CN108156286A - Electronic device - Google Patents
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- CN108156286A CN108156286A CN201711437254.XA CN201711437254A CN108156286A CN 108156286 A CN108156286 A CN 108156286A CN 201711437254 A CN201711437254 A CN 201711437254A CN 108156286 A CN108156286 A CN 108156286A
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- Prior art keywords
- light
- infrared
- infrared lamp
- electronic device
- lamp
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- 239000000758 substrate Substances 0.000 claims abstract description 53
- 230000003287 optical effect Effects 0.000 claims abstract description 37
- 230000005540 biological transmission Effects 0.000 claims abstract description 36
- 238000003384 imaging method Methods 0.000 claims description 59
- 238000004020 luminiscence type Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 14
- 238000000605 extraction Methods 0.000 claims description 11
- 230000007613 environmental effect Effects 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 8
- 239000000571 coke Substances 0.000 claims description 3
- 230000006870 function Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 238000005259 measurement Methods 0.000 description 5
- 238000009738 saturating Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/22—Illumination; Arrangements for improving the visibility of characters on dials
Abstract
Electronic device disclosed by the invention includes casing, the output module on casing, the display screen and optical flame detector that are arranged on casing.It exports module and includes encapsulating housing, infrared lamp and light-guide device, encapsulating housing includes package substrate, infrared lamp and light-guide device are encapsulated in encapsulating housing, infrared lamp is carried on package substrate, light-guide device can be movably arranged in the luminous light path of infrared lamp, when light-guide device is located in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted from encapsulating housing using as infrared light compensating lamp or close to infrared lamp with the first field angle；When light-guide device is left in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted from encapsulating housing using as close to infrared lamp or infrared light compensating lamp with the second field angle.Display screen is formed with light transmission entity area and including the front that can show picture and the back side opposite with front.Optical flame detector is arranged on the side where the back side of display screen and corresponding with light transmission entity area.
Description
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of function element set
It is more and more, in order to realize the functions such as the facial 3D feature recognitions of distance detection, environment light detection and user, need to set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be occupied.
Invention content
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Module is exported, on the housing, the output module includes encapsulating housing, infrared for the output module installation
Lamp and light-guide device, the encapsulating housing include package substrate, and the infrared lamp and the light-guide device are encapsulated in the encapsulation
In housing, on the package substrate, the light-guide device can be movably arranged at the infrared lamp for the infrared lamp carrying
Luminous light path on, when the light-guide device is located in the luminous light path of the infrared lamp, infrared lamp transmitting it is infrared
Light is emitted from the encapsulating housing using as infrared light compensating lamp or close to infrared lamp with the first field angle；When the light-guide device
When leaving in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting is with the second field angle from the encapsulating shell
Body outgoing is using as close to infrared lamp or infrared light compensating lamp；
Display screen, on the housing, the display screen is formed with light transmission entity area and including energy for the display screen setting
Enough show the front of picture and the back side opposite with the front；And
Optical flame detector, the optical flame detector are arranged on the side where the back side of the display screen, the optical flame detector and institute
Light transmission entity area correspondence is stated, the optical flame detector is used to receive the light being incident on the optical flame detector and the mesh for exporting the light
Mark light intensity.
In some embodiments, the light-guide device includes convex lens or the lens group with positive light coke, when described
When light-guide device is located in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting is with the first field angle from institute
Encapsulating housing outgoing is stated using as close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, institute
The infrared light of infrared lamp transmitting is stated with the second field angle from encapsulating housing outgoing using as infrared light compensating lamp；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is positioned at described red
When in the luminous light path of outer lamp, the infrared light of the infrared lamp transmitting is emitted to make with the first field angle from the encapsulating housing
For infrared light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared lamp emits infrared
Light is emitted from the encapsulating housing using as close to infrared lamp with the second field angle.
In some embodiments, the output module further includes chip, and the infrared lamp is formed on the chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected at the top of the encapsulation between the package substrate, is formed at the top of the encapsulation luminous
Window, the luminescence window are corresponding with the infrared lamp.
In some embodiments, the output module further includes the optics sealing cover made of translucent material, the optics
Sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps the infrared lamp.
In some embodiments, the electronic device further includes the cover board of light transmission, and the casing offers casing through-hole,
The infrared lamp is corresponding with the casing through-hole, and the cover board setting is on the housing.
In some embodiments, the electronic device further includes the cover board of light transmission, and the casing offers casing through-hole,
The infrared lamp is corresponding with the casing through-hole, and on the housing, the cover board is combined with the casing for the cover board setting
Surface be formed with and only transmit the infrared through ink of infrared light, it is described infrared to block the casing through-hole through ink.
In some embodiments, the electronic device further includes proximity sensor and imaging modules, the imaging modules
Lens barrel including microscope base, on the microscope base and the imaging sensor being housed in the microscope base, the microscope base include position
Mounting surface between the lens barrel and described image sensor, the proximity sensor are arranged on the mounting surface.
In some embodiments, the electronic device further includes proximity sensor and imaging modules, the imaging modules
Including camera case and camera lens module, the top surface of the camera case is for cascaded surface and including connected the first sub- top surface and second
Sub- top surface, the relatively described first sub- top surface inclination in the second sub- top surface simultaneously form notch, the top with the described first sub- top surface
Face offers light extraction through-hole, and the camera lens module is housed in the camera case and corresponding with the light extraction through-hole；It is described to connect
Nearly sensor is arranged at the described first sub- top surface；Or
The electronic device further includes proximity sensor and imaging modules, and the imaging modules include camera case and two
Camera lens module offers notch on the top surface of the camera case to form step-like top surface, and the top surface includes the first ladder
Face and the second tread less than first tread are opened up on first tread there are two through-hole, each through-hole and institute
State camera lens module correspondence；The proximity sensor is arranged at second tread.
