sensor 51 can be fixed on visible On the substrate 66 of light video camera head 61, optical flame detector 52 can be fixed on the substrate 66 of infrared pick-up first 62；Alternatively, optical flame detector 52 It can be fixed on the substrate 66 of visible image capturing first 61, proximity sensor 51 can be fixed on the substrate of infrared pick-up first 62 On 66；Alternatively, proximity sensor 51 is each attached on the substrate 66 of visible image capturing first 61 with optical flame detector 52；Alternatively, close pass Sensor 51 is each attached on the substrate 66 of infrared pick-up first 62 with optical flame detector 52.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with receiving module 50, with increase The integral strength of substrate 66 so that FPC is not susceptible to around folding, while receiving module 50 (or proximity sensor 51 or optical flame detector 52) It is not susceptible to rock when being arranged on substrate 66.In one example, receiving module 50 (or proximity sensor 51 or optical flame detector 52) it may be also secured on the lateral wall of microscope base 63, such as be fixed on by cohesive mode on the lateral wall of microscope base 63.
6 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67 Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- 672 and the 3rd sub- top surface 673 of top surface, the second son top 672 and first sub- top surface 671 of face tilts connection and forms notch 675, the 3rd sub- top surface 673 and second with the first sub- top surface 671 Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- 671 and the 3rd sub- top surface 673 of top surface to connect first Sub- 671 and the 3rd sub- top surface 673 of top surface.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight Angle, the angle between the second sub- 672 and the 3rd sub- top surface 673 of top surface can be obtuse angle or right angle.Notch 675 is opened in camera shell On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.3rd sub- top surface 673 offers out Light through hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through hole 674.Imaging sensor 65 is housed in In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through hole 674 and camera lens mould Group 68 is simultaneously delivered on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Receiving module 50 is arranged on At first sub- top surface 671, receiving module 50 includes proximity sensor 51 and optical flame detector 52.In present embodiment, imaging modules 60 Can be visible image capturing first 61, receiving module 50 is single packaging body that proximity sensor 51 is collectively forming with optical flame detector 52.Connect Nearly sensor 51 can be consistent with the extending direction of notch 675 (as shown in figure 16) with the center line connecting direction of optical flame detector 52；Or Person, proximity sensor 51 can be vertical with the extending direction of notch 675 or in the two shape with the center line connecting direction of optical flame detector 52 Into angle be acute angle or obtuse angle.In other embodiments, imaging modules 60 can be infrared pick-up first 62.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the first sub- top surface On 671, receiving module 50 is set to set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, saves Installation space in electronic device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce Gap when the two is individually assembled, saves the installation space in electronic device 100.
Please continue to refer to Figure 16, in some embodiments, the receiving module 50 of the above embodiment is arranged on the first son On top surface 671 and positioned at the outside of camera case 67, specifically, whole receiving module 50 is along perpendicular to the first sub- top surface 671 Projection can be located in the first sub- top surface 671 (as shown in figure 16)；Alternatively, part receiving module 50 is pushed up along perpendicular to the first son The projection in face 671 is located in the first sub- top surface 671.That is, receiving module 50 is at least part of to be located at the first sub- top surface 671 surface, in this way, receiving module 50 sets compacter with imaging modules 60, the two horizontal space taken jointly compared with It is small, further save the installation space in electronic device 100.In other embodiments, receiving module 50 is included close to biography Sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two single single packaging bodies, at this time, are respectively single envelope The proximity sensor 51 and optical flame detector 52 for filling body can also be all disposed within the first sub- top surface 671.
7 are please referred to Fig.1, in some embodiments, the receiving module 50 of the above embodiment only includes proximity sensor 51, not comprising optical flame detector 52, at this time, proximity sensor 51 (or receiving module 50) is respectively monomer encapsulation with optical flame detector 52 and ties Structure, proximity sensor 51 are arranged on the first sub- top surface 671, and optical flame detector 52 is arranged on any other except the first sub- top surface 671 Position.
Please continue to refer to Figure 17, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, and do not include proximity sensor 51, at this time, optical flame detector 52 (or receiving module 50) is respectively monomer envelope with proximity sensor 51 Assembling structure, optical flame detector 52 are arranged on the first sub- top surface 671, proximity sensor 51 be arranged on except the first sub- top surface 671 other Optional position.
