CN108055370A - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
CN108055370A
CN108055370A CN201711437459.8A CN201711437459A CN108055370A CN 108055370 A CN108055370 A CN 108055370A CN 201711437459 A CN201711437459 A CN 201711437459A CN 108055370 A CN108055370 A CN 108055370A
Authority
CN
China
Prior art keywords
infrared light
infrared
light supply
casing
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711437459.8A
Other languages
Chinese (zh)
Inventor
吴安平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201711437459.8A priority Critical patent/CN108055370A/en
Publication of CN108055370A publication Critical patent/CN108055370A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/33—Transforming infrared radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Studio Devices (AREA)

Abstract

The invention discloses a kind of electronic devices.Electronic device includes casing, output module, vibration module and piezoelectric element.Exporting module includes encapsulating housing, structured light projector, the first infrared light supply and the second infrared light supply set around the first infrared light supply.Encapsulating housing includes package substrate, and structured light projector, the first infrared light supply and the second infrared light supply are encapsulated in encapsulating housing and are carried on package substrate.When the second infrared light supply is closed, and the first infrared light supply emit outside encapsulating housing infrared light with the first power, output module is for infrared distance measurement.When the first infrared light supply and the second infrared light supply are opened and emit infrared light outside encapsulating housing with the second power, output module is used for infrared light filling.Module is vibrated to be mounted on casing.Piezoelectric element is combined with vibration module and with exporting module interval, and piezoelectric element vibrates for being deformed upon when being applied in electric signal so as to vibrate module.It is higher to export module integrated level, small volume.

Description

Electronic device
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, the type and quantity for the function element that mobile phone needs are set It is more and more, in order to realize distance detection, ambient light detection with the functions such as the facial 3D feature recognitions of user, it is necessary to be set in electronics The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth Numerous function elements is put, the excessive space of mobile phone can be occupied.
The content of the invention
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Module is exported, the output module is mounted in the casing, and the output module includes encapsulating housing, structure light The projector, the first infrared light supply and the second infrared light supply set around first infrared light supply, the encapsulating housing include Package substrate, the structured light projector, first infrared light supply and second infrared light supply are encapsulated in the encapsulating shell It in vivo and carries on the package substrate, when second infrared light supply is closed, first infrared light supply is with the first power When emitting infrared light outside the encapsulating housing, the output module is used for infrared distance measurement；When first infrared light supply with When second infrared light supply is opened and is emitted infrared light outside the encapsulating housing with the second power, the output module For infrared light filling；
Module is vibrated, the vibration module installation is on the housing；With
Piezoelectric element, the piezoelectric element are combined with the vibration module and export module interval, the piezoelectricity with described Element is used to deform upon when being applied in electric signal so that the vibration module vibration.
In some embodiments, the vibration module includes display screen and the cover board of light transmission, the display screen are arranged on Host cavity is collectively formed on the casing and with the casing, the cover board is with reference on the housing and positioned at the display screen The one side away from the host cavity, the display screen combined with the cover board, and the casing offers spaced casing Infrared through hole, casing structure light through hole and casing vibration through hole, first infrared light supply and second infrared light supply with The infrared through hole of casing corresponds to, and the structured light projector is corresponding with the casing structure light through hole, and the piezoelectric element is received Hold in casing vibration through hole and combined with the cover board.
In some embodiments, the piezoelectric element and the display screen are attached to by fastener on the cover board.
In some embodiments, first infrared light supply is point light source, second infrared light supply for point light source and Quantity is multiple；Or
First infrared light supply is point light source, and second infrared light supply is annular light source；Or
For first infrared light supply to be multiple around the point light source circularized, second infrared light supply is annular light source； Or
For first infrared light supply to be multiple around the point light source circularized, second infrared light supply is point light source and number It measures to be multiple；Or
First infrared light supply is annular light source；Second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is annular light source.
In some embodiments, the output module further includes chip, the structured light projector, described first infrared Light source and second infrared light supply are formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly The package substrate extends and is connected at the top of the encapsulation between the package substrate, and first is formed at the top of the encapsulation Light-emitting window and the second light-emitting window, first light-emitting window and first infrared light supply and second infrared light supply pair Should, second light-emitting window is corresponding with the structured light projector.
In some embodiments, the output module further includes lens, and the lens are arranged in the encapsulating housing It is and corresponding with first infrared light supply and second infrared light supply.
In some embodiments, the output module further includes the optics sealing cover made of light transmissive material, the optics Sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps first infrared light Source and second infrared light supply.
In some embodiments, the output module further includes metal shutter, and the metal shutter is located at described In encapsulating housing, first infrared light supply and second infrared light supply are located at the one side of the metal shutter, the knot Structure light projector is located at the opposite side of the metal shutter.
In some embodiments, the cover board is formed with the surface that the casing is combined and only transmits the infrared of infrared light Through ink, the infrared transmission ink blocks the infrared through hole of the casing, the casing structure light through hole and the casing and shakes It is at least one in dynamic through hole.
In some embodiments, the electronic device further includes receiving module and imaging modules, the receiving module collection Into having proximity sensor and optical flame detector, the imaging modules include microscope base, the lens barrel on the microscope base and are housed in institute The imaging sensor in microscope base is stated, the microscope base includes the mounting surface between the lens barrel and described image sensor, institute It states receiving module and is arranged on the mounting surface.
In some embodiments, the electronic device further includes proximity sensor, optical flame detector and imaging modules, described Imaging modules include microscope base, the lens barrel on the microscope base and the imaging sensor being housed in the microscope base, the mirror Seat includes mounting surface positioned at the lens barrel and described image sensor between, in the proximity sensor and the optical flame detector It is at least one to be arranged on the mounting surface.
In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head Kind.
In some embodiments, the electronic device further includes infrared pick-up head and visible image capturing head, described defeated The center for going out module, the infrared pick-up head and the visible image capturing head is located on same line segment, the piezoelectric element position Between the top of the line segment and the casing.
In some embodiments, the electronic device further includes infrared pick-up head and visible image capturing head, the pressure The quantity of electric device is multiple, and the quantity of the casing vibration through hole is multiple, multiple piezoelectric elements and multiple machines Shell vibration through hole corresponds to, and each piezoelectric element is housed in the corresponding casing vibration through hole, the output module, institute The center for stating infrared pick-up head, the visible image capturing head and multiple piezoelectric elements is located on same line segment, and adjacent two It is provided between a piezoelectric element in the output module, the infrared pick-up head and the visible image capturing head extremely It is one few.
In some embodiments, the electronic device further includes infrared pick-up head and visible image capturing head, the pressure Electric device includes piezoelectric body and the piezoelectricity convex block stretched out from the piezoelectric body, and the quantity of the casing vibration through hole is more A, multiple piezoelectricity convex blocks are corresponding with multiple casing vibration through holes, and each piezoelectricity convex portion is housed in correspondence Casing vibration through hole in and is combined with the cover board, it is described to export module, the infrared pick-up head and described visible Light video camera head is the output module, the infrared pick-up head, described visible between the cover board and the piezoelectric body The center of light video camera head and multiple piezoelectricity convex blocks is located on same line segment, is provided between the two neighboring piezoelectricity convex block It is at least one in the output module, the infrared pick-up head and the visible image capturing head.
