CN108074941A - Input and output module and electronic device - Google Patents
Input and output module and electronic device Download PDFInfo
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- CN108074941A CN108074941A CN201711433362.XA CN201711433362A CN108074941A CN 108074941 A CN108074941 A CN 108074941A CN 201711433362 A CN201711433362 A CN 201711433362A CN 108074941 A CN108074941 A CN 108074941A
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- light
- infrared
- infrared lamp
- proximity sensor
- output module
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- 238000005538 encapsulation Methods 0.000 claims description 15
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
Abstract
Electronic device disclosed by the invention and input and output module include encapsulating housing, infrared lamp, proximity sensor, light-guide device and optical flame detector, encapsulating housing includes package substrate, infrared lamp, proximity sensor, light-guide device and optical flame detector are encapsulated in encapsulating housing, infrared lamp and optical flame detector are carried on package substrate, light-guide device can be movably arranged in the luminous light path of infrared lamp, when light-guide device is located in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted from encapsulating housing using as infrared light compensating lamp or close to infrared lamp with the first field angle；When light-guide device is left in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted from encapsulating housing using as close to infrared lamp or infrared light compensating lamp with the second field angle；Optical flame detector is used to receive visible detection light intensity.The integrated level of input and output module is higher, small volume, so as to save the space of the function for the intensity detection for realizing infrared distance measurement, infrared light filling and visible ray.
Description
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of input and output module and electronics dress
It puts.
Background technology
As the function that mobile phone is supported is more and more rich and varied, the type and quantity for the function element that mobile phone needs are set
It is more and more, in order to realize distance detection, ambient light detection with the functions such as the facial 3D feature recognitions of user, it is necessary to be set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be occupied.
The content of the invention
Embodiment of the present invention provides a kind of input and output module and electronic device.
The input and output module of embodiment of the present invention include encapsulating housing, infrared lamp, light-guide device, proximity sensor and
Optical flame detector, the encapsulating housing include package substrate, the infrared lamp, the light-guide device, the proximity sensor and described
Optical flame detector is encapsulated in the encapsulating housing, and the infrared lamp, the proximity sensor and the optical flame detector are carried on institute
It states on package substrate, the light-guide device can be movably arranged in the luminous light path of the infrared lamp, when the guide-lighting member
When part is located in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting is with the first field angle from the encapsulation
Housing outgoing is using as infrared light compensating lamp or close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp
When, the infrared light of infrared lamp transmitting is emitted from the encapsulating housing using as close to infrared lamp or red with the second field angle
Outer light compensating lamp；The proximity sensor is reflected by the object red as emitting close to infrared lamp by the infrared lamp for reception
UV light is to detect the object to the distance of the input and output module；The optical flame detector is visible in ambient light for receiving
Light, and detect the intensity of the visible ray.
In some embodiments, the light-guide device includes convex lens or the lens group with positive light coke, when described
When light-guide device is located in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting is with the first field angle from institute
Encapsulating housing outgoing is stated using as close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, institute
The infrared light of infrared lamp transmitting is stated with the second field angle from encapsulating housing outgoing using as infrared light compensating lamp；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is positioned at described red
When in the luminous light path of outer lamp, the infrared light of the infrared lamp transmitting is emitted to make with the first field angle from the encapsulating housing
For infrared light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared lamp emits infrared
Light is emitted from the encapsulating housing using as close to infrared lamp with the second field angle.
In some embodiments, the input and output module further includes chip, the infrared lamp, the proximity sensor
And the optical flame detector is respectively formed on the chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected at the top of the encapsulation between the package substrate, is formed at the top of the encapsulation luminous
Window, proximity sensor window and light sensation window, the luminescence window is corresponding with the infrared lamp, the proximity sensor window
Corresponding with the proximity sensor, the light sensation window is corresponding with the optical flame detector.
In some embodiments, the input and output module further includes light sensation lens and proximity sensor lens, described
Light sensation lens are arranged in the encapsulating housing and corresponding with the optical flame detector, the proximity sensor lens and the close biography
Sensor corresponds to, and the light sensation lens and the proximity sensor are located on same transparent base.
In some embodiments, the input and output module further includes multiple metal shutters, and the multiple metal hides
Baffle is located at arbitrary the two in the encapsulating housing and in the infrared lamp, the proximity sensor and the optical flame detector
Between.
In some embodiments, the input and output module further includes the optics sealing cover made of light transmissive material, described
Optics sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps described infrared
Lamp, the proximity sensor and the optical flame detector.
In some embodiments, the input and output module further include it is multiple go out light clapboard, it is the multiple go out light clapboard
It is formed in arbitrary the two in the optics sealing cover and in the infrared lamp, the proximity sensor and the optical flame detector
Between.
