CN108173990A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN108173990A CN108173990A CN201711437245.0A CN201711437245A CN108173990A CN 108173990 A CN108173990 A CN 108173990A CN 201711437245 A CN201711437245 A CN 201711437245A CN 108173990 A CN108173990 A CN 108173990A
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- China
- Prior art keywords
- light
- close
- infrared
- lamp
- casing
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
Electronic device includes casing, installation input and output module on the housing, the display screen and optical flame detector that are arranged on casing.Input and output module includes encapsulating housing, infrared light compensating lamp, close to infrared lamp and proximity sensor, encapsulating housing includes package substrate, infrared light compensating lamp is encapsulated in encapsulating housing close to infrared lamp and proximity sensor and is carried on package substrate, infrared light compensating lamp can emit infrared light with different power from close to infrared lamp outside encapsulating housing, and proximity sensor is for receiving the infrared light being reflected by the object to detect the distance of object.Display screen is formed with light transmission entity area and including the front that can show picture and the back side opposite with front.Optical flame detector is arranged on the side where the back side of display screen and corresponding with light transmission entity area, and optical flame detector is for receiving the target light intensity of the light being incident on optical flame detector and output light.Optical flame detector is arranged on the side where the back side of display screen, so as to increase the display area of display screen.
Description
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of function element set
It is more and more, in order to realize the functions such as the facial 3D feature recognitions of distance detection, environment light detection and user, need to set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be occupied.
Invention content
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Input and output module, on the housing, the input and output module includes envelope for the input and output module installation
Fill housing, infrared light compensating lamp, close to infrared lamp and proximity sensor, the encapsulating housing includes package substrate, the infrared benefit
Light lamp described be encapsulated in the encapsulating housing close to infrared lamp and the proximity sensor and be carried on the package substrate
On, the infrared light compensating lamp can emit infrared light with different power close to infrared lamp from described outside the encapsulating housing
Line, the proximity sensor is for receiving the infrared light that is reflected by the object to detect the distance of object；
Display screen, on the housing, the display screen is formed with light transmission entity area and including energy for the display screen setting
Enough show the front of picture and the back side opposite with the front；And
Optical flame detector, the optical flame detector are arranged on the side where the back side of the display screen, the optical flame detector and institute
Light transmission entity area correspondence is stated, the optical flame detector is used to receive the light being incident on the optical flame detector and the mesh for exporting the light
Mark light intensity.
In some embodiments, the input and output module further includes chip, the infrared light compensating lamp, described close to red
Outer lamp and the proximity sensor are both formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected at the top of the encapsulation between the package substrate, and light filling is formed at the top of the encapsulation
Window, close to luminescence window and close to receive light window, the light filling window is correspondings with the infrared light compensating lamp, it is described approach shine
Window is described corresponding with the proximity sensor close to light window is received with described corresponding close to infrared lamp.
In some embodiments, the input and output module further includes light-supplementing lamp lens, the light-supplementing lamp lens setting
It is in the encapsulating housing and corresponding with the infrared light compensating lamp；And/or
The input and output module is further included close to lamp lens, described to be arranged in the encapsulating housing simultaneously close to lamp lens
With it is described corresponding close to infrared lamp；And/or
The input and output module is further included close to sensing lens, described to be arranged on the encapsulating housing close to sensing lens
It is interior and corresponding with the proximity sensor.
In some embodiments, it is saturating to further include the light compensating lamp being arranged in the encapsulating housing for the input and output module
Mirror, close to lamp lens and close to sensing lens, the light-supplementing lamp lens are corresponding with the infrared light compensating lamp, described close to lamp lens
It is described corresponding with the proximity sensor close to sensing lens with described corresponding close to infrared lamp, it is the light-supplementing lamp lens, described
It is located on same transparent base close to lamp lens and the close sensing lens.
In some embodiments, the input and output module further includes multiple metal shutters, and multiple metals hide
Baffle is located in the encapsulating housing and respectively positioned at the infrared light compensating lamp, described close to infrared lamp and the proximity sensor
In it is arbitrary between the two.
In some embodiments, the input and output module further includes the optics sealing cover made of translucent material, described
Optics sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps the infrared benefit
It is light lamp, described close to infrared lamp and the proximity sensor.
In some embodiments, the input and output module further include it is multiple go out light clapboard, it is multiple it is described go out light clapboard
It is respectively formed in the optics sealing cover and is located at the infrared light compensating lamp, is described close in infrared lamp and the proximity sensor
It is arbitrary between the two.
In some embodiments, grounding pin, light compensating lamp pin are formed on the input and output module, drawn close to lamp
Foot and close sensing pin, when the grounding pin and the light compensating lamp pin are enabled, the infrared light compensating lamp transmitting is infrared
Light；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared lamp emit infrared light；The ground connection
Pin and it is described close to sensing pin be enabled when, infrared light that proximity sensor reception is reflected by the object is to detect object
The distance of body.
In some embodiments, the electronic device further includes the cover board of light transmission, and the casing offers casing and approaches
Through-hole, casing light filling through-hole and casing shine close to receipts light through-hole, it is described close to the close luminous through-hole of infrared lamp and the casing
Corresponding, the infrared light compensating lamp is corresponding with the casing light filling through-hole, and the proximity sensor leads to the casing close to light is received
Hole corresponds to, and the cover board setting is on the housing.
In some embodiments, the electronic device further includes the cover board of light transmission, and the casing offers casing and approaches
Through-hole, casing light filling through-hole and casing shine close to receipts light through-hole, it is described close to the close luminous through-hole of infrared lamp and the casing
Corresponding, the infrared light compensating lamp is corresponding with the casing light filling through-hole, and the proximity sensor leads to the casing close to light is received
Hole corresponds to, cover board setting on the housing, the cover board be formed with the surface that the casing is combined only transmit it is infrared
Light it is infrared through ink, it is described it is infrared through ink block the casing close to luminous through-hole, the casing light filling through-hole and
The casing is close to receive at least one of light through-hole.
