CN108012004B

CN108012004B - Electronic device

Info

Publication number: CN108012004B
Application number: CN201711433082.9A
Authority: CN
Inventors: 吴安平
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-12-26
Filing date: 2017-12-26
Publication date: 2020-05-08
Anticipated expiration: 2037-12-26
Also published as: CN108012004A

Abstract

The electronic device disclosed by the invention comprises a shell, an input/output module, a vibration module and a piezoelectric element. The input/output module is arranged in the shell and comprises a packaging shell, an infrared light supplement lamp, a proximity infrared lamp, a proximity sensor and a light sensor. The packaging shell comprises a packaging substrate, and the infrared light supplementing lamp, the proximity infrared lamp and the light sensor are packaged in the packaging shell and are borne by the packaging substrate. The infrared light supplementing lamp and the proximity infrared lamp can emit infrared light rays with different powers, the proximity sensor is used for receiving reflected infrared light to conduct infrared distance measurement, and the light sensor is used for receiving visible light detection light intensity. The vibration module is installed on the casing, and piezoelectric element combines and with the input/output module interval with the vibration module, and piezoelectric element takes place deformation so that the vibration module vibrates when being exerted the electrical signal. The integration level of input/output module is higher, and the volume is less, and electron device adopts piezoelectric element and vibration module to realize bone conduction transaudient, can effectively guarantee the privacy of conversation content.

Description

Electronic device

Technical Field

The present invention relates to the field of consumer electronics, and more particularly, to an electronic device.

Background

Along with the functions supported by the mobile phone are more and more abundant and various, the types and the number of functional devices required to be set by the mobile phone are more and more, in order to realize the functions of distance detection, ambient light detection, facial 3D feature recognition of a user and the like, functional devices such as a light sensor, an ambient light sensor, an infrared camera, a structured light projector and the like need to be configured in the electronic equipment, and in order to arrange a plurality of functional devices, the mobile phone occupies too much space.

Disclosure of Invention

The embodiment of the invention provides an electronic device.

An electronic device according to an embodiment of the present invention includes:

a housing;

the input and output module is arranged in the shell and comprises a packaging shell, an infrared light supplementing lamp, a proximity infrared lamp, a proximity sensor and a light sensor, wherein the packaging shell comprises a packaging substrate, the infrared light supplementing lamp, the proximity infrared lamp, the proximity sensor and the light sensor are packaged in the packaging shell and are borne on the packaging substrate, the infrared light supplementing lamp and the proximity infrared lamp can emit infrared light to the outside of the packaging shell at different powers, the proximity sensor is used for receiving the infrared light emitted by the proximity infrared lamp and reflected by an object so as to detect the distance from the object to the electronic device, and the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light;

the vibration module is arranged on the shell; and

the piezoelectric element is combined with the vibration module and is spaced from the input and output module, and the piezoelectric element is used for deforming when an electric signal is applied to the piezoelectric element so as to enable the vibration module to vibrate.

In some embodiments, the vibration module includes a display screen and a transparent cover plate, the display screen is disposed on the housing and forms an accommodating cavity together with the housing, the cover plate is disposed on the housing and located on a side of the display screen away from the accommodating cavity, the display screen is combined with the cover plate, the housing is provided with a housing approach through hole, a housing light supplement through hole, a housing approach sensor through hole, a housing light sensation through hole, and a housing vibration through hole which are spaced from each other, the approach infrared lamp corresponds to the housing approach through hole, the infrared light supplement lamp corresponds to the housing light supplement through hole, the light sensor corresponds to the housing light sensation through hole, and the piezoelectric element is accommodated in the housing vibration through hole and combined with the cover plate.

In some embodiments, the piezoelectric element and the display screen are attached to the cover plate by a joint.

In some embodiments, the input/output module further includes a chip, and the infrared fill-in light, the proximity infrared light, the proximity sensor, and the light sensor are all formed on one chip.

In some embodiments, the package housing further includes a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, the package top is formed with a light filling window, a proximity lamp window, a proximity sensor window, and a light sensing window, the light filling window corresponds to the infrared light filling lamp, the proximity lamp window corresponds to the proximity infrared lamp, the proximity sensor window corresponds to the proximity sensor, and the light sensing window corresponds to the light sensor.

In some embodiments, the input/output module further includes a light supplement lamp lens, and the light supplement lamp lens is disposed in the package housing and corresponds to the infrared light supplement lamp; and/or

The input and output module also comprises a proximity lamp lens which is arranged in the packaging shell and corresponds to the proximity infrared lamp; and/or

The input and output module further comprises a proximity sensor lens, and the proximity sensor lens is arranged in the packaging shell and corresponds to the proximity sensor; and/or

The input and output module further comprises a light-sensitive lens, and the light-sensitive lens is arranged in the packaging shell and corresponds to the light sensor.

In some embodiments, the input/output module further includes a light supplement lamp lens, a proximity sensor lens, and a light sensing lens, which are disposed in the package housing, wherein the light supplement lamp lens corresponds to the infrared light supplement lamp, the proximity lamp lens corresponds to the proximity infrared lamp, the proximity sensor lens corresponds to the proximity sensor, the light sensing lens corresponds to the light sensor, and the light supplement lamp lens, the proximity sensor lens, and the light sensing lens are disposed on the same transparent substrate.

In some embodiments, the input/output module further includes a plurality of metal shielding plates, and the plurality of metal shielding plates are respectively located in the package housing and between any two of the infrared fill light, the proximity infrared light, the proximity sensor, and the optical sensor.

In some embodiments, the input/output module further includes an optical enclosure made of a light-transmitting material, the optical enclosure is formed on the package substrate and located in the package housing, and the optical enclosure encloses the infrared fill light, the proximity infrared light, the proximity sensor, and the light sensor.

In some embodiments, the input/output module further includes a plurality of light-emitting partition plates, and the light-emitting partition plates are respectively formed in the optical enclosure and located between any two of the infrared fill light, the proximity infrared light, the proximity sensor, and the optical sensor.

In some embodiments, a ground pin, a fill-in light pin, a proximity sensor pin, and a light sensing pin are formed on the input/output module, and when the ground pin and the fill-in light pin are enabled, the infrared fill-in light emits infrared light; when the grounding pin and the proximity lamp pin are enabled, the proximity infrared lamp emits infrared light; when the grounding pin and the proximity sensor pin are enabled, the proximity sensor receives infrared light rays reflected by an object and emitted by the proximity infrared lamp; when the grounding pin and the light sensing pin are enabled, the light sensor detects the intensity of visible light.

In some embodiments, an infrared transparent ink which only transmits infrared light is formed on a surface of the cover plate, which is combined with the casing, and the infrared transparent ink blocks at least one of the casing access through hole, the casing light supplement through hole, the casing proximity sensor through hole, and the casing vibration through hole.

