CN108919597A - A kind of optical projection mould group - Google Patents
A kind of optical projection mould group Download PDFInfo
- Publication number
- CN108919597A CN108919597A CN201810976723.3A CN201810976723A CN108919597A CN 108919597 A CN108919597 A CN 108919597A CN 201810976723 A CN201810976723 A CN 201810976723A CN 108919597 A CN108919597 A CN 108919597A
- Authority
- CN
- China
- Prior art keywords
- light
- illuminator
- light emitting
- emitting region
- emission part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 91
- 239000004065 semiconductor Substances 0.000 claims abstract description 57
- 238000009792 diffusion process Methods 0.000 claims abstract description 40
- 238000000059 patterning Methods 0.000 claims abstract description 25
- 238000001514 detection method Methods 0.000 claims abstract description 9
- 230000008707 rearrangement Effects 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 52
- 230000001788 irregular Effects 0.000 claims description 14
- 238000009826 distribution Methods 0.000 claims description 12
- 210000004209 hair Anatomy 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 7
- 238000013461 design Methods 0.000 claims description 7
- 230000003760 hair shine Effects 0.000 claims description 7
- 239000006185 dispersion Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000036651 mood Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2518—Projection by scanning of the object
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2013—Plural light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V20/00—Scenes; Scene-specific elements
- G06V20/60—Type of objects
- G06V20/64—Three-dimensional objects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/2433—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures for measuring outlines by shadow casting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
- F21V23/0471—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor detecting the proximity, the presence or the movement of an object or a person
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/254—Projection of a pattern, viewing through a pattern, e.g. moiré
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/0944—Diffractive optical elements, e.g. gratings, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
- G02B27/0961—Lens arrays
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/206—Control of light source other than position or intensity
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/208—Homogenising, shaping of the illumination light
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/16—Human faces, e.g. facial parts, sketches or expressions
- G06V40/161—Detection; Localisation; Normalisation
- G06V40/166—Detection; Localisation; Normalisation using acquisition arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/16—Human faces, e.g. facial parts, sketches or expressions
- G06V40/174—Facial expression recognition
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/30—Semiconductor lasers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- General Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Human Computer Interaction (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The application is suitable for optics and electronic technology field, provides a kind of optical projection mould group, is sensed in predetermined pattern to measured target object for projecting comprising beam modulation element and light-source structure.The light-source structure includes the first emission part for issuing the first light beam and the second emission part for issuing the second light beam.First emission part and the second emission part are formed on the same semiconductor base or are connected with each other to be integrated into overall structure.The beam modulation element includes diffusion part and patterning portion.First emission part of the diffusion part corresponding light source structure is configured, for first beam spread to be formed to the flood beam of optical power detection.Second emission part of the patterning portion corresponding light source structure is configured, and the pattern beam of predetermined pattern can be projected on measured target object for the light field of second light beam to be carried out rearrangement formation.
Description
Technical field
The application belongs to optical technical field more particularly to a kind of optical projection mould group.
Background technique
Existing three-dimensional (Three Dimensional, 3D) sensing mould group usually require to be respectively set floodlight transmitter and
Light pattern transmitter realizes 3D sensing to cooperate.However, the respectively arranged floodlight transmitter and light pattern transmitter, not only
It will increase cost, and the larger Miniaturization Design also affected using 3D sensing module device of shared volume.
Summary of the invention
Technical problems to be solved in this application are to provide a kind of optical projection mould group, can be with highly integrated floodlight and light
Pattern projection function reaches miniaturization and reduces the beneficial effect of cost.
The application embodiment provides a kind of optical projection mould group, carries out in predetermined pattern to measured target object for projecting
Sensing comprising beam modulation element and light-source structure.The light-source structure include issue the first light beam the first emission part and
Issue the second emission part of the second light beam.First emission part and the second emission part be formed on the same semiconductor base or
It is connected with each other to be integrated into overall structure.The beam modulation element includes diffusion part and patterning portion.The diffusion part is corresponding
First emission part of light-source structure is configured, for first beam spread to be formed to the floodlight light of optical power detection
Beam.Second emission part of the patterning portion corresponding light source structure is configured, for carrying out the light field of second light beam
Rearrangement forms the pattern beam that predetermined pattern can be projected on measured target object.
In some embodiments, first emission part includes multiple for emitting the first illuminator of the first light beam.
Second emission part includes multiple for emitting the second illuminator of the second light beam.First illuminator and the second illuminator
It is formed on the same semiconductor base and can be independently controlled respectively luminous.It is defined on the semiconductor base and is located at half
The first light emitting region in the middle part of conductor substrate and around the second light emitting region of first light emitting region setting.
In some embodiments, first illuminator uniformly divides according to preset same intervals on a semiconductor substrate
Cloth.Second illuminator is randomly distributed on a semiconductor substrate or is uniformly distributed according to preset same intervals.
In some embodiments, first illuminator is formed in the first light emitting region of semiconductor base.It is described
Second illuminator is formed in the second light emitting region of semiconductor base.
In some embodiments, first illuminator is formed in the second light emitting region of semiconductor base.It is described
Second illuminator is formed in the first light emitting region of semiconductor base.
In some embodiments, first light emitting region is rectangle.Second light emitting region is correspondingly arranged at
Four edges of one light emitting region.
In some embodiments, second light emitting region is that first hair is surrounded outside first light emitting region
The blocked areas that light region one is enclosed.The size of minimum spacing D meets item between first light emitting region and the second light emitting region
PartWherein H is the light-emitting surface of light-source structure and is arranged tactic first above light-source structure
The distance between a optical element, θ is from the maximum dispersion angle of the issued light beam in the first light emitting region and the second light emitting region.
In some embodiments, first light emitting region is the rectangle in the middle part of semiconductor base.Described second
Light emitting region is that the semiconductor base is formed on the surface of illuminator other regions other than the first light emitting region.
In some embodiments, first emission part includes that first be formed on one first semiconductor base shines
Body and light guide plate.The light guide plate includes incidence surface and light-emitting surface.First illuminator corresponds to the incidence surface setting of light guide plate.
The middle position of light guide plate light-emitting surface is arranged in second emission part.Second emission part includes being formed in one the second half to lead
The second illuminator of one or more in body substrate.
In some embodiments, the multiple second illuminator is randomly distributed on the second semiconductor base.
In some embodiments, the multiple second illuminator is on the second semiconductor base according to preset identical
Every equably arranging.
In some embodiments, second emission part include one be formed in the middle part of semiconductor base second shine
Body.First emission part includes multiple first illuminator symmetrical around first illuminator.Described first shines
Body and the second illuminator are formed on the same semiconductor base and are independently controlled respectively luminous.First illuminator and
Second illuminator is the wide face type vertical cavity surface emitting laser of single hole.
In some embodiments, second emission part include multiple irregular distributions in the semiconductor substrate portion the
Two illuminators.First emission part includes multiple first hairs symmetrical around the multiple second illuminator region
Body of light.First illuminator and the second illuminator are formed on the same semiconductor base and are independently controlled hair respectively
Light, first illuminator are the wide face type vertical cavity surface emitting laser of single hole.Second illuminator is multiple vertical cavity surfaces
The light emitting array of emitting laser composition.
In some embodiments, the light-emitting surface of the wide face type vertical cavity surface emitting laser of the single hole of first illuminator
Shape can be rectangle or right angle moulding shape.
