CN108023984B - Input/output module and electronic device - Google Patents
Input/output module and electronic device Download PDFInfo
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- CN108023984B CN108023984B CN201711437124.6A CN201711437124A CN108023984B CN 108023984 B CN108023984 B CN 108023984B CN 201711437124 A CN201711437124 A CN 201711437124A CN 108023984 B CN108023984 B CN 108023984B
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- infrared light
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- proximity sensor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
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- Geophysics And Detection Of Objects (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The invention discloses an electronic device and an input/output module. The first infrared light source, the second infrared light source, the proximity sensor and the light sensor are all packaged in the packaging shell and are carried on the packaging substrate. When the second infrared light source is turned off, the first infrared light source emits infrared light to the outside of the packaging shell, and the input and output module is used for infrared distance measurement; when the first infrared light source and the second infrared light source are both started to emit infrared light to the outside of the packaging shell, the input and output module is used for infrared light supplement. The proximity sensor is used for receiving infrared light reflected by an object to detect the distance from the object to the input and output module, and the light sensor is used for receiving visible light in ambient light to detect the intensity of the visible light. A plurality of units are integrated into a single packaging body structure, the integration level of the input and output module is high, and the space for realizing the functions of infrared light supplement, infrared distance measurement and visible light intensity detection is saved.
Description
Technical Field
The present invention relates to the field of consumer electronics technologies, and in particular, to an input/output module and an electronic device.
Background
Along with the functions supported by the mobile phone are more and more abundant and various, the types and the number of functional devices required to be set by the mobile phone are more and more, in order to realize the functions of distance detection, ambient light detection, facial 3D feature recognition of a user and the like, functional devices such as a proximity sensor, an ambient light sensor, an infrared camera, a structured light projector and the like need to be configured in the electronic equipment, and in order to arrange numerous functional devices, the mobile phone occupies too much space.
Disclosure of Invention
The embodiment of the invention provides an input/output module and an electronic device.
The input/output module comprises a packaging shell, a first infrared light source, a second infrared light source, a proximity sensor and a light sensor, wherein the second infrared light source, the proximity sensor and the light sensor are arranged around the first infrared light source; when the first infrared light source and the second infrared light source are both started and emit infrared light to the outside of the packaging shell at a second power, the input and output module is used for infrared supplementary lighting; the proximity sensor is used for receiving infrared light reflected by an object and emitted by the first infrared light source so as to detect the distance from the object to the input and output module, and the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light.
In some embodiments, the first infrared light source is a point light source, and the second infrared light source is a point light source and is in plurality; or
The first infrared light source is a point light source, and the second infrared light source is an annular light source; or
The first infrared light source is a plurality of point light sources which surround into a ring, and the second infrared light source is a ring light source; or
The first infrared light sources are a plurality of point light sources which surround into a ring, and the second infrared light sources are a plurality of point light sources; or
The first infrared light source is an annular light source; the second infrared light sources are point light sources and are multiple in number; or
The first infrared light source is an annular light source; the second infrared light source is an annular light source.
In some embodiments, the input-output module further includes a chip, and the first infrared light source, the second infrared light source, the proximity sensor and the optical sensor are formed on one chip.
In some embodiments, the package housing further includes a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, the package top is formed with a light-emitting window, a proximity sensor window and a light-sensing window, the light-emitting window corresponds to the first infrared light source and the second infrared light source, the proximity sensor window corresponds to the proximity sensor, and the light-sensing window corresponds to the light sensor.
In some embodiments, the input-output module further comprises a light source lens disposed within the package housing and corresponding to the first infrared light source and the second infrared light source; and/or
The input and output module further comprises a proximity sensor lens, and the proximity sensor lens is arranged in the packaging shell and corresponds to the proximity sensor; and/or
The input and output module further comprises a light-sensitive lens, and the light-sensitive lens is arranged in the packaging shell and corresponds to the light sensor.
In some embodiments, the input/output module further includes a light source lens, a proximity sensor lens and a light sensor lens disposed in the package housing, the light source lens corresponds to the first infrared light source and the second infrared light source, the proximity sensor lens corresponds to the proximity sensor, the light sensor lens corresponds to the light sensor, and the light source lens, the proximity sensor lens and the light sensor lens are disposed on a same transparent substrate.
In some embodiments, the input-output module further includes a plurality of metal shielding plates located within the package housing and between any two of the second infrared light source, the proximity sensor, and the light sensor.
In some embodiments, the input-output module further includes an optical enclosure made of a light transmissive material formed on the package substrate and located within the package housing, the optical enclosure enclosing the first infrared light source, the second infrared light source, the proximity sensor, and the light sensor.
