CN108200235A - Export module and electronic device - Google Patents
Export module and electronic device Download PDFInfo
- Publication number
- CN108200235A CN108200235A CN201711437437.1A CN201711437437A CN108200235A CN 108200235 A CN108200235 A CN 108200235A CN 201711437437 A CN201711437437 A CN 201711437437A CN 108200235 A CN108200235 A CN 108200235A
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- CN
- China
- Prior art keywords
- infrared light
- light supply
- infrared
- output module
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The invention discloses a kind of output modules.It exports module and includes encapsulating housing, the first infrared light supply and the second infrared light supply around the setting of the first infrared light supply.Encapsulating housing includes package substrate.First infrared light supply and the second infrared light supply are encapsulated in encapsulating housing and are carried on package substrate.When the second infrared light supply is closed, and the first infrared light supply emit outside encapsulating housing infrared light with the first power, output module is as close to infrared lamp；When the first infrared light supply and the second infrared light supply are opened and emit infrared light outside encapsulating housing with the second power, output module is used as infrared light compensating lamp.The opening and closing that the output module of embodiment of the present invention passes through the first infrared light supply of control and the second infrared light supply, output module both can be used as close to infrared lamp, infrared light compensating lamp also is used as, has gathered transmitting infrared light with the function of infrared distance measurement and infrared light filling, has occupied little space.In addition, the invention also discloses a kind of electronic devices.
Description
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of output module and electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of function element set
It is more and more, in order to realize the functions such as the facial 3D feature recognitions of distance detection, environment light detection and user, need to set in electronics
The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth
Numerous function elements is put, the excessive space of mobile phone can be occupied.
Invention content
Embodiment of the present invention provides a kind of output module and electronic device.
The output module of embodiment of the present invention is infrared including encapsulating housing, the first infrared light supply and around described first
Second infrared light supply of light source setting, the encapsulating housing include package substrate, first infrared light supply and described second red
Outer light source is encapsulated in the encapsulating housing and carries on the package substrate, described when second infrared light supply closing
When first infrared light supply emits outside the encapsulating housing infrared light with the first power, the output module is used as close to infrared
Lamp；When first infrared light supply is opened with second infrared light supply and is emitted outside the encapsulating housing with the second power
During infrared light, the output module is used as infrared light compensating lamp.
The electronic device of embodiment of the present invention, including：
Casing；With
The output module of embodiment of the present invention, the output module are arranged in the casing.
In the output module and electronic device of embodiment of the present invention, by controlling the first infrared light supply and the second infrared light
The opening and closing in source, output module both can be used as close to infrared lamp, it is also possible to make infrared light compensating lamp, gather transmitting infrared light
With the function of infrared distance measurement and infrared light filling.In addition, the first infrared light supply and the second infrared light supply are integrated into a single packaging body
Structure, the integrated level for exporting module is higher, small volume, and output module has saved the infrared light filling of realization and infrared distance measurement function
Space.Furthermore the first infrared light supply and the second infrared light supply are carried on same package substrate, red compared to traditional handicraft
Outer light compensating lamp is encapsulated from needing to be respectively adopted in different wafer manufacture recombinants to PCB substrate close to infrared lamp, improves encapsulation
Efficiency.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following
Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
It obtains significantly and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 3 to Fig. 4 is the status diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 5 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Fig. 6 to Fig. 8 is the distribution of the first infrared light supply and the second infrared light supply of the output module of embodiment of the present invention
Schematic diagram；
Fig. 9 is the part isometric schematic diagram of the output module of the electronic device of embodiment of the present invention；
Figure 10 is the partial sectional schematic view of the electronic device of embodiment of the present invention；
Figure 11 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 12 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 13 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Figure 14 is the proximity sensor of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 15 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 16 is the partial sectional schematic view of the electronic device of embodiment of the present invention；
Figure 17 is the receiving module of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 18 to Figure 25 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the whole element for representing same or similar element or there is same or like function.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's
Embodiment, and be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature
It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature right over second feature or oblique upper or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity
Sub- component includes output module 10, receiving module 50 (such as Figure 11), imaging modules 60 (such as Figure 11), receiver 70 and structure light
The projector 80.Electronic device 100 can be mobile phone, tablet computer, laptop, smartwatch, Intelligent bracelet, automatic teller machine
Deng the embodiment of the present invention is illustrated so that electronic device 100 is mobile phone as an example, it will be understood that the concrete form of electronic device 100
Can be other, this is not restricted.
Fig. 2 to Fig. 4 is please referred to, output module 10 is single package body structure, including encapsulating housing 11, the first infrared light supply 12
With the second infrared light supply 13.
Encapsulating housing 11 for encapsulating the first infrared light supply 12 and the second infrared light supply 13 simultaneously, and in other words, first is infrared
12 and second infrared light supply 13 of light source is encapsulated in encapsulating housing 11 simultaneously.Encapsulating housing 11 includes package substrate 111, package-side
Wall 112 and encapsulation top 113.Encapsulating housing 11 can be by electromagnetic interference (Electromagnetic Interference,
EMI) shielding material is made, and output module 10 is had an impact to avoid extraneous electromagnetic interference.
