WO2019128625A1

WO2019128625A1 - Output module, input and output module and electronic apparatus

Info

Publication number: WO2019128625A1
Application number: PCT/CN2018/118683
Authority: WO
Inventors: 吴安平
Original assignee: Oppo广东移动通信有限公司
Priority date: 2017-12-26
Filing date: 2018-11-30
Publication date: 2019-07-04

Abstract

An output module (10). The output module (10) comprises an encapsulating housing (11), an infrared lamp (12) and a light guide element (13). The encapsulating housing (11) comprises an encapsulating substrate (111). The infrared lamp (12) and the light guide element (13) are encapsulated within the encapsulating housing (11). The infrared lamp (12) is borne on the encapsulating substrate (111). The light guide element (13) can be movably arranged on a light emission path of the infrared lamp (12). When the light guide element (13) is located on the light emission path of the infrared lamp (12), infrared light rays emitted by the infrared lamp (12) exit the encapsulating housing (11) in a first field of view to serve as an infrared supplementation lamp or a proximity infrared lamp; and when the light guide element (13) is away from the light emission path of the infrared lamp (12), infrared light rays emitted by the infrared lamp (12) exit the encapsulating housing (11) in a second field of view to serve as a proximity infrared lamp or an infrared supplementation lamp.

Description

Output module, input and output module and electronic device

Priority information

This application claims the priority and benefit of the patent application filed on December 26, 2017, to the Chinese National Intellectual Property Office, and the patent application numbers are 201711433098.X, 201711433363.4, 201711437254.X, 201711433355.X, 201711437148.1, and 201711433362.X, and The full text is incorporated herein by reference.

Technical field

The present disclosure relates to the field of consumer electronics, and in particular, to an output module, an input/output module, and an electronic device.

Background technique

As the functions supported by mobile phones become more and more diverse, the types and number of functional devices that mobile phones need to be set are also increasing. In order to realize functions such as distance detection, ambient light detection and facial 3D feature recognition of users, it is necessary to use electronic devices. In the middle of the configuration of proximity sensors, ambient light sensors, infrared light cameras, structured light projectors and other functional devices, in order to arrange a large number of functional devices, it will take up too much space on the phone.

Summary of the invention

Embodiments of the present invention provide an output module, an input and output module, and an electronic device.

The output module of the embodiment of the present invention includes a package housing, an infrared lamp, and a light guiding component, the package housing includes a package substrate, and the infrared lamp and the light guiding component are encapsulated in the package housing, An infrared lamp is carried on the package substrate, the light guiding element is movably disposed on a light emitting path of the infrared lamp, and when the light guiding element is located on a light emitting path of the infrared lamp, the infrared lamp The emitted infrared light exits the package housing at a first angle of view as an infrared fill light or an near infrared light; the infrared light emits when the light guiding element leaves the light emitting path of the infrared light The infrared light exits the package housing at a second field of view as a near infrared light or an infrared fill light.

An electronic device according to an embodiment of the present invention includes a casing and an output module of the above embodiment, and the output module is disposed in the casing.

In the output module and the electronic device according to the embodiment of the present invention, by moving the position of the light guiding component, the output module can be used as a near-infrared lamp or an infrared fill lamp, and the infrared light is collected to be infrared ranging and infrared filling. The function. Secondly, compared with the current electronic device, the near-infrared lamp and the infrared fill lamp need to be disposed at the same time, the output module of the embodiment of the invention only needs to set an infrared lamp, and the volume is small, thereby saving infrared light and infrared. The space for the ranging function. Furthermore, since only one infrared lamp needs to be disposed on the package substrate for packaging, the infrared fill light and the near-infrared lamp of the conventional process need to be separately assembled by different wafers and assembled onto the PCB substrate, thereby improving the package. effectiveness.

An electronic device according to an embodiment of the present invention includes a casing, an output module, a vibration module, and a piezoelectric element. The output module is disposed in the casing, the output module includes a package housing, an infrared lamp, and a light guiding component, the package housing includes a package substrate, the infrared lamp and the light guiding component Encapsulating in the package housing, the infrared lamp is carried on the package substrate, the light guiding element is movably disposed on a light emitting path of the infrared lamp, and the light guiding element is located in the infrared light When the illuminating light path is on, the infrared light emitted by the infrared lamp is emitted from the package housing at a first angle of view as an infrared fill light or a near infrared light; when the light guiding element leaves the infrared light When the light is on the light path, the infrared light emitted by the infrared light is emitted from the package housing at a second angle of view as a near infrared light or an infrared fill light; the vibration module is mounted on the casing; The piezoelectric element is coupled to the vibration module and spaced apart from the output module, and the piezoelectric element is configured to deform when an electrical signal is applied to vibrate the vibration module.

An electronic device according to an embodiment of the present invention includes a casing, an output module, a display screen, and a light sensor. The output module is mounted on the casing, the output module includes a package housing, an infrared lamp, and a light guiding component, the package housing includes a package substrate, the infrared lamp and the light guiding component Encapsulating in the package housing, the infrared lamp is carried on the package substrate, the light guiding element is movably disposed on a light emitting path of the infrared lamp, and the light guiding element is located in the infrared light When the illuminating light path is on, the infrared light emitted by the infrared lamp is emitted from the package housing at a first angle of view as an infrared fill light or a near infrared light; when the light guiding element leaves the infrared light When the light path is illuminated, the infrared light emitted by the infrared light is emitted from the package housing at a second angle of view as a proximity infrared light or an infrared fill light; the display screen is disposed on the casing. The display screen is formed with a light transmissive physical area and includes a front surface capable of displaying a picture and a back surface opposite to the front surface; the light sensor is disposed on a side of the display screen on which the back side is located, the light sense And the light transmissive physical zone pair Preferably, the light sensor is configured to receive light incident on the light sensor and output a target light intensity of the light.

An input/output module according to an embodiment of the present invention includes a package housing, an infrared lamp, a light guiding element, and a proximity sensor, the package housing includes a package substrate, the infrared lamp, the light guiding element, and the proximity sensor Each of the infrared lamp and the proximity sensor are carried on the package substrate, and the light guiding element is movably disposed on a light emitting path of the infrared lamp, when the guiding When the light element is located on the light emitting path of the infrared lamp, the infrared light emitted by the infrared light is emitted from the package housing at a first angle of view as an infrared fill light or a near infrared light; when the light guide When the component leaves the illuminating light path of the infrared lamp, the infrared ray emitted by the infrared lamp exits the package housing at a second angle of view as a proximity infrared lamp or an infrared fill light; the proximity sensor is used for The infrared light reflected by the object is received to detect the distance of the object.

An electronic device according to an embodiment of the present invention includes a casing and an input/output module of the above embodiment, and the input/output module is disposed in the casing.

An input/output module according to an embodiment of the present invention includes a package housing, an infrared lamp, a light guiding component, and a light sensor, the package housing includes a package substrate, the infrared lamp, the light guiding component, and the light The sensor is packaged in the package housing, and the infrared lamp and the light sensor are respectively carried on the package substrate, and the light guiding element is movably disposed on the light emitting path of the infrared lamp. When the light guiding element is located on the light emitting path of the infrared lamp, the infrared light emitted by the infrared lamp is emitted from the package housing at a first angle of view as an infrared fill light or a near infrared light; When the light guiding element leaves the light emitting path of the infrared lamp, the infrared light emitted by the infrared light is emitted from the package housing at a second angle of view as a near infrared light or an infrared fill light; The sensor is for receiving visible light in ambient light and detecting the intensity of the visible light.

An input/output module according to an embodiment of the present invention includes a package housing, an infrared lamp, a light guiding component, a proximity sensor, and a light sensor, the package housing includes a package substrate, the infrared lamp, the light guiding component, and the The proximity sensor and the light sensor are all packaged in the package housing, and the infrared lamp, the proximity sensor and the light sensor are all carried on the package substrate, and the light guiding element is movable Provided on the illuminating light path of the infrared lamp, when the light guiding element is located on the illuminating light path of the infrared lamp, the infrared ray emitted by the infrared lamp is emitted from the package housing at a first angle of view As an infrared fill light or a near infrared light; when the light guiding element leaves the light emitting path of the infrared light, the infrared light emitted by the infrared light is emitted from the package housing at a second angle of view as Proximity to an infrared lamp or an infrared fill light; the proximity sensor is configured to receive infrared light emitted by the infrared light as a proximity infrared light reflected by the object to detect the distance from the object to the input/output module ; Said light sensor for receiving visible ambient light, and detecting the intensity of visible light.

The additional aspects and advantages of the embodiments of the present invention will be set forth in part in the description which follows.

DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from

1 is a schematic structural view of an electronic device according to an embodiment of the present invention;

2 is a perspective view of an output module of an electronic device according to an embodiment of the present invention;

3 to FIG. 4 are schematic diagrams showing states of an output module of an electronic device according to an embodiment of the present invention;

5 to FIG. 7 are schematic cross-sectional views showing an output module of an electronic device according to an embodiment of the present invention;

8 is a perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention;

9 is a schematic view showing the arrangement of electronic components of an electronic device according to an embodiment of the present invention;

10 is a schematic cross-sectional view showing an output module of an electronic device according to an embodiment of the present invention;

11 is a perspective view of a proximity sensor and an imaging module according to an embodiment of the present invention;

12 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

13 is a partial cross-sectional view showing an electronic device according to an embodiment of the present invention;

14 is a perspective view of a receiving module and an imaging module according to an embodiment of the present invention;

15 to 22 are schematic perspective views of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention.

23 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

Figure 24 is a cross-sectional view of the electronic device of Figure 23 taken along line A-A;

Figure 25 is a partial cross-sectional view of the electronic device of Figure 23 taken along line B-B;

26 is a schematic view showing the arrangement of electronic components of an electronic device according to an embodiment of the present invention;

FIG. 27 is a schematic structural diagram of an electronic device according to an embodiment of the present invention; FIG.

28 to 29 are schematic diagrams showing the arrangement of electronic components of an electronic device according to an embodiment of the present invention;

30 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

Figure 31 is a partial cross-sectional view of the electronic device of Figure 30 taken along line C-C;

32 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

Figure 33 is a cross-sectional view taken along line D-D of the electronic device of Figure 32;

FIG. 34 is a schematic structural diagram of an electronic device according to some embodiments of the present invention; FIG.

35 to 42 are perspective views of a proximity sensor and an imaging module of an electronic device according to some embodiments of the present invention;

43 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

44 is a perspective view of an input/output module of an electronic device according to some embodiments of the present invention;

45 is a schematic diagram showing states of an input/output module of an electronic device according to some embodiments of the present invention;

FIG. 46 is a schematic diagram of a state of an input/output module of an electronic device according to some embodiments of the present invention; FIG.

47 is a schematic cross-sectional view showing an input/output module of an electronic device according to some embodiments of the present invention;

48 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the present invention;

49 is a partial perspective view of an input/output module of an electronic device according to some embodiments of the present invention;

50 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the present invention;

51 is a perspective view of a photosensor and an imaging module of an electronic device according to some embodiments of the present invention;

52 is a schematic diagram showing the arrangement of electronic components of an electronic device according to some embodiments of the present invention;

53 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the present invention;

FIG. 54 is a schematic structural diagram of an electronic device according to some embodiments of the present invention; FIG.

55 is a partial cross-sectional view of an electronic device according to some embodiments of the present invention;

Figure 56 is a partial cross-sectional view showing an electronic device according to some embodiments of the present invention;

57 to FIG. 64 are perspective views of a photosensor and an imaging module of an electronic device according to some embodiments of the present invention.

65 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

66 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

67 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

68 is a perspective view of an input/output module of an electronic device according to some embodiments of the present invention;

69 to FIG. 70 are schematic diagrams showing states of an input/output module of an electronic device according to some embodiments of the present invention;

71 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the present invention;

72 is a cross-sectional view showing an input/output module of an electronic device according to some embodiments of the present invention;

73 is a partial perspective view of an input/output module of an electronic device according to some embodiments of the present invention;

74 is a partial cross-sectional view of an electronic device according to some embodiments of the present invention;

75 is a schematic cross-sectional view showing an input/output module of an electronic device according to some embodiments of the present invention;

76 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

77-79 are partial cross-sectional views of an electronic device in accordance with some embodiments of the present invention.

Detailed ways

Embodiments of the present invention will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings denote the same or similar elements or elements having the same or similar functions.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are merely illustrative of the embodiments of the invention, and are not to be construed as limiting.

In the present invention, the first feature "on" or "under" the second feature may be a direct contact of the first and second features, or the first and second features may be indirectly through an intermediate medium, unless otherwise explicitly stated and defined. contact. Moreover, the first feature "above", "above" and "above" the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.

Embodiment 1:

Referring to FIG. 1 , an electronic device 100 according to an embodiment of the present invention includes a casing 20 , a cover 30 , and electronic components. The electronic components include an output module 10, a receiving module 50 (Fig. 8), an imaging module 60 (Fig. 8), a receiver 70, and a structured light projector 80. The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc. The embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here.

Referring to FIG. 2 to FIG. 4 , the output module 10 is a single package structure, including a package housing 11 , an infrared lamp 12 , and a light guiding component 13 .

The package housing 11 is used to simultaneously package the infrared lamp 12 and the light guiding element 13, or the infrared lamp 12 and the light guiding element 13 are simultaneously packaged in the package housing 11. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an electromagnetic interference (EMI) shielding material to prevent external electromagnetic interference from affecting the output module 10.

Referring to FIG. 5, the package substrate 111 is used to carry the infrared lamp 12. When the output module 10 is manufactured, the infrared lamp 12 can be formed on the chip 14, and the infrared lamp 12 and the chip 14 are disposed on the package substrate 111. Specifically, the chip 14 can be bonded to the package substrate 111. At the same time, the package substrate 111 can also be used to connect with other components of the electronic device 100 (for example, the casing 20 of the electronic device 100, the motherboard, etc.) to fix the output module 10 in the electronic device 100.

The package sidewall 112 can be disposed around the infrared lamp 12 and the light guiding component 13. The package sidewall 112 extends from the package substrate 111, and the package sidewall 112 can be combined with the package substrate 111. Preferably, the package sidewall 112 and the package substrate 111 are The infrared lamp 12 is detachably connected to facilitate inspection of the infrared lamp 12 after the package side wall 112 is removed. The material of the package sidewall 112 may be a material that is not transparent to infrared light to prevent infrared light emitted by the infrared lamp 12 from passing through the package sidewall 112.

The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. The package top 113 is formed with a light-emitting window 1131, and the light-emitting window 1131 corresponds to the infrared light 12, and the infrared light emitted by the infrared light 12 passes through the light-emitting window 1131. The package top 113 and the package sidewalls 112 may be integrally formed or may be separately formed. In one example, the light-emitting window 1131 is a through-hole, and the material of the package top 113 is made of a material that is impermeable to infrared light. In another example, the package top portion 113 is made of a material that is not transparent to infrared light and a material that transmits infrared light. Specifically, the light-emitting window 1131 is made of a material that transmits infrared light, and the rest is made of infrared-impermeable light. The material is made. Further, the light-emitting window 1131 may be formed with a lens structure to improve the infrared light emission angle emitted from the light-emitting window 1131. For example, the light-emitting window 1131 is formed with a concave lens structure to diverge the light passing through the light-emitting window 1131. The light-emitting window 1131 is formed with a convex lens structure so that the light passing through the light-emitting window 1131 is gathered and emitted outward.

The light guiding element 13 is movably disposed on the light emitting path of the infrared lamp 12. Referring to FIGS. 5 and 6, the output module 10 further includes a driving member 17 for driving the light guiding member 13 to be movably disposed on the light emitting path of the infrared lamp 12. The driving member 17 driving the light guiding element 13 to be movably disposed on the light emitting path of the infrared lamp 12 includes: in a normal state, the light guiding element 13 is disposed on the light emitting path of the infrared lamp 12, and the infrared lamp 12 is used as the infrared light. a fill light (or near infrared light), when the infrared light 12 is used as a proximity infrared light (or an infrared fill light), the driving member 17 drives the light guiding element 13 to move away from the light emitting path of the infrared light 12; or, under normal conditions, The light guiding element 13 is not disposed on the light emitting path of the infrared lamp 12, the infrared lamp 12 is used as the near infrared light (or infrared fill light), and when the infrared light 12 is used as the infrared fill light (or near the infrared light), the driving member The 17 driving light guiding element 13 is moved to the light emitting path of the infrared lamp 12.

Referring to FIG. 5, the driving member 17 includes a linear motor including a stator 172 and a mover 174. The stator 172 is mounted on the package sidewall 112, the mover 174 is coupled to the light guiding member 13, and the driving member 17 drives the mover 174 to move. The light guiding element 13 is driven to move. Referring to FIG. 6 , the structure of the driving component 17 can be replaced by: the driving component 17 includes a linear motor, the linear motor includes a stator 172 and a mover 174 , the stator 172 is mounted on the package sidewall 112 , and the output module 10 further includes a rotating shaft 18 . And the connecting arm 19, the first end of the connecting arm 19 is connected to the light guiding element 13, the mover 174 is connected with the second end of the connecting arm 19 away from the light guiding element 13, and the connecting arm 19 is sleeved on the rotating shaft 18, and the rotating shaft 18 is located Between the light guiding element 13 and the mover 174, the mover 174 of the linear motor drives the second end of the connecting arm 19 to move, and the connecting arm 19 rotates about the rotating shaft 18, whereby the first end of the connecting arm 19 drives the light guiding element 13 is rotated about the rotating shaft 18 to realize that the light guiding element 13 is on the illuminating light path of the infrared lamp 12 or away from the illuminating light path of the infrared lamp 12. In the embodiment of the present invention, the output module 10 may further include a carrying board (not shown). The carrying board is provided with a bearing hole, the light guiding element 13 is installed in the carrying hole, and the driving component 17 is used to drive the carrying board. To drive the light guiding element 13 to move.

Referring to FIG. 3, when the light guiding element 13 is located on the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 passes through the light guiding element 13, and the first field of view angle is removed from the package by the light guiding element 13. The body 11 is emitted as a proximity infrared lamp; when the light guiding element 13 leaves the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 is emitted from the package housing 11 at a second angle of view as an infrared fill light. At this time, the first field of view angle is smaller than the second field of view angle, wherein the first field of view angle ranges from 10 degrees to 30 degrees, for example, the first field of view angle is 10 degrees, 15 degrees, 20 degrees, 25 degrees. Or 30 degrees, etc., the second field of view angle ranges from 60 degrees to 90 degrees, for example, the second field of view angle is 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 Degree, or 90 degrees, etc. The light guiding element 13 is for concentrating light, and the light guiding element 13 comprises a convex lens or a lens group having positive power, and the lens group may be one or more lenses. In the embodiment of the present invention, the angle of view refers to a range in which infrared light is emitted from the package housing 11 through the light-emitting window 1131.

Referring to FIG. 4, when the light guiding element 13 is located on the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 passes through the light guiding element 13, and the first field of view angle is removed from the package by the light guiding element 13. The body 11 is emitted as an infrared fill light; when the light guiding element 13 leaves the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 is emitted from the package housing 11 at a second angle of view as a near infrared light. At this time, the first field of view angle is greater than the second field of view angle, wherein the first field of view angle ranges from 60 degrees to 90 degrees, for example, the first field of view angle is 60 degrees, 65 degrees, 70 degrees, 75 degrees. , 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees, etc., the second field of view angle ranges from 10 degrees to 30 degrees, for example, the second field of view angle is 10 degrees, 15 degrees, 20 degrees, 25 Degree, or 30 degrees, etc. The light guiding element 13 is for diverging light, and the light guiding element 13 comprises a concave lens or a lens group having a negative refractive power, and the lens group may be one or more lenses. In the embodiment of the present invention, the angle of view refers to a range in which infrared light is emitted from the package housing 11 through the light-emitting window 1131.

When the infrared lamp 12 is turned on and used as an infrared fill light to emit infrared light to the outside of the package housing 11, the infrared light passes through the illumination window 1131 to be projected onto the surface of the object, and the infrared light camera 62 of the electronic device 100 (shown in FIG. 1) receives The infrared light reflected by the object acquires image information of the object (at this time, the infrared lamp 12 is used for infrared fill light). When the infrared lamp 12 is turned on and used as a near-infrared light to emit infrared light to the outside of the package housing 11, the infrared light passes through the light-emitting window 1131 and reaches the surface of the object, and the proximity sensor 51 of the electronic device 100 (shown in FIG. 8) receives the object reflected. The infrared light is used to detect the distance of the object to the electronic device 100 (at this time, the infrared lamp 12 is used for infrared ranging).

When the infrared lamp 12 is used as an infrared fill lamp and when used as a near-infrared lamp, infrared light can be emitted to the outside of the package casing 11 at different powers. Specifically, when the infrared lamp 12 is used as the near-infrared lamp, the infrared light is emitted to the outside of the package housing 11 at the first power, and when the infrared lamp 12 is used as the infrared fill lamp, the infrared light is emitted to the outside of the package housing 11 with the second power. The first power may be less than the second power.

Referring to FIG. 1 and FIG. 7 , the casing 20 can be used as a mounting carrier for the output module 10 , or the output module 10 can be disposed in the casing 20 . The casing 20 may be an outer casing of the electronic device 100. In the embodiment of the present invention, the display 20 of the electronic device 100 may be disposed in the casing 20. The output module 10 of the embodiment of the present invention occupies a small volume. Therefore, the volume for setting the display screen 90 in the casing 20 can be correspondingly increased to increase the screen ratio of the electronic device 100. Specifically, the casing 20 includes a top portion 21 and a bottom portion 22. The display screen 90 and the output module 10 are disposed between the top portion 21 and the bottom portion 22. The top portion 21 is located above the bottom portion 22 in a state where the user normally uses the electronic device 100. As shown in FIG. 1, the output module 10 can be disposed between the display screen 90 and the top portion 21. In other embodiments, the display screen 90 can be provided with a gap for the full screen, the display screen 90 surrounds the output module 10, and the output module 10 is exposed from the gap of the display screen 90.

The casing 20 also has an organic casing through hole 23. When the output module 10 is disposed in the casing 20, the infrared lamp 12 corresponds to the casing through hole 23. The infrared lamp 12 and the through hole 23 of the casing correspond to the light emitted by the infrared lamp 12 and can pass through the through hole 23 of the casing. Specifically, the infrared lamp 12 can be directly opposite to the through hole 23 of the casing, or can be an infrared lamp. The emitted light of 12 passes through the casing through hole 23 after being acted upon by the light guiding element 13.

The cover plate 30 may be light transmissive, and the material of the cover plate 30 may be light transmissive glass, resin, plastic or the like. The cover plate 30 is disposed on the casing 20, and the cover plate 30 includes an inner surface 32 coupled to the casing 20, and an outer surface 31 opposite the inner surface 32. The light emitted by the output module 10 sequentially passes through the inner surface 32 and The outer surface 31 is then passed through the cover 30. In the embodiment shown in FIG. 7, the cover plate 30 covers the through hole 23 of the casing, and the inner surface 32 of the cover plate 30 is coated with infrared ray transmitting ink 40, and the infrared ray transmitting ink 40 has a high infrared light. The transmittance can be, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user can hardly see the infrared light transmitting ink on the electronic device 100 in normal use. Covered area. In particular, the infrared permeable ink 40 can cover an area of the inner surface 32 that does not correspond to the display screen 90.

The infrared transmission ink 40 can also block the through hole 23 of the casing (as shown in FIG. 7 ). It is difficult for the user to see the internal structure of the electronic device 100 through the through hole 23 of the casing, and the electronic device 100 has a beautiful appearance.

Referring to FIG. 8, the receiving module 50 is integrated with a proximity sensor 51 and a photo sensor 52. The proximity sensor 51 and the photo sensor 52 together form a single package structure. The infrared light 12 is used as an infrared light emitted outwardly when the infrared light is emitted. After being reflected by an external object, the infrared light is received by the proximity sensor 51. The proximity sensor 51 determines the relationship between the external object and the electronic device 100 according to the received reflected infrared light. distance. The light sensor 52 receives visible light in the ambient light and detects the intensity of the visible light as a basis for controlling the display brightness of the display screen 90. The proximity sensor 51 and the photo sensor 52 are collectively packaged into the receiving module 50 to reduce the gap between the two when the components are separately assembled, thereby saving the installation space in the electronic device 100.

