CN108012004A

CN108012004A - Electronic device

Info

Publication number: CN108012004A
Application number: CN201711433082.9A
Authority: CN
Inventors: 吴安平
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-12-26
Filing date: 2017-12-26
Publication date: 2018-05-08
Anticipated expiration: 2037-12-26
Also published as: CN108012004B

Abstract

Electronic device disclosed by the invention includes casing, input and output module, vibration module and piezoelectric element.Input and output module is arranged in casing, and input and output module includes encapsulating housing, infrared light compensating lamp, close to infrared lamp, proximity sensor and optical flame detector.Encapsulating housing includes package substrate, and infrared light compensating lamp, be encapsulated in encapsulating housing close to infrared lamp and optical flame detector and carried by package substrate.Infrared light compensating lamp with different capacity close to infrared lamp with that can launch infrared light, and the infrared light that proximity sensor is used to receive reflection carries out infrared distance measurement, and optical flame detector is used to receive visible detection light intensity.Vibrate module to be installed on casing, piezoelectric element is combined with vibration module and deformed upon when being applied in electric signal so as to vibrate module vibration with input and output module interval, piezoelectric element.The integrated level of input and output module is higher, small volume, and electronic device realizes that osteoacusis is transaudient using piezoelectric element and vibration module, can effectively ensure that the privacy of dialog context.

Description

Electronic device

Technical field

The present invention relates to consumer electronics technical field, more specifically, is related to a kind of electronic device.

Background technology

As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of the function element set It is more and more, in order to realize distance detection, ambient light detection with the function such as the facial 3D feature recognitions of user, it is necessary to be set in electronics The function elements such as standby middle configuration optical flame detector, ambient light sensor, infrared pick-up head, structured light projector, and in order to arrange crowd More function elements, can take the excessive space of mobile phone.

The content of the invention

Embodiment of the present invention provides a kind of electronic device.

The electronic device of embodiment of the present invention includes：

Casing；

Input and output module, the input and output module are arranged in the casing, and the input and output module includes envelope Fill housing, infrared light compensating lamp, close to infrared lamp, proximity sensor and optical flame detector, the encapsulating housing includes package substrate, described Infrared light compensating lamp, described be encapsulated in the encapsulating housing simultaneously close to infrared lamp, the proximity sensor and the optical flame detector Carrying on the package substrate, the infrared light compensating lamp from it is described can be with different power to the encapsulation close to infrared lamp Launch infrared light outside housing, the proximity sensor be used to receiving be reflected by the object by described close to the red of infrared lamp transmitting To detect the object to the distance of the electronic device, the optical flame detector is used to receive the visible ray in ambient light UV light, And detect the intensity of the visible ray；

Module is vibrated, the vibration module installation is on the housing；With

Piezoelectric element, the piezoelectric element with it is described vibration module combined and with the input and output module interval, it is described Piezoelectric element is used to deform upon when being applied in electric signal so that the vibration module vibration.

In some embodiments, the vibration module includes the cover board of display screen and printing opacity, and the display screen is arranged on Host cavity is collectively forming on the casing and with the casing, the cover board sets on the housing and is located at the display screen The remote host cavity side, the display screen combined with the cover board, and the casing offers spaced casing Through hole is vibrated close to through hole, casing light filling through hole, casing proximity sensor through hole, casing light sensation through hole and casing, it is described close Infrared lamp is corresponding close to through hole with the casing, and the infrared light compensating lamp is corresponding with the casing light filling through hole, the optical flame detector Corresponding with the casing light sensation through hole, the piezoelectric element is housed in the casing vibration through hole and is combined with the cover board.

In some embodiments, the piezoelectric element and the display screen are attached on the cover board by fastener.

In some embodiments, the input and output module further includes chip, the infrared light compensating lamp, described close to red Outer lamp, the proximity sensor and the optical flame detector are both formed on a piece of chip.

In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly The package substrate extends and is connected at the top of the encapsulation between the package substrate, formed with light filling at the top of the encapsulation Window, close to lamp window, proximity sensor window and light sensation window, the light filling window is corresponding with the infrared light compensating lamp, institute State close to lamp window with described corresponding close to infrared lamp, described corresponding with the proximity sensor close to sensing window, the light It is corresponding with the optical flame detector to feel window.

In some embodiments, the input and output module further includes light-supplementing lamp lens, and the light-supplementing lamp lens are set It is in the encapsulating housing and corresponding with the infrared light compensating lamp；And/or

The input and output module is further included close to lamp lens, described to be arranged on close to lamp lens in the encapsulating housing simultaneously With it is described corresponding close to infrared lamp；And/or

The input and output module further includes proximity sensor lens, and the proximity sensor lens are arranged on the encapsulation It is in housing and corresponding with the proximity sensor；And/or

The input and output module further includes light sensation lens, the light sensation lens be arranged in the encapsulating housing and with institute State optical flame detector correspondence.

In some embodiments, it is saturating to further include the light compensating lamp being arranged in the encapsulating housing for the input and output module Mirror, close to lamp lens, proximity sensor lens and light sensation lens, the light-supplementing lamp lens are corresponding with the infrared light compensating lamp, institute State close to lamp lens with described corresponding close to infrared lamp, the proximity sensor lens are corresponding with the proximity sensor, described Light sensation lens are corresponding with the optical flame detector, the light-supplementing lamp lens, described close to lamp lens, the proximity sensor lens and institute Light sensation lens are stated to be located on same transparent base.

In some embodiments, the input and output module further includes multiple metal shutters, and multiple metals hide Baffle is located in the encapsulating housing and is located at the infrared light compensating lamp, is described close to infrared lamp, the proximity sensor respectively And in the optical flame detector it is any between the two.

In some embodiments, the input and output module further includes the optics sealing cover made of light transmissive material, described Optics sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps the infrared benefit It is light lamp, described close to infrared lamp, the proximity sensor and the optical flame detector.

In some embodiments, the input and output module further include it is multiple go out light clapboard, it is multiple it is described go out light clapboard Be respectively formed in the optics sealing cover and positioned at the infrared light compensating lamp, it is described close to infrared lamp, the proximity sensor and In the optical flame detector it is any between the two.

In some embodiments, draw on the input and output module formed with grounding pin, light compensating lamp pin, close to lamp When foot, proximity sensor pin and light sensation pin, the grounding pin and the light compensating lamp pin are enabled, the infrared light filling Lamp launches infrared light；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared lamp launch infrared light Line；When the grounding pin and the proximity sensor pin are enabled, the proximity sensor receive be reflected by the object by The infrared light close to infrared lamp transmitting；When the grounding pin and the light sensation pin are enabled, the optical flame detector inspection Survey the intensity of visible ray.

In some embodiments, the cover board and the surface that the casing is combined are formed with only transmitting the infrared of infrared light Through ink, the infrared ink that passes through blocks the casing close to through hole, the casing light filling through hole, casing proximity sensor It is at least one in through hole and casing vibration through hole.

In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head, structure light and throws Emitter, in the input and output module, the infrared pick-up head, the visible image capturing head and the structured light projector The heart is located on same line segment, and the piezoelectric element is between the line segment and the top of the casing.