Incorporated by reference to Fig. 5, package substrate 111 is for the first infrared light supply 12 of carrying and the second infrared light supply 13.It is defeated manufacturing
When going out module 10, the first infrared light supply 12 and the second infrared light supply 13 can be formed on a piece of chip 14, then infrared by first
Light source 12, the second infrared light supply 13 and chip 14 are set along on package substrate 111, specifically, can be bonded chip 14
On package substrate 111.Meanwhile package substrate 111 can be used for and other parts of electronic device 100 (such as electronics
The casing 20 of device 100, mainboard etc.) connection, module 10 will be exported and be fixed in electronic device 100.
Package wall 112 can surround the first infrared light supply 12 and the second infrared light supply 13 is set, and package wall 112 is self-styled
Dress substrate 111 extends, and package wall 112 can be combined with package substrate 111, preferably, package wall 112 and package substrate 111
To be detachably connected, in order to be examined to the first infrared light supply 12 and the second infrared light supply 13 after removing package wall 112
It repaiies.The making material of package wall 112 can be the material of impermeable infrared light, infrared to avoid the first infrared light supply 12 and second
The infrared light that light source 13 is sent out passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connect with package wall 112.Encapsulation top 113
Luminescence window 1131 is formed with, luminescence window 1131 is corresponding with the first infrared light supply 12 and the second infrared light supply 13, and first is infrared
The infrared light of 12 and second infrared light supply 13 of light source transmitting is pierced by from luminescence window 1131.Encapsulation top 113 and package wall 112
Integrally formed can obtain, can also split shape to obtain.In one example, luminescence window 1131 is through-hole, encapsulates top
113 making material is the material of impermeable infrared light.In another example, encapsulation top 113 by impermeable infrared light material and
The material co-manufactured of saturating infrared light forms, and specifically, luminescence window 1131 is made of the material of saturating infrared light, remaining position by
The material of impermeable infrared light is made, and further, luminescence window 1131 could be formed with lens arrangement, to improve from luminescence window
The 1131 infrared light emission angles projected, such as luminescence window 1131 are formed with concavees lens structure, so that across luminescence window
1131 divergence of beam projects outward；Luminescence window 1131 is formed with convex lens structures, so that the light across luminescence window 1131
Line gathers outside injection.
First infrared light supply 12 and the second infrared light supply 13 can be formed on a piece of chip 14, and it is red further to reduce first
Volume after 12 and second infrared light supply 13 of outer light source is integrated, and preparation process is simpler.First infrared light supply 12 and second is red
Outer light source 13 can emit infrared light.When the first infrared light supply 12 and the second infrared light supply 13 are opened and to 11 outgoing of encapsulating housing
When penetrating infrared light (as shown in Figure 3), infrared light passes through luminescence window 1131 to project body surface, electronic device 100
The infrared light (as shown in Figure 1) that be reflected by the object that receives of infrared pick-up head 62 is to obtain the image information of object, at this point, output
Module 10 is used as infrared light compensating lamp (i.e. for infrared light filling), and the first infrared light supply 12 and the second transmitting jointly of infrared light supply 13
The light-emitting area that covers of the infrared light for light filling it is larger, the field angle α of light filling infrared light can be 60 degree -90 and spend, such as：
The field angle α of light filling infrared light is 60 degree, 65 degree, 70 degree, 75 degree, 80 degree, 82 degree, 85 degree, 87 degree or 90 degree etc..When
Two infrared light supplies 13 are closed, when the first infrared light supply 12 emits infrared light outside encapsulating housing 11 (as shown in Figure 4), infrared light
Across luminescence window 1131 and body surface is reached, the reception (as shown in figure 11) of proximity sensor 51 of electronic device 100 is by object
The infrared light of body reflection is with detection object to the distance of electronic device 100, at this point, output module 10 is used as close to infrared lamp (i.e.
For infrared distance measurement), and the light-emitting area that the infrared light for infrared distance measurement of the first infrared light supply 12 transmitting covers is smaller, it is red
The field angle β of outer ranging infrared light is 10 degree of -30 degree, such as：The field angle β of infrared distance measurement infrared light for 10 degree, 15 degree,
20 degree, 25 degree or 30 degree etc..In an embodiment of the present invention, field angle refers to that infrared light passes through luminescence window 1131 from envelope
Fill the range of the outgoing covering of housing 11.
It exports when module 10 is used as infrared light compensating lamp and as close to can be with different power to encapsulating shell during infrared lamp
Emit infrared light outside body 11.Output module 10 is used as infrared close to being emitted outside encapsulating housing 11 with the first power during infrared lamp
Light emits infrared light with the second power when output module 10 is used as infrared light compensating lamp outside encapsulating housing 11, wherein, first
Power can be less than second power.
Second infrared light supply 13 is set around the first infrared light supply 12.First infrared light supply 12 and the second infrared light supply 13 are whole
Round, annular, rectangular or regular polygon etc. can be rendered as on body.Can be：First infrared light supply 12 is point light source, and second is red
Outer light source 13 is also point light source and quantity is multiple (as shown in Figure 6)；Or first infrared light supply 12 be point light source, second is infrared
Light source 13 is annular light source (as shown in Figure 7)；Or first infrared light supply 12 to be multiple red around the point light source circularized, second
Outer light source 13 is annular light source；Or first infrared light supply 12 to be multiple around the point light source circularized, the second infrared light supply 13
It is multiple (as shown in Figure 8) for point light source and quantity；Or first infrared light supply 12 be annular light source；Second infrared light supply 13 is
Point light source and quantity are multiple；Or first infrared light supply 12 be annular light source；Second infrared light supply 13 is annular light source.