In some embodiments, the electronic device further includes an infrared camera, a visible light camera, and a structured light projector, centers of the input/output module, the infrared camera, the visible light camera, and the structured light projector are located on a same line segment, and the piezoelectric element is located between the line segment and the top of the housing.

In some embodiments, the electronic device further includes an infrared camera, a visible light camera, and a structured light projector, the number of the piezoelectric elements is plural, the number of the casing vibration through holes is plural, the plural piezoelectric elements correspond to the plural casing vibration through holes, each piezoelectric element is accommodated in the corresponding casing vibration through hole, centers of the input/output module, the infrared camera, the visible light camera, the plural piezoelectric elements, and the structured light projector are located on the same line segment, and at least one of the input/output module, the infrared camera, the visible light camera, and the structured light projector is disposed between two adjacent piezoelectric elements.

In some embodiments, the electronic device further includes an infrared camera, a visible light camera, and a structured light projector, the piezoelectric element includes a piezoelectric body and a plurality of piezoelectric bumps extending from the piezoelectric body, the number of the casing vibration through holes is multiple, the plurality of piezoelectric bumps correspond to the plurality of casing vibration through holes, each of the piezoelectric bumps is partially received in the corresponding casing vibration through hole and is combined with the cover plate, the input/output module, the infrared camera, the visible light camera, and the structured light projector are located between the cover plate and the piezoelectric body, the centers of the input/output module, the infrared camera, the visible light camera, the plurality of piezoelectric bumps, and the structured light projector are located on the same line segment, and the input/output module, the visible light camera, the plurality of piezoelectric bumps, and the structured light projector are located between two adjacent piezoelectric bumps, At least one of the infrared camera, the visible light camera, and the structured light projector.

In the electronic device of the embodiment of the invention, the input/output module integrates the infrared light supplement lamp, the proximity infrared lamp, the proximity sensor and the light sensor into a single packaging body structure, and integrates the functions of transmitting infrared light for infrared distance measurement, infrared light supplement and visible light intensity detection, so that the input/output module has higher integration level and smaller volume, and saves space for realizing the functions of infrared light supplement, infrared distance measurement and visible light intensity detection. In addition, because infrared light filling lamp, the proximity infrared lamp, the proximity sensor and the light sensor are borne on the same packaging substrate, compared with the infrared light filling lamp, the proximity infrared lamp, the proximity sensor and the light sensor in the traditional process, different wafers are required to be manufactured respectively and then combined on the PCB substrate for packaging, and the packaging efficiency is improved. Furthermore, the electronic device adopts the piezoelectric element and the vibration module to realize bone conduction sound transmission, replaces the traditional telephone receiver structure which is used for transmitting sound through air, effectively ensures the privacy of conversation content on the one hand, and on the other hand, because the original telephone receiver is cancelled, the through hole which corresponds to the telephone receiver is avoided being arranged on the cover plate, the process is simpler, and the appearance is more attractive.

Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

fig. 2 is a schematic perspective view of an input/output module of an electronic device according to an embodiment of the invention;

FIG. 3 is a schematic cross-sectional view illustrating an input/output module of an electronic device according to an embodiment of the invention;

FIG. 4 is a schematic perspective view of an input/output module of an electronic device according to an embodiment of the invention;

FIG. 5 is a schematic cross-sectional view of the electronic device of FIG. 1 taken along line V-V;

FIG. 6 is a schematic partial cross-sectional view of the electronic device of FIG. 1 taken along line VI-VI;

FIG. 7 is a schematic structural diagram of an electronic device according to some embodiments of the invention;

FIG. 8 is a schematic partial cross-sectional view of the electronic device of FIG. 7 taken along line VIII-VIII;

FIG. 9 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the invention;

fig. 10-13 are schematic partial cross-sectional views of electronic devices according to some embodiments of the invention.

Detailed Description

The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, an electronic device 100 according to an embodiment of the invention includes a housing 20, a cover 30, and electronic components. The electronic component includes an input-output module 10, a vibration module 30a, a piezoelectric element 70, an imaging module 60, and a structured light projector 80. The electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, an intelligent watch, an intelligent bracelet, a teller machine, and the like, and the embodiment of the invention is described by taking the electronic device 100 as a mobile phone, it is understood that the specific form of the electronic device 100 may be other, and is not limited herein.

Referring to fig. 2 and 3, the input/output module 10 is a single package structure, and includes a package housing 11, an infrared fill-in light 12, a proximity infrared light 13, a proximity sensor 50, and a light sensor 1 d.

The packaging shell 11 is used for simultaneously packaging the infrared light supplement lamp 12, the proximity infrared lamp 13, the proximity sensor 50 and the light sensor 1d, or the infrared light supplement lamp 12, the proximity infrared lamp 13, the proximity sensor and the light sensor 1d are simultaneously packaged in the packaging shell 11. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an Electromagnetic Interference (EMI) shielding material to prevent external EMI from affecting the input/output module 10. In the present embodiment, the centers of the infrared fill-in light 12, the proximity infrared light 13, the proximity sensor 50, and the photosensor 1d are located on the same line segment, for example: an infrared light supplement lamp 12, a proximity infrared lamp 13, a proximity sensor 50 and a light sensor 1d are sequentially arranged from one end to the other end of the line segment; or, a proximity infrared lamp 13, a proximity sensor 50, an infrared light supplement lamp 12 and a light sensor 1d are sequentially arranged from one end to the other end of the line segment; or, the proximity infrared lamp 13, the proximity sensor 50, the light sensor 1d and the infrared supplementary lighting lamp 12 are sequentially arranged from one end to the other end of the line segment. In other embodiments, the connection line between the infrared fill light 12, the near infrared light 13 and the light sensor 1d is triangular.

The package substrate 111 is used for carrying the infrared fill light 12, the proximity infrared light 13, the proximity sensor 50, and the optical sensor 1 d. When the input/output module 10 is manufactured, the infrared light supplement lamp 12, the proximity infrared lamp 13, the proximity sensor 50, and the photo sensor 1d may be formed on one chip 14, and then the infrared light supplement lamp 12, the proximity infrared lamp 13, the proximity sensor 50, the photo sensor 1d, and the chip 14 are together disposed on the package substrate 111, and specifically, the chip 14 may be bonded on the package substrate 111. Meanwhile, the package substrate 111 may also be used to connect with other components of the electronic device 100 (e.g., the housing 20 and the motherboard of the electronic device 100) to fix the input/output module 10 in the electronic device 100.

