CN107918459A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN107918459A CN107918459A CN201711435267.3A CN201711435267A CN107918459A CN 107918459 A CN107918459 A CN 107918459A CN 201711435267 A CN201711435267 A CN 201711435267A CN 107918459 A CN107918459 A CN 107918459A
- Authority
- CN
- China
- Prior art keywords
- infrared
- casing
- lamp
- light
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 238000009434 installation Methods 0.000 claims abstract description 39
- 230000003287 optical effect Effects 0.000 claims description 88
- 238000005538 encapsulation Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 5
- 230000008901 benefit Effects 0.000 claims description 4
- 210000003128 head Anatomy 0.000 description 44
- 230000006870 function Effects 0.000 description 10
- 238000004806 packaging method and process Methods 0.000 description 9
- 238000000605 extraction Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 210000000860 cochlear nerve Anatomy 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 210000000883 ear external Anatomy 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000009738 saturating Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 210000000988 bone and bone Anatomy 0.000 description 2
- 210000000845 cartilage Anatomy 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 230000035807 sensation Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
Abstract
The invention discloses a kind of electronic device.Electronic device includes casing, output module, vibration module, piezoelectric element, mainboard, imaging modules and receiving module.Output module is arranged in casing, including encapsulating housing, infrared light compensating lamp and close to infrared lamp.Encapsulating housing includes package substrate, and infrared light compensating lamp can launch infrared light to outside encapsulating housing with being encapsulated in encapsulating housing and being carried on package substrate close to infrared lamp with different power.Module is vibrated to be installed on casing.Piezoelectric element is combined with vibration module and with exporting module interval, and for being deformed upon when being applied in electric signal so as to vibrate module vibration.Since output module integrated level is higher, small volume, and imaging modules and receiving module partly overlap on the depth direction of installation gap, have saved the space inside electronic device.In addition, electronic device realizes that osteoacusis is transaudient using piezoelectric element and vibration module, the privacy of dialog context can effectively ensure that.
Description
Technical field
The present invention relates to consumer electronics technical field, more specifically, is related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of the function element set
It is more and more, in order to realize distance detection, ambient light detection with the function such as the facial 3D feature recognitions of user, it is necessary to be set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be taken.
The content of the invention
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Module is exported, the output module is arranged in the casing, and the output module includes encapsulating housing, infrared benefit
Light lamp and close to infrared lamp, the encapsulating housing include package substrate, and the infrared light compensating lamp is encapsulated with described close to infrared lamp
In the encapsulating housing and carry on the package substrate, the infrared light compensating lamp with it is described can be with not close to infrared lamp
Same power launches infrared light to outside the encapsulating housing；
Module is vibrated, the vibration module installation is on the housing；
Piezoelectric element, the piezoelectric element are combined with the vibration module and export module interval, the piezoelectricity with described
Element is used to deform upon when being applied in electric signal so that the vibration module vibration；
Mainboard, the mainboard are installed in the casing and formed with installation gap；
Imaging modules, the imaging modules are installed in the casing and corresponding with the installation gap；With
Receiving module, the receiving module are incorporated on the mainboard, and are stretched into from the edge of the installation gap described
Installation gap, along the depth direction of the installation gap, the receiving module partly overlaps with the imaging modules, described to connect
Receiving module includes proximity sensor and/or optical flame detector.
In some embodiments, the vibration module includes the cover board of display screen and printing opacity, and the display screen is arranged on
Host cavity is collectively forming on the casing and with the casing, the cover board sets on the housing and is located at the display screen
The remote host cavity side, the display screen combined with the cover board, and the casing offers spaced casing
Through hole, described corresponding close to through hole with the casing close to infrared lamp, institute are vibrated close to through hole, casing light filling through hole and casing
It is corresponding with the casing light filling through hole to state infrared light compensating lamp, the piezoelectric element be housed in casing vibration through hole and with institute
State cover board combination.
In some embodiments, the piezoelectric element and the display screen are attached on the cover board by fastener.
In some embodiments, the output module further includes chip, and the infrared light compensating lamp is with described close to infrared
Lamp is formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected at the top of the encapsulation between the package substrate, formed with light filling at the top of the encapsulation
Window and close to window, the light filling window is corresponding with the infrared light compensating lamp, it is described close to window with it is described close to infrared lamp
It is corresponding.
In some embodiments, the output module further includes light-supplementing lamp lens, and the light-supplementing lamp lens are arranged on institute
State in encapsulating housing and corresponding with the infrared light compensating lamp；And/or
The output module is further included close to lamp lens, it is described be arranged on close to lamp lens in the encapsulating housing and with institute
State and corresponded to close to infrared lamp.
In some embodiments, the output module further include the light-supplementing lamp lens that are arranged in the encapsulating housing and
Close to lamp lens, the light-supplementing lamp lens are corresponding with the infrared light compensating lamp, described close to lamp lens and described close to infrared lamp
Corresponding, the light-supplementing lamp lens are located on same transparent base with described close to lamp lens.
In some embodiments, the output module further includes metal shutter, and the metal shutter is positioned at described
In encapsulating housing and positioned at the infrared light compensating lamp and described close between infrared lamp.
In some embodiments, the output module further includes the optics sealing cover made of light transmissive material, the optics
Sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps the infrared light compensating lamp
It is and described close to infrared lamp.
In some embodiments, the output module further includes out light clapboard, it is described go out light clapboard be formed in the light
Learn in sealing cover and positioned at the infrared light compensating lamp and described close between infrared lamp.
In some embodiments, formed with grounding pin, light compensating lamp pin and close to lamp pin on the output module,
When the grounding pin and the light compensating lamp pin are enabled, the infrared light compensating lamp launches infrared light；The grounding pin
With it is described close to lamp pin be enabled when, it is described close to infrared lamp launch infrared light.
In some embodiments, the cover board and the surface that the casing is combined are formed with only transmitting the infrared of infrared light
Through ink, the infrared ink that passes through blocks the casing close to the vibration of through hole, the casing light filling through hole and the casing
It is at least one in through hole.
In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head
Kind.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and structure light
The projector, output module, the infrared pick-up head, the visible image capturing head, the piezoelectric element and the structure
The center of light projector is located on same line segment, is followed successively by from one end of the line segment to the other end：
It is the output module, the structured light projector, the piezoelectric element, the infrared pick-up head, described visible
Light video camera head；Or
The output module, the infrared pick-up head, the piezoelectric element, the visible image capturing head, the structure
Light projector；Or
The infrared pick-up head, the output module, the piezoelectric element, the visible image capturing head, the structure
Light projector；Or
The infrared pick-up head, the visible image capturing head, the piezoelectric element, the output module, the structure
Light projector.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head, structure light and throws
Emitter, the centre bit for exporting module, the infrared pick-up head, the visible image capturing head and the structured light projector
In on same line segment, the piezoelectric element is between the line segment and the top of the casing.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and structure light
The projector, the quantity of the piezoelectric element is multiple, and the quantity of the casing vibration through hole is multiple, multiple piezoelectric elements
Corresponding with multiple casing vibration through holes, each piezoelectric element is housed in the corresponding casing vibration through hole, institute
State output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectric elements and the project structured light
The center of device is located on same line segment, and the output module, the infrared light are provided between the two neighboring piezoelectric element
It is at least one in camera, the visible image capturing head and the structured light projector.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and structure light
The projector, the piezoelectric element include piezoelectric body and the piezoelectricity convex block stretched out from the piezoelectric body, and the casing vibration is logical
The quantity in hole is multiple, and multiple piezoelectricity convex blocks are corresponding with multiple casing vibration through holes, each piezoelectricity convex block portion
Divide and be housed in the corresponding casing vibration through hole and combined with the cover board, the output module, the infrared pick-up
Head, the visible image capturing head and the structured light projector are between the cover board and the piezoelectric body, the output
In module, the infrared pick-up head, the visible image capturing head, multiple piezoelectricity convex blocks and the structured light projector
The heart is located on same line segment, be provided between the two neighboring piezoelectricity convex block it is described output module, the infrared pick-up head,
It is at least one in the visible image capturing head and the structured light projector.
