CN108023984A - Input and output module and electronic device - Google Patents

Input and output module and electronic device Download PDF

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Publication number
CN108023984A
CN108023984A CN201711437124.6A CN201711437124A CN108023984A CN 108023984 A CN108023984 A CN 108023984A CN 201711437124 A CN201711437124 A CN 201711437124A CN 108023984 A CN108023984 A CN 108023984A
Authority
CN
China
Prior art keywords
infrared light
light supply
output module
input
proximity sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201711437124.6A
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Chinese (zh)
Other versions
CN108023984B (en
Inventor
吴安平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201711437124.6A priority Critical patent/CN108023984B/en
Publication of CN108023984A publication Critical patent/CN108023984A/en
Priority to PCT/CN2018/117920 priority patent/WO2019128605A1/en
Application granted granted Critical
Publication of CN108023984B publication Critical patent/CN108023984B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/30Transforming light or analogous information into electric information
    • H04N5/33Transforming infrared radiation

Abstract

Electronic device disclosed by the invention and input and output module include encapsulating housing, the first infrared light supply, the second infrared light supply, proximity sensor and optical flame detector.First infrared light supply, the second infrared light supply, proximity sensor and optical flame detector are encapsulated in encapsulating housing and are carried on package substrate.When the second infrared light supply is closed, the first infrared light supply launches infrared light to outside encapsulating housing, and input and output module is used for infrared distance measurement;Opened when the first infrared light supply and the second infrared light supply and launch infrared light to outside encapsulating housing, input and output module is used for infrared light filling.Proximity sensor is used to receive distance of the infrared light being reflected by the object with detection object to input and output module, and optical flame detector is used to receive the visible ray in ambient light to detect the intensity of visible ray.Multiple units are integrated into a single package body structure, and the integrated level of input and output module is high, has saved the space of the function for the intensity detection for realizing infrared light filling, infrared distance measurement and visible ray.

Description

Input and output module and electronic device
Technical field
The present invention relates to consumer electronics technical field, more specifically, is related to a kind of input and output module and electronics dress Put.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of the function element set It is more and more, in order to realize distance detection, ambient light detection with the function such as the facial 3D feature recognitions of user, it is necessary to be set in electronics The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth Numerous function elements is put, the excessive space of mobile phone can be taken.
The content of the invention
Embodiment of the present invention provides a kind of input and output module and electronic device.
The input and output module of embodiment of the present invention includes encapsulating housing, the first infrared light supply, around described first red The second infrared light supply, proximity sensor and the optical flame detector that outer light source is set, the encapsulating housing include package substrate, and described first Infrared light supply, second infrared light supply, proximity sensor and the optical flame detector are encapsulated in the encapsulating housing and carry On the package substrate, when second infrared light supply is closed, first infrared light supply is with the first power to the encapsulation When launching infrared light outside housing, the input and output module is used for infrared distance measurement;When first infrared light supply and described the When two infrared light supplies are opened and launched infrared light to outside the encapsulating housing with the second power, the input and output module is used In infrared light filling;The proximity sensor is used to receive the infrared light launched by first infrared light supply being reflected by the object To detect the object to the distance of the input and output module, the optical flame detector is used to receive the visible ray in ambient light, and Detect the intensity of the visible ray.
In some embodiments, first infrared light supply is point light source, second infrared light supply for point light source and Quantity is multiple;Or
First infrared light supply is point light source, and second infrared light supply is annular light source;Or
First infrared light supply is multiple around the point light source circularized, and second infrared light supply is annular light source; Or
First infrared light supply is multiple around the point light source circularized, and second infrared light supply is point light source and number Measure to be multiple;Or
First infrared light supply is annular light source;Second infrared light supply is point light source and quantity is multiple;Or
First infrared light supply is annular light source;Second infrared light supply is annular light source.
In some embodiments, the input and output module further includes chip, first infrared light supply, described second Infrared light supply, the proximity sensor and the optical flame detector are both formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly The package substrate extends and is connected between the encapsulation top and the package substrate, formed with luminous at the top of the encapsulation Window, proximity sensor window and light sensation window, the luminescence window and first infrared light supply and second infrared light Source corresponds to, and the proximity sensor window is corresponding with the proximity sensor, and the light sensation window is corresponding with the optical flame detector.
In some embodiments, the input and output module further includes light lens, and the light lens are arranged on institute State in encapsulating housing and corresponding with first infrared light supply and second infrared light supply;And/or
The input and output module further includes proximity sensor lens, and the proximity sensor lens are arranged on the encapsulation It is in housing and corresponding with the proximity sensor;And/or
The input and output module further includes light sensation lens, the light sensation lens be arranged in the encapsulating housing and with institute State optical flame detector correspondence.
In some embodiments, it is saturating to further include the light source being arranged in the encapsulating housing for the input and output module Mirror, proximity sensor lens and light sensation lens, the light lens and first infrared light supply and second infrared light supply Corresponding, the proximity sensor lens are corresponding with the proximity sensor, and the light sensation lens are corresponding with the optical flame detector, described Light lens, the proximity sensor lens and the light sensation lens are located on same transparent base.
