CN108074947A - Input and output module and electronic device - Google Patents
Input and output module and electronic device Download PDFInfo
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- CN108074947A CN108074947A CN201711435723.4A CN201711435723A CN108074947A CN 108074947 A CN108074947 A CN 108074947A CN 201711435723 A CN201711435723 A CN 201711435723A CN 108074947 A CN108074947 A CN 108074947A
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
Abstract
Electronic device disclosed by the invention and input and output module include encapsulating housing, infrared lamp, light-guide device, structured light projector, and optical flame detector, encapsulating housing includes package substrate, infrared lamp, light-guide device, structured light projector and optical flame detector are encapsulated in encapsulating housing, infrared lamp, structured light projector, it is carried on optical flame detector on package substrate, light-guide device can be movably arranged in the luminous light path of infrared lamp, when light-guide device is located in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted from encapsulating housing using as infrared light compensating lamp or close to infrared lamp with the first field angle；When light-guide device is left in the luminous light path of infrared lamp, the infrared light of infrared lamp transmitting is emitted from encapsulating housing using as close to infrared lamp or infrared light compensating lamp with the second field angle；Optical flame detector is used to receive the visible ray in ambient light, and detects the intensity of visible ray.The integrated level of input and output module is higher, small volume.
Description
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of input and output module and electronics dress
It puts.
Background technology
As the function that mobile phone is supported is more and more rich and varied, the type and quantity for the function element that mobile phone needs are set
It is more and more, in order to realize distance detection, ambient light detection with the functions such as the facial 3D feature recognitions of user, it is necessary to be set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be occupied.
The content of the invention
Embodiment of the present invention provides a kind of input and output module and electronic device.
The input and output module of embodiment of the present invention includes encapsulating housing, infrared lamp, light-guide device, project structured light
Device and optical flame detector, the encapsulating housing include package substrate, the infrared lamp, the light-guide device, the structured light projector
And the optical flame detector is encapsulated in the encapsulating housing, the infrared lamp and the structured light projector are carried on the encapsulation
On substrate, the light-guide device can be movably arranged in the luminous light path of the infrared lamp, when the light-guide device is located at
When in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting is gone out with the first field angle from the encapsulating housing
It penetrates using as infrared light compensating lamp or close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, institute
The infrared light of infrared lamp transmitting is stated with the second field angle from encapsulating housing outgoing using as close to infrared lamp or infrared benefit
Light lamp；The optical flame detector is used to receive the visible ray in ambient light, and detects the intensity of the visible ray.
In some embodiments, the light-guide device includes convex lens or the lens group with positive light coke, when described
When light-guide device is located in the luminous light path of the infrared lamp, the infrared light of infrared lamp transmitting is with the first field angle from institute
Encapsulating housing outgoing is stated using as close to infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, institute
The infrared light of infrared lamp transmitting is stated with the second field angle from encapsulating housing outgoing using as infrared light compensating lamp；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is positioned at described red
When in the luminous light path of outer lamp, the infrared light of the infrared lamp transmitting is emitted to make with the first field angle from the encapsulating housing
For infrared light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared lamp emits infrared
Light is emitted from the encapsulating housing using as close to infrared lamp with the second field angle.
In some embodiments, the input and output module further includes chip, the infrared lamp, the project structured light
Device and the optical flame detector are respectively formed on the chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected at the top of the encapsulation between the package substrate, is formed at the top of the encapsulation infrared
Light window, structure light window and light sensation window, the infrared light window is corresponding with the infrared lamp, the structure light window and institute
Structured light projector correspondence is stated, the light sensation window is corresponding with the optical flame detector.
In some embodiments, the input and output module further includes multiple metal shutters, and multiple metals hide
Baffle is respectively positioned in the encapsulating housing, and multiple metal shutters are separately positioned on the infrared lamp, the structure light is thrown
In emitter and the optical flame detector it is arbitrary between the two.
The electronic device of embodiment of the present invention includes：
Casing；With
Input and output module described in above-mentioned any one embodiment, the input and output module are arranged on the casing
It is interior.
In some embodiments, the electronic device further includes the cover board of light transmission, and it is infrared that the casing offers casing
Through hole, casing structure light through hole and casing light sensation through hole, the infrared lamp is corresponding with the infrared through hole of the casing, the structure light
The projector is corresponding with the casing structure light through hole, and the optical flame detector is corresponding with the casing light sensation through hole, and the cover board is set
On the housing.
In some embodiments, the cover board is formed with the surface that the casing is combined and only transmits the infrared of infrared light
Through ink, it is described it is infrared blocked through ink in the infrared through hole of the casing and the casing structure light through hole at least one
It is a.
In some embodiments, the electronic device further includes proximity sensor and imaging modules, the imaging modules
Lens barrel including microscope base, on the microscope base and the imaging sensor being housed in the microscope base, the microscope base include position
Mounting surface between the lens barrel and described image sensor, the proximity sensor are arranged on the mounting surface.
In some embodiments, the electronic device further includes imaging modules and proximity sensor, the imaging modules
On the housing, the imaging modules include camera case and camera lens module, and the top surface of the camera case is ladder for installation
Face and including connected the first sub- top surface and the second sub- top surface, the relatively described first sub- top surface inclination of the second sub- top surface and with
The first sub- top surface forms notch, and the top surface offers light extraction through hole, and the camera lens module is housed in the camera case
Interior and corresponding with the light extraction through hole, the proximity sensor is arranged at the described first sub- top surface.
In some embodiments, the electronic device further includes imaging modules and proximity sensor, the imaging modules
Including camera case and two camera lens modules, notch is offered to form step-like top surface on the top surface of the camera case,
The top surface includes the first tread and the second tread less than first tread, opens up that there are two light extractions on first tread
Through hole, each light extraction through hole is corresponding with the camera lens module, and the proximity sensor is arranged at second tread.