In some embodiments, the input-output module further comprises a plurality of light-exiting baffles formed within the optical enclosure between any two of the second infrared light source, the proximity sensor, and the light sensor.
In some embodiments, a ground pin, a fill-in light pin, a proximity sensor pin, and a light sensing pin are formed on the input/output module, and when the ground pin and the proximity light pin are enabled, the first infrared light source emits infrared light; when the grounding pin and the light supplement lamp pin are enabled, the first infrared light source and the second infrared light source emit infrared light; when the grounding pin and the proximity sensor pin are enabled, the proximity sensor receives infrared light rays emitted by the first infrared light source and reflected by an object; when the grounding pin and the light sensing pin are enabled, the light sensor receives visible light in the environment.
The electronic device comprises a shell and the input and output module, wherein the input and output module is arranged in the shell.
In some embodiments, the electronic device further includes a transparent cover plate, the housing defines a housing light source through hole, a housing proximity sensor through hole, and a housing light sensation through hole, the first infrared light source and the second infrared light source correspond to the housing light source through hole, the proximity sensor corresponds to the housing proximity sensor through hole, the light sensor corresponds to the housing light sensation through hole, and the cover plate is disposed on the housing.
In some embodiments, the electronic device further includes a transparent cover plate, the housing is provided with a housing light source through hole, a housing proximity sensor through hole, and a housing light sensation through hole, the first infrared light source and the second infrared light source correspond to the housing light source through hole, the proximity sensor corresponds to the housing proximity sensor through hole, the light sensor corresponds to the housing light sensation through hole, the cover plate is disposed on the housing, an infrared transparent ink that only transmits infrared light is formed on a surface of the cover plate that is combined with the housing, and the infrared transparent ink blocks at least one of the housing light source through hole and the housing proximity sensor through hole.
The electronic device and the input/output module of the embodiment of the invention are matched with the proximity sensor when only the first infrared light source is started, and can be used for proximity infrared distance measurement, and simultaneously can be used for infrared light supplement when the first infrared light source and the second infrared light source are started, and the light sensor can also be used for visible light intensity detection. In addition, first infrared light source, second infrared light source, proximity sensor and light sense ware are integrated into a single packaging body structure, and input/output module's integrated level is higher, and the volume is less, and input/output module has practiced thrift the space of realizing the function of infrared light filling, infrared range finding and the intensity detection of visible light.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;
FIG. 2 is a schematic perspective view of an input/output module of an electronic device according to some embodiments of the present invention;
fig. 3 to 4 are schematic views illustrating states of an input/output module of an electronic device according to some embodiments of the invention;
FIG. 5 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the invention;
fig. 6 to 8 are schematic distribution diagrams of the first infrared light source and the second infrared light source of the input-output module according to some embodiments of the invention;
FIG. 9 is a partial perspective view of an input/output module of an electronic device according to some embodiments of the present invention;
FIG. 10 is a schematic, partial cross-sectional view of an electronic device according to some embodiments of the invention;
FIG. 11 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the invention;
FIG. 12 is a schematic structural diagram of an electronic device according to some embodiments of the invention;
fig. 13-15 are schematic partial cross-sectional views of electronic devices according to some embodiments of the invention.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.
In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1, an electronic device 100 according to an embodiment of the invention includes a housing 20, a cover 30, and electronic components. The electronic components include an input/output module 10, an imaging module 60, a receiver 70, and a structured light projector 80. The electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, an intelligent watch, an intelligent bracelet, a teller machine, and the like, and the embodiment of the invention is described by taking the electronic device 100 as a mobile phone, it is understood that the specific form of the electronic device 100 may be other, and is not limited herein.
Referring to fig. 2 to 5, the input/output module 10 is a single package structure, and includes a package housing 11, a first infrared light source 12, a second infrared light source 13, a proximity sensor 50, and a light sensor 1 a.
The package housing 11 is used for simultaneously packaging the first infrared light source 12, the second infrared light source 13, the proximity sensor 50 and the optical sensor 1a, or the first infrared light source 12, the second infrared light source 13, the proximity sensor 50 and the optical sensor 1a are all packaged in the package housing 11. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an Electromagnetic Interference (EMI) shielding material to prevent external EMI from affecting the input/output module 10.
