CN108183984B

CN108183984B - Input/output module and electronic device

Info

Publication number: CN108183984B
Application number: CN201711433092.2A
Authority: CN
Inventors: 吴安平
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-12-26
Filing date: 2017-12-26
Publication date: 2020-12-29
Anticipated expiration: 2037-12-26
Also published as: CN108183984A

Abstract

The invention discloses an electronic device and an input/output module, which comprise a packaging shell, a first infrared light source, a second infrared light source and a light sensor, wherein the second infrared light source and the light sensor are arranged around the first infrared light source; when the first infrared light source and the second infrared light source are both started and emit infrared light to the outside of the packaging shell at a second power, the input and output module is used for infrared supplementary lighting; the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light. First infrared light source, second infrared light source and light sense ware are integrated to be a single packaging body structure, and the integrated level of input/output module is high, has practiced thrift the space of realizing the function that infrared light filling, infrared range finding and the intensity of visible light detected.

Description

Input/output module and electronic device

Technical Field

The present invention relates to the field of consumer electronics technologies, and in particular, to an input/output module and an electronic device.

Background

Along with the functions supported by the mobile phone are more and more abundant and various, the types and the number of functional devices required to be set by the mobile phone are more and more, in order to realize the functions of distance detection, ambient light detection, facial 3D feature recognition of a user and the like, functional devices such as a proximity sensor, an ambient light sensor, an infrared camera, a structured light projector and the like need to be configured in the electronic equipment, and in order to arrange numerous functional devices, the mobile phone occupies too much space.

Disclosure of Invention

The embodiment of the invention provides an input/output module and an electronic device.

The input/output module comprises a packaging shell, a first infrared light source, a second infrared light source and a light sensor, wherein the second infrared light source and the light sensor are arranged around the first infrared light source; when the first infrared light source and the second infrared light source are both started and emit infrared light to the outside of the packaging shell at a second power, the input and output module is used for infrared supplementary lighting; the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light.

In some embodiments, the first infrared light source is a point light source, and the second infrared light source is a point light source and is in plurality; or

The first infrared light source is a point light source, and the second infrared light source is an annular light source; or

The first infrared light source is a plurality of point light sources which surround into a ring, and the second infrared light source is a ring light source; or

The first infrared light sources are a plurality of point light sources which surround into a ring, and the second infrared light sources are a plurality of point light sources; or

The first infrared light source is an annular light source; the second infrared light sources are point light sources and are multiple in number; or

The first infrared light source is an annular light source; the second infrared light source is an annular light source.

In some embodiments, the input-output module further includes a chip, and the first infrared light source, the second infrared light source, and the light sensor are formed on one chip.

In some embodiments, the package housing further includes a package sidewall extending from the package substrate and connected between the package top and the package substrate, and a package top formed with a light emitting window and a light sensing window, the light emitting window corresponding to the first infrared light source and the second infrared light source, and the light sensing window corresponding to the light sensor.

In some embodiments, the input-output module further comprises a light source lens disposed within the package housing and corresponding to the first infrared light source and the second infrared light source; and/or

The input and output module further comprises a light-sensitive lens, and the light-sensitive lens is arranged in the packaging shell and corresponds to the light sensor.

In some embodiments, the input/output module further includes a light source lens and a light sensor lens disposed in the package housing, the light source lens corresponds to the first infrared light source and the second infrared light source, the light sensor lens corresponds to the light sensor, and the light source lens and the light sensor lens are disposed on the same transparent substrate.

In some embodiments, the input/output module further includes a metal shielding plate located inside the package housing and between the second infrared light source and the light sensor.

In some embodiments, the input-output module further includes an optical enclosure made of a light-transmissive material, the optical enclosure being formed on the package substrate and located within the package housing, the optical enclosure enclosing the first infrared light source, the second infrared light source, and the light sensor.

In some embodiments, the input-output module further comprises a light-emitting spacer formed within the optical enclosure and located between the second infrared light source and the light sensor.

In some embodiments, a ground pin, a fill light pin, a proximity light pin, and a light sensing pin are formed on the input/output module, and when the ground pin and the proximity light pin are enabled, the first infrared light source emits infrared light; when the grounding pin and the light supplement lamp pin are enabled, the first infrared light source and the second infrared light source emit infrared light; when the grounding pin and the light sensing pin are enabled, the light sensor detects the intensity of visible light.

The electronic device according to an embodiment of the present invention includes a housing and the input/output module according to any one of the above embodiments, where the input/output module is disposed in the housing.

In some embodiments, the electronic device further includes a transparent cover plate, the housing is provided with a housing light source through hole and a housing light sensation through hole, the first infrared light source and the second infrared light source correspond to the housing light source through hole, the light sensor corresponds to the housing light sensation through hole, and the cover plate is disposed on the housing.

In some embodiments, the electronic device further includes a transparent cover plate, the housing is provided with a housing light source through hole and a housing light sensation through hole, the first infrared light source and the second infrared light source correspond to the housing light source through hole, the light sensor corresponds to the housing light sensation through hole, the cover plate is disposed on the housing, an infrared transparent ink that only transmits infrared light is formed on a surface of the cover plate that is combined with the housing, and the infrared transparent ink covers the housing light source through hole.

In some embodiments, the electronic device further includes a proximity sensor and an imaging module, the imaging module includes a lens base, a lens barrel mounted on the lens base, and an image sensor housed in the lens base, the lens base includes a mounting surface located between the lens barrel and the image sensor, and the proximity sensor is disposed on the mounting surface.

