CN108074941B - Input/output module and electronic device - Google Patents
Input/output module and electronic device Download PDFInfo
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- CN108074941B CN108074941B CN201711433362.XA CN201711433362A CN108074941B CN 108074941 B CN108074941 B CN 108074941B CN 201711433362 A CN201711433362 A CN 201711433362A CN 108074941 B CN108074941 B CN 108074941B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
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Abstract
The invention discloses an electronic device and an input/output module, which comprise a packaging shell, an infrared lamp, a proximity sensor, a light guide element and a light sensor, wherein the packaging shell comprises a packaging substrate, the infrared lamp, the proximity sensor, the light guide element and the light sensor are all packaged in the packaging shell, the infrared lamp and the light sensor are both carried on the packaging substrate, the light guide element can be movably arranged on a light emitting light path of the infrared lamp, and when the light guide element is positioned on the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a first view angle to serve as an infrared light supplement lamp or a proximity infrared lamp; when the light guide element leaves the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second viewing angle to be used as a near infrared lamp or an infrared light supplement lamp; the light sensor is used for receiving the intensity of the visible light. The input and output module has higher integration level and smaller volume, thereby saving the space for realizing the functions of infrared distance measurement, infrared light supplement and visible light intensity detection.
Description
Technical Field
The present invention relates to the field of consumer electronics technologies, and in particular, to an input/output module and an electronic device.
Background
Along with the functions supported by the mobile phone are more and more abundant and various, the types and the number of functional devices required to be set by the mobile phone are more and more, in order to realize the functions of distance detection, ambient light detection, facial 3D feature recognition of a user and the like, functional devices such as a proximity sensor, an ambient light sensor, an infrared camera, a structured light projector and the like need to be configured in the electronic equipment, and in order to arrange numerous functional devices, the mobile phone occupies too much space.
Disclosure of Invention
The embodiment of the invention provides an input/output module and an electronic device.
The input and output module comprises a packaging shell, an infrared lamp, a light guide element, a proximity sensor and a light sensor, wherein the packaging shell comprises a packaging substrate, the infrared lamp, the light guide element, the proximity sensor and the light sensor are packaged in the packaging shell, the infrared lamp, the proximity sensor and the light sensor are all carried on the packaging substrate, the light guide element can be movably arranged on a light emitting light path of the infrared lamp, and when the light guide element is positioned on the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a first view angle to serve as an infrared light supplement lamp or a proximity infrared lamp; when the light guide element leaves the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second field angle to serve as a near infrared lamp or an infrared light supplement lamp; the proximity sensor is used for receiving infrared light which is reflected by an object and emitted by the infrared lamp as a proximity infrared lamp so as to detect the distance from the object to the input and output module; the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light.
In some embodiments, the light guide element comprises a convex lens or a lens group having positive optical power, and infrared light rays emitted by the infrared lamp exit the package housing as a proximity infrared lamp at a first angle of view when the light guide element is positioned on a light emitting optical path of the infrared lamp; when the light guide element leaves the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second field angle to serve as an infrared light supplement lamp; or
The light guide element comprises a concave lens or a lens group with negative focal power, and when the light guide element is positioned on a light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a first field angle to serve as an infrared light supplement lamp; when the light guide element leaves the light emitting optical path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second angle of view to serve as a proximity infrared lamp.
In some embodiments, the input-output module further comprises a chip, and the infrared lamp, the proximity sensor and the light sensor are all formed on the chip.
In some embodiments, the package housing further includes a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, the package top is formed with a light-emitting window, a proximity sensor window and a light-sensing window, the light-emitting window corresponds to the infrared lamp, the proximity sensor window corresponds to the proximity sensor, and the light-sensing window corresponds to the light sensor.
In some embodiments, the input/output module further includes a light-sensing lens and a proximity sensor lens, the light-sensing lens is disposed in the package housing and corresponds to the light sensor, the proximity sensor lens corresponds to the proximity sensor, and the light-sensing lens and the proximity sensor are located on the same transparent substrate.
In some embodiments, the input-output module further comprises a plurality of metal shielding plates located within the package housing and between any two of the infrared lamp, the proximity sensor, and the light sensor.
In some embodiments, the input-output module further comprises an optical enclosure made of a light transmissive material formed on the package substrate and located within the package housing, the optical enclosure enclosing the infrared lamp, the proximity sensor, and the light sensor.
In some embodiments, the input-output module further comprises a plurality of light-exiting baffles formed within the optical enclosure between any two of the infrared light, the proximity sensor, and the light sensor.