In some embodiments, second light beam is via the predetermined pattern formed after patterning portion rearrangement light field
Selected from irregular distribution spot pattern, the striped design of regular array and along the cross one another regular grid of different directions
One of pattern beam of pattern and combinations thereof.
In some embodiments, the patterning portion of the beam modulation element and diffusion part are formed in the same transparent base
On plate.Or, the diffusion part and patterned features of the beam modulation element are not formed on different transparent substrates.The formation
There is the transparent substrate in patterning portion to be defined as patterned substrate.Diffusion substrate region corresponding with patterning portion keeps saturating
Light.Patterned substrate region corresponding with diffusion part keeps light transmission.
In some embodiments, the function in the patterning portion is formed specific by corresponding position on the transparent substrate
Patterned optical lines realize.The patterned optical lines is selected from diffraction optics lines, optical micro lens array, grating
One of and combinations thereof.
In some embodiments, the optical projection mould group further includes optical path director element.The optical path director element
The corresponding position of the light-emitting surface of the first emission part between light-source structure and beam modulation element and with the light-source structure is set
Set place.The optical path director element is used to the first emission part being irradiated to the light beam in the first light beam guidance of divergent shape outgoing
The diffusion part of modulation element.
Optical projection mould group provided by the application embodiment will project the emitter set of flood beam and pattern beam
At together, the not only smaller design for being conducive to equipment of volume, but also also further reduce the cost of device.
The additional aspect and advantage of the application embodiment will be set forth in part in the description, partially will be from following
Become obvious in description, or is recognized by the practice of the application embodiment.
Detailed description of the invention
Fig. 1 is the top view for the light-source structure that the application first embodiment provides.
Fig. 2 is the top view for the light-source structure that the application second embodiment provides.
Fig. 3 is the top view for the light-source structure that the application third embodiment provides.
Fig. 4 is that the light-source structure in Fig. 3 is tactic along the cross-sectional view of IV-IV line and the light-source structure and top
The positional diagram of first optical element.
Fig. 5 is the top view for the light-source structure that the 4th embodiment of the application provides.
Fig. 6 is the top view for the light-source structure that the 5th embodiment of the application provides.
Fig. 7 is the top view for the light-source structure that the application sixth embodiment provides.
Fig. 8 is cross-sectional view of the light-source structure in Fig. 7 along VIII-VIII line.
Fig. 9 is the top view for the light-source structure that the 7th embodiment of the application provides.
Figure 10 is the top view for the light-source structure that the 8th embodiment of the application provides.
Figure 11 is the structural schematic diagram for the optical projection mould group that the 9th embodiment of the application provides.
Figure 12 is the schematic diagram that the beam modulation component structure of the group of optical projection mould described in Figure 11 changes with light-source structure.
Figure 13 is the signal of the detection route on the transparent substrate of the beam modulation element of the optical projection mould group in Figure 11
Figure.
Figure 14 is the structural schematic diagram for the optical projection mould group that the tenth embodiment of the application provides.
Figure 15 is the structural schematic diagram for the optical projection mould group that the 11st embodiment of the application provides.
Figure 16 is the structural schematic diagram for the sensing device that the 12nd embodiment of the application provides.
Figure 17 is the functional block diagram of sensing device described in Figure 16.
Figure 18 is the structural schematic diagram for the equipment that the 13rd embodiment of the application provides.
Specific embodiment
Present patent application requires the applying date on July 30th, 2018, application No. is 201810854491.4, invention names
A kind of referred to as domestic priority of the earlier application of " light-source structure, optical projection mould group, biological identification device and equipment ", the part
All the elements of application are described herein by reference.
Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.?
In the description of the present application, it is to be understood that term " first ", " second " are only used for describing, and should not be understood as instruction or dark
Show relative importance or implicitly indicates the quantity of indicated technical characteristic or put in order.Define as a result, " first ",
The technical characteristic of " second " can explicitly or implicitly include one or more technical characteristic.In retouching for the application
In stating, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise specific regulation or limit, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integration connection;It can
To be mechanical connection, it is also possible to be electrically connected or is in communication with each other;It can be directly connected, the indirect phase of intermediary can also be passed through
Even, the connection inside two elements or the interaction relationship between two elements be can be.For the ordinary skill of this field
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
Following disclosure provides many different embodiments or example is used to realize the different structure of the application.In order to
Simplify disclosure herein, hereafter only to the component of specific examples and being set for describing.Certainly, they are merely examples, and
And purpose does not lie in limitation the application.In addition, the application can reuse reference number and/or reference word in different examples
Mother, this reuse are itself not indicate the various embodiments discussed to simplify and clearly state the application
And/or the particular kind of relationship between setting.In addition, the application in the following description provided by various specific techniques and material only
For the example for realizing technical scheme, but those of ordinary skill in the art should be aware that the technical solution of the application
It can be realized by other techniques for not describing hereafter and/or other materials.
Further, described feature, structure can be incorporated in one or more embodiment party in any suitable manner
In formula.In the following description, many details are provided so as to fully understand presently filed embodiment.However, this
Field technical staff will be appreciated that even if without one or more in the specific detail, or using other structures, group
Member etc. can also practice the technical solution of the application.In other cases, it is not shown in detail or describes known features or operation
To avoid the emphasis of fuzzy the application.
It should be understood that embodiments described herein and/or method are exemplary in itself, it is not construed as pair
The limitation of technical scheme.Embodiment or method described herein are only that the application the relevant technologies thought is covered
One of numerous technical solutions are a variety of, therefore each step of described method and technology scheme can be according to being indicated
Order executes, and can execute, may be performed simultaneously, or be omitted in some cases, above-mentioned change according to other order
It is regarded as the range that the application technical solution claimed is covered.
As shown in Figure 1, the application first embodiment provides a kind of light-source structure 1, for emitting light beam to one tested
It is sensed on object.The light beam can be the light beam with specific wavelength according to sensing principle and application scenarios.At this
In embodiment, the light beam is used to sense the three-dimensional information of measured target object, can be infrared or near-infrared wavelength light beam, wave
Long range is 750 nanometers (Nanometer, nm) to 1650nm.
The light-source structure 1 includes the first emission part 10 and the second emission part 12.First emission part 10 issues first
Light beam is used to form the flood beam of optical power detection.The flood beam is projected on measured target object tested for sensing
The floodlight image of object.For example, the flood beam can be used for sensing whether the measured target object is face.Described second
The second light beam that emission part 12 issues is used to form the pattern beam that predetermined pattern can be projected on measured target object.It is described
Predetermined pattern can be used for the three-dimensional information for sensing the measured target object.
First emission part 10 is formed in the same substrate 14 with the second emission part 12 or is connected with each other to be integrated into
Overall structure.The first light emitting region 122 in the middle part of semiconductor base 14 is defined on the semiconductor base 14 and is enclosed
Around the second light emitting region 102 of first light emitting region 122 setting.
The integration mode of first emission part 10 and the second emission part 12 includes being directly connected to, be indirectly connected with or distinguishing shape
At on the same substrate 14 etc..In the present embodiment, first light beam and the second light beam are the identical near-infrared of wavelength
Light.
In the present embodiment, first emission part 10 includes multiple for emitting the first illuminator of the first light beam
100.Second emission part 12 includes multiple for emitting the second illuminator 120 of the second light beam.First illuminator 100
It is formed on the same semiconductor base 14 with the second illuminator 120.First illuminator 100 in semiconductor base 14
It is uniformly distributed in two light emitting regions 102 according to preset same intervals.Second illuminator 120 is in the semiconductor base 14
The first light emitting region 122 in irregular distribution.