In some embodiments, the light transmission entity area includes image pixel, and the electronic device further includes processor,
The optical flame detector receives the light to export the initial beam intensity of the environmental light intensity information including the external electronic device；It is described
Processor is used to handle the initial beam intensity to obtain the institute for the environmental light intensity information for only including the external electronic device
State target light intensity.
In some embodiments, the initial beam intensity includes the environmental light intensity information and the display screen shows image
When display intensity signal, the processor is used to obtain the display intensity signal when display screen shows image in real time, and
The display intensity signal is removed when handling the initial beam intensity to obtain the target light intensity.
In some embodiments, the light transmission entity area does not include image pixel and is surrounded by multiple images pixel.
In the electronic device of embodiment of the present invention, input and output module by infrared light compensating lamp, close to infrared lamp with it is close
Sensor integration is a single package body structure, has gathered transmitting and has received infrared light with the function of infrared distance measurement and infrared benefit
The function of light, therefore, the integrated level of input and output module are higher, small volume, and input and output module has saved the infrared benefit of realization
The space of the function of light and infrared distance measurement.In addition, it is carried on due to infrared light compensating lamp, close to infrared lamp and proximity sensor same
On a package substrate, infrared light compensating lamp compared to traditional handicraft is respectively adopted not close to infrared lamp and proximity sensor needs
With being encapsulated in wafer manufacture recombinant to PCB substrate, packaging efficiency is improved.Meanwhile optical flame detector is arranged on the back side of display screen
The side at place so as to which optical flame detector will not occupy the space between display platen edge and shell rim, shows platen edge and housing
Gap between edge be can be made smaller, and in other words, the display area of display screen can increase, to improve electronic device
Shield accounting.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
It obtains significantly and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of certain embodiments of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 3 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 4 is the stereoscopic schematic diagram of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 5 is the partial sectional schematic view along V-V lines of the electronic device of Fig. 1；
Fig. 6 is the schematic cross-section along line VI -- VI of the electronic device of Fig. 1；
Fig. 7 is the arrangement schematic diagram of the electronic component of the electronic device of certain embodiments of the present invention；
Fig. 8 is the schematic cross-section of the input and output module of certain embodiments of the present invention；
Fig. 9 is the structure diagram of the electronic device of certain embodiments of the present invention；With
Figure 10 to Figure 12 is that the electronic device edge of certain embodiments of the present invention is intercepted with V-V lines corresponding position in Fig. 1
Partial sectional schematic view.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the whole element for representing same or similar element or there is same or like function.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature right over second feature or oblique upper or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30, display screen 90 and electronics
Component.Electronic component includes input and output module 10, optical flame detector 50, imaging modules 60, receiver 70 and project structured light
Device 80.Electronic device 100 can be mobile phone, tablet computer, laptop, smartwatch, Intelligent bracelet, automatic teller machine etc., this
Inventive embodiments are illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the concrete form of electronic device 100 can be with
It is other, this is not restricted.
Fig. 2 and Fig. 3 are please referred to, input and output module 10 is single package body structure, including encapsulating housing 11, infrared light compensating lamp
12nd, close to infrared lamp 13 and proximity sensor 1d.
Encapsulating housing 11 for encapsulating infrared light compensating lamp 12 simultaneously, close to infrared lamp 13 and proximity sensor 1d, in other words,
Infrared light compensating lamp 12 is encapsulated in close to infrared lamp 13 and proximity sensor 1d in encapsulating housing 11 simultaneously.Encapsulating housing 11 includes
Package substrate 111, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference
(Electromagnetic Interference, EMI) shielding material is made, to avoid extraneous electromagnetic interference to input and output
Module 10 has an impact.In present embodiment, infrared light compensating lamp 12 is located at close to the center of infrared lamp 13 and proximity sensor 1d
On same line segment, such as：Along one end of line segment to the other end be followed successively by infrared light compensating lamp 12, close to infrared lamp 13 and close to sensing
Device 1d；Alternatively, it is followed successively by along one end of line segment to the other end close to infrared lamp 13, infrared light compensating lamp 12 and proximity sensor 1d；
Alternatively, it is followed successively by along one end of line segment to the other end close to infrared lamp 13, proximity sensor 1d and infrared light compensating lamp 12.At other
In embodiment, infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d the line of centres it is triangular in shape.
Package substrate 111 for carrying infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d.It is inputted in manufacture
When exporting module 10, infrared light compensating lamp 12 can be formed in close to infrared lamp 13 and proximity sensor 1d on a piece of chip 14, then
It is set along on package substrate 111 by infrared light compensating lamp 12, close to infrared lamp 13, proximity sensor 1d and chip 14, specifically
Chip 14 can be bonded on package substrate 111 by ground.Meanwhile package substrate 111 can be used for and electronic device 100
Other parts (such as the casing 20 of electronic device 100, mainboard etc.) connect, and input and output module 10 is fixed on electronics dress
It puts in 100.
