CN108124032A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN108124032A CN108124032A CN201711433073.XA CN201711433073A CN108124032A CN 108124032 A CN108124032 A CN 108124032A CN 201711433073 A CN201711433073 A CN 201711433073A CN 108124032 A CN108124032 A CN 108124032A
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- Prior art keywords
- light
- close
- electronic device
- infrared
- casing
- Prior art date
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/22—Illumination; Arrangements for improving the visibility of characters on dials
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
Abstract
The invention discloses a kind of electronic devices.Electronic device includes casing, output module, display screen, optical flame detector and proximity sensor.Exporting module includes encapsulating housing, structured light projector and close to infrared lamp.Encapsulating housing includes package substrate, and for structured light projector with being encapsulated in encapsulating housing and being carried on package substrate close to infrared lamp, structured light projector can emit infrared light with different power from close to infrared lamp outside encapsulating housing.Display screen is arranged on casing, and display screen is formed with light transmission entity area and including the front that can show picture and the back side opposite with front.Optical flame detector is arranged on the one side where the back side of display screen, and optical flame detector is corresponding with light transmission entity area, and optical flame detector incides into the target light intensity of light and output light on optical flame detector for receiving.Proximity sensor is arranged on package substrate and outside encapsulation encapsulating housing.The set-up mode of output module, optical flame detector and proximity sensor optimizes the space layout in electronic device.
Description
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, the type and quantity for the function element that mobile phone needs are set
It is more and more, in order to realize distance detection, ambient light detection with the functions such as the facial 3D feature recognitions of user, it is necessary to be set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be occupied.
The content of the invention
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Module is exported, on the housing, the output module includes encapsulating housing, structure light for the output module installation
The projector and close to infrared lamp, the encapsulating housing include package substrate, the structured light projector with it is described close to infrared lamp
Be encapsulated in the encapsulating housing and carry on the package substrate, the structured light projector with it is described close to infrared lamp energy
It is enough that infrared light is emitted outside the encapsulating housing with different power；
Display screen, the display screen are set on the housing, and the display screen is formed with light transmission entity area and including energy
Enough show the front of picture and the back side opposite with the front；
Optical flame detector, the optical flame detector are arranged on the one side where the back side of the display screen, the optical flame detector and institute
Light transmission entity area correspondence is stated, the optical flame detector incides into the light on the optical flame detector for reception and exports the mesh of the light
Mark light intensity；With
The proximity sensor on the package substrate and being located at outside the encapsulating housing is set.
In some embodiments, the output module further includes chip, and the structured light projector is with described close to red
Outer lamp is formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected at the top of the encapsulation between the package substrate, and structure is formed at the top of the encapsulation
Light window and close to window, the structure light window is corresponding with the structured light projector, it is described close to window with it is described close
Infrared lamp corresponds to.
In some embodiments, the output module is further included close to lamp lens, described to be arranged on institute close to lamp lens
State in encapsulating housing and with it is described corresponding close to infrared lamp.
In some embodiments, the output module further includes metal shutter, and the metal shutter is located at described
In encapsulating housing and positioned at the structured light projector and described close between infrared lamp.
In some embodiments, grounding pin, structure light pin are formed with and close to lamp pin on the output module,
When the grounding pin and the structure light pin are enabled, the structured light projector emits infrared light；The grounding lead
Foot and it is described close to lamp pin be enabled when, it is described close to infrared lamp emit infrared light.
In some embodiments, the electronic device further includes the cover board of light transmission, and the casing offers casing and approaches
Through hole and casing structure light through hole, it is described corresponding close to through hole with the casing close to infrared lamp, the structured light projector with
The casing structure light through hole corresponds to, and the cover board is set on the housing.
In some embodiments, the cover board is formed with the surface that the casing is combined and only transmits the infrared of infrared light
It is described infrared to block the casing close at least one in through hole and the casing structure light through hole through ink through ink
It is a.
In some embodiments, the light transmission entity area includes image pixel, and the electronic device further includes processor,
The optical flame detector receives the light to export the initial beam intensity of the environmental light intensity information including the external electronic device；It is described
Processor is used to handle the initial beam intensity to obtain the institute for the environmental light intensity information for only including the external electronic device
State target light intensity.
In some embodiments, the initial beam intensity includes the environmental light intensity information and the display screen shows image
When display intensity signal, the processor is used to obtain the display intensity signal when display screen shows image in real time, and
The display intensity signal is removed when handling the initial beam intensity to obtain the target light intensity.
In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head
Kind.
In some embodiments, the electronic device further include infrared pick-up head, visible image capturing head, receiver,
And infrared light compensating lamp, the output module, the infrared pick-up head, the visible image capturing head, the receiver and described
The center of infrared light compensating lamp is located on same line segment, is followed successively by from one end of the line segment to the other end：
The output module, the infrared light compensating lamp, the receiver, the infrared pick-up head, the visible ray are taken the photograph
As head；Or
The output module, the visible image capturing head, the receiver, the infrared pick-up head, the infrared benefit
Light lamp；Or
The infrared pick-up head, the infrared light compensating lamp, the receiver, the visible image capturing head, the output
Module；Or
The infrared pick-up head, the visible image capturing head, the receiver, the output module, the infrared benefit
Light lamp.
