CN108023983A - Input and output module and electronic device - Google Patents
Input and output module and electronic device Download PDFInfo
- Publication number
- CN108023983A CN108023983A CN201711435268.8A CN201711435268A CN108023983A CN 108023983 A CN108023983 A CN 108023983A CN 201711435268 A CN201711435268 A CN 201711435268A CN 108023983 A CN108023983 A CN 108023983A
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- China
- Prior art keywords
- infrared light
- infrared
- light
- light supply
- input
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
Abstract
Electronic device disclosed by the invention and input and output module include encapsulating housing, structured light projector, the first infrared light supply, the second infrared light supply, proximity sensor and the optical flame detector set around the first infrared light supply, encapsulating housing includes package substrate, structured light projector, the first infrared light supply, the second infrared light supply, proximity sensor and optical flame detector are encapsulated in encapsulating housing and are carried on package substrate, when the second infrared light supply is closed, when first infrared light supply launches to outside encapsulating housing infrared light with the first power, input and output module is used for infrared distance measurement；When the first infrared light supply and the second infrared light supply are opened and launch infrared light to outside encapsulating housing with the second power, input and output module is used for infrared light filling；Proximity sensor is used to receive the infrared light being reflected by the object to detect the distance of object, and optical flame detector is used to receive the visible ray in ambient light, and detects the intensity of visible ray.The integrated level of input and output module is higher, small volume.
Description
Technical field
The present invention relates to consumer electronics technical field, more specifically, is related to a kind of input and output module and electronics dress
Put.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of the function element set
It is more and more, in order to realize distance detection, ambient light detection with the function such as the facial 3D feature recognitions of user, it is necessary to be set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be taken.
The content of the invention
Embodiment of the present invention provides a kind of input and output module and electronic device.
The input and output module of embodiment of the present invention includes encapsulating housing, structured light projector, the first infrared light supply, ring
The second infrared light supply, proximity sensor and the optical flame detector set around first infrared light supply, the encapsulating housing include encapsulation
Substrate, the structured light projector, first infrared light supply, second infrared light supply, the proximity sensor and described
Optical flame detector is encapsulated in the encapsulating housing and carries on the package substrate, described when second infrared light supply closing
When first infrared light supply launches to outside the encapsulating housing infrared light with the first power, the input and output module is used for infrared
Ranging；When first infrared light supply and second infrared light supply are opened and with the second power to the encapsulating housing outgoing
When penetrating infrared light, the input and output module is used for infrared light filling；The proximity sensor is used to receive what is be reflected by the object
To detect the distance of object, the optical flame detector is used to receive the visible ray in ambient light infrared light, and detects the visible ray
Intensity.
In some embodiments, first infrared light supply is point light source, second infrared light supply for point light source and
Quantity is multiple；Or
First infrared light supply is point light source, and second infrared light supply is annular light source；Or
First infrared light supply is multiple around the point light source circularized, and second infrared light supply is annular light source；
Or
First infrared light supply is multiple around the point light source circularized, and second infrared light supply is point light source and number
Measure to be multiple；Or
First infrared light supply is annular light source；Second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is annular light source.
In some embodiments, the input and output module further includes chip, the structured light projector, described first
Infrared light supply, second infrared light supply, the proximity sensor and the optical flame detector are formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected at the top of the encapsulation between the package substrate, formed with infrared at the top of the encapsulation
Light window, structure light window, close sensing window and light sensation window, the infrared light window and first infrared light supply and institute
The second infrared light supply correspondence is stated, the structure light window is corresponding with the structured light projector, described close to sensing window and institute
Proximity sensor correspondence is stated, the light sensation window is corresponding with the optical flame detector.
In some embodiments, the input and output module further includes infrared light supply lens, the infrared light supply lens
It is arranged in the encapsulating housing and corresponding with first infrared light supply and second infrared light supply；And/or
The input and output module is further included close to sensing lens, described to be arranged on the encapsulating housing close to sensing lens
It is interior and corresponding with the proximity sensor；And/or
The input and output module further includes light sensation lens, the light sensation lens be arranged in the encapsulating housing and with institute
State optical flame detector correspondence.
In some embodiments, the input and output module further includes the optics sealing cover made of light transmissive material, described
Optics sealing cover is formed on the package substrate and in the encapsulating housing, and it is red that the optics sealing cover wraps described first
Outer light source, second infrared light supply, the proximity sensor and the optical flame detector.
In some embodiments, the input and output module further includes multiple metal shutters, and multiple metals hide
Baffle is respectively positioned in the encapsulating housing, and multiple metal shutters are separately positioned on second infrared light supply, the knot
In structure light projector, the proximity sensor and the optical flame detector it is any between the two.
The electronic device of embodiment of the present invention includes：
Casing；With
Input and output module described in above-mentioned any one embodiment, the input and output module are arranged on the casing
It is interior.
In some embodiments, the electronic device further includes the cover board of printing opacity, and it is infrared that the casing offers casing
Through hole, casing structure light through hole, casing are close to receive light through hole and casing light sensation through hole, first infrared light supply and described second
Infrared light supply is corresponding with the infrared through hole of the casing, and the structured light projector is corresponding with the casing structure light through hole, institute
Stating proximity sensor, close to receiving, light through hole is corresponding, and the optical flame detector is corresponding with the casing light sensation through hole, described with the casing
Cover board is set on the housing.
In some embodiments, the cover board and the surface that the casing is combined are formed with only transmitting the infrared of infrared light
Through ink, the infrared transmission ink blocks the infrared through hole of the casing, the casing structure light through hole and the casing and connects
It is at least one in nearly receipts light through hole.