In some embodiments, the input and output module further includes multiple metal shutters, and the multiple metal hides Baffle is located at appointing in the encapsulating housing and in second infrared light supply, the proximity sensor and the optical flame detector Meaning is between the two.
In some embodiments, the input and output module further includes the optics sealing cover made of light transmissive material, described Optics sealing cover is formed on the package substrate and in the encapsulating housing, and it is red that the optics sealing cover wraps described first Outer light source, second infrared light supply, the proximity sensor and the optical flame detector.
In some embodiments, the input and output module further include it is multiple go out light clapboard, it is the multiple go out light clapboard It is formed in any in the optics sealing cover and in second infrared light supply, the proximity sensor and the optical flame detector Between the two.
In some embodiments, draw on the input and output module formed with grounding pin, light compensating lamp pin, close to lamp Foot, proximity sensor pin and light sensation pin, the grounding pin and it is described close to lamp pin be enabled when, described first is infrared Light source launches infrared light;When the grounding pin and the light compensating lamp pin are enabled, first infrared light supply and described Second infrared light supply launches infrared light;It is described close to biography when the grounding pin and the proximity sensor pin are enabled Sensor receives the infrared light launched by first infrared light supply being reflected by the object;The grounding pin and the light sensation draw When foot is enabled, the optical flame detector receives the visible ray in environment.
The electronic device of embodiment of the present invention includes casing and above-mentioned input and output module, the input and output module It is arranged in the casing.
In some embodiments, the electronic device further includes the cover board of printing opacity, and the casing offers casing light source Through hole, casing proximity sensor through hole and casing light sensation through hole, first infrared light supply and second infrared light supply and institute Casing light source through holes correspondence is stated, the proximity sensor is corresponding with the casing proximity sensor through hole, the optical flame detector and institute Casing light sensation through hole correspondence is stated, the cover board is set on the housing.
In some embodiments, the electronic device further includes the cover board of printing opacity, and the casing offers casing light source Through hole, casing proximity sensor through hole and casing light sensation through hole, first infrared light supply and second infrared light supply and institute Casing light source through holes correspondence is stated, the proximity sensor is corresponding with the casing proximity sensor through hole, the optical flame detector and institute Casing light sensation through hole correspondence is stated, the cover board is set on the housing, and the cover board is formed with the surface that the casing is combined Have and only transmit the infrared of infrared light and pass through ink, it is described infrared to block the casing light source through holes through ink and the casing connects It is at least one in nearly sensor through hole.
The electronic device and input and output module of embodiment of the present invention coordinate when only opening the first infrared light supply close to biography Sensor, available for close to infrared distance measurement, while when opening the first infrared light supply and the second infrared light supply, available for infrared light filling, And optical flame detector can be used for visual intensity detection, in other words, the first infrared light supply, the second infrared light supply, proximity sensor A single package body structure is integrated into optical flame detector, makes input and output module group infrared distance measurement, infrared light filling and visible ray Intensity detection function.In addition, the first infrared light supply, the second infrared light supply, proximity sensor and optical flame detector are integrated into one Single package body structure, the integrated level of input and output module is higher, small volume, and input and output module, which has been saved, realizes infrared benefit The space of the function of the intensity detection of light, infrared distance measurement and visible ray.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become obvious, or recognized by the practice of embodiments of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change Obtain substantially and be readily appreciated that, wherein:
Fig. 1 is the structure diagram of the electronic device of certain embodiments of the present invention;
Fig. 2 is the schematic perspective view of the input and output module of the electronic device of certain embodiments of the present invention;
Fig. 3 to Fig. 4 is the view of the input and output module of the electronic device of certain embodiments of the present invention;
Fig. 5 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention;
Fig. 6 to Fig. 8 is the first infrared light supply and the second infrared light of the input and output module of certain embodiments of the present invention The distribution schematic diagram in source;
Fig. 9 is the part isometric schematic diagram of the input and output module of the electronic device of certain embodiments of the present invention;
Figure 10 is the partial sectional schematic view of the electronic device of certain embodiments of the present invention;
Figure 11 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention;
Figure 12 is the structure diagram of the electronic device of certain embodiments of the present invention;
Figure 13 to Figure 15 is the partial sectional schematic view of the electronic device of certain embodiments of the present invention.
Embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing To the same or similar element of expression eventually or there is same or like element.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's Embodiment, and be not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity Sub- component includes input and output module 10, imaging modules 60, receiver 70 and structured light projector 80.Electronic device 100 can To be mobile phone, tablet computer, laptop, intelligent watch, Intelligent bracelet, automatic teller machine etc., the embodiment of the present invention is filled with electronics Putting 100 is illustrated exemplified by mobile phone, it will be understood that the concrete form of electronic device 100 can be other, not limit herein System.
Refer to Fig. 2 to Fig. 5, input and output module 10 is single package body structure, including encapsulating housing 11, the first infrared light Source 12, the second infrared light supply 13, proximity sensor 50 and optical flame detector 1a.
