CN108183984A - Input and output module and electronic device - Google Patents
Input and output module and electronic device Download PDFInfo
- Publication number
- CN108183984A CN108183984A CN201711433092.2A CN201711433092A CN108183984A CN 108183984 A CN108183984 A CN 108183984A CN 201711433092 A CN201711433092 A CN 201711433092A CN 108183984 A CN108183984 A CN 108183984A
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- China
- Prior art keywords
- infrared light
- light supply
- light
- input
- output module
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/74—Circuitry for compensating brightness variation in the scene by influencing the scene brightness using illuminating means
Abstract
Electronic device disclosed by the invention and input and output module include encapsulating housing, the first infrared light supply, the second infrared light supply and optical flame detector around the setting of the first infrared light supply, encapsulating housing includes package substrate, first infrared light supply, the second infrared light supply and optical flame detector are encapsulated in encapsulating housing and are carried on package substrate, when the second infrared light supply is closed, when first infrared light supply emits outside encapsulating housing infrared light with the first power, input and output module is used for infrared distance measurement；When the first infrared light supply and the second infrared light supply are opened and emit infrared light outside encapsulating housing with the second power, input and output module is used for infrared light filling；Optical flame detector is used to receive the visible ray in ambient light, and detect the intensity of visible ray.First infrared light supply, the second infrared light supply and optical flame detector are integrated into a single package body structure, and the integrated level of input and output module is high, has saved the space of the function of the intensity detection of the infrared light filling of realization, infrared distance measurement and visible ray.
Description
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of input and output module and electronics dress
It puts.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of function element set
It is more and more, in order to realize the functions such as the facial 3D feature recognitions of distance detection, environment light detection and user, need to set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be occupied.
Invention content
Embodiment of the present invention provides a kind of input and output module and electronic device.
The input and output module of embodiment of the present invention includes encapsulating housing, the first infrared light supply, around described first red
Outer light source setting the second infrared light supply and optical flame detector, the encapsulating housing include package substrate, first infrared light supply,
Second infrared light supply and the optical flame detector are encapsulated in the encapsulating housing and carry on the package substrate, work as institute
The closing of the second infrared light supply is stated, when first infrared light supply emits outside the encapsulating housing infrared light with the first power,
The input and output module is used for infrared distance measurement；When first infrared light supply and second infrared light supply are opened and with the
When two power emit infrared light outside the encapsulating housing, the input and output module is used for infrared light filling；The optical flame detector
For receiving the visible ray in ambient light, and detect the intensity of the visible ray.
In some embodiments, first infrared light supply is point light source, second infrared light supply for point light source and
Quantity is multiple；Or
First infrared light supply is point light source, and second infrared light supply is annular light source；Or
For first infrared light supply to be multiple around the point light source circularized, second infrared light supply is annular light source；
Or
For first infrared light supply to be multiple around the point light source circularized, second infrared light supply is point light source and number
It is multiple to measure；Or
First infrared light supply is annular light source；Second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is annular light source.
In some embodiments, the input and output module further includes chip, first infrared light supply, described second
Infrared light supply and the optical flame detector are both formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly
The package substrate extends and is connected at the top of the encapsulation between the package substrate, is formed at the top of the encapsulation luminous
Window and light sensation window, the luminescence window is corresponding with first infrared light supply and second infrared light supply, the light sensation
Window is corresponding with the optical flame detector.
In some embodiments, the input and output module further includes light lens, and the light lens are arranged on institute
It states in encapsulating housing and corresponding with first infrared light supply and second infrared light supply；And/or
The input and output module further includes light sensation lens, the light sensation lens be arranged in the encapsulating housing and with institute
State optical flame detector correspondence.
In some embodiments, the input and output module further includes the light lens being arranged in the encapsulating housing
And light sensation lens, the light lens are corresponding with first infrared light supply and second infrared light supply, the light sensation lens
Corresponding with the optical flame detector, the light lens are located at the light sensation lens on same transparent base.
In some embodiments, the input and output module further includes metal shutter, and the metal shutter is located at
In the encapsulating housing and between second infrared light supply and the optical flame detector.
In some embodiments, the input and output module further includes the optics sealing cover made of translucent material, described
Optics sealing cover is formed on the package substrate and in the encapsulating housing, and it is red that the optics sealing cover wraps described first
Outer light source, second infrared light supply and the optical flame detector.
In some embodiments, the input and output module further includes out light clapboard, it is described go out light clapboard be formed in institute
It states in optics sealing cover and between second infrared light supply and the optical flame detector.
In some embodiments, grounding pin, light compensating lamp pin are formed on the input and output module, drawn close to lamp
Foot and light sensation pin, the grounding pin and it is described close to lamp pin be enabled when, first infrared light supply emits infrared light
Line；When the grounding pin and the light compensating lamp pin are enabled, first infrared light supply and second infrared light supply hair
Penetrate infrared light；When the grounding pin and the light sensation pin are enabled, the intensity of the optical flame detector detection visible ray.
Input and output of the electronic device of embodiment of the present invention described in including casing and above-mentioned any one embodiment
Module, the input and output module are arranged in the casing.
In some embodiments, the electronic device further includes the cover board of light transmission, and the casing offers casing light source
Through-hole and casing light sensation through-hole, first infrared light supply and second infrared light supply are corresponding with the casing light source through holes,
The optical flame detector is corresponding with the casing light sensation through-hole, and the cover board setting is on the housing.
In some embodiments, the electronic device further includes the cover board of light transmission, and the casing offers casing light source
Through-hole and casing light sensation through-hole, first infrared light supply and second infrared light supply are corresponding with the casing light source through holes,
The optical flame detector is corresponding with the casing light sensation through-hole, and the cover board is set on the housing, the cover board and the casing
With reference to surface be formed with and only transmit the infrared through ink of infrared light, it is described infrared to block the casing light source through ink and lead to
Hole.