When the electronic device of embodiment of the present invention opens the first infrared light supply and proximity sensor, available for infrared survey
Away from, while open the first infrared light supply and during the second infrared light supply, available for infrared light filling, and combine structured light projector and
Optical flame detector, input and output module group transmitting infrared light are examined with infrared distance measurement, infrared light filling, three-dimensional imaging and visual intensity
The function of survey, therefore, the integrated level of input and output module are higher, small volume, and input and output module, which has been saved, realizes infrared survey
Away from, infrared light filling, three-dimensional imaging and visual intensity detection function space.Further, since structured light projector, close biography
Sensor, optical flame detector, the first infrared light supply and the second infrared light supply are carried on a package substrate, compared to the knot of traditional handicraft
Structure light projector, proximity sensor, optical flame detector, close to infrared lamp, infrared light compensating lamp need to be respectively adopted different wafers manufactures again
The encapsulation being combined in PCB substrate, improves packaging efficiency.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become obvious, or recognized by the practice of embodiments of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the schematic perspective view of the input and output module of the electronic device of embodiment of the present invention；
Fig. 3 is the view of the input and output module of the electronic device of embodiment of the present invention；
Fig. 4 is the view of the input and output module of the electronic device of embodiment of the present invention；
Fig. 5 is the schematic cross-section of the input and output module of the electronic device of embodiment of the present invention；
Fig. 6 is the schematic perspective view of the input and output module of the electronic device of embodiment of the present invention；
Fig. 7 to Fig. 9 is the first infrared light supply and the second infrared light supply of the input and output module of embodiment of the present invention
Distribution schematic diagram；
Figure 10 is the partial sectional schematic view of the electronic device of embodiment of the present invention；
Figure 11 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 12 is the schematic cross-section of the input and output module of the electronic device of embodiment of the present invention；
Figure 13 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 14 to 17 is the partial sectional schematic view of the electronic device of embodiment of the present invention.
Embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the same or similar element of expression eventually or there is same or like element.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity
Sub- component includes input and output module 10, imaging modules 60 and receiver 70.Electronic device 100 can be mobile phone, tablet electricity
Brain, laptop, intelligent watch, Intelligent bracelet, automatic teller machine etc., the embodiment of the present invention is by taking electronic device 100 is mobile phone as an example
Illustrate, it will be understood that the concrete form of electronic device 100 can be other, and this is not restricted.
Refer to Fig. 2 and Fig. 5, input and output module 10 is single package body structure, including encapsulating housing 11, the first infrared light
Source 12, the second infrared light supply 13, structured light projector 14, proximity sensor 1e and optical flame detector 1h.
Encapsulating housing 11 is used to encapsulate the first infrared light supply 12, the second infrared light supply 13 at the same time, structured light projector 14, connects
Nearly sensor 1e and optical flame detector 1h, it is in other words, the first infrared light supply 12, the second infrared light supply 13, structured light projector 14, close
Sensor 1e and optical flame detector 1h are encapsulated in encapsulating housing 11 at the same time.Encapsulating housing 11 includes package substrate 111, package wall
112 and at the top of encapsulation 113.Encapsulating housing 11 can be by electromagnetic interference (Electromagnetic Interference, EMI)
Shielding material is made, and input and output module 10 is had an impact to avoid extraneous electromagnetic interference.In present embodiment, structure light
The center of the projector 14, the center of the first infrared light supply 12, the center of the center of proximity sensor 1e and optical flame detector 1h are positioned at same
On one line segment, such as：Structured light projector 14, the first infrared light supply 12, close biography are followed successively by along one end of line segment to the other end
Sensor 1e and optical flame detector 1h；Alternatively, it is followed successively by the first infrared light supply 12, structured light projector along one end of line segment to the other end
14th, proximity sensor 1e and optical flame detector 1h；Alternatively, it is followed successively by the first infrared light supply 12 along one end of line segment to the other end, approaches
Sensor 1e, optical flame detector 1h and structured light projector 14 etc., herein without exhaustion.In other embodiments, structure light
The line of centres of the projector 14, the first infrared light supply 12 and proximity sensor 1e is triangular in shape or quadrangle.
Incorporated by reference to Fig. 5, package substrate 111 is used to carry the first infrared light supply 12, the second infrared light supply 13, project structured light
Device 14, proximity sensor 1e and optical flame detector 1h.When manufacturing input and output module 10, the first infrared light supply 12, the second infrared light
Source 13, structured light projector 14, proximity sensor 1e and optical flame detector 1h can be formed on chip 15, then by the first infrared light supply
12nd, the second infrared light supply 13, structured light projector 14, proximity sensor 1e, optical flame detector 1h and chip 15, which are set along, is encapsulating
On substrate 111, specifically, chip 15 can be bonded on package substrate 111.Meanwhile package substrate 111 can be used for
Other parts (such as the casing 20 of electronic device 100, mainboard etc.) connection of electronic device 100, by input and output module
10 are fixed in electronic device 100.
