CN209690700U - A kind of optical sensing mould group, sensing device and equipment - Google Patents

Abstract

The utility model is suitable for optics and electronic technology field, provides a kind of optical sensing mould group comprising imaging sensor, optical element, circuit board, pedestal and bracket.The chip and circuit board are respectively set on the base.The chip is connect through circuit board and extraneous transmission signal with circuit board.The bracket includes independently molding first support and second support.The first support is mounted on the pedestal.The one end of first support far from pedestal is arranged in the second support.Package assembly is provided in the first support and/or second support.The optical element is arranged in the first support and/or second support by package assembly.The utility model also provides a kind of sensing device and equipment.

Description

A kind of optical sensing mould group, sensing device and equipment

Technical field

The utility model belongs to optical technical field more particularly to a kind of optical sensing mould group, sensing device and equipment.

Background technique

The functionalization mould group of existing sensing device is often connected on pedestal using integrated bracket.It is set on the bracket The component of various different function is set, but because bracket is fixed integrated formed structure, a variety of different functional elements It must assemble together, it is very inconvenient.

Utility model content

The technical problem to be solved by the utility model is to provide a kind of optical sensing mould group, sensing device and equipment

The utility model embodiment provides a kind of optical sensing mould group comprising imaging sensor, optical element, circuit Plate, pedestal and bracket.Described image sensor and circuit board are respectively set on the base.Described image sensor and circuit board connect It connects through circuit board and extraneous transmission signal.The bracket includes independently molding first support and second support.Institute First support is stated to be mounted on the pedestal.The one end of first support far from pedestal is arranged in the second support.Described first Package assembly is provided in bracket and/or second support.The optical element is arranged by package assembly in the first support And/or in second support.

In other embodiments, the bracket is in hollow tube-shape, and the package assembly is formed on the inner sidewall of bracket, The package assembly includes card slot and step, and the card slot is that the rotation axes of symmetry on the inner sidewall of bracket around bracket opens up A circle groove, the step is the step structure that the different part of thickness is formed in junction on bracket inner sidewall.

In other embodiments, the second support includes the first connecting pin connecting with first support and with described The opposite second connection end in one connecting pin, the inner peripheral of first connecting pin are less than in the first support and second support phase The inner peripheral of end even, the inner peripheral edge of first connecting pin axially extends a circle flange connector, the connection Flange protrudes into the end that the first support is connected with second support and is formed by through-hole, the first connection of the second support It is fixed between the end face being correspondingly connected on the end face at end and first support with the first connecting pin by viscose glue, the flange connector It is fixed between outer surface and the portion inner surface of the through-hole of its first support protruded by viscose glue or helicitic texture.

In other embodiments, the second support is directly anchored to close to the end face of pedestal one end by viscose glue described On end face of the first support far from pedestal one end.

In other embodiments, the optical element includes focus lens, optical filter and cover board.

In other embodiments, the focus lens are arranged on the step of second support, and the optical filter setting exists In the card slot of first support, the cover board is arranged on end face of the second support far from pedestal side.

In other embodiments, the focus lens are arranged in the card slot of second support, and the optical filter setting exists On the step of first support, the cover board is arranged on end face of the second support far from pedestal side.

In other embodiments, the inner sidewall of one end that the second support is connected with first support is towards second A circle light-blocking structure is extended at the center of frame, and the light-blocking structure is the triangular bump to stand upside down, so that the second support Central through hole formed in the end section close to first support it is up-narrow and down-wide tower-shaped.

The utility model embodiment provides a kind of sensing device, for sensing the three-dimensional information of measured target object, wraps Include optical projection mould group and optical sensing mould group as described in the embodiment.The optical projection mould group is in object upslide Project preset spot pattern.The optical sensing mould group senses the specific light image projected on measured target object and by dividing Analyse the related three-dimensional information that the specific light image obtains tested subject matter.

The utility model embodiment provides a kind of equipment, including sensing device described in above embodiment.It is described to set The three-dimensional information of the standby measured target object sensed according to the sensing device executes corresponding function.

Optical sensing mould group, sensing device and equipment provided by the utility model embodiment can make different function Can property element be assembled apart, last recombinant has flexibly convenient beneficial effect to together.

