CN108156282A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN108156282A CN108156282A CN201711433414.3A CN201711433414A CN108156282A CN 108156282 A CN108156282 A CN 108156282A CN 201711433414 A CN201711433414 A CN 201711433414A CN 108156282 A CN108156282 A CN 108156282A
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- China
- Prior art keywords
- infrared light
- infrared
- light
- light supply
- electronic device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The invention discloses a kind of electronic devices.Electronic device includes casing, output module, display screen and optical flame detector.It exports module to be mounted on casing, output module includes encapsulating housing, structured light projector, the first infrared light supply and the second infrared light supply around the setting of the first infrared light supply.Encapsulating housing includes package substrate, and structured light projector, the first infrared light supply and the second infrared light supply are encapsulated in encapsulating housing and are carried on package substrate.When the second infrared light supply is closed, and the first infrared light supply emit outside encapsulating housing infrared light with the first power, output module is for infrared distance measurement.When the first infrared light supply and the second infrared light supply are opened and emit infrared light outside encapsulating housing with the second power, output module is used for infrared light filling.Optical flame detector is arranged on the back side side of display screen, and optical flame detector is corresponding with the light transmission entity area of display screen, and optical flame detector is incident on the target light intensity of the light and output light on optical flame detector for reception.
Description
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of function element set
It is more and more, in order to realize the functions such as the facial 3D feature recognitions of distance detection, environment light detection and user, need to set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be occupied.
Invention content
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Module is exported, on the housing, the output module includes encapsulating housing, structure light for the output module installation
The projector, the first infrared light supply and the second infrared light supply around first infrared light supply setting, the encapsulating housing include
Package substrate, the structured light projector, first infrared light supply and second infrared light supply are encapsulated in the encapsulating shell
It in vivo and carries on the package substrate, when second infrared light supply is closed, first infrared light supply is with the first power
When emitting infrared light outside the encapsulating housing, the output module is used for infrared distance measurement；When first infrared light supply with
When second infrared light supply is opened and is emitted infrared light outside the encapsulating housing with the second power, the output module
For infrared light filling；
Display screen, on the housing, the display screen is formed with light transmission entity area and including energy for the display screen setting
Enough show the front of picture and the back side opposite with the front；With
Optical flame detector, the optical flame detector are arranged on the side where the back side of the display screen, the optical flame detector and institute
Light transmission entity area correspondence is stated, the optical flame detector is used to receive the light being incident on the optical flame detector and the mesh for exporting the light
Mark light intensity.
In some embodiments, first infrared light supply is point light source, second infrared light supply for point light source and
Quantity is multiple；Or
First infrared light supply is point light source, and second infrared light supply is annular light source；Or
For first infrared light supply to be multiple around the point light source circularized, second infrared light supply is annular light source；
Or
For first infrared light supply to be multiple around the point light source circularized, second infrared light supply is point light source and number
It is multiple to measure；Or
First infrared light supply is annular light source；Second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is annular light source.
In some embodiments, the output module further includes chip, the structured light projector, described first infrared
Light source and second infrared light supply are formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected at the top of the encapsulation between the package substrate, and first is formed at the top of the encapsulation
Light-emitting window and the second light-emitting window, first light-emitting window and first infrared light supply and second infrared light supply pair
Should, second light-emitting window is corresponding with the structured light projector.
In some embodiments, the output module further includes lens, and the lens are arranged in the encapsulating housing
It is and corresponding with first infrared light supply and second infrared light supply.
In some embodiments, the output module further includes the optics sealing cover made of translucent material, the optics
Sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps first infrared light
Source and second infrared light supply.
In some embodiments, the output module further includes metal shutter, and the metal shutter is located at described
In encapsulating housing, first infrared light supply and second infrared light supply are located at the side of the metal shutter, the knot
Structure light projector is located at the opposite side of the metal shutter.
In some embodiments, the electronic device further includes the cover board of light transmission, and it is infrared that the casing offers casing
Through-hole and casing structure light through-hole, first infrared light supply and second infrared light supply with the infrared through-hole pair of the casing
Should, the structured light projector is corresponding with the casing structure light through-hole, and the cover board setting is on the housing.
In some embodiments, the cover board is formed with the surface that the casing is combined and only transmits the infrared of infrared light
Through ink, it is described it is infrared blocked through ink in the infrared through-hole of the casing and the casing structure light through-hole at least one
It is a.
In some embodiments, the electronic device further includes proximity sensor and imaging modules, the imaging modules
Lens barrel including microscope base, on the microscope base and the imaging sensor being housed in the microscope base, the microscope base include position
Mounting surface between the lens barrel and described image sensor, the proximity sensor are arranged on the mounting surface.
In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head
Kind.
In some embodiments, the light transmission entity area includes image pixel, and the electronic device further includes processor,
The optical flame detector receives the light to export the initial beam intensity of the environmental light intensity information including the external electronic device；It is described
Processor is used to handle the initial beam intensity to obtain the institute for the environmental light intensity information for only including the external electronic device
State target light intensity.
In some embodiments, the initial beam intensity includes the environmental light intensity information and the display screen shows image
When display intensity signal, the processor is used to obtain the display intensity signal when display screen shows image in real time, and
The display intensity signal is removed when handling the initial beam intensity to obtain the target light intensity.
In some embodiments, the electronic device further include receiver, infrared pick-up head, visible image capturing head and
The cover board of light transmission, the casing offer casing sound outlet hole, and the cover board offers cover board sound outlet hole, the receiver with it is described
The position of cover board sound outlet hole and the casing sound outlet hole corresponds to, the output module, the infrared pick-up head and described visible
The center of light video camera head is located on same line segment, and the receiver is between the line segment and the top of the casing.
