CN108063150A - Electronic device - Google Patents

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Publication number
CN108063150A
CN108063150A CN201711437409.XA CN201711437409A CN108063150A CN 108063150 A CN108063150 A CN 108063150A CN 201711437409 A CN201711437409 A CN 201711437409A CN 108063150 A CN108063150 A CN 108063150A
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CN
China
Prior art keywords
close
light
infrared
lamp
casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201711437409.XA
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Chinese (zh)
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CN108063150B (en
Inventor
吴安平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201711437409.XA priority Critical patent/CN108063150B/en
Publication of CN108063150A publication Critical patent/CN108063150A/en
Priority to PCT/CN2018/118716 priority patent/WO2019128628A1/en
Application granted granted Critical
Publication of CN108063150B publication Critical patent/CN108063150B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14649—Infrared imagers

Abstract

Electronic device disclosed by the invention includes casing, input and output module, vibration module and piezoelectric element.Input and output module is arranged in casing, and input and output module includes encapsulating housing, infrared light compensating lamp, close to infrared lamp and proximity sensor.Encapsulating housing includes package substrate, and infrared light compensating lamp is encapsulated in encapsulating housing close to infrared lamp and proximity sensor and is carried on package substrate.Infrared light compensating lamp can emit infrared light with different power from close to infrared lamp outside encapsulating housing, and proximity sensor is for receiving the infrared light being reflected by the object to detect the distance of object.Vibrate module be mounted on casing on, piezoelectric element with vibration module is combined and with input and output module interval, piezoelectric element be used for deformed upon when being applied in electric signal so that vibrate module vibrates.The integrated level of input and output module is higher, small volume, and electronic device realizes that osteoacusis is transaudient using piezoelectric element and vibration module, can effectively ensure that the privacy of dialog context.

Description

Electronic device
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, the type and quantity for the function element that mobile phone needs are set It is more and more, in order to realize distance detection, ambient light detection with the functions such as the facial 3D feature recognitions of user, it is necessary to be set in electronics The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth Numerous function elements is put, the excessive space of mobile phone can be occupied.
The content of the invention
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Input and output module, the input and output module are arranged in the casing, and the input and output module includes envelope Fill housing, infrared light compensating lamp, close to infrared lamp and proximity sensor, the encapsulating housing includes package substrate, the infrared benefit Light lamp described be encapsulated in the encapsulating housing close to infrared lamp and the proximity sensor and be carried on the package substrate On, the infrared light compensating lamp can emit infrared light with different power close to infrared lamp from described outside the encapsulating housing Line, the proximity sensor is for receiving the infrared light that is reflected by the object to detect the distance of object；
Module is vibrated, the vibration module installation is on the housing；With
Piezoelectric element, the piezoelectric element with it is described vibration module combined and with the input and output module interval, it is described Piezoelectric element is used to deform upon when being applied in electric signal so that the vibration module vibration.
In some embodiments, the vibration module includes display screen and the cover board of light transmission, the display screen are arranged on Host cavity is collectively formed on the casing and with the casing, the cover board is set on the housing and positioned at the display screen The one side away from the host cavity, the display screen combined with the cover board, and the casing offers spaced casing It is described close to infrared lamp and institute close to luminous through hole, casing light filling through hole, casing close to receipts light through hole and casing vibration through hole Casing is stated to correspond to close to luminous through hole, the infrared light compensating lamp is corresponding with the casing light filling through hole, the proximity sensor and The casing is corresponded to close to light through hole is received, the piezoelectric element be housed in the casing vibration through hole and with the cover board knot It closes.
In some embodiments, the piezoelectric element and the display screen are attached to by fastener on the cover board.
In some embodiments, the input and output module further includes chip, the infrared light compensating lamp, described close to red Outer lamp and the proximity sensor are both formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly The package substrate extends and is connected at the top of the encapsulation between the package substrate, and light filling is formed at the top of the encapsulation Window, close to luminescence window and close to receive light window, the light filling window is correspondings with the infrared light compensating lamp, it is described approach shine Window is described corresponding with the proximity sensor close to light window is received with described corresponding close to infrared lamp.
In some embodiments, the input and output module further includes light-supplementing lamp lens, and the light-supplementing lamp lens are set It is in the encapsulating housing and corresponding with the infrared light compensating lamp；And/or the input and output module is further included close to lamp lens, It is described be arranged on close to lamp lens in the encapsulating housing and with it is described corresponding close to infrared lamp；And/or the input and output mould Group is further included close to sensing lens, it is described be arranged on close to sensing lens in the encapsulating housing and with the proximity sensor pair It should.
In some embodiments, the input and output module further includes that be arranged on the in vivo light compensating lamp of the encapsulating shell saturating Mirror, close to lamp lens and close to sensing lens, the light-supplementing lamp lens are corresponding with the infrared light compensating lamp, described close to lamp lens It is described corresponding with the proximity sensor close to sensing lens with described corresponding close to infrared lamp, it is the light-supplementing lamp lens, described It is located at close to lamp lens and the close sensing lens on same transparent base.
In some embodiments, the input and output module further includes multiple metal shutters, and multiple metals hide Baffle is located in the encapsulating housing and respectively positioned at the infrared light compensating lamp, described close to infrared lamp and the proximity sensor In it is arbitrary between the two.
In some embodiments, the input and output module further includes the optics sealing cover made of light transmissive material, described Optics sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps the infrared benefit It is light lamp, described close to infrared lamp and the proximity sensor.
In some embodiments, the input and output module further include it is multiple go out light clapboard, it is multiple it is described go out light clapboard It is respectively formed in the optics sealing cover and is located at the infrared light compensating lamp, is described close in infrared lamp and the proximity sensor It is arbitrary between the two.
In some embodiments, grounding pin, light compensating lamp pin are formed on the input and output module, drawn close to lamp Foot and close sensing pin, when the grounding pin and the light compensating lamp pin are enabled, the infrared light compensating lamp transmitting is infrared Light；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared lamp emit infrared light；The ground connection Pin and it is described close to sensing pin be enabled when, infrared light that proximity sensor reception is reflected by the object is to detect object The distance of body.
In some embodiments, the cover board is formed with the surface that the casing is combined and only transmits the infrared of infrared light Through ink, the infrared transmission ink blocks the casing and is connect close to luminous through hole, the casing light filling through hole, the casing It is at least one in nearly receipts light through hole and casing vibration through hole.
In some embodiments, the electronic device further includes optical flame detector and imaging modules, and the imaging modules include Microscope base, the lens barrel on the microscope base and the imaging sensor being housed in the microscope base, the microscope base include being located at institute The mounting surface between lens barrel and described image sensor is stated, the optical flame detector is arranged on the mounting surface.
In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head Kind.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and structure light The projector, the input and output module, the infrared pick-up head, the visible image capturing head, the piezoelectric element and described The center of structured light projector is located on same line segment, is followed successively by from one end of the line segment to the other end：
It is the input and output module, the structured light projector, the piezoelectric element, the infrared pick-up head, described Visible image capturing head；Or
It is the input and output module, the infrared pick-up head, the piezoelectric element, the visible image capturing head, described Structured light projector；Or
It is the infrared pick-up head, the input and output module, the piezoelectric element, the visible image capturing head, described Structured light projector；Or
It is the infrared pick-up head, the visible image capturing head, the piezoelectric element, the input and output module, described Structured light projector.
In some embodiments, the electronic device further includes imaging modules and optical flame detector, the imaging modules installation On the housing, the imaging modules include camera case and camera lens module, the top surface of the camera case for cascaded surface simultaneously Including connected the first sub- top surface and the second sub- top surface, the relatively described first sub- top surface inclination of the second sub- top surface and with it is described First sub- top surface forms notch, and the top surface offers light extraction through hole, and the camera lens module is housed in the camera case simultaneously Corresponding with the light extraction through hole, the optical flame detector is arranged at the described first sub- top surface.
In some embodiments, the electronic device further includes imaging modules and optical flame detector, and the imaging modules include Camera case and two camera lens modules offer notch to form step-like top surface on the top surface of the camera case, described Top surface includes the first tread and the second tread less than first tread, opens up on first tread and leads to there are two light extraction Hole, each light extraction through hole is corresponding with the camera lens module, and the optical flame detector is arranged at second tread.