In some embodiments, the electronic device further includes proximity sensor and imaging modules, the imaging modules
Lens barrel and part including microscope base, on the microscope base are arranged on the substrate in the microscope base；The proximity sensor is set
It puts on the substrate.
In some embodiments, the transparent area includes light transmission entity area, and the light transmission entity area includes image pixel,
The electronic device further includes processor, and the optical flame detector receives the light to export the ring for including the external electronic device
The initial beam intensity of border intensity signal；The processor is only included with obtaining outside the electronic device for handling the initial beam intensity
The target light intensity of the environmental light intensity information in portion.
In some embodiments, the initial beam intensity includes the environmental light intensity information and the display screen shows image
When display intensity signal, the processor is used to obtain the display intensity signal when display screen shows image in real time, and
The display intensity signal is removed when handling the initial beam intensity to obtain the target light intensity.
In some embodiments, the transparent area includes light transmission entity area, and the light transmission entity area does not include image slices
Element and surrounded by multiple images pixel.
To sum up, in the electronic device of embodiment of the present invention, pass through the position of mobile light-guide device so that output module can
As close to infrared lamp or infrared light compensating lamp, transmitting infrared light is gathered with the function of infrared distance measurement and infrared light filling.Secondly, phase
It is needed for being positioned proximate to infrared lamp and infrared light compensating lamp simultaneously compared with current electronic device, the output of embodiment of the present invention
Module only needs to set an infrared lamp, and small volume has saved the space of the infrared light filling of realization and infrared distance measurement function.Again
Person is packaged due to only needing an infrared lamp being arranged on package substrate, compared to the infrared light compensating lamp of traditional handicraft
It is encapsulated from needing to be respectively adopted in different wafer manufacture recombinants to PCB substrate close to infrared lamp, improves packaging efficiency.Together
When, optical flame detector is arranged on the side where the back side of display screen, so as to which optical flame detector will not occupy display platen edge and shell rim
Between space, show that the gap between platen edge and shell rim be can be made smaller, in other words, the viewing area of display screen
Domain can increase, to improve the screen accounting of electronic device.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
It obtains significantly and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of certain embodiments of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the output module of the electronic device of certain embodiments of the present invention；
Fig. 3 is the status diagram of the output module of the electronic device of certain embodiments of the present invention；
Fig. 4 is the status diagram of the output module of the electronic device of certain embodiments of the present invention；
Fig. 5 is the schematic cross-section of the output module of the electronic device of certain embodiments of the present invention；
Fig. 6 is the schematic cross-section of the output module of the electronic device of certain embodiments of the present invention；
Fig. 7 is the partial sectional schematic view along VII-VII lines of the electronic device of Fig. 1；
Fig. 8 is the schematic cross-section along VIII-VIII lines of the electronic device of Fig. 1；
Fig. 9 is the proximity sensor of the electronic device of certain embodiments of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 10 is the arrangement schematic diagram of the electronic component of the electronic device of certain embodiments of the present invention；
Figure 11 is the schematic cross-section of the output module of the electronic device of certain embodiments of the present invention；
Figure 12 be certain embodiments of the present invention electronic device along with VII-VII lines corresponding position intercepts in Fig. 1 portion
Partial cross-section schematic diagram；
Figure 13 be another embodiment of the present invention electronic device along with VII-VII lines corresponding position intercepts in Fig. 1 portion
Partial cross-section schematic diagram；With
Figure 14 to 21 is that the proximity sensor of the electronic device of certain embodiments of the present invention and the solid of imaging modules are shown
It is intended to.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the whole element for representing same or similar element or there is same or like function.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature right over second feature or oblique upper or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity
Sub- component includes output module 10, proximity sensor 51 (such as Fig. 9), optical flame detector 52, imaging modules 60 (such as Fig. 9), receiver
70 and structured light projector 80.Electronic device 100 can be mobile phone, tablet computer, laptop, smartwatch, intelligent hand
Ring, automatic teller machine etc., the embodiment of the present invention are illustrated so that electronic device 100 is mobile phone as an example, it will be understood that electronic device 100
Concrete form can be other, this is not restricted.
Fig. 2 to Fig. 4 is please referred to, output module 10 is single package body structure, including encapsulating housing 11, infrared lamp 12 and leaded light
Element 13.
Encapsulating housing 11 for encapsulating infrared lamp 12 and light-guide device 13 simultaneously, in other words, infrared lamp 12 and light-guide device
13 are encapsulated in encapsulating housing 11 simultaneously.Encapsulating housing 11 includes package substrate 111, package wall 112 and encapsulation top 113.
Encapsulating housing 11 can be made of electromagnetic interference (Electromagnetic Interference, EMI) shielding material, to keep away
Exempt from extraneous electromagnetic interference to have an impact output module 10.
Incorporated by reference to Fig. 5, package substrate 111 is used to carry infrared lamp 12.When manufacture exports module 10, infrared lamp 12 can be with
It is formed on chip 14, then infrared lamp 12 and chip 14 is set along on package substrate 111, it specifically, can be by chip
14 are bonded on package substrate 111.Meanwhile package substrate 111 can be used for other parts (examples with electronic device 100
Casing 20, the mainboard of such as electronic device 100) connection, module 10 will be exported and be fixed in electronic device 100.