In some embodiments, the electronic device further includes an imaging module and a proximity sensor, the imaging module is installed on the housing, the imaging module includes a camera housing and a lens module, the top surface of the camera housing is a step surface and includes a first sub-top surface and a second sub-top surface which are connected, the second sub-top surface is opposite to the first sub-top surface and inclines to form a notch with the first sub-top surface, the top surface has been provided with a light-emitting through hole, the lens module is accommodated in the camera housing and corresponds to the light-emitting through hole, and the proximity sensor is disposed at the first sub-top surface.

In some embodiments, the electronic device further includes an imaging module and a proximity sensor, the imaging module includes a camera housing and two lens modules, a notch is formed on a top surface of the camera housing to form a stepped top surface, the top surface includes a first step surface and a second step surface lower than the first step surface, two light-emitting through holes are formed on the first step surface, each light-emitting through hole corresponds to the lens module, and the proximity sensor is disposed at the second step surface.

In some embodiments, the electronic device further includes an imaging module and a proximity sensor, the imaging module includes a lens holder, a lens barrel mounted on the lens holder, and a substrate partially disposed in the lens holder, and the proximity sensor is disposed on the substrate.

The electronic device and the input/output module of the embodiment of the invention can be used for approaching infrared distance measurement when only the first infrared light source is turned on, and can be used for infrared light supplement when the first infrared light source and the second infrared light source are turned on, and the light sensor can also be used for visible light intensity detection. In addition, first infrared light source, second infrared light source and light sense ware are integrated to be a single packaging body structure, and input/output module's integrated level is higher, and the volume is less, and input/output module has practiced thrift the space of realizing infrared light filling, infrared range finding and the intensity detection's of visible light function.

Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;

FIG. 2 is a schematic perspective view of an input/output module of an electronic device according to some embodiments of the present invention;

fig. 3 to 4 are schematic views illustrating states of an input/output module of an electronic device according to some embodiments of the invention;

FIG. 5 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the invention;

fig. 6 to 8 are schematic distribution diagrams of the first infrared light source and the second infrared light source of the input-output module according to some embodiments of the invention;

FIG. 9 is a partial perspective view of an input/output module of an electronic device according to some embodiments of the present invention;

FIG. 10 is a schematic, partial cross-sectional view of an electronic device according to some embodiments of the invention;

FIG. 11 is a perspective view of a proximity sensor and an imaging module of an electronic device according to some embodiments of the present invention;

FIG. 12 is a schematic diagram of an arrangement of electronic components of an electronic device in accordance with certain embodiments of the invention;

FIG. 13 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the invention;

FIG. 14 is a schematic structural diagram of an electronic device according to some embodiments of the invention;

FIG. 15 is a schematic partial cross-sectional view of an electronic device according to some embodiments of the invention

FIG. 16 is a schematic drawing in section of a portion of an electronic device according to some embodiments of the inventions;

fig. 17 to 24 are schematic perspective views of a proximity sensor and an imaging module of an electronic device according to some embodiments of the invention.

Detailed Description

The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, an electronic device 100 according to an embodiment of the invention includes a housing 20, a cover 30, and electronic components. The electronic components include an input/output module 10, a proximity sensor 50 (see fig. 11), an imaging module 60 (see fig. 11), a receiver 70, and a structured light projector 80. The electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, an intelligent watch, an intelligent bracelet, a teller machine, and the like, and the embodiment of the invention is described by taking the electronic device 100 as a mobile phone, it is understood that the specific form of the electronic device 100 may be other, and is not limited herein.

Referring to fig. 2 to 5, the input/output module 10 is a single package structure, and includes a package housing 11, a first infrared light source 12, a second infrared light source 13, and a light sensor 1 a.

The package housing 11 is used for simultaneously packaging the first infrared light source 12, the second infrared light source 13 and the optical sensor 1a, or the first infrared light source 12, the second infrared light source 13 and the optical sensor 1a are all packaged in the package housing 11. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an Electromagnetic Interference (EMI) shielding material to prevent external EMI from affecting the input/output module 10.

Referring to fig. 5, the package substrate 111 is used to carry the first infrared light source 12, the second infrared light source 13 and the optical sensor 1 a. In manufacturing the input/output module 10, the first infrared light source 12, the second infrared light source 13 and the photo sensor 1a may be formed on one chip 14, and then the first infrared light source 12, the second infrared light source 13, the photo sensor 1a and the chip 14 may be disposed on the package substrate 111 together, specifically, the chip 14 may be bonded on the package substrate 111. Meanwhile, the package substrate 111 may also be used to connect with other components of the electronic device 100 (e.g., the housing 20 and the motherboard of the electronic device 100) to fix the input/output module 10 in the electronic device 100.

The package sidewall 112 may be disposed around the first infrared light source 12, the second infrared light source 13 and the optical sensor 1a, the package sidewall 112 extends from the package substrate 111, the package sidewall 112 may be combined with the package substrate 111, and preferably, the package sidewall 112 and the package substrate 111 are detachably connected, so as to facilitate the maintenance of the first infrared light source 12, the second infrared light source 13 and the optical sensor 1a after the package sidewall 112 is removed. The package sidewall 112 may be made of an infrared opaque material to prevent infrared light from the first and second

infrared light sources

12 and 13 from passing through the package sidewall 112.

