CN108200237A

CN108200237A - Electronic device

Info

Publication number: CN108200237A
Application number: CN201711437448.XA
Authority: CN
Inventors: 吴安平
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-12-26
Filing date: 2017-12-26
Publication date: 2018-06-22
Anticipated expiration: 2037-12-26
Also published as: CN108200237B

Abstract

The invention discloses a kind of electronic devices.Electronic device includes casing, output module, vibration module and piezoelectric element.It exports module and includes encapsulating housing, infrared lamp and thang-kng component.Encapsulating housing includes package substrate, and in encapsulating housing, infrared lamp is carried on package substrate for infrared lamp and thang-kng component package, and thang-kng component is located in the luminous light path of infrared lamp.Thang-kng component includes matrix and Flexible film, and matrix offers light hole, and Flexible film is housed in light hole.Flexible film can deform upon under the action of electric field and change the area for blocking light hole, and the infrared light of infrared lamp transmitting can be emitted with different field angles from encapsulating housing.Module is vibrated to be mounted on casing.Piezoelectric element is combined with vibration module and with exporting module interval, and piezoelectric element vibrates for being deformed upon when being applied in electric signal so as to vibrate module.Output module integrated level is higher, and small volume, the call privacy of electronic device is higher, and appearance is more beautiful.

Description

Electronic device

Technical field

The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.

Background technology

As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of function element set It is more and more, in order to realize the functions such as the facial 3D feature recognitions of distance detection, environment light detection and user, need to set in electronics The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth Numerous function elements is put, the excessive space of mobile phone can be occupied.

Invention content

Embodiment of the present invention provides a kind of electronic device.

The electronic device of embodiment of the present invention includes：

Casing；

Module is exported, the output module includes encapsulating housing, infrared lamp and thang-kng component, and the encapsulating housing includes In the encapsulating housing, the infrared lamp is carried on the envelope for package substrate, the infrared lamp and the thang-kng component package It filling on substrate, the thang-kng component is located in the luminous light path of the infrared lamp, and the thang-kng component includes matrix and Flexible film, Described matrix offers light hole, and the Flexible film is housed in the light hole, Flexible film energy under the action of electric field It enough deforms upon and changes the area for blocking the light hole, the infrared light of the infrared lamp transmitting can be with different visual fields Angle is emitted from the encapsulating housing；

Module is vibrated, the vibration module installation is on the housing；With

Piezoelectric element, the piezoelectric element are combined with the vibration module and export module interval, the piezoelectricity with described Element is used to deform upon when being applied in electric signal so that the vibration module vibration.

In some embodiments, the Flexible film include the first surface that is combined with the inner wall of the light hole and with The opposite second surface of the first surface, under the action of electric field, the second surface can be relative to the first surface It deforms upon to change the area that the Flexible film blocks the light hole.

In some embodiments, the quantity of the light hole is single, and the Flexible film can under the action of electric field It deforms upon to change the area for blocking the single light hole；Or

The quantity of the light hole is at least two, and the Flexible film also is able to change the institute blocked under the action of electric field State the quantity of light hole.

In some embodiments, the vibration module includes display screen and the cover board of light transmission, the display screen are arranged on Host cavity is collectively formed on the casing and with the casing, the cover board is with reference on the housing and positioned at the display screen The side far from the host cavity, the display screen combined with the cover board, and the casing offers spaced casing Infrared through-hole, casing structure light through-hole and casing vibration through-hole, the infrared lamp is corresponding with the infrared through-hole of the casing, described Structured light projector is corresponding with the casing structure light through-hole, the piezoelectric element be housed in casing vibration through-hole and with The cover board combines.

In some embodiments, the piezoelectric element and the display screen are attached to by fastener on the cover board.

In some embodiments, the output module further includes chip, the infrared lamp and the structured light projector It is formed on the chip.

In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly The package substrate extends and is connected at the top of the encapsulation between the package substrate, and first is formed at the top of the encapsulation Light-emitting window and the second light-emitting window, first light-emitting window is corresponding with the infrared lamp, second light-emitting window and institute State structured light projector correspondence.

In some embodiments, the output module further includes metal shutter, and the metal shutter is located at described In encapsulating housing, and between the infrared lamp and the structured light projector.

In some embodiments, the cover board is formed with the surface that the casing is combined and only transmits the infrared of infrared light Through ink, the infrared transmission ink blocks the infrared through-hole of the casing, the casing structure light through-hole and the casing and shakes At least one of dynamic through-hole.

In some embodiments, the electronic device further includes receiving module and imaging modules, the receiving module collection Into having proximity sensor and optical flame detector, the imaging modules include microscope base, the lens barrel on the microscope base and are housed in institute The imaging sensor in microscope base is stated, the microscope base includes the mounting surface between the lens barrel and described image sensor, institute It states receiving module and is arranged on the mounting surface.

In some embodiments, the electronic device further includes proximity sensor, optical flame detector and imaging modules, described Imaging modules include microscope base, the lens barrel on the microscope base and the imaging sensor being housed in the microscope base, the mirror Seat includes mounting surface positioned at the lens barrel and described image sensor between, in the proximity sensor and the optical flame detector It is at least one to be arranged on the mounting surface.

In some embodiments, the electronic device further includes infrared pick-up head and visible image capturing head, described defeated The center for going out module, the infrared pick-up head and the visible image capturing head is located on same line segment, the piezoelectric element position Between the top of the line segment and the casing.

In some embodiments, the electronic device further includes infrared pick-up head and visible image capturing head, the pressure The quantity of electric device is multiple, and the quantity of the casing vibration through-hole is multiple, multiple piezoelectric elements and multiple machines Shell vibration through-hole corresponds to, and each piezoelectric element is housed in the corresponding casing vibration through-hole, the output module, institute The center for stating infrared pick-up head, the visible image capturing head and multiple piezoelectric elements is located on same line segment, and adjacent two It is provided between a piezoelectric element in the output module, the infrared pick-up head and the visible image capturing head extremely It is one few.

In some embodiments, the electronic device further includes infrared pick-up head and visible image capturing head, the pressure Electric device includes piezoelectric body and the piezoelectricity convex block stretched out from the piezoelectric body, and the quantity of the casing vibration through-hole is more A, multiple piezoelectricity convex blocks are corresponding with multiple casing vibration through-holes, and each piezoelectricity convex portion is housed in correspondence Casing vibration through-hole in and is combined with the cover board, it is described to export module, the infrared pick-up head and described visible Light video camera head is the output module, the infrared pick-up head, described visible between the cover board and the piezoelectric body The center of light video camera head and multiple piezoelectricity convex blocks is located on same line segment, is provided between the two neighboring piezoelectricity convex block At least one of the output module, the infrared pick-up head and described visible image capturing head.

The electronic device of embodiment of the present invention blocks the area of light hole by changing Flexible film, and infrared lamp emits red UV light can be emitted with different field angles from encapsulating housing, and corresponding different field angle, output module can be used as close to red Outer lamp or infrared light compensating lamp export module group transmitting infrared light with the function of infrared distance measurement and infrared light filling.Secondly, it compares For current electronic device needs to be positioned proximate to infrared lamp and infrared light compensating lamp simultaneously, the output mould of embodiment of the present invention Group only needs to set an infrared lamp, and small volume has saved the space of the infrared light filling of realization and infrared distance measurement function.Furthermore Be packaged due to only needing an infrared lamp being arranged on package substrate, compared to traditional handicraft infrared light compensating lamp with connecing Near-infrared lamp, which needs to be respectively adopted in different wafer manufacture recombinants to PCB substrate, to be encapsulated, and improves packaging efficiency.It is further more, electric Sub-device realizes that osteoacusis is transaudient using piezoelectric element and vibration module, instead of traditional receiver knot by air transmitted sound On the one hand the privacy of dialog context is effectively ensured in structure, on the other hand, due to eliminating the receiver of script, avoid and covering Open up through-hole corresponding with receiver on plate, it is simpler in technique, it is also more aesthetically pleasing in appearance.