Package wall 112 can surround infrared lamp 12 and light-guide device 13 and set, and package wall 112 is from package substrate 111
Extension, package wall 112 can be combined with package substrate 111, preferably, package wall 112 is removably with package substrate 111
Connection, in order to be overhauled to infrared lamp 12 after removing package wall 112.The making material of package wall 112 can be not
The material of saturating infrared light passes through package wall 112 to avoid the infrared light that infrared lamp 12 is sent out.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connect with package wall 112.Encapsulation top 113
Luminescence window 1131 is formed with, luminescence window 1131 is corresponding with infrared lamp 12, and the infrared light that infrared lamp 12 emits is from luminescence window
1131 are pierced by.Encapsulation top 113 integrally formed can be obtained with package wall 112, can also split shape to obtain.In an example
In son, luminescence window 1131 is through-hole, and the making material at encapsulation top 113 is the material of impermeable infrared light.In another example,
Encapsulation top 113 is formed by the material of impermeable infrared light and the material co-manufactured of saturating infrared light, specifically, luminescence window 1131
It is made of the material of saturating infrared light, remaining position is made of the material of impermeable infrared light, and further, luminescence window 1131 can be with
Lens arrangement is formed with, to improve the infrared light emission angle projected from luminescence window 1131, such as luminescence window 1131 is formed
There is concavees lens structure, so that the divergence of beam across luminescence window 1131 projects outward；Luminescence window 1131 is formed with convex lens
Structure, so that the light across luminescence window 1131 gathers outside injection.
Light-guide device 13 can be movably arranged in the luminous light path of infrared lamp 12.Fig. 5 and Fig. 6 are please referred to, exports mould
Group 10 further includes actuator 17, and actuator 17 is used to light-guide device 13 be driven to move can be movably arranged at infrared lamp 12
In the light path that shines.Wherein, actuator 17 drives light-guide device 13 to move the luminous light can be movably arranged at infrared lamp 12
Road includes：Under normal conditions, light-guide device 13 is arranged in the luminous light path of infrared lamp 12, and infrared lamp 12 is used as infrared light compensating lamp
(or close to infrared lamp), when infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), actuator 17 drives light-guide device
13 move the luminous light path to leave infrared lamp 12；Or under normal conditions, light-guide device 13 is not arranged in shining for infrared lamp 12
In light path, infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), when infrared lamp 12 is used as infrared light compensating lamp (or close to red
Outer lamp) when, actuator 17 drives light-guide device 13 to move in the luminous light path of infrared lamp 12.
Referring to Fig. 5, actuator 17 includes linear motor, linear motor includes stator 172 and mover 174, and stator 172 is pacified
In package wall 112, mover 174 is connect with light-guide device 13, and actuator 17 drives mover 174 to move to drive guide-lighting member
Part 13 moves.Referring to Fig. 6, the structure of above-mentioned actuator 17 could alternatively be：Actuator 17 includes linear motor, linear motor
Including stator 172 and mover 174, stator 172 is mounted in package wall 112, and output module 10 further includes shaft 18 and connection
Arm 19, the first end connection light-guide device 13 of linking arm 19, the second end of mover 174 and the separate light-guide device 13 of linking arm 19
Connection, linking arm 19 are set in shaft 18, and shaft 18 is between light-guide device 13 and mover 174, the mover of linear motor
174 are drivingly connected the second end motion of arm 19, and linking arm 19 is rotated around shaft 18, and the first end of linking arm 19 drives as a result,
Light-guide device 13 is rotated around shaft 18, to realize that light-guide device 13 is in the luminous light path of infrared lamp 12 or far from infrared lamp
12 luminous light path.In an embodiment of the present invention, output module 10 can also include loading plate (not shown), be opened on loading plate
Equipped with bearing holes, light-guide device 13 is mounted in bearing holes, and actuator 17 is used to that loading plate movement to be driven to drive light-guide device
13 movements.
Referring to Fig. 3, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 using as close to red
Outer lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 emits is with the second visual field
Angle is emitted from encapsulating housing 11 using as infrared light compensating lamp, at this point, the first field angle is less than the second field angle, wherein, first regards
Ranging from 10 degree -30 degree of rink corner, for example, the first field angle is 10 degree, 15 degree, 20 degree, 25 degree or 30 degree etc., the second visual field
Ranging from 60 degree -90 of angle degree, for example, the second field angle is 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 degree,
Or 90 degree etc..Light-guide device 13 is for converging light, and light-guide device 13 includes convex lens or the lens group with positive light coke, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light passes through luminescence window
1131 ranges covered from the outgoing of encapsulating housing 11.
Referring to Fig. 4, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 using as infrared benefit
Light lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 emits is with the second visual field
Angle is emitted from encapsulating housing 11 using as close to infrared lamp, at this point, the first field angle is more than the second field angle, wherein, first regards
Ranging from 60 degree -90 of rink corner degree, for example, the first field angle is 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87
Degree or 90 degree etc., ranging from 10 the degree -30 of the second field angle spends, for example, the second field angle is 10 degree, 15 degree, 20 degree, 25 degree,
Or 30 degree etc..Light-guide device 13 is used for divergent rays, and light-guide device 13 includes concavees lens or the lens group with negative power, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light passes through luminescence window
1131 ranges covered from the outgoing of encapsulating housing 11.
