CN108173992A - Electronic device - Google Patents

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Publication number
CN108173992A
CN108173992A CN201711437415.5A CN201711437415A CN108173992A CN 108173992 A CN108173992 A CN 108173992A CN 201711437415 A CN201711437415 A CN 201711437415A CN 108173992 A CN108173992 A CN 108173992A
Authority
CN
China
Prior art keywords
infrared
infrared light
light supply
head
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201711437415.5A
Other languages
Chinese (zh)
Other versions
CN108173992B (en
Inventor
吴安平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201711437415.5A priority Critical patent/CN108173992B/en
Publication of CN108173992A publication Critical patent/CN108173992A/en
Priority to PCT/CN2018/117920 priority patent/WO2019128605A1/en
Application granted granted Critical
Publication of CN108173992B publication Critical patent/CN108173992B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70—Circuitry for compensating brightness variation in the scene
    • H04N23/74—Circuitry for compensating brightness variation in the scene by influencing the scene brightness using illuminating means

Abstract

Electronic device disclosed by the invention includes casing, output module, vibration module and piezoelectric element.It exports module and includes encapsulating housing, the first infrared light supply and the second infrared light supply around the setting of the first infrared light supply.Encapsulating housing includes package substrate, and the first infrared light supply and the second infrared light supply are encapsulated in encapsulating housing and are carried on package substrate.When the second infrared light supply is closed, and the first infrared light supply emit outside encapsulating housing infrared light with the first power, output module is as close to infrared lamp；When the first infrared light supply and the second infrared light supply are opened and emit infrared light outside encapsulating housing with the second power, output module is used as infrared light compensating lamp.Module is vibrated to be mounted on casing.Piezoelectric element is combined with vibration module and with exporting module interval, and piezoelectric element vibrates for being deformed upon when being applied in electric signal so as to vibrate module.Electronic device realizes that osteoacusis is transaudient using piezoelectric element and vibration module, and the privacy of dialog context has been effectively ensured.

Description

Electronic device
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of function element set It is more and more, in order to realize the functions such as the facial 3D feature recognitions of distance detection, environment light detection and user, need to set in electronics The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth Numerous function elements is put, the excessive space of mobile phone can be occupied.
Invention content
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Module is exported, the output module is arranged in the casing, and the output module includes encapsulating housing, first red Outer light source and the second infrared light supply around first infrared light supply setting, the encapsulating housing includes package substrate, described First infrared light supply is encapsulated in the encapsulating housing with second infrared light supply and carries on the package substrate, works as institute The closing of the second infrared light supply is stated, when first infrared light supply emits outside the encapsulating housing infrared light with the first power, The output module is used as close to infrared lamp；When first infrared light supply and second infrared light supply are opened and with second When power emits infrared light outside the encapsulating housing, the output module is used as infrared light compensating lamp；
Module is vibrated, the vibration module installation is on the housing；With
Piezoelectric element, the piezoelectric element are combined with the vibration module and export module interval, the piezoelectricity with described Element is used to deform upon when being applied in electric signal so that the vibration module vibration.
In some embodiments, the vibration module includes display screen and the cover board of light transmission, the display screen are arranged on Host cavity is collectively formed on the casing and with the casing, the cover board setting is on the housing and positioned at the display screen The side far from the host cavity, the display screen combined with the cover board, and the casing offers spaced casing Infrared through-hole and casing vibration through-hole, first infrared light supply and second infrared light supply and the infrared through-hole pair of the casing Should, the piezoelectric element is housed in the casing vibration through-hole and is combined with the cover board.
In some embodiments, the piezoelectric element and the display screen are attached to by fastener on the cover board.
In some embodiments, first infrared light supply is point light source, second infrared light supply for point light source and Quantity is multiple；Or
First infrared light supply is point light source, and second infrared light supply is annular light source；Or
For first infrared light supply to be multiple around the point light source circularized, second infrared light supply is annular light source； Or
For first infrared light supply to be multiple around the point light source circularized, second infrared light supply is point light source and number It is multiple to measure；Or
First infrared light supply is annular light source；Second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is annular light source.
In some embodiments, the output module further includes chip, first infrared light supply and described second red Outer light source is formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly The package substrate extends and is connected at the top of the encapsulation between the package substrate, is formed at the top of the encapsulation luminous Window, the luminescence window are corresponding with first infrared light supply and second infrared light supply.
In some embodiments, the output module further includes Infrared Lens, and the Infrared Lens are arranged on the envelope It fills in housing and corresponding with first infrared light supply and second infrared light supply.
In some embodiments, the output module further includes the Infrared Lens being arranged in the encapsulating housing, institute It is corresponding with first infrared light supply and second infrared light supply to state Infrared Lens, the Infrared Lens are located at transparent base On.
In some embodiments, the output module further includes the optics sealing cover made of translucent material, the optics Sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps first infrared light Source and second infrared light supply.
In some embodiments, grounding pin, light compensating lamp pin are formed with and close to lamp pin on the output module, The grounding pin and it is described close to lamp pin be enabled when, first infrared light supply emits infrared light；The grounding lead When foot and the light compensating lamp pin are enabled, first infrared light supply and second infrared light supply transmitting infrared light.
In some embodiments, the cover board is formed with the surface that the casing is combined and only transmits the infrared of infrared light Through ink, the infrared ink that penetrates blocks at least one of the infrared through-hole of the casing and casing vibration through-hole.
In some embodiments, the electronic device further includes receiving module and imaging modules, the receiving module collection Into having proximity sensor and optical flame detector, the imaging modules include microscope base, the lens barrel on the microscope base and are housed in institute The imaging sensor in microscope base is stated, the microscope base includes the mounting surface between the lens barrel and described image sensor, institute It states receiving module and is arranged on the mounting surface.
In some embodiments, the electronic device further includes proximity sensor, optical flame detector and imaging modules, described Imaging modules include microscope base, the lens barrel on the microscope base and the imaging sensor being housed in the microscope base, the mirror Seat includes mounting surface positioned at the lens barrel and described image sensor between, in the proximity sensor and the optical flame detector It is at least one to be arranged on the mounting surface.
In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head Kind.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and structure light The projector, the output module, the infrared pick-up head, the visible image capturing head, the piezoelectric element and the structure The center of light projector is located on same line segment, is followed successively by from one end of the line segment to the other end：
It is the output module, the structured light projector, the piezoelectric element, the infrared pick-up head, described visible Light video camera head；Or
The output module, the infrared pick-up head, the piezoelectric element, the visible image capturing head, the structure Light projector；Or
The infrared pick-up head, the output module, the piezoelectric element, the visible image capturing head, the structure Light projector；Or
The infrared pick-up head, the visible image capturing head, the piezoelectric element, the output module, the structure Light projector.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head, structure light and throws Emitter, the centre bit for exporting module, the infrared pick-up head, the visible image capturing head and the structured light projector In on same line segment, the piezoelectric element is between the line segment and the top of the casing.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and structure light The projector, the quantity of the piezoelectric element is multiple, and the quantity of the casing vibration through-hole is multiple, multiple piezoelectric elements Corresponding with multiple casing vibration through-holes, each piezoelectric element is housed in the corresponding casing vibration through-hole, institute State output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectric elements and the project structured light The center of device is located on same line segment, and the output module, the infrared light are provided between the two neighboring piezoelectric element At least one of camera, the visible image capturing head and described structured light projector.