First illuminator 100 and the second illuminator 120 can be semiconductor laser.Preferably, in this embodiment party
In formula, first illuminator 100 and the second illuminator 120 are vertical cavity surface emitting laser (Vertical Cavity
Surface Emitting Laser, VCSEL), it is made up on the semiconductor base 14 of the techniques such as photoetching and etching.Institute
The pattern beam that the flood beam and the second illuminator 120 for stating the sending of the first illuminator 100 issue is that wavelength is identical infrared
Or near infrared light, wave-length coverage are 750nm to 1650nm.
In the present embodiment, first light emitting region 122 positioned at 14 middle part of semiconductor base is rectangle.Described
Two light emitting regions 102 are correspondingly arranged at four edges of the first light emitting region 122.First illuminator 100 is in the second hair
It uniformly arranges along two sides of each corner in the second light emitting region 102 according to same intervals four corners in light region 102
Multilayer, first light emitting region 122 be dotted line described in Fig. 1 surround envelope the first light emitting region 102 each be straight
Four right angle frame bar-shaped zones at angle.Second illuminator 102 is randomly distributed in the first light emitting region 122, is used for
Launch the second light beam with irregular distribution pattern when lighting.
It is provided on the semiconductor base 14 and connect with external circuit for controlling in first light emitting region 122
Light the first pad 104.Be provided on the semiconductor base 14 connect with external circuit it is described for controlling
Second pad 124 of the light in the second light emitting region 102.So being located at the first light emitting region in present embodiment
The second illuminator 120 in 122 and the first illuminator 100 in the second light emitting region 102 can pass through different control
Signal independently works.
As shown in Fig. 2, the second embodiment of the application provides a kind of light-source structure 2, in first embodiment
Light-source structure 1 it is essentially identical, difference be that first illuminator 200 is evenly distributed according to preset same intervals
In first light emitting region 222.The irregular distribution of second illuminator 220 is in the second light emitting region 202.
Also referring to shown in Fig. 3 and Fig. 4, the application third embodiment provides a kind of light-source structure 3, with first
Light-source structure 1 in embodiment is essentially identical, and difference is that second light emitting region 302 is to shine described first
The blocked areas that first light emitting region 322 1 is enclosed is surrounded outside region 322.Second light emitting region 302 and first shines
The size of minimum spacing D is it is ensured that the light beam sent out from the first light emitting region 322 and the second light emitting region between region 322
302 light beams sent out reach be arranged light-source structure 3 above before tactic first optical element 31 it is mutual it
Between do not cross.
Since manufacturing process is there are a degree of error, first illuminator 300 is issued with the second illuminator 320
The dispersion angle of light beam can not accomplish it is just the same, but can be within the scope of preset dispersion angle.Because first illuminator 300 with
The dispersion angle of the issued light beam of second illuminator 320 is bigger, in light-source structure 3 and tactic first optical element in top
31 spacing remain unchanged under the premise of in order to meet the issued light beam in first light emitting region 322 and the second light emitting region 302
It does not cross, it is required that the distance between the first light emitting region 322 and the second light emitting region 302 D are bigger.Assuming that from the first light emitting region
322 and the maximum dispersion angle of the issued light beam in the second light emitting region 302 be θ, the light-emitting surface of the light-source structure 3 and be arranged at it
The distance between tactic first optical element 31 in top is H, according to trigonometric function relationship, in the first light emitting region
First light emitting region under the critical condition that 322 issued light beams just intersect with the issued light beam in the second light emitting region 302
322 and the second minimum spacing D between light emitting region 302 meets formulaInstitute
It is set with the light beam sent out in order to ensure the light beam sent out from the first light emitting region 322 with the second light emitting region 302 in arrival
It sets and does not cross mutually before tactic first optical element 31 above light-source structure 3, first luminous zone
Minimum spacing D between domain 322 and the second light emitting region 302 should meetCause
When meeting above-mentioned condition, the light beam issued respectively from the first light emitting region 322 and the second light emitting region 302 reaches setting in light
Do not cross between each other before first optical element 31 of the top of source structure 3, thus do not need in the first light emitting region 322 or
The other elements for adjusting beam direction are arranged in the light emission side of second light emitting region 302 again.
In the present embodiment, the irregular distribution of the second illuminator 320 is in the first luminous zone of semiconductor base 34
In domain 322.First illuminator 300 is equably arranged in the second light emitting region 302 according to identical preset interval.
As shown in figure 5, the 4th embodiment of the application provides a kind of light-source structure 4, in third embodiment
Light-source structure 3 it is essentially identical, difference be that first illuminator 400 is evenly distributed according to preset same intervals
In first light emitting region 422.The irregular distribution of second illuminator 420 is in the second light emitting region 402.
As shown in fig. 6, the 5th embodiment of the application provides a kind of light-source structure 5, in first embodiment
Light-source structure 1 is essentially identical, and difference is that second light emitting region 502 is that the semiconductor base 54 is formed with illuminator
Surface on other regions other than the first light emitting region 522.First illuminator 500 is arranged in the second light emitting region
In 502.Second illuminator 520 is arranged in first light emitting region 522.First illuminator 500 and the second hair
Body of light 520 is equably arranged all in accordance with preset same intervals.
In the present embodiment, the second light beam cooperation that the second illuminator 520 of first light emitting region 522 is issued
The optical element that 5 top of light-source structure is arranged in can be formed can project irregular distribution hot spot figure on measured target object
Case, the striped design of regular array or the pattern beam along the cross one another regular grid pattern of different directions.
It is understood that it is not shown go out other embodiments in, be arranged in the in the first light emitting region 522
Two illuminators 520 can also be randomly distributed.
It is understood that first illuminator 500 can also be according to pre- in other embodiments out not shown
If same intervals be evenly distributed in the first light emitting region 522.The irregular distribution of second illuminator 520 is second
In light emitting region 502.
Referring to Figure 7 together and Fig. 8, the application sixth embodiment provides a kind of light-source structure 6, for emitting light beam
It is sensed on to a measured target object.The light beam can be the light with specific wavelength according to sensing principle and application scenarios
Beam.In the present embodiment, the light beam is used for recognition of face, can be for infrared or near-infrared wavelength light beam, wave-length coverage
750 nanometers (Nanometer, nm) to 1650nm.
The light-source structure 6 includes the first emission part 60 and the second emission part 62.First emission part 60 issues first
Light beam is used to form the flood beam of optical power detection.The flood beam is projected on measured target object for sensing quilt
Survey the floodlight image of object.For example, the flood beam can be used for sensing whether the measured target object is face.Described
Two emission parts 62 issue the second light beam and are used to form the pattern beam that can project predetermined pattern on measured target object.It is described
Predetermined pattern can be used for the three-dimensional information for sensing the measured target object.In the present embodiment, first light beam and
Two light beams are the identical near infrared light of wavelength.
First emission part 60 includes the first illuminator 600 and the light guide plate being formed on the first semiconductor base 601
602.The light guide plate 602 includes incidence surface 6020 and light-emitting surface 6022.In the present embodiment, the light guide plate 602 is substantially
In rectangular shape, the incidence surface 6020 is perpendicular to light-emitting surface 6022.The corresponding light guide plate 602 of first illuminator 600
Incidence surface 6020 is arranged, so that the first light beam that first illuminator 600 is issued injects light guide plate from incidence surface 6020
Flood beam is projected from light-emitting surface 6022 after evenly mixing in 602.