In some embodiments, the electronic device further includes proximity sensor and imaging modules, the imaging modules
In the casing, the imaging modules include microscope base, the lens barrel on the microscope base and are partly arranged on described
Substrate in microscope base, the proximity sensor are set on the substrate.
In the electronic device of embodiment of the present invention, pass through the position of mobile light-guide device so that infrared lamp can be used as connecing
Near-infrared lamp or infrared light compensating lamp, integrated structure light projector and optical flame detector, input and output module group transmitting infrared light with
Infrared distance measurement, infrared light filling, three-dimensional imaging and the function of visual intensity detection, therefore, the integrated level of input and output module compared with
Height, small volume, input and output module have saved realization infrared distance measurement, infrared light filling, three-dimensional imaging and visual intensity detection
Function space.Further, since structured light projector, optical flame detector and infrared lamp are carried on a package substrate, compared to
The structured light projector of traditional handicraft, optical flame detector need that different wafers manufactures are respectively adopted again close to infrared lamp, infrared light compensating lamp
The encapsulation being combined in PCB substrate, improves packaging efficiency.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
It obtains substantially and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the input and output module of the electronic device of embodiment of the present invention；
Fig. 3 is the view of the input and output module of the electronic device of embodiment of the present invention；
Fig. 4 is the view of the input and output module of the electronic device of embodiment of the present invention；
Fig. 5 and Fig. 6 is the schematic cross-section of the input and output module of the electronic device of embodiment of the present invention；
Fig. 7 is the partial sectional schematic view of the electronic device of embodiment of the present invention；
Fig. 8 is the proximity sensor of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Fig. 9 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 10 is the schematic cross-section of the input and output module of the electronic device of embodiment of the present invention；
Figure 11 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 12 to Figure 14 is the partial sectional schematic view of the electronic device of embodiment of the present invention；With
Figure 15 to Figure 22 is the proximity sensor of the electronic device of embodiment of the present invention and the three-dimensional signal of imaging modules
Figure.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the same or similar element of expression eventually or there is same or like element.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features contact directly or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity
Sub- component includes input and output module 10, proximity sensor 50 (such as Fig. 8), imaging modules 60 (such as Fig. 8) and receiver 70.Electricity
Sub-device 100 can be mobile phone, tablet computer, laptop, smartwatch, Intelligent bracelet, automatic teller machine etc., and the present invention is implemented
Example is illustrated so that electronic device 100 is mobile phone as an example, it will be understood that and the concrete form of electronic device 100 can be other,
This is not restricted.
Refer to Fig. 2 and Fig. 5, input and output module 10 is single package body structure, including encapsulating housing 11, infrared lamp 12,
Light-guide device 13, structured light projector 14 and optical flame detector 1b.
Encapsulating housing 11 for simultaneously encapsulate infrared lamp 12, light-guide device 13, structured light projector 14 and optical flame detector 1b or
Person says that infrared lamp 12, light-guide device 13, structured light projector 14 and optical flame detector 1b are encapsulated in simultaneously in encapsulating housing 11.Encapsulation
Housing 11 includes package substrate 111, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference
(Electromagnetic Interference, EMI) shielding material is made, to avoid extraneous electromagnetic interference to input and output
Module 10 has an impact.In present embodiment, the center of structured light projector 14, the center of infrared lamp 12 and optical flame detector 1b
Center is located on same line segment, such as：Structured light projector 14, infrared lamp 12 and light are followed successively by along one end of line segment to the other end
Sensor 1b；Alternatively, it is followed successively by infrared lamp 12, structured light projector 14 and optical flame detector 1b along one end of line segment to the other end；Alternatively,
Infrared lamp 12, optical flame detector 1b and structured light projector 14 are followed successively by along one end of line segment to the other end.In other embodiments,
The line of centres of structured light projector 14, infrared lamp 12 and optical flame detector 1b is triangular in shape.
Package substrate 111 is used to carry infrared lamp 12, structured light projector 14 and optical flame detector 1b.In manufacture input and output mould
During group 10, infrared lamp 12, structured light projector 14 and optical flame detector 1b can be formed on chip 15, then by infrared lamp 12, structure
Light projector 14, optical flame detector 1b and chip 15 are set along on package substrate 111, specifically, can be bonded in chip 15
On package substrate 111.Meanwhile package substrate 111 can be used for that (such as electronics fills with other parts of electronic device 100
Put 100 casing 20, mainboard etc.) connection, input and output module 10 is fixed in electronic device 100.
Package wall 112 can surround infrared lamp 12, light-guide device 13, structured light projector 14 and optical flame detector 1b and set,
Package wall 112 extends from package substrate 111, and package wall 112 can be combined with package substrate 111, it is preferred that package wall
112 with package substrate 111 to be detachably connected, in order to remove after package wall 112 to infrared lamp 12, light-guide device 13,
Structured light projector 14 and optical flame detector 1b are overhauled.The making material of package wall 112 can be the material of impermeable infrared light,
Package wall 112 is passed through to avoid the infrared light that infrared lamp 12 or structured light projector 14 are sent.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113
Infrared light window 1131, structure light window 1132 and light sensation window 1133 are formed with, infrared light window 1131 and infrared lamp 12 are right
Should, the infrared light that infrared lamp 12 emits is pierced by from infrared light window 1131；Structure light window 1132 and structured light projector 14 are right
Should, the structure light (infrared light) that structured light projector 14 emits is pierced by from structure light window 1132；Light sensation window 1133 and light sensation
Device 1b is corresponded to, it is seen that light can pass through light sensation window 1133 and incide on optical flame detector 1b.Encapsulation top 113 and package wall
112 integrally formed can obtain, can also split shape to obtain.In one example, infrared light window 1131, structure light window
1132 and light sensation window 1133 be through hole, the making material at encapsulation top 113 for impermeable infrared light and visible ray material.