In some embodiments, the electronic device further includes infrared pick-up head, visible image capturing head and structure light The projector, the piezoelectric element include piezoelectric body and the piezoelectricity convex block stretched out from the piezoelectric body, and the casing vibration is logical The quantity in hole is multiple, and multiple piezoelectricity convex blocks are corresponding with multiple casing vibration through-holes, each piezoelectricity convex block portion Divide and be housed in the corresponding casing vibration through-hole and combined with the cover board, the output module, the infrared pick-up Head, the visible image capturing head and the structured light projector are between the cover board and the piezoelectric body, the output In module, the infrared pick-up head, the visible image capturing head, multiple piezoelectricity convex blocks and the structured light projector The heart is located on same line segment, be provided between the two neighboring piezoelectricity convex block it is described output module, the infrared pick-up head, At least one of the visible image capturing head and the structured light projector.
In the electronic device of embodiment of the present invention, by control the first infrared light supply and the second infrared light supply unlatching and It closes, output module both can be used as close to infrared lamp, it is also possible to make infrared light compensating lamp, gather transmitting infrared light with infrared distance measurement And the function of infrared light filling.In addition, the first infrared light supply and the second infrared light supply are integrated into a single package body structure, mould is exported The integrated level of group is higher, small volume, and output module has saved the space of the infrared light filling of realization and infrared distance measurement function.Furthermore First infrared light supply and the second infrared light supply are carried on same package substrate, compared to traditional handicraft infrared light compensating lamp with It needs to be respectively adopted in different wafer manufacture recombinants to PCB substrate close to infrared lamp and encapsulate, improve packaging efficiency.Finally, Electronic device realizes that osteoacusis is transaudient using piezoelectric element and vibration module, instead of traditional receiver by air transmitted sound On the one hand the privacy of dialog context is effectively ensured in structure, on the other hand, due to eliminating the receiver of script, avoid Open up through-hole corresponding with receiver on cover board, it is simpler in technique, it is also more aesthetically pleasing in appearance.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change It obtains significantly and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 3 to Fig. 4 is the status diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 5 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Fig. 6 to Fig. 8 is the distribution of the first infrared light supply and the second infrared light supply of the output module of embodiment of the present invention Schematic diagram；
Fig. 9 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Figure 10 is schematic cross-section of the electronic device along X-X lines in Fig. 1；
Figure 11 is partial sectional schematic view of the electronic device along XI-XI lines in Fig. 1；
Figure 12 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 13 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 14 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 15 to Figure 16 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 17 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 18 is partial sectional schematic view of the electronic device along XVIII-XVIII lines in Figure 17；
Figure 19 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Figure 20 is the receiving module of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 21 is that the electronic device of embodiment of the present invention is cut along with XXI-XXI lines corresponding position intercepts in Fig. 1 part Face schematic diagram；
Figure 22 to Figure 30 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing To the whole element for representing same or similar element or there is same or like function.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's Embodiment, and be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature right over second feature or oblique upper or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity Sub- component includes output module 10, vibration module 30a (such as Figure 10), piezoelectric element 70, receiving module 50 (such as Figure 12), imaging Module 60 (such as Figure 12) and structured light projector 80.Electronic device 100 can be mobile phone, tablet computer, laptop, intelligence Energy wrist-watch, Intelligent bracelet, automatic teller machine etc., the embodiment of the present invention is illustrated so that electronic device 100 is mobile phone as an example, Ke Yili Solution, the concrete form of electronic device 100 can be other, and this is not restricted.
Fig. 2 to Fig. 4 is please referred to, output module 10 is single package body structure, including encapsulating housing 11, the first infrared light supply 12 With the second infrared light supply 13.
Encapsulating housing 11 for encapsulating the first infrared light supply 12 and the second infrared light supply 13 simultaneously, and in other words, first is infrared 12 and second infrared light supply 13 of light source is encapsulated in encapsulating housing 11 simultaneously.Encapsulating housing 11 includes package substrate 111, package-side Wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference (Electromagnetic Interference, EMI) shielding material is made, and output module 10 is had an impact to avoid extraneous electromagnetic interference.
Incorporated by reference to Fig. 5, package substrate 111 is for the first infrared light supply 12 of carrying and the second infrared light supply 13.It is defeated manufacturing When going out module 10, the first infrared light supply 12 and the second infrared light supply 13 can be formed on a piece of chip 14, then infrared by first Light source 12, the second infrared light supply 13 and chip 14 are set along on package substrate 111, specifically, can be bonded chip 14 On package substrate 111.Meanwhile package substrate 111 can be used for and other parts of electronic device 100 (such as electronics The casing 20 of device 100, mainboard etc.) connection, module 10 will be exported and be fixed in electronic device 100.
Package wall 112 can surround the first infrared light supply 12 and the second infrared light supply 13 is set, and package wall 112 is self-styled Dress substrate 111 extends, and package wall 112 can be combined with package substrate 111, preferably, package wall 112 and package substrate 111 To be detachably connected, in order to be examined to the first infrared light supply 12 and the second infrared light supply 13 after removing package wall 112 It repaiies.The making material of package wall 112 can be the material of impermeable infrared light, infrared to avoid the first infrared light supply 12 and second The infrared light that light source 13 is sent out passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connect with package wall 112.Encapsulation top 113 Luminescence window 1131 is formed with, luminescence window 1131 is corresponding with the first infrared light supply 12 and the second infrared light supply 13, and first is infrared The infrared light of 12 and second infrared light supply 13 of light source transmitting is pierced by from luminescence window 1131.Encapsulation top 113 and package wall 112 Integrally formed can obtain, can also split shape to obtain.In one example, luminescence window 1131 is through-hole, encapsulates top 113 making material is the material of impermeable infrared light.In another example, encapsulation top 113 by impermeable infrared light material and The material co-manufactured of saturating infrared light forms, and specifically, luminescence window 1131 is made of the material of saturating infrared light, remaining position by The material of impermeable infrared light is made, and further, luminescence window 1131 could be formed with lens arrangement, to improve from luminescence window The 1131 infrared light emission angles projected, such as luminescence window 1131 are formed with concavees lens structure, so that across luminescence window 1131 divergence of beam projects outward；Luminescence window 1131 is formed with convex lens structures, so that the light across luminescence window 1131 Line gathers outside injection.
First infrared light supply 12 and the second infrared light supply 13 can be formed on a piece of chip 14, and it is red further to reduce first Volume after 12 and second infrared light supply 13 of outer light source is integrated, and preparation process is simpler.First infrared light supply 12 and second is red Outer light source 13 can emit infrared light.When the first infrared light supply 12 and the second infrared light supply 13 are opened and to 11 outgoing of encapsulating housing When penetrating infrared light (as shown in Figure 3), infrared light passes through luminescence window 1131 to project body surface, electronic device 100 The infrared light (as shown in Figure 1) that be reflected by the object that receives of infrared pick-up head 62 is to obtain the image information of object, at this point, output Module 10 is used as infrared light compensating lamp (i.e. for infrared light filling), and the first infrared light supply 12 and the second transmitting jointly of infrared light supply 13 The light-emitting area that covers of the infrared light for light filling it is larger, the field angle α of light filling infrared light can be 60 degree -90 and spend, such as： The field angle α of light filling infrared light is 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 degree or 90 degree etc..When Two infrared light supplies 13 are closed, when the first infrared light supply 12 emits infrared light outside encapsulating housing 11 (as shown in Figure 4), infrared light Across luminescence window 1131 and body surface is reached, the reception (as shown in figure 12) of proximity sensor 51 of electronic device 100 is by object The infrared light of body reflection is with detection object to the distance of electronic device 100, at this point, output module 10 is used as close to infrared lamp (i.e. For infrared distance measurement), and the light-emitting area that the infrared light for infrared distance measurement of the first infrared light supply 12 transmitting covers is smaller, it is red The field angle β of outer ranging infrared light is 10 degree of -30 degree, such as：The field angle β of infrared distance measurement infrared light for 10 degree, 15 degree, 20 degree, 25 degree or 30 degree etc..In an embodiment of the present invention, field angle refers to that infrared light passes through luminescence window 1131 from envelope Fill the range of the outgoing covering of housing 11.