When the output module and electronic device of embodiment of the present invention only open the first infrared light supply, available for infrared survey
Away from, while when the first infrared light supply of unlatching and the second infrared light supply, available for infrared light filling, and structured light projector is combined,
Module group transmitting infrared light is exported with the function of infrared distance measurement, infrared light filling and three-dimensional imaging, therefore, exports the collection of module
Cheng Du higher, small volume, output module have saved the space for the function of realizing infrared distance measurement, infrared light filling and three-dimensional imaging.
In addition, since structured light projector, the first infrared light supply and the second infrared light supply are carried on same package substrate, compared to
The structured light projector of traditional handicraft needs to be respectively adopted different wafers manufacture recombinants close to infrared lamp, infrared light compensating lamp and arrives
Encapsulation in PCB substrate, improves packaging efficiency.Meanwhile optical flame detector is arranged on the side where the back side of display screen, so as to light
Sensor will not occupy the space between display platen edge and envelope edge, show that gap between platen edge and envelope edge can be with
Smaller is made, in other words, the display area of display screen can increase, to improve the screen accounting of electronic device.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
It obtains significantly and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 3 and Fig. 4 is the status diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 5 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Fig. 6 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 7 to Fig. 9 is the distribution of the first infrared light supply and the second infrared light supply of the output module of embodiment of the present invention
Schematic diagram；
Figure 10 is partial sectional schematic view of the electronic device of Fig. 1 along X-X lines；
Figure 11 is schematic cross-section of the electronic device of Fig. 1 along XI-XI lines；
Figure 12 is the proximity sensor of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 13 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 14 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Figure 15 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 16 is the part that the electronic device edge of another embodiment of the present invention is intercepted with the X-X line corresponding positions in Fig. 1
Schematic cross-section；
Figure 17 is the part that the electronic device edge of a further embodiment of this invention is intercepted with the X-X line corresponding positions in Fig. 1
Schematic cross-section；
Figure 18 is the stereoscopic schematic diagram of the proximity sensor and output module of the electronic device of embodiment of the present invention；
Figure 19 to Figure 26 is that the proximity sensor of the electronic device of embodiment of the present invention and the three-dimensional of imaging modules are illustrated
Figure.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the whole element for representing same or similar element or there is same or like function.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature right over second feature or oblique upper or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30, display screen 90 and electronics
Component.Electronic component includes output module 10, proximity sensor 51 (such as Figure 12), optical flame detector 52, imaging modules 60 (as schemed
And receiver 70 12).Electronic device 100 can be mobile phone, tablet computer, laptop, smartwatch, Intelligent bracelet, cabinet
Member's machine etc., the embodiment of the present invention is illustrated so that electronic device 100 is mobile phone as an example, it will be understood that electronic device 100 it is specific
Form can be other, and this is not restricted.
Fig. 2 and Fig. 5 are please referred to, output module 10 is single package body structure, and output module 10 includes encapsulating housing 11, first
Infrared light supply 12, the second infrared light supply 13 and structured light projector 14.
Encapsulating housing 11 is used to encapsulate the first infrared light supply 12, the second infrared light supply 13 and structured light projector 14 simultaneously,
In other words, the first infrared light supply 12, the second infrared light supply 13 and structured light projector 14 are encapsulated in encapsulating housing 11 simultaneously.Envelope
It fills housing 11 and includes package substrate 111, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference
(Electromagnetic Interference, EMI) shielding material is made, to avoid extraneous electromagnetic interference to exporting module
10 have an impact.
Referring to Fig. 5, package substrate 111 is thrown for carrying the first infrared light supply 12, the second infrared light supply 13 and structure light
Emitter 14.When manufacture exports module 10, the first infrared light supply 12, the second infrared light supply 13 and structured light projector 14 can be with shapes
It is set along on chip 15, then by the first infrared light supply 12, the second infrared light supply 13, structured light projector 14 and chip 15
On package substrate 111, specifically, chip 15 can be bonded on package substrate 111.Meanwhile package substrate 111 can also
It is connect for other parts (such as the casing 20 of electronic device 100, mainboard etc.) with electronic device 100, mould will be exported
Group 10 is fixed in electronic device 100.
Package wall 112 can be set around the first infrared light supply 12, the second infrared light supply 13 and structured light projector 14,
Package wall 112 extends from package substrate 111, and package wall 112 can be combined with package substrate 111, preferably, package wall
112 with package substrate 111 to be detachably connected, it is red to the first infrared light supply 12, second after package wall 112 in order to remove
Outer light source 13 and structured light projector 14 are overhauled.The making material of package wall 112 can be the material of impermeable infrared light,
Package wall is passed through to avoid the infrared light that the first infrared light supply 12, the second infrared light supply 13 or structured light projector 14 are sent out
112。
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connect with package wall 112.Encapsulation top 113
It is formed with the first light-emitting window 1131 and the second light-emitting window 1132, the first light-emitting window 1131 and the first infrared light supply 12 and
Two infrared light supplies 13 correspond to, and the infrared light of the first infrared light supply 12 and the transmitting of the second infrared light supply 13 is from the first light-emitting window 1131
It is pierced by；Second light-emitting window 1132 is corresponding with structured light projector 14, the structure light (infrared light) that structured light projector 14 emits
It is pierced by from the second light-emitting window 1132.Encapsulation top 113 integrally formed can be obtained with package wall 112, can also split into
Shape obtains.In one example, the first light-emitting window 1131 and the second light-emitting window 1132 are through-hole, encapsulate the system at top 113
Make the material that material is impermeable infrared light.In another example, encapsulation 113 materials by impermeable infrared light of top and saturating infrared light
Material co-manufactured form, specifically, the first light-emitting window 1131 and the second light-emitting window 1132 by saturating infrared light material
It being made, remaining position is made of the material of impermeable infrared light, further, the first light-emitting window 1131 and the second light-emitting window
1132 could be formed with lens arrangement, to improve the infrared light projected from the first light-emitting window 1131 and the second light-emitting window 1132
Launch angle, such as the second light-emitting window 1132 are formed with concavees lens structure, so that the light across the second light-emitting window 1132
Diverging is projected outward；First light-emitting window 1131 is formed with convex lens structures, so that the light across the first light-emitting window 1131
Gather outside injection.