In some embodiments, a ground pin, an infrared lamp pin, a proximity sensor pin and a light sensing pin are formed on the input/output module, and when the ground pin and the infrared lamp pin are enabled, the infrared lamp emits infrared light; when the grounding pin and the proximity sensor pin are enabled, the proximity sensor is used for receiving infrared light reflected by an object and emitted by the infrared lamp as a proximity infrared lamp so as to detect the distance from the object to the input and output module; when the grounding pin and the light sensing pin are enabled, the light sensor detects the intensity of visible light.
An electronic device according to an embodiment of the present invention includes:
a housing; and
the input and output module is arranged in the shell.
In some embodiments, the electronic device further includes a transparent cover plate, the housing has a housing light source through hole, a housing proximity sensor through hole, and a housing light sensation through hole, the infrared lamp corresponds to the housing light source through hole, the proximity sensor corresponds to the housing proximity sensor through hole, the light sensor corresponds to the housing light sensation through hole, and the cover plate is disposed on the housing.
In some embodiments, the electronic device further includes a transparent cover plate, the housing is provided with a housing light source through hole, a housing proximity sensor through hole, and a housing light sensation through hole, the infrared lamp corresponds to the housing light source through hole, the light sensation sensor corresponds to the housing light sensation through hole, the proximity sensor corresponds to the housing proximity sensor through hole, the cover plate is disposed on the housing, an infrared transmissive ink that only transmits infrared light is formed on a surface of the cover plate combined with the housing, and the infrared transmissive ink shields at least one of the housing light source through hole and the housing proximity sensor through hole.
According to the electronic device and the input and output module, the position of the light guide element is moved, so that the input and output module can be used as a proximity infrared lamp or an infrared light supplement lamp, the infrared lamp, the light guide element, the proximity sensor and the light sensor are integrated into a single packaging body structure, and the input and output module integrates the functions of infrared distance measurement and infrared light supplement and the function of visible light intensity detection. Compared with the existing electronic device which needs to be provided with the proximity infrared lamp and the infrared light supplement lamp at the same time, the input/output module provided by the embodiment of the invention only needs to be provided with one infrared lamp, has a small volume, and saves space for realizing the infrared light supplement and infrared distance measurement functions. Further, infrared lamp, proximity sensor and light sense ware are integrated to be a single packaging body structure, and the integrated level of input/output module is higher, and the volume is less, and the space of the function that realizes infrared range finding, infrared light filling and the intensity detection of visible light has been practiced thrift to the input/output module.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present invention;
FIG. 2 is a schematic perspective view of an input/output module of an electronic device according to some embodiments of the present invention;
fig. 3 to 4 are schematic views illustrating states of an input/output module of an electronic device according to some embodiments of the invention;
FIG. 5 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the invention;
FIG. 6 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the invention;
FIG. 7 is a partial perspective view of an input/output module of an electronic device according to some embodiments of the present invention;
FIG. 8 is a schematic, partial cross-sectional view of an electronic device according to some embodiments of the invention;
FIG. 9 is a schematic cross-sectional view of an input/output module of an electronic device according to some embodiments of the invention;
FIG. 10 is a schematic structural diagram of an electronic device according to some embodiments of the invention;
FIGS. 11-13 are schematic partial cross-sectional views of electronic devices according to some embodiments of the invention
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.
In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1, an electronic device 100 according to an embodiment of the invention includes a housing 20, a cover 30, and electronic components. The electronic components include an input/output module 10, an imaging module 60, a receiver 70, and a structured light projector 80. The electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, an intelligent watch, an intelligent bracelet, a teller machine, and the like, and the embodiment of the invention is described by taking the electronic device 100 as a mobile phone, it is understood that the specific form of the electronic device 100 may be other, and is not limited herein.
Referring to fig. 2 to 4, the input/output module 10 is a single package structure, and includes a package housing 11, an infrared lamp 12, a light guide element 13, a proximity sensor 50, and a light sensor 1 a.
The package housing 11 is used for simultaneously packaging the infrared lamp 12, the light guide element 13, the proximity sensor 50 and the light sensor 1a, or the infrared lamp 12, the light guide element 13, the proximity sensor 50 and the light sensor 1a are simultaneously packaged in the package housing 11. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an Electromagnetic Interference (EMI) shielding material to prevent external EMI from affecting the input/output module 10.
Referring to fig. 5, the package substrate 111 is used for simultaneously carrying the infrared lamp 12, the proximity sensor 50 and the optical sensor 1 a. In manufacturing the input/output module 10, the infrared lamp 12, the proximity sensor 50, and the photo sensor 1a may be formed on one chip 14, and then the infrared lamp 12, the proximity sensor 50, the photo sensor 1a, and the chip 14 may be disposed on the package substrate 111 together, and specifically, the chip 14 may be bonded on the package substrate 111. Meanwhile, the package substrate 111 may also be used to connect with other components of the electronic device 100 (e.g., the housing 20 and the motherboard of the electronic device 100) to fix the input/output module 10 in the electronic device 100. The infrared lamp 12 and the light sensor 1a can be formed on one chip 14, the volume of the integrated infrared lamp 12 and the light sensor 1a is further reduced, and the preparation process is simple.