In the electronic device of embodiment of the present invention, output module is by infrared light compensating lamp with being integrated into one close to infrared lamp
Single package body structure, has gathered transmitting infrared light with the function of infrared distance measurement and infrared light filling, therefore, has exported the integrated level of module
Higher, small volume, output module has saved the space for the function of realizing infrared light filling and infrared distance measurement.It is further, since infrared
Light compensating lamp and be carried on close to infrared lamp on same package substrate, compared to traditional handicraft infrared light compensating lamp with close to infrared
Lamp needs to be respectively adopted different wafers and manufactures recombinants to be encapsulated to PCB substrate, improves packaging efficiency.Further more, electronic device
Realize that osteoacusis is transaudient using piezoelectric element and vibration module, instead of traditional telephone receiver structure by air transmitted sound, one
The privacy of dialog context is effectively ensured in aspect, on the other hand, due to eliminating the receiver of script, avoids and opens on the cover board
It is simpler in technique if through hole corresponding with receiver, it is also more aesthetically pleasing in appearance.Finally, due to imaging modules and reception mould
Group partly overlaps on the depth direction of installation gap, and receiving module sets compacter with imaging modules, the two common occupancy
Horizontal space it is smaller, saved the space inside electronic device.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become obvious, or recognized by the practice of embodiments of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the schematic perspective view of the output module of the electronic device of embodiment of the present invention；
Fig. 3 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Fig. 4 is the schematic perspective view of the output module of the electronic device of embodiment of the present invention；
Fig. 5 is schematic cross-section of the electronic device along V-V lines in Fig. 1；
Fig. 6 is the partial sectional schematic view that the electronic device in Fig. 1 is intercepted along line VI -- VI correspondence position；
Fig. 7 is the receiving module of the electronic device of embodiment of the present invention and the schematic perspective view of imaging modules；
Fig. 8 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Fig. 9 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 10 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 11 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 12 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 13 is the partial sectional schematic view of the electronic device XIII-XIII lines in Figure 12；
Figure 14 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Figure 15 is the receiving module of embodiment of the present invention and the schematic perspective view of imaging modules；
Figure 16 to Figure 17 is that the electronic device edge of embodiment of the present invention is intercepted with XVI-XVI lines correspondence position in Fig. 1
Partial sectional schematic view；
Figure 18 to Figure 26 is the receiving module of the electronic device of embodiment of the present invention and the schematic perspective view of imaging modules；
Figure 27 is the schematic perspective view of the receiving module of the electronic device of embodiment of the present invention, imaging modules and mainboard；
With
Figure 28 is the partial sectional schematic view of the electronic device of embodiment of the present invention.
Embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the same or similar element of expression eventually or there is same or like element.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity
Sub- component includes output module 10, vibration module 30a (such as Fig. 5), piezoelectric element 70, receiving module 50 (such as Fig. 7), imaging mould
60 (such as Fig. 7) of group and structured light projector 80.Electronic device 100 can be mobile phone, tablet computer, laptop, intelligent hand
Table, Intelligent bracelet, automatic teller machine etc., the embodiment of the present invention are illustrated so that electronic device 100 is mobile phone as an example, it will be understood that electricity
The concrete form of sub-device 100 can be other, and this is not restricted.
Fig. 2 and Fig. 3 are referred to, exports module 10 as single package body structure, including encapsulating housing 11,12 and of infrared light compensating lamp
Close to infrared lamp 13.
Encapsulating housing 11 is used to encapsulate infrared light compensating lamp 12 at the same time and close to infrared lamp 13, in other words, infrared light compensating lamp 12
It is encapsulated at the same time in encapsulating housing 11 with close to infrared lamp 13.Encapsulating housing 11 includes package substrate 111,112 and of package wall
Encapsulation top 113.Encapsulating housing 11 can be shielded by electromagnetic interference (Electromagnetic Interference, EMI)
Material is made, and output module 10 is had an impact to avoid extraneous electromagnetic interference.
Package substrate 111 is used to carry infrared light compensating lamp 12 and close to infrared lamp 13.It is infrared when manufacture exports module 10
Light compensating lamp 12 and can be formed on a piece of chip 14 close to infrared lamp 13, then by infrared light compensating lamp 12, close to 13 and of infrared lamp
Chip 14 is set along on package substrate 111, and specifically, chip 14 can be bonded on package substrate 111.Meanwhile seal
Dress substrate 111 can be used for and other parts of electronic device 100 (such as the casing 20 of electronic device 100, mainboard 110
(as shown in figure 27) etc.) connection, output module 10 is fixed in electronic device 100.
Package wall 112 can surround infrared light compensating lamp 12 and be set close to infrared lamp 13, and package wall 112 encapsulates base certainly
Plate 111 extends, and package wall 112 can be combined with package substrate 111, it is preferred that package wall 112 is can with package substrate 111
Releasably connect, in order to remove to infrared light compensating lamp 12 after package wall 112 and overhauled close to infrared lamp 13.Package-side
The making material of wall 112 can be the material of impermeable infrared light, be sent to avoid infrared light compensating lamp 12 or close to infrared lamp 13
Infrared light passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113
Formed with light filling window 1131 and close to window 1132, light filling window 1131 is corresponding with infrared light compensating lamp 12, infrared light compensating lamp 12
The infrared light of transmitting is pierced by from light filling window 1131；It is corresponding with close to infrared lamp 13 close to window 1132, sent out close to infrared lamp 13
The infrared light penetrated is pierced by from close to window 1132.Encapsulation top 113 integrally formed can be obtained with package wall 112, can also
Split shapes to obtain.In one example, light filling window 1131 and close to window 1132 be through hole, encapsulation top 113 making
Material is the material of impermeable infrared light.In another example, 113 material by impermeable infrared light of encapsulation top and saturating infrared light
Material co-manufactured forms, and specifically, light filling window 1131 and is made close to window 1132 of the material of saturating infrared light, its remaining part
Position is made of the material of impermeable infrared light, further, light filling window 1131 and could be formed with lens knot close to window 1132
Structure, to improve the infrared light emission angle projected from light filling window 1131 and close to window 1132, such as 1131 shape of light filling window
Into there is concavees lens structure, so that the divergence of beam through light filling window 1131 outwards projects；Close to window 1132 formed with convex lens
Mirror structure, so as to gather outside injection through the light close to window 1132.
Infrared light compensating lamp 12 further reduces infrared light compensating lamp with that can be formed on a piece of chip 14 close to infrared lamp 13
12 with the volume close to infrared lamp 13 after integrated, and preparation process is simpler.Infrared light compensating lamp 12 can launch infrared light, infrared light
Through light filling window 1131 to project body surface, the infrared pick-up first 62 of electronic device 100 is (as shown in Figure 1) to receive quilt
The infrared light of object reflection is to obtain the image information of object (at this time, infrared light compensating lamp 12 is used for infrared light filling).Close to infrared
Lamp 13 can launch infrared light, and infrared light passes through close to window 1132 and reaches body surface, the proximity sensor of electronic device 100
The infrared light that 51 receptions (as shown in Figure 7) are reflected by the object is with the distance of detection object to electronic device 100 (at this time, close to red
Outer lamp 13 is used for infrared distance measurement).
Infrared light compensating lamp 12 can launch infrared light with different power from close to infrared lamp 13 to outside encapsulating housing 11,
Specifically, infrared light compensating lamp 12 close to infrared lamp 13 with that can launch infrared light at the same time, and output module 10 is at the same time for infrared
Light filling and infrared distance measurement；Can also infrared light compensating lamp 12 launch light and do not launch light close to infrared lamp 13, export module 10
It is only used for infrared light filling；Can also infrared light compensating lamp 12 do not launch light and close to infrared lamp 13 launch light, export module 10
It is only used for infrared distance measurement.
Incorporated by reference to Fig. 4, in embodiments of the present invention, export on module 10 formed with grounding pin 15, light compensating lamp pin 16
With close to lamp pin 17.Grounding pin 15, light compensating lamp pin 16 and it can be formed on package substrate 111 close to lamp pin 17,
When grounding pin 15 and light compensating lamp pin 16 are enabled, (that is, grounding pin 15 and light compensating lamp pin 16 access circuit turn-on
When), infrared light compensating lamp 12 launches infrared light；When grounding pin 15 and (that is, grounding pin 15 when being enabled close to lamp pin 17
During with close to the access circuit turn-on of lamp pin 17), launch infrared light close to infrared lamp 13.
Please refer to Fig.1 and Fig. 5, casing 20 can be as the installation carriers of output module 10, in other words, output module 10 can
To be arranged in casing 20.Casing 20 can be the shell of electronic device 100.
Incorporated by reference to Fig. 6, casing 20 includes top 21 and bottom 22, and in position corresponding with electronic component, casing 20 is opened
Equipped with spaced casing through hole 2a is vibrated close to through hole 23, casing light filling through hole 24 and casing.Output module 10 is arranged on
Corresponding close to through hole 23 with casing close to infrared lamp 13 when in casing 20, infrared light compensating lamp 12 is corresponding with casing light filling through hole 24.
Wherein can be from casing close to through hole close to the corresponding light sent close to infrared lamp 13 that refers to of through hole 23 close to infrared lamp 13 and casing
23 pass through, and can launch close to infrared lamp 13 with casing close to 23 face of through hole or close to infrared lamp 13 specifically
Light after light-guide device acts on through casing close to through hole 23.Infrared light compensating lamp 12 is corresponding with casing light filling through hole 24 same
Reason, therefore not to repeat here.In the embodiment illustrated in fig. 6, casing close to through hole 23 and casing light filling through hole 24 can be mutual
Separately, certainly, in other embodiments, casing close to through hole 23 and casing light filling through hole 24 can also interconnect
's.