8 are please referred to Fig.1, the first sub- top surface 671 of the above embodiment offers loophole 676, and receiving module 50 is located at It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without light sensation Device 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 The light in portion can pass through loophole 676 and be delivered on proximity sensor 51.The receiving module 50 of present embodiment is arranged on In camera case 67, receiving module 50 and the structure of camera case 67 is set more to stablize and be easy to receiving module 50 and imaging mould Group 60 is installed on casing 20.
Please continue to refer to Figure 18, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without connecing Nearly sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electricity Light outside sub-device 100 can pass through loophole 676 and be delivered on optical flame detector 52.The receiving module 50 of present embodiment Be arranged in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and easy to by receiving module 50 with Imaging modules 60 are installed on casing 20.
9 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 be integrated with it is close When sensor 51 is with optical flame detector 52, loophole 676 can be one and proximity sensor 51 and the corresponding printing opacity of optical flame detector 52 Hole or two it is spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that light can pass through loophole 676 and be delivered in receiving module 50.In other realities Apply in mode, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two Individually list packaging body, at this time, the proximity sensor 51 and optical flame detector 52 for being respectively single packaging body can also be all disposed within camera It is in housing 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, makes receiving module 50 more stablize with the structure of camera case 67 and easy to which receiving module 50 and imaging modules 60 are installed on casing 20.
9 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground, FPC is provided with substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connected with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connected with FPC.This embodiment party In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation Device 52 is collectively forming single package body structure, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 51 also encapsulates for monomer Structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 simultaneously Outside camera case 67.
In yet another embodiment, optical flame detector 52 is only included in receiving module 50, proximity sensor 51, which is not integrated into, to be connect Receive in module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 also seals for monomer Assembling structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when one of substrate 66 Divide in camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate On 66 and outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67 Structure is more stablized and easy to which receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, receiving module 50 is firmly mounted in camera case 67.
Figure 20 is referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 take the photograph module, including two imaging sensors 65, camera case 67 and two camera lens moulds to be double Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677 678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a positioned at the first tread 677 with With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677 Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle. Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two A light extraction through hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through holes 674 Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions Through hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68, Light outside electronic device 100 can pass through light extraction through hole 674 and camera lens module 68 and be delivered on imaging sensor 65.This reality Apply in mode, imaging modules 60 can be visible image capturing first 61, and two camera lens modules 68 are visible image capturing first 61 at this time Corresponding camera lens module.Receiving module 50 is arranged on the second tread 678 and outside camera case 67.Receiving module 50 is to connect Single packaging body that nearly sensor 51 is collectively forming with optical flame detector 52.The center line connecting direction of proximity sensor 51 and optical flame detector 52 can With consistent with the extending direction of notch 675；Alternatively, the center line connecting direction of proximity sensor 51 and optical flame detector 52 can be with notch 675 extending direction vertical (as shown in figure 20) or the two angle formed are acute angle or obtuse angle.In other embodiments, into As module 60 can be infrared pick-up first 62, two camera lens modules 68 are first 62 corresponding camera lens mould of infrared pick-up at this time Group.In yet another embodiment, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, at this time one of them Camera lens module 68 is first 62 corresponding camera lens module of infrared pick-up, another camera lens module 68 corresponds to for visible image capturing first 61 Camera lens module.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the second tread 678 On, receiving module 50 is set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, has saved electronics Installation space in device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce the two Individually gap during assembling, saves the installation space in electronic device 100.
Figure 21 is referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670 On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through holes 674 are opened in the first son respectively On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675 Both sides.At this time, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face 679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678, Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating receiving module 50 is arranged on the second tread On 678.