In some embodiments, the electronic device further includes imaging modules and optical flame detector, and the imaging modules include Microscope base, the lens barrel on the microscope base and part are arranged on the substrate in the microscope base, and the optical flame detector is arranged on described On substrate.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head, structure light and throws Emitter, in the input and output module, the infrared pick-up head, the visible image capturing head and the structured light projector The heart is located on same line segment, and the piezoelectric element is between the line segment and the top of the casing.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and structure light The projector, the quantity of the piezoelectric element is multiple, and the quantity of the casing vibration through hole is multiple, multiple piezoelectric elements Corresponding with multiple casing vibration through holes, each piezoelectric element is housed in the corresponding casing vibration through hole, institute State input and output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectric elements and the structure light The center of the projector is located on same line segment, and the input and output module, institute are provided between the two neighboring piezoelectric element It states at least one in infrared pick-up head, the visible image capturing head and the structured light projector.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and structure light The projector, the piezoelectric element include piezoelectric body and the piezoelectricity convex block stretched out from the piezoelectric body, and the casing vibration is logical The quantity in hole is multiple, and multiple piezoelectricity convex blocks are corresponding with multiple casing vibration through holes, each piezoelectricity convex block portion Divide and be housed in the corresponding casing vibration through hole and combined with the cover board, the input and output module, the infrared light Camera, the visible image capturing head and the structured light projector are described between the cover board and the piezoelectric body Input and output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectricity convex blocks and the structure light are thrown The center of emitter is located on same line segment, and the input and output module, described is provided between the two neighboring piezoelectricity convex block It is at least one in infrared pick-up head, the visible image capturing head and the structured light projector.
In the electronic device of embodiment of the present invention, input and output module by infrared light compensating lamp, close to infrared lamp with it is close Sensor integration is a single package body structure, has gathered transmitting and has received infrared light with the function of infrared distance measurement and infrared benefit The function of light, therefore, the integrated level of input and output module are higher, small volume, and input and output module has saved the infrared benefit of realization The space of the function of light and infrared distance measurement.Further, since infrared light compensating lamp, be carried on close to infrared lamp and proximity sensor it is same On a package substrate, infrared light compensating lamp compared to traditional handicraft is respectively adopted not close to infrared lamp and proximity sensor needs Recombinant is manufactured with wafer to encapsulate to PCB substrate, improves packaging efficiency.Further more, electronic device is using piezoelectric element and shakes Dynamic model group realizes that osteoacusis is transaudient, and instead of traditional telephone receiver structure by air transmitted sound, call is on the one hand effectively ensured The privacy of content, on the other hand, due to eliminating the receiver of script, avoid open up on the cover board it is corresponding with receiver Through hole, it is simpler in technique, it is also more aesthetically pleasing in appearance.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change It obtains substantially and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the input and output module of the electronic device of embodiment of the present invention；
Fig. 3 is the schematic cross-section of the input and output module of the electronic device of embodiment of the present invention；
Fig. 4 is the stereoscopic schematic diagram of the input and output module of the electronic device of embodiment of the present invention；
Fig. 5 is schematic cross-section of the electronic device along V-V lines in Fig. 1；
Fig. 6 is partial sectional schematic view of the electronic device in Fig. 1 along line VI -- VI；
Fig. 7 is the optical flame detector of the electronic device of certain embodiments of the present invention and the stereoscopic schematic diagram of imaging modules；
Fig. 8 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Fig. 9 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 10 to Figure 11 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 12 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 13 is partial sectional schematic view of the electronic device along XIII-XIII lines in Figure 12；
Figure 14 is the schematic cross-section of the input and output module of the electronic device of embodiment of the present invention；
Figure 15 to Figure 17 be embodiment of the present invention electronic device along with XV-XV lines correspondence position intercepts in Fig. 1 portion Partial cross-section schematic diagram；
Figure 18 to Figure 25 is the optical flame detector of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing To the same or similar element of expression eventually or there is same or like element.In addition, the sheet described below in conjunction with the accompanying drawings The embodiment of invention is exemplary, and is only used for explaining embodiments of the present invention, and it is not intended that limit of the invention System.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature It is that the first and second features contact directly or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity Sub- component includes input and output module 10, optical flame detector 50 (such as Fig. 7), vibration module 30a (such as Fig. 5), piezoelectric element 70, imaging Module 60 (such as Fig. 7) and structured light projector 80.Electronic device 100 can be mobile phone, tablet computer, laptop, intelligence Wrist-watch, Intelligent bracelet, automatic teller machine etc., the embodiment of the present invention are illustrated so that electronic device 100 is mobile phone as an example, it will be understood that The concrete form of electronic device 100 can be other, and this is not restricted.
Fig. 2 and Fig. 3 are referred to, input and output module 10 is single package body structure, including encapsulating housing 11, infrared light compensating lamp 12nd, close to infrared lamp 13 and proximity sensor 1d.
Encapsulating housing 11 for encapsulating infrared light compensating lamp 12 simultaneously, close to infrared lamp 13 and proximity sensor 1d, in other words, Infrared light compensating lamp 12 is encapsulated in close to infrared lamp 13 and proximity sensor 1d in encapsulating housing 11 simultaneously.Encapsulating housing 11 includes Package substrate 111, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference (Electromagnetic Interference, EMI) shielding material is made, to avoid extraneous electromagnetic interference to input and output Module 10 has an impact.In present embodiment, infrared light compensating lamp 12 is located at close to the center of infrared lamp 13 and proximity sensor 1d On same line segment, such as：Along one end of line segment to the other end be followed successively by infrared light compensating lamp 12, close to infrared lamp 13 and close to sensing Device 1d；Alternatively, it is followed successively by along one end of line segment to the other end close to infrared lamp 13, infrared light compensating lamp 12 and proximity sensor 1d； Alternatively, it is followed successively by along one end of line segment to the other end close to infrared lamp 13, proximity sensor 1d and infrared light compensating lamp 12.At other In embodiment, infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d the line of centres it is triangular in shape.
Package substrate 111 for carrying infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d.It is inputted in manufacture When exporting module 10, infrared light compensating lamp 12 can be formed in close to infrared lamp 13 and proximity sensor 1d on a piece of chip 14, then It is set along by infrared light compensating lamp 12, close to infrared lamp 13, proximity sensor 1d and chip 14 on package substrate 111, specifically Chip 14 can be bonded on package substrate 111 by ground.Meanwhile package substrate 111 can be used for and electronic device 100 Other parts (such as the casing 20 of electronic device 100, mainboard etc.) connect, and input and output module 10 is fixed on electronics dress It puts in 100.
Package wall 112 can surround infrared light compensating lamp 12, be set close to infrared lamp 13 and proximity sensor 1d, package-side Wall 112 extends from package substrate 111, and package wall 112 can be combined with package substrate 111, it is preferred that package wall 112 and envelope Substrate 111 is filled to be detachably connected, in order to remove after package wall 112 to infrared light compensating lamp 12, close to 13 and of infrared lamp Proximity sensor 1d is overhauled.The making material of package wall 112 can be the material of impermeable infrared light, to avoid infrared benefit Light lamp 12 or the infrared light sent close to infrared lamp 13 pass through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113 It is formed with light filling window 1131, close to luminescence window 1132 and close to receiving light window 1133, light filling window 1131 and infrared light filling Lamp 12 corresponds to, and the infrared light that infrared light compensating lamp 12 emits is pierced by from light filling window 1131；Close to luminescence window 1132 with close to red Outer lamp 13 corresponds to, and the infrared light emitted close to infrared lamp 13 is pierced by from close to luminescence window 1132；Close to receive light window 1133 with Proximity sensor 1d is corresponded to, and the infrared light being reflected by the object can pass through close to receipts light window 1133 and incide into proximity sensor On 1d.Encapsulation top 113 integrally formed can be obtained with package wall 112, can also split shape to obtain.In an example In, light filling window 1131, close to luminescence window 1132 and close to receive light window 1133 be through hole, encapsulation top 113 making Material is impermeable infrared light and the material of visible ray.In another example, encapsulation top 113 by impermeable infrared light material, thoroughly Infrared light and the material co-manufactured being opaque to visible light but form, specifically, light filling window 1131, close to 1132 and of luminescence window It is made close to light window 1133 is received of the material of saturating infrared light, remaining position is by impermeable infrared light and the material system being opaque to visible light but Into.Further, light filling window 1131 and lens arrangement is could be formed with close to luminescence window 1132, to improve from light filling window 1131 and close to the infrared light emission angle that luminescence window 1132 projects, such as light filling window 1131 is formed with concavees lens structure, So that the divergence of beam through light filling window 1131 outwards projects；Convex lens structures are formed with close to luminescence window 1132, so that Gather outside injection through the light close to luminescence window 1132；Lens arrangement can also be formed with close to light window 1133 is received, There are convex lens structures to improve from close to the infrared light emission angle for receiving 1133 incidence of light window, such as close to light window 1133 is received So that by gathering close to the light for receiving 1133 incidence of light window and projecting on proximity sensor 1d.