The middle position of 602 light-emitting surface 6022 of light guide plate is arranged in second emission part 62.Second transmitting
Portion 62 includes the second illuminator of one or more 620 being formed on the second semiconductor base 621.In the present embodiment, institute
It states multiple second illuminators 620 to be randomly distributed on the second semiconductor base 621, be used for and is arranged above light-source structure 6
Optical element cooperation the spot pattern of irregular distribution is projected on measured target object.It is understood that in other realities
It applies in mode, the multiple second illuminator 620 can also equably arrange according to preset same intervals, can be used for and set
Set striped design or edge that the optical element cooperation above light-source structure 6 projects regular array on measured target object
The cross one another regular grid pattern of different directions.
In the present embodiment, first illuminator 600 and the second illuminator 620 can be semiconductor laser, example
Such as:VCSEL.Unlike, because first illuminator 600 is different from the position where the second illuminator 620, need shape respectively
At on different the first semiconductor bases 601 and the second semiconductor base 621.The shape of first semiconductor base 601
It is corresponding with 6020 shape of incidence surface.
Also referring to Fig. 1 and Fig. 9, the 7th embodiment of the application provides a kind of light-source structure 7, implements with first
Light-source structure 1 in mode is essentially identical, and difference is that first illumination region 70 includes each second light emitting region 702
Inside respectively correspond single first illuminator 700 of setting, first illuminator 700 is the wide face type VCSEL of single hole, to replace the
It is multiple according to evenly arranged first illuminator of preset same intervals in second light emitting region 102 described in one embodiment
100.Described wide only one lightening hole of face type VCSEL of single hole, but the aperture that shines is larger, several times in first embodiment
One of VCSEL as the first illuminator 100.The illumination effect of the wide face type VCSEL of single hole is equal to luminous intensity
Uniform area source.The light-emitting surface shape of the wide face type VCSEL of single hole can be the shape of rule, such as rectangle;It can also be with
For irregular shape, such as the light-emitting surface shape of the wide face type VCSEL of the single hole is second hair in the present embodiment
The right angle moulding shape in light region 702.
Also referring to Fig. 1 and Figure 10, the 8th embodiment of the application provides a kind of light-source structure 8, real with first
The light-source structure 1 applied in mode is essentially identical, and difference is that second emission part 82 includes being arranged in the first light emitting region
Single second illuminator 820 in 822, second illuminator 820 are the wide face type VCSEL of single hole, to replace the first embodiment party
The second illuminator 120 being randomly distributed in first light emitting region 122 described in formula.First emission part 80 includes each the
Single first illuminator 800 of setting is respectively corresponded in one light emitting region 802, first illuminator 800 is the wide face type of single hole
VCSEL multiple is uniformly arranged with replace described in first embodiment in the second light emitting region 102 according to preset same intervals
First illuminator 100 of cloth.Described wide only one lightening hole of face type VCSEL of single hole, but the aperture that shines is larger, several times in the
One of VCSEL in one embodiment as the first illuminator 100 and the second illuminator 120.The wide face type of single hole
The illumination effect of VCSEL is similar to the uniform area source of luminous intensity.The light-emitting surface shape of the wide face type VCSEL of single hole can be with
For the shape of rule, such as rectangle;It may be irregular shape, such as second light emitting region in the present embodiment
802 right angle moulding shape.
As shown in figure 11, the 9th embodiment of the application provides a kind of optical projection mould group 11, for projecting specific light
It is sensed on beam to measured target object.The optical projection mould group 11 includes beam modulation element 110 and above-mentioned first to the
Light-source structure 1 in eight embodiments.
The beam modulation element 110 includes diffusion part 111 and patterning portion 112.111 corresponding light source of diffusion part
First emission part 10 of structure 1 is arranged, and the first light beam for issuing first illuminator 100 of the first emission part 10 expands
Dissipate the flood beam for forming optical power detection.Second emission part 12 of the 112 corresponding light source structure 1 of patterning portion is arranged,
The second light beam formation for issuing second illuminator 120 of the second emission part 12 can project on measured target object
The pattern beam of predetermined pattern is out with the three-dimensional information for sensing measured target object.
It is arranged in the first light emitting region 122 corresponding to second illuminator 120 to issue and be used to form pattern beam
The second light beam situation, first illuminator 100 is arranged in the second light emitting region 102 to issue and be used to form floodlight figure
The case where first light beam of case, the patterning portion 112 be arranged in the middle position of beam modulation element 110 with setting the
The second illuminator 120 in one light emitting region 122 is corresponding.The diffusion part 111 surround be arranged in patterning portion 112 periphery with
It is corresponding with the first illuminator 100 being arranged in the second light emitting region 102.
As shown in figure 12, correspond to second illuminator 220 to be arranged in the second light emitting region 202 to issue and be used for shape
At the situation of the second light beam of pattern beam, first illuminator 100 is arranged in the first light emitting region 122 to issue and be used for
Formed flood light pattern the first light beam the case where, the diffusion part 111 be arranged in the middle position of beam modulation element 110 with
The first illuminator 120 being arranged in the first light emitting region 122 is corresponding.The patterning portion 112 is around setting in diffusion part
111 periphery is with corresponding with the second illuminator 120 being arranged in the second light emitting region 102.
The function of the patterning portion 112 and diffusion part 111 in the corresponding position of transparent substrate 113 by forming specifically
Optical grains are realized.In the present embodiment, the patterning portion 112 of the beam modulation element 110 and diffusion part 111 are arranged
On the same transparent substrate 113.That is, the middle position of the transparent substrate 113 is formed with the figure for rearrangement light field
Case optical grains 1120 are used as the patterning portion 112, and the transparent substrate 113 is in the patterned optical lines 1120
Corresponding with 1 first light emitting region 102 of the light-source structure position in periphery be formed with the diffusion optical grains of light diffusion
1100 are used as the diffusion part 111.The patterned optical lines 1120 including but not limited to diffraction optics lines, optics is micro-
Lens array, grating and combinations thereof.
As shown in figure 13, detection route 134 can also be formed on the surface of the transparent substrate 113.The detection route
It can be made of an electrically conducting material, which is provided with multiple test points 135.It can by being detected to any two of them test point 135
Knowing whether 113 surface of transparent substrate that route between the two o'clock passes through has to burst apart etc. influences the flaw of optical element integrality.
As shown in figure 14, the tenth embodiment of the application provides a kind of optical projection mould group 15, with the 9th embodiment party
Optical projection mould group 11 in formula is essentially identical, and difference is that the optical projection mould group 15 further includes optical path director element 16.
The optical path director element 16 is arranged between light-source structure 1 and beam modulation element 110, and with the light source knot
At the corresponding position of light-emitting surface of first emission part 10 of structure 1.The optical path director element 16 is used for the first emission part 10
The first light beam guidance of divergent shape outgoing is irradiated to the diffusion part 111 of the beam modulation element 110.The optical path guiding member
The setting of part 16 is the technical solution in order to avoid being closer in the first emission part 10 of light-source structure 1 and the second emission part 12
In, issued from the first emission part 10 be used to form floodlight irradiation the first light beam of a part light can by beam modulation member
The patterning portion 112 of part 110 projects away the pattern beam for forming luminous intensity irregular distribution, to influence flood beam
Uniformity.The optical path director element 16 includes but is not limited to prism, lenticule and grating.The optical path director element 16 is set
Region is set to be consistent with the region where the first emission part 10 of light-source structure 1.