The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become apparent or recognized by the practice of embodiments of the present invention.

Description of the drawings

The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change It obtains significantly and is readily appreciated that, wherein：

Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；

Fig. 2 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；

Fig. 3 and Fig. 4 is the status diagram of the output module of the electronic device of embodiment of the present invention；

Fig. 5 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；

Fig. 6 is the status diagram of the thang-kng component of the electronic device of embodiment of the present invention；

Fig. 7 and Fig. 8 is the partial status schematic diagram of the thang-kng component of the electronic device of another embodiment of the present invention；

Fig. 9 is schematic cross-section of the electronic device along IX-IX lines in Fig. 1；

Figure 10 is the partial sectional schematic view that intercepts of the electronic device in Fig. 1 along X-X lines；

Figure 11 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；

Figure 12 is the electronic component of the electronic device of embodiment of the present invention and the arrangement schematic diagram of piezoelectric element；

Figure 13 is the structure diagram of the electronic device of embodiment of the present invention；

Figure 14 and Figure 15 is the arrangement signal of the electronic component and piezoelectric element of the electronic device of embodiment of the present invention Figure；

Figure 16 is the structure diagram of the electronic device of embodiment of the present invention；

Figure 17 is schematic cross-section of the electronic device along XVII-XVII lines in Figure 16；

Figure 18 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；

Figure 19 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；

Figure 20 and Figure 21 be embodiment of the present invention electronic device along with XX-XX lines corresponding position intercepts in Fig. 1 portion Partial cross-section schematic diagram；

Figure 22 to Figure 30 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules.

Specific embodiment

Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing To the whole element for representing same or similar element or there is same or like function.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's Embodiment, and be not considered as limiting the invention.

In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature right over second feature or oblique upper or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.

It please refers to Fig.1 and Fig. 9, the electronic device 100 of embodiment of the present invention includes casing 20, electronic component, vibration Module 30a and piezoelectric element 70.Electronic component includes output module 10, receiving module 50 (such as Figure 11) and imaging modules 60 (such as Figure 11).Electronic device 100 can be mobile phone, tablet computer, laptop, smartwatch, Intelligent bracelet, automatic teller machine Deng the embodiment of the present invention is illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the concrete form of electronic device 100 Can be other, this is not restricted.

Fig. 2 and Fig. 5 are please referred to, output module 10 is single package body structure, including encapsulating housing 11, infrared lamp 12, thang-kng Component 13 and structured light projector 14.

Encapsulating housing 11 is in other words, infrared for encapsulating infrared lamp 12, thang-kng component 13 and structured light projector 14 simultaneously Lamp 12, thang-kng component 13 and structured light projector 14 are encapsulated in encapsulating housing 11 simultaneously.Encapsulating housing 11 includes package substrate 111st, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference (Electromagnetic Interference, EMI) shielding material is made, output module 10 had an impact to avoid extraneous electromagnetic interference.

Package substrate 111 is used to carry infrared lamp 12 and structured light projector 14.When manufacture exports module 10, infrared lamp 12 and structured light projector 14 can be formed on chip 15, then by infrared lamp 12, structured light projector 14 and chip 15 together It is arranged on package substrate 111, specifically, chip 15 can be bonded on package substrate 111.Meanwhile package substrate 111 It can be used for connecting with other parts (such as the casing 20 of electronic device 100, mainboard etc.) of electronic device 100, it will be defeated Go out module 10 to be fixed in electronic device 100.

Package wall 112 can be set around infrared lamp 12, thang-kng component 13 and structured light projector 14, package wall 112 extend from package substrate 111, and package wall 112 can be combined with package substrate 111, preferably, package wall 112 and encapsulation Substrate 111 is detachably connected, in order to throw infrared lamp 12, thang-kng component 13 and structure light after removing package wall 112 Emitter 14 is overhauled.The making material of package wall 112 can be the material of impermeable infrared light, to avoid infrared lamp 12 or knot The infrared light that structure light projector 14 is sent out passes through package wall 112.

Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connect with package wall 112.Encapsulation top 113 The first light-emitting window 1131 and the second light-emitting window 1132 are formed with, the first light-emitting window 1131 is corresponding with infrared lamp 12, infrared The infrared light that lamp 12 emits is pierced by from the first light-emitting window 1131；Second light-emitting window 1132 is corresponding with structured light projector 14, The structure light (infrared light) that structured light projector 14 emits is pierced by from the second light-emitting window 1132.Encapsulation top 113 and package-side Wall 112 integrally formed can obtain, can also split shape to obtain.In one example, the first light-emitting window 1131 and second Light-emitting window 1132 is through-hole, and the making material at encapsulation top 113 is the material of impermeable infrared light.In another example, it encapsulates Top 113 is formed by the material of impermeable infrared light and the material co-manufactured of saturating infrared light, specifically, the first light-emitting window 1131 It is made with the second light-emitting window 1132 of the material of saturating infrared light, remaining position is made of the material of impermeable infrared light, further Ground, the first light-emitting window 1131 and the second light-emitting window 1132 could be formed with lens arrangement, to improve from the first light-emitting window 1131 and the second infrared light emission angle that projects of light-emitting window 1132, such as the second light-emitting window 1132 is formed with concavees lens knot Structure, so that the divergence of beam across the second light-emitting window 1132 projects outward；First light-emitting window 1131 is formed with convex lens knot Structure, so that the light across the first light-emitting window 1131 gathers outside injection.

Fig. 5 and Fig. 6 are please referred to, thang-kng component 13 is located in the luminous light path of infrared lamp 12, and infrared lamp 12 emits infrared Light projects after passing through thang-kng component 13 from light-emitting window 1131.Thang-kng component 13 includes matrix 131 and Flexible film 133.

Matrix 131 can be made of the material of impermeable infrared light and conduction, and matrix 131 can be connected by connector 18 It can be used for being laid with the circuits such as the driving circuit of thang-kng component 13 in package wall 112, in connector 18.Matrix 131 can also In light-emitting window 1131.The global shape of matrix 131 can rounded, rectangle, ellipse etc..It is offered on matrix 131 Light hole 132, light hole 132 run through matrix 131, and the infrared light that infrared lamp 12 is sent out passes through thang-kng after passing through light hole 132 Component 13.

Flexible film 133 is housed in light hole 132, and specifically, Flexible film 133 can be fixed in light hole 132, is stretched The lighting area of at least shield portions light hole 132 of film 133.Infrared light cannot penetrate Flexible film 133 or Flexible film 133 is right The transmitance of infrared light is very low.Flexible film 133 can be made of the material for having electrostriction effect, such as Kynoar (Polyvinylidence Fluoride, PVDE), Flexible film 133 can deform upon under the action of electric field.It is appreciated that When Flexible film 133 deforms upon, the area that Flexible film 133 blocks light hole 132 also changes, and that is to say light hole 132 In can be changed by the area of light, cause across thang-kng component 13 light quantity and light distribution occur respective change. In one example, by controlling the deformation of Flexible film 133, the infrared light that infrared lamp 12 emits can be with different field angles It is emitted from encapsulating housing 11, it, can be by the infrared light being pierced by from encapsulating housing 11 for not by obtaining different field angles Same purposes.For example, as shown in figure 3, when the infrared light that infrared lamp 12 emits (is called in the following text with ranging from 60 degree -90 degree of field angle α First field angle) when being emitted from encapsulating housing 11, the first field angle can be 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 degree or 90 degree etc., infrared light can be used for infrared light filling, and infrared light passes through light-emitting window 1131 to project object Surface, the infrared pick-up head 62 of electronic device 100 is (as shown in Figure 1) to receive the infrared light that is reflected by the object to obtain object Image information；As shown in figure 4, when the infrared light that infrared lamp 12 emits (calls second in the following text with ranging from 10 degree -30 degree of field angle β Field angle) when being emitted from encapsulating housing 11, the second field angle can be 10 degree, 15 degree, 20 degree, 25 degree or 30 degree etc., infrared light Line can be used for infrared distance measurement, and infrared light passes through light-emitting window 1131 and reaches body surface, the proximity sensor of electronic device 100 51 distances (as shown in Figure 10) for receiving the infrared light being reflected by the object with detection object to electronic device 100.The present invention's In embodiment, field angle refers to the range that infrared light passes through light-emitting window 1131 from the outgoing covering of encapsulating housing 11.