The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. A light emitting window 1131 and a light sensing window 1132 are formed on the package top 113, the light emitting window 1131 corresponds to the first infrared light source 12 and the second infrared light source 13, and infrared light emitted by the first infrared light source 12 and the second infrared light source 13 passes through the light emitting window 1131; the light sensor window 1132 corresponds to the light sensor 1a, and the visible light can pass through the light sensor window 1132 and be incident on the light sensor 1 a. The package top 113 and the package side wall 112 may be formed integrally or separately. In one example, the light emitting window 1131 and the light sensing window 1132 are both through holes, and the package top 113 is made of a material opaque to infrared light and visible light. In another example, the package top 113 is made of a material opaque to infrared light, a material transparent to infrared light, a material opaque to visible light, and a material transparent to visible light, specifically, the light emitting window 1131 is made of a material transparent to infrared light, the light sensing window 1132 is made of a material transparent to visible light, and the rest is made of a material opaque to infrared light and a material opaque to visible light, further, the light emitting window 1131 may be formed with a lens structure to improve the infrared light emitting angle from the light emitting window 1131, for example, the light emitting window 1131 is formed with a concave lens structure to make the light passing through the light emitting window 1131 diffuse outward; the light-emitting window 1131 is formed with a convex lens structure, so that light rays passing through the light-emitting window 1131 are gathered and emitted outwards; the light sensing window 1132 may also be formed with a lens structure to improve the visible light emitting angle incident from the light sensing window 1132, for example, the light sensing window 1132 has a convex lens structure to focus and project the light incident from the light sensing window 1132 onto the light sensor 1 a.

The first infrared light source 12, the second infrared light source 13 and the light sensor 1a can be formed on one chip 14, so that the volume of the integrated first infrared light source 12, the integrated second infrared light source 13 and the integrated light sensor 1a is further reduced, and the preparation process is simple. The first infrared light source 12 and the second infrared light source 13 may emit infrared light. When the first infrared light source 12 and the second infrared light source 13 are both turned on and emit infrared light to the outside of the package housing 11 (as shown in fig. 3), the infrared light passes through the light emitting window 1131 to be projected onto the surface of the object, the infrared camera 62 (as shown in fig. 1) of the electronic device 100 receives the infrared light reflected by the object to obtain image information of the object, at this time, the input/output module 10 is used for infrared supplementary lighting, the light emitting area covered by the infrared light for supplementary lighting, which is emitted by the first infrared light source 12 and the second infrared light source 13 together, is large, and the field angle α of the infrared light for supplementary lighting may be 60 degrees to 90 degrees, for example: the angle of view α of the fill-in infrared light is 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, 90 degrees, or the like. When the second infrared light source 13 is turned off and the first infrared light source 12 emits infrared light to the outside of the package housing 11 (as shown in fig. 4), the infrared light passes through the light-emitting window 1131 and reaches the surface of the object, the proximity sensor 50 (as shown in fig. 11) of the electronic device 100 receives the infrared light reflected by the object to detect the distance from the object to the electronic device 100, at this time, the input-output module 10 is used for infrared distance measurement, and the light-emitting area covered by the infrared light emitted by the first infrared light source 12 for infrared distance measurement is small, and the field angle β of the infrared light for infrared distance measurement is 10 degrees to 30 degrees, for example: the angle of view β of the infrared light for infrared distance measurement is 10 degrees, 15 degrees, 20 degrees, 25 degrees, 30 degrees, or the like. In the embodiment of the present invention, the angle of field refers to a range covered by the infrared light exiting from the package case 11 through the light emission window 1131. The light sensor 1a receives visible light in the ambient light incident from the light sensing window 1132, and detects the intensity of the visible light.

The input/output module 10 can emit infrared light to the outside of the package housing 11 with different powers when being used for infrared supplementary lighting and being used for approaching infrared distance measurement. The input/output module 10 is configured to emit infrared light to the outside of the package housing 11 with a first power when approaching the infrared distance measurement, and the input/output module 10 is configured to emit infrared light to the outside of the package housing 11 with a second power when compensating for the infrared light, where the first power may be smaller than the second power.

The second infrared light source 13 is disposed around the first infrared light source 12. The first infrared light source 12 and the second infrared light source 13 may be circular, annular, square, regular polygon, or the like as a whole. Can be as follows: the first infrared light source 12 is a point light source, and the second infrared light source 13 is also a point light source and is a plurality of (as shown in fig. 6); or the first infrared light source 12 is a point light source, and the second infrared light source 13 is a ring light source (as shown in fig. 7); or the first infrared light source 12 is a plurality of point light sources surrounding into a ring, and the second infrared light source 13 is a ring light source; or the first infrared light source 12 is a plurality of point light sources surrounding a ring, and the second infrared light source 13 is a plurality of point light sources (as shown in fig. 8); or the first infrared light source 12 is a ring light source; the second infrared light sources 13 are point light sources and are multiple in number; or the first infrared light source 12 is a ring light source; the second infrared light source 13 is a ring light source. The light sensor 1a is disposed on one side of the first infrared light source 12 and the second infrared light source 13, that is, the light sensor 1a is disposed outside the space surrounded by the second infrared light source 13.

Referring to fig. 9, in the embodiment of the invention, the input/output module 10 is formed with a ground pin 15, a fill light pin 16, a proximity light pin 17, and a light sensing pin 1 c. The ground pin 15, the fill-in lamp pin 16, the proximity lamp pin 17, and the light sensing pin 1c may be formed on the package substrate 111, and when the ground pin 15 and the fill-in lamp pin 16 are enabled (i.e., when the ground pin 15 and the fill-in lamp pin 16 are connected to a circuit, the first infrared light source 12 and the second infrared light source 13 emit infrared light; when the ground pin 15 and the proximity lamp pin 17 are enabled (i.e., when the ground pin 15 and the proximity lamp pin 17 access circuit are turned on), the first infrared light source 12 emits infrared light; when the ground pin 15 and the light sensing pin 1c are enabled (i.e., when the ground pin 15 and the light sensing pin 1c are connected to the circuit, the light sensor 1a detects the intensity of the visible light, which is used as a basis for controlling the display brightness of the display screen 90.