When the electronic device of embodiment of the present invention only opens the first infrared light supply, available for infrared distance measurement, open simultaneously When the first infrared light supply and the second infrared light supply, available for infrared light filling, and structured light projector is combined, export module group Transmitting infrared light is with the function of infrared distance measurement, infrared light filling and three-dimensional imaging, and therefore, it is higher to export the integrated level of module, body Product is smaller, and output module has saved the space for the function of realizing infrared distance measurement, infrared light filling and three-dimensional imaging.Further, since knot Structure light projector, the first infrared light supply and the second infrared light supply are carried on same package substrate, compared to traditional handicraft Structured light projector needs to be respectively adopted different wafers manufacture recombinants to PCB substrate close to infrared lamp, infrared light compensating lamp Encapsulation, improves packaging efficiency.Further more, electronic device realizes that osteoacusis is transaudient using piezoelectric element and vibration module, instead of On the one hand the privacy of dialog context is effectively ensured in traditional telephone receiver structure by air transmitted sound, on the other hand, due to taking Disappeared the receiver of script, avoids and opens up through hole corresponding with receiver on the cover board, simpler in technique, in appearance also more For beauty.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change It obtains substantially and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 3 and Fig. 4 is the view of the output module of the electronic device of embodiment of the present invention；
Fig. 5 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Fig. 6 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 7 to Fig. 9 is the distribution of the first infrared light supply and the second infrared light supply of the output module of embodiment of the present invention Schematic diagram；
Figure 10 is schematic cross-section of the electronic device along X-X lines in Fig. 1；
Figure 11 is the partial sectional schematic view that intercepts of the electronic device in Fig. 1 along XI-XI lines；
Figure 12 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 13 is the electronic component of the electronic device of embodiment of the present invention and the arrangement schematic diagram of piezoelectric element；
Figure 14 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 15 and Figure 16 is the arrangement signal of the electronic component and piezoelectric element of the electronic device of embodiment of the present invention Figure；
Figure 17 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 18 is schematic cross-section of the electronic device along XVIII-XVIII lines in Figure 17；
Figure 19 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Figure 20 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 21 and Figure 22 is that the electronic device edge of embodiment of the present invention is intercepted with XXI-XXI lines correspondence position in Fig. 1 Partial sectional schematic view；
Figure 23 to Figure 31 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing To the same or similar element of expression eventually or there is same or like element.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's Embodiment, and be not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature It is that the first and second features contact directly or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, electronic component, vibration module 30a and piezoelectric element 70.Electronic component includes output module 10, receiving module 50 (such as Figure 12) and imaging modules 60 (as schemed 12).Electronic device 100 can be mobile phone, tablet computer, laptop, smartwatch, Intelligent bracelet, automatic teller machine etc., this hair Bright embodiment is illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the concrete form of electronic device 100 can be Other, this is not restricted.
Fig. 2 and Fig. 5 are referred to, output module 10 is single package body structure, including encapsulating housing 11, the first infrared light supply 12nd, the second infrared light supply 13 and structured light projector 14.
Encapsulating housing 11 is used to encapsulate the first infrared light supply 12, the second infrared light supply 13 and structured light projector 14 simultaneously, In other words, the first infrared light supply 12, the second infrared light supply 13 and structured light projector 14 are encapsulated in encapsulating housing 11 simultaneously.Envelope Filling housing 11 includes package substrate 111, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference (Electromagnetic Interference, EMI) shielding material is made, to avoid extraneous electromagnetic interference to exporting module 10 have an impact.
Incorporated by reference to Fig. 5, package substrate 111 is thrown for carrying the first infrared light supply 12, the second infrared light supply 13 and structure light Emitter 14.When manufacture exports module 10, the first infrared light supply 12, the second infrared light supply 13 and structured light projector 14 can be with shapes It is set along on chip 15, then by the first infrared light supply 12, the second infrared light supply 13, structured light projector 14 and chip 15 On package substrate 111, specifically, chip 15 can be bonded on package substrate 111.Meanwhile package substrate 111 can also It is connected for other parts (such as the casing 20 of electronic device 100, mainboard etc.) with electronic device 100, mould will be exported Group 10 is fixed in electronic device 100.
Package wall 112 can be set around the first infrared light supply 12, the second infrared light supply 13 and structured light projector 14, Package wall 112 extends from package substrate 111, and package wall 112 can be combined with package substrate 111, it is preferred that package wall 112 with package substrate 111 to be detachably connected, it is red to the first infrared light supply 12, second after package wall 112 in order to remove Outer light source 13 and structured light projector 14 are overhauled.The making material of package wall 112 can be the material of impermeable infrared light, Package wall is passed through to avoid the infrared light that the first infrared light supply 12, the second infrared light supply 13 or structured light projector 14 are sent 112。
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113 It is formed with the first light-emitting window 1131 and the second light-emitting window 1132, the first light-emitting window 1131 and the first infrared light supply 12 and Two infrared light supplies 13 correspond to, and the infrared light of the first infrared light supply 12 and the transmitting of the second infrared light supply 13 is from the first light-emitting window 1131 It is pierced by；Second light-emitting window 1132 is corresponding with structured light projector 14, the structure light (infrared light) that structured light projector 14 emits It is pierced by from the second light-emitting window 1132.Encapsulation top 113 integrally formed can be obtained with package wall 112, can also split into Shape obtains.In one example, the first light-emitting window 1131 and the second light-emitting window 1132 are through hole, encapsulate the system at top 113 Make the material that material is impermeable infrared light.In another example, encapsulation 113 materials by impermeable infrared light of top and saturating infrared light Material co-manufactured form, specifically, the first light-emitting window 1131 and the second light-emitting window 1132 by saturating infrared light material It being made, remaining position is made of the material of impermeable infrared light, further, the first light-emitting window 1131 and the second light-emitting window 1132 could be formed with lens arrangement, to improve the infrared light projected from the first light-emitting window 1131 and the second light-emitting window 1132 Launch angle, such as the second light-emitting window 1132 are formed with concavees lens structure, so that the light through the second light-emitting window 1132 Diverging is outwards projected；First light-emitting window 1131 is formed with convex lens structures, so that the light through the first light-emitting window 1131 Gather outside injection.
Referring to Fig. 5, the first infrared light supply 12 and the second infrared light supply 13 can be formed on a piece of chip 15, further Reduce the first infrared light supply 12 and the second infrared light supply 13 it is integrated after volume, and preparation process is simpler.First infrared light supply 12 and second infrared light supply 13 can emit infrared light.When the first infrared light supply 12 and the second infrared light supply 13 are opened and to encapsulation When emitting infrared light outside housing 11 (as shown in Figure 3), infrared light passes through the first light-emitting window 1131 to project body surface, The infrared pick-up first 62 of electronic device 100 is (as shown in Figure 1) to receive the infrared light that is reflected by the object to obtain the image of object Information, at this point, output module 10 is used as infrared light compensating lamp (i.e. for infrared light filling), and the first infrared light supply 12 and second is infrared The light-emitting area that the infrared light for light filling that light source 13 emits jointly covers is larger, and the field angle α of light filling infrared light can be 60 degree of -90 degree, such as：The field angle α of light filling infrared light for 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 Degree or 90 degree etc..When the second infrared light supply 13 is closed, and the first infrared light supply 12 emits infrared light outside encapsulating housing 11 (as shown in Figure 4), infrared light is through the first light-emitting window 1131 and reaches body surface, the proximity sensor of electronic device 100 51 distances (as shown in figure 12) for receiving the infrared light being reflected by the object with detection object to electronic device 100, at this point, output mould Group 10 is used for close to infrared distance measurement, and the light-emitting area that the infrared light for infrared distance measurement of the first infrared light supply 12 transmitting covers Smaller, the field angle β of infrared distance measurement infrared light is 10 degree of -30 degree, such as：The field angle β of infrared distance measurement infrared light is 10 Degree, 15 degree, 20 degree, 25 degree or 30 degree etc..In an embodiment of the present invention, field angle refers to that infrared light passes through the first light extraction The scope that window 1131 is covered from the outgoing of encapsulating housing 11.
It exports when module 10 is used for infrared light filling and can be with different power to encapsulating shell during for approaching infrared distance measurement Emit infrared light outside body 11.Output module 10 is used for red close to being emitted during infrared distance measurement with the first power outside encapsulating housing 11 UV light emits infrared light with the second power when output module 10 is used for infrared light filling outside encapsulating housing 11, wherein, first Power can be less than second power.