Incorporated by reference to Fig. 9, in embodiments of the present invention, export and be formed with grounding pin 15, light compensating lamp pin 16 on module 10
With close to lamp pin 17.It grounding pin 15, light compensating lamp pin 16 and can be formed on package substrate 111 close to lamp pin 17,
When grounding pin 15 and light compensating lamp pin 16 are enabled (that is, grounding pin 15 and light compensating lamp pin 16 access circuit turn-on
When), the first infrared light supply 12 and the second infrared light supply 13 transmitting infrared light；Made when grounding pin 15 and close to lamp pin 17
Can when (that is, grounding pin 15 and close to lamp pin 17 access circuit turn-on when), the first infrared light supply 12 transmitting infrared light.
It please refers to Fig.1 and Figure 10, casing 20 in other words, can export module 10 as the installation carrier of output module 10
It can be arranged in casing 20.Casing 20 can be the shell of electronic device 100, in embodiments of the present invention, in casing 20 also
Available for set electronic device 100 display screen 90, due to embodiment of the present invention output module 10 occupy small volume,
Therefore, for setting the volume of display screen 90 that can correspond to increase in casing 20, to improve the screen accounting of electronic device 100.
Specifically, casing 20 includes top 21 and bottom 22, and display screen 90 and output module 10 are arranged between top 21 and bottom 22,
In the state of user's normal use electronic device 100, top 21 is located at the top of bottom 22, as shown in Figure 1, output module 10
It can be arranged between display screen 90 and top 21.In other embodiments, display screen 90 can offer scarce for screen comprehensively
Mouthful, display screen 90 surrounds output module 10, and exports module 10 and expose from the notch of display screen 90.
Casing 20 is further opened with casing through-hole 23.When output module 10 is arranged in casing 20,12 He of the first infrared light supply
Second infrared light supply 13 is corresponding with casing through-hole 23.Wherein the first infrared light supply 12 and the second infrared light supply 13 and casing through-hole 23
It is corresponding to refer to the light that the first infrared light supply 12 and the second infrared light supply 13 are sent out and be passed through from casing through-hole 23, it specifically, can be with
It is the first infrared light supply 12 and the second infrared light supply 13 and 23 face of casing through-hole or the first infrared light supply 12 and second
The light that infrared light supply 13 emits passes through casing through-hole 23 after light-guide device acts on.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set
It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated
Go out after the light that module 10 is sent out sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 10
In, cover board 30 covers casing through-hole 23, and infrared transmission ink 40 is coated on the inner surface 32 of cover board 30, infrared to penetrate ink 40
There is higher transmitance to infrared light, such as can reach 85% or more, and have higher attenuation rate to visible ray, such as reachable
To more than 70% so that user during normal use, is visually difficult to see that on electronic device 100 and is covered by infrared through ink 40
Region.Specifically, it is infrared through ink 40 can cover on inner surface 32 not with 90 corresponding region of display screen.
Infrared to block casing through-hole 23 (as shown in Figure 10) through ink 40, user is difficult to through casing through-hole 23
See the internal structure of electronic device 100, the shape of electronic device 100 is more beautiful.
1 is please referred to Fig.1, receiving module 50 is integrated with proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation
Single package body structure is collectively formed in device 52.The infrared light that output module 10 is sent out when being used as close to infrared lamp, by foreign objects
After body reflection, received by proximity sensor 51, proximity sensor 51 judges foreign objects according to the infrared light reflected received
The distance between body and electronic device 100.Optical flame detector 52 receives the visible ray in ambient light, and detects the intensity of visible ray, with
The foundation of display brightness as control display screen 90.Proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly,
Reduce gap when the two is individually assembled, save the installation space in electronic device 100.
It please refers to Fig.1 and Figure 11, imaging modules 60 can be visible image capturing head 61 and one in infrared pick-up head 62
It is a or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, image
Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, and mounting surface 631 is located at lens barrel 64 and imaging sensor 65
Between.In embodiment as shown in figure 11, receiving module 50 is arranged on mounting surface 631, and specifically, receiving module 50 is being pacified
Plane orthographic projection where dress face 631 is at least partly dropped on mounting surface 631, in this way, receiving module 50 and imaging modules 60
Set compacter, the horizontal space that the two occupies jointly is smaller.