Package wall 112 can surround the first infrared light supply 12, the second infrared light supply 13, structured light projector 14, close
Sensor 1e and optical flame detector 1h is set, and package wall 112 extends from package substrate 111, and package wall 112 can be with package substrate
111 combine, it is preferred that package wall 112 is detachably connected with package substrate 111, after removing package wall 112
First infrared light supply 12, the second infrared light supply 13, structured light projector 14, proximity sensor 1e and optical flame detector 1h are examined
Repair.The making material of package wall 112 can be the material of impermeable infrared light, infrared to avoid the first infrared light supply 12, second
The infrared light that light source 13 or structured light projector 14 are sent passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113
Formed with infrared light window 1131, structure light window 1132, close sensing window 1133 and light sensation window 1134, infrared light window
1131 is corresponding with the first infrared light supply 12 and the second infrared light supply 13, the first infrared light supply 12 and the second infrared light supply 13 transmitting
Infrared light is pierced by from infrared light window 1131；Structure light window 1132 is corresponding with structured light projector 14, structured light projector 14
The structure light (infrared light) of transmitting is pierced by from structure light window 1132；It is corresponding with proximity sensor 1e close to sensing window 1133,
The infrared light being reflected by the object can be passed through close to sensing window 1133 and incided on proximity sensor 1e；Light sensation window 1134
It is corresponding with optical flame detector 1h, it is seen that light can pass through light sensation window 1134 and incide on optical flame detector 1h.Encapsulation top 113 and encapsulation
Side wall 112 integrally formed can obtain, can also split shape to obtain.In one example, infrared light window 1131, structure light
Window 1132, close sensing window 1133 and light sensation window 1134 are through hole, and the making material at encapsulation top 113 is impermeable infrared
Light and the material being opaque to visible light but.In another example, encapsulation top 113 is by the material of impermeable infrared light, the material of saturating infrared light
The material that expect, is opaque to visible light but, the material co-manufactured of saturating visible ray form, specifically, infrared light window 1131, structure optical window
Mouthfuls 1132 and be made close to sensing window 1133 of the material of saturating infrared light, light sensation window 1134 by saturating visible ray material system
It is made into, remaining position of the material of impermeable infrared light and the material being opaque to visible light but, further, 1131 He of infrared light window
Structure light window 1132 could be formed with lens arrangement, to improve what is projected from infrared light window 1131 and structure light window 1132
Infrared light emission angle, such as structure light window 1132 is formed with concavees lens structure, so that the light through structure light window 1132
Line diverging is outwards projected；Infrared light window 1131 is formed with convex lens structures, so that the light through infrared light window 1131 gathers
Hold together outside injection；Can also be formed with lens arrangement, to improve from incident close to sensing window 1133 close to sensing window 1133
Infrared light emission angle, such as close to sensing window 1133 formed with convex lens structures so that by close to sensing window 1133 enter
The light penetrated is gathered and is projected on proximity sensor 1e；Light sensation window 1134 can also formed with lens arrangement, with improve from
The incident VISIBLE LIGHT EMISSION angle of light sensation window 1134, for example, light sensation window 1134 formed with convex lens structures so that by light sensation window
The incident light of mouth 1134 are gathered and are projected on optical flame detector 1h.
Please continue to refer to Fig. 5, the first infrared light supply 12 and the second infrared light supply 13 can be formed on a piece of chip 15, into
Volume after one step the first infrared light supply 12 of reduction and the second infrared light supply 13 are integrated, and preparation process is simpler.First is infrared
12 and second infrared light supply 13 of light source can launch infrared light.When the first infrared light supply 12 and the second infrared light supply 13 open and to
When launching infrared light outside encapsulating housing 11 (as shown in Figure 3), infrared light passes through infrared light window 1131 to project object table
Face, the infrared pick-up first 62 of electronic device 100 is (as shown in Figure 1) to receive the infrared light that is reflected by the object to obtain the shadow of object
As information, at this time, input and output module 10 is used as infrared light compensating lamp (i.e. for infrared light filling), and the first infrared light supply 12 and the
The light-emitting area that the infrared light for light filling that two infrared light supplies 13 are launched jointly covers is larger, the field angle of light filling infrared light
α can be 60 degree of -90 degree, such as：The field angle α of light filling infrared light for 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85
Degree, 87 degree or 90 degree etc..When the second infrared light supply 13 is closed, the first infrared light supply 12 launches infrared light to outside encapsulating housing 11
During line (as shown in Figure 4), infrared light is through infrared light window 1131 and reaches body surface, and proximity sensor 1e is received by object
Distance of the infrared light of reflection with detection object to electronic device 100, at this time, input and output module 10 are used for close to infrared survey
Away from, and the light-emitting area of the infrared light for the being used for infrared distance measurement covering of the first infrared light supply 12 transmitting is smaller, infrared distance measurement is with red
The field angle β of outer light is 10 degree of -30 degree, such as：The field angle β of infrared distance measurement infrared light for 10 degree, 15 degree, 20 degree, 25 degree,
Or 30 degree etc..In an embodiment of the present invention, field angle refers to that infrared light passes through infrared light window 1131 from encapsulating housing 11
It is emitted the scope of covering.
When input and output module 10 is used for infrared light filling and for close to can be with different power to envelope during infrared distance measurement
Fill and launch infrared light outside housing 11.Input and output module 10 be used for close to during infrared distance measurement with the first power to encapsulating housing 11
Outer transmitting infrared light, launches infrared light with the second power when input and output module 10 is used for infrared light filling to outside encapsulating housing 11
Line, wherein, the first power can be less than second power.
Second infrared light supply 13 is set around the first infrared light supply 12.First infrared light supply 12 and the second infrared light supply 13 are whole
Circular, annular, square or regular polygon etc. can be rendered as on body.Can be：First infrared light supply 12 is point light source, and second is red
Outer light source 13 is also point light source and quantity is multiple (as shown in Figure 7)；Or first infrared light supply 12 be point light source, second is infrared
Light source 13 is annular light source (as shown in Figure 8)；Or first infrared light supply 12 to be multiple red around the point light source circularized, second
Outer light source 13 is annular light source；Or first infrared light supply 12 to be multiple around the point light source circularized, the second infrared light supply 13
It is multiple (as shown in Figure 9) for point light source and quantity；Or first infrared light supply 12 be annular light source；Second infrared light supply 13 is
Point light source and quantity are multiple；Or first infrared light supply 12 be annular light source；Second infrared light supply 13 is annular light source.
Referring to Fig. 5,14 and first infrared light supply 12 of structured light projector and the second infrared light supply 13 can be formed in one
On piece chip 15, the body after further reduction 14 and first infrared light supply 12 of structured light projector and the second infrared light supply 13 are integrated
Product, and preparation process is simpler.Structured light projector 14 outwards emitting structural light, structure light can form infrared laser speckle pattern
Case, project structured light to target object surface are modulated by target object by the collection (as shown in Figure 1) of infrared pick-up first 62
Structured light patterns, the depth image that acquisition target object is calculated by the way that the structured light patterns modulated are carried out with analysis (at this time, are tied
Structure light projector 14 is used for three-dimensional imaging).In embodiments of the present invention, structured light projector 14 includes projector light source 141, mirror
Frame 142, projector lens 143 and diffraction optical element (diffractive optical elements, DOE) 144.The projector
The light beam that light source 141 is sent is expanded by diffraction optical element 144 after projector lens 143 are collimated or converged and with certain light
Beam pattern is outwards launched.Specifically, projector light source 141 can be formed on chip 15, projector lens 143 and diffraction optics
Element 144 can be fixed on mirror holder 1422, such as is fixed on by gluing mode on mirror holder 142.