In another example, encapsulation top 113 by the material of impermeable infrared light, saturating infrared light, be opaque to visible light but and thoroughly visible ray material
Co-manufactured forms, and specifically, infrared light window 1131 and structure light window 1132 are made of the material of saturating infrared light, light sensation window
Mouth 1133 is made of the material of saturating visible ray, remaining position is made of impermeable infrared light and the material being opaque to visible light but, further
Ground, infrared light window 1131, structure light window 1132 and light sensation window 1133 could be formed with lens arrangement, to improve from infrared
The infrared light emission angle that light window 1131 and structure light window 1132 project, such as structure light window 1132 are formed with concavees lens
Structure, so that the divergence of beam through structure light window 1132 outwards projects；Infrared light window 1131 is formed with convex lens structures,
So that the light through infrared light window 1131 gathers outside injection；Light sensation window 1133 can also be formed with lens arrangement, with
Improve from the incident VISIBLE LIGHT EMISSION angle of light sensation window 1133, such as light sensation window 1133 and be formed with convex lens structures 1c (such as
Shown in Fig. 5) so as to be gathered by the incident light of light sensation window 1133 and projected on optical flame detector 1b.
Light-guide device 13 can be movably arranged in the luminous light path of infrared lamp 12.Fig. 5 and Fig. 6 are referred to, input is defeated
Go out module 10 and further include actuator 17, actuator 17 is used to that light-guide device 13 to be driven to move so as to being movably arranged at infrared lamp
In 12 luminous light path.Wherein, actuator 17 drives light-guide device 13 to move so as to being movably arranged at the hair of infrared lamp 12
Include in light light path：Under normal conditions, light-guide device 13 is arranged in the luminous light path of infrared lamp 12, and infrared lamp 12 is used as infrared benefit
Light lamp (or close to infrared lamp), when infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), actuator 17 drives leaded light
Element 13 moves to leave the luminous light path of infrared lamp 12；Or under normal conditions, light-guide device 13 is not arranged in infrared lamp 12
In the light path that shines, infrared lamp 12 is used as close to infrared lamp (or infrared light compensating lamp), (or is connect when infrared lamp 12 is used as infrared light compensating lamp
Near-infrared lamp) when, actuator 17 drives light-guide device 13 to move in the luminous light path of infrared lamp 12.
Referring to Fig. 5, actuator 17 includes linear motor, linear motor includes stator 172 and mover 174, and stator 172 is pacified
In package wall 112, mover 174 is connected with light-guide device 13, and actuator 17 drives mover 174 to move to drive guide-lighting member
Part 13 moves.Referring to Fig. 6, the structure of above-mentioned actuator 17 could alternatively be：Actuator 17 includes linear motor, linear motor
Including stator 172 and mover 174, stator 172 is mounted in package wall 112, input and output module 10 further include shaft 18 and
Linking arm 19, the first end connection light-guide device 13 of linking arm 19, the of the separate light-guide device 13 of mover 174 and linking arm 19
Two ends connect, and linking arm 19 is set in shaft 18, shaft 18 between light-guide device 13 and mover 174, linear motor
Mover 174 is drivingly connected the second end motion of arm 19, and linking arm 19 is rotated around shaft 18, as a result, the first end of linking arm 19
Light-guide device 13 is driven to be rotated around shaft 18, to realize that light-guide device 13 is in the luminous light path of infrared lamp 12 or away from red
The luminous light path of outer lamp 12.In an embodiment of the present invention, input and output module 10 can also include loading plate (not shown), hold
Bearing holes are offered on support plate, light-guide device 13 is mounted in bearing holes, and actuator 17 is used to that loading plate movement to be driven to drive
Light-guide device 13 moves.
Referring to Fig. 3, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 using as close to red
Outer lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 emits is with the second visual field
Angle is emitted from encapsulating housing 11 using as infrared light compensating lamp, at this point, the first field angle is less than the second field angle, wherein, first regards
The scope of rink corner is 10 degree of -30 degree, for example, the first field angle is 10 degree, 15 degree, 20 degree, 25 degree or 30 degree etc., the second visual field
The scope at angle for 60 degree -90 degree, for example, the second field angle be 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 degree,
Or 90 degree etc..Light-guide device 13 is for converging light, and light-guide device 13 includes convex lens or the lens group with positive light coke, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light passes through infrared light window
1131 scopes covered from the outgoing of encapsulating housing 11.
Referring to Fig. 4, when light-guide device 13 is located in the luminous light path of infrared lamp 12, the infrared light of the transmitting of infrared lamp 12
Line passes through light-guide device 13, is emitted under the action of light-guide device 13 with the first field angle from encapsulating housing 11 using as infrared benefit
Light lamp；When light-guide device 13 is left in the luminous light path of infrared lamp 12, the infrared light that infrared lamp 12 emits is with the second visual field
Angle is emitted from encapsulating housing 11 using as close to infrared lamp, at this point, the first field angle is more than the second field angle, wherein, first regards
The scope of rink corner for 60 degree -90 degree, for example, the first field angle be 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87
Degree or 90 degree etc., the scope of the second field angle is spent for 10 degree -30, for example, the second field angle is 10 degree, 15 degree, 20 degree, 25 degree,
Or 30 degree etc..Light-guide device 13 is used for divergent rays, and light-guide device 13 includes concavees lens or the lens group with negative power, thoroughly
Microscope group can be one or more pieces lens.In an embodiment of the present invention, field angle refers to that infrared light passes through infrared light window
1131 scopes covered from the outgoing of encapsulating housing 11.