Referring to Fig. 6, specifically, Flexible film 133 includes first surface 1331 and second surface 1332, first surface 1331 It is combined with the inner wall of light hole 132, second surface 1332 is opposite with first surface 1331.In the embodiment illustrated in fig. 6, one Flexible film 133, two Flexible films 133 can be symmetrical arranged in light hole 132 there are two receivings in a light hole 132.Such as Fig. 6 (a) shown in, when not applying electric field, Flexible film 133 in the raw, gap is formed between two second surfaces 1332 1321, infrared light can be passed through out of gap 1321；As shown in Fig. 6 (b), when acting on an electric field on Flexible film 133, specifically Ground, matrix 131 can be connect with the cathode of power supply, Flexible film 133 can be connect with the anode of power supply or matrix 131 with electricity The anode connection in source, Flexible film 133 are connect with the cathode of power supply, and Flexible film 133 deforms upon under the action of electric field, the first table The inner wall of face 1331 and light hole 132 with reference to and be difficult to move relative to inner wall, second surface 1332 has higher degree of freedom, The size that second surface 1332 will occur extension and be gradually reduced gap 1321, that is, increase Flexible film 133 block light hole 132 area.By controlling the power of electric field, the amount of the extension of second surface 1332 can be controlled, to control light hole 132 Clear field, that is, the size in control gap 1321.In one example, as shown in Fig. 6 (c), when two second surfaces 1332 when being affixed completely, and the clear field of light hole 132 is zero, and infrared light cannot be passed through from light hole 132.Certainly, one The Flexible film 133 of other quantity, such as one, three, four, five, six etc., Flexible film can be set in light hole 132 133 concrete shape can also be according to light hole 132 the factors such as shape be adjusted, this is not restricted.

In the embodiment illustrated in fig. 6, the quantity of light hole 132 opened up on matrix 131 is single, by controlling electricity The size of field changes the deformation quantity of Flexible film 133, and then changes the size in gap 1321, to change the field angle of infrared light, Such as field angle is made to be above-mentioned the first field angle or the second field angle.

In embodiment as shown in Figure 7 and Figure 8, the quantity of light hole 132 is at least two, and Flexible film 133 is in electric field Under the action of also be able to change the quantity of light hole 132 blocked.In the present embodiment, multiple light holes 132 are radial Array distribution, the light hole 132 positioned at center can be corresponding with the centre of luminescence of infrared lamp 12, remaining light hole 132 is surround The light hole 132 at the center is distributed, and the Flexible film 133 in different light holes 132 can independently be turned on or off with power supply.When During all 133 equal no powers of Flexible film, thang-kng component 13 is to the percent of pass highest of infrared light, and field angle is also maximum at this time (as shown in Figure 7)；When needing to reduce thang-kng amount or reduce field angle, the light hole 132 positioned at array edges can be controlled Interior Flexible film 133 deforms upon and blocks corresponding light hole 132 (as shown in Figure 8).Certainly, in other embodiments, The distribution mode of multiple light holes 132 can have other, and the distribution mode of light hole 132 being blocked can also be needed according to user It asks and is set, such as the open and-shut mode by controlling multiple light holes 132, so that the light projected from output module 10 is in The shape of animal, heart etc..

Referring to Fig. 5, structured light projector 14 can be formed in infrared lamp 12 on a piece of chip 15, further reduce knot Volume of the structure light projector 14 with infrared lamp 12 after integrated, and preparation process is simpler.Structured light projector 14 can emit outward Structure light, structure light can form infrared laser speckle pattern, project structured light to target object surface, by infrared pick-up head 62 Acquisition (as shown in Figure 1) is by the modulated structured light patterns of target object, by analyzing the structured light patterns modulated Calculate the depth image (at this point, structured light projector 14 is used for three-dimensional imaging) for obtaining target object.In embodiments of the present invention, Structured light projector 14 includes light source 141, mirror holder 142, lens 143 and diffraction optical element (diffractive optical elements,DOE)144.The light beam that light source 141 is sent out is expanded after lens 143 are collimated or converged by diffraction optical element 144 And emitted outward with certain beam pattern.Specifically, light source 141 can be formed on chip 15, lens 143 and diffraction optics Element 144 can be fixed on mirror holder 1422, such as is fixed on mirror holder 142 by way of gluing.

It please refers to Fig.1 and Figure 10, casing 20 includes top 21 and bottom 22, right with electronic component and piezoelectric element 70 The position answered, casing 20 offer the infrared through-hole 23 of casing, casing structure light through-hole 24 and casing vibration through-hole 2a.Export module 10 when being arranged in casing 20, and the through-hole 23 infrared with casing of infrared lamp 12 is corresponding, and structured light projector 14 is led to casing structure light Hole 24 corresponds to.Wherein the through-hole 23 infrared with casing of infrared lamp 12 it is corresponding refer to light that infrared lamp 12 is sent out can be from the infrared through-hole of casing 23 pass through, and can be that infrared lamp 12 and the light of infrared 23 face of through-hole of casing or the transmitting of infrared lamp 12 pass through specifically The infrared through-hole 23 of casing is passed through after leaded light device effect.Structured light projector 14 is corresponding with casing structure light through-hole 24 similarly, This is not repeated.In embodiment as shown in Figure 10, the infrared through-hole 23 of casing and casing structure light through-hole 24 can be mutual Interval, certainly, in other embodiments, the infrared through-hole 23 of casing can be interconnected with casing structure light through-hole 24.

It please refers to Fig.1, Fig. 9 and Figure 10, vibration module 30a are mounted on casing 20.Vibration module 30a may include display screen 90 and cover board 30, in other words display screen 90 formation vibration module 30a is combined with cover board 30, to promote the rigidity of vibration module 30a. Display screen 90 is arranged on casing 20 and forms host cavity 91 with casing 20, and cover board 30 is arranged on casing 20 and positioned at display screen The side of 90 separate host cavity 91, to protect display screen 90.Since the output module 10 of embodiment of the present invention can occupy Smaller volume, therefore, for setting the volume of display screen 90 that can correspond to increase in casing 20, to improve electronic device 100 screen accounting.Specifically, display screen 90, output module 10 and piezoelectric element 70 are arranged between top 21 and bottom 22, In the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, as shown in Figure 1, output module 10 can To be arranged between display screen 90 and top 21.In other embodiments, display screen 90 can open up jagged for screen comprehensively, Display screen 90 surrounds output module 10, and exports module 10 and expose from the notch of display screen 90.