When infrared lamp 12 is opened and emits infrared light outside encapsulating housing 11 as infrared light compensating lamp, infrared light passes through
Luminescence window 1131 is to project body surface, and the reception (as shown in Figure 1) of infrared pick-up head 62 of electronic device 100 is by object
The infrared light of reflection is to obtain the image information of object (at this point, infrared lamp 12 be used for infrared light filling).When infrared lamp 12 is opened simultaneously
During as emitting infrared light outside encapsulating housing 11 close to infrared lamp, infrared light passes through luminescence window 1131 and reaches object table
Face, the proximity sensor 51 of electronic device 100 the infrared light (as shown in Figure 9) that be reflected by the object that receives is with detection object to electronics
The distance (at this point, infrared lamp 12 is used for infrared distance measurement) of device 100.
When infrared lamp 12 is used as infrared light compensating lamp and as close to can be with different power to encapsulating housing during infrared lamp
Transmitting infrared light outside 11.Specifically, infrared lamp 12 is used as with the first power outside encapsulating housing 11 emitting close to during infrared lamp
Infrared light emits infrared light with the second power when infrared lamp 12 is used as infrared light compensating lamp outside encapsulating housing 11, wherein, the
One power can be less than the second power.
It please refers to Fig.1, Fig. 7 and Fig. 8, casing 20 in other words, can export module as the installation carrier of output module 10
10 can be arranged in casing 20.Casing 20 includes top 21 and bottom 22, in the state of user's normal use electronic device 100
Under, top 21 is located at the top of bottom 22, as shown in Figure 1.Output module 10 is arranged between top 21 and bottom 22.Casing 20
Mounting groove 25 is offered, mounting groove 25 is opened between top 21 and bottom 22.Casing 20 can be the middle shell of electronic device 100
Or shell.
It please refers to Fig.1 and Fig. 8, display screen 90 is arranged on casing 20 and closes mounting groove 25 to form the installation of closing sky
Between, specifically, display screen 90 is arranged between top 21 and bottom 22.Display screen 90 be formed with light transmission entity area 91 with it is non-transparent
Area 94, light transmission entity area 91 do not include image pixel and are surrounded by multiple images pixel, and image pixel is distributed in alternatively non-transparent district 94
Interior, in other words, alternatively non-transparent district 94 is the viewing area of display screen 90, and alternatively non-transparent district 94 is used to implement the display function of display screen 90.
The material in light transmission entity area 91 includes but not limited to glass.Light outside electronic device 100 may pass through light transmission entity area 91 and enter
Electronic device 100, without destroying the integrality of display screen 90.Display screen 90 include can show picture front 92 and with just
The opposite back side 93 in face 92.Specifically, when display screen 90 shines and when showing picture, the light that display screen 90 is sent out is from front 92
Project display screen 90；When display screen 90 is installed on casing 20, mounting groove 25 is located at the opposite both sides at the back side 93 with front 92
(that is, the back side 93 is located between front 92 and mounting groove 25).In embodiments of the present invention, output module 10 can be arranged on display
Shield between pane edge and top 21, due to the small volume that the output module 10 of embodiment of the present invention occupies, casing 20
It is interior to be used to set the volume of display screen 90 that correspond to increase, to improve the screen accounting of electronic device 100.In other embodiment party
In formula, display screen 90 can be that screen open up jagged comprehensively, and display screen 90 surrounds output module 10, and export module 10 from aobvious
The notch of display screen 90 exposes.In some embodiments, 94 uniform thickness of alternatively non-transparent district of light transmission entity area 91 and surrounding and continuous.
Casing 20 is further opened with casing through-hole 23.When output module 10 is arranged in casing 20, infrared lamp 12 leads to casing
Hole 23 corresponds to.Wherein infrared lamp 12 is corresponding with casing through-hole 23 refers to the light that infrared lamp 12 is sent out and can be passed through from casing through-hole 23,
Specifically, it can be infrared lamp 12 with 23 face of casing through-hole or the light of the transmitting of infrared lamp 12 is through light-guide device 13
Casing through-hole 23 is passed through after effect.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set
It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated
Go out after the light that module 10 is sent out sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 7
In, cover board 30 covers casing through-hole 23, and infrared transmission ink 40 is coated on the inner surface 32 of cover board 30, infrared to penetrate ink 40
There is higher transmitance to infrared light, such as can reach 85% or more, and have higher attenuation rate to visible ray, such as reachable
To more than 70% so that user during normal use, is visually difficult to see that on electronic device 100 and is covered by infrared through ink 40
Region.Specifically, it is infrared through ink 40 can cover on inner surface 32 not with 90 corresponding region of display screen.
Infrared to block casing through-hole 23 (as shown in Figure 7) through ink 40, user is difficult to through casing through-hole 23
See the internal structure of electronic device 100, the shape of electronic device 100 is more beautiful.
Referring to Fig. 8, optical flame detector 52 is single package body structure.Optical flame detector 52 is mounted in mounting groove 25 and positioned at display screen
Side where 90 back side 93, in other words, optical flame detector 52 is located at the lower section of display screen 90.Optical flame detector 52 and light transmission entity area 91
Corresponding, specifically, the visible ray outside electronic device 100 can pass through light transmission entity area 91 and be transmitted on optical flame detector 52.It is infrared
The infrared light that lamp 12 is sent out when being used as close to infrared lamp, after being reflected by external object, is received by proximity sensor 51, is approached
Sensor 51 judges the distance between external object and electronic device 100 according to the intensity of the infrared light reflected received.