Referring to fig. 5, the package substrate 111 is used to carry the first infrared light source 12, the second infrared light source 13, the proximity sensor 50 and the optical sensor 1 a. In manufacturing the input/output module 10, the first infrared light source 12, the second infrared light source 13, the proximity sensor 50, and the photo sensor 1a may be formed on one chip 14, and then the first infrared light source 12, the second infrared light source 13, the proximity sensor 50, the photo sensor 1a, and the chip 14 may be disposed on the package substrate 111 together, specifically, the chip 14 may be bonded on the package substrate 111. Meanwhile, the package substrate 111 may also be used to connect with other components of the electronic device 100 (e.g., the housing 20 and the motherboard of the electronic device 100) to fix the input/output module 10 in the electronic device 100.
The package sidewall 112 may be disposed around the first infrared light source 12, the second infrared light source 13, the proximity sensor 50 and the optical sensor 1a, the package sidewall 112 extends from the package substrate 111, the package sidewall 112 may be combined with the package substrate 111, and preferably, the package sidewall 112 and the package substrate 111 are detachably connected, so as to facilitate maintenance of the first infrared light source 12, the second infrared light source 13, the proximity sensor 50 and the optical sensor 1a after the package sidewall 112 is removed. The package sidewall 112 may be made of an infrared opaque material to prevent infrared light from the first and second infrared light sources 12 and 13 from passing through the package sidewall 112.
The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. A light emitting window 1131, a proximity sensor window 1134 and a light sensing window 1132 are formed on the package top 113, the light emitting window 1131 corresponds to the first infrared light source 12 and the second infrared light source 13, and infrared light emitted by the first infrared light source 12 and the second infrared light source 13 passes through the light emitting window 1131; the proximity sensor window 1134 corresponds to the proximity sensor 50, and infrared light emitted by the proximity first infrared light source 12 after being reflected by an object can pass through the proximity sensor window 1134 and be incident on the proximity sensor 50; the light sensor window 1132 corresponds to the light sensor 1a, and the visible light can pass through the light sensor window 1132 and be incident on the light sensor 1 a. The package top 113 and the package side wall 112 may be formed integrally or separately. In one example, the light emitting window 1131, the proximity sensor window 1134 and the light sensing window 1132 are all through holes, and the package top 113 is made of a material opaque to infrared light and visible light. In another example, the package top 113 is made of a material opaque to infrared light, a material transparent to infrared light, a material opaque to visible light, and a material transparent to visible light, specifically, the light emitting window 1131 is made of a material transparent to infrared light, the proximity sensing port window 1134 and the light sensing window 1132 are made of a material transparent to visible light, and the rest of the light sensing window is made of a material opaque to infrared light and a material opaque to visible light, further, the light emitting window 1131 may be formed with a lens structure to improve the emission angle of infrared light emitted from the light emitting window 1131, for example, the light emitting window 1131 is formed with a concave lens structure to make the light passing through the light emitting window 1131 diverge and emit outward; the light-emitting window 1131 is formed with a convex lens structure, so that light rays passing through the light-emitting window 1131 are gathered and emitted outwards; the proximity sensor window 1134 is formed with a convex lens mechanism so that infrared light passing through the proximity sensor window 1134 is gathered inward and projected onto the proximity sensor 50; the light sensing window 1132 may also be formed with a lens structure to improve the visible light emitting angle incident from the light sensing window 1132, for example, the light sensing window 1132 has a convex lens structure to focus and project the light incident from the light sensing window 1132 onto the light sensor 1 a.
Referring to fig. 6 to 8, the first infrared light source 12, the second infrared light source 13, the proximity sensor 50 and the optical sensor 1a may be formed on a chip 14, so as to further reduce the volume of the integrated first infrared light source 12, the second infrared light source 13 and the optical sensor 1a, and the manufacturing process is simple. The first infrared light source 12 and the second infrared light source 13 may emit infrared light. When the first infrared light source 12 and the second infrared light source 13 are both turned on and emit infrared light to the outside of the package housing 11, the infrared light passes through the light emitting window 1131 to project onto the surface of the object, the infrared camera 62 of the electronic device 100 receives the infrared light reflected by the object to obtain image information of the object, at this time, the input/output module 10 is used for infrared supplementary lighting, the light emitting area covered by the infrared light for supplementary lighting, which is emitted by the first infrared light source 12 and the second infrared light source 13 together, is large, and the field angle α of the infrared light for supplementary lighting may be 60 degrees to 90 degrees, for example: the angle of view α of the fill-in infrared light is 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, 90 degrees, or the like. When the second infrared light source 13 is turned off and the first infrared light source 12 emits infrared light to the outside of the package housing 11, the infrared light passes through the light emitting window 1131 and reaches the surface of the object, and the proximity sensor 50 receives the infrared light reflected by the object to detect the distance from the object to the input/output module 10, at this time, the input/output module 10 is used for infrared distance measurement, and the light emitting area covered by the infrared light emitted by the first infrared light source 12 for infrared distance measurement is small, and the field angle β of the infrared light for infrared distance measurement is 10 degrees to 30 degrees, for example: the angle of view β of the infrared light for infrared distance measurement is 10 degrees, 15 degrees, 20 degrees, 25 degrees, 30 degrees, or the like. In the embodiment of the present invention, the angle of field refers to a range covered by the infrared light exiting from the package case 11 through the light emission window 1131. The light sensor 1a receives visible light in the ambient light incident from the light sensing window 1132, and detects the intensity of the visible light.