The packaging side wall 112 can surround the infrared light supplement lamp 12, the proximity infrared lamp 13, the proximity sensor 50 and the light sensor 1d, the packaging side wall 112 extends from the packaging substrate 111, the packaging side wall 112 can be combined with the packaging substrate 111, and preferably, the packaging side wall 112 and the packaging substrate 111 are detachably connected, so that the infrared light supplement lamp 12, the proximity infrared lamp 13, the proximity sensor 50 and the light sensor 1d can be conveniently overhauled after the packaging side wall 112 is taken down. The package sidewall 112 may be made of a material opaque to infrared light to prevent infrared light emitted from the infrared fill light 12 or the near infrared light 13 from passing through the package sidewall 112.

The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. A light supplement window 1131, a proximity lamp window 1132, a proximity sensor window 1134 and a light sensation window 1133 are formed in the package top 113, the light supplement window 1131 corresponds to the infrared light supplement lamp 12, and infrared light emitted by the infrared light supplement lamp 12 passes through the light supplement window 1131; the proximity lamp window 1132 corresponds to the proximity infrared lamp 13, and infrared light emitted by the proximity infrared lamp 13 penetrates out of the proximity window 1132; the proximity sensor window 1134 corresponds to the proximity sensor 50, and infrared light emitted by the proximity infrared lamp 13 can pass through the proximity sensor window 1134 after being reflected by an object and be incident on the proximity sensor 50; the light sensing window 1133 corresponds to the light sensor 1d, and the visible light can pass through the light sensing window 1133 and be incident on the light sensor 1 d. The package top 113 and the package side wall 112 may be formed integrally or separately. In one example, the fill light window 1131, the proximity lamp window 1132, the proximity sensor window 1134, and the light sensing window 1133 are all through holes, and the package top 113 is made of a material opaque to infrared light and visible light. In another example, the package top 113 is fabricated from an infrared opaque material, a visible opaque material, and in particular, the proximity lamp window 1132 and the proximity sensor window 1134 are fabricated from an infrared opaque material, the light sensing window 1133 is fabricated from a visible opaque material, and the remainder is fabricated from an infrared opaque and visible opaque material. Further, the fill light window 1131 and the proximity lamp window 1132 may be formed with lens structures to improve an emission angle of the infrared light emitted from the fill light window 1131 and the proximity lamp window 1132, for example, the fill light window 1131 is formed with a concave lens structure to diffuse the light passing through the fill light window 1131 to be emitted outward; the proximity window 1132 is formed with a convex lens structure, so that light passing through the proximity window 1132 is gathered and emitted outwards; the light sensing window 1133 may also be formed with a lens structure to improve the visible light emitting angle incident from the light sensing window 1133, for example, the light sensing window 1133 has a convex lens structure to gather and project the light incident from the light sensing window 1133 onto the light sensor 1 d.

The infrared light supplement lamp 12, the proximity infrared lamp 13, the proximity sensor 50 and the light sensor 1d can be formed on one chip 14, the size of the integrated infrared light supplement lamp 12, the proximity infrared lamp 13, the proximity sensor 50 and the light sensor 1d is further reduced, and the preparation process is simple. The infrared fill light 12 can emit infrared light, the infrared light passes through the fill light window 1131 to project onto the surface of the object, and the infrared camera 62 of the electronic device 100 receives the infrared light reflected by the object to obtain image information of the object (at this time, the infrared fill light 12 is used for infrared fill light). The proximity infrared lamp 13 may emit infrared light, the infrared light passes through the proximity lamp window 1132 and reaches the surface of the object, and the proximity sensor 50 receives the infrared light reflected by the object to detect the distance from the object to the input-output module 10 (at this time, the proximity infrared lamp 13 is used for infrared ranging). The light sensor 1d receives visible light in the ambient light incident from the light sensing window 1133, and detects the intensity of the visible light.

The infrared light supplementing lamp 12 and the near infrared lamp 13 can emit infrared light to the outside of the packaging shell 11 at different powers, specifically, the infrared light supplementing lamp 12 and the near infrared lamp 13 can emit infrared light simultaneously, and the input and output module 10 is used for infrared light supplementing and infrared distance measurement simultaneously; the infrared light supplement lamp 12 can emit light rays and does not emit light rays close to the infrared lamp 13, and the input and output module 10 is only used for infrared light supplement; or the infrared light supplement lamp 12 does not emit light and is close to the infrared lamp 13 to emit light, and the input and output module 10 is only used for infrared distance measurement.

Referring to fig. 4, in the embodiment of the invention, a ground pin 15, a fill-in light pin 16, a proximity light pin 17, a proximity sensor pin 1g, and a light sensing pin 1f are formed on the input/output module 10. The ground pin 15, the fill-in light pin 16, the proximity light pin 17, the proximity sensor pin 1g, and the light sensing pin 1f may be formed on the package substrate 111, and when the ground pin 15 and the fill-in light pin 16 are enabled (i.e., when the access circuits of the ground pin 15 and the fill-in light pin 16 are turned on), the infrared fill-in light 12 emits infrared light; when the ground pin 15 and the proximity lamp pin 17 are enabled (i.e., when the ground pin 15 and the proximity lamp pin 17 access circuit are on), the proximity infrared lamp 13 emits infrared light; when the ground pin and the proximity sensor pin 1g are enabled, the proximity sensor 50 receives infrared light reflected by the object and emitted by the proximity infrared lamp 13; when the ground pin 15 and the light sensing pin 1f are enabled (i.e., when the ground pin 15 and the light sensing pin 1f are connected to the circuit, the light sensor 1d detects the intensity of the visible light, which is used as a basis for controlling the display brightness of the display screen 90.

Referring to fig. 1 and 5, the housing 20 may serve as a mounting carrier for the input/output module 10, or the input/output module 10 may be disposed in the housing 20. The chassis 20 may be a housing of the electronic device 100. Specifically, the casing 20 includes a top 21 and a bottom 22, and at a position corresponding to the electronic component, the casing 20 is provided with a casing proximity lamp through hole 23, a casing proximity sensor through hole 26, a casing light supplement through hole 24, a casing light sensation through hole 2f, and a casing vibration through hole 2a, which are spaced from each other. When the input/output module 10 is disposed in the housing 20, the proximity infrared lamp 13 corresponds to the housing proximity through hole 23, the proximity sensor 50 corresponds to the housing proximity sensor through hole 26, the infrared light supplement lamp 12 corresponds to the housing light supplement through hole 24, and the light sensor 1d corresponds to the housing light supplement through hole 2 f. The light emitted by the near infrared lamp 13 corresponding to the case near through hole 23 can pass through the case near through hole 23, specifically, the near infrared lamp 13 is opposite to the case near through hole 23, or the light emitted by the near infrared lamp 13 passes through the case near through hole 23 after being acted by the light guide element. The infrared light supplement lamp 12 corresponds to the chassis light supplement through hole 24, and the description thereof is omitted. The light sensor 1d and the case light sensing through hole 2f correspond to each other, and the visible light can pass through the case light sensing through hole 2f and be incident on the light sensor 1d, specifically, the light sensor 1d is opposite to the case light sensing through hole 2f, or the incident light of the visible light passes through the case light sensing through hole 2f and is incident on the light sensor 1d after the light guide element acts on the light sensor. The proximity sensor 50 corresponds to the housing proximity sensor through hole 26 for the same reason, and will not be described in detail. The enclosure proximity through hole 23, the enclosure proximity sensor through hole 26, the enclosure light supplement through hole 24, and the enclosure light sensing through hole 2f may be spaced from each other, and of course, in other embodiments, the enclosure proximity through hole 23, the enclosure proximity sensor through hole 26, the enclosure light supplement through hole 24, and the enclosure light sensing through hole 2f may also be communicated with each other.