It exports when module 10 is used as infrared light compensating lamp and as close to can be with different power to encapsulating shell during infrared lamp Emit infrared light outside body 11.Output module 10 is used as infrared close to being emitted outside encapsulating housing 11 with the first power during infrared lamp Light emits infrared light with the second power when output module 10 is used as infrared light compensating lamp outside encapsulating housing 11, wherein, first Power can be less than second power.
Second infrared light supply 13 is set around the first infrared light supply 12.First infrared light supply 12 and the second infrared light supply 13 are whole Round, annular, rectangular or regular polygon etc. can be rendered as on body.Can be：First infrared light supply 12 is point light source, and second is red Outer light source 13 is also point light source and quantity is multiple (as shown in Figure 6)；Or first infrared light supply 12 be point light source, second is infrared Light source 13 is annular light source (as shown in Figure 7)；Or first infrared light supply 12 to be multiple red around the point light source circularized, second Outer light source 13 is annular light source；Or first infrared light supply 12 to be multiple around the point light source circularized, the second infrared light supply 13 It is multiple (as shown in Figure 8) for point light source and quantity；Or first infrared light supply 12 be annular light source；Second infrared light supply 13 is Point light source and quantity are multiple；Or first infrared light supply 12 be annular light source；Second infrared light supply 13 is annular light source.
Incorporated by reference to Fig. 9, in embodiments of the present invention, export and be formed with grounding pin 15, light compensating lamp pin 16 on module 10 With close to lamp pin 17.It grounding pin 15, light compensating lamp pin 16 and can be formed on package substrate 111 close to lamp pin 17, When grounding pin 15 and light compensating lamp pin 16 are enabled (that is, grounding pin 15 and light compensating lamp pin 16 access circuit turn-on When), the first infrared light supply 12 and the second infrared light supply 13 transmitting infrared light；Made when grounding pin 15 and close to lamp pin 17 Can when (that is, grounding pin 15 and close to lamp pin 17 access circuit turn-on when), the first infrared light supply 12 transmitting infrared light.
It please refers to Fig.1 and Figure 10, casing 20 in other words, can export module 10 as the installation carrier of output module 10 It can be arranged in casing 20.Casing 20 can be the shell of electronic device 100.
Also referring to Fig. 1, Figure 10 and Figure 11, casing 20 includes top 21 and bottom 22, corresponding with electronic component Position, casing 20 offers the infrared through-hole 23 of spaced casing and casing vibration through-hole 2a.Output module 10 is arranged on When in casing 20, the first infrared light supply 12 and the second infrared light supply 13 through-hole 23 infrared with casing are corresponding.Wherein, the first infrared light 12 and second infrared light supply 13 of source through-hole 23 infrared with casing is corresponding to refer to the first infrared light supply 12 and the second infrared light supply 13 is sent out Light can be passed through from the infrared through-hole 23 of casing, can be the first infrared light supply 12 and the second infrared light supply 13 and machine specifically The light that infrared 23 face of through-hole of shell or the first infrared light supply 12 and the second infrared light supply 13 emit is made through light-guide device The infrared through-hole 23 of casing is passed through with rear.
Module 30a is vibrated to be mounted on casing 20.Vibration module 30a may include display screen 90 and cover board 30, show in other words Display screen 90 is combined formation vibration module 30a with cover board 30, to promote the rigidity of vibration module 30a.Display screen 90 is arranged on casing Host cavity 91 is formed on 20 and with casing 20, cover board 30 is arranged on casing 20 and is located at the separate host cavity 91 of display screen 90 Side, to protect display screen 90.Since the output module 10 of embodiment of the present invention can occupy smaller volume, machine For setting the volume of display screen 90 that can correspond to increase in shell 20, to improve the screen accounting of electronic device 100.Specifically, Display screen 90, output module 10 and piezoelectric element 70 are arranged between top 21 and bottom 22, are filled in user's normal use electronics In the state of putting 100, top 21 is located at the top of bottom 22, as shown in Figure 1, output module 10 can be arranged on display screen 90 with Between top 21.In other embodiments, display screen 90 can open up jagged for screen comprehensively, and display screen 90 surrounds output Module 10, and export module 10 and expose from the notch of display screen 90.
Piezoelectric element 70 is made of ceramics or quartz crystal materials, and piezoelectric element 70 can be single-chip, twin crystal sheet or layer The piezoelectric element 70 of pressure.Piezoelectric element 70 is combined with vibration module 30a and is spaced with output module 10.Specifically, piezoelectric element 70 are housed in casing vibration through-hole 2a and are combined, and be spaced with casing 20, Ke Yishi with cover board 30：It receives 70 part of piezoelectric element Hold in casing vibration through-hole 2a or piezoelectric element 70 is housed in completely in the logical 2a holes of casing vibration.When the two of piezoelectric element 70 When end is applied with electric signal (voltage), due to inverse piezoelectric effect, mechanical deformation, such as expansion or shrinkage occur for piezoelectric element 70, The vibration module 30a combined with piezoelectric element 70 is driven to be vibrated according to the frequency of the electric signal as a result,.When the body of user is with shaking When dynamic model group 30a is contacted, the part that osteoacusis sound is contacted by the body of user with vibration module 30a is (for example, external ear is soft Bone, tooth) it is sent to the auditory nerve of user.In this way, user can realize voice by piezoelectric element 70 and vibration module 30a It the functions such as converses, listen to music.In embodiments of the present invention, the processor of electronic device 100 is used to obtain voice signal, and pressing The both ends of electric device 70 apply electric signal corresponding with the voice signal.
It is appreciated that traditional telephone receiver structure, using air transmitted sound, part acoustic pressure usually exists when receiver works 90dB~100dB or so, in ambient enviroment quieter (under the working environment as 50dB or so) even if sound is transmitted to week It encloses 1 meter of range and also still remains with 50dB~60dB or so, the chat script between caller is caused to be perceived by surrounding, secret is caused to be let out Dew.The electronic device 100 of embodiment of the present invention realizes that osteoacusis is transaudient using piezoelectric element 70 and vibration module 30a, call Sound be mainly perceived by the user by the osteoacusis vibrated, can effectively ensure that the privacy of dialog context.
Referring to Figure 10 and Figure 11, piezoelectric element 70 and display screen 90 are attached to cover board 30 by fastener 30b On.Fastener 30b is with heat curable properties, the adhesive of UV-curing characteristics, double faced adhesive tape, viscose etc..For example, fastener 30b can be Photoelasticity resin (the UV curable acrylic adhesive of colorless and transparent).Cover board 30 and piezoelectric element Being combined with display screen 90 for 70 regions combined and cover board 30 is interregional every to prevent the display of display screen 90 first by piezoelectricity The interference of part 70.Certainly, cover board 30 can also be bonded to casing 20 by fastener 30b, be set up directly on machine compared to cover board 30 On shell 20, the vibration of vibration module 30a can be prevented to be transmitted directly onto casing 20, to reduce user because casing 20 shakes Dynamic amplitude is excessive and falls the possibility of electronic device 100.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated Go out after the light that module 10 is sent out sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in figure 11 In, cover board 30 covers the infrared through-hole 23 of casing, be coated on the inner surface 32 of cover board 30 it is infrared penetrate ink 40, it is infrared through oil Black 40 pairs of infrared lights have higher transmitance, such as can reach 85% or more, and have higher attenuation rate to visible ray, such as It can reach more than 70% so that user during normal use, is visually difficult to see that on electronic device 100 and penetrates ink 40 by infrared The region of covering.Specifically, it is infrared through ink 40 can cover on inner surface 32 not with 90 corresponding region of display screen.