The input/output module 10 can emit infrared light to the outside of the package housing 11 with different powers when being used for infrared supplementary lighting and being used for approaching infrared distance measurement. The input/output module 10 is configured to emit infrared light to the outside of the package housing 11 with a first power when approaching the infrared distance measurement, and the input/output module 10 is configured to emit infrared light to the outside of the package housing 11 with a second power when compensating for the infrared light, where the first power may be smaller than the second power.
The second infrared light source 13 is disposed around the first infrared light source 12. The first infrared light source 12 and the second infrared light source 13 may be circular, annular, square, regular polygon, or the like as a whole. Can be as follows: the first infrared light sources 12 are point light sources, and the second infrared light sources 13 are also point light sources and are multiple in number; or the first infrared light source 12 is a point light source, and the second infrared light source 13 is an annular light source; or the first infrared light source 12 is a plurality of point light sources surrounding into a ring, and the second infrared light source 13 is a ring light source; or the first infrared light sources 12 are a plurality of point light sources surrounding into a ring, and the second infrared light sources 13 are a plurality of point light sources; or the first infrared light source 12 is a ring light source; the second infrared light sources 13 are point light sources and are multiple in number; or the first infrared light source 12 is a ring light source; the second infrared light source 13 is a ring light source. The proximity sensor 50 and the photo sensor 1a are disposed at one side of the first infrared light source 12 and the second infrared light source 13, that is, the proximity sensor 50 and the photo sensor 1a are disposed outside the space surrounded by the second infrared light source 13.
Referring to fig. 9, in the embodiment of the invention, a ground pin 15, a fill-in light pin 16, a proximity light pin 17, a proximity sensor pin 1g and a light sensing pin 1c are formed on the input/output module 10. The ground pin 15, the fill-in lamp pin 16, the proximity lamp pin 17, the proximity sensor pin 1g, and the light sensing pin 1c may be formed on the package substrate 111, and when the ground pin 15 and the fill-in lamp pin 16 are enabled (i.e., when the ground pin 15 and the fill-in lamp pin 16 are connected to a circuit, the first infrared light source 12 and the second infrared light source 13 emit infrared light; when the ground pin 15 and the proximity lamp pin 17 are enabled (i.e., when the ground pin 15 and the proximity lamp pin 17 access circuit are turned on), the first infrared light source 12 emits infrared light; when the ground pin and the proximity sensor pin 1g are enabled, the proximity sensor 50 receives infrared light reflected by the object and emitted by the first infrared light source 12; when the ground pin 15 and the light sensing pin 1c are enabled (i.e., when the ground pin 15 and the light sensing pin 1c are connected to the circuit, the light sensor 1a detects the intensity of the visible light, which is used as a basis for controlling the display brightness of the display screen 90.
Referring to fig. 1, the housing 20 may be used as a mounting carrier for the input/output module 10, or the input/output module 10 may be disposed in the housing 20. The housing 20 may be a housing of the electronic device 100, in the embodiment of the present invention, the housing 20 may further be used to set the display screen 90 of the electronic device 100, and since the volume occupied by the input/output module 10 according to the embodiment of the present invention is smaller, the volume occupied by the housing 20 to set the display screen 90 may be correspondingly increased, so as to increase the screen occupation ratio of the electronic device 100. Specifically, the housing 20 includes a top 21 and a bottom 22, the display screen 90 and the input/output module 10 are disposed between the top 21 and the bottom 22, the top 21 is located above the bottom 22 in a state that the user uses the electronic device 100 normally, and the input/output module 10 can be disposed between the display screen 90 and the top 21. In other embodiments, the display 90 may be a full screen with a gap, the display 90 surrounds the input/output module 10, and the input/output module 10 is exposed from the gap of the display 90.