In some embodiments, grounding pin, infrared lamp pin, close sensing are formed on the input and output module
When device pin and light sensation pin, the grounding pin and the infrared lamp pin are enabled, the infrared lamp emits infrared light；
When the grounding pin and the proximity sensor pin are enabled, the proximity sensor for receive be reflected by the object by
The infrared lamp is as the infrared light emitted close to infrared lamp to detect the object to the distance of the input and output module；
When the grounding pin and the light sensation pin are enabled, the intensity of the optical flame detector detection visible ray.
The electronic device of embodiment of the present invention includes：
Casing；With
The input and output module, the input and output module are arranged in the casing.
In some embodiments, the electronic device further includes the cover board of light transmission, and the casing offers casing light source
Through hole, casing proximity sensor through hole and casing light sensation through hole, the infrared lamp is corresponding with the casing light source through holes, described to connect
Nearly sensor is corresponding with the casing proximity sensor through hole, and the optical flame detector is corresponding with the casing light sensation through hole, the lid
Plate is set on the housing.
In some embodiments, the electronic device further includes the cover board of light transmission, and the casing offers casing light source
Through hole, casing proximity sensor through hole and casing light sensation through hole, the infrared lamp is corresponding with the casing light source through holes, the light
Sensor is corresponding with the casing light sensation through hole, and the proximity sensor is corresponding with the casing proximity sensor through hole, the lid
Plate is set on the housing, and the cover board is formed with the surface that the casing is combined only transmits the infrared through oil of infrared light
Ink, it is described it is infrared through ink block the casing light source through holes and be in the casing proximity sensor through hole at least one
It is a.
The position that the electronic device and input and output module of embodiment of the present invention pass through mobile light-guide device so that input
Output module can be used as close to infrared lamp or infrared light compensating lamp, and infrared lamp, light-guide device, proximity sensor and optical flame detector are integrated into
One single package body structure makes input and output module group transmitting infrared light with the function of infrared distance measurement and infrared light filling and can
See the function of the intensity detection of light.Secondly, need to be positioned proximate to infrared lamp and infrared benefit simultaneously compared to current electronic device
For light lamp, the input and output module of embodiment of the present invention only needs to set an infrared lamp, and small volume has saved realization
The space of infrared light filling and infrared distance measurement function.Further, infrared lamp, proximity sensor and optical flame detector are integrated into a single envelope
Body structure is filled, the integrated level of input and output module is higher, small volume, and input and output module has saved realization infrared distance measurement, red
The space of the function of the intensity detection of outer light filling and visible ray.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
It obtains substantially and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of certain embodiments of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 3 to Fig. 4 is the view of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 5 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 6 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 7 is the part isometric schematic diagram of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 8 is the partial sectional schematic view of the electronic device of certain embodiments of the present invention；
Fig. 9 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention；
Figure 10 is the structure diagram of the electronic device of certain embodiments of the present invention；
Figure 11 to Figure 13 is the partial sectional schematic view of the electronic device of certain embodiments of the present invention
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the same or similar element of expression eventually or there is same or like element.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features contact directly or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity
Sub- component includes input and output module 10, imaging modules 60, receiver 70 and structured light projector 80.Electronic device 100 can
To be mobile phone, tablet computer, laptop, smartwatch, Intelligent bracelet, automatic teller machine etc., the embodiment of the present invention is filled with electronics
Putting 100 is illustrated exemplified by mobile phone, it will be understood that the concrete form of electronic device 100 can be other, not limit herein
System.
Refer to Fig. 2 to Fig. 4, input and output module 10 is single package body structure, including encapsulating housing 11, infrared lamp 12,
Light-guide device 13, proximity sensor 50 and optical flame detector 1a.
Encapsulating housing 11 for simultaneously encapsulate infrared lamp 12, light-guide device 13, proximity sensor 50 and optical flame detector 1a or
It says, infrared lamp 12, light-guide device 13, proximity sensor 50 and optical flame detector 1a are encapsulated in simultaneously in encapsulating housing 11.Encapsulating housing
11 include package substrate 111, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference
(Electromagnetic Interference, EMI) shielding material is made, to avoid extraneous electromagnetic interference to input and output
Module 10 has an impact.
Incorporated by reference to Fig. 5, package substrate 111 is used to carry infrared lamp 12, proximity sensor 50 and optical flame detector 1a simultaneously.It is making
When making input and output module 10, infrared lamp 12, proximity sensor 50 and optical flame detector 1a can be formed on a piece of chip 14, then
Infrared lamp 12, proximity sensor 50, optical flame detector 1a and chip 14 are set along on package substrate 111, specifically, can be incited somebody to action
Chip 14 is bonded on package substrate 111.Meanwhile package substrate 111 can be used for other parts with electronic device 100
(such as the casing 20 of electronic device 100, mainboard etc.) connects, and input and output module 10 is fixed in electronic device 100.It is red
Outer lamp 12 and optical flame detector 1a can be formed on a piece of chip 14, after further reduction infrared lamp 12 and optical flame detector 1a are integrated
Volume, and preparation process is simpler.