The package sidewall 112 may be disposed around the infrared lamp 12, the light guiding element 13, the proximity sensor 50 and the optical sensor 1a, the package sidewall 112 extends from the package substrate 111, the package sidewall 112 may be combined with the package substrate 111, and preferably, the package sidewall 112 and the package substrate 111 are detachably connected, so as to facilitate the maintenance of the infrared lamp 12, the proximity sensor 50 and the optical sensor 1a after the package sidewall 112 is removed. The package side wall 112 may be made of an infrared opaque material to prevent infrared light emitted by the infrared lamp 12 from passing through the package side wall 112.
The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. A light emitting window 1131, a proximity sensor window 1134 and a light sensing window 1132 are formed on the top 113 of the package, the light emitting window 1131 corresponds to the infrared lamp 12, and infrared light emitted by the infrared lamp 12 penetrates out of the light emitting window 1131; the proximity sensor window 1134 corresponds to the proximity sensor 50, and the infrared light emitted by the proximity infrared lamp 12 as the proximity infrared lamp can pass through the proximity sensor window 1134 and be incident on the proximity sensor 50 after being reflected by an object; the light sensor window 1132 corresponds to the light sensor 1a, and the visible light can pass through the light sensor window 1132 and be incident on the light sensor 1 a. The package top 113 and the package side wall 112 may be formed integrally or separately. In one example, the light emitting window 1131 and the light sensing window 1132 are both through holes, and the package top 113 is made of a material opaque to infrared light and visible light. In another example, the package top 113 is made of a material opaque to infrared light, a material transparent to infrared light, a material opaque to visible light, and a material transparent to visible light, specifically, the light emitting window 1131 is made of a material transparent to infrared light, the light sensing window 1132 is made of a material transparent to visible light, and the rest is made of a material opaque to infrared light and a material opaque to visible light, further, the light emitting window 1131 may be formed with a lens structure to improve the infrared light emitting angle from the light emitting window 1131, for example, the light emitting window 1131 is formed with a concave lens structure to make the light passing through the light emitting window 1131 diffuse outward; the light-emitting window 1131 is formed with a convex lens structure, so that light rays passing through the light-emitting window 1131 are gathered and emitted outwards; the proximity sensor window 1134 is formed with a convex lens mechanism so that infrared light passing through the proximity sensor window 1134 is gathered inward and projected onto the proximity sensor 50; the light sensing window 1132 may also be formed with a lens structure to improve the visible light emitting angle incident from the light sensing window 1132, for example, the light sensing window 1132 has a convex lens structure to focus and project the light incident from the light sensing window 1132 onto the light sensor 1 a.
The light guide member 13 is movably disposed on the light emission optical path of the infrared lamp 12. Referring to fig. 5 and 6, the input/output module 10 further includes a driving member 17, and the driving member 17 is used for driving the light guide element 13 to move so as to be movably disposed on the light emitting path of the infrared lamp 12. Wherein, the driving member 17 drives the light guide element 13 to move so as to be movably arranged on the light emitting optical path of the infrared lamp 12 comprises: in a normal state, the light guide element 13 is arranged on a light emitting optical path of the infrared lamp 12, the infrared lamp 12 is used as an infrared fill lamp (or a near infrared lamp), and when the infrared lamp 12 is used as a near infrared lamp (or an infrared fill lamp), the driving element 17 drives the light guide element 13 to move to leave the light emitting optical path of the infrared lamp 12; or in a normal state, the light guide element 13 is not disposed on the light emitting optical path of the infrared lamp 12, the infrared lamp 12 is used as a proximity infrared lamp (or an infrared fill-in lamp), and when the infrared lamp 12 is used as the infrared fill-in lamp (or a proximity infrared lamp), the driving member 17 drives the light guide element 13 to move to the light emitting optical path of the infrared lamp 12.