As shown in figure 15, the 11st embodiment of the application provides a kind of optical projection mould group 17, implements with the 9th
Optical projection mould group 11 in mode is essentially identical, and difference is the diffusion part 171 and figure of the beam modulation element 170
Case portion 172 is respectively formed on different transparent substrates.
The transparent substrate for being formed with patterning portion 172 is defined as patterned substrate 1721.The patterned substrate
It is formed at position corresponding with the second emission part 12 of light-source structure 1 on 1721 and the light field of light beam is subjected to rearrangement
Patterned optical lines 1720.In the present embodiment, 1 middle part of light-source structure is set corresponding to second emission part 12
Situation, the patterned optical lines 1720 are formed in the middle position of patterned substrate 1721.
The transparent substrate for being formed with diffusion part 171 is defined as diffusion substrate 1710.On the diffusion substrate 1710 with
The diffusion optical grains 1711 for playing light diffusion are formed at the corresponding position of the first emission part 10 of light-source structure 1.
The diffusion substrate 1710 region corresponding with patterned optical lines 1720 on patterned substrate 1721 keeps light transmission, the figure
The region corresponding with optical grains 1711 are spread on diffusion substrate 1710 of case substrate 1721 keeps light transmission, is defined as transmission region
1712.In the present embodiment, the light-source structure 1 of the second emission part 12 setting, institute are surrounded corresponding to first emission part 10
Diffusion substrate 1710 is stated to be formed at the periphery position corresponding with 1 first emission part 10 of light-source structure of the transmission region 1712
There are the diffusion optical grains 1711.
The patterned substrate 1721 and diffusion substrate 1710 can be stacked together, and can also be thrown along the optics
The projecting light path of shadow mould group 17 is respectively and independently arranged at the different location in optical path.It is understood that needing only assure that described
It corresponds to optical grains position on diffusion substrate 1710 and patterned substrate 1721 to be mutually aligned, for diffusion substrate 1710 and pattern
Change substrate 1721 not specially require along putting in order for the projecting light path.
As shown in FIG. 16 and 17, the 12nd embodiment of the application provides a kind of sensing device 18, is used to sense
The spatial information of measured target object.The spatial information includes, but are not limited to the depth information on measured target object surface, is tested
Object location information in space, the dimension information etc. of measured target object other three-dimensional letters relevant to measured target object
Breath.The spatial information of the measured target object sensed can be used for identifying measured target object or construct the three-dimensional of measured target object
Model.
The sensing device 18 include the optical projection mould group 11 as provided by above-mentioned 9th to the 11st embodiment and
Sense mould group 180.The optical projection mould group 11 is for projecting particular beam to measured target object.The sensing mould group 180
Including camera lens 181, imaging sensor 182 and image analysis processor 183.Described image sensor 182 is sensed by camera lens 181
The image that the particular beam is formed on measured target object.Described image analysis processor 183 analyzes sensed projection
Image on measured target object obtains the three-dimensional information of measured target object.
In the present embodiment, the sensing device 18 is to sense the three-dimensional information on measured target object surface and identify accordingly
The 3D face authentification device of measured target object identity.
The particular beam includes the flood beam of even intensity and can project default figure on measured target object
The pattern beam of case.The sensing mould group 180 according to the image that the flood beam sensed is formed on measured target object come
Identify whether close measured target object is face.The sensing mould group 180 is according to the pattern beam sensed tested
The change in shape of the predetermined pattern projected on object is to analyze the three-dimensional information on measured target object surface and accordingly to quilt
It surveys object and carries out face recognition.
As shown in figure 18, the 13rd embodiment of the application provides a kind of equipment 19, such as mobile phone, laptop, flat
Plate computer, touch-control interaction screen, door, the vehicles, robot, automatic numerical control lathe etc..The equipment 19 includes at least one
State sensing device 18 provided by the 12nd embodiment.The equipment 19 be used for according to the sensing result of the sensing device 18 come
It is corresponding to execute corresponding function.The corresponding function unlocks after including but not limited to identifying user's identity, payment, starts and preset
Application program, avoidance, identification user's countenance after using depth learning technology judge user mood and health feelings
Any one or more in condition.
In the present embodiment, the sensing device 18 is to sense the three-dimensional information on measured target object surface and identify accordingly
The 3D face authentification device of measured target object identity.The equipment 19 is the mobile phone equipped with the 3D face authentification device, notes
Electric terminals, door, the vehicles, safety check, the entry and exit such as this computer, tablet computer, touch-control interaction screen etc. are related to passing in and out permission
Equipment.
Need to be respectively set floodlight transmitter and light pattern with the existing optical projection mould group for sensing space information
The structure of transmitter is compared, and optical projection mould group 11 provided herein and its projecting method will project flood beam and pattern
The transmitter of light beam integrates, not only the smaller design for being conducive to equipment of volume, but also also further reduces device
The cost of part.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the application.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
The foregoing is merely the better embodiments of the application, all the application's not to limit the application
Made any modifications, equivalent replacements, and improvements etc., should be included within the scope of protection of this application within spirit and principle.
Claims (15)
1. a kind of optical projection mould group is sensed in predetermined pattern to measured target object comprising beam modulation for projecting
Element and light-source structure, the light-source structure include the second hair for issuing the first emission part of the first light beam and issuing the second light beam
Portion is penetrated, first emission part and the second emission part are formed on the same semiconductor base or are connected with each other to be integrated into entirety
Structure, the beam modulation element include diffusion part and patterning portion, the first emission part of the diffusion part corresponding light source structure
It is configured, for first beam spread to be formed to the flood beam of optical power detection, the patterning portion corresponds to light
Second emission part of source structure is configured, and is formed and can be tested for the light field of second light beam to be carried out rearrangement
The pattern beam of predetermined pattern is projected on object.
2. optical projection mould group as described in claim 1, it is characterised in that:First emission part includes multiple for emitting
First illuminator of the first light beam, second emission part includes multiple for emitting the second illuminator of the second light beam, described
First illuminator and the second illuminator be formed on the same semiconductor base and can be independently controlled respectively it is luminous, described half
The first light emitting region in the middle part of semiconductor base is defined in conductor substrate and is arranged around first light emitting region
The second light emitting region.
3. optical projection mould group as claimed in claim 2, it is characterised in that:First illuminator is pressed on a semiconductor substrate
It is uniformly distributed according to preset same intervals, second illuminator is randomly distributed on a semiconductor substrate or according to preset
Same intervals are uniformly distributed.
4. optical projection mould group as claimed in claim 3, it is characterised in that:First illuminator is formed in semiconductor base
The first light emitting region in, second illuminator is formed in the second light emitting region of semiconductor base;Or
First illuminator is formed in the second light emitting region of semiconductor base, and second illuminator is formed in semiconductor
In first light emitting region of substrate.
5. optical projection mould group as claimed in claim 4, it is characterised in that:First light emitting region is rectangle, described the
Two light emitting regions are correspondingly arranged at four edges of the first light emitting region.
6. optical projection mould group as claimed in claim 4, it is characterised in that:Second light emitting region is in first hair
The blocked areas that first light emitting region one is enclosed is surrounded outside light region, between first light emitting region and the second light emitting region
The size of minimum spacing D meets conditionWherein H is the light-emitting surface of light-source structure and is arranged in light source knot
The distance between tactic first optical element above structure, θ is is sent out from the first light emitting region and the second light emitting region
The maximum dispersion angle of light beam out.