In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and structure light The projector, the quantity of the piezoelectric element is multiple, and the quantity of the casing vibration through hole is multiple, multiple piezoelectric elements Corresponding with multiple casing vibration through holes, each piezoelectric element is housed in the corresponding casing vibration through hole, institute State input and output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectric elements and the structure light The center of the projector is located on same line segment, and the input and output module, institute are provided between the two neighboring piezoelectric element State at least one in infrared pick-up head, the visible image capturing head and the structured light projector.

In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and structure light The projector, the piezoelectric element include piezoelectric body and the piezoelectricity convex block stretched out from the piezoelectric body, and the casing vibration is logical The quantity in hole is multiple, and multiple piezoelectricity convex blocks are corresponding with multiple casing vibration through holes, each piezoelectricity convex block portion Divide and be housed in the corresponding casing vibration through hole and combined with the cover board, the input and output module, the infrared light Camera, the visible image capturing head and the structured light projector are described between the cover board and the piezoelectric body Input and output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectricity convex blocks and the structure light are thrown The center of emitter is located on same line segment, and the input and output module, described is provided between the two neighboring piezoelectricity convex block It is at least one in infrared pick-up head, the visible image capturing head and the structured light projector.

In the electronic device of embodiment of the present invention, input and output module by infrared light compensating lamp, close to infrared lamp, close to pass Sensor is integrated into a single package body structure with optical flame detector, has gathered transmitting infrared light with the function of infrared distance measurement, infrared light filling Function and visible ray intensity detection function, therefore, the integrated level of input and output module is higher, small volume, input it is defeated Go out the space that module has saved the function of realizing infrared light filling, infrared distance measurement and visual intensity detection.It is further, since infrared Light compensating lamp, be carried on same package substrate close to infrared lamp, proximity sensor and optical flame detector, red compared to traditional handicraft Outer light compensating lamp, need different wafers are respectively adopted and manufacture recombinants to PCB substrate close to infrared lamp, proximity sensor and optical flame detector Upper encapsulation, improves packaging efficiency.Further more, electronic device realizes that osteoacusis is transaudient using piezoelectric element and vibration module, instead of Traditional telephone receiver structure by air transmitted sound, is on the one hand effectively ensured the privacy of dialog context, on the other hand, due to The receiver of script is eliminated, avoids and opens up through hole corresponding with receiver on the cover board, it is simpler in technique, in appearance It is more aesthetically pleasing.

The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become obvious, or recognized by the practice of embodiments of the present invention.

Brief description of the drawings

The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change Obtain substantially and be readily appreciated that, wherein：

Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；

Fig. 2 is the schematic perspective view of the input and output module of the electronic device of embodiment of the present invention；

Fig. 3 is the schematic cross-section of the input and output module of the electronic device of embodiment of the present invention；

Fig. 4 is the schematic perspective view of the input and output module of the electronic device of embodiment of the present invention；

Fig. 5 is schematic cross-section of the electronic device along V-V lines in Fig. 1；

Fig. 6 is partial sectional schematic view of the electronic device in Fig. 1 along line VI -- VI；

Fig. 7 is the structure diagram of the electronic device of certain embodiments of the present invention；

Fig. 8 is partial sectional schematic view of the electronic device along VIII-VIII lines in Fig. 7；

Fig. 9 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention；

Figure 10 to Figure 13 is the partial sectional schematic view of the electronic device of certain embodiments of the present invention.

Embodiment

Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing To the same or similar element of expression eventually or there is same or like element.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's Embodiment, and be not considered as limiting the invention.

In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.

Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity Sub- component includes input and output module 10, vibration module 30a, piezoelectric element 70, imaging modules 60 and structured light projector 80.Electronic device 100 can be mobile phone, tablet computer, laptop, intelligent watch, Intelligent bracelet, automatic teller machine etc., this hair Bright embodiment is illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the concrete form of electronic device 100 can be Other, this is not restricted.

Refer to Fig. 2 and Fig. 3, input and output module 10 is single package body structure, including encapsulating housing 11, infrared light compensating lamp 12nd, close to infrared lamp 13, proximity sensor 50 and optical flame detector 1d.

Encapsulating housing 11 is used to encapsulating infrared light compensating lamp 12 at the same time, close to infrared lamp 13, proximity sensor 50 and optical flame detector 1d, in other words, infrared light compensating lamp 12, close to infrared lamp 13, proximity sensor and optical flame detector 1d be encapsulated in encapsulating housing 11 at the same time It is interior.Encapsulating housing 11 includes package substrate 111, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetism Interference (Electromagnetic Interference, EMI) shielding material is made, to avoid extraneous electromagnetic interference to input Output module 10 has an impact.In present embodiment, infrared light compensating lamp 12, close to infrared lamp 13, proximity sensor 50 and light sensation The center of device 1d is located on same line segment, such as：Infrared light compensating lamp 12 is followed successively by along one end of line segment to the other end, close to infrared Lamp 13, proximity sensor 50 and optical flame detector 1d；Alternatively, it is followed successively by close to infrared lamp 13, approaches along one end of line segment to the other end Sensor 50, infrared light compensating lamp 12 and optical flame detector 1d；Alternatively, along one end of line segment to the other end be followed successively by close to infrared lamp 13, Proximity sensor 50, optical flame detector 1d and infrared light compensating lamp 12.In other embodiments, infrared light compensating lamp 12, close to infrared lamp The line of centres of 13 and optical flame detector 1d is triangular in shape.

Package substrate 111 is used to carrying infrared light compensating lamp 12, close to infrared lamp 13, proximity sensor 50 and optical flame detector 1d. When manufacturing input and output module 10, infrared light compensating lamp 12, can be with close to infrared lamp 13, proximity sensor 50 and optical flame detector 1d Be formed on a piece of chip 14, then by infrared light compensating lamp 12, close to infrared lamp 13, proximity sensor 50, optical flame detector 1d and chip 14 are set along on package substrate 111, and specifically, chip 14 can be bonded on package substrate 111.Meanwhile encapsulate base Plate 111 can be used for being connected with other parts (such as the casing 20 of electronic device 100, mainboard etc.) of electronic device 100, Input and output module 10 is fixed in electronic device 100.

Package wall 112 can surround infrared light compensating lamp 12, close to infrared lamp 13, proximity sensor 50 and optical flame detector 1d Set, package wall 112 extends from package substrate 111, and package wall 112 can be combined with package substrate 111, it is preferred that encapsulation Side wall 112 and package substrate 111 are detachably connected, in order to remove after package wall 112 to infrared light compensating lamp 12, close Infrared lamp 13, proximity sensor 50 and optical flame detector 1d are overhauled.The making material of package wall 112 can be impermeable infrared light Material, the infrared light sent to avoid infrared light compensating lamp 12 or close to infrared lamp 13 passes through package wall 112.

Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113 Formed with light filling window 1131, close to lamp window 1132, proximity sensor window 1134 and light sensation window 1133, light filling window 1131 is corresponding with infrared light compensating lamp 12, and the infrared light that infrared light compensating lamp 12 is launched is pierced by from light filling window 1131；Close to lamp window 1132 is corresponding with close to infrared lamp 13, and the infrared light launched close to infrared lamp 13 is pierced by from close to window 1132；Proximity sensor Window 1134 is corresponding with proximity sensor 50, and the infrared light launched close to infrared lamp 13 can pass after object reflects to pass through approaching Sensor window 1134 is simultaneously incided on proximity sensor 50；Light sensation window 1133 is corresponding with optical flame detector 1d, it is seen that light can pass through Light sensation window 1133 is simultaneously incided on optical flame detector 1d.Encapsulation top 113 integrally formed can be obtained with package wall 112, also may be used Shape to obtain with split.In one example, light filling window 1131, close to lamp window 1132,1134 and of proximity sensor window Light sensation window 1133 is through hole, and the making material at encapsulation top 113 is impermeable infrared light and the material of visible ray.In another example In son, encapsulation top 113 by the material of impermeable infrared light, saturating infrared light, be opaque to visible light but and the material of visible ray is made jointly thoroughly Make and form, specifically, be made of the material of saturating infrared light close to lamp window 1132 and proximity sensor window 1134, light sensation window Mouth 1133 is made of the material of saturating visible ray, remaining position is made of impermeable infrared light and the material being opaque to visible light but.Further Ground, light filling window 1131 and could be formed with lens arrangement close to lamp window 1132, to improve from light filling window 1131 and close The infrared light emission angle that lamp window 1132 projects, such as light filling window 1131 is formed with concavees lens structure, so as to pass through light filling The divergence of beam of window 1131 outwards projects；Close to window 1132 formed with convex lens structures, so as to pass through close to lamp window 1132 light gathers outside injection；Light sensation window 1133 can also be formed with lens arrangement, to improve from light sensation window 1133 Incident VISIBLE LIGHT EMISSION angle, such as light sensation window 1133 have convex lens structures so that by the incident light of light sensation window 1133 Gather and project on optical flame detector 1d.

Infrared light compensating lamp 12, close to infrared lamp 13, proximity sensor 50 and optical flame detector 1d can be formed in a piece of chip On 14, further reduce infrared light compensating lamp 12, integrated close to infrared lamp 13, proximity sensor 50 and optical flame detector 1d after volume, And preparation process is simpler.Infrared light compensating lamp 12 can launch infrared light, and infrared light passes through light filling window 1131 to project object Surface, the infrared pick-up of electronic device 100 first 62 receive the infrared light that is reflected by the object to obtain image information (this of object When, infrared light compensating lamp 12 is used for infrared light filling).Infrared light can be launched close to infrared lamp 13, infrared light is passed through close to lamp window 1132 and body surface is reached, proximity sensor 50 receives the infrared light being reflected by the object with detection object to input and output module 10 distance (at this time, being used for infrared distance measurement close to infrared lamp 13).Optical flame detector 1d is received by the incident environment of light sensation window 1133 Visible ray in light, and detect the intensity of visible ray.

Infrared light compensating lamp 12 can launch infrared light with different power from close to infrared lamp 13 to outside encapsulating housing 11, Specifically, with that can launch infrared light at the same time close to infrared lamp 13, input and output module 10 is used for infrared light compensating lamp 12 at the same time Infrared light filling and infrared distance measurement；Can also infrared light compensating lamp 12 launch light and do not launch light close to infrared lamp 13, input is defeated Go out module 10 and be only used for infrared light filling；Can also infrared light compensating lamp 12 do not launch light and close to infrared lamp 13 launch light, it is defeated Enter to export module 10 and be only used for infrared distance measurement.

Incorporated by reference to Fig. 4, in embodiments of the present invention, draw on input and output module 10 formed with grounding pin 15, light compensating lamp Foot 16, close to lamp pin 17, proximity sensor pin 1g and light sensation pin 1f.Grounding pin 15, light compensating lamp pin 16, approach Lamp pin 17, proximity sensor pin 1g and light sensation pin 1f can be formed on package substrate 111, when grounding pin 15 and mended When light lamp pin 16 is enabled (that is, when grounding pin 15 and light compensating lamp pin 16 access circuit turn-on), infrared light compensating lamp 12 is sent out Penetrate infrared light；(that is, grounding pin 15 and access when grounding pin 15 and close to lamp pin 17 when being enabled close to lamp pin 17 During circuit turn-on), launch infrared light close to infrared lamp 13；When grounding pin and proximity sensor pin 1g are enabled, connect Nearly sensor 50 receive be reflected by the object by the infrared light launched close to infrared lamp 13；When grounding pin 15 and light sensation draw When foot 1f is enabled (that is, when grounding pin 15 and light sensation pin 1f access circuit turn-on), optical flame detector 1d detection visual intensities, Using the foundation of the display brightness as control display screen 90.

Please refer to Fig.1 and Fig. 5, casing 20 can be as the installation carriers of input and output module 10, in other words, input and output Module 10 can be arranged in casing 20.Casing 20 can be the shell of electronic device 100.Specifically, casing 20 includes top 21 and bottom 22, in position corresponding with electronic component, casing 20 offers spaced casing close to lamp through hole 23, machine Shell proximity sensor through hole 26, casing light filling through hole 24, casing light sensation through hole 2f and casing vibration through hole 2a.Input and output mould When group 10 is arranged in casing 20, corresponding close to through hole 23 with casing close to infrared lamp 13, proximity sensor 50 is approached with casing Sensor through hole 26 corresponds to, and infrared light compensating lamp 12 is corresponding with casing light filling through hole 24,2f pairs of optical flame detector 1d and casing light sensation through hole Should.It can wherein be approached close to infrared lamp 13 and casing close to the corresponding light sent close to infrared lamp 13 that refers to of through hole 23 from casing Through hole 23 passes through, and can be close to infrared lamp 13 and casing close to 23 face of through hole or close to infrared lamp 13 specifically The light of transmitting passes through casing close to through hole 23 after light-guide device acts on.Infrared light compensating lamp 12 is corresponding with casing light filling through hole 24 Similarly, therefore not to repeat here.The optical flame detector 1d visible rays that refer to corresponding with casing light sensation through hole 2f can be worn from casing light sensation through hole 2f Cross and incide on optical flame detector 1d, can be optical flame detector 1d and casing light sensation through hole 2f faces or visible specifically The light of light incidence through casing light sensation through hole 2f and is incided on optical flame detector 1d after light-guide device acts on.Proximity sensor 50 It is corresponding with casing proximity sensor through hole 26 similarly, therefore not to repeat here.Casing is close to through hole 23, casing proximity sensor through hole 26th, casing light filling through hole 24 and casing light sensation through hole 2f can be apart from one another by certainly, in other embodiments, casing connects Nearly through hole 23, casing proximity sensor through hole 26, casing light filling through hole 24 and casing light sensation through hole 2f can also be interconnected 's.