Second infrared light supply 13 is set around the first infrared light supply 12.First infrared light supply 12 and the second infrared light supply 13 are whole Circular, annular, square or regular polygon etc. can be rendered as on body.Can be：First infrared light supply 12 is point light source, and second is red Outer light source 13 is also point light source and quantity is multiple (as shown in Figure 7)；Or first infrared light supply 12 be point light source, second is infrared Light source 13 is annular light source (as shown in Figure 8)；Or first infrared light supply 12 to be multiple red around the point light source circularized, second Outer light source 13 is annular light source；Or first infrared light supply 12 to be multiple around the point light source circularized, the second infrared light supply 13 It is multiple (as shown in Figure 9) for point light source and quantity；Or first infrared light supply 12 be annular light source；Second infrared light supply 13 is Point light source and quantity are multiple；Or first infrared light supply 12 be annular light source；Second infrared light supply 13 is annular light source.
Referring to Fig. 5,14 and first infrared light supply 12 of structured light projector and the second infrared light supply 13 can be formed in one On piece chip 15, the body after further reduction 14 and first infrared light supply 12 of structured light projector and the second infrared light supply 13 are integrated Product, and preparation process is simpler.Structured light projector 14 outwards emitting structural light, structure light can form infrared laser speckle pattern Case, project structured light to target object surface are modulated by target object by the acquisition (as shown in Figure 1) of infrared pick-up first 62 Structured light patterns calculate the depth image for obtaining target object (at this point, knot by the way that the structured light patterns modulated are carried out with analysis Structure light projector 14 is used for three-dimensional imaging).In embodiments of the present invention, structured light projector 14 includes projector light source 141, mirror Frame 142, projector lens 143 and diffraction optical element (diffractive optical elements, DOE) 144.The projector The light beam that light source 141 is sent is expanded by diffraction optical element 144 after projector lens 143 are collimated or converged and with certain light Beam pattern outwards emits.Specifically, projector light source 141 can be formed on chip 15, projector lens 143 and diffraction optics Element 144 can be fixed on mirror holder 1422, such as is fixed on by way of gluing on mirror holder 142.
First infrared light supply 12, the second infrared light supply 13 and structured light projector 14 can be with different power to encapsulation Emit infrared light outside housing 11, specifically, 14 and first infrared light supply 12 of structured light projector can emit infrared light simultaneously Line and the second infrared light supply 13 do not emit light, and output module 10 is simultaneously for three-dimensional imaging and infrared distance measurement；It can also structure Light projector 14 emits light and the first infrared light supply 12 and the second infrared light supply 13 do not emit light, and output module 10 is only used for Three-dimensional imaging；Can also 14 and second infrared light supply 13 of structured light projector do not emit light and the first infrared light supply 12 transmitting light Line, output module 10 are only used for infrared distance measurement；It is red to be that the first infrared light supply 12 emits simultaneously with the second infrared light supply 13 UV light and structured light projector 14 do not emit light, and output module 10 is only used for infrared light filling during infrared imaging.
Incorporated by reference to Fig. 6, in embodiments of the present invention, export be formed on module 10 grounding pin 1a, light compensating lamp pin 1b, Close to lamp pin 1c and structure light pin 1d.Grounding pin 1a, light compensating lamp pin 1b, close to lamp pin 1c and structure light pin 1d can be formed on package substrate 111, when grounding pin 1a and light compensating lamp pin 1b is enabled (that is, grounding pin 1a and When light compensating lamp pin 1b accesses circuit turn-on), the first infrared light supply 12 and the second infrared light supply 13 transmitting infrared light；Work as ground connection Pin 1a and close to lamp pin 1c be enabled when (that is, grounding pin 1a and close to lamp pin 1c access circuit turn-on when), first Infrared light supply 12 emits infrared light.(that is, grounding pin 1a and structure when grounding pin 1a and structure light pin 1d are enabled When light pin 1d accesses circuit turn-on), structured light projector 14 emits infrared light.When grounding pin 1a, close to lamp pin 1c, And structure light pin 1d when being enabled (that is, grounding pin 1a, close to lamp pin 1c and structure light pin 1d access circuit turn-ons When), the first infrared light supply 12 transmitting infrared light while structured light projector 14 emits infrared light.
It please refers to Fig.1 and Figure 11, casing 20 includes top 21 and bottom 22, right with electronic component and piezoelectric element 70 The position answered, casing 20 offer the infrared through hole 23 of casing, casing structure light through hole 24 and casing vibration through hole 2a.Export module 10 when being arranged in casing 20, the first infrared light supply 12 and the second infrared light supply 13 23 corresponding, structure of through hole infrared with casing Light projector 14 is corresponding with casing structure light through hole 24.Wherein the first infrared light supply 12 and the second infrared light supply 13 are red with casing The correspondence of accessibke porosity 23, which refers to the light that the first infrared light supply 12 and/or the second infrared light supply 13 are sent, to be worn from the infrared through hole 23 of casing Cross, specifically, can be the first infrared light supply 12 and the second infrared light supply 13 23 face of through hole infrared with casing or First infrared light supply 12 and the light of the second infrared light supply 13 transmitting pass through the infrared through hole 23 of casing after leaded light device acts on.Knot Structure light projector 14 is corresponding with casing structure light through hole 24 similarly, and therefore not to repeat here.In embodiment as shown in figure 11, machine The infrared through hole 23 of shell can be spaced with casing structure light through hole 24, and certainly, in other embodiments, casing is infrared logical Hole 23 can be interconnected with casing structure light through hole 24.
It please refers to Fig.1 and Figure 10, vibration module 30a is mounted on casing 20.Vibration module 30a may include 90 He of display screen Cover board 30, display screen 90 is combined to form with cover board 30 in other words vibrates module 30a, to promote the rigidity of vibration module 30a.Display Screen 90 is arranged on casing 20 and forms host cavity 91 with casing 20, and cover board 30 is arranged on casing 20 and positioned at display screen 90 One side away from host cavity 91, to protect display screen 90.Due to the output module 10 of embodiment of the present invention can occupy it is smaller Volume, therefore, for setting the volume of display screen 90 that can correspond to increase in casing 20, to improve electronic device 100 Shield accounting.Specifically, display screen 90, output module 10 and piezoelectric element 70 are arranged between top 21 and bottom 22, in user In the state of normal use electronic device 100, top 21 is located at the top of bottom 22, as shown in Figure 1, output module 10 can be set It puts between display screen 90 and top 21.In other embodiments, display screen 90 can be that screen opens up jagged, display comprehensively Screen 90 surrounds output module 10, and exports module 10 and expose from the notch of display screen 90.
0 and Figure 11 are please referred to Fig.1, piezoelectric element 70 is made of ceramics or quartz crystal materials, and piezoelectric element 70 can be Single-chip, twin lamella or the piezoelectric element of lamination 70.Piezoelectric element 70 is combined with vibration module 30a and between output module 10 Every.Specifically, piezoelectric element 70 is housed in casing vibration through hole 2a and is combined with cover board 30, and is spaced with casing 20, can be with It is：70 partial receipt of piezoelectric element is in casing vibration through hole 2a or piezoelectric element 70 is housed in the logical 2a holes of casing vibration completely It is interior.When the both ends of piezoelectric element 70 are applied with electric signal (voltage), due to inverse piezoelectric effect, mechanical shape occurs for piezoelectric element 70 Become, such as expansion or shrinkage, as a result, the vibration module 30a combined with piezoelectric element 70 is driven to be shaken according to the frequency of the electric signal It is dynamic.When the body of user is contacted with vibration module 30a, osteoacusis sound is contacted by the body of user with vibration module 30a Partly (for example, the cartilage of external ear, tooth) is sent to the auditory nerve of user.In this way, user can pass through 70 He of piezoelectric element Vibration module 30a such as realizes voice communication, listens to music at the functions.In embodiments of the present invention, the processor of electronic device 100 is used for Voice signal is obtained, and applies electric signal corresponding with the voice signal at the both ends of piezoelectric element 70.