Encapsulating housing 11 is used to encapsulate the first infrared light supply 12, the second infrared light supply 13, proximity sensor 50 and light at the same time Sensor 1a, in other words, the first infrared light supply 12, the second infrared light supply 13, proximity sensor 50 and optical flame detector 1a are encapsulated at the same time In encapsulating housing 11.Encapsulating housing 11 includes package substrate 111, package wall 112 and encapsulation top 113.Encapsulating housing 11 Can be made of electromagnetic interference (Electromagnetic Interference, EMI) shielding material, to avoid extraneous electricity Magnetic disturbance has an impact input and output module 10.
Referring to Fig. 5, package substrate 111 is used to carry the first infrared light supply 12, the second infrared light supply 13, proximity sensor 50 and optical flame detector 1a.When manufacturing input and output module 10, the first infrared light supply 12, the second infrared light supply 13, proximity sensor 50 and optical flame detector 1a can be formed on a piece of chip 14, then by the first infrared light supply 12, the second infrared light supply 13, close to sensing Device 50, optical flame detector 1a and chip 14 are set along on package substrate 111, specifically, chip 14 can be bonded in encapsulation base On plate 111.Meanwhile package substrate 111 can be used for and other parts of electronic device 100 (such as electronic device 100 Casing 20, mainboard etc.) connection, input and output module 10 is fixed in electronic device 100.
Package wall 112 can surround the first infrared light supply 12, the second infrared light supply 13, proximity sensor 50 and optical flame detector 1a is set, and package wall 112 extends from package substrate 111, and package wall 112 can be combined with package substrate 111, it is preferred that envelope Fill side wall 112 and package substrate 111 be it is detachably connected, in order to remove after package wall 112 to the first infrared light supply 12, Second infrared light supply 13, proximity sensor 50 and optical flame detector 1a are overhauled.The making material of package wall 112 can be impermeable The material of infrared light, package wall 112 is passed through to avoid the infrared light that the first infrared light supply 12 and the second infrared light supply 13 are sent.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connected with package wall 112.Encapsulation top 113 Formed with luminescence window 1131, proximity sensor window 1134 and light sensation window 1132,1131 and first infrared light of luminescence window 12 and second infrared light supply 13 of source corresponds to, and the infrared light of the first infrared light supply 12 and the transmitting of the second infrared light supply 13 is from luminescence window 1131 are pierced by;Proximity sensor window 1134 is corresponding with proximity sensor 50, close to the infrared light of the first infrared light supply 12 transmitting To pass through proximity sensor window 1134 and it can be incided after object reflects on proximity sensor 50;Light sensation window 1132 and light Sensor 1a is corresponded to, it is seen that light can pass through light sensation window 1132 and incide on optical flame detector 1a.Encapsulation top 113 and package wall 112 integrally formed can obtain, can also split shape to obtain.In one example, luminescence window 1131, proximity sensor window Mouth 1134 and light sensation window 1132 are through hole, and the making material at encapsulation top 113 is impermeable infrared light and the material of visible ray. In another example, encapsulation top 113 by the material of impermeable infrared light, saturating infrared light, be opaque to visible light but and thoroughly visible ray material Material co-manufactured forms, and specifically, luminescence window 1131 is made of the material of saturating infrared light, close to sensing port window 1134 and light Sense window 1132 is made of the material of saturating visible ray, remaining position is made of impermeable infrared light and the material being opaque to visible light but, into One step, luminescence window 1131 could be formed with lens arrangement, to improve from the infrared light emission angle that luminescence window 1131 projects Degree, such as luminescence window 1131 is formed with concavees lens structure, so that the divergence of beam through luminescence window 1131 outwards projects;Hair Light window 1131 is formed with convex lens structures, so that the light through luminescence window 1131 gathers outside injection;Proximity sensor Window 1134 is formed with convex lens mechanism, so that the infrared light through proximity sensor window 1134 is inwardly gathered and projected and connects On nearly sensor 50;Light sensation window 1132 can also be incident from light sensation window 1132 to improve formed with lens arrangement Light emitting angle, such as light sensation window 1132 have convex lens structures so as to be gathered and projected by the incident light of light sensation window 1132 Onto optical flame detector 1a.