Referring to Fig. 1, receiver 70 is for sending out acoustic signals when being encouraged by power supply, user can by by
Words device 70 is conversed.Structured light projector 80 is used for outside emitting structural light, on project structured light to testee after it is anti-
It penetrates, the structure light reflected can be received by infrared pick-up head 62, and the processor of electronic device 100 is further analyzed by infrared light
The structure light that camera 62 receives, to obtain the depth information of testee.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, defeated
Go out the center of module 10, infrared pick-up head 62, visible image capturing head 61, receiver 70 and structured light projector 80 positioned at same
On line segment.Specifically, output module 10, structured light projector 80, receiver 70, red is followed successively by from one end of line segment to the other end
Outer light video camera head 62, visible image capturing head 61 (as shown in figure 12)；Or output mould is followed successively by from one end of line segment to the other end
Group 10, infrared pick-up head 62, receiver 70, visible image capturing head 61, structured light projector 80 (as shown in Figure 1)；Or from
One end of line segment is followed successively by infrared pick-up head 62, output module 10, receiver 70, visible image capturing head 61, knot to the other end
Structure light projector 80；Or infrared pick-up head 62, visible image capturing head 61, called is followed successively by from one end of line segment to the other end
Device 70, output module 10, structured light projector 80.Certainly, module 10, infrared pick-up head 62, receiver 70, visible ray are exported
Camera 61, structured light projector 80 arrangement mode be not limited to above-mentioned citing, can also have other, such as each electronics member device
The center of part arranges the shapes such as in the arc-shaped, center arrangement is rectangular.
Further, incorporated by reference to Figure 11, receiving module 50 can be arranged on the mounting surface 631 of infrared pick-up head 62,
It can also be arranged on the mounting surface 631 of visible image capturing head 61, certainly, receiving module 50 can not also be arranged on mounting surface
On 631, receiving module 50 can be disposed adjacent with output module 10, and proximity sensor 51 is readily received to be used by output module 10
Emit, and the infrared light being reflected back by external object when making close to infrared lamp；Receiving module 50 can also be adjacent with receiver 70
Setting, when user receives calls, proximity sensor 51 is readily detected the ear of user close to receiver 70.
To sum up, in the electronic device 100 of embodiment of the present invention, by controlling the first infrared light supply 12 and the second infrared light
The opening and closing in source 13, output module 10 both can be used as close to infrared lamp, it is also possible to make infrared light compensating lamp, it is red to have gathered transmitting
Outer light is with the function of infrared distance measurement and infrared light filling.In addition, the first infrared light supply 12 and the second infrared light supply 13 are integrated into one
Single package body structure, the integrated level for exporting module 10 is higher, small volume, and output module 10 has saved the infrared light filling of realization and red
The space of the function of outer ranging.In addition, since the first infrared light supply 12 and the second infrared light supply 13 are carried on same encapsulation base
On plate 111, different wafer manufacture recombinants are respectively adopted from being needed close to infrared lamp in the infrared light compensating lamp compared to traditional handicraft
It is encapsulated on to PCB substrate, improves packaging efficiency.
Referring again to Fig. 5, in some embodiments, output module 10 further includes lens 18.Lens 18 are arranged on encapsulation
It is in housing 11 and corresponding with the first infrared light supply 12 and the second infrared light supply 13.First infrared light supply 12 and the second infrared light supply 13
The infrared light of transmitting is converged in luminescence window 1131 under the action of lens 18 and is projected, and reduction is emitted to 112 He of package wall
The light quantity in other regions at encapsulation top 113, it is only necessary to meet the first infrared light supply 12 and the second transmitting jointly of infrared light supply 13
Field angle α of the infrared light for light filling after lens 18 be 60 degree -90 degree, being used for for the first infrared light supply 12 transmitting is red
Field angle β of the infrared light of outer ranging after lens 18 is 10 degree of -30 degree.Specifically, lens 18 can be located at transparent base
On, it is made more specifically, lens 18 can be integrally formed with the transparent base.Certainly, output module 10 can not also be set
Mirror 18.
3 are please referred to Fig.1, in some embodiments, output module 10 further includes optics sealing cover 19.Optics sealing cover 19 is by saturating
Luminescent material is made, and optics sealing cover 19 is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 19 wraps
One infrared light supply 12 and the second infrared light supply 13.Specifically, optics sealing cover 19 can be formed by encapsulating injection molding and forming technology, light
Sealing cover 19 may be used transparent thermosetting epoxy resin and be made, and to be not easy to soften in use, optics sealing cover 19 can be consolidated
The position of fixed first infrared light supply 12 and the second infrared light supply 13, and the first infrared light supply 12 and the second infrared light supply 13 are existed
It is not easy to shake in encapsulating housing 11.
4 are please referred to Fig.1, in some embodiments, proximity sensor 51 can be not integrated in reception mould with optical flame detector 52
In group 50, in other words, proximity sensor 51 is separately set with optical flame detector 52.At this point, proximity sensor 51 can be arranged on microscope base
On 63 mounting surface 631；Optical flame detector 52 can also be arranged on the mounting surface 631 of microscope base 63；Or proximity sensor 51 and light
Sensor 52 is arranged on the mounting surface 631 of microscope base 63 simultaneously.Microscope base 63 can be the microscope base 63 of infrared pick-up head 62, can also
It is the microscope base 63 of visible image capturing head 61.
5 are please referred to Fig.1, in some embodiments, casing 20 is further opened with casing sound outlet hole (not shown), and cover board 30 is also
Cover board sound outlet hole 34 is offered, receiver 70 is corresponding with the position of cover board sound outlet hole 34 and casing sound outlet hole.Export module 10, red
The center of outer light video camera head 62, visible image capturing head 61 and structured light projector 80 is located on same line segment, and receiver 70 is located at
Between the line segment and the top 21 of casing 20.