It is appreciated that traditional telephone receiver structure uses air transmitted sound, part acoustic pressure usually exists when receiver works 90dB~100dB or so, in ambient enviroment quieter (under the working environment as 50dB or so) even if sound is transferred to week It encloses 1 meter of scope and also still remains with 50dB~60dB or so, the chat script between caller is caused to be perceived by surrounding, secret is caused to be let out Dew.The electronic device 100 of embodiment of the present invention realizes that osteoacusis is transaudient using piezoelectric element 70 and vibration module 30a, call Sound be mainly perceived by the user by the osteoacusis vibrated, can effectively ensure that the privacy of dialog context.
Referring to Figure 10 and Figure 11, piezoelectric element 70 and display screen 90 are attached to cover board 30 by fastener 30b On.Fastener 30b is with heat curable properties, the adhesive of UV-curing characteristics, double faced adhesive tape, viscose etc..For example, fastener 30b can be Photoelasticity resin (the UV curable acrylic adhesive of colorless and transparent).Cover board 30 and piezoelectric element 70 combine regions and cover board 30 is combined with display screen 90 it is interregional every, with the display for preventing display screen 90 be subject to piezoelectricity member The interference of part 70.Certainly, cover board 30 can also be bonded to casing 20 by fastener 30b, be set directly at machine compared to cover board 30 On shell 20, the vibration of vibration module 30a can be prevented to be transmitted directly onto casing 20, to reduce user because casing 20 shakes Dynamic amplitude is excessive and the possibility for the electronic device 100 that drops.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated Go out after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 10 In, cover board 30 covers the infrared through hole 23 of casing and casing structure light through hole 24, is coated on the inner surface 32 of cover board 30 infrared Ink 40 is crossed, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and to visible ray There is higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device By the infrared region covered through ink 40 on 100.Specifically, it is infrared to be covered on inner surface 32 not with showing through ink 40 90 corresponding region of display screen.
It is infrared to block the infrared through hole 23 of casing, casing structure light through hole 24 and casing vibration through hole through ink 40 It is at least one in 2a, i.e. infrared to cover the infrared through hole 23 of casing, 24 and of casing structure light through hole simultaneously through ink 40 Casing vibration through hole 2a (as shown in figure 11), user are difficult to through the infrared through hole 23 of casing, casing structure light through hole 24 and casing Vibration through hole 2a sees the internal structure of electronic device 100, and the shape of electronic device 100 is more beautiful；It is infrared to penetrate ink 40 The infrared through hole 23 of casing can be covered, and does not cover casing structure light through hole 24 and casing vibration through hole 2a；Or infrared transmission Ink 40 can also cover casing structure light through hole 24, and not cover the infrared through hole 23 of casing and casing vibration through hole 2a；It is infrared Casing vibration through hole 2a can also be covered through ink 40, and does not cover the infrared through hole 23 of casing and casing structure light through hole 24； It is infrared to cover the infrared through hole 23 of casing through ink 40 and cover casing structure light through hole 24, and casing vibration is not covered Through hole 2a；It is infrared to cover casing structure light through hole 24 and casing vibration through hole 2a through ink 40, and casing is not covered Infrared through hole 23；It is infrared to cover the infrared through hole 23 of casing and casing vibration through hole 2a through ink 40, and machine is not covered Shell structure light through hole 24.
2 are please referred to Fig.1, receiving module 50 is integrated with proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation Single packaging body is collectively formed in device 52.Output module 10 is used for the infrared light sent out during infrared distance measurement, is reflected by external object Afterwards, received by proximity sensor 51, proximity sensor 51 judges foreign objects according to the intensity of the infrared light reflected received The distance between body and electronic device 100.Optical flame detector 52 receives the visible ray in ambient light, and detects the intensity of visible ray, with The foundation of display brightness as control display screen 90.Proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, Reduce gap when the two is individually assembled, save the installation space in electronic device 100.
It please refers to Fig.1 and Figure 12, imaging modules 60 can be visible image capturing first 61 and one in infrared pick-up first 62 It is a or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, image Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, and mounting surface 631 is located at lens barrel 64 and imaging sensor 65 Between.In embodiment as shown in figure 12, receiving module 50 is arranged on mounting surface 631, and specifically, receiving module 50 is being pacified Plane orthographic projection where dress face 631 is at least partly dropped on mounting surface 631, in this way, receiving module 50 and imaging modules 60 Set compacter, the horizontal space that the two occupies jointly is smaller.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, defeated The center for going out module 10, infrared pick-up first 62, visible image capturing first 61 and piezoelectric element 70 is located on same line segment.Specifically Ground, is followed successively by that output module 10, visible image capturing are first 61, infrared pick-up is first 62, piezoelectricity member from one end of line segment to the other end Part 70 (as shown in figure 13)；Or output module 10, piezoelectric element 70, visible ray are followed successively by from one end of line segment to the other end and is taken the photograph As first 61, infrared pick-up first 62 (as shown in Figure 1)；Or visible image capturing head is followed successively by from one end of line segment to the other end 61st, module 10, piezoelectric element 70, infrared pick-up first 62 are exported.Certainly, export that module 10, infrared pick-up be first 62, piezoelectricity member Part 70 and the arrangement mode of visible image capturing first 61 are not limited to above-mentioned citing, can also there is other, such as each electronic component The shapes such as in the arc-shaped, center arrangement is rectangular are arranged with the center of piezoelectric element 70.
4 are please referred to Fig.1, in some embodiments, output module 10, infrared pick-up first 62 and visible image capturing first 61 Center be located on same line segment, piezoelectric element 70 is located between the line segment and the top 21 of casing 20.Specifically, from the line segment One end be followed successively by that output module 10, infrared pick-up be first 62, visible image capturing first 61 to the other end；Or one from the line segment The other end is held to be followed successively by, and output module 10, visible image capturing be first 61, infrared pick-up first 62 (as shown in fig. 14b)；Or from One end of line segment is followed successively by that infrared pick-up is first 62, visible image capturing is first 61, output module 10 to the other end.Certainly, mould is exported Group 10, infrared pick-up are first 62, the arrangement mode of visible image capturing first 61 is not limited to above-mentioned citing.In the embodiment of the present invention In, the center of piezoelectric element 70 is not located on the line segment, saved piezoelectric element 70 and each electronic component (output module 10, Infrared pick-up is first 62, visible image capturing first 61 etc.) horizontal space that occupies.
Further, incorporated by reference to Figure 12, receiving module 50 can be arranged on the mounting surface 631 of infrared pick-up first 62, It can also be arranged on the mounting surface 631 of visible image capturing first 61, certainly, receiving module 50 can not also be arranged on mounting surface On 631, receiving module 50 can be disposed adjacent with output module 10, and proximity sensor 51 is readily received by close to infrared lamp 13 Transmitting, and the infrared light being reflected back by external object；Receiving module 50 can also be disposed adjacent with piezoelectric element 70, not made herein Limitation.
To sum up, when the electronic device 100 of embodiment of the present invention only opens the first infrared light supply 12, available for infrared survey Away from, while when the first infrared light supply 12 of unlatching and the second infrared light supply 13, available for infrared light filling, and combine project structured light Device 14, output module 10 have gathered transmitting infrared light with the function of infrared distance measurement, infrared light filling and three-dimensional imaging, therefore, output The integrated level of module 10 is higher, small volume, and output module 10, which has been saved, realizes infrared distance measurement, infrared light filling and three-dimensional imaging The space of function.Further, since structured light projector 14, the first infrared light supply 12 and the second infrared light supply 13 are carried on an envelope It fills on substrate 111, structured light projector compared to traditional handicraft is respectively adopted not close to infrared lamp, infrared light compensating lamp needs With the encapsulation in wafer manufacture recombinant to PCB substrate, packaging efficiency is improved.Further more, electronic device 100 uses piezoelectric element 70 and vibration module 30a realizes that osteoacusis is transaudient, instead of traditional telephone receiver structure by air transmitted sound, on the one hand, energy The privacy of dialog context is enough effectively ensured；On the other hand, due to eliminating the receiver of script, avoid and opened on cover board 30 It is simpler in technique if through hole corresponding with receiver, it is also more aesthetically pleasing in appearance, and can prevent dust or moisture from entering electricity In sub-device 100.