In some embodiments, the electronic device further include receiver, infrared pick-up head, visible image capturing head and
Infrared light compensating lamp, the electronic device further include the cover board of light transmission, and the cover board is set on the housing, and the casing opens up
There is casing sound outlet hole, the cover board offers cover board sound outlet hole, and the receiver goes out with the cover board sound outlet hole and the casing
The position of sound hole corresponds to, the output module, the infrared pick-up head, the visible image capturing head and the infrared light compensating lamp
Center be located on same line segment, the receiver is between the line segment and the top of the casing.
In the electronic device of embodiment of the present invention, output module is by structured light projector with being integrated into one close to infrared lamp
A list package body structure has gathered transmitting infrared light with the function of infrared distance measurement and three-dimensional imaging, therefore, has exported the integrated of module
Higher, small volume is spent, output module has saved the space for the function of realizing three-dimensional imaging and infrared distance measurement.Further, since knot
Structure light projector and be carried on close to infrared lamp on same package substrate, compared to traditional handicraft structured light projector with connecing
Near-infrared lamp needs to be respectively adopted different wafers and manufactures recombinants to be encapsulated to PCB substrate, improves packaging efficiency.Meanwhile light
Sensor is arranged on the one side where the back side of display screen, so as to which optical flame detector will not be occupied between display platen edge and envelope edge
Space shows that the gap between platen edge and envelope edge be can be made smaller, and in other words, the display area of display screen can be with
Increase, to improve the screen accounting of electronic device.Proximity sensor is arranged on package substrate, it may not be necessary to be set again additional
Fixed structure fixes proximity sensor, saves the installation space in electronic device.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
It obtains substantially and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 3 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Fig. 4 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 5 is partial sectional schematic view of the electronic device of Fig. 1 along V-V lines；
Fig. 6 is the electronic device of Fig. 1 along the schematic cross-section of line VI -- VI；
Fig. 7 is the proximity sensor of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Fig. 8 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Fig. 9 is the schematic cross-section of the output module of another embodiment of the present invention；
Figure 10 is the structure diagram of the electronic device of another embodiment of the present invention；
Figure 11 is the part that the electronic device edge of another embodiment of the present invention is intercepted with the V-V line correspondence positions in Fig. 1
Schematic cross-section；
Figure 12 is the part that the electronic device edge of a further embodiment of this invention is intercepted with the V-V line correspondence positions in Fig. 1
Schematic cross-section；
Figure 13 is the output module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of proximity sensor；
Figure 14 is the proximity sensor of another embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 15 to Figure 21 is the proximity sensor of the electronic device of embodiment of the present invention and the three-dimensional signal of imaging modules
Figure.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the same or similar element of expression eventually or there is same or like element.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features contact directly or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30, display screen 90 and electronics
Component.Electronic component includes output module 10, proximity sensor 51 (such as Fig. 7), optical flame detector 52, imaging modules 60 (as schemed
7), receiver 70 and infrared light compensating lamp 80.Electronic device 100 can be mobile phone, tablet computer, laptop, smartwatch,
Intelligent bracelet, automatic teller machine etc., the embodiment of the present invention are illustrated so that electronic device 100 is mobile phone as an example, it will be understood that electronics fills
The concrete form for putting 100 can be other, and this is not restricted.
Fig. 2 and Fig. 3 are referred to, output module 10 is single package body structure, and output module 10 includes encapsulating housing 11, structure
Light projector 12 and close to infrared lamp 13.
Encapsulating housing 11 is for encapsulating structure light projector 12 simultaneously and close to infrared lamp 13, in other words, project structured light
Device 12 and close to infrared lamp 13 simultaneously be encapsulated in encapsulating housing 11.Encapsulating housing 11 includes package substrate 111, package wall
112 and at the top of encapsulation 113.Encapsulating housing 11 can be by electromagnetic interference (Electromagnetic Interference, EMI)
Shielding material is made, and output module 10 is had an impact to avoid extraneous electromagnetic interference.
Package substrate 111 is for bearing structure light projector 12 and close to infrared lamp 13.When manufacture exports module 10, knot
Structure light projector 12 and can be formed on a piece of chip 14 close to infrared lamp 13, then by structured light projector 12, close to infrared
Lamp 13 and chip 14 are set along on package substrate 111, and specifically, chip 14 can be bonded on package substrate 111.Together
When, package substrate 111 can be used for (such as the casing 20 of electronic device 100, main with other parts of electronic device 100
Plate etc.) connection, module 10 will be exported and be fixed in electronic device 100.