Referring to fig. 5, the driving member 17 includes a linear motor, the linear motor includes a stator 172 and a mover 174, the stator 172 is mounted on the package sidewall 112, the mover 174 is connected to the light guiding element 13, and the driving member 17 drives the mover 174 to move so as to drive the light guiding element 13 to move. Referring to fig. 6, the structure of the driving member 17 can be replaced by: the driving member 17 includes a linear motor, the linear motor includes a stator 172 and a mover 174, the stator 172 is installed on the package sidewall 112, the input/output module 10 further includes a rotating shaft 18 and a connecting arm 19, the first end of the connecting arm 19 is connected to the light guiding element 13, the mover 174 is connected to the second end of the connecting arm 19, which is away from the light guiding element 13, the connecting arm 19 is sleeved on the rotating shaft 18, the rotating shaft 18 is located between the light guiding element 13 and the mover 174, the mover 174 of the linear motor drives the second end of the connecting arm 19 to move, and the connecting arm 19 rotates around the rotating shaft 18, so that the first end of the connecting arm 19 drives the light guiding element 13 to rotate around the rotating shaft 18, so as to enable the light guiding element 13 to be. In an embodiment of the present invention, the input/output module 10 may further include a carrier plate (not shown) having a carrier hole, the light guide element 13 is installed in the carrier hole, and the driving element 17 is used for driving the carrier plate to move so as to drive the light guide element 13 to move.
Referring to fig. 3, when the light guide element 13 is located on the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 passes through the light guide element 13, and exits from the package housing 11 as a proximity infrared lamp at a first viewing angle under the action of the light guide element 13; when the light guide element 13 leaves the light emission optical path of the infrared lamp 12, the infrared light emitted from the infrared lamp 12 exits the package housing 11 as an infrared fill-in lamp at a second angle of view, and at this time, the first angle of view is smaller than the second angle of view, where the first angle of view is in a range of 10 degrees to 30 degrees, for example, 10 degrees, 15 degrees, 20 degrees, 25 degrees, or 30 degrees, and the second angle of view is in a range of 60 degrees to 90 degrees, for example, 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees. The light guide element 13 is used for converging light, and the light guide element 13 includes a convex lens or a lens group with positive focal power, and the lens group can be one or more lenses. In the embodiment of the present invention, the angle of field refers to a range covered by the infrared light exiting from the package case 11 through the light emission window 1131.
Referring to fig. 4, when the light guide element 13 is located on the light emitting path of the infrared lamp 12, the infrared light emitted by the infrared lamp 12 passes through the light guide element 13, and exits from the package housing 11 at a first field angle under the action of the light guide element 13 to serve as an infrared fill-in light; when the light guide member 13 is separated from the light emission optical path of the infrared lamp 12, the infrared light emitted from the infrared lamp 12 is emitted from the package housing 11 as a proximity infrared lamp at a second angle of view, and at this time, the first angle of view is larger than the second angle of view, where the first angle of view is in a range of 60 degrees to 90 degrees, for example, 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees, and the second angle of view is in a range of 10 degrees to 30 degrees, for example, the second angle of view is 10 degrees, 15 degrees, 20 degrees, 25 degrees, or 30 degrees, and the like. The light guide element 13 is used for diverging light, and the light guide element 13 includes a concave lens or a lens group with negative power, and the lens group can be one or more lenses. In the embodiment of the present invention, the angle of field refers to a range covered by the infrared light exiting from the package case 11 through the light emission window 1131.
When the infrared lamp 12 is turned on and used as an infrared fill-in lamp to emit infrared light to the outside of the package housing 11, the infrared light passes through the light-emitting window 1131 to be projected onto the surface of the object, and the infrared camera 62 of the electronic device 100 receives the infrared light reflected by the object to obtain image information of the object (at this time, the infrared lamp 12 is used for infrared fill-in). When the infrared lamp 12 is turned on and used as a proximity infrared lamp to emit infrared light to the outside of the package housing 11, infrared light passes through the light emitting window 1131 and reaches the surface of the object, and the proximity sensor 50 receives the infrared light reflected by the object to detect the distance from the object to the input-output module 10 (at this time, the infrared lamp 12 is used for infrared ranging).
The infrared lamp 12 can emit infrared light to the outside of the package case 11 at different powers when used as an infrared fill light and when used as a near infrared lamp. Specifically, the infrared lamp 12 emits infrared light to the outside of the package housing 11 at a first power when serving as a proximity infrared lamp, and the infrared lamp 12 emits infrared light to the outside of the package housing 11 at a second power when serving as an infrared fill light, where the first power may be smaller than the second power.
The light sensor 1a receives visible light in the ambient light incident from the light sensing window 1132, and detects the intensity of the visible light.