1 and Figure 15 are please referred to Fig.1, in some embodiments, imaging modules 60 include visible image capturing first 61 and infrared Light video camera head 62.It is logical that casing 20 offers the infrared through hole 23 of spaced casing, casing structure light through hole 24 and casing vibration Hole 2a.First infrared light supply 12 and the second infrared light supply 13 through hole 23 infrared with casing are corresponding, structured light projector 14 and machine Shell structure light through hole 24 corresponds to.The quantity of piezoelectric element 70 is multiple, and the quantity of casing vibration through hole 2a is multiple, multiple piezoelectricity Element 70 is corresponding with multiple casings vibration through hole 2a, and each piezoelectric element 70 is housed in corresponding casing vibration through hole 2a.It is defeated The center for going out module 10, infrared pick-up first 62, visible image capturing first 61 and multiple piezoelectric elements 70 is located on same line segment, phase Be provided between adjacent two piezoelectric elements 70 output module 10, infrared pick-up be first 62, at least one in visible image capturing first 61 It is a.For example, the quantity of piezoelectric element 70 is two, piezoelectric element 70, output module are followed successively by from one end of line segment to the other end 10th, visible image capturing is first 61, infrared pick-up is first 62, piezoelectric element 70 (as shown in figure 15)；Or from one end of line segment to another One end is followed successively by piezoelectric element 70, output module 10, visible image capturing first 61, piezoelectric element 70, infrared pick-up first 62 etc..Again For example, the quantity of piezoelectric element 70 be three, be followed successively by from one end of line segment to the other end piezoelectric element 70, output module 10, Piezoelectric element 70, see light video camera head 61, infrared pick-up it is first 62, can piezoelectric element 70 (as shown in figure 16)；Or from line segment One end to the other end be followed successively by piezoelectric element 70, output module 10, piezoelectric element 70, visible image capturing first 61, piezoelectric element 70, Infrared pick-up first 62 etc..Certainly, the quantity of piezoelectric element 70 and piezoelectric element 70, output module 10, infrared pick-up head 62nd, the arrangement mode of visible image capturing first 61 is not limited to above-mentioned citing.In embodiments of the present invention, multiple piezoelectric elements 70 with Cover board 30 combines, and is in particular that multiple piezoelectric elements 70 are attached to by fastener 30b on cover board 30 respectively.Electronic device 100 Processor for obtaining voice signal, and apply electricity corresponding with the voice signal at the both ends of multiple piezoelectric elements 70 simultaneously Mechanical deformation occurs for signal, multiple piezoelectric elements 70, and multiple piezoelectric elements 70 are multiple and different from being combined with cover board 30 as a result, Position drives vibration module 30a to be vibrated according to the frequency of the electric signal.When the body of user is contacted with vibration module 30a, bone Conduction sound is sent to user's by the body of user with the vibration module 30a parts (for example, the cartilage of external ear, tooth) contacted Auditory nerve.
In embodiments of the present invention, multiple piezoelectric elements 70 drive simultaneously from the multiple and different positions combined with cover board 30 Vibrate module 30a vibration, the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts To the auditory nerve of user.
1, Figure 17 and Figure 18 is please referred to Fig.1, in some embodiments, imaging modules 60 include first 61 He of visible image capturing Infrared pick-up first 62.Casing 20 offers the infrared through hole 23 of spaced casing, casing structure light through hole 24 and casing and shakes Dynamic through hole 2a.First infrared light supply 12 and the second infrared light supply 13 through hole 23 infrared with casing are corresponding, structured light projector 14 It is corresponding with casing structure light through hole 24.Piezoelectric element 70 includes piezoelectric body 71 and the piezoelectricity convex block stretched out from piezoelectric body 71 72, the quantity of piezoelectricity convex block 72 is multiple, and the quantity of casing vibration through hole 2a is multiple, multiple piezoelectricity convex blocks 72 and multiple casings It vibrates through hole 2a to correspond to, each 72 partial receipt of piezoelectricity convex block is combined in corresponding casing vibration through hole 2a and with cover board 30. Module 10, infrared pick-up first 62 and visible image capturing first 61 are exported between cover board 30 and piezoelectric body 71.Export module 10th, infrared pick-up is first 62, the center of visible image capturing first 61 and multiple piezoelectricity convex blocks 72 is located on same line segment, two neighboring It is provided between piezoelectricity convex block 72 at least one in output module 10, infrared pick-up first 62 and visible image capturing first 61.Example Such as, the quantity of piezoelectricity convex block 72 be two, be followed successively by from one end of line segment to the other end piezoelectricity convex block 72, output module 10, can See that light video camera head 61, infrared pick-up be first 62, piezoelectricity convex block 72；Or piezoelectricity convex block is followed successively by from one end of line segment to the other end 72nd, first 61, infrared pick-up first 62 of module 10, piezoelectricity convex block 72, visible image capturing etc. is exported.In another example piezoelectricity convex block 72 Quantity is three, and piezoelectricity convex block 72, output module 10, piezoelectricity convex block 72, visible ray are followed successively by from one end of line segment to the other end Camera 61, infrared pick-up are first 62, piezoelectricity convex block 72；Or be followed successively by from one end of line segment to the other end piezoelectricity convex block 72, Export module 10, piezoelectricity convex block 72, visible image capturing first 61, piezoelectricity convex block 72, infrared pick-up first 62 etc..For another example piezoelectricity The quantity of convex block 72 is four, and piezoelectricity convex block 72, output module 10, piezoelectricity convex block are followed successively by from one end of line segment to the other end 72nd, visible image capturing is first 61, piezoelectricity convex block 72, infrared pick-up are first 62, piezoelectricity convex block 72 (as shown in figure 18).Certainly, piezoelectricity The quantity and piezoelectricity convex block 72 of convex block 72, output module 10, infrared pick-up are first 62, the arrangement mode of visible image capturing first 61 It is not limited to above-mentioned citing.In embodiments of the present invention, multiple piezoelectricity convex blocks 72 are combined with cover board 30, more specifically multiple pressures Electric convex block 72 is attached to by fastener 30b on cover board 30 respectively.The processor of electronic device 100 is used to obtain voice signal, And electric signal corresponding with the voice signal, the pressure including piezoelectric body 71 and piezoelectricity convex block 72 are applied to piezoelectric element 70 Mechanical deformation occurs for electric device 70, and multiple piezoelectricity convex blocks 72 drive vibration from the multiple and different positions combined with cover board 30 as a result, Module 30a is vibrated according to the frequency of the electric signal.When user body with vibration module 30a contact when, osteoacusis sound by using The body at family is sent to the auditory nerve of user with the vibration module 30a parts (for example, the cartilage of external ear, tooth) contacted.
In embodiment as shown in figure 18, casing 20 offers spaced casing vibration through hole 2a, output through hole 25th, infrared light through hole 27, visible ray through hole 28.Casing vibration through hole 2a is corresponding with piezoelectricity convex block 72, output through hole 25 and output Module 10 corresponds to, and infrared light through hole 27 is corresponding with infrared pick-up first 62, it is seen that light through hole 28 is corresponding with visible image capturing first 61. Wherein, through hole 25 is exported alternatively into the infrared through hole 23 of above-mentioned spaced casing and casing structure light through hole 24 or defeated Go out through hole 25 and connected with casing structure light through hole 24 by the infrared through hole 23 of said machine casing to be formed.In addition, infrared light through hole 27 with it is red The outer correspondence of light video camera head 62 refers to infrared pick-up first 62 can receive the infrared light being reflected by the object from infrared light through hole 27, it is seen that light Through hole 28 is corresponding with visible image capturing first 61 refer to visible image capturing first 61 can be received from visible ray through hole 28 be reflected by the object can See light.