First infrared light supply 12, the second infrared light supply 13 and structured light projector 14 can be with different power to encapsulation
Launch infrared light outside housing 11, specifically, 14 and first infrared light supply 12 of structured light projector can launch infrared light at the same time
Line and the second infrared light supply 13 does not launch light, input and output module 10 is used for three-dimensional imaging and infrared distance measurement at the same time；Can also
Structured light projector 14 launches light and the first infrared light supply 12 and the second infrared light supply 13 do not launch light, input and output module
10 are only used for three-dimensional imaging；Can also 14 and second infrared light supply 13 of structured light projector do not launch light and the first infrared light supply
12 transmitting light, input and output module 10 are only used for infrared distance measurement；Can also be the first infrared light supply 12 and the second infrared light supply
13 launch infrared light and structured light projector 14 does not launch light at the same time, when input and output module 10 is only used for infrared imaging
Infrared light filling.
Structured light projector 14, the first infrared light supply 12, the second infrared light supply 13 and proximity sensor 1e can be formed in
On a piece of chip 15, further reduce structured light projector 14, the first infrared light supply 12, the second infrared light supply 13 and close sensing
Device 1e integrate after volume, and preparation process is simpler.Proximity sensor 1e is received by the quilt close to 1133 incidence of sensing window
Object reflection infrared light, the distance with judgment object to electronic device 100, specifically, proximity sensor 1e can receive by
Infrared light that first infrared light supply 12 is launched and is reflected by the object and for the distance of judgment object to electronic device 100.
Structured light projector 14, the first infrared light supply 12, the second infrared light supply 13, proximity sensor 1e and optical flame detector 1h can
To be formed on a piece of chip 15, further reduce structured light projector 14, the first infrared light supply 12, the second infrared light supply 13,
Proximity sensor 1e and optical flame detector 1h integrate after volume, and preparation process is simpler.Optical flame detector 1h is received by light sensation window
Visible ray in 1134 incident ambient lights, and detect the intensity of visible ray.
Incorporated by reference to Fig. 6, in embodiments of the present invention, draw on input and output module 10 formed with grounding pin 1a, light compensating lamp
Foot 1b, close to lamp pin 1c, structure light pin 1d, close to sensing pin 1g and light sensation pin 1j.Grounding pin 1a, light compensating lamp draw
Foot 1b, close to lamp pin 1c, structure light pin 1d, close to sensing pin 1g and light sensation pin 1j can be formed in package substrate
On 111, (that is, grounding pin 1a and light compensating lamp pin 1b access circuits when grounding pin 1a and light compensating lamp pin 1b is enabled
During conducting), the first infrared light supply 12 and the second infrared light supply 13 transmitting infrared light；As grounding pin 1a and close to lamp pin 1c
When being enabled (that is, grounding pin 1a and close to lamp pin 1c access circuit turn-on when), the first infrared light supply 12 transmitting infrared light
Line.(that is, grounding pin 1a and structure light pin 1d access circuit turn-ons when grounding pin 1a and structure light pin 1d are enabled
When), structured light projector 14 launches infrared light.It is enabled as grounding pin 1a, close to lamp pin 1c and structure light pin 1d
When (that is, grounding pin 1a, close to lamp pin 1c and structure light pin 1d access circuit turn-on when), structured light projector 14 is sent out
The first infrared light supply 12 launches infrared light while penetrating infrared light.When grounding pin 1a, close to lamp pin 1c and close to pass
Sense pin 1g is when being enabled (that is, grounding pin 1a, close to lamp pin 1c and close to sensing pin 1g access circuit turn-ons when),
First infrared light supply 12 launches infrared light, and it is sending out and anti-by object that proximity sensor 1e detects the first infrared light supply 12
The infrared light penetrated is using the foundation as judgment object to the distance of electronic device 100.As grounding pin 1a and light sensation pin 1j quilts
When enabled when light sensation pin 1j access circuit turn-ons (that is, grounding pin 1a and), optical flame detector 1h detection visual intensities, using as
The foundation of the display brightness of control display screen 90.
Please refer to Fig.1 and Figure 10, casing 20 can be as the installation carriers of input and output module 10, in other words, input is defeated
Going out module 10 can be arranged in casing 20.Casing 20 can be the shell of electronic device 100, in embodiments of the present invention, machine
It can be additionally used in the display screen 90 that electronic device 100 is set in shell 20, since the input and output module 10 of embodiment of the present invention accounts for
Small volume, therefore, in casing 20 is used to set the volume of display screen 90 to correspond to increase, to improve electronic device
100 screen accounting.Specifically, casing 20 includes top 21 and bottom 22, and display screen 90 and input and output module 10 are arranged on top
Between portion 21 and bottom 22, in the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, such as
Shown in Fig. 1, input and output module 10 can be arranged between display screen 90 and top 21.In other embodiments, display screen
90 can be that screen open up jagged comprehensively, and display screen 90 surrounds input and output module 10, and input and output module 10 is from display
The notch of screen 90 exposes.