Referring to fig. 1 and 10, the housing 20 may be used as a mounting carrier for the input/output module 10, or the input/output module 10 may be disposed in the housing 20. The housing 20 may be a housing of the electronic device 100, in the embodiment of the present invention, the housing 20 may further be used to set the display screen 90 of the electronic device 100, and since the volume occupied by the input/output module 10 according to the embodiment of the present invention is smaller, the volume occupied by the housing 20 to set the display screen 90 may be correspondingly increased, so as to increase the screen occupation ratio of the electronic device 100. Specifically, the housing 20 includes a top 21 and a bottom 22, the display 90 and the input/output module 10 are disposed between the top 21 and the bottom 22, and the top 21 is located above the bottom 22 in a state that the user normally uses the electronic device 100, as shown in fig. 1, the input/output module 10 may be disposed between the display 90 and the top 21. In other embodiments, the display 90 may be a full screen with a gap, the display 90 surrounds the input/output module 10, and the input/output module 10 is exposed from the gap of the display 90.

The casing 20 further has a casing light source through hole 23 and a casing light sensing through hole 24. When the input/output module 10 is disposed in the housing 20, the first infrared light source 12 and the second infrared light source 13 correspond to the housing light source through hole 23, and the optical sensor 1a corresponds to the housing light sensor through hole 24. The first infrared light source 12 and the second infrared light source 13 correspond to the chassis light source through hole 23, which means that light emitted by the first infrared light source 12 and the second infrared light source 13 can pass through the chassis light source through hole 23, specifically, the first infrared light source 12 and the second infrared light source 13 are opposite to the chassis light source through hole 23, or the light emitted by the first infrared light source 12 and the second infrared light source 13 passes through the chassis light source through hole 23 after being acted by the light guide element. The light sensor 1a and the case light sensing through hole 24 correspond to each other, and the visible light can pass through the case light sensing through hole 24 and be incident on the light sensor 1a, specifically, the light sensor 1a and the case light sensing through hole 24 are opposite, or the incident light of the visible light passes through the case light sensing through hole 24 and is incident on the light sensor 1a after being acted by the light guide element. The case light through hole 23 and the case light through hole 24 may be spaced apart from each other, but in other embodiments, the case light through hole 23 and the case light through hole 24 may be connected to each other.

The cover plate 30 may be light-transmissive, and the material of the cover plate 30 may be light-transmissive glass, resin, plastic, or the like. The cover plate 30 is disposed on the chassis 20, the cover plate 30 includes an inner surface 32 combined with the chassis 20, and an outer surface 31 opposite to the inner surface 32, and the light emitted by the input/output module 10 sequentially passes through the inner surface 32 and the outer surface 31 and then passes through the cover plate 30. In the embodiment shown in fig. 10, the cover plate 30 covers the chassis light source through hole 23 and the chassis light sensing through hole 24, the inner surface 32 of the cover plate 30 is coated with the infrared transmissive ink 40, and the infrared transmissive ink 40 has a high transmittance to infrared light, for example, 85% or more, and a high attenuation to visible light, for example, 70% or more, so that a user can hardly see an area of the electronic device 100 covered by the infrared transmissive ink 40 with naked eyes in normal use. Specifically, infrared-transmissive ink 40 may cover areas of inner surface 32 that do not correspond to display 90.

The ir transmissive ink 40 can also block the chassis light source through hole 23 (as shown in fig. 10), so that it is difficult for a user to see the internal structure of the electronic device 100 through the chassis light source through hole 23, and the electronic device 100 has a beautiful appearance.

Referring to fig. 11, the proximity sensor 50 is a single package. The first infrared light source 12 and the second infrared light source 13 emit infrared light when used as a proximity infrared lamp, and after being reflected by an external object, the infrared light is received by the proximity sensor 50, and the proximity sensor 50 determines the distance between the external object and the electronic device 100 according to the received infrared light reflected by the object.

Referring to fig. 1 and 11, the imaging module 60 may be one or both of a visible light camera 61 and an infrared camera 62. The imaging module 60 includes a lens mount 63, a lens barrel 64, and an image sensor 65. The lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63. The mirror base 63 includes a mounting surface 631, and the mounting surface 631 is located between the lens barrel 64 and the image sensor 65. In the embodiment shown in fig. 11, the proximity sensor 50 is disposed on the mounting surface 631, and specifically, the orthogonal projection of the proximity sensor 50 on the plane of the mounting surface 631 at least partially falls on the mounting surface 631, so that the proximity sensor 50 and the imaging module 60 are disposed compactly, and the lateral space occupied by the two together is small.

Referring to fig. 1, the receiver 70 is used for sending out an acoustic signal when being excited by a power supply, and a user can talk through the receiver 70. The structured light projector 80 is configured to emit structured light outwards, the structured light is reflected after being projected onto the object to be measured, the reflected structured light can be received by the infrared camera 62, and the processor of the electronic device 100 further analyzes the structured light received by the infrared camera 62 to obtain depth information of the object to be measured.

In the embodiment shown in fig. 1, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, and the centers of the input-output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70 and the structured light projector 80 are located on the same line segment. Specifically, the input/output module 10, the structured light projector 80, the receiver 70, the infrared camera 62, and the visible light camera 61 (as shown in fig. 12) are sequentially arranged from one end to the other end of the line segment, and at this time, the visible light camera 61 and the infrared camera 62 may form a dual camera (as shown in fig. 21); or the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61 and the structured light projector 80 (as shown in fig. 1) are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the input/output module 10, the receiver 70, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the visible light camera 61, the receiver 70, the input/output module 10 and the structured light projector 80 are sequentially arranged from one end to the other end of the line segment, and at this time, the visible light camera 61 and the infrared camera 62 can form a double camera (as shown in fig. 21). Of course, the arrangement of the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above example, and may be other shapes such as a shape in which the centers of the respective electronic components are arranged in a circular arc shape and a shape in which the centers are arranged in a rectangular shape.