In embodiments of the present invention, multiple piezoelectricity convex blocks 72 drive vibration from the multiple and different positions combined with cover board 30 Module 30a vibrates, and the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts to use The auditory nerve at family；In addition, multiple piezoelectricity convex blocks 72 are stretched out from same piezoelectric body 71, convenient for multiple piezoelectricity convex blocks 72 simultaneously Apply electric signal, to be vibrated from multiple and different position synchronous drives vibration module 30a；Further more, output module 10, visible image capturing First 61 and infrared pick-up first 62 between cover board 30 and piezoelectric body 71, and interspersed be provided with piezoelectricity convex block 72, electronics dress It is smaller to put 100 overall volumes, saves space.
Referring to Fig. 5, in some embodiments, output module 10 further includes Infrared Lens 17.Infrared Lens 17 are set It is in encapsulating housing 11 and corresponding with the first infrared light supply 12 and the second infrared light supply 13.First infrared light supply 12 or/and second The infrared light that infrared light supply 13 emits, which is converged under the action of Infrared Lens 17 in first light-emitting window 1131, to be projected, and reduces hair It is mapped to the light quantity in other regions at package wall 112 and encapsulation top 113, it is only necessary to it is red to meet the first infrared light supply 12 and second Field angle α of the infrared light for light filling that outer light source 13 emits jointly after Infrared Lens 17 is 60 degree of -90 degree, and first is red Field angle β of the infrared light for infrared distance measurement that outer light source 12 emits after Infrared Lens 17 is 10 degree of -30 degree.Specifically Ground, Infrared Lens 17 can be located on transparent base, be made more specifically, Infrared Lens 17 can be integrally formed with the transparent base .Certainly, output module 10 can not also set Infrared Lens 17.
Referring to Fig. 5, in some embodiments, output module 10 further includes metal shutter 16, metal shutter 16 In encapsulating housing 11, and metal shutter 16 is located between 14 and second infrared light supply 13 of structured light projector, that is, First infrared light supply 12 and the second infrared light supply 13 are located at the one side of metal shutter 16, and structured light projector 14 is located at metal screening The opposite side of baffle 16.Metal shutter 16 on the one hand can be with 14 and first infrared light supply 12, second of shielding construction light projector Mutual electromagnetic interference between infrared light supply 13, structured light projector 14 and first infrared light supply 12, the second infrared light supply 13 Luminous intensity and sequential will not interact, and another aspect metal shutter 16 can be used for where isolation structures light projector 14 Cavity where cavity and the first infrared light supply 12 and the second infrared light supply 13, light will not enter another from a cavity Cavity.
9 are please referred to Fig.1, in some embodiments, output module 10 further includes optics sealing cover 18.Optics sealing cover 18 is by saturating Luminescent material is made, and optics sealing cover 18 is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 18 wraps One infrared light supply 12 and the second infrared light supply 13.Specifically, optics sealing cover 18 can be formed by encapsulating injection molding and forming technology, light Sealing cover 18 may be employed transparent thermosetting epoxy resin and be made, and to be not easy to soften in use, optics sealing cover 18 can be consolidated The position of fixed first infrared light supply 12 and the second infrared light supply 13, and the first infrared light supply 12 and the second infrared light supply 13 are existed It is not easy to rock in encapsulating housing 11.
Figure 20 is referred to, in some embodiments, proximity sensor 51 can be not integrated in reception mould with optical flame detector 52 In group 50, in other words, proximity sensor 51 is separately set with optical flame detector 52.At this point, proximity sensor 51 can be arranged on microscope base On 63 mounting surface 631；Optical flame detector 52 can also be arranged on the mounting surface 631 of microscope base 63；Or proximity sensor 51 and light Sensor 52 is arranged on the mounting surface 631 of microscope base 63 simultaneously.Microscope base 63 can be the microscope base 63 of infrared pick-up first 62, can also It is the microscope base 63 of visible image capturing first 61.
Figure 21 is referred to, the infrared through hole 33 of cover board can also be offered in some embodiments, on cover board 30, cover board is red The through hole 23 infrared with casing of accessibke porosity 33 is corresponding, and the infrared light of the first infrared light supply 12 and/or the transmitting of the second infrared light supply 13 is worn Electronic device 100 can be pierced by after crossing the infrared through hole 23 of casing from the infrared through hole 33 of cover board.At this point, on cover board 30 with casing knot 24 corresponding position of structure light through hole can set infrared transmission ink 40, and user is difficult to see electricity by casing structure light through hole 24 The structured light projector 14 of the inside of sub-device 100, the shape of electronic device 100 are more beautiful.
Figure 22 is referred to, covering plate structure light through hole 34, cover board knot can also be opened up in some embodiments, on cover board 30 Structure light through hole 34 is corresponding with casing structure light through hole 24, and the infrared light that structured light projector 14 emits passes through casing structure light through hole Electronic device 100 can be pierced by after 24 from covering plate structure light through hole 34.At this point, through hole 23 infrared with casing is corresponding on cover board 30 Position can set it is infrared penetrate ink 40, user is difficult to see by the infrared through hole 23 of casing the inside of electronic device 100 The first infrared light supply 12 and the second infrared light supply 13, the shape of electronic device 100 it is more beautiful.
Figure 23 is referred to, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on On substrate 66, receiving module 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, one of substrate 66 Divide and be located in microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and is used to carry image sensing Device 65, the other end can be connected with the mainboard of electronic device 100.When receiving module 50 is arranged on substrate 66, receiving module 50 It is arranged on outside microscope base 63, receiving module 50 can also be connected with FPC.
Further, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, close to biography Single package body structure is collectively formed with optical flame detector 52 in sensor 51, reduces gap when the two is individually assembled, saves electronic device 100 Interior installation space.In other embodiments, being arranged on the receiving module 50 of substrate 66 includes proximity sensor 51 or/and light Sensor 52, proximity sensor 51 and optical flame detector 52 are respectively single package body structure.That is, the receiving module 50 for being arranged on substrate 66 is The proximity sensor 51 of single package body structure；Alternatively, the receiving module 50 for being arranged on substrate 66 is the light sensation of single package body structure Device 52；Alternatively, the receiving module 50 for being arranged on substrate 66 is the proximity sensor 51 of single package body structure and single package body structure Optical flame detector 52.
Imaging modules 60 can be visible image capturing first 61 and one or two in infrared pick-up first 62.Specifically, Receiving module 50 can be fixed on the substrate 66 of visible image capturing first 61；Receiving module 50 can be fixed on infrared pick-up head On 62 substrate 66.When proximity sensor 51 and optical flame detector 52 encapsulate for split, proximity sensor 51 can be fixed on visible On the substrate 66 of light video camera head 61, optical flame detector 52 can be fixed on the substrate 66 of infrared pick-up first 62；Alternatively, optical flame detector 52 It can be fixed on the substrate 66 of visible image capturing first 61, proximity sensor 51 can be fixed on the substrate of infrared pick-up first 62 On 66；Alternatively, proximity sensor 51 is each attached to optical flame detector 52 on the substrate 66 of visible image capturing first 61；Alternatively, close pass Sensor 51 is each attached to optical flame detector 52 on the substrate 66 of infrared pick-up first 62.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the one side opposite with receiving module 50, to increase The integral strength of substrate 66 so that FPC is not susceptible to around folding, while receiving module 50 (or proximity sensor 51 or optical flame detector 52) It is not susceptible to rock when being arranged on substrate 66.In one example, receiving module 50 (or proximity sensor 51 or optical flame detector 52) it may be also secured on the lateral wall of microscope base 63, such as be fixed on by cohesive mode on the lateral wall of microscope base 63.