Fig. 9 and Figure 10 are please referred to, piezoelectric element 70 is made of ceramics or quartz crystal materials, and piezoelectric element 70 can be single Chip, twin lamella or the piezoelectric element of lamination 70.Piezoelectric element 70 is combined with vibration module 30a and is spaced with output module 10. Specifically, piezoelectric element 70 is housed in casing vibration through-hole 2a and is combined, and be spaced with casing 20, Ke Yishi with cover board 30： 70 partial receipt of piezoelectric element is in casing vibration through-hole 2a or piezoelectric element 70 is housed in completely in the logical 2a holes of casing vibration. When the both ends of piezoelectric element 70 are applied with electric signal (voltage), due to inverse piezoelectric effect, mechanical deformation occurs for piezoelectric element 70, Such as expansion or shrinkage, the vibration module 30a combined with piezoelectric element 70 is driven to be vibrated according to the frequency of the electric signal as a result,. When the body of user is contacted with vibration module 30a, part that osteoacusis sound is contacted by the body of user with vibrating module 30a (for example, the cartilage of external ear, tooth) is sent to the auditory nerve of user.In this way, user can pass through piezoelectric element 70 and vibration Module 30a realizes voice communication, the functions such as listens to music.In embodiments of the present invention, the processor of electronic device 100 is used to obtain Voice signal, and apply electric signal corresponding with the voice signal at the both ends of piezoelectric element 70.

It is appreciated that traditional telephone receiver structure, using air transmitted sound, part acoustic pressure usually exists when receiver works 90dB~100dB or so, in ambient enviroment quieter (under the working environment as 50dB or so) even if sound is transmitted to week It encloses 1 meter of range and also still remains with 50dB~60dB or so, the chat script between caller is caused to be perceived by surrounding, secret is caused to be let out Dew.The electronic device 100 of embodiment of the present invention realizes that osteoacusis is transaudient using piezoelectric element 70 and vibration module 30a, call Sound be mainly perceived by the user by the osteoacusis vibrated, can effectively ensure that the privacy of dialog context.

Referring to Fig. 9 and Figure 10, piezoelectric element 70 and display screen 90 are attached to cover board 30 by fastener 30b On.Fastener 30b is with heat curable properties, the adhesive of UV-curing characteristics, double faced adhesive tape, viscose etc..For example, fastener 30b can be Photoelasticity resin (the UV curable acrylic adhesive of colorless and transparent).Cover board 30 and piezoelectric element Being combined with display screen 90 for 70 regions combined and cover board 30 is interregional every to prevent the display of display screen 90 first by piezoelectricity The interference of part 70.Certainly, cover board 30 can also be bonded to casing 20 by fastener 30b, be set up directly on machine compared to cover board 30 On shell 20, the vibration of vibration module 30a can be prevented to be transmitted directly onto casing 20, to reduce user because casing 20 shakes Dynamic amplitude is excessive and falls the possibility of electronic device 100.

Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated Go out after the light that module 10 is sent out sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 10 In, cover board 30 covers the infrared through-hole 23 of casing and casing structure light through-hole 24, is coated on the inner surface 32 of cover board 30 infrared Ink 40 is crossed, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and to visible ray There is higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device By the infrared region covered through ink 40 on 100.Specifically, it is infrared to be covered on inner surface 32 not with showing through ink 40 90 corresponding region of display screen.

It is infrared to block the infrared through-hole 23 of casing, casing structure light through-hole 24 and casing vibration through-hole through ink 40 At least one of 2a, that is, infrared to cover the infrared through-hole 23 of casing, 24 and of casing structure light through-hole simultaneously through ink 40 Casing vibration through-hole 2a (as shown in Figure 10), user are difficult to through the infrared through-hole 23 of casing, casing structure light through-hole 24 and casing Vibration through-hole 2a sees the internal structure of electronic device 100, and the shape of electronic device 100 is more beautiful；It is infrared to penetrate ink 40 The infrared through-hole 23 of casing can be covered, and does not cover casing structure light through-hole 24 and casing vibration through-hole 2a；Or infrared transmission Ink 40 can also cover casing structure light through-hole 24, and not cover the infrared through-hole 23 of casing and casing vibration through-hole 2a；It is infrared Casing vibration through-hole 2a can also be covered, and do not cover the infrared through-hole 23 of casing and casing structure light through-hole 24 through ink 40； It is infrared to cover the infrared through-hole 23 of casing through ink 40 and cover casing structure light through-hole 24, and casing vibration is not covered Through-hole 2a；It is infrared to cover casing structure light through-hole 24 and casing vibration through-hole 2a through ink 40, and casing is not covered Infrared through-hole 23；It is infrared to cover the infrared through-hole 23 of casing and casing vibration through-hole 2a through ink 40, and machine is not covered Shell structure light through-hole 24.

1 is please referred to Fig.1, receiving module 50 is integrated with proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation Single packaging body is collectively formed in device 52.Output module 10 is used for the infrared light sent out during infrared distance measurement, is reflected by external object Afterwards, it is received by proximity sensor 51, proximity sensor 51 judges foreign objects according to the intensity of the infrared light reflected received The distance between body and electronic device 100.Optical flame detector 52 receives the visible ray in ambient light, and detects the intensity of visible ray, with The foundation of display brightness as control display screen 90.Proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, Reduce gap when the two is individually assembled, save the installation space in electronic device 100.

It please refers to Fig.1 and Figure 11, imaging modules 60 can be visible image capturing head 61 and one in infrared pick-up head 62 It is a or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, image Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, and mounting surface 631 is located at lens barrel 64 and imaging sensor 65 Between.In embodiment as shown in Figure 9, receiving module 50 is arranged on mounting surface 631, and specifically, receiving module 50 is being pacified Plane orthographic projection where dress face 631 is at least partly dropped on mounting surface 631, in this way, receiving module 50 and imaging modules 60 Set compacter, the horizontal space that the two occupies jointly is smaller.

In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, defeated The center for going out module 10, infrared pick-up head 62, visible image capturing head 61 and piezoelectric element 70 is located on same line segment.Specifically Ground is followed successively by output module 10, visible image capturing head 61, infrared pick-up head 62, piezoelectricity member from one end of line segment to the other end Part 70 (as shown in figure 12)；Or output module 10, piezoelectric element 70, visible ray are followed successively by from one end of line segment to the other end and is taken the photograph As head 61, infrared pick-up head 62 (as shown in Figure 1)；Or visible image capturing head is followed successively by from one end of line segment to the other end 61st, module 10, piezoelectric element 70, infrared pick-up head 62 are exported.Certainly, module 10, infrared pick-up head 62, piezoelectricity member are exported The arrangement mode of part 70 and visible image capturing head 61 is not limited to above-mentioned citing, can also there is other, such as each electronic component The shapes such as in the arc-shaped, center arrangement is rectangular are arranged with the center of piezoelectric element 70.

3 are please referred to Fig.1, in some embodiments, output module 10, infrared pick-up head 62 and visible image capturing head 61 Center be located on same line segment, piezoelectric element 70 is located between the line segment and the top 21 of casing 20.Specifically, from the line segment One end to the other end be followed successively by output module 10, infrared pick-up head 62, visible image capturing head 61；Or one from the line segment The other end is held to be followed successively by output module 10, visible image capturing head 61, infrared pick-up head 62 (as illustrated in fig. 13b)；Or from One end of line segment is followed successively by infrared pick-up head 62, visible image capturing head 61, output module 10 to the other end.Certainly, mould is exported Organize 10, infrared pick-up head 62, the arrangement mode of visible image capturing head 61 is not limited to above-mentioned citing.In the embodiment of the present invention In, the center of piezoelectric element 70 is not located on the line segment, saved piezoelectric element 70 and each electronic component (output module 10, Infrared pick-up head 62, visible image capturing head 61 etc.) occupy horizontal space.

Further, incorporated by reference to Figure 11, receiving module 50 can be arranged on the mounting surface 631 of infrared pick-up head 62, It can also be arranged on the mounting surface 631 of visible image capturing head 61, certainly, receiving module 50 can not also be arranged on mounting surface On 631, receiving module 50 can be disposed adjacent with output module 10, and proximity sensor 51 is readily received by close to infrared lamp 13 Transmitting, and the infrared light being reflected back by external object；Receiving module 50 can also be disposed adjacent with piezoelectric element 70, not made herein Limitation.