Please continue to refer to Fig. 5, the first infrared light supply 12 and the second infrared light supply 13 can be formed on a piece of chip 15, into
Volume after one step the first infrared light supply 12 of reduction and the second infrared light supply 13 are integrated, and preparation process is simpler.First is infrared
12 and second infrared light supply 13 of light source can emit infrared light.When the first infrared light supply 12 and the second infrared light supply 13 open and to
When emitting infrared light outside encapsulating housing 11 (as shown in Figure 3), infrared light passes through the first light-emitting window 1131 to project object
Surface, the infrared pick-up head 62 of electronic device 100 is (as shown in Figure 1) to receive the infrared light that is reflected by the object to obtain object
Image information, at this point, output module 10 is used as infrared light compensating lamp (i.e. for infrared light filling), and the first infrared light supply 12 and second
The light-emitting area that the infrared light for light filling that infrared light supply 13 emits jointly covers is larger, the field angle α of light filling infrared light
Can be 60 degree of -90 degree, such as：The field angle α of light filling infrared light for 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree,
87 degree or 90 degree etc..When the second infrared light supply 13 is closed, and the first infrared light supply 12 emits infrared light outside encapsulating housing 11
(as shown in Figure 4), infrared light pass through the first light-emitting window 1131 and reach body surface, the proximity sensor of electronic device 100
51 distances (as shown in figure 12) for receiving the infrared light being reflected by the object with detection object to electronic device 100, at this point, output mould
Group 10 is used for close to infrared distance measurement, and the light-emitting area that the infrared light for infrared distance measurement of the first infrared light supply 12 transmitting covers
Smaller, the field angle β of infrared distance measurement infrared light is 10 degree of -30 degree, such as：The field angle β of infrared distance measurement infrared light is 10
Degree, 15 degree, 20 degree, 25 degree or 30 degree etc..In an embodiment of the present invention, field angle refers to that infrared light passes through the first light extraction
The range that window 1131 is covered from the outgoing of encapsulating housing 11.
It exports when module 10 is used for infrared light filling and can be with different power to encapsulating shell during for approaching infrared distance measurement
Emit infrared light outside body 11.Output module 10 is used for red close to being emitted outside encapsulating housing 11 with the first power during infrared distance measurement
UV light emits infrared light with the second power when output module 10 is used for infrared light filling outside encapsulating housing 11, wherein, first
Power can be less than second power.
Second infrared light supply 13 is set around the first infrared light supply 12.First infrared light supply 12 and the second infrared light supply 13 are whole
Round, annular, rectangular or regular polygon etc. can be rendered as on body.Can be：First infrared light supply 12 is point light source, and second is red
Outer light source 13 is also point light source and quantity is multiple (as shown in Figure 7)；Or first infrared light supply 12 be point light source, second is infrared
Light source 13 is annular light source (as shown in Figure 8)；Or first infrared light supply 12 to be multiple red around the point light source circularized, second
Outer light source 13 is annular light source；Or first infrared light supply 12 to be multiple around the point light source circularized, the second infrared light supply 13
It is multiple (as shown in Figure 9) for point light source and quantity；Or first infrared light supply 12 be annular light source；Second infrared light supply 13 is
Point light source and quantity are multiple；Or first infrared light supply 12 be annular light source；Second infrared light supply 13 is annular light source.
Referring to Fig. 5,14 and first infrared light supply 12 of structured light projector and the second infrared light supply 13 can be formed in one
On piece chip 15, the body after further reduction 14 and first infrared light supply 12 of structured light projector and the second infrared light supply 13 are integrated
Product, and preparation process is simpler.Structured light projector 14 emitting structural light, structure light can form infrared laser speckle pattern outward
Case, project structured light to target object surface are modulated by target object by the acquisition (as shown in Figure 1) of infrared pick-up head 62
Structured light patterns calculate the depth image for obtaining target object (at this point, knot by the way that the structured light patterns modulated are carried out with analysis
Structure light projector 14 is used for three-dimensional imaging).In embodiments of the present invention, structured light projector 14 includes projector light source 141, mirror
Frame 142, projector lens 143 and diffraction optical element (diffractive optical elements, DOE) 144.The projector
The light beam that light source 141 is sent out is expanded by diffraction optical element 144 after projector lens 143 are collimated or converged and with certain light
Beam pattern emits outward.Specifically, projector light source 141 can be formed on chip 15, projector lens 143 and diffraction optics
Element 144 can be fixed on mirror holder 1422, such as is fixed on mirror holder 142 by way of gluing.
First infrared light supply 12, the second infrared light supply 13 and structured light projector 14 can be with different power to encapsulation
Emit infrared light outside housing 11, specifically, 14 and first infrared light supply 12 of structured light projector can emit infrared light simultaneously
Line and the second infrared light supply 13 do not emit light, and output module 10 is simultaneously for three-dimensional imaging and infrared distance measurement；It can also structure
Light projector 14 emits light and the first infrared light supply 12 and the second infrared light supply 13 do not emit light, and output module 10 is only used for
Three-dimensional imaging；Can also 14 and second infrared light supply 13 of structured light projector do not emit light and the first infrared light supply 12 transmitting light
Line, output module 10 are only used for infrared distance measurement；It is red to be that the first infrared light supply 12 emits simultaneously with the second infrared light supply 13
UV light and structured light projector 14 do not emit light, and output module 10 is only used for infrared light filling during infrared imaging.