Figure 20 and Figure 21 is referred to, in some embodiments, the receiving module 50 of the above embodiment is arranged on second On tread 678 and positioned at the outside of camera case 67.Specifically, it is whole when notch 675 is opened in the marginal position of top surface 670 A receiving module 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, part receives mould Group 50 is located in the second tread 678 (as shown in figure 20) along the projection perpendicular to the second tread 678.That is, receiving module The 50 at least part of surfaces for being located at the second tread 678.It is whole when notch 675 is opened on the centre position of top surface 670 A receiving module 50 can be located in the second tread 678 (as shown in figure 21) along perpendicular to the projection of the second tread 678.Such as This, receiving module 50 sets compacter with imaging modules 60, and the horizontal space that the two takes jointly is smaller, further saves Installation space in electronic device 100.In other embodiments, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two single single packaging bodies, at this time, be respectively single packaging body close to sensing Device 51 and optical flame detector 52 can also be all disposed within the second tread 678.
Figure 21 is referred to, in some embodiments, the receiving module 50 of the above embodiment only includes close to sensing Device 51, receiving module 50 do not include optical flame detector 52, and at this time, proximity sensor 51 (or receiving module 50) is respectively with optical flame detector 52 Cell packaging configuration, proximity sensor 51 are arranged on the second tread 678, and optical flame detector 52 is arranged on the casing outside imaging modules 60 On 20.
Figure 21 is referred to, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, Receiving module 50 does not include proximity sensor 51, and at this time, optical flame detector 52 (or receiving module 50) is respectively with proximity sensor 51 Cell packaging configuration, optical flame detector 52 are arranged on the second tread 678, and proximity sensor 51 is arranged on the casing outside imaging modules 60 On 20.
Figure 22 is referred to, the second tread 678 of the above embodiment offers loophole 676, and receiving module 50 is located at phase It is in casing body 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without optical flame detector 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 Light can pass through and loophole 676 and be delivered on proximity sensor 51.The receiving module 50 of present embodiment is arranged on phase In casing body 67, the structure of receiving module 50 and camera case 67 is set more to stablize and be easy to receiving module 50 and imaging modules 60 are installed on casing 20.
Please continue to refer to Figure 22, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics Light outside device 100 can pass through loophole 676 and be delivered on optical flame detector 52.The receiving module 50 of present embodiment is set Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and easy to by receiving module 50 with into As module 60 is installed on casing 20.
Figure 23 is referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, Receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 is integrated with close to sensing When device 51 and optical flame detector 52, loophole 676 can be one with proximity sensor 51 and the corresponding loophole of optical flame detector 52 or Two spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, the light outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that loophole 676 can be passed through and be delivered in receiving module 50.In other embodiment party In formula, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are independent for two Single packaging body, at this time, the proximity sensor 51 and optical flame detector 52 for being respectively single packaging body can also be all disposed within camera case It is in 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, make receiving module 50 with The structure of camera case 67 is more stablized and easy to which receiving module 50 and imaging modules 60 is installed on casing 20.
Please continue to refer to Figure 23, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground, FPC is provided with substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connected with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connected with FPC.This embodiment party In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation Device 52 is collectively forming single package body structure, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 51 also encapsulates for monomer Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at Outside camera case 67.
In yet another embodiment, receiving module 50 only includes optical flame detector 52, and proximity sensor 51 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 also encapsulates for monomer Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at In camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate 66 simultaneously Outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67 Structure is more stablized and easy to which receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, receiving module 50 is firmly mounted in camera case 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention. In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two, Three, unless otherwise specifically defined.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.

Claims (13)

1. one kind output module, it is characterised in that the output module includes encapsulating housing, infrared lamp, light-guide device and structure Light projector, the encapsulating housing include package substrate, the infrared lamp, the light-guide device and structured light projector envelope In the encapsulating housing, the infrared lamp and the structured light projector carry on the package substrate, the leaded light Element can be movably arranged in the luminous light path of the infrared lamp, when the light-guide device is located at shining for the infrared lamp When in light path, the infrared light of the infrared lamp transmitting is emitted to be used as infrared light filling with the first field angle from the encapsulating housing Lamp or close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared lamp is launched red UV light is emitted using as close to infrared lamp or infrared light compensating lamp with the second field angle from the encapsulating housing.