Fig. 6 to Fig. 8 is referred to, the first infrared light supply 12, the second infrared light supply 13, proximity sensor 50 and optical flame detector 1a are equal It can be formed on a piece of chip 14, further reduce the first infrared light supply 12, the second infrared light supply 13 and optical flame detector 1a and integrate Volume afterwards, and preparation process is simpler.First infrared light supply 12 and the second infrared light supply 13 can launch infrared light.When first red When 12 and second infrared light supply 13 of outer light source is opened and launches infrared light to outside encapsulating housing 11, infrared light passes through light-emission window Mouthfuls 1131 to project body surface, and the infrared pick-up first 62 of electronic device 100 receives the infrared light that is reflected by the object to obtain The image information of object is taken, at this time, input and output module 10 is used for infrared light filling, and the first infrared light supply 12 and the second infrared light The light-emitting area that the infrared light for light filling that source 13 is launched jointly covers is larger, and the field angle α of light filling infrared light can be 60 The degree of degree -90, such as:The field angle α of light filling infrared light for 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 degree, Or 90 degree etc..It is infrared when the second infrared light supply 13 is closed, and the first infrared light supply 12 launches infrared light to outside encapsulating housing 11 Light is through luminescence window 1131 and reaches body surface, and proximity sensor 50 receives the infrared light being reflected by the object with detection object To the distance of input and output module 10, at this time, input and output module 10 is used for infrared distance measurement, and the transmitting of the first infrared light supply 12 The light-emitting area that infrared light for infrared distance measurement covers is smaller, and the field angle β of infrared distance measurement infrared light is 10 degree of -30 degree, Such as:The field angle β of infrared distance measurement infrared light is 10 degree, 15 degree, 20 degree, 25 degree or 30 degree etc..In the embodiment of the present invention In, field angle refers to scope of the infrared light through luminescence window 1131 from the outgoing covering of encapsulating housing 11.Optical flame detector 1a is received By the visible ray in the incident ambient light of light sensation window 1132, and detect the intensity of visible ray.
Input and output module 10 is used for infrared light filling and for close to can be with different power to encapsulation during infrared distance measurement Launch infrared light outside housing 11.Input and output module 10 be used for close to during infrared distance measurement with the first power to outside encapsulating housing 11 Launch infrared light, infrared light is launched to outside encapsulating housing 11 with the second power when input and output module 10 is used for infrared light filling Line, wherein, the first power can be less than second power.
Second infrared light supply 13 is set around the first infrared light supply 12.First infrared light supply 12 and the second infrared light supply 13 are whole Circular, annular, square or regular polygon etc. can be rendered as on body.Can be:First infrared light supply 12 is point light source, and second is red Outer light source 13 is also point light source and quantity is multiple;Or first infrared light supply 12 be point light source, the second infrared light supply 13 is ring Shape light source;Or first infrared light supply 12 to be multiple around the point light source circularized, the second infrared light supply 13 is annular light source;Or The first infrared light supply of person 12 is multiple around the point light source circularized, and the second infrared light supply 13 is point light source and quantity is multiple; Or first infrared light supply 12 be annular light source;Second infrared light supply 13 is point light source and quantity is multiple;Or first is infrared Light source 12 is annular light source;Second infrared light supply 13 is annular light source.It is red that proximity sensor 50 and optical flame detector 1a are arranged on first The side of 12 and second infrared light supply 13 of outer light source, that is to say, proximity sensor 50 and optical flame detector 1a are arranged on the second infrared light Outside the circular space in source 13.
Referring to Fig. 9, in embodiments of the present invention, draw on input and output module 10 formed with grounding pin 15, light compensating lamp Foot 16, close to lamp pin 17, proximity sensor pin 1g and light sensation pin 1c.Grounding pin 15, light compensating lamp pin 16, close to lamp Pin 17, proximity sensor pin 1g and light sensation pin 1c can be formed on package substrate 111, when grounding pin 15 and light filling When lamp pin 16 is enabled (that is, when grounding pin 15 and light compensating lamp pin 16 access circuit turn-on), 12 He of the first infrared light supply Second infrared light supply 13 launches infrared light;When grounding pin 15 and (that is, 15 He of grounding pin when being enabled close to lamp pin 17 When accessing circuit turn-on close to lamp pin 17), the first infrared light supply 12 transmitting infrared light;When grounding pin and proximity sensor When pin 1g is enabled, proximity sensor 50 receives the infrared light launched by the first infrared light supply 12 being reflected by the object;When When grounding pin 15 and light sensation pin 1c are enabled (that is, when grounding pin 15 and light sensation pin 1c access circuit turn-on), light sensation Device 1a detects visual intensity, using the foundation of the display brightness as control display screen 90.
Referring to Fig. 1, casing 20 can be as the installation carrier of input and output module 10, in other words, input and output module 10 can be arranged in casing 20.Casing 20 can be the shell of electronic device 100, in embodiments of the present invention, in casing 20 It can be additionally used in the display screen 90 that electronic device 100 is set, the body taken due to the input and output module 10 of embodiment of the present invention Product is smaller, therefore, in casing 20 is used to set the volume of display screen 90 to correspond to increase, to improve electronic device 100 Shield accounting.Specifically, casing 20 includes top 21 and bottom 22, and display screen 90 and input and output module 10 are arranged on 21 Hes of top Between bottom 22, in the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, input and output Module 10 can be arranged between display screen 90 and top 21.In other embodiments, display screen 90 can be that screen is opened comprehensively Equipped with notch, display screen 90 surrounds input and output module 10, and the notch of input and output module 10 from display screen 90 exposes.