Package wall 112 can surround infrared light compensating lamp 12, be set close to infrared lamp 13 and proximity sensor 1d, package-side
Wall 112 extends from package substrate 111, and package wall 112 can be combined with package substrate 111, preferably, package wall 112 and envelope
Substrate 111 is filled to be detachably connected, in order to remove after package wall 112 to infrared light compensating lamp 12, close to 13 and of infrared lamp
Proximity sensor 1d is overhauled.The making material of package wall 112 can be the material of impermeable infrared light, to avoid infrared benefit
Light lamp 12 or the infrared light sent out close to infrared lamp 13 pass through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connect with package wall 112.Encapsulation top 113
It is formed with light filling window 1131, close to luminescence window 1132 and close to receiving light window 1133, light filling window 1131 and infrared light filling
Lamp 12 corresponds to, and the infrared light that infrared light compensating lamp 12 emits is pierced by from light filling window 1131；Close to luminescence window 1132 with close to red
Outer lamp 13 corresponds to, and the infrared light emitted close to infrared lamp 13 is pierced by from close to luminescence window 1132；Close to receive light window 1133 with
Proximity sensor 1d is corresponded to, and the infrared light being reflected by the object can pass through close to receipts light window 1133 and be incident on proximity sensor
On 1d.Encapsulation top 113 integrally formed can be obtained with package wall 112, can also split shape to obtain.In an example
In, light filling window 1131, close to luminescence window 1132 and close to receive light window 1133 be through-hole, encapsulation top 113 making
Material is impermeable infrared light and the material of visible ray.In another example, encapsulation top 113 by impermeable infrared light material, thoroughly
Infrared light and the material co-manufactured being opaque to visible light but form, specifically, light filling window 1131, close to 1132 and of luminescence window
It is made close to light window 1133 is received of the material of saturating infrared light, remaining position is by impermeable infrared light and the material system being opaque to visible light but
Into.Further, light filling window 1131 and lens arrangement is could be formed with close to luminescence window 1132, to improve from light filling window
1131 and close to the infrared light emission angle that luminescence window 1132 projects, such as light filling window 1131 is formed with concavees lens structure,
So that the divergence of beam across light filling window 1131 projects outward；Convex lens structures are formed with close to luminescence window 1132, so that
Gather outside injection across the light close to luminescence window 1132；Lens arrangement can also be formed with close to light window 1133 is received,
There are convex lens structures to improve from close to the infrared light emission angle for receiving 1133 incidence of light window, such as close to light window 1133 is received
So that by gathering close to the light for receiving 1133 incidence of light window and projecting on proximity sensor 1d.
Infrared light compensating lamp 12 can be formed in close to infrared lamp 13 and proximity sensor 1d on a piece of chip 14, into one
Step reduces infrared light compensating lamp 12, integrated close to infrared lamp 13 and proximity sensor 1d after volume, and preparation process is simpler.It is red
Outer light compensating lamp 12 can emit infrared light, and infrared light passes through light filling window 1131 to project body surface, electronic device 100 it is red
Outer light video camera head 62 is (as shown in Figure 1) to receive the infrared light that is reflected by the object to obtain the image information of object (at this point, infrared benefit
Light lamp 12 is used for infrared light filling).Infrared light can be emitted close to infrared lamp 13, infrared light is passed through close to luminescence window 1132 and reached
Body surface, proximity sensor 1d are received by the infrared light being reflected by the object close to 1133 incidence of receipts light window, to judge object
Body is to the distance (at this point, close to infrared lamp 13 be used for infrared distance measurement) of electronic device 100.Optical flame detector 50 receive ambient light in can
See light, and detect the intensity (as shown in Figure 1) of visible ray.
Infrared light compensating lamp 12 can emit infrared light with different power from close to infrared lamp 13 outside encapsulating housing 11,
Specifically, with that can emit infrared light simultaneously close to infrared lamp 13, input and output module 10 is used for infrared light compensating lamp 12 simultaneously
Infrared light filling and infrared distance measurement；Can also infrared light compensating lamp 12 emit light and do not emit light close to infrared lamp 13, input is defeated
Go out module 10 and be only used for infrared light filling；Can also infrared light compensating lamp 12 do not emit light and close to infrared lamp 13 emit light, it is defeated
Enter to export module 10 and be only used for infrared distance measurement.
Incorporated by reference to Fig. 4, in embodiments of the present invention, grounding pin 15 is formed on input and output module 10, light compensating lamp draws
Foot 16, close to lamp pin 17 and close to sensing pin 1f.Grounding pin 15, light compensating lamp pin 16, close to lamp pin 17 and close
Sensing pin 1f can be formed on package substrate 111, when grounding pin 15 and light compensating lamp pin 16 are enabled (that is, ground connection
When pin 15 and light compensating lamp pin 16 access circuit turn-on), infrared light compensating lamp 12 emits infrared light；When grounding pin 15 and connect
When low beam pin 17 is enabled (that is, grounding pin 15 and close to lamp pin 17 access circuit turn-on when), sent out close to infrared lamp 13
Penetrate infrared light.When grounding pin 15 and close sensing pin 1f are enabled (that is, grounding pin 15 and close sensing pin 1f
When accessing circuit turn-on), the infrared light being reflected by the object that proximity sensor 1d detections are sent out close to infrared lamp 13 is to make
For judgment object to the foundation of the distance of electronic device 100.
It please refers to Fig.1 and Fig. 5, casing 20 can be as the installation carrier of input and output module 10, in other words, input and output
Module 10 can be arranged in casing 20.Casing 20 includes top 21 and bottom 22, in user's normal use electronic device 100
Under state, top 21 is located at the top of bottom 22, as shown in Figure 1.Output module 10 is arranged between top 21 and bottom 22.Machine
Shell 20 offers mounting groove 28, and mounting groove 28 is opened between top 21 and bottom 22.Casing 20 can be electronic device 100
Middle shell or shell.