7. optical projection mould group as claimed in claim 4, it is characterised in that:First light emitting region is positioned at semiconductor-based
Rectangle in the middle part of bottom, second light emitting region are that the semiconductor base is formed on the surface of illuminator in addition to first shines
Other regions other than region.
8. optical projection mould group as described in claim 1, it is characterised in that:First emission part includes being formed in one first
The first illuminator and light guide plate on semiconductor base, the light guide plate include incidence surface and light-emitting surface, first illuminator
The middle position of light guide plate light-emitting surface, second hair is arranged in the incidence surface setting of corresponding light guide plate, second emission part
The portion of penetrating includes the second illuminator of one or more being formed on one second semiconductor base.
9. optical projection mould group as claimed in claim 8, it is characterised in that:The multiple second illuminator is in the second semiconductor
It is randomly distributed in substrate;Or
The multiple second illuminator is equably arranged on the second semiconductor base according to preset same intervals.
10. optical projection mould group as described in claim 1, it is characterised in that:Second emission part includes one and is formed in
The second illuminator in the middle part of semiconductor base, first emission part include multiple symmetrical around first illuminator
First illuminator, first illuminator and the second illuminator are formed on the same semiconductor base and are independently controlled respectively
System shines, and first illuminator and the second illuminator are the wide face type vertical cavity surface emitting laser of single hole;Or
Second emission part includes multiple the second illuminators for being randomly distributed portion in the semiconductor substrate, first transmitting
Portion include around symmetrical multiple first illuminators in the multiple second illuminator region, first illuminator and
Second illuminator be formed on the same semiconductor base and be independently controlled respectively it is luminous, first illuminator be single hole
Wide face type vertical cavity surface emitting laser, second illuminator are the light-emitting array of multiple vertical cavity surface emitting lasers composition
Column.
11. optical projection mould group as claimed in claim 10, it is characterised in that:The wide face type of the single hole of first illuminator hangs down
The light-emitting surface shape of straight cavity surface-emitting laser can be rectangle or right angle moulding shape.
12. optical projection mould group as described in claim 1, it is characterised in that:Second light beam via patterning portion again
The predetermined pattern formed after arrangement light field is selected from irregular distribution spot pattern, the striped design of regular array and along not
One of pattern beam of equidirectional cross one another regular grid pattern and combinations thereof.
13. the optical projection mould group as described in any one of claim 1-11, it is characterised in that:The beam modulation element
Patterning portion and diffusion part be formed on the same transparent substrate;Or
The diffusion part and patterned features of the beam modulation element are not formed on different transparent substrates, described to be formed with figure
The transparent substrate in case portion is defined as patterned substrate, and diffusion substrate region corresponding with patterning portion keeps light transmission, institute
It states patterned substrate region corresponding with diffusion part and keeps light transmission.
14. the optical projection mould group as described in any one of claim 1-11, it is characterised in that:The function in the patterning portion
Specific patterned optical lines can be formed by corresponding position on the transparent substrate to realize, the patterned optical lines
Selected from one of diffraction optics lines, optical micro lens array, grating and combinations thereof.
15. the optical projection mould group as described in any one of claim 1-11, it is characterised in that:The optical projection mould group
Further include optical path director element, the optical path director element be arranged between light-source structure and beam modulation element and with the light
At the corresponding position of light-emitting surface of first emission part of source structure, the optical path director element is used for the first emission part in diverging
The first light beam guidance of shape outgoing is irradiated to the diffusion part of the beam modulation element.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810854491 | 2018-07-30 | ||
CN2018108544914 | 2018-07-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108919597A true CN108919597A (en) | 2018-11-30 |
CN108919597B CN108919597B (en) | 2024-02-13 |
Family
ID=64081104
Family Applications (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810976732.2A Active CN108954025B (en) | 2018-07-30 | 2018-08-25 | Light source structure and equipment using same |
CN201810976725.2A Withdrawn CN108803050A (en) | 2018-07-30 | 2018-08-25 | A kind of beam modulation element |
CN201810976729.0A Pending CN108957912A (en) | 2018-07-30 | 2018-08-25 | A kind of optical projection method |
CN201810976720.XA Pending CN109186494A (en) | 2018-07-30 | 2018-08-25 | A kind of method for sensing |
CN201810976736.0A Active CN109031872B (en) | 2018-07-30 | 2018-08-25 | Optical projection module and optical projection method |
CN201810976724.8A Withdrawn CN108921144A (en) | 2018-07-30 | 2018-08-25 | A kind of sensing device |
CN201810976723.3A Active CN108919597B (en) | 2018-07-30 | 2018-08-25 | Optical projection module |
CN201810976737.5A Withdrawn CN109211135A (en) | 2018-07-30 | 2018-08-25 | A kind of sensing device, method for sensing and equipment |
Family Applications Before (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810976732.2A Active CN108954025B (en) | 2018-07-30 | 2018-08-25 | Light source structure and equipment using same |
CN201810976725.2A Withdrawn CN108803050A (en) | 2018-07-30 | 2018-08-25 | A kind of beam modulation element |
CN201810976729.0A Pending CN108957912A (en) | 2018-07-30 | 2018-08-25 | A kind of optical projection method |
CN201810976720.XA Pending CN109186494A (en) | 2018-07-30 | 2018-08-25 | A kind of method for sensing |
CN201810976736.0A Active CN109031872B (en) | 2018-07-30 | 2018-08-25 | Optical projection module and optical projection method |
CN201810976724.8A Withdrawn CN108921144A (en) | 2018-07-30 | 2018-08-25 | A kind of sensing device |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810976737.5A Withdrawn CN109211135A (en) | 2018-07-30 | 2018-08-25 | A kind of sensing device, method for sensing and equipment |
Country Status (1)
Country | Link |
---|---|