When infrared lamp 12 is opened and emits infrared light outside encapsulating housing 11 as infrared light compensating lamp, infrared light passes through
Infrared light window 1131 is to project body surface, and the reception (as shown in Figure 1) of infrared pick-up first 62 of electronic device 100 is by object
The infrared light of body reflection is to obtain the image information of object (at this point, infrared lamp 12 be used for infrared light filling).When infrared lamp 12 is opened
And during as emitting infrared light outside encapsulating housing 11 close to infrared lamp, infrared light is through infrared light window 1131 and reaches object
Body surface face, the proximity sensor 50 of electronic device 100 the infrared light (as shown in Figure 8) that be reflected by the object that receives are arrived with detection object
The distance (at this point, infrared lamp 12 is used for infrared distance measurement) of electronic device 100.
When infrared lamp 12 is used as infrared light compensating lamp and as close to can be with different power to encapsulating housing during infrared lamp
Transmitting infrared light outside 11.Specifically, infrared lamp 12 is used as with the first power outside encapsulating housing 11 emitting close to during infrared lamp
Infrared light emits infrared light with the second power when infrared lamp 12 is used as infrared light compensating lamp outside encapsulating housing 11, wherein, the
One power can be less than the second power.
Fig. 5 and Fig. 6 are referred to, structured light projector 14 can be formed in infrared lamp 12 on a piece of chip 15, further
Reduce volume of the structured light projector 14 with infrared lamp 12 after integrated, and preparation process is simpler.Structured light projector 14 can be to
Outer transmitting structure light, structure light can form infrared laser speckle pattern, and project structured light to target object surface is taken the photograph by infrared light
As first 62 it is (as shown in Figure 1) gathers by the modulated structured light patterns of target object, by the structured light patterns to being modulated into
Row analysis calculates the depth image (at this point, structured light projector 14 is used for three-dimensional imaging) for obtaining target object.Of the invention real
It applies in example, structured light projector 14 includes light source 141, mirror holder 142, lens 143 and diffraction optical element (diffractive
optical elements,DOE)144.The light beam that light source 141 is sent is after lens 143 are collimated or converged by diffraction optical element
144 are expanded and are outwards emitted with certain beam pattern.Specifically, light source 141 can be formed on chip 15,143 He of lens
Diffraction optical element 144 can be fixed on mirror holder 1422, such as is fixed on by way of gluing on mirror holder 142.
Fig. 5 and Fig. 6 are referred to, structured light projector 14, infrared lamp 12 and optical flame detector 1b can be formed in a piece of chip 15
On, further reduce the volume after structured light projector 14, infrared lamp 12 and optical flame detector 1b are integrated, and preparation process is simpler.
Optical flame detector 1b detects the intensity of visible ray for receiving by the visible ray in the incident environment of light sensation window 1133, using as
The foundation of the display brightness of control display screen 90.
It please refers to Fig.1 and Fig. 7, casing 20 can be as the installation carrier of input and output module 10, in other words, input and output
Module 10 can be arranged in casing 20.Casing 20 can be the shell of electronic device 100, in embodiments of the present invention, casing
It can be additionally used in the display screen 90 that electronic device 100 is set in 20, since the input and output module 10 of embodiment of the present invention occupies
Small volume, therefore, for setting the volume of display screen 90 that can correspond to increase in casing 20, to improve electronic device
100 screen accounting.Specifically, casing 20 includes top 21 and bottom 22, and display screen 90 and input and output module 10 are arranged on top
Between portion 21 and bottom 22, in the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, such as
Shown in Fig. 1, input and output module 10 can be arranged between display screen 90 and top 21.In other embodiments, display screen
90 can be that screen open up jagged comprehensively, and display screen 90 surrounds input and output module 10, and input and output module 10 is from display
The notch of screen 90 exposes.
Casing 20 is further opened with the infrared through hole 23 of casing, casing structure light through hole 24 and casing light sensation through hole 25.It inputs defeated
When going out module 10 and being arranged in casing 20, the through hole 23 infrared with casing of infrared lamp 12 is corresponding, structured light projector 14 and casing knot
Structure light through hole 24 corresponds to, and optical flame detector 1b is corresponding with casing light sensation through hole 25.The wherein through hole 23 infrared with casing of infrared lamp 12 is corresponding
Referring to the light that infrared lamp 12 is sent can pass through from the infrared through hole 23 of casing, can be that infrared lamp 12 and casing are infrared logical specifically
The light that 23 face of hole or infrared lamp 12 emit passes through the infrared through hole 23 of casing after leaded light device acts on.Structure light
The projector 14 is corresponding with casing structure light through hole 24 similarly, and therefore not to repeat here.Optical flame detector 1b is corresponding with casing light sensation through hole 25
Referring to visible ray can pass through from casing light sensation through hole 25 and incide on optical flame detector 1b, can be optical flame detector 1b and machine specifically
25 face of shell light sensation through hole or the visible ray of incidence pass through casing light sensation through hole 25 and the incidence after light-guide device acts on
Onto optical flame detector 1b.In the embodiment as shown in figure 7, the infrared through hole 23 of casing, casing structure light through hole 24 and casing light sensation
Through hole 25 can be apart from one another by.Certainly, in other embodiments, the infrared through hole 23 of casing, 24 and of casing structure light through hole
Any two in casing light sensation through hole 25 can also interconnect；Alternatively, the infrared through hole 23 of casing, casing structure light lead to
Hole 24 and 25 three of casing light sensation through hole can interconnect.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set
It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated
Enter to export after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In reality as shown in Figure 7
It applies in example, cover board 30 covers the infrared through hole 23 of casing, casing structure light through hole 24 and casing light sensation through hole 25, the interior table of cover board 30
It is infrared to have higher transmitance to infrared light through ink 40 coated with infrared transmission ink 40 on face 32, such as can reach
85% or more, and have higher attenuation rate to visible ray, such as can reach more than 70% so that user during normal use,
Naked eyes are difficult to see that on electronic device 100 by the infrared region covered through ink 40.Specifically, it is infrared can be with through ink 40
Cover region not corresponding with display screen 90 and optical flame detector 1b on inner surface 32.
It is infrared can also be blocked through ink 40 it is at least one in the infrared through hole 23 of casing and casing structure light through hole 24,
That is, it is infrared to block the infrared through hole 23 of casing and casing structure light through hole 24 (as shown in Figure 7), user simultaneously through ink 40
It is difficult to see by the infrared through hole 23 of casing and casing structure light through hole 24 internal structure of electronic device 100, electronic device 100
Shape it is more beautiful；It is infrared to cover the infrared through hole 23 of casing through ink 40, and casing structure light through hole 24 is not covered；
Or the infrared ink 40 that penetrates can also cover casing structure light through hole 24, and the infrared through hole 23 of casing is not covered.
Referring to Fig. 8, proximity sensor 50 is single package body structure.Proximity sensor 50 is received by external object reflection
Infrared light, to judge the distance between external object and electronic device 100.
It please refers to Fig.1 and Fig. 8, imaging modules 60 can be visible image capturing first 61 and one in infrared pick-up first 62
Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, and image passes
Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it
Between.In the embodiment shown in fig. 8, proximity sensor 50 is arranged on mounting surface 631, and specifically, proximity sensor 50 exists
Plane orthographic projection where mounting surface 631 is at least partly dropped on mounting surface 631, in this way, proximity sensor 50 and imaging mould
Group 60 sets compacter, and the horizontal space that the two occupies jointly is smaller.
Referring to Fig. 1, receiver 70 is for sending out acoustic signals when being encouraged be subject to power supply, user can by by
Words device 70 is conversed.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, defeated
The center for entering to export module 10, infrared pick-up first 62, visible image capturing first 61 and receiver 70 is located on same line segment.Specifically
Ground is followed successively by input and output module 10, visible image capturing first 61 from one end of line segment to the other end, receiver 70, infrared light are taken the photograph
As first 62 (as shown in Figure 9)；Or from one end of line segment to the other end be followed successively by input and output module 10, receiver 70,
Light video camera head 61, infrared pick-up first 62 (as shown in Figure 1), at this point, visible image capturing first 61 and infrared pick-up first 62 can be with
The double photography/videography heads (as shown in figure 19) of composition；Or it is followed successively by that infrared pick-up is first 62, input from one end of line segment to the other end
Export module 10, receiver 70, visible image capturing first 61.Certainly, input and output module 10, infrared pick-up be first 62, receiver
70 and the arrangement mode of visible image capturing first 61 be not limited to above-mentioned citing, can also have other, such as each electronic component
The shapes such as center arrangement is in the arc-shaped, center arrangement is rectangular.
Further, incorporated by reference to Fig. 8, proximity sensor 50 can be arranged on the mounting surface 631 of infrared pick-up first 62,
It can also be arranged on the mounting surface 631 of visible image capturing first 61, certainly, proximity sensor 50 can not also be arranged on mounting surface
On 631, for example, proximity sensor 50 can be disposed adjacent or adjacent with receiver 70 set with input input and output module 10
It puts, this is not restricted.
To sum up, in the electronic device 100 of embodiment of the present invention, the position of mobile light-guide device 13 is passed through so that infrared
Lamp 12 can be used as close to infrared lamp or infrared light compensating lamp, integrated structure light projector 14 and optical flame detector 1b, input and output module 10
The function that transmitting infrared light is detected with infrared distance measurement, infrared light filling, three-dimensional imaging and visual intensity, therefore, input are gathered
It is higher to export the integrated level of module 10, small volume, input and output module 10 has been saved realization infrared distance measurement, infrared light filling, stood
Body is imaged and the space of the function of visual intensity detection.Further, since structured light projector 14, optical flame detector 1b and infrared lamp 12
It is carried on a package substrate 111, compared to the structured light projector of traditional handicraft, optical flame detector, close to infrared lamp, infrared benefit
Light lamp needs the encapsulation being respectively adopted in different wafer manufacture recombinants to PCB substrate, improves packaging efficiency.
Referring to Fig. 5, in some embodiments, input and output module 10 further includes multiple metal shutters 16, multiple
Metal shutter 16 is respectively positioned in encapsulating housing 11, and multiple metal shutters 16 are separately positioned on infrared lamp 12, project structured light
In device 14 and optical flame detector 1b it is arbitrary between the two.When the center of infrared lamp 12, structured light projector 14, optical flame detector 1b are located at
When on same line segment, the quantity of metal shutter 16 is two；If one end of line segment is followed successively by infrared lamp 12, structure to the other end
Light projector 14, optical flame detector 1b, two metal shutters 16 respectively between structure infrared lamp 12 and structured light projector 14,
And between structured light projector 14 and optical flame detector 1b；If one end of line segment is followed successively by infrared lamp 12, optical flame detector 1b, knot to the other end
Structure light projector 14, two metal shutters 18 are respectively between infrared lamp 12 and optical flame detector 1b and optical flame detector 1b and structure
Between light projector 14；If one end of line segment is followed successively by structured light projector 14, infrared lamp 12, optical flame detector 1b to the other end, two
A metal shutter 18 is respectively between structured light projector 14 and infrared lamp 12 and between infrared lamp 12 and optical flame detector 1b.
For metal shutter 16 between structured light projector 14 and infrared lamp 12, metal shutter 16 on the one hand can be with shielding construction light
The projector 14 and the mutual electromagnetic interference of infrared lamp 12, structured light projector 14 and the luminous intensity and sequential of infrared lamp 12
It will not interact, another aspect metal shutter 16 can be used for 14 place cavity of isolation structures light projector and infrared lamp 12
The cavity at place, light will not enter another cavity from a cavity.Metal shutter 16 is located at structured light projector 14
Between optical flame detector 1b, the infrared light that structured light projector 14 emits can be avoided to incide on optical flame detector 1b, moreover it is possible to from shielding
Structured light projector 14 and electromagnetic interference mutual optical flame detector 1b.Metal shutter 16 is located at infrared lamp 12 and optical flame detector 1b
Between, the infrared light that infrared lamp 12 emits can be avoided to incide on optical flame detector 1b, moreover it is possible to from shielding infrared lamp 12 and optical flame detector
Electromagnetic interference mutual 1b.
Referring to Fig. 10, in some embodiments, input and output module 10 further includes optics sealing cover 1a.Optics sealing cover 1a
It is made of light transmissive material, optics sealing cover 1a is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1a is wrapped up
Firmly infrared lamp 12 and optical flame detector 1b.Specifically, optics sealing cover 1a can be formed by encapsulating injection molding and forming technology, optics sealing cover 1a
Transparent thermosetting epoxy resin may be employed to be made, to be not easy to soften in use, optics sealing cover 1a can fix infrared lamp
12 and the position of optical flame detector 1b, and infrared lamp 12 and optical flame detector 1b is caused to be not easy to rock in encapsulating housing 11.At this point, guide-lighting member
Part 13 is arranged on beyond optics sealing cover 1a and is movably housed in encapsulating housing 11.
1 is please referred to Fig.1, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Cover board sound outlet hole 35 is offered, receiver 70 is corresponding with the position of cover board sound outlet hole 35 and casing sound outlet hole.Input and output module
10th, the center of infrared pick-up first 62 and visible image capturing first 61 is located on same line segment, and receiver 70 is located at the line segment and machine
Between the top 21 of shell 20.
The center of receiver 70 is not located on the line segment, has saved each electronic component (input and output module on cover board 30
10th, first 62, visible image capturing first 61 of infrared pick-up etc.) horizontal space that occupies.In embodiment as shown in figure 12, cover board
Sound outlet hole 35 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
Referring again to Figure 12, the infrared through hole 33 of cover board, cover board can also be offered in some embodiments, on cover board 30
The infrared through hole 23 infrared with casing of through hole 33 is corresponding, and the infrared light that infrared lamp 12 emits is through can be from after the infrared through hole 23 of casing
Electronic device 100 is pierced by the infrared through hole 33 of cover board.It at this point, can be with 24 corresponding position of casing structure light through hole on cover board 30
Infrared transmission ink 40 is set, and user is difficult to see by casing structure light through hole 24 structure light of the inside of electronic device 100
The projector 14, the shape of electronic device 100 are more beautiful.
3 are please referred to Fig.1, covering plate structure light through hole 34, cover board knot can also be opened up in some embodiments, on cover board 30
Structure light through hole 34 is corresponding with casing structure light through hole 24, and the infrared light that structured light projector 14 emits passes through casing structure light through hole
Electronic device 100 can be pierced by after 24 from covering plate structure light through hole 34.At this point, through hole 23 infrared with casing is corresponding on cover board 30
Position can set it is infrared penetrate ink 40, user is difficult to see by the infrared through hole 23 of casing the inside of electronic device 100
Light-guide device 13 and infrared lamp 12, the shape of electronic device 100 it is more beautiful.
4 are please referred to Fig.1, cover board light sensation through hole 36, cover board light sensation can also be opened up in some embodiments, on cover board 30
Through hole 36 and casing light sensation through hole 25 and optical flame detector 1b are corresponding, and the visible ray outside electronic device 100 passes through cover board light sensation through hole
36 and casing light sensation through hole 25 after can incide on optical flame detector 1b.It is at this point, corresponding with casing structure light through hole 24 on cover board 30
Position can set it is infrared penetrate ink 40, user is difficult to see in electronic device 100 by casing structure light through hole 24
The structured light projector 14 in portion；23 corresponding position of through hole infrared with casing can also set infrared through ink on cover board 30
40, user is difficult to see the light-guide device 13 of inside of electronic device 100 and infrared lamp 12, electronics by the infrared through hole 23 of casing
The shape of device 100 is more beautiful.
5 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on
On substrate 66, proximity sensor 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, the one of substrate 66
Part is located in microscope base 63, and another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and for carrying image biography
Sensor 65, the other end can be connected with the mainboard of electronic device 100.When proximity sensor 50 is arranged on substrate 66, close to biography
Sensor 50 is arranged on outside microscope base 63, and proximity sensor 50 can also be connected with FPC.
Imaging modules 60 can be visible image capturing first 61 and one or two in infrared pick-up first 62.Specifically,
Proximity sensor 50 can be fixed on the substrate 66 of visible image capturing first 61；Proximity sensor 50 can be fixed on infrared light and take the photograph
On the substrate 66 of picture first 62.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the one side opposite with proximity sensor 50, to increase
Add the integral strength of substrate 66 so that FPC is not susceptible to around folding, while when proximity sensor 50 is arranged on substrate 66 is not easy to send out
Life is rocked.In one example, proximity sensor 50 may be also secured on the lateral wall of microscope base 63, such as pass through cohesive side
Formula is fixed on the lateral wall of microscope base 63.