It please refers to Fig.1 and Fig. 6, display screen 90 is arranged on casing 20 and closes mounting groove 28 to form the installation of closing sky
Between, specifically, display screen 90 is arranged between top 21 and bottom 22.Display screen 90 be formed with light transmission entity area 91 with it is non-transparent
Area 94, light transmission entity area 91 do not include image pixel and are surrounded by multiple images pixel, and image pixel is distributed in alternatively non-transparent district 94
Interior, in other words, alternatively non-transparent district 94 is the viewing area of display screen 90, and alternatively non-transparent district 94 is used to implement the display function of display screen 90.
The material in light transmission entity area 91 includes but not limited to glass.Light outside electronic device 100 may pass through light transmission entity area 91 and enter
Electronic device 100, without destroying the integrality of display screen 90.Display screen 90 include can show picture front 92 and with just
The opposite back side 93 in face 92.Specifically, when display screen 90 shines and when showing picture, the light that display screen 90 is sent out is from front 92
Project display screen 90；When display screen 90 is installed on casing 20, mounting groove 28 is located at the opposite both sides at the back side 93 with front 92
(that is, the back side 93 is located between front 92 and mounting groove 28).In embodiments of the present invention, output module 10 can be arranged on display
Shield between pane edge and top 21, since the input and output module 10 of embodiment of the present invention can occupy smaller volume, because
This, for setting the volume of display screen 90 that can correspond to increase in casing 20, to improve the screen accounting of electronic device 100.
In other embodiment, display screen 90 can be that screen open up jagged comprehensively, and display screen 90 surrounds input and output module 10, and
Input and output module 10 exposes from the notch of display screen 90.In some embodiments, light transmission entity area 91 and surrounding is non-
94 uniform thickness of light area and continuous.
Casing 20 is further opened with casing close to luminous through-hole 23, casing light filling through-hole 24 and the close receipts light through-hole 25 of casing.
It is corresponding with the close luminous through-hole 23 of casing close to infrared lamp 13 when input and output module 10 is arranged in casing 20, infrared light filling
Lamp 12 is corresponding with casing light filling through-hole 24, and proximity sensor 1d is corresponding close to light through-hole 25 is received with casing.Wherein close to infrared lamp
13 light sent out close to infrared lamp 13 that refer to corresponding with the close luminous through-hole 23 of casing can be passed through from casing close to luminous through-hole 23,
Specifically, can approach luminous 23 face of through-hole close to infrared lamp 13 and casing or emit close to infrared lamp 13
Light passes through casing close to luminous through-hole 23 after light-guide device acts on.Infrared light compensating lamp 12 is corresponding with casing light filling through-hole 24 same
Reason, therefore not to repeat here.Proximity sensor 1d and casing close to receive light through-hole 25 it is corresponding refer to the infrared light being reflected by the object can
It passes through and is incident on proximity sensor 1d from casing close to receipts light through-hole 25, can be proximity sensor 1d and machine specifically
Shell passes through casing close to receipts light through-hole 25 and through guide-lighting member close to the light for receiving 25 face of light through-hole or infrared light incidence
It is incident on proximity sensor 1d after part effect.In the embodiment as shown in fig.5, casing is mended close to luminous through-hole 23, casing
Light through-hole 24 and the close light through-hole 25 of receiving of casing can be apart from one another by certainly, in other embodiments, casing is close to shine
Through-hole 23, casing light filling through-hole 24 and casing can also be interconnected close to light through-hole 25 is received.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set
It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated
Enter to export after the light that module 10 is sent out sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In reality as shown in Figure 5
It applies in example, cover board 30 covers casing light filling through-hole 24, casing receives light through-hole 25, cover board 30 close to luminous through-hole 23 and casing are close
Inner surface 32 on be coated with it is infrared penetrate ink 40, it is infrared to have higher transmitance to infrared light through ink 40, such as can
Reach 85% or more, and have higher attenuation rate to visible ray, such as can reach more than 70% so that user is in normal use
In, it is visually difficult to see that on electronic device 100 by the infrared region covered through ink 40.Specifically, it is infrared to penetrate ink 40
Can cover on inner surface 32 not with 90 corresponding region of display screen.
Infrared transmission ink 40 can also block casing and be approached close to luminous through-hole 23, casing light filling through-hole 24 and casing
Receive at least one of light through-hole 25, that is, infrared to cover casing simultaneously close to luminous through-hole 23, casing benefit through ink 40
Light through-hole 24 and casing are difficult to close to light through-hole 25 (as shown in Figure 5), user is received through the close luminous through-hole 23 of casing, casing
Light filling through-hole 24, casing see the internal structure of electronic device 100 close to receipts light through-hole 25, and the shape of electronic device 100 is more beautiful
It sees；It is infrared to cover casing simultaneously close to luminous through-hole 23 and casing light filling through-hole 24 through ink 40, and machine is not covered
Shell is close to receive light through-hole 25；It is infrared to cover casing close to luminous through-hole 23 through ink 40, and casing light filling is not covered
Through-hole 24 and the close receipts light through-hole 25 of casing；It is infrared to cover casing light filling through-hole 24, and do not cover machine through ink 40
Shell receives light through-hole 25 close to luminous through-hole 23 and casing are close；It is close luminous that infrared transmission ink 40 can also cover casing simultaneously
Through-hole 23 and casing do not cover casing light filling through-hole 24 close to receipts light through-hole 25；Or infrared transmission ink 40 can also be same
When cover casing light filling through-hole 24 and casing close to receiving light through-hole 25, and do not cover casing close to luminous through-hole 23；It is or infrared
Through ink 40 casing can also be covered close to receipts light through-hole 25, and it is logical close to shining not cover casing light filling through-hole 24 and casing
Hole 23.