Referring to fig. 7, in the embodiment of the invention, the input/output module 10 is formed with a ground pin 1e, an infrared lamp pin 1f, a proximity sensor pin 15 and a light sensing pin 1 g. The grounding pin 1e, the infrared lamp pin 1f, the proximity sensor pin 15, and the light sensing pin 1g may all be formed on the package substrate 111, and when the grounding pin 1e and the infrared lamp pin 1f are enabled (i.e., when the grounding pin 1e and the infrared lamp pin 1f are connected to a circuit and turned on), the infrared lamp 12 emits infrared light; when the ground pin and the proximity sensor pin 1g are enabled, the proximity sensor 50 receives infrared light reflected by the object and emitted as a proximity infrared lamp by the infrared lamp 12; when the ground pin 1e and the light sensing pin 1g are enabled (i.e., when the ground pin 1e and the light sensing pin 1g are connected to the circuit and turned on), the light sensor 1a detects the intensity of the visible light, which is used as a basis for controlling the display brightness of the display screen 90.
Referring to fig. 1, the housing 20 may be used as a mounting carrier for the input/output module 10, or the input/output module 10 may be disposed in the housing 20. The housing 20 may be a housing of the electronic device 100, in the embodiment of the present invention, the housing 20 may further be used to set the display screen 90 of the electronic device 100, and since the volume occupied by the input/output module 10 according to the embodiment of the present invention is smaller, the volume occupied by the housing 20 to set the display screen 90 may be correspondingly increased, so as to increase the screen occupation ratio of the electronic device 100. Specifically, the housing 20 includes a top 21 and a bottom 22, the display screen 90 and the input/output module 10 are disposed between the top 21 and the bottom 22, the top 21 is located above the bottom 22 in a state that the user uses the electronic device 100 normally, and the input/output module 10 can be disposed between the display screen 90 and the top 21. In other embodiments, the display 90 may be a full screen with a gap, the display 90 surrounds the input/output module 10, and the input/output module 10 is exposed from the gap of the display 90.
The casing 20 is further provided with a casing light source through hole 23, a casing proximity sensor through hole 26 and a casing light sensing through hole 24. When the input/output module 10 is disposed in the housing 20, the infrared lamp 12 corresponds to the housing light source through hole 23, the proximity sensor 50 corresponds to the housing proximity sensor through hole 26, and the optical sensor 1a corresponds to the housing optical sensor through hole 24. The correspondence between the infrared lamp 12 and the casing light source through hole 23 means that light emitted by the infrared lamp 12 can pass through the casing light source through hole 23, specifically, the infrared lamp 12 is opposite to the casing light source through hole 23, or the light emitted by the infrared lamp 12 passes through the casing light source through hole 23 after being acted by the light guide element 13. The light sensor 1a and the case light sensing through hole 24 correspond to each other, and the visible light can pass through the case light sensing through hole 24 and be incident on the light sensor 1a, specifically, the light sensor 1a and the case light sensing through hole 24 are opposite, or the incident light of the visible light passes through the case light sensing through hole 24 and is incident on the light sensor 1a after being acted by the light guide element. The proximity sensor 50 corresponds to the housing proximity sensor through hole 26 for the same reason, and will not be described in detail. The case light through hole 23 and the case light through hole 24 may be spaced apart from each other, but of course, in other embodiments, the case light through hole 23, the case proximity sensor through hole 26 and the case light through hole 24 may be communicated with each other.
The cover plate 30 may be light-transmissive, and the material of the cover plate 30 may be light-transmissive glass, resin, plastic, or the like. The cover plate 30 is disposed on the chassis 20, the cover plate 30 includes an inner surface 32 combined with the chassis 20, and an outer surface 31 opposite to the inner surface 32, and the light emitted by the input/output module 10 sequentially passes through the inner surface 32 and the outer surface 31 and then passes through the cover plate 30. The cover plate 30 covers the case light source through hole 23, the case proximity sensor through hole 26 and the case light sensing through hole 24, the infrared transmission ink 40 is coated on the inner surface 32 of the cover plate 30, and the infrared transmission ink 40 has a high transmittance to infrared light, for example, 85% or more, and a high attenuation to visible light, for example, 70% or more, so that a user can hardly see an area of the electronic device 100 covered by the infrared transmission ink 40 with naked eyes in normal use. Specifically, infrared-transmissive ink 40 may cover areas of inner surface 32 that do not correspond to display 90.
The infrared transmission ink 40 can also shield at least one of the case light source through hole 23 and the case proximity sensor through hole 26, that is, the infrared transmission ink 40 can simultaneously shield the case light source through hole 23 and the case proximity sensor through hole 26, so that a user cannot easily see the internal structure of the electronic device 100 through the case light source through hole 23 and the case proximity sensor through hole 26, and the electronic device 100 has a more beautiful appearance; the IR transmissive ink 40 may also cover the chassis light source through hole 23 and uncover the chassis sensor through hole 26; or the infrared transparent ink may cover the chassis sensor through hole 26 and uncover the chassis light source through hole 23.