Infrared light compensating lamp 12 can be formed in close to infrared lamp 13 and proximity sensor 1d on a piece of chip 14, into one Step reduces infrared light compensating lamp 12, integrated close to infrared lamp 13 and proximity sensor 1d after volume, and preparation process is simpler.It is red Outer light compensating lamp 12 can emit infrared light, infrared light through light filling window 1131 to project body surface, electronic device 100 it is red Outer light video camera head 62 is (as shown in Figure 1) to receive the infrared light that is reflected by the object to obtain the image information of object (at this point, infrared benefit Light lamp 12 is used for infrared light filling).Infrared light can be emitted close to infrared lamp 13, infrared light is passed through close to luminescence window 1132 and reached Body surface, proximity sensor 1d are received by the infrared light being reflected by the object close to 1133 incidence of receipts light window, to judge object Body is to the distance (at this point, close to infrared lamp 13 be used for infrared distance measurement) of electronic device 100.Optical flame detector 50 receive ambient light in can See light, and detect the intensity (as shown in Figure 7) of visible ray.
Infrared light compensating lamp 12 can emit infrared light with different power from close to infrared lamp 13 outside encapsulating housing 11, Specifically, with that can emit infrared light simultaneously close to infrared lamp 13, input and output module 10 is used for infrared light compensating lamp 12 simultaneously Infrared light filling and infrared distance measurement；Can also infrared light compensating lamp 12 emit light and do not emit light close to infrared lamp 13, input is defeated Go out module 10 and be only used for infrared light filling；Can also infrared light compensating lamp 12 do not emit light and close to infrared lamp 13 emit light, it is defeated Enter to export module 10 and be only used for infrared distance measurement.
Incorporated by reference to Fig. 4, in embodiments of the present invention, grounding pin 15 is formed on input and output module 10, light compensating lamp draws Foot 16, close to lamp pin 17 and close to sensing pin 1f.Grounding pin 15, light compensating lamp pin 16, close to lamp pin 17 and close Sensing pin 1f can be formed on package substrate 111, (that is, be grounded when grounding pin 15 and light compensating lamp pin 16 are enabled When pin 15 and light compensating lamp pin 16 access circuit turn-on), infrared light compensating lamp 12 emits infrared light；When grounding pin 15 and connect When low beam pin 17 is enabled (that is, grounding pin 15 and close to lamp pin 17 access circuit turn-on when), sent out close to infrared lamp 13 Penetrate infrared light.When grounding pin 15 and approach (that is, grounding pin 15 and close sensing pin 1f when sensing pin 1f is enabled When accessing circuit turn-on), the infrared light being reflected by the object that proximity sensor 1d detections are sent out close to infrared lamp 13 is to make For judgment object to the foundation of the distance of electronic device 100.
It please refers to Fig.1 and Fig. 5, casing 20 can be as the installation carrier of input and output module 10, in other words, input and output Module 10 can be arranged in casing 20.Casing 20 can be the shell of electronic device 100.
Also referring to Fig. 1, Fig. 5 and Fig. 6, casing 20 includes top 21 and bottom 22, corresponding with electronic component Position, casing 20 offer spaced casing close to luminous through hole 23, casing light filling through hole 24, the close receipts light through hole of casing 2f and casing vibration through hole 2a.When input and output module 10 is arranged in casing 20, shine close to infrared lamp 13 and casing are close Through hole 23 corresponds to, and infrared light compensating lamp 12 is corresponding with casing light filling through hole 24, the proximity sensor 1d and close receipts light through hole 2f of casing It is corresponding.It wherein can be from casing close to the light sent close to infrared lamp 13 that refers to corresponding with the close through hole 23 that shines of casing of infrared lamp 13 Passed through close to luminous through hole 23, specifically, can be close to infrared lamp 13 and casing close to luminous 23 face of through hole or The light emitted close to infrared lamp 13 is after light-guide device acts on through the close luminous through hole 23 of casing.Infrared light compensating lamp 12 and machine Shell light filling through hole 24 corresponds to similarly, and therefore not to repeat here.Close to receiving, light through hole 2f is corresponding to be referred to by object proximity sensor 1d with casing The infrared light of body reflection can be passed through and incided on proximity sensor 1d from casing close to light through hole 2f is received, specifically, can be with It is that proximity sensor 1d is received with casing close to the light for receiving light through hole 2f faces or infrared light incidence through casing is close Light through hole 2f is simultaneously incided into after light-guide device acts on proximity sensor 1d.In the embodiment illustrated in fig. 6, casing approaches Shine through hole 23, casing light filling through hole 24 and casing close to receive light through hole 2f can be apart from one another by it is certain, in other implementations Example, in, casing can also interconnect close to luminous through hole 23, casing light filling through hole 24 and casing close to light through hole 2f is received 's.
Module 30a is vibrated to be mounted on casing 20.Vibration module 30a may include display screen 90 and cover board 30, show in other words Display screen 90 combines to form vibration module 30a with cover board 30, to promote the rigidity of vibration module 30a.Display screen 90 is arranged on casing Host cavity 91 is formed on 20 and with casing 20, cover board 30 is arranged on casing 20 and is located at the separate host cavity 91 of display screen 90 One side, to protect display screen 90.Since the input and output module 10 of embodiment of the present invention can occupy smaller volume, because This, for setting the volume of display screen 90 that can correspond to increase in casing 20, to improve the screen accounting of electronic device 100.Tool Body, display screen 90, input and output module 10 and piezoelectric element 70 are arranged between top 21 and bottom 22, are normally made in user In the state of electronic device 100, top 21 is located at the top of bottom 22, as shown in Figure 1, input and output module 10 can be set Between display screen 90 and top 21.In other embodiments, display screen 90 can be that screen opens up jagged, display screen comprehensively 90 surround input and output module 10, and input and output module 10 exposes from the notch of display screen 90.
Piezoelectric element 70 is made of ceramics or quartz crystal materials, and piezoelectric element 70 can be single-chip, twin crystal sheet or layer The piezoelectric element 70 of pressure.Piezoelectric element 70 is combined with vibration module 30a and is spaced with input and output module 10.Specifically, piezoelectricity Element 70 is housed in casing vibration through hole 2a and is combined with cover board 30, and is spaced with casing 20, Ke Yishi：Piezoelectric element 70 It point is housed in casing vibration through hole 2a or piezoelectric element 70 is housed in completely in the logical 2a holes of casing vibration.When piezoelectric element 70 Both ends when being applied with electric signal (voltage), due to inverse piezoelectric effect, mechanical deformation occurs for piezoelectric element 70, such as expansion or receives Contracting drives the vibration module 30a combined with piezoelectric element 70 to be vibrated according to the frequency of the electric signal as a result,.When the body of user When being contacted with vibration module 30a, osteoacusis sound is by the body of user with vibrating part that module 30a is contacted (for example, external ear Cartilage, tooth) it is sent to the auditory nerve of user.In this way, user can realize language by piezoelectric element 70 and vibration module 30a Sound such as is conversed, listens to music the functions.In embodiments of the present invention, the processor of electronic device 100 is for obtaining voice signal, and The both ends of piezoelectric element 70 apply electric signal corresponding with the voice signal.
It is appreciated that traditional telephone receiver structure uses air transmitted sound, part acoustic pressure usually exists when receiver works 90dB~100dB or so, in ambient enviroment quieter (under the working environment as 50dB or so) even if sound is transferred to week It encloses 1 meter of scope and also still remains with 50dB~60dB or so, the chat script between caller is caused to be perceived by surrounding, secret is caused to be let out Dew.The electronic device 100 of embodiment of the present invention realizes that osteoacusis is transaudient using piezoelectric element 70 and vibration module 30a, call Sound be mainly perceived by the user by the osteoacusis vibrated, can effectively ensure that the privacy of dialog context.