Further, please refer to fig. 11, the proximity sensor 50 may be disposed on the mounting surface 631 of the infrared camera 62, or may be disposed on the mounting surface 631 of the visible light camera 61, of course, the proximity sensor 50 may not be disposed on the mounting surface 631, the proximity sensor 50 may be disposed adjacent to the input/output module 10, and the proximity sensor 50 is easy to receive the infrared light emitted by the input/output module 10 when the proximity infrared distance measurement is performed, and reflected by an external object; the proximity sensor 50 may also be located adjacent to the receiver 70, and when the user answers the call, the proximity sensor 50 easily detects that the user's ear is close to the receiver 70.

In summary, the electronic device 100 of the embodiment of the invention can be used for proximity infrared distance measurement when only the first infrared source 12 is turned on, and can be used for infrared light supplement when the first infrared source 12 and the second infrared source 13 are turned on, and the optical sensor 1a can also be used for visible light intensity detection, in other words, the first infrared source 12, the second infrared source 13 and the optical sensor 1a are integrated into a single package structure, so that the input/output module 10 integrates the functions of infrared distance measurement and infrared light supplement and visible light intensity detection. In addition, first infrared light source 12, second infrared light source 13 and light sense ware 1a are integrated to be a single packaging body structure, and input/output module 10's integrated level is higher, and the volume is less, and input/output module 10 has practiced thrift the space of realizing infrared light filling, infrared range finding and the intensity detection's of visible light function. In addition, since the first infrared light source 12, the second infrared light source 13 and the light sensor 1a are all supported on the same package substrate 111, compared with the infrared fill light, the proximity infrared light and the light sensor 1a in the conventional art, which need to be manufactured by different wafers and then packaged on a PCB substrate, the package efficiency is improved.

Referring to fig. 5, in some embodiments, the input/output module 10 further includes a light source lens 18 and a light-sensing lens 1 b. The light source lens 18 is disposed inside the package case 11 and corresponds to the first infrared light source 12 and the second infrared light source 13. The light-sensing lens 1b is disposed in the package housing 11 and corresponds to the light sensor 1 a. The infrared light emitted by the first infrared light source 12 and the second infrared light source 13 is converged into the light emitting window 1131 under the action of the light source lens 18 to be emitted, so as to reduce the light quantity emitted to other areas of the package sidewall 112 and the package top 113, and it only needs to be satisfied that the field angle α of the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 for light supplement after passing through the light source lens 18 is 60 degrees to 90 degrees, and the field angle β of the infrared light emitted by the first infrared light source 12 for infrared distance measurement after passing through the light source lens 18 is 10 degrees to 30 degrees. Similarly, when the visible light entering from the light sensing window 1132 is incident on the light sensing lens 1b, the light sensing lens 1b converges the visible light on the light sensor 1a, so as to reduce the amount of the visible light transmitted to the region outside the light sensor 1 a. Specifically, the light source lens 18 and the light-sensing lens 1b may be located on a transparent substrate, and more specifically, the light source lens 18 and the light-sensing lens 1b may be integrally formed with the transparent substrate. Of course, the input/output module 10 may be provided with only one of the light source lens 18 and the light sensing lens 1 b; alternatively, the input/output module 10 may not be provided with the light source lens 18 and the photo lens 1 b.

Referring to fig. 5, in some embodiments, the input/output module 10 further includes a metal shielding plate 1d, and the metal shielding plate 1d is located in the package housing 11 and located between the second infrared light source 13 and the optical sensor 1 a. The metal shielding plate 1d is located between the second infrared light source 13 and the optical sensor 1a, and can prevent infrared light emitted by the first infrared light source 12 and the second infrared light source 13 from being incident on the optical sensor 1a, and also can shield electromagnetic interference between the first infrared light source 12 and the optical sensor 1a and electromagnetic interference between the second infrared light source 13 and the optical sensor 1 a.

Referring to fig. 13, in some embodiments, the input-output module 10 further includes an optical enclosure 19. The optical enclosure 19 is made of a light transmissive material, and the optical enclosure 19 is formed on the package substrate 111 and located within the package housing 11. Optical enclosure 19 encloses first infrared light source 12, second infrared light source 13, and light sensor 1 a. Specifically, optical enclosure 19 may be formed by a potting injection molding process, optical enclosure 19 may be made of a transparent thermosetting epoxy resin so as to be not easily softened in use, and optical enclosure 19 may fix the relative positions among first infrared light source 12, second infrared light source 13, and light sensor 1a, and make first infrared light source 12, second infrared light source 13, and light sensor 1a not easily shake within package housing 11.

Referring to fig. 13, in some embodiments, the input/output module 10 further includes a light-emitting partition 1e, and the light-emitting partition 1e is formed in the optical enclosure 19 and located between the second infrared light source 13 and the optical sensor 1 a. The light-emitting partition board 1e can block infrared light emitted by the first infrared light source 12 and the second infrared light source 13 from being incident on the light sensor 1a, and simultaneously block visible light entering from the light sensing window 1132 and emitted to the light sensor 1a from affecting the light emission of the first infrared light source 12 and the second infrared light source 13.

Referring to fig. 11, in some embodiments, the proximity sensor 50 of the above embodiments may be disposed on the mounting surface 631 of the mirror base 63. The lens mount 63 can be the lens mount 63 of the infrared camera 62, and can also be the lens mount 63 of the visible camera 61.