The casing 20 is further provided with a casing light source through hole 23, a casing proximity sensor through hole 26 and a casing light sensing through hole 24. When the input/output module 10 is disposed in the housing 20, the first infrared light source 12 and the second infrared light source 13 correspond to the housing light source through hole 23, the proximity sensor 50 corresponds to the housing proximity sensor through hole 26, and the optical sensor 1a corresponds to the housing optical sensor through hole 24. The first infrared light source 12 and the second infrared light source 13 correspond to the chassis light source through hole 23, which means that light emitted by the first infrared light source 12 and the second infrared light source 13 can pass through the chassis light source through hole 23, specifically, the first infrared light source 12 and the second infrared light source 13 are opposite to the chassis light source through hole 23, or the light emitted by the first infrared light source 12 and the second infrared light source 13 passes through the chassis light source through hole 23 after being acted by the light guide element. The light sensor 1a and the case light sensing through hole 24 correspond to each other, and the visible light can pass through the case light sensing through hole 24 and be incident on the light sensor 1a, specifically, the light sensor 1a and the case light sensing through hole 24 are opposite, or the incident light of the visible light passes through the case light sensing through hole 24 and is incident on the light sensor 1a after being acted by the light guide element. The proximity sensor 50 corresponds to the housing proximity sensor through hole 26 for the same reason, and will not be described in detail. The case light through hole 23 and the case light through hole 24 may be spaced apart from each other, but of course, in other embodiments, the case light through hole 23, the case proximity sensor through hole 26 and the case light through hole 24 may be communicated with each other.
The cover plate 30 may be light-transmissive, and the material of the cover plate 30 may be light-transmissive glass, resin, plastic, or the like. The cover plate 30 is disposed on the chassis 20, the cover plate 30 includes an inner surface 32 combined with the chassis 20, and an outer surface 31 opposite to the inner surface 32, and the light emitted by the input/output module 10 sequentially passes through the inner surface 32 and the outer surface 31 and then passes through the cover plate 30. The cover plate 30 covers the case light source through hole 23, the case proximity sensor through hole 26 and the case light sensing through hole 24, the infrared transmission ink 40 is coated on the inner surface 32 of the cover plate 30, and the infrared transmission ink 40 has a high transmittance to infrared light, for example, 85% or more, and a high attenuation to visible light, for example, 70% or more, so that a user can hardly see an area of the electronic device 100 covered by the infrared transmission ink 40 with naked eyes in normal use. Specifically, infrared-transmissive ink 40 may cover areas of inner surface 32 that do not correspond to display 90.
The infrared transmission ink 40 can also shield at least one of the case light source through hole 23 and the case proximity sensor through hole 26, that is, the infrared transmission ink 40 can simultaneously shield the case light source through hole 23 and the case proximity sensor through hole 26, so that a user cannot easily see the internal structure of the electronic device 100 through the case light source through hole 23 and the case proximity sensor through hole 26, and the electronic device 100 has a more beautiful appearance; the IR transmissive ink 40 may also cover the chassis light source through hole 23 and uncover the chassis sensor through hole 26; or the infrared transparent ink may cover the chassis sensor through hole 26 and uncover the chassis light source through hole 23.
Referring to fig. 1, the receiver 70 is used for sending out an acoustic signal when being excited by a power supply, and a user can talk through the receiver 70. The structured light projector 80 is configured to emit structured light outwards, the structured light is reflected after being projected onto the object to be measured, the reflected structured light can be received by the infrared camera 62, and the processor of the electronic device 100 further analyzes the structured light received by the infrared camera 62 to obtain depth information of the object to be measured.
The imaging module 60 comprises a visible light camera 61 and an infrared light camera 62, and the centers of the input and output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70 and the structured light projector 80 are located on the same line segment. Specifically, the input/output module 10, the structured light projector 80, the receiver 70, the infrared camera 62 and the visible light camera 61 are sequentially arranged from one end to the other end of the line segment, and at this time, the visible light camera 61 and the infrared camera 62 can form a double camera; or the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the input/output module 10, the receiver 70, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the visible light camera 61, the receiver 70, the input/output module 10 and the structured light projector 80 are sequentially arranged from one end to the other end of the line segment, and at this time, the visible light camera 61 and the infrared camera 62 can form a double camera. Of course, the arrangement of the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above example, and may be other shapes such as a shape in which the centers of the respective electronic components are arranged in a circular arc shape and a shape in which the centers are arranged in a rectangular shape.