In some embodiments, the electronic device further includes proximity sensor and imaging modules, proximity sensor institute
It states imaging modules and includes microscope base, the lens barrel on the microscope base and the imaging sensor being housed in the microscope base, it is described
Microscope base includes the mounting surface between the lens barrel and described image sensor, and the proximity sensor is arranged on the installation
Face.
In some embodiments, the electronic device further includes imaging modules and proximity sensor, the imaging modules
On the housing, the imaging modules include camera case and camera lens module, and the top surface of the camera case is ladder for installation
Face and including connected the first sub- top surface and the second sub- top surface, the relatively described first sub- top surface inclination in the second sub- top surface and with
The first sub- top surface forms notch, and the top surface offers light extraction through-hole, and the camera lens module is housed in the camera case
Interior and corresponding with the light extraction through-hole, the proximity sensor is arranged at the described first sub- top surface.
In some embodiments, the electronic device further includes imaging modules and proximity sensor, the imaging modules
Including camera case and two camera lens modules, notch is offered to form step-like top surface on the top surface of the camera case,
The top surface includes the first tread and the second tread less than first tread, opens up that there are two light extractions on first tread
Through-hole, each light extraction through-hole is corresponding with the camera lens module, and the proximity sensor is arranged at second tread.
In some embodiments, the electronic device further includes imaging modules and proximity sensor, the imaging modules
Lens barrel and part including microscope base, on the microscope base are arranged on the substrate in the microscope base, and the proximity sensor is set
It puts on the substrate.
When the electronic device and input and output module of embodiment of the present invention only open the first infrared light supply, available for approaching
Infrared distance measurement, while when the first infrared light supply of unlatching and the second infrared light supply, available for infrared light filling, and optical flame detector can also be used
It is detected in visual intensity, in other words, the first infrared light supply, the second infrared light supply and optical flame detector are integrated into a single packaging body knot
Structure makes input and output module group emit infrared light with the intensity detection of infrared distance measurement, the function of infrared light filling and visible ray
Function.In addition, the first infrared light supply, the second infrared light supply and optical flame detector are integrated into a single package body structure, input and output
The integrated level of module is higher, small volume, and input and output module has saved the infrared light filling of realization, infrared distance measurement and visible ray
The space of the function of intensity detection.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
It obtains significantly and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of certain embodiments of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 3 to Fig. 4 is the status diagram of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 5 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention；
Fig. 6 to Fig. 8 is the first infrared light supply and the second infrared light of the input and output module of certain embodiments of the present invention
The distribution schematic diagram in source；
Fig. 9 is the part isometric schematic diagram of the input and output module of the electronic device of certain embodiments of the present invention；
Figure 10 is the partial sectional schematic view of the electronic device of certain embodiments of the present invention；
Figure 11 is the proximity sensor of the electronic device of certain embodiments of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 12 is the arrangement schematic diagram of the electronic component of the electronic device of certain embodiments of the present invention；
Figure 13 is the schematic cross-section of the input and output module of the electronic device of certain embodiments of the present invention；
Figure 14 is the structure diagram of the electronic device of certain embodiments of the present invention；
Figure 15 is the partial sectional schematic view of the electronic device of certain embodiments of the present invention
Figure 16 is the partial sectional schematic view of the electronic device of certain embodiments of the present invention；
Figure 17 to Figure 24 is the proximity sensor of the electronic device of certain embodiments of the present invention and the solid of imaging modules
Schematic diagram.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the whole element for representing same or similar element or there is same or like function.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature right over second feature or oblique upper or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity
Sub- component includes input and output module 10, proximity sensor 50 (such as Figure 11), imaging modules 60 (such as Figure 11), 70 and of receiver
Structured light projector 80.Electronic device 100 can be mobile phone, tablet computer, laptop, smartwatch, Intelligent bracelet, cabinet
Member's machine etc., the embodiment of the present invention is illustrated so that electronic device 100 is mobile phone as an example, it will be understood that electronic device 100 it is specific
Form can be other, and this is not restricted.
Fig. 2 to Fig. 5 is please referred to, input and output module 10 is single package body structure, including encapsulating housing 11, the first infrared light
Source 12, the second infrared light supply 13 and optical flame detector 1a.
Encapsulating housing 11 for encapsulating the first infrared light supply 12, the second infrared light supply 13 and optical flame detector 1a simultaneously, in other words,
First infrared light supply 12, the second infrared light supply 13 and optical flame detector 1a are encapsulated in encapsulating housing 11 simultaneously.Encapsulating housing 11 wraps
Include package substrate 111, package wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference
(Electromagnetic Interference, EMI) shielding material is made, to avoid extraneous electromagnetic interference to input and output
Module 10 has an impact.
Incorporated by reference to Fig. 5, package substrate 111 is for the first infrared light supply 12 of carrying, the second infrared light supply 13 and optical flame detector 1a.
When manufacturing input and output module 10, the first infrared light supply 12, the second infrared light supply 13 and optical flame detector 1a can be formed in a piece of
On chip 14, then the first infrared light supply 12, the second infrared light supply 13, optical flame detector 1a and chip 14 be set along in package substrate
On 111, specifically, chip 14 can be bonded on package substrate 111.Meanwhile package substrate 111 can be used for and electronics
Other parts (such as the casing 20 of electronic device 100, mainboard etc.) connection of device 100, input and output module 10 is consolidated
It is scheduled in electronic device 100.