Referring to Fig. 5 and Fig. 6, piezoelectric element 70 and display screen 90 are attached to by fastener 30b on cover board 30. Fastener 30b is with heat curable properties, the adhesive of UV-curing characteristics, double faced adhesive tape, viscose etc..For example, fastener 30b can To be Photoelasticity resin (the UV curable acrylic adhesive of colorless and transparent).Cover board 30 is combined with piezoelectric element 70 Region and cover board 30 combined with display screen 90 it is interregional every being subject to piezoelectric element 70 with the display for preventing display screen 90 Interference.Certainly, cover board 30 can also be bonded to casing 20 by fastener 30b, be set directly at compared to cover board 30 on casing 20, The vibration of vibration module 30a can be prevented to be transmitted directly onto casing 20, to reduce user because the Oscillation Amplitude of casing 20 Excessive and the electronic device 100 that drops possibility.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated Enter to export after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In reality as shown in Figure 6 It applies in example, cover board 30 covers casing light filling through hole 24, casing receives light through hole 2f and casing close to shine through hole 23, casing are close Vibrate through hole 2a, penetrate ink 40 coated with infrared on the inner surface 32 of cover board 30, it is infrared through ink 40 have to infrared light compared with High transmitance, such as 85% or more is can reach, and have higher attenuation rate to visible ray, such as more than 70% is can reach, So that user is during normal use, visually it is difficult to see that on electronic device 100 by the infrared region covered through ink 40.Specifically Ground, it is infrared through ink 40 can cover on inner surface 32 not with 90 corresponding region of display screen.
It is infrared to block casing close to luminous through hole 23, casing light filling through hole 24, the close receipts of casing through ink 40 It is at least one in light through hole 2f and casing vibration through hole 2a, i.e. infrared to cover casing simultaneously close to hair through ink 40 Light through hole 23, casing light filling through hole 24, casing vibrate through hole 2a (as shown in Figure 6), Yong Hunan close to receipts light through hole 2f and casing It is seen with vibrating through hole 2a close to receipts light through hole 2f and casing close to luminous through hole 23, casing light filling through hole 24, casing by casing To the internal structure of electronic device 100, the shape of electronic device 100 is more beautiful；It is infrared to cover casing through ink 40 Close to luminous through hole 23, and the close receipts light through hole 2f of casing light filling through hole 24, casing and casing vibration through hole 2a are not covered；It is infrared Casing light filling through hole 24 can also be covered through ink 40, and does not cover casing and leads to close to luminous through hole 23, casing close to light is received Hole 2f and casing vibration through hole 2a；It is infrared to cover casing close to receipts light through hole 2f through ink 40, and casing is not covered Close to luminous through hole 23, casing light filling through hole 24 and casing vibration through hole 2a；Infrared transmission ink 40 can also cover casing and shake Dynamic through hole 2a and casing do not cover casing close to luminous through hole 23 and casing light filling through hole 24 close to receipts light through hole 2f；It is infrared Casing can also be covered close to luminous through hole 23 and casing light filling through hole 24 through ink 40, and is not covered casing and led to close to light is received Hole 2f and casing vibration through hole 2a etc., this is not restricted.
Referring to Fig. 7, optical flame detector 50 is single packaging body.Optical flame detector 50 receives the visible ray in ambient light, and detects visible The intensity of light, using the foundation of the display brightness as control display screen 90.
It please refers to Fig.1 and Fig. 7, imaging modules 60 can be visible image capturing first 61 and one in infrared pick-up first 62 Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, and image passes Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it Between.In the embodiment as shown in figure 7, optical flame detector 50 is arranged on mounting surface 631, and specifically, optical flame detector 50 is in mounting surface 631 The plane orthographic projection at place is at least partly dropped on mounting surface 631, in this way, optical flame detector 50 sets tighter with imaging modules 60 It gathers, the horizontal space that the two occupies jointly is smaller.
Referring to Fig. 1, structured light projector 80 is used for outside emitting structural light, on project structured light to testee after quilt Reflection, the structure light reflected can be received by infrared pick-up first 62, and the processor of electronic device 100 is further analyzed by infrared The structure light that light video camera head 62 receives, to obtain the depth information of testee.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, defeated Enter to export that module 10, infrared pick-up are first 62, visible image capturing is first 61, the centre bit of piezoelectric element 70 and structured light projector 80 In on same line segment.Specifically, be followed successively by from one end of line segment to the other end input and output module 10, structured light projector 80, Piezoelectric element 70, infrared pick-up are first 62, visible image capturing first 61 (as shown in Figure 8), at this point, visible image capturing first 61 and infrared Light video camera head 62 can form double photography/videography heads (as shown in figure 22)；Or be followed successively by from one end of line segment to the other end input it is defeated Go out that module 10, infrared pick-up first 62, piezoelectric element 70, visible image capturing be first 61, structured light projector 80 (as shown in Figure 1)； Or infrared pick-up first 62, input and output module 10, piezoelectric element 70, visible ray are followed successively by from one end of line segment to the other end Camera 61, structured light projector 80；Or it is followed successively by that infrared pick-up is first 62, visible ray is taken the photograph from one end of line segment to the other end As first 61, piezoelectric element 70, input and output module 10, structured light projector 80, at this point, visible image capturing first 61 and infrared light are taken the photograph Double photography/videography heads (as shown in figure 22) can be formed as first 62.Certainly, input and output module 10, infrared pick-up be first 62, piezoelectricity Element 70, visible image capturing are first 61, the arrangement mode of structured light projector 80 is not limited to above-mentioned citing, can also there is other, Such as the shapes such as the center arrangement of each electronic component is in the arc-shaped, center arrangement is rectangular.
Referring to Fig. 9, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62.Input and output module 10th, infrared pick-up is first 62, the center of visible image capturing first 61 and structured light projector 80 is located on same line segment, piezoelectric element 70 between line segment and the top 21 of casing 20.Specifically, input and output module is followed successively by from one end of line segment to the other end 10th, structured light projector 80, infrared pick-up be first 62, visible image capturing first 61；Or from one end of line segment to the other end successively For input and output module 10, infrared pick-up be first 62, visible image capturing is first 61, structured light projector 80 (as shown in Figure 9)；Or It is followed successively by that infrared pick-up first 62, input and output module 10, visible image capturing be first 61, structure light from one end of line segment to the other end The projector 80；Or it is followed successively by that infrared pick-up is first 62, visible image capturing is first 61, input and output from one end of line segment to the other end Module 10, structured light projector 80.Certainly, input and output module 10, infrared pick-up be first 62, visible image capturing is first 61, structure The arrangement mode of light projector 80 is not limited to above-mentioned citing.In embodiments of the present invention, the center of piezoelectric element 70 is not located at On the line segment, having saved each electronic component on cover board 30, (input and output module 10, infrared pick-up are first 62, visible image capturing First 61, structured light projector 80 etc.) occupy horizontal space.
Further, incorporated by reference to Fig. 7, optical flame detector 50 can be arranged on the mounting surface 631 of infrared pick-up first 62, also may be used To be arranged on the mounting surface 631 of visible image capturing first 61, certainly, optical flame detector 50 can not also be arranged on mounting surface 631, example Such as, optical flame detector 50 can be disposed adjacent with input and output module 10 or is disposed adjacent with piezoelectric element 70, not limit herein System.
To sum up, in the electronic device 100 of embodiment of the present invention, input and output module 10 is by infrared light compensating lamp 12, close Infrared lamp 13 and proximity sensor 1d is integrated into a single package body structure, has gathered transmitting and has received infrared light with infrared distance measurement Function and infrared light filling function, therefore, the integrated level of input and output module 10 is higher, small volume, input and output module 10 have saved the space of the function of the infrared light filling of realization and infrared distance measurement.Further, since infrared light compensating lamp 12, close to infrared lamp 13 It is carried on proximity sensor 1d on same package substrate 111, infrared light compensating lamp 12 compared to traditional handicraft, close to infrared Lamp 13 and proximity sensor 1d, which need different wafers are respectively adopted, to be manufactured recombinants and is encapsulated to PCB substrate, improves encapsulation effect Rate.Further more, electronic device 100 realizes that osteoacusis is transaudient using piezoelectric element 70 and vibration module 30a, instead of traditional by sky The telephone receiver structure of gas conduction sound, on the one hand, can effectively ensure that the privacy of dialog context；On the other hand, due to eliminating The receiver of script avoids and through hole corresponding with receiver is opened up on cover board 30, simpler in technique, in appearance also more Beauty, and can prevent dust or moisture from entering in electronic device 100.