In summary, the electronic device 100 of the embodiment of the invention can be used for proximity infrared distance measurement by only turning on the first infrared light source 12 in cooperation with the proximity sensor 50, and can be used for infrared light supplement by turning on the first infrared light source 12 and the second infrared light source 13, and the optical sensor 1a can also be used for visible light intensity detection, in other words, the first infrared light source 12, the second infrared light source 13, the proximity light sensor 50 and the optical sensor 1a are integrated into a single package structure, so that the input/output module 10 integrates the functions of emitting infrared light for infrared distance measurement, infrared light supplement and visible light intensity detection. In addition, the first infrared light source 12, the second infrared light source 13, the proximity light sensor 50 and the light sensor 1a are integrated into a single package structure, the integration level of the input/output module 10 is high, the size is small, and the space for realizing the functions of infrared light supplement, infrared distance measurement and visible light intensity detection is saved by the input/output module 10. In addition, since the first infrared light source 12, the second infrared light source 13, the proximity light sensor 50 and the light sensor 1a are all supported on the same package substrate 111, compared with the infrared fill light, the proximity infrared light, the proximity light sensor 50 and the light sensor 1a in the conventional process, which need to be manufactured by different wafers respectively and then packaged on a PCB substrate, the package efficiency is improved.
Referring to fig. 5, in some embodiments, the input/output module 10 further includes a light source lens 18, a proximity optical sensor lens 1h and a light sensing lens 1 b. The light source lens 18 is disposed inside the package case 11 and corresponds to the first infrared light source 12 and the second infrared light source 13. The proximity light sensor lens 1h is provided inside the package case 11 and corresponds to the proximity sensor 50. The light-sensing lens 1b is disposed in the package housing 11 and corresponds to the light sensor 1 a. The infrared light emitted by the first infrared light source 12 and the second infrared light source 13 is converged into the light emitting window 1131 under the action of the light source lens 18 to be emitted, so as to reduce the light quantity emitted to other areas of the package sidewall 112 and the package top 113, and it only needs to be satisfied that the field angle α of the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 for light supplement after passing through the light source lens 18 is 60 degrees to 90 degrees, and the field angle β of the infrared light emitted by the first infrared light source 12 for infrared distance measurement after passing through the light source lens 18 is 10 degrees to 30 degrees. Similarly, when infrared light emitted from the proximity infrared lamp 13 reflected by an object entering from the proximity sensor window 1134 is incident on the proximity sensor lens 1h, the proximity sensor lens 1h reduces the amount of light of the reflected infrared light transmitted to the outside of the proximity sensor 50. Similarly, when the visible light entering from the light sensing window 1132 is incident on the light sensing lens 1b, the light sensing lens 1b converges the visible light on the light sensor 1a, so as to reduce the amount of the visible light transmitted to the outside of the light sensor 1 a. Specifically, the light source lens 18, the proximity sensor lens 1h, and the light sensing lens 1b may be located on a transparent substrate, and more specifically, the light source lens 18 and the light sensing lens 1b may be integrally formed with the transparent substrate. Of course, the input/output module 10 may also be provided with only one or more of the light source lens 18, the proximity sensor lens 1h and the light-sensing lens 1 b; alternatively, the input/output module 10 may not include the light source lens 18, the proximity sensor lens 1h, and the photo-sensing lens 1 b.
Referring to fig. 5, in some embodiments, the input/output module 10 further includes a metal shielding plate 1d, and the metal shielding plate 1d is located in the package housing 11 and located between the second infrared light source 13 and the proximity sensor 50 and between the proximity sensor 50 and the optical sensor 1 a. The metal shielding plate 1d is located between the second infrared light source 13 and the optical sensor 1a, and can prevent infrared light emitted by the first infrared light source 12 and the second infrared light source 13 from being incident on the optical sensor 1a, and also can shield electromagnetic interference between the first infrared light source 12 and the optical sensor 1a, between the second infrared light source 13 and the optical sensor 1a, and between the proximity sensor 50 and the optical sensor 1 a.
Referring to fig. 11, in some embodiments, the input-output module 10 further includes an optical enclosure 19. The optical enclosure 19 is made of a light transmissive material, and the optical enclosure 19 is formed on the package substrate 111 and located within the package housing 11. Optical enclosure 19 encloses first infrared light source 12, second infrared light source 13, proximity sensor 50, and light sensor 1 a. Specifically, optical enclosure 19 may be formed by a potting injection molding process, optical enclosure 19 may be made of a transparent thermosetting epoxy to be not easily softened in use, and optical enclosure 19 may fix the relative positions between first infrared light source 12, second infrared light source 13, proximity sensor 50, and light sensor 1a and make first infrared light source 12, second infrared light source 13, proximity sensor 50, and light sensor 1a less prone to rattle within package housing 11.