Casing 20 is further opened with the close receipts light through hole 25 of the infrared through hole 23 of casing, casing structure light through hole 24, casing and machine
Shell light sensation through hole 26.When input and output module 10 is arranged in casing 20, the first infrared light supply 12 and the second infrared light supply 13 are equal
Through hole 23 infrared with casing is corresponding, and structured light projector 14 is corresponding with casing structure light through hole 24, proximity sensor 1e and casing
Corresponded to close to light through hole 25 is received, optical flame detector 1h is corresponding with casing light sensation through hole 26.Wherein the first infrared light supply 12 and second is infrared
The through hole 23 infrared with casing of light source 13 is corresponding refer to light that the first infrared light supply 12 and/or the second infrared light supply 13 send can be from
The infrared through hole 23 of casing passes through, and can be that the first infrared light supply 12 and the second infrared light supply 13 are infrared logical with casing specifically
The light that 23 face of hole or the first infrared light supply 12 and the second infrared light supply 13 are launched passes through after leaded light device acts on
The infrared through hole 23 of casing.Structured light projector 14 is corresponding with casing structure light through hole 24 similarly, and therefore not to repeat here.Close to sensing
The device 1e infrared lights being reflected by the object that refer to corresponding with the close receipts light through hole 25 of casing can be passed through from casing close to light through hole 25 is received
And incide on proximity sensor 1e, specifically, it can be proximity sensor 1e and close 25 face of receipts light through hole of casing, also may be used
To be the light of infrared light incidence through casing close to receipts light through hole 25 and incide proximity sensor after light-guide device acts on
On 1e.The optical flame detector 1h visible rays that refer to corresponding with casing light sensation through hole 26 can pass through from casing light sensation through hole 26 and incide light sensation
Can be that optical flame detector 1h and the light of 26 face of casing light sensation through hole or visible ray incidence pass through specifically on device 1h
Casing light sensation through hole 26 is simultaneously incided on optical flame detector 1h after light-guide device acts on.In embodiment as shown in Figure 10, casing
Infrared through hole 23, casing structure light through hole 24, casing close to receive light through hole 25 and casing light sensation through hole 26 can be apart from one another by
's.Certainly, in other embodiments, the infrared through hole 23 of casing, casing structure light through hole 24, casing are close receives light through hole 25 and machine
Any two in shell light sensation through hole 26 or three can also interconnect；Alternatively, the infrared through hole 23 of casing, casing structure
Light through hole 24, casing can also be interconnected close to light through hole 25 and casing light sensation through hole 26 4 is received.
Cover board 30 can be printing opacity, and the material of cover board 30 can be glass, resin, plastics of printing opacity etc..Cover board 30 is set
Put on casing 20, cover board 30 includes the inner surface 32 combined with casing 20, and the outer surface 31 opposite with inner surface 32, defeated
Enter to export after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In reality as shown in Figure 10
Apply in example, cover board 30 covers the close receipts light through hole 25 of the infrared through hole 23 of casing, casing structure light through hole 24, casing and casing light sensation
Through hole 26, passes through ink 40 on the inner surface 32 of cover board 30 coated with infrared, it is infrared have through ink 40 to infrared light it is higher
Transmitance, such as 85% or more is can reach, and have higher attenuation rate to visible ray, such as can reach more than 70% so that
User during normal use, is visually difficult to see that on electronic device 100 by the infrared region covered through ink 40.Specifically,
It is infrared through ink 40 can cover on inner surface 32 not with 90 corresponding region of display screen.
It is infrared to block the infrared through hole 23 of casing, casing structure light through hole 24 and casing close to receipts light through ink 40
It is at least one in through hole 25, i.e. infrared to block the infrared through hole 23 of casing, casing structure light through hole at the same time through ink 40
24 and casing close to light through hole 25 (as shown in Figure 10) is received, user is difficult to by the infrared through hole 23 of casing and casing structure light through hole
24 see the internal structure of electronic device 100, and the shape of electronic device 100 is more beautiful；It is infrared to be covered through ink 40
The infrared through hole 23 of casing and casing do not cover casing structure light through hole 24 close to receipts light through hole 25；It is infrared to pass through ink 40
Casing structure light through hole 24 and casing can be covered close to receipts light through hole 25, and do not cover the infrared through hole 23 of casing；Infrared transmission
Ink 40 can also cover casing structure light through hole 24 and the infrared through hole 23 of lid casing, and not hide casing close to receipts light through hole 25；
Or it is infrared can also cover casing structure light through hole 24 through ink 40, and do not cover the infrared through hole 23 of casing and casing approaches
Receive light through hole 25；It is infrared to cover the infrared through hole 23 of casing through ink 40, and 24 He of casing structure light through hole is not covered
Casing is close to receive light through hole 25；Or the infrared ink 40 that passes through can also cover casing structure light through hole 24, and casing is not covered
Infrared through hole 23 and casing are close to receive light through hole 25；Or the infrared ink 40 that passes through can also hide the close receipts light through hole 25 of casing,
And the infrared through hole 23 of casing and lid casing structure light through hole 24 are not covered.
Referring to Fig. 1, receiver 70 is used to send out acoustic signals when being encouraged be subject to power supply, user can by by
Words device 70 is conversed.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, defeated
The center for entering to export module 10, infrared pick-up first 62, visible image capturing first 61 and receiver 70 is located on same line segment.Specifically
Ground, input and output module 10, visible image capturing first 61 is followed successively by from one end of line segment to the other end, receiver 70, infrared light are taken the photograph
As first 62 (as shown in figure 11)；Or from one end of line segment to the other end be followed successively by input and output module 10, receiver 70,
Light video camera head 61, infrared pick-up first 62 (as shown in Figure 1), at this time, it is seen that light video camera head 61 and infrared pick-up first 62 can be with
The double photography/videography heads of composition；Or be followed successively by from one end of line segment to the other end infrared pick-up first 62, input and output module 10, by
Talk about device 70, visible image capturing first 61.Certainly, input and output module 10, infrared pick-up be first 62, receiver 70 and visible image capturing
First 61 arrangement mode is not limited to above-mentioned citing, can also there is other, such as the center of each electronic component is arranged in circular arc
Shape, center arrange the shape such as rectangular.