To sum up, in the electronic device 100 of embodiment of the present invention, the face of light hole 132 is blocked by changing Flexible film 133 Product, the infrared light that infrared lamp 12 emits can be emitted with different field angles from encapsulating housing 11, corresponding different field angle, Output module 10 can be used as close to infrared lamp or infrared light compensating lamp, output module 10 gathered transmitting infrared light with infrared distance measurement and The function of infrared light filling.Furthermore it is packaged, compares due to only needing an infrared lamp 12 being arranged on package substrate 111 It is sealed in the infrared light compensating lamp of traditional handicraft from needing to be respectively adopted close to infrared lamp in different wafer manufacture recombinants to PCB substrate Dress, improves packaging efficiency.Further more, electronic device 100 realizes that osteoacusis is transaudient using piezoelectric element 70 and vibration module 30a, Instead of traditional telephone receiver structure by air transmitted sound, on the one hand, can effectively ensure that the privacy of dialog context；It is another Aspect due to eliminating the receiver of script, avoids and through-hole corresponding with receiver is opened up on cover board 30, simpler in technique It is single, it is also more aesthetically pleasing in appearance, and can prevent dust or moisture from entering in electronic device 100.

It is appreciated that the position setting of thang-kng component 13 is not limited to the above embodiment, in other embodiments, Thang-kng component 13 can also be the inner surface that encapsulation top 113 is arranged on by way of glued and shelter from light-emitting window 1131.It is arranged in light-emitting window 1131 alternatively, thang-kng component 13 can also be.

0 and Figure 14 are please referred to Fig.1, in some embodiments, imaging modules 60 include visible image capturing head 61 and infrared Light video camera head 62.It is logical that casing 20 offers the infrared through-hole 23 of spaced casing, casing structure light through-hole 24 and casing vibration Hole 2a.The through-hole 23 infrared with casing of infrared lamp 12 is corresponding, and structured light projector 14 is corresponding with casing structure light through-hole 24.Piezoelectricity member The quantity of part 70 is multiple, and the quantity of casing vibration through-hole 2a is multiple, and multiple piezoelectric elements 70 vibrate through-hole with multiple casings 2a is corresponded to, and each piezoelectric element 70 is housed in corresponding casing vibration through-hole 2a.Export module 10, infrared pick-up head 62, The center of visible image capturing head 61 and multiple piezoelectric elements 70 is located on same line segment, is set between two neighboring piezoelectric element 70 There are at least one of output module 10, infrared pick-up head 62, visible image capturing head 61.For example, the quantity of piezoelectric element 70 It is two, piezoelectric element 70, output module 10, visible image capturing head 61, infrared light is followed successively by from one end of line segment to the other end Camera 62, piezoelectric element 70 (as shown in figure 14)；Or piezoelectric element 70, output are followed successively by from one end of line segment to the other end Module 10, visible image capturing head 61, piezoelectric element 70, infrared pick-up head 62 etc..In another example the quantity of piezoelectric element 70 is three It is a, piezoelectric element 70 is followed successively by from one end of line segment to the other end, output module 10, piezoelectric element 70, light video camera head 61 is seen, is red Outer light video camera head 62, can piezoelectric element 70 (as shown in figure 15)；Or piezoelectric element is followed successively by the other end from one end of line segment 70th, module 10, piezoelectric element 70, visible image capturing head 61, piezoelectric element 70, infrared pick-up head 62 etc. are exported.Certainly, piezoelectricity The quantity and piezoelectric element 70 of element 70, the arrangement mode for exporting module 10, infrared pick-up head 62, visible image capturing head 61 It is not limited to above-mentioned citing.In embodiments of the present invention, multiple piezoelectric elements 70 are combined with cover board 30, in particular multiple piezoelectricity Element 70 is attached to by fastener 30b on cover board 30 respectively.The processor of electronic device 100 is used to obtain voice signal, and Apply electric signal corresponding with the voice signal at the both ends of multiple piezoelectric elements 70 simultaneously, machine occurs for multiple piezoelectric elements 70 Tool deformation, multiple piezoelectric elements 70 drive from the multiple and different positions combined with cover board 30 as a result, vibrates module 30a according to the electricity The frequency vibration of signal.When the body of user is contacted with vibration module 30a, osteoacusis sound passes through the body of user and vibration mould The part (for example, the cartilage of external ear, tooth) of group 30a contacts is sent to the auditory nerve of user.

In embodiments of the present invention, multiple piezoelectric elements 70 drive simultaneously from the multiple and different positions combined with cover board 30 Vibrate module 30a vibration, the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts To the auditory nerve of user.

0, Figure 16 and Figure 17 is please referred to Fig.1, in some embodiments, imaging modules 60 include 61 He of visible image capturing head Infrared pick-up head 62.Casing 20 offers the infrared through-hole 23 of spaced casing, casing structure light through-hole 24 and casing and shakes Dynamic through-hole 2a.The through-hole 23 infrared with casing of infrared lamp 12 is corresponding, and structured light projector 14 is corresponding with casing structure light through-hole 24.Pressure Electric device 70 includes piezoelectric body 71 and the piezoelectricity convex block 72 stretched out from piezoelectric body 71, the quantity of piezoelectricity convex block 72 be it is multiple, The quantity of casing vibration through-hole 2a is multiple, and multiple piezoelectricity convex blocks 72 are corresponding with multiple casings vibration through-hole 2a, and each piezoelectricity is convex 72 partial receipt of block is combined in corresponding casing vibration through-hole 2a and with cover board 30.Export module 10, infrared pick-up head 62 And visible image capturing head 61 is between cover board 30 and piezoelectric body 71.Output module 10, infrared pick-up head 62, visible ray are taken the photograph As the center of first 61 and multiple piezoelectricity convex blocks 72 is located on same line segment, output mould is provided between two neighboring piezoelectricity convex block 72 At least one of group 10, infrared pick-up head 62 and visible image capturing head 61.For example, the quantity of piezoelectricity convex block 72 is two, Piezoelectricity convex block 72, output module 10, visible image capturing head 61, infrared pick-up head are followed successively by from one end of line segment to the other end 62nd, piezoelectricity convex block 72；Or be followed successively by from one end of line segment to the other end piezoelectricity convex block 72, output module 10, piezoelectricity convex block 72, Visible image capturing head 61, infrared pick-up head 62 etc..In another example the quantity of piezoelectricity convex block 72 be three, from one end of line segment to The other end is followed successively by piezoelectricity convex block 72, output module 10, piezoelectricity convex block 72, visible image capturing head 61, infrared pick-up head 62, pressure Electric convex block 72；Or from one end of line segment to the other end be followed successively by piezoelectricity convex block 72, output module 10, piezoelectricity convex block 72, Light video camera head 61, piezoelectricity convex block 72, infrared pick-up head 62 etc..For another example the quantity of piezoelectricity convex block 72 is four, from line segment One end to the other end be followed successively by piezoelectricity convex block 72, output module 10, piezoelectricity convex block 72, visible image capturing head 61, piezoelectricity convex block 72, Infrared pick-up head 62, piezoelectricity convex block 72 (as shown in figure 17).Certainly, the quantity of piezoelectricity convex block 72 and piezoelectricity convex block 72, defeated Go out module 10, infrared pick-up head 62, visible image capturing head 61 arrangement mode be not limited to above-mentioned citing.Implement in the present invention In example, multiple piezoelectricity convex blocks 72 are combined with cover board 30, and more specifically multiple piezoelectricity convex blocks 72 are attached respectively by fastener 30b To cover board 30.The processor of electronic device 100 applies and the voice signal piezoelectric element 70 for obtaining voice signal Corresponding electric signal, mechanical deformation occurs for the piezoelectric element 70 including piezoelectric body 71 and piezoelectricity convex block 72, multiple as a result, Piezoelectricity convex block 72 drives vibration module 30a to be vibrated according to the frequency of the electric signal from the multiple and different positions combined with cover board 30. When the body of user is contacted with vibration module 30a, part that osteoacusis sound is contacted by the body of user with vibrating module 30a (for example, the cartilage of external ear, tooth) is sent to the auditory nerve of user.