Referring to Fig. 6, optical flame detector 50 is single packaging body.Optical flame detector 50 is mounted in mounting groove 28 and positioned at display screen 90
Side where the back side 93, in other words, optical flame detector 50 is located at the lower section of display screen 90.Optical flame detector 50 and light transmission entity area 91 are right
Should, specifically, the visible ray outside electronic device 100 can pass through light transmission entity area 91 and be transmitted on optical flame detector 50.Optical flame detector
50 receive the visible ray in ambient light, and detect the intensity of visible ray, using the foundation of the display brightness as control display screen 90.
In present embodiment, optical flame detector 50 is first mounted in mounting groove 28 and display screen 90 is installed on casing 20 again, and optical flame detector 50 can
To contact or be arranged at intervals with display screen 90.In other embodiments, optical flame detector 50 can first be mounted on display screen 90 and make
Optical flame detector 50 is corresponding with light transmission entity area 91, is then again installed to display screen 90 and optical flame detector 50 on casing 20 simultaneously.
Referring to Fig. 1, receiver 70 is for sending out acoustic signals when being encouraged by power supply, user can by by
Words device 70 is conversed.Structured light projector 80 is used for outside emitting structural light, on project structured light to testee after it is anti-
It penetrates, the structure light reflected can be received by infrared pick-up head 62, and the processor of electronic device 100 is further analyzed by infrared light
The structure light that camera 62 receives, to obtain the depth information of testee.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, defeated
The center for entering to export module 10, infrared pick-up head 62, visible image capturing head 61, receiver 70 and structured light projector 80 is located at
On same line segment.Specifically, be followed successively by from one end of line segment to the other end input and output module 10, structured light projector 80, by
Device 70, infrared pick-up head 62, visible image capturing head 61 (as shown in Figure 7) are talked about, at this point, visible image capturing head 61 and infrared light are taken the photograph
Double photography/videography heads can be formed as first 62；Or input and output module 10, infrared light are followed successively by from one end of line segment to the other end
Camera 62, receiver 70, visible image capturing head 61, structured light projector 80 (as shown in Figure 1)；Or from one end of line segment to
The other end is followed successively by infrared pick-up head 62, input and output module 10, receiver 70, visible image capturing head 61, project structured light
Device 80；Or infrared pick-up head 62, visible image capturing head 61, receiver 70, defeated is followed successively by from one end of line segment to the other end
Enter to export module 10, structured light projector 80, at this point, visible image capturing head 61 and infrared pick-up head 62 can form double take the photograph
As head.Certainly, input and output module 10, infrared pick-up head 62, receiver 70, visible image capturing head 61, structured light projector
80 arrangement mode is not limited to above-mentioned citing, can also there is other, for example, each electronic component center arrangement it is in the arc-shaped,
Center arranges the shapes such as rectangular.
To sum up, in the electronic device 100 of embodiment of the present invention, input and output module 10 is by infrared light compensating lamp 12, close
Infrared lamp 13 and proximity sensor 1d is integrated into a single package body structure, has gathered transmitting and has received infrared light with infrared distance measurement
Function and infrared light filling function, therefore, the integrated level of input and output module 10 is higher, small volume, input and output module
10 have saved the space of the function of the infrared light filling of realization and infrared distance measurement.In addition, due to infrared light compensating lamp 12, close to infrared lamp 13
It is carried on same package substrate 111 with proximity sensor 1d, infrared light compensating lamp 12 compared to traditional handicraft, close to infrared
Lamp 13 needs to be respectively adopted in different wafer manufacture recombinants to PCB substrate from proximity sensor 1d to be encapsulated, and improves encapsulation effect
Rate.Meanwhile optical flame detector 50 is arranged on the side (in the lower section of display screen 90) where the back side 93 of display screen 90, so as to optical flame detector
50 will not occupy the space between 20 edge of display screen pane edge and casing, between 20 edge of display screen pane edge and casing between
Gap be can be made smaller, and in other words, the display area of display screen 90 can increase, to improve the screen accounting of electronic device 100.
Referring to Fig. 3, in some embodiments, input and output module 10 further includes light-supplementing lamp lens 18, saturating close to lamp
Mirror 19 and close sensing lens 1e.Light-supplementing lamp lens 18 are arranged in encapsulating housing 11 and corresponding with infrared light compensating lamp 12.It is close
Lamp lens 19 are arranged in encapsulating housing 11 and corresponding with close to infrared lamp 13.Encapsulating housing 11 is arranged on close to sensing lens 1e
It is interior and corresponding with proximity sensor 1d.The infrared light that infrared light compensating lamp 12 emits converges to benefit under the action of light-supplementing lamp lens 18
It is projected in light window 1131, reduces the light quantity in other regions for being emitted to package wall 112 and encapsulation top 113.Similarly, it approaches
The infrared light that infrared lamp 13 emits is projected being converged to close under the action of lamp lens 19 close in luminescence window 1132, reduces hair
It is mapped to the light quantity in other regions at package wall 112 and encapsulation top 113.Similarly, the quilt by entering close to receipts light window 1133
When the infrared light of object reflection is incident on close on sensing lens 1e, infrared light is converged to close to sensing close to sensing lens 1e
On device 1d, reduce infrared light and be transferred to proximity sensor 1d with the light quantity of exterior domain.Specifically, light-supplementing lamp lens 18, close to lamp
Lens 19 close to sensing lens 1e with can be located on same transparent base, more specifically, light-supplementing lamp lens 18, saturating close to lamp
Mirror 19 is made with can be integrally formed close to sensing lens 1e with the transparent base.Certainly, input and output module 10 can also
It is provided only with light-supplementing lamp lens 18, close to lamp lens 19 and close to any one in sensing lens 1e or any two, also may be used
To be not provided with light-supplementing lamp lens 18, close to lamp lens 19 and close to sensing lens 1e.