Fig. 6 and Figure 10 are referred to, in some embodiments, imaging modules 60 include visible image capturing first 61 and infrared light Camera 62.Casing 20 offers spaced casing close to luminous through hole 23, casing light filling through hole 24, the close receipts light of casing Through hole 2f and casing vibration through hole 2a., infrared light compensating lamp 12 and machine corresponding with the close luminous through hole 23 of casing close to infrared lamp 13 Shell light filling through hole 24 corresponds to, and proximity sensor 1d is corresponding close to light through hole 2f is received with casing.The quantity of piezoelectric element 70 to be multiple, The quantity of casing vibration through hole 2a is multiple, and multiple piezoelectric elements 70 are corresponding with multiple casings vibration through hole 2a, each piezoelectricity member Part 70 is housed in corresponding casing vibration through hole 2a.Input and output module 10, infrared pick-up are first 62, visible image capturing head 61st, the center of multiple piezoelectric elements 70 and structured light projector 80 is located on same line segment, between two neighboring piezoelectric element 70 At least one be provided in input and output module 10, infrared pick-up first 62, visible image capturing first 61 and structured light projector 80 It is a.For example, the quantity of piezoelectric element 70 is two, piezoelectric element 70, input and output are followed successively by from one end of line segment to the other end Module 10, structured light projector 80, infrared pick-up are first 62, visible image capturing is first 61, piezoelectric element 70 (as shown in Figure 10)；Or Person is followed successively by that piezoelectric element 70, input and output module 10, infrared pick-up be first 62, visible ray is taken the photograph from one end of line segment to the other end As first 61, piezoelectric element 70, structured light projector 80 etc..In another example the quantity of piezoelectric element 70 is three, from one end of line segment Piezoelectric element 70, input and output module 10, structured light projector 80, piezoelectric element 70, infrared pick-up are followed successively by the other end First 62, visible image capturing is first 61, piezoelectric element 70 (as shown in figure 11)；Or piezoelectricity is followed successively by the other end from one end of line segment Element 70, input and output module 10, piezoelectric element 70, infrared pick-up are first 62, visible image capturing is first 61, piezoelectric element 70, knot Structure light projector 80 etc..Certainly, the quantity of piezoelectric element 70 and piezoelectric element 70, input and output module 10, infrared pick-up First 62, visible image capturing is first 61, the arrangement mode of structured light projector 80 is not limited to above-mentioned citing.In the embodiment of the present invention In, multiple piezoelectric elements 70 are combined with cover board 30, are in particular that multiple piezoelectric elements 70 are attached to lid by fastener 30b respectively On plate 30.The processor of electronic device 100 for obtaining voice signal, and apply simultaneously at the both ends of multiple piezoelectric elements 70 with Mechanical deformation occurs for the corresponding electric signal of the voice signal, multiple piezoelectric elements 70, as a result, multiple piezoelectric elements 70 from lid Multiple and different positions that plate 30 combines drive vibration module 30a to be vibrated according to the frequency of the electric signal.When the body of user is with shaking When dynamic model group 30a is contacted, the part that osteoacusis sound is contacted by the body of user with vibration module 30a is (for example, external ear is soft Bone, tooth) it is sent to the auditory nerve of user.
In embodiments of the present invention, multiple piezoelectric elements 70 drive simultaneously from the multiple and different positions combined with cover board 30 Vibrate module 30a vibration, the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts To the auditory nerve of user.
Fig. 6, Figure 12 and Figure 13 are referred to, in some embodiments, imaging modules 60 include first 61 He of visible image capturing Infrared pick-up first 62.Casing 20 offers spaced casing and is connect close to luminous through hole 23, casing light filling through hole 24, casing It is near to receive light through hole 2f and casing vibration through hole 2a., the infrared light compensating lamp corresponding with the close luminous through hole 23 of casing close to infrared lamp 13 12 is corresponding with casing light filling through hole 24, and proximity sensor 1d is corresponding close to light through hole 2f is received with casing.Piezoelectric element 70 includes pressure Electric body 71 and the piezoelectricity convex block 72 stretched out from piezoelectric body 71, the quantity of piezoelectricity convex block 72 is multiple, casing vibration through hole 2a Quantity to be multiple, multiple piezoelectricity convex blocks 72 vibrate that through hole 2a is corresponding, and each 72 partial receipt of piezoelectricity convex block exists with multiple casings It is combined in corresponding casing vibration through hole 2a and with cover board 30.Input and output module 10, infrared pick-up are first 62, visible image capturing First 61 and structured light projector 80 between cover board 30 and piezoelectric body 71.Input and output module 10, infrared pick-up head 62nd, visible image capturing is first 61, the center of multiple piezoelectricity convex blocks 72 and structured light projector 80 is located on same line segment, two neighboring Input and output module 10, infrared pick-up first 62, visible image capturing first 61 and project structured light are provided between piezoelectricity convex block 72 It is at least one in device 80.For example, the quantity of piezoelectricity convex block 72 is two, it is convex to be followed successively by piezoelectricity from one end of line segment to the other end Block 72, input and output module 10, structured light projector 80, infrared pick-up are first 62, visible image capturing is first 61, piezoelectricity convex block 72； Or it is followed successively by that piezoelectricity convex block 72, input and output module 10, infrared pick-up be first 62, visible ray from one end of line segment to the other end Camera 61, piezoelectricity convex block 72, structured light projector 80 etc..In another example the quantity of piezoelectricity convex block 72 is three, from the one of line segment The other end is held to be followed successively by piezoelectricity convex block 72, input and output module 10, structured light projector 80, piezoelectricity convex block 72, infrared light to take the photograph As first 62, visible image capturing is first 61, piezoelectricity convex block 72；Or piezoelectricity convex block 72, defeated is followed successively by from one end of line segment to the other end Enter to export that module 10, piezoelectricity convex block 72, infrared pick-up are first 62, visible image capturing is first 61, piezoelectricity convex block 72, structured light projector 80 etc..For another example the quantity of piezoelectricity convex block 72 is five, piezoelectricity convex block 72, input are followed successively by from one end of line segment to the other end Export module 10, piezoelectricity convex block 72, structured light projector 80, piezoelectricity convex block 72, infrared pick-up first 62, piezoelectricity convex block 72, can See light video camera head 61, piezoelectricity convex block 72 (as shown in figure 13).Certainly, the quantity of piezoelectricity convex block 72 and piezoelectricity convex block 72, input Output module 10, infrared pick-up is first 62, visible image capturing is first 61, the arrangement mode of structured light projector 80 be not limited to it is above-mentioned Citing.In embodiments of the present invention, multiple piezoelectricity convex blocks 72 are combined with cover board 30, and more specifically multiple piezoelectricity convex blocks 72 are distinguished It is attached to by fastener 30b on cover board 30.The processor of electronic device 100 is used to obtain voice signal, and to piezoelectric element 70 apply electric signal corresponding with the voice signal, and the piezoelectric element 70 including piezoelectric body 71 and piezoelectricity convex block 72 occurs Mechanical deformation, multiple piezoelectricity convex blocks 72 drive from the multiple and different positions combined with cover board 30 as a result, vibrates module 30a according to this The frequency vibration of electric signal.When the body of user is contacted with vibration module 30a, body and vibration of the osteoacusis sound by user The part (for example, the cartilage of external ear, tooth) of module 30a contacts is sent to the auditory nerve of user.
In as shown for example in fig.13, casing 20 offers spaced casing vibration through hole 2a, input and output Through hole 25, structure light through hole 26, infrared light through hole 27, visible ray through hole 28.Casing vibration through hole 2a is corresponding with piezoelectricity convex block 72, Input and output through hole 25 is corresponding with input and output module 10, and structure light through hole 26 is corresponding with structured light projector 80, and infrared light leads to Hole 27 is corresponding with infrared pick-up first 62, it is seen that light through hole 28 is corresponding with visible image capturing first 61.Wherein, input and output through hole 25 Alternatively into the close luminous through hole 23 of above-mentioned spaced casing and casing light filling through hole 24 and the close receipts light through hole of casing 2f or input and output through hole 25 are led to by said machine casing close to luminous through hole 23, casing light filling through hole 24 and casing close to light is received Hole 2f connects to be formed.In addition, the structure for referring to structured light projector 80 and sending corresponding with structured light projector 80 of structure light through hole 26 Light can be passed through from structure light through hole 26, infrared light through hole 27 is corresponding with infrared pick-up first 62 refer to infrared pick-up first 62 can be from red Outer smooth through hole 27 receives the infrared light being reflected by the object, it is seen that light through hole 28 is corresponding with visible image capturing first 61 to refer to visible image capturing First 61 can receive the visible ray being reflected by the object from visible ray through hole 28.