The vibration module 30a is mounted on the cabinet 20. The vibration module 30a may include a display screen 90 and a cover plate 30, or the display screen 90 and the cover plate 30 are combined to form the vibration module 30a, so as to improve the rigidity of the vibration module 30 a. The display screen 90 is disposed on the housing 20 and forms a receiving cavity 91 with the housing 20, and the cover plate 30 is disposed on the housing 20 and located on a side of the display screen 90 away from the receiving cavity 91 to protect the display screen 90. Since the input/output module 10 according to the embodiment of the invention can occupy a smaller volume, the volume for disposing the display screen 90 in the housing 20 can be correspondingly increased, so as to increase the screen occupation ratio of the electronic device 100. Specifically, the display screen 90, the input/output module 10 and the piezoelectric element 70 are disposed between the top portion 21 and the bottom portion 22, the top portion 21 is located above the bottom portion 22 in a state where the user normally uses the electronic device 100, and the input/output module 10 may be disposed between the display screen 90 and the top portion 21. In other embodiments, the display 90 may be a full screen with a gap, the display 90 surrounds the input/output module 10, and the input/output module 10 is exposed from the gap of the display 90.

The piezoelectric element 70 is made of a ceramic or quartz crystal material, and the piezoelectric element 70 may be a single wafer, a twin wafer, or a laminated piezoelectric element 70. The piezoelectric element 70 is coupled to the vibration module 30a and spaced apart from the input-output module 10. Specifically, the piezoelectric element 70 is accommodated in the casing vibration through hole 2a, is coupled to the cover plate 30, and is spaced apart from the casing 20, and may be: the piezoelectric element 70 is partially accommodated in the chassis vibration through hole 2a, or the piezoelectric element 70 is entirely accommodated in the chassis vibration through hole 2 a. When an electric signal (voltage) is applied to both ends of the piezoelectric element 70, the piezoelectric element 70 is mechanically deformed, for example, expanded or contracted, due to the inverse piezoelectric effect, thereby causing the vibration module 30a coupled to the piezoelectric element 70 to vibrate according to the frequency of the electric signal. When the user's body is in contact with the vibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with the vibration module 30a (e.g., cartilage of the outer ear, teeth). In this way, the user can realize the functions of voice call, listening to music, etc. through the piezoelectric element 70 and the vibration module 30 a. In an embodiment of the present invention, the processor of the electronic device 100 is configured to acquire a sound signal and apply an electrical signal corresponding to the sound signal to the two ends of the piezoelectric element 70.

It can be understood that the traditional receiver structure adopts air conduction sound, the local sound pressure of the receiver is usually about 90 dB-100 dB when the receiver works, and the sound is still about 50 dB-60 dB even if the sound is transmitted to the range of 1 meter around in the quiet surrounding environment (such as in the general office environment of about 50 dB), which causes the conversation content among the callers to be perceived around, resulting in privacy leakage. The electronic device 100 according to the embodiment of the invention adopts the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, and the sound of the call is mainly sensed by the bone conduction of the vibration and can effectively ensure the privacy of the call content.

Referring again to fig. 5 and 6, the piezoelectric element 70 and the display screen 90 are attached to the cover plate 30 by the joint 30 b. The bonding member 30b is an adhesive, a double-sided tape, an adhesive tape, or the like having a thermosetting property and an ultraviolet curing property. For example, the joining member 30b may be an optically elastic resin (a colorless and transparent ultraviolet-curing acrylic adhesive). The area of the cover 30 bonded to the piezoelectric element 70 is spaced apart from the area of the cover 30 bonded to the display screen 90 to prevent the display of the display screen 90 from being interfered with by the piezoelectric element 70. Of course, the cover 30 can also be coupled to the housing 20 by the coupling member 30b, so that compared with the case where the cover 30 is directly disposed on the housing 20, the vibration of the vibration module 30a can be prevented from being directly transmitted to the housing 20, thereby reducing the possibility that the user may drop the electronic device 100 due to the excessive vibration amplitude of the housing 20.

The cover plate 30 may be light-transmissive, and the material of the cover plate 30 may be light-transmissive glass, resin, plastic, or the like. The cover plate 30 is disposed on the chassis 20, the cover plate 30 includes an inner surface 32 combined with the chassis 20, and an outer surface 31 opposite to the inner surface 32, and the light emitted by the input/output module 10 sequentially passes through the inner surface 32 and the outer surface 31 and then passes through the cover plate 30. The cover plate 30 covers the chassis light filling through hole 24, the chassis approach through hole 23, the chassis light sensing through hole 2f, and the chassis vibration through hole 2a, the inner surface 32 of the cover plate 30 is coated with the infrared transmission ink 40, and the infrared transmission ink 40 has a high transmittance to infrared light, for example, 85% or more, and a high attenuation to visible light, for example, 70% or more, so that a user can hardly see an area covered by the infrared transmission ink 40 on the electronic device 100 with naked eyes in normal use. Specifically, infrared-transmissive ink 40 may cover areas of inner surface 32 that do not correspond to display 90.

The infrared transmission ink 40 can further shield at least one of the case access through hole 23, the case access sensor through hole 26, the case light supplement through hole 24 and the case vibration through hole 2a, that is, the infrared transmission ink 40 can simultaneously cover the case access lamp through hole 23, the case access sensor through hole 26, the case light supplement through hole 24 and the case vibration through hole 2a, a user cannot easily see the internal structure of the electronic device 100 through the case access lamp through hole 23, the case access sensor through hole 26, the case light supplement through hole 24 and the case vibration through hole 2a, and the electronic device 100 is attractive in appearance; the ir pass-through ink 40 may also cover one or more of the chassis access through-hole 23, the chassis fill light through-hole 24, the chassis proximity sensor through-hole 26, or the chassis vibration through-hole 2a, while leaving one or more through-holes uncovered.