Module 30a is vibrated to be installed on casing 20.Vibration module 30a may include display screen 90 and cover board 30, show in other words
Display screen 90 combines to form vibration module 30a with cover board 30, with the rigidity of lifting vibration module 30a.Display screen 90 is arranged on casing
Host cavity 91 is formed on 20 and with casing 20, cover board 30 is arranged on casing 20 and is located at the remote host cavity 91 of display screen 90
Side, to protect display screen 90.Since the output module 10 of embodiment of the present invention can take less volume, machine
It is used to set the volume of display screen 90 to correspond to increase in shell 20, to improve the screen accounting of electronic device 100.Specifically,
Display screen 90, output module 10 and piezoelectric element 70 are arranged between top 21 and bottom 22, are filled in user's normal use electronics
In the state of putting 100, top 21 is located at the top of bottom 22, as shown in Figure 1, output module 10 can be arranged on display screen 90 with
Between top 21.In other embodiments, display screen 90 can open up jagged for screen comprehensively, and display screen 90 surrounds output
Module 10, and the notch for exporting module 10 from display screen 90 exposes.
Piezoelectric element 70 is made of ceramics or quartz crystal materials, and piezoelectric element 70 can be single-chip, twin crystal sheet or layer
The piezoelectric element 70 of pressure.Piezoelectric element 70 is combined with vibration module 30a and is spaced with output module 10.Specifically, piezoelectric element
70 are housed in casing vibration through hole 2a and are combined with cover board 30, and are spaced with casing 20, Ke Yishi：Receive 70 part of piezoelectric element
Hold in casing vibration through hole 2a, or piezoelectric element 70 is housed in the logical 2a holes of casing vibration completely.When the two of piezoelectric element 70
When end is applied with electric signal (voltage), due to inverse piezoelectric effect, mechanical deformation, such as expansion or shrinkage occur for piezoelectric element 70,
Thus, the vibration module 30a combined with piezoelectric element 70 is driven to be vibrated according to the frequency of the electric signal.When the body of user is with shaking
When dynamic model group 30a is contacted, the part that osteoacusis sound is contacted by the body of user with vibration module 30a is (for example, external ear is soft
Bone, tooth) it is sent to the auditory nerve of user.In this way, user can realize voice by piezoelectric element 70 and vibration module 30a
The function such as converse, listen to music.In embodiments of the present invention, the processor of electronic device 100 is used to obtain voice signal, and is pressing
The both ends of electric device 70 apply electric signal corresponding with the voice signal.Processor is installed on mainboard 110.
It is appreciated that traditional telephone receiver structure uses air transmitted sound, part acoustic pressure usually exists when receiver works
90dB~100dB or so, in surrounding environment quieter (under the working environment as 50dB or so) even if sound is delivered to week
Enclose 1 meter of scope and also still remain with 50dB~60dB or so, cause the chat script between caller to be perceived by surrounding, cause secret to be let out
Dew.The electronic device 100 of embodiment of the present invention realizes that osteoacusis is transaudient using piezoelectric element 70 and vibration module 30a, converses
Sound be mainly perceived by the user by the osteoacusis vibrated, can effectively ensure that the privacy of dialog context.
Referring to Fig. 5 and Fig. 6, piezoelectric element 70 and display screen 90 are attached on cover board 30 by fastener 30b.
Fastener 30b is with heat curable properties, the adhesive of UV-curing characteristics, double faced adhesive tape, viscose etc..For example, fastener 30b can
To be Photoelasticity resin (the UV curable acrylic adhesive of colorless and transparent).Cover board 30 is combined with piezoelectric element 70
Region and cover board 30 combined with display screen 90 it is interregional every to prevent the display of display screen 90 to be subject to piezoelectric element 70
Interference.Certainly, cover board 30 can also be bonded to casing 20 by fastener 30b, be set directly at compared to cover board 30 on casing 20,
The vibration of vibration module 30a can be prevented to be transmitted directly onto casing 20, to reduce user because the Oscillation Amplitude of casing 20
Excessive and the electronic device 100 that drops possibility.
Cover board 30 can be printing opacity, and the material of cover board 30 can be glass, resin, plastics of printing opacity etc..Cover board 30 is set
Put on casing 20, cover board 30 includes the inner surface 32 combined with casing 20, and the outer surface 31 opposite with inner surface 32, defeated
Go out after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 6
In, cover board 30 covers casing light filling through hole 24 and casing close to through hole 23, and infrared transmission is coated with the inner surface 32 of cover board 30
Ink 40, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and have to visible ray
Higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device 100
On by the infrared region covered through ink 40.Specifically, it is infrared through ink 40 can cover on inner surface 32 not with display
Shield 90 corresponding regions.
It is infrared to block casing close to through hole 23, casing light filling through hole 24 and casing vibration through hole through ink 40
It is at least one in 2a, i.e. infrared to cover casing at the same time close to through hole 23, casing light filling through hole 24 and machine through ink 40
Shell vibration through hole 2a (as shown in Figure 6), user are difficult to logical close to the vibration of through hole 23, casing light filling through hole 24 and casing by casing
Hole 2a sees the internal structure of electronic device 100, and the shape of electronic device 100 is more beautiful；It is infrared to be hidden through ink 40
Lid casing does not cover casing light filling through hole 24 and casing vibration through hole 2a close to through hole 23；Infrared transmission ink 40 can also
Casing light filling through hole 24 is covered, and does not cover casing close to through hole 23 and casing vibration through hole 2a；It is infrared also through ink 40
To cover casing vibration through hole 2a, and casing is not covered close to through hole 23 and casing light filling through hole 24；It is infrared to pass through ink 40
Casing can be covered close to through hole 23 and casing light filling through hole 24, and do not cover casing vibration through hole 2a；It is infrared to pass through ink 40
Casing light filling through hole 24 and casing vibration through hole 2a can also be covered, and does not cover casing close to through hole 23；It is infrared to pass through ink
40 can also cover casing close to through hole 23 and casing vibration through hole 2a, and not cover casing light filling through hole 24.
Referring to Fig. 7, receiving module 50 is integrated with proximity sensor 51 and optical flame detector 52, proximity sensor 51 and optical flame detector
52 are collectively forming single package body structure.The infrared light sent out close to infrared lamp 13, after being reflected by external object, is passed by close
Sensor 51 receives, and proximity sensor 51 judges external object and electronic device according to the intensity of the infrared light reflected received
The distance between 100.Optical flame detector 52 receives the visible ray in ambient light, and detects the intensity of visible ray, to be shown as control
The foundation of the display brightness of screen 90.Proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce the two individually
Gap during assembling, saves the installation space in electronic device 100.
Please refer to Fig.1 and Fig. 7, imaging modules 60 can be visible image capturing first 61 and one in infrared pick-up first 62
Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is installed on microscope base 63, and image passes
Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it
Between.In the embodiment as shown in figure 7, receiving module 50 is arranged on mounting surface 631, and specifically, receiving module 50 is being installed
Plane orthographic projection where face 631 is at least partly dropped on mounting surface 631, in this way, receiving module 50 is set with imaging modules 60
Put compacter, the horizontal space that the two takes jointly is smaller.
Referring to Fig. 1, structured light projector 80 is used for outside emitting structural light, on project structured light to testee after quilt
Reflection, the structure light reflected can be received by infrared pick-up first 62, and the processor of electronic device 100 is further analyzed by infrared
The structure light that light video camera head 62 receives, to obtain the depth information of testee.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, defeated
Go out that module 10, infrared pick-up are first 62, visible image capturing is first 61, the center of piezoelectric element 70 and structured light projector 80 is positioned at same
On one line segment.Specifically, output module 10, structured light projector 80, piezoelectric element are followed successively by from one end of line segment to the other end
70th, infrared pick-up is first 62, visible image capturing first 61 (as shown in Figure 8)；Or it is followed successively by from one end of line segment to the other end defeated
Go out that module 10, infrared pick-up first 62, piezoelectric element 70, visible image capturing be first 61, structured light projector 80 (as shown in Figure 1)；
Or infrared pick-up first 62, output module 10, piezoelectric element 70, visible image capturing are followed successively by from one end of line segment to the other end
First 61, structured light projector 80；Or it is followed successively by that infrared pick-up is first 62, visible image capturing head from one end of line segment to the other end
61st, piezoelectric element 70, output module 10, structured light projector 80.Certainly, export that module 10, infrared pick-up be first 62, piezoelectricity member
Part 70, visible image capturing are first 61, the arrangement mode of structured light projector 80 is not limited to above-mentioned citing, can also have other, example
The center of such as each electronic component arranges in the arc-shaped, center and arranges rectangular shape.
Referring to Fig. 9, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62.Export module 10, red
The center of outer light video camera head 62, visible image capturing first 61 and structured light projector 80 is located on same line segment, piezoelectric element 70
Between line segment and the top 21 of casing 20.Specifically, output module 10, structure light are followed successively by from one end of line segment to the other end
The projector 80, infrared pick-up are first 62, visible image capturing first 61；Or output module is followed successively by from one end of line segment to the other end
10th, infrared pick-up is first 62, visible image capturing is first 61, structured light projector 80 (as shown in Figure 9)；Or from one end of line segment to
The other end is followed successively by that infrared pick-up first 62, output module 10, visible image capturing be first 61, structured light projector 80；Or from line
One end of section is followed successively by that infrared pick-up is first 62, visible image capturing is first 61, exports module 10, structured light projector to the other end
80.Certainly, export that module 10, infrared pick-up are first 62, visible image capturing is first 61, the arrangement mode of structured light projector 80 is unlimited
In above-mentioned citing.In embodiments of the present invention, the center of piezoelectric element 70 has been saved each on cover board 30 not on the line segment
The horizontal stroke that electronic component (output module 10, infrared pick-up is first 62, visible image capturing is first 61, structured light projector 80 etc.) takes
To space.