Referring to fig. 14, in some embodiments, the housing 20 further has a housing sound outlet (not shown), the cover 30 further has a cover sound outlet 34, and the receiver 70 corresponds to the positions of the cover sound outlet 34 and the housing sound outlet. The centers of the input/output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the housing 20.

The center of the receiver 70 is not located on the line segment, so that the transverse space occupied by each electronic component (the input/output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover plate 30 is saved. In the embodiment shown in fig. 14, the cover sound outlet 34 is opened at the edge of the cover 30, and the case sound outlet is opened near the top 21.

Referring to fig. 15, in some embodiments, the cover plate 30 may further have a cover plate light source through hole 33, the cover plate light source through hole 33 corresponds to the case light source through hole 23, and the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 may pass through the cover plate light source through hole 33 and then pass through the electronic device 100.

Referring to fig. 16, in some embodiments, the cover plate 30 may further have a cover plate light sensing through hole 35, the cover plate light sensing through hole 35 corresponds to the case light sensing through hole 24 and the light sensor 1a, and visible light outside the electronic device 100 may pass through the cover plate light sensing through hole 35 and the case light sensing through hole 24 and then may be incident on the light sensor 1 a.

Referring to fig. 17, in some embodiments, the imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the proximity sensor 50 can be further fixed on the substrate 66. Specifically, the substrate 66 is provided with an FPC, a part of the substrate 66 is located in the mirror base 63, another part of the substrate extends out of the mirror base 63, one end of the FPC is located in the mirror base 63 and is used for bearing the image sensor 65, and the other end of the FPC can be connected with a main board of the electronic device 100. When the proximity sensor 50 is provided on the substrate 66, the proximity sensor 50 is provided outside the mirror base 63, and the proximity sensor 50 may be connected to an FPC.

The imaging module 60 may be one or two of a visible light camera 61 and an infrared light camera 62. Specifically, the proximity sensor 50 may be fixed on the substrate 66 of the visible light camera 61; the proximity sensor 50 may be fixed on a substrate 66 of the infrared camera 62. Further, base plate 66 still includes the stiffening plate, and the stiffening plate setting is in the one side that carries on the back mutually with proximity sensor 50 to increase base plate 66's bulk strength, make FPC be difficult for taking place around rolling over, be difficult for taking place to rock when proximity sensor 50 sets up on base plate 66 simultaneously. In one example, the proximity sensor 50 may also be fixed to an outer sidewall of the mirror base 63, for example, by means of bonding.

Referring to fig. 18, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 includes an image sensor 65, a camera housing 67 and a lens module 68. The top surface 670 of the camera housing 67 is a stepped surface, the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672 and a third sub-top surface 673, the second sub-top surface 672 is connected to the first sub-top surface 671 in an inclined manner and forms a notch 675 with the first sub-top surface 671, the third sub-top surface 673 is connected to the second sub-top surface 672 in an inclined manner, and the second sub-top surface 672 is located between the first sub-top surface 671 and the third sub-top surface 673 to connect the first sub-top surface 671 and the third sub-top surface 673. The angle between the second sub top surface 672 and the first sub top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub top surface 672 and the third sub top surface 673 may be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The third sub-top surface 673 is provided with a light-emitting through hole 674, and the lens module 68 is accommodated in the camera housing 67 and corresponds to the light-emitting through hole 674. The image sensor 65 is accommodated in the camera housing 67 and corresponds to the lens module 68, light outside the electronic device 100 can pass through the light-out hole 674 and the lens module 68 and be transmitted to the image sensor 65, and the image sensor 65 converts an optical signal into an electrical signal. The proximity sensor 50 is disposed at the first sub-top surface 671. In the present embodiment, the imaging module 60 may be a visible light camera 61, and the proximity sensor 50 may be a single package. In other embodiments, the imaging module 60 may be an infrared camera 62.

The imaging module 60 of the present embodiment has a notch 675, and the proximity sensor 50 is disposed on the first sub-top surface 671, so that the proximity sensor 50 and the imaging module 60 are disposed compactly, and the horizontal space occupied by the two is small, thereby saving the installation space in the electronic device 100.

With continued reference to fig. 18, in some embodiments, the proximity sensor 50 of the above embodiments is disposed on the first sub-top surface 671 and is located outside the camera housing 67, and specifically, a projection of the entire proximity sensor 50 along a direction perpendicular to the first sub-top surface 671 may be located within the first sub-top surface 671 (as shown in fig. 18); alternatively, a portion of the proximity sensor 50 is located within the first sub-top surface 671 along a projection perpendicular to the first sub-top surface 671. That is, at least a portion of the proximity sensor 50 is located directly above the first sub-top surface 671, so that the proximity sensor 50 and the imaging module 60 are disposed compactly, and the lateral space occupied by the two is small, thereby further saving the installation space in the electronic device 100.

Referring to fig. 19, the first sub-top surface 671 of the above embodiment is provided with a light hole 676, and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. Light external to the electronic device 100 can pass through the light transmissive hole 676 and pass onto the proximity sensor 50. The proximity sensor 50 of the present embodiment is disposed in the camera housing 67, so that the structures of the proximity sensor 50 and the camera housing 67 are more stable and the proximity sensor 50 and the imaging module 60 are easily mounted on the housing 20.