Incorporated by reference to Fig. 6, in embodiments of the present invention, export be formed on module 10 grounding pin 1a, light compensating lamp pin 1b,
Close to lamp pin 1c and structure light pin 1d.Grounding pin 1a, light compensating lamp pin 1b, close to lamp pin 1c and structure light pin
1d can be formed on package substrate 111, when grounding pin 1a and light compensating lamp pin 1b is enabled (that is, grounding pin 1a and
When light compensating lamp pin 1b accesses circuit turn-on), the first infrared light supply 12 and the second infrared light supply 13 transmitting infrared light；Work as ground connection
Pin 1a and close to lamp pin 1c be enabled when (that is, grounding pin 1a and close to lamp pin 1c access circuit turn-on when), first
Infrared light supply 12 emits infrared light.When grounding pin 1a and structure light pin 1d are enabled (that is, grounding pin 1a and structure
When light pin 1d accesses circuit turn-on), structured light projector 14 emits infrared light.When grounding pin 1a, close to lamp pin 1c,
And structure light pin 1d when being enabled (that is, grounding pin 1a, close to lamp pin 1c and structure light pin 1d access circuit turn-ons
When), the first infrared light supply 12 transmitting infrared light while structured light projector 14 emits infrared light.
It please refers to Fig.1 and Figure 10, casing 20 in other words, can export module 10 as the installation carrier of output module 10
It can be arranged in casing 20.Casing 20 includes top 21 and bottom 22, in the state of user's normal use electronic device 100
Under, top 21 is located at the top of bottom 22, as shown in Figure 1, output module 10 is arranged between top 21 and bottom 22.Incorporated by reference to
Figure 11, casing 20 offer mounting groove 25, and mounting groove 25 is opened between top 21 and bottom 22.Casing 20 can be electronics dress
Put 100 middle shell or shell.
Referring to Fig. 6, display screen 90 is arranged on casing 20 and closes mounting groove 25 to form the installation space of closing.It is aobvious
Display screen 90 is formed with light transmission entity area 91 and alternatively non-transparent district 94, and light transmission entity area 91 does not include image pixel and by multiple images picture
Element surrounds, and image pixel is distributed in alternatively non-transparent district 94, and in other words, alternatively non-transparent district 94 is the viewing area of display screen 90, non-transparent
Area 94 is used to implement the display function of display screen 90.The material in light transmission entity area 91 includes but not limited to glass.Electronic device 100
Outer light may pass through light transmission entity area 91 and enter electronic device 100, without destroying the integrality of display screen 90.Display screen 90
Including can show picture front 92 and with the positive 92 opposite back sides 93.Specifically, when display screen 90 shines and shows picture
During face, the light that display screen 90 is sent out projects display screen 90 from front 92；When display screen 90 is installed on casing 20, mounting groove
25 are located at the opposite both sides (that is, the back side 93 is located between front 92 and mounting groove 25) at the back side 93 with front 92.Of the invention real
It applies in example, output module 10 can be arranged between display screen pane edge and top 21, due to the output of embodiment of the present invention
Module 10 can occupy smaller volume, therefore, for setting the volume of display screen 90 that can correspond to increase in casing 20, with
Improve the screen accounting of electronic device 100.In other embodiments, display screen 90 can be that screen opens up jagged, display comprehensively
Screen 90 surrounds output module 10, and exports module 10 and expose from the notch of display screen 90.In some embodiments, light transmission is real
94 uniform thickness of alternatively non-transparent district of body area 91 and surrounding and continuous.
Referring to Fig. 10, casing 20 is further opened with the infrared through-hole 23 of casing and casing structure light through-hole 24.Export module 10
When being arranged in casing 20, the first infrared light supply 12 and the second infrared light supply 13 23 corresponding, structure light of through-hole infrared with casing
The projector 14 is corresponding with casing structure light through-hole 24.Wherein the first infrared light supply 12 and the second infrared light supply 13 are infrared with casing
The correspondence of through-hole 23, which refers to the light that the first infrared light supply 12 and/or the second infrared light supply 13 are sent out, to be worn from the infrared through-hole 23 of casing
Cross, specifically, can be the first infrared light supply 12 and the second infrared light supply 13 23 face of through-hole infrared with casing or
First infrared light supply 12 and the light of the second infrared light supply 13 transmitting pass through the infrared through-hole 23 of casing after leaded light device acts on.Knot
Structure light projector 14 is corresponding with casing structure light through-hole 24 similarly, and therefore not to repeat here.In embodiment as shown in Figure 10, machine
The infrared through-hole 23 of shell and casing structure light through-hole 24 can be apart from one another by certainly, in other embodiments, casing is infrared logical
Hole 23 and casing structure light through-hole 24 can also interconnect.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set
It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated
Go out after the light that module 10 is sent out sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 10
In, cover board 30 covers the infrared through-hole 23 of casing and casing structure light through-hole 24, is coated on the inner surface 32 of cover board 30 infrared
Ink 40 is crossed, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and to visible ray
There is higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device
By the infrared region covered through ink 40 on 100.Specifically, it is infrared to be covered on inner surface 32 not with showing through ink 40
90 corresponding region of display screen.
It is infrared to block at least one of the infrared through-hole 23 of casing and casing structure light through-hole 24 through ink 40,
That is, infrared can block the infrared through-hole 23 of casing and casing structure light through-hole 24 (as shown in Figure 10) simultaneously through ink 40, use
Family is difficult to see by the infrared through-hole 23 of casing and casing structure light through-hole 24 internal structure of electronic device 100, electronic device
100 shape is more beautiful；It is infrared to cover the infrared through-hole 23 of casing, and do not cover casing structure light through-hole through ink 40
24；Or the infrared ink 40 that penetrates can also cover casing structure light through-hole 24, and do not cover the infrared through-hole 23 of casing.