To sum up, can when the electronic device 100 of embodiment of the present invention opens the first infrared light supply 12 and proximity sensor 1e
For infrared distance measurement, while when the first infrared light supply 12 of unlatching and the second infrared light supply 13, available for infrared light filling, and combine
Structured light projector 14, proximity sensor 1e and optical flame detector 1h, input and output module 10 have gathered transmitting infrared light with infrared survey
Away from, the function of infrared light filling, three-dimensional imaging, infrared distance measurement and visual intensity detection, therefore, input and output module 10 it is integrated
Higher, small volume is spent, input and output module 10, which has been saved, realizes infrared distance measurement, infrared light filling, three-dimensional imaging and visible light intensity
Spend the space of the function of detection.Further, since structured light projector 14, proximity sensor 1e, optical flame detector 1h, the first infrared light supply
12 and second infrared light supply 13 be carried on a package substrate 111, structured light projector compared to traditional handicraft, close to passing
Sensor, optical flame detector, need to be respectively adopted different wafers close to infrared lamp, infrared light compensating lamp and manufacture recombinants to PCB substrate
Encapsulation, improves packaging efficiency.
Referring to Fig. 5, in some embodiments, input and output module 10 further includes infrared light supply lens 17, close biography
Feel lens 1f and light sensation lens 1i.Infrared light supply lens 17 be arranged in encapsulating housing 11 and with the first infrared light supply 12 and second
Infrared light supply 13 corresponds to.It is arranged on close to sensing lens 1f in encapsulating housing 11 and corresponding with proximity sensor 1e.Light sensation lens
1i is arranged in encapsulating housing 11 and corresponding with optical flame detector 1h.What the first infrared light supply 12 or/and the second infrared light supply 13 were launched
Infrared light is converged in infrared light window 1131 under the action of infrared light supply lens 17 and projected, and reduction is transmitted to package wall
112 and encapsulation top 113 other regions light quantity, it is only necessary to meet that the first infrared light supply 12 and the second infrared light supply 13 are common
Field angle α of the infrared light for light filling of transmitting after infrared light supply lens 17 spends for 60 degree -90, the first infrared light supply 12
Field angle β of the infrared light for infrared distance measurement of transmitting after infrared light supply lens 17 is 10 degree of -30 degree.Specifically, it is red
Outer light source lens 17 can be located at transparent base on, more specifically, infrared light supply lens 17 can with the transparent base one into
Type is made.Certainly, input and output module 10 can not also set infrared light supply lens 17.Similarly, by close sensing window 1133
When the infrared light being reflected by the object entered is incided close on sensing lens 1f, infrared light is converged to close to sensing lens 1f
On proximity sensor 1e, reduce infrared light and be transferred to proximity sensor 1e with the light quantity of exterior domain.Similarly, by light sensation window 1134
When the visible ray of entrance is incided on light sensation lens 1i, light sensation lens 1i will be seen that light is converged on optical flame detector 1h, reduce visible
Optical transport is to optical flame detector 1h with the light quantity of exterior domain.Specifically, infrared light supply lens 17, close sensing lens 1f and light sensation lens
1i can be located on same transparent base, more specifically, infrared light supply lens 17, close sensing lens 1f and light sensation lens 1i
It can be integrally formed with the transparent base obtained.Certainly, input and output module 10 can also be provided only with infrared light supply lens
17th, close to one in sensing lens 1f and light sensation lens 1i, infrared light supply lens 17, close sensing lens can not also be set
1f and light sensation lens 1i.
Referring to Fig. 5, in some embodiments, input and output module 10 further includes multiple metal shutters 16, multiple
Metal shutter 16 is respectively positioned in encapsulating housing 11, and multiple metal shutters 16 are separately positioned on the second infrared light supply 13, structure
In light projector 14, proximity sensor 1e and optical flame detector 1h it is any between the two.Center, structure when the second infrared light supply 13
When the center of light projector 14, proximity sensor 1e and optical flame detector 1h is located on same line segment, the quantity of metal shutter 16 is
Three.For example, if one end of line segment is followed successively by the second infrared light supply 13, structured light projector 14, proximity sensor to the other end
1e and optical flame detector 1h, three metal shutters 16 respectively between the second infrared light supply of structure 13 and structured light projector 14,
Between structured light projector 14 and proximity sensor 1e and between proximity sensor 1e and optical flame detector 1h；If one end of line segment is arrived
The other end is followed successively by the second infrared light supply 13, proximity sensor 1e, structured light projector 14 and optical flame detector 1h, three metals and blocks
Plate 18 respectively between the second infrared light supply 13 and proximity sensor 1e, proximity sensor 1e and structured light projector 14 it
Between and structured light projector 14 and optical flame detector 1h between；If one end of line segment is followed successively by structured light projector 14, to the other end
Two infrared light supplies 13, proximity sensor 1e and optical flame detector 1h, three metal shutters 18 respectively positioned at structured light projector 14 with
Between second infrared light supply 13, between the second infrared light supply 13 and proximity sensor 1e and proximity sensor 1e and optical flame detector 1h
Between.Metal shutter 16 is arranged between 14 and second infrared light supply 13 of structured light projector, and metal shutter 16 is on the one hand
Electromagnetic interference that can be mutual between 14 and first infrared light supply 12 of shielding construction light projector, the second infrared light supply 13, structure
Light projector 14 will not interact with the first infrared light supply 12, the luminous intensity of the second infrared light supply 13 and sequential, the opposing party
Face metal shutter 16 can be used for 14 place cavity of isolation structures light projector and the first infrared light supply 12 and the second infrared light
Cavity where source 13, light will not enter another cavity from a cavity.Metal shutter 16 is located at project structured light
Between device 14 and proximity sensor 1e, the infrared light that structured light projector 14 is launched can be avoided to incide proximity sensor 1e
On, moreover it is possible to shielding construction light projector 14 and electromagnetic interference mutual proximity sensor 1e.Metal shutter 16 is positioned at the
Between two infrared light supplies 13 and proximity sensor 1e, 14 and second infrared light supply 13 of structured light projector can be avoided to launch red
UV light is incided on proximity sensor 1e, can be shielded the second infrared light supply 13 electromagnetism mutual with proximity sensor 1e and be done
Disturb.Metal shutter 18 can avoid the second infrared light supply 13 from just originating between structured light projector 14 and optical flame detector 1h
The infrared light penetrated is incided on optical flame detector 1h, moreover it is possible to which the electromagnetism mutual with optical flame detector 1h of shielding construction light projector 14 is done
Disturb.Metal shutter 18 is located between optical flame detector 1h and the second infrared light supply 13, can avoid the second infrared light supply 13 initial
The infrared light of transmitting is incided on optical flame detector 1h, moreover it is possible to shields the second infrared light supply 13 and electromagnetism mutual optical flame detector 1h
Interference.Metal shutter 18 is located adjacent between sensor 1e and optical flame detector 1h, can shield proximity sensor 1e and optical flame detector
Electromagnetic interference mutual 1h.