The additional aspect and advantage of the utility model embodiment will be set forth in part in the description, partially will be under Become obvious in the description in face, or is recognized by the practice of the utility model embodiment.

Detailed description of the invention

Fig. 1 is the structural schematic diagram for the functionalization mould group that the utility model first embodiment provides.

Fig. 2 is the structural schematic diagram for the functionalization mould group that the utility model second embodiment provides.

Fig. 3 is the structural schematic diagram for the functionalization mould group that the utility model third embodiment provides.

Fig. 4 is the structural schematic diagram for the functionalization mould group that the 4th embodiment of the utility model provides.

Fig. 5 is the structural schematic diagram for the functionalization mould group that the 5th embodiment of the utility model provides.

Fig. 6 is the structural schematic diagram for the functionalization mould group that the utility model sixth embodiment provides.

Fig. 7 is the structural schematic diagram for the functionalization mould group that the 7th embodiment of the utility model provides.

Fig. 8 is the structural schematic diagram for the functionalization mould group that the 8th embodiment of the utility model provides.

Fig. 9 is the structural schematic diagram for the functionalization mould group that the 9th embodiment of the utility model provides.

Figure 10 is the structural schematic diagram for the functionalization mould group that the tenth embodiment of the utility model provides.

Figure 11 is the structural schematic diagram for the sensing device that the 11st embodiment of the utility model provides.

Figure 12 is the structural schematic diagram for the equipment that the 12nd embodiment of the utility model provides.

Specific embodiment

The embodiments of the present invention is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein Same or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Lead to below It crosses the embodiment being described with reference to the drawings to be exemplary, is only used for explaining the utility model, and should not be understood as practical to this Novel limitation.In the description of the present invention, it should be understood that term " first ", " second " are only used for describing, without It can be interpreted as indication or suggestion relative importance or implicitly indicate the quantity of indicated technical characteristic or put in order.By This defines " first ", the technical characteristic of " second " can explicitly or implicitly include one or more technology Feature.The meaning of " plurality " is two or more in the description of the present invention, unless otherwise clearly specific limit It is fixed.

In the description of the present invention, it should be noted that unless otherwise specific regulation or limiting, term " peace Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integration Connection；It can be mechanical connection, be also possible to be electrically connected or be in communication with each other；It can be directly connected, intermediate matchmaker can also be passed through Jie is indirectly connected, and can be the connection inside two elements or the interaction relationship between two elements.For this field For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.

Following disclosure provides many different embodiments or example is used to realize the different structure of the utility model. In order to simplify the disclosure of the utility model, hereafter only to the component of specific examples and being set for describing.Certainly, they are only Example, and purpose does not lie in limitation the utility model.In addition, the utility model can reuse reference in different examples Number and/or reference letter, this reuse are to simplify and clearly state the utility model, itself does not indicate institute The particular kind of relationship between various embodiments and/or setting discussed.In addition, the utility model is provided in the following description Various specific techniques and material are only the example for realizing technical solutions of the utility model, but those of ordinary skill in the art answer This recognizes that the technical solution of the utility model can also be by other techniques for not describing hereafter and/or other materials come real It is existing.

Further, described feature, structure can be incorporated in one or more embodiment party in any suitable manner In formula.In the following description, many details are provided so as to fully understand the embodiments of the present invention.So And one of ordinary skill in the art would recognize that, even if without one or more in the specific detail, or using other knots Structure, constituent element etc. can also practice the technical solution of the utility model.In other cases, it is not shown in detail or describes known knot Structure or operation to avoid fuzzy the utility model emphasis.

As shown in Figure 1, the utility model first embodiment provides a kind of functionalization mould group 1, have not for assembling The mould group of executable corresponding specific function is formed with the functional element 10 of specific function.The functional element 10 include but It is not limited to chip 12 and optical element 14.The functionalization mould group 1 includes functional element 10, circuit board 15, pedestal 16 and branch Frame 18.The chip 12 and circuit board 15 are separately positioned on pedestal 16.The chip 12 is connect with circuit board 12 to pass through electricity Road plate 15 and extraneous transmission signal.The setting of optical element 14 on mount 18, is provided with the bracket of the optical element 14 18 are fixed on the functionalization mould group 1 that executable corresponding function is formed on the pedestal 16.The bracket 18 is to chip 10 and light It learns element 14 etc. and plays the role of protection and support.