The center of receiver 70 is not located on the line segment, and it is (output module 10, red to have saved each electronic component on cover board 30
Outer light video camera head 62, visible image capturing head 61, structured light projector 80 etc.) occupy horizontal space.In reality as shown in figure 15
It applies in example, cover board sound outlet hole 34 is opened in the marginal position of cover board 30, and casing sound outlet hole is opened up close to top 21.
Referring again to Figure 16, in some embodiments, cover plate through hole 33, cover plate through hole can also be offered on cover board 30
33 is corresponding with casing through-hole 23, after the infrared light that the first infrared light supply 12 and the second infrared light supply 13 emit passes through casing through-hole 23
Electronic device 100 can be pierced by from cover plate through hole 33.
7 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on
On substrate 66, receiving module 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, one of substrate 66
Divide and be located in microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and is used to carry image sensing
Device 65, the other end can be connect with the mainboard of electronic device 100.When receiving module 50 is arranged on substrate 66, receiving module 50
It is arranged on outside microscope base 63, receiving module 50 can also be connect with FPC.
Further, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, close to biography
Single package body structure is collectively formed with optical flame detector 52 in sensor 51, reduces gap when the two is individually assembled, saves electronic device 100
Interior installation space.In other embodiments, the receiving module 50 for being arranged on substrate 66 includes proximity sensor 51 or/and light
Sensor 52, proximity sensor 51 and optical flame detector 52 are respectively single package body structure.That is, the receiving module 50 for being arranged on substrate 66 is
The proximity sensor 51 of single package body structure；Alternatively, the receiving module 50 for being arranged on substrate 66 is the light sensation of single package body structure
Device 52；Alternatively, the receiving module 50 for being arranged on substrate 66 is the proximity sensor 51 of single package body structure and single package body structure
Optical flame detector 52.
Imaging modules 60 can be visible image capturing head 61 and one or two in infrared pick-up head 62.Specifically,
Receiving module 50 can be fixed on the substrate 66 of visible image capturing head 61；Receiving module 50 can be fixed on infrared pick-up head
On 62 substrate 66.When proximity sensor 51 and optical flame detector 52 are encapsulated for split, proximity sensor 51 can be fixed on visible
On the substrate 66 of light video camera head 61, optical flame detector 52 can be fixed on the substrate 66 of infrared pick-up head 62；Alternatively, optical flame detector 52
It can be fixed on the substrate 66 of visible image capturing head 61, proximity sensor 51 can be fixed on the substrate of infrared pick-up head 62
On 66；Alternatively, proximity sensor 51 is each attached to optical flame detector 52 on the substrate 66 of visible image capturing head 61；Alternatively, close to passing
Sensor 51 is each attached to optical flame detector 52 on the substrate 66 of infrared pick-up head 62.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with receiving module 50, to increase
The integral strength of substrate 66 so that FPC is not susceptible to around folding, while receiving module 50 (or proximity sensor 51 or optical flame detector 52)
It is not susceptible to shake when being arranged on substrate 66.In one example, receiving module 50 (or proximity sensor 51 or optical flame detector
52) it may be also secured on the lateral wall of microscope base 63, such as be fixed on the lateral wall of microscope base 63 by cohesive mode.
8 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67
Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- top surface 672 and the sub- top surface 673 of third, the second son top
672 and first sub- top surface 671 of face tilts connection and forms notch 675, the sub- top surface 673 and second of third with the first sub- top surface 671
Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- top surface 671 and the sub- top surface 673 of third to connect first
Sub- top surface 671 and the sub- top surface 673 of third.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight
Angle, the angle between the second sub- top surface 672 and the sub- top surface 673 of third can be obtuse angle or right angle.Notch 675 is opened in camera shell
On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.The sub- top surface 673 of third offers out
Light through-hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through-hole 674.Imaging sensor 65 is housed in
In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens mould
Group 68 is simultaneously transmitted on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Receiving module 50 is arranged on
At first sub- top surface 671, receiving module 50 includes proximity sensor 51 and optical flame detector 52.In present embodiment, imaging modules 60
Can be visible image capturing head 61, receiving module 50 is single packaging body knot that proximity sensor 51 is collectively formed with optical flame detector 52
Structure.Proximity sensor 51 can be consistent with the extending direction of notch 675 (such as Figure 18 institutes with the center line connecting direction of optical flame detector 52
Show)；Alternatively, proximity sensor 51 can be vertical with the extending direction of notch 675 with the center line connecting direction of optical flame detector 52 or be in
The angle that the two is formed is acute angle or obtuse angle.In other embodiments, imaging modules 60 can be infrared pick-up head 62.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the first sub- top surface
On 671, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves
Installation space in electronic device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce
The installation space in electronic device 100 is saved in gap when the two is individually assembled.