Referring to fig. 1, the receiver 70 is used for sending out an acoustic signal when being excited by a power supply, and a user can talk through the receiver 70. The structured light projector 80 is configured to emit structured light outwards, the structured light is reflected after being projected onto the object to be measured, the reflected structured light can be received by the infrared camera 62, and the processor of the electronic device 100 further analyzes the structured light received by the infrared camera 62 to obtain depth information of the object to be measured.
The imaging module 60 comprises a visible light camera 61 and an infrared light camera 62, and the centers of the input and output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70 and the structured light projector 80 are located on the same line segment. Specifically, the input/output module 10, the structured light projector 80, the receiver 70, the infrared camera 62 and the visible light camera 61 are sequentially arranged from one end to the other end of the line segment, and at this time, the visible light camera 61 and the infrared camera 62 can form a double camera; or the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the input/output module 10, the receiver 70, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the visible light camera 61, the receiver 70, the input/output module 10 and the structured light projector 80 are sequentially arranged from one end to the other end of the line segment, and at this time, the visible light camera 61 and the infrared camera 62 can form a double camera. Of course, the arrangement of the input/output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above example, and may be other shapes such as a shape in which the centers of the respective electronic components are arranged in a circular arc shape and a shape in which the centers are arranged in a rectangular shape.
In summary, in the electronic device 100 according to the embodiment of the invention, the input/output module 10 can be used as a proximity infrared lamp or an infrared supplementary light lamp by moving the position of the light guide element 13, and the infrared lamp 12, the light guide element 13, the proximity sensor 50 and the light sensor 1a are integrated into a single package structure, so that the input/output module 10 integrates the functions of emitting infrared light for infrared distance measurement and infrared supplementary light and detecting the intensity of visible light. Compared with the existing electronic device which needs to be provided with a proximity infrared lamp and an infrared supplementary lighting lamp at the same time, the input/output module 10 provided by the embodiment of the invention only needs to be provided with one infrared lamp 12, has a small volume, and saves space for realizing the infrared supplementary lighting and infrared distance measuring functions. Further, the infrared lamp 12, the proximity sensor 50 and the light sensor 1a are integrated into a single packaging body structure, the integration level of the input/output module 10 is high, and the size is small, so that the space for realizing the functions of infrared distance measurement, infrared light supplement and visible light intensity detection is saved. Moreover, as only one infrared lamp 12, one proximity sensor 50 and one light sensor 1a need to be arranged on the same packaging substrate 111 for packaging, compared with the infrared light supplement lamp, the proximity infrared lamp and the light sensor 1a in the traditional process, which need to be manufactured by different wafers respectively and then packaged on a PCB substrate, the packaging efficiency is improved.
Referring to fig. 5, in some embodiments, the input/output module 10 further includes a photo sensor lens 1b and a proximity sensor lens 1 h. The light-sensing lens 1b is disposed in the package housing 11 and corresponds to the light sensor 1 a. The light sensor lens 1b concentrates the visible light on the light sensor 1a, and reduces the amount of the visible light transmitted to the region other than the light sensor 1 a. The proximity light sensor lens 1h is provided inside the package case 11 and corresponds to the proximity sensor 50. When infrared light emitted from the infrared lamp 12 reflected by an object entering from the proximity sensor window 1134 is incident on the proximity sensor lens 1h, the proximity sensor lens 1h reduces the amount of light of the reflected infrared light transmitted to the outside of the proximity sensor 50.
Referring to fig. 5, in some embodiments, the input/output module 10 further includes a metal shielding plate 1c, and the metal shielding plate 1c is located in the package housing 11 and located between the infrared lamp 12 and the proximity sensor 50 and between the proximity sensor 50 and the optical sensor 1 a. The metal shielding plate 1c is located between the infrared lamp 12 and the optical sensor 1a, and can prevent infrared light emitted from the infrared lamp 12 from being incident on the optical sensor 1a, and can shield electromagnetic interference between the infrared lamp 12 and the optical sensor 1a and between the proximity sensor 50 and the optical sensor 1 a.
Referring to fig. 9, in some embodiments, the input-output module 10 further includes an optical enclosure 16. The optical enclosure 16 is made of a light transmissive material, and the optical enclosure 16 is formed on the package substrate 111 and within the package housing 11. Optical enclosure 16 encloses infrared lamp 12, proximity sensor 50, and light sensor 1 a. Specifically, optical enclosure 16 may be formed by a potting injection molding process, optical enclosure 16 may be made of a transparent thermosetting epoxy to be not easily softened in use, optical enclosure 16 may fix the relative positions between infrared lamp 12, proximity sensor 50, and light sensor 1a, and make infrared lamp 12, proximity sensor 50, and light sensor 1a not easily rattle within package housing 11. At this time, the light guide element 13 is disposed outside the optical enclosure 16 and is movably housed in the package housing 11.