Further, incorporated by reference to Fig. 7, receiving module 50 can be arranged on the mounting surface 631 of infrared pick-up first 62,
It can be arranged on the mounting surface 631 of visible image capturing first 61, certainly, receiving module 50 can not also be arranged on mounting surface 631
On, receiving module 50 can be disposed adjacent with output module 10, and proximity sensor 51 is readily received by being sent out close to infrared lamp 13
Penetrate, and the infrared light being reflected back by external object；Receiving module 50 can also be disposed adjacent with piezoelectric element 70, not limited herein
System.
To sum up, in the electronic device 100 of embodiment of the present invention, output module 10 by infrared light compensating lamp 12 with close to infrared
Lamp 13 is integrated into a single package body structure, has gathered transmitting infrared light with the function of infrared distance measurement and infrared light filling, therefore, defeated
It is higher to go out the integrated level of module 10, small volume, output module 10 has saved the function of realizing infrared light filling and infrared distance measurement
Space.Further, since infrared light compensating lamp 12 and it is carried on close to infrared lamp 13 on same package substrate 111, compared to tradition
The infrared light compensating lamp 12 of technique manufactures recombinants from needing to be respectively adopted different wafers close to infrared lamp 13 and is sealed to PCB substrate
Dress, improves packaging efficiency.Further more, electronic device 100 realizes that osteoacusis is transaudient using piezoelectric element 70 and vibration module 30a,
It instead of traditional telephone receiver structure by air transmitted sound, on the one hand, can effectively ensure that the privacy of dialog context；It is another
Aspect, due to eliminating the receiver of script, avoids and through hole corresponding with receiver is opened up on cover board 30, simpler in technique
It is single, it is also more aesthetically pleasing in appearance, and can prevent dust or moisture from entering in electronic device 100.
Fig. 6 and Figure 10 are referred to, in some embodiments, imaging modules 60 include visible image capturing first 61 and infrared light
Camera 62.Casing 20 offers spaced casing and vibrates through hole close to through hole 23, casing light filling through hole 24 and casing
2a.Corresponding close to through hole 23 with casing close to infrared lamp 13, infrared light compensating lamp 12 is corresponding with casing light filling through hole 24.Piezoelectric element
70 quantity is multiple, and the quantity of casing vibration through hole 2a is multiple, multiple piezoelectric elements 70 and multiple casings vibration through hole 2a
Corresponding, each piezoelectric element 70 is housed in corresponding casing vibration through hole 2a.Export module 10, infrared pick-up it is first 62, can
See that the center of light video camera head 61, multiple piezoelectric elements 70 and structured light projector 80 is located on same line segment, two neighboring piezoelectricity
It is provided between element 70 in output module 10, infrared pick-up first 62, visible image capturing first 61 and structured light projector 80
It is at least one.For example, the quantity of piezoelectric element 70 is two, piezoelectric element 70, defeated is followed successively by from one end of line segment to the other end
Go out that module 10, structured light projector 80, infrared pick-up are first 62, visible image capturing is first 61, piezoelectric element 70 (as shown in Figure 10)；
Or it is followed successively by that piezoelectric element 70, output module 10, infrared pick-up be first 62, visible image capturing from one end of line segment to the other end
First 61, piezoelectric element 70, structured light projector 80 etc..In another example the quantity of piezoelectric element 70 be three, from one end of line segment to
The other end be followed successively by piezoelectric element 70, output module 10, structured light projector 80, piezoelectric element 70, infrared pick-up it is first 62, can
See light video camera head 61, piezoelectric element 70 (as shown in figure 11)；Or be followed successively by from one end of line segment to the other end piezoelectric element 70,
Export that module 10, piezoelectric element 70, infrared pick-up are first 62, visible image capturing is first 61, piezoelectric element 70, structured light projector 80
Deng.Certainly, the quantity of piezoelectric element 70 and piezoelectric element 70, output module 10, infrared pick-up be first 62, visible image capturing head
61st, the arrangement mode of structured light projector 80 is not limited to above-mentioned citing.In embodiments of the present invention, multiple piezoelectric elements 70 with
Cover board 30 combines, and is in particular that multiple piezoelectric elements 70 are attached on cover board 30 by fastener 30b respectively.Electronic device 100
Processor be used to obtain voice signal, and apply electricity corresponding with the voice signal at the both ends of multiple piezoelectric elements 70 at the same time
Mechanical deformation occurs for signal, multiple piezoelectric elements 70, and thus, multiple piezoelectric elements 70 are multiple and different from being combined with cover board 30
Position drives vibration module 30a to be vibrated according to the frequency of the electric signal.When the body of user is contacted with vibration module 30a, bone
Conduction sound is sent to user's by the body of user with the vibration module 30a parts (for example, the cartilage of external ear, tooth) contacted
Auditory nerve.
In embodiments of the present invention, multiple piezoelectric elements 70 drive from the multiple and different positions combined with cover board 30 at the same time
Vibrate module 30a vibration, the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and stably conducts
To the auditory nerve of user.
Fig. 6, Figure 12 and Figure 13 are referred to, in some embodiments, imaging modules 60 include first 61 He of visible image capturing
Infrared pick-up first 62.Casing 20 offers spaced casing and is vibrated close to through hole 23, casing light filling through hole 24 and casing
Through hole 2a.Corresponding close to through hole 23 with casing close to infrared lamp 13, infrared light compensating lamp 12 is corresponding with casing light filling through hole 24.Piezoelectricity
Element 70 includes piezoelectric body 71 and the piezoelectricity convex block 72 stretched out from piezoelectric body 71, and the quantity of piezoelectricity convex block 72 is multiple, machine
The quantity of shell vibration through hole 2a is multiple, and multiple piezoelectricity convex blocks 72 are corresponding with multiple casings vibration through hole 2a, each piezoelectricity convex block
72 partial receipts are combined in corresponding casing vibration through hole 2a and with cover board 30.Export module 10, infrared pick-up it is first 62, can
See light video camera head 61 and structured light projector 80 between cover board 30 and piezoelectric body 71.Export module 10, infrared pick-up
First 62, visible image capturing is first 61, the center of multiple piezoelectricity convex blocks 72 and structured light projector 80 is located on same line segment, and adjacent two
Output module 10, infrared pick-up first 62, visible image capturing first 61 and structured light projector are provided between a piezoelectricity convex block 72
It is at least one in 80.For example, the quantity of piezoelectricity convex block 72 is two, piezoelectricity convex block is followed successively by from one end of line segment to the other end
72nd, export that module 10, structured light projector 80, infrared pick-up are first 62, visible image capturing is first 61, piezoelectricity convex block 72；Or from
One end of line segment to the other end be followed successively by piezoelectricity convex block 72, output module 10, infrared pick-up are first 62, visible image capturing is first 61,
Piezoelectricity convex block 72, structured light projector 80 etc..In another example the quantity of piezoelectricity convex block 72 is three, from one end of line segment to another
End is followed successively by that piezoelectricity convex block 72, output module 10, structured light projector 80, piezoelectricity convex block 72, infrared pick-up be first 62, visible ray
Camera 61, piezoelectricity convex block 72；Or piezoelectricity convex block 72, output module 10, piezoelectricity are followed successively by from one end of line segment to the other end
Convex block 72, infrared pick-up are first 62, visible image capturing is first 61, piezoelectricity convex block 72, structured light projector 80 etc..For another example piezoelectricity
The quantity of convex block 72 is five, and piezoelectricity convex block 72, output module 10, piezoelectricity convex block are followed successively by from one end of line segment to the other end
72nd, structured light projector 80, piezoelectricity convex block 72, infrared pick-up be first 62, piezoelectricity convex block 72, visible image capturing are first 61, piezoelectricity is convex
Block 72 (as shown in figure 13).Certainly, the quantity of piezoelectricity convex block 72 and piezoelectricity convex block 72, output module 10, infrared pick-up head
62nd, visible image capturing is first 61, the arrangement mode of structured light projector 80 is not limited to above-mentioned citing.In embodiments of the present invention,
Multiple piezoelectricity convex blocks 72 are combined with cover board 30, and more specifically multiple piezoelectricity convex blocks 72 are attached to lid by fastener 30b respectively
On plate 30.The processor of electronic device 100 is used to obtain voice signal, and piezoelectric element 70 is applied corresponding with the voice signal
Electric signal, mechanical deformation, thus, multiple piezoelectricity occur for piezoelectric element 70 including piezoelectric body 71 and piezoelectricity convex block 72
Convex block 72 drives vibration module 30a to be vibrated according to the frequency of the electric signal from the multiple and different positions combined with cover board 30.When with
When the body at family is contacted with vibration module 30a, part (example that osteoacusis sound is contacted by the body of user with vibrating module 30a
Such as, the cartilage of external ear, tooth) it is sent to the auditory nerve of user.