Optical flame detector 52 receives the visible ray in ambient light, and detects the intensity of visible ray, using the display brightness as control display screen 90
Foundation.In present embodiment, optical flame detector 52 is first mounted in mounting groove 25 and display screen 90 is installed on casing 20 again, light sensation
Device 52 can contact or be arranged at intervals with display screen 90.In other embodiments, optical flame detector 52 can first be mounted on display screen 90
It goes up and makes optical flame detector 52 corresponding with light transmission entity area 91, display screen 90 and optical flame detector 52 are then installed to casing 20 simultaneously again
On.
Proximity sensor 51 is single packaging body.The infrared light sent out close to infrared lamp 13, after being reflected by external object,
Received by proximity sensor 51, proximity sensor 51 according to the infrared light being reflected by the object received come judge external object with
The distance between electronic device 100.
It please refers to Fig.1 and Fig. 9, imaging modules 60 can be visible image capturing head 61 and one in infrared pick-up head 62
Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, and image passes
Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it
Between.In embodiment as shown in Figure 9, proximity sensor 51 is arranged on mounting surface 631, and specifically, proximity sensor 51 exists
Plane orthographic projection where mounting surface 631 is at least partly dropped on mounting surface 631, in this way, proximity sensor 51 and imaging mould
Group 60 sets compacter, and the horizontal space that the two occupies jointly is smaller.
Referring to Fig. 1, receiver 70 is for sending out acoustic signals when being encouraged by power supply, user can by by
Words device 70 is conversed.Structured light projector 80 is used for outside emitting structural light, on project structured light to testee after it is anti-
It penetrates, the structure light reflected can be received by infrared pick-up head 62, and the processor of electronic device 100 is further analyzed by infrared light
The structure light that camera 62 receives, to obtain the depth information of testee.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, defeated
Go out the center of module 10, infrared pick-up head 62, visible image capturing head 61, receiver 70 and structured light projector 80 positioned at same
On line segment.Specifically, output module 10, structured light projector 80, receiver 70, red is followed successively by from one end of line segment to the other end
Outer light video camera head 62, visible image capturing head 61 (as shown in Figure 10), at this point, visible image capturing head 61 and infrared pick-up head 62 can
To form double photography/videography heads (as shown in figure 18)；Or output module 10, infrared light are followed successively by from one end of line segment to the other end
Camera 62, receiver 70, visible image capturing head 61, structured light projector 80 (as shown in Figure 1)；Or from one end of line segment to
The other end is followed successively by infrared pick-up head 62, output module 10, receiver 70, visible image capturing head 61, structured light projector 80；
Or infrared pick-up head 62, visible image capturing head 61, receiver 70, output module are followed successively by from one end of line segment to the other end
10th, structured light projector 80, at this point, visible image capturing head 61 and infrared pick-up head 62 can form double photography/videography heads (as schemed
Shown in 18).Certainly, module 10, infrared pick-up head 62, receiver 70, visible image capturing head 61, structured light projector 80 are exported
Arrangement mode be not limited to above-mentioned citing, can also have other, for example, each electronic component center arrangement it is in the arc-shaped, in
The heart arranges the shapes such as rectangular.
Further, incorporated by reference to Fig. 9, proximity sensor 51 can be arranged on the mounting surface 631 of infrared pick-up head 62,
It can also be arranged on the mounting surface 631 of visible image capturing head 61, certainly, proximity sensor 51 can not also be arranged on mounting surface
On 631, proximity sensor 51 can be disposed adjacent with output module 10, and proximity sensor 51 is readily received to be used by infrared lamp 12
Emit, and the infrared light being reflected back by external object when making close to infrared lamp；Proximity sensor 51 can also be with 70 phase of receiver
Neighbour's setting, when user receives calls, proximity sensor 51 is readily detected the ear of user close to receiver 70.
To sum up, in the electronic device 100 of embodiment of the present invention, pass through the position of mobile light-guide device 13 so that output
Module 10 can be used as, close to infrared lamp or infrared light compensating lamp, having gathered transmitting infrared light with infrared distance measurement and the work(of infrared light filling
Energy.Secondly, it is needed for being positioned proximate to infrared lamp and infrared light compensating lamp simultaneously compared to current electronic device, the present invention is implemented
The output module 10 of mode only needs to set an infrared lamp 12, and small volume has saved the infrared light filling of realization and infrared distance measurement
The space of function.Furthermore it is packaged due to only needing an infrared lamp 12 being arranged on package substrate 111, compared to biography
The infrared light compensating lamp for technique of uniting is encapsulated from needing to be respectively adopted in different wafer manufacture recombinants to PCB substrate close to infrared lamp,
Improve packaging efficiency.Meanwhile optical flame detector 52 is arranged on the side at 93 place of the back side of display screen 90 (under display screen 90
Side), so as to which optical flame detector 52 will not occupy the space between 20 edge of display screen pane edge and casing, display screen pane edge and casing
Gap between 20 edges be can be made smaller, and in other words, the display area of display screen 90 can increase, to improve electronics dress
Put 100 screen accounting.
1 is please referred to Fig.1, in some embodiments, output module 10 further includes optics sealing cover 16.Optics sealing cover 16 is by saturating
Luminescent material is made, and optics sealing cover 16 is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 16 wraps red
Outer lamp 12.Specifically, optics sealing cover 16 can be formed by encapsulating injection molding and forming technology, and optics sealing cover 16 may be used transparent
Thermosetting epoxy resin is made, and to be not easy to soften in use, optics sealing cover 16 can fix the position of infrared lamp 12, and cause
Infrared lamp 12 is not easy to shake in encapsulating housing 11.At this point, light-guide device 13 is arranged on other than optics sealing cover 16 and movably
It is housed in encapsulating housing 11.