Package wall 112 can surround infrared lamp 12, light-guide device 13, proximity sensor 50 and optical flame detector 1a and set, envelope
Dress side wall 112 extends from package substrate 111, and package wall 112 can be combined with package substrate 111, it is preferred that package wall 112
With package substrate 111 to be detachably connected, in order to remove after package wall 112 to infrared lamp 12,50 and of proximity sensor
Optical flame detector 1a is overhauled.The making material of package wall 112 can be the material of impermeable infrared light, be sent out to avoid infrared lamp 12
The infrared light gone out passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113
Luminescence window 1131, proximity sensor window 1134 and light sensation window 1132 are formed with, luminescence window 1131 and infrared lamp 12 are right
Should, the infrared light that infrared lamp 12 emits is pierced by from luminescence window 1131；Proximity sensor window 1134 and proximity sensor 50 are right
Should, close to infrared grade 12 as can be to pass through proximity sensor window after object reflects close to the infrared light that infrared lamp emits
It 1134 and incides on proximity sensor 50；Light sensation window 1132 is corresponding with optical flame detector 1a, it is seen that light can pass through light sensation window
It 1132 and incides on optical flame detector 1a.Encapsulation top 113 integrally formed can be obtained with package wall 112, can also split into
Shape obtains.In one example, luminescence window 1131 and light sensation window 1132 are through hole, the making material at encapsulation top 113
For impermeable infrared light and the material being opaque to visible light but.In another example, encapsulation top 113 by impermeable infrared light material, thoroughly
Infrared light is opaque to visible light but and the material co-manufactured of visible ray forms thoroughly, and specifically, luminescence window 1131 is by saturating infrared light
Material be made, light sensation window 1132 is made of the material of saturating visible ray, remaining position is by impermeable infrared light and is opaque to visible light but
Material be made, further, luminescence window 1131 could be formed with lens arrangement, with improve from luminescence window 1131 project
Infrared light emission angle, such as luminescence window 1131 are formed with concavees lens structure, so that the light through luminescence window 1131 is sent out
It dissipates and outwards projects；Luminescence window 1131 is formed with convex lens structures, so that the light through luminescence window 1131 is gathered and outwards penetrated
Go out；Proximity sensor window 1134 is formed with convex lens mechanism, so that the infrared light through proximity sensor window 1134 is inside
Gather and project on proximity sensor 50；Light sensation window 1132 can also be formed with lens arrangement, to improve from light sensation window
1132 incident VISIBLE LIGHT EMISSION angles, such as light sensation window 1132 have convex lens structures so that by 1132 incidence of light sensation window
Light is gathered and is projected on optical flame detector 1a.
Light-guide device 13 can be movably arranged in the luminous light path of infrared lamp 12.Fig. 5 and Fig. 6 are referred to, input is defeated
Go out module 10 and further include actuator 17, actuator 17 is used to that light-guide device 13 to be driven to move so as to being movably arranged at infrared lamp
In 12 luminous light path.Wherein, actuator 17 drives light-guide device 13 to move so as to being movably arranged at the hair of infrared lamp 12
Include in light light path：Under normal conditions, light-guide device 13 is arranged in the luminous light path of infrared lamp 12, and infrared lamp 12 is used as infrared benefit
Light lamp (or close to infrared lamp), when infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), actuator 17 drives leaded light
Element 13 moves to leave the luminous light path of infrared lamp 12；Or under normal conditions, light-guide device 13 is not arranged in infrared lamp 12
In the light path that shines, infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), (or is connect when infrared lamp 12 is used as infrared light compensating lamp
Near-infrared lamp) when, actuator 17 drives light-guide device 13 to move in the luminous light path of infrared lamp 12.
Referring to Fig. 5, actuator 17 includes linear motor, linear motor includes stator 172 and mover 174, and stator 172 is pacified
In package wall 112, mover 174 is connected with light-guide device 13, and actuator 17 drives mover 174 to move to drive guide-lighting member
Part 13 moves.Referring to Fig. 6, the structure of above-mentioned actuator 17 could alternatively be：Actuator 17 includes linear motor, linear motor
Including stator 172 and mover 174, stator 172 is mounted in package wall 112, input and output module 10 further include shaft 18 and
Linking arm 19, the first end connection light-guide device 13 of linking arm 19, the of the separate light-guide device 13 of mover 174 and linking arm 19
Two ends connect, and linking arm 19 is set in shaft 18, shaft 18 between light-guide device 13 and mover 174, linear motor
Mover 174 is drivingly connected the second end motion of arm 19, and linking arm 19 is rotated around shaft 18, as a result, the first end of linking arm 19
Light-guide device 13 is driven to be rotated around shaft 18, to realize that light-guide device 13 is in the luminous light path of infrared lamp 12 or away from red
The luminous light path of outer lamp 12.In an embodiment of the present invention, input and output module 10 can also include loading plate (not shown), hold
Bearing holes are offered on support plate, light-guide device 13 is mounted in bearing holes, and actuator 17 is used to that loading plate movement to be driven to drive
Light-guide device 13 moves.