In embodiments of the present invention, multiple piezoelectricity convex blocks 72 drive vibration from the multiple and different positions combined with cover board 30 Module 30a vibrates, and the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts to use The auditory nerve at family；In addition, multiple piezoelectricity convex blocks 72 are stretched out from same piezoelectric body 71, convenient for multiple piezoelectricity convex blocks 72 simultaneously Apply electric signal, to be vibrated from multiple and different position synchronous drives vibration module 30a；Further more, input and output module 10, infrared light Camera 62, visible image capturing first 61 and structured light projector 80 are between cover board 30 and piezoelectric body 71, and interspersed setting There is piezoelectricity convex block 72,100 overall volume of electronic device is smaller, saves space.
Referring to Fig. 3, in some embodiments, input and output module 10 further includes light-supplementing lamp lens 18, saturating close to lamp Mirror 19 and close sensing lens 1e.Light-supplementing lamp lens 18 are arranged in encapsulating housing 11 and corresponding with infrared light compensating lamp 12.It is close Lamp lens 19 are arranged in encapsulating housing 11 and corresponding with close to infrared lamp 13.Encapsulating housing 11 is arranged on close to sensing lens 1e It is interior and corresponding with proximity sensor 1d.The infrared light that infrared light compensating lamp 12 emits converges to benefit under the action of light-supplementing lamp lens 18 It is projected in light window 1131, reduces the light quantity in other regions for being transmitted to package wall 112 and encapsulation top 113.Similarly, approach The infrared light that infrared lamp 13 emits is projected being converged to close under the action of lamp lens 19 close in luminescence window 1132, reduces hair It is mapped to the light quantity in other regions at package wall 112 and encapsulation top 113.Similarly, the quilt by entering close to receipts light window 1133 When the infrared light of object reflection is incided into close on sensing lens 1e, infrared light is converged to close to sensing close to sensing lens 1e On device 1d, reduce infrared light and be transferred to proximity sensor 1d with the light quantity of exterior domain.Specifically, light-supplementing lamp lens 18, close to lamp Lens 19 close to sensing lens 1e with can be located on same transparent base, more specifically, light-supplementing lamp lens 18, saturating close to lamp Mirror 19 is made with can be integrally formed close to sensing lens 1e with the transparent base.Certainly, input and output module 10 can also It is provided only with light-supplementing lamp lens 18, close to lamp lens 19 and close to any one in sensing lens 1e or any two, also may be used To be not provided with light-supplementing lamp lens 18, close to lamp lens 19 and close to sensing lens 1e.
Referring to Fig. 3, in some embodiments, input and output module 10 further includes multiple metal shutter 1a, multiple Metal shutter 1a is respectively positioned in encapsulating housing 11, and multiple metal shutter 1a are located at infrared light compensating lamp 12, close to red respectively Outer lamp 13 and proximity sensor 1d are arbitrarily between the two.When infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d When center is located on same line segment, the quantity of metal shutter 1a is two；If one end of line segment is followed successively by infrared to the other end Light compensating lamp 12 is located at infrared light compensating lamp 12 with connecing respectively close to infrared lamp 13 and proximity sensor 1d, two metal shutter 1a Between near-infrared lamp 13 and close between infrared lamp 13 and proximity sensor 1d；It is connect if one end of line segment is followed successively by the other end Near-infrared lamp 13, infrared light compensating lamp 12 and proximity sensor 1d, two metal shutter 1a respectively be located at infrared light compensating lamp 12 with Close between infrared lamp 13 and between infrared light compensating lamp 12 and proximity sensor 1d；If one end of line segment is followed successively by the other end Close to infrared lamp 13, proximity sensor 1d and infrared light compensating lamp 12, two metal shutter 1a are respectively situated proximate to sensor 1d With close between infrared lamp 13 and between infrared light compensating lamp 12 and proximity sensor 1d.Metal shutter 1a is located at infrared light filling Lamp 12 and close between infrared lamp 13, metal shutter 1a on the one hand can shield infrared light compensating lamp 12 with close to 13 phase of infrared lamp Electromagnetic interference between mutually, infrared light compensating lamp 12 will not interact with the luminous intensity close to infrared lamp 13 and sequential, another Aspect metal shutter 1a can be used for completely cutting off 12 place cavity of infrared light compensating lamp and the cavity close to 13 place of infrared lamp, light Another cavity will not be entered from a cavity.Metal shutter 1a is between infrared light compensating lamp 12 and proximity sensor 1d Or it is located adjacent to sensor 1d and close to infrared light compensating lamp 12 between infrared lamp 13, can be avoided and close to infrared lamp 13 initial The infrared light of transmitting is incided on proximity sensor 1d, moreover it is possible to shield infrared light compensating lamp 12 and proximity sensor 1d is mutual Electromagnetic interference or shielding close to infrared lamp 13 and electromagnetic interference mutual proximity sensor 1d.
4 are please referred to Fig.1, in some embodiments, input and output module 10 further includes optics sealing cover 1b.Optics sealing cover 1b It is made of light transmissive material, optics sealing cover 1b is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1b is wrapped up Firmly infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d.Specifically, optics sealing cover 1b can be injection molded as by encapsulating Type technique is formed, and optics sealing cover 1b may be employed transparent thermosetting epoxy resin and be made, to be not easy to soften in use, optics Sealing cover 1b can fix infrared light compensating lamp 12, close to the relative position between infrared lamp 13 and proximity sensor 1d three, and make It obtains infrared light compensating lamp 12, be not easy to rock in encapsulating housing 11 close to infrared lamp 13 and proximity sensor 1d.
In addition, please refer to Fig.1 4, input and output module 10 further include it is multiple go out light clapboard 1c, it is multiple go out light clapboard 1c formed In optics sealing cover 1b and it is located at infrared light compensating lamp 12, close between infrared lamp 13 and proximity sensor 1d three.When infrared benefit Light lamp 12, close to the center of infrared lamp 13 and proximity sensor 1d be located on same line segment when, go out light clapboard 1c quantity be two It is a；If one end of line segment is followed successively by infrared light compensating lamp 12, close to infrared lamp 13 and proximity sensor 1d, two light extractions to the other end Partition plate 1c be located at respectively infrared light compensating lamp 12 and close between infrared lamp 13 and close to infrared lamp 13 and proximity sensor 1d it Between；If one end of line segment is followed successively by the other end close to infrared lamp 13, infrared light compensating lamp 12 and proximity sensor 1d, two light extractions Partition plate 1c be located at respectively infrared light compensating lamp 12 and close between infrared lamp 13 and infrared light compensating lamp 12 and proximity sensor 1d it Between；If one end of line segment is followed successively by the other end close to infrared lamp 13, proximity sensor 1d and infrared light compensating lamp 12, two light extractions Partition plate 1c be respectively situated proximate to sensor 1d and close between infrared lamp 13 and infrared light compensating lamp 12 and proximity sensor 1d it Between.Go out light clapboard 1c and can be used for interval infrared light compensating lamp 12 and close to infrared lamp 13, the light that infrared light compensating lamp 12 is sent will not It is pierced by from close to luminescence window 1132, the light sent close to infrared lamp 13 will not be pierced by from light filling window 1131.Light extraction Partition plate 1c can stop that infrared light compensating lamp 12 and the infrared light close to 13 initial transmissions of infrared lamp incide into proximity sensor 1d On, at the same stop from close to receive light window 1133 into and directive proximity sensor 1d infrared light influence infrared light compensating lamp 12 and Close to shining for infrared lamp 13.
Referring to Fig. 7, in some embodiments, the optical flame detector 50 of the above embodiment can be arranged on the peace of microscope base 63 On dress face 631.Microscope base 63 can be the microscope base 63 of infrared pick-up first 62 or the microscope base 63 of visible image capturing first 61.
Referring again to Figure 15, cover board light filling through hole 34, cover board can also be offered in some embodiments, on cover board 30 Light filling through hole 34 is corresponding with casing light filling through hole 24, and the infrared light that infrared light compensating lamp 12 emits can after passing through casing light filling through hole 24 To be pierced by electronic device 100 from cover board light filling through hole 34.At this point, luminous 23 corresponding position of through hole is approached on cover board 30 with casing Infrared transmission ink 40 can be set by putting, and user is difficult to close to luminous through hole 23 see by casing the inside of electronic device 100 Close to infrared lamp 13, the shape of electronic device 100 is more beautiful.