Package wall 112 can be set with coil structure light projector 12 and close to infrared lamp 13, and package wall 112 encapsulates certainly
Substrate 111 extends, and package wall 112 can be combined with package substrate 111.It is preferred that package wall 112 is with package substrate 111
It is detachably connected, in order to remove to structured light projector 12 after package wall 112 and overhauled close to infrared lamp 13.Envelope
The making material of dress side wall 112 can be the material of impermeable infrared light, to avoid structured light projector 12 or close to infrared lamp 13
The infrared light sent passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113
It is formed with structure light window 1131 and close to window 1132, structure light window 1131 is corresponding with structured light projector 12, structure light
The structure light (infrared light) that the projector 12 emits is pierced by from structure light window 1131；Close to window 1132 with it is right close to infrared lamp 13
Should, the infrared light emitted close to infrared lamp 13 is pierced by from close to window 1132.Encapsulation top 113 can be with one with package wall 112
Body shapes to obtain, can also split shape to obtain.In one example, structure light window 1131 and close to window 1132 be logical
Hole, the making material at encapsulation top 113 is the material of impermeable infrared light.In another example, encapsulation top 113 is by impermeable infrared
The material co-manufactured of the material of light and saturating infrared light forms, specifically, structure light window 1131 and close to window 1132 by saturating
The material of infrared light is made, remaining position is made of the material of impermeable infrared light, further, structure light window 1131 and close
Window 1132 could be formed with lens arrangement, be sent out with the infrared light for improving from structure light window 1131 and being projected close to window 1132
Firing angle degree, such as structure light window 1131 are formed with concavees lens structure so that through structure light window 1131 divergence of beam to
Outer injection；Convex lens structures are formed with close to window 1132, so as to gather outside injection through the light close to window 1132.
Structured light projector 12 further reduces structure light and throws with that can be formed on a piece of chip 14 close to infrared lamp 13
Emitter 12 and the volume close to infrared lamp 13 after integrated, and preparation process is simpler.Structured light projector 12 can outside emitter junction
Structure light, structure light can form infrared laser speckle pattern, project structured light to target object surface, by infrared pick-up first 62
Acquisition (as shown in Figure 1) is by the modulated structured light patterns of target object, by analyzing the structured light patterns modulated
Calculate the depth image (at this point, structured light projector 12 is used for three-dimensional imaging) for obtaining target object.In embodiments of the present invention,
Structured light projector 12 includes projector light source 121, mirror holder 122, projector lens 123 and diffraction optical element
(diffractive optical elements,DOE)124.The light beam that projector light source 121 is sent is through projector lens 123
It is expanded by diffraction optical element 124 after collimation or convergence and is outwards emitted with certain beam pattern.Specifically, projector light source
121 can be formed on chip 14, and projector lens 123 and diffraction optical element 124 can be fixed on mirror holder 122, such as
It is fixed on by way of gluing on mirror holder 122.Infrared light can be emitted close to infrared lamp 13, infrared light is passed through close to window 1132
And body surface is reached, the proximity sensor 51 of electronic device 100 is (as shown in Figure 7) to receive the infrared light that is reflected by the object to examine
Object is surveyed to the distance (at this point, being used for infrared distance measurement close to infrared lamp 13) of electronic device 100.
Structured light projector 12 can emit infrared light with different power from close to infrared lamp 13 outside encapsulating housing 11
Line, specifically, with that can emit infrared light simultaneously close to infrared lamp 13, output module 10 is used for structured light projector 12 simultaneously
Three-dimensional imaging and infrared distance measurement；Can also structured light projector 12 emit light and do not emit light close to infrared lamp 13, export
Module 10 is only used for three-dimensional imaging；Can also structured light projector 12 do not emit light and emit light close to infrared lamp 13, it is defeated
Go out module 10 and be only used for infrared distance measurement.Incorporated by reference to Fig. 4, in embodiments of the present invention, export and be formed with grounding pin on module 10
15th, structure light pin 16 and close to lamp pin 17.It grounding pin 15, structure light pin 16 and can be formed in close to lamp pin 17
On package substrate 111, (that is, grounding pin 15 and structure light pin 16 when grounding pin 15 and structure light pin 16 are enabled
When accessing circuit turn-on), structured light projector 12 emits infrared light；When grounding pin 15 and when being enabled close to lamp pin 17
(that is, grounding pin 15 and close to lamp pin 17 access circuit turn-on when), close to infrared lamp 13 emit infrared light；Work as grounding lead
Foot 15, structure light pin 16 and while being enabled close to lamp pin 17, (that is, grounding pin 15, structure light pin 16 and draw close to lamp
When foot 17 accesses circuit turn-on), structured light projector 12 emits infrared light, and emits infrared light close to infrared lamp 13.
It please refers to Fig.1 and Fig. 5, casing 20 can be as the installation carrier of output module 10, in other words, output module 10 can
To be arranged in casing 20.Casing 20 includes top 21 and bottom 22, in the state of user's normal use electronic device 100,
Top 21 is located at the top of bottom 22, as shown in Figure 1, output module 10 is arranged between top 21 and bottom 22.Incorporated by reference to figure
6, casing 20 offers mounting groove 25, and mounting groove 25 is opened between top 21 and bottom 22.Casing 20 can be electronic device
100 middle shell or shell.