Referring to FIGS. 1 and 8 , the imaging module 60 may be one or both of a visible light camera 61 and an infrared light camera 62 . The imaging module 60 includes a lens holder 63, a lens barrel 64, and an image sensor 65. The lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63. The mirror holder 63 includes a mounting surface 631 between the lens barrel 64 and the image sensor 65. In the embodiment shown in FIG. 8 , the receiving module 50 is disposed on the mounting surface 631 . Specifically, the orthographic projection of the receiving module 50 on the plane where the mounting surface 631 is located at least partially falls onto the mounting surface 631 . The receiving module 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small.

Referring to FIG. 1, the receiver 70 is configured to emit an acoustic signal when excited by a power source, and the user can make a call through the receiver 70. The structured light projector 80 is configured to emit structured light outwardly, and the structured light is reflected onto the object to be measured and then reflected. The reflected structured light can be received by the infrared light camera 62, and the processor of the electronic device 100 further analyzes the infrared light camera 62. Receive structured light to obtain depth information of the measured object.

In the embodiment shown in FIG. 1, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The center of the output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70, and the structured light projector 80 are located. On the same line segment. Specifically, from one end of the line segment to the other end, the output module 10, the structured light projector 80, the receiver 70, the infrared light camera 62, and the visible light camera 61 (shown in FIG. 9); or from one end of the line segment to the other end In order, the output module 10, the infrared light camera 62, the receiver 70, the visible light camera 61, the structured light projector 80 (shown in FIG. 1); or the infrared light camera 62 and the output module from one end to the other end of the line segment. 10. The receiver 70, the visible light camera 61, and the structured light projector 80; or from one end of the line segment to the other end, the infrared light camera 62, the visible light camera 61, the receiver 70, the output module 10, and the structured light projector 80. Of course, the arrangement of the output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in a circular arc shape. The center is arranged in a shape such as a rectangle.

Further, the receiving module 50 may be disposed on the mounting surface 631 of the infrared camera 62 or on the mounting surface 631 of the visible light camera 61. Of course, the receiving module 50 may not be installed. On the surface 631, the receiving module 50 can be disposed adjacent to the output module 10, and the proximity sensor 51 can easily receive the infrared light emitted by the infrared lamp 12 when it is used as an infrared light, and reflected by an external object; the receiving module 50 It is also possible to be disposed adjacent to the receiver 70, and when the user answers the call, the proximity sensor 51 easily detects that the user's ear is close to the receiver 70.

In summary, in the electronic device 100 of the embodiment of the present invention, by moving the position of the light guiding element 13, the output module 10 can be used as a near infrared light or an infrared fill light, and the infrared light is collected for infrared ranging and infrared. Fill light function. The output module 10 of the embodiment of the present invention only needs to be provided with an infrared lamp 12, which is small in size and saves the realization of infrared fill light, as compared with the current electronic device, which requires the proximity of the infrared light and the infrared fill light. And the space for infrared ranging function. Furthermore, since only one infrared lamp 12 needs to be disposed on the package substrate 111 for packaging, compared with the conventional process, the infrared fill lamp and the near-infrared lamp need to be separately fabricated and assembled on the PCB substrate, thereby improving the package. Packaging efficiency.

Referring to FIG. 10, in some embodiments, the output module 10 further includes an optical enclosure 16. The optical enclosure 16 is made of a light transmissive material, and an optical enclosure 16 is formed on the package substrate 111 and within the package housing 11. The optical enclosure 16 encases the infrared lamp 12. Specifically, the optical enclosure 16 can be formed by a potting injection molding process, the optical enclosure 16 can be made of a transparent thermosetting epoxy resin to be less susceptible to softening in use, and the optical enclosure 16 can fix the position of the infrared lamp 12 And the infrared lamp 12 is not easily shaken in the package housing 11. At this time, the light guiding element 13 is disposed outside the optical enclosure 16 and is movably housed in the package casing 11.

Referring to FIG. 11 , in some embodiments, the proximity sensor 51 and the light sensor 52 may not be integrated in the receiving module 50 , or the proximity sensor 51 and the light sensor 52 may be separately disposed. At this time, the proximity sensor 51 may be disposed on the mounting surface 631 of the lens holder 63; the light sensor 52 may also be disposed on the mounting surface 631 of the lens holder 63; or the proximity sensor 51 and the light sensor 52 may be disposed at the mirror holder 63 at the same time. On the mounting surface 631. The mirror mount 63 may be the mirror mount 63 of the infrared light camera 62 or the mirror mount 63 of the visible light camera 61.

Referring to FIG. 12, in some embodiments, the casing 20 further has an organic sound hole (not shown), and the cover 30 is further provided with a cover sound hole 34, and the receiver 70 and the cover sound hole. 34 corresponds to the position of the sound hole of the case. The centers of the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20.

The center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (the output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover 30. In the embodiment shown in FIG. 12, the cover sound hole 34 is opened at the edge of the cover 30, and the sound hole of the casing is opened near the top 21.

Referring to FIG. 13 again, in some embodiments, the cover plate 30 can also be provided with a cover through hole 33. The cover through hole 33 corresponds to the through hole 23 of the casing, and the infrared light emitted by the infrared lamp 12 passes through the machine. After the case through hole 23, the electronic device 100 can be passed through the cover through hole 33.

Referring to FIG. 14 , in some embodiments, the imaging module 60 further includes a substrate 66 . The image sensor 65 is disposed on the substrate 66 , and the receiving module 50 can also be fixed on the substrate 66 . Specifically, the substrate 66 is provided with an FPC. A part of the substrate 66 is located in the lens holder 63, and another part protrudes from the lens holder 63. One end of the FPC is located in the lens holder 63 and is used to carry the image sensor 65, and the other end can be The main board of the electronic device 100 is connected. When the receiving module 50 is disposed on the substrate 66, the receiving module 50 is disposed outside the lens holder 63, and the receiving module 50 can also be connected to the FPC.

Further, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52. The proximity sensor 51 and the light sensor 52 together form a single package structure, which reduces the gap between the two when assembled separately, and saves electrons. The installation space within the device 100. In other embodiments, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 or/and a light sensor 52, each of which is a single package structure. That is, the receiving module 50 disposed on the substrate 66 is a proximity sensor 51 having a single package structure; or the receiving module 50 disposed on the substrate 66 is a single package structure photo sensor 52; or, disposed on the substrate 66 The receiving module 50 is a proximity sensor 51 of a single package structure and a photosensor 52 of a single package structure.

The imaging module 60 can be one or both of the visible light camera 61 and the infrared light camera 62. Specifically, the receiving module 50 can be fixed on the substrate 66 of the visible light camera 61; the receiving module 50 can be fixed on the substrate 66 of the infrared light camera 62. When the proximity sensor 51 and the photo sensor 52 are separately packaged, the proximity sensor 51 may be fixed on the substrate 66 of the visible light camera 61, and the light sensor 52 may be fixed on the substrate 66 of the infrared light camera 62; or, the light sensor 52 may be fixed on the substrate 66 of the visible light camera 61, and the proximity sensor 51 may be fixed on the substrate 66 of the infrared light camera 62; or the proximity sensor 51 and the light sensor 52 may be fixed on the substrate 66 of the visible light camera 61; or Both the proximity sensor 51 and the light sensor 52 are fixed to the substrate 66 of the infrared light camera 62.

Further, the substrate 66 further includes a reinforcing plate disposed on a side opposite to the receiving module 50 to increase the overall strength of the substrate 66, so that the FPC is less likely to be wound, and the receiving module 50 is (or close to) When the sensor 51 or the photo sensor 52) is disposed on the substrate 66, it is less likely to be shaken. In one example, the receiving module 50 (or the proximity sensor 51 or the light sensor 52) may also be attached to the outer sidewall of the mirror mount 63, such as by adhesive bonding to the outer sidewall of the mirror mount 63.

Referring to FIG. 15 , in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiment may be replaced with the following structure: the imaging module 60 includes an image sensor 65 , a camera housing 67 , and a lens module 68 . The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673, and the second sub-top surface 672 and the first sub-top surface The 671 is obliquely connected and forms a slit 675 with the first sub-top surface 671. The third sub-top surface 673 is obliquely connected to the second sub-top surface 672. The second sub-top surface 672 is located at the first sub-top surface 671 and the third sub-top surface. Between the 673, the first sub-top surface 671 and the third sub-top surface 673 are connected. The angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle. The slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670. The third sub-top surface 673 is provided with a light-emitting through hole 674. The lens module 68 is received in the camera housing 67 and corresponds to the light-emitting through hole 674. The image sensor 65 is received in the camera housing 67 and corresponding to the lens module 68. The light outside the electronic device 100 can pass through the light-emitting through-hole 674 and the lens module 68 and be transmitted to the image sensor 65. The image sensor 65 transmits the light signal. Converted to an electrical signal. The receiving module 50 is disposed at the first sub-top surface 671, and the receiving module 50 includes a proximity sensor 51 and a photo sensor 52. In the embodiment, the imaging module 60 may be a visible light camera 61, and the receiving module 50 is a single package structure formed by the proximity sensor 51 and the light sensor 52. The direction in which the proximity sensor 51 and the photosensor 52 are connected may coincide with the extending direction of the slit 675 (as shown in FIG. 15); or, the direction in which the proximity sensor 51 and the photosensor 52 are connected may be extended with the slit 675. The angle formed by the direction perpendicular or both is an acute angle or an obtuse angle. In other embodiments, the imaging module 60 can be an infrared camera 62.

The imaging module 60 of the present embodiment is provided with a slit 675, and the receiving module 50 is disposed on the first sub-top surface 671, so that the receiving module 50 and the imaging module 60 are relatively compact. The space is small, and the installation space in the electronic device 100 is saved. At the same time, the proximity sensor 51 and the light sensor 52 are collectively packaged into the receiving module 50 to reduce the gap between the two when the components are separately assembled, thereby saving the installation space in the electronic device 100.

Referring to FIG. 15 , in some embodiments, the receiving module 50 of the above embodiment is disposed on the first sub-top surface 671 and located outside the camera housing 67 . Specifically, the entire receiving module 50 is perpendicular to The projection of the first sub-top surface 671 may be located in the first sub-top surface 671 (as shown in FIG. 15); or, the partial receiving module 50 is located on the first sub-top surface along the projection perpendicular to the first sub-top surface 671. Within 671. That is to say, at least a part of the receiving module 50 is located directly above the first sub-top surface 671. Thus, the receiving module 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small, further saving The installation space in the electronic device 100. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the photo sensor 52, but the proximity sensor 51 and the photo sensor 52 are two separate single package structures. In this case, the proximity sensor 51 is a single package structure. The photo sensor 52 can also be disposed on the first sub top surface 671.

Referring to FIG. 16 , in some embodiments, the receiving module 50 of the above embodiment includes only the proximity sensor 51 and does not include the light sensor 52 . In this case, the proximity sensor 51 (or the receiving module 50 ) and the light sensor Each of the 52 is a single package structure, the proximity sensor 51 is disposed on the first sub-top surface 671, and the photo sensor 52 is disposed at any other position than the first sub-top surface 671.

Referring to FIG. 16 , in some embodiments, the receiving module 50 of the above embodiment only includes the light sensor 52 , and does not include the proximity sensor 51 . In this case, the light sensor 52 (or the receiving module 50 ) The proximity sensors 51 are each a single package structure, the light sensor 52 is disposed on the first sub top surface 671, and the proximity sensor 51 is disposed at any other position than the first sub top surface 671.

Referring to FIG. 17 , the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Specifically, when the receiving module 50 includes only the proximity sensor 51 and no photo sensor 52, and the photo sensor 52 is disposed outside the camera housing 67, the number of the light transmission holes 676 may be one, and the light outside the electronic device 100 It can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51. The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.

Continuing to refer to 17, the first sub-top surface 671 of the above embodiment is provided with a light transmission hole 676. The receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676. Specifically, when the receiving module 50 includes only the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of the light transmission holes 676 may be one, and the light outside the electronic device 100 It can pass through the light transmission hole 676 and be transmitted to the photosensor 52. The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.

Referring to FIG. 18 , in some embodiments, the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Specifically, when the receiving module 50 is integrated with the proximity sensor 51 and the light sensor 52, the light transmission hole 676 may be a light transmission hole corresponding to both the proximity sensor 51 and the light sensor 52 or two spaced apart and respectively The light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the photo sensor 52, but the proximity sensor 51 and the photo sensor 52 are two separate single package structures. In this case, the proximity sensor 51 is a single package structure. The light sensor 52 may also be disposed in the camera housing 67 and correspond to the light transmission hole 676. The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.

Referring to FIG. 18 , in some embodiments, the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . The imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66. The receiving module 50 can also be fixed on the substrate 66 and housed in the camera housing 67. Specifically, an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100. In other embodiments, the receiving module 50 can also be connected to the FPC. In the embodiment, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52. The proximity sensor 51 and the light sensor 52 together form a single package structure, which reduces the gap between the two when assembled separately. The installation space in the electronic device 100 is saved.

In other embodiments, the receiving module 50 only includes the proximity sensor 51. The light sensor 52 is not integrated in the receiving module 50. That is, the receiving module 50 is a single package structure of the proximity sensor 51. The device 52 is also a single package structure, and the light sensor 52 may be fixed on the substrate 66 and housed in the camera housing 67; or, when a portion of the substrate 66 is located in the camera housing 67 and another portion is from the camera housing 67 When extended, the light sensor 52 can also be attached to the substrate 66 and located outside of the camera housing 67.

In another embodiment, the receiving module 50 only includes the photo sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50. That is, the receiving module 50 is a single package structure of the photo sensor 52. The proximity sensor 51 is also a single package structure, and the proximity sensor 51 may be fixed on the substrate 66 and housed in the camera housing 67; or, when a portion of the substrate 66 is located in the camera housing 67, another portion is from the camera housing 67. The proximity sensor 51 may also be fixed to the substrate 66 and located outside the camera housing 67 when projecting inside.

The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20; The imaging module 60 is provided with a substrate 66 and the receiving module 50 is disposed on the substrate 66 so that the receiving module 50 can be stably mounted in the camera housing 67.

Referring to FIG. 19 , in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiment may be replaced by the following structure: the imaging module 60 is a dual camera module, and includes two image sensors 65 and a camera housing. 67 and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 that is lower than the first step surface 677, and a first connection surface 679a. The first connecting surface 679a is obliquely connected to the second step 678 and forms a slit 675 with the second step 678. The first connecting surface 679a is obliquely connected to the first step 677, and the first connecting surface 679a is located at the first step 677 and The second step 678 is connected between the first step 677 and the second step 678. The angle between the first connecting surface 679a and the first step surface 677 may be an obtuse angle or a right angle, and the angle between the first connecting surface 679a and the second step surface 678 may be an obtuse angle or a right angle. The slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670. The two light-emitting through holes 674 are both formed on the first step surface 677 and are located on the same side of the slit 675. The center lines of the two light-emitting through holes 674 are perpendicular to the extending direction of the slit 675. The two lens modules 68 are respectively received in the camera housing 67 and respectively correspond to the two light-emitting through holes 674. The two image sensors 65 are received in the camera housing 67 and respectively correspond to the two lens modules 68. Light outside 100 can pass through the light through hole 674 and the lens module 68 and be transmitted to the image sensor 65. In this embodiment, the imaging module 60 may be a visible light camera 61. In this case, the two lens modules 68 are lens modules corresponding to the visible light camera 61. The receiving module 50 is disposed on the second step 678 and located outside the camera housing 67. The receiving module 50 is a single package structure formed by the proximity sensor 51 and the photo sensor 52. The direction in which the proximity sensor 51 and the photosensor 52 are connected may coincide with the extending direction of the slit 675; or the direction in which the proximity sensor 51 and the photosensor 52 are connected may be perpendicular to the extending direction of the slit 675 (as shown in FIG. 19). The angle formed by either or both is an acute or obtuse angle. In other embodiments, the imaging module 60 may be an infrared camera 62. In this case, the two lens modules 68 are lens modules corresponding to the infrared camera 62. In another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. One lens module 68 is a lens module corresponding to the infrared light camera 62, and the other lens module 68 is a visible light camera 61. Corresponding lens module.

The imaging module 60 of the present embodiment is provided with a slit 675, and the receiving module 50 is disposed on the second step 678, so that the receiving module 50 and the imaging module 60 are relatively compact, and the horizontal space occupied by the two together The installation space is reduced in the electronic device 100. At the same time, the proximity sensor 51 and the photo sensor 52 are collectively packaged into the receiving module 50, which reduces the gap between the two when the components are separately assembled, thereby saving the installation space in the electronic device 100.

Referring to FIG. 20, in some embodiments, the slit 675 of the above embodiment is disposed at a middle position of the top surface 670, and the first step surface 677 is divided by the slit 675 into the first sub-step surface 677a and the second sub-step surface. 677b, the first sub-surface 677a and the second sub-surface 677b are respectively located on opposite sides of the slit 675, and the two light-emitting through holes 674 are respectively opened on the first sub-surface 677a and the second sub-surface 677b, and are installed on The lens modules 68 within the camera housing 67 are also located on opposite sides of the slit 675. At this time, the slit 675 is surrounded by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b. The first connecting surface 679a is obliquely connected to the first sub-top surface 677a and the second ladder surface 678 and is located at the first sub-surface. Between the top surface 677a and the second step surface 678, the second connecting surface 679b is obliquely connected to the second sub-top surface 677b and the second step surface 678 and located between the second sub-top surface 677b and the second ladder surface 678. In this embodiment, the first step surface 677 is parallel to the second step surface 678, the angle between the first connecting surface 679a and the first sub-surface 677a is an obtuse angle, and the second connecting surface 679b is sandwiched by the second sub-surface 677b. The angle is an obtuse angle. In other embodiments, the angle between the first connecting surface 679a and the first sub-surface 677a is a right angle, and the angle between the second connecting surface 679b and the second sub-surface 677b is a right angle. With respect to the opening of the slit 675 at the edge position of the top surface 670, the slit 675 of the present embodiment is opened at the intermediate position of the top surface 670 to make the width of the slit 675 wider, thereby facilitating the setting of the receiving module 50 on the second surface. 678.

Referring to FIG. 19 and FIG. 20 , in some embodiments, the receiving module 50 of the above embodiment is disposed on the second step 678 and located outside the camera housing 67 . Specifically, when the slit 675 is opened at the edge position of the top surface 670, the projection of the entire receiving module 50 along the second ladder surface 678 may be located in the second ladder surface 678; or, the partial receiving module 50 is vertical. The projection of the second step 678 is located within the second step 678 (as shown in Figure 19). That is, at least a portion of the receiving module 50 is located directly above the second step 678. When the slit 675 is opened in the middle of the top surface 670, the projection of the entire receiving module 50 along the second step 678 can be located in the second step 678 (as shown in FIG. 20). In this way, the receiving module 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small, which further saves the installation space in the electronic device 100. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the photo sensor 52, but the proximity sensor 51 and the photo sensor 52 are two separate single package structures. In this case, the proximity sensor 51 is a single package structure. The photo sensor 52 can also be disposed on the second step 678.

Referring to FIG. 20, in some embodiments, the receiving module 50 of the above embodiment includes only the proximity sensor 51. The receiving module 50 does not include the light sensor 52. At this time, the proximity sensor 51 (or the receiving module 50) The photosensors 52 are each provided in a single package structure, the proximity sensor 51 is disposed on the second step 678, and the photosensor 52 is disposed on the casing 20 outside the imaging module 60.

Referring to FIG. 20, in some embodiments, the receiving module 50 of the above embodiment includes only the light sensor 52, and the receiving module 50 does not include the proximity sensor 51. At this time, the light sensor 52 (or the receiving module) 50) The proximity sensor 51 is each a single package structure, the light sensor 52 is disposed on the second step 678, and the proximity sensor 51 is disposed on the casing 20 outside the imaging module 60.

Referring to FIG. 21 , the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Specifically, when the receiving module 50 includes only the proximity sensor 51 and no photo sensor 52, and the photo sensor 52 is disposed outside the camera housing 67, the number of the light transmission holes 676 may be one, and the light outside the electronic device 100 It can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51. The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.

Referring to FIG. 21 , the second step 678 of the above embodiment is provided with a light transmission hole 676 . The receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Specifically, when the receiving module 50 includes only the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of the light transmission holes 676 may be one, and the light outside the electronic device 100 It can pass through the light transmission hole 676 and be transmitted to the photosensor 52. The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.

Referring to FIG. 22 , in some embodiments, the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Specifically, when the receiving module 50 is integrated with the proximity sensor 51 and the light sensor 52, the light transmission hole 676 may be a light transmission hole corresponding to both the proximity sensor 51 and the light sensor 52 or two spaced apart and respectively The light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the photo sensor 52, but the proximity sensor 51 and the photo sensor 52 are two separate single package structures. In this case, the proximity sensor 51 is a single package structure. The light sensor 52 may also be disposed in the camera housing 67 and correspond to the light transmission hole 676. The receiving module 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the receiving module 50 and the camera housing 67 more stable and to facilitate mounting the receiving module 50 and the imaging module 60 to the casing 20.

Referring to FIG. 22 , in some embodiments, the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . The imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66. The receiving module 50 can also be fixed on the substrate 66 and housed in the camera housing 67. Specifically, an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100. In other embodiments, the receiving module 50 can also be connected to the FPC. In the embodiment, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52. The proximity sensor 51 and the light sensor 52 together form a single package structure, which reduces the gap between the two when assembled separately. The installation space in the electronic device 100 is saved.

In another embodiment, the receiving module 50 only includes the photo sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50. That is, the receiving module 50 is a single package structure of the photo sensor 52. The proximity sensor 51 is also a single package structure, and the proximity sensor 51 may be fixed on the substrate 66 and housed in the camera housing 67; or, when a portion of the substrate 66 is located in the camera housing 67 and another portion is inside the camera housing 67 The proximity sensor 51 can also be fixed to the substrate 66 and located outside the camera housing 67 when extended.

Embodiment 2:

Referring to FIG. 23, an electronic device 100 according to an embodiment of the present invention includes a casing 20, a cover 30, and electronic components. The electronic components include an output module 10, a vibration module 30a (as shown in FIG. 24), a piezoelectric element 70, a receiving module 50 (FIG. 8), an imaging module 60 (FIG. 8), and a structured light projector 80. . The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc. The embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here. The following is a description of the parts of the electronic device 100 of the present embodiment that are different from the electronic device 100 of the first embodiment. For the same parts, refer to the related description of the electronic device 100 of the first embodiment.

The output module 10 of the present embodiment has the same structure as that of the output module 10 described in the first embodiment, and details are not described herein again.

Referring to FIG. 23 and FIG. 24, the casing 20 can be used as a mounting carrier for the output module 10, or the output module 10 can be disposed in the casing 20. The casing 20 may be an outer casing of the electronic device 100.

Referring to FIG. 23 to FIG. 25, the casing 20 includes a top portion 21 and a bottom portion 22. At a position corresponding to the electronic component, the casing 20 is provided with a casing infrared through hole 23 and a casing vibration through hole 2a. . When the output module 10 is disposed in the casing 20, the infrared lamp 12 corresponds to the infrared through hole 23 of the casing. The infrared lamp 12 and the infrared through hole 23 of the casing correspond to that the light emitted by the infrared lamp 12 can pass through the infrared through hole 23 of the casing. Specifically, the infrared lamp 12 and the infrared through hole 23 of the casing can be directly opposite. The light emitted by the infrared lamp 12 may pass through the infrared through hole 23 of the casing through the light guiding element 13.