6 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to luminous through hole 33, cover board It is corresponding with the close luminous through hole 23 of casing close to the through hole 33 that shines, it is sent out close to the infrared light that infrared lamp 13 emits through casing is close After light through hole 23 electronic device 100 can be pierced by close in luminous through hole 33 from cover board.At this point, lead on cover board 30 with casing light filling 24 corresponding position of hole can set infrared transmission ink 40, and user is difficult to see electronic device by casing light filling through hole 24 The infrared light compensating lamp 12 of 100 inside, the shape of electronic device 100 are more beautiful.
7 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to receipts light through hole 36, cover board Corresponding close to light through hole 2f and proximity sensor 1d is received with casing close to light through hole 36 is received, electronic device 100 is outer anti-by object The infrared light penetrated can incide into proximity sensor 1d through cover board close to after receiving light through hole 36 and the close receipts light through hole 2f of casing On.
8 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on On substrate 66, optical flame detector 50 may be also secured on substrate 66.Specifically, FPC, a part for substrate 66 are provided on substrate 66 In microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and for carrying imaging sensor 65, the other end can be connected with the mainboard of electronic device 100.When optical flame detector 50 is arranged on substrate 66, optical flame detector 50 is arranged on Outside microscope base 63, optical flame detector 50 can also be connected with FPC.
Imaging modules 60 can be visible image capturing first 61 and one or two in infrared pick-up first 62.Specifically, Optical flame detector 50 can be fixed on the substrate 66 of visible image capturing first 61；Optical flame detector 50 can be fixed on infrared pick-up first 62 On substrate 66.Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the one side opposite with optical flame detector 50, to increase The integral strength of substrate 66 so that FPC is not susceptible to around folding, while when optical flame detector 50 is arranged on substrate 66 is not susceptible to shake It is dynamic.In one example, optical flame detector 50 may be also secured on the lateral wall of microscope base 63, such as is fixed on by cohesive mode On the lateral wall of microscope base 63.
9 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67 Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- 672 and the 3rd sub- top surface 673 of top surface, the second son top 672 and first sub- top surface 671 of face tilts connection and forms notch 675, the 3rd sub- top surface 673 and second with the first sub- top surface 671 Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- 671 and the 3rd sub- top surface 673 of top surface to connect first Sub- 671 and the 3rd sub- top surface 673 of top surface.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight Angle, the angle between the second sub- 672 and the 3rd sub- top surface 673 of top surface can be obtuse angle or right angle.Notch 675 is opened in camera shell On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.3rd sub- top surface 673 offers out Light through hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through hole 674.Imaging sensor 65 is housed in In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through hole 674 and camera lens mould Group 68 is simultaneously transferred on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Optical flame detector 50 is arranged on At one sub- top surface 671.In present embodiment, imaging modules 60 can be visible image capturing first 61, and optical flame detector 50 is single packaging body. In other embodiments, imaging modules 60 can be infrared pick-up first 62.
The imaging modules 60 of present embodiment offer notch 675, and optical flame detector 50 is arranged on the first sub- top surface 671 On, optical flame detector 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, has saved electronics dress Put the installation space in 100.
Please continue to refer to Figure 19, in some embodiments, the optical flame detector 50 of the above embodiment is arranged on the first son top On face 671 and positioned at the outside of camera case 67, specifically, entire optical flame detector 50 is along the projection perpendicular to the first sub- top surface 671 It can be located in the first sub- top surface 671 (as shown in figure 19)；Alternatively, part optical flame detector 50 is along perpendicular to the first sub- top surface 671 Projection be located in the first sub- top surface 671.That is, optical flame detector 50 is at least part of to be located at the first sub- top surface 671 just Top, in this way, optical flame detector 50 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, further The installation space in electronic device 100 is saved.
Figure 20 is referred to, the first sub- top surface 671 of the above embodiment offers loophole 676, and optical flame detector 50 is located at phase It is in casing body 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be transferred to light On sensor 50.The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67 More stablize and convenient for optical flame detector 50 and imaging modules 60 are installed on casing 20.
Figure 21 is referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, optical flame detector 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image sensing Device 65 is arranged on substrate 66, and optical flame detector 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically, base It is provided with FPC on plate 66, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can be with The mainboard connection of electronic device 100.In other embodiments, optical flame detector 50 can also be connected with FPC.
The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67 more Add and stablize and convenient for optical flame detector 50 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60 set substrate 66 simultaneously Optical flame detector 50 is arranged on substrate 66, optical flame detector 50 is enable to be firmly mounted in camera case 67.
Figure 22 is referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677 678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 677 shape of the first tread Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677 Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle. Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two A light extraction through hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through holes 674 Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions Through hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68, Light outside electronic device 100 can pass through light extraction through hole 674 and camera lens module 68 and be transferred on imaging sensor 65.This reality It applies in mode, imaging modules 60 can be visible image capturing first 61, and two camera lens modules 68 are visible image capturing first 61 at this time Corresponding camera lens module.Optical flame detector 50 is arranged on the second tread 678 and outside camera case 67.Optical flame detector 50 encapsulates to be single Body.In other embodiments, imaging modules 60 can be infrared pick-up first 62, and two camera lens modules 68 are infrared at this time 62 corresponding camera lens module of light video camera head.In yet another embodiment, imaging modules 60 include visible image capturing first 61 and infrared Light video camera head 62, at this time one of camera lens module 68 be first 62 corresponding camera lens module of infrared pick-up, another camera lens mould Group 68 is first 61 corresponding camera lens module of visible image capturing.
The imaging modules 60 of present embodiment offer notch 675, and optical flame detector 50 is arranged on the second tread 678 On, optical flame detector 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, has saved electronics dress Put the installation space in 100.
Figure 23 is referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670 On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through holes 674 are opened in the first son respectively On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675 Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face 679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678, Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second Angle be right angle.Compared with the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating optical flame detector 50 is arranged on the second tread 678 On.
Figure 22 and Figure 23 is referred to, in some embodiments, the optical flame detector 50 of the above embodiment is arranged on the second ladder On face 678 and positioned at the outside of camera case 67.Specifically, when notch 675 is opened in the marginal position of top surface 670, entirely Optical flame detector 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, 50 edge of part optical flame detector Projection perpendicular to the second tread 678 is located in the second tread 678 (as shown in figure 22).That is, optical flame detector 50 is at least A part is located at the surface of the second tread 678.When notch 675 is opened on the centre position of top surface 670, entire optical flame detector 50 can be located in the second tread 678 (as shown in figure 23) along perpendicular to the projection of the second tread 678.In this way, optical flame detector 50 Set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, further saves in electronic device 100 Installation space.
Figure 24 is referred to, the second tread 678 of the above embodiment offers loophole 676, and optical flame detector 50 is located at camera It is in housing 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be transferred to light sensation On device 50.The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67 more Add and stablize and convenient for optical flame detector 50 and imaging modules 60 are installed on casing 20.
Figure 25 is referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, Optical flame detector 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, imaging sensor 65 It is arranged on substrate 66, optical flame detector 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically, substrate 66 On be provided with FPC, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can be with electronics The mainboard connection of device 100.In other embodiments, optical flame detector 50 can also be connected with FPC.
The optical flame detector 50 of present embodiment is arranged in camera case 67, makes the structure of optical flame detector 50 and camera case 67 more Add and stablize and convenient for optical flame detector 50 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60 set substrate 66 simultaneously Optical flame detector 50 is arranged on substrate 66, optical flame detector 50 is enable to be firmly mounted in camera case 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention. In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side Formula combines.In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two, Three, unless otherwise specifically defined.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.

Claims (19)

1. a kind of electronic device, which is characterized in that including：
Casing；
Input and output module, the input and output module are arranged in the casing, and the input and output module includes encapsulating shell Body, infrared light compensating lamp, close to infrared lamp and proximity sensor, the encapsulating housing includes package substrate, the infrared light filling Lamp described be encapsulated in the encapsulating housing close to infrared lamp and the proximity sensor and be carried on the package substrate On, the infrared light compensating lamp can emit infrared light with different power close to infrared lamp from described outside the encapsulating housing Line, the proximity sensor is for receiving the infrared light that is reflected by the object to detect the distance of object；
Module is vibrated, the vibration module installation is on the housing；With
Piezoelectric element, the piezoelectric element with it is described vibration module combined and with the input and output module interval, the piezoelectricity Element is used to deform upon when being applied in electric signal so that the vibration module vibration.