Referring to fig. 1, the structured light projector 80 is configured to emit structured light to the outside, the structured light is reflected after being projected onto the object to be measured, the reflected structured light can be received by the infrared camera 62, and the processor of the electronic device 100 further analyzes the structured light received by the infrared camera 62 to obtain the depth information of the object to be measured.

The imaging module 60 comprises a visible light camera 61 and an infrared light camera 62, and the centers of the input and output module 10, the infrared light camera 62, the visible light camera 61, the piezoelectric element 70 and the structured light projector 80 are located on the same line segment. Specifically, the input/output module 10, the structured light projector 80, the piezoelectric element 70, the infrared camera 62 and the visible light camera 61 are sequentially arranged from one end to the other end of the line segment, and at this time, the visible light camera 61 and the infrared camera 62 can form a double camera; or the input/output module 10, the infrared camera 62, the piezoelectric element 70, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the input/output module 10, the piezoelectric element 70, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the visible light camera 61, the piezoelectric element 70, the input/output module 10 and the structured light projector 80 are sequentially arranged from one end to the other end of the line segment, and at the moment, the visible light camera 61 and the infrared camera 62 can form a double-camera. Of course, the arrangement of the input/output module 10, the infrared camera 62, the piezoelectric element 70, the visible light camera 61, and the structured light projector 80 is not limited to the above example, and may be other shapes such as a shape in which the centers of the respective electronic components are arranged in a circular arc shape and a shape in which the centers are arranged in a rectangular shape.

Referring to fig. 9, the imaging module 60 includes a visible light camera 61 and an infrared camera 62. The centers of the input-output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 are located on the same line segment, and the piezoelectric element 70 is located between the line segment and the top 21 of the housing 20. Specifically, the input/output module 10, the structured light projector 80, the infrared camera 62 and the visible light camera 61 are sequentially arranged from one end to the other end of the line segment; or the input/output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 are arranged from one end to the other end of the line segment in sequence; or the infrared camera 62, the input and output module 10, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the visible light camera 61, the input/output module 10 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment. Of course, the arrangement of the input/output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 is not limited to the above example. In the embodiment of the present invention, the center of the piezoelectric element 70 is not located on the line segment, so that the lateral space occupied by the electronic components (the input/output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover plate 30 is saved.

In summary, in the electronic device 100 according to the embodiment of the invention, the input/output module 10 integrates the infrared light supplement lamp 12, the proximity infrared lamp 13, the proximity sensor 50 and the optical sensor 1d into a single package structure, and integrates the infrared distance measurement function of emitting infrared light, the infrared light supplement function and the visible light intensity detection function, so that the input/output module 10 has a higher integration level and a smaller volume, and the input/output module 10 saves space for realizing the infrared light supplement, the infrared distance measurement and the visible light intensity detection functions. In addition, since the infrared light supplement lamp 12, the proximity infrared lamp 13, the proximity sensor 50 and the light sensor 1d are supported on the same package substrate 111, compared with the conventional process that the infrared light supplement lamp 12, the proximity infrared lamp 13, the proximity sensor 50 and the light sensor 1d need to be manufactured by different wafers respectively and then packaged on a PCB substrate, the packaging efficiency is improved. Moreover, the electronic device 100 adopts the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, and replaces the traditional receiver structure which conducts sound through air, so that on one hand, the privacy of the conversation content can be effectively ensured; on the other hand, the original telephone receiver is eliminated, so that a through hole corresponding to the telephone receiver is not formed in the cover plate 30, the process is simpler, the appearance is more attractive, and dust or moisture can be prevented from entering the electronic device 100.

Referring to fig. 6 and 10, in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared camera 62. The casing 20 is provided with a casing approach through hole 23, a casing approach sensor through hole 26, a casing light supplement through hole 24, a casing light sensation through hole 2f, and a casing vibration through hole 2a, which are spaced from each other. The proximity infrared lamp 13 corresponds to the case proximity through hole 23, the proximity sensor 50 corresponds to the case proximity sensor through hole 26, the infrared light supplement lamp 12 corresponds to the case light supplement through hole 24, and the light sensor 1d corresponds to the case light sense through hole 2 f. The number of the piezoelectric elements 70 is plural, the number of the chassis vibration through holes 2a is plural, the plural piezoelectric elements 70 correspond to the plural chassis vibration through holes 2a, and each piezoelectric element 70 is accommodated in the corresponding chassis vibration through hole 2 a. The centers of the input and output module 10, the infrared camera 62, the visible light camera 61, the plurality of piezoelectric elements 70 and the structured light projector 80 are located on the same line segment, and at least one of the input and output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 is arranged between two adjacent piezoelectric elements 70. For example, the number of the piezoelectric elements 70 is two, and the piezoelectric elements 70, the input/output module 10, the structured light projector 80, the infrared camera 62, the visible light camera 61, and the piezoelectric elements 70 are arranged in sequence from one end to the other end of the line segment; or the piezoelectric element 70, the input/output module 10, the infrared camera 62, the visible light camera 61, the piezoelectric element 70, the structured light projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of the piezoelectric elements 70 is three, and the piezoelectric elements 70, the input/output module 10, the structured light projector 80, the piezoelectric elements 70, the infrared camera 62, the visible light camera 61, and the piezoelectric elements 70 are arranged in this order from one end to the other end of the line segment; or the piezoelectric element 70, the input/output module 10, the piezoelectric element 70, the infrared camera 62, the visible light camera 61, the piezoelectric element 70, the structured light projector 80, and the like are arranged in sequence from one end to the other end of the line segment. Of course, the number of the piezoelectric elements 70 and the arrangement of the piezoelectric elements 70, the input/output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are not limited to the above examples. In the embodiment of the present invention, the plurality of piezoelectric elements 70 are combined with the cover plate 30, and specifically, the plurality of piezoelectric elements 70 are respectively attached to the cover plate 30 by the joining members 30 b. The processor of the electronic device 100 is configured to obtain a sound signal, and apply an electrical signal corresponding to the sound signal to two ends of the piezoelectric elements 70, and the piezoelectric elements 70 are mechanically deformed, so that the piezoelectric elements 70 drive the vibration module 30a to vibrate according to the frequency of the electrical signal from different positions combined with the cover plate 30. When the user's body is in contact with the vibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with the vibration module 30a (e.g., cartilage of the outer ear, teeth).

In the embodiment of the present invention, the plurality of piezoelectric elements 70 simultaneously drive the vibration module 30a to vibrate from a plurality of different positions combined with the cover plate 30, and the vibration of the vibration module 30a is uniform and has higher intensity, which is beneficial to stably transmitting the bone conduction sound to the auditory nerve of the user.