In as shown for example in fig.13, casing 20 offers spaced casing vibration through hole 2a, output through hole
25th, structure light through hole 26, infrared light through hole 27, visible ray through hole 28.Casing vibration through hole 2a is corresponding with piezoelectricity convex block 72, output
Through hole 25 is corresponding with output module 10, and structure light through hole 26 is corresponding with structured light projector 80, infrared light through hole 27 and infrared light
Camera 62 corresponds to, it is seen that light through hole 28 is corresponding with visible image capturing first 61.Wherein, through hole 25 is exported alternatively into above-mentioned mutual
The casing at interval close to through hole 23 and casing light filling through hole 24, or output through hole 25 by said machine casing close to through hole 23 and casing
The connection of light filling through hole 24 is formed.In addition, the structured light projector 80 that refers to corresponding with structured light projector 80 of structure light through hole 26 is sent
Structure light can be passed through from structure light through hole 26, infrared light through hole 27 is corresponding with infrared pick-up first 62 to refer to infrared pick-up first 62
The infrared light that is reflected by the object can be received from infrared light through hole 27, it is seen that light through hole 28 is corresponding with visible image capturing first 61 refer to it is visible
Light video camera head 61 can receive the visible ray being reflected by the object from visible ray through hole 28.
In embodiments of the present invention, multiple piezoelectricity convex blocks 72 drive vibration from the multiple and different positions combined with cover board 30
Module 30a vibrates, and the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and stably conducts to use
The auditory nerve at family；In addition, multiple piezoelectricity convex blocks 72 are stretched out from same piezoelectric body 71, easy to multiple piezoelectricity convex blocks 72 at the same time
Apply electric signal, to be vibrated from multiple and different position synchronous drives vibration module 30a；Further more, output module 10, infrared pick-up
First 62, visible image capturing first 61 and structured light projector 80 are between cover board 30 and piezoelectric body 71, and intert and be provided with pressure
Electric convex block 72,100 overall volume of electronic device is smaller, saves space.
Referring to Fig. 3, in some embodiments, output module 10 further includes light-supplementing lamp lens 18 and close to lamp lens
19.Light-supplementing lamp lens 18 are arranged in encapsulating housing 11 and corresponding with infrared light compensating lamp 12.Encapsulation is arranged on close to lamp lens 19
It is in housing 11 and corresponding with close to infrared lamp 13.The infrared light that infrared light compensating lamp 12 is launched converges under the action of light-supplementing lamp lens 18
Gather and projected in light filling window 1131, reduce the light quantity in other regions for being transmitted to package wall 112 and encapsulation top 113.Together
Reason, the infrared light launched close to infrared lamp 13 are projected being converged to close under the action of lamp lens 19 close in window 1132, subtracted
The light quantity in other regions at package wall 112 and encapsulation top 113 is transmitted to less.Specifically, light-supplementing lamp lens 18 with close to lamp
Lens 19 can be located at same transparent base on, more specifically, light-supplementing lamp lens 18 with can be transparent with this close to lamp lens 19
Matrix is integrally formed obtained.Certainly, output module 10 can also be provided only with light-supplementing lamp lens 18 and close in lamp lens 19
One, light-supplementing lamp lens 18 can not also be set and close to lamp lens 19.
Referring to Fig. 3, in some embodiments, output module 10 further includes metal shutter 1a, metal shutter 1a
In encapsulating housing 11, and metal shutter 1a is located at infrared light compensating lamp 12 and close between infrared lamp 13.Metal shutter
1a is located at infrared light compensating lamp 12 and close between infrared lamp 13, metal shutter 1a on the one hand can shield infrared light compensating lamp 12 with
The electromagnetic interference mutual close to infrared lamp 13, infrared light compensating lamp 12 will not with the luminous intensity and sequential close to infrared lamp 13
Interact, another aspect metal shutter 1a can be used for completely cutting off 12 place cavity of infrared light compensating lamp with close to the institute of infrared lamp 13
Cavity, light will not enter another cavity from a cavity.
4 are please referred to Fig.1, in some embodiments, output module 10 further includes optics sealing cover 1b.Optics sealing cover 1b is by saturating
Luminescent material is made, and optics sealing cover 1b is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1b wraps red
Outer light compensating lamp 12 and close to infrared lamp 13.Specifically, optics sealing cover 1b can be formed by encapsulating injection molding and forming technology, optics envelope
Cover 1b can be made of transparent thermosetting epoxy resin, and to be not easy to soften in use, optics sealing cover 1b can fix red
Outer light compensating lamp 12 and close to the relative position between infrared lamp 13, and cause infrared light compensating lamp 12 with being encapsulated close to infrared lamp 13
It is not easy to rock in housing 11.
In addition, please referring to Fig.1 4, output module 10 further includes out light clapboard 1c, goes out light clapboard 1c and is formed in optics sealing cover 1b
It is interior and positioned at infrared light compensating lamp 12 and close between infrared lamp 13.Go out light clapboard 1c to can be used for interval infrared light compensating lamp 12 and approach
Infrared lamp 13, the light that infrared light compensating lamp 12 is sent will not be pierced by from close to window 1132, the light sent close to infrared lamp 13
Line will not be pierced by from light filling window 1131.
5 are please referred to Fig.1, in some embodiments, proximity sensor 51 can be not integrated in reception mould with optical flame detector 52
In group 50, in other words, proximity sensor 51 is separately set with optical flame detector 52.At this time, proximity sensor 51 can be arranged on microscope base
On 63 mounting surface 631；Optical flame detector 52 can also be arranged on the mounting surface 631 of microscope base 63；Or proximity sensor 51 and light
Sensor 52 is arranged on the mounting surface 631 of microscope base 63 at the same time.Microscope base 63 can be the microscope base 63 of infrared pick-up first 62, can also
It is the microscope base 63 of visible image capturing first 61.
6 are please referred to Fig.1, cover board light filling through hole 34 can also be offered in some embodiments, on cover board 30, cover board is mended
Light through hole 34 is corresponding with casing light filling through hole 24, and the infrared light that infrared light compensating lamp 12 is launched can be with after passing through casing light filling through hole 24
Electronic device 100 is pierced by from cover board light filling through hole 34.At this time, can be with close to 23 corresponding position of through hole with casing on cover board 30
Infrared transmission ink 40 is set, and user is difficult to the close infrared of the inside for seeing electronic device 100 close to through hole 23 by casing
Lamp 13, the shape of electronic device 100 are more beautiful.
7 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to through hole 33, cover board approaches
Through hole 33 is corresponding close to through hole 23 with casing, can be from close to after through hole 23 through casing close to the infrared light that infrared lamp 13 is launched
Cover board is pierced by electronic device 100 close in through hole 33.At this time, can be set with 24 corresponding position of casing light filling through hole on cover board 30
Infrared transmission ink 40 is put, user is difficult to the infrared light compensating lamp that the inside of electronic device 100 is seen by casing light filling through hole 24
12, the shape of electronic device 100 is more beautiful.
8 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on
On substrate 66, receiving module 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, one of substrate 66
Divide in microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and is used to carry image sensing
Device 65, the other end can be connected with the mainboard 110 of electronic device 100.When receiving module 50 is arranged on substrate 66, receiving module
50 are arranged on outside microscope base 63, and receiving module 50 can also be connected with FPC.
Further, being arranged on the receiving module 50 of substrate 66 includes proximity sensor 51 and optical flame detector 52, close to sensing
Device 51 is collectively forming single package body structure with optical flame detector 52, reduces gap when the two is individually assembled, saves in electronic device 100
Installation space.In other embodiments, being arranged on the receiving module 50 of substrate 66 includes proximity sensor 51 or/and light sensation
Device 52, proximity sensor 51 and optical flame detector 52 are respectively single package body structure.That is, the receiving module 50 for being arranged on substrate 66 is single
The proximity sensor 51 of package body structure；Alternatively, the receiving module 50 for being arranged on substrate 66 is the optical flame detector of single package body structure
52；Alternatively, the receiving module 50 for being arranged on substrate 66 is the proximity sensor 51 of single package body structure and single package body structure
Optical flame detector 52.
Imaging modules 60 can be visible image capturing first 61 and one or two in infrared pick-up first 62.Specifically,
Receiving module 50 can be fixed on the substrate 66 of visible image capturing first 61；Receiving module 50 can be fixed on infrared pick-up head
On 62 substrate 66.When proximity sensor 51 and optical flame detector 52 encapsulate for split, proximity sensor 51 can be fixed on visible
On the substrate 66 of light video camera head 61, optical flame detector 52 can be fixed on the substrate 66 of infrared pick-up first 62；Alternatively, optical flame detector 52
It can be fixed on the substrate 66 of visible image capturing first 61, proximity sensor 51 can be fixed on the substrate of infrared pick-up first 62
On 66；Alternatively, proximity sensor 51 is each attached on the substrate 66 of visible image capturing first 61 with optical flame detector 52；Alternatively, close pass
Sensor 51 is each attached on the substrate 66 of infrared pick-up first 62 with optical flame detector 52.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with receiving module 50, with increase
The integral strength of substrate 66 so that FPC is not susceptible to around folding, while receiving module 50 (or proximity sensor 51 or optical flame detector 52)
It is not susceptible to rock when being arranged on substrate 66.In one example, receiving module 50 (or proximity sensor 51 or optical flame detector
52) it may be also secured on the lateral wall of microscope base 63, such as be fixed on by cohesive mode on the lateral wall of microscope base 63.