It please refers to Fig.1 and Fig. 8, in some embodiments, light transmission entity area 91 includes image pixel, electronic device 100
Further include processor 96, optical flame detector 52 receives the light that is incident on optical flame detector 52 to export including outside electronic device 100
The initial beam intensity of environmental light intensity information.Processor 96 is only included with obtaining outside electronic device 100 for handling initial beam intensity
The target light intensity of environmental light intensity information.
Specifically, light transmission entity area 91 includes image pixel, and light transmission entity area 91 can be used for showing image information, meanwhile,
Ambient light can be from light transmission entity area 91 across and into electronic device 100.In some embodiments, light transmission entity area 91
Light transmittance can be more than or equal to 50%.It is appreciated that the light being incident on optical flame detector 52 had both included across light transmission entity area 91
Ambient light part, and include the image pixel in light transmission entity area 91 when showing content to the inside of electronic device 100
The part of the display light of transmitting.Processor 96 can determine that optical flame detector 52 receives according to the content that light transmission entity area 91 is shown
The display light that emits to optical flame detector 52 of light transmission entity area 91, so as to which processor 96 can be according to initial beam intensity and optical flame detector
52 receive the target light that the light intensity that display light generates determines to only include the environmental light intensity information outside electronic device 100 jointly
By force.The electronic device 100 of present embodiment can obtain the environmental light intensity information outside electronic device 100, to be shown as control
The foundation of the display brightness of display screen 90.
It please refers to Fig.1 and Fig. 8, in some embodiments, initial beam intensity includes environmental light intensity information and display screen 90 is aobvious
Diagram as when the display intensity signal that receives of optical flame detector 52, processor 96 shows the image time for obtaining display screen 90 in real time
The display intensity signal that sensor 52 receives, and removal shows intensity signal to obtain target light intensity when handling initial beam intensity.
2 are please referred to Fig.1, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Cover board sound outlet hole 34 is offered, receiver 70 is corresponding with the position of cover board sound outlet hole 34 and casing sound outlet hole.Export module 10, red
The center of outer light video camera head 62, visible image capturing head 61 and structured light projector 80 is located on same line segment, and receiver 70 is located at
Between the line segment and the top 21 of casing 20.
The center of receiver 70 is not located on the line segment, and it is (output module 10, red to have saved each electronic component on cover board 30
Outer light video camera head 62, visible image capturing head 61, structured light projector 80 etc.) occupy horizontal space.In reality as shown in figure 12
It applies in example, cover board sound outlet hole 34 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
Referring again to Figure 13, in some embodiments, cover plate through hole 33, cover plate through hole can also be offered on cover board 30
33 is corresponding with casing through-hole 23, and the infrared light that infrared lamp 12 emits can be pierced by after passing through casing through-hole 23 from cover plate through hole 33
Electronic device 100.
4 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on
On substrate 66, proximity sensor 51 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, the one of substrate 66
Part is located in microscope base 63, and another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and for carrying image biography
Sensor 65, the other end can be connect with the mainboard of electronic device 100.When proximity sensor 51 is arranged on substrate 66, close to biography
Sensor 51 is arranged on outside microscope base 63, and proximity sensor 51 can also be connect with FPC.
Imaging modules 60 can be visible image capturing head 61 and one or two in infrared pick-up head 62.Specifically,
Proximity sensor 51 can be fixed on the substrate 66 of visible image capturing head 61；Proximity sensor 51 can be fixed on infrared light and take the photograph
As first 62 substrate 66 on.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with proximity sensor 51, to increase
Add the integral strength of substrate 66 so that FPC is not susceptible to around folding, while when proximity sensor 51 is arranged on substrate 66 is not easy to send out
It is raw to shake.In one example, proximity sensor 51 may be also secured on the lateral wall of microscope base 63, such as pass through cohesive side
Formula is fixed on the lateral wall of microscope base 63.
5 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67
Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- top surface 672 and the sub- top surface 673 of third, the second son top
672 and first sub- top surface 671 of face tilts connection and forms notch 675, the sub- top surface 673 and second of third with the first sub- top surface 671
Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- top surface 671 and the sub- top surface 673 of third to connect first
Sub- top surface 671 and the sub- top surface 673 of third.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight
Angle, the angle between the second sub- top surface 672 and the sub- top surface 673 of third can be obtuse angle or right angle.Notch 675 is opened in camera shell
On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.The sub- top surface 673 of third offers out
Light through-hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through-hole 674.Imaging sensor 65 is housed in
In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens mould
Group 68 is simultaneously transmitted on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Proximity sensor 51 is set
At the first sub- top surface 671.In present embodiment, imaging modules 60 can be visible image capturing head 61.In other embodiment
In, imaging modules 60 can be infrared pick-up head 62.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 51 is arranged on the first son and is pushed up
On face 671, proximity sensor 51 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, section
Installation space about in electronic device 100.
Please continue to refer to Figure 15, in some embodiments, the proximity sensor 51 of the above embodiment is arranged on first
On sub- top surface 671 and positioned at the outside of camera case 67, specifically, entire proximity sensor 51 is along perpendicular to the first sub- top surface
671 projection can be located in the first sub- top surface 671 (as shown in figure 15)；Alternatively, part proximity sensor 51 along perpendicular to
The projection of first sub- top surface 671 is located in the first sub- top surface 671.It is located at that is, proximity sensor 51 is at least part of
The surface of first sub- top surface 671, in this way, proximity sensor 51 sets compacter with imaging modules 60, the two occupies jointly
Horizontal space it is smaller, further save the installation space in electronic device 100.