Referring to fig. 6-8, in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared camera 62. The casing 20 is provided with a casing approach through hole 23, a casing light supplement through hole 24, a casing approach sensor through hole 26, a casing light sensation through hole 2f, and a casing vibration through hole 2a, which are spaced from each other. The proximity infrared lamp 13 corresponds to the case proximity through hole 23, the proximity sensor 50 corresponds to the case proximity sensor through hole 26, the infrared light supplement lamp 12 corresponds to the case light supplement through hole 24, and the light sensor 1d corresponds to the case light sense through hole 2 f. The piezoelectric element 70 includes a piezoelectric body 71 and a plurality of piezoelectric bumps 72 extending from the piezoelectric body 71, the number of the piezoelectric bumps 72 is plural, the number of the chassis vibration through holes 2a is plural, the plurality of piezoelectric bumps 72 correspond to the plurality of chassis vibration through holes 2a, and each piezoelectric bump 72 is partially received in the corresponding chassis vibration through hole 2a and is coupled to the cover plate 30. The input/output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located between the cover plate 30 and the piezoelectric body 71. The centers of the input and output module 10, the infrared camera 62, the visible light camera 61, the plurality of piezoelectric bumps 72 and the structured light projector 80 are located on the same line segment, and at least one of the input and output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 is arranged between two adjacent piezoelectric bumps 72. For example, the number of the piezoelectric bumps 72 is two, and the piezoelectric bumps 72, the input/output module 10, the structured light projector 80, the infrared camera 62, the visible light camera 61, and the piezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment; or the piezoelectric bump 72, the input-output module 10, the infrared camera 62, the visible light camera 61, the piezoelectric bump 72, the structured light projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of the piezoelectric bumps 72 is three, and the piezoelectric bumps 72, the input/output module 10, the structured light projector 80, the piezoelectric bumps 72, the infrared camera 62, the visible light camera 61, and the piezoelectric bumps 72 are arranged in sequence from one end to the other end of the line segment; or the piezoelectric bump 72, the input-output module 10, the piezoelectric bump 72, the infrared camera 62, the visible light camera 61, the piezoelectric bump 72, the structured light projector 80 and the like are arranged in sequence from one end to the other end of the line segment. For another example, the number of the piezoelectric bumps 72 is five, and the piezoelectric bumps 72, the input/output module 10, the piezoelectric bumps 72, the structured light projector 80, the piezoelectric bumps 72, the infrared camera 62, the piezoelectric bumps 72, the visible light camera 61, and the piezoelectric bumps 72 are arranged in sequence from one end of the line segment to the other end. Of course, the number of the piezoelectric bumps 72 and the arrangement of the piezoelectric bumps 72, the input/output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are not limited to the above examples. In the embodiment of the present invention, the plurality of piezoelectric bumps 72 are combined with the cap plate 30, and more specifically, the plurality of piezoelectric bumps 72 are respectively attached to the cap plate 30 by the bonding members 30 b. The processor of the electronic device 100 is configured to obtain a sound signal, and apply an electrical signal corresponding to the sound signal to the piezoelectric element 70, and the piezoelectric element 70 including the piezoelectric body 71 and the piezoelectric bumps 72 is mechanically deformed, so that the piezoelectric bumps 72 drive the vibration module 30a to vibrate according to the frequency of the electrical signal from a plurality of different positions combined with the cover plate 30. When the user's body is in contact with the vibration module 30a, bone conduction sound is transmitted to the user's auditory nerve through a portion of the user's body in contact with the vibration module 30a (e.g., cartilage of the outer ear, teeth).

The casing 20 is provided with a casing vibration through hole 2a, an input/output through hole 25, a structured light through hole 26, an infrared light through hole 27, and a visible light through hole 28 which are spaced from each other. The case vibration through hole 2a corresponds to the piezoelectric bump 72, the input/output through hole 25 corresponds to the input/output module 10, the structured light through hole 26 corresponds to the structured light projector 80, the infrared light through hole 27 corresponds to the infrared light camera 62, and the visible light through hole 28 corresponds to the visible light camera 61. The input/output through hole 25 may be replaced by the enclosure approach through hole 23, the enclosure light supplement through hole 24, and the enclosure light sensing through hole 2f, or the input/output through hole 25 is formed by communicating the enclosure approach through hole 23, the enclosure light supplement through hole 24, and the enclosure light sensing through hole 2 f. In addition, the structured light through hole 26 corresponds to the structured light projector 80, that is, the structured light emitted by the structured light projector 80 can pass through the structured light through hole 26, the infrared light through hole 27 corresponds to the infrared camera 62, that is, the infrared camera 62 can receive the infrared light reflected by the object from the infrared light through hole 27, and the visible light through hole 28 corresponds to the visible light camera 61, that is, the visible light camera 61 can receive the visible light reflected by the object from the visible light through hole 28.

In the embodiment of the present invention, the plurality of piezoelectric bumps 72 drive the vibration module 30a to vibrate from a plurality of different positions combined with the cover plate 30, and the vibration of the vibration module 30a is more uniform and stronger, which is beneficial to stably transmitting bone conduction sound to the auditory nerve of the user; in addition, the plurality of piezoelectric bumps 72 extend from the same piezoelectric body 71, so that an electrical signal can be simultaneously applied to the plurality of piezoelectric bumps 72, and the vibration module 30a can be driven to vibrate synchronously from a plurality of different positions; furthermore, the input/output module 10, the infrared camera 62, the visible light camera 61, and the structured light projector 80 are located between the cover plate 30 and the piezoelectric body 71, and the piezoelectric bumps 72 are inserted, so that the electronic device 100 has a small overall size and saves space.