Casing 20 is further opened with casing light source through holes 23, casing proximity sensor through hole 26 and casing light sensation through hole 24.It is defeated When entering to export module 10 and being arranged in casing 20, the first infrared light supply 12 and the second infrared light supply 13 and casing light source through holes 23 are right Should, proximity sensor 50 is corresponding with casing proximity sensor through hole 26, and optical flame detector 1a is corresponding with casing light sensation through hole 24.Wherein One infrared light supply 12 and the second infrared light supply 13 is corresponding with casing light source through holes 23 refers to the first infrared light supply 12 and the second infrared light The light that source 13 is sent can be passed through from casing light source through holes 23, can be the first infrared light supply 12 and the second infrared light specifically Source 13 is with 23 face of casing light source through holes or the light of the first infrared light supply 12 and the second infrared light supply 13 transmitting is through leading Casing light source through holes 23 are passed through after optical element effect.The optical flame detector 1a visible rays that refer to corresponding with casing light sensation through hole 24 can be from casing Light sensation through hole 24 is passed through and incided on optical flame detector 1a, can be optical flame detector 1a and 24 face of casing light sensation through hole specifically, It can be the light of visible ray incidence through casing light sensation through hole 24 and be incided after light-guide device acts on optical flame detector 1a.Connect Nearly sensor 50 is corresponding with casing proximity sensor through hole 26 similarly, and therefore not to repeat here.Casing light source through holes 23 and casing light It can be apart from one another by certainly, in other embodiments, casing light source through holes 23, casing proximity sensor lead to feel through hole 24 Hole 26 and casing light sensation through hole 24 can also interconnect.
Cover board 30 can be printing opacity, and the material of cover board 30 can be glass, resin, plastics of printing opacity etc..Cover board 30 is set Put on casing 20, cover board 30 includes the inner surface 32 combined with casing 20, and the outer surface 31 opposite with inner surface 32, defeated Enter to export after the light that module 10 is sent sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.Cover board 30 covers casing light Source through hole 23, casing proximity sensor through hole 26 and casing light sensation through hole 24, coated with infrared on the inner surface 32 of cover board 30 Ink 40 is crossed, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and to visible ray There is higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device By the infrared region covered through ink 40 on 100.Specifically, it is infrared to be covered on inner surface 32 not with showing through ink 40 90 corresponding region of display screen.
It is infrared to be blocked in casing light source through holes 23 and casing proximity sensor through hole 26 at least through ink 40 One, i.e. infrared to cover casing light source through holes 23 and casing proximity sensor through hole 26, Yong Hunan at the same time through ink 40 To see the internal structure of electronic device 100, electronic device by casing light source through holes 23 and casing proximity sensor through hole 26 100 shape is more beautiful;It is infrared to cover casing light source through holes 23 through ink 40 and not cover casing sensor through hole 26;Or infrared light transmission ink can also cover casing sensor through hole 26 and not cover casing light source through holes 23.
Referring to Fig. 1, receiver 70 is used to send out acoustic signals when being encouraged be subject to power supply, user can by by Words device 70 is conversed.Structured light projector 80 is used for outside emitting structural light, on project structured light to testee after it is anti- Penetrate, the structure light reflected can be received by infrared pick-up first 62, and the processor of electronic device 100 is further analyzed by infrared light The structure light that camera 62 receives, to obtain the depth information of testee.
Imaging modules 60 include visible image capturing first 61 and infrared pick-up first 62, and input and output module 10, infrared light are taken the photograph As first 62, visible image capturing is first 61, the center of receiver 70 and structured light projector 80 is located on same line segment.Specifically, from One end of line segment is followed successively by input and output module 10, structured light projector 80, receiver 70, infrared pick-up head to the other end 62nd, visible image capturing first 61, at this time, it is seen that light video camera head 61 and infrared pick-up first 62 can form double photography/videography heads;Or Input and output module 10, infrared pick-up first 62, receiver 70, visible image capturing head are followed successively by from one end of line segment to the other end 61st, structured light projector 80;Or it is followed successively by that infrared pick-up is first 62, input and output module from one end of line segment to the other end 10th, receiver 70, visible image capturing be first 61, structured light projector 80;Or it is followed successively by from one end of line segment to the other end infrared Light video camera head 62, visible image capturing are first 61, receiver 70, input and output module 10, structured light projector 80, at this time, it is seen that light Camera 61 and infrared pick-up first 62 can form double photography/videography heads.Certainly, input and output module 10, infrared pick-up head 62nd, receiver 70, visible image capturing be first 61, the arrangement mode of structured light projector 80 is not limited to above-mentioned citing, can also have Other, such as the shapes such as the center arrangement of each electronic component is in the arc-shaped, center arrangement is rectangular.
To sum up, proximity sensor is coordinated when the electronic device 100 of embodiment of the present invention only opens the first infrared light supply 12 50, available for close to infrared distance measurement, while when opening the first infrared light supply 12 and the second infrared light supply 13, available for infrared benefit Light, and optical flame detector 1a can be used for visual intensity detection, in other words, the first infrared light supply 12, the second infrared light supply 13, connect Photosensors 50 and optical flame detector 1a is integrated into a single package body structure, input and output module 10 has been gathered transmitting infrared light With the function of the intensity detection of infrared distance measurement, the function of infrared light filling and visible ray.In addition, the first infrared light supply 12, second is red Outer light source 13, be integrated into a single package body structure close to optical sensor 50 and optical flame detector 1a, and input and output module 10 integrates Higher, small volume is spent, input and output module 10 has saved the intensity detection for realizing infrared light filling, infrared distance measurement and visible ray Function space.Further, since the first infrared light supply 12, the second infrared light supply 13, close to optical sensor 50 and optical flame detector 1a Be carried on same package substrate 111, infrared light compensating lamp compared to traditional handicraft, close to infrared lamp, close to light sensing Device 50 and optical flame detector 1a need to be respectively adopted different wafers and manufacture recombinants to be encapsulated to PCB substrate, improves packaging efficiency.