Referring to fig. 11, in some embodiments, the input/output module 10 further includes a plurality of light-emitting partitions 1e, and the light-emitting partitions 1e are formed in the optical enclosure 19 and located between the second infrared light source 13 and the proximity sensor 50 and between the proximity sensor 50 and the optical sensor 1 a. The light-emitting partition board 1e can block infrared light emitted by the first infrared light source 12 and the second infrared light source 13 from being incident on the proximity sensor 50 and the optical sensor 1a, and simultaneously block visible light entering from the optical sensor window 1132 and emitted to the optical sensor 1a from affecting the light emission of the first infrared light source 12 and the second infrared light source 13 and infrared light reflected by the proximity sensor 50 from being received.
Referring to fig. 12, in some embodiments, the housing 20 further has a housing sound outlet (not shown), the cover 30 further has a cover sound outlet 34, and the receiver 70 corresponds to the positions of the cover sound outlet 34 and the housing sound outlet. The centers of the input/output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the housing 20.
The center of the receiver 70 is not located on the line segment, so that the transverse space occupied by each electronic component (the input/output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover plate 30 is saved. The cover sound outlet 34 is formed at the edge of the cover 30, and the case sound outlet is formed near the top 21.
Referring to fig. 13 to 15, in some embodiments, the cover plate 30 may further have a cover plate light source through hole 33, the cover plate light source through hole 33 corresponds to the case light source through hole 23, and the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 may pass through the case light source through hole 23 and then pass through the electronic device 100 from the cover plate light source through hole 33.
In some embodiments, the cover 30 may further have a cover proximity sensor through hole 37, the cover proximity sensor through hole 37 corresponds to the chassis proximity sensor through hole 26, and infrared light emitted by the first infrared lamp 12 may be reflected by an object, pass through the chassis proximity sensor through hole 26, and then be incident on the proximity sensor 50 from the cover proximity sensor through hole 37. In this case, the infrared transmissive ink 40 may be provided at a position of the cover 30 corresponding to the chassis proximity sensor through hole 26, so that it is difficult for a user to see the proximity sensor 50 inside the electronic device 100 through the chassis proximity sensor through hole 26, and the appearance of the electronic device 100 is beautiful.
In some embodiments, the cover plate 30 may further have a cover plate light sensing through hole 35, the cover plate light sensing through hole 35 corresponds to the case light sensing through hole 24 and the light sensor 1a, and visible light outside the electronic device 100 may pass through the cover plate light sensing through hole 35 and the case light sensing through hole 24 and then be incident on the light sensor 1 a.
In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.
Claims (13)
1. An input/output module is characterized by comprising a packaging shell, a first infrared light source, a second infrared light source, a proximity sensor and a light sensor, wherein the second infrared light source, the proximity sensor and the light sensor are arranged around the first infrared light source; when the first infrared light source and the second infrared light source are both started and emit infrared light to the outside of the packaging shell together with second power, the input and output module is used for infrared supplementary lighting, and the first power is smaller than the second power; the proximity sensor is used for receiving infrared light reflected by an object and emitted by the first infrared light source so as to detect the distance between the object and the input and output module, the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light, the input and output module is used for the electronic device, the electronic device comprises a display screen, the display screen is provided with a notch, the display screen surrounds the input and output module, and the input and output module is exposed from the notch.
2. The input-output module according to claim 1,
the first infrared light sources are point light sources, and the second infrared light sources are multiple point light sources; or
The first infrared light source is a point light source, and the second infrared light source is an annular light source; or
The first infrared light source is a plurality of point light sources which surround into a ring, and the second infrared light source is a ring light source; or
The first infrared light sources are a plurality of point light sources which surround into a ring, and the second infrared light sources are a plurality of point light sources; or
The first infrared light source is an annular light source; the second infrared light sources are point light sources and are multiple in number; or
The first infrared light source is an annular light source; the second infrared light source is an annular light source.
3. The input-output module of claim 1, further comprising a chip, wherein the first infrared light source, the second infrared light source, the proximity sensor, and the light sensor are formed on one piece of the chip.
4. The input-output module according to claim 3, wherein the package housing further comprises a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, the package top is formed with a light-emitting window, a proximity sensor window and a light-sensing window, the light-emitting window corresponds to the first infrared light source and the second infrared light source, the proximity sensor window corresponds to the proximity sensor, and the light-sensing window corresponds to the light sensor.
5. The input-output module according to claim 3, further comprising a light source lens disposed within the package housing and corresponding to the first infrared light source and the second infrared light source; and/or
The input and output module further comprises a proximity sensor lens, and the proximity sensor lens is arranged in the packaging shell and corresponds to the proximity sensor; and/or
The input and output module further comprises a light-sensitive lens, and the light-sensitive lens is arranged in the packaging shell and corresponds to the light sensor.