Referring to fig. 3, in some embodiments, the input/output module 10 further includes a fill-in lamp lens 18, a proximity lamp lens 19, a proximity light sensor lens 1h, and a photo-sensing lens 1 e. The fill light lens 18 is disposed in the package housing 11 and corresponds to the infrared fill light 12. The proximity lamp lens 19 is provided inside the package case 11 and corresponds to the proximity infrared lamp 13. The proximity light sensor lens 1h is provided inside the package case 11 and corresponds to the proximity sensor 50. The light sensor lens 1e is disposed in the package case 11 and corresponds to the light sensor 1 d. The infrared light emitted by the infrared fill light 12 is focused into the fill light window 1131 under the action of the fill light lens 18 to be emitted, so as to reduce the amount of light emitted to other areas of the package sidewall 112 and the package top 113. Similarly, when infrared light emitted from the proximity infrared lamp 13 reflected by an object entering from the proximity sensor window 1134 is incident on the proximity sensor lens 1h, the proximity sensor lens 1h reduces the amount of light of the reflected infrared light transmitted to the outside of the proximity sensor 50. Similarly, the infrared light emitted from the proximity infrared lamp 13 is focused by the proximity lamp lens 19 into the proximity window 1132 and emitted, reducing the amount of light emitted to other areas of the package sidewall 112 and package top 113. Similarly, when the visible light entering from the light sensing window 1133 is incident on the light sensing lens 1e, the light sensing lens 1e converges the visible light on the light sensor 1d, so as to reduce the amount of the visible light transmitted to the area outside the light sensor 1 d. Specifically, the light supplement lamp lens 18, the proximity lamp lens 19, the proximity sensor lens 1h and the light sensing lens 1e may all be located on the same transparent substrate, and more specifically, the light supplement lamp lens 18, the proximity lamp lens 19, the proximity sensor lens 1h and the light sensing lens 1e may all be integrally formed with the transparent substrate. Of course, the input/output module 10 may be provided with only one or more of the light supplement lamp lens 18, the proximity lamp lens 19, the proximity sensor lens 1h, and the light sensing lens 1e, or may not be provided with the light supplement lamp lens 18, the proximity lamp lens 19, the proximity sensor lens 1h, and the light sensing lens 1 e.

Referring to fig. 3, in some embodiments, the input/output module 10 further includes a plurality of metal shielding plates 1a, the plurality of metal shielding plates 1a are all located in the package housing 11, and the plurality of metal shielding plates 1a are respectively located between any two of the infrared fill light 12, the proximity infrared light 13, the proximity sensor 50, and the optical sensor 1 d. For example, when the centers of the infrared fill light 12, the proximity infrared light 13, the proximity sensor 50, and the light sensor 1d are located on the same line segment, the number of the metal shielding plates 1a is three; if the infrared light supplement lamp 12, the proximity infrared lamp 13, the proximity sensor 50 and the light sensor 1d are sequentially arranged from one end to the other end of the line segment, the three metal shielding plates 1a are respectively positioned between the infrared light supplement lamp 12 and the proximity infrared lamp 13, between the proximity infrared lamp 13 and the proximity sensor 50 and between the proximity sensor 50 and the light sensor 1 d. Metal shielding plate 1a is located infrared light filling lamp 12 and is close between infrared lamp 13, metal shielding plate 1a can shield infrared light filling lamp 12 and is close infrared lamp 13 electromagnetic interference each other on the one hand, infrared light filling lamp 12 can not influence each other with the luminous intensity and the chronogenesis that are close infrared lamp 13, on the other hand metal shielding plate 1a can be used for isolated infrared light filling lamp 12 place cavity and the cavity that is close infrared lamp 13 place, light can not get into another cavity from a cavity.

Referring to fig. 9, in some embodiments, the input/output module 10 further includes an optical enclosure 1 b. The optical enclosure 1b is made of a light-transmissive material, and the optical enclosure 1b is formed on the package substrate 111 and located inside the package case 11. The optical enclosure 1b encloses the infrared fill light 12, the proximity infrared light 13, the proximity sensor 50 and the light sensor 1 d. Specifically, optics sealing cover 1b can form through encapsulating injection molding process, and optics sealing cover 1b can adopt transparent thermosetting epoxy to make, in order that in use is difficult for softening, and optics sealing cover 1b can fix infrared light filling lamp 12, be close infrared lamp 13, proximity sensor 50 and light sense ware 1d relative position between four, and make infrared light filling lamp 12, be close infrared lamp 13, proximity sensor 50 and light sense ware 1d difficult rocking in encapsulation casing 11.

In addition, referring to fig. 9, the input/output module 10 further includes a plurality of light-emitting partition plates 1c, and the light-emitting partition plates 1c are formed in the optical enclosure 1b and located between the infrared fill light 12, the proximity infrared light 13, the proximity sensor 50, and the optical sensor 1 d. When the centers of the infrared fill light 12, the proximity infrared light 13, the proximity sensor 50, and the light sensor 1d are located on the same line segment, the number of the light-emitting partition plates 1c is three. For example, if the infrared fill-in lamp 12, the proximity infrared lamp 13, the proximity sensor 50 and the optical sensor 1d are sequentially arranged from one end to the other end of the line segment, the three light-emitting partition plates 1c are respectively located between the infrared fill-in lamp 12 and the proximity infrared lamp 13, between the proximity infrared lamp 13 and the proximity sensor 50, and between the proximity sensor 50 and the optical sensor 1 d. Light-emitting partition 1c can be used to infrared light filling lamp 12 of interval and be close infrared lamp 13, and light that infrared light filling lamp 12 sent can not wear out from being close lamp window 1132, and light that is close infrared lamp 13 and sends can not wear out from light filling window 1131. The light-emitting partition board 1c can block infrared light initially emitted by the infrared light supplement lamp 12 and the proximity infrared lamp 13 from being incident on the proximity sensor 50 and the light sensor 1d, and simultaneously block visible light entering from the light sensor window 1133 and emitted to the light sensor 1d from affecting the light emission of the infrared light supplement lamp 12 and the proximity infrared lamp 13 and infrared light reflected by the proximity sensor 50 from being received.

Referring to fig. 10 to 13, in some embodiments, the cover plate 30 may further have a cover plate light supplement through hole 34, the cover plate light supplement through hole 34 corresponds to the chassis light supplement through hole 24, and the infrared light emitted by the infrared light supplement lamp 12 passes through the chassis light supplement through hole 24 and then passes through the electronic device 100 from the cover plate light supplement through hole 34. In this case, the infrared transmitting ink 40 may be provided on the cover 30 at a position corresponding to the chassis approach through hole 23, so that the user cannot easily see the approach infrared lamp 13 inside the electronic device 100 through the chassis approach through hole 23, and the electronic device 100 has a good appearance.

Referring to fig. 11, in some embodiments, the cover 30 may further include a cover approaching through hole 33, the cover approaching through hole 33 corresponds to the chassis approaching through hole 23, and the infrared light emitted by the approaching infrared lamp 13 passes through the chassis approaching through hole 23 and then passes through the cover approaching through hole 33 to the electronic device 100. At this time, the infrared transmissive ink 40 may be disposed at a position on the cover plate 30 corresponding to the chassis light supplement through hole 24, so that the user is difficult to see the infrared light supplement lamp 12 inside the electronic device 100 through the chassis light supplement through hole 24, and the electronic device 100 has a beautiful appearance.