It is infrared to block at least one of the infrared through-hole 23 of casing and casing vibration through-hole 2a through ink 40, That is, infrared can cover the infrared through-hole 23 of casing and casing vibration through-hole 2a (as shown in figure 11), user simultaneously through ink 40 The internal structure vibrated through-hole 2a by the infrared through-hole 23 of casing and casing and see electronic device 100 is difficult to, electronic device 100 Shape is more beautiful；It is infrared to cover the infrared through-hole 23 of casing through ink 40, and casing vibration through-hole 2a is not covered；It is infrared Casing vibration through-hole 2a can also be covered, and do not cover the infrared through-hole 23 of casing through ink 40.
2 are please referred to Fig.1, receiving module 50 is integrated with proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation Single package body structure is collectively formed in device 52.The infrared light that output module 10 is sent out when being used as close to infrared lamp, by foreign objects After body reflection, received by proximity sensor 51, proximity sensor 51 judges foreign objects according to the infrared light reflected received The distance between body and electronic device 100.Optical flame detector 52 receives the visible ray in ambient light, and detects the intensity of visible ray, with The foundation of display brightness as control display screen 90.Proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, Reduce gap when the two is individually assembled, save the installation space in electronic device 100.
It please refers to Fig.1 and Figure 12, imaging modules 60 can be visible image capturing head 61 and one in infrared pick-up head 62 It is a or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, image Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, and mounting surface 631 is located at lens barrel 64 and imaging sensor 65 Between.In embodiment as shown in figure 12, receiving module 50 is arranged on mounting surface 631, and specifically, receiving module 50 is being pacified Plane orthographic projection where dress face 631 is at least partly dropped on mounting surface 631, in this way, receiving module 50 and imaging modules 60 Set compacter, the horizontal space that the two occupies jointly is smaller.
Referring to Fig. 1, structured light projector 80 is used for outside emitting structural light, on project structured light to testee after quilt Reflection, the structure light reflected can be received by infrared pick-up head 62, and the processor of electronic device 100 is further analyzed by infrared The structure light that light video camera head 62 receives, to obtain the depth information of testee.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, defeated The center for going out module 10, infrared pick-up head 62, visible image capturing head 61, piezoelectric element 70 and structured light projector 80 is located at together On one line segment.Specifically, output module 10, structured light projector 80, piezoelectric element are followed successively by from one end of line segment to the other end 70th, infrared pick-up head 62, visible image capturing head 61 (as shown in figure 13)；Or it is followed successively by from one end of line segment to the other end defeated Go out module 10, infrared pick-up head 62, piezoelectric element 70, visible image capturing head 61, structured light projector 80 (as shown in Figure 1)； Or infrared pick-up head 62, output module 10, piezoelectric element 70, visible image capturing are followed successively by from one end of line segment to the other end First 61, structured light projector 80；Or infrared pick-up head 62, visible image capturing head are followed successively by from one end of line segment to the other end 61st, piezoelectric element 70, output module 10, structured light projector 80.Certainly, module 10, infrared pick-up head 62, piezoelectricity member are exported Part 70, visible image capturing head 61, structured light projector 80 arrangement mode be not limited to above-mentioned citing, can also have other, example The center of such as each electronic component arranges in the arc-shaped, center and arranges rectangular shape.
4 are please referred to Fig.1, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62.Export module 10, red The center of outer light video camera head 62, visible image capturing head 61 and structured light projector 80 is located on same line segment, piezoelectric element 70 Between line segment and the top 21 of casing 20.Specifically, output module 10, structure light are followed successively by from one end of line segment to the other end The projector 80, infrared pick-up head 62, visible image capturing head 61；Or output module is followed successively by from one end of line segment to the other end 10th, infrared pick-up head 62, visible image capturing head 61, structured light projector 80 (as shown in figure 14)；Or from one end of line segment Infrared pick-up head 62, output module 10, visible image capturing head 61, structured light projector 80 are followed successively by the other end；Or from One end of line segment is followed successively by infrared pick-up head 62, visible image capturing head 61, output module 10, structured light projector to the other end 80.Certainly, it is unlimited that module 10, infrared pick-up head 62, visible image capturing head 61, the arrangement mode of structured light projector 80 are exported In above-mentioned citing.In embodiments of the present invention, the center of piezoelectric element 70 is not located on the line segment, has saved each on cover board 30 The horizontal stroke that electronic component (output module 10, infrared pick-up head 62, visible image capturing head 61, structured light projector 80 etc.) occupies To space.
Further, incorporated by reference to Figure 12, receiving module 50 can be arranged on the mounting surface 631 of infrared pick-up head 62, It can also be arranged on the mounting surface 631 of visible image capturing head 61, certainly, receiving module 50 can not also be arranged on mounting surface On 631, receiving module 50 can be disposed adjacent with output module 10, and proximity sensor 51 is readily received to be used by output module 10 Emit, and the infrared light being reflected back by external object when making close to infrared lamp；Receiving module 50 can also be with 70 phase of piezoelectric element Neighbour's setting, this is not restricted.
To sum up, in the electronic device 100 of embodiment of the present invention, by controlling the first infrared light supply 12 and the second infrared light The opening and closing in source 13, output module 10 both can be used as close to infrared lamp, it is also possible to make infrared light compensating lamp, it is red to have gathered transmitting Outer light is with the function of infrared distance measurement and infrared light filling.In addition, the first infrared light supply 12 and the second infrared light supply 13 are integrated into one Single package body structure, the integrated level for exporting module 10 is higher, small volume, and output module 10 has saved the infrared light filling of realization and red The space of the function of outer ranging.In addition, since the first infrared light supply 12 and the second infrared light supply 13 are carried on same encapsulation base On plate 111, different wafer manufacture recombinants are respectively adopted from being needed close to infrared lamp in the infrared light compensating lamp compared to traditional handicraft It is encapsulated on to PCB substrate, improves packaging efficiency.Finally, electronic device 100 is real using piezoelectric element 70 and vibration module 30a Existing osteoacusis is transaudient, instead of traditional telephone receiver structure by air transmitted sound, on the one hand, can effectively ensure that dialog context Privacy；On the other hand, due to eliminating the receiver of script, avoid opened up on cover board 30 it is corresponding with receiver logical Hole, it is simpler in technique, it is also more aesthetically pleasing in appearance, and can prevent dust or moisture from entering in electronic device 100.