Referring to Fig. 6, display screen 90 is arranged on casing 20 and closes mounting groove 25 to form the installation space of closing.It is aobvious
Display screen 90 is formed with light transmission entity area 91 and alternatively non-transparent district 94, and light transmission entity area 91 does not include image pixel and by multiple images picture
Element surrounds, and image pixel is distributed in alternatively non-transparent district 94, and in other words, alternatively non-transparent district 94 is the viewing area of display screen 90, non-transparent
Area 94 is used to implement the display function of display screen 90.The material in light transmission entity area 91 includes but not limited to glass.Electronic device 100
Outer light may pass through light transmission entity area 91 and enter electronic device 100, without destroying the integrality of display screen 90.Display screen 90
Including can show picture front 92 and with the positive 92 opposite back sides 93.Specifically, when display screen 90 shines and shows picture
During face, the light that display screen 90 is sent projects display screen 90 from front 92；When display screen 90 is installed on casing 20, mounting groove
25 are located at the opposite both sides (that is, the back side 93 is located between front 92 and mounting groove 25) at the back side 93 with front 92.Of the invention real
It applies in example, output module 10 can be arranged between display screen pane edge and top 21, due to the output of embodiment of the present invention
Module 10 can occupy smaller volume, therefore, for setting the volume of display screen 90 that can correspond to increase in casing 20, with
Improve the screen accounting of electronic device 100.In other embodiments, display screen 90 can be that screen opens up jagged, display comprehensively
Screen 90 surrounds output module 10, and exports module 10 and expose from the notch of display screen 90.In some embodiments, light transmission is real
94 uniform thickness of alternatively non-transparent district of body area 91 and surrounding and continuous.
It please refers to Fig.1 and Fig. 5, casing 20 is further opened with casing close to through hole 23 and casing structure light through hole 24.Export mould
It is corresponding close to through hole 23 with casing close to infrared lamp 13 when group 10 is arranged in casing 20, structured light projector 12 and casing knot
Structure light through hole 24 corresponds to.Wherein close to infrared lamp 13 and casing close to through hole 23 it is corresponding refer to the light sent close to infrared lamp 13 can
It is passed through from casing close to through hole 23, can close to 23 face of through hole or be connect with casing close to infrared lamp 13 specifically
The light that near-infrared lamp 13 emits passes through casing close to through hole 23 after light-guide device acts on.Structured light projector 12 and casing knot
Structure light through hole 24 corresponds to similarly, and therefore not to repeat here.In the embodiment as shown in fig.5, casing is close to through hole 23 and casing knot
Structure light through hole 24 can be apart from one another by certainly, in other embodiments, casing is close to through hole 23 and casing structure light through hole
24 can also interconnect.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set
It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated
Go out after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 5
In, cover board 30 covers casing structure light through hole 24 and casing close to through hole 23, coated with infrared on the inner surface 32 of cover board 30
Ink 40 is crossed, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and to visible ray
There is higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device
By the infrared region covered through ink 40 on 100.Specifically, it is infrared to be covered on inner surface 32 not with showing through ink 40
90 corresponding region of display screen.
It is infrared to block casing close at least one in through hole 23 and casing structure light through hole 24 through ink 40,
That is, it is infrared to cover casing simultaneously close to through hole 23 and casing structure light through hole 24 (as shown in Figure 5), user through ink 40
It is difficult to close to through hole 23 and casing structure light through hole 24 see by casing the internal structure of electronic device 100, electronic device 100
Shape it is more beautiful；It is infrared to cover casing close to through hole 23 through ink 40, and casing structure light through hole 24 is not covered；
Or the infrared ink 40 that penetrates can also cover casing structure light through hole 24, and casing is not covered close to through hole 23.
Referring to Fig. 6, optical flame detector 52 is single package body structure.Optical flame detector 52 is mounted in mounting groove 25 and positioned at display screen
One side where 90 back side 93, in other words, optical flame detector 52 is located at the lower section of display screen 90.Optical flame detector 52 and light transmission entity area 91
Corresponding, specifically, the visible ray outside electronic device 100 can pass through light transmission entity area 91 and be transferred on optical flame detector 52.Light sensation
Device 52 receives the visible ray in ambient light, and detects the intensity of visible ray, using the display brightness as control display screen 90 according to
According to.In present embodiment, optical flame detector 52 is first mounted in mounting groove 25 and display screen 90 is installed on casing 20 again, optical flame detector 52
It can contact or be arranged at intervals with display screen 90.In other embodiments, optical flame detector 52 can be first mounted on display screen 90 simultaneously
Make optical flame detector 52 corresponding with light transmission entity area 91, be then again installed to display screen 90 and optical flame detector 52 on casing 20 simultaneously.
Fig. 3 and Fig. 7 are referred to, proximity sensor 51 is single package body structure.It is sent out close to infrared lamp 13 infrared
Light after being reflected by external object, is received by proximity sensor 51, and proximity sensor 51 is according to the infrared light reflected received
Judge the distance between external object and electronic device 100.
It please refers to Fig.1 and Fig. 7, imaging modules 60 can be visible image capturing first 61 and one in infrared pick-up first 62
Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, and image passes
Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it
Between.In the embodiment as shown in figure 7, proximity sensor 51 is arranged on mounting surface 631, and specifically, proximity sensor 51 exists
Plane orthographic projection where mounting surface 631 is at least partly dropped on mounting surface 631, in this way, proximity sensor 51 and imaging mould
Group 60 sets compacter, and the horizontal space that the two occupies jointly is smaller.