Package wall 112 can surround the first infrared light supply 12, the second infrared light supply 13 and optical flame detector 1a settings, package-side
Wall 112 extends from package substrate 111, and package wall 112 can be combined with package substrate 111, preferably, package wall 112 and envelope
Substrate 111 is filled to be detachably connected, in order to remove after package wall 112 to the first infrared light supply 12, the second infrared light supply
13 and optical flame detector 1a is overhauled.The making material of package wall 112 can be the material of impermeable infrared light, red to avoid first
The infrared light that 12 and second infrared light supply 13 of outer light source is sent out passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connect with package wall 112.Encapsulation top 113
It is formed with luminescence window 1131 and light sensation window 1132,1131 and first infrared light supply 12 of luminescence window and the second infrared light supply 13
Corresponding, the infrared light of the first infrared light supply 12 and the transmitting of the second infrared light supply 13 is pierced by from luminescence window 1131；Light sensation window
1132 is corresponding with optical flame detector 1a, it is seen that light can pass through light sensation window 1132 and be incident on optical flame detector 1a.Encapsulation top 113 with
Package wall 112 integrally formed can obtain, can also split shape to obtain.In one example, luminescence window 1131 and light
It is through-hole to feel window 1132, and the making material at encapsulation top 113 is impermeable infrared light and the material being opaque to visible light but.Another
In example, encapsulation top 113 by the material of impermeable infrared light, saturating infrared light, be opaque to visible light but and thoroughly visible ray material it is common
Be fabricated, specifically, luminescence window 1131 is made of the material of saturating infrared light, light sensation window 1132 by saturating visible ray material
It is made, remaining position is made of impermeable infrared light and the material being opaque to visible light but, and further, luminescence window 1131 can be formed
Have lens arrangement, to improve the infrared light emission angle that is projected from luminescence window 1131, such as luminescence window 1131 be formed with it is recessed
Lens arrangement, so that the divergence of beam across luminescence window 1131 projects outward；Luminescence window 1131 is formed with convex lens structures,
So that the light across luminescence window 1131 gathers outside injection；Light sensation window 1132 can also be formed with lens arrangement, to change
The kind VISIBLE LIGHT EMISSION angle incident from light sensation window 1132, such as light sensation window 1132 have convex lens structures so that by light sensation window
The incident light of mouth 1132 are gathered and are projected on optical flame detector 1a.
First infrared light supply 12, the second infrared light supply 13 and optical flame detector 1a can be formed on a piece of chip 14, into one
Step reduces the volume after the first infrared light supply 12, the second infrared light supply 13 and optical flame detector 1a are integrated, and preparation process is simpler.The
One infrared light supply 12 and the second infrared light supply 13 can emit infrared light.When the first infrared light supply 12 and the second infrared light supply 13 are opened
When opening and emitting infrared light outside encapsulating housing 11 (as shown in Figure 3), infrared light passes through luminescence window 1131 to project object
Body surface face, the infrared pick-up head 62 of electronic device 100 is (as shown in Figure 1) to receive the infrared light that is reflected by the object to obtain object
Image information, at this point, input and output module 10 is used for infrared light filling, and the first infrared light supply 12 and the second infrared light supply 13 are common
The light-emitting area covered with the infrared light for light filling of transmitting is larger, and the field angle α of light filling infrared light can be 60 degree -90
Degree, such as：The field angle α of light filling infrared light is 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 degree or 90 degree
Deng.When the second infrared light supply 13 is closed, and the first infrared light supply 12 emits infrared light outside encapsulating housing 11 (such as Fig. 4 institutes
Show), infrared light passes through luminescence window 1131 and reaches body surface, and the proximity sensor 50 of electronic device 100 is (such as Figure 11 institutes
Show) distance of the infrared light being reflected by the object with detection object to electronic device 100 is received, at this point, input and output module 10 is used
It is smaller in the light-emitting area that the infrared light for infrared distance measurement of infrared distance measurement, and the transmitting of the first infrared light supply 12 covers, it is infrared
The field angle β of ranging infrared light is 10 degree of -30 degree, such as：The field angle β of infrared distance measurement infrared light for 10 degree, 15 degree, 20
Degree, 25 degree or 30 degree etc..In an embodiment of the present invention, field angle refers to that infrared light passes through luminescence window 1131 from encapsulation
The range of the outgoing covering of housing 11.Optical flame detector 1a is received by the visible ray in the incident ambient light of light sensation window 1132, and is detected
The intensity of visible ray.
Input and output module 10 can be with different power to encapsulation for infrared light filling and during for approaching infrared distance measurement
Emit infrared light outside housing 11.Input and output module 10 be used for close to during infrared distance measurement with the first power outside encapsulating housing 11
Emit infrared light, infrared light is emitted outside encapsulating housing 11 with the second power when input and output module 10 is used for infrared light filling
Line, wherein, the first power can be less than second power.
Second infrared light supply 13 is set around the first infrared light supply 12.First infrared light supply 12 and the second infrared light supply 13 are whole
Round, annular, rectangular or regular polygon etc. can be rendered as on body.Can be：First infrared light supply 12 is point light source, and second is red
Outer light source 13 is also point light source and quantity is multiple (as shown in Figure 6)；Or first infrared light supply 12 be point light source, second is infrared
Light source 13 is annular light source (as shown in Figure 7)；Or first infrared light supply 12 to be multiple red around the point light source circularized, second
Outer light source 13 is annular light source；Or first infrared light supply 12 to be multiple around the point light source circularized, the second infrared light supply 13
It is multiple (as shown in Figure 8) for point light source and quantity；Or first infrared light supply 12 be annular light source；Second infrared light supply 13 is
Point light source and quantity are multiple；Or first infrared light supply 12 be annular light source；Second infrared light supply 13 is annular light source.Light sensation
Device 1a is arranged on the side of the first infrared light supply 12 and the second infrared light supply 13, that is to say, it is infrared that optical flame detector 1a is arranged on second
Outside the circular space of light source 13.