2. output module according to claim 1, it is characterised in that
The light-guide device includes convex lens or the lens group with positive light coke, when the light-guide device is located at the infrared lamp Luminous light path on when, the infrared light of infrared lamp transmitting is emitted using as connecing with the first field angle from the encapsulating housing Near-infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting It is emitted with the second field angle from the encapsulating housing to be used as infrared light compensating lamp；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is located at the infrared lamp Luminous light path on when, the infrared light of infrared lamp transmitting is emitted using as red with the first field angle from the encapsulating housing Outer light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting It is emitted with the second field angle from the encapsulating housing using as close to infrared lamp.
3. output module according to claim 1, it is characterised in that the output module further includes chip, described infrared Lamp is formed on the chip with the structured light projector.
4. output module according to claim 3, it is characterised in that the encapsulating housing further includes package wall and encapsulation Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute To state formed with the first light-emitting window and the second light-emitting window at the top of encapsulation, first light-emitting window is corresponding with the infrared lamp, Second light-emitting window is corresponding with the structured light projector.
5. output module according to claim 3, it is characterised in that the output module further includes metal shutter, institute Metal shutter is stated to be located in the encapsulating housing, and between the infrared lamp and the structured light projector.
A kind of 6. electronic device, it is characterised in that including：
Casing；With
Output module described in claim 1-5 any one, the output module are arranged in the casing.
7. electronic device according to claim 6, it is characterised in that the electronic device further includes the cover board of printing opacity, institute State casing and offer the infrared through hole of casing and casing structure light through hole, the infrared lamp is corresponding with the infrared through hole of the casing, institute It is corresponding with the casing structure light through hole to state structured light projector, the cover board is set on the housing.
8. electronic device according to claim 7, it is characterised in that the cover board is formed with the surface that the casing is combined Have and only transmit the infrared of infrared light and pass through ink, it is described infrared to block the infrared through hole of the casing and the casing knot through ink It is at least one in structure light through hole.
9. electronic device according to claim 6, it is characterised in that the electronic device further includes receiving module and imaging Module, the receiving module are integrated with proximity sensor and optical flame detector, and the imaging modules include microscope base, installed in the microscope base On lens barrel and the imaging sensor that is housed in the microscope base, the microscope base include passing positioned at the lens barrel and described image Mounting surface between sensor, the receiving module are arranged on the mounting surface.
10. electronic device according to claim 6, it is characterised in that the electronic device further includes proximity sensor, light Sensor and imaging modules, the imaging modules include microscope base, the lens barrel on the microscope base and are housed in the microscope base Interior imaging sensor, the microscope base includes the mounting surface between the lens barrel and described image sensor, described close At least one in sensor and the optical flame detector is arranged on the mounting surface.
11. the electronic device according to claim 9 or 10, it is characterised in that the imaging modules include visible image capturing At least one of head and infrared pick-up head.
12. electronic device according to claim 6, it is characterised in that the electronic device further includes receiver, infrared light The cover board of camera, visible image capturing head and printing opacity, the casing offer casing sound outlet hole, and the cover board offers cover board and goes out The position correspondence of sound hole, the receiver and the cover board sound outlet hole and the casing sound outlet hole, it is the output module, described red The center of outer light video camera head and the visible image capturing head is located on same line segment, the receiver be located at the line segment with it is described Between the top of casing.
13. electronic device according to claim 6, it is characterised in that the electronic device further include receiving module and into As module, the imaging modules are installed in the casing, and the imaging modules include microscope base, the mirror on the microscope base Cylinder and part are arranged on the substrate in the microscope base；The receiving module is set on the substrate, and the receiving module includes Proximity sensor and/or optical flame detector.
CN201711437492.0A 2017-12-26 2017-12-26 Export module and electronic device Pending CN107968865A (en)

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CN109059797A (en) * 2018-08-22 2018-12-21 Oppo广东移动通信有限公司 Flight time mould group and its control method, controller and electronic device
GB2580024A (en) * 2018-12-19 2020-07-15 Continental Automotive Gmbh Camera device and vehicle comprising the same
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CN107480589A (en) * 2017-07-07 2017-12-15 广东欧珀移动通信有限公司 Infrared light supply component and electronic installation
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CN106412159A (en) * 2016-10-26 2017-02-15 广东欧珀移动通信有限公司 Panel, panel assembly and terminal
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US11348217B2 (en) 2018-03-12 2022-05-31 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Projector, detection method thereof, and electronic device
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