Please continue to refer to Figure 18, in some embodiments, the receiving module 50 of the above embodiment is arranged on the first son
On top surface 671 and positioned at the outside of camera case 67, specifically, entire receiving module 50 is along perpendicular to the first sub- top surface 671
Projection can be located in the first sub- top surface 671 (as shown in figure 18)；Alternatively, part receiving module 50 is pushed up along perpendicular to the first son
The projection in face 671 is located in the first sub- top surface 671.That is, receiving module 50 is at least part of to be located at the first sub- top surface
671 surface, in this way, receiving module 50 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly compared with
It is small, further save the installation space in electronic device 100.In other embodiments, receiving module 50 is included close to biography
Sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two individual single package body structures, at this point, being respectively
The proximity sensor 51 and optical flame detector 52 of single package body structure can also be all disposed on the first sub- top surface 671.
9 are please referred to Fig.1, in some embodiments, the receiving module 50 of the above embodiment only includes proximity sensor
51, not comprising optical flame detector 52, tied at this point, proximity sensor 51 (or receiving module 50) is respectively monomer encapsulation with optical flame detector 52
Structure, proximity sensor 51 are arranged on the first sub- top surface 671, and optical flame detector 52 is arranged on any other except the first sub- top surface 671
Position.
Please continue to refer to Figure 19, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector
52, and not comprising proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively monomer envelope with proximity sensor 51
Assembling structure, optical flame detector 52 are arranged on the first sub- top surface 671, proximity sensor 51 be arranged on except the first sub- top surface 671 other
Any position.
Figure 20 is please referred to, the first sub- top surface 671 of the above embodiment offers loophole 676, and receiving module 50 is located at
It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without light sensation
Device 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100
The light in portion can pass through loophole 676 and be transmitted on proximity sensor 51.The receiving module 50 of present embodiment is arranged on
In camera case 67, receiving module 50 and the structure of camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging mould
Group 60 is installed on casing 20.
Please continue to refer to 20, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50
It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close
Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics
Light outside device 100 can pass through loophole 676 and be transmitted on optical flame detector 52.The receiving module 50 of present embodiment is set
Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with into
As module 60 is installed on casing 20.
Figure 21 is please referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 be integrated with it is close
When sensor 51 is with optical flame detector 52, loophole 676 can be one and proximity sensor 51 and the corresponding light transmission of optical flame detector 52
Hole or two it is spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, outside electronic device 100
On the proximity sensor 51 and optical flame detector 52 that light can pass through loophole 676 and be transmitted in receiving module 50.In other realities
It applies in mode, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two
Individually list package body structure, at this point, being respectively the proximity sensor 51 of single package body structure and optical flame detector 52 can also all set
It puts in camera case 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, is made
Receiving module 50 and the structure of camera case 67 are more stablized and convenient for receiving module 50 and imaging modules 60 are installed to casing
On 20.
Figure 21 is please referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole
676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes
Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connect with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connect with FPC.This embodiment party
In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation
Single package body structure is collectively formed in device 52, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty
Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception
In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 is also encapsulated for monomer
Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at
In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at
Outside camera case 67.
In yet another embodiment, optical flame detector 52 is only included in receiving module 50, proximity sensor 51, which is not integrated into, to be connect
It receives in module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 is also sealed for monomer
Assembling structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when one of substrate 66
Divide and be located in camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate
On 66 and outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67
Structure is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base
Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, and receiving module 50 is enable to be firmly mounted in camera case 67.
Figure 22 is please referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace
It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds
Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677
678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread
Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with
With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677
Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle.
Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two
A light extraction through-hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through-holes 674
Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions
Through-hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68,
Light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens module 68 and be transmitted on imaging sensor 65.This reality
It applies in mode, imaging modules 60 can be visible image capturing head 61, and two camera lens modules 68 are visible image capturing head 61 at this time
Corresponding camera lens module.Receiving module 50 is arranged on the second tread 678 and outside camera case 67.Receiving module 50 is connects
Single package body structure that nearly sensor 51 is collectively formed with optical flame detector 52.The line of centres side of proximity sensor 51 and optical flame detector 52
To can be consistent with the extending direction of notch 675；Alternatively, the center line connecting direction of proximity sensor 51 and optical flame detector 52 can be with
The angle that the extending direction of notch 675 vertical (as shown in figure 22) or the two are formed is acute angle or obtuse angle.In other embodiment
In, imaging modules 60 can be infrared pick-up head 62, and two camera lens modules 68 are that infrared pick-up head 62 is corresponding at this time
Camera lens module.In yet another embodiment, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, at this time its
In camera lens module 68 be 62 corresponding camera lens module of infrared pick-up head, another camera lens module 68 is visible image capturing head
61 corresponding camera lens modules.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the second tread 678
On, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, has saved electronics
Installation space in device 100；Both meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce
The installation space in electronic device 100 is saved in individually gap during assembling.
Figure 23 is please referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670
On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread
The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through-holes 674 are opened in the first son respectively
On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675
Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face
679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678,
Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second
Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first
The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment
In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second
Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in
The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating receiving module 50 is arranged on the second tread
On 678.