The vibration module 30a is mounted on the casing 20. The vibration module 30a may include a display screen 90 and a cover plate 30, or the display screen 90 is combined with the cover plate 30 to form a vibration module 30a to increase the rigidity of the vibration module 30a. The display screen 90 is disposed on the casing 20 and forms a receiving cavity 91 with the casing 20. The cover plate 30 is disposed on the casing 20 and located on a side of the display screen 90 away from the receiving cavity 91 to protect the display screen 90. Since the output module 10 of the embodiment of the present invention can occupy a small volume, the volume for setting the display screen 90 in the casing 20 can be correspondingly increased to increase the screen ratio of the electronic device 100. Specifically, the display screen 90, the output module 10, and the piezoelectric element 70 are disposed between the top portion 21 and the bottom portion 22. In a state where the user normally uses the electronic device 100, the top portion 21 is located above the bottom portion 22, as shown in FIG. The output module 10 can be disposed between the display screen 90 and the top portion 21. In other embodiments, the display screen 90 can be provided with a gap for the full screen, the display screen 90 surrounds the output module 10, and the output module 10 is exposed from the gap of the display screen 90.

The piezoelectric element 70 is made of a ceramic or quartz crystal material, and the piezoelectric element 70 may be a single wafer, a bimorph or a laminated piezoelectric element 70. The piezoelectric element 70 is coupled to the vibration module 30a and spaced apart from the output module 10. Specifically, the piezoelectric element 70 is received in the vibration through hole 2a of the casing and combined with the cover plate 30, and is spaced apart from the casing 20, and the piezoelectric element 70 may be partially received in the vibration through hole 2a of the casing, or pressed. The electrical component 70 is completely housed in the vibration hole 2a of the casing. When an electric signal (voltage) is applied to both ends of the piezoelectric element 70, the piezoelectric element 70 undergoes mechanical deformation such as expansion or contraction due to the inverse piezoelectric effect, thereby driving the vibration module coupled with the piezoelectric element 70. 30a vibrates according to the frequency of the electrical signal. When the user's body is in contact with the vibration module 30a, the bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body that is in contact with the vibration module 30a (for example, the cartilage of the outer ear, teeth). In this way, the user can implement functions such as voice call and listening to music through the piezoelectric element 70 and the vibration module 30a. In the embodiment of the present invention, the processor of the electronic device 100 is configured to acquire a sound signal, and apply an electrical signal corresponding to the sound signal at both ends of the piezoelectric element 70.

It can be understood that the traditional receiver structure uses air-conducted sound, and the local sound pressure is generally between 90dB and 100dB when the receiver is working, and the sound is quiet even in the surrounding environment (such as the general office environment of about 50dB). The retention is about 50dB~60dB, which causes the conversation content between the callers to be perceived by the surroundings, resulting in private leakage. The electronic device 100 of the embodiment of the present invention uses the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission. The sound of the conversation is mainly perceived by the user through the vibration of the bone conduction, and the privacy of the conversation content can be effectively ensured.

Referring again to Figures 24 and 25, the piezoelectric element 70 and display screen 90 are each attached to the cover 30 by a joint 30b. The joining member 30b is an adhesive having heat curing characteristics, ultraviolet curing characteristics, double-sided tape, adhesive, or the like. For example, the joining member 30b may be an optically elastic resin (a colorless and transparent ultraviolet curable acrylic adhesive). The area of the cover plate 30 that is coupled to the piezoelectric element 70 and the area of the cover plate 30 that is joined to the display screen 90 are spaced to prevent the display of the display screen 90 from being disturbed by the piezoelectric element 70. Of course, the cover plate 30 can also be coupled to the casing 20 through the joint member 30b, and the cover plate 30 can be directly disposed on the casing 20, so that the vibration of the vibration module 30a can be prevented from being directly transmitted to the casing 20 to reduce The possibility that the user drops the electronic device 100 because the vibration amplitude of the casing 20 is excessive.

The cover plate 30 may be light transmissive, and the material of the cover plate 30 may be light transmissive glass, resin, plastic or the like. The cover plate 30 is disposed on the casing 20, and the cover plate 30 includes an inner surface 32 coupled to the casing 20, and an outer surface 31 opposite the inner surface 32. The light emitted by the output module 10 sequentially passes through the inner surface 32 and The outer surface 31 is then passed through the cover 30. In the embodiment shown in FIG. 25, the cover plate 30 covers the infrared through hole 23 of the casing, and the inner surface 32 of the cover plate 30 is coated with infrared transmitting ink 40, and the infrared transmitting ink 40 has a higher infrared light. The transmittance can be, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user can hardly see the infrared transmission ink on the electronic device 100 in normal use. 40 covered areas. In particular, the infrared permeable ink 40 can cover an area of the inner surface 32 that does not correspond to the display screen 90.

The infrared transmission ink 40 can also block at least one of the infrared through hole 23 of the casing and the vibration through hole 2a of the casing, that is, the infrared transmission ink 40 can simultaneously cover the infrared through hole 23 of the casing and the vibration through hole 2a of the casing ( As shown in FIG. 25, it is difficult for the user to see the internal structure of the electronic device 100 through the infrared through hole 23 of the casing and the through hole 2a of the casing. The appearance of the electronic device 100 is beautiful; the infrared transmission ink 40 can also cover the casing. The infrared through hole 23 does not cover the vibration through hole 2a of the casing; the infrared transmission ink 40 can also cover the vibration through hole 2a of the casing, and does not cover the infrared through hole 23 of the casing.

The receiving module 50 and the imaging module 60 of the present embodiment have the same structure and mutual positional relationship as the receiving module 50 and the imaging module 60 described in the first embodiment, and are not described herein again.

The structure light projector 80 of the present embodiment has the same structure as that of the structure light projector 80 described in the first embodiment, and details are not described herein again.

In the embodiment shown in FIG. 23, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, an output module 10, an infrared light camera 62, a visible light camera 61, a piezoelectric element 70, and a structured light projector 80. The center is on the same line segment. Specifically, from one end of the line segment to the other end, the output module 10, the structured light projector 80, the piezoelectric element 70, the infrared light camera 62, and the visible light camera 61 (as shown in FIG. 26); or from one end of the line segment to The other end is an output module 10, an infrared camera 62, a piezoelectric element 70, a visible light camera 61, a structured light projector 80 (as shown in FIG. 23); or an infrared camera 62 from one end of the line to the other end. The output module 10, the piezoelectric element 70, the visible light camera 61, and the structured light projector 80; or from one end of the line segment to the other end, the infrared light camera 62, the visible light camera 61, the piezoelectric element 70, the output module 10, Structure light projector 80. Of course, the arrangement of the output module 10, the infrared light camera 62, the piezoelectric element 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in a circle. The arc shape and the center are arranged in a shape such as a rectangle.

Referring to FIG. 27, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The centers of the output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the piezoelectric element 70 is located between the line segment and the top 21 of the casing 20. Specifically, from one end of the line segment to the other end, the output module 10, the structured light projector 80, the infrared light camera 62, and the visible light camera 61 are sequentially arranged; or the output module 10 and the infrared light camera are sequentially from one end of the line segment to the other end. 62, a visible light camera 61, a structured light projector 80 (shown in Figure 27); or from one end of the line segment to the other end is an infrared light camera 62, an output module 10, a visible light camera 61, a structured light projector 80; or From one end of the line segment to the other end, the infrared light camera 62, the visible light camera 61, the output module 10, and the structured light projector 80 are sequentially arranged. Of course, the arrangement of the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 is not limited to the above examples. In the embodiment of the present invention, the center of the piezoelectric element 70 is not located on the line segment, which saves the electronic components on the cover 30 (output module 10, infrared camera 62, visible light camera 61, structured light projector 80, etc.) ) The horizontal space occupied.

Further, the receiving module 50 may be disposed on the mounting surface 631 of the infrared camera 62 or on the mounting surface 631 of the visible light camera 61. Of course, the receiving module 50 may not be installed. On the surface 631, the receiving module 50 can be disposed adjacent to the output module 10. The proximity sensor 51 can easily receive the infrared light emitted by the output module 10 when it is used as an infrared light, and reflected by an external object; the receiving module 50 may also be disposed adjacent to the piezoelectric element 70, which is not limited herein.

In summary, in the electronic device 100 of the embodiment of the present invention, by moving the position of the light guiding element 13, the output module 10 can be used as a near infrared light or an infrared fill light, and the infrared light is collected for infrared ranging and infrared. Fill light function. The output module 10 of the embodiment of the present invention only needs to be provided with an infrared lamp 12, which is small in size and saves the realization of infrared fill light, as compared with the current electronic device, which requires the proximity of the infrared light and the infrared fill light. And the space for infrared ranging function. Furthermore, since only one infrared lamp 12 needs to be disposed on the package substrate 111 for packaging, compared with the conventional process, the infrared fill lamp and the near-infrared lamp need to be separately fabricated and assembled on the PCB substrate, thereby improving the package. Packaging efficiency. Finally, the electronic device 100 uses the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, instead of the traditional air-conducting sound receiver structure, on the one hand, can effectively ensure the privacy of the call content; The original receiver is eliminated, and the through hole corresponding to the receiver is avoided on the cover 30. The process is simpler, the appearance is more beautiful, and dust or moisture can be prevented from entering the electronic device 100.

Referring to FIGS. 25 and 28 , in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62 . The casing 20 is provided with a casing infrared through hole 23 and a casing vibration through hole 2a which are spaced apart from each other. The infrared lamp 12 corresponds to the infrared through hole 23 of the casing. The number of the piezoelectric elements 70 is plural, and the number of the chassis vibration through holes 2a is plural, and the plurality of piezoelectric elements 70 correspond to the plurality of casing vibration through holes 2a, and each of the piezoelectric elements 70 is housed in the corresponding machine. The shell vibrates in the through hole 2a. The output module 10, the infrared light camera 62, the visible light camera 61, the plurality of piezoelectric elements 70, and the structure light projector 80 are located on the same line segment, and an output module 10 is disposed between two adjacent piezoelectric elements 70. At least one of the infrared light camera 62, the visible light camera 61, and the structured light projector 80. For example, the number of the piezoelectric elements 70 is two, and the piezoelectric element 70, the output module 10, the structured light projector 80, the infrared light camera 62, the visible light camera 61, and the piezoelectric element 70 are sequentially arranged from one end of the line segment to the other end. (As shown in FIG. 28); or from one end of the line segment to the other end, the piezoelectric element 70, the output module 10, the infrared light camera 62, the visible light camera 61, the piezoelectric element 70, the structured light projector 80, and the like. For another example, the number of the piezoelectric elements 70 is three, and the piezoelectric element 70, the output module 10, the structured light projector 80, the piezoelectric element 70, the infrared light camera 62, and the visible light camera are sequentially arranged from one end of the line segment to the other end. 61. Piezoelectric element 70 (shown in FIG. 29); or from one end of the line segment to the other end, piezoelectric element 70, output module 10, piezoelectric element 70, infrared light camera 62, visible light camera 61, piezoelectric Element 70, structured light projector 80, and the like. Of course, the number of piezoelectric elements 70 and the arrangement of the piezoelectric elements 70, the output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are not limited to the above examples. In the embodiment of the present invention, a plurality of piezoelectric elements 70 are combined with the cover plate 30, specifically, the plurality of piezoelectric elements 70 are attached to the cover plate 30 by the joint members 30b, respectively. The processor of the electronic device 100 is configured to acquire a sound signal, and simultaneously apply an electrical signal corresponding to the sound signal at both ends of the plurality of piezoelectric elements 70, and the plurality of piezoelectric elements 70 are mechanically deformed, thereby, a plurality of pressures The electrical component 70 drives the vibration module 30a from a plurality of different positions coupled to the cover 30 to vibrate according to the frequency of the electrical signal. When the user's body is in contact with the vibration module 30a, the bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body that is in contact with the vibration module 30a (for example, the cartilage of the outer ear, teeth).

In the embodiment of the present invention, the plurality of piezoelectric elements 70 simultaneously vibrate the vibration module 30a from a plurality of different positions combined with the cover plate 30. The vibration of the vibration module 30a is relatively uniform and the strength is stronger, which is beneficial to the bone conduction sound. Stable conduction to the user's auditory nerve.

Referring to FIG. 25, FIG. 30 and FIG. 31, in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The casing 20 is provided with a casing infrared through hole 23 and a casing vibration through hole 2a which are spaced apart from each other. The infrared lamp 12 corresponds to the infrared through hole 23 of the casing. The piezoelectric element 70 includes a piezoelectric body 71 and a piezoelectric bump 72 extending from the piezoelectric body 71. The number of the piezoelectric bumps 72 is plural, and the number of the chassis vibration through holes 2a is plural, and the plurality of pressures The electric bump 72 corresponds to the plurality of casing vibration through holes 2a, and each of the piezoelectric bumps 72 is partially housed in the corresponding casing vibration through hole 2a and combined with the cover plate 30. The output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located between the cover 30 and the piezoelectric body 71. The output module 10, the infrared light camera 62, the visible light camera 61, the plurality of piezoelectric bumps 72, and the structure light projector 80 are located on the same line segment, and an output module is disposed between the adjacent two piezoelectric bumps 72. 10. At least one of an infrared light camera 62, a visible light camera 61, and a structured light projector 80. For example, the number of the piezoelectric bumps 72 is two, from one end of the line segment to the other end, the piezoelectric bump 72, the output module 10, the structured light projector 80, the infrared light camera 62, the visible light camera 61, and the piezoelectric The bump 72; or from one end of the line segment to the other end, is a piezoelectric bump 72, an output module 10, an infrared light camera 62, a visible light camera 61, a piezoelectric bump 72, a structured light projector 80, and the like. For another example, the number of the piezoelectric bumps 72 is three. From one end of the line segment to the other end, the piezoelectric bump 72, the output module 10, the structured light projector 80, the piezoelectric bump 72, and the infrared light camera 62 are sequentially arranged. The visible light camera 61 and the piezoelectric bump 72; or from the one end of the line segment to the other end, the piezoelectric bump 72, the output module 10, the piezoelectric bump 72, the infrared light camera 62, the visible light camera 61, and the piezoelectric bump Block 72, structured light projector 80, and the like. For example, the number of the piezoelectric bumps 72 is five. From one end of the line segment to the other end, the piezoelectric bump 72, the output module 10, the piezoelectric bump 72, the structured light projector 80, and the piezoelectric bump are sequentially arranged. 72. Infrared light camera 62, piezoelectric bump 72, visible light camera 61, and piezoelectric bump 72 (shown in FIG. 31). Of course, the number of the piezoelectric bumps 72 and the arrangement of the piezoelectric bumps 72, the output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are not limited to the above examples. In the embodiment of the present invention, a plurality of piezoelectric bumps 72 are combined with the cover plate 30, and more specifically, a plurality of piezoelectric bumps 72 are attached to the cover plate 30 by the joint members 30b, respectively. The processor of the electronic device 100 is configured to acquire a sound signal, and apply an electrical signal corresponding to the sound signal to the piezoelectric element 70, and the piezoelectric element 70 including the piezoelectric body 71 and the piezoelectric bump 72 is mechanically deformed. Thus, the plurality of piezoelectric bumps 72 drive the vibration module 30a from a plurality of different positions combined with the cover plate 30 to vibrate according to the frequency of the electrical signal. When the user's body is in contact with the vibration module 30a, the bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body that is in contact with the vibration module 30a (for example, the cartilage of the outer ear, teeth).

In the embodiment shown in FIG. 31, the casing 20 is provided with a casing vibration through hole 2a, an output through hole 25, a structural light through hole 26, an infrared light through hole 27, and a visible light through hole 28 which are spaced apart from each other. The chassis vibration through hole 2a corresponds to the piezoelectric bump 72, the output through hole 25 corresponds to the output module 10, the structural light through hole 26 corresponds to the structured light projector 80, and the infrared light through hole 27 corresponds to the infrared light camera 62. The visible light through hole 28 corresponds to the visible light camera 61. The output through hole 25 is the above-mentioned casing infrared through hole 23. In addition, the structured light through hole 26 corresponds to the structured light projector 80. The structured light emitted by the structured light projector 80 can pass through the structured light through hole 26. The infrared light through hole 27 and the infrared light camera 62 correspond to the infrared light camera 62. The infrared light reflected by the object can be received from the infrared light through hole 27, and the visible light through hole 28 corresponds to the visible light camera 61, and the visible light camera 61 can receive the visible light reflected by the object from the visible light through hole 28.

In the embodiment of the present invention, the plurality of piezoelectric bumps 72 drive the vibration module 30a from a plurality of different positions combined with the cover plate 30, and the vibration of the vibration module 30a is relatively uniform and stronger, which is beneficial to the bone conduction sound. Stablely transmitted to the user's auditory nerve; in addition, a plurality of piezoelectric bumps 72 extend from the same piezoelectric body 71, thereby facilitating simultaneous application of electrical signals to the plurality of piezoelectric bumps 72 to simultaneously drive the vibration from a plurality of different positions. The module 30a is vibrated; further, the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located between the cover 30 and the piezoelectric body 71, and are provided with piezoelectric bumps 72 interposed therebetween. The overall size of the electronic device 100 is small, saving space.

Embodiment 3:

Referring to FIG. 32, an electronic device 100 according to an embodiment of the present invention includes a casing 20, a cover 30, and electronic components. The electronic components include an output module 10, a proximity sensor 51 (Fig. 11), a light sensor 52, an imaging module 60 (Fig. 11), a receiver 70, and a structured light projector 80. The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc. The embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here. The following is a description of the parts of the electronic device 100 of the present embodiment that are different from the electronic device 100 of the first embodiment. For the same parts, refer to the related description of the electronic device 100 of the first embodiment.

Referring to FIG. 7 , FIG. 32 and FIG. 33 , the casing 20 can be used as a mounting carrier of the output module 10 , or the output module 10 can be disposed in the casing 20 . The casing 20 includes a top portion 21 and a bottom portion 22, and the top portion 21 is located above the bottom portion 22 in a state where the user normally uses the electronic device 100, as shown in FIG. The output module 10 is disposed between the top 21 and the bottom 22. The casing 20 is provided with a mounting groove 25 which is opened between the top portion 21 and the bottom portion 22. The casing 20 may be a middle case or an outer casing of the electronic device 100.

Referring to FIGS. 32 and 33, the display screen 90 is disposed on the casing 20 and closes the mounting groove 25 to form a closed installation space. Specifically, the display screen 90 is disposed between the top portion 21 and the bottom portion 22. The display screen 90 is formed with a transparent solid region 91 and a non-transmissive region 94. The transparent solid region 91 does not include image pixels and is surrounded by a plurality of image pixels. The image pixels are distributed in the non-transmissive region 94, in other words, non-transparent. The area 94 is the display area of the display screen 90, and the non-light transmitting area 94 is used to implement the display function of the display screen 90. Materials for the light transmissive solid region 91 include, but are not limited to, glass. Light outside the electronic device 100 can enter the electronic device 100 through the light transmissive physical area 91 without damaging the integrity of the display screen 90. The display screen 90 includes a front side 92 that is capable of displaying a picture and a back side 93 that is opposite the front side 92. Specifically, when the display screen 90 emits light and displays a picture, light emitted from the display screen 90 is emitted from the front surface 92 from the display screen 90; when the display screen 90 is mounted to the casing 20, the mounting groove 25 and the front surface 92 are located on the back side 93. The back sides (ie, the back side 93 is located between the front side 92 and the mounting groove 25). In the embodiment of the present invention, the output module 10 can be disposed between the edge of the display screen 90 and the top portion 21. Since the output module 10 of the embodiment of the present invention occupies a small volume, the casing 20 is used for setting display. The volume of the screen 90 will be correspondingly increased to increase the screen ratio of the electronic device 100. In other embodiments, the display screen 90 can be provided with a gap for the full screen, the display screen 90 surrounds the output module 10, and the output module 10 is exposed from the gap of the display screen 90. In some embodiments, the light transmissive solid region 91 is thick and continuous with the surrounding non-transmissive region 94.

The other structures of the cover 30 and the casing 20 of the present embodiment are the same as those of the cover 30 and the casing 20 described in the first embodiment, and are not described herein again.

Referring to FIG. 33, the photo sensor 52 is a single package structure. The light sensor 52 is mounted in the mounting groove 25 and on the side where the back surface 93 of the display screen 90 is located, in other words, the light sensor 52 is located below the display screen 90. The light sensor 52 corresponds to the light transmitting solid region 91. Specifically, the visible light outside the electronic device 100 can pass through the light transmitting solid region 91 and be transmitted to the light sensor 52. The infrared light 12 is used as an infrared light emitted outwardly when the infrared light is emitted. After being reflected by an external object, the infrared light is received by the proximity sensor 51. The proximity sensor 51 determines the external object and the electronic device 100 according to the intensity of the received reflected infrared light. The distance between them. The light sensor 52 receives visible light in the ambient light and detects the intensity of the visible light as a basis for controlling the display brightness of the display screen 90. In this embodiment, the light sensor 52 is first installed in the mounting groove 25 and then the display screen 90 is mounted on the casing 20. The light sensor 52 can be placed in contact with or spaced apart from the display screen 90. In other embodiments, the light sensor 52 can be first mounted on the display screen 90 and the light sensor 52 is corresponding to the light-transmissive physical area 91, and then the display screen 90 and the light sensor 52 are simultaneously mounted on the casing 20. .

The proximity sensor 51 is a single package. The infrared light emitted from the infrared lamp 13 is reflected by the external object and received by the proximity sensor 51. The proximity sensor 51 determines the distance between the external object and the electronic device 100 according to the received infrared light reflected by the object.

Referring to FIG. 11 and FIG. 32, the imaging module 60 may be one or both of a visible light camera 61 and an infrared light camera 62. The imaging module 60 includes a lens holder 63, a lens barrel 64, and an image sensor 65. The lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63. The mirror holder 63 includes a mounting surface 631 between the lens barrel 64 and the image sensor 65. In the embodiment shown in FIG. 11, the proximity sensor 51 is disposed on the mounting surface 631. Specifically, the proximity projection 51 is projected at least partially on the mounting surface 631 at the plane in which the mounting surface 631 is located, such that the proximity sensor The imaging module 60 is relatively compact and the lateral space occupied by the two is relatively small.

The receiver 70 and the structured light projector 80 of the present embodiment are the same as the receiver 70 and the structured light projector 80 described in the first embodiment, and are not described herein again.

In the embodiment shown in FIG. 32, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The center of the output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70, and the structured light projector 80 are located. On the same line segment. Specifically, from one end of the line segment to the other end, the output module 10, the structured light projector 80, the receiver 70, the infrared light camera 62, and the visible light camera 61 (shown in FIG. 9), at this time, the visible light camera 61 and the infrared The optical camera 62 may constitute a dual camera (as shown in FIG. 39); or from one end of the line to the other end, the output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 (eg Figure 32); or from one end of the line segment to the other end, the infrared light camera 62, the output module 10, the receiver 70, the visible light camera 61, the structured light projector 80; or from the one end of the line segment to the other end in turn The optical camera 62, the visible light camera 61, the receiver 70, the output module 10, and the structured light projector 80. At this time, the visible light camera 61 and the infrared light camera 62 can constitute a dual camera (as shown in FIG. 39). Of course, the arrangement of the output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in a circular arc shape. The center is arranged in a shape such as a rectangle.

Further, please refer to FIG. 11 , the proximity sensor 51 may be disposed on the mounting surface 631 of the infrared light camera 62 , or may be disposed on the mounting surface 631 of the visible light camera 61 . Of course, the proximity sensor 51 may not be disposed on the mounting surface 631 . The proximity sensor 51 can be disposed adjacent to the output module 10, and the proximity sensor 51 can easily receive the infrared light emitted by the infrared lamp 12 when it is used as the proximity infrared lamp, and reflected by the external object; the proximity sensor 51 can also be connected to the receiver. 70 is adjacently arranged, and when the user answers the call, the proximity sensor 51 easily detects that the user's ear is close to the receiver 70.

In summary, in the electronic device 100 of the embodiment of the present invention, by moving the position of the light guiding element 13, the output module 10 can be used as a near infrared light or an infrared fill light, and the infrared light is collected for infrared ranging and infrared. Fill light function. The output module 10 of the embodiment of the present invention only needs to be provided with an infrared lamp 12, which is small in size and saves the realization of infrared fill light, as compared with the current electronic device, which requires the proximity of the infrared light and the infrared fill light. And the space for infrared ranging function. Furthermore, since only one infrared lamp 12 needs to be disposed on the package substrate 111 for packaging, compared with the conventional process, the infrared fill lamp and the near-infrared lamp need to be separately fabricated and assembled on the PCB substrate, thereby improving the package. Packaging efficiency. At the same time, the light sensor 52 is disposed on the side of the back surface 93 of the display screen 90 (below the display screen 90), so that the light sensor 52 does not occupy the space between the edge of the display screen 90 and the edge of the casing 20, and the display The gap between the edge of the screen 90 and the edge of the casing 20 can be made smaller, that is, the display area of the display screen 90 can be increased to increase the screen ratio of the electronic device 100.