Referring to Fig. 1, receiver 70 is for sending out acoustic signals when being encouraged be subject to power supply, user can by by
Words device 70 is conversed.Infrared light compensating lamp 80 is for outwards emitting infrared light, after infrared light is reflected by external object surface, electronics
The infrared pick-up of device 100 first 62 receives the infrared light that is reflected by the object to obtain the image information of object.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, defeated
Go out that module 10, visible image capturing are first 61, infrared pick-up is first 62, the center of receiver 70 and infrared light compensating lamp 80 is located at same line
Duan Shang.Specifically, output module 10, infrared light compensating lamp 80, receiver 70, infrared light are followed successively by from one end of line segment to the other end
Camera 62, visible image capturing first 61 (as shown in Figure 8)；Or be followed successively by from one end of line segment to the other end output module 10,
Visible image capturing is first 61, receiver 70, infrared pick-up are first 62, infrared light compensating lamp 80 (as shown in Figure 1)；Or one from line segment
The other end is held to be followed successively by, and infrared pick-up first 62, infrared light compensating lamp 80, receiver 70, visible image capturing be first 61, output module
10；Or be followed successively by from one end of line segment to the other end infrared pick-up is first 62, visible image capturing is first 61, receiver 70, output
Module 10, infrared light compensating lamp 80.Certainly, it is first 61, infrared that module 10, infrared pick-up head, receiver 70, visible image capturing are exported
The arrangement mode of light compensating lamp 80 is not limited to above-mentioned citing, can also there is other, such as the center of each electronic component is arranged in
Arc-shaped, center arranges the shapes such as rectangular.
Further, incorporated by reference to Fig. 7, proximity sensor 51 can be arranged on the mounting surface 631 of infrared pick-up first 62,
It can also be arranged on the mounting surface 631 of visible image capturing first 61, certainly, proximity sensor 51 can not also be arranged on mounting surface
On 631, proximity sensor 51 can be disposed adjacent with output module 10, to readily receive by emitting close to infrared lamp 13, and
The infrared light being reflected back by external object；Proximity sensor 51 can also be disposed adjacent with receiver 70, when user receives calls
When, proximity sensor 51 is readily detected the ear of user close to receiver 70.
To sum up, in the electronic device 100 of embodiment of the present invention, output module 10 by structured light projector 12 with close to red
Outer lamp 13 is integrated into a single package body structure, has gathered transmitting infrared light with the function of infrared distance measurement and three-dimensional imaging, therefore,
It is higher to export the integrated level of module 10, small volume, output module 10 has saved the function of realizing three-dimensional imaging and infrared distance measurement
Space.Further, since structured light projector 12 and be carried on close to infrared lamp 13 on same package substrate 111, compared to
The structured light projector 12 of traditional handicraft needs to be respectively adopted different wafers manufacture recombinants to PCB substrate from close to infrared lamp 13
Upper encapsulation, improves packaging efficiency.Meanwhile optical flame detector 52 is arranged on the one side where the back side 93 of display screen 90, so as to light sensation
Device 52 will not occupy the space between 20 edge of display screen pane edge and casing, between 20 edge of display screen pane edge and casing
Gap be can be made smaller, and in other words, the display area of display screen 90 can increase, and be accounted for the screen for improving electronic device 100
Than.
Referring to Fig. 3, in some embodiments, output module 10 is further included close to lamp lens 19.Close to lamp lens 19
It is arranged in encapsulating housing 11 and corresponding with close to infrared lamp 13.Close to the infrared light that infrared lamp 13 emits close to lamp lens 19
Under the action of converge to close in window 1132 and project, reduce other regions for being transmitted to package wall 112 and encapsulation top 113
Light quantity.
Referring to Fig. 3, in some embodiments, output module 10 further includes metal shutter 18, metal shutter 18
In encapsulating housing 11, and metal shutter 18 is located at structured light projector 12 and close between infrared lamp 13.Metal blocks
Plate 18 is located at structured light projector 12 and close between infrared lamp 13, and metal shutter 18 on the one hand can be with shielding construction light projection
Device 12 with close to the mutual electromagnetic interference of infrared lamp 13, structured light projector 12 and the luminous intensity close to infrared lamp 13 and
Sequential will not interact, and another aspect metal shutter 18 can be used for 12 place cavity of isolation structures light projector with approaching
Cavity where infrared lamp 13, light will not enter another cavity from a cavity.
Referring to Fig. 9, in some embodiments, output module 10 further includes optics sealing cover 1a.Optics sealing cover 1a is by saturating
Luminescent material is made, and optics sealing cover 1a is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1a, which is wrapped, to be connect
Near-infrared lamp 13.Specifically, optics sealing cover 1a can be formed by encapsulating injection molding and forming technology, and optics sealing cover 1a may be employed
Bright thermosetting epoxy resin is made, and to be not easy to soften in use, optics sealing cover 1a can fix the position close to infrared lamp 13
It puts, and to be not easy to rock in encapsulating housing 11 close to infrared lamp 13.