Figure 22 and Figure 23 is please referred to, in some embodiments, the receiving module 50 of the above embodiment is arranged on second
On tread 678 and positioned at the outside of camera case 67.Specifically, it is whole when notch 675 is opened in the marginal position of top surface 670
A receiving module 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, part receives mould
Group 50 is located at along the projection perpendicular to the second tread 678 in the second tread 678 (as shown in figure 22).That is, receiving module
The 50 at least part of surfaces for being located at the second tread 678.It is whole when notch 675 is opened on the centre position of top surface 670
A receiving module 50 can be located in the second tread 678 (as shown in figure 23) along perpendicular to the projection of the second tread 678.Such as
This, receiving module 50 sets compacter with imaging modules 60, and the horizontal space that the two occupies jointly is smaller, further saves
Installation space in electronic device 100.In other embodiments, receiving module 50 includes proximity sensor 51 and optical flame detector
52, but proximity sensor 51 and optical flame detector 52 are two individual single package body structures, at this point, being respectively single package body structure
Proximity sensor 51 and optical flame detector 52 can also be all disposed on the second tread 678.
Figure 23 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes close to sensing
Device 51, receiving module 50 does not include optical flame detector 52, at this point, proximity sensor 51 (or receiving module 50) is respectively with optical flame detector 52
Cell packaging configuration, proximity sensor 51 are arranged on the second tread 678, and optical flame detector 52 is arranged on the casing outside imaging modules 60
On 20.
Figure 23 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52,
Receiving module 50 does not include proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively with proximity sensor 51
Cell packaging configuration, optical flame detector 52 are arranged on the second tread 678, and proximity sensor 51 is arranged on the casing outside imaging modules 60
On 20.
Figure 24 is please referred to, the second tread 678 of the above embodiment offers loophole 676, and receiving module 50 is located at phase
It is in casing body 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without optical flame detector
52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100
Light can pass through and loophole 676 and be transmitted on proximity sensor 51.The receiving module 50 of present embodiment is arranged on phase
In casing body 67, the structure of receiving module 50 and camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging modules
60 are installed on casing 20.
Please continue to refer to Figure 24, the second tread 678 of the above embodiment offers loophole 676, receiving module 50
It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close
Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics
Light outside device 100 can pass through loophole 676 and be transmitted on optical flame detector 52.The receiving module 50 of present embodiment is set
Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with into
As module 60 is installed on casing 20.
Figure 25 is please referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676,
Receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 is integrated with close to sensing
When device 51 and optical flame detector 52, loophole 676 can be one with proximity sensor 51 and the corresponding loophole of optical flame detector 52 or
Two spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, the light outside electronic device 100
On the proximity sensor 51 and optical flame detector 52 that loophole 676 can be passed through and be transmitted in receiving module 50.In other embodiment party
In formula, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are independent for two
Single package body structure, at this point, being respectively the proximity sensor 51 of single package body structure and optical flame detector 52 can also be all disposed within
It is in camera case 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, makes reception
The structure of module 50 and camera case 67 is more stablized and convenient for receiving module 50 and imaging modules 60 are installed on casing 20.
Please continue to refer to Figure 25, in some embodiments, the second tread 678 of the above embodiment offers loophole
676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes
Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically
Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can
It is connect with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connect with FPC.This embodiment party
In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation
Single package body structure is collectively formed in device 52, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty
Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception
In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 is also encapsulated for monomer
Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at
In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at
Outside camera case 67.
In yet another embodiment, receiving module 50 only includes optical flame detector 52, and proximity sensor 51 is not integrated into reception
In module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 is also encapsulated for monomer
Structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66
In camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate 66
It goes up and is located at outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67
Structure is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base
Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, and receiving module 50 is enable to be firmly mounted in camera case 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention.
In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two,
Three, unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.
Claims (16)
1. a kind of output module, which is characterized in that the output module includes encapsulating housing, the first infrared light supply and around institute
State the first infrared light supply setting the second infrared light supply, the encapsulating housing include package substrate, first infrared light supply with
Second infrared light supply is encapsulated in the encapsulating housing and carries on the package substrate, when second infrared light supply
It closes, when first infrared light supply emit outside the encapsulating housing infrared light with the first power, the output module use
Make close to infrared lamp；When first infrared light supply and second infrared light supply are opened and with the second power to the encapsulation
When emitting infrared light outside housing, the output module is used as infrared light compensating lamp.
2. output module according to claim 1, which is characterized in that
First infrared light supply is point light source, and second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is point light source, and second infrared light supply is annular light source；Or
For first infrared light supply to be multiple around the point light source circularized, second infrared light supply is annular light source；Or
First infrared light supply is multiple around the point light source circularized, and second infrared light supply is point light source and quantity is
It is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is point light source and quantity is multiple；Or
First infrared light supply is annular light source；Second infrared light supply is annular light source.
3. output module according to claim 1, which is characterized in that the output module further includes chip, and described first
Infrared light supply and second infrared light supply are formed on a piece of chip.
4. output module according to claim 3, which is characterized in that the encapsulating housing further includes package wall and encapsulation
Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute
It states encapsulation top and is formed with luminescence window, the luminescence window and first infrared light supply and second infrared light supply pair
It should.
5. output module according to claim 3, which is characterized in that the output module further includes lens, the lens
It is arranged in the encapsulating housing and corresponding with first infrared light supply and second infrared light supply.
6. output module according to claim 3, which is characterized in that the output module, which further includes, is arranged on the encapsulation
Lens in housing, the lens are corresponding with first infrared light supply and second infrared light supply, and the lens are located at saturating
On bright matrix.