2 are please referred to Fig.1, in some embodiments, input and output module 10 further includes optics sealing cover 18.Optics sealing cover 18
It is made of light transmissive material, optics sealing cover 18 is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 18 wraps up
Firmly the first infrared light supply 12, the second infrared light supply 13, proximity sensor 1e and optical flame detector 1h.Specifically, optics sealing cover 18 can be with
Formed by encapsulating injection molding and forming technology, optics sealing cover 18 can be made of transparent thermosetting epoxy resin, to use
In be not easy to soften, optics sealing cover 18 can fix the first infrared light supply 12, the second infrared light supply 13, proximity sensor 1e and light sensation
The position of device 1h, and cause the first infrared light supply 12, the second infrared light supply 13, proximity sensor 1e and optical flame detector 1h in encapsulating shell
It is not easy to rock in body 11.
3 are please referred to Fig.1, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Offer cover board sound outlet hole 35, the position correspondence of receiver 70 and cover board sound outlet hole 35 and casing sound outlet hole.Input and output module
10th, the center of infrared pick-up first 62 and visible image capturing first 61 is located on same line segment, and receiver 70 is located at the line segment and machine
Between the top 21 of shell 20.
On the line segment, each electronic component (input and output module on cover board 30 has not been saved in the center of receiver 70
10th, first 62, visible image capturing first 61 of infrared pick-up etc.) horizontal space that takes.In embodiment as shown in figure 15, cover board
Sound outlet hole 35 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
4 are please referred to Fig.1, the infrared through hole 33 of cover board can also be offered in some embodiments, on cover board 30, cover board is red
The through hole 23 infrared with casing of accessibke porosity 33 is corresponding, and the infrared light of the first infrared light supply 12 and/or the transmitting of the second infrared light supply 13 is worn
Electronic device 100 can be pierced by after crossing the infrared through hole 23 of casing from the infrared through hole 33 of cover board.At this time, on cover board 30 with casing knot
24 corresponding position of structure light through hole can set infrared transmission ink 40, and user is difficult to see electricity by casing structure light through hole 24
The structured light projector 14 of the inside of sub-device 100；Can also close to 25 corresponding position of receipts light through hole with casing on cover board 30
Approaching for the inside infrared through ink 40, user is difficult to see electronic device 100 close to receipts light through hole 25 by casing is set
The shape of sensor 1e electronic devices 100 is more beautiful.
5 are please referred to Fig.1, covering plate structure light through hole 34, cover board knot can also be opened up in some embodiments, on cover board 30
Structure light through hole 34 is corresponding with casing structure light through hole 24, and the infrared light that structured light projector 14 is launched passes through casing structure light through hole
Electronic device 100 can be pierced by after 24 from covering plate structure light through hole 34.At this time, through hole 23 infrared with casing is corresponding on cover board 30
Position can set it is infrared pass through ink 40, user is difficult to the inside that electronic device 100 is seen by the infrared through hole 23 of casing
The first infrared light supply 12 and the second infrared light supply 13；Can also close to 25 corresponding position of receipts light through hole with casing on cover board 30
Approaching for the inside infrared through ink 40, user is difficult to see electronic device 100 close to receipts light through hole 25 by casing is set
Sensor 1e, the shape of electronic device 100 are more beautiful.
6 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to receipts light through hole 36, cover board
Corresponding close to receipts light through hole 25 and proximity sensor 1e with casing close to light through hole 36 is received, electronic device 100 is outer anti-by object
The infrared light penetrated can incide proximity sensor 1e through cover board close to after receiving light through hole 36 and the close receipts light through hole 25 of casing
On.At this time, infrared transmission ink 40 can be set on cover board 30 with 24 corresponding position of casing structure light through hole, and user is difficult to lead to
Cross the structured light projector 14 that casing structure light through hole 24 sees the inside of electronic device 100；It is infrared logical with casing on cover board 30
23 corresponding position of hole can also set infrared transmission ink 40, and user is difficult to see electronic device by the infrared through hole 23 of casing
The first infrared light supply 12 and the second infrared light supply 13, the shape of electronic device 100 of 100 inside are more beautiful.
7 are please referred to Fig.1, cover board light sensation through hole 37, cover board light sensation can also be opened up in some embodiments, on cover board 30
Through hole 37 and casing light sensation through hole 26 and optical flame detector 1h are corresponding, and the visible ray outside electronic device 100 passes through cover board light sensation through hole
37 and casing light sensation through hole 26 after can incide on optical flame detector 1h.At this time, it is corresponding with casing structure light through hole 24 on cover board 30
Position can set it is infrared pass through ink 40, user is difficult to see in electronic device 100 by casing structure light through hole 24
The structured light projector 14 in portion；23 corresponding position of through hole infrared with casing, which can also be set, on cover board 30 infrared passes through ink
40, user is difficult to see the first infrared light supply 12 of inside of electronic device 100 and second infrared by the infrared through hole 23 of casing
Light source 13；Infrared transmission ink 40, Yong Hunan can also be set by approaching 25 corresponding position of receipts light through hole with casing on cover board 30
The proximity sensor 1e of the inside of electronic device 100, the shape of electronic device 100 are seen close to receipts light through hole 25 by casing
It is more beautiful.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (10)
- A kind of 1. input and output module, it is characterised in that the input and output module include encapsulating housing, structured light projector, First infrared light supply, the second infrared light supply, proximity sensor and the optical flame detector set around first infrared light supply, the envelope Dress housing includes package substrate, and the structured light projector, first infrared light supply, second infrared light supply, described connect Nearly sensor and the optical flame detector are encapsulated in the encapsulating housing and carry on the package substrate, when described second infrared Light source is closed, when first infrared light supply launch to outside the encapsulating housing infrared light with the first power, it is described input it is defeated Go out module and be used for infrared distance measurement；When first infrared light supply and second infrared light supply are opened and with the second power to institute When stating transmitting infrared light outside encapsulating housing, the input and output module is used for infrared light filling；The proximity sensor is used to connect The infrared light being reflected by the object is received to detect the distance of object, the optical flame detector is used to receive the visible ray in ambient light, and Detect the intensity of the visible ray.
- 2. input and output module according to claim 1, it is characterised in thatFirst infrared light supply is point light source, and second infrared light supply is point light source and quantity is multiple；OrFirst infrared light supply is point light source, and second infrared light supply is annular light source；OrFirst infrared light supply is multiple around the point light source circularized, and second infrared light supply is annular light source；OrFirst infrared light supply is multiple around the point light source circularized, and second infrared light supply is point light source and quantity is It is multiple；OrFirst infrared light supply is annular light source；Second infrared light supply is point light source and quantity is multiple；OrFirst infrared light supply is annular light source；Second infrared light supply is annular light source.
- 3. input and output module according to claim 1, it is characterised in that the input and output module further includes chip, The structured light projector, first infrared light supply, second infrared light supply, the proximity sensor and the optical flame detector It is formed on a piece of chip.
- 4. input and output module according to claim 3, it is characterised in that the encapsulating housing further include package wall and Encapsulation top, the package wall extend from the package substrate and be connected at the top of the encapsulation and the package substrate it Between, formed with infrared light window, structure light window, close sensing window and light sensation window, the infrared light at the top of the encapsulation Window is corresponding with first infrared light supply and second infrared light supply, the structure light window and the structured light projector Corresponding, described corresponding with the proximity sensor close to sensing window, the light sensation window is corresponding with the optical flame detector.
- 5. input and output module according to claim 3, it is characterised in that the input and output module further includes infrared light Source lens, the infrared light supply lens be arranged in the encapsulating housing and with first infrared light supply and described second infrared Light source corresponds to；And/orThe input and output module is further included close to sensing lens, described to be arranged on close to sensing lens in the encapsulating housing simultaneously It is corresponding with the proximity sensor；And/orThe input and output module further includes light sensation lens, the light sensation lens be arranged in the encapsulating housing and with the light Sensor corresponds to.
- 6. input and output module according to claim 1, it is characterised in that the input and output module is further included by printing opacity Optics sealing cover made of material, the optics sealing cover is formed on the package substrate and in the encapsulating housing, described Optics sealing cover wraps first infrared light supply, second infrared light supply, the proximity sensor and the optical flame detector.
- 7. input and output module according to claim 1, it is characterised in that the input and output module further includes multiple gold Belong to shutter, multiple metal shutters are respectively positioned in the encapsulating housing, and multiple metal shutters are separately positioned on In second infrared light supply, the structured light projector, the proximity sensor and the optical flame detector it is any between the two.
- 8. a kind of electronic device, it is characterised in that the electronic device includes：Casing；WithInput and output module described in claim 1-7 any one, the input and output module are arranged in the casing.
- 9. electronic device according to claim 8, it is characterised in that the electronic device further includes the cover board of printing opacity, institute State casing and offer the infrared through hole of casing, casing structure light through hole, casing close to receiving light through hole and casing light sensation through hole, described the One infrared light supply and second infrared light supply are corresponding with the infrared through hole of the casing, the structured light projector and the machine Shell structure light through hole corresponds to, and the proximity sensor is corresponding close to light through hole is received with the casing, the optical flame detector and the machine Shell light sensation through hole corresponds to, and the cover board is set on the housing.
- 10. electronic device according to claim 9, it is characterised in that the surface shape that the cover board is combined with the casing Only transmit the infrared of infrared light into having and pass through ink, it is described infrared to block the infrared through hole of the casing, the casing through ink Structure light through hole and the casing are at least one in light through hole close to receiving.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711435268.8A CN108023983A (en) | 2017-12-26 | 2017-12-26 | Input and output module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711435268.8A CN108023983A (en) | 2017-12-26 | 2017-12-26 | Input and output module and electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN108023983A true CN108023983A (en) | 2018-05-11 |
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ID=62071461
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711435268.8A Pending CN108023983A (en) | 2017-12-26 | 2017-12-26 | Input and output module and electronic device |
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| CN (1) | CN108023983A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108495014A (en) * | 2018-05-31 | 2018-09-04 | 维沃移动通信有限公司 | A kind of camera module, mobile terminal and control method |
| EP3748411A1 (en) * | 2019-06-05 | 2020-12-09 | Beijing Xiaomi Mobile Software Co., Ltd. | Electronic device |
-
2017
- 2017-12-26 CN CN201711435268.8A patent/CN108023983A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108495014A (en) * | 2018-05-31 | 2018-09-04 | 维沃移动通信有限公司 | A kind of camera module, mobile terminal and control method |
| EP3748411A1 (en) * | 2019-06-05 | 2020-12-09 | Beijing Xiaomi Mobile Software Co., Ltd. | Electronic device |
| US11099062B2 (en) | 2019-06-05 | 2021-08-24 | Beijing Xiaomi Mobile Software Co., Ltd. | Electronic device |
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Application publication date: 20180511 |