1 is please referred to Fig.1, optical flame detector 52 is single packaging body.Optical flame detector 52 is mounted in mounting groove 25 and positioned at display screen 90
The back side 93 where side, in other words, optical flame detector 52 is located at the lower section of display screen 90.Optical flame detector 52 and light transmission entity area 91 are right
Should, specifically, the visible ray outside electronic device 100 can pass through light transmission entity area 91 and be transmitted on optical flame detector 52.Optical flame detector
52 receive the visible ray in ambient light, and detect the intensity of visible ray, using the foundation of the display brightness as control display screen 90.
In present embodiment, optical flame detector 52 is first mounted in mounting groove 25 and display screen 90 is installed on casing 20 again, and optical flame detector 52 can
To contact or be arranged at intervals with display screen 90.In other embodiments, optical flame detector 52 can first be mounted on display screen 90 and make
Optical flame detector 52 is corresponding with light transmission entity area 91, is then again installed to display screen 90 and optical flame detector 52 on casing 20 simultaneously.
Fig. 5 and Figure 12 are please referred to, proximity sensor 51 is single packaging body.The infrared light sent out close to infrared lamp 13,
It after being reflected by external object, is received by proximity sensor 51, proximity sensor 51 is sentenced according to the infrared light reflected received
Disconnected the distance between external object and electronic device 100.
2 are please referred to Fig.1, imaging modules 60 can be visible image capturing head 61 and one or two in infrared pick-up head 62
It is a.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, imaging sensor
65 are housed in microscope base 63.Microscope base 63 includes mounting surface 631, and mounting surface 631 is between lens barrel 64 and imaging sensor 65.
In embodiment as shown in figure 12, proximity sensor 51 is arranged on mounting surface 631, and specifically, proximity sensor 51 is being installed
Plane orthographic projection where face 631 is at least partly dropped on mounting surface 631, in this way, proximity sensor 51 and imaging modules 60
Set compacter, the horizontal space that the two occupies jointly is smaller.
Referring to Fig. 1, receiver 70 is for sending out acoustic signals when being encouraged by power supply, user can by by
Words device 70 is conversed.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, defeated
The center for going out module 10, infrared pick-up head 62, visible image capturing head 61 and receiver 70 is located on same line segment.Specifically,
Output module 10, visible image capturing head 61, receiver 70, infrared pick-up head 62 are followed successively by from one end of line segment to the other end
(as shown in figure 13)；Or output module 10, receiver 70, visible image capturing head are followed successively by from one end of line segment to the other end
61st, infrared pick-up head 62 (as shown in Figure 1)；Or infrared pick-up head 62, defeated is followed successively by from one end of line segment to the other end
Go out module 10, receiver 70, visible image capturing head 61.Certainly, module 10, infrared pick-up head 62, receiver 70 and can are exported
See that the arrangement mode of light video camera head 61 is not limited to above-mentioned citing, there can also be other, such as the central row of each electronic component
Arrange the shapes such as in the arc-shaped, center arrangement is rectangular.
Further, incorporated by reference to Figure 12, proximity sensor 51 can be arranged on the mounting surface 631 of infrared pick-up head 62
On, it can also be arranged on the mounting surface 631 of visible image capturing head 61, certainly, proximity sensor 51 can not also be arranged on peace
On dress face 631, proximity sensor 51 can be disposed adjacent with output module 10, to readily receive by being sent out close to infrared lamp 13
It penetrates, and the infrared light being reflected back by external object；Proximity sensor 51 can also be disposed adjacent with receiver 70, when user answers
During phone, proximity sensor 51 is readily detected the ear of user close to receiver 70.
To sum up, when the electronic device 100 of embodiment of the present invention only opens the first infrared light supply 12, available for infrared survey
Away from, while when the first infrared light supply 12 of unlatching and the second infrared light supply 13, available for infrared light filling, and combine project structured light
Device 14, output module 10 have gathered transmitting infrared light with the function of infrared distance measurement, infrared light filling and three-dimensional imaging, therefore, output
The integrated level of module 10 is higher, small volume, and output module 10, which has been saved, realizes infrared distance measurement, infrared light filling and three-dimensional imaging
The space of function.In addition, since structured light projector 14, the first infrared light supply 12 and the second infrared light supply 13 are carried on an envelope
It fills on substrate 111, structured light projector compared to traditional handicraft is respectively adopted not close to infrared lamp, infrared light compensating lamp needs
With the encapsulation in wafer manufacture recombinant to PCB substrate, packaging efficiency is improved.Meanwhile optical flame detector 52 is arranged on display screen 90
The back side 93 where side, so as to which optical flame detector 52 will not occupy the space between 20 edge of display screen pane edge and casing, show
Gap between 20 edge of display screen pane edge and casing be can be made smaller, and in other words, the display area of display screen 90 can be with
Increase, to improve the screen accounting of electronic device 100.
Referring to Fig. 10, in some embodiments, output module 10 further includes Infrared Lens 17.Infrared Lens 17 are set
It is in encapsulating housing 11 and corresponding with the first infrared light supply 12 and the second infrared light supply 13.First infrared light supply 12 or/and second
The infrared light that infrared light supply 13 emits, which is converged under the action of Infrared Lens 17 in first light-emitting window 1131, to be projected, and reduces hair
It is mapped to the light quantity in other regions at package wall 112 and encapsulation top 113, it is only necessary to it is red to meet the first infrared light supply 12 and second
Field angle α of the infrared light for light filling that outer light source 13 emits jointly after Infrared Lens 17 is 60 degree of -90 degree, and first is red
Field angle β of the infrared light for infrared distance measurement that outer light source 12 emits after Infrared Lens 17 is 10 degree of -30 degree.Specifically
Ground, Infrared Lens 17 can be located on transparent base, be made more specifically, Infrared Lens 17 can be integrally formed with the transparent base
.Certainly, output module 10 can not also set Infrared Lens 17.