Referring to fig. 20, in some embodiments, the first sub-top surface 671 of the above embodiments is formed with a light hole 676, and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the proximity sensor 50 may be fixed on the substrate 66 and housed in a camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to a main board of the electronic device 100. In other embodiments, the proximity sensor 50 may also be connected to the FPC. The proximity sensor 50 of the present embodiment is disposed in the camera housing 67, so that the structures of the proximity sensor 50 and the camera housing 67 are more stable and the proximity sensor 50 and the imaging module 60 are conveniently mounted on the housing 20; meanwhile, the imaging module 60 sets the substrate 66 and the proximity sensor 50 on the substrate 66, so that the proximity sensor 50 can be stably installed in the camera housing 67.

Referring to fig. 21, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 is a dual-camera module, and includes two image sensors 65, a camera housing 67, and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 lower than the first step surface 677, and a first connection surface 679 a. The first connecting surface 679a is obliquely connected with the second tread 678 and forms a notch 675 with the second tread 678, the first connecting surface 679a is obliquely connected with the first tread 677, and the first connecting surface 679a is positioned between the first tread 677 and the second tread 678 to connect the first tread 677 with the second tread 678. The included angle between the first connecting surface 679a and the first tread 677 can be an obtuse angle or a right angle, and the included angle between the first connecting surface 679a and the second tread 678 can be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The two light-emitting through holes 674 are arranged on the first ladder surface 677 and are located on the same side of the cut 675, and a central connecting line of the two light-emitting through holes 674 is perpendicular to the extending direction of the cut 675. The two lens modules 68 are accommodated in the camera housing 67 and respectively correspond to the two light-emitting through holes 674, the two image sensors 65 are accommodated in the camera housing 67 and respectively correspond to the two lens modules 68, and light outside the electronic device 100 can pass through the light-emitting through holes 674 and the lens modules 68 and is transmitted to the image sensors 65. In the present embodiment, the imaging module 60 can be a visible light camera 61, and at this time, both the two lens modules 68 are lens modules corresponding to the visible light camera 61. The proximity sensor 50 is provided on the second step face 678 and is located outside the camera housing 67. The proximity sensor 50 is a single package. In other embodiments, the imaging module 60 may be an infrared camera 62, and both of the lens modules 68 correspond to the infrared camera 62. In another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared camera 62, and in this case, one of the lens modules 68 is a lens module corresponding to the infrared camera 62, and the other lens module 68 is a lens module corresponding to the visible light camera 61.

The imaging module 60 of the present embodiment has a notch 675, and the proximity sensor 50 is disposed on the second step surface 678, so that the proximity sensor 50 and the imaging module 60 are disposed compactly, the two occupy a smaller lateral space, and the installation space in the electronic device 100 is saved.

Referring to fig. 22, in some embodiments, the cut 675 of the above embodiments is formed in the middle of the top surface 670, the first tread 677 is divided into a first sub-tread 677a and a second sub-tread 677b by the cut 675, the first sub-tread 677a and the second sub-tread 677b are respectively located on two opposite sides of the cut 675, two light-exiting through holes 674 are respectively formed in the first sub-tread 677a and the second sub-tread 677b, and the lens modules 68 mounted in the camera housing 67 are also located on two opposite sides of the cut 675. At this time, the cutout 675 is defined by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b, the first connecting surface 679a connects the first sub top surface 677a and the second step surface 678 obliquely and is located between the first sub top surface 677a and the second step surface 678, and the second connecting surface 679b connects the second sub top surface 677b and the second step surface 678 obliquely and is located between the second sub top surface 677b and the second step surface 678. In this embodiment, the first terraced surface 677 is parallel to the second terraced surface 678, an included angle between the first connection surface 679a and the first sub terraced surface 677a is an obtuse angle, and an included angle between the second connection surface 679b and the second sub terraced surface 677b is an obtuse angle. In other embodiments, the first connection surface 679a and the first sub-step surface 677a form a right angle, and the second connection surface 679b and the second sub-step surface 677b form a right angle. The cutout 675 of the present embodiment is opened at the middle position of the top surface 670, relative to the cutout 675 opened at the edge position of the top surface 670, so that the width of the cutout 675 can be made wider, thereby facilitating the arrangement of the proximity sensor 50 on the second tread 678.

Referring to fig. 21 and 22, in some embodiments, the proximity sensor 50 of the above embodiments is disposed on the second tread 678 and outside the camera housing 67. Specifically, when the cutout 675 is opened at the edge position of the top surface 670, the entire proximity sensor 50 projected along the direction perpendicular to the second tread 678 may be located within the second tread 678; alternatively, a projection of a portion of the proximity sensor 50 along a direction perpendicular to the second tread 678 is located within the second tread 678. That is, at least a portion of the proximity sensor 50 is located directly above the second tread 678. When the cutout 675 is opened at the middle position of the top surface 670, the entire projection of the proximity sensor 50 along the direction perpendicular to the second step surface 678 can be located in the second step surface 678 (as shown in fig. 21 and 22). Thus, the proximity sensor 50 and the imaging module 60 are arranged compactly, and the horizontal space occupied by the proximity sensor and the imaging module is small, so that the installation space in the electronic device 100 is further saved.

Referring to fig. 23, the second step surface 678 of the above embodiment is provided with a light hole 676, and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. Light external to the electronic device 100 can pass through the light transmissive hole 676 and pass onto the proximity sensor 50. The proximity sensor 50 of the present embodiment is disposed in the camera housing 67, so that the structures of the proximity sensor 50 and the camera housing 67 are more stable and the proximity sensor 50 and the imaging module 60 are easily mounted on the housing 20.

With continued reference to fig. 24, in some embodiments, the second step surface 678 of the above-mentioned embodiments is provided with a light hole 676, and the proximity sensor 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the proximity sensor 50 may be fixed on the substrate 66 and housed in a camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to a main board of the electronic device 100. In other embodiments, the proximity sensor 50 may also be connected to the FPC.