9 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67
Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- 672 and the 3rd sub- top surface 673 of top surface, the second son top
672 and first sub- top surface 671 of face tilts connection and forms notch 675, the 3rd sub- top surface 673 and second with the first sub- top surface 671
Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- 671 and the 3rd sub- top surface 673 of top surface to connect first
Sub- 671 and the 3rd sub- top surface 673 of top surface.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight
Angle, the angle between the second sub- 672 and the 3rd sub- top surface 673 of top surface can be obtuse angle or right angle.Notch 675 is opened in camera shell
On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.3rd sub- top surface 673 offers out
Light through hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through hole 674.Imaging sensor 65 is housed in
In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through hole 674 and camera lens mould
Group 68 is simultaneously delivered on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Receiving module 50 is arranged on
At first sub- top surface 671, receiving module 50 includes proximity sensor 51 and optical flame detector 52.In present embodiment, imaging modules 60
Can be visible image capturing first 61, receiving module 50 is single packaging body knot that proximity sensor 51 is collectively forming with optical flame detector 52
Structure.Proximity sensor 51 can be consistent with the extending direction of notch 675 (such as Figure 19 institutes with the center line connecting direction of optical flame detector 52
Show)；Alternatively, proximity sensor 51 can be vertical with the extending direction of notch 675 with the center line connecting direction of optical flame detector 52 or be in
The two angle formed is acute angle or obtuse angle.In other embodiments, imaging modules 60 can be infrared pick-up first 62.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the first sub- top surface
On 671, receiving module 50 is set to set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, saves
Installation space in electronic device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce
Gap when the two is individually assembled, saves the installation space in electronic device 100.
Please continue to refer to Figure 19, in some embodiments, the receiving module 50 of the above embodiment is arranged on the first son
On top surface 671 and positioned at the outside of camera case 67, specifically, whole receiving module 50 is along perpendicular to the first sub- top surface 671
Projection can be located in the first sub- top surface 671 (as shown in figure 19)；Alternatively, part receiving module 50 is pushed up along perpendicular to the first son
The projection in face 671 is located in the first sub- top surface 671.That is, receiving module 50 is at least part of to be located at the first sub- top surface
671 surface, in this way, receiving module 50 sets compacter with imaging modules 60, the two horizontal space taken jointly compared with
It is small, further save the installation space in electronic device 100.In other embodiments, receiving module 50 is included close to biography
Sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two single single package body structures, at this time, are respectively
The proximity sensor 51 and optical flame detector 52 of single package body structure can also be all disposed within the first sub- top surface 671.
Figure 20 is referred to, in some embodiments, the receiving module 50 of the above embodiment only includes proximity sensor
51, not comprising optical flame detector 52, at this time, proximity sensor 51 (or receiving module 50) is respectively monomer encapsulation with optical flame detector 52 and ties
Structure, proximity sensor 51 are arranged on the first sub- top surface 671, and optical flame detector 52 is arranged on any other except the first sub- top surface 671
Position.
Please continue to refer to Figure 20, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector
52, and do not include proximity sensor 51, at this time, optical flame detector 52 (or receiving module 50) is respectively monomer envelope with proximity sensor 51
Assembling structure, optical flame detector 52 are arranged on the first sub- top surface 671, proximity sensor 51 be arranged on except the first sub- top surface 671 other
Optional position.
Figure 21 is referred to, the first sub- top surface 671 of the above embodiment offers loophole 676, and receiving module 50 is located at
It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without light sensation
Device 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100
The light in portion can pass through loophole 676 and be delivered on proximity sensor 51.The receiving module 50 of present embodiment is arranged on
In camera case 67, receiving module 50 and the structure of camera case 67 is set more to stablize and be easy to receiving module 50 and imaging mould
Group 60 is installed on casing 20.
Please continue to refer to Figure 21, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50
It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without connecing
Nearly sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electricity
Light outside sub-device 100 can pass through loophole 676 and be delivered on optical flame detector 52.The receiving module 50 of present embodiment
Be arranged in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and easy to by receiving module 50 with
Imaging modules 60 are installed on casing 20.
Figure 22 is referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 be integrated with it is close
When sensor 51 is with optical flame detector 52, loophole 676 can be one and proximity sensor 51 and the corresponding printing opacity of optical flame detector 52
Hole or two it is spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, outside electronic device 100
On the proximity sensor 51 and optical flame detector 52 that light can pass through loophole 676 and be delivered in receiving module 50.In other realities
Apply in mode, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two
Individually list package body structure, at this time, the proximity sensor 51 and optical flame detector 52 for being respectively single package body structure can also all be set
Put in camera case 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, is made
Receiving module 50 and the structure of camera case 67 are more stablized and easy to which receiving module 50 and imaging modules 60 are installed to casing
On 20.
Figure 22 is referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes
Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground, FPC is provided with substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connected with the mainboard 110 with electronic device 100.In other embodiments, receiving module 50 can also be connected with FPC.This reality
Apply in mode, being arranged on receiving module 50 on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 with
Optical flame detector 52 is collectively forming single package body structure, reduces gap when the two is individually assembled, saves the installation in electronic device 100
Space.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception
In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 also encapsulates for monomer
Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at
In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at
Outside camera case 67.
In yet another embodiment, optical flame detector 52 is only included in receiving module 50, proximity sensor 51, which is not integrated into, to be connect
Receive in module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 also seals for monomer
Assembling structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when one of substrate 66
Divide in camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate
On 66 and outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67
Structure is more stablized and easy to which receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base
Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, receiving module 50 is firmly mounted in camera case 67.
Figure 23 is referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 take the photograph module, including two imaging sensors 65, camera case 67 and two camera lens moulds to be double
Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677
678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 677 shape of the first tread
Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a positioned at the first tread 677 with
With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677
Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle.
Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two
A light extraction through hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through holes 674
Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions
Through hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68,
Light outside electronic device 100 can pass through light extraction through hole 674 and camera lens module 68 and be delivered on imaging sensor 65.This reality
Apply in mode, imaging modules 60 can be visible image capturing first 61, and two camera lens modules 68 are visible image capturing first 61 at this time
Corresponding camera lens module.Receiving module 50 is arranged on the second tread 678 and outside camera case 67.Receiving module 50 is to connect
Single package body structure that nearly sensor 51 is collectively forming with optical flame detector 52.The line of centres side of proximity sensor 51 and optical flame detector 52
To can be consistent with the extending direction of notch 675；Alternatively, the center line connecting direction of proximity sensor 51 and optical flame detector 52 can be with
The extending direction of notch 675 vertical (as shown in figure 23) or the two angle formed are acute angle or obtuse angle.In other embodiment
In, imaging modules 60 can be infrared pick-up first 62, and two camera lens modules 68 are that infrared pick-up first 62 is corresponding at this time
Camera lens module.In yet another embodiment, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, at this time its
In a camera lens module 68 be first 62 corresponding camera lens module of infrared pick-up, another camera lens module 68 is visible image capturing head
61 corresponding camera lens modules.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the second tread 678
On, receiving module 50 is set compacter with imaging modules 60, the horizontal space that the two takes jointly is smaller, has saved electronics
Installation space in device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce the two
Individually gap during assembling, saves the installation space in electronic device 100.
Figure 24 is referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670
On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread
The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through holes 674 are opened in the first son respectively
On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675
Both sides.At this time, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face
679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678,
Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second
Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first
The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment
In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second
Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in
The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating receiving module 50 is arranged on the second tread
On 678.
Figure 23 and Figure 24 is referred to, in some embodiments, the receiving module 50 of the above embodiment is arranged on second
On tread 678 and positioned at the outside of camera case 67.Specifically, it is whole when notch 675 is opened in the marginal position of top surface 670
A receiving module 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, part receives mould
Group 50 is located in the second tread 678 (as shown in figure 23) along the projection perpendicular to the second tread 678.That is, receiving module
The 50 at least part of surfaces for being located at the second tread 678.It is whole when notch 675 is opened on the centre position of top surface 670
A receiving module 50 can be located in the second tread 678 (as shown in figure 24) along perpendicular to the projection of the second tread 678.Such as
This, receiving module 50 sets compacter with imaging modules 60, and the horizontal space that the two takes jointly is smaller, further saves
Installation space in electronic device 100.In other embodiments, receiving module 50 includes proximity sensor 51 and optical flame detector
52, but proximity sensor 51 and optical flame detector 52 are two single single package body structures, at this time, are respectively single package body structure
Proximity sensor 51 and optical flame detector 52 can also be all disposed within the second tread 678.