In the present embodiment, the chip 12 is luminescence chip.The functionalization mould group 1 is an optical projection mould group 1, For preset spot pattern being projected on object to sense the three-dimensional information of object.

The luminescence chip 12 issues the original beam with specific wavelength.The original beam is by optical element 18 The pattern beam that predetermined pattern can be projected on object is formed after modulation.The pattern beam is for sensing measured target The three-dimensional information of object, the original beam can be infrared or near-infrared light beam, and wave-length coverage is 750 nanometers (Nanometer, nm) is to 1650nm.

The luminescence chip 12 includes multiple illuminators 120.The illuminator 100 can be semiconductor laser.It is preferred that Ground, the illuminator 120 be vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL), it is made up on a semiconductor substrate of the techniques such as photoetching and etching.The illuminator 120 can be irregular arrangement, Regular array is repeated cyclically arrangement, and this is not restricted.

In other embodiments, the luminescence chip 12 can also be the wide face type VCSEL of a single hole.The single hole is wide Only one lightening hole of face type VCSEL, but shine aperture it is larger, several times in first embodiment as illuminator 120 One of VCSEL.The illumination effect of the wide face type VCSEL of single hole is equal to the uniform area source of luminous intensity.

The bracket 18 includes first support 180 and second support 182.The first support 180 is divided with second support 182 Not independent molding, in assembling, the first support 180 is mounted on the pedestal 16, and the second support 182 passes through viscose glue Or the modes such as screw thread and first support 180 are connected with each other far from one end of pedestal 16.

The optical element 14 is separately positioned in the first support 180 and second support 182.In present embodiment In, the optical element 14 includes diffraction optical element 140 (Diffractive Optical Element, DOE) and cover board 142.The light field that the DOE140 is issued for luminescence chip 12 described in rearrangement can be projected with being formed on object It is randomly distributed the pattern beam of spot pattern.It is arranged in the first support 180 in the DOE140.The cover board 142 It plays a protective role, is arranged in the second support 182.

The bracket 18 is in hollow tube-shape.It is formed on the inner sidewall of the bracket 18 for fixing the optical element 14 Package assembly 17.The package assembly 17 includes but is not limited to card slot 170 and/or step 172.The card slot 170 is to prop up The circle groove that rotation axes of symmetry on the inner sidewall of frame 18 around bracket 18 opens up.The step 172 is 18 inner sidewall of bracket The step structure that the different part of upper thickness is formed in junction.The step 172 includes loading end 1720 and step surface 1722.Plane of the loading end 1720 between 18 inner peripheral major part of connecting bracket and inner peripheral smaller portions, is used for Carry the optical element 14 being arranged on step 172.The step surface 1720 is the inner sidewall of 18 inner peripheral smaller portions of bracket Surface.The periphery that the loading end 1720 intersects with step surface 1722 is first periphery 1723 of the step 172 far from chip 12.Institute Stating the periphery that step surface 1722 intersects with 1 bottom end face of bracket is second periphery 1724 of the step 172 close to chip 12.

In the present embodiment, if the chip 12 is luminescence chip 12, the second support 182 and first support Extend a circle light-blocking structure 1820 in the center of the inner sidewall towards second support 182 of 180 one end being connected.The light-blocking knot Structure 1820 is that cross section is upright triangular bump, so that the central through hole of the second support 182 is close to first The end section of frame 180 forms gradually narrowed funnel shaped.The light-blocking structure 1820 can reduce luminescence chip 12 and be issued Light carried through step 172 14 underlying surfaces of optical element reflection after return luminescence chip 12 and upset the light of light source .It is understood that the light-blocking structure 1820 can also be applied in the other embodiments configured with luminescence chip 12.

In the present embodiment, it is card slot 170 that package assembly 17 is formed by the first support 180.The DOE is embedding Enter in card slot and is fixed.The package assembly 17 formed in the second support 182 is step 172.The setting of cover board 142 exists On step 172.The area for the end face that the first support is connected with second support is equal to or more than the second support therewith The area for the end face being correspondingly connected with.

It is understood that the needs of optical element 14 are being made when using card slot 170 come fixing optical element 14 Make to be put into molding die together when the bracket 18 and form together.

As shown in Fig. 2, the utility model second embodiment provides a kind of functionalization mould group 2, with the first embodiment party Functionalization mould group 1 in formula is essentially identical, and the main distinction is that the DOE240 is to be integrated with integrating for light beam adjustment structure 241 Formula DOE240.The integrated form DOE240 includes light-entering surface 2400, light output surface 2401, is formed on light-entering surface 2400 The patterned optical lines 2404 light beam adjustment structure 2403 and be formed on light output surface 2401.The light beam adjusts structure 2403 be the optical surface being formed on the light-entering surface 2400, and the light for being issued to the luminescence chip 12 carries out It adjusts so that it meets the requirement such as preset collimation and light beam aperture.The patterned optical lines 2404 is used for through toning Light beam after whole carries out rearrangement to form the patterned beam that can project predetermined pattern on object.

As shown in figure 3, the utility model third embodiment provides a kind of functionalization mould group 3, with the first embodiment party Functionalization mould group 1 in formula is essentially identical, and the main distinction is that the DOE340 is arranged on the step 372 of second support 382. The cover board 342 is arranged on the end face of 36 one end of separate pedestal of the second support 380.Do not have in the first support 380 There is setting optical element 14.

As shown in figure 4, the 4th embodiment of the utility model provides a kind of functionalization mould group 4, with third embodiment party Functionalization mould group 3 in formula is essentially identical, and the main distinction is that the DOE440 is that the above-mentioned light beam that is integrated with adjusts structure 4403 Integrated form DOE440.

As shown in figure 5, the 5th embodiment of the utility model provides a kind of functionalization mould group 5, with the first embodiment party Functionalization mould group 1 in formula is essentially identical, and the main distinction is to be formed with step 572 in the first support 580.It is described DOE540 is arranged on the step 572 of first support 580.The cover board 542 is arranged on the step 572 of second support 582. The second support 582 include the first connecting pin 5820 being connect with first support 580 and with 5820 phase of the first connecting pin Pair second connection end 5822.The inner peripheral of first connecting pin 5820 is less than in the first support 580 and second support The inner peripheral of 582 connected ends 5800.The inner peripheral edge of first connecting pin 5820 axially extends circle connection Flange 5823.The flange connector 5823 protrudes into the end 5800 that the first support 580 is connected with second support 582 and is formed Through-hole 5802 in.The portion of the outer surface of the flange connector 5823 and the through-hole 5802 of its first support 580 protruded into Divide between inner surface and is fixed by viscose glue.The end face of first connecting pin 5820 of the second support 582 and first support 580 It is fixed between the end face that upper and the first connecting pin 5820 is correspondingly connected with by viscose glue.

It is understood that the through-hole of the outer surface of the flange connector 5823 and its first support 580 protruded into It can also be fixed by forming helicitic texture between 5802 portion inner surface.

As shown in fig. 6, the utility model sixth embodiment provides a kind of functionalization mould group 6, with the 5th embodiment party Functionalization mould group 5 in formula is essentially identical, the main distinction be on the step 672 that the first support 680 is set be on State the integrated form DOE640 for being integrated with light beam adjustment structure 6403.

As shown in fig. 7, the 7th embodiment of the utility model provides a kind of functionalization mould group 7, with the 5th embodiment party Functionalization mould group 5 in formula is essentially identical, and the main distinction is that the step that second support 782 is arranged in the DOE740 is arranged in On 772.The cover board 742 is arranged on end face of the second support 782 far from 76 one end of pedestal.Do not have in the first support 780 There is setting optical element 14.

As shown in figure 8, the 8th embodiment of the utility model provides a kind of functionalization mould group 8, with the 7th embodiment party Functionalization mould group 7 in formula is essentially identical, and the main distinction is that the DOE840 being arranged on the step 872 of second support 882 is The above-mentioned integrated form DOE8403 for being integrated with light beam adjustment structure 840.

As shown in figure 9, the 9th embodiment of the utility model provides a kind of functionalization mould group 9, with the first embodiment party Functionalization mould group 1 in formula is essentially identical, and the main distinction is that the optical element 94 includes focus lens 944, optical filter 946 And cover board 942.The chip 92 is imaging sensor 92, and the functionalization mould group 9 is an optical sensing mould group.The focusing is saturating Mirror 944 is arranged on the step 972 of second support 982.The optical filter 946 is arranged in the card slot 970 of first support 980. The cover board 942 is arranged on end face of the second support 982 far from 96 side of pedestal.In the present embodiment, described image passes Sensor 92 is infrared or near infrared light image sensor, is incident upon on object for sensing for carrying out the pre- of three-dimensional sensing If pattern.

In the present embodiment, if the chip 92 is imaging sensor 92, the light-blocking structure 9820 is to stand upside down Triangular bump, so that the central through hole of the second support 982 is formed in the end section close to first support 980 It is narrow lower wide tower-shaped.By the scattering of 972 edge of step and to image when such light-blocking structure 9820 can reduce imaging ray incidence 92 institute of sensor is at image bring noise.

It is understood that in other embodiments, the focus lens 944 can also be arranged by card slot 970 In second support 982, the optical filter 946 can also be arranged in first support 980 by step 972, for first support 980 and second support 982 on package assembly 97 for being arranged optical element 94 be not specifically limited.

As shown in Figure 10, the tenth embodiment of the utility model provides a kind of functionalization mould group 10, implements with the 5th Functionalization mould group 5 in mode is essentially identical, and the main distinction is that the optical element 104 includes focus lens 1044, filters Piece 1046 and cover board 1042.The chip 102 is imaging sensor, and the functionalization mould group 10 is an optical sensing mould group.Institute Focus lens 1044 are stated to be arranged on the step 1072 of second support 1082.The optical filter 1046 is arranged in first support In 1080 card slot 1070.The cover board 1042 is arranged on end face of the second support 1082 far from 106 side of pedestal.In this reality It applies in mode, described image sensor 102 is infrared or near infrared light image the imaging sensor of sensing, is incident upon for sensing For carrying out the predetermined pattern of three-dimensional sensing on object.

It is understood that in other embodiments, the focus lens 1044 can also be arranged by card slot 1070 In second support 1082, the optical filter 1046 can also be arranged in first support 1082 by step 1072, for first It is not specifically limited on bracket 1080 and second support 1082 for the package assembly 107 of optical element 104 to be arranged.

As shown in figure 11, the 11st embodiment of the utility model provides a kind of sensing device 110, is used to sense quilt Survey the three-dimensional information of object.The spatial information includes but is not limited to the three-dimensional information on measured target object surface, measured target Object location information in space, the dimension information etc. of measured target object other 3 D stereos letters relevant to measured target object Breath.The spatial information of the measured target object sensed can be used for identifying measured target object or construct the three-dimensional of measured target object Three-dimensional model.

The sensing device 110 include the optical projection mould group 1 such as above-mentioned the first to eight embodiment provided by and such as it is above-mentioned Optical sensing mould group 9 provided by nine to ten embodiment.The optical projection mould group 1 is for projecting particular beam to tested Preset spot pattern is formed on object carries out three-dimensional sensing.The optical sensing mould group 9 is for sensing the optical projection Specific image that mould group 1 projects on measured target object simultaneously senses the correlation of tested subject matter by analyzing the specific image Spatial information.

In the present embodiment, the sensing device 110 is to sense the three-dimensional information on measured target object surface and know accordingly The 3D face authentification device of other measured target object identity.

As shown in figure 12, the 12nd embodiment of the utility model provides a kind of equipment 60, such as mobile phone, notebook electricity Brain, tablet computer, touch-control interaction screen, door, the vehicles, robot, automatic numerical control lathe etc..The equipment 60 includes at least one Sensing device 110 provided by a above-mentioned 11st embodiment.The equipment 60 is used for the sensing according to the sensing device 110 As a result corresponding function is executed to correspond to.The corresponding function includes but is not limited to unlock after identifying user's identity, pay, open Move preset application program, avoidance, identification user's countenance after using depth learning technology judge user mood and Any one or more in health condition.

In the present embodiment, the sensing device 110 is to sense the three-dimensional information on measured target object surface and know accordingly The 3D face authentification device of other measured target object identity.The equipment 60 is mobile phone, pen equipped with the 3D face authentification device Remember that electric terminals, door, the vehicles, safety check, the entry and exit such as this computer, tablet computer, touch-control interaction screen etc. are related to identification Equipment.

Compared with prior art, functionalization mould group, sensing device and equipment provided by the utility model, using simple light The structure of thinning meets the cooling requirements of chip, has low cost, lightening beneficial effect.

In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the utility model.In this explanation In book, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.

The foregoing is merely the better embodiments of the utility model, are not intended to limit the utility model, it is all It is practical new to should be included in this for made any modifications, equivalent replacements, and improvements etc. within the spirit and principles of the utility model Within the protection scope of type.

Claims (10)

1. a kind of optical sensing mould group, which is characterized in that including imaging sensor, optical element, circuit board, pedestal and bracket, Described image sensor and circuit board are respectively set on the base, and described image sensor is connect to pass through circuit board with circuit board Signal is transmitted with the external world, the bracket includes that independently molding first support and second support, the first support are installed On the pedestal, the second support is arranged in the one end of first support far from pedestal, the first support and/or second Package assembly is provided on frame, the optical element is arranged in the first support and/or second support by package assembly.

2. optical sensing mould group as described in claim 1, which is characterized in that the bracket is in hollow tube-shape, the assembling knot It is configured on the inner sidewall of bracket, the package assembly includes card slot and step, and the card slot is on the inner sidewall of bracket The circle groove opened up around the rotation axes of symmetry of bracket, the step is that the part that thickness is different on bracket inner sidewall is joining Locate the step structure formed.

3. optical sensing mould group as described in claim 1, which is characterized in that the second support includes connecting with first support The first connecting pin and the second connection end opposite with first connecting pin, the inner peripheral of first connecting pin be less than described The inner peripheral edge of the inner peripheral for the end being connected in first support with second support, first connecting pin axially extends One circle flange connector, the flange connector protrude into the end that the first support is connected with second support and are formed by through-hole, Pass through between the end face being correspondingly connected on the end face of first connecting pin of the second support and first support with the first connecting pin Viscose glue is fixed, and is passed through between the portion inner surface of the through-hole of the outer surface of the flange connector and its first support protruded into Viscose glue or helicitic texture are fixed.

4. optical sensing mould group as described in claim 1, which is characterized in that end face of the second support close to pedestal one end It is directly anchored on end face of the first support far from pedestal one end by viscose glue.

5. the optical sensing mould group as described in any one of claim 3 or 4, which is characterized in that the optical element includes Focus lens, optical filter and cover board.

6. optical sensing mould group as claimed in claim 5, which is characterized in that the platform of second support is arranged in the focus lens On rank, the optical filter is arranged in the card slot of first support, and end of the second support far from pedestal side is arranged in the cover board On face.

7. optical sensing mould group as claimed in claim 5, which is characterized in that the card of second support is arranged in the focus lens In slot, the optical filter is arranged on the step of first support, and end of the second support far from pedestal side is arranged in the cover board On face.

8. optical sensing mould group as claimed in claim 5, which is characterized in that the second support was connected with first support A circle light-blocking structure is extended at the center of the inner sidewall of one end towards second support, and the light-blocking structure is that the triangle of handstand is convex Block so that the central through hole of the second support formed in the end section close to first support it is up-narrow and down-wide tower-shaped.

9. a kind of sensing device, which is characterized in that for sensing the three-dimensional information of measured target object comprising optical projection mould group And optical sensing mould group, the optical projection mould group project on object as claimed in any of claims 1 to 8 in one of claims Preset spot pattern, the optical sensing mould group sense the specific light image projected on object and by described in analyses Specific light image obtains the related three-dimensional information of tested subject matter.

10. a kind of equipment, which is characterized in that including sensing device as claimed in claim 9, the equipment is filled according to the sensing The three-dimensional information of sensed measured target object is set to execute corresponding function.