Referring to FIG. 32 and FIG. 33, in some embodiments, the transparent solid area 91 includes image pixels, and the electronic device 100 further includes a processor 96. The light sensor 52 receives light incident on the light sensor 52 to output including The initial light intensity of the ambient light intensity information outside the electronic device 100. The processor 96 is configured to process the initial light intensity to obtain a target light intensity that includes only ambient light intensity information external to the electronic device 100.

Specifically, the transparent solid area 91 includes image pixels, and the transparent solid area 91 can be used to display image information, and ambient light can pass through the transparent solid area 91 and enter the electronic device 100. In some embodiments, the light transmissive solid region 91 may have a light transmittance of 50% or more. It can be understood that the light incident on the photosensor 52 includes both the portion of the ambient light passing through the transparent solid region 91 and the image pixels of the transparent solid region 91 being emitted to the inside of the electronic device 100 when the content is displayed. Shows the portion of the light. The processor 96 can determine the display light emitted by the light-transmitting physical region 91 received by the light sensor 52 to the light sensor 52 according to the content displayed by the light-transmissive physical region 91, so that the processor 96 can be based on the initial light intensity and the light sensor. 52 receives the light intensity generated by the display light to collectively determine the target light intensity including only the ambient light intensity information outside the electronic device 100. The electronic device 100 of the present embodiment can obtain ambient light intensity information outside the electronic device 100 as a basis for controlling the display brightness of the display screen 90.

Referring to FIG. 32 and FIG. 33, in some embodiments, the initial light intensity includes ambient light intensity information and display light intensity information received by the light sensor 52 when the display screen 90 displays an image, and the processor 96 is configured to acquire the display screen in real time. The display light intensity information received by the photo sensor 52 when the image is displayed is 90, and the display light intensity information is removed when the initial light intensity is processed to obtain the target light intensity.

Referring to FIG. 34, in some embodiments, the casing 20 further has an organic sound hole (not shown), and the cover 30 is further provided with a cover sound hole 34, and the receiver 70 and the cover sound hole. 34 corresponds to the position of the sound hole of the case. The centers of the output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20.

The center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (the output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover 30. In the embodiment shown in FIG. 34, the cover sound hole 34 is opened at the edge of the cover 30, and the sound hole of the casing is opened near the top 21.

Referring to FIG. 35, in some embodiments, the imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66, and the proximity sensor 51 can also be fixed on the substrate 66. Specifically, the substrate 66 is provided with an FPC. A part of the substrate 66 is located in the lens holder 63, and another part protrudes from the lens holder 63. One end of the FPC is located in the lens holder 63 and is used to carry the image sensor 65, and the other end can be The main board of the electronic device 100 is connected. When the proximity sensor 51 is disposed on the substrate 66, the proximity sensor 51 is disposed outside the lens holder 63, and the proximity sensor 51 may be connected to the FPC.

The imaging module 60 can be one or both of the visible light camera 61 and the infrared light camera 62. Specifically, the proximity sensor 51 may be fixed on the substrate 66 of the visible light camera 61; the proximity sensor 51 may be fixed on the substrate 66 of the infrared light camera 62.

Further, the substrate 66 further includes a reinforcing plate disposed on a side opposite to the proximity sensor 51 to increase the overall strength of the substrate 66, so that the FPC is less likely to be wound, and the proximity sensor 51 is disposed on the substrate 66. It is not easy to shake when it is. In one example, the proximity sensor 51 can also be attached to the outer sidewall of the mirror mount 63, such as by adhesive bonding to the outer sidewall of the mirror mount 63.

Referring to FIG. 36 , in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiment may be replaced with the following structure: the imaging module 60 includes an image sensor 65 , a camera housing 67 , and a lens module 68 . The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673, and the second sub-top surface 672 and the first sub-top surface The 671 is obliquely connected and forms a slit 675 with the first sub-top surface 671. The third sub-top surface 673 is obliquely connected to the second sub-top surface 672. The second sub-top surface 672 is located at the first sub-top surface 671 and the third sub-top surface. Between the 673, the first sub-top surface 671 and the third sub-top surface 673 are connected. The angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle. The slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670. The third sub-top surface 673 is provided with a light-emitting through hole 674. The lens module 68 is received in the camera housing 67 and corresponds to the light-emitting through hole 674. The image sensor 65 is received in the camera housing 67 and corresponding to the lens module 68. The light outside the electronic device 100 can pass through the light-emitting through-hole 674 and the lens module 68 and be transmitted to the image sensor 65. The image sensor 65 transmits the light signal. Converted to an electrical signal. The proximity sensor 51 is disposed at the first sub top surface 671. In the embodiment, the imaging module 60 may be a visible light camera 61. In other embodiments, the imaging module 60 can be an infrared camera 62.

The imaging module 60 of the present embodiment is provided with a slit 675, and the proximity sensor 51 is disposed on the first sub-top surface 671, so that the proximity sensor 51 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small. Small, saving installation space in the electronic device 100.

Referring to FIG. 36, in some embodiments, the proximity sensor 51 of the above embodiment is disposed on the first sub-top surface 671 and located outside the camera housing 67. Specifically, the entire proximity sensor 51 is perpendicular to the first The projections of the sub-top surface 671 can all be located within the first sub-top surface 671 (as shown in FIG. 36); alternatively, the partial proximity sensor 51 is located within the first sub-top surface 671 along a projection perpendicular to the first sub-top surface 671. That is to say, at least a portion of the proximity sensor 51 is located directly above the first sub-top surface 671. Thus, the proximity sensor 51 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small, further saving electrons. The installation space within the device 100.

Referring to FIG. 37 , the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676 , and the proximity sensor 51 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51. The proximity sensor 51 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 51 and the camera housing 67 more stable and to facilitate mounting of the proximity sensor 51 and the imaging module 60 to the casing 20.

Referring to FIG. 38 , in some embodiments, the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676 , and the proximity sensor 51 is located in the camera housing 67 and corresponds to the light transmission hole 676 . The imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66. The proximity sensor 51 can also be fixed on the substrate 66 and housed in the camera housing 67. Specifically, an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100. In other embodiments, the proximity sensor 51 can also be coupled to the FPC.

The proximity sensor 51 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 51 and the camera housing 67 more stable and to facilitate mounting the proximity sensor 51 and the imaging module 60 to the casing 20; The group 60 sets the substrate 66 and places the proximity sensor 51 on the substrate 66 so that the proximity sensor 51 can be stably mounted in the camera housing 67.

Referring to FIG. 39, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiment may be replaced by the following structure: the imaging module 60 is a dual camera module, and includes two image sensors 65 and a camera housing. 67 and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 that is lower than the first step surface 677, and a first connection surface 679a. The first connecting surface 679a is obliquely connected to the second step 678 and forms a slit 675 with the second step 678. The first connecting surface 679a is obliquely connected to the first step 677, and the first connecting surface 679a is located at the first step 677 and The second step 678 is connected between the first step 677 and the second step 678. The angle between the first connecting surface 679a and the first step surface 677 may be an obtuse angle or a right angle, and the angle between the first connecting surface 679a and the second step surface 678 may be an obtuse angle or a right angle. The slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670. The two light-emitting through holes 674 are both formed on the first step surface 677 and are located on the same side of the slit 675. The center lines of the two light-emitting through holes 674 are perpendicular to the extending direction of the slit 675. The two lens modules 68 are respectively received in the camera housing 67 and respectively correspond to the two light-emitting through holes 674. The two image sensors 65 are received in the camera housing 67 and respectively correspond to the two lens modules 68. Light outside 100 can pass through the light through hole 674 and the lens module 68 and be transmitted to the image sensor 65. In this embodiment, the imaging module 60 may be a visible light camera 61. In this case, the two lens modules 68 are lens modules corresponding to the visible light camera 61. The proximity sensor 51 is disposed on the second step 678 and outside the camera housing 67. In other embodiments, the imaging module 60 may be an infrared camera 62. In this case, the two lens modules 68 are lens modules corresponding to the infrared camera 62. In another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The lens module 68 is a lens module corresponding to the infrared light camera 62, and the other lens module 68 is a visible light camera 61. Lens module.

The imaging module 60 of the present embodiment is provided with a slit 675, and the proximity sensor 51 is disposed on the second step 678, so that the proximity sensor 51 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small. The installation space in the electronic device 100 is saved.

Referring to FIG. 40, in some embodiments, the slit 675 of the above embodiment is disposed at a middle position of the top surface 670, and the first step surface 677 is divided by the slit 675 into the first sub-step surface 677a and the second sub-step surface. 677b, the first sub-surface 677a and the second sub-surface 677b are respectively located on opposite sides of the slit 675, and the two light-emitting through holes 674 are respectively opened on the first sub-surface 677a and the second sub-surface 677b, and are installed on The lens modules 68 within the camera housing 67 are also located on opposite sides of the slit 675. At this time, the slit 675 is surrounded by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b. The first connecting surface 679a is obliquely connected to the first sub-top surface 677a and the second ladder surface 678 and is located at the first sub-surface. Between the top surface 677a and the second step surface 678, the second connecting surface 679b is obliquely connected to the second sub-top surface 677b and the second step surface 678 and located between the second sub-top surface 677b and the second ladder surface 678. In this embodiment, the first step surface 677 is parallel to the second step surface 678, the angle between the first connecting surface 679a and the first sub-surface 677a is an obtuse angle, and the second connecting surface 679b is sandwiched by the second sub-surface 677b. The angle is an obtuse angle. In other embodiments, the angle between the first connecting surface 679a and the first sub-surface 677a is a right angle, and the angle between the second connecting surface 679b and the second sub-surface 677b is a right angle. With respect to the opening position of the slit 675 at the edge of the top surface 670, the slit 675 of the present embodiment is opened at the intermediate position of the top surface 670 to make the width of the slit 675 wider, thereby facilitating the placement of the proximity sensor 51 on the second step 678. on.

Referring to FIGS. 39 and 40 , in some embodiments, the proximity sensor 51 of the above embodiment is disposed on the second step 678 and located outside the camera housing 67 . Specifically, when the slit 675 is opened at the edge position of the top surface 670, the projection of the entire proximity sensor 51 along the second ladder surface 678 may be located in the second ladder surface 678 (as shown in FIG. 39); or, part The proximity sensor 51 is located within the second step 678 along a projection perpendicular to the second step 678. That is, at least a portion of the proximity sensor 51 is located directly above the second step 678. When the slit 675 is opened in the middle of the top surface 670, the projection of the entire proximity sensor 51 along the second plane 678 can be located within the second step 678 (as shown in FIG. 40). As such, the proximity sensor 51 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small, which further saves the installation space in the electronic device 100.

Referring to FIG. 41 , the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the proximity sensor 51 is located in the camera housing 67 and corresponds to the light transmission hole 676 . Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 51. The proximity sensor 51 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 51 and the camera housing 67 more stable and to facilitate mounting of the proximity sensor 51 and the imaging module 60 to the casing 20.

Referring to FIG. 42 , in some embodiments, the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the proximity sensor 51 is located in the camera housing 67 and corresponds to the light transmission hole 676 . The imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66. The proximity sensor 51 can also be fixed on the substrate 66 and housed in the camera housing 67. Specifically, an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100.

Embodiment 4:

Referring to FIG. 43, an electronic device 100 according to an embodiment of the present invention includes a casing 20, a cover 30, and electronic components. The electronic components include an input and output module 10, a light sensor 50 (Fig. 51), an imaging module 60 (Fig. 51), a receiver 70, and a structured light projector 80. The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc. The embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here.

Referring to FIG. 44 to FIG. 46, the input/output module 10 is a single package structure, including a package housing 11, an infrared lamp 12, a light guiding element 13, and a proximity sensor 1a.

The package housing 11 is for simultaneously encapsulating the infrared lamp 12, the light guiding element 13, and the proximity sensor 1a, or the infrared lamp 12, the light guiding element 13, and the proximity sensor 1a are simultaneously packaged in the package housing 11. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an electromagnetic interference (EMI) shielding material to prevent external electromagnetic interference from affecting the input/output module 10.

Referring to FIG. 47, the package substrate 111 is used to simultaneously carry the infrared lamp 12 and the proximity sensor 1a. When the input/output module 10 is manufactured, the infrared lamp 12 and the proximity sensor 1a can be formed on one chip 14, and the infrared lamp 12, the proximity sensor 1a and the chip 14 are disposed together on the package substrate 111. Specifically, The chip 14 is bonded to the package substrate 111. At the same time, the package substrate 111 can also be used to connect with other components of the electronic device 100 (for example, the casing 20 of the electronic device 100, the motherboard, etc.) to fix the input/output module 10 in the electronic device 100. Both the infrared lamp 12 and the proximity sensor 1a can be formed on one chip 14, further reducing the volume of the integrated infrared lamp 12 and the proximity sensor 1a, and the preparation process is relatively simple.

The package sidewall 112 can be disposed around the infrared lamp 12, the light guiding component 13 and the proximity sensor 1a. The package sidewall 112 extends from the package substrate 111, and the package sidewall 112 can be combined with the package substrate 111. Preferably, the package sidewall 112 is The package substrate 111 is detachably connected to facilitate inspection of the infrared lamp 12 and the proximity sensor 1a after the package sidewall 112 is removed. The material of the package sidewall 112 may be a material that is not transparent to infrared light to prevent infrared light emitted by the infrared lamp 12 from passing through the package sidewall 112.

The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. The package top 113 is formed with a light-emitting window 1131 and a proximity sensing window 1132. The light-emitting window 1131 corresponds to the infrared light 12, and the infrared light emitted by the infrared light 12 passes through the light-emitting window 1131. The proximity sensing window 1132 corresponds to the proximity sensor 1a. The infrared light reflected by the object can pass through the proximity sensing window 1132 and be incident on the proximity sensor 1a. The package top 113 and the package sidewalls 112 may be integrally formed or may be separately formed. In one example, the light-emitting window 1131 and the proximity sensing window 1132 are both through holes, and the package top portion 113 is made of a material that is opaque to infrared light and opaque to visible light. In another example, the package top 113 is made of a material that is not transparent to infrared light, infrared light, and a material that is not transparent to visible light. Specifically, the light-emitting window 1131 and the proximity sensing window 1132 are both transparent to infrared light. The material is made of the material, and the rest is made of a material that is impermeable to infrared light and is not transparent to visible light. Further, the light-emitting window 1131 may be formed with a lens structure to improve the infrared light emission angle emitted from the light-emitting window 1131, for example, the light-emitting window 1131 is formed. There is a concave lens structure to cause the light passing through the light-emitting window 1131 to diverge outwardly; the light-emitting window 1131 is formed with a convex lens structure so that the light passing through the light-emitting window 1131 is gathered and emitted outward; the proximity sensing window 1132 may also be formed with a lens. The structure is configured to improve the infrared light emission angle incident from the proximity sensing window 1132. For example, the proximity sensing window 1132 has a convex lens structure to cause the light incident from the proximity sensing window 1132 to be gathered and projected onto the proximity sensor 1a.

The light guiding element 13 is movably disposed on the light emitting path of the infrared lamp 12. Referring to FIG. 47 and FIG. 48, the input/output module 10 further includes a driving member 17 for driving the light guiding member 13 to be movably disposed on the light emitting path of the infrared lamp 12. The driving member 17 driving the light guiding element 13 to be movably disposed on the light emitting path of the infrared lamp 12 includes: in a normal state, the light guiding element 13 is disposed on the light emitting path of the infrared lamp 12, and the infrared lamp 12 is used as the infrared light. a fill light (or near infrared light), when the infrared light 12 is used as a proximity infrared light (or an infrared fill light), the driving member 17 drives the light guiding element 13 to move away from the light emitting path of the infrared light 12; or, under normal conditions, The light guiding element 13 is not disposed on the light emitting path of the infrared lamp 12, the infrared lamp 12 is used as the near infrared light (or infrared fill light), and when the infrared light 12 is used as the infrared fill light (or near the infrared light), the driving member The 17 driving light guiding element 13 is moved to the light emitting path of the infrared lamp 12.

Referring to FIG. 47, the driving member 17 includes a linear motor including a stator 172 and a mover 174. The stator 172 is mounted on the package side wall 112, the mover 174 is coupled to the light guiding member 13, and the driving member 17 drives the mover 174 to move. The light guiding element 13 is driven to move. Referring to FIG. 48, the structure of the driving member 17 may be replaced by: the driving member 17 includes a linear motor, the linear motor includes a stator 172 and a mover 174, the stator 172 is mounted on the package sidewall 112, and the input/output module 10 further includes a rotating shaft. 18 and the connecting arm 19, the first end of the connecting arm 19 is connected to the light guiding element 13, the mover 174 is connected with the second end of the connecting arm 19 away from the light guiding element 13, and the connecting arm 19 is sleeved on the rotating shaft 18, and the rotating shaft 18 Located between the light guiding element 13 and the mover 174, the mover 174 of the linear motor drives the second end of the connecting arm 19 to move, and the connecting arm 19 rotates about the rotating shaft 18, whereby the first end of the connecting arm 19 drives the light guiding The element 13 is rotated about the rotating shaft 18 to realize that the light guiding element 13 is on the illuminating light path of the infrared lamp 12 or away from the illuminating light path of the infrared lamp 12. In the embodiment of the present invention, the input/output module 10 may further include a carrying board (not shown). The carrying board is provided with a carrying hole, the light guiding element 13 is installed in the carrying hole, and the driving component 17 is used to drive the carrying board. The movement moves the light guiding element 13 to move.

Referring to FIG. 45, when the light guiding element 13 is located on the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 passes through the light guiding element 13, and the first field of view angle is removed from the package by the light guiding element 13. The body 11 is emitted as a proximity infrared lamp; when the light guiding element 13 leaves the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 is emitted from the package housing 11 at a second angle of view as an infrared fill light. At this time, the first field of view angle is smaller than the second field of view angle, wherein the first field of view angle ranges from 10 degrees to 30 degrees, for example, the first field of view angle is 10 degrees, 15 degrees, 20 degrees, 25 degrees. Or 30 degrees, etc., the second field of view angle ranges from 60 degrees to 90 degrees, for example, the second field of view angle is 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 Degree, or 90 degrees, etc. The light guiding element 13 is for concentrating light, and the light guiding element 13 comprises a convex lens or a lens group having positive power, and the lens group may be one or more lenses. In the embodiment of the present invention, the angle of view refers to a range in which infrared light is emitted from the package housing 11 through the light-emitting window 1131.

Referring to FIG. 46, when the light guiding element 13 is located on the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 passes through the light guiding element 13 and is guided by the light guiding element 13 at a first angle of view from the package. The body 11 is emitted as an infrared fill light; when the light guiding element 13 leaves the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 is emitted from the package housing 11 at a second angle of view as a near infrared light. At this time, the first field of view angle is greater than the second field of view angle, wherein the first field of view angle ranges from 60 degrees to 90 degrees, for example, the first field of view angle is 60 degrees, 65 degrees, 70 degrees, 75 degrees. , 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees, etc., the second field of view angle ranges from 10 degrees to 30 degrees, for example, the second field of view angle is 10 degrees, 15 degrees, 20 degrees, 25 Degree, or 30 degrees, etc. The light guiding element 13 is for diverging light, and the light guiding element 13 comprises a concave lens or a lens group having a negative refractive power, and the lens group may be one or more lenses. In the embodiment of the present invention, the angle of view refers to a range in which infrared light is emitted from the package housing 11 through the light-emitting window 1131.

When the infrared lamp 12 is turned on and used as an infrared fill light to emit infrared light to the outside of the package housing 11, the infrared light passes through the light-emitting window 1131 to be projected onto the surface of the object, and the infrared light camera 62 of the electronic device 100 (shown in FIG. 43) receives. The infrared light reflected by the object acquires image information of the object (at this time, the infrared lamp 12 is used for infrared fill light). When the infrared lamp 12 is turned on and used as a near-infrared lamp to emit infrared light to the outside of the package housing 11, the infrared light passes through the illumination window 1131 and reaches the surface of the object, and the proximity sensor 1a of the electronic device 100 receives the infrared light reflected by the object to detect the object to The distance of the electronic device 100 (at this time, the infrared lamp 12 is used for infrared ranging).

The photosensor 50 (shown in Figure 51) receives visible light in ambient light and detects the intensity of visible light.

Referring to FIG. 49, in the embodiment of the present invention, the input/output module 10 is formed with a ground pin 1e, an infrared lamp pin 1f, and a proximity sensing pin 1g. The ground pin 1e, the infrared lamp pin 1f, and the proximity sensing pin 1g may be formed on the package substrate 111 when the ground pin 1e and the infrared lamp pin 1f are enabled (ie, the ground pin 1e and the infrared When the lamp pin 1f is connected to the circuit, the infrared lamp 12 emits infrared light; when the ground pin 1e, the proximity sensing pin 1g, and the infrared lamp pin 1f are enabled (ie, the ground pin 1e, When the proximity sensor pin 1g, the infrared lamp pin 1f is connected to the circuit, and the infrared lamp 12 is controlled to emit infrared light for infrared ranging, the proximity sensor 1a receives the infrared light reflected by the object to detect The distance of the object.

Referring to FIG. 43 and FIG. 50, the casing 20 can be used as a mounting carrier for the input/output module 10, or the input/output module 10 can be disposed in the casing 20. The casing 20 can be the outer casing of the electronic device 100. In the embodiment of the present invention, the casing 20 can also be used to set the display 90 of the electronic device 100. The input and output module 10 of the embodiment of the present invention occupies a small volume. Therefore, the volume for setting the display screen 90 in the casing 20 can be correspondingly increased to increase the screen ratio of the electronic device 100. Specifically, the casing 20 includes a top portion 21 and a bottom portion 22, and the display screen 90 and the input/output module 10 are disposed between the top portion 21 and the bottom portion 22. The top portion 21 is located above the bottom portion 22 in a state where the user normally uses the electronic device 100. As shown in FIG. 43, the input/output module 10 can be disposed between the display screen 90 and the top portion 21. In other embodiments, the display screen 90 may be provided with a gap for the full screen, the display screen 90 encloses the input and output module 10, and the input and output module 10 is exposed from the gap of the display screen 90.

The casing 20 also has an organic shell light source through hole 23 and a casing close to the sensing through hole 24. When the input/output module 10 is disposed in the casing 20, the infrared lamp 12 corresponds to the casing light source through hole 23, and the proximity sensor 1a corresponds to the casing proximity sensing through hole 24. The infrared light 12 and the light source through hole 23 of the casing correspond to the light emitted by the infrared light 12 and can pass through the through hole 23 of the casing light source. Specifically, the infrared light 12 and the through hole 23 of the casing light source may be opposite to each other. The light emitted by the infrared lamp 12 passes through the light source through hole 23 after being acted upon by the light guiding element 13. The proximity sensor 1a and the casing proximity sensing through hole 24 correspond to the infrared light reflected by the object, which can pass through the casing from the sensing through hole 24 and is incident on the proximity sensor 1a. Specifically, the proximity sensor 1a and the machine can be The shell is adjacent to the sensing through hole 24, and the light incident from the infrared light passes through the casing and approaches the sensing through hole 24 and is incident on the proximity sensor 1a through the light guiding element. The casing light source through hole 23 and the casing proximity sensing through hole 24 may be spaced apart from each other. Of course, in other embodiments, the casing light source through hole 23 and the casing proximity sensing through hole 24 may also be connected to each other. .