Figure 24 is referred to, in some embodiments, the receiving module 50 of the above embodiment only includes close to sensing
Device 51, receiving module 50 do not include optical flame detector 52, and at this time, proximity sensor 51 (or receiving module 50) is respectively with optical flame detector 52
Cell packaging configuration, proximity sensor 51 are arranged on the second tread 678, and optical flame detector 52 is arranged on the casing outside imaging modules 60
On 20.
Figure 24 is referred to, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52,
Receiving module 50 does not include proximity sensor 51, and at this time, optical flame detector 52 (or receiving module 50) is respectively with proximity sensor 51
Cell packaging configuration, optical flame detector 52 are arranged on the second tread 678, and proximity sensor 51 is arranged on the casing outside imaging modules 60
On 20.
Figure 25 is referred to, the second tread 678 of the above embodiment offers loophole 676, and receiving module 50 is located at phase
It is in casing body 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without optical flame detector
52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100
Light can pass through and loophole 676 and be delivered on proximity sensor 51.The receiving module 50 of present embodiment is arranged on phase
In casing body 67, the structure of receiving module 50 and camera case 67 is set more to stablize and be easy to receiving module 50 and imaging modules
60 are installed on casing 20.
Please continue to refer to Figure 25, the second tread 678 of the above embodiment offers loophole 676, receiving module 50
It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close
Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics
Light outside device 100 can pass through loophole 676 and be delivered on optical flame detector 52.The receiving module 50 of present embodiment is set
Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and easy to by receiving module 50 with into
As module 60 is installed on casing 20.
Figure 26 is referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676,
Receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 is integrated with close to sensing
When device 51 and optical flame detector 52, loophole 676 can be one with proximity sensor 51 and the corresponding loophole of optical flame detector 52 or
Two spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, the light outside electronic device 100
On the proximity sensor 51 and optical flame detector 52 that loophole 676 can be passed through and be delivered in receiving module 50.In other embodiment party
In formula, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are independent for two
Single package body structure, at this time, the proximity sensor 51 and optical flame detector 52 for being respectively single package body structure can also be all disposed within
It is in camera case 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, makes reception
The structure of module 50 and camera case 67 is more stablized and easy to which receiving module 50 and imaging modules 60 are installed on casing 20.
Please continue to refer to Figure 26, in some embodiments, the second tread 678 of the above embodiment offers loophole
676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes
Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground, FPC is provided with substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connected with the mainboard 110 with electronic device 100.In other embodiments, receiving module 50 can also be connected with FPC.This reality
Apply in mode, being arranged on receiving module 50 on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 with
Optical flame detector 52 is collectively forming single package body structure, reduces gap when the two is individually assembled, saves the installation in electronic device 100
Space.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception
In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 also encapsulates for monomer
Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at
In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at
Outside camera case 67.
In yet another embodiment, receiving module 50 only includes optical flame detector 52, and proximity sensor 51 is not integrated into reception
In module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 also encapsulates for monomer
Structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66
In camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate 66
Go up and be located at outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67
Structure is more stablized and easy to which receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base
Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, receiving module 50 is firmly mounted in camera case 67.
Also referring to Fig. 1, Figure 27 and Figure 28, in some embodiments, the electronic device 100 of the above embodiment is also
Including the mainboard 110 in casing 20.Mainboard 110 is formed with installation gap 110a.Imaging modules 60 are installed on casing 20
It is interior and corresponding with installation gap 110a.Receiving module 50 is incorporated on mainboard 110, and stretches into peace from the edge of installation gap 110a
Fill notch 110a.Along along the depth direction (Z-direction in such as Figure 27) of installation gap 110a, receiving module 50 and imaging modules 60
Partly overlap.
Specifically, mainboard 110 can be printed wiring board, and printed wiring board can be hardboard, soft board or Rigid Flex,
Electronic component, such as output module 10, receiving module 50, imaging modules 60, receiver 70, structured light projector 80 etc.
To be connected with mainboard 110, electronic component can be directly installed on mainboard 110 or be installed on electronic device 100
Other structures on, then be connected with mainboard 110 by circuit.Installation gap 110a is formed on mainboard 110, installation gap 110a
Mainboard 110 can be run through.Imaging modules 60 are in casing 20 and corresponding with installation gap 110a, can be imaging modules 60
Wear installation gap 110a；Can also be incidence hole (in certain embodiments, incidence hole and the above-mentioned light extraction of imaging modules 60
Through hole 674 corresponds to) it is aligned with installation gap 110a, but installation gap 110a is not penetrated.
Receiving module 50 is incorporated on mainboard 110, and specifically, the pin of receiving module 50 can be welded on mainboard 110
On pad, so that receiving module 50 is fixedly connected with mainboard 110.Receiving module 50 stretches into installation from the edge of installation gap 110a
Notch 110a, has saved the installation site on mainboard 110.Along the depth direction (Z-direction in such as Figure 28) of installation gap 110a
On, receiving module 50 partly overlaps with imaging modules 60, and receiving module 50 can be contacted with each other with imaging modules 60, receiving module
50 with imaging modules 60 can also be interval.Receiving module 50 sets compacter with imaging modules 60, the two common occupancy
Horizontal space it is smaller (perpendicular to the direction of Z-direction), saved the space inside electronic device 100.
Certainly, receiving module 50 can be integrated with proximity sensor 51 and optical flame detector 52；Receiving module 50 can also be
Individually include proximity sensor 51；Receiving module 50, which can also be, individually includes optical flame detector 52.On imaging modules 60 can also be
Imaging modules 60 and its deformation of any embodiment are stated, details are not described herein.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (17)
- A kind of 1. electronic device, it is characterised in that including：Casing；Module is exported, the output module is arranged in the casing, and the output module includes encapsulating housing, infrared light filling Lamp and include package substrate close to infrared lamp, the encapsulating housing, the infrared light compensating lamp is encapsulated in described close to infrared lamp In the encapsulating housing and carry on the package substrate, the infrared light compensating lamp with it is described can be with difference close to infrared lamp Power launch infrared light to outside the encapsulating housing；Module is vibrated, the vibration module installation is on the housing；Piezoelectric element, the piezoelectric element are combined with the vibration module and export module interval, the piezoelectric element with described For being deformed upon when being applied in electric signal so that the vibration module vibration；Mainboard, the mainboard are installed in the casing and formed with installation gap；Imaging modules, the imaging modules are installed in the casing and corresponding with the installation gap；WithReceiving module, the receiving module are incorporated on the mainboard, and stretch into the installation from the edge of the installation gap Notch, along the depth direction of the installation gap, the receiving module partly overlaps with the imaging modules, the reception mould Group includes proximity sensor and/or optical flame detector.
- 2. electronic device according to claim 1, it is characterised in that the vibration module includes the lid of display screen and printing opacity Plate, the display screen set on the housing and are collectively forming host cavity with the casing, and the cover board is arranged on the machine The side of the remote host cavity on shell and positioned at the display screen, the display screen are combined with the cover board, the casing Offer spaced casing close to through hole, casing light filling through hole and casing vibrate through hole, it is described close to infrared lamp with it is described Casing is corresponded to close to through hole, and the infrared light compensating lamp is corresponding with the casing light filling through hole, and the piezoelectric element is housed in described Combined in casing vibration through hole and with the cover board.
- 3. electronic device according to claim 2, it is characterised in that the piezoelectric element and the display screen pass through engagement Part is attached on the cover board.
- 4. electronic device according to claim 1, it is characterised in that the output module further includes chip, described infrared Light compensating lamp is formed on a piece of chip with described close to infrared lamp.
- 5. electronic device according to claim 1, it is characterised in that the encapsulating housing further includes package wall and encapsulation Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute Encapsulation top is stated formed with light filling window and close to window, the light filling window is corresponding with the infrared light compensating lamp, described close Window with it is described corresponding close to infrared lamp.
- 6. electronic device according to claim 1, it is characterised in that the output module further includes light-supplementing lamp lens, institute Light-supplementing lamp lens are stated to be arranged in the encapsulating housing and corresponding with the infrared light compensating lamp；And/orThe output module is further included close to lamp lens, described to be arranged in the encapsulating housing close to lamp lens and connect with described Near-infrared lamp corresponds to.
- 7. electronic device according to claim 1, it is characterised in that the output module, which further includes, is arranged on the encapsulation Light-supplementing lamp lens in housing and close to lamp lens, the light-supplementing lamp lens are corresponding with the infrared light compensating lamp, described close to lamp With described corresponding close to infrared lamp, the light-supplementing lamp lens are located on same transparent base lens with described close to lamp lens.
- 8. electronic device according to claim 1, it is characterised in that the output module further includes metal shutter, institute Metal shutter is stated to be located in the encapsulating housing and positioned at the infrared light compensating lamp and described close between infrared lamp.
- 9. electronic device according to claim 1, it is characterised in that the output module is further included to be made of light transmissive material Optics sealing cover, the optics sealing cover formed on the package substrate and in the encapsulating housing, the optics sealing cover Wrap the infrared light compensating lamp and described close to infrared lamp.
- 10. electronic device according to claim 9, it is characterised in that the output module further includes out light clapboard, described Go out light clapboard to be formed in the optics sealing cover and positioned at the infrared light compensating lamp and described close between infrared lamp.