Module 30a is vibrated to be installed on casing 20.Vibration module 30a may include display screen 90 and cover board 30, show in other words Display screen 90 combines to form vibration module 30a with cover board 30, with the rigidity of lifting vibration module 30a.Display screen 90 is arranged on casing Host cavity 91 is formed on 20 and with casing 20, cover board 30 is arranged on casing 20 and positioned at the remote host cavity 91 of display screen 90 Side, to protect display screen 90.Since the input and output module 10 of embodiment of the present invention can take less volume, Therefore, it is used to set the volume of display screen 90 to correspond to increase in casing 20, to improve the screen accounting of electronic device 100. Specifically, display screen 90, input and output module 10 and piezoelectric element 70 are arranged between top 21 and bottom 22, normal in user In the state of electronic device 100, top 21 is located at the top of bottom 22, and input and output module 10 can be arranged on display Between screen 90 and top 21.In other embodiments, display screen 90 can open up jagged for screen comprehensively, and display screen 90 surrounds Firmly input and output module 10, and the notch of input and output module 10 from display screen 90 exposes.

Piezoelectric element 70 is made of ceramics or quartz crystal materials, and piezoelectric element 70 can be single-chip, twin crystal sheet or layer The piezoelectric element 70 of pressure.Piezoelectric element 70 is combined with vibration module 30a and is spaced with input and output module 10.Specifically, piezoelectricity Element 70 is housed in casing vibration through hole 2a and is combined with cover board 30, and is spaced with casing 20, Ke Yishi：Piezoelectric element 70 Divide and be housed in casing vibration through hole 2a, or piezoelectric element 70 is housed in the logical 2a holes of casing vibration completely.When piezoelectric element 70 Both ends when being applied with electric signal (voltage), due to inverse piezoelectric effect, mechanical deformation occurs for piezoelectric element 70, for example, expansion or Shrink, thus, drive the vibration module 30a combined with piezoelectric element 70 to be vibrated according to the frequency of the electric signal.When the body of user When body is contacted with vibration module 30a, the part that osteoacusis sound is contacted by the body of user with vibration module 30a is (for example, external ear Cartilage, tooth) be sent to the auditory nerve of user.In this way, user can be realized by piezoelectric element 70 and vibration module 30a Voice communication, the function such as listen to music.In embodiments of the present invention, the processor of electronic device 100 is used to obtain voice signal, and Apply electric signal corresponding with the voice signal at the both ends of piezoelectric element 70.

It is appreciated that traditional telephone receiver structure uses air transmitted sound, part acoustic pressure usually exists when receiver works 90dB~100dB or so, in surrounding environment quieter (under the working environment as 50dB or so) even if sound is delivered to week Enclose 1 meter of scope and also still remain with 50dB~60dB or so, cause the chat script between caller to be perceived by surrounding, cause secret to be let out Dew.The electronic device 100 of embodiment of the present invention realizes that osteoacusis is transaudient using piezoelectric element 70 and vibration module 30a, converses Sound be mainly perceived by the user by the osteoacusis vibrated, can effectively ensure that the privacy of dialog context.

Referring to Fig. 5 and Fig. 6, piezoelectric element 70 and display screen 90 are attached to cover board 30 by fastener 30b On.Fastener 30b is with heat curable properties, the adhesive of UV-curing characteristics, double faced adhesive tape, viscose etc..For example, fastener 30b can be Photoelasticity resin (the UV curable acrylic adhesive of colorless and transparent).Cover board 30 and piezoelectric element 70 combine regions and cover board 30 combined with display screen 90 it is interregional every to prevent the display of display screen 90 to be subject to piezoelectricity The interference of element 70.Certainly, cover board 30 can also be bonded to casing 20 by fastener 30b, be set directly at compared to cover board 30 On casing 20, the vibration of vibration module 30a can be prevented to be transmitted directly onto casing 20, to reduce user because casing 20 Oscillation Amplitude is excessive and the possibility for the electronic device 100 that drops.

Cover board 30 can be printing opacity, and the material of cover board 30 can be glass, resin, plastics of printing opacity etc..Cover board 30 is set Put on casing 20, cover board 30 includes the inner surface 32 combined with casing 20, and the outer surface 31 opposite with inner surface 32, defeated Enter to export after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.Cover board 30 covers casing and mends Light through hole 24, casing vibrate through hole 2a close to through hole 23, casing light sensation through hole 2f and casing, are applied on the inner surface 32 of cover board 30 Infrared transmission ink 40 is covered with, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, And have higher attenuation rate to visible ray, such as can reach more than 70% so that user during normal use, is visually difficult to see that By the infrared region covered through ink 40 on electronic device 100.Specifically, it is infrared to cover inner surface 32 through ink 40 On not with 90 corresponding region of display screen.

It is infrared to block casing close to through hole 23, casing proximity sensor through hole 26, casing light filling through ink 40 Through hole 24 and casing vibrate at least one in through hole 2a, i.e. infrared transmission ink 40 can cover casing at the same time and lead to close to lamp Hole 23, casing proximity sensor through hole 26, casing light filling through hole 24 and casing vibration through hole 2a, user are difficult to approach by casing Lamp through hole 23, casing proximity sensor through hole 26, casing light filling through hole 24 and casing vibration through hole 2a see electronic device 100 Internal structure, the shape of electronic device 100 is more beautiful；It is infrared to cover casing close to through hole 23, machine through ink 40 Shell light filling through hole 24, casing proximity sensor through hole 26 or casing vibration through hole 2a one or more, it is surplus without covering Under a multiple or through hole.

Referring to Fig. 1, structured light projector 80 is used for outside emitting structural light, on project structured light to testee after quilt Reflection, the structure light reflected can be received by infrared pick-up first 62, and the processor of electronic device 100 is further analyzed by infrared The structure light that light video camera head 62 receives, to obtain the depth information of testee.

Imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, and input and output module 10, infrared light are taken the photograph As first 62, visible image capturing is first 61, the center of piezoelectric element 70 and structured light projector 80 is located on same line segment.Specifically, Input and output module 10, structured light projector 80, piezoelectric element 70, infrared light is followed successively by from one end of line segment to the other end to take the photograph Picture first 62, visible image capturing first 61, at this time, it is seen that light video camera head 61 and infrared pick-up first 62 can form double photography/videography heads； Or input and output module 10, infrared pick-up first 62, piezoelectric element 70, visible ray are followed successively by from one end of line segment to the other end Camera 61, structured light projector 80；Or it is followed successively by that infrared pick-up is first 62, input and output from one end of line segment to the other end Module 10, piezoelectric element 70, visible image capturing are first 61, structured light projector 80；Or from one end of line segment to the other end successively For infrared pick-up is first 62, visible image capturing is first 61, piezoelectric element 70, input and output module 10, structured light projector 80, this When, it is seen that light video camera head 61 and infrared pick-up first 62 can form double photography/videography heads.Certainly, input and output module 10, infrared Light video camera head 62, piezoelectric element 70, visible image capturing are first 61, the arrangement mode of structured light projector 80 is not limited to above-mentioned act Example, can also there is other, such as the shapes such as the center arrangement of each electronic component is in the arc-shaped, center arrangement is rectangular.