1 and Figure 15 are please referred to Fig.1, in some embodiments, imaging modules 60 include visible image capturing head 61 and infrared Light video camera head 62.Casing 20 offers the infrared through-hole 23 of spaced casing and casing vibration through-hole 2a.First infrared light supply 12 and second the through-hole 23 infrared with casing of infrared light supply 13 it is corresponding.The quantity of piezoelectric element 70 is multiple, casing vibration through-hole 2a Quantity to be multiple, multiple piezoelectric elements 70 vibrate that through-hole 2a is corresponding, and each piezoelectric element 70 is housed in correspondence with multiple casings Casing vibration through-hole 2a in.Export module 10, infrared pick-up head 62, visible image capturing head 61,70 and of multiple piezoelectric elements The center of structured light projector 80 is located on same line segment, and output module 10, red is provided between two neighboring piezoelectric element 70 At least one of outer light video camera head 62, visible image capturing head 61 and structured light projector 80.For example, the number of piezoelectric element 70 It is two to measure, and piezoelectric element 70, output module 10, structured light projector 80, infrared is followed successively by from one end of line segment to the other end Light video camera head 62, visible image capturing head 61, piezoelectric element 70 (as shown in figure 15)；Or from one end of line segment to the other end successively For piezoelectric element 70, output module 10, infrared pick-up head 62, visible image capturing head 61, piezoelectric element 70, structured light projector 80 etc..In another example the quantity of piezoelectric element 70 is three, piezoelectric element 70, output are followed successively by from one end of line segment to the other end Module 10, structured light projector 80, piezoelectric element 70, infrared pick-up head 62, visible image capturing head 61, piezoelectric element 70 are (such as Shown in Figure 16)；Or piezoelectric element 70, output module 10, piezoelectric element 70, infrared is followed successively by from one end of line segment to the other end Light video camera head 62, visible image capturing head 61, piezoelectric element 70, structured light projector 80 etc..Certainly, the quantity of piezoelectric element 70 with And the arrangement side of piezoelectric element 70, output module 10, infrared pick-up head 62, visible image capturing head 61, structured light projector 80 Formula is not limited to above-mentioned citing.In embodiments of the present invention, multiple piezoelectric elements 70 are combined with cover board 30, in particular multiple pressures Electric device 70 is attached to by fastener 30b on cover board 30 respectively.The processor of electronic device 100 is used to obtain voice signal, And applying electric signal corresponding with the voice signal at the both ends of multiple piezoelectric elements 70 simultaneously, multiple piezoelectric elements 70 occur Mechanical deformation, multiple piezoelectric elements 70 drive from the multiple and different positions combined with cover board 30 as a result, vibrates module 30a according to this The frequency vibration of electric signal.When the body of user is contacted with vibration module 30a, body and vibration of the osteoacusis sound by user The part (for example, the cartilage of external ear, tooth) of module 30a contacts is sent to the auditory nerve of user.
In embodiments of the present invention, multiple piezoelectric elements 70 drive simultaneously from the multiple and different positions combined with cover board 30 Vibrate module 30a vibration, the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts To the auditory nerve of user.
1, Figure 17 and Figure 18 is please referred to Fig.1, in some embodiments, imaging modules 60 include 61 He of visible image capturing head Infrared pick-up head 62.Casing 20 offers the infrared through-hole 23 of spaced casing and casing vibration through-hole 2a.First is infrared 12 and second infrared light supply 13 of light source through-hole 23 infrared with casing is corresponding.Piezoelectric element 70 includes piezoelectric body 71 and from piezoelectricity sheet The piezoelectricity convex block 72 that body 71 stretches out, the quantity of piezoelectricity convex block 72 is multiple, and the quantity of casing vibration through-hole 2a is multiple, multiple pressures Electric convex block 72 is corresponding with multiple casings vibration through-hole 2a, and each 72 partial receipt of piezoelectricity convex block is in corresponding casing vibration through-hole 2a It is interior and combined with cover board 30.Export module 10, infrared pick-up head 62, visible image capturing head 61 and structured light projector 80 Between cover board 30 and piezoelectric body 71.It is convex to export module 10, infrared pick-up head 62, visible image capturing head 61, multiple piezoelectricity The center of block 72 and structured light projector 80 is located on same line segment, and output module is provided between two neighboring piezoelectricity convex block 72 10th, at least one of infrared pick-up head 62, visible image capturing head 61 and structured light projector 80.For example, piezoelectricity convex block 72 Quantity for two, be followed successively by from one end of line segment to the other end piezoelectricity convex block 72, output module 10, structured light projector 80, Infrared pick-up head 62, visible image capturing head 61, piezoelectricity convex block 72；Or from one end of line segment to the other end to be followed successively by piezoelectricity convex Block 72, output module 10, infrared pick-up head 62, visible image capturing head 61, piezoelectricity convex block 72, structured light projector 80 etc..Again For example, the quantity of piezoelectricity convex block 72 be three, be followed successively by from one end of line segment to the other end piezoelectricity convex block 72, output module 10, Structured light projector 80, piezoelectricity convex block 72, infrared pick-up head 62, visible image capturing head 61, piezoelectricity convex block 72；Or from line segment One end to the other end is followed successively by piezoelectricity convex block 72, output module 10, piezoelectricity convex block 72, infrared pick-up head 62, visible ray are taken the photograph As head 61, piezoelectricity convex block 72, structured light projector 80 etc..For another example the quantity of piezoelectricity convex block 72 is five, from one end of line segment Piezoelectricity convex block 72, output module 10, piezoelectricity convex block 72, structured light projector 80, piezoelectricity convex block 72, infrared is followed successively by the other end Light video camera head 62, piezoelectricity convex block 72, visible image capturing head 61, piezoelectricity convex block 72 (as shown in figure 18).Certainly, piezoelectricity convex block 72 Quantity and piezoelectricity convex block 72, output module 10, infrared pick-up head 62, visible image capturing head 61, structured light projector 80 Arrangement mode is not limited to above-mentioned citing.In embodiments of the present invention, multiple piezoelectricity convex blocks 72 are combined with cover board 30, more specifically It is attached on cover board 30 by fastener 30b respectively for multiple piezoelectricity convex blocks 72.The processor of electronic device 100 is used to obtain sound Sound signal, and electric signal corresponding with the voice signal is applied to piezoelectric element 70, including piezoelectric body 71 and piezoelectricity convex block 72 Mechanical deformation occurs for piezoelectric element 70 inside, and multiple piezoelectricity convex blocks 72 are from the multiple and different positions combined with cover board 30 as a result, Vibration module 30a is driven to be vibrated according to the frequency of the electric signal.When the body of user is contacted with vibration module 30a, osteoacusis Sound is sent to the sense of hearing of user by the body of user with the vibration module 30a parts (for example, the cartilage of external ear, tooth) contacted Nerve.
In embodiment as shown in figure 18, casing 20 offers spaced casing vibration through-hole 2a, output through-hole 25th, structure light through-hole 26, infrared light through-hole 27, visible ray through-hole 28.Casing vibration through-hole 2a is corresponding with piezoelectricity convex block 72, output Through-hole 25 is corresponding with output module 10, and structure light through-hole 26 is corresponding with structured light projector 80, infrared light through-hole 27 and infrared light Camera 62 corresponds to, it is seen that light through-hole 28 is corresponding with visible image capturing head 61.Wherein, output through-hole 25 is that said machine casing is infrared Through-hole 23.In addition, structure light through-hole 26 it is corresponding with structured light projector 80 refer to structure light that structured light projector 80 sends out can be from Structure light through-hole 26 passes through, and the infrared pick-up head 62 that refers to corresponding with infrared pick-up head 62 of infrared light through-hole 27 can lead to from infrared light Hole 27 receives the infrared light that is reflected by the object, it is seen that light through-hole 28 is corresponding with visible image capturing head 61 refer to visible image capturing head 61 can The visible ray being reflected by the object is received from visible ray through-hole 28.