7. output module according to claim 1, which is characterized in that the output module is further included to be made of translucent material
Optics sealing cover, the optics sealing cover formed on the package substrate and in the encapsulating housing, the optics sealing cover
Wrap first infrared light supply and second infrared light supply.
8. according to the output module described in claim 1-7 any one, which is characterized in that be formed with and connect on the output module
Ground pin, light compensating lamp pin and close to lamp pin, the grounding pin and it is described close to lamp pin be enabled when, described first is red
Outer light source emits infrared light；When the grounding pin and the light compensating lamp pin are enabled, first infrared light supply and institute
State the second infrared light supply transmitting infrared light.
9. a kind of electronic device, which is characterized in that the electronic device includes：
Casing；With
Output module described in claim 1-8 any one, the output module are arranged in the casing.
10. electronic device according to claim 9, which is characterized in that the electronic device further includes the cover board of light transmission, institute
It states casing and offers casing through-hole, first infrared light supply and second infrared light supply are corresponding with the casing through-hole, institute
State cover board setting on the housing.
11. electronic device according to claim 9, which is characterized in that the electronic device further includes the cover board of light transmission, institute
It states casing and offers casing through-hole, first infrared light supply and second infrared light supply are corresponding with the casing through-hole, institute
State cover board setting on the housing, the cover board is formed with the surface that the casing is combined and only transmits the infrared of infrared light
Ink is crossed, the infrared ink that penetrates blocks the casing through-hole.
12. electronic device according to claim 9, which is characterized in that the electronic device further include receiving module and into
As module, the receiving module is integrated with proximity sensor and optical flame detector, and the imaging modules include microscope base, mounted on the mirror
Lens barrel on seat and the imaging sensor being housed in the microscope base, the microscope base include being located at the lens barrel and described image
Mounting surface between sensor, the receiving module are arranged on the mounting surface.
13. electronic device according to claim 9, which is characterized in that the electronic device further includes proximity sensor, light
Sensor and imaging modules, the imaging modules include microscope base, the lens barrel on the microscope base and are housed in the microscope base
Interior imaging sensor, the microscope base includes the mounting surface between the lens barrel and described image sensor, described close
At least one of sensor and the optical flame detector are arranged on the mounting surface.
14. electronic device according to claim 12 or 13, which is characterized in that the imaging modules include visible image capturing
At least one of head and infrared pick-up head.
15. electronic device according to claim 9, which is characterized in that the electronic device further include infrared pick-up head,
Visible image capturing head, receiver and structured light projector, the output module, the infrared pick-up head, the visible ray are taken the photograph
As the center of head, the receiver and the structured light projector is located on same line segment, from one end of the line segment to another
End is followed successively by：
The output module, the structured light projector, the receiver, the infrared pick-up head, the visible image capturing
Head；Or
The output module, the infrared pick-up head, the receiver, the visible image capturing head, the project structured light
Device；Or
The infrared pick-up head, the output module, the receiver, the visible image capturing head, the project structured light
Device；Or
The infrared pick-up head, the visible image capturing head, the receiver, the output module, the project structured light
Device.
16. electronic device according to claim 9, which is characterized in that the electronic device further includes receiver, infrared light
Camera, visible image capturing head, structured light projector and the cover board of light transmission, the casing offer casing sound outlet hole, the lid
Plate offers cover board sound outlet hole, and the receiver is corresponding with the position of the cover board sound outlet hole and the casing sound outlet hole, described
The center for exporting module, the infrared pick-up head, the visible image capturing head and the structured light projector is located at same line
Duan Shang, the receiver is between the line segment and the top of the casing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711437437.1A CN108200235B (en) | 2017-12-26 | 2017-12-26 | Output module and electronic device |
| PCT/CN2018/117920 WO2019128605A1 (en) | 2017-12-26 | 2018-11-28 | Output module, input and output module and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711437437.1A CN108200235B (en) | 2017-12-26 | 2017-12-26 | Output module and electronic device |
Publications (2)
| Publication Number | Publication Date |
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| CN108200235A true CN108200235A (en) | 2018-06-22 |
| CN108200235B CN108200235B (en) | 2020-11-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711437437.1A Active CN108200235B (en) | 2017-12-26 | 2017-12-26 | Output module and electronic device |
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| CN109803078A (en) * | 2019-01-30 | 2019-05-24 | 维沃移动通信有限公司 | A kind of terminal device |
| WO2019128605A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic apparatus |
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| CN103515371A (en) * | 2012-06-27 | 2014-01-15 | 格科微电子（上海）有限公司 | Integrated optical sensor package |
| CN107463877A (en) * | 2017-07-05 | 2017-12-12 | 广东欧珀移动通信有限公司 | Method for collecting iris, electronic installation and computer-readable recording medium |
| CN107480659A (en) * | 2017-09-21 | 2017-12-15 | 深圳普创天信科技发展有限公司 | A kind of iris identification device and terminal |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019128605A1 (en) * | 2017-12-26 | 2019-07-04 | Oppo广东移动通信有限公司 | Output module, input and output module and electronic apparatus |
| CN109803078A (en) * | 2019-01-30 | 2019-05-24 | 维沃移动通信有限公司 | A kind of terminal device |
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| CN108200235B (en) | 2020-11-27 |
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