CN (8) | CN108954025B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111352181A (en) * | 2018-12-21 | 2020-06-30 | 余姚舜宇智能光学技术有限公司 | Binary optical element, manufacturing method thereof and projection module |
CN111856849A (en) * | 2019-04-28 | 2020-10-30 | 青岛海信激光显示股份有限公司 | Projection equipment, projection system and laser television |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10607064B2 (en) * | 2018-05-21 | 2020-03-31 | Himax Technologies Limited | Optical projection system and optical projection method |
CN109445239B (en) * | 2018-11-19 | 2024-05-24 | 深圳阜时科技有限公司 | Optical projection module, sensing device and equipment |
JP2020174097A (en) * | 2019-04-10 | 2020-10-22 | 富士ゼロックス株式会社 | Light-emitting device, optical device, and information processor |
WO2020222704A1 (en) * | 2019-04-29 | 2020-11-05 | Ams Sensors Asia Pte. Ltd. | Illumination apparatus |
CN110174975B (en) * | 2019-05-20 | 2022-06-21 | 歌尔光学科技有限公司 | Projection touch system |
CN112542107A (en) * | 2019-09-20 | 2021-03-23 | 北京外号信息技术有限公司 | Panel type optical communication device and method for manufacturing the same |
TWI783409B (en) * | 2021-03-16 | 2022-11-11 | 大陸商廣州立景創新科技有限公司 | Complex diffuser, illumination module and three-dimensional scanning device |
Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005003409A (en) * | 2003-06-10 | 2005-01-06 | Kokan Keisoku Kk | Measuring device and measuring method of three-dimensional curved surface shape |
US20050275840A1 (en) * | 2004-05-27 | 2005-12-15 | Cheng-Qun Gui | Optical position assessment apparatus and method |
CN101511641A (en) * | 2006-08-01 | 2009-08-19 | 3M创新有限公司 | Illumination device |
CN102467665A (en) * | 2010-11-12 | 2012-05-23 | 中国船舶重工集团公司第七一○研究所 | Finger vein image acquisition identification apparatus |
CN102736362A (en) * | 2011-04-01 | 2012-10-17 | 华晶科技股份有限公司 | Camera |
CN103178442A (en) * | 2011-12-24 | 2013-06-26 | 普林斯顿光电子学公司 | Surface mount packaging for high-speed vertical cavity surface emitting lasers |
KR20130105381A (en) * | 2012-03-15 | 2013-09-25 | 프라임센스 엘티디. | Projectors of structured light |
US20150340841A1 (en) * | 2009-02-17 | 2015-11-26 | Trilumina Corp | Laser arrays for variable optical properties |
US20160197452A1 (en) * | 2010-02-02 | 2016-07-07 | Apple Inc. | Integrated structured-light projector |
CN105842762A (en) * | 2011-08-12 | 2016-08-10 | 西铁城电子株式会社 | Lens member and light-emitting device using same |
CN106164581A (en) * | 2016-06-29 | 2016-11-23 | 深圳市窗科技有限责任公司 | Lighting |
CN106507530A (en) * | 2015-09-03 | 2017-03-15 | 米沃奇电动工具公司 | Spotlight |
CN106990660A (en) * | 2017-05-09 | 2017-07-28 | 深圳奥比中光科技有限公司 | Structured light projection module |
CN107202554A (en) * | 2017-07-06 | 2017-09-26 | 杭州思看科技有限公司 | It is provided simultaneously with photogrammetric and 3-D scanning function hand-held large scale three-dimensional measurement beam scanner system |
CN107845627A (en) * | 2017-09-29 | 2018-03-27 | 深圳奥比中光科技有限公司 | More proximity detection optical sensors |
CN107884066A (en) * | 2017-09-29 | 2018-04-06 | 深圳奥比中光科技有限公司 | Optical sensor and its 3D imaging devices based on flood lighting function |
CN107968865A (en) * | 2017-12-26 | 2018-04-27 | 广东欧珀移动通信有限公司 | Export module and electronic device |
CN107968857A (en) * | 2017-12-26 | 2018-04-27 | 广东欧珀移动通信有限公司 | Input and output module and electronic device |
CN108169981A (en) * | 2018-01-15 | 2018-06-15 | 深圳奥比中光科技有限公司 | Multi-functional lighting module |
CN209167786U (en) * | 2018-07-30 | 2019-07-26 | 深圳阜时科技有限公司 | A kind of optical projection mould group |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006227503A (en) * | 2005-02-21 | 2006-08-31 | Sumitomo Electric Ind Ltd | Diffractive optical component and design method therefor |
JP2007155600A (en) * | 2005-12-07 | 2007-06-21 | Omron Corp | Projector for measuring three-dimensional shape, and instrument for measuring three-dimensional shape |
JP2010015794A (en) * | 2008-07-03 | 2010-01-21 | Citizen Electronics Co Ltd | Light guide sheet switch unit |
CN101482248B (en) * | 2009-03-02 | 2010-12-29 | 友达光电股份有限公司 | Light conducting plate with V shaped structure and backlight module including the same |
CN101840969A (en) * | 2009-03-16 | 2010-09-22 | 先进开发光电股份有限公司 | Semiconductor photoelectric element capable of improving light removal rate and manufacturing method thereof |
KR101863270B1 (en) * | 2009-05-01 | 2018-06-29 | 엑스트랄리스 테크놀로지 리미티드 | Improvements to Particle Detectors |
DE102009047788A1 (en) * | 2009-09-30 | 2011-03-31 | Osram Opto Semiconductors Gmbh | Lighting device for a camera and method for operating the same |
CN102073090B (en) * | 2010-11-05 | 2012-08-22 | 深圳市华星光电技术有限公司 | Light guide plate and backlight module |
CN102323828B (en) * | 2011-05-18 | 2013-06-12 | 天津蓝天太阳科技有限公司 | Sun tracking error computing method of solar power generation tracker and special equipment |
US10054430B2 (en) * | 2011-08-09 | 2018-08-21 | Apple Inc. | Overlapping pattern projector |
US8749796B2 (en) * | 2011-08-09 | 2014-06-10 | Primesense Ltd. | Projectors of structured light |
CN102346034B (en) * | 2011-09-22 | 2014-01-22 | 苏州亿帝电子科技有限公司 | Static long-distance laser planometer |
US9976725B2 (en) * | 2013-09-20 | 2018-05-22 | Osram Sylvania Inc. | Solid-state luminaire with pixelated control of light beam distribution |
CN104634277B (en) * | 2015-02-12 | 2018-05-15 | 上海图漾信息科技有限公司 | Capture apparatus and method, three-dimension measuring system, depth computing method and equipment |
TWI563438B (en) * | 2015-02-16 | 2016-12-21 | Lite On Singapore Pte Ltd | Gesture sensing module, method, and electronic apparatus thereof |
CN107690551A (en) * | 2015-05-29 | 2018-02-13 | 奥斯兰姆施尔凡尼亚公司 | The solid-state floodlight being distributed with modularized light source and electronic dimmable beam |
US20180243976A1 (en) * | 2015-09-30 | 2018-08-30 | Carbon, Inc. | Method and Apparatus for Producing Three- Dimensional Objects |
CN106153190A (en) * | 2016-06-16 | 2016-11-23 | 电子科技大学 | For obtaining spectral module and the bimodulus multiplex optical device of spectrum |
WO2018063780A1 (en) * | 2016-09-09 | 2018-04-05 | Ntt Docomo, Inc. | A manufacturing method of diffractive optical elements |
CN110249177A (en) * | 2016-12-19 | 2019-09-17 | 惠伦工程公司 | LED illumination module with fixing optical element and variable transmission mode |
US10400994B2 (en) * | 2016-12-19 | 2019-09-03 | Whelen Engineering Company, Inc. | LED illumination module with fixed optic and variable emission pattern |
CN107255889A (en) * | 2017-08-09 | 2017-10-17 | 青岛海信电器股份有限公司 | A kind of liquid crystal display device |
CN207096678U (en) * | 2017-08-31 | 2018-03-13 | 上海微电子装备(集团)股份有限公司 | LED light source and litho machine |
CN207279302U (en) * | 2017-10-17 | 2018-04-27 | 苏州欧普照明有限公司 | A kind of lighting apparatus |
CN207586618U (en) * | 2017-10-25 | 2018-07-06 | 深圳奥比中光科技有限公司 | Combination pattern projection arrangement and depth camera |
CN107908064A (en) * | 2017-11-06 | 2018-04-13 | 深圳奥比中光科技有限公司 | Structured light projection module, depth camera and the method for manufacturing structured light projection module |