- 11. electronic device according to claim 1, it is characterised in that formed with grounding pin, benefit on the output module Light lamp pin and close to lamp pin, the grounding pin and the light compensating lamp pin be enabled when, infrared light compensating lamp transmitting Infrared light；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared lamp launch infrared light.
- 12. electronic device according to claim 2, it is characterised in that the surface shape that the cover board is combined with the casing Only transmit the infrared of infrared light into having and pass through ink, it is described infrared to block the casing close to through hole, the casing through ink It is at least one in light filling through hole and casing vibration through hole.
- 13. electronic device according to claim 1, it is characterised in that the imaging modules include visible image capturing head and At least one of infrared pick-up head.
- 14. electronic device according to claim 2, it is characterised in that the electronic device further include infrared pick-up head, Visible image capturing head and structured light projector, the output module, the infrared pick-up head, the visible image capturing head, institute The center for stating piezoelectric element and the structured light projector is located on same line segment, from one end of the line segment to the other end successively For：The output module, the structured light projector, the piezoelectric element, the infrared pick-up head, the visible ray are taken the photograph As head；OrThe output module, the infrared pick-up head, the piezoelectric element, the visible image capturing head, the structure light are thrown Emitter；OrThe infrared pick-up head, the output module, the piezoelectric element, the visible image capturing head, the structure light are thrown Emitter；OrThe infrared pick-up head, the visible image capturing head, the piezoelectric element, the output module, the structure light are thrown Emitter.
- 15. electronic device according to claim 2, it is characterised in that the electronic device further include infrared pick-up head, Visible image capturing head, structured light projector, output module, the infrared pick-up head, the visible image capturing head and the institute The center for stating structured light projector is located on same line segment, the piezoelectric element be located at the line segment and the casing top it Between.
- 16. electronic device according to claim 2, it is characterised in that the electronic device further include infrared pick-up head, Visible image capturing head and structured light projector, the quantity of the piezoelectric element is multiple, and the quantity of the casing vibration through hole is Multiple, multiple piezoelectric elements are corresponding with multiple casing vibration through holes, and each piezoelectric element is housed in corresponding In the casing vibration through hole, the output module, the infrared pick-up head, the visible image capturing head, multiple pressures The center of electric device and the structured light projector is located on same line segment, is set between the two neighboring piezoelectric element State at least one in output module, the infrared pick-up head, the visible image capturing head and the structured light projector.
- 17. electronic device according to claim 2, it is characterised in that the electronic device further include infrared pick-up head, Visible image capturing head and structured light projector, the piezoelectric element include piezoelectric body and the pressure stretched out from the piezoelectric body Electric convex block, the quantity of the casing vibration through hole is multiple, multiple piezoelectricity convex blocks and multiple casing vibration through holes pair Should, each piezoelectricity convex portion is housed in the corresponding casing vibration through hole and is combined with the cover board, described defeated Go out module, the infrared pick-up head, the visible image capturing head and the structured light projector be located at the cover board with it is described Between piezoelectric body, the output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectricity convex blocks It is located at the center of the structured light projector on same line segment, the output is provided between the two neighboring piezoelectricity convex block It is at least one in module, the infrared pick-up head, the visible image capturing head and the structured light projector.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711435267.3A CN107918459B (en) | 2017-12-26 | 2017-12-26 | Electronic device |
| PCT/CN2018/118716 WO2019128628A1 (en) | 2017-12-26 | 2018-11-30 | Output module, input and output module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711435267.3A CN107918459B (en) | 2017-12-26 | 2017-12-26 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107918459A true CN107918459A (en) | 2018-04-17 |
| CN107918459B CN107918459B (en) | 2020-09-22 |
Family
ID=61894382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711435267.3A Expired - Fee Related CN107918459B (en) | 2017-12-26 | 2017-12-26 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107918459B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109151112A (en) * | 2018-08-22 | 2019-01-04 | Oppo广东移动通信有限公司 | Flight time component and mobile terminal |
| CN109245823A (en) * | 2018-11-12 | 2019-01-18 | 维沃移动通信（杭州）有限公司 | A kind of flight time TOF mould group and mobile terminal |
| CN109274871A (en) * | 2018-09-27 | 2019-01-25 | 维沃移动通信有限公司 | A kind of image imaging method and device of mobile terminal |
| WO2019128628A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic device |
| TWI717200B (en) * | 2020-01-22 | 2021-01-21 | 群光電子股份有限公司 | Camera and light adjustment module |
| US10924648B2 (en) | 2018-06-02 | 2021-02-16 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Electronic assembly and electronic device |
| US11112680B2 (en) | 2019-05-08 | 2021-09-07 | Chicony Electronics Co., Ltd. | Camera and light adjustment module |
| US11489993B2 (en) | 2018-12-24 | 2022-11-01 | Huawei Technologies Co., Ltd. | Camera assembly and electronic device |
| US11550204B2 (en) | 2019-05-08 | 2023-01-10 | Chicony Electronics Co., Ltd. | Camera and light adjustment module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103515371A (en) * | 2012-06-27 | 2014-01-15 | 格科微电子（上海）有限公司 | Integrated optical sensor package |
| CN204145746U (en) * | 2014-07-29 | 2015-02-04 | 东莞劲胜精密组件股份有限公司 | A kind of electroacoustic sensing device and there is the mobile phone of this device |
| CN104853014A (en) * | 2015-05-29 | 2015-08-19 | 广东欧珀移动通信有限公司 | Elastic sleeve and mobile terminal |
| CN106550228A (en) * | 2015-09-16 | 2017-03-29 | 上海图檬信息科技有限公司 | Obtain the equipment of the depth map of three-dimensional scenic |
-
2017
- 2017-12-26 CN CN201711435267.3A patent/CN107918459B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103515371A (en) * | 2012-06-27 | 2014-01-15 | 格科微电子（上海）有限公司 | Integrated optical sensor package |
| CN204145746U (en) * | 2014-07-29 | 2015-02-04 | 东莞劲胜精密组件股份有限公司 | A kind of electroacoustic sensing device and there is the mobile phone of this device |
| CN104853014A (en) * | 2015-05-29 | 2015-08-19 | 广东欧珀移动通信有限公司 | Elastic sleeve and mobile terminal |
| CN106550228A (en) * | 2015-09-16 | 2017-03-29 | 上海图檬信息科技有限公司 | Obtain the equipment of the depth map of three-dimensional scenic |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019128628A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic device |
| US10924648B2 (en) | 2018-06-02 | 2021-02-16 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Electronic assembly and electronic device |
| CN109151112A (en) * | 2018-08-22 | 2019-01-04 | Oppo广东移动通信有限公司 | Flight time component and mobile terminal |
| CN109274871A (en) * | 2018-09-27 | 2019-01-25 | 维沃移动通信有限公司 | A kind of image imaging method and device of mobile terminal |
| CN109245823A (en) * | 2018-11-12 | 2019-01-18 | 维沃移动通信（杭州）有限公司 | A kind of flight time TOF mould group and mobile terminal |
| CN109245823B (en) * | 2018-11-12 | 2020-08-18 | 维沃移动通信（杭州）有限公司 | Time of flight TOF module and mobile terminal |
| US11489993B2 (en) | 2018-12-24 | 2022-11-01 | Huawei Technologies Co., Ltd. | Camera assembly and electronic device |
| US11112680B2 (en) | 2019-05-08 | 2021-09-07 | Chicony Electronics Co., Ltd. | Camera and light adjustment module |
| US11550204B2 (en) | 2019-05-08 | 2023-01-10 | Chicony Electronics Co., Ltd. | Camera and light adjustment module |
| TWI717200B (en) * | 2020-01-22 | 2021-01-21 | 群光電子股份有限公司 | Camera and light adjustment module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107918459B (en) | 2020-09-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107918459A (en) | Electronic device | |
| CN108012004A (en) | Electronic device | |
| CN108063148A (en) | Electronic device | |
| CN108040148A (en) | Input and output module and electronic device | |
| CN107968865A (en) | Export module and electronic device | |
| CN107968910A (en) | Electronic device | |
| CN108173992A (en) | Electronic device | |
| CN108183987A (en) | Electronic device | |
| CN108156287A (en) | Electronic device | |
| CN108055370A (en) | Electronic device | |
| CN108063150A (en) | Electronic device | |
| CN107968864A (en) | Export module and electronic device | |
| CN108183991A (en) | Electronic device | |
| CN108183990A (en) | Electronic device | |
| CN108183984A (en) | Input and output module and electronic device | |
| CN107968863A (en) | Input and output module and electronic device | |
| CN108200239A (en) | Electronic device | |
| CN108023985A (en) | Electronic device | |
| CN108200237A (en) | Electronic device | |
| CN107968860A (en) | Export module and electronic device | |
| CN108183992A (en) | Electronic device | |
| CN108156285A (en) | Electronic device | |
| CN108200234A (en) | Electronic device | |
| CN108156283A (en) | Electronic device | |
| CN107995339A (en) | Export module and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200922 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |