CN108074947B

CN108074947B - Input/output module and electronic device

Info

Publication number: CN108074947B
Application number: CN201711435723.4A
Authority: CN
Inventors: 吴安平
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-12-26
Filing date: 2017-12-26
Publication date: 2020-12-22
Anticipated expiration: 2037-12-26
Also published as: CN108074947A

Abstract

The invention discloses an electronic device and an input/output module, which comprise a packaging shell, an infrared lamp, a light guide element, a structured light projector and a light sensor, wherein the packaging shell comprises a packaging substrate, the infrared lamp, the light guide element, the structured light projector and the light sensor are all packaged in the packaging shell, the infrared lamp, the structured light projector and the light sensor are all borne on the packaging substrate, the light guide element can be movably arranged on a light emitting light path of the infrared lamp, and when the light guide element is positioned on the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a first view angle to serve as the infrared light supplement lamp or approach the infrared lamp; when the light guide element leaves the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second viewing angle to be used as a near infrared lamp or an infrared light supplement lamp; the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light. The input and output module has high integration level and small volume.

Description

Input/output module and electronic device

Technical Field

The present invention relates to the field of consumer electronics technologies, and in particular, to an input/output module and an electronic device.

Background

Along with the functions supported by the mobile phone are more and more abundant and various, the types and the number of functional devices required to be set by the mobile phone are more and more, in order to realize the functions of distance detection, ambient light detection, facial 3D feature recognition of a user and the like, functional devices such as a proximity sensor, an ambient light sensor, an infrared camera, a structured light projector and the like need to be configured in the electronic equipment, and in order to arrange numerous functional devices, the mobile phone occupies too much space.

Disclosure of Invention

The embodiment of the invention provides an input/output module and an electronic device.

The input and output module comprises a packaging shell, an infrared lamp, a light guide element, a structured light projector and a light sensor, wherein the packaging shell comprises a packaging substrate, the infrared lamp, the light guide element, the structured light projector and the light sensor are all packaged in the packaging shell, the infrared lamp and the structured light projector are borne on the packaging substrate, the light guide element can be movably arranged on a light emitting light path of the infrared lamp, and when the light guide element is positioned on the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a first view angle to serve as an infrared light supplement lamp or an approximate infrared lamp; when the light guide element leaves the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second field angle to serve as a near infrared lamp or an infrared light supplement lamp; the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light.

In some embodiments, the light guide element comprises a convex lens or a lens group having positive optical power, and infrared light rays emitted by the infrared lamp exit the package housing as a proximity infrared lamp at a first angle of view when the light guide element is positioned on a light emitting optical path of the infrared lamp; when the light guide element leaves the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second field angle to serve as an infrared light supplement lamp; or

The light guide element comprises a concave lens or a lens group with negative focal power, and when the light guide element is positioned on a light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a first field angle to serve as an infrared light supplement lamp; when the light guide element leaves the light emitting optical path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second angle of view to serve as a proximity infrared lamp.

In some embodiments, the input-output module further comprises a chip on which the infrared lamp, the structured light projector, and the light sensor are formed.

In some embodiments, the package housing further includes a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, the package top is formed with an infrared window, a structural light window and a light sensing window, the infrared window corresponds to the infrared lamp, the structural light window corresponds to the structural light projector, and the light sensing window corresponds to the light sensor.

In some embodiments, the input/output module further includes a plurality of metal shielding plates, each of the plurality of metal shielding plates is located in the package housing, and the plurality of metal shielding plates are respectively disposed between any two of the infrared lamp, the structured light projector, and the light sensor.

An electronic device according to an embodiment of the present invention includes:

a housing; and

the input/output module of any one of the above embodiments, wherein the input/output module is disposed in the housing.

In some embodiments, the electronic device further includes a transparent cover plate, the housing has a housing infrared through hole, a housing structure light through hole, and a housing light sensing through hole, the infrared lamp corresponds to the housing infrared through hole, the structure light projector corresponds to the housing structure light through hole, the light sensor corresponds to the housing light sensing through hole, and the cover plate is disposed on the housing.

In some embodiments, the surface of the cover plate combined with the chassis is formed with an infrared transparent ink which only transmits infrared light, and the infrared transparent ink shields at least one of the chassis infrared through hole and the chassis structure light through hole.

In some embodiments, the electronic device further includes a proximity sensor and an imaging module, the imaging module includes a lens base, a lens barrel mounted on the lens base, and an image sensor housed in the lens base, the lens base includes a mounting surface located between the lens barrel and the image sensor, and the proximity sensor is disposed on the mounting surface.

In some embodiments, the electronic device further includes an imaging module and a proximity sensor, the imaging module is installed on the housing, the imaging module includes a camera housing and a lens module, the top surface of the camera housing is a step surface and includes a first sub-top surface and a second sub-top surface which are connected, the second sub-top surface is opposite to the first sub-top surface and inclines to form a notch with the first sub-top surface, the top surface has been provided with a light-emitting through hole, the lens module is accommodated in the camera housing and corresponds to the light-emitting through hole, and the proximity sensor is disposed at the first sub-top surface.

In some embodiments, the electronic device further includes an imaging module and a proximity sensor, the imaging module includes a camera housing and two lens modules, a notch is formed on a top surface of the camera housing to form a stepped top surface, the top surface includes a first step surface and a second step surface lower than the first step surface, two light-emitting through holes are formed on the first step surface, each light-emitting through hole corresponds to the lens module, and the proximity sensor is disposed at the second step surface.

In some embodiments, the electronic device further includes a proximity sensor and an imaging module, the imaging module is mounted in the housing, the imaging module includes a lens holder, a lens barrel mounted on the lens holder, and a substrate partially disposed in the lens holder, and the proximity sensor is disposed on the substrate.

In the electronic device of the embodiment of the invention, the infrared lamp can be used as a proximity infrared lamp or an infrared light supplement lamp by moving the position of the light guide element, and the input and output module integrates the functions of transmitting infrared light for infrared distance measurement, infrared light supplement, three-dimensional imaging and visible light intensity detection by combining the structured light projector and the light sensor, so that the input and output module has higher integration level and smaller volume, and saves space for realizing the functions of infrared distance measurement, infrared light supplement, three-dimensional imaging and visible light intensity detection. In addition, because the structured light projector, the light sensor and the infrared lamp are borne on one packaging substrate, compared with the traditional process that the structured light projector, the light sensor, the proximity infrared lamp and the infrared light supplement lamp need to be manufactured by different wafers respectively and then packaged on a PCB substrate, the packaging efficiency is improved.

Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

fig. 2 is a schematic perspective view of an input/output module of an electronic device according to an embodiment of the invention;

FIG. 3 is a schematic diagram illustrating an input/output module of an electronic device according to an embodiment of the invention;

FIG. 4 is a schematic diagram illustrating an input/output module of an electronic device according to an embodiment of the invention;

fig. 5 and 6 are schematic cross-sectional views of an input/output module of an electronic device according to an embodiment of the invention;

FIG. 7 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the invention;

fig. 8 is a schematic perspective view of a proximity sensor and an imaging module of an electronic device according to an embodiment of the invention;

fig. 9 is a schematic arrangement of electronic components of an electronic device according to an embodiment of the invention;

FIG. 10 is a schematic cross-sectional view illustrating an input/output module of an electronic device according to an embodiment of the invention;

FIG. 11 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

fig. 12 to 14 are schematic partial cross-sectional views of electronic devices according to embodiments of the invention; and

fig. 15 to 22 are schematic perspective views of a proximity sensor and an imaging module of an electronic device according to an embodiment of the invention.

Detailed Description

The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, an electronic device 100 according to an embodiment of the invention includes a housing 20, a cover 30, and electronic components. The electronic components include an input/output module 10, a proximity sensor 50 (see fig. 8), an imaging module 60 (see fig. 8), and a receiver 70. The electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, an intelligent watch, an intelligent bracelet, a teller machine, and the like, and the embodiment of the invention is described by taking the electronic device 100 as a mobile phone, it is understood that the specific form of the electronic device 100 may be other, and is not limited herein.

Referring to fig. 2 and 5, the input/output module 10 is a single package structure, and includes a package housing 11, an infrared lamp 12, a light guide element 13, a structured light projector 14, and a light sensor 1 b.

The package housing 11 is used for simultaneously packaging the infrared lamp 12, the light guide element 13, the structured light projector 14 and the optical sensor 1b, or the infrared lamp 12, the light guide element 13, the structured light projector 14 and the optical sensor 1b are simultaneously packaged in the package housing 11. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an Electromagnetic Interference (EMI) shielding material to prevent external EMI from affecting the input/output module 10. In the present embodiment, the center of the structured light projector 14, the center of the infrared lamp 12, and the center of the photosensor 1b are located on the same line segment, for example: a structured light projector 14, an infrared lamp 12 and a light sensor 1b are sequentially arranged from one end to the other end of the line segment; or, the infrared lamp 12, the structured light projector 14 and the light sensor 1b are arranged along one end to the other end of the line segment in sequence; alternatively, the infrared lamp 12, the light sensor 1b and the structured light projector 14 are arranged along one end of the line segment to the other end in sequence. In other embodiments, the line between the centers of the structured light projector 14, the infrared lamp 12 and the light sensor 1b is triangular.

The package substrate 111 is used to carry the infrared lamp 12, the structured light projector 14, and the optical sensor 1 b. In manufacturing the input/output module 10, the infrared lamp 12, the structured light projector 14, and the photo sensor 1b may be formed on the chip 15, and the infrared lamp 12, the structured light projector 14, the photo sensor 1b, and the chip 15 may be provided on the package substrate 111 together, specifically, the chip 15 may be bonded to the package substrate 111. Meanwhile, the package substrate 111 may also be used to connect with other components of the electronic device 100 (e.g., the housing 20 and the motherboard of the electronic device 100) to fix the input/output module 10 in the electronic device 100.

The package sidewall 112 may be disposed around the infrared lamp 12, the light guide element 13, the structured light projector 14 and the optical sensor 1b, the package sidewall 112 extends from the package substrate 111, the package sidewall 112 may be combined with the package substrate 111, and preferably, the package sidewall 112 and the package substrate 111 are detachably connected, so that the infrared lamp 12, the light guide element 13, the structured light projector 14 and the optical sensor 1b can be conveniently inspected after the package sidewall 112 is removed. The package side walls 112 may be made of an infrared opaque material to prevent infrared light emitted by the infrared lamp 12 or the structured light projector 14 from passing through the package side walls 112.

The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. An infrared light window 1131, a structural light window 1132 and a light sensing window 1133 are formed on the top 113 of the package, the infrared light window 1131 corresponds to the infrared lamp 12, and infrared light emitted by the infrared lamp 12 penetrates out of the infrared light window 1131; the structured light window 1132 corresponds to the structured light projector 14, and structured light (infrared light) emitted by the structured light projector 14 passes out of the structured light window 1132; the light sensing window 1133 corresponds to the light sensor 1b, and visible light can pass through the light sensing window 1133 and be incident on the light sensor 1 b. The package top 113 and the package side wall 112 may be formed integrally or separately. In one example, the infrared light window 1131, the structured light window 1132 and the light-sensing window 1133 are all through holes, and the package top 113 is made of a material opaque to infrared light and visible light. In another example, the package top 113 is made of a material that is opaque to infrared light, a material that is transparent to infrared light, a material that is opaque to visible light, and a material that is transparent to visible light, specifically, the infrared light window 1131 and the structured light window 1132 are made of a material that is transparent to infrared light, the light sensing window 1133 is made of a material that is transparent to visible light, and the rest is made of a material that is opaque to infrared light and is opaque to visible light, further, the infrared light window 1131, the structured light window 1132, and the light sensing window 1133 may be formed with a lens structure to improve the infrared light emission angle from the infrared light window 1131 and the structured light window 1132, for example, the structured light window 1132 is formed with a concave lens structure to diffuse the light passing through the structured light window 1132 to the outside; the infrared window 1131 is formed with a convex lens structure, so that light passing through the infrared window 1131 is gathered and emitted outwards; the light sensing window 1133 may also be formed with a lens structure to improve the visible light emitting angle incident from the light sensing window 1133, for example, the light sensing window 1133 is formed with a convex lens structure 1c (as shown in fig. 5) to gather and project the light incident from the light sensing window 1133 onto the light sensor 1 b.

The light guide member 13 is movably disposed on the light emission optical path of the infrared lamp 12. Referring to fig. 5 and 6, the input/output module 10 further includes a driving member 17, and the driving member 17 is used for driving the light guide element 13 to move so as to be movably disposed on the light emitting path of the infrared lamp 12. Wherein, the driving member 17 drives the light guide element 13 to move so as to be movably arranged on the light emitting optical path of the infrared lamp 12 comprises: in a normal state, the light guide element 13 is arranged on a light emitting optical path of the infrared lamp 12, the infrared lamp 12 is used as an infrared fill lamp (or a near infrared lamp), and when the infrared lamp 12 is used as a near infrared lamp (or an infrared fill lamp), the driving element 17 drives the light guide element 13 to move to leave the light emitting optical path of the infrared lamp 12; or in a normal state, the light guide element 13 is not disposed on the light emitting optical path of the infrared lamp 12, the infrared lamp 12 is used as a proximity infrared lamp (or an infrared fill-in lamp), and when the infrared lamp 12 is used as the infrared fill-in lamp (or a proximity infrared lamp), the driving member 17 drives the light guide element 13 to move to the light emitting optical path of the infrared lamp 12.

Referring to fig. 5, the driving member 17 includes a linear motor, the linear motor includes a stator 172 and a mover 174, the stator 172 is mounted on the package sidewall 112, the mover 174 is connected to the light guiding element 13, and the driving member 17 drives the mover 174 to move so as to drive the light guiding element 13 to move. Referring to fig. 6, the structure of the driving member 17 can be replaced by: the driving member 17 includes a linear motor, the linear motor includes a stator 172 and a mover 174, the stator 172 is installed on the package sidewall 112, the input/output module 10 further includes a rotating shaft 18 and a connecting arm 19, the first end of the connecting arm 19 is connected to the light guiding element 13, the mover 174 is connected to the second end of the connecting arm 19, which is away from the light guiding element 13, the connecting arm 19 is sleeved on the rotating shaft 18, the rotating shaft 18 is located between the light guiding element 13 and the mover 174, the mover 174 of the linear motor drives the second end of the connecting arm 19 to move, and the connecting arm 19 rotates around the rotating shaft 18, so that the first end of the connecting arm 19 drives the light guiding element 13 to rotate around the rotating shaft 18, so as to enable the light guiding element 13 to be. In an embodiment of the present invention, the input/output module 10 may further include a carrier plate (not shown) having a carrier hole, the light guide element 13 is installed in the carrier hole, and the driving element 17 is used for driving the carrier plate to move so as to drive the light guide element 13 to move.

Referring to fig. 3, when the light guide element 13 is located on the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 passes through the light guide element 13, and exits from the package housing 11 as a proximity infrared lamp at a first viewing angle under the action of the light guide element 13; when the light guide element 13 leaves the light emission optical path of the infrared lamp 12, the infrared light emitted from the infrared lamp 12 exits the package housing 11 as an infrared fill-in lamp at a second angle of view, and at this time, the first angle of view is smaller than the second angle of view, where the first angle of view is in a range of 10 degrees to 30 degrees, for example, 10 degrees, 15 degrees, 20 degrees, 25 degrees, or 30 degrees, and the second angle of view is in a range of 60 degrees to 90 degrees, for example, 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees. The light guide element 13 is used for converging light, and the light guide element 13 includes a convex lens or a lens group with positive focal power, and the lens group can be one or more lenses. In the embodiment of the present invention, the angle of field refers to a range covered by the infrared light exiting from package case 11 through infrared light window 1131.

Referring to fig. 4, when the light guide element 13 is located on the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 passes through the light guide element 13, and exits from the package housing 11 at a first field angle under the action of the light guide element 13 to serve as an infrared fill-in light; when the light guide member 13 is separated from the light emission optical path of the infrared lamp 12, the infrared light emitted from the infrared lamp 12 is emitted from the package housing 11 as a proximity infrared lamp at a second angle of view, and at this time, the first angle of view is larger than the second angle of view, where the first angle of view is in a range of 60 degrees to 90 degrees, for example, 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees, and the second angle of view is in a range of 10 degrees to 30 degrees, for example, the second angle of view is 10 degrees, 15 degrees, 20 degrees, 25 degrees, or 30 degrees, and the like. The light guide element 13 is used for diverging light, and the light guide element 13 includes a concave lens or a lens group with negative power, and the lens group can be one or more lenses. In the embodiment of the present invention, the angle of field refers to a range covered by the infrared light exiting from package case 11 through infrared light window 1131.

When the infrared lamp 12 is turned on and used as an infrared fill-in lamp to emit infrared light to the outside of the package housing 11, the infrared light passes through the infrared light window 1131 to be projected onto the surface of the object, and the infrared camera 62 (shown in fig. 1) of the electronic device 100 receives the infrared light reflected by the object to obtain image information of the object (at this time, the infrared lamp 12 is used for infrared fill-in). When the infrared lamp 12 is turned on and used as a proximity infrared lamp to emit infrared light to the outside of the package housing 11, infrared light passes through the infrared light window 1131 and reaches the surface of the object, and the proximity sensor 50 (shown in fig. 8) of the electronic device 100 receives the infrared light reflected by the object to detect the distance from the object to the electronic device 100 (at this time, the infrared lamp 12 is used for infrared ranging).

The infrared lamp 12 can emit infrared light to the outside of the package case 11 at different powers when used as an infrared fill light and when used as a near infrared lamp. Specifically, the infrared lamp 12 emits infrared light to the outside of the package housing 11 at a first power when serving as a proximity infrared lamp, and the infrared lamp 12 emits infrared light to the outside of the package housing 11 at a second power when serving as an infrared fill light, where the first power may be smaller than the second power.

Referring to fig. 5 and 6, the structured light projector 14 and the infrared lamp 12 can be formed on a chip 15, so as to further reduce the volume of the integrated structured light projector 14 and the infrared lamp 12, and the manufacturing process is simple. The structured light projector 14 may emit structured light outwards, the structured light may form an infrared laser speckle pattern, the structured light is projected onto the surface of the target object, the infrared camera 62 (as shown in fig. 1) collects the structured light pattern modulated by the target object, and the depth image of the target object is obtained by analyzing and calculating the modulated structured light pattern (at this time, the structured light projector 14 is used for stereo imaging). In an embodiment of the present invention, the structured light projector 14 includes a light source 141, a frame 142, a lens 143, and a Diffractive Optical Elements (DOE) 144. The light beam emitted from the light source 141 is collimated or converged by the lens 143, expanded by the diffractive optical element 144, and emitted outward in a certain light beam pattern. In particular, the light source 141 can be formed on the chip 15, and the lens 143 and the diffractive optical element 144 can be secured to the frame 1422, for example, by gluing to the frame 142.

Referring to fig. 5 and 6, the structured light projector 14, the infrared lamp 12 and the optical sensor 1b can be formed on a chip 15, so as to further reduce the volume of the integrated structured light projector 14, the infrared lamp 12 and the optical sensor 1b, and the manufacturing process is simple. The light sensor 1b is used for receiving the visible light in the environment incident from the light sensing window 1133 and detecting the intensity of the visible light, so as to be used as a basis for controlling the display brightness of the display screen 90.

Referring to fig. 1 and 7, the housing 20 may serve as a mounting carrier for the input/output module 10, or the input/output module 10 may be disposed in the housing 20. The housing 20 may be a housing of the electronic device 100, in the embodiment of the present invention, the housing 20 may further be used to set the display screen 90 of the electronic device 100, and since the volume occupied by the input/output module 10 according to the embodiment of the present invention is smaller, the volume occupied by the housing 20 to set the display screen 90 may be correspondingly increased, so as to increase the screen occupation ratio of the electronic device 100. Specifically, the housing 20 includes a top 21 and a bottom 22, the display 90 and the input/output module 10 are disposed between the top 21 and the bottom 22, and the top 21 is located above the bottom 22 in a state that the user normally uses the electronic device 100, as shown in fig. 1, the input/output module 10 may be disposed between the display 90 and the top 21. In other embodiments, the display 90 may be a full screen with a gap, the display 90 surrounds the input/output module 10, and the input/output module 10 is exposed from the gap of the display 90.

The casing 20 is further provided with a casing infrared through hole 23, a casing structure light through hole 24 and a casing light sensing through hole 25. When the input/output module 10 is disposed in the housing 20, the infrared lamp 12 corresponds to the housing infrared through hole 23, the structured light projector 14 corresponds to the housing structured light through hole 24, and the light sensor 1b corresponds to the housing light sensor through hole 25. The correspondence between the infrared lamp 12 and the casing infrared through hole 23 means that light emitted by the infrared lamp 12 can pass through the casing infrared through hole 23, specifically, the infrared lamp 12 is opposite to the casing infrared through hole 23, or the light emitted by the infrared lamp 12 passes through the casing infrared through hole 23 after being acted by the light guide device. The structured light projector 14 corresponds to the housing structured light aperture 24 for the same reason, and will not be described herein. The light sensor 1b and the case light sensing through hole 25 correspond to each other, and the visible light can pass through the case light sensing through hole 25 and be incident on the light sensor 1b, specifically, the light sensor 1b is opposite to the case light sensing through hole 25, or the incident visible light passes through the case light sensing through hole 25 and is incident on the light sensor 1b after being acted by the light guide element. In the embodiment shown in fig. 7, the chassis infrared via 23, the chassis structure light via 24, and the chassis light via 25 may be spaced apart from each other. Of course, in other embodiments, any two of the chassis infrared via 23, the chassis structure light via 24, and the chassis light via 25 may be interconnected; alternatively, the chassis infrared via 23, the chassis structured light via 24, and the chassis light via 25 may be interconnected.

The cover plate 30 may be light-transmissive, and the material of the cover plate 30 may be light-transmissive glass, resin, plastic, or the like. The cover plate 30 is disposed on the chassis 20, the cover plate 30 includes an inner surface 32 combined with the chassis 20, and an outer surface 31 opposite to the inner surface 32, and the light emitted by the input/output module 10 sequentially passes through the inner surface 32 and the outer surface 31 and then passes through the cover plate 30. In the embodiment shown in fig. 7, the cover plate 30 covers the chassis infrared through hole 23, the chassis structure light through hole 24 and the chassis light sensing through hole 25, the inner surface 32 of the cover plate 30 is coated with the infrared transmissive ink 40, and the infrared transmissive ink 40 has a high transmittance to infrared light, for example, 85% or more, and a high attenuation to visible light, for example, 70% or more, so that it is difficult for a user to see an area of the electronic device 100 covered by the infrared transmissive ink 40 with naked eyes in normal use. Specifically, infrared-transmissive ink 40 may cover areas of inner surface 32 that do not correspond to display 90 and light sensor 1 b.

The infrared transparent ink 40 can further shield at least one of the chassis infrared through hole 23 and the chassis structure light through hole 24, that is, the infrared transparent ink 40 can simultaneously shield the chassis infrared through hole 23 and the chassis structure light through hole 24 (as shown in fig. 7), so that a user can hardly see the internal structure of the electronic device 100 through the chassis infrared through hole 23 and the chassis structure light through hole 24, and the electronic device 100 has a beautiful appearance; the infrared transmitting ink 40 can also cover the chassis infrared through hole 23 and not cover the chassis structure light through hole 24; alternatively, the IR pass-through ink 40 may cover the chassis structure light pass-through holes 24 and uncover the chassis IR pass-through holes 23.

Referring to fig. 8, the proximity sensor 50 is a single package structure. The proximity sensor 50 receives infrared light reflected by an external object to determine a distance between the external object and the electronic device 100.

Referring to fig. 1 and 8, the imaging module 60 may be one or both of a visible light camera 61 and an infrared camera 62. The imaging module 60 includes a lens mount 63, a lens barrel 64, and an image sensor 65. The lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63. The mirror base 63 includes a mounting surface 631, and the mounting surface 631 is located between the lens barrel 64 and the image sensor 65. In the embodiment shown in fig. 8, the proximity sensor 50 is disposed on the mounting surface 631, and specifically, the orthogonal projection of the proximity sensor 50 on the plane of the mounting surface 631 at least partially falls onto the mounting surface 631, so that the proximity sensor 50 and the imaging module 60 are disposed compactly, and the lateral space occupied by the two together is small.

Referring to fig. 1, the receiver 70 is used for sending out an acoustic signal when being excited by a power supply, and a user can talk through the receiver 70.

In the embodiment shown in fig. 1, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, and the centers of the input and output module 10, the infrared light camera 62, the visible light camera 61 and the receiver 70 are located on the same line segment. Specifically, the input/output module 10, the visible light camera 61, the receiver 70, and the infrared camera 62 (as shown in fig. 9) are sequentially arranged from one end to the other end of the line segment; or the input/output module 10, the receiver 70, the visible light camera 61, and the infrared camera 62 (as shown in fig. 1) are sequentially arranged from one end to the other end of the line segment, and at this time, the visible light camera 61 and the infrared camera 62 may form a dual-camera (as shown in fig. 19); or the infrared camera 62, the input/output module 10, the receiver 70 and the visible light camera 61 are arranged in sequence from one end to the other end of the line segment. Of course, the arrangement of the input/output module 10, the infrared camera 62, the receiver 70, and the visible light camera 61 is not limited to the above example, and may be other shapes such as a shape in which the centers of the respective electronic components are arranged in a circular arc shape and a shape in which the centers are arranged in a rectangular shape.

Further, referring to fig. 8, the proximity sensor 50 may be disposed on the mounting surface 631 of the infrared camera 62, or may be disposed on the mounting surface 631 of the visible light camera 61, and of course, the proximity sensor 50 may not be disposed on the mounting surface 631, and for example, the proximity sensor 50 may be disposed adjacent to the input/output module 10, or adjacent to the receiver 70, which is not limited herein.

In summary, in the electronic device 100 according to the embodiment of the invention, the infrared lamp 12 can be used as a proximity infrared lamp or an infrared supplementary light lamp by moving the position of the light guiding element 13, and the input/output module 10 integrates functions of emitting infrared light for infrared distance measurement, infrared supplementary light, stereo imaging and visible light intensity detection in combination with the structured light projector 14 and the light sensor 1b, so that the input/output module 10 has a higher integration level and a smaller volume, and the input/output module 10 saves space for realizing the functions of infrared distance measurement, infrared supplementary light, stereo imaging and visible light intensity detection. In addition, since the structured light projector 14, the light sensor 1b and the infrared lamp 12 are supported on one package substrate 111, compared with the conventional art in which the structured light projector, the light sensor, the proximity infrared lamp and the infrared light supplement lamp are manufactured by using different wafers and then packaged on a PCB substrate, the packaging efficiency is improved.

Referring to fig. 5, in some embodiments, the input/output module 10 further includes a plurality of metal shielding plates 16, the plurality of metal shielding plates 16 are all located in the package housing 11, and the plurality of metal shielding plates 16 are respectively disposed between any two of the infrared lamp 12, the structured light projector 14, and the optical sensor 1 b. When the centers of the infrared lamp 12, the structured light projector 14 and the light sensor 1b are located on the same line segment, the number of the metal shielding plates 16 is two; if the infrared lamp 12, the structured light projector 14 and the light sensor 1b are arranged from one end to the other end of the line segment in sequence, the two metal shielding plates 16 are respectively positioned between the structured infrared lamp 12 and the structured light projector 14 and between the structured light projector 14 and the light sensor 1 b; if the infrared lamp 12, the light sensor 1b and the structured light projector 14 are arranged from one end to the other end of the line segment in sequence, the two metal shielding plates 18 are respectively positioned between the infrared lamp 12 and the light sensor 1b and between the light sensor 1b and the structured light projector 14; if the structural light projector 14, the infrared lamp 12 and the light sensor 1b are sequentially arranged from one end to the other end of the line segment, the two metal shielding plates 18 are respectively positioned between the structural light projector 14 and the infrared lamp 12 and between the infrared lamp 12 and the light sensor 1 b. The metal shielding plate 16 is located between the structured light projector 14 and the infrared lamp 12, on one hand, the metal shielding plate 16 can shield electromagnetic interference between the structured light projector 14 and the infrared lamp 12, the luminous intensity and the time sequence of the structured light projector 14 and the infrared lamp 12 cannot be influenced mutually, on the other hand, the metal shielding plate 16 can be used for isolating a cavity where the structured light projector 14 is located and a cavity where the infrared lamp 12 is located, and light cannot enter the other cavity from one cavity. The metal shielding plate 16 is located between the structured light projector 14 and the optical sensor 1b, and can prevent the infrared light emitted by the structured light projector 14 from being incident on the optical sensor 1b, and can shield the electromagnetic interference between the structured light projector 14 and the optical sensor 1 b. The metal shielding plate 16 is located between the infrared lamp 12 and the light sensor 1b, and can prevent infrared light emitted by the infrared lamp 12 from being incident on the light sensor 1b, and can shield electromagnetic interference between the infrared lamp 12 and the light sensor 1 b.

Referring to fig. 10, in some embodiments, the input/output module 10 further includes an optical enclosure 1 a. The optical enclosure 1a is made of a light-transmissive material, and the optical enclosure 1a is formed on the package substrate 111 and located inside the package case 11. The optical enclosure 1a encloses the infrared lamp 12 and the optical sensor 1 b. Specifically, the optical enclosure 1a may be formed by a potting injection molding process, the optical enclosure 1a may be made of transparent thermosetting epoxy resin, so as to be not easily softened in use, the optical enclosure 1a may fix the positions of the infrared lamp 12 and the light sensor 1b, and the infrared lamp 12 and the light sensor 1b are not easily shaken in the package housing 11. At this time, the light guide element 13 is disposed outside the optical enclosure 1a and is movably housed in the package housing 11.

Referring to fig. 11, in some embodiments, the housing 20 further has a housing sound outlet (not shown), the cover 30 further has a cover sound outlet 35, and the receiver 70 corresponds to the positions of the cover sound outlet 35 and the housing sound outlet. The centers of the input/output module 10, the infrared camera 62 and the visible light camera 61 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the housing 20.

The center of the receiver 70 is not located on the line segment, so that the transverse space occupied by each electronic component (the input/output module 10, the infrared camera 62, the visible light camera 61, etc.) on the cover plate 30 is saved. In the embodiment shown in fig. 12, the cover sound outlet 35 is opened at the edge of the cover 30, and the case sound outlet is opened near the top 21.

Referring to fig. 12, in some embodiments, the cover plate 30 may further have a cover plate infrared through hole 33, the cover plate infrared through hole 33 corresponds to the case infrared through hole 23, and the infrared light emitted by the infrared lamp 12 passes through the case infrared through hole 23 and then passes through the electronic device 100 from the cover plate infrared through hole 33. In this case, the infrared transmissive ink 40 may be disposed on the cover 30 at a position corresponding to the chassis structured light passing hole 24, so that the user cannot easily see the structured light projector 14 inside the electronic device 100 through the chassis structured light passing hole 24, and the electronic device 100 has a good appearance.

Referring to fig. 13, in some embodiments, the cover plate 30 may further have a cover plate structured light through hole 34, the cover plate structured light through hole 34 corresponds to the case structured light through hole 24, and the infrared light emitted by the structured light projector 14 passes through the case structured light through hole 24 and then passes out of the electronic device 100 from the cover plate structured light through hole 34. In this case, the infrared transparent ink 40 may be disposed at a position of the cover 30 corresponding to the housing infrared through hole 23, so that the light guide element 13 and the infrared lamp 12 inside the electronic device 100 are difficult to be seen through the housing infrared through hole 23, and the electronic device 100 has a beautiful appearance.

Referring to fig. 14, in some embodiments, the cover plate 30 may further have a cover plate light sensing through hole 36, the cover plate light sensing through hole 36 corresponds to the case light sensing through hole 25 and the light sensor 1b, and visible light outside the electronic device 100 may pass through the cover plate light sensing through hole 36 and the case light sensing through hole 25 and then may be incident on the light sensor 1 b. At this time, the infrared transparent ink 40 may be disposed on the cover 30 at a position corresponding to the chassis-structured light through hole 24, so that the user is hard to see the structured-light projector 14 inside the electronic device 100 through the chassis-structured light through hole 24; the cover plate 30 may be provided with the infrared transparent ink 40 at a position corresponding to the casing infrared through hole 23, so that the user is difficult to see the light guide element 13 and the infrared lamp 12 inside the electronic device 100 through the casing infrared through hole 23, and the electronic device 100 has a beautiful appearance.

Referring to fig. 15, in some embodiments, the imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the proximity sensor 50 can be further fixed on the substrate 66. Specifically, the substrate 66 is provided with an FPC, a part of the substrate 66 is located in the mirror base 63, another part of the substrate extends out of the mirror base 63, one end of the FPC is located in the mirror base 63 and is used for bearing the image sensor 65, and the other end of the FPC can be connected with a main board of the electronic device 100. When the proximity sensor 50 is provided on the substrate 66, the proximity sensor 50 is provided outside the mirror base 63, and the proximity sensor 50 may be connected to an FPC.

The imaging module 60 may be one or two of a visible light camera 61 and an infrared light camera 62. Specifically, the proximity sensor 50 may be fixed on the substrate 66 of the visible light camera 61; the proximity sensor 50 may be fixed on a substrate 66 of the infrared camera 62.

Further, base plate 66 still includes the stiffening plate, and the stiffening plate setting is in the one side that carries on the back mutually with proximity sensor 50 to increase base plate 66's bulk strength, make FPC be difficult for taking place around rolling over, be difficult for taking place to rock when proximity sensor 50 sets up on base plate 66 simultaneously. In one example, the proximity sensor 50 may also be fixed to an outer sidewall of the mirror base 63, for example, by means of bonding.

Referring to fig. 16, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 includes an image sensor 65, a camera housing 67 and a lens module 68. The top surface 670 of the camera housing 67 is a stepped surface, the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672 and a third sub-top surface 673, the second sub-top surface 672 is connected to the first sub-top surface 671 in an inclined manner and forms a notch 675 with the first sub-top surface 671, the third sub-top surface 673 is connected to the second sub-top surface 672 in an inclined manner, and the second sub-top surface 672 is located between the first sub-top surface 671 and the third sub-top surface 673 to connect the first sub-top surface 671 and the third sub-top surface 673. The angle between the second sub top surface 672 and the first sub top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub top surface 672 and the third sub top surface 673 may be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The third sub-top surface 673 is provided with a light-emitting through hole 674, and the lens module 68 is accommodated in the camera housing 67 and corresponds to the light-emitting through hole 674. The image sensor 65 is accommodated in the camera housing 67 and corresponds to the lens module 68, light outside the electronic device 100 can pass through the light-out hole 674 and the lens module 68 and be transmitted to the image sensor 65, and the image sensor 65 converts an optical signal into an electrical signal. The proximity sensor 50 is disposed at the first sub-top surface 671. In this embodiment, the imaging module 60 may be a visible light camera 61, and the proximity sensor 50 is a single package structure. In other embodiments, the imaging module 60 may be an infrared camera 62.

The imaging module 60 of the present embodiment has a notch 675, and the proximity sensor 50 is disposed on the first sub-top surface 671, so that the proximity sensor 50 and the imaging module 60 are disposed compactly, and the horizontal space occupied by the two is small, thereby saving the installation space in the electronic device 100.

With continued reference to fig. 16, in some embodiments, the proximity sensor 50 of the above embodiments is disposed on the first sub-top surface 671 and is located outside the camera housing 67, and specifically, a projection of the entire proximity sensor 50 along a direction perpendicular to the first sub-top surface 671 may be located within the first sub-top surface 671 (as shown in fig. 16); alternatively, a portion of the proximity sensor 50 is located within the first sub-top surface 671 along a projection perpendicular to the first sub-top surface 671. That is, at least a portion of the proximity sensor 50 is located directly above the first sub-top surface 671, so that the proximity sensor 50 and the imaging module 60 are disposed compactly, and the lateral space occupied by the two is small, thereby further saving the installation space in the electronic device 100.

Referring to fig. 17, the first sub-top surface 671 of the above embodiment is provided with a light hole 676, and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. Light external to the electronic device 100 can pass through the light transmissive hole 676 and pass onto the proximity sensor 50. The proximity sensor 50 of the present embodiment is disposed in the camera housing 67, so that the structures of the proximity sensor 50 and the camera housing 67 are more stable and the proximity sensor 50 and the imaging module 60 are easily mounted on the housing 20.

Referring to fig. 18, in some embodiments, the first sub-top surface 671 of the above embodiments is formed with a light hole 676, and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the proximity sensor 50 may be fixed on the substrate 66 and housed in a camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to a main board of the electronic device 100. In other embodiments, the proximity sensor 50 may also be connected to the FPC.

The proximity sensor 50 of the present embodiment is disposed in the camera housing 67, so that the structures of the proximity sensor 50 and the camera housing 67 are more stable and the proximity sensor 50 and the imaging module 60 are conveniently mounted on the housing 20; meanwhile, the imaging module 60 sets the substrate 66 and the proximity sensor 50 on the substrate 66, so that the proximity sensor 50 can be stably installed in the camera housing 67.

Referring to fig. 19, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 is a dual-camera module, and includes two image sensors 65, a camera housing 67, and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 lower than the first step surface 677, and a first connection surface 679 a. The first connecting surface 679a is obliquely connected with the second tread 678 and forms a notch 675 with the second tread 678, the first connecting surface 679a is obliquely connected with the first tread 677, and the first connecting surface 679a is positioned between the first tread 677 and the second tread 678 to connect the first tread 677 with the second tread 678. The included angle between the first connecting surface 679a and the first tread 677 can be an obtuse angle or a right angle, and the included angle between the first connecting surface 679a and the second tread 678 can be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The two light-emitting through holes 674 are arranged on the first ladder surface 677 and are located on the same side of the cut 675, and a central connecting line of the two light-emitting through holes 674 is perpendicular to the extending direction of the cut 675. The two lens modules 68 are accommodated in the camera housing 67 and respectively correspond to the two light-emitting through holes 674, the two image sensors 65 are accommodated in the camera housing 67 and respectively correspond to the two lens modules 68, and light outside the electronic device 100 can pass through the light-emitting through holes 674 and the lens modules 68 and is transmitted to the image sensors 65. In the present embodiment, the imaging module 60 can be a visible light camera 61, and at this time, both the two lens modules 68 are lens modules corresponding to the visible light camera 61. The proximity sensor 50 is provided on the second step face 678 and is located outside the camera housing 67. The proximity sensor 50 is a single package structure. In other embodiments, the imaging module 60 may be an infrared camera 62, and both of the lens modules 68 correspond to the infrared camera 62. In another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared camera 62, and in this case, one of the lens modules 68 is a lens module corresponding to the infrared camera 62, and the other lens module 68 is a lens module corresponding to the visible light camera 61.

The imaging module 60 of the present embodiment has a notch 675, and the proximity sensor 50 is disposed on the second step surface 678, so that the proximity sensor 50 and the imaging module 60 are disposed compactly, the two occupy a smaller lateral space, and the installation space in the electronic device 100 is saved.

Referring to fig. 20, in some embodiments, the cut 675 of the above embodiments is formed in the middle of the top surface 670, the first tread 677 is divided into a first sub-tread 677a and a second sub-tread 677b by the cut 675, the first sub-tread 677a and the second sub-tread 677b are respectively located on two opposite sides of the cut 675, two light-exiting through holes 674 are respectively formed in the first sub-tread 677a and the second sub-tread 677b, and the lens modules 68 mounted in the camera housing 67 are also located on two opposite sides of the cut 675. At this time, the cutout 675 is defined by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b, the first connecting surface 679a connects the first sub top surface 677a and the second step surface 678 obliquely and is located between the first sub top surface 677a and the second step surface 678, and the second connecting surface 679b connects the second sub top surface 677b and the second step surface 678 obliquely and is located between the second sub top surface 677b and the second step surface 678. In this embodiment, the first terraced surface 677 is parallel to the second terraced surface 678, an included angle between the first connection surface 679a and the first sub terraced surface 677a is an obtuse angle, and an included angle between the second connection surface 679b and the second sub terraced surface 677b is an obtuse angle. In other embodiments, the first connection surface 679a and the first sub-step surface 677a form a right angle, and the second connection surface 679b and the second sub-step surface 677b form a right angle. The cutout 675 of the present embodiment is opened at the middle position of the top surface 670, relative to the cutout 675 opened at the edge position of the top surface 670, so that the width of the cutout 675 can be made wider, thereby facilitating the arrangement of the proximity sensor 50 on the second tread 678.

Referring to fig. 19 and 20, in some embodiments, the proximity sensor 50 of the above embodiments is disposed on the second tread 678 and outside the camera housing 67. Specifically, when the cutout 675 is opened at the edge position of the top surface 670, the entire proximity sensor 50 projected along the direction perpendicular to the second tread 678 may be located within the second tread 678 (as shown in fig. 19); alternatively, a projection of a portion of the proximity sensor 50 along a direction perpendicular to the second tread 678 is located within the second tread 678. That is, at least a portion of the proximity sensor 50 is located directly above the second tread 678. When the cutout 675 is opened at the middle position of the top surface 670, the entire proximity sensor 50 projected in a direction perpendicular to the second step surface 678 may be located within the second step surface 678 (as shown in fig. 20). Thus, the proximity sensor 50 and the imaging module 60 are arranged compactly, and the horizontal space occupied by the proximity sensor and the imaging module is small, so that the installation space in the electronic device 100 is further saved.

Referring to fig. 21, the second step surface 678 of the above embodiment is provided with a light hole 676, and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. Light external to the electronic device 100 can pass through the light transmissive hole 676 and pass onto the proximity sensor 50. The proximity sensor 50 of the present embodiment is disposed in the camera housing 67, so that the structures of the proximity sensor 50 and the camera housing 67 are more stable and the proximity sensor 50 and the imaging module 60 are easily mounted on the housing 20.

Referring to fig. 22, in some embodiments, the second step surface 678 of the above embodiments is provided with a light hole 676, and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the proximity sensor 50 may be fixed on the substrate 66 and housed in a camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to a main board of the electronic device 100. In other embodiments, the proximity sensor 50 may also be connected to the FPC.

In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.

Claims

1. An input and output module is characterized in that the input and output module comprises a packaging shell, an infrared lamp, a light guide element, a structured light projector and a light sensor, wherein the packaging shell comprises a packaging substrate, the infrared lamp, the light guide element, the structured light projector and the light sensor are all packaged in the packaging shell, the infrared lamp, the structured light projector and the light sensor are all carried on the packaging substrate, the light guide element can be movably arranged on a light emitting light path of the infrared lamp, and when the light guide element is positioned on the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a first field angle to serve as the infrared lamp or a near infrared lamp; when the light guide element leaves the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second field angle to serve as a near infrared lamp or an infrared light supplement lamp; the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light; the structured light projector comprises a projector light source, a mirror bracket, a projector lens and a diffraction optical element, wherein light beams emitted by the projector light source are collimated or converged by the projector lens and then expanded and emitted outwards by the diffraction optical element, and the projector lens and the diffraction optical element are fixed on the mirror bracket;

the input and output module further comprises a chip, and the infrared lamp, the projector light source of the structured light projector and the light sensor are all formed on the chip;

the input and output module further comprises an optical sealing cover made of light-transmitting materials, the optical sealing cover is formed on the packaging substrate and located in the packaging shell, the infrared lamp and the light sensor are wrapped by the optical sealing cover, and the light guide element is arranged outside the optical sealing cover and movably contained in the packaging shell.

2. The input-output module according to claim 1,

the light guide element comprises a convex lens or a lens group with positive focal power, and when the light guide element is positioned on a light emitting optical path of the infrared lamp, infrared rays emitted by the infrared lamp are emitted from the packaging shell at a first visual angle to serve as a proximity infrared lamp; when the light guide element leaves the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second field angle to serve as an infrared light supplement lamp; or

3. The input-output module according to claim 1, wherein the package housing further comprises a package sidewall and a package top, the package sidewall extending from the package substrate and connected between the package top and the package substrate, the package top forming an infrared window, a structured light window and a light-sensing window, the infrared window corresponding to the infrared lamp, the structured light window corresponding to the structured light projector, and the light-sensing window corresponding to the light sensor.

4. The input-output module of claim 1, further comprising a plurality of metal shielding plates, each of the plurality of metal shielding plates being disposed within the enclosure, each of the plurality of metal shielding plates being disposed between any two of the infrared lamp, the structured light projector, and the light sensor.

5. An electronic device, comprising:

a housing; and

the input-output module of any one of claims 1-4 disposed within the housing.

6. The electronic device of claim 5, further comprising a transparent cover plate, wherein the housing defines a housing infrared through hole, a housing structure light through hole, and a housing light sensing through hole, the infrared lamp corresponds to the housing infrared through hole, the structure light projector corresponds to the housing structure light through hole, the light sensor corresponds to the housing light sensing through hole, and the cover plate is disposed on the housing.

7. The electronic device of claim 6, wherein the surface of the cover plate combined with the housing is formed with an infrared transparent ink that only transmits infrared light, and the infrared transparent ink blocks at least one of the housing infrared through hole and the housing structure light through hole.

8. The electronic device according to claim 5, further comprising a proximity sensor and an imaging module, wherein the imaging module comprises a lens base, a lens barrel mounted on the lens base, and an image sensor accommodated in the lens base, the lens base comprises a mounting surface between the lens barrel and the image sensor, and the proximity sensor is disposed on the mounting surface.

9. The electronic device according to claim 5, further comprising an imaging module and a proximity sensor, wherein the imaging module is mounted on the housing, the imaging module comprises a camera housing and a lens module, a top surface of the camera housing is a step surface and comprises a first sub-top surface and a second sub-top surface connected to each other, the second sub-top surface is inclined with respect to the first sub-top surface and forms a notch with the first sub-top surface, the top surface has a light exit hole, the lens module is accommodated in the camera housing and corresponds to the light exit hole, and the proximity sensor is disposed at the first sub-top surface.

10. The electronic device according to claim 5, further comprising an imaging module and a proximity sensor, wherein the imaging module comprises a camera housing and two lens modules, a top surface of the camera housing is cut to form a stepped top surface, the top surface comprises a first step surface and a second step surface lower than the first step surface, the first step surface is provided with two light-emitting through holes, each light-emitting through hole corresponds to one lens module, and the proximity sensor is disposed at the second step surface.

11. The electronic device of claim 5, further comprising a proximity sensor and an imaging module, wherein the imaging module is mounted in the housing, the imaging module comprises a lens holder, a lens barrel mounted on the lens holder, and a substrate partially disposed in the lens holder, and the proximity sensor is disposed on the substrate.