In embodiment as shown in figure 17, casing 20 offers spaced casing vibration through-hole 2a, output through-hole 25th, infrared light through-hole 27, visible ray through-hole 28.Casing vibration through-hole 2a is corresponding with piezoelectricity convex block 72, output through-hole 25 and output Module 10 corresponds to, and infrared light through-hole 27 is corresponding with infrared pick-up head 62, it is seen that light through-hole 28 is corresponding with visible image capturing head 61. Wherein, output through-hole 25 is alternatively into the infrared through-hole 23 of above-mentioned spaced casing and casing structure light through-hole 24 or defeated Go out through-hole 25 and connected with casing structure light through-hole 24 by the infrared through-hole 23 of said machine casing to be formed.In addition, infrared light through-hole 27 with it is red The outer correspondence of light video camera head 62 refers to infrared pick-up head 62 can receive the infrared light being reflected by the object from infrared light through-hole 27, it is seen that light Through-hole 28 is corresponding with visible image capturing head 61 refer to visible image capturing head 61 can be received from visible ray through-hole 28 be reflected by the object can See light.

In embodiments of the present invention, multiple piezoelectricity convex blocks 72 drive vibration from the multiple and different positions combined with cover board 30 Module 30a vibrates, and the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts to use The auditory nerve at family；In addition, multiple piezoelectricity convex blocks 72 are stretched out from same piezoelectric body 71, convenient for multiple piezoelectricity convex blocks 72 simultaneously Apply electric signal, to be vibrated from multiple and different position synchronous drives vibration module 30a；Further more, output module 10, visible image capturing First 61 and infrared pick-up head 62 between cover board 30 and piezoelectric body 71, and interspersed be provided with piezoelectricity convex block 72, electronics dress It is smaller to put 100 overall volumes, saves space.

Referring to Fig. 5, in some embodiments, output module 10 further includes metal shutter 16, metal shutter 16 In encapsulating housing 11, and metal shutter 16 is between structured light projector 14 and infrared lamp 12.Metal shutter 16 Between structured light projector 14 and infrared lamp 12, metal shutter 16 on the one hand can with shielding construction light projector 14 with it is red The luminous intensity and sequential of the mutual electromagnetic interference of outer lamp 12, structured light projector 14 and infrared lamp 12 will not mutual shadows It rings, another aspect metal shutter 16 can be used for chamber of the 14 place cavity of isolation structures light projector where with infrared lamp 12 Body, light will not enter another cavity from a cavity.

8 are please referred to Fig.1, in some embodiments, output module 10 further includes optics sealing cover 17.Optics sealing cover 17 is by saturating Luminescent material is made, and optics sealing cover 17 is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 17 wraps red Outer lamp 12.Specifically, optics sealing cover 17 can be formed by encapsulating injection molding and forming technology, and optics sealing cover 17 may be used transparent Thermosetting epoxy resin is made, and to be not easy to soften in use, optics sealing cover 17 can fix the position of infrared lamp 12, and cause Infrared lamp 12 is not easy to shake in encapsulating housing 11.At this point, thang-kng component 13 can be arranged in optics sealing cover 17, can also set It puts outside optics sealing cover 17.

9 are please referred to Fig.1, in some embodiments, proximity sensor 51 can be not integrated in reception mould with optical flame detector 52 In group 50, in other words, proximity sensor 51 is separately set with optical flame detector 52.At this point, proximity sensor 51 can be arranged on microscope base On 63 mounting surface 631；Optical flame detector 52 can also be arranged on the mounting surface 631 of microscope base 63；Or proximity sensor 51 and light Sensor 52 is arranged on the mounting surface 631 of microscope base 63 simultaneously.Microscope base 63 can be the microscope base 63 of infrared pick-up head 62, can also It is the microscope base 63 of visible image capturing head 61.

Figure 20 is please referred to, the infrared through-hole 33 of cover board can also be offered in some embodiments, on cover board 30, cover board is red The through-hole 23 infrared with casing of accessibke porosity 33 is corresponding, and the infrared light that infrared lamp 12 emits can be from lid after passing through the infrared through-hole 23 of casing Electronic device 100 is pierced by the infrared through-hole 33 of plate.At this point, it can be set with 24 corresponding position of casing structure light through-hole on cover board 30 Infrared transmission ink 40 is put, user is difficult to see that the structure light of the inside of electronic device 100 is thrown by casing structure light through-hole 24 Emitter 14, the shape of electronic device 100 are more beautiful.

Figure 21 is please referred to, covering plate structure light through-hole 34, cover board knot can also be opened up in some embodiments, on cover board 30 Structure light through-hole 34 is corresponding with casing structure light through-hole 24, and the infrared light that structured light projector 14 emits passes through casing structure light through-hole Electronic device 100 can be pierced by after 24 from covering plate structure light through-hole 34.At this point, through-hole 23 infrared with casing is corresponding on cover board 30 Position can set it is infrared penetrate ink 40, user is difficult to see by the infrared through-hole 23 of casing the inside of electronic device 100 Infrared lamp 12 and thang-kng component 13, the shape of electronic device 100 it is more beautiful.

Figure 22 is please referred to, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on On substrate 66, receiving module 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, one of substrate 66 Divide and be located in microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and is used to carry image sensing Device 65, the other end can be connect with the mainboard of electronic device 100.When receiving module 50 is arranged on substrate 66, receiving module 50 It is arranged on outside microscope base 63, receiving module 50 can also be connect with FPC.

Further, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, close to biography Single package body structure is collectively formed with optical flame detector 52 in sensor 51, reduces gap when the two is individually assembled, saves electronic device 100 Interior installation space.In other embodiments, the receiving module 50 for being arranged on substrate 66 includes proximity sensor 51 or/and light Sensor 52, proximity sensor 51 and optical flame detector 52 are respectively single package body structure.That is, the receiving module 50 for being arranged on substrate 66 is The proximity sensor 51 of single package body structure；Alternatively, the receiving module 50 for being arranged on substrate 66 is the light sensation of single package body structure Device 52；Alternatively, the receiving module 50 for being arranged on substrate 66 is the proximity sensor 51 of single package body structure and single package body structure Optical flame detector 52.

Imaging modules 60 can be visible image capturing head 61 and one or two in infrared pick-up head 62.Specifically, Receiving module 50 can be fixed on the substrate 66 of visible image capturing head 61；Receiving module 50 can be fixed on infrared pick-up head On 62 substrate 66.When proximity sensor 51 and optical flame detector 52 are encapsulated for split, proximity sensor 51 can be fixed on visible On the substrate 66 of light video camera head 61, optical flame detector 52 can be fixed on the substrate 66 of infrared pick-up head 62；Alternatively, optical flame detector 52 It can be fixed on the substrate 66 of visible image capturing head 61, proximity sensor 51 can be fixed on the substrate of infrared pick-up head 62 On 66；Alternatively, proximity sensor 51 is each attached to optical flame detector 52 on the substrate 66 of visible image capturing head 61；Alternatively, close to passing Sensor 51 is each attached to optical flame detector 52 on the substrate 66 of infrared pick-up head 62.

Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with receiving module 50, to increase The integral strength of substrate 66 so that FPC is not susceptible to around folding, while receiving module 50 (or proximity sensor 51 or optical flame detector 52) It is not susceptible to shake when being arranged on substrate 66.In one example, receiving module 50 (or proximity sensor 51 or optical flame detector 52) it may be also secured on the lateral wall of microscope base 63, such as be fixed on the lateral wall of microscope base 63 by cohesive mode.

Figure 23 is please referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67 Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- top surface 672 and the sub- top surface 673 of third, the second son top 672 and first sub- top surface 671 of face tilts connection and forms notch 675, the sub- top surface 673 and second of third with the first sub- top surface 671 Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- top surface 671 and the sub- top surface 673 of third to connect first Sub- top surface 671 and the sub- top surface 673 of third.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight Angle, the angle between the second sub- top surface 672 and the sub- top surface 673 of third can be obtuse angle or right angle.Notch 675 is opened in camera shell On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.The sub- top surface 673 of third offers out Light through-hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through-hole 674.Imaging sensor 65 is housed in In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens mould Group 68 is simultaneously transmitted on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Receiving module 50 is arranged on At first sub- top surface 671, receiving module 50 includes proximity sensor 51 and optical flame detector 52.In present embodiment, imaging modules 60 Can be visible image capturing head 61, receiving module 50 is single packaging body that proximity sensor 51 is collectively formed with optical flame detector 52.It connects Nearly sensor 51 can be consistent with the extending direction of notch 675 (as shown in figure 23) with the center line connecting direction of optical flame detector 52；Or Person, proximity sensor 51 can be vertical with the extending direction of notch 675 or in the two shape with the center line connecting direction of optical flame detector 52 Into angle be acute angle or obtuse angle.In other embodiments, imaging modules 60 can be infrared pick-up head 62.

The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the first sub- top surface On 671, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves Installation space in electronic device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce The installation space in electronic device 100 is saved in gap when the two is individually assembled.

Please continue to refer to Figure 23, in some embodiments, the receiving module 50 of the above embodiment is arranged on the first son On top surface 671 and positioned at the outside of camera case 67, specifically, entire receiving module 50 is along perpendicular to the first sub- top surface 671 Projection can be located in the first sub- top surface 671 (as shown in figure 23)；Alternatively, part receiving module 50 is pushed up along perpendicular to the first son The projection in face 671 is located in the first sub- top surface 671.That is, receiving module 50 is at least part of to be located at the first sub- top surface 671 surface, in this way, receiving module 50 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly compared with It is small, further save the installation space in electronic device 100.In other embodiments, receiving module 50 is included close to biography Sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two individual single packaging bodies, at this point, being respectively single envelope The proximity sensor 51 and optical flame detector 52 for filling body can also be all disposed on the first sub- top surface 671.

Figure 24 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes proximity sensor 51, not comprising optical flame detector 52, tied at this point, proximity sensor 51 (or receiving module 50) is respectively monomer encapsulation with optical flame detector 52 Structure, proximity sensor 51 are arranged on the first sub- top surface 671, and optical flame detector 52 is arranged on any other except the first sub- top surface 671 Position.

Please continue to refer to Figure 24, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, and not comprising proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively monomer envelope with proximity sensor 51 Assembling structure, optical flame detector 52 are arranged on the first sub- top surface 671, proximity sensor 51 be arranged on except the first sub- top surface 671 other Any position.

Figure 25 is please referred to, the first sub- top surface 671 of the above embodiment offers loophole 676, and receiving module 50 is located at It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without light sensation Device 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 The light in portion can pass through loophole 676 and be transmitted on proximity sensor 51.The receiving module 50 of present embodiment is arranged on In camera case 67, receiving module 50 and the structure of camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging mould Group 60 is installed on casing 20.

Please continue to refer to Figure 25, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without connecing Nearly sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electricity Light outside sub-device 100 can pass through loophole 676 and be transmitted on optical flame detector 52.The receiving module 50 of present embodiment Be arranged in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with Imaging modules 60 are installed on casing 20.

Figure 26 is please referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 be integrated with it is close When sensor 51 is with optical flame detector 52, loophole 676 can be one and proximity sensor 51 and the corresponding light transmission of optical flame detector 52 Hole or two it is spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that light can pass through loophole 676 and be transmitted in receiving module 50.In other realities It applies in mode, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two Individually list packaging body, at this point, camera can also be all disposed within by being respectively the proximity sensor 51 of single packaging body and optical flame detector 52 It is in housing 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, makes receiving module 50 more stablize with the structure of camera case 67 and convenient for receiving module 50 and imaging modules 60 are installed on casing 20.

Figure 26 is please referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connect with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connect with FPC.This embodiment party In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation Single package body structure is collectively formed in device 52, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty Between.

In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 51 is also encapsulated for monomer Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at Outside camera case 67.

In yet another embodiment, optical flame detector 52 is only included in receiving module 50, proximity sensor 51, which is not integrated into, to be connect It receives in module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 is also sealed for monomer Assembling structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part of position of substrate 66 In in camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate 66 And outside camera case 67.

The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67 Structure is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, and receiving module 50 is enable to be firmly mounted in camera case 67.

Figure 27 is please referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677 678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677 Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle. Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two A light extraction through-hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through-holes 674 Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions Through-hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68, Light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens module 68 and be transmitted on imaging sensor 65.This reality It applies in mode, imaging modules 60 can be visible image capturing head 61, and two camera lens modules 68 are visible image capturing head 61 at this time Corresponding camera lens module.Receiving module 50 is arranged on the second tread 678 and outside camera case 67.Receiving module 50 is connects Single packaging body that nearly sensor 51 is collectively formed with optical flame detector 52.The center line connecting direction of proximity sensor 51 and optical flame detector 52 can With consistent with the extending direction of notch 675；Alternatively, the center line connecting direction of proximity sensor 51 and optical flame detector 52 can be with notch The angle that 675 extending direction vertical (as shown in figure 27) or the two are formed is acute angle or obtuse angle.In other embodiments, into As module 60 can be infrared pick-up head 62, two camera lens modules 68 are 62 corresponding camera lens mould of infrared pick-up head at this time Group.In yet another embodiment, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, at this time one of them Camera lens module 68 is 62 corresponding camera lens module of infrared pick-up head, another camera lens module 68 is corresponded to for visible image capturing head 61 Camera lens module.

The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the second tread 678 On, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, has saved electronics Installation space in device 100；Both meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce The installation space in electronic device 100 is saved in individually gap during assembling.

Figure 28 is please referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670 On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through-holes 674 are opened in the first son respectively On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675 Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face 679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678, Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating receiving module 50 is arranged on the second tread On 678.

Figure 27 and Figure 28 is please referred to, in some embodiments, the receiving module 50 of the above embodiment is arranged on second On tread 678 and positioned at the outside of camera case 67.Specifically, it is whole when notch 675 is opened in the marginal position of top surface 670 A receiving module 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, part receives mould Group 50 is located at along the projection perpendicular to the second tread 678 in the second tread 678 (as shown in figure 27).That is, receiving module The 50 at least part of surfaces for being located at the second tread 678.It is whole when notch 675 is opened on the centre position of top surface 670 A receiving module 50 can be located in the second tread 678 (as shown in figure 28) along perpendicular to the projection of the second tread 678.Such as This, receiving module 50 sets compacter with imaging modules 60, and the horizontal space that the two occupies jointly is smaller, further saves Installation space in electronic device 100.In other embodiments, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two individual single packaging bodies, at this point, be respectively single packaging body close to sensing Device 51 and optical flame detector 52 can also be all disposed on the second tread 678.