In embodiments of the present invention, multiple piezoelectricity convex blocks 72 drive vibration from the multiple and different positions combined with cover board 30 Module 30a vibrates, and the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts to use The auditory nerve at family；In addition, multiple piezoelectricity convex blocks 72 are stretched out from same piezoelectric body 71, convenient for multiple piezoelectricity convex blocks 72 simultaneously Apply electric signal, to be vibrated from multiple and different position synchronous drives vibration module 30a；Further more, output module 10, infrared pick-up First 62, visible image capturing head 61 and structured light projector 80 are between cover board 30 and piezoelectric body 71, and intert and be provided with pressure Electric convex block 72,100 overall volume of electronic device is smaller, saves space.
Referring to Fig. 5, in some embodiments, output module 10 further includes Infrared Lens 18.Infrared Lens 18 are set It is in encapsulating housing 11 and corresponding with the first infrared light supply 12 and the second infrared light supply 13.First infrared light supply 12 and second is infrared The infrared light that light source 13 emits, which is converged under the action of Infrared Lens 18 in luminescence window 1131, to be projected, and reduction is emitted to encapsulation The light quantity in other regions at side wall 112 and encapsulation top 113, it is only necessary to meet the first infrared light supply 12 and the second infrared light supply 13 Field angle α of the infrared light for light filling emitted jointly after Infrared Lens 18 is spent for 60 degree -90, the first infrared light supply 12 Field angle β of the infrared light for infrared distance measurement of transmitting after Infrared Lens 18 is 10 degree of -30 degree.Specifically, it is infrared Mirror 18 can be located on transparent base, be made more specifically, Infrared Lens 18 can be integrally formed with the transparent base.Certainly, Output module 10 can not also set Infrared Lens 18.
9 are please referred to Fig.1, in some embodiments, output module 10 further includes optics sealing cover 1b.Optics sealing cover 1b is by saturating Luminescent material is made, and optics sealing cover 1b is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1b wraps One infrared light supply 12 and the second infrared light supply 13.Specifically, optics sealing cover 1b can be formed by encapsulating injection molding and forming technology, light Sealing cover 1b may be used transparent thermosetting epoxy resin and be made, and to be not easy to soften in use, optics sealing cover 1b can consolidate Fixed relative position between first infrared light supply 12 and the second infrared light supply 13, and cause the first infrared light supply 12 and second infrared Light source 13 is not easy to shake in encapsulating housing 11.
Figure 20 is please referred to, in some embodiments, proximity sensor 51 can be not integrated in reception mould with optical flame detector 52 In group 50, in other words, proximity sensor 51 is separately set with optical flame detector 52.At this point, proximity sensor 51 can be arranged on microscope base On 63 mounting surface 631；Optical flame detector 52 can also be arranged on the mounting surface 631 of microscope base 63；Or proximity sensor 51 and light Sensor 52 is arranged on the mounting surface 631 of microscope base 63 simultaneously.Microscope base 63 can be the microscope base 63 of infrared pick-up head 62, can also It is the microscope base 63 of visible image capturing head 61.
Figure 21 is please referred to, in some embodiments, cover plate through hole 33, cover plate through hole 33 can also be offered on cover board 30 Through-hole 23 infrared with casing is corresponding, and the infrared light of the first infrared light supply 12 and the transmitting of the second infrared light supply 13 passes through casing infrared logical Electronic device 100 can be pierced by behind hole 23 from cover plate through hole 33.
Figure 22 is please referred to, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on On substrate 66, receiving module 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, one of substrate 66 Divide and be located in microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and is used to carry image sensing Device 65, the other end can be connect with the mainboard of electronic device 100.When receiving module 50 is arranged on substrate 66, receiving module 50 It is arranged on outside microscope base 63, receiving module 50 can also be connect with FPC.
Further, the receiving module 50 for being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, close to sensing Single package body structure is collectively formed with optical flame detector 52 in device 51, reduces gap when the two is individually assembled, saves in electronic device 100 Installation space.In other embodiments, the receiving module 50 for being arranged on substrate 66 includes proximity sensor 51 or/and light sensation Device 52, proximity sensor 51 and optical flame detector 52 are respectively single package body structure.That is, the receiving module 50 for being arranged on substrate 66 is single The proximity sensor 51 of package body structure；Alternatively, the receiving module 50 for being arranged on substrate 66 is the optical flame detector of single package body structure 52；Alternatively, the receiving module 50 for being arranged on substrate 66 is the proximity sensor 51 of single package body structure and single package body structure Optical flame detector 52.
Imaging modules 60 can be visible image capturing head 61 and one or two in infrared pick-up head 62.Specifically, Receiving module 50 can be fixed on the substrate 66 of visible image capturing head 61；Receiving module 50 can be fixed on infrared pick-up head On 62 substrate 66.When proximity sensor 51 and optical flame detector 52 are encapsulated for split, proximity sensor 51 can be fixed on visible On the substrate 66 of light video camera head 61, optical flame detector 52 can be fixed on the substrate 66 of infrared pick-up head 62；Alternatively, optical flame detector 52 It can be fixed on the substrate 66 of visible image capturing head 61, proximity sensor 51 can be fixed on the substrate of infrared pick-up head 62 On 66；Alternatively, proximity sensor 51 is each attached to optical flame detector 52 on the substrate 66 of visible image capturing head 61；Alternatively, close to passing Sensor 51 is each attached to optical flame detector 52 on the substrate 66 of infrared pick-up head 62.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with receiving module 50, to increase The integral strength of substrate 66 so that FPC is not susceptible to around folding, while receiving module 50 (or proximity sensor 51 or optical flame detector 52) It is not susceptible to shake when being arranged on substrate 66.In one example, receiving module 50 (or proximity sensor 51 or optical flame detector 52) it may be also secured on the lateral wall of microscope base 63, such as be fixed on the lateral wall of microscope base 63 by cohesive mode.
Figure 23 is please referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67 Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- top surface 672 and the sub- top surface 673 of third, the second son top 672 and first sub- top surface 671 of face tilts connection and forms notch 675, the sub- top surface 673 and second of third with the first sub- top surface 671 Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- top surface 671 and the sub- top surface 673 of third to connect first Sub- top surface 671 and the sub- top surface 673 of third.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight Angle, the angle between the second sub- top surface 672 and the sub- top surface 673 of third can be obtuse angle or right angle.Notch 675 is opened in camera shell On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.The sub- top surface 673 of third offers out Light through-hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through-hole 674.Imaging sensor 65 is housed in In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens mould Group 68 is simultaneously transmitted on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Receiving module 50 is arranged on At first sub- top surface 671, receiving module 50 includes proximity sensor 51 and optical flame detector 52.In present embodiment, imaging modules 60 Can be visible image capturing head 61, receiving module 50 is single packaging body knot that proximity sensor 51 is collectively formed with optical flame detector 52 Structure.Proximity sensor 51 can be consistent with the extending direction of notch 675 (such as Figure 23 institutes with the center line connecting direction of optical flame detector 52 Show)；Alternatively, proximity sensor 51 can be vertical with the extending direction of notch 675 with the center line connecting direction of optical flame detector 52 or be in The angle that the two is formed is acute angle or obtuse angle.In other embodiments, imaging modules 60 can be infrared pick-up head 62.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the first sub- top surface On 671, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves Installation space in electronic device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce The installation space in electronic device 100 is saved in gap when the two is individually assembled.