Referring to Fig. 9, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62.Input and output module 10th, infrared pick-up is first 62, the center of visible image capturing first 61 and structured light projector 80 is located on same line segment, piezoelectric element 70 between line segment and the top 21 of casing 20.Specifically, input and output module is followed successively by from one end of line segment to the other end 10th, structured light projector 80, infrared pick-up be first 62, visible image capturing first 61；Or from one end of line segment to the other end successively For input and output module 10, infrared pick-up be first 62, visible image capturing is first 61, structured light projector 80；Or one from line segment Holding the other end to be followed successively by, infrared pick-up first 62, input and output module 10, visible image capturing be first 61, structured light projector 80； Or it is followed successively by that infrared pick-up is first 62, visible image capturing is first 61, input and output module 10, knot from one end of line segment to the other end Structure light projector 80.Certainly, input and output module 10, infrared pick-up be first 62, visible image capturing is first 61, structured light projector 80 Arrangement mode be not limited to above-mentioned citing.In embodiments of the present invention, the center of piezoelectric element 70 is not on the line segment, section (input and output module 10, infrared pick-up are first 62, visible image capturing is first 61, structure light for each electronic component about on cover board 30 Projector 80 etc.) take horizontal space.

To sum up, in the electronic device 100 of embodiment of the present invention, input and output module 10 is by infrared light compensating lamp 12, close Infrared lamp 13, proximity sensor 50 and optical flame detector 1d are integrated into a single package body structure, have gathered transmitting infrared light with infrared The function of the intensity detection of the function of ranging, the function of infrared light filling and visible ray, therefore, input and output module 10 integrate Higher, small volume is spent, input and output module 10, which has been saved, realizes infrared light filling, infrared distance measurement and visual intensity detection The space of function.Further, since infrared light compensating lamp 12, being carried on together close to infrared lamp 13, proximity sensor 50 and optical flame detector 1d On one package substrate 111, infrared light compensating lamp 12 compared to traditional handicraft, close to infrared lamp 13, proximity sensor 50 and light Sensor 1d needs to be respectively adopted different wafers and manufactures recombinants to be encapsulated to PCB substrate, improves packaging efficiency.Further more, electronics Device 100 using piezoelectric element 70 and vibration module 30a realizes that osteoacusis is transaudient, instead of it is traditional by air transmitted sound by Talk about device structure, on the one hand, can effectively ensure that the privacy of dialog context；On the other hand, due to eliminating the receiver of script, Avoid and through hole corresponding with receiver is opened up on cover board 30, it is simpler in technique, it is also more aesthetically pleasing in appearance, and can prevent Only dust or moisture enter in electronic device 100.

Fig. 6 and Figure 10 are referred to, in some embodiments, imaging modules 60 include visible image capturing first 61 and infrared light Camera 62.Casing 20 offers spaced casing and leads to close to through hole 23, casing proximity sensor through hole 26, casing light filling Hole 24, casing light sensation through hole 2f and casing vibration through hole 2a.It is corresponding close to through hole 23 with casing close to infrared lamp 13, close to biography Sensor 50 is corresponding with casing proximity sensor through hole 26, and infrared light compensating lamp 12 is corresponding with casing light filling through hole 24, optical flame detector 1d with Casing light sensation through hole 2f is corresponded to.The quantity of piezoelectric element 70 is multiple, and the quantity of casing vibration through hole 2a is multiple, multiple piezoelectricity Element 70 is corresponding with multiple casings vibration through hole 2a, and each piezoelectric element 70 is housed in corresponding casing vibration through hole 2a.It is defeated Enter to export that module 10, infrared pick-up are first 62, visible image capturing is first 61, in multiple piezoelectric elements 70 and structured light projector 80 The heart is located on same line segment, be provided between two neighboring piezoelectric element 70 input and output module 10, infrared pick-up it is first 62, It is at least one in visible image capturing first 61 and structured light projector 80.For example, the quantity of piezoelectric element 70 is two, from line One end of section is followed successively by piezoelectric element 70, input and output module 10, structured light projector 80, infrared pick-up head to the other end 62nd, visible image capturing is first 61, piezoelectric element 70；Or be followed successively by from one end of line segment to the other end piezoelectric element 70, input it is defeated Go out that module 10, infrared pick-up are first 62, visible image capturing is first 61, piezoelectric element 70, structured light projector 80 etc..In another example pressure The quantity of electric device 70 is three, and piezoelectric element 70, input and output module 10, knot are followed successively by from one end of line segment to the other end Structure light projector 80, piezoelectric element 70, infrared pick-up are first 62, visible image capturing is first 61, piezoelectric element 70；Or from line segment One end is followed successively by that piezoelectric element 70, input and output module 10, piezoelectric element 70, infrared pick-up be first 62, visible ray to the other end Camera 61, piezoelectric element 70, structured light projector 80 etc..Certainly, the quantity of piezoelectric element 70 and piezoelectric element 70, input Output module 10, infrared pick-up is first 62, visible image capturing is first 61, the arrangement mode of structured light projector 80 be not limited to it is above-mentioned Citing.In embodiments of the present invention, multiple piezoelectric elements 70 are combined with cover board 30, are in particular that multiple piezoelectric elements 70 are distinguished It is attached to by fastener 30b on cover board 30.The processor of electronic device 100 is used to obtain voice signal, and at the same time multiple The both ends of piezoelectric element 70 apply electric signal corresponding with the voice signal, and mechanical deformation occurs for multiple piezoelectric elements 70, by This, multiple piezoelectric elements 70 drive frequencies of the vibration module 30a according to the electric signal from the multiple and different positions combined with cover board 30 Rate is vibrated.When the body of user is contacted with vibration module 30a, osteoacusis sound is connect by the body of user with vibration module 30a Tactile part (for example, the cartilage of external ear, tooth) is sent to the auditory nerve of user.

In embodiments of the present invention, multiple piezoelectric elements 70 drive from the multiple and different positions combined with cover board 30 at the same time Vibrate module 30a vibration, the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and stably conducts To the auditory nerve of user.

Fig. 6 to Fig. 8 is referred to, in some embodiments, imaging modules 60 include visible image capturing first 61 and infrared light Camera 62.Casing 20 offers spaced casing and leads to close to through hole 23, casing light filling through hole 24, casing proximity sensor Hole 26, casing light sensation through hole 2f and casing vibration through hole 2a.It is corresponding close to through hole 23 with casing close to infrared lamp 13, close to biography Sensor 50 is corresponding with casing proximity sensor through hole 26, and infrared light compensating lamp 12 is corresponding with casing light filling through hole 24, optical flame detector 1d with Casing light sensation through hole 2f is corresponded to.Piezoelectric element 70 includes piezoelectric body 71 and the piezoelectricity convex block 72 stretched out from piezoelectric body 71, pressure The quantity of electric convex block 72 is multiple, and the quantity of casing vibration through hole 2a is multiple, and multiple piezoelectricity convex blocks 72 are vibrated with multiple casings Through hole 2a is corresponded to, and each 72 partial receipt of piezoelectricity convex block is combined in corresponding casing vibration through hole 2a and with cover board 30.Input Output module 10, infrared pick-up is first 62, visible image capturing first 61 and structured light projector 80 are located at cover board 30 and piezoelectric body Between 71.Input and output module 10, infrared pick-up are first 62, visible image capturing is first 61, multiple piezoelectricity convex blocks 72 and structure light are thrown The center of emitter 80 is located on same line segment, and input and output module 10, infrared light are provided between two neighboring piezoelectricity convex block 72 It is at least one in camera 62, visible image capturing first 61 and structured light projector 80.For example, the quantity of piezoelectricity convex block 72 is Two, piezoelectricity convex block 72, input and output module 10, structured light projector 80, infrared is followed successively by from one end of line segment to the other end Light video camera head 62, visible image capturing are first 61, piezoelectricity convex block 72；Or piezoelectricity convex block is followed successively by from one end of line segment to the other end 72nd, input and output module 10, infrared pick-up be first 62, visible image capturing is first 61, piezoelectricity convex block 72, structured light projector 80 etc.. In another example the quantity of piezoelectricity convex block 72 is three, piezoelectricity convex block 72, input and output mould are followed successively by from one end of line segment to the other end Group 10, structured light projector 80, piezoelectricity convex block 72, infrared pick-up are first 62, visible image capturing is first 61, piezoelectricity convex block 72；Or Piezoelectricity convex block 72, input and output module 10, piezoelectricity convex block 72, infrared pick-up head are followed successively by from one end of line segment to the other end 62nd, visible image capturing is first 61, piezoelectricity convex block 72, structured light projector 80 etc..For another example the quantity of piezoelectricity convex block 72 is five, Piezoelectricity convex block 72, input and output module 10, piezoelectricity convex block 72, structured light projector are followed successively by from one end of line segment to the other end 80th, piezoelectricity convex block 72, infrared pick-up be first 62, piezoelectricity convex block 72, visible image capturing are first 61, piezoelectricity convex block 72.Certainly, piezoelectricity is convex The quantity and piezoelectricity convex block 72 of block 72, input and output module 10, infrared pick-up are first 62, visible image capturing is first 61, structure light The arrangement mode of the projector 80 is not limited to above-mentioned citing.In embodiments of the present invention, multiple piezoelectricity convex blocks 72 and 30 knot of cover board Close, more specifically multiple piezoelectricity convex blocks 72 are attached on cover board 30 by fastener 30b respectively.The processing of electronic device 100 Device is used to obtain voice signal, and applies electric signal corresponding with the voice signal, including piezoelectric body 71 to piezoelectric element 70 And mechanical deformation occurs for piezoelectric element 70 including piezoelectricity convex block 72, thus, multiple piezoelectricity convex blocks 72 with cover board 30 from being combined Multiple and different positions drive vibration module 30a to be vibrated according to the frequency of the electric signal.When the body of user connects with vibration module 30a When touching, osteoacusis sound is transmitted by the body of user with the vibration module 30a parts (for example, the cartilage of external ear, tooth) contacted To the auditory nerve of user.

Casing 20 offers spaced casing vibration through hole 2a, input and output through hole 25, structure light through hole 26, infrared Light through hole 27, visible ray through hole 28.Casing vibration through hole 2a is corresponding with piezoelectricity convex block 72, and input and output through hole 25 is defeated with inputting Go out module 10 to correspond to, structure light through hole 26 is corresponding with structured light projector 80, and infrared light through hole 27 and infrared pick-up first 62 are right Should, it is seen that light through hole 28 is corresponding with visible image capturing first 61.Wherein, input and output through hole 25 is alternatively into above-mentioned spaced Casing close to through hole 23 and, casing light filling through hole 24 and casing light sensation through hole 2f, or input and output through hole 25 is by above-mentioned machine Shell is connected with casing light sensation through hole 2f and formed close to through hole 23, casing light filling through hole 24.In addition, structure light through hole 26 and structure light The projector 80, which corresponds to, to be referred to the structure light that structured light projector 80 is sent and can be passed through from structure light through hole 26, infrared light through hole 27 with it is red The outer correspondence of light video camera head 62 refers to infrared pick-up first 62 can receive the infrared light being reflected by the object from infrared light through hole 27, it is seen that light Through hole 28 is corresponding with visible image capturing first 61 refer to visible image capturing first 61 can be received from visible ray through hole 28 be reflected by the object can See light.

In embodiments of the present invention, multiple piezoelectricity convex blocks 72 drive vibration from the multiple and different positions combined with cover board 30 Module 30a vibrates, and the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and stably conducts to use The auditory nerve at family；In addition, multiple piezoelectricity convex blocks 72 are stretched out from same piezoelectric body 71, easy to multiple piezoelectricity convex blocks 72 at the same time Apply electric signal, to be vibrated from multiple and different position synchronous drives vibration module 30a；Further more, input and output module 10, infrared light Camera 62, visible image capturing first 61 and structured light projector 80 are between cover board 30 and piezoelectric body 71, and interspersed setting There is piezoelectricity convex block 72,100 overall volume of electronic device is smaller, saves space.

Referring to Fig. 3, in some embodiments, input and output module 10 further includes light-supplementing lamp lens 18, saturating close to lamp Mirror 19, close to optical sensor lens 1h and light sensation lens 1e.Light-supplementing lamp lens 18 be arranged in encapsulating housing 11 and with infrared benefit Light lamp 12 corresponds to.It is arranged on close to lamp lens 19 in encapsulating housing 11 and corresponding with close to infrared lamp 13.It is saturating close to optical sensor Mirror 1h is arranged in encapsulating housing 11 and corresponding with proximity sensor 50.Light sensation lens 1e be arranged in encapsulating housing 11 and with light Sensor 1d is corresponded to.The infrared light that infrared light compensating lamp 12 is launched is converged under the action of light-supplementing lamp lens 18 in light filling window 1131 Project, reduce the light quantity in other regions for being transmitted to package wall 112 and encapsulation top 113.Similarly, by proximity sensor window When 1134 infrared lights launched close to infrared lamp 13 by object reflection entered are incided on proximity sensor lens 1h, approach Sensor leads 1h, reduces the light quantity that the infrared light being reflected back is transferred to outside proximity sensor 50.Similarly, close to infrared lamp 13 The infrared light of transmitting is projected being converged to close under the action of lamp lens 19 close in window 1132, and reduction is transmitted to package wall 112 and encapsulation top 113 other regions light quantity.Similarly, similarly, the visible ray entered by light sensation window 1133 incides light When feeling on lens 1e, light sensation lens 1e will be seen that light is converged on optical flame detector 1d, beyond reduction transmission of visible light to optical flame detector 1d The light quantity in region.Specifically, light-supplementing lamp lens 18, close to lamp lens 19, proximity sensor lens 1h and light sensation lens 1e With on same transparent base, more specifically, light-supplementing lamp lens 18, close to lamp lens 19, proximity sensor lens 1h and light Sense lens 1e can be integrally formed obtained with the transparent base.Certainly, input and output module 10 can also be provided only with light filling Lamp lens 18, close to any one or more in lamp lens 19, proximity sensor lens 1h and light sensation lens 1e, can not also Light-supplementing lamp lens 18 are set, close to lamp lens 19, proximity sensor lens 1h and light sensation lens 1e.