Referring to Fig. 3, in some embodiments, input and output module 10 further includes multiple metal shutter 1a, multiple
Metal shutter 1a is respectively positioned in encapsulating housing 11, and multiple metal shutter 1a are located at infrared light compensating lamp 12, close to red respectively
Outer lamp 13 and proximity sensor 1d are arbitrarily between the two.When infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d
When center is located on same line segment, the quantity of metal shutter 1a is two；If one end of line segment is followed successively by infrared to the other end
Light compensating lamp 12 is located at infrared light compensating lamp 12 with connecing respectively close to infrared lamp 13 and proximity sensor 1d, two metal shutter 1a
Between near-infrared lamp 13 and close between infrared lamp 13 and proximity sensor 1d；It is connect if one end of line segment is followed successively by the other end
Near-infrared lamp 13, infrared light compensating lamp 12 and proximity sensor 1d, two metal shutter 1a respectively be located at infrared light compensating lamp 12 with
Close between infrared lamp 13 and between infrared light compensating lamp 12 and proximity sensor 1d；If one end of line segment is followed successively by the other end
Close to infrared lamp 13, proximity sensor 1d and infrared light compensating lamp 12, two metal shutter 1a are respectively situated proximate to sensor 1d
With close between infrared lamp 13 and between infrared light compensating lamp 12 and proximity sensor 1d.Metal shutter 1a is located at infrared light filling
Lamp 12 and close between infrared lamp 13, metal shutter 1a on the one hand can shield infrared light compensating lamp 12 with close to 13 phase of infrared lamp
Electromagnetic interference between mutually, infrared light compensating lamp 12 will not interact with the luminous intensity close to infrared lamp 13 and sequential, another
Aspect metal shutter 1a can be used for completely cutting off 12 place cavity of infrared light compensating lamp and the cavity close to 13 place of infrared lamp, light
Another cavity will not be entered from a cavity.Metal shutter 1a is between infrared light compensating lamp 12 and proximity sensor 1d
Or it is located adjacent to sensor 1d and close to infrared light compensating lamp 12 between infrared lamp 13, can be avoided and close to infrared lamp 13 initial
The infrared light of transmitting is incident on proximity sensor 1d, moreover it is possible to shield infrared light compensating lamp 12 and proximity sensor 1d is mutual
Electromagnetic interference or shielding close to infrared lamp 13 and electromagnetic interference mutual proximity sensor 1d.
Referring to Fig. 8, in some embodiments, input and output module 10 further includes optics sealing cover 1b.Optics sealing cover 1b
It is made of translucent material, optics sealing cover 1b is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1b is wrapped up
Firmly infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d.Specifically, optics sealing cover 1b can be injection molded as by encapsulating
Type technique is formed, and optics sealing cover 1b may be used transparent thermosetting epoxy resin and be made, to be not easy to soften in use, optics
Sealing cover 1b can fix infrared light compensating lamp 12, close to the relative position between infrared lamp 13 and proximity sensor 1d three, and make
It obtains infrared light compensating lamp 12, be not easy to shake in encapsulating housing 11 close to infrared lamp 13 and proximity sensor 1d.
In addition, referring to Fig. 8, input and output module 10 further includes out multiple light clapboard 1c, it is multiple go out light clapboard 1c formed
In optics sealing cover 1b and it is located at infrared light compensating lamp 12, close between infrared lamp 13 and proximity sensor 1d three.When infrared benefit
Light lamp 12, close to the center of infrared lamp 13 and proximity sensor 1d be located on same line segment when, go out light clapboard 1c quantity be two
It is a；If one end of line segment is followed successively by infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d, two light extractions to the other end
Partition board 1c be located at respectively infrared light compensating lamp 12 and close between infrared lamp 13 and close to infrared lamp 13 and proximity sensor 1d it
Between；If one end of line segment is followed successively by the other end close to infrared lamp 13, infrared light compensating lamp 12 and proximity sensor 1d, two light extractions
Partition board 1c be located at respectively infrared light compensating lamp 12 and close between infrared lamp 13 and infrared light compensating lamp 12 and proximity sensor 1d it
Between；If one end of line segment is followed successively by the other end close to infrared lamp 13, proximity sensor 1d and infrared light compensating lamp 12, two light extractions
Partition board 1c be respectively situated proximate to sensor 1d and close between infrared lamp 13 and infrared light compensating lamp 12 and proximity sensor 1d it
Between.Go out light clapboard 1c and can be used for interval infrared light compensating lamp 12 and close to infrared lamp 13, the light that infrared light compensating lamp 12 is sent out will not
It is pierced by from close to luminescence window 1132, the light sent out close to infrared lamp 13 will not be pierced by from light filling window 1131.Light extraction
Partition board 1c can stop that infrared light compensating lamp 12 and the infrared light close to 13 initial transmissions of infrared lamp are incident on proximity sensor 1d
On, at the same stop from close to receive light window 1133 enter and directive proximity sensor 1d infrared light influence infrared light compensating lamp 12 and
Close to shining for infrared lamp 13.
It please refers to Fig.1 and Fig. 6, in some embodiments, light transmission entity area 91 includes image pixel, electronic device 100
Further include processor 96, optical flame detector 50 receives the light that is incident on optical flame detector 50 to export including outside electronic device 100
The initial beam intensity of environmental light intensity information.Processor 96 is only included with obtaining outside electronic device 100 for handling initial beam intensity
The target light intensity of environmental light intensity information.