Please continue to refer to Figure 23, in some embodiments, the receiving module 50 of the above embodiment is arranged on the first son On top surface 671 and positioned at the outside of camera case 67, specifically, entire receiving module 50 is along perpendicular to the first sub- top surface 671 Projection can be located in the first sub- top surface 671 (as shown in figure 23)；Alternatively, part receiving module 50 is pushed up along perpendicular to the first son The projection in face 671 is located in the first sub- top surface 671.That is, receiving module 50 is at least part of to be located at the first sub- top surface 671 surface, in this way, receiving module 50 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly compared with It is small, further save the installation space in electronic device 100.In other embodiments, receiving module 50 is included close to biography Sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two individual single package body structures, at this point, being respectively The proximity sensor 51 and optical flame detector 52 of single package body structure can also be all disposed on the first sub- top surface 671.
Figure 24 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes proximity sensor 51, not comprising optical flame detector 52, tied at this point, proximity sensor 51 (or receiving module 50) is respectively monomer encapsulation with optical flame detector 52 Structure, proximity sensor 51 are arranged on the first sub- top surface 671, and optical flame detector 52 is arranged on any other except the first sub- top surface 671 Position.
Please continue to refer to Figure 24, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, and not comprising proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively monomer envelope with proximity sensor 51 Assembling structure, optical flame detector 52 are arranged on the first sub- top surface 671, proximity sensor 51 be arranged on except the first sub- top surface 671 other Any position.
Figure 25 is please referred to, the first sub- top surface 671 of the above embodiment offers loophole 676, and receiving module 50 is located at It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without light sensation Device 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 The light in portion can pass through loophole 676 and be transmitted on proximity sensor 51.The receiving module 50 of present embodiment is arranged on In camera case 67, receiving module 50 and the structure of camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging mould Group 60 is installed on casing 20.
Please continue to refer to Figure 25, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without connecing Nearly sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electricity Light outside sub-device 100 can pass through loophole 676 and be transmitted on optical flame detector 52.The receiving module 50 of present embodiment Be arranged in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with Imaging modules 60 are installed on casing 20.
Figure 26 is please referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 be integrated with it is close When sensor 51 is with optical flame detector 52, loophole 676 can be one and proximity sensor 51 and the corresponding light transmission of optical flame detector 52 Hole or two it is spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that light can pass through loophole 676 and be transmitted in receiving module 50.In other realities It applies in mode, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two Individually list package body structure, at this point, being respectively the proximity sensor 51 of single package body structure and optical flame detector 52 can also all set It puts in camera case 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, is made Receiving module 50 and the structure of camera case 67 are more stablized and convenient for receiving module 50 and imaging modules 60 are installed to casing On 20.
Figure 26 is please referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connect with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connect with FPC.This embodiment party In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation Single package body structure is collectively formed in device 52, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 is also encapsulated for monomer Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at Outside camera case 67.
In yet another embodiment, optical flame detector 52 is only included in receiving module 50, proximity sensor 51, which is not integrated into, to be connect It receives in module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 is also sealed for monomer Assembling structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when one of substrate 66 Divide and be located in camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate On 66 and outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67 Structure is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, and receiving module 50 is enable to be firmly mounted in camera case 67.
Figure 27 is please referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677 678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677 Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle. Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two A light extraction through-hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through-holes 674 Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions Through-hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68, Light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens module 68 and be transmitted on imaging sensor 65.This reality It applies in mode, imaging modules 60 can be visible image capturing head 61, and two camera lens modules 68 are visible image capturing head 61 at this time Corresponding camera lens module.Receiving module 50 is arranged on the second tread 678 and outside camera case 67.Receiving module 50 is connects Single package body structure that nearly sensor 51 is collectively formed with optical flame detector 52.The line of centres side of proximity sensor 51 and optical flame detector 52 To can be consistent with the extending direction of notch 675；Alternatively, the center line connecting direction of proximity sensor 51 and optical flame detector 52 can be with The angle that the extending direction of notch 675 vertical (as shown in figure 27) or the two are formed is acute angle or obtuse angle.In other embodiment In, imaging modules 60 can be infrared pick-up head 62, and two camera lens modules 68 are that infrared pick-up head 62 is corresponding at this time Camera lens module.In yet another embodiment, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, at this time its In camera lens module 68 be 62 corresponding camera lens module of infrared pick-up head, another camera lens module 68 is visible image capturing head 61 corresponding camera lens modules.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the second tread 678 On, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, has saved electronics Installation space in device 100；Both meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce The installation space in electronic device 100 is saved in individually gap during assembling.
Figure 28 is please referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670 On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through-holes 674 are opened in the first son respectively On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675 Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face 679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678, Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating receiving module 50 is arranged on the second tread On 678.
Figure 27 and Figure 28 is please referred to, in some embodiments, the receiving module 50 of the above embodiment is arranged on second On tread 678 and positioned at the outside of camera case 67.Specifically, it is whole when notch 675 is opened in the marginal position of top surface 670 A receiving module 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, part receives mould Group 50 is located at along the projection perpendicular to the second tread 678 in the second tread 678 (as shown in figure 27).That is, receiving module The 50 at least part of surfaces for being located at the second tread 678.It is whole when notch 675 is opened on the centre position of top surface 670 A receiving module 50 can be located in the second tread 678 (as shown in figure 28) along perpendicular to the projection of the second tread 678.Such as This, receiving module 50 sets compacter with imaging modules 60, and the horizontal space that the two occupies jointly is smaller, further saves Installation space in electronic device 100.In other embodiments, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two individual single package body structures, at this point, being respectively single package body structure Proximity sensor 51 and optical flame detector 52 can also be all disposed on the second tread 678.
Figure 28 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes close to sensing Device 51, receiving module 50 does not include optical flame detector 52, at this point, proximity sensor 51 (or receiving module 50) is respectively with optical flame detector 52 Cell packaging configuration, proximity sensor 51 are arranged on the second tread 678, and optical flame detector 52 is arranged on the casing outside imaging modules 60 On 20.
Figure 28 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, Receiving module 50 does not include proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively with proximity sensor 51 Cell packaging configuration, optical flame detector 52 are arranged on the second tread 678, and proximity sensor 51 is arranged on the casing outside imaging modules 60 On 20.
Figure 29 is please referred to, the second tread 678 of the above embodiment offers loophole 676, and receiving module 50 is located at phase It is in casing body 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without optical flame detector 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 Light can pass through and loophole 676 and be transmitted on proximity sensor 51.The receiving module 50 of present embodiment is arranged on phase In casing body 67, the structure of receiving module 50 and camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging modules 60 are installed on casing 20.
Please continue to refer to Figure 29, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics Light outside device 100 can pass through loophole 676 and be transmitted on optical flame detector 52.The receiving module 50 of present embodiment is set Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with into As module 60 is installed on casing 20.
Figure 30 is please referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, Receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 is integrated with close to sensing When device 51 and optical flame detector 52, loophole 676 can be one with proximity sensor 51 and the corresponding loophole of optical flame detector 52 or Two spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, the light outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that loophole 676 can be passed through and be transmitted in receiving module 50.In other embodiment party In formula, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are independent for two Single package body structure, at this point, being respectively the proximity sensor 51 of single package body structure and optical flame detector 52 can also be all disposed within It is in camera case 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, makes reception The structure of module 50 and camera case 67 is more stablized and convenient for receiving module 50 and imaging modules 60 are installed on casing 20.