Referring to Fig. 3, in some embodiments, input and output module 10 further includes multiple metal shutter 1a, multiple Metal shutter 1a is respectively positioned in encapsulating housing 11, and multiple metal shutter 1a are respectively positioned at infrared light compensating lamp 12, close to red Outer lamp 13, proximity sensor 50 and optical flame detector 1d are arbitrarily between the two.For example, when infrared light compensating lamp 12, close to infrared lamp 13, connect When the center of nearly sensor 50 and optical flame detector 1d is located on same line segment, the quantity of metal shutter 1a is three；If line segment One end is followed successively by infrared light compensating lamp 12 to the other end, is hidden close to infrared lamp 13, proximity sensor 50 and optical flame detector 1d, three metals Baffle 1a respectively positioned at infrared light compensating lamp 12 and close between infrared lamp 13 and close to infrared lamp 13 and proximity sensor 50 it Between, between proximity sensor 50 and optical flame detector 1d.Metal shutter 1a be located at infrared light compensating lamp 12 with close to infrared lamp 13 it Between, on the one hand metal shutter 1a can shield infrared light compensating lamp 12 and close to the mutual electromagnetic interference of infrared lamp 13, red Outer light compensating lamp 12 will not interact with the luminous intensity close to infrared lamp 13 and sequential, and another aspect metal shutter 1a can be with For completely cutting off 12 place cavity of infrared light compensating lamp with that will not enter close to the cavity where infrared lamp 13, light from a cavity Another cavity.

Referring to Fig. 9, in some embodiments, input and output module 10 further includes optics sealing cover 1b.Optics sealing cover 1b It is made of light transmissive material, optics sealing cover 1b is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1b is wrapped up Firmly infrared light compensating lamp 12, close to infrared lamp 13, proximity sensor 50 and optical flame detector 1d.Specifically, optics sealing cover 1b can pass through Encapsulating injection molding and forming technology is formed, and optics sealing cover 1b can be made of transparent thermosetting epoxy resin, with use not Easily softening, optics sealing cover 1b can fix infrared light compensating lamp 12, close to infrared lamp 13, proximity sensor 50 and optical flame detector 1d Between relative position, and cause infrared light compensating lamp 12, encapsulating close to infrared lamp 13, proximity sensor 50 and optical flame detector 1d It is not easy to rock in housing 11.

In addition, referring to Fig. 9, input and output module 10 further include it is multiple go out light clapboard 1c, it is multiple go out light clapboard 1c formed In optics sealing cover 1b and positioned at infrared light compensating lamp 12, close to infrared lamp 13, proximity sensor 50 and optical flame detector 1d it Between.When infrared light compensating lamp 12, be located at close to the center of infrared lamp 13, proximity sensor 50 and optical flame detector 1d on same line segment when, The quantity for going out light clapboard 1c is three.For example, if one end of line segment is followed successively by infrared light compensating lamp 12, close to infrared lamp to the other end 13rd, proximity sensor 50 and optical flame detector 1d, three go out light clapboard 1c respectively positioned at infrared light compensating lamp 12 with close to infrared lamp 13 it Between, close between infrared lamp 13 and proximity sensor 50, between proximity sensor 50 and optical flame detector 1d.Going out light clapboard 1c can use In interval infrared light compensating lamp 12 and close to infrared lamp 13, the light that infrared light compensating lamp 12 is sent will not be from close to lamp window 1132 It is pierced by, the light sent close to infrared lamp 13 will not be pierced by from light filling window 1131.Infrared benefit can be stopped by going out light clapboard 1c Light lamp 12 and infrared light close to 13 initial transmissions of infrared lamp are incided on proximity sensor 50 and optical flame detector 1d, are stopped at the same time Enter from light sensation window 1133 and the visible ray of directive optical flame detector 1d influences infrared light compensating lamp 12 and shining close to infrared lamp 13 And proximity sensor 50 receives the infrared light of reflection.

Referring again to Figure 10 to Figure 13, cover board light filling through hole can also be offered in some embodiments, on cover board 30 34, cover board light filling through hole 34 is corresponding with casing light filling through hole 24, and the infrared light that infrared light compensating lamp 12 is launched leads to through casing light filling Electronic device 100 can be pierced by behind hole 24 from cover board light filling through hole 34.At this time, it is corresponding close to through hole 23 with casing on cover board 30 Position can set it is infrared pass through ink 40, user is difficult to the inside for seeing electronic device 100 close to through hole 23 by casing It is more beautiful close to infrared lamp 13, the shape of electronic device 100.

1 is please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to through hole 33, cover board approaches Through hole 33 is corresponding close to through hole 23 with casing, can be with close to after through hole 23 through casing close to the infrared light that infrared lamp 13 is launched Electronic device 100 is pierced by close in through hole 33 from cover board.At this time, can with 24 corresponding position of casing light filling through hole on cover board 30 To set infrared transmission ink 40, user is difficult to the infrared benefit that the inside of electronic device 100 is seen by casing light filling through hole 24 Light lamp 12, the shape of electronic device 100 are more beautiful.

In some embodiments, cover board proximity sensor through hole 37, the close sensing of cover board can also be opened up on cover board 30 Device through hole 37 is corresponding with casing proximity sensor through hole 26, and the infrared light launched close to infrared lamp 13 passes through machine after object reflects It can be incided after shell proximity sensor through hole 26 from cover board proximity sensor through hole 37 on proximity sensor 50.At this time, cover Infrared transmission ink 40 can be set on plate 30 with 26 corresponding position of casing proximity sensor through hole, and user is difficult to pass through casing Proximity sensor through hole 26 sees the proximity sensor 50 of the inside of electronic device 100, and the shape of electronic device 100 is more beautiful.

3 are please referred to Fig.1, cover board light sensation through hole 36, cover board light sensation can also be opened up in some embodiments, on cover board 30 Through hole 36 and casing light sensation through hole 2f and optical flame detector 1d are corresponding, and the visible ray outside electronic device 100 passes through cover board light sensation through hole It can be incided on optical flame detector 1d after 36 and casing light sensation through hole 2f.At this time, it is corresponding close to through hole 23 with casing on cover board 30 Position can set infrared transmission ink 40, and user is difficult to the inside for seeing electronic device 100 close to through hole 23 by casing Close to infrared lamp 13；Infrared transmission ink 40, user can also be set on cover board 30 with 24 corresponding position of casing light filling through hole Be difficult to the infrared light compensating lamp 12 that the inside of electronic device 100 is seen by casing light filling through hole 24, the shape of electronic device 100 compared with It is beautiful.

In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention. In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side Formula combines.

In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two, Three, unless otherwise specifically defined.

Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.