6 are please referred to Fig.1, the first sub- top surface 671 of the above embodiment offers loophole 676, proximity sensor 51
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and transmit
Onto proximity sensor 51.The proximity sensor 51 of present embodiment is arranged in camera case 67, make proximity sensor 51 with
The structure of camera case 67 is more stablized and convenient for proximity sensor 51 and imaging modules 60 is installed on casing 20.
7 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, proximity sensor 51 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image
Sensor 65 is arranged on substrate 66, and proximity sensor 51 may be also secured on substrate 66 and be housed in camera case 67.
Specifically, FPC is provided on substrate 66, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, another
End can be connect with the mainboard of electronic device 100.In other embodiments, proximity sensor 51 can also be connect with FPC.
The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and camera case 67
Structure more stablize and convenient for proximity sensor 51 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60
Proximity sensor 51 is simultaneously arranged on substrate 66 by setting substrate 66, and proximity sensor 51 is enable to be firmly mounted to camera shell
In body 67.
8 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds
Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677
678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread
Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with
With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677
Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle.
Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two
A light extraction through-hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through-holes 674
Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions
Through-hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68,
Light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens module 68 and be transmitted on imaging sensor 65.This reality
It applies in mode, imaging modules 60 can be visible image capturing head 61, and two camera lens modules 68 are visible image capturing head 61 at this time
Corresponding camera lens module.Proximity sensor 51 is arranged on the second tread 678 and outside camera case 67.In other embodiment party
In formula, imaging modules 60 can be infrared pick-up head 62, and two camera lens modules 68 are that infrared pick-up head 62 corresponds at this time
Camera lens module.In yet another embodiment, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, at this time
Wherein camera lens module 68 is 62 corresponding camera lens module of infrared pick-up head, another camera lens module 68 is visible image capturing head 61
Corresponding camera lens module.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 51 is arranged on the second tread
On 678, proximity sensor 51 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves
Installation space in electronic device 100.
9 are please referred to Fig.1, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670
On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread
The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through-holes 674 are opened in the first son respectively
On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675
Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face
679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678,
Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second
Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first
The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment
In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second
Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in
The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating proximity sensor 51 is arranged on the second tread
On 678.
8 and Figure 19 is please referred to Fig.1, in some embodiments, the proximity sensor 51 of the above embodiment is arranged on
On two treads 678 and positioned at the outside of camera case 67.Specifically, when notch 675 is opened in the marginal position of top surface 670,
Entire proximity sensor 51 can be located in the second tread 678 (as shown in figure 18) along perpendicular to the projection of the second tread 678；
Alternatively, part proximity sensor 51 is located at along the projection perpendicular to the second tread 678 in the second tread 678.It is that is, close
At least part of surface for being located at the second tread 678 of sensor 51.When notch 675 is opened in the centre position of top surface 670
When upper, entire proximity sensor 51 can be located at (such as Figure 19 in the second tread 678 along perpendicular to the projection of the second tread 678
It is shown).In this way, proximity sensor 51 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, into
One step has saved the installation space in electronic device 100.
Figure 20 is please referred to, the second tread 678 of the above embodiment offers loophole 676, and proximity sensor 51 is located at
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be transmitted to
On proximity sensor 51.The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and phase
The structure of casing body 67 is more stablized and convenient for proximity sensor 51 and imaging modules 60 is installed on casing 20.
Figure 21 is please referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676,
Proximity sensor 51 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image sensing
Device 65 is arranged on substrate 66, and proximity sensor 51 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connect with the mainboard with electronic device 100.
The proximity sensor 51 of present embodiment is arranged in camera case 67, makes proximity sensor 51 and camera case 67
Structure more stablize and convenient for proximity sensor 51 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60
Proximity sensor 51 is simultaneously arranged on substrate 66 by setting substrate 66, and proximity sensor 51 is enable to be firmly mounted to camera shell
In body 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (13)
1. a kind of electronic device, which is characterized in that including：
Casing；
Export module, it is described output module installation on the housing, it is described output module include encapsulating housing, infrared lamp and
Light-guide device, the encapsulating housing include package substrate, and the infrared lamp and the light-guide device are encapsulated in the encapsulating housing
Interior, on the package substrate, the light-guide device can be movably arranged at the hair of the infrared lamp for the infrared lamp carrying
In light light path, when the light-guide device is located in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the first field angle from the encapsulating housing using as infrared light compensating lamp or close to infrared lamp；When the light-guide device leaves
When in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting is gone out with the second field angle from the encapsulating housing
It penetrates using as close to infrared lamp or infrared light compensating lamp；
Display screen, on the housing, the display screen is formed with light transmission entity area and including that can show for the display screen setting
Show the front of picture and the back side opposite with the front；And
Optical flame detector, the optical flame detector are arranged on the side where the back side of the display screen, the optical flame detector with it is described
Light entity area corresponds to, and the optical flame detector is used to receive the light being incident on the optical flame detector and the target light for exporting the light
By force.
2. electronic device according to claim 1, which is characterized in that
The light-guide device includes convex lens or the lens group with positive light coke, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted from the encapsulating housing using as connecing with the first field angle
Near-infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing using as infrared light compensating lamp；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted from the encapsulating housing using as red with the first field angle
Outer light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing using as close to infrared lamp.