Referring to fig. 9, in some embodiments, the input/output module 10 further includes a plurality of light-emitting partitions 1d, and the light-emitting partitions 1d are formed in the optical enclosure 16 and located between the infrared lamp 12 and the proximity sensor 50 and between the proximity sensor 50 and the optical sensor 1 a. The light-exiting partition 1d can block infrared light emitted from the infrared lamp 12 from being incident on the proximity sensor 50 and the light sensor 1a, and simultaneously block visible light entering from the light sensing window 1132 and being emitted to the light sensor 1a from affecting the light emission of the infrared lamp 12 and the reflected infrared light received by the proximity sensor 50.
Referring to fig. 10, in some embodiments, the housing 20 further has a housing sound outlet (not shown), the cover 30 further has a cover sound outlet 34, and the receiver 70 corresponds to the positions of the cover sound outlet 34 and the housing sound outlet. The centers of the input/output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the housing 20.
The center of the receiver 70 is not located on the line segment, so that the transverse space occupied by each electronic component (the input/output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, etc.) on the cover plate 30 is saved. The cover sound outlet 34 is formed at the edge of the cover 30, and the case sound outlet is formed near the top 21.
Referring to fig. 11 to 13, in some embodiments, the cover plate 30 may further have a cover plate light source through hole 33, the cover plate light source through hole 33 corresponds to the case light source through hole 23, and the infrared light emitted by the infrared lamp 12 passes through the case light source through hole 23 and then passes through the cover plate light source through hole 33 to the electronic device 100.
In some embodiments, the cover 30 may further have a cover proximity sensor through hole 37, the cover proximity sensor through hole 37 corresponds to the chassis proximity sensor through hole 26, and infrared light emitted by the first infrared lamp 12 may be reflected by an object, pass through the chassis proximity sensor through hole 26, and then be incident on the proximity sensor 50 from the cover proximity sensor through hole 37. In this case, the infrared transmissive ink 40 may be provided at a position of the cover 30 corresponding to the chassis proximity sensor through hole 26, so that it is difficult for a user to see the proximity sensor 50 inside the electronic device 100 through the chassis proximity sensor through hole 26, and the appearance of the electronic device 100 is beautiful.
In some embodiments, the cover plate 30 may further have a cover plate light sensing through hole 35, the cover plate light sensing through hole 35 corresponds to the case light sensing through hole 24 and the light sensor 1a, and visible light outside the electronic device 100 may pass through the cover plate light sensing through hole 35 and the case light sensing through hole 24 and then be incident on the light sensor 1 a.
In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.
Claims (12)
1. An input and output module is characterized in that the input and output module comprises a packaging shell, an infrared lamp, a light guide element, a proximity sensor and a light sensor, wherein the packaging shell comprises a packaging substrate, the infrared lamp, the light guide element, the proximity sensor and the light sensor are packaged in the packaging shell, the infrared lamp, the proximity sensor and the light sensor are all borne on the packaging substrate, the light guide element is movably arranged on a light emitting light path of the infrared lamp, and when the light guide element is positioned on the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a first view angle to serve as an infrared fill light or a proximity infrared lamp; when the light guide element leaves the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second field angle to serve as a near infrared lamp or an infrared light supplement lamp; the first field of view is different from the second field of view; the infrared light is emitted to the outside of the packaging shell by first power when the infrared lamp is used as the near infrared lamp, the infrared light is emitted to the outside of the packaging shell by second power when the infrared lamp is used as the infrared light supplement lamp, and the first power is different from the second power; the proximity sensor is used for receiving infrared light which is reflected by an object and emitted by the infrared lamp as a proximity infrared lamp so as to detect the distance from the object to the input and output module; the light sensor is used for receiving visible light in ambient light and detecting the intensity of the visible light.
2. The input-output module according to claim 1,
the light guide element comprises a convex lens or a lens group with positive focal power, and when the light guide element is positioned on a light emitting optical path of the infrared lamp, infrared rays emitted by the infrared lamp are emitted from the packaging shell at a first visual angle to serve as a proximity infrared lamp; when the light guide element leaves the light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second field angle to serve as an infrared light supplement lamp; or
The light guide element comprises a concave lens or a lens group with negative focal power, and when the light guide element is positioned on a light emitting light path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a first field angle to serve as an infrared light supplement lamp; when the light guide element leaves the light emitting optical path of the infrared lamp, infrared light emitted by the infrared lamp is emitted from the packaging shell at a second angle of view to serve as a proximity infrared lamp.