Claims

A kind of 1. electronic device, it is characterised in that including：

Casing；

Input and output module, the input and output module are arranged in the casing, and the input and output module includes encapsulating shell Body, infrared light compensating lamp, close to infrared lamp, proximity sensor and optical flame detector, the encapsulating housing includes package substrate, described infrared Light compensating lamp, described be encapsulated in the encapsulating housing and carry close to infrared lamp, the proximity sensor and the optical flame detector On the package substrate, the infrared light compensating lamp from it is described can be with different power to the encapsulating housing close to infrared lamp Outer transmitting infrared light, the proximity sensor be used for receive be reflected by the object by it is described close to infrared lamp transmitting infrared light To detect the object to the distance of the electronic device, the optical flame detector is used to receive the visible ray in ambient light line, and examines Survey the intensity of the visible ray；

Module is vibrated, the vibration module installation is on the housing；With

Piezoelectric element, the piezoelectric element with it is described vibration module combined and with the input and output module interval, the piezoelectricity Element is used to deform upon when being applied in electric signal so that the vibration module vibration.
2. electronic device according to claim 1, it is characterised in that the vibration module includes the lid of display screen and printing opacity Plate, the display screen set on the housing and are collectively forming host cavity with the casing, and the cover board is arranged on the machine The side of the remote host cavity on shell and positioned at the display screen, the display screen are combined with the cover board, the casing Offer spaced casing close to through hole, casing light filling through hole, casing proximity sensor through hole, casing light sensation through hole and Casing vibrates through hole, described corresponding close to through hole with the casing close to infrared lamp, and the infrared light compensating lamp is mended with the casing Light through hole corresponds to, and the proximity sensor is corresponding with the casing proximity sensor through hole, the optical flame detector and the casing light Feel through hole to correspond to, the piezoelectric element is housed in the casing vibration through hole and is combined with the cover board.
3. electronic device according to claim 2, it is characterised in that the piezoelectric element and the display screen pass through engagement Part is attached on the cover board.
4. electronic device according to claim 1, it is characterised in that the input and output module further includes chip, described Infrared light compensating lamp, described be both formed on a piece of chip close to infrared lamp, the proximity sensor and the optical flame detector.
5. electronic device according to claim 1, it is characterised in that the encapsulating housing further includes package wall and encapsulation Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute State encapsulation top formed with light filling window, close to lamp window, proximity sensor window and light sensation window, the light filling window and institute State infrared light compensating lamp correspondence, it is described close to lamp window with described correspondings close to infrared lamp, it is described approach sense window connect with described Nearly sensor corresponds to, and the light sensation window is corresponding with the optical flame detector.
6. electronic device according to claim 1, it is characterised in that it is saturating that the input and output module further includes light compensating lamp Mirror, the light-supplementing lamp lens are arranged in the encapsulating housing and corresponding with the infrared light compensating lamp；And/or

The input and output module is further included close to lamp lens, it is described be arranged on close to lamp lens in the encapsulating housing and with institute State and corresponded to close to infrared lamp；And/or

The input and output module further includes proximity sensor lens, and the proximity sensor lens are arranged on the encapsulating housing It is interior and corresponding with the proximity sensor；And/or

The input and output module further includes light sensation lens, the light sensation lens be arranged in the encapsulating housing and with the light Sensor corresponds to.
7. electronic device according to claim 1, it is characterised in that the input and output module further include be arranged on it is described Light-supplementing lamp lens in encapsulating housing, close to lamp lens, proximity sensor lens and light sensation lens, the light-supplementing lamp lens and institute State infrared light compensating lamp correspondence, it is described close to lamp lens with described corresponding close to infrared lamp, the proximity sensor lens with it is described Proximity sensor corresponds to, and the light sensation lens are corresponding with the optical flame detector, the light-supplementing lamp lens, described close to lamp lens, institute State proximity sensor lens and the light sensation lens are located on same transparent base.
8. electronic device according to claim 1, it is characterised in that the input and output module further includes multiple metals and hides Baffle, multiple metal shutters are located in the encapsulating housing and are located at the infrared light compensating lamp, are described close to red respectively In outer lamp, the proximity sensor and the optical flame detector it is any between the two.
9. electronic device according to claim 1, it is characterised in that the input and output module is further included by light transmissive material Manufactured optics sealing cover, the optics sealing cover are formed on the package substrate and in the encapsulating housing, the optics Sealing cover wraps the infrared light compensating lamp, is described close to infrared lamp, the proximity sensor and the optical flame detector.
10. electronic device according to claim 9, it is characterised in that the input and output module further includes multiple light extractions Partition plate, it is multiple it is described go out light clapboard be respectively formed in the optics sealing cover and positioned at the infrared light compensating lamp, described close to red In outer lamp, the proximity sensor and the optical flame detector it is any between the two.
11. electronic device according to claim 1, it is characterised in that formed with grounding lead on the input and output module Foot, light compensating lamp pin, draw close to lamp pin, proximity sensor pin and light sensation pin, the grounding pin and the light compensating lamp When foot is enabled, the infrared light compensating lamp launches infrared light；The grounding pin and it is described close to lamp pin be enabled when, institute State close to infrared lamp and launch infrared light；It is described close to biography when the grounding pin and the proximity sensor pin are enabled Sensor receive be reflected by the object by it is described close to infrared lamp transmitting infrared light；The grounding pin and the light sensation pin When being enabled, the intensity of the optical flame detector detection visible ray.
12. electronic device according to claim 2, it is characterised in that the surface shape that the cover board is combined with the casing Only transmit the infrared of infrared light into having and pass through ink, it is described infrared to block the casing close to through hole, the casing through ink It is at least one in light filling through hole, casing proximity sensor through hole and casing vibration through hole.
13. electronic device according to claim 2, it is characterised in that the electronic device further include infrared pick-up head, Visible image capturing head, structured light projector, the input and output module, the infrared pick-up head, the visible image capturing head It is located at the center of the structured light projector on same line segment, the piezoelectric element is located at the top of the line segment and the casing Between portion.
14. electronic device according to claim 2, it is characterised in that the electronic device further include infrared pick-up head, Visible image capturing head and structured light projector, the quantity of the piezoelectric element is multiple, and the quantity of the casing vibration through hole is Multiple, multiple piezoelectric elements are corresponding with multiple casing vibration through holes, and each piezoelectric element is housed in corresponding In the casing vibration through hole, the input and output module, the infrared pick-up head, the visible image capturing head, Duo Gesuo The center for stating piezoelectric element and the structured light projector is located on same line segment, is set between the two neighboring piezoelectric element Have in the input and output module, the infrared pick-up head, the visible image capturing head and the structured light projector extremely It is one few.
15. electronic device according to claim 2, it is characterised in that the electronic device further include infrared pick-up head, Visible image capturing head and structured light projector, the piezoelectric element include piezoelectric body and the pressure stretched out from the piezoelectric body Electric convex block, the quantity of the casing vibration through hole is multiple, multiple piezoelectricity convex blocks and multiple casing vibration through holes pair Should, each piezoelectricity convex portion is housed in the corresponding casing vibration through hole and is combined with the cover board, described defeated Enter to export module, the infrared pick-up head, the visible image capturing head and the structured light projector be located at the cover board with It is the input and output module, the infrared pick-up head, the visible image capturing head, multiple described between the piezoelectric body The center of piezoelectricity convex block and the structured light projector is located on same line segment, is provided between the two neighboring piezoelectricity convex block In the input and output module, the infrared pick-up head, the visible image capturing head and the structured light projector at least One.