2. electronic device according to claim 1, which is characterized in that the vibration module includes display screen and the lid of light transmission Plate, the display screen set on the housing and host cavity are collectively formed with the casing, and the cover board is arranged on the machine On shell and positioned at the one side away from the host cavity of the display screen, the display screen is combined with the cover board, the casing It is logical close to luminous through hole, casing light filling through hole, casing close to receipts light through hole and casing vibration to offer spaced casing Hole, described corresponding close to luminous through hole with the casing close to infrared lamp, the infrared light compensating lamp and the casing light filling through hole Corresponding, the proximity sensor is corresponding close to light through hole is received with the casing, and the piezoelectric element is housed in the casing vibration It is combined in through hole and with the cover board.
3. electronic device according to claim 2, which is characterized in that the piezoelectric element and the display screen pass through engagement Part is attached on the cover board.
4. electronic device according to claim 1, which is characterized in that the input and output module further includes chip, described Infrared light compensating lamp described is both formed in close to infrared lamp and the proximity sensor on a piece of chip.
5. electronic device according to claim 1, which is characterized in that the encapsulating housing further includes package wall and encapsulation Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute It states encapsulation top and is formed with light filling window, close to luminescence window and close to receiving light window, the light filling window and the infrared benefit Light lamp corresponds to, it is described close to luminescence window with described correspondings close to infrared lamp, it is described close to be sensed with described close to receiving light window Device corresponds to.
6. electronic device according to claim 1, which is characterized in that it is saturating that the input and output module further includes light compensating lamp Mirror, the light-supplementing lamp lens are arranged in the encapsulating housing and corresponding with the infrared light compensating lamp；And/or
The input and output module is further included close to lamp lens, it is described be arranged on close to lamp lens in the encapsulating housing and with institute It states and is corresponded to close to infrared lamp；And/or
The input and output module is further included close to sensing lens, described to be arranged on close to sensing lens in the encapsulating housing simultaneously It is corresponding with the proximity sensor.
7. electronic device according to claim 1, which is characterized in that the input and output module further include be arranged on it is described The in vivo light-supplementing lamp lens of encapsulating shell, close to lamp lens and close to sensing lens, the light-supplementing lamp lens and the infrared light filling Lamp corresponds to, it is described close to lamp lens with described correspondings close to infrared lamp, it is described close to sensing lens and the proximity sensor pair Should, the light-supplementing lamp lens, it is described close to lamp lens and it is described close to sensing lens be located on same transparent base.
8. electronic device according to claim 1, which is characterized in that the input and output module further includes multiple metals and hides Baffle, multiple metal shutters are located in the encapsulating housing and are located at the infrared light compensating lamp, are described close to red respectively In outer lamp and the proximity sensor it is arbitrary between the two.
9. electronic device according to claim 1, which is characterized in that the input and output module is further included by light transmissive material Manufactured optics sealing cover, the optics sealing cover are formed on the package substrate and in the encapsulating housing, the optics Sealing cover wraps the infrared light compensating lamp, is described close to infrared lamp and the proximity sensor.
10. electronic device according to claim 9, which is characterized in that the input and output module further includes multiple light extractions Partition plate, it is multiple it is described go out light clapboard be respectively formed in the optics sealing cover and positioned at the infrared light compensating lamp, described close to red In outer lamp and the proximity sensor it is arbitrary between the two.
11. electronic device according to claim 1, which is characterized in that be formed with grounding lead on the input and output module Foot, light compensating lamp pin, close to lamp pin and close to sensing pin, when the grounding pin and the light compensating lamp pin are enabled, The infrared light compensating lamp emits infrared light；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared Lamp emits infrared light；When the grounding pin and the close sensing pin are enabled, the proximity sensor is received by object The infrared light of body reflection is to detect the distance of object.
12. electronic device according to claim 2, which is characterized in that the surface shape that the cover board is combined with the casing The infrared through ink of infrared light is only transmitted into having, it is described infrared to block the casing close to luminous through hole, described through ink Casing light filling through hole, the casing vibrate at least one in through hole close to receipts light through hole and the casing.
13. electronic device according to claim 1, which is characterized in that the electronic device further includes optical flame detector and imaging Module, the imaging modules include microscope base, the lens barrel on the microscope base and the image sensing being housed in the microscope base Device, the microscope base include the mounting surface between the lens barrel and described image sensor, and the optical flame detector is arranged on described Mounting surface.
14. electronic device according to claim 1, which is characterized in that the electronic device further includes imaging modules and light Sensor, on the housing, the imaging modules include camera case and camera lens module, the camera for the imaging modules installation The top surface of housing is for cascaded surface and the first sub- top surface and the second sub- top surface including being connected, the second sub- top surface relatively described the One sub- top surface inclination simultaneously forms notch with the described first sub- top surface, and the top surface offers light extraction through hole, and the camera lens module is received Appearance is in the camera case and corresponding with the light extraction through hole, and the optical flame detector is arranged at the described first sub- top surface.
15. electronic device according to claim 1, which is characterized in that the electronic device further includes imaging modules and light Sensor, the imaging modules include camera case and two camera lens modules, offer on the top surface of the camera case notch with Step-like top surface is formed, the top surface includes the first tread and the second tread less than first tread, first ladder It is opened up on face there are two light extraction through hole, each light extraction through hole is corresponding with the camera lens module, and the optical flame detector is arranged on institute It states at the second tread.
16. electronic device according to claim 1, which is characterized in that the electronic device further includes imaging modules and light Sensor, the imaging modules include the substrate that microscope base, the lens barrel on the microscope base and part are arranged in the microscope base, The optical flame detector is set on the substrate.
17. electronic device according to claim 2, which is characterized in that the electronic device further include infrared pick-up head, Visible image capturing head, structured light projector, the input and output module, the infrared pick-up head, the visible image capturing head It is located at the center of the structured light projector on same line segment, the piezoelectric element is located at the top of the line segment and the casing Between portion.
18. electronic device according to claim 2, which is characterized in that the electronic device further include infrared pick-up head, Visible image capturing head and structured light projector, the quantity of the piezoelectric element is multiple, and the quantity of the casing vibration through hole is Multiple, multiple piezoelectric elements are corresponding with multiple casing vibration through holes, and each piezoelectric element is housed in corresponding In the casing vibration through hole, the input and output module, the infrared pick-up head, the visible image capturing head, Duo Gesuo The center for stating piezoelectric element and the structured light projector is located on same line segment, is set between the two neighboring piezoelectric element Have in the input and output module, the infrared pick-up head, the visible image capturing head and the structured light projector extremely It is one few.
19. electronic device according to claim 2, which is characterized in that the electronic device further include infrared pick-up head, Visible image capturing head and structured light projector, the piezoelectric element include piezoelectric body and the pressure stretched out from the piezoelectric body Electric convex block, the quantity of the casing vibration through hole is multiple, multiple piezoelectricity convex blocks and multiple casing vibration through holes pair Should, each piezoelectricity convex portion is housed in the corresponding casing vibration through hole and is combined with the cover board, described defeated Enter to export module, the infrared pick-up head, the visible image capturing head and the structured light projector be located at the cover board with It is the input and output module, the infrared pick-up head, the visible image capturing head, multiple described between the piezoelectric body The center of piezoelectricity convex block and the structured light projector is located on same line segment, is provided between the two neighboring piezoelectricity convex block In the input and output module, the infrared pick-up head, the visible image capturing head and the structured light projector at least One.
CN201711437409.XA 2017-12-26 2017-12-26 Electronic device Active CN108063150B (en)

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CN108495014A (en) * 2018-05-31 2018-09-04 维沃移动通信有限公司 A kind of camera module, mobile terminal and control method
WO2019128628A1 (en) * 2017-12-26 2019-07-04 Oppo广东移动通信有限公司 Output module, input and output module and electronic device

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CN204145746U (en) * 2014-07-29 2015-02-04 东莞劲胜精密组件股份有限公司 A kind of electroacoustic sensing device and there is the mobile phone of this device
CN107508938A (en) * 2017-09-06 2017-12-22 广东欧珀移动通信有限公司 Camera module and electronic installation

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CN103515371A (en) * 2012-06-27 2014-01-15 格科微电子（上海）有限公司 Integrated optical sensor package
CN204145746U (en) * 2014-07-29 2015-02-04 东莞劲胜精密组件股份有限公司 A kind of electroacoustic sensing device and there is the mobile phone of this device
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WO2019128628A1 (en) * 2017-12-26 2019-07-04 Oppo广东移动通信有限公司 Output module, input and output module and electronic device
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