Figure 24 is referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67 Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- 672 and the 3rd sub- top surface 673 of top surface, the second son top 672 and first sub- top surface 671 of face tilts connection and forms notch 675, the 3rd sub- top surface 673 and second with the first sub- top surface 671 Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- 671 and the 3rd sub- top surface 673 of top surface to connect first Sub- 671 and the 3rd sub- top surface 673 of top surface.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight Angle, the angle between the second sub- 672 and the 3rd sub- top surface 673 of top surface can be obtuse angle or right angle.Notch 675 is opened in camera shell On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.3rd sub- top surface 673 offers out Light through hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through hole 674.Imaging sensor 65 is housed in In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through hole 674 and camera lens mould Group 68 is simultaneously transferred on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Receiving module 50 is arranged on At first sub- top surface 671, receiving module 50 includes proximity sensor 51 and optical flame detector 52.In present embodiment, imaging modules 60 Can be visible image capturing first 61, receiving module 50 is single packaging body that proximity sensor 51 is collectively formed with optical flame detector 52.It connects Nearly sensor 51 can be consistent with the extending direction of notch 675 (as shown in figure 24) with the center line connecting direction of optical flame detector 52；Or Person, proximity sensor 51 can be vertical with the extending direction of notch 675 or in the two shape with the center line connecting direction of optical flame detector 52 Into angle be acute angle or obtuse angle.In other embodiments, imaging modules 60 can be infrared pick-up first 62.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the first sub- top surface On 671, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves Installation space in electronic device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce The installation space in electronic device 100 is saved in gap when the two is individually assembled.
Please continue to refer to Figure 24, in some embodiments, the receiving module 50 of the above embodiment is arranged on the first son On top surface 671 and positioned at the outside of camera case 67, specifically, entire receiving module 50 is along perpendicular to the first sub- top surface 671 Projection can be located in the first sub- top surface 671 (as shown in figure 24)；Alternatively, part receiving module 50 is pushed up along perpendicular to the first son The projection in face 671 is located in the first sub- top surface 671.That is, receiving module 50 is at least part of to be located at the first sub- top surface 671 surface, in this way, receiving module 50 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly compared with It is small, further save the installation space in electronic device 100.In other embodiments, receiving module 50 is included close to biography Sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two individual single packaging bodies, at this point, being respectively single envelope The proximity sensor 51 and optical flame detector 52 for filling body can also be all disposed on the first sub- top surface 671.
Figure 25 is referred to, in some embodiments, the receiving module 50 of the above embodiment only includes proximity sensor 51, not comprising optical flame detector 52, tied at this point, proximity sensor 51 (or receiving module 50) is respectively monomer encapsulation with optical flame detector 52 Structure, proximity sensor 51 are arranged on the first sub- top surface 671, and optical flame detector 52 is arranged on any other except the first sub- top surface 671 Position.
Please continue to refer to Figure 25, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, and not comprising proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively monomer envelope with proximity sensor 51 Assembling structure, optical flame detector 52 are arranged on the first sub- top surface 671, proximity sensor 51 be arranged on except the first sub- top surface 671 other Any position.
Figure 26 is referred to, the first sub- top surface 671 of the above embodiment offers loophole 676, and receiving module 50 is located at It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without light sensation Device 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 The light in portion can pass through loophole 676 and be transferred on proximity sensor 51.The receiving module 50 of present embodiment is arranged on In camera case 67, receiving module 50 and the structure of camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging mould Group 60 is installed on casing 20.
Please continue to refer to Figure 26, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without connecing Nearly sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electricity Light outside sub-device 100 can pass through loophole 676 and be transferred on optical flame detector 52.The receiving module 50 of present embodiment Be arranged in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with Imaging modules 60 are installed on casing 20.
Figure 27 is referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 be integrated with it is close When sensor 51 is with optical flame detector 52, loophole 676 can be one and proximity sensor 51 and the corresponding light transmission of optical flame detector 52 Hole or two it is spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that light can pass through loophole 676 and be transferred in receiving module 50.In other realities It applies in mode, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two Individually list packaging body, at this point, camera can also be all disposed within by being respectively the proximity sensor 51 of single packaging body and optical flame detector 52 It is in housing 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, makes receiving module 50 more stablize with the structure of camera case 67 and convenient for receiving module 50 and imaging modules 60 are installed on casing 20.
Figure 27 is referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connected with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connected with FPC.This embodiment party In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation Single package body structure is collectively formed in device 52, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 51 also encapsulates for monomer Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at Outside camera case 67.
In yet another embodiment, optical flame detector 52 is only included in receiving module 50, proximity sensor 51, which is not integrated into, to be connect It receives in module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 also seals for monomer Assembling structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part of position of substrate 66 In in camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate 66 And outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67 Structure is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, and receiving module 50 is enable to be firmly mounted in camera case 67.
Figure 28 is referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677 678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677 Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle. Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two A light extraction through hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through holes 674 Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions Through hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68, Light outside electronic device 100 can pass through light extraction through hole 674 and camera lens module 68 and be transferred on imaging sensor 65.This reality It applies in mode, imaging modules 60 can be visible image capturing first 61, and two camera lens modules 68 are visible image capturing first 61 at this time Corresponding camera lens module.Receiving module 50 is arranged on the second tread 678 and outside camera case 67.Receiving module 50 is to connect Single packaging body that nearly sensor 51 is collectively formed with optical flame detector 52.The center line connecting direction of proximity sensor 51 and optical flame detector 52 can With consistent with the extending direction of notch 675；Alternatively, the center line connecting direction of proximity sensor 51 and optical flame detector 52 can be with notch The angle that 675 extending direction vertical (as shown in figure 28) or the two are formed is acute angle or obtuse angle.In other embodiments, into As module 60 can be infrared pick-up first 62, two camera lens modules 68 are first 62 corresponding camera lens mould of infrared pick-up at this time Group.In yet another embodiment, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, at this time one of them Camera lens module 68 is first 62 corresponding camera lens module of infrared pick-up, another camera lens module 68 corresponds to for visible image capturing first 61 Camera lens module.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the second tread 678 On, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, has saved electronics Installation space in device 100；Both meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce The installation space in electronic device 100 is saved in individually gap during assembling.
Figure 29 is referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670 On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through holes 674 are opened in the first son respectively On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675 Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face 679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678, Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second Angle be right angle.Compared with the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating receiving module 50 is arranged on the second tread On 678.
Figure 28 and Figure 29 is referred to, in some embodiments, the receiving module 50 of the above embodiment is arranged on second On tread 678 and positioned at the outside of camera case 67.Specifically, it is whole when notch 675 is opened in the marginal position of top surface 670 A receiving module 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, part receives mould Group 50 is located at along the projection perpendicular to the second tread 678 in the second tread 678 (as shown in figure 28).That is, receiving module The 50 at least part of surfaces for being located at the second tread 678.It is whole when notch 675 is opened on the centre position of top surface 670 A receiving module 50 can be located in the second tread 678 (as shown in figure 29) along perpendicular to the projection of the second tread 678.Such as This, receiving module 50 sets compacter with imaging modules 60, and the horizontal space that the two occupies jointly is smaller, further saves Installation space in electronic device 100.In other embodiments, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two individual single packaging bodies, at this point, be respectively single packaging body close to sensing Device 51 and optical flame detector 52 can also be all disposed on the second tread 678.
Figure 29 is referred to, in some embodiments, the receiving module 50 of the above embodiment only includes close to sensing Device 51, receiving module 50 does not include optical flame detector 52, at this point, proximity sensor 51 (or receiving module 50) is respectively with optical flame detector 52 Cell packaging configuration, proximity sensor 51 are arranged on the second tread 678, and optical flame detector 52 is arranged on the casing outside imaging modules 60 On 20.