Please continue to refer to Figure 30, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connect with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connect with FPC.This embodiment party In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation Single package body structure is collectively formed in device 52, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 is also encapsulated for monomer Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at Outside camera case 67.
In yet another embodiment, receiving module 50 only includes optical flame detector 52, and proximity sensor 51 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 is also encapsulated for monomer Structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 In camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate 66 It goes up and is located at outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67 Structure is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, and receiving module 50 is enable to be firmly mounted in camera case 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention. In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two, Three, unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.

Claims (18)

1. a kind of electronic device, which is characterized in that including：
Casing；
Module is exported, the output module is arranged in the casing, and the output module includes encapsulating housing, the first infrared light Source and around first infrared light supply setting the second infrared light supply, the encapsulating housing include package substrate, described first Infrared light supply and second infrared light supply are encapsulated in the encapsulating housing and carry on the package substrate, when described the Two infrared light supplies are closed, described when first infrared light supply emits outside the encapsulating housing infrared light with the first power Module is exported to be used as close to infrared lamp；When first infrared light supply and second infrared light supply are opened and with the second power When emitting infrared light outside the encapsulating housing, the output module is used as infrared light compensating lamp；
Module is vibrated, the vibration module installation is on the housing；With
Piezoelectric element, the piezoelectric element are combined with the vibration module and export module interval, the piezoelectric element with described For being deformed upon when being applied in electric signal so that the vibration module vibration.
2. electronic device according to claim 1, which is characterized in that the vibration module includes display screen and the lid of light transmission Host cavity is collectively formed on the housing and with the casing in plate, the display screen setting, and the cover board is arranged on the machine On shell and positioned at the side far from the host cavity of the display screen, the display screen is combined with the cover board, the casing Offer the infrared through-hole of spaced casing and casing vibration through-hole, first infrared light supply and second infrared light supply Corresponding with the infrared through-hole of the casing, the piezoelectric element is housed in the casing vibration through-hole and is combined with the cover board.
3. electronic device according to claim 2, which is characterized in that the piezoelectric element and the display screen pass through engagement Part is attached on the cover board.
4. electronic device according to claim 1, which is characterized in that
First infrared light supply is point light source, and second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is point light source, and second infrared light supply is annular light source；Or
For first infrared light supply to be multiple around the point light source circularized, second infrared light supply is annular light source；Or
First infrared light supply is multiple around the point light source circularized, and second infrared light supply is point light source and quantity is It is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is annular light source.
5. electronic device according to claim 1, which is characterized in that the output module further includes chip, and described first Infrared light supply and second infrared light supply are formed on a piece of chip.
6. electronic device according to claim 1, which is characterized in that the encapsulating housing further includes package wall and encapsulation Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute It states encapsulation top and is formed with luminescence window, the luminescence window and first infrared light supply and second infrared light supply pair It should.
7. electronic device according to claim 1, which is characterized in that the output module further includes Infrared Lens, described Infrared Lens are arranged in the encapsulating housing and corresponding with first infrared light supply and second infrared light supply.
8. electronic device according to claim 1, which is characterized in that the output module, which further includes, is arranged on the encapsulation Infrared Lens in housing, the Infrared Lens are corresponding with first infrared light supply and second infrared light supply, described red Outer lens are located on transparent base.
9. electronic device according to claim 1, which is characterized in that the output module is further included to be made of translucent material Optics sealing cover, the optics sealing cover formed on the package substrate and in the encapsulating housing, the optics sealing cover Wrap first infrared light supply and second infrared light supply.
10. electronic device according to claim 1, which is characterized in that be formed with grounding pin on the output module, mend Light lamp pin and close to lamp pin, the grounding pin and it is described close to lamp pin be enabled when, the first infrared light supply hair Penetrate infrared light；When the grounding pin and the light compensating lamp pin are enabled, first infrared light supply and described second red Outer light source emits infrared light.
11. electronic device according to claim 2, which is characterized in that the surface shape that the cover board is combined with the casing The infrared through ink of infrared light is only transmitted into having, the infrared ink that penetrates blocks the infrared through-hole of the casing and the casing Vibrate at least one of through-hole.
12. electronic device according to claim 1, which is characterized in that the electronic device further include receiving module and into As module, the receiving module is integrated with proximity sensor and optical flame detector, and the imaging modules include microscope base, mounted on the mirror Lens barrel on seat and the imaging sensor being housed in the microscope base, the microscope base include being located at the lens barrel and described image Mounting surface between sensor, the receiving module are arranged on the mounting surface.
13. electronic device according to claim 1, which is characterized in that the electronic device further includes proximity sensor, light Sensor and imaging modules, the imaging modules include microscope base, the lens barrel on the microscope base and are housed in the microscope base Interior imaging sensor, the microscope base includes the mounting surface between the lens barrel and described image sensor, described close At least one of sensor and the optical flame detector are arranged on the mounting surface.
14. electronic device according to claim 12 or 13, which is characterized in that the imaging modules include visible image capturing At least one of head and infrared pick-up head.
15. electronic device according to claim 2, which is characterized in that the electronic device further include infrared pick-up head, Visible image capturing head and structured light projector, the output module, the infrared pick-up head, the visible image capturing head, institute The center for stating piezoelectric element and the structured light projector is located on same line segment, from one end of the line segment to the other end successively For：
The output module, the structured light projector, the piezoelectric element, the infrared pick-up head, the visible ray are taken the photograph As head；Or
The output module, the infrared pick-up head, the piezoelectric element, the visible image capturing head, the structure light are thrown Emitter；Or
The infrared pick-up head, the output module, the piezoelectric element, the visible image capturing head, the structure light are thrown Emitter；Or
The infrared pick-up head, the visible image capturing head, the piezoelectric element, the output module, the structure light are thrown Emitter.
16. electronic device according to claim 2, which is characterized in that the electronic device further include infrared pick-up head, Visible image capturing head, structured light projector, the output module, the infrared pick-up head, the visible image capturing head and institute The center for stating structured light projector is located on same line segment, the piezoelectric element be located at the line segment and the casing top it Between.
17. electronic device according to claim 2, which is characterized in that the electronic device further include infrared pick-up head, Visible image capturing head and structured light projector, the quantity of the piezoelectric element is multiple, and the quantity of the casing vibration through-hole is Multiple, multiple piezoelectric elements are corresponding with multiple casing vibration through-holes, and each piezoelectric element is housed in corresponding In the casing vibration through-hole, the output module, the infrared pick-up head, the visible image capturing head, multiple pressures The center of electric device and the structured light projector is located on same line segment, is set between the two neighboring piezoelectric element State at least one of output module, the infrared pick-up head, the visible image capturing head and described structured light projector.
18. electronic device according to claim 2, which is characterized in that the electronic device further include infrared pick-up head, Visible image capturing head and structured light projector, the piezoelectric element include piezoelectric body and the pressure stretched out from the piezoelectric body Electric convex block, the quantity of the casing vibration through-hole is multiple, multiple piezoelectricity convex blocks and multiple casing vibration through-holes pair Should, each piezoelectricity convex portion is housed in the corresponding casing vibration through-hole and is combined with the cover board, described defeated Go out module, the infrared pick-up head, the visible image capturing head and the structured light projector be located at the cover board with it is described Between piezoelectric body, the output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectricity convex blocks It is located on same line segment with the center of the structured light projector, the output is provided between the two neighboring piezoelectricity convex block At least one of module, the infrared pick-up head, the visible image capturing head and described structured light projector.
CN201711437415.5A 2017-12-26 2017-12-26 Electronic device Active CN108173992B (en)

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