6 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67
Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- 672 and the 3rd sub- top surface 673 of top surface, the second son top
672 and first sub- top surface 671 of face tilts connection and forms notch 675, the 3rd sub- top surface 673 and second with the first sub- top surface 671
Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- 671 and the 3rd sub- top surface 673 of top surface to connect first
Sub- 671 and the 3rd sub- top surface 673 of top surface.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight
Angle, the angle between the second sub- 672 and the 3rd sub- top surface 673 of top surface can be obtuse angle or right angle.Notch 675 is opened in camera shell
On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.3rd sub- top surface 673 offers out
Light through hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through hole 674.Imaging sensor 65 is housed in
In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through hole 674 and camera lens mould
Group 68 is simultaneously transferred on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Proximity sensor 50 is set
At the first sub- top surface 671.In present embodiment, imaging modules 60 can be visible image capturing first 61, and proximity sensor 50 is
Single package body structure.In other embodiments, imaging modules 60 can be infrared pick-up first 62.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 50 is arranged on the first son and is pushed up
On face 671, proximity sensor 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, section
Installation space about in electronic device 100.
Please continue to refer to Figure 16, in some embodiments, the proximity sensor 50 of the above embodiment is arranged on first
On sub- top surface 671 and positioned at the outside of camera case 67, specifically, entire proximity sensor 50 is along perpendicular to the first sub- top surface
671 projection can be located in the first sub- top surface 671 (as shown in figure 16)；Alternatively, part proximity sensor 50 along perpendicular to
The projection of first sub- top surface 671 is located in the first sub- top surface 671.It is located at that is, proximity sensor 50 is at least part of
The surface of first sub- top surface 671, in this way, proximity sensor 50 sets compacter with imaging modules 60, the two occupies jointly
Horizontal space it is smaller, further save the installation space in electronic device 100.
7 are please referred to Fig.1, the first sub- top surface 671 of the above embodiment offers loophole 676, proximity sensor 50
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and transfer
Onto proximity sensor 50.The proximity sensor 50 of present embodiment is arranged in camera case 67, make proximity sensor 50 with
The structure of camera case 67 is more stablized and convenient for proximity sensor 50 and imaging modules 60 is installed on casing 20.
8 are please referred to Fig.1, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, proximity sensor 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image
Sensor 65 is arranged on substrate 66, and proximity sensor 50 may be also secured on substrate 66 and be housed in camera case 67.
Specifically, FPC is provided on substrate 66, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, another
End can be connected with the mainboard of electronic device 100.In other embodiments, proximity sensor 50 can also be connected with FPC.
The proximity sensor 50 of present embodiment is arranged in camera case 67, makes proximity sensor 50 and camera case 67
Structure more stablize and convenient for proximity sensor 50 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60
Substrate 66 is set and proximity sensor 50 is arranged on substrate 66, proximity sensor 50 is enable to be firmly mounted to camera shell
In body 67.
9 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds
Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677
678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread
Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with
With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677
Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle.
Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two
A light extraction through hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through holes 674
Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions
Through hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68,
Light outside electronic device 100 can pass through light extraction through hole 674 and camera lens module 68 and be transferred on imaging sensor 65.This reality
It applies in mode, imaging modules 60 can be visible image capturing first 61, and two camera lens modules 68 are visible image capturing first 61 at this time
Corresponding camera lens module.Proximity sensor 50 is arranged on the second tread 678 and outside camera case 67.Proximity sensor 50
For single package body structure.In other embodiments, imaging modules 60 can be infrared pick-up first 62, at this time two camera lens moulds
Group 68 is first 62 corresponding camera lens module of infrared pick-up.In yet another embodiment, imaging modules 60 are taken the photograph including visible ray
As first 61 and infrared pick-up first 62, one of camera lens module 68 is first 62 corresponding camera lens module of infrared pick-up at this time,
Another camera lens module 68 is first 61 corresponding camera lens module of visible image capturing.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 50 is arranged on the second tread
On 678, proximity sensor 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves
Installation space in electronic device 100.
Figure 20 is referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670
On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread
The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through holes 674 are opened in the first son respectively
On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675
Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face
679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678,
Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second
Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first
The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment
In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second
Angle be right angle.Compared with the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in
The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating proximity sensor 50 is arranged on the second tread
On 678.
9 and Figure 20 is please referred to Fig.1, in some embodiments, the proximity sensor 50 of the above embodiment is arranged on
On two treads 678 and positioned at the outside of camera case 67.Specifically, when notch 675 is opened in the marginal position of top surface 670,
Entire proximity sensor 50 can be located in the second tread 678 (as shown in figure 19) along perpendicular to the projection of the second tread 678；
Alternatively, part proximity sensor 50 is located at along the projection perpendicular to the second tread 678 in the second tread 678.It is that is, close
At least part of surface for being located at the second tread 678 of sensor 50.When notch 675 is opened in the centre position of top surface 670
When upper, entire proximity sensor 50 can be located at (such as Figure 20 in the second tread 678 along perpendicular to the projection of the second tread 678
It is shown).In this way, proximity sensor 50 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, into
One step has saved the installation space in electronic device 100.
Figure 21 is referred to, the second tread 678 of the above embodiment offers loophole 676, and proximity sensor 50 is located at
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be transferred to
On proximity sensor 50.The proximity sensor 50 of present embodiment is arranged in camera case 67, makes proximity sensor 50 and phase
The structure of casing body 67 is more stablized and convenient for proximity sensor 50 and imaging modules 60 is installed on casing 20.
Figure 22 is referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676,
Proximity sensor 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image sensing
Device 65 is arranged on substrate 66, and proximity sensor 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connected with the mainboard with electronic device 100.In other embodiments, proximity sensor 50 can also be connected with FPC.
The proximity sensor 50 of present embodiment is arranged in camera case 67, makes proximity sensor 50 and camera case 67
Structure more stablize and convenient for proximity sensor 50 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60
Substrate 66 is set and proximity sensor 50 is arranged on substrate 66, proximity sensor 50 is enable to be firmly mounted to camera shell
In body 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (12)
1. a kind of input and output module, which is characterized in that the input and output module includes encapsulating housing, infrared lamp, guide-lighting member
Part, structured light projector and optical flame detector, the encapsulating housing include package substrate, the infrared lamp, the light-guide device, institute
State structured light projector and the optical flame detector be encapsulated in the encapsulating housing, the infrared lamp, the structured light projector,
It is carried on the package substrate with the optical flame detector, the light-guide device can be movably arranged at the hair of the infrared lamp
In light light path, when the light-guide device is located in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the first field angle from the encapsulating housing using as infrared light compensating lamp or close to infrared lamp；When the light-guide device leaves
When in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting is gone out with the second field angle from the encapsulating housing
It penetrates using as close to infrared lamp or infrared light compensating lamp；The optical flame detector is used to receive the visible ray in ambient light, and described in detection
The intensity of visible ray.
2. input and output module according to claim 1, which is characterized in that
The light-guide device includes convex lens or the lens group with positive light coke, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted from the encapsulating housing using as connecing with the first field angle
Near-infrared lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing using as infrared light compensating lamp；Or
The light-guide device includes concavees lens or the lens group with negative power, when the light-guide device is located at the infrared lamp
Luminous light path on when, the infrared light of infrared lamp transmitting is emitted from the encapsulating housing using as red with the first field angle
Outer light compensating lamp；When the light-guide device is left in the luminous light path of the infrared lamp, the infrared light of the infrared lamp transmitting
It is emitted with the second field angle from the encapsulating housing using as close to infrared lamp.
3. input and output module according to claim 1, which is characterized in that the input and output module further includes chip,
The infrared lamp, the structured light projector and the optical flame detector are respectively formed on the chip.
4. input and output module according to claim 3, which is characterized in that the encapsulating housing further include package wall and
Encapsulation top, the package wall extend from the package substrate and be connected at the top of the encapsulation and the package substrate it
Between, be formed with infrared light window, structure light window and light sensation window at the top of the encapsulation, the infrared light window with it is described infrared
Lamp corresponds to, and the structure light window is corresponding with the structured light projector, and the light sensation window is corresponding with the optical flame detector.
5. input and output module according to claim 3, which is characterized in that the input and output module further includes multiple gold
Belong to shutter, multiple metal shutters are respectively positioned in the encapsulating housing, and multiple metal shutters are separately positioned on
In the infrared lamp, the structured light projector and the optical flame detector it is arbitrary between the two.
6. a kind of electronic device, which is characterized in that including：
Casing；With
Input and output module described in claim 1-5 any one, the input and output module are arranged in the casing.
7. electronic device according to claim 6, which is characterized in that the electronic device further includes the cover board of light transmission, institute
It states casing and offers the infrared through hole of casing, casing structure light through hole and casing light sensation through hole, the infrared lamp and the casing are red
Accessibke porosity corresponds to, and the structured light projector is corresponding with the casing structure light through hole, the optical flame detector and the casing light sensation
Through hole corresponds to, and the cover board is set on the housing.
8. electronic device according to claim 7, which is characterized in that the cover board is formed with the surface that the casing is combined
Have and only transmit the infrared through ink of infrared light, the infrared ink that penetrates blocks the infrared through hole of the casing and the casing knot
It is at least one in structure light through hole.
9. electronic device according to claim 6, which is characterized in that the electronic device further include proximity sensor and into
As module, the imaging modules include microscope base, the lens barrel on the microscope base and the image biography being housed in the microscope base
Sensor, the microscope base include the mounting surface between the lens barrel and described image sensor, and the proximity sensor is set
In the mounting surface.
10. electronic device according to claim 6, which is characterized in that the electronic device further includes imaging modules and connects
Nearly sensor, on the housing, the imaging modules include camera case and camera lens module, described for the imaging modules installation
The top surface of camera case is for cascaded surface and including connected the first sub- top surface and the second sub- top surface, and the second sub- top surface is with respect to institute
It states the first sub- top surface inclination and forms notch with the described first sub- top surface, the top surface offers light extraction through hole, the camera lens mould
Group is housed in the camera case and corresponding with the light extraction through hole, and the proximity sensor is arranged on the described first sub- top surface
Place.
11. electronic device according to claim 6, which is characterized in that the electronic device further includes imaging modules and connects
Nearly sensor, the imaging modules include camera case and two camera lens modules, offer and cut on the top surface of the camera case
Mouthful to form step-like top surface, the top surface includes the first tread and the second tread less than first tread, and described the
It is opened up on one tread there are two light extraction through hole, each light extraction through hole is corresponding with the camera lens module, the proximity sensor
It is arranged at second tread.
12. electronic device according to claim 6, which is characterized in that the electronic device further include proximity sensor and
Imaging modules, the imaging modules are mounted in the casing, and the imaging modules include microscope base, on the microscope base
Lens barrel and part are arranged on the substrate in the microscope base, and the proximity sensor is set on the substrate.
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| CN110493400A (en) * | 2019-08-28 | 2019-11-22 | Oppo广东移动通信有限公司 | Projective module group and terminal |
| WO2022000575A1 (en) * | 2020-07-01 | 2022-01-06 | 东莞市美光达光学科技有限公司 | Infrared emission module for wide-angle time of fly optical ranging and module thereof |
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| CN108074947B (en) | 2020-12-22 |
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