Referring again to Fig. 5, in some embodiments, input and output module 10 further includes light lens 18, is passed close to light Sensor lens 1h and light sensation lens 1b.Light lens 18 are arranged in encapsulating housing 11 and red with the first infrared light supply 12 and second Outer light source 13 corresponds to.It is arranged on close to optical sensor lens 1h in encapsulating housing 11 and corresponding with proximity sensor 50.Light sensation is saturating Mirror 1b is arranged in encapsulating housing 11 and corresponding with optical flame detector 1a.First infrared light supply 12 and the second infrared light supply 13 are launched red Outer light is converged in luminescence window 1131 under the action of light lens 18 and projected, and reduction is transmitted to package wall 112 and encapsulation The light quantity in other regions at top 113, it is only necessary to meet the use that the first infrared light supply 12 and the second infrared light supply 13 are launched jointly In field angle α of the infrared light after light lens 18 of light filling be 60 degree -90 degree, the transmitting of the first infrared light supply 12 for red Field angle β of the infrared light of outer ranging after light lens 18 is 10 degree of -30 degree.Similarly, by proximity sensor window 1134 When the infrared light launched close to infrared lamp 13 by object reflection entered is incided on proximity sensor lens 1h, close to sensing Device lens 1h reduces the light quantity that the infrared light being reflected back is transferred to outside proximity sensor 50.Similarly, by light sensation window 1132 into When the visible ray entered is incided on light sensation lens 1b, light sensation lens 1b will be seen that light is converged on optical flame detector 1a, reduce visible ray The light quantity being transferred to outside optical flame detector 1a.Specifically, light lens 18, proximity sensor lens 1h and light sensation lens 1b can be located at On transparent base, more specifically, light lens 18 and light sensation lens 1b can be integrally formed with the transparent base it is obtained.Certainly, Input and output module 10 can also only set one or more in light lens 18, proximity sensor lens 1h and light sensation lens 1b It is a;Alternatively, input and output module 10 can not also set light lens 18, proximity sensor lens 1h and light sensation lens 1b.
Referring to Fig. 5, in some embodiments, input and output module 10 further includes metal shutter 1d, metal blocks Plate 1d is located in encapsulating housing 11 and positioned at the second infrared light supply 13 and proximity sensor 50 and proximity sensor 50 and optical flame detector Between 1a.Metal shutter 1d between the second infrared light supply 13 and optical flame detector 1a, can avoid the first infrared light supply 12 and Second infrared light supply 13 sends infrared light and incides on optical flame detector 1a, moreover it is possible to shields the first infrared light supply 12 and optical flame detector 1a phases Between mutually, the second infrared light supply 13 with optical flame detector 1a between each other and close to sensing 50 and electromagnetism mutual optical flame detector 1a Interference.
1 is please referred to Fig.1, in some embodiments, input and output module 10 further includes optics sealing cover 19.Optics sealing cover 19 It is made of light transmissive material, optics sealing cover 19 is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 19 wraps up Firmly the first infrared light supply 12, the second infrared light supply 13, proximity sensor 50 and optical flame detector 1a.Specifically, optics sealing cover 19 can be with Formed by encapsulating injection molding and forming technology, optics sealing cover 19 can be made of transparent thermosetting epoxy resin, to use In be not easy to soften, optics sealing cover 19 can fix the first infrared light supply 12, the second infrared light supply 13, proximity sensor 50 and light sensation Relative position between device 1a, and cause the first infrared light supply 12, the second infrared light supply 13, proximity sensor 50 and light sensation Device 1a is not easy to rock in encapsulating housing 11.
Please refer to Fig.1 1, in some embodiments, input and output module 10 further include it is multiple go out light clapboard 1e, it is multiple go out Light clapboard 1e is formed in optics sealing cover 19 and positioned at the second infrared light supply 13 and proximity sensor 50 and proximity sensor 50 Between optical flame detector 1a.Going out light clapboard 1e can stop that the first infrared light supply 12 and the second infrared light supply 13 send infrared light and enter It is mapped on proximity sensor 50 and optical flame detector 1a, while stops the visible ray for entering simultaneously directive optical flame detector 1a from light sensation window 1132 Influence the infrared light to shine and the reception of proximity sensor 50 is reflected of the first infrared light supply 12 and the second infrared light supply 13.