The cover plate 30 may be light transmissive, and the material of the cover plate 30 may be light transmissive glass, resin, plastic or the like. The cover plate 30 is disposed on the casing 20, and the cover plate 30 includes an inner surface 32 combined with the casing 20, and an outer surface 31 opposite to the inner surface 32. The light emitted by the input/output module 10 sequentially passes through the inner surface 32. The cover plate 30 is then passed through the outer surface 31. In the embodiment shown in FIG. 50, the cover plate 30 covers the casing light source through hole 23 and the casing is close to the sensing through hole 24. The inner surface 32 of the cover plate 30 is coated with infrared transmitting ink 40, and the infrared is transparent. The ink 40 has a high transmittance to infrared light, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user can hardly see it in normal use. The area of the electronic device 100 that is covered by the infrared light through the ink 40. In particular, the infrared permeable ink 40 can cover an area of the inner surface 32 that does not correspond to the display screen 90.

The infrared transmission ink 40 can also block at least one of the casing light source through hole 23 and the casing proximity sensing through hole 24, that is, the infrared transmission ink 40 can block the casing light source through hole 23 and the casing proximity sensing at the same time. The through hole 24 (shown in FIG. 50) is difficult for the user to see the internal structure of the electronic device 100 through the casing light source through hole 23 and the casing close to the sensing through hole 24. The electronic device 100 has a beautiful appearance; the infrared transmission ink 40 can also block the light source through hole 23 of the casing, and the unshielded casing approaches the sensing through hole 24; or the infrared transmitting ink 40 can also block the casing from approaching the sensing through hole 24, and the casing light source through hole 23 is not blocked. .

Referring to FIG. 51, the photosensor 50 is a single package structure. The photosensor 50 receives visible light in ambient light and detects the intensity of visible light as a basis for controlling the display brightness of the display screen 90.

Referring to FIG. 43 and FIG. 51, the imaging module 60 may be one or both of a visible light camera 61 and an infrared light camera 62. The imaging module 60 includes a lens holder 63, a lens barrel 64, and an image sensor 65. The lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63. The mirror holder 63 includes a mounting surface 631 between the lens barrel 64 and the image sensor 65. In the embodiment shown in FIG. 51, the light sensor 50 is disposed on the mounting surface 631. Specifically, the orthographic projection of the light sensor 50 on the plane where the mounting surface 631 is located at least partially falls onto the mounting surface 631. The photosensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small.

Referring to FIG. 43, the receiver 70 is configured to emit an acoustic signal when excited by the power source, and the user can make a call through the receiver 70. The structured light projector 80 is configured to emit structured light outwardly, and the structured light is reflected onto the object to be measured and then reflected. The reflected structured light can be received by the infrared light camera 62, and the processor of the electronic device 100 further analyzes the infrared light camera 62. Receive structured light to obtain depth information of the measured object.

In the embodiment shown in FIG. 43, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, an input/output module 10, an infrared light camera 62, a visible light camera 61, a receiver 70, and a center of the structured light projector 80. Located on the same line segment. Specifically, from one end of the line segment to the other end, the input/output module 10, the structured light projector 80, the receiver 70, the infrared light camera 62, and the visible light camera 61 (shown in FIG. 52) are sequentially, at this time, the visible light camera 61 and The infrared camera 62 may constitute a dual camera (as shown in FIG. 61); or from one end of the line to the other, the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80. (as shown in FIG. 43); or from one end of the line segment to the other end, the infrared light camera 62, the input/output module 10, the receiver 70, the visible light camera 61, the structured light projector 80; or from one end of the line segment to the other end In turn, the infrared camera 62, the visible light camera 61, the receiver 70, the input/output module 10, and the structured light projector 80. At this time, the visible light camera 61 and the infrared light camera 62 can constitute a dual camera (as shown in FIG. 61). Of course, the arrangement of the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in an arc. The shape and the center are arranged in a shape such as a rectangle.

Further, please refer to FIG. 51, the light sensor 50 may be disposed on the mounting surface 631 of the infrared light camera 62, or may be disposed on the mounting surface 631 of the visible light camera 61. Of course, the light sensor 50 may not be installed. On the surface 631, for example, the photo sensor 50 may be disposed adjacent to the input/output module 10 or adjacent to the receiver 70, which is not limited herein.

In summary, in the electronic device 100 of the embodiment of the present invention, by moving the position of the light guiding element 13, the input/output module 10 can be used as a near infrared light or an infrared fill light, and the infrared light 12 and the light guiding element 13 are close to each other. The sensor 1a is integrated into a single package structure, so that the input and output module 10 integrates the function of transmitting and receiving infrared light to perform infrared ranging, and infrared filling. Secondly, the input/output module 10 of the embodiment of the present invention only needs to be provided with an infrared lamp 12, which is small in volume, as compared with the current electronic device, which requires the proximity of the infrared light and the infrared fill light. Further, the infrared lamp 12 and the proximity sensor 1a are integrated into a single package structure, and the input/output module 10 has a high integration degree and a small volume, thereby saving space for realizing functions of infrared ranging and infrared fill light. Furthermore, since only one infrared lamp 12 and the proximity sensor 1a need to be disposed on the same package substrate 111 for packaging, different crystals are required for the infrared fill lamp, the near-infrared lamp and the proximity sensor 1a compared with the conventional process. The round manufacturing is combined with the package on the PCB substrate to improve the packaging efficiency.

Referring again to FIG. 47, in some embodiments, the input and output module 10 further includes a proximity sensing lens 1b. The proximity sensor lens 1b is disposed in the package housing 11 and corresponds to the proximity sensor 1a. The proximity sensing lens 1b concentrates the infrared light onto the proximity sensor 1a, reducing the amount of light transmitted by the infrared light to an area other than the proximity sensor 1a.

Referring to FIG. 47, in some embodiments, the input/output module 10 further includes a metal shielding plate 1c. The metal shielding plate 1c is located in the package housing 11 and located between the infrared lamp 12 and the proximity sensor 1a. The metal shielding plate 1c is located between the infrared lamp 12 and the proximity sensor 1a, and can prevent the infrared light emitted from the infrared lamp 12 from entering the proximity sensor 1a, and can also shield the electromagnetic interference between the infrared lamp 12 and the proximity sensor 1a.

Referring to FIG. 53 , in some embodiments, the input and output module 10 further includes an optical enclosure 16 . The optical enclosure 16 is made of a light transmissive material, and an optical enclosure 16 is formed on the package substrate 111 and within the package housing 11. The optical enclosure 16 encases the infrared lamp 12 and the proximity sensor 1a. Specifically, the optical enclosure 16 can be formed by a potting injection molding process, the optical enclosure 16 can be made of a transparent thermosetting epoxy resin to be less susceptible to softening during use, and the optical enclosure 16 can be fixed to the infrared lamp 12 and close thereto. The relative position between the sensors 1a is such that the infrared lamp 12 and the proximity sensor 1a are less likely to sway within the package housing 11. At this time, the light guiding element 13 is disposed outside the optical enclosure 16 and is movably housed in the package casing 11.

Referring to FIG. 53, in some embodiments, the input-output module 10 further includes a light-emitting partition 1d formed in the optical enclosure 16 between the infrared lamp 12 and the proximity sensor 1a. The light exiting partition 1d can block the infrared light 12 from being incident on the proximity sensor 1a at the initially emitted infrared light while blocking the infrared light entering from the proximity sensing window 1132 and incident on the proximity sensor 1a to affect the illumination of the infrared light 12.

Referring to FIG. 51, in some embodiments, the photosensor 50 of the above embodiment may be disposed on the mounting surface 631 of the lens holder 63. The mirror mount 63 may be the mirror mount 63 of the infrared light camera 62 or the mirror mount 63 of the visible light camera 61.

Referring to FIG. 54 , in some embodiments, the casing 20 further has an organic sound hole (not shown), and the cover 30 is further provided with a cover sound hole 34, and the receiver 70 and the cover sound hole. 34 corresponds to the position of the sound hole of the case. The centers of the input/output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20.

The center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (the input/output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover 30. In the embodiment shown in FIG. 54, the cover sound hole 34 is opened at the edge of the cover 30, and the sound hole of the casing is opened near the top 21.

Referring to FIG. 55 again, in some embodiments, the cover plate 30 may further be provided with a cover light source through hole 33. The cover light source through hole 33 corresponds to the casing light source through hole 23, and the infrared light emitted by the infrared lamp 12 The electronic device 100 can be passed through the cover light source through hole 33 after passing through the casing light source through hole 23.

Referring to FIG. 56, in some embodiments, the cover 30 can also be provided with a cover close to the sensing through hole 35. The cover is close to the sensing through hole 35 and the casing is close to the sensing through hole 24 and the proximity sensor 1a. Correspondingly, the infrared light reflected by the object outside the electronic device 100 passes through the cover plate to approach the sensing through hole 35 and the casing approaches the sensing through hole 24, and can be incident on the proximity sensor 1a.

Referring to FIG. 57, in some embodiments, the imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66, and the photosensor 50 can also be fixed on the substrate 66. Specifically, the substrate 66 is provided with an FPC. A part of the substrate 66 is located in the lens holder 63, and another part protrudes from the lens holder 63. One end of the FPC is located in the lens holder 63 and is used to carry the image sensor 65, and the other end can be The main board of the electronic device 100 is connected. When the photo sensor 50 is disposed on the substrate 66, the photo sensor 50 is disposed outside the lens holder 63, and the photo sensor 50 may be connected to the FPC.

The imaging module 60 can be one or both of the visible light camera 61 and the infrared light camera 62. Specifically, the photo sensor 50 may be fixed on the substrate 66 of the visible light camera 61; the photo sensor 50 may be fixed on the substrate 66 of the infrared light camera 62. Further, the substrate 66 further includes a reinforcing plate disposed on a side opposite to the photosensor 50 to increase the overall strength of the substrate 66, so that the FPC is less likely to be wound, and the photosensor 50 is disposed on the substrate. When it is 66, it is not easy to shake. In one example, the photosensor 50 can also be attached to the outer sidewall of the mirror mount 63, such as by adhesive bonding to the outer sidewall of the mirror mount 63.

Referring to FIG. 58 , in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiment may be replaced with the following structure: the imaging module 60 includes an image sensor 65 , a camera housing 67 , and a lens module 68 . The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673, and the second sub-top surface 672 and the first sub-top surface The 671 is obliquely connected and forms a slit 675 with the first sub-top surface 671. The third sub-top surface 673 is obliquely connected to the second sub-top surface 672. The second sub-top surface 672 is located at the first sub-top surface 671 and the third sub-top surface. Between the 673, the first sub-top surface 671 and the third sub-top surface 673 are connected. The angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle. The slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670. The third sub-top surface 673 is provided with a light-emitting through hole 674. The lens module 68 is received in the camera housing 67 and corresponds to the light-emitting through hole 674. The image sensor 65 is received in the camera housing 67 and corresponding to the lens module 68. The light outside the electronic device 100 can pass through the light-emitting through-hole 674 and the lens module 68 and be transmitted to the image sensor 65. The image sensor 65 transmits the light signal. Converted to an electrical signal. The photo sensor 50 is disposed at the first sub top surface 671. In the embodiment, the imaging module 60 may be a visible light camera 61, and the light sensor 50 has a single package structure.

The imaging module 60 of the present embodiment is provided with a slit 675, and the photo sensor 50 is disposed on the first sub-top surface 671, so that the photo sensor 50 and the imaging module 60 are relatively compact. The space is small, saving installation space in the electronic device 100.

Referring to FIG. 58, in some embodiments, the photosensor 50 of the above embodiment is disposed on the first sub-top surface 671 and located outside the camera housing 67. Specifically, the entire photo sensor 50 is perpendicular to The projection of the first sub-top surface 671 may be located in the first sub-top surface 671 (as shown in FIG. 57); or, the partial photosensor 50 is located on the first sub-top surface along the projection perpendicular to the first sub-top surface 671. Within 671. That is to say, at least a part of the photo sensor 50 is located directly above the first sub-top surface 671. Thus, the photo sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small, further saving The installation space in the electronic device 100.

Referring to FIG. 59, the first sub-top surface 671 of the above embodiment is provided with a light transmission hole 676. The photo sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676. Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the photosensor 50. The photosensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the photosensor 50 and the camera housing 67 more stable and to facilitate mounting the photosensor 50 and the imaging module 60 to the casing 20.

Referring to FIG. 60 , in some embodiments, the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676 , and the photo sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . The imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66. The photo sensor 50 can also be fixed on the substrate 66 and housed in the camera housing 67. Specifically, an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100. In other embodiments, the light sensor 50 can also be coupled to an FPC.

The photosensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the photo sensor 50 and the camera housing 67 more stable and to facilitate mounting the photo sensor 50 and the imaging module 60 to the casing 20; The imaging module 60 is provided with a substrate 66 and the photosensor 50 is disposed on the substrate 66 so that the photosensor 50 can be stably mounted in the camera housing 67.

Referring to FIG. 61, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiment may be replaced by the following structure: the imaging module 60 is a dual camera module, and includes two image sensors 65 and a camera housing. 67 and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 that is lower than the first step surface 677, and a first connection surface 679a. The first connecting surface 679a is obliquely connected to the second step 678 and forms a slit 675 with the second step 678. The first connecting surface 679a is obliquely connected to the first step 677, and the first connecting surface 679a is located at the first step 677 and The second step 678 is connected between the first step 677 and the second step 678. The angle between the first connecting surface 679a and the first step surface 677 may be an obtuse angle or a right angle, and the angle between the first connecting surface 679a and the second step surface 678 may be an obtuse angle or a right angle. The slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670. The two light-emitting through holes 674 are both formed on the first step surface 677 and are located on the same side of the slit 675. The center lines of the two light-emitting through holes 674 are perpendicular to the extending direction of the slit 675. The two lens modules 68 are respectively received in the camera housing 67 and respectively correspond to the two light-emitting through holes 674. The two image sensors 65 are received in the camera housing 67 and respectively correspond to the two lens modules 68. Light outside 100 can pass through the light through hole 674 and the lens module 68 and be transmitted to the image sensor 65. In this embodiment, the imaging module 60 may be a visible light camera 61. In this case, the two lens modules 68 are lens modules corresponding to the visible light camera 61. The photosensor 50 is disposed on the second step 678 and outside the camera housing 67. The photosensor 50 is a single package structure. In other embodiments, the imaging module 60 may be an infrared camera 62. In this case, the two lens modules 68 are lens modules corresponding to the infrared camera 62. In another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The lens module 68 is a lens module corresponding to the infrared light camera 62, and the other lens module 68 is a visible light camera 61. Lens module.

The imaging module 60 of the present embodiment is provided with a slit 675, and the photo sensor 50 is disposed on the second step 678, so that the photo sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is shared. Smaller, saving installation space in the electronic device 100.

Referring to FIG. 62, in some embodiments, the slit 675 of the above embodiment is disposed at a middle position of the top surface 670, and the first step surface 677 is divided by the slit 675 into the first sub-step surface 677a and the second sub-step surface. 677b, the first sub-surface 677a and the second sub-surface 677b are respectively located on opposite sides of the slit 675, and the two light-emitting through holes 674 are respectively opened on the first sub-surface 677a and the second sub-surface 677b, and are installed on The lens modules 68 within the camera housing 67 are also located on opposite sides of the slit 675. At this time, the slit 675 is surrounded by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b. The first connecting surface 679a is obliquely connected to the first sub-top surface 677a and the second ladder surface 678 and is located at the first sub-surface. Between the top surface 677a and the second step surface 678, the second connecting surface 679b is obliquely connected to the second sub-top surface 677b and the second step surface 678 and located between the second sub-top surface 677b and the second ladder surface 678. In this embodiment, the first step surface 677 is parallel to the second step surface 678, the angle between the first connecting surface 679a and the first sub-surface 677a is an obtuse angle, and the second connecting surface 679b is sandwiched by the second sub-surface 677b. The angle is an obtuse angle. In other embodiments, the angle between the first connecting surface 679a and the first sub-surface 677a is a right angle, and the angle between the second connecting surface 679b and the second sub-surface 677b is a right angle. With respect to the opening position of the slit 675 at the edge of the top surface 670, the slit 675 of the present embodiment is opened at the intermediate position of the top surface 670 to make the width of the slit 675 wider, thereby facilitating the placement of the photosensor 50 on the second surface. 678.

Referring to FIG. 61 and FIG. 62, in some embodiments, the photosensor 50 of the above embodiment is disposed on the second step 678 and located outside the camera housing 67. Specifically, when the slit 675 is opened at the edge position of the top surface 670, the projection of the entire photo sensor 50 along the second step 678 may be located in the second step 678 (as shown in FIG. 61); or A portion of the photosensor 50 is located within the second step 678 along a projection perpendicular to the second step 678. That is, at least a portion of the photosensor 50 is located directly above the second step 678. When the slit 675 is opened in the middle of the top surface 670, the projection of the entire photosensor 50 along the second plane 678 can be located within the second step 678 (as shown in FIG. 62). In this way, the photo sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small, which further saves the installation space in the electronic device 100.

Referring to FIG. 63, the second step 678 of the above embodiment is provided with a light transmission hole 676. The light sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676. Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the photosensor 50. The photosensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the photosensor 50 and the camera housing 67 more stable and to facilitate mounting the photosensor 50 and the imaging module 60 to the casing 20.

Referring to FIG. 64 , in some embodiments, the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the light sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . The imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66. The photo sensor 50 can also be fixed on the substrate 66 and housed in the camera housing 67. Specifically, an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100. In other embodiments, the light sensor 50 can also be coupled to an FPC.

Embodiment 5:

Referring to FIG. 65, an electronic device 100 according to an embodiment of the present invention includes a casing 20, a cover 30, and electronic components. The electronic components include an input and output module 10, a proximity sensor 50 (Fig. 51), an imaging module 60 (Fig. 51), a receiver 70, and a structured light projector 80. The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc. The embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here. The drawings for describing the present embodiment will be the same as those of the above-mentioned fourth embodiment. It can be understood that the same reference numerals in the drawings may have different meanings in the present embodiment and the fourth embodiment. description of.

Referring to FIG. 44 to FIG. 46, the input/output module 10 is a single package structure, including a package housing 11, an infrared lamp 12, a light guiding element 13, and a light sensor 1a.

The package housing 11 is used to simultaneously package the infrared lamp 12, the light guiding element 13 and the photosensor 1a, or the infrared lamp 12, the light guiding element 13 and the photo sensor 1a are simultaneously packaged in the package housing 11. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an electromagnetic interference (EMI) shielding material to prevent external electromagnetic interference from affecting the input/output module 10.

Referring to FIG. 47, the package substrate 111 is used to simultaneously carry the infrared lamp 12 and the photosensor 1a. When the input/output module 10 is manufactured, the infrared lamp 12 and the photo sensor 1a can be formed on one chip 14, and the infrared lamp 12, the photosensor 1a and the chip 14 are disposed together on the package substrate 111. Specifically, The chip 14 is bonded to the package substrate 111. At the same time, the package substrate 111 can also be used to connect with other components of the electronic device 100 (for example, the casing 20 of the electronic device 100, the motherboard, etc.) to fix the input/output module 10 in the electronic device 100. Both the infrared lamp 12 and the photosensor 1a can be formed on one chip 14 to further reduce the volume of the integrated infrared lamp 12 and the photo sensor 1a, and the preparation process is relatively simple.

The package sidewall 112 can be disposed around the infrared lamp 12, the light guiding component 13 and the photosensor 1a. The package sidewall 112 extends from the package substrate 111, and the package sidewall 112 can be combined with the package substrate 111. Preferably, the package sidewall 112 is The package substrate 111 is detachably connected to facilitate inspection of the infrared lamp 12 and the photosensor 1a after the package sidewall 112 is removed. The material of the package sidewall 112 may be a material that is not transparent to infrared light to prevent infrared light emitted by the infrared lamp 12 from passing through the package sidewall 112.

The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. The package top 113 is formed with a light-emitting window 1131 and a light-sensing window 1132. The light-emitting window 1131 corresponds to the infrared light 12, and the infrared light emitted by the infrared light 12 passes through the light-emitting window 1131. The light-sensing window 1132 corresponds to the light sensor 1a, and the visible light can It passes through the light sensing window 1132 and is incident on the light sensor 1a. The package top 113 and the package sidewalls 112 may be integrally formed or may be separately formed. In one example, the light-emitting window 1131 and the light-sensing window 1132 are both through holes, and the package top portion 113 is made of a material that is opaque to infrared light and opaque to visible light. In another example, the package top 113 is made of a material that is not transparent to infrared light, infrared light, opaque light, and visible light. Specifically, the light emitting window 1131 is made of a material that transmits infrared light. The light sensing window 1132 is made of a material that transmits visible light, and the remaining portion is made of a material that is impermeable to infrared light and is not transparent to visible light. Further, the light emitting window 1131 may be formed with a lens structure to improve infrared light emitted from the light emitting window 1131. The emission angle, for example, the illumination window 1131 is formed with a concave lens structure such that the light passing through the illumination window 1131 is diverged and emitted outward; the illumination window 1131 is formed with a convex lens structure to cause the light passing through the illumination window 1131 to be gathered and emitted outward; The window 1132 may also be formed with a lens structure to improve the visible light emission angle incident from the light sensing window 1132. For example, the light sensing window 1132 has a convex lens structure to cause the light incident from the light sensing window 1132 to be gathered and projected onto the light sensor 1a.

Referring to FIG. 47, the driving member 17 includes a linear motor including a stator 172 and a mover 174. The stator 172 is mounted on the package side wall 112, the mover 174 is coupled to the light guiding member 13, and the driving member 17 drives the mover 174 to move. The light guiding element 13 is driven to move. Referring to FIG. 48, the structure of the driving member 17 may be replaced by: the driving member 17 includes a linear motor, the linear motor includes a stator 172 and a mover 174, the stator 172 is mounted on the package sidewall 112, and the input/output module 10 further includes a rotating shaft. 18 and the connecting arm 19, the first end of the connecting arm 19 is connected to the light guiding element 13, the mover 174 is connected with the second end of the connecting arm 19 away from the light guiding element 13, and the connecting arm 19 is sleeved on the rotating shaft 18, and the rotating shaft 18 Located between the light guiding element 13 and the mover 174, the mover 174 of the linear motor drives the second end of the connecting arm 19 to move, and the connecting arm 19 rotates about the rotating shaft 18, whereby the first end of the connecting arm 19 drives the light guiding The element 13 is rotated about the rotating shaft 18 to realize that the light guiding element 13 is on the illuminating light path of the infrared lamp 12 or away from the illuminating light path of the infrared lamp 12. In the embodiment of the present invention, the input/output module 10 may further include a carrier board (not shown). The carrier board is provided with a bearing hole, the light guiding component 13 is installed in the bearing hole, and the driving component 17 is used to drive the carrier board. The movement moves the light guiding element 13 to move.

When the infrared lamp 12 is turned on and used as an infrared fill light to emit infrared light to the outside of the package housing 11, the infrared light passes through the illumination window 1131 to be projected onto the surface of the object, and the infrared light camera 62 of the electronic device 100 (shown in FIG. 65) receives. The infrared light reflected by the object acquires image information of the object (at this time, the infrared lamp 12 is used for infrared fill light). When the infrared lamp 12 is turned on and used as a near-infrared lamp to emit infrared light to the outside of the package housing 11, the infrared light passes through the illumination window 1131 and reaches the surface of the object, and the proximity sensor 50 of the electronic device 100 (shown in FIG. 50) receives the object reflection. The infrared light is used to detect the distance of the object to the electronic device 100 (at this time, the infrared lamp 12 is used for infrared ranging).

The photosensor 1a receives visible light in ambient light incident from the light sensing window 1132 and detects the intensity of visible light.

Referring to FIG. 49, in the embodiment of the present invention, the input/output module 10 is formed with a ground pin 1e, an infrared lamp pin 1f, and a light sensing pin 1g. The ground pin 1e, the infrared lamp pin 1f, and the light sensing pin 1g may be formed on the package substrate 111 when the ground pin 1e and the infrared lamp pin 1f are enabled (ie, the ground pin 1e and the infrared lamp lead) When the foot 1f access circuit is turned on, the infrared lamp 12 emits infrared light; when the ground pin 1e and the light sensing pin 1g are enabled (that is, when the ground pin 1e and the light sensing pin 1g are connected to the circuit) The photosensor 1a detects the intensity of visible light as a basis for controlling the display brightness of the display screen 90.