The proximity sensor 50 of the present embodiment is disposed in the camera housing 67, so that the structures of the proximity sensor 50 and the camera housing 67 are more stable and the proximity sensor 50 and the imaging module 60 are conveniently mounted on the housing 20; meanwhile, the imaging module 60 sets the substrate 66 and the proximity sensor 50 on the substrate 66, so that the proximity sensor 50 can be stably installed in the camera housing 67.

In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.

Claims

1. An input/output module is characterized by comprising a packaging shell, a first infrared light source, a second infrared light source and a light sensor, wherein the second infrared light source and the light sensor are arranged around the first infrared light source; when the first infrared light source and the second infrared light source are both started and emit infrared light to the outside of the packaging shell with second power, the input and output module is used for supplementing infrared light so that an infrared camera outside the packaging shell receives infrared light reflected by an object to acquire image information of the object; the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light; the first power is less than the second power; the light sensor is arranged outside the space surrounded by the second infrared light source; the light emitting area covered by the infrared light for light supplement emitted by the first infrared light source and the second infrared light source is larger than the light emitting area covered by the infrared light for infrared distance measurement emitted by the first infrared light source;

the packaging shell comprises a packaging side wall and a packaging top part, the packaging side wall extends from the packaging substrate and is connected between the packaging top part and the packaging substrate, a light emitting window and a light sensation window are formed in the packaging top part, the light emitting window corresponds to the first infrared light source and the second infrared light source, and the light sensation window corresponds to the light sensation device;

the light-emitting window is provided with a concave lens structure so that light rays passing through the light-emitting window are diffused and emitted outwards; the light sensation window is formed with a convex lens structure so that light rays incident from the light sensation window are gathered and projected onto the light sensor.

2. The input-output module according to claim 1,

the first infrared light sources are point light sources, and the second infrared light sources are multiple point light sources; or

3. The input-output module of claim 1, further comprising a chip, wherein the first infrared light source, the second infrared light source, and the photo-sensor are formed on one chip.

4. The input-output module according to claim 3, further comprising a light source lens disposed within the package housing and corresponding to the first infrared light source and the second infrared light source; and/or

5. The input-output module of claim 3, further comprising a light source lens and a light sense lens disposed in the package housing, wherein the light source lens corresponds to the first infrared light source and the second infrared light source, the light sense lens corresponds to the light sensor, and the light source lens and the light sense lens are disposed on a same transparent substrate.

6. The input-output module of claim 1, further comprising a metal shielding plate disposed within the package housing and between the second infrared light source and the light sensor.

7. The input-output module according to claim 1, further comprising an optical enclosure made of a light transmissive material formed on the package substrate and located within the package housing, the optical enclosure enclosing the first infrared light source, the second infrared light source, and the light sensor.

8. The input-output module according to claim 7, further comprising a light-exiting baffle formed within the optical enclosure between the second infrared light source and the light sensor.

9. The input-output module according to any one of claims 1 to 8, wherein a ground pin, a fill light pin, a proximity light pin, and a light sensing pin are formed on the input-output module, and when the ground pin and the proximity light pin are enabled, the first infrared light source emits infrared light; when the grounding pin and the light supplement lamp pin are enabled, the first infrared light source and the second infrared light source emit infrared light; when the grounding pin and the light sensing pin are enabled, the light sensor detects the intensity of visible light.

10. An electronic device, comprising:

a housing; and

the input-output module of any one of claims 1-9 disposed within the housing.

11. The electronic device of claim 10, further comprising a transparent cover plate, wherein the housing defines a housing light source through hole and a housing light sensor through hole, the first infrared light source and the second infrared light source correspond to the housing light source through hole, the light sensor corresponds to the housing light sensor through hole, and the cover plate is disposed on the housing.

12. The electronic device of claim 10, further comprising a transparent cover plate, wherein the housing defines a housing light source through hole and a housing light sensation through hole, the first infrared light source and the second infrared light source correspond to the housing light source through hole, the light sensor corresponds to the housing light sensation through hole, the cover plate is disposed on the housing, an infrared transmissive ink that only transmits infrared light is formed on a surface of the cover plate that is combined with the housing, and the infrared transmissive ink blocks the housing light source through hole.

13. The electronic device of claim 10, further comprising a proximity sensor and an imaging module, wherein the imaging module comprises a lens base, a lens barrel mounted on the lens base, and an image sensor housed in the lens base, the lens base comprises a mounting surface between the lens barrel and the image sensor, and the proximity sensor is disposed on the mounting surface.

14. The electronic device according to claim 10, further comprising an imaging module and a proximity sensor, wherein the imaging module is mounted on the housing, the imaging module comprises a camera housing and a lens module, a top surface of the camera housing is a step surface and comprises a first sub-top surface and a second sub-top surface connected to each other, the second sub-top surface is inclined with respect to the first sub-top surface and forms a notch with the first sub-top surface, the top surface has a light exit hole, the lens module is accommodated in the camera housing and corresponds to the light exit hole, and the proximity sensor is disposed at the first sub-top surface.

15. The electronic device according to claim 10, further comprising an imaging module and a proximity sensor, wherein the imaging module comprises a camera housing and two lens modules, a top surface of the camera housing is cut to form a stepped top surface, the top surface comprises a first step surface and a second step surface lower than the first step surface, the first step surface is cut with two light-emitting through holes, each light-emitting through hole corresponds to the lens module, and the proximity sensor is disposed at the second step surface.

16. The electronic device of claim 10, further comprising an imaging module and a proximity sensor, wherein the imaging module comprises a lens holder, a lens barrel mounted on the lens holder, and a substrate partially disposed in the lens holder, and the proximity sensor is disposed on the substrate.