Figure 29 is referred to, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, Receiving module 50 does not include proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively with proximity sensor 51 Cell packaging configuration, optical flame detector 52 are arranged on the second tread 678, and proximity sensor 51 is arranged on the casing outside imaging modules 60 On 20.
Figure 30 is referred to, the second tread 678 of the above embodiment offers loophole 676, and receiving module 50 is located at phase It is in casing body 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without optical flame detector 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 Light can pass through and loophole 676 and be transferred on proximity sensor 51.The receiving module 50 of present embodiment is arranged on phase In casing body 67, the structure of receiving module 50 and camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging modules 60 are installed on casing 20.
Please continue to refer to Figure 30, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics Light outside device 100 can pass through loophole 676 and be transferred on optical flame detector 52.The receiving module 50 of present embodiment is set Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with into As module 60 is installed on casing 20.
Figure 31 is referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, Receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 is integrated with close to sensing When device 51 and optical flame detector 52, loophole 676 can be one with proximity sensor 51 and the corresponding loophole of optical flame detector 52 or Two spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, the light outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that loophole 676 can be passed through and be transferred in receiving module 50.In other embodiment party In formula, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are independent for two Single packaging body, at this point, camera case can also be all disposed within by being respectively the proximity sensor 51 of single packaging body and optical flame detector 52 It is in 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, make receiving module 50 with The structure of camera case 67 is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20.
Please continue to refer to Figure 31, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connected with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connected with FPC.This embodiment party In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation Single package body structure is collectively formed in device 52, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 51 also encapsulates for monomer Structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 simultaneously Outside camera case 67.
In yet another embodiment, receiving module 50 only includes optical flame detector 52, and proximity sensor 51 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 also encapsulates for monomer Structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 In camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate 66 It goes up and is located at outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67 Structure is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, and receiving module 50 is enable to be firmly mounted in camera case 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention. In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two, Three, unless otherwise specifically defined.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.

Claims (15)

1. a kind of electronic device, which is characterized in that including：
Casing；
Module is exported, the output module is mounted in the casing, and the output module includes encapsulating housing, project structured light Device, the first infrared light supply and the second infrared light supply set around first infrared light supply, the encapsulating housing include encapsulation Substrate, the structured light projector, first infrared light supply and second infrared light supply are encapsulated in the encapsulating housing And carry on the package substrate, when second infrared light supply is closed, first infrared light supply is with the first power to institute When stating transmitting infrared light outside encapsulating housing, the output module is used for infrared distance measurement；When first infrared light supply with it is described When second infrared light supply is opened and emitted infrared light outside the encapsulating housing with the second power, the output module is used for Infrared light filling；
Module is vibrated, the vibration module installation is on the housing；With
Piezoelectric element, the piezoelectric element are combined with the vibration module and export module interval, the piezoelectric element with described For being deformed upon when being applied in electric signal so that the vibration module vibration.
2. electronic device according to claim 1, which is characterized in that the vibration module includes display screen and the lid of light transmission Plate, the display screen set on the housing and host cavity are collectively formed with the casing, and the cover board is incorporated in the machine On shell and positioned at the one side away from the host cavity of the display screen, the display screen is combined with the cover board, the casing Offer the infrared through hole of spaced casing, casing structure light through hole and casing vibration through hole, first infrared light supply and Second infrared light supply is corresponding with the infrared through hole of the casing, the structured light projector and the casing structure light through hole Corresponding, the piezoelectric element is housed in the casing vibration through hole and is combined with the cover board.
3. electronic device according to claim 2, which is characterized in that the piezoelectric element and the display screen pass through engagement Part is attached on the cover board.
4. electronic device according to claim 1, which is characterized in that
First infrared light supply is point light source, and second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is point light source, and second infrared light supply is annular light source；Or
For first infrared light supply to be multiple around the point light source circularized, second infrared light supply is annular light source；Or
First infrared light supply is multiple around the point light source circularized, and second infrared light supply is point light source and quantity is It is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is annular light source.
5. electronic device according to claim 1, which is characterized in that the output module further includes chip, the structure Light projector, first infrared light supply and second infrared light supply are formed on a piece of chip.
6. electronic device according to claim 1, which is characterized in that the encapsulating housing further includes package wall and encapsulation Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute It states encapsulation top and is formed with the first light-emitting window and the second light-emitting window, first light-emitting window and first infrared light supply Corresponding with second infrared light supply, second light-emitting window is corresponding with the structured light projector.
7. electronic device according to claim 1, which is characterized in that the output module further includes lens, the lens It is arranged in the encapsulating housing and corresponding with first infrared light supply and second infrared light supply.
8. electronic device according to claim 1, which is characterized in that the output module is further included to be made of light transmissive material Optics sealing cover, the optics sealing cover formed on the package substrate and in the encapsulating housing, the optics sealing cover Wrap first infrared light supply and second infrared light supply.
9. electronic device according to claim 1, which is characterized in that the output module further includes metal shutter, institute It states metal shutter to be located in the encapsulating housing, first infrared light supply and second infrared light supply are located at the metal The one side of shutter, the structured light projector are located at the opposite side of the metal shutter.
10. electronic device according to claim 2, which is characterized in that the surface shape that the cover board is combined with the casing The infrared through ink of infrared light is only transmitted into having, the infrared ink that penetrates blocks the infrared through hole of the casing, the casing It is at least one in structure light through hole and casing vibration through hole.
11. electronic device according to claim 1, which is characterized in that the electronic device further include receiving module and into As module, the receiving module is integrated with proximity sensor and optical flame detector, and the imaging modules include microscope base, mounted on the mirror Lens barrel on seat and the imaging sensor being housed in the microscope base, the microscope base include being located at the lens barrel and described image Mounting surface between sensor, the receiving module are arranged on the mounting surface.
12. electronic device according to claim 1, which is characterized in that the electronic device further includes proximity sensor, light Sensor and imaging modules, the imaging modules include microscope base, the lens barrel on the microscope base and are housed in the microscope base Interior imaging sensor, the microscope base includes the mounting surface between the lens barrel and described image sensor, described close At least one in sensor and the optical flame detector is arranged on the mounting surface.
13. electronic device according to claim 1, which is characterized in that the electronic device further includes infrared pick-up head With visible image capturing head, the center of the output module, the infrared pick-up head and the visible image capturing head is positioned at same On line segment, the piezoelectric element is between the line segment and the top of the casing.
14. electronic device according to claim 2, which is characterized in that the electronic device further includes infrared pick-up head With visible image capturing head, the quantity of the piezoelectric element is multiple, and the casing vibrates the quantity of through hole to be multiple, multiple described Piezoelectric element is corresponding with multiple casing vibration through holes, and it is logical that each piezoelectric element is housed in the corresponding casing vibration In hole, the centre bit for exporting module, the infrared pick-up head, the visible image capturing head and multiple piezoelectric elements In on same line segment, being provided with the output module, the infrared pick-up head and institute between the two neighboring piezoelectric element It states at least one in visible image capturing head.
15. electronic device according to claim 2, which is characterized in that the electronic device further includes infrared pick-up head With visible image capturing head, the piezoelectric element includes piezoelectric body and the piezoelectricity convex block stretched out from the piezoelectric body, the machine The quantity of shell vibration through hole is multiple, and multiple piezoelectricity convex blocks are corresponding with multiple casing vibration through holes, each pressure Electric convex portion is housed in corresponding casing vibration through hole and is combined with the cover board, the module, described red of exporting Outer light video camera head and the visible image capturing head are between the cover board and the piezoelectric body, the output module, described The center of infrared pick-up head, the visible image capturing head and multiple piezoelectricity convex blocks is located on same line segment, two neighboring It is provided between the piezoelectricity convex block in the output module, the infrared pick-up head and the visible image capturing head at least One.
CN201711437459.8A 2017-12-26 2017-12-26 Electronic device Pending CN108055370A (en)

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