Referring to FIG. 50 and FIG. 65, the casing 20 can be used as a mounting carrier for the input/output module 10, or the input/output module 10 can be disposed in the casing 20. The casing 20 can be the outer casing of the electronic device 100. In the embodiment of the present invention, the casing 20 can also be used to set the display 90 of the electronic device 100. The input and output module 10 of the embodiment of the present invention occupies a small volume. Therefore, the volume for setting the display screen 90 in the casing 20 can be correspondingly increased to increase the screen ratio of the electronic device 100. Specifically, the casing 20 includes a top portion 21 and a bottom portion 22, and the display screen 90 and the input/output module 10 are disposed between the top portion 21 and the bottom portion 22. The top portion 21 is located above the bottom portion 22 in a state where the user normally uses the electronic device 100. As shown in FIG. 65, the input/output module 10 can be disposed between the display screen 90 and the top portion 21. In other embodiments, the display screen 90 may be provided with a gap for the full screen, the display screen 90 encloses the input and output module 10, and the input and output module 10 is exposed from the gap of the display screen 90.

The casing 20 also has an organic shell light source through hole 23 and a casing light inductive hole 24. When the input/output module 10 is disposed in the casing 20, the infrared lamp 12 corresponds to the casing light source through hole 23, and the photosensor 1a corresponds to the casing light inductive hole 24. The infrared light 12 and the light source through hole 23 of the casing correspond to the light emitted by the infrared light 12 and can pass through the through hole 23 of the casing light source. Specifically, the infrared light 12 and the through hole 23 of the casing light source may be opposite to each other. The light emitted by the infrared lamp 12 passes through the light source through hole 23 after being acted upon by the light guiding element 13. The light sensor 1a corresponds to the light-sensitive through-hole 24 of the casing, and the visible light can pass through the light-sensitive through-hole 24 of the casing and enter the photosensor 1a. Specifically, the light sensor 1a and the casing can be light-sensible. The hole 24 is facing right, and the light incident on the visible light passes through the light-sensitive through hole 24 of the casing and is incident on the photosensor 1a after being acted upon by the light guiding element. The casing light source through hole 23 and the casing light inducting hole 24 may be spaced apart from each other. Of course, in other embodiments, the casing light source through hole 23 and the casing light inducting hole 24 may also be in communication with each other.

The cover plate 30 may be light transmissive, and the material of the cover plate 30 may be light transmissive glass, resin, plastic or the like. The cover plate 30 is disposed on the casing 20, and the cover plate 30 includes an inner surface 32 combined with the casing 20, and an outer surface 31 opposite to the inner surface 32. The light emitted by the input/output module 10 sequentially passes through the inner surface 32. The cover plate 30 is then passed through the outer surface 31. In the embodiment shown in FIG. 50, the cover plate 30 covers the casing light source through hole 23 and the casing light inductive hole 24, and the inner surface 32 of the cover plate 30 is coated with infrared transmission ink 40 for infrared transmission. The ink 40 has a high transmittance to infrared light, for example, 85% or more, and has a high attenuation rate for visible light, for example, 70% or more, so that the user can hardly see the electrons in normal use. The area of device 100 that is covered by infrared light through ink 40. In particular, the infrared permeable ink 40 can cover an area of the inner surface 32 that does not correspond to the display screen 90.

The infrared light transmitting ink 40 can also block the through-hole 23 of the casing light source (as shown in FIG. 50). It is difficult for the user to see the internal structure of the electronic device 100 through the through-hole 23 of the casing light source, and the electronic device 100 has a beautiful appearance.

Referring to Figure 51, the proximity sensor 50 is a single package. The infrared lamp 12 is used as an infrared light emitted outwardly when the infrared lamp is used. After being reflected by an external object, the infrared light is received by the proximity sensor 50. The proximity sensor 50 determines the external object and the electronic device 100 according to the received infrared light reflected by the object. The distance between them.

Referring to FIG. 51 and FIG. 65, the imaging module 60 may be one or both of the visible light camera 61 and the infrared light camera 62. The imaging module 60 includes a lens holder 63, a lens barrel 64, and an image sensor 65. The lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63. The mirror holder 63 includes a mounting surface 631 between the lens barrel 64 and the image sensor 65. In the embodiment shown in FIG. 51, the proximity sensor 50 is disposed on the mounting surface 631. Specifically, the proximity projection 50 is projected at least partially onto the mounting surface 631 at the plane in which the mounting surface 631 is located. Thus, the proximity sensor The imaging module 60 is relatively compact and the lateral space occupied by the two is relatively small.

Referring to FIG. 65, the receiver 70 is configured to emit an acoustic signal when excited by the power source, and the user can make a call through the receiver 70. The structured light projector 80 is configured to emit structured light outwardly, and the structured light is reflected onto the object to be measured and then reflected. The reflected structured light can be received by the infrared light camera 62, and the processor of the electronic device 100 further analyzes the infrared light camera 62. Receive structured light to obtain depth information of the measured object.

In the embodiment shown in FIG. 65, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, an input/output module 10, an infrared light camera 62, a visible light camera 61, a receiver 70, and a center of the structured light projector 80. Located on the same line segment. Specifically, from one end of the line segment to the other end, the input/output module 10, the structured light projector 80, the receiver 70, the infrared light camera 62, and the visible light camera 61 (shown in FIG. 52) are sequentially, at this time, the visible light camera 61 and The infrared camera 62 may constitute a dual camera (as shown in FIG. 61); or from one end of the line to the other, the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80. (as shown in FIG. 65); or from one end of the line segment to the other end, the infrared light camera 62, the input/output module 10, the receiver 70, the visible light camera 61, the structured light projector 80; or from one end of the line segment to the other end In turn, the infrared camera 62, the visible light camera 61, the receiver 70, the input/output module 10, and the structured light projector 80. At this time, the visible light camera 61 and the infrared light camera 62 can constitute a dual camera (as shown in FIG. 61). Of course, the arrangement of the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in an arc. The shape and the center are arranged in a shape such as a rectangle.

Further, please refer to FIG. 51, the proximity sensor 50 may be disposed on the mounting surface 631 of the infrared light camera 62, or may be disposed on the mounting surface 631 of the visible light camera 61. Of course, the proximity sensor 50 may not be disposed on the mounting surface 631. The proximity sensor 50 can be disposed adjacent to the input/output module 10, and the proximity sensor 50 can easily receive the infrared light emitted by the infrared lamp 12 when it is used as a proximity infrared lamp, and reflected by an external object; the proximity sensor 50 can also be The receiver 70 is disposed adjacent to each other, and when the user answers the call, the proximity sensor 50 easily detects that the user's ear is close to the receiver 70.

In summary, in the electronic device 100 of the embodiment of the present invention, by moving the position of the light guiding element 13, the input/output module 10 can be used as a near infrared light or an infrared fill light, and the infrared light 12, the light guiding element 13 and the light The sensor 1a is integrated into a single package structure, so that the input/output module 10 integrates the functions of emitting infrared light with infrared ranging and infrared filling light and detecting the intensity of visible light. Secondly, compared with the current electronic device, the near-infrared lamp and the infrared fill lamp need to be disposed at the same time, the input/output module 10 of the embodiment of the present invention only needs to set an infrared lamp 12, which is small in size, and saves the infrared compensation. Space for light and infrared ranging functions. Further, the infrared lamp 12 and the photo sensor 1a are integrated into a single package structure, and the input/output module 10 has a high integration degree and a small volume, thereby saving the intensity of infrared ranging, infrared supplementation, and visible light. The space for detecting features. Furthermore, since only one infrared lamp 12 and the photo sensor 1a need to be disposed on the same package substrate 111 for packaging, different crystals are required for the infrared fill lamp, the near-infrared lamp and the photosensor 1a compared with the conventional process. The round manufacturing is combined with the package on the PCB substrate to improve the packaging efficiency.

Referring to FIG. 47 again, in some embodiments, the input and output module 10 further includes a light sensitive lens 1b. The photo-sensitive lens 1b is disposed in the package casing 11 and corresponds to the photosensor 1a. The light-sensitive lens 1b condenses visible light onto the photosensor 1a, and reduces the amount of light that is transmitted to the region other than the photosensor 1a.

Referring to FIG. 47, in some embodiments, the input/output module 10 further includes a metal shielding plate 1c. The metal shielding plate 1c is located in the package housing 11 and located between the infrared lamp 12 and the photosensor 1a. The metal shielding plate 1c is located between the infrared lamp 12 and the photosensor 1a, and can prevent the infrared light emitted from the infrared lamp 12 from entering the photosensor 1a, and can also shield the electromagnetic interference between the infrared lamp 12 and the photosensor 1a. .

Referring to FIG. 53 , in some embodiments, the input and output module 10 further includes an optical enclosure 16 . The optical enclosure 16 is made of a light transmissive material, and an optical enclosure 16 is formed on the package substrate 111 and within the package housing 11. The optical enclosure 16 encases the infrared lamp 12 and the photosensor 1a. Specifically, the optical enclosure 16 can be formed by a potting injection molding process, and the optical enclosure 16 can be made of a transparent thermosetting epoxy resin to be hard to soften in use, and the optical enclosure 16 can fix the infrared lamp 12 and the light perception. The relative position between the devices 1a causes the infrared lamp 12 and the photosensor 1a to be less likely to sway within the package housing 11. At this time, the light guiding element 13 is disposed outside the optical enclosure 16 and is movably housed in the package casing 11.

Referring to FIG. 53, in some embodiments, the input/output module 10 further includes a light-emitting partition 1d formed in the optical enclosure 16 between the infrared lamp 12 and the photosensor 1a. The light exiting partition 1d can block the infrared light 12 from emitting infrared light onto the photosensor 1a while blocking the visible light entering from the light sensing window 1132 and incident on the photosensor 1a to affect the illumination of the infrared lamp 12.

Referring to FIG. 51, in some embodiments, the proximity sensor 50 of the above embodiment may be disposed on the mounting surface 631 of the mirror mount 63. The mirror mount 63 may be the mirror mount 63 of the infrared light camera 62 or the mirror mount 63 of the visible light camera 61.

Referring to FIG. 66, in some embodiments, the casing 20 further has an organic sound hole (not shown), and the cover 30 is further provided with a cover sound hole 34, and the receiver 70 and the cover sound hole. 34 corresponds to the position of the sound hole of the case. The centers of the input/output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20.

The center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (the input/output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover 30. In the embodiment shown in FIG. 66, the cover sound hole 34 is opened at the edge of the cover 30, and the sound hole of the casing is opened near the top 21.

Referring to FIG. 56, in some embodiments, a cover light-sensing through hole 35 is defined in the cover 30, and the cover light-sensitive through-hole 35 corresponds to the light-sensitive through-hole 24 of the casing and the photosensor 1a. The visible light outside the electronic device 100 passes through the cover light-sensitive through hole 35 and the chassis light-sensitive through hole 24, and can be incident on the photosensor 1a.

Referring to FIG. 57, in some embodiments, the imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66, and the proximity sensor 50 can also be fixed on the substrate 66. Specifically, the substrate 66 is provided with an FPC. A part of the substrate 66 is located in the lens holder 63, and another part protrudes from the lens holder 63. One end of the FPC is located in the lens holder 63 and is used to carry the image sensor 65, and the other end can be The main board of the electronic device 100 is connected. When the proximity sensor 50 is disposed on the substrate 66, the proximity sensor 50 is disposed outside the lens holder 63, and the proximity sensor 50 may be coupled to the FPC.

The imaging module 60 can be one or both of the visible light camera 61 and the infrared light camera 62. Specifically, the proximity sensor 50 may be fixed on the substrate 66 of the visible light camera 61; the proximity sensor 50 may be fixed on the substrate 66 of the infrared light camera 62. Further, the substrate 66 further includes a reinforcing plate disposed on a side opposite to the proximity sensor 50 to increase the overall strength of the substrate 66, so that the FPC is less likely to be wound, and the proximity sensor 50 is disposed on the substrate 66. It is not easy to shake when it is. In one example, the proximity sensor 50 can also be attached to the outer sidewall of the mirror mount 63, such as by adhesive bonding to the outer sidewall of the mirror mount 63.

Referring to FIG. 58 , in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiment may be replaced with the following structure: the imaging module 60 includes an image sensor 65 , a camera housing 67 , and a lens module 68 . The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673, and the second sub-top surface 672 and the first sub-top surface The 671 is obliquely connected and forms a slit 675 with the first sub-top surface 671. The third sub-top surface 673 is obliquely connected to the second sub-top surface 672. The second sub-top surface 672 is located at the first sub-top surface 671 and the third sub-top surface. Between the 673, the first sub-top surface 671 and the third sub-top surface 673 are connected. The angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle. The slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670. The third sub-top surface 673 is provided with a light-emitting through hole 674. The lens module 68 is received in the camera housing 67 and corresponds to the light-emitting through hole 674. The image sensor 65 is received in the camera housing 67 and corresponding to the lens module 68. The light outside the electronic device 100 can pass through the light-emitting through-hole 674 and the lens module 68 and be transmitted to the image sensor 65. The image sensor 65 transmits the light signal. Converted to an electrical signal. The proximity sensor 50 is disposed at the first sub-top surface 671. In the embodiment, the imaging module 60 may be a visible light camera 61, and the proximity sensor 50 is a single package.

The imaging module 60 of the present embodiment is provided with a slit 675, and the proximity sensor 50 is disposed on the first sub-top surface 671, so that the proximity sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small. Small, saving installation space in the electronic device 100.

Referring to FIG. 58 , in some embodiments, the proximity sensor 50 of the above embodiment is disposed on the first sub top surface 671 and located outside the camera housing 67 . Specifically, the entire proximity sensor 50 is perpendicular to the first The projections of the sub-top surface 671 can all be located within the first sub-top surface 671 (as shown in FIG. 57); alternatively, the partial proximity sensor 50 is located within the first sub-top surface 671 along a projection perpendicular to the first sub-top surface 671. That is to say, at least a portion of the proximity sensor 50 is located directly above the first sub-top surface 671. Thus, the proximity sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is small, further saving electrons. The installation space within the device 100.

Referring to FIG. 59, the first sub-top surface 671 of the above embodiment is provided with a light transmission hole 676. The proximity sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676. Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 50. The proximity sensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 50 and the camera housing 67 more stable and to facilitate mounting of the proximity sensor 50 and the imaging module 60 to the casing 20.

Referring to FIG. 60 , in some embodiments, the first sub top surface 671 of the above embodiment is provided with a light transmission hole 676 , and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . The imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66. The proximity sensor 50 can also be fixed on the substrate 66 and housed in the camera housing 67. Specifically, an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100. In other embodiments, the proximity sensor 50 can also be coupled to the FPC.

The proximity sensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 50 and the camera housing 67 more stable and to facilitate mounting the proximity sensor 50 and the imaging module 60 to the casing 20; The group 60 sets the substrate 66 and places the proximity sensor 50 on the substrate 66 so that the proximity sensor 50 can be stably mounted in the camera housing 67.

Referring to FIG. 61, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiment may be replaced by the following structure: the imaging module 60 is a dual camera module, and includes two image sensors 65 and a camera housing. 67 and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 that is lower than the first step surface 677, and a first connection surface 679a. The first connecting surface 679a is obliquely connected to the second step 678 and forms a slit 675 with the second step 678. The first connecting surface 679a is obliquely connected to the first step 677, and the first connecting surface 679a is located at the first step 677 and The second step 678 is connected between the first step 677 and the second step 678. The angle between the first connecting surface 679a and the first step surface 677 may be an obtuse angle or a right angle, and the angle between the first connecting surface 679a and the second step surface 678 may be an obtuse angle or a right angle. The slit 675 is opened on one end of the camera housing 67, that is, the slit 675 is located at the edge of the top surface 670. The two light-emitting through holes 674 are both formed on the first step surface 677 and are located on the same side of the slit 675. The center lines of the two light-emitting through holes 674 are perpendicular to the extending direction of the slit 675. The two lens modules 68 are respectively received in the camera housing 67 and respectively correspond to the two light-emitting through holes 674. The two image sensors 65 are received in the camera housing 67 and respectively correspond to the two lens modules 68. Light outside 100 can pass through the light through hole 674 and the lens module 68 and be transmitted to the image sensor 65. In this embodiment, the imaging module 60 may be a visible light camera 61. In this case, the two lens modules 68 are lens modules corresponding to the visible light camera 61. The proximity sensor 50 is disposed on the second step 678 and outside the camera housing 67. The proximity sensor 50 is a single package. In other embodiments, the imaging module 60 may be an infrared camera 62. In this case, the two lens modules 68 are lens modules corresponding to the infrared camera 62. In another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The lens module 68 is a lens module corresponding to the infrared light camera 62, and the other lens module 68 is a visible light camera 61. Lens module.

The imaging module 60 of the present embodiment is provided with a slit 675, and the proximity sensor 50 is disposed on the second step 678, so that the proximity sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small. The installation space in the electronic device 100 is saved.

Referring to FIG. 62, in some embodiments, the slit 675 of the above embodiment is disposed at a middle position of the top surface 670, and the first step surface 677 is divided by the slit 675 into the first sub-step surface 677a and the second sub-step surface. 677b, the first sub-surface 677a and the second sub-surface 677b are respectively located on opposite sides of the slit 675, and the two light-emitting through holes 674 are respectively opened on the first sub-surface 677a and the second sub-surface 677b, and are installed on The lens modules 68 within the camera housing 67 are also located on opposite sides of the slit 675. At this time, the slit 675 is surrounded by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b. The first connecting surface 679a is obliquely connected to the first sub-top surface 677a and the second ladder surface 678 and is located at the first sub-surface. Between the top surface 677a and the second step surface 678, the second connecting surface 679b is obliquely connected to the second sub-top surface 677b and the second step surface 678 and located between the second sub-top surface 677b and the second ladder surface 678. In this embodiment, the first step surface 677 is parallel to the second step surface 678, the angle between the first connecting surface 679a and the first sub-surface 677a is an obtuse angle, and the second connecting surface 679b is sandwiched by the second sub-surface 677b. The angle is an obtuse angle. In other embodiments, the angle between the first connecting surface 679a and the first sub-surface 677a is a right angle, and the angle between the second connecting surface 679b and the second sub-surface 677b is a right angle. With respect to the opening of the slit 675 at the edge position of the top surface 670, the slit 675 of the present embodiment is opened at an intermediate position of the top surface 670 to make the width of the slit 675 wider, thereby facilitating the placement of the proximity sensor 50 on the second step 678. on.

Referring to FIG. 61 and FIG. 62, in some embodiments, the proximity sensor 50 of the above embodiment is disposed on the second step 678 and located outside the camera housing 67. Specifically, when the slit 675 is opened at the edge position of the top surface 670, the projection of the entire proximity sensor 50 along the second ladder surface 678 may be located in the second ladder surface 678 (as shown in FIG. 61); or, part The proximity sensor 50 is located within the second step 678 along a projection perpendicular to the second step 678. That is, at least a portion of the proximity sensor 50 is located directly above the second step 678. When the slit 675 is opened in the middle of the top surface 670, the projection of the entire proximity sensor 50 along the second plane 678 can be located within the second step 678 (as shown in FIG. 62). As such, the proximity sensor 50 and the imaging module 60 are relatively compact, and the lateral space occupied by the two is relatively small, which further saves the installation space in the electronic device 100.

Referring to FIG. 63, the second step 678 of the above embodiment is provided with a light transmission hole 676. The proximity sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676. Light outside the electronic device 100 can pass through the light transmission hole 676 and be transmitted to the proximity sensor 50. The proximity sensor 50 of the present embodiment is disposed in the camera housing 67 to make the structure of the proximity sensor 50 and the camera housing 67 more stable and to facilitate mounting of the proximity sensor 50 and the imaging module 60 to the casing 20.

Referring to FIG. 64 , in some embodiments, the second step 678 of the above embodiment is provided with a light transmission hole 676 , and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light transmission hole 676 . The imaging module 60 further includes a substrate 66. The image sensor 65 is disposed on the substrate 66. The proximity sensor 50 can also be fixed on the substrate 66 and housed in the camera housing 67. Specifically, an FPC is disposed on the substrate 66. One end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65, and the other end is connected to the main board of the electronic device 100. In other embodiments, the proximity sensor 50 can also be coupled to the FPC.

Example 6:

Referring to FIG. 67, an electronic device 100 according to an embodiment of the present invention includes a casing 20, a cover 30, and electronic components. The electronic components include an input and output module 10, an imaging module 60, a receiver 70, and a structured light projector 80. The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart wristband, a teller machine, etc. The embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example. It can be understood that the specific form of the electronic device 100 may be other There are no restrictions here.

Referring to FIG. 68 to FIG. 70, the input/output module 10 is a single package structure, including a package housing 11, an infrared lamp 12, a light guiding element 13, a proximity sensor 50, and a photo sensor 1a.

The package housing 11 is used for simultaneously encapsulating the infrared lamp 12, the light guiding element 13, the proximity sensor 50, and the photosensor 1a, or the infrared lamp 12, the light guiding element 13, the proximity sensor 50, and the photosensor 1a are simultaneously packaged in the package housing. 11 inside. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an electromagnetic interference (EMI) shielding material to prevent external electromagnetic interference from affecting the input/output module 10.

Referring to FIG. 71, the package substrate 111 is used to simultaneously carry the infrared lamp 12, the proximity sensor 50, and the photosensor 1a. When the input/output module 10 is manufactured, the infrared lamp 12, the proximity sensor 50, and the photosensor 1a may be formed on one chip 14, and the infrared lamp 12, the proximity sensor 50, the photosensor 1a, and the chip 14 are disposed together in the package. On the substrate 111, specifically, the chip 14 can be bonded to the package substrate 111. At the same time, the package substrate 111 can also be used to connect with other components of the electronic device 100 (for example, the casing 20 of the electronic device 100, the motherboard, etc.) to fix the input/output module 10 in the electronic device 100. Both the infrared lamp 12 and the photosensor 1a can be formed on one chip 14 to further reduce the volume of the integrated infrared lamp 12 and the photo sensor 1a, and the preparation process is relatively simple.

The package sidewalls 112 may be disposed around the infrared lamp 12, the light guiding component 13, the proximity sensor 50, and the photosensor 1a. The package sidewalls 112 extend from the package substrate 111, and the package sidewalls 112 may be combined with the package substrate 111, preferably, the package. The sidewall 112 is detachably connected to the package substrate 111 to facilitate inspection of the infrared lamp 12, the proximity sensor 50, and the photosensor 1a after the package sidewall 112 is removed. The material of the package sidewall 112 may be a material that is not transparent to infrared light to prevent infrared light emitted by the infrared lamp 12 from passing through the package sidewall 112.

The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. The package top 113 is formed with a light-emitting window 1131, a proximity sensor window 1134 and a light-sensing window 1132. The light-emitting window 1131 corresponds to the infrared light 12, and the infrared light emitted by the infrared light 12 passes through the light-emitting window 1131; the proximity sensor window 1134 and the proximity sensor 50 Correspondingly, the infrared light emitted by the near infrared or the like as the near infrared light can be reflected by the object and can pass through the proximity sensor window 1134 and enter the proximity sensor 50; the light sensing window 1132 corresponds to the light sensor 1a, and the visible light can pass through the light sense. The window 1132 is incident on the photosensor 1a. The package top 113 and the package sidewalls 112 may be integrally formed or may be separately formed. In one example, the light-emitting window 1131 and the light-sensing window 1132 are both through holes, and the package top portion 113 is made of a material that is opaque to infrared light and opaque to visible light. In another example, the package top 113 is made of a material that is not transparent to infrared light, infrared light, opaque light, and visible light. Specifically, the light emitting window 1131 is made of a material that transmits infrared light. The light sensing window 1132 is made of a material that transmits visible light, and the remaining portion is made of a material that is impermeable to infrared light and is not transparent to visible light. Further, the light emitting window 1131 may be formed with a lens structure to improve infrared light emitted from the light emitting window 1131. The emission angle, for example, the light-emitting window 1131 is formed with a concave lens structure such that the light passing through the light-emitting window 1131 is diverged and emitted outward; the light-emitting window 1131 is formed with a convex lens structure so that the light passing through the light-emitting window 1131 is gathered and emitted outward; the proximity sensor The window 1134 is formed with a convex lens mechanism to cause the infrared light passing through the proximity sensor window 1134 to be gathered inward and projected onto the proximity sensor 50; the light sensing window 1132 may also be formed with a lens structure to improve visible light incident from the light sensing window 1132. The emission angle, for example, the light perception window 1132 has a convex lens structure to cause the light incident from the light sensing window 1132 to be gathered and cast It is incident on the photosensor 1a.