Referring to Fig. 10, in some embodiments, output module 10 further includes metal shutter 16, metal shutter 16
In encapsulating housing 11, and metal shutter 16 is located between 14 and second infrared light supply 13 of structured light projector, that is,
First infrared light supply 12 and the second infrared light supply 13 are located at the side of metal shutter 16, and structured light projector 14 is located at metal screening
The opposite side of baffle 16.Metal shutter 16 on the one hand can be with 14 and first infrared light supply 12, second of shielding construction light projector
Mutual electromagnetic interference between infrared light supply 13, structured light projector 14 and first infrared light supply 12, the second infrared light supply 13
Luminous intensity and sequential will not interact, and another aspect metal shutter 16 can be used for where isolation structures light projector 14
Cavity where cavity and the first infrared light supply 12 and the second infrared light supply 13, light will not enter another from a cavity
Cavity.
4 are please referred to Fig.1, in some embodiments, output module 10 further includes optics sealing cover 18.Optics sealing cover 18 is by saturating
Luminescent material is made, and optics sealing cover 18 is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 18 wraps
One infrared light supply 12 and the second infrared light supply 13.Specifically, optics sealing cover 18 can be formed by encapsulating injection molding and forming technology, light
Sealing cover 18 may be used transparent thermosetting epoxy resin and be made, and to be not easy to soften in use, optics sealing cover 18 can be consolidated
The position of fixed first infrared light supply 12 and the second infrared light supply 13, and the first infrared light supply 12 and the second infrared light supply 13 are existed
It is not easy to shake in encapsulating housing 11.
It please refers to Fig.1 and Figure 11, in some embodiments, light transmission entity area 91 includes image pixel, electronic device 100
Further include processor 96, optical flame detector 52 receives the light that is incident on optical flame detector 52 to export including outside electronic device 100
The initial beam intensity of environmental light intensity information.Processor 96 is only included with obtaining outside electronic device 100 for handling initial beam intensity
The target light intensity of environmental light intensity information.
Specifically, light transmission entity area 91 includes image pixel, and light transmission entity area 91 can be used for showing image information, meanwhile,
Ambient light can be from light transmission entity area 91 across and into electronic device 100.In some embodiments, light transmission entity area 91
Light transmittance can be more than or equal to 50%.It is appreciated that the light being incident on optical flame detector 52 had both included across light transmission entity area 91
Ambient light part, and include the image pixel in light transmission entity area 91 when showing content to the inside of electronic device 100
The part of the display light of transmitting.Processor 96 can determine that optical flame detector 52 receives according to the content that light transmission entity area 91 is shown
The display light that emits to optical flame detector 52 of light transmission entity area 91, so as to which processor 96 can be according to initial beam intensity and optical flame detector
52 receive the target light that the light intensity that display light generates determines to only include the environmental light intensity information outside electronic device 100 jointly
By force.The electronic device 100 of present embodiment can obtain the environmental light intensity information outside electronic device 100, to be shown as control
The foundation of the display brightness of display screen 90.
Referring to Fig. 1, in some embodiments, initial beam intensity includes environmental light intensity information and display screen 90 shows image
When the display intensity signal that receives of optical flame detector 52, processor 96 for obtaining optical flame detector 52 when display screen 90 shows image in real time
The display intensity signal received, and removal shows intensity signal to obtain target light intensity when handling initial beam intensity.
5 are please referred to Fig.1, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Cover board sound outlet hole 35 is offered, receiver 70 is corresponding with the position of cover board sound outlet hole 35 and casing sound outlet hole.Export module 10, red
The center of outer light video camera head 62 and visible image capturing head 61 is located on same line segment, and receiver 70 is located at the line segment and casing 20
Between top 21.
The center of receiver 70 is not located on the line segment, and it is (output module 10, red to have saved each electronic component on cover board 30
Outer light video camera head 62, visible image capturing head 61 etc.) occupy horizontal space.In embodiment as shown in figure 15, cover board goes out sound
Hole 35 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
6 are please referred to Fig.1, the infrared through-hole 33 of cover board can also be offered in some embodiments, on cover board 30, cover board is red
The through-hole 23 infrared with casing of accessibke porosity 33 is corresponding, and the infrared light of the first infrared light supply 12 and/or the transmitting of the second infrared light supply 13 is worn
Electronic device 100 can be pierced by after crossing the infrared through-hole 23 of casing from the infrared through-hole 33 of cover board.At this point, on cover board 30 with casing knot
24 corresponding position of structure light through-hole can set infrared transmission ink 40, and user is difficult to see electricity by casing structure light through-hole 24
The structured light projector 14 of the inside of sub-device 100, the shape of electronic device 100 are more beautiful.
7 are please referred to Fig.1, covering plate structure light through-hole 34, cover board knot can also be opened up in some embodiments, on cover board 30
Structure light through-hole 34 is corresponding with casing structure light through-hole 24, and the infrared light that structured light projector 14 emits passes through casing structure light through-hole
Electronic device 100 can be pierced by after 24 from covering plate structure light through-hole 34.At this point, through-hole 23 infrared with casing is corresponding on cover board 30
Position can set it is infrared penetrate ink 40, user is difficult to see by the infrared through-hole 23 of casing the inside of electronic device 100
The first infrared light supply 12 and the second infrared light supply 13, the shape of electronic device 100 it is more beautiful.
8 are please referred to Fig.1, in some embodiments, proximity sensor 51 can be arranged on package substrate 111.Specifically
Ground, a part for package substrate 111 are used for bearing structure light projector 14, the first infrared light supply 12 and the second infrared light supply 13,
It is corresponding with the space that package wall 112 surrounds in other words；Another part of package substrate 111 is protruding, proximity sensor 51
It can be fixed on package substrate 111 and outside encapsulating housing 11.On package substrate 111 can laying-out, circuit can be
Structured light projector 14, the control of the first infrared light supply 12 and the second infrared light supply 13 and driver circuit, in one example, line
Road is the form of FPC, and FPC can be connect with proximity sensor 51 simultaneously, for the control of simultaneous transmission proximity sensor 51
And drive signal.
9 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on
On substrate 66, proximity sensor 51 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, the one of substrate 66
Part is located in microscope base 63, and another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and for carrying image biography
Sensor 65, the other end can be connect with the mainboard of electronic device 100.When proximity sensor 51 is arranged on substrate 66, close to biography
Sensor 51 is arranged on outside microscope base 63, and proximity sensor 51 can also be connect with FPC.
Imaging modules 60 can be visible image capturing head 61 and one or two in infrared pick-up head 62.Specifically,
Proximity sensor 51 can be fixed on the substrate 66 of visible image capturing head 61；Proximity sensor 51 can be fixed on infrared light and take the photograph
As first 62 substrate 66 on.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with proximity sensor 51, to increase
Add the integral strength of substrate 66 so that FPC is not susceptible to around folding, while when proximity sensor 51 is arranged on substrate 66 is not easy to send out
It is raw to shake.In one example, proximity sensor 51 may be also secured on the lateral wall of microscope base 63, such as pass through cohesive side
Formula is fixed on the lateral wall of microscope base 63.
Figure 20 is please referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67
Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- top surface 672 and the sub- top surface 673 of third, the second son top
672 and first sub- top surface 671 of face tilts connection and forms notch 675, the sub- top surface 673 and second of third with the first sub- top surface 671
Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- top surface 671 and the sub- top surface 673 of third to connect first
Sub- top surface 671 and the sub- top surface 673 of third.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight
Angle, the angle between the second sub- top surface 672 and the sub- top surface 673 of third can be obtuse angle or right angle.Notch 675 is opened in camera shell
On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.The sub- top surface 673 of third offers out
Light through-hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through-hole 674.Imaging sensor 65 is housed in
In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens mould
Group 68 is simultaneously transmitted on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Proximity sensor 51 is set
At the first sub- top surface 671.In present embodiment, imaging modules 60 can be visible image capturing head 61.In other embodiment
In, imaging modules 60 can be infrared pick-up head 62.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 51 is arranged on the first son and is pushed up
On face 671, proximity sensor 51 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, section
Installation space about in electronic device 100.
Please continue to refer to Figure 20, in some embodiments, the proximity sensor 51 of the above embodiment is arranged on first
On sub- top surface 671 and positioned at the outside of camera case 67, specifically, entire proximity sensor 51 is along perpendicular to the first sub- top surface
671 projection can be located in the first sub- top surface 671 (as shown in figure 20)；Alternatively, part proximity sensor 51 along perpendicular to
The projection of first sub- top surface 671 is located in the first sub- top surface 671.It is located at that is, proximity sensor 51 is at least part of
The surface of first sub- top surface 671, in this way, proximity sensor 51 sets compacter with imaging modules 60, the two occupies jointly
Horizontal space it is smaller, further save the installation space in electronic device 100.
Figure 21 is please referred to, the first sub- top surface 671 of the above embodiment offers loophole 676, proximity sensor 51
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and transmit
Onto proximity sensor 51.The proximity sensor 51 of present embodiment is arranged in camera case 67, make proximity sensor 51 with
The structure of camera case 67 is more stablized and convenient for proximity sensor 51 and imaging modules 60 is installed on casing 20.
Figure 22 is please referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, proximity sensor 51 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image
Sensor 65 is arranged on substrate 66, and proximity sensor 51 may be also secured on substrate 66 and be housed in camera case 67.
Specifically, FPC is provided on substrate 66, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, another
End can be connect with the mainboard of electronic device 100.In other embodiments, proximity sensor 51 can also be connect with FPC.
The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and camera case 67
Structure more stablize and convenient for proximity sensor 51 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60
Proximity sensor 51 is simultaneously arranged on substrate 66 by setting substrate 66, and proximity sensor 51 is enable to be firmly mounted to camera shell
In body 67.
Figure 23 is please referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds
Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677
678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread
Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with
With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677
Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle.
Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two
A light extraction through-hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through-holes 674
Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions
Through-hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68,
Light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens module 68 and be transmitted on imaging sensor 65.This reality
It applies in mode, imaging modules 60 can be visible image capturing head 61, and two camera lens modules 68 are visible image capturing head 61 at this time
Corresponding camera lens module.Proximity sensor 51 is arranged on the second tread 678 and outside camera case 67.In other embodiment party
In formula, imaging modules 60 can be infrared pick-up head 62, and two camera lens modules 68 are that infrared pick-up head 62 corresponds at this time
Camera lens module.In yet another embodiment, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, at this time
Wherein camera lens module 68 is 62 corresponding camera lens module of infrared pick-up head, another camera lens module 68 is visible image capturing head 61
Corresponding camera lens module.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 51 is arranged on the second tread
On 678, proximity sensor 51 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves
Installation space in electronic device 100.
Figure 24 is please referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670
On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread
The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through-holes 674 are opened in the first son respectively
On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675
Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face
679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678,
Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second
Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first
The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment
In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second
Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in
The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating proximity sensor 51 is arranged on the second tread
On 678.
Figure 23 and Figure 24 is please referred to, in some embodiments, the proximity sensor 51 of the above embodiment is arranged on
On two treads 678 and positioned at the outside of camera case 67.Specifically, when notch 675 is opened in the marginal position of top surface 670,
Entire proximity sensor 51 can be located in the second tread 678 (as shown in figure 23) along perpendicular to the projection of the second tread 678；
Alternatively, part proximity sensor 51 is located at along the projection perpendicular to the second tread 678 in the second tread 678.It is that is, close
At least part of surface for being located at the second tread 678 of sensor 51.When notch 675 is opened in the centre position of top surface 670
When upper, entire proximity sensor 51 can be located at (such as Figure 24 in the second tread 678 along perpendicular to the projection of the second tread 678
It is shown).In this way, proximity sensor 51 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, into
One step has saved the installation space in electronic device 100.
Figure 25 is please referred to, the second tread 678 of the above embodiment offers loophole 676, and proximity sensor 51 is located at
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be transmitted to
On proximity sensor 51.The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and phase
The structure of casing body 67 is more stablized and convenient for proximity sensor 51 and imaging modules 60 is installed on casing 20.
Figure 26 is please referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676,
Proximity sensor 51 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image sensing
Device 65 is arranged on substrate 66, and proximity sensor 51 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connect with the mainboard with electronic device 100.In other embodiments, proximity sensor 51 can also be connect with FPC.
The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and camera case 67
Structure more stablize and convenient for proximity sensor 51 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60
Proximity sensor 51 is simultaneously arranged on substrate 66 by setting substrate 66, and proximity sensor 51 is enable to be firmly mounted to camera shell
In body 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (13)
1. a kind of electronic device, which is characterized in that including：
Casing；
Module is exported, on the housing, the output module includes encapsulating housing, project structured light for the output module installation
Device, the first infrared light supply and the second infrared light supply around first infrared light supply setting, the encapsulating housing include encapsulation
Substrate, the structured light projector, first infrared light supply and second infrared light supply are encapsulated in the encapsulating housing
And carry on the package substrate, when second infrared light supply is closed, first infrared light supply is with the first power to institute
When stating transmitting infrared light outside encapsulating housing, the output module is used for infrared distance measurement；When first infrared light supply with it is described
When second infrared light supply is opened and emitted infrared light outside the encapsulating housing with the second power, the output module is used for
Infrared light filling；
Display screen, on the housing, the display screen is formed with light transmission entity area and including that can show for the display screen setting
Show the front of picture and the back side opposite with the front；With
Optical flame detector, the optical flame detector are arranged on the side where the back side of the display screen, the optical flame detector with it is described
Light entity area corresponds to, and the optical flame detector is used to receive the light being incident on the optical flame detector and the target light for exporting the light
By force.
2. electronic device according to claim 1, which is characterized in that
First infrared light supply is point light source, and second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is point light source, and second infrared light supply is annular light source；Or
For first infrared light supply to be multiple around the point light source circularized, second infrared light supply is annular light source；Or
First infrared light supply is multiple around the point light source circularized, and second infrared light supply is point light source and quantity is
It is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is annular light source.
3. electronic device according to claim 1, which is characterized in that the output module further includes chip, the structure
Light projector, first infrared light supply and second infrared light supply are formed on a piece of chip.
4. electronic device according to claim 3, which is characterized in that the encapsulating housing further includes package wall and encapsulation
Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute
It states encapsulation top and is formed with the first light-emitting window and the second light-emitting window, first light-emitting window and first infrared light supply
Corresponding with second infrared light supply, second light-emitting window is corresponding with the structured light projector.
5. electronic device according to claim 3, which is characterized in that the output module further includes lens, the lens
It is arranged in the encapsulating housing and corresponding with first infrared light supply and second infrared light supply.
6. electronic device according to claim 1, which is characterized in that the output module is further included to be made of translucent material
Optics sealing cover, the optics sealing cover formed on the package substrate and in the encapsulating housing, the optics sealing cover
Wrap first infrared light supply and second infrared light supply.
7. electronic device according to claim 1, which is characterized in that the output module further includes metal shutter, institute
It states metal shutter to be located in the encapsulating housing, first infrared light supply and second infrared light supply are located at the metal
The side of shutter, the structured light projector are located at the opposite side of the metal shutter.
8. electronic device according to claim 1, which is characterized in that the electronic device further includes the cover board of light transmission, institute
It states casing and offers the infrared through-hole of casing and casing structure light through-hole, first infrared light supply and second infrared light supply are equal
Corresponding with the infrared through-hole of the casing, the structured light projector is corresponding with the casing structure light through-hole, the cover board setting
On the housing.
9. electronic device according to claim 8, which is characterized in that the cover board is formed with the surface that the casing is combined
Have and only transmit the infrared through ink of infrared light, the infrared ink that penetrates blocks the infrared through-hole of the casing and the casing knot
At least one of structure light through-hole.
10. electronic device according to claim 1, which is characterized in that the electronic device further include proximity sensor and
Imaging modules, the imaging modules include microscope base, the lens barrel on the microscope base and the image being housed in the microscope base
Sensor, the microscope base include the mounting surface between the lens barrel and described image sensor, and the proximity sensor is set
It puts on the mounting surface.
11. electronic device according to claim 10, which is characterized in that the imaging modules include visible image capturing head and
At least one of infrared pick-up head.
12. electronic device according to claim 1, which is characterized in that the light transmission entity area includes image pixel, described
Electronic device further includes processor, and the optical flame detector receives the light to export the ambient light for including the external electronic device
The initial beam intensity of strong information；The processor only includes the external electronic device for handling the initial beam intensity to obtain
The target light intensity of the environmental light intensity information.
13. electronic device according to claim 12, which is characterized in that the initial beam intensity is believed including the environmental light intensity
Breath and the display screen show display intensity signal during image, and the processor is used to obtain the display screen display figure in real time
As when display intensity signal, and remove when handling the initial beam intensity display intensity signal to obtain the target light
By force.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109120758A (en) * | 2018-10-09 | 2019-01-01 | Oppo广东移动通信有限公司 | Light emitters, flight time mould group and electronic equipment |
| CN109451107A (en) * | 2018-11-16 | 2019-03-08 | Oppo广东移动通信有限公司 | Electronic device |
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Application publication date: 20180612 |