CN107942612A (en) * | 2017-11-24 | 2018-04-20 | 深圳奥比中光科技有限公司 | The optical projection apparatus and its method for packing of the film containing monitoring |
CN107991836A (en) * | 2017-12-18 | 2018-05-04 | 深圳奥比中光科技有限公司 | A kind of optical projection module containing safety monitoring function |
CN108107662A (en) * | 2018-01-06 | 2018-06-01 | 广东欧珀移动通信有限公司 | Laser emitter, optoelectronic device and depth camera |
CN108337492B (en) * | 2018-01-15 | 2020-04-17 | 深圳奥比中光科技有限公司 | Dynamic projection imaging device |
CN108332082B (en) * | 2018-01-15 | 2020-06-30 | 深圳奥比中光科技有限公司 | Lighting module |
CN108132573A (en) * | 2018-01-15 | 2018-06-08 | 深圳奥比中光科技有限公司 | Floodlighting module |
-
2018
- 2018-08-25 CN CN201810976732.2A patent/CN108954025B/en active Active
- 2018-08-25 CN CN201810976725.2A patent/CN108803050A/en not_active Withdrawn
- 2018-08-25 CN CN201810976729.0A patent/CN108957912A/en active Pending
- 2018-08-25 CN CN201810976720.XA patent/CN109186494A/en active Pending
- 2018-08-25 CN CN201810976736.0A patent/CN109031872B/en active Active
- 2018-08-25 CN CN201810976724.8A patent/CN108921144A/en not_active Withdrawn
- 2018-08-25 CN CN201810976723.3A patent/CN108919597B/en active Active
- 2018-08-25 CN CN201810976737.5A patent/CN109211135A/en not_active Withdrawn
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005003409A (en) * | 2003-06-10 | 2005-01-06 | Kokan Keisoku Kk | Measuring device and measuring method of three-dimensional curved surface shape |
US20050275840A1 (en) * | 2004-05-27 | 2005-12-15 | Cheng-Qun Gui | Optical position assessment apparatus and method |
CN101511641A (en) * | 2006-08-01 | 2009-08-19 | 3M创新有限公司 | Illumination device |
US20150340841A1 (en) * | 2009-02-17 | 2015-11-26 | Trilumina Corp | Laser arrays for variable optical properties |
US20160197452A1 (en) * | 2010-02-02 | 2016-07-07 | Apple Inc. | Integrated structured-light projector |
CN102467665A (en) * | 2010-11-12 | 2012-05-23 | 中国船舶重工集团公司第七一○研究所 | Finger vein image acquisition identification apparatus |
CN102736362A (en) * | 2011-04-01 | 2012-10-17 | 华晶科技股份有限公司 | Camera |
CN105842762A (en) * | 2011-08-12 | 2016-08-10 | 西铁城电子株式会社 | Lens member and light-emitting device using same |
CN103178442A (en) * | 2011-12-24 | 2013-06-26 | 普林斯顿光电子学公司 | Surface mount packaging for high-speed vertical cavity surface emitting lasers |
KR20130105381A (en) * | 2012-03-15 | 2013-09-25 | 프라임센스 엘티디. | Projectors of structured light |
CN106507530A (en) * | 2015-09-03 | 2017-03-15 | 米沃奇电动工具公司 | Spotlight |
CN106164581A (en) * | 2016-06-29 | 2016-11-23 | 深圳市窗科技有限责任公司 | Lighting |
CN106990660A (en) * | 2017-05-09 | 2017-07-28 | 深圳奥比中光科技有限公司 | Structured light projection module |
CN107202554A (en) * | 2017-07-06 | 2017-09-26 | 杭州思看科技有限公司 | It is provided simultaneously with photogrammetric and 3-D scanning function hand-held large scale three-dimensional measurement beam scanner system |
CN107845627A (en) * | 2017-09-29 | 2018-03-27 | 深圳奥比中光科技有限公司 | More proximity detection optical sensors |
CN107884066A (en) * | 2017-09-29 | 2018-04-06 | 深圳奥比中光科技有限公司 | Optical sensor and its 3D imaging devices based on flood lighting function |
CN107968865A (en) * | 2017-12-26 | 2018-04-27 | 广东欧珀移动通信有限公司 | Export module and electronic device |
CN107968857A (en) * | 2017-12-26 | 2018-04-27 | 广东欧珀移动通信有限公司 | Input and output module and electronic device |
CN108169981A (en) * | 2018-01-15 | 2018-06-15 | 深圳奥比中光科技有限公司 | Multi-functional lighting module |
CN209167786U (en) * | 2018-07-30 | 2019-07-26 | 深圳阜时科技有限公司 | A kind of optical projection mould group |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111352181A (en) * | 2018-12-21 | 2020-06-30 | 余姚舜宇智能光学技术有限公司 | Binary optical element, manufacturing method thereof and projection module |
CN111856849A (en) * | 2019-04-28 | 2020-10-30 | 青岛海信激光显示股份有限公司 | Projection equipment, projection system and laser television |
CN111856849B (en) * | 2019-04-28 | 2022-12-20 | 青岛海信激光显示股份有限公司 | Projection equipment, projection system and laser television |
Also Published As
Publication number | Publication date |
---|---|
CN109031872A (en) | 2018-12-18 |
CN109186494A (en) | 2019-01-11 |
CN108803050A (en) | 2018-11-13 |
CN108957912A (en) | 2018-12-07 |
CN109031872B (en) | 2024-02-13 |
CN108954025B (en) | 2024-03-01 |
CN108954025A (en) | 2018-12-07 |
CN108919597B (en) | 2024-02-13 |
CN109211135A (en) | 2019-01-15 |
CN108921144A (en) | 2018-11-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108919597A (en) | A kind of optical projection mould group | |
CN109581795A (en) | A kind of optical projection mould group, sensing device and equipment | |
CN209167786U (en) | A kind of optical projection mould group | |
CN109143756A (en) | A kind of optical module, optical projection mould group, sensing device and equipment | |
CN209803547U (en) | Light source structure, optical projection module, sensing device and equipment | |
CN209446958U (en) | A kind of functionalization mould group, sensing device and equipment | |
CN110941132B (en) | Light source structure, optical projection module, sensing device and equipment | |
CN209044291U (en) | A kind of optical module, optical projection mould group, sensing device and equipment | |
CN109471321A (en) | A kind of light-source structure, optical projection mould group, sensing device and equipment | |
CN209327768U (en) | A kind of light-source structure, optical projection mould group, sensing device and equipment | |
CN210401989U (en) | Light source structure, optical projection module, sensing device and equipment | |
CN209327766U (en) | A kind of light-source structure, optical projection mould group, sensing device and equipment | |
CN209690699U (en) | A kind of functionalization mould group, sensing device and equipment | |
CN209446960U (en) | A kind of light-source structure, optical projection mould group, sensing device and equipment | |
CN209044290U (en) | A kind of optical module, optical projection mould group, sensing device and equipment | |
CN209690701U (en) | A kind of optical projection mould group, sensing device and equipment | |
CN209044289U (en) | A kind of optical module, optical projection mould group, sensing device and equipment | |
CN109143749A (en) | A kind of optical module, optical projection mould group, sensing device and equipment | |
CN110941131B (en) | Light source structure, optical projection module, sensing device and equipment | |
CN109143750A (en) | A kind of optical module, optical projection mould group, sensing device and equipment | |
CN109143752A (en) | A kind of optical module, optical projection mould group, sensing device and equipment | |
CN109254476B (en) | Optical projection method, sensing method and object three-dimensional information application method | |
CN209690700U (en) | A kind of optical sensing mould group, sensing device and equipment | |
CN109143757A (en) | A kind of functionalization mould group, sensing device and equipment | |
CN109143754A (en) | A kind of optical module, optical projection mould group, sensing device and equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |