CN109212880A - A kind of functionalization mould group, sensing device and equipment - Google Patents
A kind of functionalization mould group, sensing device and equipment Download PDFInfo
- Publication number
- CN109212880A CN109212880A CN201811247829.6A CN201811247829A CN109212880A CN 109212880 A CN109212880 A CN 109212880A CN 201811247829 A CN201811247829 A CN 201811247829A CN 109212880 A CN109212880 A CN 109212880A
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- China
- Prior art keywords
- support
- mould group
- bracket
- functionalization
- pedestal
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/208—Homogenising, shaping of the illumination light
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Optics & Photonics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The application is suitable for optics and electronic technology field, provides a kind of functionalization mould group comprising chip, optical element, circuit board, pedestal and bracket.The chip and circuit board are respectively set on the base.The chip is connect through circuit board and extraneous transmission signal with circuit board.The bracket includes independently molding first support and second support.The first support is mounted on the pedestal.The one end of first support far from pedestal is arranged in the second support.Package assembly is provided in the first support and/or second support.The optical element is arranged in the first support and/or second support by package assembly.The application also provides a kind of sensing device and equipment.
Description
Technical field
The application belongs to optical technical field more particularly to a kind of functionalization mould group, sensing device and equipment.
Background technique
The functionalization mould group of existing sensing device is often connected on pedestal using integrated bracket.It is set on the bracket
The component of various different function is set, but because bracket is fixed integrated formed structure, a variety of different functional elements
It must assemble together, it is very inconvenient.
Summary of the invention
Technical problems to be solved in this application are to provide a kind of functionalization mould group, sensing device and equipment
The application embodiment provides a kind of functionalization mould group comprising chip, optical element, circuit board, pedestal and branch
Frame.The chip and circuit board are respectively set on the base.The chip is connect through circuit board and extraneous biography with circuit board
Defeated signal.The bracket includes independently molding first support and second support.The first support is mounted on the base
On seat.The one end of first support far from pedestal is arranged in the second support.It is arranged in the first support and/or second support
There is package assembly.The optical element is arranged in the first support and/or second support by package assembly.
In other embodiments, the bracket is in hollow tube-shape, and the package assembly is formed on the inner sidewall of bracket,
The package assembly includes card slot and step, and the card slot is that the rotation axes of symmetry on the inner sidewall of bracket around bracket opens up
A circle groove, the step is the step structure that the different part of thickness is formed in junction on bracket inner sidewall.
In other embodiments, the second support includes the first connecting pin connecting with first support and with described
The opposite second connection end in one connecting pin, the inner peripheral of first connecting pin are less than in the first support and second support phase
The inner peripheral of end even, the inner peripheral edge of first connecting pin axially extends a circle flange connector, the connection
Flange protrudes into the end that the first support is connected with second support and is formed by through-hole, the first connection of the second support
It is fixed between the end face being correspondingly connected on the end face at end and first support with the first connecting pin by viscose glue, the flange connector
It is fixed between outer surface and the portion inner surface of the through-hole of its first support protruded by viscose glue or helicitic texture.
In other embodiments, the second support is directly anchored to close to the end face of pedestal one end by viscose glue described
On end face of the first support far from pedestal one end.
In other embodiments, the chip is imaging sensor, and the functionalization mould group is optical sensing mould group, institute
Stating optical element includes focus lens, optical filter and cover board.
In other embodiments, the focus lens are arranged on the step of second support, and the optical filter setting exists
In the card slot of first support, the cover board is arranged on end face of the second support far from pedestal side.
In other embodiments, the focus lens are arranged in the card slot of second support, and the optical filter setting exists
On the step of first support, the cover board is arranged on end face of the second support far from pedestal side.
In other embodiments, the inner sidewall of one end that the second support is connected with first support is towards second
A circle light-blocking structure is extended at the center of frame, and the light-blocking structure is the triangular bump to stand upside down, so that the second support
Central through hole formed in the end section close to first support it is up-narrow and down-wide tower-shaped.
The application embodiment provides a kind of sensing device, for sensing the three-dimensional information of measured target object comprising light
Learn projective module group and optical sensing mould group as described in the embodiment.The optical projection mould group projects on object
Preset spot pattern.The optical sensing mould group senses the specific light image projected on measured target object and by analysis institute
State the related three-dimensional information that specific light image obtains tested subject matter.
The application embodiment provides a kind of equipment, including sensing device described in above embodiment.The equipment root
The three-dimensional information of the measured target object sensed according to the sensing device executes corresponding function.
Functionalization mould group, sensing device and equipment provided by the application embodiment can make different functionality members
Part is assembled apart, and last recombinant has flexible convenient beneficial effect to together.
The additional aspect and advantage of the application embodiment will be set forth in part in the description, partially will be from following
Become obvious in description, or is recognized by the practice of the application embodiment.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the functionalization mould group that the application first embodiment provides.
Fig. 2 is the structural schematic diagram for the functionalization mould group that the application second embodiment provides.
Fig. 3 is the structural schematic diagram for the functionalization mould group that the application third embodiment provides.
Fig. 4 is the structural schematic diagram for the functionalization mould group that the 4th embodiment of the application provides.
Fig. 5 is the structural schematic diagram for the functionalization mould group that the 5th embodiment of the application provides.
Fig. 6 is the structural schematic diagram for the functionalization mould group that the application sixth embodiment provides.
Fig. 7 is the structural schematic diagram for the functionalization mould group that the 7th embodiment of the application provides.
Fig. 8 is the structural schematic diagram for the functionalization mould group that the 8th embodiment of the application provides.
Fig. 9 is the structural schematic diagram for the functionalization mould group that the 9th embodiment of the application provides.
Figure 10 is the structural schematic diagram for the functionalization mould group that the tenth embodiment of the application provides.
Figure 11 is the structural schematic diagram for the sensing device that the 11st embodiment of the application provides.
Figure 12 is the structural schematic diagram for the equipment that the 12nd embodiment of the application provides.
Specific embodiment
Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.?
In the description of the present application, it is to be understood that term " first ", " second " are only used for describing, and should not be understood as instruction or dark
Show relative importance or implicitly indicates the quantity of indicated technical characteristic or put in order.Define as a result, " first ",
The technical characteristic of " second " can explicitly or implicitly include one or more technical characteristic.In retouching for the application
In stating, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise specific regulation or limit, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integration connection；It can
To be mechanical connection, it is also possible to be electrically connected or is in communication with each other；It can be directly connected, the indirect phase of intermediary can also be passed through
Even, the connection inside two elements or the interaction relationship between two elements be can be.For the ordinary skill of this field
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
Following disclosure provides many different embodiments or example is used to realize the different structure of the application.In order to
Simplify disclosure herein, hereafter only to the component of specific examples and being set for describing.Certainly, they are merely examples, and
And purpose does not lie in limitation the application.In addition, the application can reuse reference number and/or reference word in different examples
Mother, this reuse are itself not indicate the various embodiments discussed to simplify and clearly state the application
And/or the particular kind of relationship between setting.In addition, the application in the following description provided by various specific techniques and material only
For the example for realizing technical scheme, but those of ordinary skill in the art should be aware that the technical solution of the application
It can be realized by other techniques for not describing hereafter and/or other materials.
Further, described feature, structure can be incorporated in one or more embodiment party in any suitable manner
In formula.In the following description, many details are provided so as to fully understand presently filed embodiment.However, this
Field technical staff will be appreciated that even if without one or more in the specific detail, or using other structures, group
Member etc. can also practice the technical solution of the application.In other cases, it is not shown in detail or describes known features or operation
To avoid the emphasis of fuzzy the application.
As shown in Figure 1, the application first embodiment provides a kind of functionalization mould group 1, there are different spies for assembling
The functional element 10 of function is determined to form the mould group of executable corresponding specific function.The functional element 10 includes but unlimited
In chip 12 and optical element 14.The functionalization mould group 1 includes functional element 10, circuit board 15, pedestal 16 and bracket 18.
The chip 12 and circuit board 15 are separately positioned on pedestal 16.The chip 12 is connect through circuit board 15 with circuit board 12
Signal is transmitted with the external world.On mount 18, the bracket 18 for being provided with the optical element 14 is fixed for the setting of optical element 14
The functionalization mould group 1 of executable corresponding function is formed on the pedestal 16.The bracket 18 is to chip 10 and optical element
14 etc. play the role of protection and support.
In the present embodiment, the chip 12 is luminescence chip.The functionalization mould group 1 is an optical projection mould group 1,
For preset spot pattern being projected on object to sense the three-dimensional information of object.
The luminescence chip 12 issues the original beam with specific wavelength.The original beam is by optical element 18
The pattern beam that predetermined pattern can be projected on object is formed after modulation.The pattern beam is for sensing measured target
The three-dimensional information of object, the original beam can be infrared or near-infrared light beam, and wave-length coverage is 750 nanometers
(Nanometer, nm) is to 1650nm.
The luminescence chip 12 includes multiple illuminators 120.The illuminator 100 can be semiconductor laser.It is preferred that
Ground, the illuminator 120 be vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser,
VCSEL), it is made up on a semiconductor substrate of the techniques such as photoetching and etching.The illuminator 120 can be irregular arrangement,
Regular array is repeated cyclically arrangement, and this is not restricted.
In other embodiments, the luminescence chip 12 can also be the wide face type VCSEL of a single hole.The single hole is wide
Only one lightening hole of face type VCSEL, but shine aperture it is larger, several times in first embodiment as illuminator 120
One of VCSEL.The illumination effect of the wide face type VCSEL of single hole is equal to the uniform area source of luminous intensity.
The bracket 18 includes first support 180 and second support 182.The first support 180 is divided with second support 182
Not independent molding, in assembling, the first support 180 is mounted on the pedestal 16, and the second support 182 passes through viscose glue
Or the modes such as screw thread and first support 180 are connected with each other far from one end of pedestal 16.
The optical element 14 is separately positioned in the first support 180 and second support 182.In present embodiment
In, the optical element 14 includes diffraction optical element 140 (Diffractive Optical Element, DOE) and cover board
142.The light field that the DOE140 is issued for luminescence chip 12 described in rearrangement can be projected with being formed on object
It is randomly distributed the pattern beam of spot pattern.It is arranged in the first support 180 in the DOE140.The cover board 142
It plays a protective role, is arranged in the second support 182.
The bracket 18 is in hollow tube-shape.It is formed on the inner sidewall of the bracket 18 for fixing the optical element 14
Package assembly 17.The package assembly 17 includes but is not limited to card slot 170 and/or step 172.The card slot 170 is to prop up
The circle groove that rotation axes of symmetry on the inner sidewall of frame 18 around bracket 18 opens up.The step 172 is 18 inner sidewall of bracket
The step structure that the different part of upper thickness is formed in junction.The step 172 includes loading end 1720 and step surface
1722.Plane of the loading end 1720 between 18 inner peripheral major part of connecting bracket and inner peripheral smaller portions, is used for
Carry the optical element 14 being arranged on step 172.The step surface 1720 is the inner sidewall of 18 inner peripheral smaller portions of bracket
Surface.The periphery that the loading end 1720 intersects with step surface 1722 is first periphery 1723 of the step 172 far from chip 12.Institute
Stating the periphery that step surface 1722 intersects with 1 bottom end face of bracket is second periphery 1724 of the step 172 close to chip 12.
In the present embodiment, if the chip 12 is luminescence chip 12, the second support 182 and first support
Extend a circle light-blocking structure 1820 in the center of the inner sidewall towards second support 182 of 180 one end being connected.The light-blocking knot
Structure 1820 is that cross section is upright triangular bump, so that the central through hole of the second support 182 is close to first
The end section of frame 180 forms gradually narrowed funnel shaped.The light-blocking structure 1820 can reduce luminescence chip 12 and be issued
Light carried through step 172 14 underlying surfaces of optical element reflection after return luminescence chip 12 and upset the light of light source
?.It is understood that the light-blocking structure 1820 can also be applied in the other embodiments configured with luminescence chip 12.
In the present embodiment, it is card slot 170 that package assembly 17 is formed by the first support 180.The DOE is embedding
Enter in card slot and is fixed.The package assembly 17 formed in the second support 182 is step 172.The setting of cover board 142 exists
On step 172.The area for the end face that the first support is connected with second support is equal to or more than the second support therewith
The area for the end face being correspondingly connected with.
It is understood that the needs of optical element 14 are making when using card slot 170 come fixing optical element 14
It is put into molding die when the bracket 18 and forms together together.
As shown in Fig. 2, the application second embodiment provides a kind of functionalization mould group 2, in first embodiment
Functionalization mould group 1 it is essentially identical, the main distinction be the DOE240 be integrated with light beam adjustment structure 241 integrated form
DOE240.The integrated form DOE240 includes light-entering surface 2400, light output surface 2401, the light being formed on light-entering surface 2400
The patterned optical lines 2404 beam adjustment structure 2403 and be formed on light output surface 2401.The light beam adjusts structure
2403 be the optical surface being formed on the light-entering surface 2400, and the light for being issued to the luminescence chip 12 carries out
It adjusts so that it meets the requirement such as preset collimation and light beam aperture.The patterned optical lines 2404 is used for through toning
Light beam after whole carries out rearrangement to form the patterned beam that can project predetermined pattern on object.
As shown in figure 3, the application third embodiment provides a kind of functionalization mould group 3, in first embodiment
Functionalization mould group 1 it is essentially identical, the main distinction is that the DOE340 is arranged on the step 372 of second support 382.It is described
Cover board 342 is arranged on the end face of 36 one end of separate pedestal of the second support 380.It is not set in the first support 380
Set optical element 14.
As shown in figure 4, the 4th embodiment of the application provides a kind of functionalization mould group 4, in third embodiment
Functionalization mould group 3 it is essentially identical, the main distinction be the DOE440 be it is above-mentioned be integrated with light beam adjust structure 4403 collection
Accepted way of doing sth DOE440.
As shown in figure 5, the 5th embodiment of the application provides a kind of functionalization mould group 5, in first embodiment
Functionalization mould group 1 it is essentially identical, the main distinction is to be formed with step 572 in the first support 580.The DOE540 is set
It sets on the step 572 of first support 580.The cover board 542 is arranged on the step 572 of second support 582.Described second
Frame 582 includes to be connected with the first connecting pin 5820 that first support 580 is connect and opposite with first connecting pin 5820 second
Connect end 5822.The inner peripheral of first connecting pin 5820 is less than the end being connected in the first support 580 with second support 582
The inner peripheral in portion 5800.The inner peripheral edge of first connecting pin 5820 axially extends a circle flange connector 5823.Institute
It states flange connector 5823 and protrudes into the end 5800 that the first support 580 is connected with second support 582 and be formed by through-hole 5802
It is interior.The portion inner surface of the through-hole 5802 of the outer surface of the flange connector 5823 and its first support 580 protruded into it
Between fixed by viscose glue.The end face of first connecting pin 5820 of the second support 582 is connect in first support 580 with first
It is fixed between the end face that end 5820 is correspondingly connected with by viscose glue.
It is understood that the through-hole of the outer surface of the flange connector 5823 and its first support 580 protruded into
It can also be fixed by forming helicitic texture between 5802 portion inner surface.
As shown in fig. 6, the application sixth embodiment provides a kind of functionalization mould group 6, in the 5th embodiment
Functionalization mould group 5 it is essentially identical, the main distinction is that on the step 672 that the first support 680 is arranged in be above-mentioned collection
At the integrated form DOE640 for having light beam adjustment structure 6403.
As shown in fig. 7, the 7th embodiment of the application provides a kind of functionalization mould group 7, in the 5th embodiment
Functionalization mould group 5 it is essentially identical, the main distinction is that the step 772 that second support 782 is arranged in the DOE740 is arranged in
On.The cover board 742 is arranged on end face of the second support 782 far from 76 one end of pedestal.It is not set in the first support 780
Set optical element 14.
As shown in figure 8, the 8th embodiment of the application provides a kind of functionalization mould group 8, in the 7th embodiment
Functionalization mould group 7 it is essentially identical, the main distinction be the DOE840 being arranged on the step 872 of second support 882 be it is above-mentioned
It is integrated with the integrated form DOE8403 of light beam adjustment structure 840.
As shown in figure 9, the 9th embodiment of the application provides a kind of functionalization mould group 9, in first embodiment
Functionalization mould group 1 it is essentially identical, the main distinction be the optical element 94 include focus lens 944, optical filter 946 and lid
Plate 942.The chip 92 is imaging sensor 92, and the functionalization mould group 9 is an optical sensing mould group.The focus lens
944 are arranged on the step 972 of second support 982.The optical filter 946 is arranged in the card slot 970 of first support 980.Institute
Cover board 942 is stated to be arranged on end face of the second support 982 far from 96 side of pedestal.In the present embodiment, described image senses
Device 92 is infrared or near infrared light image sensor, is incident upon on object for sensing for carrying out the default figure of three-dimensional sensing
Case.
In the present embodiment, if the chip 92 is imaging sensor 92, the light-blocking structure 9820 is to stand upside down
Triangular bump so that the central through hole of the second support 982 close to first support 980 end section formed it is upper narrow
It is lower wide tower-shaped.Such light-blocking structure 9820 is scattered and passed to image by 972 edge of step when can reduce imaging ray incidence
92 institute of sensor is at image bring noise.
It is understood that in other embodiments, the focus lens 944 can also be arranged by card slot 970
In second support 982, the optical filter 946 can also be arranged in first support 980 by step 972, for first support 980
It is not specifically limited in second support 982 for the package assembly 97 of optical element 94 to be arranged.
As shown in Figure 10, the tenth embodiment of the application provides a kind of functionalization mould group 10, with the 5th embodiment
In functionalization mould group 5 it is essentially identical, the main distinction be the optical element 104 include focus lens 1044, optical filter
1046 and cover board 1042.The chip 102 is imaging sensor, and the functionalization mould group 10 is an optical sensing mould group.It is described
Focus lens 1044 are arranged on the step 1072 of second support 1082.First support 1080 is arranged in the optical filter 1046
In card slot 1070.The cover board 1042 is arranged on end face of the second support 1082 far from 106 side of pedestal.In present embodiment
In, described image sensor 102 is infrared or near infrared light image the imaging sensor of sensing, is incident upon object for sensing
On for carrying out the predetermined pattern of three-dimensional sensing.
It is understood that in other embodiments, the focus lens 1044 can also be arranged by card slot 1070
In second support 1082, the optical filter 1046 can also be arranged in first support 1082 by step 1072, for first
It is not specifically limited on bracket 1080 and second support 1082 for the package assembly 107 of optical element 104 to be arranged.
As shown in figure 11, the 11st embodiment of the application provides a kind of sensing device 110, is used to sense tested mesh
Mark the three-dimensional information of object.The spatial information includes but is not limited to that the three-dimensional information on measured target object surface, measured target object exist
Other 3 D stereo information relevant to measured target object such as dimension information of location information, measured target object in space.Institute
The spatial information of the measured target object sensed can be used for identifying measured target object or construct the 3 D stereo of measured target object
Model.
The sensing device 110 include the optical projection mould group 1 such as above-mentioned the first to eight embodiment provided by and such as it is above-mentioned
Optical sensing mould group 9 provided by nine to ten embodiment.The optical projection mould group 1 is for projecting particular beam to tested
Preset spot pattern is formed on object carries out three-dimensional sensing.The optical sensing mould group 9 is for sensing the optical projection
Specific image that mould group 1 projects on measured target object simultaneously senses the correlation of tested subject matter by analyzing the specific image
Spatial information.
In the present embodiment, the sensing device 110 is to sense the three-dimensional information on measured target object surface and know accordingly
The 3D face authentification device of other measured target object identity.
As shown in figure 12, the 12nd embodiment of the application provides a kind of equipment 60, such as mobile phone, laptop, flat
Plate computer, touch-control interaction screen, door, the vehicles, robot, automatic numerical control lathe etc..The equipment 60 includes at least one
State sensing device 110 provided by the 11st embodiment.The equipment 60 is used for the sensing result according to the sensing device 110
Corresponding function is executed to correspond to.The corresponding function unlocks after including but not limited to identifying user's identity, payment, starts in advance
If application program, avoidance, using depth learning technology judge the mood and health of user after identification user's countenance
Any one or more in situation.
In the present embodiment, the sensing device 110 is to sense the three-dimensional information on measured target object surface and know accordingly
The 3D face authentification device of other measured target object identity.The equipment 60 is mobile phone, pen equipped with the 3D face authentification device
Remember that electric terminals, door, the vehicles, safety check, the entry and exit such as this computer, tablet computer, touch-control interaction screen etc. are related to identification
Equipment.
Compared with prior art, functionalization mould group, sensing device and equipment provided herein, using simple lightening
Structure meet the cooling requirements of chip, there is low cost, lightening beneficial effect.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the application.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
The foregoing is merely the better embodiments of the application, all the application's not to limit the application
Made any modifications, equivalent replacements, and improvements etc., should be included within the scope of protection of this application within spirit and principle.
Claims (10)
1. a kind of functionalization mould group comprising chip, optical element, circuit board, pedestal and bracket, the chip and circuit board point
It is not arranged on the base, the chip is connect so that by circuit board and extraneous transmission signal, the bracket includes point with circuit board
Not independent molding first support and second support, the first support are mounted on the pedestal, the second support setting
In the one end of first support far from pedestal, package assembly, the optics member are provided in the first support and/or second support
Part is arranged in the first support and/or second support by package assembly.
2. functionalization mould group as described in claim 1, which is characterized in that the bracket is in hollow tube-shape, the package assembly
It is formed on the inner sidewall of bracket, the package assembly includes card slot and step, and the card slot is to enclose on the inner sidewall of bracket
The circle groove opened up around the rotation axes of symmetry of bracket, the step is the different part of thickness on bracket inner sidewall in junction
The step structure of formation.
3. functionalization mould group as claimed in claim 2, which is characterized in that the second support includes connecting with first support
First connecting pin and the second connection end opposite with first connecting pin, the inner peripheral of first connecting pin are less than described the
The inner peripheral edge of the inner peripheral for the end being connected on one bracket with second support, first connecting pin axially extends one
Flange connector is enclosed, the flange connector protrudes into the end that the first support is connected with second support and is formed by through-hole, institute
It states between the end face being correspondingly connected on the end face and first support of the first connecting pin of second support with the first connecting pin by viscous
Glue is fixed, by viscous between the portion inner surface of the through-hole of the outer surface of the flange connector and its first support protruded into
Glue or helicitic texture are fixed.
4. functionalization mould group as claimed in claim 2, which is characterized in that the second support is logical close to the end face of pedestal one end
Viscose glue is crossed to be directly anchored on end face of the first support far from pedestal one end.
5. the functionalization mould group as described in any one of claim 3 or 4, which is characterized in that the chip is image sensing
Device, the functionalization mould group are optical sensing mould group, and the optical element includes focus lens, optical filter and cover board.
6. functionalization mould group as claimed in claim 5, which is characterized in that the step of second support is arranged in the focus lens
On, the optical filter is arranged in the card slot of first support, and end face of the second support far from pedestal side is arranged in the cover board
On.
7. functionalization mould group as claimed in claim 5, which is characterized in that the card slot of second support is arranged in the focus lens
Interior, the optical filter is arranged on the step of first support, and end face of the second support far from pedestal side is arranged in the cover board
On.
8. functionalization mould group as claimed in claim 5, which is characterized in that the second support be connected with first support one
A circle light-blocking structure is extended at the center of the inner sidewall at end towards second support, and the light-blocking structure is that the triangle of handstand is convex
Block so that the central through hole of the second support formed in the end section close to first support it is up-narrow and down-wide tower-shaped.
9. a kind of sensing device, for sensing the three-dimensional information of measured target object comprising optical projection mould group and as right is wanted
Optical sensing mould group described in asking any one of 1 to 8, the optical projection mould group project preset hot spot on object
Pattern, the optical sensing mould group sense the specific light image projected on object and by analyzing the specific light image
Obtain the related three-dimensional information of tested subject matter.
10. a kind of equipment, including sensing device as claimed in claim 9, the equipment are sensed according to the sensing device
The three-dimensional information of measured target object execute corresponding function.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811247829.6A CN109212880A (en) | 2018-10-25 | 2018-10-25 | A kind of functionalization mould group, sensing device and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811247829.6A CN109212880A (en) | 2018-10-25 | 2018-10-25 | A kind of functionalization mould group, sensing device and equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109212880A true CN109212880A (en) | 2019-01-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811247829.6A Withdrawn CN109212880A (en) | 2018-10-25 | 2018-10-25 | A kind of functionalization mould group, sensing device and equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109212880A (en) |
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2018
- 2018-10-25 CN CN201811247829.6A patent/CN109212880A/en not_active Withdrawn
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Application publication date: 20190115 |
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