6. The input-output module of claim 3, further comprising a light source lens, a proximity sensor lens and a light sense lens disposed in the package housing, wherein the light source lens corresponds to the first infrared light source and the second infrared light source, the proximity sensor lens corresponds to the proximity sensor, the light sense lens corresponds to the light sense device, and the light source lens, the proximity sensor lens and the light sense lens are disposed on a same transparent substrate.
7. The input-output module of claim 1, further comprising a plurality of metal shielding plates positioned within the package housing and between any two of the second infrared light source, the proximity sensor, and the light sensor.
8. The input-output module according to claim 1, further comprising an optical enclosure made of a light transmissive material formed on the package substrate and located within the package housing, the optical enclosure enclosing the first infrared light source, the second infrared light source, the proximity sensor, and the light sensor.
9. The input-output module according to claim 8, further comprising a plurality of light-exiting baffles formed within the optical enclosure between any two of the second infrared light source, the proximity sensor, and the light sensor.
10. The input-output module according to any one of claims 1 to 9, wherein a ground pin, a fill light pin, a proximity sensor pin, and a light sensing pin are formed on the input-output module, and when the ground pin and the proximity light pin are enabled, the first infrared light source emits infrared light; when the grounding pin and the light supplement lamp pin are enabled, the first infrared light source and the second infrared light source emit infrared light; when the grounding pin and the proximity sensor pin are enabled, the proximity sensor receives infrared light rays emitted by the first infrared light source and reflected by an object; when the grounding pin and the light sensing pin are enabled, the light sensor receives visible light in the environment.
11. An electronic device, comprising:
a housing; and
the input-output module of any one of claims 1 to 10, disposed within the housing.
12. The electronic device of claim 11, further comprising a transparent cover plate, wherein the housing defines a housing light source through hole, a housing proximity sensor through hole, and a housing light sensor through hole, the first infrared light source and the second infrared light source correspond to the housing light source through hole, the proximity sensor corresponds to the housing proximity sensor through hole, the light sensor corresponds to the housing light sensor through hole, and the cover plate is disposed on the housing.
13. The electronic device of claim 11, further comprising a transparent cover plate, wherein the housing defines a housing light source through hole, a housing proximity sensor through hole, and a housing light sensation through hole, the first infrared light source and the second infrared light source correspond to the housing light source through hole, the proximity sensor corresponds to the housing proximity sensor through hole, the light sensor corresponds to the housing light sensation through hole, the cover plate is disposed on the housing, an infrared transmissive ink that only transmits infrared light is formed on a surface of the cover plate that is coupled to the housing, and the infrared transmissive ink shields at least one of the housing light source through hole and the housing proximity sensor through hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201711437124.6A CN108023984B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
| PCT/CN2018/117920 WO2019128605A1 (en) | 2017-12-26 | 2018-11-28 | Output module, input and output module and electronic apparatus |
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| CN201711437124.6A CN108023984B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
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| CN108023984B true CN108023984B (en) | 2020-09-25 |
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| WO2019128605A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic apparatus |
| CN108701233A (en) * | 2018-05-16 | 2018-10-23 | 深圳阜时科技有限公司 | A kind of light source module group, image acquiring device, identity recognition device and electronic equipment |
| CN110290330B (en) * | 2019-06-26 | 2022-03-29 | Oppo广东移动通信有限公司 | Control method, electronic device, and storage medium |
| CN114234817A (en) * | 2021-12-16 | 2022-03-25 | 昆山乔格里光电科技有限公司 | Ambient light and distance sensor and packaging method thereof |
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| CN107463877A (en) * | 2017-07-05 | 2017-12-12 | 广东欧珀移动通信有限公司 | Method for collecting iris, electronic installation and computer-readable recording medium |
| CN107480659A (en) * | 2017-09-21 | 2017-12-15 | 深圳普创天信科技发展有限公司 | A kind of iris identification device and terminal |
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| CN103515371B (en) * | 2012-06-27 | 2016-09-21 | 格科微电子（上海）有限公司 | Integrated-type optical sensor package |
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| CN107463877A (en) * | 2017-07-05 | 2017-12-12 | 广东欧珀移动通信有限公司 | Method for collecting iris, electronic installation and computer-readable recording medium |
| CN107480659A (en) * | 2017-09-21 | 2017-12-15 | 深圳普创天信科技发展有限公司 | A kind of iris identification device and terminal |
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