Incorporated by reference to Fig. 9, in embodiments of the present invention, grounding pin 15 is formed on input and output module 10, light compensating lamp draws
Foot 16, close to lamp pin 17 and light sensation pin 1c.Grounding pin 15, light compensating lamp pin 16, close to lamp pin 17 and light sensation pin
1c can be formed on package substrate 111, when grounding pin 15 and light compensating lamp pin 16 are enabled (that is, 15 He of grounding pin
When light compensating lamp pin 16 accesses circuit turn-on), the first infrared light supply 12 and the second infrared light supply 13 transmitting infrared light；Work as ground connection
Pin 15 and close to lamp pin 17 be enabled when (that is, grounding pin 15 and close to lamp pin 17 access circuit turn-on when), first
Infrared light supply 12 emits infrared light；When grounding pin 15 and light sensation pin 1c are enabled (that is, grounding pin 15 and light sensation draw
Foot 1c access circuit turn-on when), optical flame detector 1a detection visual intensity, using the display brightness as control display screen 90 according to
According to.
It please refers to Fig.1 and Figure 10, casing 20 can be as the installation carrier of input and output module 10, in other words, input is defeated
Going out module 10 can be arranged in casing 20.Casing 20 can be the shell of electronic device 100, in embodiments of the present invention, machine
It can also be used to set the display screen 90 of electronic device 100 in shell 20, since the input and output module 10 of embodiment of the present invention accounts for
Small volume, therefore, for setting the volume of display screen 90 that can correspond to increase in casing 20, to improve electronic device
100 screen accounting.Specifically, casing 20 includes top 21 and bottom 22, and display screen 90 and input and output module 10 are arranged on top
Between portion 21 and bottom 22, in the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, such as
Shown in Fig. 1, input and output module 10 can be arranged between display screen 90 and top 21.In other embodiments, display screen
90 can be that screen open up jagged comprehensively, and display screen 90 surrounds input and output module 10, and input and output module 10 is from display
The notch of screen 90 exposes.
Casing 20 is further opened with casing light source through holes 23 and casing light sensation through-hole 24.Input and output module 10 is arranged on casing
When in 20, the first infrared light supply 12 and the second infrared light supply 13 are corresponding with casing light source through holes 23, optical flame detector 1a and casing light sensation
Through-hole 24 corresponds to.Wherein the first infrared light supply 12 and the second infrared light supply 13 is corresponding with casing light source through holes 23 refers to the first infrared light
The light that 12 and second infrared light supply 13 of source is sent out can be passed through from casing light source through holes 23, can be the first infrared light specifically
12 and second infrared light supply 13 of source and 23 face of casing light source through holes or the first infrared light supply 12 and the second infrared light supply
The light of 13 transmittings passes through casing light source through holes 23 after light-guide device acts on.Optical flame detector 1a is corresponding with casing light sensation through-hole 24 to be referred to
Visible ray can be passed through from casing light sensation through-hole 24 and is incident on optical flame detector 1a, can be optical flame detector 1a and casing specifically
24 face of light sensation through-hole or the light of visible ray incidence pass through casing light sensation through-hole 24 and enter after light-guide device acts on
It is mapped on optical flame detector 1a.Casing light source through holes 23 and casing light sensation through-hole 24 can be apart from one another by certainly, in other implementations
In example, casing light source through holes 23 and casing light sensation through-hole 24 can also interconnect.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set
It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated
Enter to export after the light that module 10 is sent out sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In reality as shown in Figure 10
It applies in example, cover board 30 covers casing light source through holes 23 and casing light sensation through-hole 24, is coated on the inner surface 32 of cover board 30 infrared
It is infrared to have higher transmitance to infrared light through ink 40 through ink 40, such as 85% or more is can reach, and to visible
Light has higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device
By the infrared region covered through ink 40 on 100.Specifically, it is infrared to be covered on inner surface 32 not with showing through ink 40
90 corresponding region of display screen.
Infrared to block casing light source through holes 23 (as shown in Figure 10) through ink 40, user is difficult to through casing light
Source through-hole 23 sees the internal structure of electronic device 100, and the shape of electronic device 100 is more beautiful.
1 is please referred to Fig.1, proximity sensor 50 is single packaging body.First infrared light supply 12 and the second infrared light supply 13 are used as
The infrared light sent out during close to infrared lamp after being reflected by external object, is received, proximity sensor 50 by proximity sensor 50
Judge the distance between external object and electronic device 100 according to the infrared light being reflected by the object received.
It please refers to Fig.1 and Figure 11, imaging modules 60 can be visible image capturing head 61 and one in infrared pick-up head 62
It is a or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, image
Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, and mounting surface 631 is located at lens barrel 64 and imaging sensor 65
Between.In embodiment as shown in figure 11, proximity sensor 50 is arranged on mounting surface 631, specifically, proximity sensor 50
It is at least partly dropped on mounting surface 631 in the plane orthographic projection where mounting surface 631, in this way, proximity sensor 50 and imaging
Module 60 sets compacter, and the horizontal space that the two occupies jointly is smaller.