It please refers to Fig.1 and Fig. 6, in some embodiments, light transmission entity area 91 includes image pixel, electronic device 100
Processor 96 is further included, the reception of optical flame detector 52 incides into the light on optical flame detector 52 to export including outside electronic device 100
The initial beam intensity of environmental light intensity information.Processor 96 is only included with obtaining outside electronic device 100 for handling initial beam intensity
The target light intensity of environmental light intensity information.
Specifically, light transmission entity area 91 includes image pixel, and light transmission entity area 91 can be used for showing image information, meanwhile,
Ambient light can be from light transmission entity area 91 across and into electronic device 100.In some embodiments, light transmission entity area 91
Light transmittance can be more than or equal to 50%.It is appreciated that the light incided on optical flame detector 52 had both included through light transmission entity area 91
Ambient light part, and include the image pixel in light transmission entity area 91 in display content to the inside of electronic device 100
The part of the display light of transmitting.Processor 96 can determine that optical flame detector 52 receives according to the content that light transmission entity area 91 is shown
The display light that emits to optical flame detector 52 of light transmission entity area 91, so as to which processor 96 can be according to initial beam intensity and optical flame detector
52 receive the target light that the light intensity that display light generates determines to only include the environmental light intensity information outside electronic device 100 jointly
By force.The electronic device 100 of present embodiment can obtain the environmental light intensity information outside electronic device 100, to be shown as control
The foundation of the display brightness of display screen 90.
Referring to Fig. 1, in some embodiments, initial beam intensity includes environmental light intensity information and display screen 90 shows image
When the display intensity signal that receives of optical flame detector 52, processor 96 for obtaining optical flame detector 52 when display screen 90 shows image in real time
The display intensity signal received, and removal shows intensity signal to obtain target light intensity when handling initial beam intensity.
Referring to Fig. 10, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Cover board sound outlet hole 35 is offered, receiver 70 is corresponding with the position of cover board sound outlet hole 35 and casing sound outlet hole.Export module 10, red
The center of outer light video camera head 62, visible image capturing first 61 and infrared light compensating lamp 80 is located on same line segment, and receiver 70 is located at should
Between line segment and the top 21 of casing 20.
The center of receiver 70 is not located on the line segment, and it is (output module 10, red to have saved each electronic component on cover board 30
Outer light video camera head 62, visible image capturing are first 61, infrared light compensating lamp 80 etc.) horizontal space that occupies.In implementation as shown in Figure 10
In example, cover board sound outlet hole 35 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
1 is please referred to Fig.1, covering plate structure light through hole 34, cover board can also be offered in some embodiments, on cover board 30
Structure light through hole 34 is corresponding with casing structure light through hole 24, and the infrared light that structured light projector 12 emits leads to through casing structure light
Electronic device 100 can be pierced by behind hole 24 from covering plate structure light through hole 34.It is at this point, right close to through hole 23 with casing on cover board 30
The position answered can set infrared transmission ink 40, and user is difficult to close to through hole 23 see in electronic device 100 by casing
Portion close to infrared lamp 13, the shape of electronic device 100 is more beautiful.
2 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to through hole 33, cover board approaches
Through hole 33 is corresponding close to through hole 23 with casing, can be from close to after through hole 23 through casing close to the infrared light that infrared lamp 13 emits
Cover board is pierced by electronic device 100 close in through hole 33.It at this point, can be with 24 corresponding position of casing structure light through hole on cover board 30
Infrared transmission ink 40 is set, and user is difficult to see by casing structure light through hole 24 structure light of the inside of electronic device 100
The projector 12, the shape of electronic device 100 are more beautiful.
3 are please referred to Fig.1, in some embodiments, proximity sensor 51 can be arranged on package substrate 111.Specifically
Ground, the part of package substrate 111 for bearing structure light projector 12 and close to infrared lamp 13, in other words with package wall
112 spaces surrounded correspond to；Another part of package substrate 111 is protruding, and proximity sensor 51 can be fixed on encapsulation base
On plate 111 and outside encapsulating housing 11.On package substrate 111 can laying-out, circuit can be 12 He of structured light projector
Control and driver circuit close to infrared lamp 13, in one example, circuit are the form of FPC, and FPC can be passed with close simultaneously
Sensor 51 connects, control and drive signal for simultaneous transmission proximity sensor 51.
4 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on
On substrate 66, proximity sensor 51 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, the one of substrate 66
Part is located in microscope base 63, and another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and for carrying image biography
Sensor 65, the other end can be connected with the mainboard of electronic device 100.When proximity sensor 51 is arranged on substrate 66, close to biography
Sensor 51 is arranged on outside microscope base 63, and proximity sensor 51 can also be connected with FPC.