Specifically, light transmission entity area 91 includes image pixel, and light transmission entity area 91 can be used for showing image information, meanwhile,
Ambient light can be from light transmission entity area 91 across and into electronic device 100.In some embodiments, light transmission entity area 91
Light transmittance can be more than or equal to 50%.It is appreciated that the light being incident on optical flame detector 50 had both included across light transmission entity area 91
Ambient light part, and include the image pixel in light transmission entity area 91 when showing content to the inside of electronic device 100
The part of the display light of transmitting.Processor 96 can determine that optical flame detector 50 receives according to the content that light transmission entity area 91 is shown
The display light that emits to optical flame detector 50 of light transmission entity area 91, so as to which processor 96 can be according to initial beam intensity and optical flame detector
50 receive the target light that the light intensity that display light generates determines to only include the environmental light intensity information outside electronic device 100 jointly
By force.The electronic device 100 of present embodiment can obtain the environmental light intensity information outside electronic device 100, to be shown as control
The foundation of the display brightness of display screen 90.
It please refers to Fig.1 and Fig. 6, in some embodiments, initial beam intensity includes environmental light intensity information and display screen 90 is aobvious
Diagram as when the display intensity signal that receives of optical flame detector 50, processor 96 shows the image time for obtaining display screen 90 in real time
The display intensity signal that sensor 50 receives, and removal shows intensity signal to obtain target light intensity when handling initial beam intensity.
Referring to Fig. 9, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Cover board sound outlet hole 35 is offered, receiver 70 is corresponding with the position of cover board sound outlet hole 35 and casing sound outlet hole.Input and output module
10th, the center of infrared pick-up head 62, visible image capturing head 61 and structured light projector 80 is located on same line segment, receiver 70
Between the line segment and the top 21 of casing 20.
The center of receiver 70 is not located on the line segment, has saved each electronic component (input and output module on cover board 30
10th, infrared pick-up head 62, visible image capturing head 61, structured light projector 80 etc.) occupy horizontal space.As shown in Figure 9
Embodiment in, cover board sound outlet hole 35 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
Referring again to Figure 10, cover board light filling through-hole 34, cover board can also be offered in some embodiments, on cover board 30
Light filling through-hole 34 is corresponding with casing light filling through-hole 24, and the infrared light that infrared light compensating lamp 12 emits can after passing through casing light filling through-hole 24
To be pierced by electronic device 100 from cover board light filling through-hole 34.At this point, luminous 23 corresponding position of through-hole is approached on cover board 30 with casing
Infrared transmission ink 40 can be set by putting, and user is difficult to close to luminous through-hole 23 see by casing the inside of electronic device 100
Close to infrared lamp 13, the shape of electronic device 100 is more beautiful.
1 is please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to luminous through-hole 33, cover board
Corresponding close to luminous through-hole 23 with casing close to luminous through-hole 33, the infrared light emitted close to infrared lamp 13 passes through casing close to hair
After light through-hole 23 electronic device 100 can be pierced by close in luminous through-hole 33 from cover board.At this point, lead on cover board 30 with casing light filling
24 corresponding position of hole can set infrared transmission ink 40, and user is difficult to see electronic device by casing light filling through-hole 24
The infrared light compensating lamp 12 of 100 inside, the shape of electronic device 100 are more beautiful.
2 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to receipts light through-hole 36, cover board
Corresponding close to receipts light through-hole 25 and proximity sensor 1d with casing close to light through-hole 36 is received, electronic device 100 is outer anti-by object
The infrared light penetrated passes through cover board that can be incident on proximity sensor 1d close to after receiving light through-hole 36 and the close receipts light through-hole 25 of casing
On.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (14)
1. a kind of electronic device, which is characterized in that including：
Casing；
Input and output module, on the housing, the input and output module includes encapsulating shell for the input and output module installation
Body, infrared light compensating lamp, close to infrared lamp and proximity sensor, the encapsulating housing includes package substrate, the infrared light filling
Lamp described be encapsulated in the encapsulating housing close to infrared lamp and the proximity sensor and be carried on the package substrate
On, the infrared light compensating lamp can emit infrared light with different power close to infrared lamp from described outside the encapsulating housing
Line, the proximity sensor is for receiving the infrared light that is reflected by the object to detect the distance of object；
Display screen, on the housing, the display screen is formed with light transmission entity area and including that can show for the display screen setting
Show the front of picture and the back side opposite with the front；And
Optical flame detector, the optical flame detector are arranged on the side where the back side of the display screen, the optical flame detector with it is described
Light entity area corresponds to, and the optical flame detector is used to receive the light being incident on the optical flame detector and the target light for exporting the light
By force.
2. electronic device according to claim 1, which is characterized in that the input and output module further includes chip, described
Infrared light compensating lamp described is both formed in close to infrared lamp and the proximity sensor on a piece of chip.
3. electronic device according to claim 2, which is characterized in that the encapsulating housing further includes package wall and encapsulation
Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute
It states encapsulation top and is formed with light filling window, close to luminescence window and close to receiving light window, the light filling window and the infrared benefit
Light lamp corresponds to, it is described close to luminescence window with described correspondings close to infrared lamp, it is described close to be sensed with described close to receiving light window
Device corresponds to.
4. electronic device according to claim 2, which is characterized in that it is saturating that the input and output module further includes light compensating lamp
Mirror, the light-supplementing lamp lens are arranged in the encapsulating housing and corresponding with the infrared light compensating lamp；And/or
The input and output module is further included close to lamp lens, it is described be arranged in the encapsulating housing close to lamp lens and with institute
It states and is corresponded to close to infrared lamp；And/or
The input and output module is further included close to sensing lens, described to be arranged in the encapsulating housing simultaneously close to sensing lens
It is corresponding with the proximity sensor.
5. electronic device according to claim 2, which is characterized in that the input and output module further include be arranged on it is described
Light-supplementing lamp lens in encapsulating housing, close to lamp lens and close to sensing lens, the light-supplementing lamp lens and the infrared light filling
Lamp corresponds to, it is described close to lamp lens with described correspondings close to infrared lamp, it is described close to sensing lens and the proximity sensor pair
Should, the light-supplementing lamp lens, it is described close to lamp lens and it is described close to sensing lens be located on same transparent base.