Referring to Fig. 3, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 using as close to red
Outer lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 emits is with the second visual field
Angle is emitted from encapsulating housing 11 using as infrared light compensating lamp, at this point, the first field angle is less than the second field angle, wherein, first regards
The scope of rink corner is 10 degree of -30 degree, for example, the first field angle is 10 degree, 15 degree, 20 degree, 25 degree or 30 degree etc., the second visual field
The scope at angle for 60 degree -90 degree, for example, the second field angle be 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 degree,
Or 90 degree etc..Light-guide device 13 is for converging light, and light-guide device 13 includes convex lens or the lens group with positive light coke, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light passes through luminescence window
1131 scopes covered from the outgoing of encapsulating housing 11.
Referring to Fig. 4, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 using as infrared benefit
Light lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 emits is with the second visual field
Angle is emitted from encapsulating housing 11 using as close to infrared lamp, at this point, the first field angle is more than the second field angle, wherein, first regards
The scope of rink corner for 60 degree -90 degree, for example, the first field angle be 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87
Degree or 90 degree etc., the scope of the second field angle is spent for 10 degree -30, for example, the second field angle is 10 degree, 15 degree, 20 degree, 25 degree,
Or 30 degree etc..Light-guide device 13 is used for divergent rays, and light-guide device 13 includes concavees lens or the lens group with negative power, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light passes through luminescence window
1131 scopes covered from the outgoing of encapsulating housing 11.
When infrared lamp 12 is opened and emits infrared light outside encapsulating housing 11 as infrared light compensating lamp, infrared light passes through
Luminescence window 1131 to project body surface, the infrared pick-up first 62 of electronic device 100 receive be reflected by the object it is infrared
Light is to obtain the image information of object (at this point, infrared lamp 12 be used for infrared light filling).When infrared lamp 12 is opened and is used as close to red
When outer lamp emits infrared light outside encapsulating housing 11, infrared light is through luminescence window 1131 and reaches body surface, close to biography
Sensor 50 receives the infrared light being reflected by the object with the distance of detection object to input and output module 10 (at this point, infrared lamp 12 is used
In infrared distance measurement).
When infrared lamp 12 is used as infrared light compensating lamp and as close to can be with different power to encapsulating housing during infrared lamp
Transmitting infrared light outside 11.Specifically, infrared lamp 12 is used as with the first power outside encapsulating housing 11 emitting close to during infrared lamp
Infrared light emits infrared light with the second power when infrared lamp 12 is used as infrared light compensating lamp outside encapsulating housing 11, wherein, the
One power can be less than the second power.
Optical flame detector 1a is received by the visible ray in the incident ambient light of light sensation window 1132, and detects the intensity of visible ray.
Incorporated by reference to Fig. 7, in embodiments of the present invention, grounding pin 1e is formed on input and output module 10, infrared lamp draws
Foot 1f, proximity sensor pin 15 and light sensation pin 1g.Grounding pin 1e, infrared lamp pin 1f, 15 and of proximity sensor pin
Light sensation pin 1g can be formed on package substrate 111, (that is, connect when grounding pin 1e and infrared lamp pin 1f is enabled
During ground pin 1e and infrared lamp pin 1f access circuit turn-ons), infrared lamp 12 emits infrared light；When grounding pin and close biography
When sensor pin 1g is enabled, proximity sensor 50 receive be reflected by the object by infrared lamp 12 as emitting close to infrared lamp
Infrared light；When grounding pin 1e and light sensation pin 1g are enabled, (that is, grounding pin 1e and light sensation pin 1g access circuits are led
When logical), optical flame detector 1a detection visual intensities, using the foundation of the display brightness as control display screen 90.
Referring to Fig. 1, casing 20 can be as the installation carrier of input and output module 10, in other words, input and output module
10 can be arranged in casing 20.Casing 20 can be the shell of electronic device 100, in embodiments of the present invention, in casing 20
It can be additionally used in the display screen 90 that electronic device 100 is set, the body occupied due to the input and output module 10 of embodiment of the present invention
Product is smaller, therefore, for setting the volume of display screen 90 that can correspond to increase in casing 20, to improve electronic device 100
Shield accounting.Specifically, casing 20 includes top 21 and bottom 22, and display screen 90 and input and output module 10 are arranged on 21 Hes of top
Between bottom 22, in the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, input and output
Module 10 can be arranged between display screen 90 and top 21.In other embodiments, display screen 90 can be that screen is opened comprehensively
Equipped with notch, display screen 90 surrounds input and output module 10, and input and output module 10 exposes from the notch of display screen 90.
Casing 20 is further opened with casing light source through holes 23, casing proximity sensor through hole 26 and casing light sensation through hole 24.It is defeated
When entering to export module 10 and being arranged in casing 20, infrared lamp 12 is corresponding with casing light source through holes 23, proximity sensor 50 and casing
Proximity sensor through hole 26 corresponds to, and optical flame detector 1a is corresponding with casing light sensation through hole 24.Wherein infrared lamp 12 and casing light source through holes
23 correspondences, which refer to the light that infrared lamp 12 is sent, to be passed through from casing light source through holes 23, can be infrared lamp 12 and casing specifically
The light that 23 face of light source through holes or infrared lamp 12 emit passes through casing light source through holes after the effect of light-guide device 13
23.The optical flame detector 1a visible rays that refer to corresponding with casing light sensation through hole 24 can pass through from casing light sensation through hole 24 and incide into optical flame detector
Can be that optical flame detector 1a passes through machine with 24 face of casing light sensation through hole or the light of visible ray incidence specifically on 1a
Shell light sensation through hole 24 is simultaneously incided into after light-guide device acts on optical flame detector 1a.Proximity sensor 50 leads to casing proximity sensor
Hole 26 corresponds to similarly, and therefore not to repeat here.Casing light source through holes 23 and casing light sensation through hole 24 can be apart from one another by, when
So, in other embodiments, casing light source through holes 23, casing proximity sensor through hole 26 and casing light sensation through hole 24 can also be
It interconnects.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set
It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated
Enter to export after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.Cover board 30 covers casing light
Source through hole 23, casing proximity sensor through hole 26 and casing light sensation through hole 24, coated with infrared on the inner surface 32 of cover board 30
Ink 40 is crossed, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and to visible ray
There is higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device
By the infrared region covered through ink 40 on 100.Specifically, it is infrared to be covered on inner surface 32 not with showing through ink 40
90 corresponding region of display screen.
It is infrared to be blocked in casing light source through holes 23 and casing proximity sensor through hole 26 at least through ink 40
One, i.e. infrared to cover casing light source through holes 23 and casing proximity sensor through hole 26, Yong Hunan simultaneously through ink 40
To see the internal structure of electronic device 100, electronic device by casing light source through holes 23 and casing proximity sensor through hole 26
100 shape is more beautiful；It is infrared to cover casing light source through holes 23 through ink 40 and not cover casing sensor through hole
26；Or infrared light transmission ink can also cover casing sensor through hole 26 and not cover casing light source through holes 23.
Referring to Fig. 1, receiver 70 is for sending out acoustic signals when being encouraged be subject to power supply, user can by by
Words device 70 is conversed.Structured light projector 80 is used for outside emitting structural light, on project structured light to testee after it is anti-
It penetrates, the structure light reflected can be received by infrared pick-up first 62, and the processor of electronic device 100 is further analyzed by infrared light
The structure light that camera 62 receives, to obtain the depth information of testee.
Imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, and input and output module 10, infrared light are taken the photograph
As first 62, visible image capturing is first 61, the center of receiver 70 and structured light projector 80 is located on same line segment.Specifically, from
One end of line segment is followed successively by input and output module 10, structured light projector 80, receiver 70, infrared pick-up head to the other end
62nd, visible image capturing first 61, at this point, visible image capturing first 61 and infrared pick-up first 62 can form double photography/videography heads；Or
Input and output module 10, infrared pick-up first 62, receiver 70, visible image capturing head are followed successively by from one end of line segment to the other end
61st, structured light projector 80；Or it is followed successively by that infrared pick-up is first 62, input and output module from one end of line segment to the other end
10th, receiver 70, visible image capturing be first 61, structured light projector 80；Or it is followed successively by from one end of line segment to the other end infrared
Light video camera head 62, visible image capturing are first 61, receiver 70, input and output module 10, structured light projector 80, at this point, visible ray
Camera 61 and infrared pick-up first 62 can form double photography/videography heads.Certainly, input and output module 10, infrared pick-up head
62nd, receiver 70, visible image capturing be first 61, the arrangement mode of structured light projector 80 is not limited to above-mentioned citing, can also have
Other, such as the shapes such as the center arrangement of each electronic component is in the arc-shaped, center arrangement is rectangular.
To sum up, in the electronic device 100 of embodiment of the present invention, the position of mobile light-guide device 13 is passed through so that input
Output module 10 can be used as close to infrared lamp or infrared light compensating lamp, infrared lamp 12, light-guide device 13, proximity sensor 50 and light sensation
Device 1a is integrated into a single package body structure, and input and output module 10 is made to have gathered transmitting infrared light with infrared distance measurement and infrared benefit
The function of the function of light and the intensity detection of visible ray.Secondly, need to be positioned proximate to simultaneously compared to current electronic device red
For outer lamp and infrared light compensating lamp, the input and output module 10 of embodiment of the present invention only needs to set an infrared lamp 12, body
Product is smaller, has saved the space of the infrared light filling of realization and infrared distance measurement function.Further, infrared lamp 12, proximity sensor 50
A single package body structure is integrated into optical flame detector 1a, the integrated level of input and output module 10 is higher, small volume, so as to save
Realize the space of the function of the intensity detection of infrared distance measurement, infrared light filling and visible ray.Furthermore due to only needing one
Infrared lamp 12, proximity sensor 50 and optical flame detector 1a are arranged on same package substrate 111 and are packaged, compared to tradition
The infrared light compensating lamp of technique needs to be respectively adopted different wafers manufacture recombinants to PCB substrate close to infrared lamp and optical flame detector 1a
Upper encapsulation, improves packaging efficiency.
Referring again to Fig. 5, in some embodiments, input and output module 10 further includes light sensation lens 1b and is passed close to light
Sensor lens 1h.Light sensation lens 1b is arranged in encapsulating housing 11 and corresponding with optical flame detector 1a.Light sensation lens 1b will be seen that light converges
Gather on optical flame detector 1a, reduce transmission of visible light to optical flame detector 1a with the light quantity of exterior domain.It is set close to optical sensor lens 1h
It is in encapsulating housing 11 and corresponding with proximity sensor 50.By proximity sensor window 1134 enter by object reflection it is infrared
When the infrared light that lamp 12 emits is incided on proximity sensor lens 1h, proximity sensor lens 1h reduces the infrared light being reflected back
Line is transferred to the light quantity outside proximity sensor 50.
Referring to Fig. 5, in some embodiments, input and output module 10 further includes metal shutter 1c, metal blocks
Plate 1c is located in encapsulating housing 11 and between infrared lamp 12 and proximity sensor 50 and proximity sensor 50 and optical flame detector 1a.
Metal shutter 1c can avoid the infrared light that infrared lamp 12 is sent from inciding into light between infrared lamp 12 and optical flame detector 1a
On sensor 1a, moreover it is possible to shield infrared lamp 12 and optical flame detector 1a mutual and proximity sensor 50 and optical flame detector 1a is mutual
Electromagnetic interference.
Referring to Fig. 9, in some embodiments, input and output module 10 further includes optics sealing cover 16.Optics sealing cover 16
It is made of light transmissive material, optics sealing cover 16 is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 16 wraps up
Firmly infrared lamp 12, proximity sensor 50 and optical flame detector 1a.Specifically, optics sealing cover 16 can pass through encapsulating injection molding and forming technology shape
Into optics sealing cover 16 may be employed transparent thermosetting epoxy resin and be made, and to be not easy to soften in use, optics sealing cover 16 can
To fix the relative position between infrared lamp 12, proximity sensor 50 and optical flame detector 1a, and cause infrared lamp 12, proximity sensor
50 and optical flame detector 1a is not easy to rock in encapsulating housing 11.At this point, light-guide device 13 is arranged on beyond optics sealing cover 16 and removable
It is housed in dynamicly in encapsulating housing 11.
Referring to Fig. 9, in some embodiments, input and output module 10 further include it is multiple go out light clapboard 1d, it is multiple go out
Light clapboard 1d is formed in optics sealing cover 16 and positioned at infrared lamp 12 and proximity sensor 50 and proximity sensor 50 and light sensation
Between device 1a.Going out light clapboard 1d can stop that infrared lamp 12 sends infrared light and incides into proximity sensor 50 and optical flame detector 1a
On, while stop the luminous and close of the visible ray influence infrared lamp 12 from light sensation window 1132 into simultaneously directive optical flame detector 1a
Sensor 50 receives the infrared light of reflection.
Referring to Fig. 10, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Cover board sound outlet hole 34 is offered, receiver 70 is corresponding with the position of cover board sound outlet hole 34 and casing sound outlet hole.Input and output module
10th, infrared pick-up is first 62, the center of visible image capturing first 61 and structured light projector 80 is located on same line segment, receiver 70
Between the line segment and the top 21 of casing 20.
The center of receiver 70 is not located on the line segment, has saved each electronic component (input and output module on cover board 30
10th, infrared pick-up is first 62, visible image capturing is first 61, structured light projector 80 etc.) horizontal space that occupies.Cover board sound outlet hole 34
The marginal position of cover board 30 is opened in, and casing sound outlet hole is opened up close to top 21.
Referring again to Figure 11 to Figure 13, in some embodiments, cover board light source through holes can also be offered on cover board 30
33, cover board light source through holes 33 are corresponding with casing light source through holes 23, and the infrared light that infrared lamp 12 emits passes through casing light source through holes 23
After electronic device 100 can be pierced by from cover board light source through holes 33.
In some embodiments, cover board proximity sensor through hole 37, the close sensing of cover board can also be opened up on cover board 30
Device through hole 37 is corresponding with casing proximity sensor through hole 26, and the infrared light of the first infrared lamp 12 transmitting passes through machine after object reflects
It can be incided into after shell proximity sensor through hole 26 from cover board proximity sensor through hole 37 on proximity sensor 50.At this point, lid
Infrared transmission ink 40 can be set on plate 30 with 26 corresponding position of casing proximity sensor through hole, and user is difficult to pass through casing
Proximity sensor through hole 26 sees the proximity sensor 50 of the inside of electronic device 100, and the shape of electronic device 100 is more beautiful.
In some embodiments, cover board light sensation through hole 35, cover board light sensation through hole 35 and machine can also be opened up on cover board 30
Shell light sensation through hole 24 and optical flame detector 1a are corresponding, and the visible ray outside electronic device 100 passes through cover board light sensation through hole 35 and casing light
It can be incided on optical flame detector 1a after sense through hole 24.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (12)
1. a kind of input and output module, which is characterized in that the input and output module includes encapsulating housing, infrared lamp, guide-lighting member
Part, proximity sensor and optical flame detector, the encapsulating housing include package substrate, and the infrared lamp, the light-guide device described connect
Nearly sensor and the optical flame detector are encapsulated in the encapsulating housing, the infrared lamp, the proximity sensor and the light
Sensor carries on the package substrate, and the light-guide device can be movably arranged at the luminous light path of the infrared lamp
On, when the light-guide device is located in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting is with first
Field angle is emitted from the encapsulating housing using as infrared light compensating lamp or close to infrared lamp；When the light-guide device leave it is described red
When in the luminous light path of outer lamp, the infrared light of the infrared lamp transmitting is emitted to make with the second field angle from the encapsulating housing
To approach infrared lamp or infrared light compensating lamp；The proximity sensor is connect for what reception was reflected by the object by infrared lamp conduct
The infrared light of near-infrared lamp transmitting is to detect the object to the distance of the input and output module；The optical flame detector is used to connect
The visible ray in ambient light is received, and detects the intensity of the visible ray.
2. input and output module according to claim 1, which is characterized in that
The light-guide device includes convex lens or the lens group with positive light coke, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted from the encapsulating housing using as connecing with the first field angle
Near-infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing using as infrared light compensating lamp；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted from the encapsulating housing using as red with the first field angle
Outer light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing using as close to infrared lamp.
3. input and output module according to claim 1, which is characterized in that the input and output module further includes chip,
The infrared lamp, the proximity sensor and the optical flame detector are respectively formed on the chip.
4. input and output module according to claim 3, which is characterized in that the encapsulating housing further include package wall and
Encapsulation top, the package wall extend from the package substrate and be connected at the top of the encapsulation and the package substrate it
Between, be formed with luminescence window, proximity sensor window and light sensation window at the top of the encapsulation, the luminescence window with it is described infrared
Lamp corresponds to, and the proximity sensor window is corresponding with the proximity sensor, and the light sensation window is corresponding with the optical flame detector.
5. input and output module according to claim 3, which is characterized in that it is saturating that the input and output module further includes light sensation
Mirror and proximity sensor lens, the light sensation lens are arranged in the encapsulating housing and corresponding with the optical flame detector, described to connect
Nearly sensor leads are corresponding with the proximity sensor, and the light sensation lens and the proximity sensor are located at same transparent base
On.
6. input and output module according to claim 1, which is characterized in that the input and output module further includes multiple gold
Belong to shutter, the multiple metal shutter is located in the encapsulating housing and positioned at the infrared lamp, the proximity sensor
And in the optical flame detector it is arbitrary between the two.
7. input and output module according to claim 1, which is characterized in that the input and output module is further included by light transmission
Optics sealing cover made of material, the optics sealing cover is formed on the package substrate and in the encapsulating housing, described
Optics sealing cover wraps the infrared lamp, the proximity sensor and the optical flame detector.
8. input and output module according to claim 7, which is characterized in that the input and output module further include it is multiple go out
Light clapboard, it is the multiple go out light clapboard be formed in the optics sealing cover and positioned at the infrared lamp, the proximity sensor and
In the optical flame detector it is arbitrary between the two.
9. input and output module according to any one of claims 1 to 8, which is characterized in that on the input and output module
Grounding pin, infrared lamp pin, proximity sensor pin and light sensation pin are formed with, the grounding pin and the infrared lamp draw
When foot is enabled, the infrared lamp emits infrared light；When the grounding pin and the proximity sensor pin are enabled, institute
State proximity sensor for receive be reflected by the object by the infrared lamp as the infrared light emitted close to infrared lamp to examine
The object is surveyed to the distance of the input and output module；When the grounding pin and the light sensation pin are enabled, the light
Sensor detects the intensity of visible ray.
10. a kind of electronic device, which is characterized in that the electronic device includes：
Casing；With
Input and output module as described in any one of claims 1-9, the input and output module are arranged in the casing.
11. electronic device according to claim 10, which is characterized in that the electronic device further includes the cover board of light transmission,
The casing offers casing light source through holes, casing proximity sensor through hole and casing light sensation through hole, the infrared lamp with it is described
Casing light source through holes correspond to, the proximity sensor is corresponding with the casing proximity sensor through hole, the optical flame detector with it is described
Casing light sensation through hole corresponds to, and the cover board is set on the housing.
12. electronic device according to claim 10, which is characterized in that the electronic device further includes the cover board of light transmission,
The casing offers casing light source through holes, casing proximity sensor through hole and casing light sensation through hole, the infrared lamp with it is described
Casing light source through holes correspond to, and the optical flame detector is corresponding with the casing light sensation through hole, and the proximity sensor connects with the casing
Nearly sensor through hole corresponds to, and the cover board is set on the housing, and the cover board is formed with the surface that the casing is combined
The infrared through ink of infrared light is only transmitted, the infrared transmission ink blocks the casing light source through holes and is that the casing connects
It is at least one in nearly sensor through hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711433362.XA CN108074941B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
| PCT/CN2018/118683 WO2019128625A1 (en) | 2017-12-26 | 2018-11-30 | Output module, input and output module and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711433362.XA CN108074941B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
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| Publication Number | Publication Date |
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| CN108074941A true CN108074941A (en) | 2018-05-25 |
| CN108074941B CN108074941B (en) | 2020-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711433362.XA Expired - Fee Related CN108074941B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
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| Country | Link |
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| CN (1) | CN108074941B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109639897A (en) * | 2018-12-20 | 2019-04-16 | 维沃移动通信有限公司 | A kind of light transmission method and device |
| WO2019128625A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic apparatus |
| WO2020029718A1 (en) * | 2018-08-07 | 2020-02-13 | Oppo广东移动通信有限公司 | Screen, electronic apparatus, and method for manufacturing screen |
| CN110827699A (en) * | 2018-08-07 | 2020-02-21 | Oppo广东移动通信有限公司 | Screen, electronic device, and method for manufacturing screen |
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| CN103515371A (en) * | 2012-06-27 | 2014-01-15 | 格科微电子（上海）有限公司 | Integrated optical sensor package |
| US20160309098A1 (en) * | 2013-12-12 | 2016-10-20 | Connaught Electronics Ltd. | Image capturing device with an image sensor and a thermal infrared sensor as well as motor vehicle with an image capturing device |
| CN107451542A (en) * | 2017-07-14 | 2017-12-08 | 广东欧珀移动通信有限公司 | Iris recognition modular arrangements structure and mobile terminal |
| CN107480589A (en) * | 2017-07-07 | 2017-12-15 | 广东欧珀移动通信有限公司 | Infrared light supply component and electronic installation |
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| CN103515371A (en) * | 2012-06-27 | 2014-01-15 | 格科微电子（上海）有限公司 | Integrated optical sensor package |
| US20160309098A1 (en) * | 2013-12-12 | 2016-10-20 | Connaught Electronics Ltd. | Image capturing device with an image sensor and a thermal infrared sensor as well as motor vehicle with an image capturing device |
| CN107480589A (en) * | 2017-07-07 | 2017-12-15 | 广东欧珀移动通信有限公司 | Infrared light supply component and electronic installation |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2019128625A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic apparatus |
| WO2020029718A1 (en) * | 2018-08-07 | 2020-02-13 | Oppo广东移动通信有限公司 | Screen, electronic apparatus, and method for manufacturing screen |
| CN110827699A (en) * | 2018-08-07 | 2020-02-21 | Oppo广东移动通信有限公司 | Screen, electronic device, and method for manufacturing screen |
| CN110827699B (en) * | 2018-08-07 | 2021-02-23 | Oppo广东移动通信有限公司 | Screen, electronic device, and method for manufacturing screen |
| CN109639897A (en) * | 2018-12-20 | 2019-04-16 | 维沃移动通信有限公司 | A kind of light transmission method and device |
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|---|---|
| CN108074941B (en) | 2020-04-03 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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