Imaging modules 60 can be visible image capturing first 61 and one or two in infrared pick-up first 62.Specifically,
Proximity sensor 51 can be fixed on the substrate 66 of visible image capturing first 61；Proximity sensor 51 can be fixed on infrared light and take the photograph
On the substrate 66 of picture first 62.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the one side opposite with proximity sensor 51, to increase
Add the integral strength of substrate 66 so that FPC is not susceptible to around folding, while when proximity sensor 51 is arranged on substrate 66 is not easy to send out
Life is rocked.In one example, proximity sensor 51 may be also secured on the lateral wall of microscope base 63, such as pass through cohesive side
Formula is fixed on the lateral wall of microscope base 63.
5 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67
Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- 672 and the 3rd sub- top surface 673 of top surface, the second son top
672 and first sub- top surface 671 of face tilts connection and forms notch 675, the 3rd sub- top surface 673 and second with the first sub- top surface 671
Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- 671 and the 3rd sub- top surface 673 of top surface to connect first
Sub- 671 and the 3rd sub- top surface 673 of top surface.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight
Angle, the angle between the second sub- 672 and the 3rd sub- top surface 673 of top surface can be obtuse angle or right angle.Notch 675 is opened in camera shell
On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.3rd sub- top surface 673 offers out
Light through hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through hole 674.Imaging sensor 65 is housed in
In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through hole 674 and camera lens mould
Group 68 is simultaneously transferred on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Proximity sensor 51 is set
At the first sub- top surface 671.In present embodiment, imaging modules 60 can be visible image capturing first 61.In other embodiment
In, imaging modules 60 can be infrared pick-up first 62.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 51 is arranged on the first son and is pushed up
On face 671, proximity sensor 51 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, section
Installation space about in electronic device 100.
Please continue to refer to Figure 15, in some embodiments, the proximity sensor 51 of the above embodiment is arranged on first
On sub- top surface 671 and positioned at the outside of camera case 67, specifically, entire proximity sensor 51 is along perpendicular to the first sub- top surface
671 projection can be located in the first sub- top surface 671 (as shown in figure 15)；Alternatively, part proximity sensor 51 along perpendicular to
The projection of first sub- top surface 671 is located in the first sub- top surface 671.It is located at that is, proximity sensor 51 is at least part of
The surface of first sub- top surface 671, in this way, proximity sensor 51 sets compacter with imaging modules 60, the two occupies jointly
Horizontal space it is smaller, further save the installation space in electronic device 100.
6 are please referred to Fig.1, the first sub- top surface 671 of the above embodiment offers loophole 676, proximity sensor 51
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and transfer
Onto proximity sensor 51.The proximity sensor 51 of present embodiment is arranged in camera case 67, make proximity sensor 51 with
The structure of camera case 67 is more stablized and convenient for proximity sensor 51 and imaging modules 60 is installed on casing 20.
7 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, proximity sensor 51 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image
Sensor 65 is arranged on substrate 66, and proximity sensor 51 may be also secured on substrate 66 and be housed in camera case 67.
Specifically, FPC is provided on substrate 66, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, another
End can be connected with the mainboard of electronic device 100.In other embodiments, proximity sensor 51 can also be connected with FPC.
The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and camera case 67
Structure more stablize and convenient for proximity sensor 51 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60
Substrate 66 is set and proximity sensor 51 is arranged on substrate 66, proximity sensor 51 is enable to be firmly mounted to camera shell
In body 67.
8 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds
Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677
678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread
Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with
With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677
Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle.
Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two
A light extraction through hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through holes 674
Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions
Through hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68,
Light outside electronic device 100 can pass through light extraction through hole 674 and camera lens module 68 and be transferred on imaging sensor 65.This reality
It applies in mode, imaging modules 60 can be visible image capturing first 61, and two camera lens modules 68 are visible image capturing first 61 at this time
Corresponding camera lens module.Proximity sensor 51 is arranged on the second tread 678 and outside camera case 67.In other embodiment party
In formula, imaging modules 60 can be infrared pick-up first 62, and two camera lens modules 68 are that infrared pick-up first 62 corresponds at this time
Camera lens module.In yet another embodiment, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, at this time
Wherein camera lens module 68 is first 62 corresponding camera lens module of infrared pick-up, another camera lens module 68 is visible image capturing first 61
Corresponding camera lens module.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 51 is arranged on the second tread
On 678, proximity sensor 51 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves
Installation space in electronic device 100.
9 are please referred to Fig.1, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670
On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread
The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through holes 674 are opened in the first son respectively
On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675
Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face
679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678,
Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second
Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first
The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment
In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second
Angle be right angle.Compared with the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in
The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating proximity sensor 51 is arranged on the second tread
On 678.
8 and Figure 19 is please referred to Fig.1, in some embodiments, the proximity sensor 51 of the above embodiment is arranged on
On two treads 678 and positioned at the outside of camera case 67.Specifically, when notch 675 is opened in the marginal position of top surface 670,
Entire proximity sensor 51 can be located in the second tread 678 (as shown in figure 18) along perpendicular to the projection of the second tread 678；
Alternatively, part proximity sensor 51 is located at along the projection perpendicular to the second tread 678 in the second tread 678.It is that is, close
At least part of surface for being located at the second tread 678 of sensor 51.When notch 675 is opened in the centre position of top surface 670
When upper, entire proximity sensor 51 can be located at (such as Figure 19 in the second tread 678 along perpendicular to the projection of the second tread 678
It is shown).In this way, proximity sensor 51 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, into
One step has saved the installation space in electronic device 100.