Figure 28 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes close to sensing Device 51, receiving module 50 does not include optical flame detector 52, at this point, proximity sensor 51 (or receiving module 50) is respectively with optical flame detector 52 Cell packaging configuration, proximity sensor 51 are arranged on the second tread 678, and optical flame detector 52 is arranged on the casing outside imaging modules 60 On 20.

Figure 28 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, Receiving module 50 does not include proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively with proximity sensor 51 Cell packaging configuration, optical flame detector 52 are arranged on the second tread 678, and proximity sensor 51 is arranged on the casing outside imaging modules 60 On 20.

Figure 29 is please referred to, the second tread 678 of the above embodiment offers loophole 676, and receiving module 50 is located at phase It is in casing body 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without optical flame detector 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 Light can pass through and loophole 676 and be transmitted on proximity sensor 51.The receiving module 50 of present embodiment is arranged on phase In casing body 67, the structure of receiving module 50 and camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging modules 60 are installed on casing 20.

Please continue to refer to Figure 29, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics Light outside device 100 can pass through loophole 676 and be transmitted on optical flame detector 52.The receiving module 50 of present embodiment is set Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with into As module 60 is installed on casing 20.

Figure 30 is please referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, Receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 is integrated with close to sensing When device 51 and optical flame detector 52, loophole 676 can be one with proximity sensor 51 and the corresponding loophole of optical flame detector 52 or Two spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, the light outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that loophole 676 can be passed through and be transmitted in receiving module 50.In other embodiment party In formula, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are independent for two Single packaging body, at this point, camera case can also be all disposed within by being respectively the proximity sensor 51 of single packaging body and optical flame detector 52 It is in 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, make receiving module 50 with The structure of camera case 67 is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20.

Please continue to refer to Figure 30, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connect with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connect with FPC.This embodiment party In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation Single package body structure is collectively formed in device 52, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty Between.

In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 51 is also encapsulated for monomer Structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 simultaneously Outside camera case 67.

In yet another embodiment, receiving module 50 only includes optical flame detector 52, and proximity sensor 51 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 is also encapsulated for monomer Structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 In camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate 66 It goes up and is located at outside camera case 67.

In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention. In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side Formula combines.

In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two, Three, unless otherwise specifically defined.

Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.

Claims

1. a kind of electronic device, which is characterized in that including：

Casing；

Module is exported, the output module includes encapsulating housing, infrared lamp and thang-kng component, and the encapsulating housing includes encapsulation In the encapsulating housing, the infrared lamp is carried on the encapsulation base for substrate, the infrared lamp and the thang-kng component package On plate, the thang-kng component is located in the luminous light path of the infrared lamp, and the thang-kng component includes matrix and Flexible film, described Matrix offers light hole, and the Flexible film is housed in the light hole, and the Flexible film can be sent out under the action of electric field Raw deformation simultaneously changes the area for blocking the light hole, the infrared light of the infrared lamp transmitting can with different field angles from The encapsulating housing outgoing；

Module is vibrated, the vibration module installation is on the housing；With

Piezoelectric element, the piezoelectric element are combined with the vibration module and export module interval, the piezoelectric element with described For being deformed upon when being applied in electric signal so that the vibration module vibration.

2. electronic device according to claim 1, which is characterized in that the Flexible film includes the inner wall with the light hole With reference to first surface and the second surface opposite with the first surface, under the action of electric field, the second surface can It deforms upon to change the area that the Flexible film blocks the light hole relative to the first surface.

3. electronic device according to claim 1 or 2, which is characterized in that the quantity of the light hole is described to stretch to be single Contracting film can deform upon to change the area for blocking the single light hole under the action of electric field；Or

The quantity of the light hole is at least two, the Flexible film also be able to change under the action of electric field block it is described logical The quantity of unthreaded hole.

4. electronic device according to claim 1, which is characterized in that the vibration module includes display screen and the lid of light transmission Host cavity is collectively formed on the housing and with the casing in plate, the display screen setting, and the cover board is incorporated in the machine On shell and positioned at the side far from the host cavity of the display screen, the display screen is combined with the cover board, the casing Offer the infrared through-hole of spaced casing, casing structure light through-hole and casing vibration through-hole, the infrared lamp and the machine The infrared through-hole of shell corresponds to, and the structured light projector is corresponding with the casing structure light through-hole, and the piezoelectric element is housed in institute It states in casing vibration through-hole and is combined with the cover board.

5. electronic device according to claim 4, which is characterized in that the piezoelectric element and the display screen pass through engagement Part is attached on the cover board.

6. electronic device according to claim 1, which is characterized in that the output module further includes chip, described infrared Lamp is formed on the chip with the structured light projector.

7. electronic device according to claim 1, which is characterized in that the encapsulating housing further includes package wall and encapsulation Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute It states encapsulation top and is formed with the first light-emitting window and the second light-emitting window, first light-emitting window is corresponding with the infrared lamp, Second light-emitting window is corresponding with the structured light projector.

8. electronic device according to claim 1, which is characterized in that the output module further includes metal shutter, institute Metal shutter is stated to be located in the encapsulating housing, and between the infrared lamp and the structured light projector.

9. electronic device according to claim 4, which is characterized in that the cover board is formed with the surface that the casing is combined Have and only transmit the infrared through ink of infrared light, the infrared ink that penetrates blocks the infrared through-hole of the casing, the casing knot At least one of structure light through-hole and casing vibration through-hole.

10. electronic device according to claim 1, which is characterized in that the electronic device further include receiving module and into As module, the receiving module is integrated with proximity sensor and optical flame detector, and the imaging modules include microscope base, mounted on the mirror Lens barrel on seat and the imaging sensor being housed in the microscope base, the microscope base include being located at the lens barrel and described image Mounting surface between sensor, the receiving module are arranged on the mounting surface.

11. electronic device according to claim 1, which is characterized in that the electronic device further includes proximity sensor, light Sensor and imaging modules, the imaging modules include microscope base, the lens barrel on the microscope base and are housed in the microscope base Interior imaging sensor, the microscope base includes the mounting surface between the lens barrel and described image sensor, described close At least one of sensor and the optical flame detector are arranged on the mounting surface.

12. electronic device according to claim 1, which is characterized in that the electronic device further includes infrared pick-up head With visible image capturing head, the center of the output module, the infrared pick-up head and the visible image capturing head is positioned at same On line segment, the piezoelectric element is between the line segment and the top of the casing.

13. electronic device according to claim 4, which is characterized in that the electronic device further includes infrared pick-up head With visible image capturing head, the quantity of the piezoelectric element be it is multiple, the quantity of the casing vibration through-hole be it is multiple, it is multiple described Piezoelectric element is corresponding with multiple casing vibration through-holes, and it is logical that each piezoelectric element is housed in the corresponding casing vibration In hole, the centre bit for exporting module, the infrared pick-up head, the visible image capturing head and multiple piezoelectric elements In on same line segment, being provided with the output module, the infrared pick-up head and institute between the two neighboring piezoelectric element State at least one of visible image capturing head.

14. electronic device according to claim 4, which is characterized in that the electronic device further includes infrared pick-up head With visible image capturing head, the piezoelectric element includes piezoelectric body and the piezoelectricity convex block stretched out from the piezoelectric body, the machine The quantity of shell vibration through-hole is multiple, and multiple piezoelectricity convex blocks are corresponding with multiple casing vibration through-holes, each pressure Electric convex portion is housed in corresponding casing vibration through-hole and is combined with the cover board, the module, described red of exporting Outer light video camera head and the visible image capturing head are between the cover board and the piezoelectric body, the output module, described The center of infrared pick-up head, the visible image capturing head and multiple piezoelectricity convex blocks is located on same line segment, two neighboring It is provided between the piezoelectricity convex block in the output module, the infrared pick-up head and the visible image capturing head at least One.