Referring to Fig. 1, receiver 70 is for sending out acoustic signals when being encouraged by power supply, user can by by
Words device 70 is conversed.Structured light projector 80 is used for outside emitting structural light, on project structured light to testee after it is anti-
It penetrates, the structure light reflected can be received by infrared pick-up head 62, and the processor of electronic device 100 is further analyzed by infrared light
The structure light that camera 62 receives, to obtain the depth information of testee.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, defeated
The center for entering to export module 10, infrared pick-up head 62, visible image capturing head 61, receiver 70 and structured light projector 80 is located at
On same line segment.Specifically, be followed successively by from one end of line segment to the other end input and output module 10, structured light projector 80, by
Device 70, infrared pick-up head 62, visible image capturing head 61 (as shown in figure 12) are talked about, at this point, visible image capturing head 61 and infrared light
Camera 62 can form double photography/videography heads (as shown in figure 21)；Or input and output are followed successively by the other end from one end of line segment
Module 10, infrared pick-up head 62, receiver 70, visible image capturing head 61, structured light projector 80 (as shown in Figure 1)；Or
Infrared pick-up head 62, input and output module 10, receiver 70, visible image capturing head are followed successively by from one end of line segment to the other end
61st, structured light projector 80；Or infrared pick-up head 62, visible image capturing head are followed successively by from one end of line segment to the other end
61st, receiver 70, input and output module 10, structured light projector 80, at this point, visible image capturing head 61 and infrared pick-up head 62
Double photography/videography heads (as shown in figure 21) can be formed.Certainly, input and output module 10, infrared pick-up head 62, receiver 70, can
See light video camera head 61, the arrangement mode of structured light projector 80 is not limited to above-mentioned citing, can also have other, such as each electronics
The center of component arranges the shapes such as in the arc-shaped, center arrangement is rectangular.
Further, incorporated by reference to Figure 11, proximity sensor 50 can be arranged on the mounting surface 631 of infrared pick-up head 62
On, it can also be arranged on the mounting surface 631 of visible image capturing head 61, certainly, proximity sensor 50 can not also be arranged on peace
On dress face 631, proximity sensor 50 can be disposed adjacent with input and output module 10, and proximity sensor 50 is readily received by defeated
Emit, and the infrared light being reflected back by external object when entering to export module 10 for close to infrared distance measurement；Proximity sensor 50
Can be disposed adjacent with receiver 70, when user receives calls, proximity sensor 50 be readily detected the ear of user close to
Receiver 70.
To sum up, when the electronic device 100 of embodiment of the present invention only opens the first infrared light supply 12, available for close to infrared
Ranging, while when the first infrared light supply 12 of unlatching and the second infrared light supply 13, available for infrared light filling, and optical flame detector 1a can also
It is detected for visual intensity, in other words, the first infrared light supply 12, the second infrared light supply 13 and optical flame detector 1a are integrated into a list
Package body structure makes input and output module 10 gather transmitting infrared light with infrared distance measurement, the function of infrared light filling and visible ray
Intensity detection function.In addition, the first infrared light supply 12, the second infrared light supply 13 and optical flame detector 1a are integrated into a single encapsulation
Body structure, the integrated level of input and output module 10 is higher, small volume, input and output module 10 saved the infrared light filling of realization,
The space of the function of the intensity detection of infrared distance measurement and visible ray.In addition, due to the first infrared light supply 12, the second infrared light supply
13 and optical flame detector 1a is carried on same package substrate 111, infrared light compensating lamp compared to traditional handicraft, close to infrared
Lamp and optical flame detector 1a, which need to be respectively adopted in different wafer manufacture recombinants to PCB substrate, to be encapsulated, and improves packaging efficiency.
Referring again to Fig. 5, in some embodiments, input and output module 10 further includes light lens 18 and light sensation lens
1b.Light lens 18 are arranged in encapsulating housing 11 and corresponding with the first infrared light supply 12 and the second infrared light supply 13.Light sensation is saturating
Mirror 1b is arranged in encapsulating housing 11 and corresponding with optical flame detector 1a.First infrared light supply 12 and the second infrared light supply 13 emit red
Outer light is converged in luminescence window 1131 under the action of light lens 18 and is projected, and reduction is emitted to package wall 112 and encapsulation
The light quantity in other regions at top 113, it is only necessary to meet the use that the first infrared light supply 12 and the second infrared light supply 13 emit jointly
It is 60 degree -90 degree in field angle α of the infrared light after light lens 18 of light filling, being used for for the first infrared light supply 12 transmitting is red
Field angle β of the infrared light of outer ranging after light lens 18 is 10 degree of -30 degree.Similarly, entered by light sensation window 1132
When visible ray is incident on light sensation lens 1b, light sensation lens 1b will be seen that light is converged on optical flame detector 1a, reduce transmission of visible light
To optical flame detector 1a with the light quantity of exterior domain.Specifically, light lens 18 and light sensation lens 1b can be located on transparent base, more
Body, light lens 18 and light sensation lens 1b can be integrally formed with the transparent base and be made.Certainly, input and output module 10
One in light lens 18 and light sensation lens 1b can be only set；Alternatively, input and output module 10 can not also set light source
Lens 18 and light sensation lens 1b.
Referring to Fig. 5, in some embodiments, input and output module 10 further includes metal shutter 1d, metal blocks
Plate 1d is located in encapsulating housing 11 and between the second infrared light supply 13 and optical flame detector 1a.It is red that metal shutter 1d is located at second
Between outer light source 13 and optical flame detector 1a, the infrared light that the first infrared light supply 12 and the second infrared light supply 13 are sent out can be avoided to enter
It is mapped on optical flame detector 1a, moreover it is possible to shield the first infrared light supply 12 and electromagnetic interference mutual optical flame detector 1a and shielding second
Infrared light supply 13 and electromagnetic interference mutual optical flame detector 1a.
3 are please referred to Fig.1, in some embodiments, input and output module 10 further includes optics sealing cover 19.Optics sealing cover 19
It is made of translucent material, optics sealing cover 19 is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 19 wraps up
Firmly the first infrared light supply 12, the second infrared light supply 13 and optical flame detector 1a.Specifically, optics sealing cover 19 can be injection molded as by encapsulating
Type technique is formed, and optics sealing cover 19 may be used transparent thermosetting epoxy resin and be made, to be not easy to soften in use, optics
Sealing cover 19 can fix the relative position between the first infrared light supply 12, the second infrared light supply 13 and optical flame detector 1a three, and make
The first infrared light supply 12, the second infrared light supply 13 and optical flame detector 1a is obtained to be not easy to shake in encapsulating housing 11.