3. The input-output module according to claim 1, further comprising a chip on which the infrared lamp, the proximity sensor and the light sensor are formed.
4. The input-output module according to claim 3, wherein the package housing further comprises a package sidewall and a package top, the package sidewall extends from the package substrate and is connected between the package top and the package substrate, the package top is formed with a light-emitting window, a proximity sensor window and a light-sensing window, the light-emitting window corresponds to the infrared lamp, the proximity sensor window corresponds to the proximity sensor, and the light-sensing window corresponds to the light sensor.
5. The input-output module according to claim 3, further comprising a light-sensing lens and a proximity sensor lens, wherein the light-sensing lens is disposed in the package housing and corresponds to the light sensor, the proximity sensor lens corresponds to the proximity sensor, and the light-sensing lens and the proximity sensor are disposed on a same transparent substrate.
6. The input-output module according to claim 1, further comprising a plurality of metal shielding plates positioned within the package housing and between any two of the infrared lamp, the proximity sensor, and the light sensor.
7. The input-output module according to claim 1, further comprising an optical enclosure made of an optically transparent material formed on the package substrate and within the package housing, the optical enclosure enclosing the infrared lamp, the proximity sensor, and the optical sensor.
8. The input-output module according to claim 7, further comprising a plurality of light-exiting baffles formed within the optical enclosure between any two of the infrared light, the proximity sensor, and the light sensor.
9. The input-output module according to any one of claims 1 to 8, wherein a ground pin, an infrared lamp pin, a proximity sensor pin and a light sensing pin are formed on the input-output module, and when the ground pin and the infrared lamp pin are enabled, the infrared lamp emits infrared light; when the grounding pin and the proximity sensor pin are enabled, the proximity sensor is used for receiving infrared light reflected by an object and emitted by the infrared lamp as a proximity infrared lamp so as to detect the distance from the object to the input and output module; when the grounding pin and the light sensing pin are enabled, the light sensor detects the intensity of visible light.
10. An electronic device, comprising:
a housing; and
the input-output module of any one of claims 1 to 9, disposed within the housing.
11. The electronic device of claim 10, further comprising a transparent cover plate, wherein the housing defines a housing light source through hole, a housing proximity sensor through hole, and a housing light sensor through hole, the infrared lamp corresponds to the housing light source through hole, the proximity sensor corresponds to the housing proximity sensor through hole, the light sensor corresponds to the housing light sensor through hole, and the cover plate is disposed on the housing.
12. The electronic device of claim 10, further comprising a transparent cover plate, wherein the housing defines a housing light source through hole, a housing proximity sensor through hole, and a housing light sensation through hole, the infrared lamp corresponds to the housing light source through hole, the light sensation sensor corresponds to the housing light sensation through hole, the proximity sensor corresponds to the housing proximity sensor through hole, the cover plate is disposed on the housing, an infrared transmissive ink that only transmits infrared light is formed on a surface of the cover plate that is coupled to the housing, and the infrared transmissive ink blocks at least one of the housing light source through hole and the housing proximity sensor through hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711433362.XA CN108074941B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
| PCT/CN2018/118683 WO2019128625A1 (en) | 2017-12-26 | 2018-11-30 | Output module, input and output module and electronic apparatus |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711433362.XA CN108074941B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
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| CN108074941A CN108074941A (en) | 2018-05-25 |
| CN108074941B true CN108074941B (en) | 2020-04-03 |
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| CN201711433362.XA Expired - Fee Related CN108074941B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2019128625A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic apparatus |
| CN110825251B (en) * | 2018-08-07 | 2021-04-23 | Oppo广东移动通信有限公司 | Screen, electronic device, and method for manufacturing screen |
| CN112581880B (en) * | 2018-08-07 | 2022-08-16 | Oppo广东移动通信有限公司 | Screen, electronic device, and method for manufacturing screen |
| CN109639897A (en) * | 2018-12-20 | 2019-04-16 | 维沃移动通信有限公司 | A kind of light transmission method and device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103515371B (en) * | 2012-06-27 | 2016-09-21 | 格科微电子（上海）有限公司 | Integrated-type optical sensor package |
| DE102013021519A1 (en) * | 2013-12-12 | 2015-06-18 | Connaught Electronics Ltd. | Image capture device with an image sensor and a thermal infrared sensor and motor vehicle with an image capture device |
| CN107480589B (en) * | 2017-07-07 | 2020-08-04 | Oppo广东移动通信有限公司 | Infrared light source assembly and electronic device |
| CN107451542B (en) * | 2017-07-14 | 2020-09-01 | Oppo广东移动通信有限公司 | Iris identification module arrangement structure and mobile terminal |
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