In some embodiments, the cover 30 may further have a cover proximity sensor through hole 37, the cover proximity sensor through hole 37 corresponds to the chassis proximity sensor through hole 26, and infrared light emitted by the proximity infrared lamp 13 after being reflected by an object passes through the chassis proximity sensor through hole 26 may be incident on the proximity sensor 50 from the cover proximity sensor through hole 37. In this case, the infrared transmissive ink 40 may be provided at a position of the cover 30 corresponding to the chassis proximity sensor through hole 26, so that it is difficult for a user to see the proximity sensor 50 inside the electronic device 100 through the chassis proximity sensor through hole 26, and the appearance of the electronic device 100 is beautiful.

Referring to fig. 13, in some embodiments, the cover plate 30 may further have a cover plate light sensing through hole 36, the cover plate light sensing through hole 36 corresponds to the case light sensing through hole 2f and the light sensor 1d, and visible light outside the electronic device 100 may pass through the cover plate light sensing through hole 36 and the case light sensing through hole 2f and then be incident on the light sensor 1 d. At this time, the infrared transparent ink 40 may be disposed on the cover 30 at a position corresponding to the chassis approach through hole 23, so that the user is difficult to see the approach infrared lamp 13 inside the electronic device 100 through the chassis approach through hole 23; the cover plate 30 may also be provided with infrared transparent ink 40 at a position corresponding to the casing light supplement through hole 24, so that a user is difficult to see the infrared light supplement lamp 12 inside the electronic device 100 through the casing light supplement through hole 24, and the electronic device 100 has a beautiful appearance.

In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising:

a housing;

the vibration module is arranged on the shell; the vibration module comprises a display screen and a light-transmitting cover plate, the display screen is arranged on the shell and forms an accommodating cavity together with the shell, the cover plate is combined on the shell through a joint and is positioned on one side of the display screen, which is far away from the accommodating cavity, and the display screen is combined with the cover plate through the joint; and

a piezoelectric element coupled to the cover plate through the coupling member, an area where the cover plate is coupled to the piezoelectric element being spaced apart from an area where the cover plate is coupled to the display screen; the piezoelectric element is combined with the vibration module and is spaced from the input and output module, and the piezoelectric element is used for deforming when an electric signal is applied to the piezoelectric element so as to enable the vibration module to vibrate; the piezoelectric element comprises a piezoelectric body and a plurality of piezoelectric lugs extending out of the piezoelectric body, and the plurality of piezoelectric lugs extend out of the same piezoelectric body; the shell is provided with a plurality of shell vibration through holes, a plurality of piezoelectric lugs correspond to the shell vibration through holes, and each piezoelectric lug is partially accommodated in the corresponding shell vibration through hole and combined with the cover plate; the input and output module is positioned between the cover plate and the piezoelectric body;

infrared camera, visible light camera and structured light projector, infrared camera visible light camera reaches structured light projector is located the apron with between the piezoelectricity body, it is a plurality of piezoelectricity lug interlude sets up between input/output module, infrared camera, visible light camera and the structured light transmitter.

2. The electronic device of claim 1, wherein the housing further defines a housing proximity through hole, a housing light filling through hole, a housing proximity sensor through hole, and a housing light sensation through hole, the proximity infrared lamp corresponds to the housing proximity through hole, the infrared light filling lamp corresponds to the housing light filling through hole, the proximity sensor corresponds to the housing proximity sensor through hole, and the light sensor corresponds to the housing light sensation through hole.

3. The electronic device of claim 2, wherein the piezoelectric element and the display screen are attached to the cover plate by a joint.

4. The electronic device of claim 1, wherein the input/output module further comprises a chip, and the infrared fill-in light, the proximity infrared light, the proximity sensor and the light sensor are all formed on one chip.

5. The electronic device according to claim 1, wherein the package housing further comprises a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, the package top is formed with a fill light window, a proximity lamp window, a proximity sensor window, and a light sensation window, the fill light window corresponds to the infrared fill light, the proximity lamp window corresponds to the proximity infrared lamp, the proximity sensor window corresponds to the proximity sensor, and the light sensation window corresponds to the light sensation device.

6. The electronic device according to claim 1, wherein the input/output module further comprises a fill-in lamp lens, and the fill-in lamp lens is disposed in the package housing and corresponds to the infrared fill-in lamp; and/or

7. The electronic device of claim 1, wherein the input/output module further comprises a light supplement lamp lens, a proximity sensor lens and a light sense lens disposed in the package housing, the light supplement lamp lens corresponds to the infrared light supplement lamp, the proximity lamp lens corresponds to the proximity infrared lamp, the proximity sensor lens corresponds to the proximity sensor, the light sense lens corresponds to the light sense device, and the light supplement lamp lens, the proximity sensor lens and the light sense lens are disposed on a same transparent substrate.

8. The electronic device of claim 1, wherein the input/output module further comprises a plurality of metal shielding plates, and the plurality of metal shielding plates are respectively located in the package housing and between any two of the infrared fill light, the proximity infrared light, the proximity sensor, and the light sensor.

9. The electronic device of claim 1, wherein the input-output module further comprises an optical enclosure made of a light-transmissive material, the optical enclosure being formed on the package substrate and located within the package housing, the optical enclosure enclosing the infrared fill light, the proximity infrared light, the proximity sensor, and the light sensor.

10. The electronic device of claim 9, wherein the input/output module further comprises a plurality of light-emitting partitions, and the light-emitting partitions are respectively formed in the optical enclosure and located between any two of the infrared fill light, the proximity infrared light, the proximity sensor, and the light sensor.

11. The electronic device according to claim 1, wherein a ground pin, a fill-in light pin, a proximity sensor pin and a light sensing pin are formed on the input/output module, and when the ground pin and the fill-in light pin are enabled, the infrared fill-in light emits infrared light; when the grounding pin and the proximity lamp pin are enabled, the proximity infrared lamp emits infrared light; when the grounding pin and the proximity sensor pin are enabled, the proximity sensor receives infrared light rays reflected by an object and emitted by the proximity infrared lamp; when the grounding pin and the light sensing pin are enabled, the light sensor detects the intensity of visible light.

12. The electronic device of claim 2, wherein a surface of the cover plate combined with the housing is formed with an infrared transparent ink that only transmits infrared light, and the infrared transparent ink blocks at least one of the housing access through hole, the housing fill light through hole, the housing proximity sensor through hole, and the housing vibration through hole.

13. The electronic device of claim 2 wherein centers of the input-output module, the infrared camera, the visible camera, and the structured light projector are located on a same line segment, the piezoelectric element being located between the line segment and a top of the housing.

14. The electronic device of claim 2, wherein centers of the input-output module, the infrared camera, the visible light camera, the plurality of piezoelectric elements, and the structured light projector are located on a same line segment, and at least one of the input-output module, the infrared camera, the visible light camera, and the structured light projector is disposed between two adjacent piezoelectric elements.