3. electronic device according to claim 1, which is characterized in that the output module further includes chip, described infrared
Lamp is formed on the chip.
4. electronic device according to claim 3, which is characterized in that the encapsulating housing further includes package wall and encapsulation
Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute
It states encapsulation top and is formed with luminescence window, the luminescence window is corresponding with the infrared lamp.
5. electronic device according to claim 1, which is characterized in that the output module is further included to be made of translucent material
Optics sealing cover, the optics sealing cover formed on the package substrate and in the encapsulating housing, the optics sealing cover
Wrap the infrared lamp.
6. electronic device according to claim 1, which is characterized in that the electronic device further includes the cover board of light transmission, institute
It states casing and offers casing through-hole, the infrared lamp is corresponding with the casing through-hole, and the cover board setting is on the housing.
7. electronic device according to claim 1, which is characterized in that the electronic device further includes the cover board of light transmission, institute
It states casing and offers casing through-hole, the infrared lamp is corresponding with the casing through-hole, and the cover board is set on the housing, institute
It states cover board and is formed with the surface that the casing is combined and only transmit the infrared through ink of infrared light, it is described infrared to be hidden through ink
Keep off the casing through-hole.
8. electronic device according to claim 1, which is characterized in that the electronic device further include proximity sensor and into
As module, the imaging modules include microscope base, the lens barrel on the microscope base and the image biography being housed in the microscope base
Sensor, the microscope base include the mounting surface between the lens barrel and described image sensor, the proximity sensor setting
On the mounting surface.
9. electronic device according to claim 1, which is characterized in that the electronic device further include proximity sensor and into
As module, the imaging modules include camera case and camera lens module, and the top surface of the camera case is for cascaded surface and including phase
The first sub- top surface and the second sub- top surface even, the relatively described first sub- top surface inclination in the second sub- top surface and with the described first son
Top surface forms notch, and the top surface offers light extraction through-hole, the camera lens module be housed in the camera case and with it is described
Light extraction through-hole corresponds to；The proximity sensor is arranged at the described first sub- top surface；Or
The electronic device further includes proximity sensor and imaging modules, and the imaging modules include camera case and two camera lenses
Module offers notch on the top surface of the camera case to form step-like top surface, the top surface include the first tread and
It less than the second tread of first tread, is opened up on first tread there are two through-hole, each through-hole and the mirror
Head mould group corresponds to；The proximity sensor is arranged at second tread.
10. electronic device according to claim 1, which is characterized in that the electronic device further include proximity sensor and
Imaging modules, the imaging modules include microscope base, the lens barrel on the microscope base and part and are arranged in the microscope base
Substrate；The proximity sensor setting is on the substrate.
11. electronic device according to claim 1, which is characterized in that the transparent area includes light transmission entity area, described
Light entity area includes image pixel, and the electronic device further includes processor, and the optical flame detector receives the light to export packet
Include the initial beam intensity of the environmental light intensity information of the external electronic device；The processor is used to handle the initial beam intensity to obtain
The target light intensity of the environmental light intensity information of the external electronic device must be only included.
12. electronic device as claimed in claim 11, which is characterized in that the initial beam intensity includes the environmental light intensity information
And the display intensity signal of display screen when showing image, the processor show image for obtaining the display screen in real time
When display intensity signal, and remove when handling the initial beam intensity display intensity signal to obtain the target light
By force.
13. electronic device as described in claim 1, which is characterized in that the transparent area includes light transmission entity area, the light transmission
Entity area does not include image pixel and is surrounded by multiple images pixel.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711437254.XA CN108156286B (en) | 2017-12-26 | 2017-12-26 | Electronic device |
| PCT/CN2018/118683 WO2019128625A1 (en) | 2017-12-26 | 2018-11-30 | Output module, input and output module and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711437254.XA CN108156286B (en) | 2017-12-26 | 2017-12-26 | Electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN108156286A true CN108156286A (en) | 2018-06-12 |
| CN108156286B CN108156286B (en) | 2020-12-18 |
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| CN201711437254.XA Expired - Fee Related CN108156286B (en) | 2017-12-26 | 2017-12-26 | Electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109510928A (en) * | 2018-11-16 | 2019-03-22 | 维沃移动通信有限公司 | Mobile terminal |
| WO2019128625A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic apparatus |
| WO2020199894A1 (en) * | 2019-03-29 | 2020-10-08 | Oppo广东移动通信有限公司 | Electronic device and control method for electronic device |
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| US20130038535A1 (en) * | 2011-08-12 | 2013-02-14 | Pixart Imaging Inc. | Optical pointing device |
| CN107480589A (en) * | 2017-07-07 | 2017-12-15 | 广东欧珀移动通信有限公司 | Infrared light supply component and electronic installation |
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| US20130038535A1 (en) * | 2011-08-12 | 2013-02-14 | Pixart Imaging Inc. | Optical pointing device |
| CN107480589A (en) * | 2017-07-07 | 2017-12-15 | 广东欧珀移动通信有限公司 | Infrared light supply component and electronic installation |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2019128625A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic apparatus |
| CN109510928A (en) * | 2018-11-16 | 2019-03-22 | 维沃移动通信有限公司 | Mobile terminal |
| WO2020199894A1 (en) * | 2019-03-29 | 2020-10-08 | Oppo广东移动通信有限公司 | Electronic device and control method for electronic device |
| CN111756890A (en) * | 2019-03-29 | 2020-10-09 | Oppo广东移动通信有限公司 | Electronic device and control method of electronic device |
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