The light guiding element 13 is movably disposed on the light emitting path of the infrared lamp 12. Referring to FIG. 71 and FIG. 72, the input/output module 10 further includes a driving member 17 for driving the light guiding member 13 to be movably disposed on the light emitting path of the infrared lamp 12. The driving member 17 driving the light guiding element 13 to be movably disposed on the light emitting path of the infrared lamp 12 includes: in a normal state, the light guiding element 13 is disposed on the light emitting path of the infrared lamp 12, and the infrared lamp 12 is used as the infrared light. a fill light (or near infrared light), when the infrared light 12 is used as a proximity infrared light (or an infrared fill light), the driving member 17 drives the light guiding element 13 to move away from the light emitting path of the infrared light 12; or, under normal conditions, The light guiding element 13 is not disposed on the light emitting path of the infrared lamp 12, the infrared lamp 12 is used as the near infrared light (or infrared fill light), and when the infrared light 12 is used as the infrared fill light (or near the infrared light), the driving member The 17 driving light guiding element 13 is moved to the light emitting path of the infrared lamp 12.

Referring to FIG. 71, the driving member 17 includes a linear motor including a stator 172 and a mover 174. The stator 172 is mounted on the package sidewall 112, the mover 174 is coupled to the light guiding member 13, and the driving member 17 drives the mover 174 to move. The light guiding element 13 is driven to move. Referring to FIG. 72, the structure of the driving member 17 may be replaced by: the driving member 17 includes a linear motor, the linear motor includes a stator 172 and a mover 174, the stator 172 is mounted on the package sidewall 112, and the input/output module 10 further includes a rotating shaft. 18 and the connecting arm 19, the first end of the connecting arm 19 is connected to the light guiding element 13, the mover 174 is connected with the second end of the connecting arm 19 away from the light guiding element 13, and the connecting arm 19 is sleeved on the rotating shaft 18, and the rotating shaft 18 Located between the light guiding element 13 and the mover 174, the mover 174 of the linear motor drives the second end of the connecting arm 19 to move, and the connecting arm 19 rotates about the rotating shaft 18, whereby the first end of the connecting arm 19 drives the light guiding The element 13 is rotated about the rotating shaft 18 to realize that the light guiding element 13 is on the illuminating light path of the infrared lamp 12 or away from the illuminating light path of the infrared lamp 12. In the embodiment of the present invention, the input/output module 10 may further include a carrier board (not shown). The carrier board is provided with a bearing hole, the light guiding component 13 is installed in the bearing hole, and the driving component 17 is used to drive the carrier board. The movement moves the light guiding element 13 to move.

Referring to FIG. 69, when the light guiding element 13 is located on the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 passes through the light guiding element 13 and is guided by the light guiding element 13 at a first angle of view from the package. The body 11 is emitted as a proximity infrared lamp; when the light guiding element 13 leaves the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 is emitted from the package housing 11 at a second angle of view as an infrared fill light. At this time, the first field of view angle is smaller than the second field of view angle, wherein the first field of view angle ranges from 10 degrees to 30 degrees, for example, the first field of view angle is 10 degrees, 15 degrees, 20 degrees, 25 degrees. Or 30 degrees, etc., the second field of view angle ranges from 60 degrees to 90 degrees, for example, the second field of view angle is 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 Degree, or 90 degrees, etc. The light guiding element 13 is for concentrating light, and the light guiding element 13 comprises a convex lens or a lens group having positive power, and the lens group may be one or more lenses. In the embodiment of the present invention, the angle of view refers to a range in which infrared light is emitted from the package housing 11 through the light-emitting window 1131.

Referring to FIG. 70, when the light guiding element 13 is located on the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 passes through the light guiding element 13 and acts from the package with the first field of view under the action of the light guiding element 13. The body 11 is emitted as an infrared fill light; when the light guiding element 13 leaves the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 is emitted from the package housing 11 at a second angle of view as a near infrared light. At this time, the first field of view angle is greater than the second field of view angle, wherein the first field of view angle ranges from 60 degrees to 90 degrees, for example, the first field of view angle is 60 degrees, 65 degrees, 70 degrees, 75 degrees. , 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees, etc., the second field of view angle ranges from 10 degrees to 30 degrees, for example, the second field of view angle is 10 degrees, 15 degrees, 20 degrees, 25 Degree, or 30 degrees, etc. The light guiding element 13 is for diverging light, and the light guiding element 13 comprises a concave lens or a lens group having a negative refractive power, and the lens group may be one or more lenses. In the embodiment of the present invention, the angle of view refers to a range in which infrared light is emitted from the package housing 11 through the light-emitting window 1131.

When the infrared lamp 12 is turned on and used as an infrared fill light to emit infrared light to the outside of the package housing 11, the infrared light passes through the illumination window 1131 to be projected onto the surface of the object, and the infrared light camera 62 of the electronic device 100 receives the infrared light reflected by the object. Obtain image information of the object (in this case, the infrared lamp 12 is used for infrared fill light). When the infrared lamp 12 is turned on and used as a near-infrared light to emit infrared light to the outside of the package housing 11, the infrared light passes through the illumination window 1131 and reaches the surface of the object, and the proximity sensor 50 receives the infrared light reflected by the object to detect the object to the input and output module. A distance of 10 (in this case, the infrared lamp 12 is used for infrared ranging).

Referring to FIG. 73, in the embodiment of the present invention, the input/output module 10 is formed with a ground pin 1e, an infrared lamp pin 1f, a proximity sensor pin 15 and a light sensing pin 1g. The ground pin 1e, the infrared lamp pin 1f, the proximity sensor pin 15 and the light sensing pin 1g may be formed on the package substrate 111 when the ground pin 1e and the infrared lamp pin 1f are enabled (ie, the ground lead When the foot 1e and the infrared lamp pin 1f are connected to the circuit, the infrared lamp 12 emits infrared light; when the ground pin and the proximity sensor pin 1g are enabled, the proximity sensor 50 receives the infrared lamp 12 reflected by the object. As the infrared light emitted by the infrared lamp; when the ground pin 1e and the light sensing pin 1g are enabled (that is, when the ground pin 1e and the light sensing pin 1g are connected to the circuit), the photosensor 1a detects the visible light intensity. As a basis for controlling the display brightness of the display screen 90.

Referring to FIG. 67, the casing 20 can be used as a mounting carrier for the input/output module 10, or the input/output module 10 can be disposed in the casing 20. The casing 20 can be the outer casing of the electronic device 100. In the embodiment of the present invention, the casing 20 can also be used to set the display 90 of the electronic device 100. The input and output module 10 of the embodiment of the present invention occupies a small volume. Therefore, the volume for setting the display screen 90 in the casing 20 can be correspondingly increased to increase the screen ratio of the electronic device 100. Specifically, the casing 20 includes a top portion 21 and a bottom portion 22, and the display screen 90 and the input/output module 10 are disposed between the top portion 21 and the bottom portion 22. The top portion 21 is located above the bottom portion 22 in a state where the user normally uses the electronic device 100. The input/output module 10 can be disposed between the display screen 90 and the top portion 21. In other embodiments, the display screen 90 may be provided with a gap for the full screen, the display screen 90 encloses the input and output module 10, and the input and output module 10 is exposed from the gap of the display screen 90.

The casing 20 also has an organic shell light source through hole 23, a casing proximity sensor through hole 26, and a casing light inductive hole 24. When the input/output module 10 is disposed in the casing 20, the infrared lamp 12 corresponds to the casing light source through hole 23, and the proximity sensor 50 corresponds to the casing proximity sensor through hole 26, and the light sensor 1a and the casing light inductive hole 24 correspond. The infrared light 12 and the light source through hole 23 of the casing correspond to the light emitted by the infrared light 12 and can pass through the through hole 23 of the casing light source. Specifically, the infrared light 12 and the through hole 23 of the casing light source may be opposite to each other. The light emitted by the infrared lamp 12 passes through the light source through hole 23 after being acted upon by the light guiding element 13. The light sensor 1a corresponds to the light-sensitive through-hole 24 of the casing, and the visible light can pass through the light-sensitive through-hole 24 of the casing and enter the photosensor 1a. Specifically, the light sensor 1a and the casing can be light-sensible. The hole 24 is facing right, and the light incident on the visible light passes through the light-sensitive through hole 24 of the casing and is incident on the photosensor 1a after being acted upon by the light guiding element. The proximity sensor 50 is similar to the case proximity sensor through hole 26, and will not be described herein. The casing light source through hole 23 and the casing light inducting hole 24 may be spaced apart from each other. Of course, in other embodiments, the casing light source through hole 23, the casing proximity sensor through hole 26, and the casing light inductive hole 24 It can also be connected to each other.

The cover plate 30 may be light transmissive, and the material of the cover plate 30 may be light transmissive glass, resin, plastic or the like. The cover plate 30 is disposed on the casing 20, and the cover plate 30 includes an inner surface 32 combined with the casing 20, and an outer surface 31 opposite to the inner surface 32. The light emitted by the input/output module 10 sequentially passes through the inner surface 32. The cover plate 30 is then passed through the outer surface 31. The cover plate 30 covers the casing light source through hole 23, the casing proximity sensor through hole 26 and the casing light inductive hole 24. The inner surface 32 of the cover plate 30 is coated with infrared transmitting ink 40, and the infrared transmitting ink 40 is paired. The infrared light has a high transmittance, for example, can reach 85% or more, and has a high attenuation rate for visible light, for example, can reach 70% or more, so that the user can hardly see the electronic device 100 in normal use. The area covered by the infrared light through the ink 40. In particular, the infrared permeable ink 40 can cover an area of the inner surface 32 that does not correspond to the display screen 90.

The infrared transmission ink 40 can also block at least one of the casing light source through hole 23 and the casing proximity sensor through hole 26, that is, the infrared transmission ink 40 can simultaneously cover the casing light source through hole 23 and the casing proximity sensor through hole. 26, the user is difficult to see the internal structure of the electronic device 100 through the casing light source through hole 23 and the casing proximity sensor through hole 26, the electronic device 100 has a beautiful appearance; the infrared transmission ink 40 can also cover the casing light source through hole 23 The cover sensor through hole 26 is not covered; or the infrared light transmitting ink can cover the case sensor through hole 26 without covering the case light source through hole 23.

Referring to FIG. 67, the receiver 70 is configured to emit an acoustic signal when excited by the power source, and the user can make a call through the receiver 70. The structured light projector 80 is configured to emit structured light outwardly, and the structured light is reflected onto the object to be measured and then reflected. The reflected structured light can be received by the infrared light camera 62, and the processor of the electronic device 100 further analyzes the infrared light camera 62. Receive structured light to obtain depth information of the measured object.

The imaging module 60 includes a visible light camera 61 and an infrared light camera 62. The centers of the input/output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70, and the structured light projector 80 are located on the same line segment. Specifically, from one end of the line segment to the other end, the input/output module 10, the structured light projector 80, the receiver 70, the infrared light camera 62, and the visible light camera 61 are sequentially formed. At this time, the visible light camera 61 and the infrared light camera 62 can form a double. Camera camera; or from one end of the line segment to the other end, the input/output module 10, the infrared light camera 62, the receiver 70, the visible light camera 61, the structured light projector 80; or the infrared light camera from one end of the line segment to the other end 62, the input/output module 10, the receiver 70, the visible light camera 61, the structured light projector 80; or from one end of the line segment to the other end, the infrared light camera 62, the visible light camera 61, the receiver 70, the input and output module 10, the structure The light projector 80, at this time, the visible light camera 61 and the infrared light camera 62 can constitute a dual camera. Of course, the arrangement of the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above examples, and there may be other, for example, the center of each electronic component is arranged in an arc. The shape and the center are arranged in a shape such as a rectangle.

In summary, in the electronic device 100 of the embodiment of the present invention, by moving the position of the light guiding element 13, the input/output module 10 can be used as a near infrared light or an infrared fill light, the infrared light 12, the light guiding element 13, and the proximity. The sensor 50 and the photosensor 1a are integrated into a single package structure, so that the input/output module 10 integrates the functions of emitting infrared light to perform infrared ranging and infrared filling, and detecting the intensity of visible light. Secondly, compared with the current electronic device, the near-infrared lamp and the infrared fill lamp need to be disposed at the same time, the input/output module 10 of the embodiment of the present invention only needs to set an infrared lamp 12, which is small in size, and saves the infrared compensation. Space for light and infrared ranging functions. Further, the infrared lamp 12, the proximity sensor 50 and the photosensor 1a are integrated into a single package structure, and the input/output module 10 has a high integration degree and a small volume, thereby saving infrared ranging, infrared filling, and And the space for the function of detecting the intensity of visible light. Furthermore, since only one infrared lamp 12, the proximity sensor 50, and the photosensor 1a need to be disposed on the same package substrate 111 for packaging, compared with the conventional process of the infrared fill lamp, the near-infrared lamp, and the photosensor 1a, Different wafer fabrications are combined and packaged onto the PCB substrate to improve packaging efficiency.

Referring to FIG. 71 again, in some embodiments, the input and output module 10 further includes a light sensitive lens 1b and a proximity light sensor lens 1h. The photo-sensitive lens 1b is disposed in the package casing 11 and corresponds to the photosensor 1a. The light-sensitive lens 1b condenses visible light onto the photosensor 1a, and reduces the amount of light that is transmitted to the region other than the photosensor 1a. The proximity photosensor lens 1h is disposed in the package housing 11 and corresponds to the proximity sensor 50. When the infrared light emitted from the infrared light 12 reflected by the object entering the proximity sensor window 1134 is incident on the proximity sensor lens 1h, the proximity sensor lens 1h reduces the amount of light transmitted back to the proximity sensor 50 by the reflected infrared light.

Referring to FIG. 71, in some embodiments, the input/output module 10 further includes a metal shielding plate 1c. The metal shielding plate 1c is located in the package housing 11 and is located at the infrared lamp 12 and the proximity sensor 50 and the proximity sensor 50 and the light sense. Between the devices 1a. The metal shielding plate 1c is located between the infrared lamp 12 and the photosensor 1a, and can prevent the infrared light emitted from the infrared lamp 12 from entering the photosensor 1a, and can also shield the infrared lamp 12 from the photosensor 1a and the proximity sensor. 50 electromagnetic interference with the photosensor 1a.

Referring to FIG. 75, in some embodiments, the input and output module 10 further includes an optical enclosure 16. The optical enclosure 16 is made of a light transmissive material, and an optical enclosure 16 is formed on the package substrate 111 and within the package housing 11. The optical enclosure 16 encases the infrared lamp 12, the proximity sensor 50, and the light sensor 1a. Specifically, the optical enclosure 16 can be formed by a potting injection molding process, and the optical enclosure 16 can be made of a transparent thermosetting epoxy resin to be hard to soften in use, and the optical enclosure 16 can fix the infrared lamp 12, close to The relative position between the sensor 50 and the photosensor 1a causes the infrared lamp 12, the proximity sensor 50, and the photosensor 1a to be less likely to sway within the package housing 11. At this time, the light guiding element 13 is disposed outside the optical enclosure 16 and is movably housed in the package casing 11.

Referring to FIG. 75, in some embodiments, the input/output module 10 further includes a plurality of light exiting partitions 1d formed in the optical enclosure 16 and located in the infrared light 12 and the proximity sensor 50 and in proximity. The sensor 50 is between the photosensor 1a. The light exiting partition 1d can block the infrared light 12 from emitting infrared light onto the proximity sensor 50 and the light sensor 1a, while blocking visible light entering from the light sensing window 1132 and incident on the light sensor 1a, affecting the light emission of the infrared light 12 and the proximity sensor 50. Receive reflected infrared light.

Referring to FIG. 76, in some embodiments, the casing 20 further has an organic sound hole (not shown), and the cover 30 is further provided with a cover sound hole 34, and the receiver 70 and the cover sound hole. 34 corresponds to the position of the sound hole of the case. The centers of the input/output module 10, the infrared light camera 62, the visible light camera 61, and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the casing 20.

The center of the receiver 70 is not located on the line segment, which saves the lateral space occupied by the electronic components (the input/output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover 30. The cover sound hole 34 is opened at the edge of the cover 30, and the sound hole of the casing is opened near the top 21.

Referring to FIG. 77 to FIG. 79, in some embodiments, the cover plate 30 may further be provided with a cover light source through hole 33. The cover light source through hole 33 corresponds to the casing light source through hole 23, and the infrared lamp 12 emits The infrared light passes through the through-hole 23 of the casing light source to pass through the electronic device 100 from the cover light source through hole 33.

In some embodiments, the cover 30 can also have a cover proximity sensor through hole 37. The cover proximity sensor through hole 37 corresponds to the case proximity sensor through hole 26, and the infrared light emitted by the first infrared lamp 12 passes through the object. After being reflected, it passes through the casing proximity sensor through hole 26 and can be incident on the proximity sensor 50 from the cover proximity sensor through hole 37. At this time, the infrared light transmitting ink 40 may be disposed on the cover 30 at a position corresponding to the casing proximity sensor through hole 26, and it is difficult for the user to see the proximity sensor 50 inside the electronic device 100 through the casing proximity sensor through hole 26, the electronic device. The shape of the 100 is more beautiful.

In some embodiments, the cover 30 can also be provided with a cover light-sensitive through hole 35. The cover light-sensitive through-hole 35 corresponds to the light-sensitive through-hole 24 of the casing and the light sensor 1a, and is external to the electronic device 100. The visible light passes through the cover light-sensitive through hole 35 and the chassis light-sensitive through hole 24, and can be incident on the photosensor 1a.

In the description of the present specification, the description with reference to the terms "some embodiments", "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. Particular features, structures, materials or features described in the examples or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms is not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, various embodiments or examples described in the specification, as well as features of various embodiments or examples, may be combined and combined.

Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include at least one of the features, either explicitly or implicitly. In the description of the present invention, "a plurality" means at least two, for example two, three, unless specifically defined otherwise.

Although the embodiments of the present invention have been shown and described, it is understood that the above-described embodiments are illustrative and are not to be construed as limiting the scope of the invention. The scope of the invention is defined by the claims and their equivalents.

Claims

An output module includes a package housing, an infrared lamp, and a light guiding component, the package housing includes a package substrate, and the infrared lamp and the light guiding component are packaged in the same In the package housing, the infrared lamp is carried on the package substrate, and the light guiding element is movably disposed on a light emitting path of the infrared lamp, and when the light guiding element is located in the infrared light of the infrared lamp On the road, the infrared light emitted by the infrared lamp exits the package housing at a first angle of view as an infrared fill light or an near infrared light; when the light guiding element leaves the light path of the infrared light The infrared light emitted by the infrared lamp exits the package housing at a second angle of view as a near infrared light or an infrared fill light.
The output module of claim 1 wherein:

The light guiding element includes a convex lens or a lens group having positive refractive power, and when the light guiding element is located on a light emitting path of the infrared light, the infrared light emitted by the infrared light is from the first angle of view from the The package housing emerges as a proximity infrared lamp; when the light guiding element leaves the light emitting path of the infrared lamp, the infrared light emitted by the infrared lamp exits from the package housing at a second angle of view as Infrared fill light; or

The light guiding element comprises a concave lens or a lens group having a negative refractive power, and when the light guiding element is located on a light emitting path of the infrared light, the infrared light emitted by the infrared light is at a first angle of view The package housing emerges as an infrared fill light; when the light guiding element leaves the light emitting path of the infrared light, the infrared light emitted by the infrared light exits from the package housing at a second angle of view Take as close to the infrared light.
The output module according to claim 1, wherein the output module further comprises a chip, and the infrared lamp is formed on the chip.
The output module of claim 3, wherein the package housing further comprises a package sidewall and a package top, the package sidewall extending from the package substrate and connected to the package top and the Between the package substrates, a top of the package is formed with a light-emitting window, and the light-emitting window corresponds to the infrared light.
The output module of claim 1 , wherein the output module further comprises an optical enclosure made of a light transmissive material, the optical enclosure being formed on the package substrate and located in the package Within the housing, the optical enclosure encases the infrared light.
An electronic device, the electronic device comprising:

Case; and

The output module according to any one of claims 1 to 5, wherein the output module is disposed in the casing.
The electronic device according to claim 6, wherein the electronic device further comprises a light-transmitting cover plate, the casing is provided with an organic shell through hole, and the infrared lamp corresponds to the through hole of the casing, The cover plate is disposed on the casing.
The electronic device according to claim 6, wherein the electronic device further comprises a light-transmitting cover plate, the casing is provided with an organic shell through hole, and the infrared lamp corresponds to the through hole of the casing, The cover plate is disposed on the casing, and the surface of the cover plate and the casing is formed with infrared transmission ink that transmits only infrared light, and the infrared transmission ink blocks the through hole of the casing .
The electronic device according to claim 6, wherein the electronic device further comprises a receiving module and an imaging module, the receiving module is integrated with a proximity sensor and a light sensor, and the imaging module comprises a lens holder, a lens barrel mounted on the lens holder, and an image sensor housed in the lens holder, the lens holder including a mounting surface between the lens barrel and the image sensor, the receiving module being disposed On the mounting surface.
The electronic device according to claim 6, wherein the electronic device further comprises a proximity sensor, a light sensor, and an imaging module, the imaging module comprising a lens holder and a mirror mounted on the lens holder a cartridge, and an image sensor housed in the lens holder, the lens holder including a mounting surface between the lens barrel and the image sensor, and the proximity sensor and at least one of the light sensors are disposed On the mounting surface.
The electronic device according to claim 9 or 10, wherein the imaging module comprises at least one of a visible light camera and an infrared light camera.
The electronic device according to claim 6, wherein the electronic device further comprises an infrared light camera, a visible light camera, a receiver, and a structured light projector, the output module, the infrared camera, and the visible light The center of the camera, the receiver and the structured light projector are located on the same line segment, from one end of the line segment to the other end:

The output module, the structured light projector, the receiver, the infrared camera, the visible light camera; or

The output module, the infrared light camera, the receiver, the visible light camera, the structured light projector; or

The infrared light camera, the output module, the receiver, the visible light camera, the structured light projector; or

The infrared light camera, the visible light camera, the receiver, the output module, and the structured light projector.
The electronic device according to claim 6, wherein the electronic device further comprises a receiver, an infrared camera, a visible light camera, a structured light projector, and a transparent cover plate, wherein the casing has an organic shell sound a hole, the cover plate is provided with a cover sound hole, the receiver corresponds to a position of the cover sound hole and the sound hole of the casing, the output module, the infrared light camera, the The center of the visible light camera and the structured light projector are located on the same line segment, and the receiver is located between the line segment and the top of the casing.
The electronic device according to claim 6, wherein the electronic device further comprises a receiving module and an imaging module, wherein the imaging module is mounted on the casing, and the imaging module comprises a lens holder. a lens barrel mounted on the lens holder and a substrate partially disposed in the lens holder; the receiving module being disposed on the substrate, the receiving module comprising a proximity sensor and/or a light sensor.
An electronic device, comprising:

cabinet;

An output module, the output module is disposed in the casing, the output module includes a package housing, an infrared lamp, and a light guiding component, the package housing includes a package substrate, the infrared lamp and the The light guiding element is encapsulated in the package housing, the infrared lamp is carried on the package substrate, and the light guiding element is movably disposed on a light emitting path of the infrared lamp, when the light guiding element is located When the infrared light is illuminated on the optical path, the infrared light emitted by the infrared light is emitted from the package housing at a first angle of view as an infrared fill light or a near infrared light; when the light guiding element leaves When the infrared light is illuminated, the infrared light emitted by the infrared light is emitted from the package housing at a second angle of view as a near infrared light or an infrared fill light;

a vibration module, the vibration module being mounted on the casing; and

a piezoelectric element coupled to the vibration module and spaced apart from the output module, the piezoelectric element being configured to deform when an electrical signal is applied to vibrate the vibration module.
The electronic device according to claim 15, wherein the vibration module comprises a display screen and a light-transmissive cover plate, and the display screen is disposed on the casing and forms a receiving cavity together with the casing The cover plate is disposed on the casing and located on a side of the display screen away from the receiving cavity, the display screen is combined with the cover plate, and the casing is provided with a casing spaced apart from each other The infrared through hole and the casing vibrate the through hole, and the infrared lamp corresponds to the infrared through hole of the casing, and the piezoelectric element is received in the vibration through hole of the casing and combined with the cover plate.
The electronic device according to claim 16, wherein said piezoelectric element and said display screen are attached to said cover by an engaging member.
The electronic device according to claim 16, wherein the surface of the cover plate combined with the casing is formed with infrared transmitting ink that transmits only infrared light, and the infrared penetrating ink blocks the casing At least one of an infrared through hole and the chassis vibration through hole.
The electronic device according to claim 15, wherein the electronic device further comprises a receiving module and an imaging module, the receiving module is integrated with a proximity sensor and a light sensor, and the imaging module comprises a lens holder, a lens barrel mounted on the lens holder, and an image sensor housed in the lens holder, the lens holder including a mounting surface between the lens barrel and the image sensor, the receiving module being disposed On the mounting surface.
The electronic device according to claim 15, wherein the electronic device further comprises a proximity sensor, a light sensor, and an imaging module, the imaging module comprising a lens holder and a mirror mounted on the lens holder a cartridge, and an image sensor housed in the lens holder, the lens holder including a mounting surface between the lens barrel and the image sensor, and the proximity sensor and at least one of the light sensors are disposed On the mounting surface.
The electronic device according to claim 19 or 20, wherein the imaging module comprises at least one of a visible light camera and an infrared light camera.
The electronic device according to claim 16, wherein the electronic device further comprises an infrared light camera, a visible light camera, and a structured light projector, the output module, the infrared light camera, the visible light camera, The piezoelectric element and the center of the structured light projector are located on the same line segment, and from one end to the other end of the line segment are:

The output module, the structured light projector, the piezoelectric element, the infrared light camera, the visible light camera; or

The output module, the infrared light camera, the piezoelectric element, the visible light camera, the structured light projector; or

The infrared light camera, the output module, the piezoelectric element, the visible light camera, the structured light projector; or

The infrared light camera, the visible light camera, the piezoelectric element, the output module, and the structured light projector.
The electronic device according to claim 16, wherein the electronic device further comprises an infrared light camera, a visible light camera, a structured light projector, the output module, the infrared light camera, the visible light camera, and the The center of the structured light projector is located on the same line segment, and the piezoelectric element is located between the line segment and the top of the casing.
The electronic device according to claim 16, wherein the electronic device further comprises an infrared light camera, a visible light camera, and a structured light projector, wherein the number of the piezoelectric elements is plural, and the casing vibrates a plurality of the plurality of piezoelectric elements corresponding to the plurality of the vibration through holes of the casing, each of the piezoelectric elements being housed in a corresponding vibration through hole of the casing, the output mode a group, the infrared light camera, the visible light camera, a plurality of the piezoelectric elements, and a center of the structured light projector are located on a same line segment, and the output is disposed between two adjacent piezoelectric elements At least one of a module, the infrared camera, the visible light camera, and the structured light projector.
The electronic device according to claim 16, wherein the electronic device further comprises an infrared light camera, a visible light camera, and a structured light projector, the piezoelectric element comprising a piezoelectric body and extending from the piezoelectric body Piezoelectric bumps, the number of the vibration through holes of the casing is plural, and the plurality of the piezoelectric bumps correspond to the plurality of the vibration through holes of the casing, and each of the piezoelectric bumps is partially received In the corresponding vibration through hole of the casing and combined with the cover plate, the output module, the infrared light camera, the visible light camera, and the structured light projector are located at the cover plate and the cover Between the piezoelectric bodies, the center of the output module, the infrared light camera, the visible light camera, the plurality of the piezoelectric bumps, and the structured light projector are located on the same line segment, adjacent to two At least one of the output module, the infrared camera, the visible light camera, and the structured light projector is disposed between the piezoelectric bumps.
An electronic device, comprising:

cabinet;

An output module, the output module is mounted on the casing, the output module comprises a package housing, an infrared lamp, and a light guiding component, the package housing comprises a package substrate, the infrared lamp and the The light guiding element is encapsulated in the package housing, the infrared lamp is carried on the package substrate, and the light guiding element is movably disposed on a light emitting path of the infrared lamp, when the light guiding element is located When the infrared light is illuminated on the optical path, the infrared light emitted by the infrared light is emitted from the package housing at a first angle of view as an infrared fill light or a near infrared light; when the light guiding element leaves When the infrared light is illuminated, the infrared light emitted by the infrared light is emitted from the package housing at a second angle of view as a near infrared light or an infrared fill light;

a display screen, the display screen is disposed on the casing, the display screen is formed with a light transmissive physical area and includes a front surface capable of displaying a picture and a back surface opposite to the front surface;

a light sensor, the light sensor is disposed on a side of the back surface of the display screen, the light sensor corresponds to the light transmissive physical area, and the light sensor is configured to receive incident light to the light Light on the sensor and output the target intensity of the light.
The electronic device according to claim 26, wherein the electronic device further comprises a light-transmitting cover plate, the casing is provided with an organic shell through hole, and the infrared lamp corresponds to the through hole of the casing, The cover plate is disposed on the casing.
The electronic device according to claim 26, wherein the electronic device further comprises a light-transmitting cover plate, the casing is provided with an organic shell through hole, and the infrared lamp corresponds to the through hole of the casing, The cover plate is disposed on the casing, and the surface of the cover plate and the casing is formed with infrared transmission ink that transmits only infrared light, and the infrared transmission ink blocks the through hole of the casing .
The electronic device according to claim 26, wherein the electronic device further comprises a proximity sensor and an imaging module, the imaging module comprising a lens holder, a lens barrel mounted on the lens holder, and a housing An image sensor in the lens holder, the lens holder includes a mounting surface between the lens barrel and the image sensor, and the proximity sensor is disposed on the mounting surface.
The electronic device according to claim 26, wherein the electronic device further comprises a proximity sensor and an imaging module, the imaging module comprises a camera housing and a lens module, and a top surface of the camera housing is a step surface and including a connected first sub-top surface and a second sub-top surface, the second sub-top surface being inclined with respect to the first sub-top surface and forming a slit with the first sub-top surface, the top surface Having a light-emitting through hole, the lens module being received in the camera housing and corresponding to the light-emitting through hole; the proximity sensor being disposed at the first sub-top surface; or

The electronic device further includes a proximity sensor and an imaging module, the imaging module includes a camera housing and two lens modules, and the top surface of the camera housing is provided with a slit to form a stepped top surface. The top surface includes a first step surface and a second step surface lower than the first step surface, and the first step surface is provided with two through holes, each of the through holes corresponding to the lens module The proximity sensor is disposed at the second step.
The electronic device according to claim 26, wherein the electronic device further comprises a proximity sensor and an imaging module, the imaging module comprising a lens holder, a lens barrel mounted on the lens holder, and a portion disposed on a substrate within the lens holder; the proximity sensor is disposed on the substrate.
The electronic device according to claim 26, wherein the light transmissive area comprises a light transmissive physical area, the light transmissive physical area comprises image pixels, and the electronic device further comprises a processor, the light sensor receiving The light is outputting an initial light intensity including ambient light intensity information outside the electronic device; the processor is configured to process the initial light intensity to obtain a target including only the ambient light intensity information outside the electronic device Light intensity.
The electronic device according to claim 32, wherein the initial light intensity comprises the ambient light intensity information and display light intensity information when the display screen displays an image, and the processor is configured to acquire the display in real time. The display light intensity information is displayed when the screen displays the image, and the display light intensity information is removed when the initial light intensity is processed to obtain the target light intensity.
The electronic device of claim 26, wherein the light transmissive region comprises a light transmissive solid region, the light transmissive solid region not containing image pixels and surrounded by a plurality of image pixels.
An input/output module, comprising: a package housing, an infrared lamp, a light guiding component, and a proximity sensor, the package housing comprising a package substrate, the infrared lamp, the guide The optical component and the proximity sensor are both enclosed in the package housing, and the infrared lamp and the proximity sensor are both carried on the package substrate, and the light guiding component is movably disposed on the infrared lamp. On the optical path, when the light guiding element is located on the light emitting path of the infrared lamp, the infrared light emitted by the infrared lamp is emitted from the package housing at a first angle of view as an infrared fill light or near infrared a light; when the light guiding element leaves the light emitting path of the infrared lamp, the infrared light emitted by the infrared light is emitted from the package housing at a second angle of view as a near infrared light or an infrared fill light The proximity sensor is configured to receive infrared light reflected by the object to detect the distance of the object.
The input/output module according to claim 35, wherein

The light guiding element includes a convex lens or a lens group having positive refractive power, and when the light guiding element is located on a light emitting path of the infrared light, the infrared light emitted by the infrared light is from the first angle of view from the The package housing emerges as a proximity infrared lamp; when the light guiding element leaves the light emitting path of the infrared lamp, the infrared light emitted by the infrared lamp exits from the package housing at a second angle of view as Infrared fill light; or

The light guiding element comprises a concave lens or a lens group having a negative refractive power, and when the light guiding element is located on a light emitting path of the infrared light, the infrared light emitted by the infrared light is at a first angle of view The package housing emerges as an infrared fill light; when the light guiding element leaves the light emitting path of the infrared light, the infrared light emitted by the infrared light exits from the package housing at a second angle of view Take as close to the infrared light.
The input/output module according to claim 35, wherein the input/output module further comprises a chip, and the infrared lamp and the proximity sensor are both formed on the chip.
The input/output module of claim 37, wherein the package housing further comprises a package sidewall and a package top, the package sidewall extending from the package substrate and connected to the top of the package Between the package substrates, a top of the package is formed with a light-emitting window and a proximity sensing window, the light-emitting window corresponding to the infrared light, and the proximity sensing window corresponds to the proximity sensor.
The input/output module according to claim 37, wherein the input/output module further comprises a proximity sensing lens disposed in the package housing and corresponding to the proximity sensor.
The input/output module according to claim 35, wherein the input/output module further comprises a metal shielding plate, the metal shielding plate is located in the package housing and located in the infrared lamp and the proximity sensor between.
The input/output module according to claim 35, wherein the input/output module further comprises an optical enclosure made of a light transmissive material, the optical enclosure being formed on the package substrate and located at Within the package housing, the optical enclosure encases the infrared lamp and the proximity sensor.
The input/output module according to claim 41, wherein the input/output module further comprises a light exiting baffle, the light exiting baffle is formed in the optical enclosure and located in the infrared lamp and the Near the sensor.
The input/output module according to any one of claims 35 to 42, wherein the input and output module is formed with a ground pin, an infrared lamp pin and a proximity sensing pin, and the ground pin And when the infrared lamp pin is enabled, the infrared lamp emits infrared light; when the ground pin and the proximity sensing pin are enabled, the proximity sensor receives infrared light reflected by an object The distance of the object is detected.
An electronic device, the electronic device comprising:

Case; and

The input/output module according to any one of claims 35 to 43, wherein the input/output module is disposed in the casing.
The electronic device according to claim 44, wherein the electronic device further comprises a light-transmissive cover plate, the casing is provided with an organic shell light source through hole and the casing is close to the sensing through hole, and the infrared lamp Corresponding to the through hole of the casing light source, the proximity sensor corresponds to the casing close to the sensing through hole, and the cover plate is disposed on the casing.
The electronic device according to claim 44, wherein the electronic device further comprises a light-transmissive cover plate, the casing is provided with an organic shell light source through hole and the casing is close to the sensing through hole, and the infrared lamp Corresponding to the through hole of the casing light source, the proximity sensor corresponds to the casing close to the sensing through hole, the cover plate is disposed on the casing, and the surface of the cover plate combined with the casing An infrared transmitting ink that transmits only infrared light is formed, the infrared transmitting ink blocking at least one of the casing light source through hole and the casing close to the sensing through hole.
The electronic device according to claim 44, wherein the electronic device further comprises a light sensor and an imaging module, the imaging module comprising a lens holder, a lens barrel mounted on the lens holder, and receiving An image sensor in the lens holder, the lens holder includes a mounting surface between the lens barrel and the image sensor, and the light sensor is disposed on the mounting surface.
The electronic device according to claim 44, wherein the electronic device further comprises a light sensor and an imaging module, the imaging module is mounted on the casing, and the imaging module comprises a lens holder. a lens barrel mounted on the lens holder and a substrate partially disposed in the lens holder; the photo sensor being disposed on the substrate.
The electronic device according to claim 44, wherein the electronic device further comprises an imaging module and a light sensor, the imaging module is mounted on the casing, and the imaging module comprises a camera housing And a lens module, the top surface of the camera housing is a step surface and includes a connected first sub-top surface and a second sub-top surface, the second sub-top surface is inclined with respect to the first sub-top surface and The first sub-top surface is formed with a slit, the top surface is provided with a light-emitting through hole, the lens module is received in the camera housing and corresponds to the light-emitting through-hole, and the light sensor is disposed in the At the top of the first child.
The electronic device of claim 44, wherein the electronic device further comprises an imaging module and a light sensor, the imaging module comprising a camera housing and two lens modules, the camera housing a slit is formed on the top surface to form a stepped top surface, the top surface includes a first step surface and a second step surface lower than the first step surface, and the first step surface is provided with two light emitting surfaces a through hole, each of the light emitting through holes corresponding to the lens module, wherein the light sensor is disposed at the second step surface.
An input/output module, comprising: a package housing, an infrared lamp, a light guiding component, and a light sensor, the package housing comprising a package substrate, the infrared lamp, the The light guiding element and the photosensor are both enclosed in the package housing, and the infrared lamp and the photosensor are respectively carried on the package substrate, and the light guiding element is movably disposed in the infrared On the illuminating light path of the lamp, when the light guiding element is located on the illuminating light path of the infrared lamp, the infrared ray emitted by the infrared lamp is emitted from the package housing at a first angle of view as an infrared fill light Or approaching an infrared lamp; when the light guiding element leaves the luminous path of the infrared lamp, the infrared light emitted by the infrared lamp exits the package housing at a second angle of view as a near infrared lamp or infrared a fill light; the light sensor is configured to receive visible light in ambient light and detect the intensity of the visible light.
The input/output module according to claim 51, wherein

The light guiding element includes a convex lens or a lens group having positive refractive power, and when the light guiding element is located on a light emitting path of the infrared light, the infrared light emitted by the infrared light is from the first angle of view from the The package housing emerges as a proximity infrared lamp; when the light guiding element leaves the light emitting path of the infrared lamp, the infrared light emitted by the infrared lamp exits from the package housing at a second angle of view as Infrared fill light; or

The light guiding element comprises a concave lens or a lens group having a negative refractive power, and when the light guiding element is located on a light emitting path of the infrared light, the infrared light emitted by the infrared light is at a first angle of view The package housing emerges as an infrared fill light; when the light guiding element leaves the light emitting path of the infrared light, the infrared light emitted by the infrared light exits from the package housing at a second angle of view Take as close to the infrared light.
The input/output module according to claim 51, wherein the input/output module further comprises a chip, and the infrared lamp and the photo sensor are both formed on the chip.
The input/output module of claim 53 , wherein the package housing further comprises a package sidewall and a package top, the package sidewall extending from the package substrate and connected to the top of the package Between the package substrates, a top of the package is formed with a light-emitting window and a light-sensing window, and the light-emitting window corresponds to the infrared light, and the light-sensing window corresponds to the light sensor.
The input/output module according to claim 53, wherein the input/output module further comprises a light-sensitive lens, and the light-sensitive lens is disposed in the package housing and corresponds to the light sensor.
The input/output module according to claim 51, wherein the input/output module further comprises a metal shielding plate, the metal shielding plate is located in the package housing and located in the infrared lamp and the light sense Between the devices.
The input/output module according to claim 51, wherein the input/output module further comprises an optical enclosure made of a light transmissive material, the optical enclosure being formed on the package substrate and located at In the package housing, the optical cover encloses the infrared lamp and the photo sensor.
The input/output module according to claim 57, wherein the input/output module further comprises a light exiting baffle, the light exiting baffle being formed in the optical enclosure and located in the infrared lamp and the Between light sensors.
The input/output module according to any one of claims 51 to 58, wherein the input/output module is formed with a ground pin, an infrared lamp pin and a light sensing pin, and the ground pin and the ground When the infrared lamp pin is enabled, the infrared lamp emits infrared light; when the ground pin and the light sensing pin are enabled, the light sensor detects the intensity of visible light.
An electronic device, the electronic device comprising:

Case; and

The input/output module according to any one of claims 51 to 59, wherein the input/output module is disposed in the casing.
The electronic device according to claim 60, wherein the electronic device further comprises a light-transmissive cover plate, the casing is provided with an organic shell light source through hole and a casing light-sensing through hole, and the infrared lamp and The light source through hole corresponds to the light source, and the light sensor corresponds to the light sensing through hole of the casing, and the cover plate is disposed on the casing.
The electronic device according to claim 60, wherein the electronic device further comprises a light-transmissive cover plate, the casing is provided with an organic shell light source through hole and a casing light-sensing through hole, and the infrared lamp and Corresponding to the through hole of the casing light source, the light sensor corresponds to the light sensing through hole of the casing, the cover plate is disposed on the casing, and a surface of the cover plate combined with the casing is formed There is an infrared transmitting ink that transmits only infrared light, and the infrared light blocks the through hole of the casing light source through the ink.
The electronic device according to claim 60, wherein the electronic device further comprises a proximity sensor and an imaging module, the imaging module comprising a lens holder, a lens barrel mounted on the lens holder, and a housing An image sensor in the lens holder, the lens holder includes a mounting surface between the lens barrel and the image sensor, and the proximity sensor is disposed on the mounting surface.
The electronic device according to claim 60, wherein the electronic device further comprises a proximity sensor and an imaging module, the imaging module is mounted on the casing, and the imaging module comprises a lens holder and is mounted a lens barrel on the lens holder and a substrate partially disposed in the lens holder; the proximity sensor is disposed on the substrate.
The electronic device according to claim 60, wherein the electronic device further comprises an imaging module and a proximity sensor, the imaging module is mounted on the casing, and the imaging module comprises a camera housing and a lens module, the top surface of the camera housing is a step surface and includes a first first top surface and a second top surface, wherein the second sub top surface is inclined with respect to the first sub top surface a first sub-top surface is formed with a slit, the top surface is provided with a light-emitting through hole, the lens module is received in the camera housing and corresponds to the light-emitting through-hole, and the proximity sensor is disposed at the first At the top of the child.
The electronic device according to claim 60, wherein the electronic device further comprises an imaging module and a proximity sensor, the imaging module comprising a camera housing and two lens modules, the top of the camera housing a slit is formed on the surface to form a stepped top surface, the top surface includes a first step surface and a second step surface lower than the first step surface, and the first step surface is provided with two light passages a hole, each of the light-emitting through holes corresponding to the lens module, wherein the proximity sensor is disposed at the second step surface.
An input/output module, comprising: a package housing, an infrared lamp, a light guiding component, a proximity sensor and a light sensor, wherein the package housing comprises a package substrate, the infrared lamp, The light guiding element, the proximity sensor and the light sensor are all packaged in the package housing, and the infrared lamp, the proximity sensor and the light sensor are all carried on the package substrate. The light guiding element is movably disposed on the illuminating light path of the infrared lamp, and when the light guiding element is located on the illuminating light path of the infrared lamp, the infrared ray emitted by the infrared lamp is at a first angle of view The package housing emerges as an infrared fill light or a near-infrared light; when the light guiding element leaves the light-emitting path of the infrared light, the infrared light emitted by the infrared light passes from the second field of view The package housing emerges as a proximity infrared lamp or an infrared fill light; the proximity sensor is configured to receive infrared light emitted by the infrared light as a proximity infrared light reflected by the object to detect the object to the input Output from the module; said light sensor for receiving visible ambient light, and detecting the intensity of visible light.
The input/output module according to claim 67, wherein

The light guiding element includes a convex lens or a lens group having positive refractive power, and when the light guiding element is located on a light emitting path of the infrared light, the infrared light emitted by the infrared light is from the first angle of view from the The package housing emerges as a proximity infrared lamp; when the light guiding element leaves the light emitting path of the infrared lamp, the infrared light emitted by the infrared lamp exits from the package housing at a second angle of view as Infrared fill light; or

The light guiding element comprises a concave lens or a lens group having a negative refractive power, and when the light guiding element is located on a light emitting path of the infrared light, the infrared light emitted by the infrared light is at a first angle of view The package housing emerges as an infrared fill light; when the light guiding element leaves the light emitting path of the infrared light, the infrared light emitted by the infrared light exits from the package housing at a second angle of view Take as close to the infrared light.
The input/output module according to claim 67, wherein the input/output module further comprises a chip, and the infrared lamp, the proximity sensor and the photo sensor are both formed on the chip.
The input/output module of claim 69, wherein the package housing further comprises a package sidewall and a package top, the package sidewall extending from the package substrate and connected to the top of the package Between the package substrates, a top of the package is formed with a light-emitting window, a proximity sensor window, and a light-sensing window, the light-emitting window corresponding to the infrared light, the proximity sensor window corresponding to the proximity sensor, the light sense A window corresponds to the light sensor.
The input/output module according to claim 69, wherein the input/output module further comprises a light sensing lens and a proximity sensor lens, wherein the light sensing lens is disposed in the package housing and is related to the light sense Correspondingly, the proximity sensor lens corresponds to the proximity sensor, and the light sensor lens and the proximity sensor are located on the same transparent substrate.
The input/output module according to claim 67, wherein the input/output module further comprises a plurality of metal shielding plates, the plurality of metal shielding plates are located in the package housing and located in the infrared lamp, Between the proximity sensor and any of the photosensors.
The input/output module according to claim 67, wherein the input/output module further comprises an optical enclosure made of a light transmissive material, the optical enclosure being formed on the package substrate and located at Within the package housing, the optical enclosure encases the infrared lamp, the proximity sensor, and the light sensor.
The input/output module of claim 73, wherein the input/output module further comprises a plurality of light exiting baffles, the plurality of light exiting baffles being formed in the optical enclosure and located in the infrared Between the lamp, the proximity sensor, and any of the photosensors.
The input/output module according to any one of claims 67 to 74, wherein the input/output module is formed with a ground pin, an infrared lamp pin, a proximity sensor pin, and a light sensing pin. The infrared lamp emits infrared light when the ground pin and the infrared lamp pin are enabled; the proximity sensor is configured to receive reflection by an object when the ground pin and the proximity sensor pin are enabled The infrared light emitted by the infrared lamp as a proximity infrared lamp to detect the distance of the object to the input/output module; when the ground pin and the light sensing pin are enabled, the light sensation The device detects the intensity of visible light.
An electronic device, the electronic device comprising:

Case; and

The input/output module according to any one of claims 67 to 75, wherein the input/output module is disposed in the casing.
The electronic device according to claim 76, wherein the electronic device further comprises a light-transmissive cover plate, the casing is provided with an organic shell light source through hole, the casing is close to the sensor through hole, and the casing is light-sensed a hole, the infrared lamp corresponding to the through hole of the casing light source, the proximity sensor corresponding to the through hole of the casing proximity sensor, the light sensor corresponding to the light sensing through hole of the casing, the cover A plate is disposed on the casing.
The electronic device according to claim 76, wherein the electronic device further comprises a light-transmissive cover plate, the casing is provided with an organic shell light source through hole, the casing is close to the sensor through hole, and the casing is light-sensed a hole, the infrared lamp corresponding to the through hole of the casing light source, the light sensor corresponding to the light sensing through hole of the casing, the proximity sensor corresponding to the through hole of the casing proximity sensor, the cover a plate is disposed on the casing, and a surface of the cover plate and the casing is formed with infrared transmission ink that transmits only infrared light, and the infrared transmission ink blocks the through hole of the casing light source and is The housing is proximate to at least one of the sensor through holes.