Figure 20 is referred to, the second tread 678 of the above embodiment offers loophole 676, and proximity sensor 51 is located at
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be transferred to
On proximity sensor 51.The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and phase
The structure of casing body 67 is more stablized and convenient for proximity sensor 51 and imaging modules 60 is installed on casing 20.
Figure 21 is referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676,
Proximity sensor 51 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image sensing
Device 65 is arranged on substrate 66, and proximity sensor 51 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connected with the mainboard with electronic device 100.In other embodiments, proximity sensor 51 can also be connected with FPC.
The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and camera case 67
Structure more stablize and convenient for proximity sensor 51 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60
Substrate 66 is set and proximity sensor 51 is arranged on substrate 66, proximity sensor 51 is enable to be firmly mounted to camera shell
In body 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (10)
1. a kind of electronic device, which is characterized in that including：
Casing；
Module is exported, on the housing, the output module includes encapsulating housing, project structured light for the output module installation
Device and close to infrared lamp, the encapsulating housing includes package substrate, and the structured light projector is encapsulated with described close to infrared lamp
In the encapsulating housing and carry on the package substrate, the structured light projector with it is described can be with close to infrared lamp
Different power emits infrared light outside the encapsulating housing；
Display screen, the display screen are set on the housing, and the display screen is formed with light transmission entity area and including that can show
Show the front of picture and the back side opposite with the front；
Optical flame detector, the optical flame detector are arranged on the one side where the back side of the display screen, the optical flame detector with it is described
Light entity area corresponds to, and the optical flame detector incides into the light on the optical flame detector for reception and exports the target light of the light
By force；With
The proximity sensor on the package substrate and being located at outside the encapsulating housing is set.
2. electronic device according to claim 1, which is characterized in that the output module further includes chip, the structure
Light projector is formed in close to infrared lamp on a piece of chip with described.
3. electronic device according to claim 2, which is characterized in that the encapsulating housing further includes package wall and encapsulation
Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute
It states encapsulation top and is formed with structure light window and close to window, the structure light window is corresponding with the structured light projector, institute
State close to window with it is described corresponding close to infrared lamp.
4. electronic device according to claim 2, which is characterized in that the output module is further included close to lamp lens, institute
State be arranged on close to lamp lens in the encapsulating housing and with it is described corresponding close to infrared lamp.
5. electronic device according to claim 2, which is characterized in that the output module further includes metal shutter, institute
Metal shutter is stated to be located in the encapsulating housing and positioned at the structured light projector and described close between infrared lamp.
6. according to the electronic device described in claim 1-5 any one, which is characterized in that be formed with and connect on the output module
Ground pin, structure light pin and close to lamp pin, the grounding pin and the structure light pin be enabled when, the structure light
The projector emits infrared light；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared lamp emit it is red
UV light.
7. electronic device according to claim 1, which is characterized in that the electronic device further includes the cover board of light transmission, institute
It states casing and offers casing close to through hole and casing structure light through hole, it is described close to infrared lamp and the casing close to through hole pair
Should, the structured light projector is corresponding with the casing structure light through hole, and the cover board is set on the housing.
8. electronic device according to claim 7, which is characterized in that the cover board is formed with the surface that the casing is combined
Have and only transmit the infrared through ink of infrared light, the infrared ink that penetrates blocks the casing close to through hole and the casing knot
It is at least one in structure light through hole.
9. electronic device according to claim 1, which is characterized in that the light transmission entity area includes image pixel, described
Electronic device further includes processor, and the optical flame detector receives the light to export the ambient light for including the external electronic device
The initial beam intensity of strong information；The processor only includes the external electronic device for handling the initial beam intensity to obtain
The target light intensity of the environmental light intensity information.
10. electronic device according to claim 9, which is characterized in that the initial beam intensity is believed including the environmental light intensity
Breath and the display screen show display intensity signal during image, and the processor is used to obtain the display screen display figure in real time
As when display intensity signal, and remove when handling the initial beam intensity display intensity signal to obtain the target light
By force.
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| CN108828702A (en) * | 2018-06-06 | 2018-11-16 | Oppo广东移动通信有限公司 | Diffraction optical element, photoelectricity mould group, in-out box and electronic equipment |
| CN110798548A (en) * | 2018-08-01 | 2020-02-14 | Oppo广东移动通信有限公司 | Electronic device |
| CN111337995A (en) * | 2018-12-18 | 2020-06-26 | 夏普株式会社 | Optical proximity sensor and portable terminal device |
| CN111405146A (en) * | 2019-01-02 | 2020-07-10 | 北京图森智途科技有限公司 | Method for manufacturing camera housing, multi-view camera, imaging apparatus, and vehicle |
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| CN111405146A (en) * | 2019-01-02 | 2020-07-10 | 北京图森智途科技有限公司 | Method for manufacturing camera housing, multi-view camera, imaging apparatus, and vehicle |
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| CN108124032B (en) | 2020-08-07 |
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