2 are please referred to Fig.1, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also Offer cover board sound outlet hole 34, the position correspondence of receiver 70 and cover board sound outlet hole 34 and casing sound outlet hole.Input and output module 10th, infrared pick-up is first 62, the center of visible image capturing first 61 and structured light projector 80 is located on same line segment, receiver 70 Between the line segment and the top 21 of casing 20.
On the line segment, each electronic component (input and output module on cover board 30 has not been saved in the center of receiver 70 10th, infrared pick-up is first 62, visible image capturing is first 61, structured light projector 80 etc.) horizontal space that takes.Cover board sound outlet hole 34 The marginal position of cover board 30 is opened in, and casing sound outlet hole is opened up close to top 21.
3 to Figure 15 are please referred to Fig.1, in some embodiments, cover board light source through holes 33 can also be offered on cover board 30, Cover board light source through holes 33 are corresponding with casing light source through holes 23, the infrared light of the first infrared light supply 12 and the transmitting of the second infrared light supply 13 Electronic device 100 can be pierced by after through casing light source through holes 23 from cover board light source through holes 33.
In some embodiments, cover board proximity sensor through hole 37, the close sensing of cover board can also be opened up on cover board 30 Device through hole 37 is corresponding with casing proximity sensor through hole 26, and the infrared light of the first infrared lamp 12 transmitting passes through machine after object reflects It can be incided after shell proximity sensor through hole 26 from cover board proximity sensor through hole 37 on proximity sensor 50.At this time, cover Infrared transmission ink 40 can be set on plate 30 with 26 corresponding position of casing proximity sensor through hole, and user is difficult to pass through casing Proximity sensor through hole 26 sees the proximity sensor 50 of the inside of electronic device 100, and the shape of electronic device 100 is more beautiful.
In some embodiments, cover board light sensation through hole 35, cover board light sensation through hole 35 and machine can also be opened up on cover board 30 Shell light sensation through hole 24 and optical flame detector 1a are corresponding, and the visible ray outside electronic device 100 passes through cover board light sensation through hole 35 and casing light It can be incided on optical flame detector 1a after sense through hole 24.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention. In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment or example.Moreover, description Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two, Three, unless otherwise specifically defined.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.

Claims (13)

  1. A kind of 1. input and output module, it is characterised in that the input and output module include encapsulating housing, the first infrared light supply, The second infrared light supply, proximity sensor and the optical flame detector set around first infrared light supply, the encapsulating housing include envelope Substrate is filled, first infrared light supply, second infrared light supply, proximity sensor and the optical flame detector are encapsulated in the envelope Fill in housing and carry on the package substrate, when second infrared light supply is closed, first infrared light supply is with first When power launches infrared light to outside the encapsulating housing, the input and output module is used for infrared distance measurement;When described first red It is described when outer light source is opened with second infrared light supply and launched infrared light to outside the encapsulating housing with the second power Input and output module is used for infrared light filling;The proximity sensor be used for receive be reflected by the object by first infrared light supply To detect the object to the distance of the input and output module, the optical flame detector is used to receive ambient light the infrared light of transmitting In visible ray, and detect the intensity of the visible ray.
  2. 2. input and output module according to claim 1, it is characterised in that
    First infrared light supply is point light source, and second infrared light supply is point light source and quantity is multiple;Or
    First infrared light supply is point light source, and second infrared light supply is annular light source;Or
    First infrared light supply is multiple around the point light source circularized, and second infrared light supply is annular light source;Or
    First infrared light supply is multiple around the point light source circularized, and second infrared light supply is point light source and quantity is It is multiple;Or
    First infrared light supply is annular light source;Second infrared light supply is point light source and quantity is multiple;Or
    First infrared light supply is annular light source;Second infrared light supply is annular light source.
  3. 3. input and output module according to claim 1, it is characterised in that the input and output module further includes chip, First infrared light supply, second infrared light supply, the proximity sensor and the optical flame detector are both formed in a piece of described On chip.
  4. 4. input and output module according to claim 3, it is characterised in that the encapsulating housing further include package wall and Encapsulation top, the package wall extend from the package substrate and be connected at the top of the encapsulation and the package substrate it Between, formed with luminescence window, proximity sensor window and light sensation window, the luminescence window and described first at the top of the encapsulation Infrared light supply and second infrared light supply correspond to, and the proximity sensor window is corresponding with the proximity sensor, the light It is corresponding with the optical flame detector to feel window.
  5. 5. input and output module according to claim 3, it is characterised in that it is saturating that the input and output module further includes light source Mirror, the light lens be arranged in the encapsulating housing and with first infrared light supply and second infrared light supply pair Should;And/or
    The input and output module further includes proximity sensor lens, and the proximity sensor lens are arranged on the encapsulating housing It is interior and corresponding with the proximity sensor;And/or
    The input and output module further includes light sensation lens, the light sensation lens be arranged in the encapsulating housing and with the light Sensor corresponds to.
  6. 6. input and output module according to claim 3, it is characterised in that the input and output module, which further includes, to be arranged on Light lens, proximity sensor lens and light sensation lens in the encapsulating housing, light lens and described first infrared Light source and second infrared light supply correspond to, and the proximity sensor lens are corresponding with the proximity sensor, and the light sensation is saturating Mirror is corresponding with the optical flame detector, and the light lens, the proximity sensor lens are with the light sensation lens positioned at same transparent On matrix.
  7. 7. input and output module according to claim 1, it is characterised in that the input and output module further includes multiple gold Belong to shutter, the multiple metal shutter is located in the encapsulating housing and is located at second infrared light supply, is described close In sensor and the optical flame detector it is any between the two.
  8. 8. input and output module according to claim 1, it is characterised in that the input and output module is further included by printing opacity Optics sealing cover made of material, the optics sealing cover is formed on the package substrate and in the encapsulating housing, described Optics sealing cover wraps first infrared light supply, second infrared light supply, the proximity sensor and the optical flame detector.
  9. 9. input and output module according to claim 8, it is characterised in that the input and output module further include it is multiple go out Light clapboard, it is the multiple go out light clapboard be formed in the optics sealing cover and positioned at second infrared light supply, described close to passing In sensor and the optical flame detector it is any between the two.
  10. 10. according to the input and output module described in claim 1-9 any one, it is characterised in that the input and output module On formed with grounding pin, light compensating lamp pin, close to lamp pin, proximity sensor pin and light sensation pin, the grounding pin With it is described close to lamp pin be enabled when, first infrared light supply launches infrared light;The grounding pin and the light filling When lamp pin is enabled, first infrared light supply and second infrared light supply transmitting infrared light;The grounding pin and When the proximity sensor pin is enabled, what the proximity sensor reception was reflected by the object is sent out by first infrared light supply The infrared light penetrated;When the grounding pin and the light sensation pin are enabled, the optical flame detector receives the visible ray in environment.
  11. 11. a kind of electronic device, it is characterised in that the electronic device includes:
    Casing;With
    Input and output module as described in claim 1-10 any one, the input and output module are arranged on the casing It is interior.
  12. 12. electronic device according to claim 11, it is characterised in that the electronic device further includes the cover board of printing opacity, The casing offers casing light source through holes, casing proximity sensor through hole and casing light sensation through hole, first infrared light supply Corresponding with the casing light source through holes with second infrared light supply, the proximity sensor leads to the casing proximity sensor Hole corresponds to, and the optical flame detector is corresponding with the casing light sensation through hole, and the cover board is set on the housing.
  13. 13. electronic device according to claim 11, it is characterised in that the electronic device further includes the cover board of printing opacity, The casing offers casing light source through holes, casing proximity sensor through hole and casing light sensation through hole, first infrared light supply Corresponding with the casing light source through holes with second infrared light supply, the proximity sensor leads to the casing proximity sensor Hole corresponds to, and the optical flame detector is corresponding with the casing light sensation through hole, and the cover board is set on the housing, the cover board and institute The surface for stating casing combination passes through ink formed with the infrared of infrared light is only transmitted, and the infrared ink that passes through blocks the casing It is at least one in light source through holes and the casing proximity sensor through hole.
CN201711437124.6A 2017-12-26 2017-12-26 Input/output module and electronic device Active CN108023984B (en)

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CN201711437124.6A CN108023984B (en) 2017-12-26 2017-12-26 Input/output module and electronic device
PCT/CN2018/117920 WO2019128605A1 (en) 2017-12-26 2018-11-28 Output module, input and output module and electronic apparatus

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WO2019128605A1 (en) * 2017-12-26 2019-07-04 Oppo广东移动通信有限公司 Output module, input and output module and electronic apparatus
CN110290330A (en) * 2019-06-26 2019-09-27 Oppo广东移动通信有限公司 Control method, electronic device and storage medium
WO2019218274A1 (en) * 2018-05-16 2019-11-21 深圳阜时科技有限公司 Light source module, image acquisition apparatus, identity recognition apparatus, and electronic device
CN114234817A (en) * 2021-12-16 2022-03-25 昆山乔格里光电科技有限公司 Ambient light and distance sensor and packaging method thereof

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CN107463877A (en) * 2017-07-05 2017-12-12 广东欧珀移动通信有限公司 Method for collecting iris, electronic installation and computer-readable recording medium
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CN107463877A (en) * 2017-07-05 2017-12-12 广东欧珀移动通信有限公司 Method for collecting iris, electronic installation and computer-readable recording medium
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Publication number Priority date Publication date Assignee Title
WO2019128605A1 (en) * 2017-12-26 2019-07-04 Oppo广东移动通信有限公司 Output module, input and output module and electronic apparatus
WO2019218274A1 (en) * 2018-05-16 2019-11-21 深圳阜时科技有限公司 Light source module, image acquisition apparatus, identity recognition apparatus, and electronic device
CN110290330A (en) * 2019-06-26 2019-09-27 Oppo广东移动通信有限公司 Control method, electronic device and storage medium
CN110290330B (en) * 2019-06-26 2022-03-29 Oppo广东移动通信有限公司 Control method, electronic device, and storage medium
CN114234817A (en) * 2021-12-16 2022-03-25 昆山乔格里光电科技有限公司 Ambient light and distance sensor and packaging method thereof

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