6. electronic device according to claim 2, which is characterized in that the input and output module further includes multiple metals and hides
Baffle, multiple metal shutters are located in the encapsulating housing and are located at the infrared light compensating lamp, are described close to red respectively
In outer lamp and the proximity sensor it is arbitrary between the two.
7. electronic device according to claim 1, which is characterized in that the input and output module is further included by translucent material
Manufactured optics sealing cover, the optics sealing cover are formed on the package substrate and in the encapsulating housing, the optics
Sealing cover wraps the infrared light compensating lamp, is described close to infrared lamp and the proximity sensor.
8. electronic device according to claim 7, which is characterized in that the input and output module further include multiple light extractions every
Plate, it is multiple it is described go out light clapboard be respectively formed in the optics sealing cover and positioned at the infrared light compensating lamp, described close to infrared
In lamp and the proximity sensor it is arbitrary between the two.
9. electronic device according to any one of claims 1 to 8, which is characterized in that formed on the input and output module
There are grounding pin, light compensating lamp pin, close to lamp pin and close to sensing pin, the grounding pin and the light compensating lamp pin quilt
When enabled, the infrared light compensating lamp emits infrared light；The grounding pin and it is described close to lamp pin be enabled when, it is described to connect
Near-infrared lamp emits infrared light；When the grounding pin and the close sensing pin are enabled, the proximity sensor connects
The infrared light that is reflected by the object is received to detect the distance of object.
10. electronic device according to claim 1, which is characterized in that the electronic device further includes the cover board of light transmission, institute
State casing and offer casing close to luminous through-hole, casing light filling through-hole and casing close to receiving light through-hole, it is described close to infrared lamp with
The casing is corresponded to close to luminous through-hole, and the infrared light compensating lamp is corresponding with the casing light filling through-hole, the proximity sensor
Corresponding close to light through-hole is received with the casing, the cover board setting is on the housing.
11. electronic device according to claim 1, which is characterized in that the electronic device further includes the cover board of light transmission, institute
State casing and offer casing close to luminous through-hole, casing light filling through-hole and casing close to receiving light through-hole, it is described close to infrared lamp with
The casing is corresponded to close to luminous through-hole, and the infrared light compensating lamp is corresponding with the casing light filling through-hole, the proximity sensor
Corresponding close to light through-hole is received with the casing, on the housing, the cover board is combined with the casing for the cover board setting
Surface, which is formed with, only transmits the infrared through ink of infrared light, and described infrared through ink to block the casing logical close to shining
Hole, the casing light filling through-hole and the casing are close to receive at least one of light through-hole.
12. electronic device according to claim 1, which is characterized in that the light transmission entity area includes image pixel, described
Electronic device further includes processor, and the optical flame detector receives the light to export the ambient light for including the external electronic device
The initial beam intensity of strong information；The processor only includes the external electronic device for handling the initial beam intensity to obtain
The target light intensity of the environmental light intensity information.
13. electronic device according to claim 12, which is characterized in that the initial beam intensity is believed including the environmental light intensity
Breath and the display screen show display intensity signal during image, and the processor is used to obtain the display screen display figure in real time
As when display intensity signal, and remove when handling the initial beam intensity display intensity signal to obtain the target light
By force.
14. electronic device according to claim 1, which is characterized in that the light transmission entity area do not include image pixel and
It is surrounded by multiple images pixel.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711437245.0A CN108173990A (en) | 2017-12-26 | 2017-12-26 | Electronic device |
| EP18215188.6A EP3514512B1 (en) | 2017-12-26 | 2018-12-21 | Electronic device |
| US16/231,266 US11449102B2 (en) | 2017-12-26 | 2018-12-21 | Electronic device |
| PCT/CN2018/123390 WO2019128967A1 (en) | 2017-12-26 | 2018-12-25 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711437245.0A CN108173990A (en) | 2017-12-26 | 2017-12-26 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108173990A true CN108173990A (en) | 2018-06-15 |
Family
ID=62521347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711437245.0A Pending CN108173990A (en) | 2017-12-26 | 2017-12-26 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108173990A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019128967A1 (en) * | 2017-12-26 | 2019-07-04 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Electronic device |
| CN111785230A (en) * | 2020-06-22 | 2020-10-16 | Oppo广东移动通信有限公司 | Brightness adjusting method, terminal and storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050089A (en) * | 2011-10-12 | 2013-04-17 | 富泰华工业（深圳）有限公司 | Electronic device and method for adjusting brightness of display screen thereof |
| CN103515371A (en) * | 2012-06-27 | 2014-01-15 | 格科微电子（上海）有限公司 | Integrated optical sensor package |
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2017
- 2017-12-26 CN CN201711437245.0A patent/CN108173990A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050089A (en) * | 2011-10-12 | 2013-04-17 | 富泰华工业（深圳）有限公司 | Electronic device and method for adjusting brightness of display screen thereof |
| CN103515371A (en) * | 2012-06-27 | 2014-01-15 | 格科微电子（上海）有限公司 | Integrated optical sensor package |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019128967A1 (en) * | 2017-12-26 | 2019-07-04 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Electronic device |
| US11449102B2 (en) | 2017-12-26 | 2022-09-20 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Electronic device |
| CN111785230A (en) * | 2020-06-22 | 2020-10-16 | Oppo广东移动通信有限公司 | Brightness adjusting method, terminal and storage medium |
| WO2021258950A1 (en) * | 2020-06-22 | 2021-12-30 | Oppo广东移动通信有限公司 | Brightness adjustment method, and terminal and storage medium |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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