3 are please referred to Fig.1, in some embodiments, input and output module 10 further includes out light clapboard 1e, goes out light clapboard 1e
It is formed in optics sealing cover 19 and between the second infrared light supply 13 and optical flame detector 1a.Going out light clapboard 1e can stop that first is red
The infrared light that 12 and second infrared light supply 13 of outer light source is sent out is incident on optical flame detector 1a, while is stopped from light sensation window 1132
Into visible ray the first infrared light supply 12 of influence of simultaneously directive optical flame detector 1a and shining for the second infrared light supply 13.
1 is please referred to Fig.1, in some embodiments, the proximity sensor 50 of the above embodiment can be arranged on microscope base
On 63 mounting surface 631.Microscope base 63 can be the microscope base 63 of infrared pick-up head 62 or the mirror of visible image capturing head 61
Seat 63.
4 are please referred to Fig.1, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Cover board sound outlet hole 34 is offered, receiver 70 is corresponding with the position of cover board sound outlet hole 34 and casing sound outlet hole.Input and output module
10th, the center of infrared pick-up head 62, visible image capturing head 61 and structured light projector 80 is located on same line segment, receiver 70
Between the line segment and the top 21 of casing 20.
The center of receiver 70 is not located on the line segment, has saved each electronic component (input and output module on cover board 30
10th, infrared pick-up head 62, visible image capturing head 61, structured light projector 80 etc.) occupy horizontal space.As shown in figure 14
Embodiment in, cover board sound outlet hole 34 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
Referring again to Figure 15, in some embodiments, cover board light source through holes 33, cover board can also be offered on cover board 30
Light source through holes 33 are corresponding with casing light source through holes 23, and the infrared light of the first infrared light supply 12 and the transmitting of the second infrared light supply 13 passes through
Electronic device 100 can be pierced by after casing light source through holes 23 from cover board light source through holes 33.
6 are please referred to Fig.1, cover board light sensation through-hole 35, cover board light sensation can also be opened up in some embodiments, on cover board 30
Through-hole 35 and casing light sensation through-hole 24 and optical flame detector 1a are corresponding, and the visible ray outside electronic device 100 passes through cover board light sensation through-hole
35 and casing light sensation through-hole 24 after can be incident on optical flame detector 1a.
7 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on
On substrate 66, proximity sensor 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, the one of substrate 66
Part is located in microscope base 63, and another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and for carrying image biography
Sensor 65, the other end can be connect with the mainboard of electronic device 100.When proximity sensor 50 is arranged on substrate 66, close to biography
Sensor 50 is arranged on outside microscope base 63, and proximity sensor 50 can also be connect with FPC.
Imaging modules 60 can be visible image capturing head 61 and one or two in infrared pick-up head 62.Specifically,
Proximity sensor 50 can be fixed on the substrate 66 of visible image capturing head 61；Proximity sensor 50 can be fixed on infrared light and take the photograph
As first 62 substrate 66 on.Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on opposite with proximity sensor 50
Side, to increase the integral strength of substrate 66 so that FPC is not susceptible to around folding, while proximity sensor 50 is arranged on substrate 66
It was not susceptible to shake when upper.In one example, proximity sensor 50 may be also secured on the lateral wall of microscope base 63, such as logical
Cohesive mode is crossed to be fixed on the lateral wall of microscope base 63.
8 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67
Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- top surface 672 and the sub- top surface 673 of third, the second son top
672 and first sub- top surface 671 of face tilts connection and forms notch 675, the sub- top surface 673 and second of third with the first sub- top surface 671
Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- top surface 671 and the sub- top surface 673 of third to connect first
Sub- top surface 671 and the sub- top surface 673 of third.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight
Angle, the angle between the second sub- top surface 672 and the sub- top surface 673 of third can be obtuse angle or right angle.Notch 675 is opened in camera shell
On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.The sub- top surface 673 of third offers out
Light through-hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through-hole 674.Imaging sensor 65 is housed in
In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens mould
Group 68 is simultaneously transmitted on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Proximity sensor 50 is set
At the first sub- top surface 671.In present embodiment, imaging modules 60 can be visible image capturing head 61, and proximity sensor 50 is
Single packaging body.In other embodiments, imaging modules 60 can be infrared pick-up head 62.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 50 is arranged on the first son and is pushed up
On face 671, proximity sensor 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, section
Installation space about in electronic device 100.
Please continue to refer to Figure 18, in some embodiments, the proximity sensor 50 of the above embodiment is arranged on first
On sub- top surface 671 and positioned at the outside of camera case 67, specifically, entire proximity sensor 50 is along perpendicular to the first sub- top surface
671 projection can be located in the first sub- top surface 671 (as shown in figure 18)；Alternatively, part proximity sensor 50 along perpendicular to
The projection of first sub- top surface 671 is located in the first sub- top surface 671.It is located at that is, proximity sensor 50 is at least part of
The surface of first sub- top surface 671, in this way, proximity sensor 50 sets compacter with imaging modules 60, the two occupies jointly
Horizontal space it is smaller, further save the installation space in electronic device 100.
9 are please referred to Fig.1, the first sub- top surface 671 of the above embodiment offers loophole 676, proximity sensor 50
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and transmit
Onto proximity sensor 50.The proximity sensor 50 of present embodiment is arranged in camera case 67, make proximity sensor 50 with
The structure of camera case 67 is more stablized and convenient for proximity sensor 50 and imaging modules 60 is installed on casing 20.
Figure 20 is please referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, proximity sensor 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image
Sensor 65 is arranged on substrate 66, and proximity sensor 50 may be also secured on substrate 66 and be housed in camera case 67.
Specifically, FPC is provided on substrate 66, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, another
End can be connect with the mainboard of electronic device 100.In other embodiments, proximity sensor 50 can also be connect with FPC.This
The proximity sensor 50 of embodiment is arranged in camera case 67, makes the structure of proximity sensor 50 and camera case 67 more
Stablize and be convenient for proximity sensor 50 and imaging modules 60 being installed on casing 20；Meanwhile imaging modules 60 set substrate 66
And proximity sensor 50 is arranged on substrate 66, proximity sensor 50 is enable to be firmly mounted in camera case 67.
Figure 21 is please referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds
Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677
678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread
Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with
With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677
Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle.
Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two
A light extraction through-hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through-holes 674
Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions
Through-hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68,
Light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens module 68 and be transmitted on imaging sensor 65.This reality
It applies in mode, imaging modules 60 can be visible image capturing head 61, and two camera lens modules 68 are visible image capturing head 61 at this time
Corresponding camera lens module.Proximity sensor 50 is arranged on the second tread 678 and outside camera case 67.Proximity sensor 50
For single packaging body.In other embodiments, imaging modules 60 can be infrared pick-up head 62, at this time two camera lens modules 68
It is 62 corresponding camera lens module of infrared pick-up head.In yet another embodiment, imaging modules 60 include visible image capturing head
61 and infrared pick-up head 62, one of camera lens module 68 is 62 corresponding camera lens module of infrared pick-up head at this time, another
A camera lens module 68 is 61 corresponding camera lens module of visible image capturing head.
The imaging modules 60 of present embodiment offer notch 675, and proximity sensor 50 is arranged on the second tread
On 678, proximity sensor 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves
Installation space in electronic device 100.
Figure 22 is please referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670
On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread
The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through-holes 674 are opened in the first son respectively
On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675
Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face
679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678,
Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second
Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first
The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment
In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second
Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in
The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating proximity sensor 50 is arranged on the second tread
On 678.
Figure 21 and Figure 22 is please referred to, in some embodiments, the proximity sensor 50 of the above embodiment is arranged on
On two treads 678 and positioned at the outside of camera case 67.Specifically, when notch 675 is opened in the marginal position of top surface 670,
Entire proximity sensor 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, part connects
Nearly sensor 50 is located at along the projection perpendicular to the second tread 678 in the second tread 678.That is, proximity sensor 50 to
A rare part is located at the surface of the second tread 678.When notch 675 is opened on the centre position of top surface 670, entirely connect
Nearly sensor 50 perpendicular to the projection of the second tread 678 along can be located in the second tread 678 (as shown in Figure 21 and Figure 22).
In this way, proximity sensor 50 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, further saves
Installation space about in electronic device 100.
Figure 23 is please referred to, the second tread 678 of the above embodiment offers loophole 676, and proximity sensor 50 is located at
It is in camera case 67 and corresponding with loophole 676.Light outside electronic device 100 can pass through loophole 676 and be transmitted to
On proximity sensor 50.The proximity sensor 50 of present embodiment is arranged in camera case 67, makes proximity sensor 50 and phase
The structure of casing body 67 is more stablized and convenient for proximity sensor 50 and imaging modules 60 is installed on casing 20.
Please continue to refer to Figure 24, in some embodiments, the second tread 678 of the above embodiment offers loophole
676, proximity sensor 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, image
Sensor 65 is arranged on substrate 66, and proximity sensor 50 may be also secured on substrate 66 and be housed in camera case 67.
Specifically, FPC is provided on substrate 66, one end of FPC is located in camera case 67 and for carrying imaging sensor 65, another
End can be connect with the mainboard of electronic device 100.In other embodiments, proximity sensor 50 can also be connect with FPC.
The proximity sensor 50 of present embodiment is arranged in camera case 67, makes proximity sensor 50 and camera case 67
Structure more stablize and convenient for proximity sensor 50 and imaging modules 60 are installed on casing 20；Meanwhile imaging modules 60
Proximity sensor 50 is simultaneously arranged on substrate 66 by setting substrate 66, and proximity sensor 50 is enable to be firmly mounted to camera shell
In body 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (17)
1. a kind of input and output module, which is characterized in that the input and output module include encapsulating housing, the first infrared light supply,
Around the second infrared light supply and optical flame detector of first infrared light supply setting, the encapsulating housing includes package substrate, described
First infrared light supply, second infrared light supply and the optical flame detector are encapsulated in the encapsulating housing and are carried on the envelope
It fills on substrate, when second infrared light supply is closed, first infrared light supply is with the first power to the encapsulating housing outgoing
When penetrating infrared light, the input and output module is used for infrared distance measurement；When first infrared light supply and second infrared light
When source is opened and emitted infrared light outside the encapsulating housing with the second power, the input and output module is used for infrared benefit
Light；The optical flame detector is used to receive the visible ray in ambient light, and detect the intensity of the visible ray.
2. input and output module according to claim 1, which is characterized in that
First infrared light supply is point light source, and second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is point light source, and second infrared light supply is annular light source；Or
For first infrared light supply to be multiple around the point light source circularized, second infrared light supply is annular light source；Or
First infrared light supply is multiple around the point light source circularized, and second infrared light supply is point light source and quantity is
It is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is annular light source.
3. input and output module according to claim 1, which is characterized in that the input and output module further includes chip,
First infrared light supply, second infrared light supply and the optical flame detector are both formed on a piece of chip.
4. input and output module according to claim 3, which is characterized in that the encapsulating housing further include package wall and
Encapsulation top, the package wall extend from the package substrate and be connected at the top of the encapsulation and the package substrate it
Between, it is formed with luminescence window and light sensation window at the top of the encapsulation, the luminescence window and first infrared light supply and described
Second infrared light supply corresponds to, and the light sensation window is corresponding with the optical flame detector.
5. input and output module according to claim 3, which is characterized in that it is saturating that the input and output module further includes light source
Mirror, the light lens be arranged in the encapsulating housing and with first infrared light supply and second infrared light supply pair
It should；And/or
The input and output module further includes light sensation lens, the light sensation lens be arranged in the encapsulating housing and with the light
Sensor corresponds to.
6. input and output module according to claim 3, which is characterized in that the input and output module, which further includes, to be arranged on
Light lens and light sensation lens in the encapsulating housing, the light lens and first infrared light supply and described second red
Outer light source corresponds to, and the light sensation lens are corresponding with the optical flame detector, and the light lens are located at same with the light sensation lens
On bright matrix.
7. input and output module according to claim 1, which is characterized in that the input and output module further includes metal screening
Baffle, the metal shutter are located in the encapsulating housing and between second infrared light supply and the optical flame detector.
8. input and output module according to claim 1, which is characterized in that the input and output module is further included by light transmission
Optics sealing cover made of material, the optics sealing cover is formed on the package substrate and in the encapsulating housing, described
Optics sealing cover wraps first infrared light supply, second infrared light supply and the optical flame detector.
9. input and output module according to claim 8, which is characterized in that the input and output module further include light extraction every
Plate, it is described go out light clapboard be formed in the optics sealing cover and between second infrared light supply and the optical flame detector.
10. according to input and output module described in any one of claim 1-9, which is characterized in that the input and output module
On be formed with grounding pin, light compensating lamp pin, close to lamp pin and light sensation pin, the grounding pin and described close to lamp pin
When being enabled, first infrared light supply emits infrared light；When the grounding pin and the light compensating lamp pin are enabled, institute
State the first infrared light supply and second infrared light supply transmitting infrared light；The grounding pin and the light sensation pin are enabled
When, the intensity of the optical flame detector detection visible ray.
11. a kind of electronic device, which is characterized in that the electronic device includes：
Casing；With
Input and output module described in claim 1-10 any one, the input and output module are arranged in the casing.
12. electronic device according to claim 11, which is characterized in that the electronic device further includes the cover board of light transmission,
The casing offers casing light source through holes and casing light sensation through-hole, first infrared light supply and second infrared light supply with
The casing light source through holes correspond to, and the optical flame detector is corresponding with the casing light sensation through-hole, and the cover board is arranged on the casing
On.
13. electronic device according to claim 11, which is characterized in that the electronic device further includes the cover board of light transmission,
The casing offers casing light source through holes and casing light sensation through-hole, first infrared light supply and second infrared light supply with
The casing light source through holes correspond to, and the optical flame detector is corresponding with the casing light sensation through-hole, and the cover board is arranged on the casing
On, the cover board is formed with the surface that the casing is combined only transmits the infrared through ink, the infrared transmission of infrared light
Ink blocks the casing light source through holes.
14. electronic device according to claim 11, which is characterized in that the electronic device further include proximity sensor and
Imaging modules, imaging modules described in proximity sensor include microscope base, the lens barrel on the microscope base and are housed in the mirror
Imaging sensor in seat, the microscope base includes the mounting surface between the lens barrel and described image sensor, described to connect
Nearly sensor is arranged on the mounting surface.
15. electronic device according to claim 11, which is characterized in that the electronic device further includes imaging modules and connects
Nearly sensor, on the housing, the imaging modules include camera case and camera lens module, described for the imaging modules installation
The top surface of camera case is for cascaded surface and including connected the first sub- top surface and the second sub- top surface, and the second sub- top surface is with respect to institute
It states the first sub- top surface inclination and forms notch with the described first sub- top surface, the top surface offers light extraction through-hole, the camera lens mould
Group is housed in the camera case and corresponding with the light extraction through-hole, and the proximity sensor is arranged on the described first sub- top surface
Place.
16. electronic device according to claim 11, which is characterized in that the electronic device further includes imaging modules and connects
Nearly sensor, the imaging modules include camera case and two camera lens modules, offer and cut on the top surface of the camera case
Mouthful to form step-like top surface, the top surface includes the first tread and the second tread less than first tread, and described the
It is opened up on one tread there are two light extraction through-hole, each light extraction through-hole is corresponding with the camera lens module, the proximity sensor
It is arranged at second tread.
17. electronic device according to claim 11, which is characterized in that the electronic device further includes imaging modules and connects
Nearly sensor, the imaging modules include microscope base, the lens barrel on the microscope base and part and are arranged in the microscope base
Substrate, the proximity sensor setting is on the substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711433092.2A CN108183984B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
| PCT/CN2018/117920 WO2019128605A1 (en) | 2017-12-26 | 2018-11-28 | Output module, input and output module and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711433092.2A CN108183984B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
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| Publication Number | Publication Date |
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| CN108183984A true CN108183984A (en) | 2018-06-19 |
| CN108183984B CN108183984B (en) | 2020-12-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711433092.2A Active CN108183984B (en) | 2017-12-26 | 2017-12-26 | Input/output module and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019128605A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic apparatus |
| CN113078253A (en) * | 2021-04-01 | 2021-07-06 | 淄博职业学院 | Art exhibition lighting device |
| US11455018B2 (en) | 2018-08-01 | 2022-09-27 | Honor Device Co., Ltd. | Optical proximity sensor component comprising light guide |
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| EP3809680B1 (en) * | 2018-08-01 | 2023-03-15 | Honor Device Co., Ltd. | Optical proximity sensor assembly and electronic device |
| CN113078253A (en) * | 2021-04-01 | 2021-07-06 | 淄博职业学院 | Art exhibition lighting device |
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| CN108183984B (en) | 2020-12-29 |
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